Negative electrode and negative electrode structure

Abstract

The present disclosure describes negative electrodes comprising a plating layer and a lithium plating layer, and optionally a support layer, a capping layer, and a binding layer.

Description

[0001] Priority

[0002] This patent application claims the benefit of U.S. Provisional Patent Application No. 63 / 606,318, filed December 5, 2023, entitled “ANODES AND ANODE STRUCTURES,” which is incorporated by reference herein in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates generally to batteries, and more particularly to anodes and anode structures for lithium-ion batteries. BACKGROUND

[0004] A commonly used rechargeable battery type is a lithium battery, such as a lithium-ion or lithium-polymer battery. As battery-powered devices become smaller and more powerful, the batteries that power these devices need to store more energy in a smaller volume.

[0005] There is a need for a dense, uniform thin lithium film. Additionally, there is a need to create a uniform current distribution in a lithium battery cell. A stacked design with conventional thick films or foils does not provide support for a uniform lithium film, as the surface of these lithium films is rough and can crack, dissolve, and expose Li. SUMMARY

[0006] In a first aspect, the present disclosure relates to an anode comprising: a plating layer; and a lithium layer plated uniformly on the plating layer.

[0007] In a second aspect, the anode can comprise a support layer disposed on the plating layer on an opposite side of the lithium layer. The anode can further comprise a capping layer disposed on the support layer on an opposite side of the plating layer. Still further, the anode can comprise a bonding layer disposed on the capping layer on an opposite side of the support layer.

[0008] In a third aspect, the support layer and the capping layer are optional; the plating layer can be directly attached to the bonding layer.

[0009] In a fourth aspect, the present disclosure relates to a battery stack comprising a first battery cell stacked onto a second battery cell. A positive electrode of the first battery cell is connected via the bonding layer of the second battery cell. The first battery cell and the second battery cell can be the same or different.

[0010] In a fifth aspect, the anode can be covered by a Li layer that acts as a capping layer. The lithium layer can be disposed on a surface of the plating layer, for example, by sputtering, e-beam deposition, or chemical vapor deposition, or hot pressing. BRIEF DESCRIPTION OF DRAWINGS

[0011] The present disclosure will be readily understood by persons skilled in the art with the foregoing Description and drawings in conjunction, in which:

[0012] Figure 1 is a top view of a battery cell according to an illustrative embodiment;

[0013] Figure 2 is a side view of a set of layers of a battery cell according to an illustrative embodiment;

[0014] Figure 3 depicts an example of a negative electrode stack according to one illustrative embodiment;

[0015] Figure 4 depicts an example of another negative electrode stack according to one illustrative embodiment;

[0016] Figure 5 depicts an example of a negative electrode stack according to one illustrative embodiment;

[0017] Figure 6 depicts an example of a negative electrode stack according to one illustrative embodiment; and

[0018] Figure 7 depicts a battery stack formed from a plurality of batteries according to one illustrative embodiment. DETAILED DESCRIPTION

[0019] The following description is given for the purpose of allowing any person skilled in the art to make and use the embodiments and is provided in the context of a particular application. Various modifications to the embodiments disclosed will be readily apparent to those skilled in the art and the generic principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure. It is to be understood that the following description is not intended to limit the embodiments to one preferred embodiment. Rather, it is intended to cover alternatives, modifications, and equivalents, which can be included within the spirit and scope of the embodiments as defined by the claims appended hereto. Accordingly, the present disclosure is not limited to the embodiments shown but is to be accorded the widest scope consistent with the principles and characteristics disclosed herein.

[0020] As used herein, all compositions for positive electrode active materials represent the composition of the material as prepared (i.e., the “as- made” material). The materials of these compositions have not been exposed to additional processes, such as delithiation and lithiation, respectively, during charging and discharging of lithium ion batteries.

