Semiconductor processing equipment and processing method

Abstract

The invention discloses semiconductor processing equipment and a processing method, and belongs to the field of semiconductor wafer processing. Semiconductor processing equipment comprises a base table and an electric push rod fixed to the top of the base table, a processing disc is fixedly connected to the top of the base table, a positioning disc is rotationally connected into the processing disc, a driving part for driving the positioning disc to rotate is arranged on the base table, and the semiconductor processing equipment further comprises a mounting frame; in the downward moving process of the dropping pipette, a piston cylinder, an air exhaust plate and a connecting rod are matched to generate a negative pressure suction effect at the adsorption holes, so that a wafer is adsorbed and fixed at the top of the positioning disc, the stability of the wafer in the machining process is ensured, the wafer is prevented from inclining in the machining process, and the machining quality of the wafer is improved. The processing quality is further improved; and in cooperation with rotation of the semiconductor wafer, the photoresist is uniformly spread on the surface of the whole wafer, so that the coating quality is improved, meanwhile, the drying speed of the photoresist can be increased, and the processing efficiency of the semiconductor wafer is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, and particularly relates to a semiconductor processing device and a processing method. BACKGROUND

[0002] Semiconductor refers to a material with electrical conductivity between conductor and insulator at room temperature, and the semiconductor is applied in the fields of integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion, etc., and the semiconductor manufacturing process includes wafer manufacturing, deposition, photolithography, etching, diffusion, ion implantation, packaging and other processes.

[0003] The photolithography technology is one of the most core processes in semiconductor manufacturing, and is mainly used for accurately transferring a designed circuit pattern to a semiconductor material surface, and the process is achieved by coating a photoresist on a wafer surface and then using a specific wavelength of light to irradiate a mask plate to the wafer coated with the photoresist, and the photoresist will change chemically after exposure, so that the subsequent developing step can selectively remove the unexposed or exposed part, thereby forming the required circuit pattern.

[0004] At present, when the spin coating method is used to coat the photoresist on the wafer surface, the wafer needs to be fixed on a rotating seat, and the stability of the wafer is insufficient due to the large centrifugal force in the rotation, and the wafer is prone to deviation, which reduces the coating quality of the photoresist; and the photoresist may precipitate in the storage tank during the standing and waiting for the next drop, thereby reducing the uniformity of the distribution of the photoresist; therefore, a semiconductor processing device and a processing method are proposed. SUMMARY

[0005] The present application aims to solve the problems in the prior art that the wafer is unstable during coating of the photoresist, is prone to deviation, reduces the coating quality of the photoresist, and the photoresist standing and waiting in the storage tank may be unevenly distributed, thereby reducing the coating quality, and proposes a semiconductor processing device and a processing method.

[0006] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0007] The utility model provides a kind of semiconductor processing equipment, including base and fixed electric push rod on its top, the top of the base is fixedly connected with processing disc, the processing disc is rotatably connected with positioning disc in, and drive part for driving positioning disc rotation is provided on the base, further comprising: mounting bracket, the mounting bracket is fixed in the telescopic end top of electric push rod, the top of the mounting bracket is fixedly connected with glue storage tank, the bottom end of the glue storage tank is fixed and is communicated with drop tube, and electromagnetic valve is provided on the drop tube, wherein, the processing disc is provided with the agitating part for the uniform mixing of photoresist in glue storage tank;Positioning rod, the positioning rod is fixed on the top of base, the mounting bracket is slidably adjusted on positioning rod, wherein, the top of the positioning rod is provided with negative pressure part for generating suction in positioning disc;Heating assembly, the heating assembly is arranged in processing disc, and heating assembly is used to carry out soft baking to wafer surface after coating photoresist.

[0008] In order to improve the uniformity of photoresist coating, preferably, the drive part includes a drive motor fixed at the bottom of the base, the bottom of the base is provided with a drive slot, the rotating shaft of the positioning disc penetrates downward into the drive slot, the bottom end of the rotating shaft of the positioning disc is fixedly connected with a first magnetic sleeve, the top end of the output shaft of the drive motor is fixedly connected with a second magnetic sleeve, and the second magnetic sleeve is sleeved outside the first magnetic sleeve, and the first magnetic sleeve and the second magnetic sleeve are magnetically attracted.

