Chip adsorbing and transferring device capable of automatically turning over

Abstract

The invention discloses an automatic turn-over chip adsorbing and transferring device, and relates to the technical field of chip transferring, a sliding support is slidably connected to a horizontal support in the horizontal direction, a rotating cylinder is rotatably mounted on the sliding support, a sliding plate is slidably connected to the rotating cylinder in the vertical direction, and a horizontal telescopic assembly is arranged on the sliding plate; the overturning assembly drives the adsorption assembly to rotate in the circumferential direction to overturn, and a plurality of electric adsorption discs used for adsorbing the other surface of the chip are arranged on the second fixing plate. According to the invention, one surface of the chip is adsorbed through the plurality of first adsorption discs, the chip adsorbed by the adsorption assembly is conveyed to the corresponding second bearing disc, the plurality of first adsorption discs on the shell are separated from the chip, and the plurality of electric adsorption discs at the bottom of the second fixing plate adsorb the other surface of the chip on the shell; and the chips adsorbed by the multiple electric adsorption discs are conveyed to the second bearing disc located below the second fixing plate, the overturning action of the chips is completed, and automatic overturning can be achieved while the chips are adsorbed and transferred.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and in particular to an automatic flipping chip adsorption and transfer device. Background Technology

[0002] During the packaging, testing and other processing of chips, it is necessary to accurately transfer the chip from one position to the next, and at the same time, the chip needs to be flipped to meet the requirements of large-scale production and high-precision processing.

[0003] During chip transfer, mechanical grippers can scratch the chip surface and damage it. Traditional manual flipping is not only inefficient but also contaminates the chip surface with hand contact, affecting packaging yield. Furthermore, chips need to be sorted during transfer, requiring them to be flipped at a certain angle. However, existing chip flipping mechanisms have low automation and low production efficiency, failing to meet increasing production demands, and are prone to chip damage during the flipping process.

[0004] In the prior art, Chinese invention patent application number CN202310868862.5 discloses a chip adsorption and transfer mechanism. It adopts a design that uses an eccentric wheel to rotate and drive the suction head to move up and down. The power output direction changes from vertical to horizontal, making the overall structure more compact and requiring less installation space, thus saving space. At the same time, the suction head has a floating design, and the floating displacement is limited by a contact switch at the point of vertical floating. This prevents hard pressure when close to the adsorbed product and protects the product's shape from damage. The suction head can rotate within a certain range under the drive of the rotating seat. However, during the adsorption process, chip edge breakage and surface scratches can still occur. It cannot achieve automatic flipping while adsorbing and transferring the chip. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a chip adsorption and transfer device that can automatically flip the chip while adsorbing and transferring it.

[0006] The technical solution adopted to solve the above technical problems is as follows: A horizontal support is set on one side of the platform, and a sliding support is slidably connected to the horizontal support. A rotating cylinder is rotatably installed on the sliding support, and a sliding plate is slidably connected to the rotating cylinder in the vertical direction. A horizontal telescopic component is set on the sliding plate to drive the adsorption component and the flipping component to move in the horizontal direction. The flipping component drives the adsorption component to rotate in the circumferential direction to flip it. A support platform and multiple supports are set on the other side of the platform. A first carrier plate for placing chips is set on the support platform. The adsorption component is used to adsorb one surface of the chip. A second carrier plate for placing chips is set on each support. The adsorption component adsorbs the chip and moves it to the second carrier plate. An electric cylinder is set on each support. The output end of the electric cylinder is fixedly connected to a fixed plate. A first guide rod is set on the top of the fixed plate and slidably connected to the support in the vertical direction. A second fixed plate is set on the bottom of the fixed plate. Multiple electric adsorption plates for adsorbing the other surface of the chip are set on the second fixed plate. The second fixed plate is located directly above the second carrier plate. The electric cylinder drives the chip adsorbed on the second fixed plate to move and place the flipped chip on the second carrier plate.

