Plating device for improving plating quality of plated object and preventing gloss reduction

Abstract

The present invention relates to an electroplating apparatus for improving the electroplating quality of an object to be plated and preventing a decrease in gloss, for improving the electroplating quality of a vertical continuous electroplating bath or a common electroplating bath and increasing the manufacturing yield. The electroplating device comprises an electroplating bath, a liquid supply part, a substrate hanging frame and a hanging frame moving part, the hanging frame moving part is arranged on the upper portion of the substrate hanging frame, and the substrate hanging frame is independently moved in the left-right direction and the front-back direction of the electroplating bath to change the position of a plated object in the electroplating bath or the separation distance between the liquid supply part and the plated object. The plated object can be moved along the front-back direction, the left-right direction and the up-down direction of the plating bath, and the whole plated object with aspect ratio difference or thickness difference is influenced by the liquid supply part through the spraying pressure of the liquid supply part.

Description

Technical Field

[0001] This invention relates to an electroplating apparatus for improving the electroplating quality and preventing gloss reduction of a workpiece within a vertical continuous electroplating tank or a conventional electroplating tank (Dip type). More specifically, it relates to an electroplating apparatus for improving the electroplating quality and preventing gloss reduction of a workpiece, wherein the workpiece is moved along the x-axis and y-axis of the electroplating tank within a vertical continuous electroplating tank or a conventional electroplating tank (Dip type) for electrolytic plating of copper (Cu), gold (Au), or nickel (Ni), etc., and a liquid supply section can be moved along the x-axis of the electroplating tank to spray pressure, so that the workpiece with aspect ratio differences or thickness differences is uniformly affected by the liquid supply section. Furthermore, within the electroplating tank, a shielding film located outside the dimensions of the workpiece constrains the flow of metal ions around the workpiece to prevent over-plating at the edges of the workpiece, thereby improving electroplating quality and increasing manufacturing yield. Moreover, by improving the space utilization of the same space, multiple electroplating lines can be set up, thus effectively applicable to multi-variety, small-batch production and mass production. Background Technology

[0002] Typically, in order to connect the layers of a PCB (Printed Circuit Board), through-holes and electroplating are required at the corresponding locations. In this case, since the hole wall is an insulator, electroless plating is preferred. After the hole wall is energized, electroplating is used to increase the thickness of the hole wall metal.

[0003] Electroplating methods include conventional electroplating equipment and vertical continuous electroplating equipment, each with its own advantages and disadvantages.

[0004] First, compared to vertical continuous electroplating equipment, conventional electroplating equipment has a significantly smaller plating bath volume, requiring less space and thus achieving higher space utilization. This allows for the installation of multiple plating units, enabling simultaneous electroplating of various products with different plating conditions to achieve high throughput. Furthermore, the smaller plating bath volume of conventional equipment allows for the use of relatively small amounts of dry bath chemicals and the installation of multiple plating units. Therefore, dry bath operations can be performed independently, and delivery delays due to dry bath chemical replenishment are relatively lower.

[0005] However, in conventional electroplating equipment, only a portion of the substrate area is affected by the liquid supply unit. Therefore, the electroplating quality, such as gloss and uniformity in perforated electroplating, is lower than that of vertical continuous electroplating equipment. In this system, the liquid supply unit forcefully sprays chemicals into the electroplating tank under pressure to remove air adhering to the substrate and maximize plating within the holes.

[0006] Vertical continuous electroplating equipment has characteristics that are the opposite of the advantages and disadvantages of ordinary electroplating equipment. That is, when the liquid supply section sprays, compared with ordinary electroplating equipment where only a part of the substrate area is affected, the entire area of ​​the substrate is affected. Therefore, in terms of electroplating quality such as electroplating gloss and uniform perforation plating, it has disadvantages such as reduced setup area, production capacity, reduced operability due to excessive use of dry bath chemicals, and the possibility of delivery delays.