[0009] In order to realize accurate alignment and improve coating quality, preferably, the mounting bracket is fixedly connected with guide plates on both sides, the top of the processing disc is provided with guide slots on both sides, the guide slots are fixedly connected with guide rods, the top end of the guide rods is slidably inserted into the guide plates, the guide slots are vertically aligned with the guide plates, and the inner diameter of the guide slots is the same as the outer diameter of the guide plates.

[0010] In order to improve the uniformity of photoresist distribution, preferably, the agitating part includes an agitating shaft rotatably connected in the glue storage tank, the bottom end of the agitating shaft is fixedly connected with an agitating paddle, the top of the glue storage tank is fixedly connected with a pneumatic box, the top end of the agitating shaft penetrates into the pneumatic box and is fixedly connected with a pneumatic blade, and the processing disc is provided with a gas guide part for driving the pneumatic blade to rotate.

[0011] Further, the gas guide part includes two groups of driven wheels rotatably connected on both sides of the top of the processing disc, the side wall of the driven wheel is fitted with the outer wall of the guide plate, the side wall of the processing disc is fixedly connected with a piston chamber, the piston chamber is slidably connected with a piston plate, the top of the piston plate is rotatably connected with a push-pull rod, the rotating shaft end of the driven wheel is fixedly connected with a rotating disc, the top end of the push-pull rod is rotatably connected with the side wall of the rotating disc through a pin shaft, the side wall of the piston chamber is fixedly connected and communicated with a gas guide pipe, and the other end of the gas guide pipe is communicated with the inner cavity of the pneumatic box.

[0012] Further, the two groups of air guide tubes are arranged in a staggered manner, and the outer wall of the air box is provided with exhaust holes.

[0013] In order to improve the stability of the semiconductor wafer, preferably, the negative pressure part comprises a piston cylinder fixed at the top end of the positioning rod, a suction plate connected to the outer wall of the positioning rod in the piston cylinder, a connecting rod fixed between the bottom of the suction plate and the top of the mounting frame, a top cavity of the piston cylinder in communication with the inner cavity of the positioning rod, a sealing ring rotatably connected to the rotating shaft of the positioning disc, the sealing ring fixedly connected to the inner cavity of the processing disc, a plurality of adsorption holes equally spaced apart on the top of the positioning disc, the sealing ring in communication with the inner cavity of the positioning disc, a negative pressure suction tube fixed on the outer wall of the sealing ring and in communication with the other end of the negative pressure suction tube and the inner cavity of the positioning rod.

[0014] In order to improve the soft drying efficiency, preferably, the heating assembly comprises an electric heating tube, a heating groove is formed in the processing disc, the electric heating tube is fixed in the lower part of the inner cavity of the heating groove, a heating controller is fixedly connected to the outer wall of the processing disc, the output end of the heating controller is connected to the input end of the electric heating tube, the rotating shaft of the positioning disc passes through the center of the inner cavity of the heating groove and is fixedly connected with a guide vane, the lower end of the guide groove on both sides is in communication with the inner cavity of the heating groove, and the side of the guide groove on both sides facing the positioning disc is provided with a blowing hole.

[0015] In order to facilitate exposure, preferably, a light shield is fixedly connected to the outer wall of the droplet tube, an ultraviolet lamp is fixedly connected to the inner cavity of the light shield, a mask is fixedly connected to the outer wall of the droplet tube, and the mask is located below the ultraviolet lamp.

[0016] A semiconductor processing method, the steps are as follows:

[0017] Step one: place the semiconductor wafer on the positioning disc through the existing mechanical arm, so that the wafer is aligned with the center of the positioning disc;

[0018] Step two: adsorb and fix the wafer on the positioning disc, and drive the wafer to rotate to complete the coating of photoresist;

[0019] Step three: soft baking the surface of the wafer coated with photoresist;

[0020] Step four: expose the surface of the wafer after soft baking and cooling.

