Electronic equipment shell for improving plastic molding shrinkage and preparation method thereof

Abstract

The invention discloses an electronic equipment shell for improving plastic molding shrinkage and a preparation method thereof. The electronic equipment shell comprises a plate body, a frame body, a first plastic structure and a second plastic structure, the frame bodies are convexly arranged on at least one edge surface of the peripheral edge surfaces of the surface of the plate body, and at least one frame body is arranged on each edge surface; the first plastic structure wraps two adjacent outer side surfaces of the frame body along the side edge direction of the plate body and extends to cover the surface of the corresponding edge of the plate body; and the second plastic structure is filled in an included angle area formed by the rest two surfaces of the frame body and the edge surface of the plate body, and is respectively attached to the corresponding surface of the frame body and the edge surface of the plate body. According to the invention, shrinkage deformation after plastic and plate molding can be reduced, the usage amount of the plastic material is reduced, the plate strength is improved, the plate density is optimized, and the sealing performance of the equipment shell is enhanced.

Description

Technical Field

[0001] This invention relates to an electronic device housing and its manufacturing method, specifically to an electronic device housing with improved plastic molding shrinkage and its manufacturing method. Background Technology

[0002] With economic development, consumers are using more and more electronic devices. Their demands for electronic devices are no longer limited to basic functions. They have higher requirements for appearance design, portability, and personalization, prompting manufacturers to continuously optimize casing design and adopt novel materials and processes to meet consumers' aesthetic and usage needs.

[0003] Currently, most electronic device casings in China utilize new materials such as magnesium alloys, carbon fiber, and ceramics. Magnesium alloys, with their low density and excellent heat dissipation, are commonly used in high-end laptops and mobile phones. Carbon fiber, with its high strength, low density, lightweight properties, and good electromagnetic shielding, meets the requirements of high-end electronic devices for both lightweight design and high performance. Ceramics, with their unique texture and excellent wear resistance, are emerging in some high-end mobile phones. In addition to traditional thermosetting resins such as epoxy resin and thermoplastic resins such as ABS, PC, and PA, high-performance engineering plastics such as PPS, LCP, and PEEK are increasingly being used, combined with reinforcing materials such as glass fiber, carbon fiber, and special fibers to manufacture electronic device casings.

[0004] To meet the protection and stability requirements of the precision components inside electronic devices, the housing structure is typically assembled from multiple fiber composite materials and plastic molded sheets. However, traditional multi-sheet assembled housings have some significant drawbacks. Because the gaps between the sheets are difficult to completely eliminate, the housing's sealing is poor, allowing dust and moisture to enter the device, affecting the normal operation of electronic components and shortening its lifespan. Furthermore, during use, vibrations, impacts, or high-load operation can cause relative vibrations between the sheets, leading to loosening of the housing structure and noise, severely impacting the user experience. Additionally, molding shrinkage exists between the plastic and fiber composite sheets, resulting in significant deformation, necessitating improvements to the shrinkage characteristics of the plastic.

[0005] Currently, methods such as adding sealing strips have been used to improve sealing performance, but these strips are prone to aging and falling off, making it impossible to guarantee a long-term seal. Furthermore, simple cushioning measures are insufficient to fundamentally address the issue of reducing vibration and noise between panels. Additionally, wrapping the edges of the panels with plastic material can increase the shell's seal and reduce vibration and noise between panels, but the shrinkage of the plastic material can easily cause panel deformation. Summary of the Invention

[0006] To effectively mitigate the impact of molding shrinkage of plastic materials on the housing of fiber composite materials, this invention provides an electronic device housing with improved plastic molding shrinkage and its preparation method. This invention can reduce shrinkage deformation of plastic and sheet materials after molding, reduce the amount of plastic material used, increase sheet strength, optimize sheet density, and enhance the sealing performance of the equipment housing.

[0007] The objective of this invention is achieved through the following technical solution:

[0008] An electronic device housing with improved plastic molding shrinkage includes a plate, a frame, a first plastic structure, and a second plastic structure;

[0009] The frame protrudes from at least one edge surface of the four edges of the plate surface, and at least one frame is provided on each edge surface;

[0010] The first plastic structure wraps around two adjacent outer surfaces of the frame along the side of the plate and extends to cover the surface of the corresponding edge of the plate;

[0011] The second plastic structure fills the angled area formed by the remaining two surfaces of the frame and the edge surface of the plate, and is respectively attached to the corresponding surface of the frame and the edge surface of the plate.

