Temperature detection assembly, temperature detection device and server

Abstract

The application discloses a temperature detection assembly, a temperature detection device and a server, and relates to the technical field of servers. The temperature detection assembly comprises a heat insulation piece, a heat conduction piece and a temperature detection piece. The heat conduction piece and the heat insulation piece are arranged, the heat insulation piece forms a heat insulation channel, and heat conduction interference during temperature detection is reduced. When the temperature detection assembly is in a compressed state, the first heat conduction part and the second heat conduction part change from point contact to surface contact, and the heat conduction efficiency is improved. The temperature detection device comprises a heat conduction base, a temperature detection assembly and a signal connecting piece. The array-arranged temperature detection assembly is arranged at the mounting position of the heat conduction base, the temperature distribution on the surface of the to-be-detected piece can be measured, and the temperature detection device can be used in cooperation with a heat sink. The temperature detection device still maintains relative position accuracy after being compressed through the tensile deformation of the signal connecting piece, and temperature measurement errors caused by deformation are reduced.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a temperature detection component, a temperature detection device, and a server. Background Technology

[0002] As the power consumption of electronic devices continues to increase, the local hot spot temperature of heat-generating components in these devices also rises, making the thermal resistance control capability and temperature uniformity of these components a major concern. During the research and development and testing phases of heat-generating components, it is necessary to monitor their surface temperature distribution in real time to optimize heat dissipation design.

[0003] In related technologies, non-contact infrared thermal imaging detection technology is used to generate a temperature cloud map by capturing infrared radiation on the surface of the heat-generating device, but it can only detect temperature transiently and cannot detect it stably for a long time; contact temperature sensors are easily affected by heat conduction interference. Summary of the Invention

[0004] This application provides a temperature detection component, a temperature detection device, and a server to at least solve the problems in related technologies, such as the difficulty in long-term stable temperature detection and the susceptibility of temperature detection results to interference from heat conduction.

[0005] In a first aspect, embodiments of this application provide a temperature detection component, comprising: a heat insulation component, which is a deformable component and has a heat insulation channel formed thereon; a heat conductor, which is also a deformable component, with the deformation direction of the heat conductor and the heat insulation component being the same, the heat conductor being located within the heat insulation channel, and a gap being formed between the heat conductor and the heat insulation component; the end of the heat conductor in the deformation direction is used to conduct heat to the component to be detected; and a temperature detection component, which is disposed within the heat insulation component and is used to detect the heat conducted to the heat conductor.

[0006] Secondly, embodiments of this application provide a temperature detection device, including: a heat-conducting base; the aforementioned temperature detection components, wherein multiple temperature detection components are arranged in an array and spaced apart on the heat-conducting base; the heat-conducting element of the temperature detection component is thermally connected to the heat-conducting base; and a signal connector, which connects the temperature detection elements of at least two temperature detection components.

[0007] Thirdly, embodiments of this application also provide a server, including electronic components and the aforementioned temperature detection device, wherein the electronic components and the heat-conducting base of the temperature detection device are thermally connected.

[0008] This application provides a temperature detection component, a temperature detection device, and a server. In the temperature detection component, by incorporating a heat insulation element that forms a heat insulation channel, the heat conduction path along the XY plane can be effectively blocked while retaining heat conduction along the Z-axis, reducing interference from heat conduction in the XY plane on the temperature at the measuring point and improving measurement accuracy. By incorporating a heat-conducting element within the heat insulation channel, when the temperature detection component is in a compressed state, the two heat-conducting elements achieve surface contact instead of point contact, increasing the contact area and forming a stable contact. This not only improves heat conduction efficiency but also enables long-term stable detection.

[0009] In the temperature detection device, by setting multiple array-spaced mounting positions on the heat-conducting base, multiple temperature detection components are installed one-to-one at the mounting positions on the heat-conducting base, which can realize the detection of the temperature distribution on the surface of the workpiece to be tested, and can be used in conjunction with the heat sink; the signal connector connects at least two temperature detection components, and by the deformation of the signal connector, the temperature detection device maintains the relative positional accuracy after being compressed, reducing the temperature measurement error caused by deformation.

