Resource board card temperature calibration coefficient acquisition method, calibration method, control method and device

Abstract

The invention relates to a resource board card temperature calibration coefficient acquisition method, calibration method, control method and device. The method comprises the following steps: acquiring each output set value and each meter measurement value of a target channel of a resource board card at each target temperature; respectively determining a first fitting relationship between each meter measurement value and each output set value under each target temperature; obtaining each fitting coefficient in each first fitting relationship corresponding to each target temperature; and obtaining a second fitting relationship based on each fitting coefficient and each target temperature, and obtaining a temperature calibration coefficient based on the second fitting relationship. By adopting the method, the output precision of the resource board card can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a resource board card temperature calibration coefficient acquisition method, a calibration method, a control method and apparatus. BACKGROUND

[0002] In a semiconductor automatic test equipment product, VI sources (which are excitation voltage sources of a unit under test, and provide controllable, measurable and ideal power supplies), resistors and operational amplifiers and other devices susceptible to temperature influence are affected by temperature fluctuations in an actual working environment, resulting in that the output of a resource board card is affected in an environment with large temperature fluctuations, for example, VI source output precision is not up to standard, and therefore, for a resource board card with high precision requirements, the influence of temperature fluctuations on VI source output, resistors and operational amplifiers needs to be considered during calibration, so as to ensure calibration precision of the equipment and accuracy of chip measurement results. SUMMARY

[0003] Therefore, it is necessary to provide a resource board card temperature calibration coefficient acquisition method, a calibration method, a control method and apparatus capable of improving resource board card output precision in view of the above technical problems.

[0004] In a first aspect, the present application provides a resource board card temperature calibration coefficient acquisition method, which comprises the following steps:

[0005] acquiring each output set value and each table measured value of a target channel of a resource board card at each target temperature;

[0006] determining a first fitting relationship between each table measured value and each output set value at each target temperature;

[0007] acquiring each fitting coefficient in each first fitting relationship corresponding to each target temperature;

[0008] obtaining a second fitting relationship based on each fitting coefficient and each target temperature, and obtaining a temperature calibration coefficient based on the second fitting relationship.

[0009] In one embodiment, the acquiring each output set value and each table measured value of a target channel of a resource board card at each target temperature comprises the following steps:

[0010] after the resource board card is powered on, acquiring a current target temperature collected, and determining each output set value and each table measured value of a target channel of the resource board card at the current target temperature;

[0011] acquiring a next current target temperature collected, taking the next current target temperature collected as a new current target temperature, and continuing to perform the step of determining each output set value and each table measured value of a target channel of the resource board card at the current target temperature;

[0012] stopping obtaining the output set value and the measured value of the target channel of the resource board card when the difference between the next current target temperature and the initial temperature is greater than or equal to the target temperature threshold.

[0013] In one of the embodiments, the obtaining of the output set value and the measured value of the target channel of the resource board card at each target temperature comprises:

[0014] Before the resource board card is powered on, the resource board card is temperature-adjusted so that the temperature of the resource board card is the same as the ambient temperature.

[0015] In one of the embodiments, the determining of the first fitting relationship between the measured value and the output set value at each target temperature comprises:

[0016] At each target temperature, a linear fitting relationship between the measured value and the output set value is determined as the first fitting relationship.

[0017] The obtaining of the fitting coefficient in the first fitting relationship corresponding to each target temperature comprises:

[0018] The slope coefficient and the intercept coefficient in the first fitting relationship corresponding to each target temperature are obtained.

[0019] The obtaining of the second fitting relationship based on the fitting coefficient and the target temperature, and the obtaining of the temperature calibration coefficient based on the second fitting relationship comprise:

[0020] A slope fitting relationship is determined based on the slope coefficient and the target temperature, and an intercept fitting relationship is determined based on the intercept coefficient and the target temperature.

[0021] The first temperature calibration coefficient is obtained based on the slope fitting relationship, and the second temperature calibration coefficient is obtained based on the intercept fitting relationship.

[0022] In a second aspect, the present application further provides a resource board card calibration method, which comprises:

[0023] reading the current temperature of the resource board card;

[0024] When the current temperature is different from the calibration temperature, reading the current machine measured value and the pre-stored temperature calibration coefficient, which is obtained based on the resource board card temperature calibration coefficient obtaining method in any one of the above embodiments;

[0025] obtaining a corrected machine measured value based on the temperature calibration coefficient, the current temperature, the calibration temperature and the current machine measured value;

[0026] obtaining a compensation output value of the resource board card based on the corrected measured value.

[0027] In one of the embodiments, the corrected measured value is obtained based on the temperature calibration coefficient, the current temperature, the calibration temperature and the current measured value, including:

[0028] determining a temperature difference value based on the current temperature and the calibration temperature;

[0029] obtaining the corrected measured value based on the temperature difference value, the current measured value and the temperature calibration coefficient.

[0030] In one of the embodiments, the corrected measured value is obtained based on the temperature difference value, the current measured value and the temperature calibration coefficient, including:

[0031] the corrected measured value is calculated by the following formula:

[0032] MV2 = mv_value * (1 + MKgain_x * △T) + MKoffset * △T

[0033] wherein MV2 is the corrected measured value, mv_value is the current measured value, MKgain_x is the first temperature calibration coefficient, MKoffset is the second temperature calibration coefficient, and △T is the temperature difference value.

[0034] In one of the embodiments, before the compensation output value of the resource board card is obtained based on the corrected measured value, further including:

[0035] determining a calibration temperature, and obtaining each first measured value and each second table measured value of a target channel of the resource board card at the calibration temperature;

[0036] obtaining a third fitting relationship based on each first measured value and each second table measured value.

[0037] In one of the embodiments, the compensation output value of the resource board card is obtained based on the corrected measured value, including:

[0038] obtaining the compensation output value of the resource board card based on the third fitting relationship and the corrected measured value.

