Method and device for carrying out three-dimensional cutting on transparent material

Abstract

The invention provides a method and device for conducting three-dimensional cutting on a transparent material, and the method comprises the steps that parameters of a three-dimensional light field needed for cutting the transparent material are determined according to a cutting target needing to be achieved by the transparent material to be cut; iteratively executing the following steps until a detection result meets a preset condition to obtain a cut transparent material; obtaining a hologram according to the parameters of the three-dimensional light field based on a three-dimensional iterative algorithm; generating a three-dimensional light field in the transparent material based on the hologram by utilizing a light generating assembly so as to cut the transparent material to be cut by utilizing the three-dimensional light field; and detecting the morphology of the cut transparent material and the uniformity of the cut surface, and changing the parameters of the three-dimensional light field according to the detection result.

Description

TECHNICAL FIELD

[0001] At least one embodiment of the present application relates to the field of optical precision machining, and more particularly to a method and device for three-dimensional cutting of transparent materials. BACKGROUND

[0002] In the modern manufacturing and processing industry, the application of transparent materials is becoming more and more widespread, covering optical elements, display panels and many other fields. However, traditional mechanical processing technology often faces a series of challenges when dealing with transparent materials, such as low cutting quality, poor processing efficiency, and insufficient control precision of cutting edges. With the rapid development of laser technology, researchers have begun to use high-energy laser to focus on the material inside to form a modified layer, and to achieve cutting of transparent hard materials by controlling the extension of the crack. However, this method has the problems of difficulty in crack control and single cutting ability, which not only affects the appearance quality of the finished product, but also limits the application of transparent materials in precision machining.

[0003] Processing technology based on light field regulation has gradually become a research hotspot. By adjusting the spatial distribution and phase of light, precise control of laser beam shape and energy distribution can be achieved, providing a new solution for cutting of transparent materials. However, existing technology uses two-dimensional planar light field regulation, which can only form a focal point array in a single plane, and cannot achieve true three-dimensional energy control. Secondly, existing solutions generally use static light field distribution, i.e. the number of focal points, energy and spacing are preset before cutting, and the light field parameters are not adjusted in real time according to the material response during the processing.

[0004] Because the refractive index, absorption rate and other characteristics of transparent materials may change due to temperature, stress or the influence of the modified area, fixed light field can cause the following problems: First, as the laser propagates inside the material, there are significant differences in energy absorption rate at different depths, and equal energy distribution leads to insufficient modification of deep layer areas. Secondly, equal spacing arrangement cannot adapt to the nonlinear absorption characteristics of the material, and is prone to cause heat accumulation effect in strong absorption areas, while the processing efficiency is low in weak absorption areas. Ultimately, it leads to increased roughness of the cutting surface and decreased shape accuracy. SUMMARY

[0005] Therefore, the present application provides a method and device for three-dimensional cutting of transparent materials,

[0006] As a first aspect of the present application, a method for three-dimensional cutting of transparent materials is provided, comprising:

[0007] According to the cutting target to be achieved by the transparent material to be cut, the parameters of the three-dimensional light field required for cutting the transparent material are determined, including the number and spatial distribution of focal points of the three-dimensional light field.

[0008] The following steps are iteratively performed until the detection result meets a preset condition, and the transparent material is cut to completion;

[0009] Based on a three-dimensional iterative algorithm, a hologram is obtained according to parameters of the three-dimensional light field;

[0010] The light generating assembly generates the three-dimensional light field in the transparent material based on the hologram, so as to cut the transparent material to be cut by using the three-dimensional light field;

[0011] The morphology of the cut transparent material and the uniformity of the cutting surface are detected, and the parameters of the three-dimensional light field are changed according to the detection result.

[0012] According to an embodiment of the present application, the parameters of the three-dimensional light field are changed according to the detection result, including:

[0013] In the case where the detection result represents that the cutting surface has a non-uniform region parallel to the normal direction, the energy of the focal point corresponding to the non-uniform region in the three-dimensional light field is changed.