[0012] A method for preparing an electronic device housing with improved plastic molding shrinkage, comprising the following steps, using injection molding:

[0013] Step 1: Attach the frame to the edge of the board;

[0014] Step 2: Select the appropriate injection molding process based on the type of plastic material:

[0015] For plastics processed at high temperatures: The fixed sheet and frame are placed in a molding die with pre-set temperature parameters. The mold temperature for the sheet is 120–300℃ and the pressure is 20–100 MPa, while the mold temperature for the frame is 250–380℃ and the pressure is 20–100 MPa. Plastic material is injected into the die through the injection port, with a gradient heating process to form the first plastic structure and the second plastic structure, respectively. The plastic processed at high temperatures is plastic material A or a mixture of plastic material A and a reinforcing agent, wherein plastic material A is polytetrafluoroethylene (PTFE). One or more of the following are selected: (PTFE), polycarbonate (PC), polyamide (PA), PA46, polysulfone (PSU), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetheretherketone (PEEK), liquid crystal polymer (LCP), polyurethane (PU), polyetherimide (PEI), polyaryletherketone (PAEK), polyethersulfone (PES), polyvinylidene fluoride (PVDF), and polyphenylene sulfide (PPS); the reinforcement is one or more of the following: fiber, glass microspheres, and nanofillers; the addition amount is 10-40 wt.%.

[0016] For conventionally processed plastics: The fixed plate and frame are placed in a pre-set mold at a temperature of 90–150°C and 10–100 MPa, respectively, while the mold for the plate is at 150–280°C and 20–100 MPa. Plastic material is injected into the mold through the injection port, and the temperature is gradually increased to form the first plastic structure and the second plastic structure, respectively. The conventionally processed plastic is plastic material B or a mixture of plastic material B and a reinforcing agent. Plastic material B is one or more of polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyoxymethylene (POM), polyvinyl alcohol (PVA), polylactic acid resin (PLA), and polyester (PET). The reinforcing agent is one or more of fiber, glass microspheres, and nanofillers, with an addition amount of 10–40 wt.%.

[0017] The mold includes at least two injection ports, and the mold temperature is set to a gradient temperature.

[0018] Step 3: After the plastic structure cools and solidifies, demold to obtain the electronic device housing.

[0019] A molding method for an electronic device housing that improves shrinkage during plastic molding, comprising the following steps, using 3D printing technology to fabricate the electronic device housing:

[0020] Step 1: Attach the frame to the edge of the board;

[0021] Step 2: Place the fixed plate and frame into a fixture with pre-set temperature parameters. The fixture temperature for the plate is 50-360℃, and the fixture temperature for the frame is 60-150℃. Inject plastic material using 3D printing to form the first plastic structure and the second plastic structure respectively, controlling the printing accuracy to 0.01-0.1mm.

[0022] Step 3: After the first and second plastic structures have solidified, remove the clamping fixture to obtain the electronic device housing.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] 1. To address the shrinkage and deformation problem after molding plastic materials, a combination of engineering plastic materials with low shrinkage rate is used, and the structure of the plastic body is simplified, which helps to achieve integrated molding.

[0025] 2. By changing the shape of the frame and the plastic body, the impact of plastic shrinkage on the board is reduced, and the board is reinforced, vibration is reduced, and the strength of the board is enhanced, resulting in good dimensional stability of the shell, reduced scrap rate, and reduced production costs.

[0026] 3. The mold temperature is set to a gradient temperature to control the shrinkage rate of the plastic material. This results in more stable product quality, reduced subsequent finishing and rework processes, shorter production cycles, and increased production efficiency, thereby enhancing the company's production capacity and market competitiveness.

[0027] 4. Use low-shrinkage materials such as LCP and glass fiber to improve the shrinkage of plastic materials, reduce the risk of cracking and deformation of the casing due to stress, improve the strength and durability of the casing, and extend the service life of electronic devices. Attached Figure Description

[0028] Figure 1 A flowchart illustrating the molding process for electronic device housings designed to reduce shrinkage during molding;

[0029] Figure 2 A flowchart illustrating the molding process for electronic device housings designed to reduce shrinkage during molding;

[0030] Figure 3 This is a schematic diagram of the electronic device housing in Example 1;

[0031] Figure 4 This is a schematic diagram of the electronic device housing in Example 2;

[0032] Figure 5 This is a schematic diagram of the electronic device housing in Example 5;

[0033] Figure 6 This is a schematic diagram of the electronic device housing in Example 6;

[0034] In the figure, 1-plate, 2-frame, 3-first plastic structure, 4-second plastic structure, 5-lower surface, 6-overlapping part, 7-left surface, 8-right surface, 9-upper surface, 10-upper left intersection line, 11-lower left intersection line, 12-upper right intersection line, 13-first groove, 14-second groove, 15-third groove. Detailed Implementation

[0035] The technical solution of the present invention will be further described below with reference to the accompanying drawings, but it is not limited thereto. Any modifications or equivalent substitutions to the technical solution of the present invention that do not depart from the spirit and scope of the technical solution of the present invention should be covered within the protection scope of the present invention.

