Method, system, equipment and medium for detecting whether back drilling leakage exists in circuit board

Abstract

The invention discloses a method, a system, equipment and a medium for detecting whether back drilling leakage exists in a circuit board, and relates to the technical field of circuit board detection. The method comprises the following steps: determining a back drilling hole of the circuit board as a deep back drilling hole or a shallow back drilling hole; when AVI detection data of the circuit board is manufactured, layers, belonging to deep back drilling holes, of the circuit board are combined into a deep back drilling layer, and layers, belonging to shallow back drilling holes, of the circuit board are combined into a shallow back drilling layer; outputting the back drilling holes of the deep back drilling layer on the surface of the circuit board as first back drilling holes, and outputting the back drilling holes of the shallow back drilling layer on the surface of the circuit board as second back drilling holes; determining the shadow area difference between the exposed back drilling hole and the first back drilling hole and the shadow area difference between the exposed back drilling hole and the second back drilling hole of the circuit board through an AVI detection machine; setting a color value standard according to the shadow region difference; and according to the color value standard, performing scanning detection on the circuit board to be detected through the AVI detection machine, and determining whether the back drilling leakage exists in the circuit board to be detected or not. According to the method, the situation of false point reporting can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board detection, in particular to a method and system for detecting whether a circuit board has a missed back drill, a device and a medium. BACKGROUND

[0002] Currently, with the rapid development of 5G communication, signal integrity is a major challenge in the PCB design and manufacturing process. PCB back drilling, also known as controlled depth drilling, aims to remove the conductive via stub of the copper cylinder in the PCB via. The via stub will seriously affect the signal integrity in high-speed design, causing the signal to reflect back from the stub end and interfere with the original signal. The longer the stub, the more serious the signal distortion. To solve this problem, there is a back drilling process. When the AVI machine detects the related PCB circuit board with a back drilling process, it often reports false points, i.e., missed back drilling and shallow back drilling / deep back drilling are reported at the same time, and manual visual inspection is prone to missed detection. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a method and system for detecting whether a circuit board has a missed back drill, a device and a medium, which can avoid the occurrence of missed detection or false point reporting.

[0004] In one aspect, the method for detecting whether a circuit board has a missed back drill according to an embodiment of the present application comprises:

[0005] determining whether the back drill hole of the circuit board is a deep back drill hole or a shallow back drill hole;

[0006] when making AVI detection data of the circuit board, merging layers of the circuit board belonging to the deep back drill hole into a deep back drill layer and merging layers of the circuit board belonging to the shallow back drill hole into a shallow back drill layer;

[0007] outputting the back drill hole of the deep back drill layer on the surface of the circuit board as a first back drill hole and outputting the back drill hole of the shallow back drill layer on the surface of the circuit board as a second back drill hole;

[0008] determining the shadow area difference between the missed back drill hole of the circuit board and the first back drill hole and the second back drill hole by an AVI detection machine;

[0009] setting a color value standard according to the shadow area difference;

[0010] scanning and detecting a circuit board to be detected by the AVI detection machine according to the color value standard to determine whether the circuit board to be detected has a missed back drill.

[0011] According to some embodiments of the present application, the determination of whether the back drill hole of the circuit board is a deep back drill hole or a shallow back drill hole comprises:

[0012] visually inspecting the back-drilling holes of the circuit board;

[0013] According to whether the copper layer is visible, the back-drilling holes are divided into deep back-drilling holes and shallow back-drilling holes; the back-drilling holes in which the copper layer is not visible are the deep back-drilling holes, and the back-drilling holes in which the copper layer is visible are the shallow back-drilling holes.

[0014] According to some embodiments of the present application, when the AVI detection data of the circuit board is made, the layers of the circuit board belonging to the deep back-drilling holes are combined into deep back-drilling layers, and the layers of the circuit board belonging to the shallow back-drilling holes are combined into shallow back-drilling layers, including:

[0015] determining which layer of the circuit board is drilled by the shallow back-drilling hole, and attributing the corresponding layer to the shallow back-drilling layer;

[0016] determining which layer of the circuit board is drilled by the deep back-drilling hole, and attributing the corresponding layer to the deep back-drilling layer.