[0014] According to an embodiment of the present application, the parameters of the three-dimensional light field are changed according to the detection result, including:

[0015] In the case where the detection result represents that the cutting surface has a non-uniform region perpendicular to the normal direction, the density of the focal point corresponding to the non-uniform region in the three-dimensional light field is changed.

[0016] According to an embodiment of the present application, the inclination angle of the principal axis direction of the three-dimensional light field relative to the normal direction of the incident surface of the transparent material is 5°-10°.

[0017] According to an embodiment of the present application, the wavelength of the three-dimensional light field can cause the transparent material to be modified.

[0018] According to an embodiment of the present application, the preset condition is that the deviation between the morphology of the cut transparent material and the morphology of the cutting target is less than a first preset threshold, and the uniformity of the cutting surface is less than a second preset threshold.

[0019] As a second aspect of the present application, a device for three-dimensional cutting of a transparent material is provided for implementing the above method, and the device comprises:

[0020] A displacement table adapted to carry the transparent material to be cut;

[0021] A light generating assembly comprising:

[0022] A laser adapted to generate an initial laser;

[0023] A spatial light modulator is configured to modulate a wavefront of the laser according to a hologram to obtain a modulated laser, the modulated laser carrying information of a three-dimensional light field;

[0024] A 4f system is configured to transmit the modulated laser;

[0025] An objective lens is configured to focus the modulated laser into the transparent material to form a three-dimensional light field having a plurality of focal points in a three-dimensional space through a diffraction effect, the three-dimensional light field being configured to cut the transparent material;

[0026] A light source is configured to generate an illumination beam; the illumination beam is transmitted through the objective lens after being reflected by the transparent material;

[0027] An imaging assembly is configured to obtain an image of the transparent material by using a reflected beam of the illumination beam transmitted by the objective lens after being reflected by the transparent material, the image being used to determine a topography of the transparent material after being cut and uniformity of a cutting surface;

[0028] A processing assembly is configured to determine parameters of the three-dimensional light field required when cutting the transparent material according to a cutting target required to be achieved by the transparent material to be cut; obtain the hologram according to the parameters of the three-dimensional light field based on a three-dimensional iterative algorithm, and change the parameters of the three-dimensional light field according to the detection result.

[0029] According to an embodiment of the present application, the 4f system includes a first lens and a second lens, positions of the first lens and the second lens are configured to have the same focal plane;

[0030] The device further includes:

[0031] A diaphragm is located on the same focal plane of the first lens and the second lens, and is configured to filter the modulated laser.

[0032] According to an embodiment of the present application, the device further includes:

[0033] A half-mirror is configured to reflect the modulated laser output by the 4f system to the objective lens, and is configured to transmit a reflected beam from the objective lens so that the imaging assembly receives the reflected beam.

[0034] According to an embodiment of the present application, the three-dimensional light field is determined according to a magnification of the objective lens and a target three-dimensional shape required to be achieved by the transparent material to be cut.

[0035] According to the embodiment of the present application, the spatial limitation of traditional two-dimensional light field is broken by inversely mapping the target three-dimensional shape into a three-dimensional focal array. In the embodiment of the present application, the phase distribution is calculated based on a three-dimensional iterative algorithm, and the accurate construction of complex three-dimensional light field such as arc point array is realized. By continuously changing the parameters of the three-dimensional light field, the uniform cutting of transparent materials is finally realized.