[0036] This invention provides an electronic device housing with improved molding shrinkage, the housing comprising a plate 1, a frame 2, a first plastic structure 3, and a second plastic structure 4;

[0037] The frame 2 protrudes from at least one edge surface of the four edges of the plate 1, and at least one frame 2 is provided on each edge surface;

[0038] The first plastic structure 3 wraps around two adjacent outer surfaces of the frame 2 along the side of the plate and extends to cover the surface of the corresponding edge of the plate 1;

[0039] The second plastic structure 4 fills the angled area formed by the remaining two surfaces of the frame 2 and the edge surface of the plate 1, and is respectively attached to the corresponding surface of the frame 2 and the edge surface of the plate 1;

[0040] The first plastic structure 3, the second plastic structure 4, together with the plate 1 and the frame 2, constitute the complete structure of the electronic device housing.

[0041] In this invention, the lower surface of the frame 2 is connected to the corresponding edge area of ​​the plate 1 to form an overlapping part H. The width H of the overlapping part satisfies 0.4K≤H≤K, where K is the width of the lower surface of the frame. A groove is provided at the intersection of the surfaces of the frame 2, and the groove is filled with a plastic structure to optimize the stress distribution during plastic molding. The groove is provided at at least one position: at the intersection of the upper surface of the frame with the surface away from the side of the plate, at the intersection of the surface near the side of the plate with the upper surface, at the intersection of the surface near the side of the plate with the lower surface, and at the intersection of the surface away from the side of the plate with the lower surface. The groove is a square or rectangular groove, and the number is unlimited.

[0042] In this invention, the upper surface of the frame is designed as a stepped structure, the stepped structure includes at least two stepped surfaces, and a step is formed between adjacent stepped surfaces; the first plastic structure wraps around the stepped surfaces of the stepped structure.

[0043] In this invention, the frame material can be one or more of the following: glass (microcrystalline glass, 3D glass, soda-lime glass, borosilicate glass, aluminosilicate glass, tempered glass), metal (aluminum-magnesium alloy, titanium alloy, stainless steel, magnesium-lithium alloy, magnesium alloy), composite material (one or more combinations of fiber composite material, metal matrix composite material, PC / ABS composite material, etc.), plastic material (ABS, PC, PPS, TPE, etc.), wood (bamboo fiber laminate, hemp fiber laminate), and ceramic material (silicon nitride-based composite material, alumina ceramic coating); the cross-section of the frame is cuboid, cube, irregular shape, etc.

[0044] In this invention, the material of the plate can be one of the following: glass (microcrystalline glass, 3D glass, soda-lime glass, borosilicate glass, aluminosilicate glass, tempered glass), metal (aluminum-magnesium alloy, titanium alloy, stainless steel, magnesium-lithium alloy, magnesium alloy), composite material (one or more of fiber composite material, metal matrix composite material, PC / ABS composite material, etc.), plastic material (ABS, PC, PPS, TPE, etc.), wood (bamboo fiber laminate, hemp fiber laminate), and ceramic material (silicon nitride-based composite material, alumina ceramic coating).

[0045] In this invention, the fiber composite material uses one or more of aramid fiber, glass fiber, basalt fiber, PBO fiber, carbon fiber, and Kevlar fiber as the reinforcing phase, and one or a mixture of thermosetting resin and thermoplastic resin as the matrix phase; the carbon fiber includes, but is not limited to, conventional carbon fibers (such as T300, T700, T800, etc.) and high-strength, high-modulus carbon fibers (T1000, T1100, M40J, M40x, M55J, M60J, etc.); the carbon fiber includes, but is not limited to, petroleum-based, bio-based, or mass balance carbon fibers and recycled carbon fibers; the thermosetting resin is one or more of epoxy resin, phenolic resin, unsaturated polyester, vinyl resin, cyanate ester resin, polyimide resin, and phthalonitrile resin; the thermoplastic resin includes one or more of polyolefins, polyamides, polyesters, polycarbonates, polyphenylene sulfide, polysulfones, polyetheramides, and polyurethanes.

