Wafer box carrying system

Abstract

The invention provides a wafer box carrying system, which comprises a wafer box, a conveying device and a control device, and is characterized in that the wafer box comprises a taking block; the AMR comprises a moving part, a carrying part, a mechanical arm, a clamping jaw and an image acquisition unit, the carrying part comprises an electric control box and a carrying table, the carrying part is located on the moving part, a base of the mechanical arm is fixed to the carrying part, the clamping jaw and the taking block are designed in a matched mode, and the clamping jaw and the image acquisition unit are arranged at the tail end of the mechanical arm; the moving part, the image acquisition unit and the mechanical arm are all electrically connected with the electric control box, the electric control box drives and controls the moving part to move, and the electric control box controls the mechanical arm to move according to images, acquired by the image acquisition unit, of the clamping jaw and the taking block, so that the clamping jaw and the taking block are aligned and the wafer box is taken. According to the wafer box carrying method, carrying of various wafer boxes can be achieved through one AMR, path planning and moving scenes are simple, and carrying efficiency is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of AMR technology, and particularly relates to a wafer box conveying system. BACKGROUND

[0002] In a 12-inch semiconductor wafer manufacturing factory, personnel conveying wafer boxes may cause fragments due to large vibration, greatly reduce production yield, and the full load weight of the wafer box is large, and personnel conveying multiple batches at a time is easy to cause personnel fatigue or work injury, etc.

[0003] To solve the above problems, some factories use AMR (Autonomous Mobile Robot) to convey wafer boxes. However, due to the variety of wafer boxes, in order to realize the taking of different wafer boxes, a corresponding plurality of AMRs are often configured in a region, or an AMR with replaceable grippers of a mechanical arm is configured, which easily leads to path conflicts of multiple AMRs, time-consuming replacement of grippers, and other problems affecting conveying efficiency. SUMMARY

[0004] The present application provides a wafer box conveying system, which can realize the conveying of multiple wafer boxes by one AMR, has simple path planning and moving scene, and has high conveying efficiency.

[0005] The technical scheme adopted by the present application is as follows: A wafer box conveying system, comprising: a wafer box, the wafer box comprising a taking block; an AMR, the AMR comprising a moving part, a carrying part, a mechanical arm, a gripper and an image acquisition unit, the carrying part comprising an electric control box and a carrying table, the carrying part being located on the moving part, the base of the mechanical arm being fixed on the carrying part, the gripper being matched with the taking block, the gripper and the image acquisition unit being arranged at the end of the mechanical arm, the moving part, the image acquisition unit and the mechanical arm being electrically connected with the electric control box, the electric control box driving and controlling the moving part to move, the electric control box controlling the movement of the mechanical arm according to the images of the gripper and the taking block acquired by the image acquisition unit, so that the gripper is aligned with the taking block and the wafer box is taken.

[0006] The taking block is a cuboid, the gripper comprises two mutually parallel clamping arms and a support rod connected between the ends of the two clamping arms, a groove penetrating the length direction of the clamping arm is formed on the inner side of each clamping arm, the connection position of the support rod and the end of each clamping arm is located on one side of the groove, and the gap between the support rod and the other side of the groove is greater than the thickness of the taking block, so as to form a gap suitable for inserting and extracting the taking block.

[0007] A to-position sensor is further arranged in the groove of at least one of the clamping arms to detect whether the taking block is inserted into position.

[0008] The to-position sensor is a pressure sensor, at least one notch is arranged on at least one side of the taking block, the pressure sensor is arranged to adapt to the position of the notch, and the electric control box is electrically connected with the pressure sensor to determine that the taking block is inserted into position when the pressure sensor detects that the pressure continuously changes to no pressure.

[0009] The image acquisition unit is a first camera, the first camera is installed above the clamping jaw wrist, the shooting direction of the first camera is parallel to the length direction of any one of the clamping arms and faces the end of the clamping arm.