[0036] According to the embodiment of the present application, the wavelength of the three-dimensional light field can cause the modification of the transparent material. According to the embodiment of the present application, the parameters of the three-dimensional light field are changed according to the detection results, including changing the number of focal points in the three-dimensional light field and / or changing the energy of at least part of the focal points in the three-dimensional light field. The traditional equidistant focal point distribution cannot adapt to the nonlinear absorption characteristics of the material, resulting in uneven energy deposition (such as overburning in the shallow layer, insufficient modification in the deep layer, etc.). By optimizing the energy distribution of the focal point array (changing the energy of at least part of the focal points in the three-dimensional light field), the unevenness of energy transmission can be effectively compensated, thereby significantly improving the cutting quality and processing stability. Optimizing the spatial distribution of the focal point array (changing the number of focal points in the three-dimensional light field) can further improve the energy utilization and processing uniformity on the premise of ensuring high-energy focusing of the three-dimensional light field. BRIEF DESCRIPTION OF DRAWINGS

[0037] The above and other objects, features and advantages of the present application will become more apparent from the following description of the embodiments of the present application taken with reference to the accompanying drawings, in which:

[0038] Figure 1 A flow chart of a method for three-dimensional cutting of a transparent material according to an embodiment of the present application is shown.

[0039] Figure 2 A comparison chart of cutting effects of three-dimensional light fields with different focal point array energy distributions according to an embodiment of the present application is shown.

[0040] Figure 3 A comparison chart of cutting effects of three-dimensional light fields with different spatial distributions of focal point arrays according to an embodiment of the present application is shown.

[0041] Figure 4 A chart of cutting effects of three-dimensional light fields at different inclination angles according to an embodiment of the present application is shown.

[0042] Figure 5 A schematic diagram of a device for three-dimensional cutting of a transparent material according to an embodiment of the present application is shown.

[0043] Explanation of reference signs:

[0044] 1: displacement table

[0045] 2: light generating assembly

[0046] 21: laser

[0047] 22: spatial light modulator

[0048] 23: 4f system and objective lens

[0049] 231: first lens

[0050] 232: second lens

[0051] 24: objective lens

[0052] 3: light source

[0053] 4: imaging assembly

[0054] 5: half mirror

[0055] 6: transparent material

[0056] 7: aperture stop DETAILED DESCRIPTION

[0057] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. It should be understood, however, that the description which follows is merely illustrative and is not intended to limit the scope of the present application. In the following detailed description of embodiments of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that one or more embodiments of the present application can be practiced without these specific details. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring aspects of the present application.

[0058] The terms used herein are merely used to describe specific embodiments and are not intended to limit the present application. The terms "include", "comprise", and the like used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0059] All terms used herein, including technical and scientific terms, have the same meanings as those generally understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having meanings consistent with the context of the present specification, and should not be interpreted in an idealized or overly formal manner.

[0060] Figure 1 A flowchart of a method of three-dimensionally cutting a transparent material according to an embodiment of the present application is shown.

[0061] As Figure 1 shown, the above method includes operations S1-S5.

[0062] At operation S1, parameters of the three-dimensional light field required for cutting the transparent material are determined according to a cutting target to be achieved by the transparent material to be cut, the parameters of the three-dimensional light field including a number of focal points of the three-dimensional light field and a spatial distribution of the three-dimensional light field.

[0063] At operation S2, the following steps are iteratively performed until a detection result meets a preset condition, and a transparent material with completed cutting is obtained.

[0064] At operation S3, a hologram is obtained according to the parameters of the three-dimensional light field based on a three-dimensional iterative algorithm.

[0065] At operation S4, a three-dimensional light field is generated in the transparent material based on the hologram by using a light generating assembly, so as to cut the transparent material to be cut by using the three-dimensional light field.

[0066] At operation S5, a morphology of the transparent material after cutting and uniformity of a cutting surface are detected, and the parameters of the three-dimensional light field are changed according to a detection result.

[0067] According to an embodiment of the present application, the target three-dimensional shape is reversely mapped into a three-dimensional focal point array, breaking through the spatial limitation of a traditional two-dimensional light field. In the embodiment of the present application, a phase distribution is calculated based on a three-dimensional iterative algorithm, so as to realize accurate construction of a complex three-dimensional light field such as an arc-shaped point array. By continuously changing the parameters of the three-dimensional light field, uniform cutting of the transparent material is finally realized.