[0007] Furthermore, a sixth motor is provided on the horizontal support, the output shaft of the sixth motor is fixedly connected to one end of the first lead screw, the first lead screw is rotatably connected to the horizontal support, the first lead screw is threadedly connected to the sliding support, and a horizontal guide rail is provided on the horizontal support and slidably connected to the sliding support in the horizontal direction.

[0008] Furthermore, a seventh motor is installed inside the sliding bracket. The output shaft of the seventh motor is fixedly connected to the second gear shaft. The second gear shaft is rotatably connected to the bottom of the rotating drum. A third gear is installed on the second gear shaft. A third gear shaft is fixedly installed on the bottom of the rotating drum. A fourth gear is installed on the third gear shaft to mesh with the third gear.

[0009] Furthermore, a fifth motor is provided on the rotating drum, and a second lead screw is rotatably installed inside the rotating drum. The output shaft of the fifth motor is fixedly connected to one end of the second lead screw, and the second lead screw is threadedly connected to the sliding plate. Multiple second guide rods are provided inside the rotating drum, and the sliding plate is slidably connected to the multiple second guide rods in the vertical direction.

[0010] Furthermore, the horizontal telescopic component comprises: a fourth motor is provided at the bottom of the sliding plate, the output shaft of the fourth motor is fixedly connected to one end of the bottom of the second connecting plate, a third motor is provided at the bottom of the other end of the second connecting plate, the output shaft of the third motor is fixedly connected to one end of the third connecting plate, a second motor is provided at the bottom of the other end of the third connecting plate, the output shaft of the second motor is fixedly connected to the bottom of the first connecting plate, and a flipping component and an adsorption component are provided on the first connecting plate.

[0011] Furthermore, the flipping component is as follows: a fixed frame is provided on the first connecting plate, a first motor is provided on the fixed frame, the output shaft of the first motor is fixedly connected to the first gear shaft, a first gear is provided on the first gear shaft, a second gear that meshes with the first gear is rotatably mounted on the fixed frame, the second gear is located below the first gear, the second gear is fixedly connected to the rotating disk, the rotating disk is rotatably connected to the fixed frame, and the rotating disk is fixedly connected to the adsorption component.

[0012] Furthermore, the adsorption assembly comprises: multiple fixing blocks respectively arranged on both sides of the first fixing plate; sliding holes processed on both sides of each fixing block; a connecting rod slidably connected in the vertical direction inside each fixing block; sliding rods slidably connected in the vertical direction to the sliding holes on both sides of each connecting rod; each connecting rod being fixedly connected to the housing by a spring; the housing being located below the first fixing plate; multiple first adsorption disks for adsorbing one surface of the chip being arranged on the housing; an internal space communicating with the inlet ends of the multiple first adsorption disks being processed inside the housing; an air extraction hole communicating with the internal space being processed on the housing; and the outlet end of the vacuum generator communicating with the air extraction hole.

[0013] Furthermore, a laser emitter is provided on the sliding plate, and a laser receiver is provided on the mounting bracket.

[0014] The beneficial effects of the present invention are as follows: (1) The present invention uses multiple first adsorption plates to adsorb one surface of the chip. The rotating cylinder drives the adsorption component, the flipping component and the horizontal telescopic component to move in the horizontal direction, and transports the chip adsorbed by the adsorption component to the corresponding second carrier plate. When the chip needs to be flipped, the multiple first adsorption plates on the shell separate from the chip, and the multiple electric adsorption plates at the bottom of the second fixed plate adsorb the other surface of the chip on the shell, and transport the chip adsorbed by the multiple electric adsorption plates to the second carrier plate located below the second fixed plate, thus completing the flipping action of the chip. It can automatically flip the chip while adsorbing and transferring it. The present invention is suitable for transportation with large displacement.