[0046] In this invention, the fiber composite material includes, but is not limited to, solid sheets or sandwich sheets. In the sandwich sheet, the material of the sandwich layer is one or two of thermoplastic foam, thermosetting foam, thermoplastic resin, carbon felt, and felt; the density of the thermoplastic foam is 0.02–1.5 g / cm³. 3 The density of thermosetting foam materials is 0.2–1.5 g / cm³. 3The thermoplastic foaming material is one or more of the following: polystyrene, polyethylene, polypropylene, polyvinyl chloride, ethylene-vinyl acetate copolymer, thermoplastic polyurethane elastomer, thermoplastic elastomer, thermoplastic polyester elastomer, polycarbonate, ethylene-acrylate copolymer, polyamide-based thermoplastic elastomer foam, polylactic acid, thermoplastic polymethacrylimide, thermoplastic polyimide, poly4-methyl-1-pentene, ethylene-vinyl alcohol copolymer, polyamide, polyhydroxyalkanoates, polyetheretherketone, polytetrafluoroethylene, polyphenylene sulfide, polyoxymethylene, and thermoplastic epoxy resin; the thermosetting foaming material is thermosetting polyurethane. Phenolic resin, epoxy resin, urea-formaldehyde resin, melamine-formaldehyde resin, organosilicon, chloroprene rubber, nitrile rubber, silicone rubber, butyl rubber, fluororubber, phenolic-nitrile rubber, epoxy-nitrile rubber, thermosetting polymethacrylamide, cyanate ester, thermosetting polyimide, vinyl ester resin, furan resin, boron phenolic resin, magnesium oxysulfate foaming material, siliborazoline, polyurea, polybenzimidazole, bismaleimide, furan-formaldehyde, melamine-urea-formaldehyde resin, epoxy-phenolic resin, nitrile-polyvinyl chloride, chlorosulfonated polyethylene, polysulfide rubber, and one or more combinations thereof; thermoplastic resin materials are polyolefin resins and polyester resins. The resin is one or more of the following: resin, polyamide resin, polystyrene resin, polycarbonate resin, polyether resin, polyimide resin, polyphenylene sulfide resin, polysulfone resin, polyetheramide resin, and thermoplastic polyurethane; the polyolefin resin is one or more of the following: polyethylene, low-density polyethylene, high-density polyethylene, linear low-density polyethylene, and polypropylene; the polyester resin is one or more of the following: polyethylene terephthalate and polybutylene terephthalate; the polyamide resin is one or more of the following: polyamide 6, polyamide 66, polyamide 11, and polyamide 12. The polystyrene resin is one or more of polystyrene, high-impact polystyrene, and acrylonitrile-butadiene-styrene copolymer; the polycarbonate resin is one or more of polycarbonate and aromatic polycarbonate; the polyether resin is one or more of polyetheretherketone, polyetherketoneketone, and polyethersulfone; the polyimide resin is one or more of polyimide and polyamide-imide; the polyphenylene sulfide resin is polyphenylene sulfide; the polysulfone resin is bisphenol A type polysulfone; the polyetherimide resin is polyetherimide; and the thermoplastic polyurethane resin is thermoplastic polyurethane.

[0047] In this invention, the materials of the first and second plastic structures are high-temperature plastic materials or conventional plastic materials. The high-temperature plastic material is plastic material A or a mixture of plastic material A and a reinforcing body. Plastic material A is one or more of the following: polytetrafluoroethylene (PTFE), polycarbonate (PC), polyamide (PA), PA46, polysulfone (PSU), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetheretherketone (PEEK), liquid crystal polymer (LCP), polyurethane (PU), polyetherimide (PEI), polyaryletherketone (PAEK), polyethersulfone (PES), polyvinylidene fluoride (PVDF), and polyphenylene sulfide (PPS). The reinforcing body is carbon fiber. The plastic material is selected from one or more of the following: glass fiber, glass microspheres, and nanofillers, with an addition amount of 10–40 wt.%. The conventional plastic material is plastic material B or a mixture of plastic material B and a reinforcing agent. The plastic material B is selected from one or more of the following: polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyoxymethylene (POM), polyvinyl alcohol (PVA), polylactic acid resin (PLA), and polyester (PET). The reinforcing agent is selected from one or more of the following: carbon fiber, glass fiber, glass microspheres, and nanofillers, with an addition amount of 10–40 wt.%.

[0048] In this invention, the first plastic structure and the second plastic structure are integrally molded.

[0049] A molding method for improving the molding shrinkage of an electronic device housing as described above, such as... Figure 1 As shown, the electronic device housing is manufactured using injection molding, specifically including the following steps:

[0050] Step 1: Attach the frame to the edge of the board;

[0051] Step 2: Select the appropriate injection molding process based on the type of plastic material:

[0052] For plastics processed at high temperatures: The fixed plate and frame are placed in a molding mold with pre-set temperature parameters. The mold temperature for the plate is 120-300℃ and the pressure is 20-100MPa, while the mold temperature for the frame is 250-380℃ and the pressure is 20-100MPa. Plastic material is injected into the mold through the injection port, and the temperature is gradually increased to form the first plastic structure and the second plastic structure, respectively.

[0053] For conventionally processed plastics: The fixed plate and frame are placed in a molding mold with a pre-set temperature. The mold temperature for the plate is 90-150℃ and the pressure is 10-100MPa, while the mold temperature for the frame is 150-280℃ and the pressure is 20-100MPa. Plastic material is injected into the mold through the injection port, and the temperature is gradually increased to form the first plastic structure and the second plastic structure, respectively.

[0054] Step 3: After the plastic structure cools and solidifies, demold to obtain the electronic device housing.

[0055] A molding method for improving the molding shrinkage of an electronic device housing as described above, such as... Figure 2 As shown, the electronic device housing is fabricated using 3D printing technology, which specifically includes the following steps:

[0056] Step 1: Attach the frame to the edge of the board;

[0057] Step 2: Place the fixed plate and frame into a fixture with pre-set temperature parameters. The fixture temperature for the plate is 50-360℃, and the fixture temperature for the frame is 60-150℃. Inject plastic material using 3D printing to form the first plastic structure and the second plastic structure respectively, controlling the printing accuracy to 0.01-0.1mm.