[0010] The electric control box is specifically used for: controlling the mechanical arm to maintain at an initial position when the AMR reaches a loading position and a side of the object table faces a storage area where the wafer box is located, wherein, when the side of the object table faces the storage area where the wafer box is located and the mechanical arm is at the initial position, the two clamping arms of the clamping jaw are at the same horizontal plane, and the ends of the two clamping arms point to the storage area where the wafer box is located; controlling the end of the mechanical arm to move horizontally from a lateral one-side limit position to another-side limit position, controlling the first camera to acquire images and record the position of the end of the mechanical arm every interval preset time; regarding the position of the end of the mechanical arm as a lateral alignment position when the pixels at the midpoint position of the target surface of the taking block and the pixels at the midpoint position of the supporting rod are at the same pixel horizontal coordinate according to the images acquired during horizontal movement and the recorded positions, wherein the target surface is the surface of the taking block facing the first camera; controlling the end of the mechanical arm to move to the lateral alignment position; controlling the end of the mechanical arm to move downward from an upper limit position to a lower limit position or to move upward from the lower limit position to the upper limit position, controlling the first camera to acquire images and record the position of the end of the mechanical arm every interval preset time; regarding the position of the end of the mechanical arm as an initial vertical alignment position when the area of the target surface of the taking block in the image is maximum according to the images acquired during downward or upward movement and the recorded positions; controlling the end of the mechanical arm to move to the initial vertical alignment position and continue to move upward by a preset distance, wherein the preset distance is the vertical distance between the center point of the insertion gap and the focal point of the first camera; controlling the end of the mechanical arm to move to the wafer box in the front-back direction from the current position to make the taking block inserted into the clamping jaw from the insertion gap.

[0011] The moving part includes an obstacle sensor.

[0012] The obstacle sensor includes a laser radar and a second camera.

[0013] The side of the moving part is provided with a first emergency stop button, and the top of the object carrying part is provided with a second emergency stop button.

[0014] The wafer box is a FOUP (Front Opening Unified Pod) or a CST (Cassette).

[0015] The beneficial effects of the present application are: The present application can realize the carrying of various wafer boxes through one AMR, the path planning and the moving scene are simple, and the carrying efficiency is high, by the design of the taking block on the wafer box, the matching design of the AMR clamp jaw and the taking block, and the alignment and taking control of the clamp jaw and the taking block. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The structure schematic diagram of the wafer box carrying system of one embodiment of the present application is shown in the figure. Figure 2 The structure schematic diagram of the wafer box of one embodiment of the present application is shown in the figure. Figure 3 The structure schematic diagram of the wafer box of one embodiment of the present application is shown in the figure. Figure 4 The structure schematic diagram of the clamp jaw and the first camera of one embodiment of the present application is shown in the figure. Figure 5 The structure schematic diagram of the wafer box carrying system of one embodiment of the present application is shown in the figure.

[0017] Reference signs: Wafer box 100, AMR 200; Taking block 110, moving part 210, object carrying part 220, mechanical arm 230, clamp jaw 240, image acquisition unit 250; Notch 111, laser radar 211, second camera 212, first emergency stop button 213, electric control box 221, object table 222, second emergency stop button 223, clamp arm 241, support rod 242, groove 243, insertion gap 244, pressure sensor 245. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0019] As Figure 1As shown, the wafer box carrying system of the embodiment of the present application comprises a wafer box 100 and an AMR 200, the wafer box 100 comprises a taking block 110, the AMR 200 comprises a moving part 210, a carrying part 220, a mechanical arm 230, a clamping jaw 240 and an image acquisition unit 250, the carrying part 220 comprises an electric control box 221 and a carrying table 222, the carrying part 220 is located on the moving part 210, the base of the mechanical arm 230 is fixed on the carrying part 210, the clamping jaw 240 is designed to match the taking block 110, the clamping jaw 240 and the image acquisition unit 250 are arranged at the end of the mechanical arm 230, the moving part 210, the image acquisition unit 250 and the mechanical arm 230 are electrically connected with the electric control box 221, the electric control box 221 drives and controls the moving part 210 to move, the electric control box 221 controls the mechanical arm 230 to move according to the images of the clamping jaw 240 and the taking block 110 acquired by the image acquisition unit 250, so that the clamping jaw 240 is aligned with the taking block 110 and the wafer box 100 is taken.