[0021] Compared with the prior art, the present application provides a semiconductor processing equipment and processing method, which has the following advantages:

[0022] 1. The semiconductor processing equipment, in the process of moving down of the droplet pipe, the cooperation between the piston cylinder, the suction plate and the connecting rod generates negative pressure suction force at the adsorption hole, so that the wafer is adsorbed and fixed on the top of the positioning disc, ensuring the stability of the wafer in the processing process, avoiding the inclination of the wafer in the processing process, and improving the processing quality; and cooperating with the rotation of the semiconductor wafer, the photoresist is uniformly spread on the whole wafer surface, improving the coating quality, and also accelerating the drying speed of the photoresist, improving the processing efficiency of the semiconductor wafer.

[0023] 2. The semiconductor processing equipment, through the friction between the guide plate and the driven wheel, cooperating with the setting of the rotating disc, the push-pull rod, the piston plate and the piston bin, the opposite air flow thrust is applied to the pneumatic blade from both sides at the same time, so as to drive the pneumatic blade to rotate, so that the photoresist in the storage tank is stirred, and the photoresist is uniformly distributed in the storage tank, ensuring the use quality of the photoresist and improving the final plating quality.

[0024] 3. The semiconductor processing equipment, through the cooperation of the guide plate and the guide groove, the heating groove is sealed first, so as to heat the gas in the heating groove, avoid heat loss, improve the energy saving effect, and then use the heated air flow to produce uniform hot air blowing effect on the surface of the semiconductor wafer, so that the residual solvent of the photoresist is dried, so as to improve the adhesion between the photoresist and the semiconductor wafer, and then improve the quality of the photoresist layer. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The overall structure of the semiconductor processing equipment is shown in the present application Figure One ;

[0026] Figure 2 The overall structure of the semiconductor processing equipment is shown in the present application Figure Two ;

[0027] Figure 3 The side view of the semiconductor processing equipment is shown in the present application

[0028] Figure 4 The overall structure of the semiconductor processing equipment is shown in the present application Figure 3 The enlarged structure of area A is shown in the present application

[0029] Figure 5 The overall structure of the semiconductor processing equipment is shown in the present application Figure 3 The enlarged structure of area B is shown in the present application

[0030] Figure 6 The internal structure of the piston cylinder of the semiconductor processing equipment is shown in the present application

[0031] Figure 7 A partial enlarged structural schematic view of a semiconductor processing equipment according to the present application;

[0032] Figure 8 A schematic view of the internal structure of a pneumatic box of a semiconductor processing equipment according to the present application;

[0033] Figure 9 A flow chart of a semiconductor processing method according to the present application.

[0034] In the figure: 1, base; 2, electric push rod; 3, processing disc; 31, positioning disc; 32, guide groove; 321, guide rod; 4, mounting frame; 41, glue storage tank; 42, droplet pipe; 43, guide plate; 44, light shield; 45, ultraviolet lamp; 46, mask; 5, positioning rod; 6, driving motor; 61, driving groove; 62, first magnetic sleeve; 63, second magnetic sleeve; 7, stirring shaft; 71, stirring paddle; 72, pneumatic box; 721, exhaust hole; 73, pneumatic blade; 74, driven wheel; 75, piston chamber; 76, piston plate; 77, push-pull rod; 78, rotating disc; 79, air guide pipe; 8, piston cylinder; 81, air suction plate; 82, connecting rod; 83, sealing ring; 84, adsorption hole; 85, negative pressure suction pipe; 9, electric heating pipe; 91, heating groove; 92, heating controller; 93, flow guide blade; 94, air blowing hole. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application.