[0058] Step 3: After the first and second plastic structures have solidified, remove the clamping fixture to obtain the electronic device housing.

[0059] Example 1

[0060] This embodiment provides an electronic device housing that improves molding shrinkage, such as Figure 3As shown, the housing includes a plate 1, a frame 2, a first plastic structure 3, and a second plastic structure 4. The frame 2 is located at the upper left edge, upper right edge, and lower left edge of the plate 1. A flipping shaft is provided at the lower right edge. Taking the frame located at the upper left edge as an example, it includes a lower surface 5: the lower surface 5 is connected to the plate 1 by adhesive to form an overlapping part 6 with a width of H. The width of the lower surface 5 is K, where 0.4K≤H≤K; an upper surface 9: opposite to the lower surface 5; and a left surface 7: the upper surface 9. The first plastic structure 3 encloses the upper surface 9, left surface 7, lower surface 5, upper left intersection line 12, and lower left intersection line 11, and connects to the left edge of the plate. The second plastic structure 4 fills the angle between the right surface 8 of the frame and the upper surface of the plate. When the frame is located on other edges of the plate, the first plastic structure encloses two adjacent surfaces in the corresponding edge direction and extends to the corresponding edge of the plate. The second plastic structure fills the angle formed between the two surfaces of the frame away from the side of the plate and the plate.

[0061] Example 2:

[0062] like Figure 2 As shown, this embodiment differs from Embodiment 1 in that a first groove 13 is provided at the upper right intersection line 12, a third groove 15 is provided at the upper left intersection line 10, and a second groove 14 is provided at the lower left intersection line 11. The first groove 13, the second groove 14, and the third groove 15 are square or rectangular grooves; the first plastic structure 3 wraps around the upper surface 9, the left surface 7, the lower surface 5, the upper left intersection line 10, and the lower left intersection line 11, respectively filling the first groove 13, the second groove 14, and the third groove 15, and connecting with the left edge of the plate; the second plastic structure 4 fills the included angle between the right surface 8 of the frame and the upper surface of the plate.

[0063] In this embodiment, the plastic material is PPS + 40% glass fiber, and the plate and frame are carbon fiber reinforced composite materials. The electronic device housing is manufactured using injection molding. Figure 1 As shown, the specific steps are as follows:

[0064] 1) Attach the frame to the left edge of the upper surface of the board. Grooves are cut into different positions on each surface of the frame.

[0065] 2) Place the fixed frame and plate into a molding mold with a pre-set temperature of 300-320℃ and a pressure of 220-240℃, and a pressure of 30-80MPa;

[0066] 3) Plastic material is injected into the mold through two injection ports, with an injection temperature of 300-350℃ and an injection pressure of 65-130MPa, to form a first plastic structure that wraps the frame and a second plastic structure that fixes the frame and the plate, respectively.

[0067] 4) Demolding is performed after the plastic structure has cooled and solidified.

[0068] Example 3:

[0069] The difference between this embodiment and Embodiment 2 is that the plastic material is a low-shrinkage liquid crystal polymer (LCP) + 35% glass fiber, and the plate and frame are carbon fiber reinforced composite material systems, such as... Figure 1 As shown, the specific steps are as follows:

[0070] 1) Attach the frame to the upper left edge of the board. Grooves are cut into different positions on each surface of the frame.

[0071] 2) Place the fixed frame and plate into a molding mold with a pre-set temperature of 290-370℃ and 120-200℃ and a pressure of 20-80MPa;

[0072] 3) A certain amount of plastic material is injected into the mold through two injection ports, wherein the injection temperature is controlled at 300-380℃ and the pressure is controlled at 60-130MPa, to form the first plastic structure that wraps the frame and the second plastic structure that fixes the frame and the plate, respectively.

[0073] 4) Demolding is performed after the plastic structure has cooled and solidified.

[0074] Example 4:

[0075] The difference between this embodiment and embodiments 1-3 is that the number of frames can be set to one, two, or four as needed.

[0076] Example 5

[0077] like Figure 3 As shown, this embodiment differs from embodiments 1-4 in that the upper surface 9 of the frame is designed as a stepped structure. The stepped structure includes two stepped surfaces, with a step formed between adjacent stepped surfaces; the first plastic structure 3 wraps around the lower stepped surface of the upper surface of the frame, the left surface 7, the lower surface 5, the upper right intersection line 12, the upper left intersection line 10, and the lower left intersection line 11, and connects to the left edge of the plate; the second plastic structure 4 fills the included angle between the right surface 8 of the frame and the upper surface of the plate.

[0078] Example 6

[0079] like Figure 4As shown, this embodiment differs from embodiment 5 in that a third groove 15 and a first groove 13 are respectively provided at the intersection of the high-level stepped surface with the upper left line 10 and the upper right line 12.

[0080] In this embodiment, the plastic material is PEEK + 35% carbon fiber, and the plate and frame are carbon fiber reinforced composite material systems. The electronic device housing is manufactured using injection molding. Figure 1 As shown, the specific steps are as follows:

[0081] 1) Attach the frame to the upper left edge of the board. Grooves are cut into different positions on each surface of the frame.