[0021] Figure 1A top view of a battery cell 100 is presented in accordance with an embodiment. The battery cell 100 can correspond to a lithium-ion or lithium-polymer battery cell used to power a device for use in consumer, medical, aerospace, defense, and / or transportation applications. The battery cell 100 includes a stack 102 that contains a plurality of layers including a positive electrode, a separator, and a negative electrode. The stack 102 also includes a separator disposed between the positive electrode and the negative electrode. The positive electrode, negative electrode, and separator layers can be held flat in a planar configuration.

[0022] The battery cell can be encased in, for example, a flexible pouch or a hard case. Returning to Figure 1 During assembly of the battery cell 100, the stack 102 can be encased in a pouch. The pouch can be flexible or rigid. The stack 102 can be in a planar configuration, although other configurations are possible. If flexible, the pouch can be formed by folding a flexible sheet along fold lines 112. For example, the flexible sheet can be made of aluminum with a polymer film, such as polypropylene. After folding the flexible sheet, the flexible sheet can be sealed, for example, by applying heat along the side seals 110 and along the platform seal 108. In some variations, the thickness of the flexible pouch can be less than 120 microns to improve the packing efficiency of the battery cell 100, the density of the battery cell 100, or both.

[0023] The stack 102 also includes a set of conductive tabs 106 coupled to the positive and negative electrodes. The conductive tabs 106 can extend through the seals in the pouch (e.g., the seals formed using the seal band 104) to provide terminals for the battery cell 100. The conductive tabs 106 can then be used to electrically couple the battery cell 100 with one or more other battery cells to form a battery pack.

[0024] The batteries can be combined in a battery pack in any configuration. For example, the battery pack can couple battery cells in series, in parallel, or in a series-parallel configuration to form. The cells so coupled can be encased in a hard case to complete the battery pack, or can be embedded within the housing of a portable electronic device, such as a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a digital camera, and / or a portable media player.

[0025] Figure 2 A side view of a set of layers of a first battery cell (e.g., Figure 1 the battery cell 100) in accordance with the disclosed embodiments is presented. The set of layers can include a positive current collector 202, a positive active material 204, a separator 206, a negative active material 208, and a negative current collector 210. The positive current collector 202 and the positive active material 204 form a positive electrode of the battery cell, and the negative current collector 210 and the negative active material 208 form a negative electrode of the battery cell. To create the battery cell, the set of layers can be stacked in a planar configuration.

[0026] As described above, the positive current collector 202 can be an aluminum foil, the positive active material 204 can be a lithium compound, the negative current collector 210 can be a copper foil, and the separator 206 can include a conductive polymer electrolyte.

[0027] It should be appreciated that the positive active materials described herein can be used in conjunction with any battery cell or component thereof known in the art. For example, the layers can be stacked and / or used to form other types of battery cell structures, such as dual cell structures. All such battery cell structures are known in the art.

[0028] The present disclosure relates to a negative electrode comprising a plating layer having a lithium layer plated thereon. The negative electrode can include three optional layers: a support layer, a capping layer, and a bonding layer. Depending on the nature of the plating layer, the optional layers are configured to impart additional properties to the negative electrode.

[0029] The metal electrode stack allows plating, mechanical support, and encapsulation of a lithium film that can be used in a rechargeable electrochemical device. Several properties can give advantages over other negative electrodes. Primarily, the negative electrode can be used in a battery cell without a liquid electrolyte. Additionally, the negative electrode allows the battery cell to be configured such that the battery cell can be stacked to allow current flow in the z-direction. The negative electrode is mechanically robust and compliant to the plated lithium film. The negative electrode is chemically and mechanically compliant to the ionically conductive separator. In some variations, the negative electrode can have a low surface or interface roughness to promote uniform current density. The battery cell also provides the ability for Li ions from a Li ion source to reversibly traverse the metal stack at least once in both z-directions.

[0030] Figure 3 An example of a negative electrode stack 300 is depicted. The negative electrode stack 300 includes a plating layer 302 having a lithium layer 304 plated thereon. A support layer 306 is disposed on opposite sides of the plating layer 302. A capping layer 308 is disposed on the support layer 306. A bonding layer 310 is disposed on the capping layer 308. Current flows in the z-direction through an ionically conductive layer 312 to and from a Li ion source 314. Since current flows in the direction indicated in the z-direction during discharge, the battery cells will be stacked on one another via the bonding layer 310.