[0068] According to an embodiment of the present application, the wavelength of the three-dimensional light field can cause modification of the transparent material. According to an embodiment of the present application, the parameters of the three-dimensional light field are changed according to a detection result, including changing a number of focal points in the three-dimensional light field and / or changing energy of at least part of the focal points in the three-dimensional light field. A traditional equidistant focal point distribution cannot adapt to nonlinear absorption characteristics of the material, resulting in uneven energy deposition (such as overburning in a shallow layer and insufficient modification in a deep layer). By optimizing the energy distribution of the focal point array (changing the energy of at least part of the focal points in the three-dimensional light field), the unevenness of energy transmission can be effectively compensated, thereby significantly improving cutting quality and processing stability. Optimizing the spatial distribution of the focal point array (changing the number of focal points in the three-dimensional light field) can further improve energy utilization and processing uniformity on the premise of ensuring high-energy focusing of the three-dimensional light field.

[0069] Based on the dynamic light field regulation principle of the present application, different optimization strategies are respectively adopted for non-uniformity problems in different dimensions of the cutting surface. The following are described respectively.

[0070] According to one embodiment of the present application, the parameters of the three-dimensional light field are changed according to the detection result, including: in the case that the detection result represents that the cutting surface has a non-uniform area in the direction parallel to the normal line, the energy of the focal point corresponding to the non-uniform area in the three-dimensional light field is changed. For materials with different laser absorption rates (such as semiconductor materials such as silicon wafers and silicon nitride), regulating the focal point energy distribution not only improves the consistency of laser modification, but also effectively improves the cutting quality and processing stability.

[0071] According to an embodiment of the present application, the preset condition is that the deviation between the morphology of the transparent material after cutting and the morphology of the cutting target is less than a first preset threshold, and the uniformity of the cutting surface is less than a second preset threshold. The morphology includes shape and size. When the morphology of the transparent material after cutting and the morphology of the cutting target are relatively small, and the cutting surface is uniform enough, the cutting can be completed.

[0072] Figure 2 A cutting effect comparison diagram of a three-dimensional light field with different focal point array energy distributions is shown.

[0073] In Figure 2 , the three-dimensional light field is in an arc shape, and the cutting surface of the transparent material is also in an arc shape. Figure 2 In each part of the figure, "1" represents a smaller energy of the focal point, and "2" represents a larger energy of the focal point. The three-dimensional light field adopted in part a is a focal point array with the same focal point energy distribution; the three-dimensional light field adopted in part b1 has a focal point array with the focal point energy increasing from top to bottom; the three-dimensional light field adopted in part b2 has a focal point array with the focal point energy decreasing from top to bottom; the three-dimensional light field adopted in part c1 has a focal point array with the focal point energy increasing from the center to both ends; and the three-dimensional light field adopted in part c2 has a focal point array with the focal point energy decreasing from the center to both ends. As shown in Figure 2 It can be seen that the energy distribution of the focal point array in the three-dimensional light field has a direct impact on the cutting effect. The energy distribution of the focal point in the focal point array affects the cutting effect of the cutting surface in the direction parallel to the normal line.

[0074] According to another embodiment of the present application, the parameters of the three-dimensional light field are changed according to the detection result, including: in the case that the detection result represents that the cutting surface has a non-uniform area in the direction perpendicular to the normal line, the density of the focal point corresponding to the non-uniform area in the three-dimensional light field is changed. Optimizing the spatial layout of the focal point array can improve the energy utilization rate and the processing uniformity while maintaining high energy focusing.

[0075] Figure 3 A cutting effect comparison diagram of a three-dimensional light field with different spatial distribution of focal point arrays is shown.