[0010] Since the server uses the aforementioned temperature detection components and temperature detection devices, it has at least the beneficial effects of the aforementioned temperature detection components and temperature detection devices. Attached Figure Description

[0011] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of the temperature detection component provided in the embodiments of this application;

[0013] Figure 2 A schematic diagram of the first state of the heat insulation and heat conduction components of the temperature detection component provided in the embodiments of this application;

[0014] Figure 3 A schematic diagram of the second state of the heat insulation and heat conduction components of the temperature detection assembly provided in the embodiments of this application;

[0015] Figure 4 This is a schematic diagram of the structure of the temperature detection device provided in the embodiments of this application;

[0016] Figure 5 This is a schematic diagram of the structure of the heat-conducting base of the temperature detection device provided in the embodiments of this application;

[0017] Figure 6A schematic diagram of the structure of a signal connector for a temperature detection device provided in an embodiment of this application;

[0018] Figure 7 A schematic diagram of another signal connector for the temperature detection device provided in the embodiments of this application;

[0019] Figure 8 A schematic diagram of the signal output component of the temperature detection device provided in the embodiments of this application.

[0020] The above figures include the following reference numerals:

[0021] 100. Temperature detection component; 110. Thermal insulation component; 120. Spacing; 121. Middle section; 122. First end; 123. Second end; 130. Thermal conductive component; 131. First thermal conductive part; 132. Second thermal conductive part; 140. Temperature detection component; 141. Detection part; 142. Transmission part; 200. Temperature detection device; 210. Thermal conductive base; 211. Mounting position; 212. Thermal insulation structure; 220. Signal connector; 221. Connection channel; 230. Signal output component. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, other embodiments obtained by those of ordinary skill in the art without creative effort are all within the protection scope of this application.

[0023] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, the difference between the two equal entities being less than or equal to 5% of either one. The terms "first" and "second," etc., are used only to distinguish one entity or operation from another entity or operation and do not necessarily require or imply any such actual relationship or order between these entities or operations. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] First, let me explain the terms used in this application:

[0025] Seebeck effect: refers to the phenomenon that when two different conductors or semiconductors are connected to form a closed circuit, a continuous potential difference is generated in the circuit when the two junctions are at different temperatures, thus forming a current and converting heat energy into electrical energy.

[0026] In related technologies, the surface temperature of heat-generating components in electronic devices is typically detected using non-contact infrared thermal imaging or contact-type flexible temperature sensors or thermocouples. However, infrared thermal imaging can only detect temperature transiently and cannot provide stable long-term measurements. While flexible temperature sensors are malleable, the direction of deformation under pressure can affect measurement errors, and they are also susceptible to interference from heat conduction. Thermocouples can only perform single-point measurements and cannot measure the surface temperature distribution of heat-generating components, thus limiting their measurement range. Furthermore, none of these methods can be used as thermal interface materials in conjunction with heat sinks, which limits their application.

[0027] Therefore, embodiments of this application provide a temperature detection component, a temperature detection device, and a server. The temperature detection component includes a heat insulation component, a heat conduction component, and a temperature detection component. Both the heat insulation component and the heat conduction component are deformable components. The heat insulation component forms a heat insulation channel, and the heat conduction component is located within the heat insulation channel and spaced apart from the heat insulation component. By setting the heat insulation component and forming the heat insulation channel, the heat insulation component and the heat insulation channel work together to effectively block the heat conduction path along the XY plane while retaining heat conduction in the Z-axis direction, thereby reducing the interference of heat conduction in the XY plane on the temperature of the measuring point and improving measurement accuracy. By setting the heat conduction component within the heat insulation channel, when the temperature detection component is in a compressed state, the two heat conduction components achieve surface contact from point contact, increasing the contact area and forming a stable contact. This not only improves heat conduction efficiency but also enables long-term stable detection.

[0028] The temperature detection device includes a heat-conducting base, temperature detection components, and a signal connector. The heat-conducting base has mounting positions arranged in an array at intervals. Multiple temperature detection components are installed in corresponding mounting positions. The signal connector connects at least two temperature detection components. By setting multiple array-arranged mounting positions on the heat-conducting base, and installing multiple temperature detection components in corresponding positions, the temperature distribution on the surface of the workpiece can be detected, and it can be used in conjunction with a heat sink. The signal connector connects at least two temperature detection components. Through the deformation of the signal connector, the temperature detection device maintains relative positional accuracy even under pressure, reducing temperature measurement errors caused by deformation.

[0029] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Firstly, referring to Figure 1As shown in the figure, this application embodiment provides a temperature detection component 100, including a heat insulation component 110, a heat conduction component 130, and a temperature detection component 140. The heat insulation component 110 is a deformable component and has a heat insulation channel. The heat conduction component 130 is a deformable component with the same deformation direction as the heat insulation component 110. The heat conduction component 130 is located in the heat insulation channel, and a gap 120 is formed between the heat conduction component 130 and the heat insulation component 110. The end of the heat conduction component 130 in the deformation direction is used for thermal communication with the component to be detected. The temperature detection component 140 is disposed in the heat insulation component 110 and is used to detect the heat conducted to the heat conduction component 130.