[0036] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0037] Embodiment one:

[0038] Reference Figures 1-8The utility model provides a kind of semiconductor processing equipment, including base 1 and fixed electric push rod 2 on its top, base 1 top is fixedly connected with processing disc 3, rotatingly connected with positioning disc 31 in processing disc 3, and drive part for driving positioning disc 31 rotation is provided on base 1, further include: mounting bracket 4, mounting bracket 4 is fixed in the telescopic end top of electric push rod 2, mounting bracket 4 top is fixedly connected with storage glue tank 41, storage glue tank 41 bottom end is fixed and is communicated with drip tube 42, and electromagnetic valve is provided on drip tube 42, wherein, processing disc 3 is provided with the agitating part of uniform mixing for storage glue tank 41 in photoresist;Positioning rod 5, positioning rod 5 is fixed on the top of base 1, mounting bracket 4 is slidably adjusted on positioning rod 5, wherein, positioning rod 5 top is provided with the negative pressure part of generating suction in positioning disc 31;Heating assembly, heating assembly is provided in processing disc 3, and heating assembly is used for the soft baking of wafer surface after coating photoresist.

[0039] Refer to Figure 1 、 Figure 6 Wherein, negative pressure part includes piston cylinder 8, piston cylinder 8 is fixed in the top end of positioning rod 5, suction plate 81 is slidably connected on the outer wall of positioning rod 5 in piston cylinder 8, the bottom of suction plate 81 is fixed between the top of mounting bracket 4 and is fixed by connecting rod 82, the top cavity of piston cylinder 8 is communicated with the inner cavity of positioning rod 5, the rotating shaft of positioning disc 31 is rotatably connected with sealing ring 83, sealing ring 83 is fixedly connected with the inner cavity bottom of processing disc 3, a plurality of adsorption holes 84 are equidistantly arranged on the top of positioning disc 31, sealing ring 83 is communicated with the inner cavity of positioning disc 31, sealing ring 83 outer wall is fixed and communicated with negative pressure suction tube 85, the other end of negative pressure suction tube 85 is communicated with the inner cavity of positioning rod 5.

[0040] Through the setting of the above structure, in the process that mounting bracket 4 moves downward, suction plate 81 is pulled along positioning rod 5 to slide downward by connecting rod 82, so as to generate negative pressure suction force on the top of piston cylinder 8, and the action is transmitted to positioning disc 31 along positioning rod 5, negative pressure suction tube 85 and sealing ring 83, so that negative pressure suction force acts on a plurality of adsorption holes 84, so that semiconductor wafer is adsorbed and fixed on the top of positioning disc 31, so as to ensure the stability of semiconductor wafer in subsequent processing process, avoid its inclination in processing process, and thus improve the processing quality.

[0041] Refer to Figure 2 、 Figure 3 Wherein, drive part includes drive motor 6, drive motor 6 is fixed on the bottom of base 1, drive groove 61 is arranged on the bottom of base 1, the rotating shaft of positioning disc 31 penetrates downward into drive groove 61, the bottom end of rotating shaft of positioning disc 31 is fixedly connected with first magnetic sleeve 62, the top end of output shaft of drive motor 6 is fixedly connected with second magnetic sleeve 63, and second magnetic sleeve 63 is sleeved outside first magnetic sleeve 62, and first magnetic sleeve 62 and second magnetic sleeve 63 are magnetically attracted.

[0042] Through the setting of the above structure, the opening drive motor 6 is started, the first magnetic sleeve 62 and the second magnetic sleeve 63 are attracted, the positioning disc 31 and the semiconductor wafer are driven to rotate, and the electromagnetic valve in the liquid drop pipe 42 is opened, so that the photoresist in the storage tank 41 drops to the center of the semiconductor wafer. At this time, under the action of the centrifugal force generated by the rotation of the semiconductor wafer, the photoresist is evenly spread on the entire wafer surface to form a thin and flat photoresist layer, effectively improving the coating quality. During the rotation process, the photoresist is quickly contacted with the airflow, thereby accelerating the drying speed of the photoresist, and thereby improving the processing efficiency of the semiconductor wafer.