[0017] According to some embodiments of the present application, the back-drilling holes of the deep back-drilling layers are output as first back-drilling holes on the surface of the circuit board, and the back-drilling holes of the shallow back-drilling layers are output as second back-drilling holes on the surface of the circuit board, including:

[0018] judging whether the deep back-drilling holes and the shallow back-drilling holes are located on the component surface or the solder surface of the circuit board;

[0019] according to the judgment result, outputting the back-drilling holes of the deep back-drilling layers as first back-drilling holes on the component surface or the solder surface of the circuit board, and outputting the back-drilling holes of the shallow back-drilling layers as second back-drilling holes on the component surface or the solder surface of the circuit board.

[0020] According to some embodiments of the present application, the difference between the missing back-drilling hole of the circuit board and the shadow area of the first back-drilling hole and the second back-drilling hole is determined by an AVI detection machine, including:

[0021] determining the shadow range of the missing back-drilling hole, the shadow range of the first back-drilling hole, and the shadow range of the second back-drilling hole by scanning the circuit board through the AVI detection machine;

[0022] According to the shadow range of the missing back-drilling hole, the shadow range of the first back-drilling hole, and the shadow range of the second back-drilling hole, setting the detection threshold value of the AVI detection machine for detecting the missing back-drilling hole, the first back-drilling hole, and the second back-drilling hole.

[0023] In another aspect, a system for detecting whether a back-drilling is missed on a circuit board according to embodiments of the application includes at least one control processor and a memory communicatively coupled to the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to perform the method for detecting whether a back-drilling is missed on a circuit board as described in the above aspects.

[0024] In another aspect, an electronic device according to embodiments of the application includes the system for detecting whether a back-drilling is missed on a circuit board as described in the above aspects.

[0025] In another aspect, a computer-readable storage medium according to embodiments of the application stores computer-executable instructions for causing a computer to perform the method for detecting whether a back-drilling is missed on a circuit board as described above.

[0026] The method and system, device and medium for detecting whether a back-drilling is missed on a circuit board according to embodiments of the application have at least the following beneficial effects: by distinguishing between deep back-drilling and shallow back-drilling, and determining the difference in the shadow area of the missed back-drilling and the first back-drilling and the second back-drilling, a color value standard can be set, and the circuit board is scanned according to the color value standard, so that the area of the missed back-drilling can be accurately identified, and false point reporting can be avoided.

[0027] Additional aspects and advantages of the application will be made apparent by the following description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and / or additional aspects and advantages of the application will become apparent and be made clear to the reader by the following description and the accompanying drawings, in which:

[0029] Figure 1 Flowchart of the steps of the method for detecting whether a back-drilling is missed on a circuit board according to embodiments of the application. DETAILED DESCRIPTION

[0030] Embodiments of the application are described in detail below with reference to examples illustrated in the accompanying drawings, in which the same or similar reference signs identify the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and cannot be understood as limiting the present application. For the step numbers in the following embodiments, they are only set for the convenience of description and explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0031] In the description of the application, it needs to be understood that the orientation description, such as the orientation or position relationship indicated by the upper, lower, front, rear, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0032] The terms "first", "second", "third", and "fourth" and the like in the description and claims of the application and the accompanying drawings are used to distinguish different objects, not to describe a particular order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0033] In the present application, the term "embodiment" means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the application. The appearance of this phrase at various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] AVI detection machine: Automated Visual Inspection, is an automatic appearance detection equipment based on machine vision technology, which realizes the rapid and accurate identification of industrial product appearance defects through high-precision image acquisition and intelligent algorithm.

[0035] At present, with the rapid development of 5G communication, signal integrity is a big challenge in the process of PCB design and manufacturing. PCB back drilling, also known as controllable depth drilling, aims to remove the conductive via stub of the copper cylinder in the PCB via. Via stub will seriously affect signal integrity in high-speed design, causing signal to reflect back from the stub end, interfering with the original signal. The longer the stub, the more serious the signal distortion. In order to solve this problem, there is a back drilling process, and the AVI machine often has false points when detecting related PCB boards with back drilling process, that is, it reports points at the same time of missing back drilling and shallow back drilling / deep back drilling, and manual visual inspection is prone to missing detection.