[0031] In this embodiment, the heat insulation component 110 extends along the Z-axis, preventing heat conduction along the XY plane while also supporting the structure of the temperature detection component to prevent asymmetric deformation of the core heat-conducting area during compression deformation, which could affect measurement accuracy. The heat insulation component 110 has a ring-shaped structure with a heat insulation channel extending along the Z-axis in its central region. The heat insulation component 110 and the heat insulation channel work together to further prevent heat conduction along the XY plane of the temperature detection component 100, thereby affecting the accuracy of temperature detection in the measurement area. Exemplarily, the heat insulation component 110 can be made of heat insulation foam or heat insulation gel. The heat insulation foam is a closed-cell or open-cell foam material formed by polymer foaming, and the heat insulation gel can be polydimethylsiloxane gel, specifically an organosilicon material with low crosslinking density and a semi-solid gel state. It has good elasticity and high-temperature resistance, and is easy to recover after deformation, effectively adapting to the high heat of the device under test and the compression deformation of the temperature detection component 100.

[0032] In this embodiment, the heat-conducting element 130 is disposed within the heat-insulating channel to conduct heat from the object to be tested, so that the temperature detection element 140 disposed within the heat-conducting element 130 can detect it. Exemplarily, the heat-conducting element 130 can be a heat-conducting pad with good resilience, specifically a carbon fiber heat-conducting pad. Since carbon fiber heat-conducting pads have strong thermal anisotropy, exhibiting a high thermal conductivity in the Z-axis direction and a lower thermal conductivity in the XY plane, using a carbon fiber heat-conducting pad can reduce temperature measurement errors caused by heat conduction at the measuring point in the XY plane, thereby improving heat conduction efficiency.

[0033] It is understood that the heat insulation element 110 is arranged in a ring around the heat conducting element 130, and a gap 120 is formed between the inner wall of the heat insulation element 110 and the heat conducting element 130 (e.g., Figure 2As shown), the space 120 can be filled with a gaseous insulating medium, such as air or argon, to further prevent heat conduction along the XY plane. The dimensions of the space 120 need to take into account the compression rate of the temperature sensing component 100 during installation. For example, the XY dimension before compression can be 100-300 μm, and the space 120 will still exist after compression (as shown). Figure 3 As shown in the figure, the XY dimension after compression can be 50-150μm. At this time, the temperature detection component 100 is in a compressed state, which can effectively isolate the conduction of heat in the XY plane after compression, so that the temperature at the measuring point can reflect the local thermal state of the object under test.

[0034] In other embodiments, an elastic insulation layer can be provided within the gap between the heat-conducting element 130 and the heat-insulating element 110 to increase the heat insulation effect in the XY plane. The elastic insulation layer can deform synchronously during compression and maintain its heat insulation effect even after compression. For example, the elastic insulation layer can be multi-layered, with multiple layers nested along the XY direction, forming multiple gaps between adjacent insulation layers. Different low-thermal-conductivity gases are filled in these gaps to further enhance the heat insulation effect and effectively improve the heat conduction blocking rate in the XY plane.

[0035] It should be noted that the extension direction of the XY plane is perpendicular to the compression direction of the temperature detection component 100, and the Z-axis direction is the compression direction of the temperature detection component 100.

[0036] As one feasible implementation, along the deformation direction of the heat insulation member 110, the heat insulation channel has a middle portion 121 and two ends located on opposite sides of the middle portion 121; the channel size of the heat insulation channel tends to increase along the middle portion 121 to the ends; in the heat insulation channel, at least a gap 120 is formed between the middle portion 121 and the relative position of the heat conductor 130.

[0037] Exemplarily, the channel size from the middle 121 to the end of the heat insulation channel tends to increase. Specifically, the channel size gradually increases from the middle 121 to the end, making the inner wall surface of the heat insulation member 110 inclined. This helps to reduce lateral shear stress during compression, provides a smooth stress transition, and reduces stress concentration-induced material damage to the heat insulation member 110. In this embodiment, the end of the heat insulation channel near the test member is the first end 122, and the end away from the test member is the second end 123.

[0038] As one feasible implementation, the cross-sectional area of ​​the heat-conducting element 130 located at the middle 121 is smaller than the cross-sectional area of ​​the heat-conducting element 130 located at the end; the cross-section of the heat-conducting element 130 is perpendicular to the deformation direction of the heat-conducting element 130; when the heat-conducting element 130 is compressed along the deformation direction, the cross-sectional area of ​​the heat-conducting element 130 located at the middle 121 increases.