[0020] In one embodiment of the present application, as shown in Figure 2 and Figure 3 , the taking block 110 is a cuboid, as shown in Figure 4 , the clamping jaw 240 comprises two clamping arms 241 parallel to each other and a support rod 242 connected between the ends of the two clamping arms 241, recesses 243 penetrating the length direction of the clamping arms 241 are formed on the inner sides of the two clamping arms 241, the connection position of the support rod 242 and the end of each clamping arm 241 is located on one side of the recess 243, and the gap between the support rod 242 and the other side of the recess 243 is greater than the thickness of the taking block 110, so as to form a gap 244 suitable for the insertion and extraction of the taking block 110.

[0021] In one embodiment of the present application, the wafer box 100 can be various types such as FOUP or CST, and the above-mentioned taking block 110 is arranged on each type of wafer box 100, so as to be suitable for the taking of the AMR 200 in the embodiment of the present application.

[0022] In one embodiment of the present application, a position sensor can also be arranged in the groove of the recess 243 of at least one clamping arm 241, so as to detect whether the taking block 110 is inserted in place. Specifically, as shown in Figure 4 , the position sensor can be a pressure sensor 245, as shown in Figure 3As shown, at least one notch 111 is arranged on at least one side of the taking block 110, and the pressure sensor 245 is arranged at the position of the notch 111, and the electric control box 221 is electrically connected with the pressure sensor 245, so as to determine that the taking block 110 is inserted into the position when the pressure sensor 245 detects that the pressure changes from continuous to no pressure. In the process of inserting the taking block 110, the side of the taking block 110 can extrude the pressure sensor 245 in the groove 243, so that the pressure sensor 245 continuously senses the pressure. When the notch 111 on the side of the taking block 110 reaches the position of the pressure sensor 245, the pressure sensor 245 is no longer extruded by the side of the taking block 110. By designing the position of the notch 111 on the side of the taking block 110 and the position of the pressure sensor 245 in the groove 243, the taking block 110 can be inserted into the position when the notch 111 reaches the position of the pressure sensor 245, so that the insertion of the taking block 110 into the position can be detected by the pressure sensor 245.

[0023] In one embodiment of the present application, as shown in Figure 4 The image acquisition unit 250 can be a first camera, which is installed above the wrist of the clamping jaw 240, and the shooting direction of the first camera is parallel to the length direction of any clamping arm 241 and faces the end of the clamping arm 241.

[0024] Further, the moving part 210 can include an obstacle sensor for detecting obstacles around during movement to realize automatic obstacle avoidance.

[0025] As shown in Figure 1 and Figure 5 The obstacle sensor can include a laser radar 211 and a second camera 212, both of which are electrically connected with the electric control box 221, so as to send the collected laser radar data and images to the electric control box 221, and the electric control box 221 processes and analyzes the laser radar data and images to obtain obstacle information.

[0026] Further, a first emergency stop button 213 is arranged on the side of the moving part 210, and a second emergency stop button 223 is arranged on the top of the carrying part 220. Both of the emergency stop buttons are electrically connected with the electric control box 221, so that the electric control box 221 can control the moving part to stop moving when the first emergency stop button 213 is triggered, and the electric control box 221 can control the mechanical arm to stop moving when the second emergency stop button 223 is triggered. Since the first emergency stop button 213 is arranged on the side of the moving part 210, its height is suitable for triggering by kicking, and the second emergency stop button 223 is arranged on the top of the carrying part 220, its height is suitable for triggering by pressing with hand. The two different triggering modes can be suitable for the operator to distinguish the two components to be stopped in emergency, and reduce the possibility of taking corresponding measures by mistake in emergency.

[0027] In an embodiment of the present application, the electric control box 221 can specifically perform the following steps S1-S8 to realize the alignment of the gripper 240 and the taking block 110.

[0028] S1, when the AMR 200 reaches the loading position and the side of the object table 222 faces the storage area where the wafer box 100 is located, control the mechanical arm 230 to maintain at the initial position, wherein when the side of the object table 222 faces the storage area where the wafer box 100 is located and the mechanical arm 230 is at the initial position, the two clamping arms 241 of the gripper 240 are at the same horizontal plane, and the ends of the two clamping arms 241 point to the storage area where the wafer box 100 is located.

[0029] The electric control box 221 can control the AMR 200 to reach the loading position and make the side of the object table 222 face the storage area where the wafer box 100 is located according to the preset navigation route.

[0030] S2, when controlling the end of the mechanical arm 230 to move laterally from one side limit position to the other side limit position, control the first camera to capture an image and record the position of the end of the mechanical arm 230 every preset time interval.