[0036] Wherein, the leak back drilling refers to that some via holes of the circuit board have back drilling requirements, but the back drilling holes are not drilled / missed at the positions; the deep back drilling hole refers to the back drilling hole whose internal metal hole wall is invisible when the back drilling hole is visually inspected; and the shallow back drilling hole refers to the back drilling hole whose internal metal hole wall is visible when the back drilling hole is visually inspected. Since the metal hole wall of the shallow back drilling hole and the leak back drilling hole is visible, the AVI detection machine will also mistakenly detect some shallow back drilling holes as leak back drilling holes when detecting whether the circuit board has the leak back drilling, so that the false point reporting occurs.

[0037] To solve the above problems, the embodiment of the present application provides a method and system, device and medium for detecting whether the circuit board has the leak back drilling, by distinguishing the deep back drilling hole and the shallow back drilling hole, and determining the shadow area difference between the leak back drilling hole and the first back drilling hole and the second back drilling hole, so that the color value standard can be set, the circuit board is scanned and detected according to the color value standard, the area of the leak back drilling is accurately recognized, and the false point reporting is avoided.

[0038] The method for detecting whether the circuit board has the leak back drilling and the method of the embodiment of the present application will be described in detail below with reference to the drawings.

[0039] On the one hand, the embodiment of the present application provides a method for detecting whether the circuit board has the leak back drilling, as shown in the method comprises the following steps: Figure 1

[0040] Step S100: determining whether the back drilling hole of the circuit board is the deep back drilling hole or the shallow back drilling hole;

[0041] Step S200: when the AVI detection data of the circuit board is made, the layers of the circuit board belonging to the deep back drilling hole are merged into the deep back drilling layer, and the layers of the circuit board belonging to the shallow back drilling hole are merged into the shallow back drilling layer;

[0042] Step S300: outputting the back drilling hole of the deep back drilling layer on the surface of the circuit board as the first back drilling hole, and outputting the back drilling hole of the shallow back drilling layer on the surface of the circuit board as the second back drilling hole;

[0043] Step S400: determining the shadow area difference between the leak back drilling hole of the circuit board and the first back drilling hole and the second back drilling hole by the AVI detection machine;

[0044] Step S500: setting the color value standard according to the shadow area difference;

[0045] Step S600: scanning and detecting the circuit board to be detected by the AVI detection machine according to the color value standard, and determining whether the circuit board to be detected has the leak back drilling.

[0046] ​Specifically, since the drilling depths of the deep back drilling holes and the shallow back drilling holes are different, the imaging patterns of the two are different when the back drilling holes are detected by the AVI detection machine, and thus, the deep back drilling holes and the shallow back drilling holes need to be distinguished first to ensure the accuracy of the detection.

[0047] Specifically, in some embodiments of the present application, in order to distinguish the deep back drilling holes and the shallow back drilling holes, the above step S100 specifically includes the following two steps.

[0048] Step S110: visually inspecting the back drilling holes of the circuit board;

[0049] Step S120: dividing the back drilling holes into deep back drilling holes and shallow back drilling holes according to whether the copper layer is visible in the visual inspection; the deep back drilling holes are those in which the copper layer is invisible, and the shallow back drilling holes are those in which the copper layer is visible.

[0050] It should be noted that the drilling depth of the deep back drilling hole is deeper, and the drilling depth of the shallow back drilling hole is shallower; for example, assuming that the circuit board is an 8-layer board, the drilling depth of the deep back drilling hole may be 4 layers or more, and the drilling depth of the shallow back drilling hole may be only one or two layers. The number of layers of the deep back drilling hole and the shallow back drilling hole of a circuit board of different thicknesses is not the same. In order to distinguish the deep back drilling hole and the shallow back drilling hole, in the present application, the circuit board is first back drilled, and then visually inspected to observe whether the copper layer of the inner wall of the back drilling hole can be seen. If it can be seen, it means that the back drilling hole is a shallow back drilling hole. If it cannot be seen, it means that the back drilling hole is a deep back drilling hole.