[0031] Likewise, the ionically conductive layer can be any such layer known in the art. In particular, the ionically conductive layer can be a liquid, solid, semi-solid, or composite electrolyte material / species. Any conventional electrolyte can be contemplated in the present invention.

[0032] Plating layer

[0033] The plating layer is a lithium-accepting layer in contact with the Li-ion conductive layer. The plating layer is electrically conductive.

[0034] In some variations, the plating layer can be selected from one of the materials including Li, Cu, Ti, Zr, Al, Nb, V, Mo, Cr, La, Ca, Zn, Sb, Ta, Hf, Mg, TiAl, TiAlN, C, and Ni. The plating layer can also include an alloy of one or more of these elements. Any of the described materials can be selected.

[0035] In some examples, the plating layer includes Cu. Cu can include the capping layer described herein since Li diffuses through Cu when plated. In some examples, Cu does not include a capping layer. Cu layer can also include a support layer due to its low yield strength relative to TiAl.

[0036] The plating layer is disposed on the ionically conductive layer, where Li is plated onto the interface. In some examples, the plating layer is disposed on the ionically conductive layer, Li is plated onto the interface, after which the plating layer is removed from the ionically conductive layer.

[0037] In some examples, the plating layer includes Ni. Since Li diffuses through Cu when plated, the anode includes a capping layer when the plating layer is formed of Ni.

[0038] In some examples, the plating layer includes Ti. Since Li diffuses through Cu when plated, the anode includes a capping layer when the plating layer is formed of Ti.

[0039] In some variations, the plating layer has an average thickness of at least 10 nm. In some variations, the plating layer has an average thickness of at least 50 nm. In some variations, the plating layer has an average thickness of at least 100 nm. In some variations, the plating layer has an average thickness of at least 500 nm. In some variations, the plating layer has an average thickness of at least 1 pm. In some variations, the plating layer has an average thickness of at least 5 pm. In some variations, the plating layer has an average thickness of at least 10 pm. In some variations, the plating layer has an average thickness of at least 15 pm.

[0040] In some variations, the plating layer has an average thickness of less than or equal to 20 pm. In some variations, the plating layer has an average thickness of less than or equal to 15 pm. In some variations, the plating layer has an average thickness of less than or equal to 10 pm. In some variations, the plating layer has an average thickness of less than or equal to 5 pm. In some variations, the plating layer has an average thickness of less than or equal to 1 pm. In some variations, the plating layer has an average thickness of less than or equal to 500 nm. In some variations, the plating layer has an average thickness of less than or equal to 100 nm. In some variations, the plating layer has an average thickness of less than or equal to 50 nm.

[0041] The lower limit and the upper limit can be combined in any combination described herein.

[0042] Lithium layer

[0043] Lithium is plated on the plating layer. The lithium can be uniformly plated. By "uniformly plated" is meant that the lithium layer on the surface of the plating layer has a lithium thickness that varies by within 20% across the lithium layer. In some variations, the lithium layer on the surface of the plating layer has a lithium thickness that varies by within 10% across the lithium layer.

[0044] The lithium layer can be disposed on the plating layer by any method known in the art. In some non-limiting methods, the lithium can be sputtered onto the plating layer, the lithium can be added to the plating layer by electron beam deposition or chemical vapor deposition, or the lithium can be hot pressed onto the ionically conductive layer. The lithium layer can have a smooth uniform interface with the ionically conductive separator.

[0045] In some variations, the lithium layer can be fabricated as the plating layer. In such instances, the lithium plating layer includes a support layer or a capping layer. If the lithium layer only acts as a capping layer, it includes a plating layer and a support layer having different material compositions.

[0046] In some variations, the lithium layer includes a thickness having a lower limit, a thickness having an upper limit, or a combination of both.