[0076] In Figure 3In the three-dimensional light field, the three-dimensional light field is arc-shaped, and the cutting surface of the transparent material is also arc-shaped. The central angle corresponding to the arc can be 0°-180°. The three-dimensional light field adopted in part a has a focal point array with equidistantly distributed focal points, and an arc-shaped focal point array with 50 equidistantly distributed focal points; the three-dimensional light field adopted in part b1 has a focal point array gradually sparse from both ends to the center; the three-dimensional light field adopted in part b2 has a focal point array gradually dense from the center to both ends; the three-dimensional light field adopted in part c1 has a focal point array with 30 equidistantly distributed focal points, and the three-dimensional light field adopted in part c2 has a focal point array with 70 equidistantly distributed focal points. As shown in Figure 3 The energy distribution of the focal point array in the three-dimensional light field directly affects the cutting effect. The spatial distribution of the focal points in the focal point array affects the cutting effect of the cutting surface in the direction perpendicular to the normal direction.

[0077] According to an embodiment of the present application, the inclination angle of the main axis direction of the three-dimensional light field relative to the normal direction of the incident surface of the transparent material is 5°-10°. According to an embodiment of the present application, the upper modified region of the transparent material (a local region where the physical properties change under the action of the three-dimensional light field) causes changes in the upper refractive index and transmittance, thereby affecting the focusing and energy deposition effect of the three-dimensional light field spot (the energy distribution projection of the focal points of the three-dimensional light field inside the transparent material) in the lower layer. By modulating the three-dimensional light field to have a certain forward inclination angle, the interference of the modified upper region can be avoided, and the consistency of the energy deposition in the depth direction during the laser modification process can be enhanced.

[0078] Figure 4 The cutting effect diagrams of the three-dimensional light field provided by the embodiment of the present application under different inclination angles are shown.

[0079] Figure 4 The three-dimensional light field is arc-shaped, and the cutting surface of the transparent material is also arc-shaped. Figure 4 The scanning direction in the three-dimensional light field is the moving direction of the displacement table. The total focusing path is the focusing light field below the objective lens. The low focusing path is the high-energy focusing light field of the laser inside the material, i.e. the three-dimensional light field.

[0080] As shown in part a of Figure 4 When the inclination angle of the three-dimensional light field is 0°, as shown in part a of the three-dimensional light field, it can be seen from this part that the cutting surface of the transparent material is not uniform (the modification depth of the upper layer is 27.4 μm, and the modification depth of the lower layer is 15.1 μm). Figure 4 When the inclination angle of the three-dimensional light field is 5°, as shown in part b of the three-dimensional light field, it can be seen from this part that the cutting surface of the transparent material is relatively uniform (the modification depth of the upper layer is 15.0 μm, and the modification depth of the lower layer is 16.8 μm).

[0081] As a second aspect of the present application, a device for three-dimensional cutting of a transparent material is also provided, which is used to implement the above-mentioned method,

[0082] Figure 5 A schematic diagram of an apparatus for three-dimensional cutting of a transparent material is shown according to an embodiment of the present application.

[0083] The apparatus comprises a displacement table 1, a light generating assembly 2, a light source 3, an imaging assembly 4 and a processing assembly.

[0084] The displacement table 1 is adapted to carry the transparent material 6 to be cut. The light generating assembly 2 comprises a laser 21, a spatial light modulator 22, a 4f system 23 and an objective lens 24. The laser 21 is adapted to generate an initial laser, the spatial light modulator 22 is adapted to modulate the wavefront of the initial laser according to a hologram to obtain a modulated laser, the modulated laser carrying information of a three-dimensional light field. The 4f system 23 is adapted to transmit the modulated laser. The objective lens 24 is adapted to focus the modulated laser into the transparent material to form a three-dimensional light field with multiple focal points in three-dimensional space through diffraction effect, the three-dimensional light field being adapted to cut the transparent material 6. The light source 3 is adapted to generate an illumination beam; the illumination beam is transmitted through the objective lens 24 after being reflected by the transparent material 6. The imaging assembly 4 is adapted to obtain an image of the transparent material 6 by using the reflected beam of the transparent material 6 transmitted by the objective lens 24, the image being used to determine the uniformity of the cutting surface. The processing assembly is adapted to determine the parameters of the required three-dimensional light field of the cut transparent material according to the target three-dimensional shape required to be achieved by the transparent material to be cut; obtain the hologram according to the parameters of the three-dimensional light field based on a three-dimensional iterative algorithm, and change the parameters of the three-dimensional light field according to the detection result.