[0039] In one of the embodiments, the compensation output value of the resource board card is obtained based on the third fitting relationship and the corrected measured value, including:

[0040] the compensation output value is obtained based on the following formula:

[0041] y2 = K * MV2 + B,

[0042] Wherein, y2 is a compensation output value, MV2 is a corrected machine measurement value, K and B are obtained based on a third fitting relationship.

[0043] In a third aspect, the present application also provides a resource board card control method, the method comprising:

[0044] Obtaining a compensation output value of a resource board card based on the resource board card calibration method in any one of the above embodiments;

[0045] Obtaining a pre-set standard output value;

[0046] Performing closed-loop control on the resource board card based on the compensation output value and the standard output value.

[0047] In a fourth aspect, the present application also provides a resource board card temperature calibration coefficient obtaining device, the device comprising:

[0048] A first acquisition module, configured to obtain each output set value and each table measurement value of a target channel of a resource board card at each target temperature;

[0049] A first fitting relationship determination module, configured to determine a first fitting relationship between each table measurement value and each output set value at each target temperature;

[0050] A fitting coefficient determination module, configured to obtain each fitting coefficient in each first fitting relationship corresponding to each target temperature;

[0051] A temperature calibration coefficient determination module, configured to obtain a second fitting relationship based on each fitting coefficient and each target temperature, and obtain a temperature calibration coefficient based on the second fitting relationship.

[0052] In a fifth aspect, the present application also provides a resource board card calibration device, the device comprising:

[0053] A temperature acquisition module, configured to read a current temperature of the resource board card;

[0054] A reading module, configured to read a current machine measurement value and a pre-stored temperature calibration coefficient in a case where the current temperature and a calibration temperature are different, the pre-stored temperature calibration coefficient being obtained based on the resource board card temperature calibration coefficient obtaining device in any one of the above embodiments;

[0055] A corrected machine measurement value determination module, configured to obtain a corrected machine measurement value based on the temperature calibration coefficient, the current temperature, the calibration temperature, and the current machine measurement value;

[0056] A first compensation output value determination module, configured to obtain a compensation output value of the resource board card based on the corrected machine measurement value.

[0057] In a sixth aspect, the present application provides a resource board card control device, the device comprising:

[0058] A second compensation output value determination module is configured to obtain a compensation output value of the resource board card based on the resource board card calibration device in any one of the above embodiments.

[0059] A standard output value determination module is configured to obtain a pre-set standard output value.

[0060] A control module is configured to perform closed-loop control on the resource board card based on the compensation output value and the standard output value.

[0061] In the above resource board card temperature calibration coefficient obtaining method, calibration method, control method and device, the output set value and the measured value of each target channel of the resource board card at each target temperature are obtained, the first fitting relationship between the measured value and the output set value at each target temperature is determined, the fitting coefficient in the first fitting relationship corresponding to each target temperature is obtained, the second fitting relationship is obtained based on the fitting coefficient and the target temperature, and the temperature calibration coefficient is obtained based on the second fitting relationship. In this way, the temperature calibration coefficient is determined, so that the resource board card output can be calibrated based on the temperature calibration coefficient under the working condition of temperature change, the water-cooling heat dissipation device is not needed, the cost and weight of the whole machine device are reduced, and the accuracy of the resource board card output is improved. BRIEF DESCRIPTION OF DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without creative labor.

[0063] Figure 1 It is a schematic diagram of the calibration system in one embodiment.

[0064] Figure 2 It is a flowchart of the resource board card temperature calibration coefficient obtaining method in one embodiment.

[0065] Figure 3 It is a flowchart of multi-channel data acquisition in one embodiment.

[0066] Figure 4 It is a schematic diagram of the relationship between the slope coefficient gain_x and each target temperature in one embodiment.

[0067] Figure 5 It is a schematic diagram of the relationship between the intercept coefficient offset_y and each target temperature in one embodiment.

[0068] Figure 6 a flowchart of a resource board card calibration method in an embodiment;

[0069] Figure 7 a function diagram of a third fitting relationship in an embodiment;

[0070] Figure 8 a flowchart of a resource board card control method in an embodiment;

[0071] Figure 9 a flowchart of a resource board card control method in another embodiment;

[0072] Figure 10 a structural block diagram of a resource board card temperature calibration coefficient acquisition device in an embodiment;

[0073] Figure 11 a structural block diagram of a resource board card calibration device in an embodiment;

[0074] Figure 12 a structural block diagram of a resource board card control device in an embodiment;

[0075] Figure 13 an internal structural diagram of a computer device in an embodiment. DETAILED DESCRIPTION

[0076] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0077] It should be noted that the terms "first", "second" and the like used in the present application can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element. The terms "include" and "have" and any variations thereof used in the present application are intended to cover non-exclusive inclusion. The term "a plurality of" used in the present application means two and more than two.

[0078] The resource board card temperature calibration coefficient acquisition method, calibration method and control method provided by the embodiments of the present application can be applied to, for example, Figure 1The calibration system is shown. The calibration system includes a resource board card (the resource board card can include multiple channels), a PID digital loop module, a multimeter, a host computer, a DAC sampling module, a PA module, and an ADC sampling module. In this application, VI source calibration is taken as an example for description. In other embodiments, for resistors and operational amplifiers with large temperature drift, and the output and temperature show linear changes, the calibration method of this application can also be used to calibrate channel temperature drift.

[0079] The resource board card temperature calibration coefficient acquisition method considers the introduction of resource board card temperature fluctuation in the calibration process, obtains the temperature calibration coefficient by fitting the measured values (values measured by the multimeter) and the host computer set values (FI, FV) at different target temperatures, and saves it to the hardware flash of the resource board card. When the VI source normally outputs FV and FI, the ADC sampling value obtained by the ADC sampling module is substituted into the voltage / current calibration coefficient and the temperature calibration coefficient to obtain the corrected ADC sampling value. Subsequently, the PID digital loop module (in this application, FPGA is taken as an example) calculates the actual output error of the resource board card according to the difference between the FV / FI output value set by the host computer and the corrected ADC sampling value, and feeds back the error to the FPGA. The FPGA performs PID digital loop operation according to the proportional integral coefficient set by the host computer, and finally sends the calculated signal to the DAC sampling module and converts it into an analog signal. The analog signal drives the PA module to adjust the loop voltage / current.