[0043] With reference to Figure 3 , Figure 5 , both sides of the mounting frame 4 are fixedly connected with guide plates 43, both sides of the top of the processing disc 3 are provided with guide grooves 32, the guide grooves 32 are fixedly connected with guide rods 321, the top ends of the guide rods 321 are slidably inserted into the guide plates 43, the guide grooves 32 are aligned with the guide plates 43, and the inner diameter of the guide grooves 32 is the same as the outer diameter of the guide plates 43; the heating assembly includes an electric heating tube 9, the processing disc 3 is provided with a heating groove 91, the electric heating tube 9 is fixedly connected in the lower part of the inner cavity of the heating groove 91, a heating controller 92 is fixedly connected to the outer wall of the processing disc 3, the output end of the heating controller 92 is connected with the input end of the electric heating tube 9, the rotating shaft of the positioning disc 31 passes through the center of the inner cavity of the heating groove 91 and is fixedly connected with guide vanes 93, the lower ends of the two guide grooves 32 are communicated with the inner cavity of the heating groove 91, and the side of each guide groove 32 facing the positioning disc 31 is provided with a blowing hole 94.

[0044] Through the setting of the above structure, in the process of moving the mounting frame 4 downward, the guide plates 43 will be inserted into the guide grooves 32, at this time the blowing holes 94 will be blocked, the inner cavity of the heating groove 91 is closed, then the heating controller 92 controls the electric heating tube 9 to heat the gas in the inner cavity of the heating groove 91, thereby accumulating heat, and the drive motor 6 drives the guide vanes 93 to rotate in the heating groove 91, thereby pushing the airflow in the heating groove 91 towards the electric heating tube 9, thereby improving the heating efficiency; when the electric push rod 2 drives the mounting frame 4 to move upward and reset, the guide plates 43 will be pulled out of the guide grooves 32, and finally the blowing holes 94 will be unblocked, at this time the guide vanes 93 continue to rotate with the rotating shaft of the positioning disc 31 in the heating groove 91, thereby pushing the heated airflow along the guide grooves 32 and the blowing holes 94 to the surface of the rotating semiconductor wafer, thereby producing uniform hot air blowing effect on the surface of the semiconductor wafer, so that the solvent remaining in the photoresist is dried, thereby improving the adhesion between the photoresist and the semiconductor wafer, and thereby improving the quality of the photoresist layer.

[0045] With reference to Figure 2 , Figure 3、 Figure 7 and Figure 8 Wherein, the stirring part comprises a stirring shaft 7, which is rotationally connected in the glue storage tank 41, and a stirring paddle 71 is fixedly connected to the bottom end of the stirring shaft 7, a pneumatic box 72 is fixedly connected to the top of the glue storage tank 41, the top end of the stirring shaft 7 penetrates into the pneumatic box 72 and is fixedly connected with a pneumatic blade 73, and a guide gas part for pushing the pneumatic blade 73 to rotate is arranged on the processing disc 3; the guide gas part comprises two groups of driven wheels 74, which are rotationally connected to the top of the two sides of the processing disc 3 respectively, the side wall of the driven wheel 74 is in close contact with the outer wall of the guide plate 43, a piston chamber 75 is fixedly connected to the side wall of the processing disc 3, a piston plate 76 is slidingly connected in the piston chamber 75, a push-pull rod 77 is rotationally connected to the side wall of the rotating disc 78 through a pin shaft, the rotating shaft end of the driven wheel 74 is fixedly connected with a rotating disc 78, the top end of the push-pull rod 77 is rotationally connected to the side wall of the rotating disc 78 through a pin shaft, the side wall of the piston chamber 75 is fixedly and communicatively provided with a guide gas pipe 79, the other end of the guide gas pipe 79 is in communication with the inner cavity of the pneumatic box 72; the two groups of guide gas pipes 79 are arranged in position and staggered, and the outer wall of the pneumatic box 72 is provided with an exhaust hole 721.

[0046] Through the above structure, when the guide plate 43 moves to the bottom of the guide groove 32, the driven wheel 74 is driven to rotate by the friction force, and the piston plate 76 is driven to slide up and down in the piston chamber 75 by the cooperation of the rotating disc 78 and the push-pull rod 77, and when the piston plate 76 slides downward, the gas in the piston chamber 75 is compressed and filled into the pneumatic box 72 through the two side guide gas pipes 79 arranged in position and staggered, so as to simultaneously apply opposite air flow thrust to the pneumatic blade 73 from the two sides, thereby driving the pneumatic blade 73 to rotate, and driving the stirring shaft 7 and the stirring paddle 71 to rotate in the glue storage tank 41, so as to stir the photoresist and make it uniformly distributed in the glue storage tank 41, thereby ensuring the use quality of the photoresist and improving the final plating quality.