[0031] Here, the lateral direction under the view angle of the first camera can also be referred to as the left-right direction, and the movement refers to the movement from left to right or from right to left.

[0032] In an embodiment of the present application, the loading position and the movement range of the mechanical arm 230 can be designed in advance, so that when the AMR 200 reaches the loading position, the range covered by the two lateral limit positions and the two upper and lower limit positions of the end of the mechanical arm 230 covers the area projected by the taking block 110 in the front-back direction. When the mechanical arm 230 is at the initial position, the end of the mechanical arm 230 can be located at a corner of the above-mentioned range, for example, the upper left corner.

[0033] In an embodiment of the present application, the field of view range of the first camera can be designed so that the image captured at the loading position always contains the support rod 242 of the gripper 240 and the taking block 110.

[0034] The electric control box 221 records the position of the end of the mechanical arm 230 at the same time when it controls the first camera to capture an image, and stores the correspondence between the image and the position.

[0035] S3, according to the image captured during the movement and the recorded position, when the pixel at the midpoint position of the target surface of the taking block 110 in the image and the pixel at the midpoint position of the support rod 242 are at the same pixel horizontal coordinate, the position of the end of the mechanical arm 230 is taken as the lateral alignment position, wherein the target surface is the surface of the taking block 110 facing the first camera.

[0036] In one embodiment of the present application, the target face of the taking block 110, the support rod and other targets in the image can be recognized by template matching or other methods. If the target face of the taking block 110 fails to be recognized in this step, it is possible that the target face is blocked, in which case the step S2 can be performed again after adjusting the up-and-down position of the end of the mechanical arm 230.

[0037] The support rod 242 not only supports the strength of the gripper 240, but also serves as a feature for laterally aligning the gripper 240 and the taking block 110, and helps to achieve position alignment and taking.

[0038] S4, the end of the mechanical arm 230 is controlled to move to a laterally aligned position.

[0039] The movement of the end of the mechanical arm 230 in the steps S2 and S4 can always be lateral movement, and after moving to the laterally aligned position in the step S4, the lateral position of the end of the mechanical arm 230 no longer changes until the taking block 110 is inserted into the gripper 240.

[0040] S5, when the end of the mechanical arm 230 is controlled to move downward from the upper limit position to the lower limit position, or to move upward from the lower limit position to the upper limit position, the first camera is controlled to capture images and record the position of the end of the mechanical arm 230 every preset time interval.

[0041] S6, according to the images captured when moving downward or upward and the recorded positions, the position of the end of the mechanical arm 230 when the area of the target face of the taking block 110 in the image is the largest is taken as the initial vertical alignment position.

[0042] When the target face of the taking block 110 fails to be recognized due to being blocked or other reasons, the area of the target face can be recorded as 0.

[0043] S7, the end of the mechanical arm 230 is controlled to move to the initial vertical alignment position and continue to move upward by a preset distance, wherein the preset distance is the vertical distance between the center point of the insertion gap 244 and the focal point of the first camera.

[0044] S8, the end of the mechanical arm 230 is controlled to move in the front-and-back direction from the current position to the wafer box 100, so that the taking block 110 is inserted into the gripper 240 from the insertion gap 244.

[0045] The alignment algorithm of the above steps S1-S8 for the gripper 240 and the taking block 110 is relatively simple and has high recognition accuracy.

[0046] After the in-place sensor detects that the picking block 110 is inserted into the place, the electric control box 221 can control the end of the mechanical arm 230 to stop continuing to move forward, and instead control the end of the mechanical arm 230 to move upward to pick the wafer box 100, and finally move the wafer box 100 to the object table 222 according to the pre-planned path of the end of the mechanical arm 230. Figure 1 and Figure 5 It is shown that the wafer box 100 is moved to the object table 222, and it is understood that the orientation of the gripper 240 at this time is opposite to that in the alignment process and the clamping process. After the wafer box 100 is moved to the object table 222, the end of the mechanical arm 230 can be controlled to move backward relative to the wafer box 100 to extract the picking block 110 from the gripper 240. Then the mechanical arm 230 can be controlled to return to the initial position, and the above process is repeated to pick another wafer box 100 until each object table 222 is fully loaded.