[0039] In one feasible implementation, the heat-conducting element 130 includes a first heat-conducting portion 131 and a second heat-conducting portion 132 connected to each other. The first heat-conducting portion 131 is located from the middle portion 121 to one end of the heat insulation channel, and the second heat-conducting portion 132 is located from the middle portion 121 to the other end of the heat insulation channel. The connection between the first heat-conducting portion 131 and the second heat-conducting portion 132 is located in the middle portion 121 of the heat insulation channel. Along the direction from the middle portion 121 to the end, the cross-sectional area of ​​the first heat-conducting portion 131 and / or the second heat-conducting portion 132 tends to increase.

[0040] Exemplarily, the number of heat-conducting components 130 can be multiple. In this embodiment, there are two heat-conducting components 130, namely a first heat-conducting part 131 and a second heat-conducting part 132, both correspondingly disposed within the heat insulation channel, and their shape is a conical structure. The heat-conducting component 130 located in the channel from the middle 121 to the first end 122 of the heat insulation channel is the first heat-conducting part 131, and the heat-conducting component 130 located in the channel from the middle 121 to the second end 123 of the heat insulation channel is the second heat-conducting part 132. Both the first heat-conducting part 131 and the second heat-conducting part 132 are conical structures with a triangular cross-section. The tops of the first heat-conducting part 131 and the second heat-conducting part 132 abut against each other, with the abutment located in the middle 121 of the heat insulation channel. The bottom of the first heat-conducting part 131 is flush with the first end 122 of the heat insulation channel, and the bottom of the second heat-conducting part 132 is flush with the second end 123 of the heat insulation channel. In other embodiments, the heat-conducting element 130 may also be a pyramidal structure.

[0041] Along the direction from the middle 121 to the end, the cross-sectional areas of the first heat-conducting part 131 and the second heat-conducting part 132 tend to increase, specifically, they gradually increase. When the temperature detection component 100 is not deformed under pressure, the first heat-conducting part 131 and the second heat-conducting part 132 form point contact at the middle 121 position. When the temperature detection component 100 is subjected to pressure, it is easily compressed and deformed to absorb compressive stress, preventing stress transmission and damage to the test piece. Therefore, it can protect the test piece. When the two heat-conducting parts 130 are deformed under pressure, the contact point between the first heat-conducting part 131 and the second heat-conducting part 132 changes from point contact to surface contact, increasing the contact area in the XY direction. This increases the area for heat conduction, effectively improving the heat conduction efficiency in the Z-axis direction while avoiding the impact of asymmetric deformation on detection accuracy. In this way, the heat of the test piece can be quickly and efficiently conducted to the second heat-conducting part 132 through the first heat-conducting part 131. It can not only be efficiently conducted to the temperature detection part 140 for detecting the temperature of its measuring point, reducing the detection data error caused by heat transfer, but can also continue to be conducted to the heat sink installed on the side of the second heat-conducting part 132 away from the first heat-conducting part 131 for efficient heat dissipation of the test piece.

[0042] In one feasible implementation, the temperature detection element 140 includes a detection section 141 and a transmission section 142 that are electrically connected. The detection section 141 is disposed inside the heat-conducting element 130, and the transmission section 142 extends to the outside of the heat-conducting element 130 and the heat insulation element 110.

[0043] For example, the temperature sensing element 140 is a thermocouple, which is a temperature sensor that converts a temperature signal into a potential (voltage) signal based on the Seebeck effect. The sensing part 141 of the temperature sensing element 140 is a thermocouple probe, and the transmission part 142 is a thermocouple wire. The thermocouple probe is tightly connected to the heat-conducting element 130.

[0044] The detection unit 141 is the measuring end component of the temperature sensing element 140, which is in direct contact with the object under test or the heat-conducting element 130 disposed on the object under test. It consists of a measuring end, a protective structure, and a lead-out end. The measuring end is the welding joint of the transmission unit 142. For example, the protective structure can be a stainless steel metal sleeve and a ceramic insulation layer to protect the thermocouple probe from chemical corrosion, oxidation, or wear. The measuring end, protective structure, and lead-out end work together to accurately sense the temperature of the object under test, enabling rapid thermal equilibrium and minimizing temperature detection errors.