[0085] According to the embodiment of the present application, the apparatus cooperates with the light generating assembly 2 and the processing assembly to generate a three-dimensional light field for cutting the transparent material, and the light generating assembly 2, the light source 3, the imaging assembly 4 and the processing assembly cooperates to realize real-time adjustment of the three-dimensional light field, thereby ensuring the uniformity of the cutting of the transparent material.

[0086] According to the embodiment of the present application, the 4f system 23 comprises a first lens 231 and a second lens 232 arranged in sequence along the propagation direction of the modulated laser, and the first lens 231 and the second lens 232 are configured to have the same focal plane; that is, the distance between the first lens 231 and the second lens 232 is the sum of the focal lengths of the first lens 231 and the second lens 232.

[0087] According to the embodiment of the present application, the apparatus further comprises a diaphragm 7 located on the same focal plane of the first lens 231 and the second lens 232, and adapted to filter the modulated laser.

[0088] According to the embodiment of the present application, the device further comprises a half-mirror 5, which is adapted to reflect the modulated laser outputted by the 4f system 23 to the objective lens 24, and is adapted to transmit the reflected light beam from the objective lens 24 so that the imaging assembly 4 receives the reflected light beam.

[0089] According to the embodiment of the present application, the three-dimensional light field is determined according to the magnification of the objective lens and the required three-dimensional shape of the transparent material to be cut. In addition, when determining the parameters of the three-dimensional light field, the following conditions also need to be determined. The main wavelength of the initial laser generated by the laser 21 (for example, 1030 nm), the physical resolution of the spatial light modulator 22 (for example, 12.5 μm), the magnification of the first lens 231 and the second lens 232 (for example, 20X), the focal length (for example, 9 mm), the numerical aperture (for example, 0.45), and the working distance of the objective lens (for example, 3 mm). In addition, the refractive indices of the ambient medium and the transparent material to be cut, for example, 1 and 1.51 respectively, the internal processing depth of the transparent material (for example, 275 μm), and the focal point array distribution of the three-dimensional light field as an arc-shaped point array along the laser propagation direction, and the point array height (determined by the uppermost focal point and the lowermost focal point) of 550 μm are also determined.

[0090] The focal point array optimization distribution method for the three-dimensional light field for cutting transparent materials according to the embodiment of the present application uses a holographic algorithm (i.e., a three-dimensional iterative algorithm) to accurately set the number of focal points, the spatial position, the energy distribution, and the light field inclination angle of the three-dimensional light field, thereby optimizing the processing effect and significantly improving the cutting quality.

[0091] According to the embodiment of the present application, by optimizing the energy distribution in the focal point array, the non-uniformity of the three-dimensional wide-area energy transmission can be effectively compensated, thereby significantly improving the cutting quality and processing stability.

[0092] According to the embodiment of the present application, optimizing the spatial layout of the focal point array can further improve the energy utilization rate and processing uniformity while ensuring high energy focusing.

[0093] According to the embodiment of the present application, by modulating the three-dimensional light field to have a certain forward inclination angle, interference with the modified upper region can be avoided, and the consistency of energy deposition in the depth direction during the laser modification process can be enhanced.

[0094] For those skilled in the art, various changes, modifications, replacements, and variations can be made to these embodiments without departing from the principles and spirits of the present application, and still fall within the protection scope of the present application.

[0095] The embodiments of the application have been described. However, these embodiments are merely for illustration and are not intended to limit the scope of the application. Although each embodiment is described above separately, this does not mean that the measures in each embodiment cannot be used advantageously in combination. The scope of the application is defined by the appended claims and their equivalents. Various alternatives and modifications can be made to the embodiments of the application without departing from the scope of the application, and it is intended that all such alternatives and modifications be included within the scope of the application.