[0051] Further, in some embodiments of the present application, the above step S200: when the AVI detection data of the circuit board is made, the layers of the circuit board belonging to the deep back drilling holes are merged into deep back drilling layers, and the layers of the circuit board belonging to the shallow back drilling holes are merged into shallow back drilling layers, specifically includes the following two steps.

[0052] Step S210: determining which layer of the circuit board is drilled by the shallow back drilling hole, and attributing the corresponding layer to the shallow back drilling layer;

[0053] Step S220: determining which layer of the circuit board is drilled by the deep back drilling hole, and attributing the corresponding layer to the deep back drilling layer.

[0054] Specifically, if the shallow back drilling hole drills to the first layer and the second layer of the circuit board, the first layer and the second layer of the circuit board are merged into the shallow back drilling layer; if the deep back drilling hole drills to the third layer and the fourth layer of the circuit board, the third layer and the fourth layer of the circuit board are merged into the deep back drilling layer. Before the circuit board is scanned and detected by the AVI detection machine, the AVI detection data needs to be made to enable the AVI detection machine to determine the detection target. When the AVI detection data is made, there is data conversion software, which can be used to merge the layers that are all deep back drilling or all shallow back drilling by using the layer merging function, so as to facilitate the subsequent distinction between the deep back drilling hole and the shallow back drilling hole.

[0055] Further, in some embodiments of the present application, the step S300 of outputting the back-drilling holes of the deep back-drilling layer as first back-drilling holes and the back-drilling holes of the shallow back-drilling layer as second back-drilling holes on the surface of the circuit board comprises the following two steps:

[0056] Step S310: judging whether the deep back-drilling holes and the shallow back-drilling holes are located on the component surface or the solder surface of the circuit board.

[0057] Step S320: according to the judgment result, outputting the back-drilling holes of the deep back-drilling layer as first back-drilling holes and the back-drilling holes of the shallow back-drilling layer as second back-drilling holes on the component surface or the solder surface of the circuit board.

[0058] It should be noted that the component surface and the solder surface refer to the front and back surfaces of the circuit board. The component surface is mainly used for mounting electronic components and is the bearing surface of the components. The solder surface is used for soldering component pins to realize electrical connection. The presence of back-drilling holes on the front surface or the back surface can be determined by the physical circuit board, and the layer output is performed on the front surface or the back surface. The back-drilling holes of the deep back-drilling layer are output as first back-drilling holes on the component surface or the solder surface of the circuit board, and the back-drilling holes of the shallow back-drilling layer are output as second back-drilling holes on the component surface or the solder surface of the circuit board, which facilitates subsequent detection of the deep back-drilling holes and the shallow back-drilling holes by the AVI detection machine.

[0059] Further, in some embodiments of the present application, the step S400 of determining the shadow area difference between the missing back-drilling holes and the first back-drilling holes and the second back-drilling holes of the circuit board by the AVI detection machine comprises the following two steps:

[0060] Step S410: determining the shadow range of the missing back-drilling holes, the shadow range of the first back-drilling holes, and the shadow range of the second back-drilling holes by the AVI detection machine on the scan image of the circuit board.

[0061] Step S420: setting the detection threshold of the AVI detection machine for detecting the missing back-drilling holes, the first back-drilling holes and the second back-drilling holes according to the shadow range of the missing back-drilling holes, the shadow range of the first back-drilling holes, and the shadow range of the second back-drilling holes.

[0062] Specifically, the AVI detection machine is used to scan the physical circuit board to obtain the shadow range of the missing back drilling, the first back drilling and the second back drilling. Through actual measurement, it is found that the shadow area percentage of different back drillings is different. According to the shadow area percentage of different back drillings, the detection threshold of the back drilling can be set, so that the AVI detection machine can determine the type of the back drilling according to the shadow range, that is, whether the back drilling belongs to the missing back drilling, the first back drilling or the second back drilling, so that the AVI detection machine will not confuse the missing back drilling, the first back drilling and the second back drilling, and only report points in the case of detecting the missing back drilling, without reporting points for the first back drilling and the second back drilling, thereby avoiding the false point reporting. It should be noted that the shadow range of the deep back drilling is usually larger than that of the shallow back drilling, and the shadow range of the shallow back drilling is usually larger than that of the missing back drilling.