[0082] 2) Place the fixed frame and plate into a molding mold with a pre-set temperature of 320-380℃ and 280-300℃ and a pressure of 50-100MPa;

[0083] 3) A certain amount of plastic material is injected into the mold through two injection ports, wherein the injection temperature is controlled at 320-400℃ and the pressure is controlled at 100-150MPa, to form the first plastic structure that wraps the frame and the second plastic structure that fixes the frame and the plate, respectively.

[0084] 4) Demolding is performed after the plastic structure has cooled and solidified.

[0085] Example 7

[0086] The difference between this embodiment and Embodiment 6 is that the plastic material is PLA + 30% PHBV, and the electronic device housing is manufactured using 3D printing technology. Figure 2 As shown, the specific steps are as follows:

[0087] 1) Attach the frame to the left edge of the upper surface of the board. Grooves are cut at different positions on each surface of the frame. The upper surface of the frame is designed in a stepped shape to enhance the connection between the plastic material and the frame.

[0088] 2) Place the fixed frame and plate into a clamping fixture with a pre-set temperature of 180-200℃ and 50-100℃ and a pressure of 40-100MPa;

[0089] 3) A certain amount of plastic material is injected through 3D printing, wherein the molding temperature is 190-230°C, to form a first plastic structure that wraps the frame and a second plastic structure that fixes the frame and the plate.

[0090] 4) Remove the clamping fixture after the plastic structure has cooled and solidified.

[0091] Example 8

[0092] In this embodiment, the plastic material is PA + 35% glass fiber, and the plate and frame are carbon fiber reinforced composite material systems. The electronic device housing is manufactured using injection molding. Figure 1 As shown, the specific steps are as follows:

[0093] 1) Attach the frame to the upper left edge of the board. Grooves are cut into different positions on each surface of the frame.

[0094] 2) Place the fixed frame and plate into a molding mold with a pre-set temperature of 270-300℃ and 180-200℃ and a pressure of 50-80MPa;

[0095] 3) A certain amount of plastic material is injected into the mold through two injection ports, wherein the injection temperature is controlled at 260-290℃ and the pressure is controlled at 70-130MPa, to form the first plastic structure that wraps the frame and the second plastic structure that fixes the frame and the plate, respectively.

[0096] 4) Demolding is performed after the plastic structure has cooled and solidified.

[0097] Example 9

[0098] The difference between this embodiment and Embodiment 8 is that the electronic device housing is fabricated using 3D printing technology, such as... Figure 2 As shown, the specific steps are as follows:

[0099] 1) Attach the frame to the left edge of the upper surface of the board. Grooves are cut at different positions on each surface of the frame. The upper surface of the frame is designed in a stepped shape to enhance the connection between the plastic material and the frame.

[0100] 2) Place the fixed frame and plate into a clamping fixture with a pre-set temperature of 270-300℃ and 180-200℃ and a pressure of 50-80MPa;

[0101] 3) A certain amount of plastic material is injected through 3D printing, wherein the molding temperature is 260-290°C, forming a first plastic structure that wraps the frame and a second plastic structure that fixes the frame and the plate.

[0102] 4) Remove the clamping fixture after the plastic structure has cooled and solidified.

[0103] Example 10

[0104] In this embodiment, the plastic material is PC + 15% carbon fiber, and the plate and frame are carbon fiber reinforced composite material systems. The electronic device housing is manufactured using injection molding. Figure 1 As shown, the specific steps are as follows:

[0105] 1) Attach the frame to the upper left edge of the board. Grooves are cut into different positions on each surface of the frame.

[0106] 2) Place the fixed frame and plate into a molding mold with a pre-set temperature of 270-320℃ and 100-190℃ and a pressure of 40-120MPa;

[0107] 3) A certain amount of plastic material is injected into the mold through two injection ports, wherein the injection temperature is controlled at 260-300℃ and the pressure is controlled at 80-150MPa, to form a first plastic structure that wraps the frame and a second plastic structure that fixes the frame and the plate, respectively.

[0108] 4) Demolding is performed after the plastic structure has cooled and solidified.

[0109] Example 11

[0110] The difference between this embodiment and Embodiment 10 is that the electronic device housing is fabricated using 3D printing technology, such as... Figure 2 As shown, the specific steps are as follows:

[0111] 1) Attach the frame to the left edge of the upper surface of the board. Grooves are cut at different positions on each surface of the frame. The upper surface of the frame is designed in a stepped shape to enhance the connection between the plastic material and the frame.

[0112] 2) Place the fixed frame and plate into a clamping fixture with a pre-set temperature of 270-320℃ and 100-190℃ and a pressure of 40-120MPa;

[0113] 3) A certain amount of plastic material is injected through 3D printing, wherein the molding temperature is 300-330°C, to form a first plastic structure that wraps the frame and a second plastic structure that fixes the frame and the plate.