[0015] (2) The present invention uses a rotating drum to drive the adsorption component and the flipping component to rotate through the horizontal telescopic component. The adsorption component moves to the top of the chip in the first carrier plate on the support platform. The second connecting plate, the third connecting plate and the first connecting plate extend and adjust the position of the adsorption component and the flipping component on the horizontal telescopic component in the horizontal direction. The sliding plate moves in the vertical direction on the second lead screw and multiple second guide rods. The housing moves to contact the upper surface of the chip. The rotating drum drives the adsorption component, the flipping component and the horizontal telescopic component to move in the horizontal direction, transporting the chip adsorbed by the adsorption component to the corresponding second carrier plate. The position of the adsorption component can be automatically adjusted.

[0016] (3) Under the action of the spring, the sliding rods on both sides of each connecting rod on the housing slide in the sliding hole of the fixing block in the vertical direction. The housing and the first fixing plate form a flexible connection, avoiding chip edge cracking and surface scratches caused by traditional rigid adsorption.

[0017] (4) In this invention, the laser emitter emits laser light and the laser receiver receives the laser light emitted by the laser emitter, which is used to detect whether the fixed frame is kept on the same horizontal plane as the sliding plate during the movement. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of one embodiment of the chip adsorption and transfer device for automatic flipping according to the present invention.

[0019] Figure 2 yes Figure 1 A structural diagram from another angle.

[0020] Figure 3 This is a structural diagram of the adsorption component, the flipping component, and the horizontal telescopic component.

[0021] Figure 4 This is a schematic diagram of the components on the rotating drum.

[0022] Figure 5 This is a schematic diagram of a structure in which the adsorption component flips over to transport the adsorbed chip to the area below the second fixing plate and adsorbs it there.

[0023] Figure 6 This is a schematic diagram of the structure of the parts on the top of the casing.

[0024] Figure 7 This is a schematic diagram of the bottom of the shell.

[0025] Figure 8 This is a structural diagram of the flip component.

[0026] Figure 9 This is a structural diagram of the horizontal telescopic component.

[0027] Figure 10 yes Figure 9 A structural diagram from another angle.

[0028] Figure 11 This is a structural diagram of the second fixing plate and the fixing disk.

[0029] Reference numerals: 1. Support platform; 2. First bearing plate; 3. Adsorption assembly; 301. First fixing plate; 302. Housing; 303. Sliding rod; 304. Sliding hole; 305. Spring; 306. Air extraction hole; 307. Connecting rod; 308. First adsorption plate; 309. Fixing block; 4. Tilting assembly; 401. Rotating disk; 402. Fixing frame; 403. First motor; 404. First gear; 405. First gear shaft; 406. Second gear; 5. Horizontal telescopic assembly; 501. Second motor; 502. First connecting plate; 503. Third motor; 504. Fourth motor; 505. Second connecting plate 506. Plate; 6. Third connecting plate; 7. Fifth motor; 8. Rotary drum; 9. Sliding bracket; 10. Sixth motor; 11. Platform; 12. Horizontal guide rail; 13. First lead screw; 14. Horizontal bracket; 15. Bracket; 16. Second bearing plate; 17. Second fixing plate; 18. First guide rod; 19. Electric cylinder; 20. Fixing plate; 21. Second lead screw; 22. Second guide rod; 23. Sliding plate; 24. Seventh motor; 25. Third gear; 26. Chip; 27. Laser emitter; 28. Laser receiver; 29. ​​Electric suction plate; 30. Second gear shaft; 31. Third gear shaft; 32. Fourth gear. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0031] like Figures 1 to 2 , Figure 4 , Figure 11 As shown, the automatic flipping chip adsorption and transfer device of this embodiment is composed of a support platform 1, a first bearing plate 2, an adsorption component 3, a flipping component 4, a horizontal telescopic component 5, a fifth motor 6, a rotating cylinder 7, a sliding bracket 8, a sixth motor 9, a platform 10, a horizontal guide rail 11, a first lead screw 12, a horizontal bracket 13, a bracket 14, a second bearing plate 15, a second fixing plate 16, a first guide rod 17, an electric cylinder 18, a fixing plate 19, a second lead screw 20, a second guide rod 21, a sliding plate 22, a seventh motor 23, a third gear 24, a chip 25, a laser emitter 26, a laser receiver 27, an electric adsorption plate 28, a second gear shaft 29, a third gear shaft 30, and a fourth gear 31 connected together.