[0080] In combination with Figure 1 In the fitting process, two-step fitting is included. One fitting is to obtain the voltage / current calibration coefficient, and the other fitting is to obtain the temperature calibration coefficient. The specific calibration coefficient acquisition method can be referred to in the following.

[0081] In this application, the temperature calibration coefficient is determined, so that the output can be calibrated based on the temperature calibration coefficient under the condition of temperature change, without using a water-cooled heat dissipation device, reducing the cost and weight of the whole machine device, and improving the accuracy of the output.

[0082] In an exemplary embodiment, as Figure 2 As shown, a resource board card temperature calibration coefficient acquisition method is provided, including the following steps 202 to 208. Wherein:

[0083] S202: Obtain each output set value and each measured value of the target channel of the resource board card at each target temperature.

[0084] The target temperature is the temperature of the target channel of the resource board card when measuring the measured values of the target channel of the resource board card. In the case where the resource board card includes multiple channels, the target temperature is the temperature of the corresponding channel of the resource board card when collecting the measured values of each channel.

[0085] Wherein the range of target temperature is determined based on the temperature fluctuation value in a day, for example, the temperature difference (maximum-minimum) fluctuation is 6 degrees Celsius in a day, then the temperature calibration is preferably set to the temperature range of maximum-minimum when the resource board card is calibrated.

[0086] The output set value is the output value of the target channel of the resource board card under ideal conditions.

[0087] The meter value is the output value of the target channel of the resource board card measured by the multimeter. When the output set value is FV, the corresponding meter value is the output voltage value of the target channel of the resource board card measured by the multimeter, and when the output set value is FI, the corresponding meter value is the output current value of the target channel of the resource board card measured by the multimeter.

[0088] Specifically, when the resource board card set value is y1, the multimeter data and target temperature are recorded at this time, respectively denoted as P1 and T1; after the resource board card runs for a period of time, the channel temperature will rise significantly, at this time, the multimeter data and temperature data of the channel are recorded, respectively denoted as P2 and T2; in this way, when the temperature rises to the final temperature (usually the temperature difference value ΔT >= 4℃) during the running of the resource board card, the test is ended, and the multimeter data and temperature data of the channel at this time are recorded, respectively denoted as PN and TN.

[0089] S204: Determine the first fitting relationship between each meter value and each output set value at each target temperature, respectively.

[0090] The first fitting relationship is the relationship between each meter value and each output set value under the condition that the temperature is constant. Since the target temperature includes multiple, multiple first fitting relationships can be obtained.

[0091] Wherein the fitting relationship is to first determine the discrete points based on each meter value and each output set value, and then perform fitting. Optionally, the points that do not meet the requirements, such as points with large deviations, can be removed first, and then fitting is performed to avoid the influence of errors.

[0092] S206: Obtain each fitting coefficient in each first fitting relationship corresponding to each target temperature.

[0093] For example, the first fitting relationship is a linear relationship, each first fitting relationship of each channel includes at least two sets of fitting coefficients, for example, one set of fitting coefficients includes a slope coefficient gain_x and an intercept coefficient offset_y, that is, each target temperature corresponds to a set of slope coefficients gain_x and intercept coefficients offset_y, so as to obtain the slope coefficients gain_x and the intercept coefficients offset_y corresponding to different target temperatures. In an embodiment, the first fitting relationship can be fitted by using a linest function, and the slope coefficient and the intercept coefficient are obtained based on linear regression analysis.

[0094] S208: obtaining a second fitting relationship based on the fitting coefficients and the target temperatures, and obtaining the temperature calibration coefficient based on the second fitting relationship.

[0095] In the above process, after the fitting coefficients corresponding to different target temperatures are determined, the fitting coefficients and the target temperatures are fitted respectively to obtain the second fitting relationships. For example, the slope coefficients gain_x and the target temperatures are fitted to obtain a second fitting relationship, and the intercept coefficients offset_y and the target temperatures are fitted to obtain another second fitting relationship. Thus, the temperature calibration coefficients can be obtained according to the second fitting relationships. In an embodiment, the second fitting relationship is a linear fitting.

[0096] In addition, it should be noted that the process of obtaining the temperature calibration coefficient can be performed once before the resource board card is shipped, and then the temperature calibration coefficient is stored in the resource board card, and the temperature calibration coefficient can be directly used subsequently.

[0097] The above method for obtaining the temperature calibration coefficient of the resource board card obtains the output set values and the table measured values of the target channel of the resource board card under each target temperature, determines the first fitting relationship between the table measured values and the output set values under each target temperature, obtains the fitting coefficients in the first fitting relationship corresponding to each target temperature, obtains the second fitting relationship based on the fitting coefficients and the target temperatures, and obtains the temperature calibration coefficient based on the second fitting relationship. Thus, the temperature calibration coefficient is determined, and the output can be calibrated based on the temperature calibration coefficient under the temperature change condition, without using a water-cooled heat dissipation device, so as to reduce the cost and weight of the whole machine device and improve the accuracy of the output.

[0098] In one of the optional embodiments, the method for obtaining the output setting value and the measured value of each target channel of the resource board card at each target temperature comprises: obtaining the current target temperature after the resource board card is powered on, and determining the output setting value and the measured value of each target channel of the resource board card at the current target temperature; obtaining the next current target temperature, taking the next current target temperature as a new current target temperature, and continuing to determine the output setting value and the measured value of each target channel of the resource board card at the current target temperature; and stopping obtaining the output setting value and the measured value of each target channel of the resource board card when the difference between the next current target temperature and the initial temperature is greater than or equal to the target temperature threshold.