[0063] Finally, when the AVI detection machine scans and detects the circuit board to be detected, the color standard value can be set for the shadow area, and the detection threshold can be set according to the shadow range of different back drillings. The color standard value is used to scan and detect the back drilling. If it is found that the color standard value area of a certain back drilling is greater than the detection threshold, it means that the back drilling is a missing back drilling. If the color standard value area of a certain back drilling is less than the detection threshold, it means that the back drilling is a shallow back drilling or a deep back drilling.

[0064] According to the method for detecting whether the circuit board has a missing back drilling, the deep back drilling and the shallow back drilling are distinguished, and the shadow area difference between the missing back drilling and the first back drilling and the second back drilling is determined, so that the color value standard can be set, the circuit board is scanned and detected according to the color value standard, the missing back drilling area is accurately identified, and the false point reporting is avoided.

[0065] On the other hand, the embodiment of the present application also provides a system for detecting whether a circuit board has a missing back drilling, which is characterized by comprising at least one control processor and a memory connected in communication with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to execute the method for detecting whether a circuit board has a missing back drilling.

[0066] On the other hand, the embodiment of the present application also provides an electronic device comprising the system for detecting whether a circuit board has a missing back drilling.

[0067] On the other hand, the embodiment of the present application also provides a storage medium, which is a computer readable storage medium, and the storage medium stores a computer program, which is executed by a processor to implement the hybrid hydraulic control method.

[0068] Memory, as used in the foregoing description, is a non-transitory computer- readable storage medium used for storage of non-transitory software programs and non- transitory computer-executable programs. In addition, memory can include a high-speed random access memory, and can also include a non-transitory memory such as at least one disk memory device, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, memory can optionally include memory that is remotely located from the processor, which can be connected to the processor through a network. Examples of the network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof. The above-described device embodiments are merely illustrative, in which the units described as separate units can or can not be physically separated, and can be implemented in one location, or can be distributed over a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purposes of the present embodiment.

[0069] While specific embodiments are described herein, one of ordinary skill in the art will appreciate that many other modifications or alternative embodiments are within the scope of the present disclosure. For example, any of the functions and / or process capabilities described in connection with a particular device or component can be performed by any other device or component. Additionally, while various exemplary implementations and architectures have been described in accordance with embodiments of the present disclosure, one of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are within the scope of the present disclosure.

[0070] Certain aspects of the present disclosure are described above with reference to block and flow diagrams of systems, methods, systems, and / or computer program products according to example embodiments. It will be understood that one or more blocks of the block diagrams and flow diagrams, and combinations of blocks in the block diagrams and flow diagrams, can be implemented by

[0071] Thus, the blocks in the block diagrams and flow diagrams support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction means for performing the specified functions. It will also be understood that each block of the block diagrams and flow diagrams, and combinations of blocks in the block diagrams and flow diagrams, can be implemented by dedicated hardware-based computer systems which perform the specified functions or combinations of special-purpose hardware and computer instructions.

[0072] The program modules, applications, and the like described herein can include one or more software components, including, for example, software objects, methods, data structures, and the like. Each such software component can include computer-executable instructions that, in response to execution by a computer, cause at least a portion of the functionality described herein (e.g., one or more operations of the example methods described herein) to be performed.

[0073] Software components can be encoded in any of a variety of programming languages. One example programming language can be a low-level programming language, such as an assembly language associated with a particular hardware architecture and / or operating system platform. Software components that include assembly language instructions can need to be translated by an assembler into executable machine code before execution by the hardware architecture and / or platform. Another example programming language can be a higher-level programming language that can be portable across multiple architectures. Software components that include a higher-level programming language can need to be translated by an interpreter or compiler into an intermediate representation before execution. Other examples of programming languages include, but are not limited to, a macro language, a shell or command language, a job control language, a script language, a database query or search language, or a report writing language. In one or more example embodiments, a software component that includes instructions in one of the above examples of programming languages can be executed directly by an operating system or other software component without first being translated into another form.