[0032] A horizontal support 13 is provided on one side of the platform 10. A sliding support 8 is slidably connected to the horizontal support 13 in the horizontal direction. A sixth motor 9 is provided on the horizontal support 13. The output shaft of the sixth motor 9 is fixedly connected to one end of the first lead screw 12. The first lead screw 12 is rotatably connected to the horizontal support 13 and threadedly connected to the sliding support 8. A horizontal guide rail 11 is provided on the horizontal support 13 and slidably connected to the sliding support 8 in the horizontal direction. A rotating drum 7 is rotatably mounted on the sliding support 8. A seventh motor 23 is provided inside the sliding support 8. The output shaft of the seventh motor 23 is fixedly connected to the second gear shaft 29. The second gear shaft 29 is rotatably connected to the bottom of the rotating drum 7. A third gear 24 is provided on the second gear shaft 29. A third gear shaft 30 is fixedly mounted on the bottom of the rotating drum 7. A fourth gear 31 that meshes with the third gear 24 is provided on the third gear shaft 30.

[0033] A sliding plate 22 is slidably connected to the rotating drum 7 along the vertical direction. A fifth motor 6 is installed on the rotating drum 7. A second lead screw 20 is rotatably installed inside the rotating drum 7. The output shaft of the fifth motor 6 is fixedly connected to one end of the second lead screw 20. The second lead screw 20 is threadedly connected to the sliding plate 22. Multiple second guide rods 21 are installed inside the rotating drum 7. The sliding plate 22 is slidably connected to the multiple second guide rods 21 along the vertical direction. A horizontal telescopic component 5 is installed on the sliding plate 22 to drive the adsorption component 3 and the flipping component 4 to move in the horizontal direction. The flipping component 4 drives the adsorption component 3 to rotate in the circumferential direction to flip it. A support platform 1 and multiple brackets 14 are provided on the other side of the platform 10. A first carrier plate 2 for placing the chip 25 is provided on the support platform 1. The adsorption component 3 is used to adsorb one surface of the chip 25. A second carrier plate 15 for placing the chip 25 is provided on each bracket 14. The adsorption component 3 adsorbs the chip 25 and moves it to the second carrier plate 15. Each bracket 14 Electric cylinders 18 are respectively provided on the upper part. The output end of the electric cylinders 18 is fixedly connected to the fixed plate 19. The top of the fixed plate 19 is provided with a first guide rod 17 that is slidably connected to the bracket 14 in the vertical direction. The bottom of the fixed plate 19 is provided with a second fixed plate 16. The second fixed plate 16 is provided with a plurality of electric adsorption plates 28 for adsorbing the other surface of the chip 25. The second fixed plate 16 is located directly above the second carrier plate 15. The electric cylinders 18 drive the chip 25 adsorbed on the second fixed plate 16 to move and place the flipped chip 25 on the second carrier plate 15.

[0034] like Figure 3 , Figures 5 to 7 As shown, the adsorption assembly 3 is composed of a first fixing plate 301, a housing 302, a sliding rod 303, a sliding hole 304, a spring 305, an air extraction hole 306, a connecting rod 307, a first adsorption plate 308, and a fixing block 309 connected together.

[0035] The adsorption component 3 consists of: multiple fixing blocks 309 on both sides of the first fixing plate 301; sliding holes 304 on both sides of each fixing block 309; a connecting rod 307 slidably connected to the interior of each fixing block 309 in the vertical direction; sliding rods 303 slidably connected to the sliding holes 304 in the vertical direction on both sides of each connecting rod 307; and each connecting rod 307 fixedly connected to the housing 302 by a spring 305. The housing 302 is located below the first fixing plate 301. Multiple first adsorption disks 308 for adsorbing one surface of the chip 25 are provided on the housing 302. An internal space communicating with the inlet end of the multiple first adsorption disks 308 is processed inside the housing 302. An air extraction hole 306 communicating with the internal space is processed on the housing 302. The outlet end of the vacuum generator is communicating with the air extraction hole 306.