[0047] According to the wafer box carrying system of the embodiment of the present application, the carrying of various wafer boxes can be realized by one AMR through the design of the picking block on the wafer box, the matching design of the AMR gripper and the picking block, and the alignment and picking control of the gripper and the picking block, the path planning and the moving scene are simple, and the carrying efficiency is high.

[0048] In the description of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can be explicitly or implicitly included one or more of the features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0049] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] In the present application, unless specifically stated and limited otherwise, a first feature "on" or "under" a second feature can be directly in contact with the second feature, or indirectly in contact with the second feature through an intermediate medium. Also, a first feature "over", "above" and "on top of" a second feature can be directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. A first feature "under", "below" and "underneath" a second feature can be directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0051] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples, without contradiction.

[0052] Any process or method descriptions or descriptions of the flow diagrams in the specification or otherwise described herein can be understood as representing code modules, segments, or portions of code which include one or more executable instructions for implementing specific logic functions or other processes. The scope of preferred embodiments of the present application encompasses the additional implementation in which the functions are performed in a different order, in substantially simultaneous fashion, or in reverse order, as appropriate, and the scope of preferred embodiments of the present application encompasses additional implementation in which functions are performed by different entities than those shown or discussed, as appropriate, and the scope of preferred embodiments of the present application encompasses additional implementation in which functions are performed by different entities than those shown or discussed, as appropriate.

[0053] The logic and / or steps represented in flow diagrams or otherwise described herein, for example, can be considered as a sequence of instructions to implement logic functions, and can be embodied in any computer-readable medium for use by an instruction execution system, apparatus, or device, such as a computer-based system, processor- containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. In the context of this specification, a "computer-readable medium" can be any means that can contain, store, communicate, propagate or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The computer-readable medium can be a machine-readable storage device (e.g., magnetic, optical or other) a machine-readable storage diskette (e.g., floppy disk, optical disk, etc.), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), optical fibers, and a portable compact disc read-only memory (CDROM). Further, the computer-readable medium can even be paper or other suitable medium upon which the program is printed, as the program can be electronically captured, for example via the optical scanner of a device or other electronic capture device, and then compiled, interpreted, or otherwise processed in a suitable manner, if necessary, and stored in a computer memory.

[0054] It should be understood that aspects of the application can be implemented in hardware, software, firmware or combinations thereof. In the above embodiments, various steps or methods can be implemented in software or firmware that is stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any of the following technologies, known in the art, or combinations thereof, can be used: a discrete logic circuit having logic gates for implementing logic functions upon data signals, an application specific integrated circuit having appropriate combinational logic gates, a programmable gate array (PGA), a field programmable gate array (FPGA), or the like.

[0055] Those of skill in the art could readily implement the above described example methods with all or a portion of the disclosed steps carried out by a program for use with a computer system or similar electronic device, where the program is intended for use as intermediate steps to achieve the results taught by the disclosure. Note that the software can be in the form of system programs, application programs, applets or other units / modules. Those of skill would further appreciate that the various logic elements, modules, processors, and units described herein can be replaced by one or more FPGAs, PLAs, ASICs or other customized or programmable data processing components.

[0056] In addition, each function unit in each embodiment of the present application can be integrated in one processing module, or each unit can exist physically separately, or two or more units can be integrated in one module. The integrated module can be realized in the form of hardware, or in the form of software function module. When the integrated module is realized in the form of software function module and sold or used as an independent product, it can also be stored in a computer readable storage medium.

[0057] Although the embodiments of the present application have been shown and described above, it should be understood by those ordinary skilled in the art that the above embodiments are exemplary and cannot be understood as limiting the present application, and those ordinary skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A wafer cassette handling system, characterized in that, include: A wafer cassette (100) includes a pick-up block (110). The AMR (200) includes a moving part (210), a carrying part (220), a robotic arm (230), a gripper (240), and an image acquisition unit (250). The carrying part (220) includes an electrical control box (221) and a stage (222). The carrying part (220) is located on the moving part (210). The base of the robotic arm (230) is fixed on the carrying part (220). The gripper (240) is designed to match the picking block (110). The gripper (240) and the image acquisition unit (250) are designed to... The moving part (210), the image acquisition unit (250), and the robotic arm (230) are all electrically connected to the electrical control box (221). The electrical control box (221) drives and controls the moving part (210) to move. The electrical control box (221) controls the movement of the robotic arm (230) based on the images of the gripper (240) and the pick-up block (110) acquired by the image acquisition unit (250), so that the gripper (240) is aligned with the pick-up block (110) and picks up the wafer cassette (100).