[0045] The transmission unit 142 serves as the signal transmission channel for the temperature sensing element 140. It consists of two metal wires of different materials, designated as a positive and a negative wire, which can be either a K-type or a T-type thermocouple. For example, the K-type thermocouple is made of nickel-chromium / nickel-silicon material, color-coded yellow and red, suitable for medium-high temperature environments (-270℃ to 1372℃), and supports rapid dynamic response. The T-type thermocouple is made of copper / constantan material, color-coded blue and red, suitable for low-temperature environments (-270℃ to 400℃), and offers higher accuracy. One end of the transmission unit 142 is connected to the sensing unit 141, and the other end is connected to the reference end, forming a closed loop. Here, the reference end is a component with predictable and stable temperature. When a temperature difference exists between the measuring end and the reference end, a potential difference is generated at the junction of the two ends of the thermocouple. The transmission unit 142 transmits this potential difference to the temperature acquisition circuit on the reference end side, and finally, the temperature value of the measuring end can be measured through calculation.

[0046] In summary, the temperature detection component 100 provided in this application embodiment, through the synergistic effect of the heat-conducting component 130 and the heat-insulating component, and with a gap 120 between them, can effectively block the heat conduction path along the XY plane, retaining only the heat conduction in the Z-axis direction, reducing the interference of heat conduction on the temperature of the measuring point, and improving the measurement accuracy.

[0047] Secondly, referring to Figure 4 As shown, this application embodiment provides a temperature detection device 200, including a heat-conducting base 210, the aforementioned temperature detection components 100, and a signal connector 220. A plurality of temperature detection components 100 are arranged in an array and spaced apart on the heat-conducting base 210, and the heat-conducting element 130 of the temperature detection components 100 is thermally connected to the heat-conducting base 210. The signal connector 220 connects the temperature detection elements 140 of at least two temperature detection components 100.

[0048] For example, the thermally conductive base 210 is mounted on the surface of the component to be tested to conduct heat from the surface of the component to the temperature sensing component 100 for measuring its surface temperature. The thermally conductive base 210 uses a thermally conductive interface material, specifically a thermally conductive pad. The thermally conductive pad used here can be a carbon fiber thermally conductive pad. Because carbon fiber has a highly ordered graphite microcrystalline structure inside, the heat transfer efficiency along the fiber axis is extremely high. Therefore, it has a high thermal conductivity in the Z-axis direction, specifically 400-1000 W / mK, and exhibits anisotropy in the XY plane, showing a low thermal conductivity, specifically 1-5 W / mK.

[0049] In another embodiment, thermally conductive gel, thermally conductive phase change material, or other thermally conductive interface materials can also be used. Specifically, paraffin-based thermally conductive phase change materials can be used, whose phase change properties can be utilized to reduce surface temperature fluctuations of the device under test. In yet another embodiment, a graphene composite thermally conductive pad can be used, which can further improve the thermal conductivity of the Z-axis to over 1500 W / mK. In addition, since graphene is a two-dimensional material, a very thin graphene composite thermally conductive pad can achieve good thermal conductivity, and its thickness can be reduced to 50 μm, thereby reducing the overall weight of the temperature detection device 200.

[0050] In this embodiment, the thermally conductive base 210 has multiple mounting positions 211 arranged in an array at intervals. Exemplarily, the mounting positions 211 can be mounting grooves or mounting holes. Multiple temperature sensing components 100 are correspondingly disposed in the mounting grooves or mounting holes, thus the mounting positions 211 can fix the temperature sensing components 100 to a measurement area. By arranging the temperature sensing components 100 in an array at the mounting positions 211 of the thermally conductive base 210, the surface temperature distribution of the object to be tested can be measured. The thermally conductive base 210 can not only conduct heat to the temperature sensing component 140 to detect the surface temperature distribution of the object to be tested, but also transfer heat to the heat sink to dissipate heat from the heat-generating element, which can also be understood as the object to be tested.

[0051] It is understood that since the temperature detection device 200 of this application uses the technical solution of the temperature detection component 100 embodiment described above, it has at least the beneficial effects brought about by the technical solution of the temperature detection component 100 embodiment described above, which will not be described in detail here.

[0052] In the embodiments of this application, the signal connector 220 is used to connect each temperature detection component 100 to maintain the accuracy of the relative position of each temperature detection component 100. The flexible signal connector 220 can meet the extensibility required by the temperature detection component 100 when it is subjected to pressure deformation, so that a heat sink can be installed on the side of the temperature detection device 200 away from the test object to meet the installation requirements between the test object and the heat sink.