[0114] 4) Remove the clamping fixture after the plastic structure has cooled and solidified.

Claims

1. An electronic device housing that improves shrinkage of plastic molding, characterized by The electronic device shell comprises a plate body, a frame body, a first plastic structure and a second plastic structure, wherein: The frame body is arranged on at least one edge surface of the plate body, and at least one frame body is arranged on each edge surface; The first plastic structure wraps the adjacent two outer surfaces of the frame body in the side direction of the plate body, and extends to cover the surface of the corresponding edge of the plate body; The second plastic structure fills the included angle region formed by the remaining two surfaces of the frame body and the edge surface of the plate body, and is attached to the corresponding surface of the frame body and the edge surface of the plate body, respectively.

2. The electronic device case for improving shrinkage of plastic molding according to claim 1, characterized in that The lower surface of the frame body is connected to the corresponding edge region of the plate body to form an overlapping part H, the width H of the overlapping part satisfies 0.4K≤H≤K, K is the width of the lower surface of the frame body; a groove is arranged at the intersection of the surfaces of the frame body; the groove is a square or rectangular groove; the groove is arranged at at least one of the following positions: the intersection of the upper surface and the surface away from the side direction of the plate body, the intersection of the surface close to the side direction of the plate body and the upper surface, the intersection of the surface close to the side direction of the plate body and the lower surface, and the intersection of the surface away from the side direction of the plate body and the lower surface.

3. The electronic device case for improving shrinkage of plastic molding according to claim 1, characterized in that The upper surface of the frame body is designed as a stepped structure, the stepped structure comprises at least two stepped surfaces, and a step is formed between adjacent stepped surfaces; the first plastic structure wraps the stepped surface of the stepped structure.

4. The electronic device case for improving shrinkage of plastic molding according to claim 1, wherein The materials of the frame body and the plate body are one or more of glass material, metal material, fiber composite material, plastic material, wood, ceramic material, and the cross section of the frame body is cuboid, square or irregular shape.

5. The electronic device case for improving shrinkage of plastic molding according to claim 4, wherein The glass material is one or more of microcrystalline glass, 3D glass, soda-lime glass, borosilicate glass, aluminosilicate glass, tempered glass; the metal material is one or more of aluminum-magnesium alloy, titanium alloy, stainless steel, magnesium-lithium alloy, magnesium alloy; the fiber composite material takes one or more of aramid fiber, glass fiber, basalt fiber, PBO fiber, carbon fiber, Kevlar fiber as a reinforcing phase, and takes one or more of thermosetting resin or thermoplastic resin as a matrix phase, the carbon fiber includes one or more of conventional carbon fiber, high-strength and high-modulus carbon fiber, petroleum-based carbon fiber, bio-based carbon fiber, mass balance method carbon fiber, and recycled carbon fiber, the conventional carbon fiber includes one or more of T300, T700, T800, the high-strength and high-modulus carbon fiber includes one or more of T1000, T1100, M40J, M40x, M55J, M60J, the thermosetting resin is one or more of epoxy resin, phenolic resin, unsaturated polyester, vinyl resin, cyanate ester resin, polyimide resin, phthalonitrile resin, and the thermoplastic resin includes one or more of polyolefin, polyamide, polyester, polycarbonate, polyphenylene sulfide, polysulfone, polyether amide, polyurethane; the plastic material is one or more of ABS, PC, PPS, TPE composite; the wood material is one or more of bamboo fiber laminated board and hemp fiber laminated board; the ceramic material is one or more of silicon nitride-based composite material and aluminum oxide ceramic coating.