[0074] Software components can be stored as files or other data storage constructs. Software components of a similar type or related function can be stored together in a particular directory, folder, or library. Software components can be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0075] The above embodiments of the present application have been described in detail but not limited to the above-mentioned embodiments, within the scope of knowledge of those skilled in the art, various changes can be made without departing from the spirit of the present application.

Claims

1. A method of detecting whether a back-drilling of a circuit board is present, characterized in that, The method comprises the following steps: determining whether the back drilling holes of the circuit board are deep back drilling holes or shallow back drilling holes; when preparing the AVI detection data of the circuit board, merging the layers of the circuit board belonging to the deep back drilling holes into deep back drilling layers, and merging the layers of the circuit board belonging to the shallow back drilling holes into shallow back drilling layers; outputting the back drilling holes of the deep back drilling layers on the surface of the circuit board as first back drilling holes, and outputting the back drilling holes of the shallow back drilling layers on the surface of the circuit board as second back drilling holes; determining the shadow area difference between the missing back drilling holes of the circuit board and the first back drilling holes and the second back drilling holes by using an AVI detection machine; setting a color value standard according to the shadow area difference; scanning and detecting the circuit board to be detected by using the AVI detection machine according to the color value standard, and determining whether the circuit board to be detected has missing back drilling holes.

2. The method of claim 1, wherein, The method of determining whether the back drilling holes of the circuit board are deep back drilling holes or shallow back drilling holes comprises the following steps: visually inspecting the back drilling holes of the circuit board; dividing the back drilling holes into deep back drilling holes and shallow back drilling holes according to whether the copper layer can be seen; the deep back drilling holes are those in which the copper layer cannot be seen, and the shallow back drilling holes are those in which the copper layer can be seen.

3. The method of claim 1, wherein, The method of merging the layers of the circuit board into deep back drilling layers and shallow back drilling layers when preparing the AVI detection data of the circuit board comprises the following steps: determining which layer of the circuit board is drilled by the shallow back drilling holes, and attributing the corresponding layer to the shallow back drilling layers; determining which layer of the circuit board is drilled by the deep back drilling holes, and attributing the corresponding layer to the deep back drilling layers.

4. The method of claim 1, wherein, The method of outputting the back drilling holes of the deep back drilling layers on the surface of the circuit board as first back drilling holes and outputting the back drilling holes of the shallow back drilling layers on the surface of the circuit board as second back drilling holes comprises the following steps: judging whether the deep back drilling holes and the shallow back drilling holes are located on the component surface or the solder surface of the circuit board; according to the judgment result, outputting the back drilling holes of the deep back drilling layers on the component surface or the solder surface of the circuit board as first back drilling holes, and outputting the back drilling holes of the shallow back drilling layers on the component surface or the solder surface of the circuit board as second back drilling holes.

5. The method of claim 1, wherein, The method of determining the shadow area difference between the missing back drilling holes of the circuit board and the first back drilling holes and the second back drilling holes by using an AVI detection machine comprises the following steps: determining the shadow range of the missing back drilling holes, the shadow range of the first back drilling holes, and the shadow range of the second back drilling holes by using the scanning image of the circuit board; setting the detection threshold value of the AVI detection machine for detecting the missing back drilling holes, the first back drilling holes and the second back drilling holes according to the shadow range of the missing back drilling holes, the shadow range of the first back drilling holes, and the shadow range of the second back drilling holes.

6. A system for detecting whether a circuit board has missing back-drilling, characterized in that, The method comprises at least one control processor and a memory connected in communication with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to execute the method for detecting whether the circuit board has missing back drilling holes according to any one of claims 1 to 5.

7. An electronic device, comprising: The system for detecting whether a back-drilling missing exists in a circuit board according to claim 6.

8. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer executable instructions for causing a computer to execute the method for detecting whether a back-drilling missing exists in a circuit board according to any one of claims 1 to 5.

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