[0053] In summary, multiple temperature detection components 100 are arrayed on the thermally conductive base 210 to form an "island"-shaped detection unit. The signal connector 220 is pre-deformed to connect the temperature detection components 100 to form a "bridge"-shaped connection unit, so that the arrayed temperature detection components 100 form an island-bridge structure. This achieves synergistic optimization of the compressibility and thermal conductivity of the temperature detection device 200, enabling accurate detection of the temperature distribution when the surface is covered by a heat sink.

[0054] As one feasible implementation method, refer to Figure 5As shown, the heat-conducting base 210 is provided with multiple mounting positions 211, which are arranged in an array at intervals; multiple temperature detection components 100 are installed in the multiple mounting positions 211 in a corresponding manner; along the deformation direction of the heat-conducting element 130 perpendicular to the temperature detection component 100, the size of the mounting position 211 is larger than the size of the compressed temperature detection component 100.

[0055] In this embodiment, the number and density of the multiple mounting positions 211 and multiple temperature detection components 100 arranged in an array can be set according to the needs of detecting the surface temperature distribution of the device under test. For example, they can be equidistant arrays of 3×3, 4×4, or 5×5, or they can be set according to the shape of the surface to be measured, specifically equidistant arrays of 3×4, 4×5, or 5×6. Furthermore, the heat flux density distribution on the surface of the device under test can be calculated by real-time acquisition of power consumption data, and the array spacing can be dynamically adjusted to adjust the density of the detection components based on the heat flux density distribution. Specifically, the array spacing can be 1-3 mm in areas with high heat flux density (e.g., the central area), and 5-8 mm in areas with low heat flux density (e.g., the edge area). It is understood that the density of the temperature detection components 100 can be adjusted according to the known temperature distribution, which can improve the temperature detection resolution and accuracy.

[0056] As another feasible implementation method, continue to refer to Figure 5 As shown, the heat-conducting base 210 is provided with a heat insulation structure 212, which is disposed between two adjacent mounting positions 211.

[0057] In some embodiments, the heat insulation structure 212 can be a heat insulation groove, the opening of which is located on the same surface of the heat-conducting base 210 as the opening of the mounting groove. Multiple heat insulation grooves extend toward a position perpendicular to the relative positions of two adjacent mounting locations 211, which can be understood as forming a mesh-like structure on the surface of the heat-conducting base 210. The heat insulation groove can be filled with a heat insulation medium.

[0058] In other embodiments, the heat insulation structure 212 can be a heat insulation channel, which can also be filled with a heat insulation medium. For example, the heat insulation medium in the heat insulation groove or heat insulation channel can be air, aerogel powder, silica powder, or other powdered media.

[0059] In some embodiments, the heat insulation structure 212 can also be a heat insulation material embedded in the heat-conducting base 210. The heat insulation material can be a strip structure. For example, the heat insulation material can be a porous or foam material, specifically heat insulation foam, foam plastic, or aerogel. By creating heat insulation grooves or channels on the heat-conducting base 210, or by embedding heat insulation material inside the heat-conducting base 210, heat conduction along the XY plane can be further prevented, thereby improving the accuracy of temperature detection at the detection point.

[0060] As one feasible implementation method, refer to Figure 6 and Figure 7 As shown, the signal connector 220 has a connection channel 221, which is used to house the transmission section 142 of the temperature sensing element 140 of the temperature sensing assembly 100.

[0061] The signal connector 220 is a deformable component with a deformable structure. The deformation direction of the deformable structure is perpendicular to the deformation direction of the heat-conducting component 130. The deformable structure has a tendency to deform along the deformation direction perpendicular to the heat-conducting component 130.

[0062] In this embodiment, the signal connector 220 is used to connect the various temperature detection components 100 in the temperature detection device 200, ensuring the accuracy of the relative positions of the detection parts 141 in each temperature detection component 100. For example, the signal connector 220 is a folded paper structure or a pre-deformed bridge structure. When the temperature detection device 200 is compressed under pressure, the multiple arrayed temperature detection components 100 can extend and shift accordingly. Specifically, the structure can be arc-shaped (e.g., ...). Figure 6 ) or triangular arch structure (such as Figure 7 Since most of the surfaces of the parts to be tested are planar, the tensile deformation of the temperature detection device 200 in this embodiment only occurs in the XY plane and there is no tensile deformation in the Z-axis direction. Therefore, the above-mentioned deformation direction can be achieved by using a pre-deformed arc-shaped or triangular arch bridge structure, so that the temperature detection device 200 can be in stable contact with the surface of the parts to be tested, thereby satisfying the ductility required by the temperature detection component 100 array under pressure deformation.