[0099] In the embodiment, the output setting value and the measured value of each target channel of the resource board card are determined as follows: after the resource board card is powered on, the current target temperature of the resource board card is obtained, and the output setting value of each target channel of the resource board card is determined at the current target temperature, and the measured value is collected. Then, the next current target temperature is collected after a period of time, and the next current target temperature is taken as a new current target temperature, and then the output setting value of each target channel of the resource board card is determined at the current target temperature, until the difference between the next current target temperature and the initial temperature is greater than or equal to the target temperature threshold, that is, the temperature difference exceeds the value range of the target temperature, and the collection is stopped.

[0100] In combination with Figure 3 When the data collection of multiple channels is performed, multi-channel circulation can be performed, so that each time the current channel is circulated, the temperature of the resource board card is necessarily different from the temperature at the first circulation, and therefore the temperature at each time the channel is circulated can be taken as the current target temperature.

[0101] In the embodiment, the temperature drift calibration of the board card channel is performed after the VI source board is powered on, and a temperature sensor is arranged in each channel and connected to the FPGA; after the hardware is welded back to the board, the resistance and the operational amplifier have temperature drift, and the temperature drift coefficient of the resistance is positive or negative, so that each channel has a different temperature drift coefficient. In the embodiment, the temperature drift calibration of one channel is taken as an example, and the calibration method of each channel is the same, and the channel circulation temperature drift calibration is performed.

[0102] Specifically, after the resource board card is powered on, the current channel is determined, the current target temperature of the current channel is obtained, and the output set value and the meter measured value of each output of the current channel of the resource board card at the current target temperature are determined, that is, the output set value is cycled, and the meter measured value is obtained by using the multimeter. In this embodiment, the collection process of the output set value and the meter measured value of each output of the current channel of the resource board card is cycled, and the current target temperature is close to the default unchanged. Then the next channel is determined, and after the next channel is taken as the current channel, the current target temperature of the current channel is obtained, and the output set value and the meter measured value of each output of the current channel of the resource board card at the current target temperature are determined, until the first traversal of the channels of the resource board card is completed, and the second traversal of each channel of the resource board card is continued, that is, the current channel is determined, and the current target temperature of the current channel is obtained as the next collected current target temperature of the channel. It is judged whether the difference between the next collected current target temperature and the initial temperature is greater than or equal to the target temperature threshold value, if not, the next collected current target temperature is taken as the new current target temperature of the current channel, and then the output set value and the meter measured value of each output of the current channel of the resource board card at the current target temperature are determined. If yes, the collection of the output set value and the meter measured value of each output of the current channel is stopped, and the next channel is taken as the current channel, until the difference between the next collected current target temperature of each channel and the initial temperature is greater than or equal to the target temperature threshold value, then the collection of the output set value and the meter measured value of each channel of the resource board card is stopped.

[0103] In the above embodiment, the cyclic collection process of each channel is ingeniously utilized, and each collection of each channel is interval a certain time, so that the target temperature of a single channel is not the same.

[0104] In one of the optional embodiments, before obtaining the output set value and the meter measured value of each output of the target channel of the resource board card at each target temperature, the resource board card is temperature adjusted before being powered on, so that the temperature of the resource board card is the same as the ambient temperature.

[0105] Specifically, in the present application, the board card temperature fluctuation factor is considered in the calibration process, and the temperature difference is artificially introduced, for example, the fan has been running for more than 15 minutes before the whole machine is powered on, so that the board card temperature is close to the ambient temperature.

[0106] In one optional embodiment, determining a first fitting relationship between each measured value and each output setpoint at each target temperature includes: determining a linear fitting relationship between each measured value and each output setpoint as a first fitting relationship at each target temperature; obtaining each fitting coefficient in each first fitting relationship corresponding to each target temperature includes: obtaining each slope coefficient and each intercept coefficient in each first fitting relationship corresponding to each target temperature; obtaining a second fitting relationship based on each fitting coefficient and each target temperature, and obtaining a temperature calibration coefficient based on the second fitting relationship includes: determining a slope fitting relationship based on each slope coefficient and each target temperature, and determining an intercept fitting relationship based on each intercept coefficient and each target temperature; obtaining a first temperature calibration coefficient based on the slope fitting relationship, and obtaining a second temperature calibration coefficient based on the intercept fitting relationship.

[0107] For each target temperature, since multiple output setpoints and corresponding measured values ​​are obtained, a first fitting relationship can be obtained through fitting. This first fitting relationship is a linear fitting relationship. In this embodiment, the first fitting relationship includes a set of fitting coefficients, namely the slope coefficient gain_x and the intercept coefficient offset_y.

[0108] The relationship between the slope coefficient gain_x and each target temperature is plotted. Figure 4 The function graph shown has the target temperature on the horizontal axis and the slope coefficient on the vertical axis. Based on this function graph, a linear function relationship is obtained to get the temperature drift coefficient of the calibration gain_x value, which is denoted as the first temperature calibration coefficient MKgain_x value.

[0109] The relationship between the intercept coefficient offset_y and each target temperature is obtained by plotting the graph. Figure 5 The function graph shown has the target temperature on the horizontal axis and the intercept coefficient on the vertical axis. Based on this function graph, the first-order function relationship can be obtained to obtain the temperature drift coefficient of the calibrated offset_y value, which is denoted as the second temperature calibration coefficient MKoffset value.

[0110] Finally, the first and second temperature calibration coefficients are stored in the hardware flash memory of the resource board.

[0111] In one exemplary embodiment, such as Figure 6 As shown, a resource board calibration method is provided, including steps 602 to 608. Wherein:

[0112] S602: Read the current temperature of the resource board.

[0113] The current temperature of the resource board can be measured by a temperature sensor, and this current temperature can be the temperature of the target channel of the resource board.

[0114] Wherein, the FPGA can read the current temperature of the target channel of the resource board card in real time when the resource board card is outputting, for example, when the FPGA is outputting the FV.

[0115] S604: In the case where the current temperature is different from the calibration temperature, read the current measured value and the pre-stored temperature calibration coefficient, which is obtained based on the resource board card temperature calibration coefficient obtaining method in any one of the above embodiments.