[0036] like Figure 3 , Figure 8 As shown, the flipping assembly 4 is composed of a rotating disk 401, a fixed frame 402, a first motor 403, a first gear 404, a first gear shaft 405, and a second gear 406 connected together.

[0037] The flipping component 4 consists of: a fixing frame 402 on the first connecting plate 502, a first motor 403 on the fixing frame 402, the output shaft of the first motor 403 being fixedly connected to the first gear shaft 405, a first gear 404 on the first gear shaft 405, a second gear 406 rotatably mounted on the fixing frame 402 and meshing with the first gear 404, the second gear 406 being located below the first gear 404, the second gear 406 being fixedly connected to the rotating disk 401, the rotating disk 401 being rotatably connected to the fixing frame 402, and the rotating disk 401 being fixedly connected to the adsorption component 3.

[0038] like Figure 3 , Figure 5 , Figures 9 to 10 As shown, the horizontal telescopic assembly 5 is composed of a second motor 501, a first connecting plate 502, a third motor 503, a fourth motor 504, a second connecting plate 505, and a third connecting plate 506 connected together.

[0039] The horizontal telescopic component 5 consists of: a fourth motor 504 at the bottom of the sliding plate 22, the output shaft of the fourth motor 504 being fixedly connected to one end of the bottom of the second connecting plate 505; a third motor 503 at the bottom of the other end of the second connecting plate 505, the output shaft of the third motor 503 being fixedly connected to one end of the third connecting plate 506; a second motor 501 at the bottom of the other end of the third connecting plate 506, the output shaft of the second motor 501 being fixedly connected to the bottom of the first connecting plate 502; a flipping component 4 and an adsorption component 3 on the first connecting plate 502; and a fixed connection between the first connecting plate 502 and the fixing frame 402.

[0040] A laser emitter 26 is provided on the sliding plate 22, and a laser receiver 27 is provided on the fixed frame 402. The laser emitter 26 is used to emit laser light, and the laser receiver 27 is used to receive the laser light emitted by the laser emitter 26 and to detect whether the fixed frame 402 maintains the same horizontal plane as the sliding plate 22 during the movement.

[0041] The working principle of this embodiment is as follows: The output shaft of the seventh motor 23 drives the second gear shaft 29 to rotate, the second gear shaft 29 drives the third gear 24 to rotate, the third gear 24 drives the fourth gear 31 to rotate through meshing transmission, the fourth gear 31 drives the rotating drum 7 to rotate through the third gear shaft 30, the rotating drum 7 drives the adsorption assembly 3 and the flipping assembly 4 to rotate through the horizontal telescopic assembly 5, and the adsorption assembly 3 moves to above the chip 25 located in the first carrier disk 2 on the support platform 1, such as... Figure 4 As shown. The output shaft of the fourth motor 504 drives the second connecting plate 505 to swing, the output shaft of the third motor 503 drives the third connecting plate 506 to swing, and the output shaft of the second motor 501 drives the first connecting plate 502 to swing. The second connecting plate 505, the third connecting plate 506, and the first connecting plate 502 extend, adjusting the horizontal position of the adsorption component 3 and the flipping component 4 on the horizontal telescopic assembly 5, as shown. Figure 3 As shown. The output shaft of the fifth motor 6 drives the second lead screw 20 to rotate. The sliding plate 22 moves vertically along the second lead screw 20 and multiple second guide rods 21. The housing 302 moves to contact the upper surface of the chip 25. Under the action of the spring 305, the sliding rods 303 on both sides of each connecting rod 307 on the housing 302 slide vertically in the sliding holes 304 of the fixing block 309. The housing 302 and the first fixing plate 301 form a flexible connection. The output end of the vacuum generator evacuates the internal space of the housing 302 through the evacuation hole 306. Multiple first adsorption plates 308 adsorb one surface of the chip 25. The output shaft of the sixth motor 9 drives the first lead screw 12 to rotate. The sliding bracket 8 drives the rotating drum 7 to move horizontally along the first lead screw 12 and the horizontal guide rail 11. The rotating drum 7 drives the adsorption assembly 3, the flipping assembly 4 and the horizontal telescopic assembly 5 to move horizontally, transporting the chip 25 adsorbed by the adsorption assembly 3 to the corresponding second carrier plate 15.