[0047] Referring to Figure 2 , Figure 3 Wherein, the outer wall of the drop tube 42 is fixedly connected with a light shield 44, the inner cavity of the light shield 44 is fixedly connected with a ultraviolet light 45 at the top, the outer wall of the drop tube 42 is fixedly connected with a mask 46, and the mask 46 is located below the ultraviolet light 45.

[0048] Through the above structure, after drying, wait for the photoresist layer to cool to room temperature, then continue to control the mounting frame 4 to move downward, so that the mask 46 moves to the upper side of the photoresist layer, then turn on the ultraviolet light 45, so that the ultraviolet light passes through the mask 46 to expose the photoresist layer, thereby transferring the pattern designed on the mask 46 to the photoresist layer, and finally the wafer is cleaned by the developing solution, thereby completing the overall photoetching process of the wafer.

[0049] Embodiment two:

[0050] With reference to Figures 1-9 , on the basis of embodiment one, a semiconductor processing method is proposed, the steps are as follows:

[0051] Step one: the semiconductor wafer is placed on the positioning disc 31 by the existing mechanical arm, so that the wafer is aligned with the center of the positioning disc 31;

[0052] Step two: the wafer is adsorbed and fixed on the positioning disc 31, and the wafer is rotated to complete the coating of photoresist;

[0053] Step three: the wafer surface coated with photoresist is soft baked;

[0054] Step four: the wafer surface after soft baking and cooling is exposed.

[0055] With reference to Figures 1-9 , in the present application, when in use, the semiconductor wafer is placed on the positioning disc 31 by the existing mechanical arm, and the wafer is aligned with the center of the positioning disc 31, then the electric push rod 2 is retracted downward, the mounting frame 4 moves downward, and the suction plate 81 is pulled along the positioning rod 5 to slide downward, so that the negative pressure suction force is generated at the top of the piston cylinder 8, and the action is transmitted to the positioning disc 31 along the positioning rod 5, the negative pressure suction pipe 85 and the sealing ring 83, so that the negative pressure suction force is generated at the adsorption hole 84, the semiconductor wafer is adsorbed and fixed on the top of the positioning disc 31, so as to ensure the stability of the semiconductor wafer in the subsequent processing process, avoid the inclination of the wafer in the processing process, and improve the processing quality.

[0056] In the process of the installation frame 4 moving downward, the guide plate 43 is inserted into the guide groove 32, at this time, the blow hole 94 is blocked, the cavity of the heating groove 91 is closed, then the heating controller 92 controls the electric heating tube 9 to heat the gas in the cavity of the heating groove 91, so as to accumulate heat, at the same time, the driving motor 6 is started, the first magnetic sleeve 62 and the second magnetic sleeve 63 are attracted, the positioning disc 31 and the semiconductor wafer are driven to rotate, and at this time, the rotating shaft of the positioning disc 31 drives the guide vane 93 to rotate in the heating groove 91, so as to push the airflow in the heating groove 91 to move towards the electric heating tube 9, thereby improving the heating efficiency; then the dropping pipe 42 also moves to a proper height from the top of the semiconductor wafer, at the same time, the electromagnetic valve in the dropping pipe 42 is started, so that the photoresist in the storage tank 41 drops to the center of the semiconductor wafer, at this time, under the action of the centrifugal force generated by the rotation of the semiconductor wafer, the photoresist is uniformly spread on the entire wafer surface, forming a thin and flat photoresist layer, effectively improving the coating quality, and in the rotating process, the photoresist is quickly contacted with the airflow, so as to accelerate the drying speed of the photoresist, thereby improving the processing efficiency of the semiconductor wafer.