[0116] Wherein, in the case where the current temperature is different from the calibration temperature, the current measured value and the pre-stored temperature calibration coefficient can be read. The temperature calibration coefficient is pre-determined by the resource board card temperature calibration coefficient obtaining method and stored in the resource board card, for example, in the flash of the resource board card.

[0117] S606: Obtain a corrected measured value based on the temperature calibration coefficient, the current temperature, the calibration temperature, and the current measured value.

[0118] Wherein, after the temperature calibration coefficient, the current temperature, the calibration temperature, and the current measured value are determined, the current measured value can be corrected by the temperature calibration coefficient, that is, a measured value considering temperature fluctuations, that is, a corrected measured value MV2, is obtained.

[0119] S608: Obtain a compensated output value of the resource board card based on the corrected measured value.

[0120] Wherein, after the corrected measured value is obtained, a compensated output value of the resource board card can be obtained based on a pre-determined fitting relationship between the measured value and the table value (i.e., the third fitting relationship), that is, based on the measured value considering temperature fluctuations and the voltage / current calibration coefficient mentioned above, the compensated output value of the resource board card is determined.

[0121] In the above embodiments, the temperature calibration coefficient considering temperature fluctuations is introduced, so that the current measured value is corrected by the temperature calibration coefficient to obtain a corrected measured value considering temperature fluctuations, and finally the compensated output value of the resource board card is determined based on the corrected measured value considering temperature fluctuations and the voltage / current calibration coefficient mentioned above, thereby improving the accuracy of the output of the resource board card.

[0122] In some optional embodiments, obtaining a corrected measured value based on the temperature calibration coefficient, the current temperature, the calibration temperature, and the current measured value includes: determining a temperature difference value based on the current temperature and the calibration temperature; and obtaining the corrected measured value based on the temperature difference value, the current measured value, and the temperature calibration coefficient.

[0123] In this application, the temperature difference ΔT is first obtained based on the current temperature and calibration temperature of the current channel of the resource board, and then the corrected machine measurement value is obtained based on the temperature difference ΔT, the current machine measurement value, and the temperature calibration coefficient.

[0124] Optionally, a corrected machine measurement value is obtained based on the temperature difference, the current machine measurement value, and the temperature calibration coefficient, including: calculating the corrected machine measurement value using the following formula:

[0125] MV2=mv_value*(1+MKgain_x*△T)+MKoffset*△T

[0126] Where MV2 is the corrected machine measurement value, mv_value is the current machine measurement value, MKgain_x is the first temperature calibration coefficient, Mkoffset is the second temperature calibration coefficient, and △T is the temperature difference.

[0127] In the above embodiments, the measured values ​​are corrected based on the temperature calibration coefficient, so that the corrected measured values ​​take into account temperature fluctuations, thereby ensuring the accuracy of the output values ​​of the resource boards in subsequent calculations.

[0128] In some optional embodiments, before obtaining the compensated output value of the resource board based on the corrected machine measurement, the method further includes: determining the calibration temperature, and obtaining each first machine measurement value and each second meter measurement value of the target channel of the resource board at the calibration temperature; and fitting a third fitting relationship based on each first machine measurement value and each second meter measurement value.

[0129] Combination Figure 7 As shown, Figure 7 This is a schematic diagram of the third fitting relationship in one embodiment. In this embodiment, the VI source is still used as an example for explanation. When the VI source is calibrated, the output resource is connected to the BUS bus, and one resource channel is switched on via an analog switch and connected to the calibration load and a multimeter respectively. After measurement, the machine-measured value and the multimeter-measured value are obtained respectively. Then, the host computer fits the machine-measured value into a linear formula, that is, the third fitting relationship y = K*x + B, where x is the machine-measured value (ADC sampled value, MV), denoted as mv_value; y is the multimeter-measured value, denoted as P_value; K and B are calibration coefficients. After calibration, the calibration coefficients are stored in flash. When the VI source outputs FV / FI in actual operation, the FPGA compensates for the machine-measured value by substituting the K and B values, so that its output result is close to the multimeter-measured value. It should be noted that the voltage / current calibration process for one range is very fast. It can be assumed that the temperature does not change during the calibration of one channel, and the recorded temperature at this time is the calibration temperature. In addition, it should be noted that the voltage and current calibration process is performed periodically, that is, a calibration is required for each calibration cycle.

[0130] Therefore, when determining the third fitting relationship, the calibration temperature can be determined first, and then the first machine measured values (ADC sample values, MV) and the second meter measured values (i.e. the values measured by the multimeter) of the target channel of the resource board card at the calibration temperature are determined, and then the machine measured values are fitted into a linear formula, i.e. the third fitting relationship y=K*x+B, K and B being calibration coefficients.

[0131] In one of the optional embodiments, the compensation output value of the resource board card is obtained based on the corrected machine measured value, comprising: obtaining the compensation output value of the resource board card based on the third fitting relationship and the corrected machine measured value. That is, the corrected machine measured value is substituted into the third fitting relationship to obtain the compensation output value of the resource board card.

[0132] In one of the optional embodiments, the compensation output value of the resource board card is obtained based on the third fitting relationship and the corrected machine measured value, comprising: obtaining the compensation output value based on the following formula:

[0133] y2=K*MV2+B

[0134] Wherein, y2 is the compensation output value, MV2 is the corrected machine measured value, and K and B are obtained based on the third fitting relationship.

[0135] Wherein, according to the above, MV2=mv_value*(1+MKgain_x*△T)+MKoffset*△T, so y2=K*(mv_value*(1+MKgain_x*△T)+MKoffset*△T)+B can be obtained.

[0136] In the above embodiments, the influence of temperature fluctuation on the machine measured value is considered, so that an accurate machine measured value is obtained, thereby ensuring the accuracy of the output value of the resource board card.

[0137] In one exemplary embodiment, as shown in Figure 8 A resource board card control method is provided, comprising the following steps 802 to 806. Wherein:

[0138] S802: obtaining the compensation output value of the resource board card based on the resource board card calibration method in any one of the above embodiments.

[0139] Wherein, the compensation output value can be obtained in the manner described above, and is not limited here.