[0047] In some variations, the lithium layer has an average thickness of at least 10 nm. In some variations, the lithium layer has an average thickness of at least 50 nm. In some variations, the lithium layer has an average thickness of at least 100 nm. In some variations, the lithium layer has an average thickness of at least 500 nm. In some variations, the lithium layer has an average thickness of at least 1 pm. In some variations, the lithium layer has an average thickness of at least 5 pm. In some variations, the lithium layer has an average thickness of at least 10 pm. In some variations, the lithium layer has an average thickness of at least 20 pm. In some variations, the lithium layer has an average thickness of at least 30 pm. In some variations, the lithium layer has an average thickness of at least 40 pm.

[0048] In some variations, the lithium layer has an average thickness of less than or equal to 50 pm. In some variations, the lithium layer has an average thickness of less than or equal to 40 pm. In some variations, the lithium layer has an average thickness of less than or equal to 30 pm. In some variations, the lithium layer has an average thickness of less than or equal to 10 pm. In some variations, the lithium layer has an average thickness of less than or equal to 5 pm. In some variations, the lithium layer has an average thickness of less than or equal to 1 pm. In some variations, the lithium layer has an average thickness of less than or equal to 500 nm. In some variations, the lithium layer has an average thickness of less than or equal to 100 nm. In some variations, the lithium layer has an average thickness of less than or equal to 50 nm.

[0049] The lower limit and the upper limit can be combined in any combination described herein.

[0050] Support layer

[0051] An optional support layer is disposed adjacent to the plating layer. The support layer provides mechanical support and rigidity to the underlying plating layer. The support layer is electrically conductive, allowing current to flow in the z-direction.

[0052] Mechanical support can be created by increased thickness. The use of a thinner support layer increases the energy density.

[0053] In various aspects, the support layer is selected from Cu, Ti, Zr, Al, Nb, V, Mo, Cr, La, Ca, Zn, Sb, Ta, Hf, Mg, TiAl, and TiAlN. Any of the mentioned materials can be selected. The support layer can also include an alloy of one or more of these elements.

[0054] In some variations, the support layer is formed of Nb. In some variations, the support layer is formed of V. In some variations, the support layer is formed of Mo.

[0055] In some variations, the support layer has an average thickness of at least 10 nm. In some variations, the support layer has an average thickness of at least 50 nm. In some variations, the support layer has an average thickness of at least 100 nm. In some variations, the support layer has an average thickness of at least 500 nm. In some variations, the support layer has an average thickness of at least 1 pm. In some variations, the support layer has an average thickness of at least 100 pm. In some variations, the support layer has an average thickness of at least 500 pm. In some variations, the support layer has an average thickness of at least 100 pm. In some variations, the support layer has an average thickness of at least 1 mm. In some variations, the support layer has an average thickness of at least 1.5 mm.

[0056] In some variations, the support layer has an average thickness of less than or equal to 2 mm. In some variations, the support layer has an average thickness of less than or equal to 1.5 mm. In some variations, the support layer has an average thickness of less than or equal to 1 mm. In some variations, the support layer has an average thickness of less than or equal to 10 pm. In some variations, the support layer has an average thickness of less than or equal to 5 pm. In some variations, the support layer has an average thickness of less than or equal to 1 pm. In some variations, the support layer has an average thickness of less than or equal to 500 nm. In some variations, the support layer has an average thickness of less than or equal to 100 nm. In some variations, the support layer has an average thickness of less than or equal to 50 nm.

[0057] The lower and upper limits of the support layer can be combined in any combination described herein.

[0058] Support layer optional

[0059] In variations where the plating layer has a sufficiently high yield strength to serve as a layer for both plating and support, the separate support layer is optional, or need not be included. Figure 4 An example of another anode stack 400 is depicted. The anode stack 400 includes a plating layer 402 on which a lithium layer 404 is plated. Opposite sides of the plating layer 402 are provided with a capping layer 406. A bonding layer 408 is provided on the capping layer 406. As with other anodes described herein, current flows in the z-direction through an ionically conductive layer 410 to and from a source of lithium ions 412, allowing the battery cells to be stacked on one another.