[0057] In addition, when the guide plate 43 moves to the bottom of the guide groove 32, the friction drives the driven wheel 74 to rotate, cooperates with the rotary disc 78 and the push-pull rod 77, so that the piston plate 76 reciprocates up and down in the piston chamber 75, and when the piston plate 76 slides downward, the gas in the piston chamber 75 is compressed, and the gas is filled into the pneumatic box 72 along the two side gas guide pipes 79, so as to simultaneously apply opposite airflow thrust to the pneumatic vane 73 from both sides, thereby driving the pneumatic vane 73 to rotate, so that the stirring shaft 7 drives the stirring paddle 71 to rotate in the storage tank 41, so as to stir the photoresist, so that it is uniformly distributed in the storage tank 41, ensuring the use quality of the photoresist and improving the final plating quality.

[0058] When the photoresist coating is completed, the electric push rod 2 drives the installation frame 4 to move upward and reset, at this time, the guide plate 43 is pulled out of the guide groove 32, and finally the blow hole 94 is unblocked, at this time, the guide vane 93 continues to rotate with the rotating shaft of the positioning disc 31 in the heating groove 91, so as to push the heated airflow along the guide groove 32 and the blow hole 94 to the surface of the rotating semiconductor wafer, so as to produce uniform hot air blowing effect on the surface of the semiconductor wafer, so that the solvent remaining in the photoresist is dried, so as to improve the adhesion between the photoresist and the semiconductor wafer, thereby improving the quality of the photoresist layer.

[0059] When the drying is finished, the photoresist layer is cooled to room temperature, then the mounting frame 4 is controlled to move downward, so that the mask 46 moves above the photoresist layer, then the UV light lamp 45 is turned on, the UV light passes through the mask 46 to expose the photoresist layer, so that the pattern designed on the mask 46 is transferred to the photoresist layer, finally the wafer is cleaned by the developing solution, and the whole photoetch processing of the wafer is completed.

[0060] The above merely describes the preferred embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacements or changes according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered by the protection scope of the present application.

Claims

1. A semiconductor processing apparatus comprising a base (1) and an electrically driven push rod (2) fixed to the top of the base, characterized in that The base (1) top fixedly connected with processing disc (3), the processing disc (3) is rotatably connected with positioning disc (31), and the base (1) is provided with drive part for driving positioning disc (31) rotation, further comprising: Mounting bracket (4), the mounting bracket (4) is fixed in the telescopic end top of electric push rod (2), the mounting bracket (4) top fixedly connected with storage glue tank (41), the storage glue tank (41) bottom end fixed and is communicated with drip tube (42), and the drip tube (42) is provided with electromagnetic valve, Wherein, the processing disc (3) is provided with the agitating part for uniform mixing of the photoresist in the storage glue tank (41); Positioning rod (5), the positioning rod (5) is fixed in the base (1) top, the mounting bracket (4) is slidably adjusted on the positioning rod (5), Wherein, the positioning rod (5) top is provided with the negative pressure part for generating suction in the positioning disc (31); Heating assembly, the heating assembly is arranged in the processing disc (3), and the heating assembly is used for soft baking the wafer surface after coating photoresist.

2. The semiconductor processing apparatus according to claim 1, wherein The drive part includes drive motor (6), the drive motor (6) is fixed in the bottom of base (1), the base (1) bottom is provided with drive slot (61), the rotating shaft of positioning disc (31) is downwardly penetrated into drive slot (61), the bottom end of the rotating shaft of positioning disc (31) is fixedly connected with first magnetic sleeve (62), the output shaft top of drive motor (6) is fixedly connected with second magnetic sleeve (63), and the second magnetic sleeve (63) is sleeved on the outer side of first magnetic sleeve (62), and the first magnetic sleeve (62) and second magnetic sleeve (63) are magnetically attracted.

3. The semiconductor processing apparatus according to claim 1, wherein The mounting bracket (4) both sides are fixedly connected with guide plate (43), the top of processing disc (3) both sides are provided with guide slot (32), the guide slot (32) is fixedly connected with guide rod (321), the top of guide rod (321) is slidably inserted into guide plate (43), the guide slot (32) and guide plate (43) are vertically aligned, and the inner diameter of guide slot (32) is same with the outer diameter of guide plate (43).