2. The wafer cassette handling system according to claim 1, characterized in that, The grabbing block (110) is cuboid. The gripper (240) includes two parallel gripping arms (241) and a support rod (242) connected between the ends of the two gripping arms (241). On the inner side of the two gripping arms (241), a groove (243) is provided that runs through the length direction of the gripping arm (241). The connection position of the support rod (242) to the end of each gripping arm (241) is located on one side of the groove (243), and the gap between the support rod (242) and the other side of the groove (243) is greater than the thickness of the grabbing block (110) to form an insertion slot (244) suitable for the grabbing block (110) to be inserted and withdrawn.

3. The wafer cassette handling system according to claim 2, characterized in that, A positioning sensor is also provided in the groove (243) of at least one of the clamping arms (241) to detect whether the pick-up block is inserted into position.

4. The wafer cassette handling system according to claim 3, characterized in that, The positioning sensor is a pressure sensor (245). At least one notch (111) is provided on at least one side of the picking block (110). The pressure sensor (245) is adapted to the position of the notch (111). The electrical control box (221) is electrically connected to the pressure sensor (245) so that when the pressure sensor (245) detects that the pressure has changed from continuous to no pressure, it determines that the picking block (110) has been inserted into place.

5. The wafer cassette handling system according to claim 2, characterized in that, The image acquisition unit (250) is a first camera, which is mounted above the wrist of the gripper (240). The shooting direction of the first camera is parallel to the length direction of any of the grippers (241) and faces the end of the gripper (241).

6. The wafer cassette handling system according to claim 5, characterized in that, The electrical control box (221) is specifically used for: When the AMR (200) reaches the loading position and one side of the platform (222) faces the storage area where the wafer cassette (100) is located, the robotic arm (230) is controlled to maintain the initial position. When one side of the platform (222) faces the storage area where the wafer cassette (100) is located and the robotic arm (230) is in the initial position, the two gripping arms (241) of the gripper (240) are on the same horizontal plane and the ends of the two gripping arms (241) point to the storage area where the wafer cassette (100) is located. When controlling the end of the robotic arm (230) to move laterally from one extreme position to the other extreme position, the first camera is controlled to acquire images and record the position of the end of the robotic arm (230) at preset time intervals; Based on the images captured during lateral movement and the recorded positions, when the pixel at the midpoint of the target surface of the picking block (110) in the image and the pixel at the midpoint of the support rod (242) are at the same pixel horizontal coordinate, the position of the end of the robotic arm (230) is taken as the lateral alignment position, wherein the target surface is the side of the picking block (110) facing the first camera; Control the end of the robotic arm (230) to move to the lateral alignment position; When controlling the end of the robotic arm (230) to move down from the upper limit position to the lower limit position, or to move up from the lower limit position to the upper limit position, the first camera is controlled to acquire images and record the position of the end of the robotic arm (230) at preset time intervals; Based on the images and recorded positions acquired during downward or upward movement, the position of the end of the robotic arm (230) when the area of ​​the target surface of the picking block (110) in the image is maximized is taken as the initial vertical alignment position; Control the end of the robotic arm (230) to move to the initial vertical alignment position, and continue to move upward a preset distance, wherein the preset distance is the vertical distance between the center point of the slot (244) and the focal point of the first camera; The end of the robotic arm (230) is controlled to move from its current position toward the wafer cassette in a front-back direction so that the pick-up block (110) is inserted into the gripper (240) through the slot (244).

7. The wafer cassette handling system according to claim 1, characterized in that, The moving part (210) includes an obstacle sensor.

8. The wafer cassette handling system according to claim 7, characterized in that, The obstacle sensor includes a lidar (211) and a second camera (212).

9. The wafer cassette handling system according to claim 1, characterized in that, The side of the moving part (210) is provided with a first emergency stop button (213), and the top of the carrying part (220) is provided with a second emergency stop button (223).

10. The wafer cassette handling system according to claim 1, characterized in that, The wafer cassette (100) is either a FOUP or a CST.

Images