[0063] For example, the signal connector 220 may be made of polyimide film or polydimethylsiloxane (PDMS) or other polymer film, and has high elasticity. Its structure is an origami structure or pre-deformed. When the temperature detection device 200 is compressed and deformed, the array unit of the temperature detection component 100 can be extended and displaced accordingly.

[0064] In this embodiment, the transmission section 142 of the temperature sensing element 140 is disposed within the connection channel 221 of the signal connector 220. The signal connector 220 and the connection channel 221 form a physical isolation barrier, isolating electromagnetic interference and preventing the temperature signal of the transmission section 142 from being superimposed with noise, thus ensuring the detection accuracy of the temperature sensing element 140. Furthermore, the placement of the transmission section 142 within the connection channel 221 avoids the need for slotting or other operations on the metal package at the top of the component to be tested to accommodate the transmission section 142, thereby preventing damage to the component and ensuring steady-state temperature distribution detection when the component is operating normally and has a heat sink on its surface.

[0065] As one feasible implementation method, refer to Figure 8 As shown, it also includes a signal output unit 230, which is connected to the signal connector 220 and / or the transmission section 142 of the temperature detection unit 140 of the temperature detection assembly 100.

[0066] It is understood that the signal output device 230 is the centralized output terminal of the transmission section 142 of each temperature detection device 140, and can be understood as the electrode of the temperature detection signal, used to collect the signal detected by the temperature detection components 100 of each array. Exemplarily, there can be multiple signal output devices 230. In this embodiment, there are two signal output devices 230, and they are disposed on the same side of the temperature detection device 200. Specifically, by converging multiple and dispersed thermocouple wires into two centralized, structured output terminals, the electrical connection between the multiple temperature detection components 100 of the temperature detection device 200 and the external data acquisition system is greatly simplified, making the multiple temperature detection components 100 compact and facilitating subsequent maintenance.

[0067] For example, the signal output device 230 can employ a combination of a copper-clad substrate and a gold-plated layer. The copper-clad substrate is formed by covering a layer of copper onto, for example, a glass fiber epoxy resin or ceramic substrate, with the thick copper layer providing conductive pathways and mechanical support. Gold plating on the surface of the copper-clad substrate can improve the oxidation resistance of the thick copper layer and maintain the stability of the long-term connection. Furthermore, to reduce costs, tin or a tin alloy can also be plated on the copper-clad substrate, offering good solderability. The signal output device 230 can also use graphene flexible electrodes, with high-density conductive pathways formed by laser etching, further reducing electrode contact resistance and enabling detection of high-frequency temperature fluctuations.

[0068] In summary, the temperature detection device 200 of this application embodiment, by providing multiple arrayed mounting positions 211 on the thermally conductive base 210, with multiple temperature detection components 100 correspondingly arranged at the mounting positions 211, realizes the detection of the temperature distribution on the surface of the workpiece to be tested; adjacent temperature detection components 100 are connected by a flexible signal connector 220, which can adapt to the deformation of the temperature detection device 200 under pressure and absorb compressive stress, while maintaining relative positional accuracy after being compressed. The temperature detection device 200 of this application combines compressibility and high thermal conductivity, and can meet the detection requirements of flexibility, extensibility and high thermal conductivity.

[0069] Thirdly, embodiments of this application also provide a server, including electronic components and the temperature detection device 200 described above, wherein the electronic components are thermally connected to the heat-conducting base 210 of the temperature detection device 200.

[0070] It is understood that since the server in this application adopts the technical solution of the above-described temperature detection device 200 embodiment, it has at least the beneficial effects brought about by the technical solution of the above-described temperature detection device 200 embodiment, which will not be described in detail here.

[0071] For example, the electronic component is the device to be tested described above, which can also be understood as a heat source, specifically a processor, controller, battery pack, or motor. When the server is powered on, current flows through the electronic component, and the power consumption of the electronic component converts electrical energy into continuous, high-density heat energy, thereby forming an extremely high heat flux density. The heat-conducting base 210 of the temperature detection device 200 is disposed on the heating surface of the electronic component and is thermally connected to the heat-conducting base 210, for conducting heat so that the temperature detection element 140 in the temperature detection assembly 100 can perform real-time and accurate detection, converting the temperature signal into a processable electrical signal.