4. The semiconductor processing apparatus according to claim 3, wherein The agitating part includes stirring shaft (7), the stirring shaft (7) is rotatably connected in the storage glue tank (41), the bottom end of stirring shaft (7) is fixedly connected with stirring paddle (71), the top of storage glue tank (41) is fixedly connected with pneumatic box (72), the top of stirring shaft (7) is penetrated into pneumatic box (72) and is fixedly connected with pneumatic blade (73), the processing disc (3) is provided with air guide part for driving pneumatic blade (73) rotation.

5. The semiconductor processing apparatus according to claim 4, wherein The air guide part comprises two groups of driven wheels (74), and the two groups of driven wheels (74) are respectively rotationally connected on the top of the machining disc (3) on both sides.

6. The semiconductor processing apparatus according to claim 5, wherein The side wall of the driven wheel (74) is attached to the outer wall of the guide plate (43), the piston cylinder (75) is fixedly connected on the side wall of the machining disc (3), the piston plate (76) is slidably connected in the piston cylinder (75), the top of the piston plate (76) is rotationally connected with the push-pull rod (77), the rotating shaft end of the driven wheel (74) is fixedly connected with the rotating disc (78), the top end of the push-pull rod (77) is rotationally connected on the side wall of the rotating disc (78) through a pin shaft, the side wall of the piston cylinder (75) is fixedly and communicatively provided with the air guide pipe (79), and the other end of the air guide pipe (79) is in communication with the inner cavity of the pneumatic box (72).

7. The semiconductor processing apparatus of claim 1, wherein The two groups of air guide pipes (79) are arranged in a staggered manner, and the outer wall of the pneumatic box (72) is provided with an air exhaust hole (721).

8. The semiconductor processing apparatus of claim 3, wherein The negative pressure part comprises a piston cylinder (8), the piston cylinder (8) is fixed on the top end of the positioning rod (5), the positioning rod (5) is slidably connected with the air suction plate (81) on the outer wall in the piston cylinder (8), the bottom of the air suction plate (81) and the top of the mounting frame (4) are fixed by the connecting rod (82), the top cavity of the piston cylinder (8) is in communication with the inner cavity of the positioning rod (5), the rotating shaft of the positioning disc (31) is rotationally connected with the sealing ring (83), the sealing ring (83) is fixedly connected with the inner cavity bottom of the machining disc (3), a plurality of adsorption holes (84) are equally spaced on the top of the positioning disc (31), the sealing ring (83) is in communication with the inner cavity of the positioning disc (31), the outer wall of the sealing ring (83) is fixedly and communicatively provided with the negative pressure suction pipe (85), and the other end of the negative pressure suction pipe (85) is in communication with the inner cavity of the positioning rod (5).

9. The semiconductor processing apparatus of claim 1, wherein The heating assembly comprises an electric heating pipe (9), the machining disc (3) is provided with a heating groove (91), the electric heating pipe (9) is fixed in the lower part of the inner cavity of the heating groove (91), the outer wall of the machining disc (3) is fixedly connected with a heating controller (92), the output end of the heating controller (92) is connected with the input end of the electric heating pipe (9), the rotating shaft of the positioning disc (31) passes through the center of the inner cavity of the heating groove (91) and is fixedly connected with the guide vane (93), the lower ends of the two guide grooves (32) are in communication with the inner cavity of the heating groove (91), and the two guide grooves (32) are provided with air blowing holes (94) on the side facing the positioning disc (31).

10. A semiconductor processing method using the semiconductor processing apparatus according to any one of claims 1 to 9, characterized by The outer wall of the drop tube (42) is fixedly connected with a light shield (44), the inner cavity top of the light shield (44) is fixedly connected with an ultraviolet lamp (45), the outer wall of the drop tube (42) is fixedly connected with a mask (46), and the mask (46) is located below the ultraviolet lamp (45). The steps are as follows: Step one: the semiconductor wafer is placed on the positioning disc (31) by the existing mechanical arm, so that the wafer is aligned with the center of the positioning disc (31); Step two: the wafer is adsorbed and fixed on the positioning disc (31), and the wafer is rotated to complete the coating of photoresist. Step three: soft baking the wafer surface coated with photoresist; Step four: exposing the wafer surface after soft baking and cooling.

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