[0042] When chip 25 needs to be flipped, the output shaft of the first motor 403 drives the first gear shaft 405 to rotate, the first gear shaft 405 drives the first gear 404 to rotate, the first gear 404 meshes with the second gear 406 to drive the second gear 406 to rotate, the second gear 406 drives the rotating disk 401 to rotate, the rotating disk 401 drives the adsorption assembly 3 to rotate, and the housing 302 moves to a position above the first fixed plate 301, as shown. Figure 5As shown, multiple first adsorption plates 308 on the housing 302 move the adsorbed chip 25 to contact the bottom of the second fixing plate 16. The first vacuum generator is turned off, and the multiple first adsorption plates 308 on the housing 302 separate from the chip 25. Multiple electric adsorption plates 28 at the bottom of the second fixing plate 16 adsorb the other surface of the chip 25 on the housing 302. The adsorption assembly 3, the flipping assembly 4, and the horizontal telescopic assembly 5 move away from the bracket 14. The output end of the electric cylinder 18 drives the fixing plate 19 and the second fixing plate 16 to move in the vertical direction. The fixing plate 19 drives multiple first guide rods 17 to move in the vertical direction on the bracket 14, transporting the chip 25 adsorbed by the multiple electric adsorption plates 28 to the second carrier plate 15 located below the second fixing plate 16, completing the flipping action of the chip 25.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. An automatic flipping chip adsorption and transfer device, characterized in that: The horizontal support (13) is arranged on one side of the platform (10), the sliding support (8) is slidably connected to the horizontal support (13) in the horizontal direction, the rotating drum (7) is rotatably arranged on the sliding support (8), the sliding plate (22) is slidably connected to the rotating drum (7) in the vertical direction, the horizontal telescopic assembly (5) is arranged on the sliding plate (22) and used for driving the adsorption assembly (3) and the turnover assembly (4) to move in the horizontal direction, the turnover assembly (4) drives the adsorption assembly (3) to rotate and turn over in the circumferential direction, the support table (1) and a plurality of supports (14) are arranged on the other side of the platform (10), the first bearing disc (2) for placing the chip (25) is arranged on the support table (1), the adsorption assembly (3) is used for adsorbing one surface of the chip (25), the second bearing disc (15) for placing the chip (25) is arranged on each support (14), the adsorption assembly (3) moves the chip (25) to the second bearing disc (15), the electric cylinder (18) is arranged on each support (14), the output end of the electric cylinder (18) is fixedly connected with the fixed disc (19), the first guide rod (17) is arranged on the top of the fixed disc (19) and slidably connected with the support (14) in the vertical direction, the second fixed plate (16) is arranged on the bottom of the fixed disc (19), a plurality of electric adsorption discs (28) for adsorbing the other surface of the chip (25) are arranged on the second fixed plate (16), the second fixed plate (16) is located directly above the second bearing disc (15), the electric cylinder (18) drives the chip (25) adsorbed on the second fixed plate (16) to move, and the turned-over chip (25) is placed on the second bearing disc (15).