[0140] S804: obtaining a pre-set standard output value.

[0141] S806: performing closed-loop control on the resource board card based on the compensation output value and the standard output value.

[0142] The working principle of the temperature drift calibration voltage and current digital loop is as followsFigure 1 As shown in the figure, the PID digital loop module is implemented by FPGA, and its main function is to realize automatic PID adjustment control of digital voltage loop and digital current loop, and to accurately give external load voltage and current. The temperature drift calibration link considers the temperature fluctuation factor of the board card during calibration, and obtains the temperature calibration coefficient by fitting the multimeter value and the host computer setting value at different temperatures, and saves it to the resource board card hardware flash. When the VI source normally outputs FV and FI, the ADC sampling value of the ADC sampling module is substituted into the voltage / current calibration coefficient and the temperature calibration coefficient to obtain the corrected ADC sampling value. Then the FPGA calculates the actual error of the board card output according to the difference between the FV / FI output value set by the host computer (i.e. the pre-set standard output value) and the corrected ADC sampling value, and feeds back the error to the FPGA. The FPGA performs PID digital loop operation according to the proportional integral coefficient set by the host computer, and finally sends the calculated signal to the DAC sampling module and converts it into an analog signal. The analog signal drives the PA module to realize the adjustment of the loop voltage / current.

[0143] In the above embodiment, the output accuracy of the VI source board card under varying temperature conditions can be improved under the condition of using air cooling for heat dissipation. This method is suitable for board cards with low power and high accuracy requirements, and does not require the use of a water cooling device, thereby reducing the cost and weight of the entire machine. Compared with the method of sending the board card into a temperature chamber for temperature cycling, this method is more economical and efficient.

[0144] For convenience of understanding, the above embodiment is combined with Figure 9 As shown in the figure, Figure 9 is the flow of the resource board card control method in another embodiment. In this embodiment, the resource board card control method mainly includes:

[0145] 1. Before the power-on of the entire machine, ensure that the fan runs for more than 15 minutes, so that the temperature of the VI source board card is basically the same as the ambient temperature, that is, the fan is used to cool the VI source board card.

[0146] 2. After the board card is powered on, immediately perform channel temperature calibration. Generally, after the entire machine is powered on, the temperature of the entire test head will rise to a thermal equilibrium state after 30 minutes, and the board card temperature will change linearly, so that the different target temperatures of the selected channel can be obtained. After the board card is powered on, there will be a temperature rising process, and the temperature drift calibration of all channels of the board card will be completed within 30 minutes. The calibration of all channels of the board card is completed, and the next channel is calibrated.

[0147] 3. The board operating program runs, and the temperature drift calibration program records the multimeter measured values at different FV positions of the board channels, the MV machine measured values sampled by the board ADC, and the board real-time temperature sensor temperature data. During the program running, the board temperature will slowly rise (under the action of the whole machine heat temperature, every increase of 2℃, the next node temperature T2 of T1 = T1 + 2℃), and after multiple rounds of program running, the corresponding channel measured values and machine measured values at different temperatures can be obtained.

[0148] 4. When the channel temperature difference reaches the temperature threshold, the test can be stopped, the data (multimeter measured values, set values, target temperature) is fitted by a function to obtain a temperature calibration coefficient, and is saved to the flash. In this way, within the temperature threshold range, for example, within 25-30 degrees, the temperature calibration coefficient can be calculated, and in subsequent use, if the current temperature of the channel exceeds this range, the temperature calibration coefficient cannot be used.

[0149] 5. After the temperature drift calibration is completed, voltage and current calibration is performed, the calibration coefficients K and B are fitted by combining the machine measured values and the multimeter measured values, and are saved to the flash.

[0150] 6. When there is a deviation between the actual board output and the calibration temperature, the FPGA monitors the board temperature in real time to obtain the current temperature, calculates the temperature difference AT between the current temperature and the calibration temperature, then substitutes the temperature calibration coefficient, the machine measured value, and AT into the calculation to obtain the MV machine measured value after temperature drift compensation, i.e., the compensated machine measured value; then substitutes the compensated machine measured value and the voltage / current calibration coefficient into the calculation to obtain the output value reduced due to temperature drift.

[0151] It should be understood that although each step in the flowchart involved in each of the above embodiments is shown in sequence according to the arrow, these steps are not necessarily executed in sequence according to the arrow. Unless otherwise explicitly stated herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other sequences. Moreover, at least part of the steps in the flowchart involved in each of the above embodiments can include multiple steps or stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of these steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or steps or stages in other steps. It can be understood that the steps in different embodiments can be freely combined as needed, and various non-contradictory schemes formed by the combination are within the scope of protection of the present application.

[0152] Based on the same inventive concept, the embodiments of the present application also provide a resource board card temperature calibration coefficient obtaining device, a calibration device and a control device for implementing the resource board card temperature calibration coefficient obtaining method, the calibration method and the control method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more resource board card temperature calibration coefficient obtaining device, calibration device and control device embodiments provided below can refer to the limitations of the resource board card temperature calibration coefficient obtaining method, the calibration method and the control method in the foregoing, and will not be described here.

[0153] In one exemplary embodiment, as shown in Figure 10 A resource board card temperature calibration coefficient obtaining device is provided, comprising: a first acquisition module 1001, a first fitting relationship determination module 1002, a fitting coefficient determination module 1003 and a temperature calibration coefficient determination module 1004, wherein:

[0154] The first acquisition module 1001 is configured to obtain each output set value and each measured value of a target channel of a resource board card at each target temperature.

[0155] The first fitting relationship determination module 1002 is configured to determine a first fitting relationship between each measured value and each output set value at each target temperature.

[0156] The fitting coefficient determination module 1003 is configured to obtain each fitting coefficient in each first fitting relationship corresponding to each target temperature.

[0157] The temperature calibration coefficient determination module 1004 is configured to obtain a second fitting relationship based on each fitting coefficient and each target temperature, and obtain a temperature calibration coefficient based on the second fitting relationship.