[0072] In this embodiment, the server further includes a heat sink, which is disposed on the side of the temperature detection device 200 away from the electronic components. The heat-conducting base 210 of the temperature detection device 200 and the heat-conducting element 130 in the temperature detection assembly 100 conduct heat from the electronic components to the temperature detection element 140 and simultaneously to the heat sink for heat dissipation. For example, the heat sink can be an air-cooled heat sink or a liquid-cooled heat sink. The heat generated by the electronic components is efficiently conducted to the air through the heat dissipation fins on the surface of the heat sink, allowing the electronic components to operate normally and thus extending the service life of the electronic components and the server.

[0073] The temperature detection component, temperature detection device, and server provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A temperature detection component, characterized in that, include: A heat insulation component (110) is a deformable component, and the heat insulation component (110) has a heat insulation channel formed thereon; A heat-conducting element (130) is a deformable element. The heat-conducting element (130) and the heat insulation element (110) have the same deformation direction. The heat-conducting element (130) is located in the heat insulation channel. A gap (120) is formed between the heat-conducting element (130) and the heat insulation element (110). The end of the heat-conducting element (130) in the deformation direction is used to conduct heat with the object to be tested. Temperature detection element (140), which is disposed in the heat insulation element (110) and is used to detect the heat conducted to the heat conduction element (130); Along the deformation direction of the heat insulation member (110), the heat insulation channel has a middle section (121) and two ends located on opposite sides of the middle section (121); The channel size of the heat insulation channel tends to increase from the middle (121) to the end. In the heat insulation channel, at least the middle part (121) and the heat-conducting element (130) are separated by the gap (120).

2. The temperature detection component according to claim 1, characterized in that, The cross-sectional area of ​​the heat-conducting element (130) located at the middle (121) is smaller than the cross-sectional area of ​​the heat-conducting element (130) located at the end; The cross-section of the heat-conducting element (130) is perpendicular to the deformation direction of the heat-conducting element (130); When the heat-conducting element (130) is compressed along the deformation direction, the cross-sectional area of ​​the heat-conducting element (130) located at the middle (121) increases.

3. The temperature detection component according to claim 2, characterized in that, The heat-conducting component (130) includes a first heat-conducting part (131) and a second heat-conducting part (132) connected to each other. The first heat-conducting part (131) is located from the middle part (121) to one end of the heat insulation channel, and the second heat-conducting part (132) is located from the middle part (121) to the other end of the heat insulation channel. The connection between the first heat-conducting part (131) and the second heat-conducting part (132) is located in the middle part (121) of the heat insulation channel. Along the direction from the middle (121) to the end, the cross-sectional area of ​​the first heat-conducting part (131) and / or the second heat-conducting part (132) tends to increase.

4. The temperature detection component according to any one of claims 1-3, characterized in that, The temperature detection element (140) includes a detection part (141) and a transmission part (142) that are electrically connected. The detection part (141) is disposed inside the heat-conducting element (130), and the transmission part (142) is led to the outside of the heat-conducting element (130) and the heat insulation element (110).

5. A temperature detection device, characterized in that, include: Thermally conductive base (210); A plurality of temperature sensing components (100) as described in any one of claims 1-4 are mounted in an array at intervals on the heat-conducting base (210); the heat-conducting element (130) of the temperature sensing component (100) is thermally connected to the heat-conducting base (210); The signal connector (220) connects at least two of the temperature sensing components (140) of the temperature sensing assembly (100).

6. The temperature detection device according to claim 5, characterized in that, The heat-conducting base (210) is provided with multiple mounting positions (211), and the multiple mounting positions (211) are arranged in an array at intervals; Multiple temperature detection components (100) are installed in a corresponding manner at multiple mounting positions (211); Along the deformation direction of the heat-conducting element (130) perpendicular to the temperature sensing component (100), the size of the mounting position (211) is larger than the size of the compressed temperature sensing component (100).

7. The temperature detection device according to claim 5, characterized in that, The signal connector (220) has a connection channel (221) for accommodating the transmission part (142) of the temperature detection element (140) of the temperature detection component (100). The signal connector (220) is a deformable component, and the signal connector (220) has a deformable structure. The deformation direction of the deformable structure is perpendicular to the deformation direction of the heat-conducting component (130). The deformable structure has a tendency to deform along a deformation direction perpendicular to the heat-conducting element (130).

8. The temperature detection device according to any one of claims 5-7, characterized in that, It also includes a signal output unit (230), which is connected to the transmission part (142) of the signal connector (220) and / or the temperature detection unit (140) of the temperature detection assembly (100).

9. A server, characterized in that, include: Electronic components; The temperature detection device (200) according to any one of claims 5-8, wherein the electronic component is thermally connected to the thermally conductive base (210) of the temperature detection device (200).

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