6. The electronic device case for improving shrinkage of plastic molding according to claim 4 or 5, characterized by The fiber composite material is a solid plate or a sandwich plate; the material of the sandwich layer in the sandwich plate is one or two of thermoplastic foamed material, thermosetting foamed material and thermoplastic resin material; the density of the thermoplastic foamed material is 0.02-1.5 g / cm 3 , and the density of the thermosetting foamed material is 0.2-1.5 g / cm 3 ; the material of the sandwich layer is one or two of thermoplastic foamed material, thermosetting foamed material, thermoplastic resin material, carbon felt and felt; the density of the thermoplastic foamed material is 0.02-1.5 g / cm 3 , and the density of the thermosetting foamed material is 0.2-1.5 g / cm 3 ; the thermoplastic foamed material is one or several of polystyrene, polyethylene, polypropylene, polyvinyl chloride, ethylene-vinyl acetate copolymer, thermoplastic polyurethane elastomer, thermoplastic elastomer, thermoplastic polyester elastomer, polycarbonate, ethylene acrylate copolymer, polyamide-based thermoplastic elastomer foam, polylactic acid, thermoplastic polymethacrylimide, thermoplastic structured polyimide, poly-4-methyl-1-pentene, ethylene-vinyl alcohol copolymer, polyamide, polyhydroxyaliphatic ester, polyether ether ketone, polytetrafluoroethylene, polyphenylene sulfide, polyformaldehyde, thermoplastic epoxy resin; the thermosetting foamed material is one or several combinations of thermosetting polyurethane, phenolic, epoxy resin, urea-formaldehyde resin, melamine-formaldehyde resin, silicone, chlorobutyl rubber, nitrile rubber, silicone rubber, butyl rubber, fluororubber, phenolic-nitrile rubber, epoxy-nitrile rubber, thermosetting polymethacrylimide, cyanate ester, thermosetting polyimide, vinyl ester resin, furan resin, boron phenolic, magnesia foam, silicon borazane, polyurea, polybenzimidazole, bismaleimide, furan-formaldehyde, melamine-urea-formaldehyde resin, epoxy-phenolic, nitrile-polyvinyl chloride, chlorosulfonated polyethylene, polysulfide rubber; the thermoplastic resin material is one or more of polyolefin-based resin, polyester-based resin, polyamide-based resin, polystyrene-based resin, polycarbonate-based resin, polyether-based resin, polyimide-based resin, polyphenylene sulfide-based resin, polysulfone-based resin, polyether amide-based resin, thermoplastic polyurethane; the polyolefin-based resin is one or more of polyethylene, low-density polyethylene, high-density polyethylene, linear low-density polyethylene, polypropylene; the polyester-based resin is one or more of polyethylene terephthalate, polybutylene terephthalate; the polyamide-based resin is one or more of polyamide 6, polyamide 66, polyamide 11, polyamide 12; the polystyrene-based resin is one or more of polystyrene, high-impact polystyrene, acrylonitrile-butadiene-styrene copolymer; the polycarbonate-based resin is one or more of polycarbonate, aromatic polycarbonate; the polyether-based resin is one or more of polyether ether ketone, polyether ketone ketone, polyether sulfone; the polyimide-based resin is one or more of polyimide, polyamide imide; the polyphenylene sulfide-based resin is polyphenylene sulfide; the polysulfone-based resin is bisphenol A polysulfone; the polyether imide-based resin is polyether imide; the thermoplastic polyurethane-based resin is thermoplastic polyurethane.

7. The electronic device case for improving plastic molding shrinkage according to claim 1, wherein The material of the first plastic structure and the second plastic structure is high-temperature plastic material or conventional plastic material, the high-temperature plastic material is plastic material A or a mixture of plastic material A and reinforcing body, the plastic material A is one or more of PTFE, PC, PA, PSU, PEK, PEKK, PEEK, LCP, PU, PEI, PAEK, PES, PVDF, PPS, the reinforcing body is one or more of carbon fiber, glass fiber, glass beads, nano filler, and the addition amount is 10-40wt.%; the conventional plastic material is plastic material B or a mixture of plastic material B and reinforcing body, the plastic material B is one or more of PE, PP, PVC, PS, ABS, PMMA, POM, PVA, PLA, PET, the reinforcing body is one or more of carbon fiber, glass fiber, glass beads, nano filler, and the addition amount is 10-40wt.%.

8. A method of producing an electronic device housing having improved shrinkage of plastic molding according to any one of claims 1 to 7, characterized by The method adopts an injection molding process to prepare an electronic device shell, and specifically includes the following steps: Step one, paste the frame to the edge position of the plate; Step two, place the fixed plate and frame in a forming mold with pre-set temperature parameters, inject plastic material into the mold through the injection port, and perform gradient heating to form the first plastic structure and the second plastic structure respectively; Step three, after the plastic structure cools and solidifies, demold to obtain the electronic device shell.

9. The method of claim 8, wherein the method further comprises the step of: 9-1) applying a coating to the surface of the electronic device housing. In the second step, a corresponding injection molding process is selected according to the type of plastic material, for high-temperature processing plastic, the mold temperature of the plate body is 120-300 DEG C, the pressure is 20-100 MPa, the mold temperature of the frame body is 250-380 DEG C, the pressure is 20-100 MPa; for the conventional processing of plastic, the mold temperature of the plate body is 90-150 DEG C, the pressure is 10-100 MPa, the mold temperature of the frame body is 150-280 DEG C, the pressure is 20-100 MPa; the mold comprises at least two injection ports, and the mold temperature is set to gradient temperature.

10. A method of producing an electronic device housing having improved shrinkage of plastic molding according to any one of claims 1 to 7, characterized by The method adopts a 3D printing process to prepare an electronic device shell, and specifically includes the following steps: Step one, paste the frame body to the edge position of the plate body; Step two, place the fixed plate body and frame body in a jig with pre-set temperature parameters, inject plastic material in a 3D printing manner to form a first plastic structure and a second plastic structure respectively; Step three, remove the clamping jig after the first plastic structure and the second plastic structure solidify to obtain an electronic device shell.

11. The method of claim 10, wherein the method further comprises the step of: 10 applying a coating to the surface of the electronic device housing. In the second step, the jig temperature corresponding to the plate body is 50-360 DEG C, the jig temperature corresponding to the frame body is 60-150 DEG C, and the printing precision is 0.01-0.1 mm.

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