[0158] In one optional embodiment, the first acquisition module 1001 is specifically configured to obtain a current target temperature after the resource board card is powered on, and determine each output set value and each measured value of a target channel of the resource board card at the current target temperature; obtain a next current target temperature, take the obtained next current target temperature as a new current target temperature, and continue to perform the step of determining each output set value and each measured value of a target channel of the resource board card at the current target temperature; and stop obtaining each output set value and each measured value of a target channel of the resource board card when a difference between the obtained next current target temperature and an initial temperature is greater than or equal to a target temperature threshold.

[0159] In one of the embodiments, the device further comprises a pre-processing module configured to adjust the temperature of the resource board card to be the same as the ambient temperature before the resource board card is powered on.

[0160] In one of the embodiments, the first fitting relationship determining module 1002 is specifically configured to determine a linear fitting relationship between each of the measured values and each of the output set values at each of the target temperatures as the first fitting relationship.

[0161] The fitting coefficient determining module 1003 is specifically configured to obtain each of the slope coefficients and each of the intercept coefficients in each of the first fitting relationships corresponding to each of the target temperatures.

[0162] The temperature calibration coefficient determining module 1004 is specifically configured to determine a slope fitting relationship based on each of the slope coefficients and each of the target temperatures, and determine an intercept fitting relationship based on each of the intercept coefficients and each of the target temperatures; obtain a first temperature calibration coefficient based on the slope fitting relationship, and obtain a second temperature calibration coefficient based on the intercept fitting relationship.

[0163] In one of the embodiments, as shown in Figure 11 A resource board card calibration device is provided, which comprises a temperature obtaining module 1101, a reading module 1102, a corrected measured value determining module 1103, and a first compensation output value determining module 1104.

[0164] The temperature obtaining module 1101 is configured to read the current temperature of the resource board card.

[0165] The reading module 1102 is configured to read a current measured value and a pre-stored temperature calibration coefficient when the current temperature is different from a calibration temperature, wherein the pre-stored temperature calibration coefficient is obtained based on the resource board card temperature calibration coefficient obtaining device in any one of the embodiments.

[0166] The corrected measured value determining module 1103 is configured to obtain a corrected measured value based on the temperature calibration coefficient, the current temperature, the calibration temperature, and the current measured value.

[0167] The first compensation output value determining module 1104 is configured to obtain a compensation output value of the resource board card based on the corrected measured value.

[0168] In one of the optional embodiments, the corrected measured value determining module 1103 is specifically configured to determine a temperature difference value based on the current temperature and the calibration temperature; and obtain a corrected measured value based on the temperature difference value, the current measured value, and the temperature calibration coefficient.

[0169] In one of the optional embodiments, the modified measurement value determination module 1103 is specifically configured to calculate the modified measurement value by the following formula:

[0170] MV2 = mv_value * (1 + MKgain_x * ΔT) + MKoffset * ΔT

[0171] wherein MV2 is the modified measurement value, mv_value is the current measurement value, MKgain_x is the first temperature calibration coefficient, MKoffset is the second temperature calibration coefficient, and ΔT is the temperature difference.

[0172] In one of the optional embodiments, the device further comprises a third fitting relationship determination module configured to determine a calibration temperature, and obtain each first measurement value and each second table measurement value of the target channel of the resource board card at the calibration temperature; and fit a third fitting relationship based on each first measurement value and each second table measurement value.

[0173] In one of the optional embodiments, the first compensation output value determination module 1104 is specifically configured to obtain the compensation output value of the resource board card based on the third fitting relationship and the modified measurement value.

[0174] In one of the optional embodiments, the first compensation output value determination module 1104 is specifically configured to obtain the compensation output value based on the following formula:

[0175] y2 = K * MV2 + B,

[0176] wherein y2 is the compensation output value, MV2 is the modified measurement value, and K and B are obtained based on the third fitting relationship.

[0177] In one of the optional embodiments, as shown in Figure 12 a resource board card control device is provided, comprising a second compensation output value determination module 1201, a standard output value determination module 1202, and a control module 1203, wherein:

[0178] The second compensation output value determination module 1201 is configured to obtain the compensation output value of the resource board card based on the resource board card calibration device of claim 13;

[0179] The standard output value determination module 1202 is configured to obtain a pre-set standard output value;

[0180] The control module 1203 is configured to perform closed-loop control on the resource board card based on the compensation output value and the standard output value.

[0181] The modules in the resource board card temperature calibration coefficient obtaining device, the calibration device and the control device can be realized by software, hardware and combinations thereof in whole or in part. The modules can be embedded in or independent of a processor in a computer device in hardware form, or stored in a memory in the computer device in software form, so as to be called and executed by the processor to perform the operations corresponding to the modules.

[0182] In an exemplary embodiment, a computer device, which can be a host computer or an industrial computer, has an internal structure as shown in Figure 13 The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. The processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for running the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is configured to exchange information between the processor and external devices. The communication interface of the computer device is configured to perform wired or wireless communication with external terminals. The wireless communication can be achieved through WIFI, mobile cellular network, near field communication (NFC) or other technologies. The computer program is executed by the processor to implement a resource board card temperature calibration coefficient obtaining method, a calibration method and a control method. The display unit of the computer device is configured to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer overlaid on the display screen, or a key, a trackball or a touchpad arranged on the shell of the computer device, or an external keyboard, a touchpad or a mouse, etc.

[0183] Those skilled in the art can understand that Figure 13 The structure shown in the above description is only a block diagram of part of the structure related to the scheme of the present application, and does not limit the computer device to which the scheme of the present application is applied. The specific computer device can include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0184] In an embodiment, a computer device is also provided, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0185] In an embodiment, a computer readable storage medium is provided, and a computer program is stored on the computer readable storage medium, and the computer program is executed by a processor to implement the steps in the above method embodiments.

[0186] In an embodiment, a computer program product is provided, and the computer program product comprises a computer program, and the computer program is executed by a processor to implement the steps in the above method embodiments.

[0187] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of the related data need to comply with relevant regulations.