Claims

1. A method for three-dimensional cutting of a transparent material, comprising: determining parameters of a three-dimensional light field required for cutting the transparent material according to a cutting target required to be achieved by the transparent material to be cut, the parameters of the three-dimensional light field including a number and a spatial distribution of focal points of the three-dimensional light field; iteratively performing the following steps until a detection result meets a preset condition to obtain a cut transparent material: obtaining a hologram according to the parameters of the three-dimensional light field based on a three-dimensional iterative algorithm; generating the three-dimensional light field in the transparent material based on the hologram by using a light generating assembly to cut the transparent material to be cut by using the three-dimensional light field; detecting a topography of the cut transparent material and uniformity of a cutting surface, and changing the parameters of the three-dimensional light field according to a detection result.

2. The method of claim 1, wherein, changing the three-dimensional light field according to the detection result, including: in a case where the detection result represents that the cutting surface has a non-uniform region parallel to a normal direction, changing an energy of a focal point corresponding to the non-uniform region in the three-dimensional light field.

3. The method of claim 1, wherein, changing the three-dimensional light field according to the detection result, including: in a case where the detection result represents that the cutting surface has a non-uniform region perpendicular to the normal direction, changing a density of a focal point corresponding to the non-uniform region in the three-dimensional light field.

4. The method of claim 1, wherein, an inclination angle of a main axis direction of the three-dimensional light field relative to a normal direction of an incident surface of the transparent material is 5° to 10°.

5. The method of claim 1, wherein, a wavelength of the three-dimensional light field is capable of causing modification of the transparent material.

6. The method of claim 1, wherein, the preset condition is that a deviation between the topography of the cut transparent material and a topography of the cutting target is less than a first preset threshold, and the uniformity of the cutting surface is less than a second preset threshold. 7.An apparatus for three-dimensional cutting of a transparent material, configured to implement the method of any one of claims 1 to 7, the apparatus comprising: a displacement table adapted to carry the transparent material to be cut; a light generating assembly, comprising: a laser adapted to generate an initial laser; a spatial light modulator adapted to modulate a wavefront of the laser according to a hologram to obtain a modulated laser, the modulated laser carrying information of a three-dimensional light field; a 4f system adapted to transmit the modulated laser; an objective lens adapted to focus the modulated laser to an inside of the transparent material to form a three-dimensional light field having a plurality of focal points in a three-dimensional space inside the transparent material by a diffraction effect, the three-dimensional light field being adapted to cut the transparent material; a light source adapted to generate an illumination beam; the illumination beam is transmitted by the objective lens after being reflected by the transparent material; an imaging assembly adapted to obtain an image of the transparent material by using a reflected beam of the illumination beam transmitted by the objective lens, the image being used to determine a topography of the cut transparent material and uniformity of a cutting surface; a processing assembly adapted to determine parameters of the three-dimensional light field required for cutting the transparent material according to a cutting target required to be achieved by the transparent material to be cut, to obtain the hologram according to the parameters of the three-dimensional light field based on a three-dimensional iterative algorithm, and to change the parameters of the three-dimensional light field according to the detection result.

8. The apparatus of claim 7, wherein, 4f system includes a first lens and a second lens, positions of the first lens and the second lens are configured to have the same focal plane; The device further includes: a light barrier located on the same focal plane of the first lens and the second lens, and adapted to filter the modulated laser.

9. The apparatus of claim 7, wherein, The device further includes: a half-mirror adapted to reflect the modulated laser output by the 4f system to the objective lens, and adapted to transmit the reflected light beam from the objective lens so that the imaging assembly receives the reflected light beam.

10. The apparatus of claim 7, wherein, The three-dimensional light field is determined according to a magnification of the objective lens and a target three-dimensional shape required to be reached by the transparent material to be cut.

Images