[0060] In certain anode variations, such as when the plating layer has sufficient mechanical yield strength (e.g., TiAl) to support the lithium layer, a support layer can not be included. Figure 4 In examples where the plating layer does not have sufficient mechanical support (e.g., Ni or Cu), a support layer can be included to provide mechanical support. In some variations, the tensile yield strength is at least 20 MPa. In some variations, the tensile yield strength is at least 25 MPa. In some variations, the tensile yield strength is at least 30 MPa. In some variations, the tensile yield strength is at least 35 MPa. In some variations, the tensile yield strength is at least 40 MPa.

[0061] In some specific variations, the plating layer is TiAl. When TiAl is used, additional support and capping layers are optional, as TiAl can perform the functions of plating and support. In one example, the plating layer comprises a TiAl alloy. TiAl is non-diffusive, and its yield strength is 20 times that of Cu alone. Thus, TiAl can be used without a separate support layer.

[0062] Capping layer

[0063] An optional capping layer can be provided on the support layer. The capping layer can provide chemical resistance to Li ions migrating through the stack and to Li reacting with the bonding layer or current collector. In examples where the support layer is a material that allows Li migration, a capping layer can be used. The capping layer limits or prevents Li migration beyond the capping layer. As with other layers, the capping layer is electrically conductive, allowing current to flow in the z-direction.

[0064] In various aspects, the capping layer is a material that is chemically inert to Li. For example, the capping layer is selected from Ni, Ti, Zr, Nb, V, Mo, Cr, La, TiAl, TiAlN, and Li. Any of the mentioned materials can be selected. In some particular examples, the capping layer is formed of TiAlN. The capping layer can also include an alloy of one or more of these elements.

[0065] If the capping layer uses Li, it can also act as the bonding layer. Li can be intentionally reacted with the bonding layer without affecting the amount of Li plated on the plating layer (or Li as the plating layer) and the uniformity of the (plated) lithium layer

[0066] In some variations, the capping layer has an average thickness of at least 10 nm. In some variations, the capping layer has an average thickness of at least 50 nm. In some variations, the capping layer has an average thickness of at least 100 nm. In some variations, the capping layer has an average thickness of at least 500 nm. In some variations, the capping layer has an average thickness of at least 1 pm. In some variations, the capping layer has an average thickness of at least 5 pm. In some variations, the capping layer has an average thickness of at least 10 pm.

[0067] In some variations, the capping layer has an average thickness of less than or equal to 20 pm. In some variations, the capping layer has an average thickness of less than or equal to 10 pm. In some variations, the capping layer has an average thickness of less than or equal to 5 pm. In some variations, the capping layer has an average thickness of less than or equal to 1 pm. In some variations, the capping layer has an average thickness of less than or equal to 500 nm. In some variations, the capping layer has an average thickness of less than or equal to 100 nm. In some variations, the capping layer has an average thickness of less than or equal to 50 nm.

[0068] The lower limit and the upper limit can be combined in any combination described herein.

[0069] Capping layer optional

[0070] In some examples, the support layer and the capping layer are not required, such as when the plating layer has sufficient strength to not include a support layer and the plating layer and support layer do not allow lithium to diffuse through the plating layer. The plating layer can be directly attached to the bonding layer. Figure 5 An example of a negative electrode stack that does not use a support layer or a capping layer is described. The negative electrode stack 500 includes a plating layer 502 on which a lithium layer 504 is plated. A bonding layer 506 is disposed on the plating layer 502. As with the other negative electrodes described herein, current flows in the z-direction through an ionically conductive layer 508 to and from a source of lithium ions 510, allowing the battery cells to be stacked on one another.

[0071] Bonding layer

[0072] In some variations, the negative electrode optionally can include a bonding layer. The bonding layer can bond the battery to an adjacent battery cell. The electrode stack can be bonded to a current collector, a secondary battery, or other component.