[0188] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when executed, can include the processes of the above-mentioned embodiment methods. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. The non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. The volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, the RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., without being limited thereto.

[0189] The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0190] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A method for obtaining a resource board card temperature calibration coefficient, characterized in that, The method comprises: obtaining each output set value and each table measured value of a target channel of a resource board card at each target temperature; determining a first fitting relationship between each table measured value and each output set value at each target temperature; obtaining each fitting coefficient in each first fitting relationship corresponding to each target temperature; obtaining a second fitting relationship based on each fitting coefficient and each target temperature, and obtaining a temperature calibration coefficient based on the second fitting relationship.

2. The method of claim 1, wherein, The method comprises: after the resource board card is powered on, obtaining a current target temperature collected and determining each output set value and each table measured value of a target channel of the resource board card at the current target temperature; obtaining a next current target temperature collected, taking the next current target temperature collected as a new current target temperature, and continuing to determine each output set value and each table measured value of a target channel of the resource board card at the current target temperature; if a difference between the next current target temperature collected and an initial temperature is greater than or equal to a target temperature threshold, stopping obtaining each output set value and each table measured value of a target channel of the resource board card.

3. The method of claim 1, wherein, Before the method of obtaining each output set value and each table measured value of a target channel of a resource board card at each target temperature, the method comprises: before the resource board card is powered on, adjusting a temperature of the resource board card to be the same as an ambient temperature.

4. The method of claim 1, wherein, The method comprises: at each target temperature, determining a linear fitting relationship between each table measured value and each output set value as the first fitting relationship; The method comprises: obtaining each slope coefficient and each intercept coefficient in each first fitting relationship corresponding to each target temperature; The method comprises: determining a slope fitting relationship based on each slope coefficient and each target temperature, and determining an intercept fitting relationship based on each intercept coefficient and each target temperature; obtaining a first temperature calibration coefficient based on the slope fitting relationship, and obtaining a second temperature calibration coefficient based on the intercept fitting relationship.

5. A method of resource board card calibration, the method comprising: The method comprises: reading a current temperature of the resource board card; if the current temperature is different from a calibration temperature, reading a current machine measured value and a pre-stored temperature calibration coefficient, the pre-stored temperature calibration coefficient being obtained based on the resource board card temperature calibration coefficient obtaining method in any one of claims 1 to 4; obtaining a corrected machine measured value based on the temperature calibration coefficient, the current temperature, the calibration temperature, and the current machine measured value; obtaining a compensation output value of the resource board card based on the corrected machine measured value.

6. The method of claim 5, wherein, The method comprises: obtaining a corrected machine measured value based on the temperature calibration coefficient, the current temperature, the calibration temperature, and the current machine measured value. determining a temperature difference value based on the current temperature and the calibration temperature; obtaining a corrected measurement value based on the temperature difference value, the current measurement value and the temperature calibration coefficient.

7. The method of claim 6, wherein, The obtaining of the corrected measurement value based on the temperature difference value, the current measurement value and the temperature calibration coefficient comprises: The corrected measurement value is obtained through the following formula: MV2 = mv_value * (1 + MKgain_x * △T) + MKoffset * △T wherein MV2 is the corrected measurement value, mv_value is the current measurement value, MKgain_x is the first temperature calibration coefficient, MKoffset is the second temperature calibration coefficient, and △T is the temperature difference value.

8. The method of claim 5, wherein, Before the obtaining of the compensation output value of the resource board card based on the corrected measurement value, the method further comprises: determining a calibration temperature, and obtaining each first measurement value and each second measurement value of a target channel of the resource board card at the calibration temperature; obtaining a third fitting relationship based on each first measurement value and each second measurement value.

9. The method of claim 8, wherein, The obtaining of the compensation output value of the resource board card based on the corrected measurement value comprises: obtaining the compensation output value of the resource board card based on the third fitting relationship and the corrected measurement value.

10. The method of claim 9, wherein, The obtaining of the compensation output value of the resource board card based on the third fitting relationship and the corrected measurement value comprises: The compensation output value is obtained based on the following formula: y2 = K * MV2 + B, wherein y2 is the compensation output value, MV2 is the corrected measurement value, and K and B are obtained based on the third fitting relationship.

11. A resource board control method, characterized by, The method comprises: obtaining the compensation output value of the resource board card based on the resource board calibration method in any one of claims 5 to 10; obtaining a standard output value set in advance; performing closed-loop control on the resource board based on the compensation output value and the standard output value.

12. A resource board card temperature calibration coefficient acquisition apparatus characterized by comprising: The device comprises: a first acquisition module configured to obtain each output set value and each measurement value of a target channel of a resource board at each target temperature; a first fitting relationship determination module configured to determine a first fitting relationship between each measurement value and each output set value at each target temperature; a fitting coefficient determination module configured to obtain each fitting coefficient in each first fitting relationship corresponding to each target temperature; a temperature calibration coefficient determination module configured to obtain a second fitting relationship based on each fitting coefficient and each target temperature, and obtain a temperature calibration coefficient based on the second fitting relationship.

13. A resource board card calibration apparatus, comprising: The device comprises: a temperature acquisition module configured to read a current temperature of the resource board; a reading module configured to read a current measurement value and a temperature calibration coefficient stored in advance in a case where the current temperature is different from a calibration temperature, the temperature calibration coefficient stored in advance being obtained by the resource board temperature calibration coefficient acquisition device in claim 12; a corrected measurement value determination module configured to obtain a corrected measurement value based on the temperature calibration coefficient, the current temperature, the calibration temperature and the current measurement value; a first compensation output value determination module configured to obtain a compensation output value of the resource board based on the corrected measurement value.

14. A resource board controller apparatus, characterized by: The device comprises: A second compensation output value determination module is configured to obtain a compensation output value of the resource board card based on the resource board card calibration device of claim 13. A standard output value determination module is configured to obtain a pre-set standard output value. A control module is configured to perform closed-loop control on the resource board card based on the compensation output value and the standard output value.

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