2. The automatic turning chip adsorbing and transferring device according to claim 1, characterized in that: The sixth motor (9) is arranged on the horizontal support (13), the output shaft of the sixth motor (9) is fixedly connected with one end of the first screw rod (12), the first screw rod (12) is rotatably connected with the horizontal support (13), the first screw rod (12) is threadedly connected with the sliding support (8), and the horizontal guide rail (11) is arranged on the horizontal support (13) and slidably connected with the sliding support (8) in the horizontal direction.

3. The automatic turning chip adsorbing and transferring device according to claim 1, characterized in that: The seventh motor (23) is arranged in the sliding support (8), the output shaft of the seventh motor (23) is fixedly connected with the second gear shaft (29), the second gear shaft (29) is rotatably connected with the bottom of the rotating drum (7), the third gear (24) is arranged on the second gear shaft (29), the third gear shaft (30) is fixedly arranged on the bottom of the rotating drum (7), and the fourth gear (31) is arranged on the third gear shaft (30) and meshingly connected with the third gear (24) for transmission.

4. The automatic turning chip adsorbing and transferring device according to claim 1, characterized in that: The fifth motor (6) is arranged on the rotating drum (7), the second screw rod (20) is rotatably arranged in the rotating drum (7), the output shaft of the fifth motor (6) is fixedly connected with one end of the second screw rod (20), the second screw rod (20) is threadedly connected with the sliding plate (22), and a plurality of second guide rods (21) are arranged in the rotating drum (7) and slidably connected with the sliding plate (22) in the vertical direction.

5. The automatic face-up wafer pick-and-place apparatus of claim 1, wherein, The horizontal telescopic assembly (5) is characterized in that the bottom of the sliding plate (22) is provided with a fourth motor (504), the output shaft of the fourth motor (504) is fixedly connected with one end of the bottom of a second connecting plate (505), the other end of the bottom of the second connecting plate (505) is provided with a third motor (503), the output shaft of the third motor (503) is fixedly connected with one end of a third connecting plate (506), the other end of the bottom of the third connecting plate (506) is provided with a second motor (501), the output shaft of the second motor (501) is fixedly connected with the bottom of a first connecting plate (502), and the first connecting plate (502) is provided with a turnover assembly (4) and a suction assembly (3).

6. The automatic turning chip adsorbing and transferring device according to claim 5, wherein, The turnover assembly (4) is characterized in that the first connecting plate (502) is provided with a fixed frame (402), the fixed frame (402) is provided with a first motor (403), the output shaft of the first motor (403) is fixedly connected with a first gear shaft (405), the first gear shaft (405) is provided with a first gear (404), the fixed frame (402) is rotatably provided with a second gear (406) in meshing transmission with the first gear (404), the second gear (406) is located below the first gear (404), the second gear (406) is fixedly connected with a rotating disc (401), the rotating disc (401) is rotatably connected with the fixed frame (402), and the rotating disc (401) is fixedly connected with the suction assembly (3).

7. The automatic face-up chip pick-and-place device according to claim 5 or 6, wherein, The suction assembly (3) is characterized in that the first fixed plate (301) is provided with a plurality of fixed blocks (309) on both sides, each fixed block (309) is provided with a sliding hole (304) on both sides, each fixed block (309) is slidably connected with a connecting rod (307) in the vertical direction, each connecting rod (307) is provided with a sliding rod (303) slidably connected with the sliding hole (304) in the vertical direction, each connecting rod (307) is fixedly connected with the shell (302) through a spring (305), the shell (302) is located below the first fixed plate (301), the shell (302) is provided with a plurality of first suction discs (308) for suctioning one surface of the chip (25), the shell (302) is provided with an internal space in communication with the inlet end of the plurality of first suction discs (308), the shell (302) is provided with an air extraction hole (306) in communication with the internal space, and the outlet end of the vacuum generator is in communication with the air extraction hole (306).

8. The automatic turning chip adsorbing and transferring device according to claim 1, characterized in that: The sliding plate (22) is provided with a laser emitter (26), and the fixed frame (402) is provided with a laser receiver (27).

Images