[0073] The bonding layer is an electrically conductive material. In some variations, the material has a melting point less than 400 °C. Examples of such materials include In, Sn, and alloys containing In / Sn, Ga / Sn, Ga / In, Ga / Zn, Bi / Sn, Bi / In, Sn / Ag / Cu, or Bi / Sn / In. Any of these materials can be selected. In some variations, the alloy includes Sn / In. The term split / apart refers to an alloy that is a combination of those elements (e.g., Sn / In refers to an alloy of Sn and In). In other variations, the bonding layer can be an electrically conductive polymer, an electrically conductive adhesive, or an electrically conductive paste (e.g., a sintered copper paste).

[0074] In some variations, the bonding layer can have a lower limit, an upper limit, or both, on the thickness. In some variations, the thickness is at least 10 nm. The bonding layer can be from 10 nm to 20 pm.

[0075] In some variations, the bonding layer has an average thickness of at least 10 nm. In some variations, the bonding layer has an average thickness of at least 50 nm. In some variations, the bonding layer has an average thickness of at least 100 nm. In some variations, the bonding layer has an average thickness of at least 500 nm. In some variations, the bonding layer has an average thickness of at least 1 pm. In some variations, the bonding layer has an average thickness of at least 5 pm. In some variations, the bonding layer has an average thickness of at least 10 pm.

[0076] In some variations, the bonding layer has an average thickness of less than or equal to 20 pm. In some variations, the bonding layer has an average thickness of less than or equal to 10 pm. In some variations, the bonding layer has an average thickness of less than or equal to 5 pm. In some variations, the bonding layer has an average thickness of less than or equal to 1 pm. In some variations, the bonding layer has an average thickness of less than or equal to 500 nm. In some variations, the bonding layer has an average thickness of less than or equal to 100 nm. In some variations, the bonding layer has an average thickness of less than or equal to 50 nm.

[0077] Bonding layer optional

[0078] In some examples, the bonding layer is not included, such as when the battery cell is not constructed into a battery stack. Figure 6One such example of a negative electrode stack using only plating layers is described. The negative electrode stack 600 includes a plating layer 602 on which a lithium layer 604 is plated. As with other negative electrodes described herein, current flows in the z-direction through an ionically conductive layer 606 to and from a source of lithium ions 608, allowing the battery cells to be stacked on top of one another.

[0079] Battery stack

[0080] Multiple battery cells can be constructed into a battery stack. Figure 7 A battery stack 700 including battery cells 702, 704, and 706 is depicted. Since the battery cells are designed to allow current to flow in the z-direction without the use of tabs, the battery stack does not require any additional components to allow current to flow outside of the end-to-end geometry of the battery stack.

[0081] The negative electrodes described herein can be valuable in battery cells, including those used in electronic devices and consumer electronics. Electronic devices herein can refer to any electronic device known in the art. For example, the electronic device can be a telephone, such as a mobile phone and a landline phone, or any communication device, such as a smart phone (including, for example, ), and an email sending / receiving device. The electronic device can also be an entertainment device, including a portable DVD player, a regular DVD player, a Blu-ray player, a video game controller, a music player such as a portable music player (e.g., ). The electronic device can be part of a display, such as a digital display, a television monitor, an e-book reader, a portable web browser (e.g., ), a watch (e.g., Apple Watch), or a computer monitor. The electronic device can also be part of a device that provides control, such as control of the streaming of images, video, sound (e.g., ), or it can be a remote control for an electronic device. In addition, the electronic device can be part of a computer or its accessories, such as a hard drive tower enclosure or protective case, a laptop computer enclosure, a laptop computer keyboard, a laptop computer trackpad, a desktop computer keyboard, a mouse, and a speaker. The negative electrode cells, lithium metal batteries, and battery packs can also be applied to devices such as watches or clocks.

[0082] For purposes of explanation, specific nomenclature is used in the foregoing description to provide a thorough understanding of the embodiments. However, it will be apparent to one skilled in the art that specific details need not be employed to practice the embodiments. Accordingly, the foregoing description is intended by way of example only. They are not intended as limitations on the present embodiments. It will be apparent to one skilled in the art that many modifications and variations can be possible in view of the above teachings.

Claims

1. A negative electrode comprising: a plating layer; and a lithium layer plating uniformly on the plating layer.

2. The negative electrode according to claim 1, wherein the plating layer is formed of a material selected from Li, Cu, Ti, Zr, Al, Nb, V, Mo, Cr, La, Ca, Zn, Sb, Ta, Hf, Mg, TiAl, TiAlN, Ni, C, and an alloy of any of the foregoing.

3. The negative electrode according to any preceding claim, wherein the plating layer is formed of TiAl.

4. The negative electrode according to claim 1, consisting of: the plating layer, the plating layer being formed of TiAl; the lithium layer, the lithium layer being disposed on the plating layer; and a bonding layer, the bonding layer being disposed on the plating layer on opposite sides of the lithium layer.

5. The negative electrode according to any preceding claim, wherein the plating layer has an average thickness of 10 nm to 20 pm.

6. The negative electrode according to any preceding claim, wherein lithium layer has an average thickness of 10 nm to 50 pm.

7. The negative electrode according to any preceding claim, comprising a support layer, the support layer being disposed on the plating layer on the opposite sides of the lithium layer.

8. The negative electrode according to claim 7, wherein the support layer is formed of a material selected from Li, Cu, Ti, Zr, Al, Nb, V, Mo, Cr, La, Ca, Zn, Sb, Ta, Hf, Mg, TiAl, TiAlN, Ni, and an alloy of any of the foregoing.

9. The negative electrode according to one of claims 7 or 8, wherein the support layer is formed of a material selected from Nb, V, and Mo.

10. The negative electrode according to one of claims 7 to 9, wherein the plating layer is formed of Ni.

11. The negative electrode according to any one of claims 7 to 10, wherein the support layer has an average thickness of 10 nm to 2 mm.

12. The negative electrode according to one of claims 7 to 11, comprising a capping layer, the capping layer being disposed on the support layer on opposite sides of the plating layer.

13. The negative electrode according to claim 12, wherein the capping layer is formed of a material selected from Ni, Ti, Zr, Nb, V, Mo, Cr, La, TiAl, TiAlN, Li, and an alloy of any of the foregoing.

14. The negative electrode according to one of claims 12 or 13, wherein the capping layer is formed of TiAlN.

15. The negative electrode according to one of claims 12 to 14, wherein the capping layer has an average thickness of 10 nm to 20 pm.

16. The negative electrode according to one of claims 12 to 15, comprising a bonding layer, the bonding layer being disposed on the capping layer on opposite sides of the support layer.

17. The negative electrode according to claim 16, wherein the bonding layer is formed of a material selected from the group consisting of In, Sn, In / Sn, Ga / Sn, Ga / In, Ga / Zn, Bi / Sn, Bi / In, Sn / Ag / Cu, and Bi / Sn / In.

18. The negative electrode according to one of claims 16 or 17, wherein the bonding layer is formed of In / Sn.

19. The negative electrode according to one of claims 16 to 18, wherein the bonding layer has an average thickness of 10 nm to 20 pm.

20. A negative electrode comprising: a plating layer comprising lithium; a support layer disposed on a first surface of the plating layer; and a capping layer disposed on the support layer opposite the lithium layer.

21. A battery cell comprising a negative electrode according to any one of claims 1 to 19; an ionically conductive layer on a side of the lithium layer opposite the plating layer; and a lithium source on a side of the ionically conductive layer opposite the lithium layer.

22. A battery stack comprising: a first battery cell according to claim 21; and a second battery cell according to claim 21, wherein the lithium source of the first battery cell is connected to the bonding layer of the second battery cell, and wherein the first battery cell and the second battery cell are the same or different.

23. A method of manufacturing a negative electrode according to any one of claims 1 to 19, the method comprising: disposing a lithium layer on a surface of a plating layer.

24. The method according to claim 23, wherein the lithium layer is disposed on the plating layer by sputtering, electron beam deposition, or chemical vapor deposition.

25. The method according to claim 23, wherein the lithium layer is disposed on an ionically conductive layer by hot pressing. ​ ​ ​

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