[0007] Figure 1 Parts (a) and (b) are schematic diagrams illustrating a conventional electroplating apparatus, a conventional vertical continuous electroplating apparatus, and the area (glossy area) affected by the liquid supply section after electroplating performed by each apparatus. Part (a) illustrates the state of the conventional electroplating apparatus holding the substrate 1 in the electroplating tank 10 and the glossy area of ​​the substrate 1 after electroplating. Part (b) illustrates the state of the vertical continuous electroplating apparatus holding the substrate 1 in the electroplating tank 10 and the glossy area of ​​the substrate 1 after electroplating. As shown in the figures, compared to a conventional electroplating apparatus, the vertical continuous electroplating apparatus affects the entire area of ​​the substrate 1, thus effectively enabling the application of glossy and uniform perforated electroplating.

[0008] However, as Figure 2 As shown, in this conventional vertical continuous electroplating apparatus, the substrates 1 are arranged in a row within the electroplating tank 10, and the pipelines are longer than those in ordinary electroplating apparatuses. Therefore, ample installation space is required, resulting in very low space utilization. Furthermore, as the number of substrates that can be manufactured decreases, the manufacturing yield will also decrease. Moreover, for companies producing a wide variety of products in small quantities, the electroplating conditions for each product are different, making it impossible to simultaneously perform electroplating processes using this type of vertical continuous electroplating apparatus, potentially leading to delivery-related problems.

[0009] Furthermore, this type of vertical continuous electroplating equipment requires the addition of large amounts of dry bath chemicals, thus presenting significant operational disadvantages. With dry bath chemicals, only the chemicals consumed during electroplating require additional dry bath treatment; however, the chemicals themselves have a shelf life, necessitating periodic overall replenishment.

[0010] Related to this, such as Figure 3 As shown, the Korean Patent No. 10-2539090 (title: Vertical Continuous Electroplating Apparatus with Adjustable Displacement of Plated Object, hereinafter referred to as "Patent Document 1") developed by the applicant, by placing the substrate 1, which is the plated object, in the electroplating tank 10 in an adjustable angle manner, can increase the manufacturing yield and improve the quality by maximizing the workload of the plated object in the electroplating tank and the effect of the liquid supply section. Furthermore, as the plated object moves forward and backward, the size of the electroplating tank can be reduced by gradually moving forward and extending the total moving distance. As a result, multiple electroplating lines can be set up, which is beneficial for multi-variety and small-batch production.

[0011] According to Patent Document 1, although the liquid supply unit can be improved compared to existing electroplating apparatuses, the workpiece can only move back and forth (see reference). Figure 3 (In the direction of the arrow), gradually move forward or backward, such as... Figure 4 As shown, for the separation distance between the plated object and the liquid supply section, the thinner plated object (a) is larger than the thicker plated object (b), thus resulting in a relatively lower influence 2 from the liquid supply section. For example, the thickness of a typical PCB ranges from 0.4mm to over 8.5mm. Since the thickness of each product varies, differences in PCB thickness can lead to differences in electroplating quality. That is, when located in the center of the electroplating tank, the PCB can only be plated along the front-to-back direction (refer to...). Figure 3 The device moves (in the direction of the arrow) gradually forward or backward, so that the hole surface can withstand the least liquid supply effect in the center of the PCB thickness. During electroplating, where the liquid supply is used to achieve a glossy and uniform through-hole plating effect, the most vulnerable part of the PCB thickness, the center hole portion, needs to withstand more of the liquid supply effect; however, this is not the case in existing devices.

[0012] On the other hand, in order to solve the problem of Patent Document 1, in Korean Patent Application No. 10-2024-0017277 (Title: Vertical Continuous Electroplating Apparatus for Adjusting Electroplating Deviation Based on Difference in Thickness of the Substrate), developed by the applicant and currently pending, such as Figure 5 As shown, the substrate 1 is disposed in the electroplating tank 10 in a displaceable manner. It can move along the length direction (left-right direction in the figure) and width direction (front-back direction in the figure) of the electroplating tank. For the workpiece with thickness differences, the influence of the liquid supply section is made uniform. By maximizing the workload of the workpiece in the electroplating tank and the effect of the liquid supply section, the manufacturing yield and quality can be increased. Furthermore, multiple electroplating lines can be set up by reducing the size of the electroplating tank, so that it can be effectively applied to the production of multiple varieties in small quantities.

[0013] However, as this technology is only applicable to vertical continuous electroplating equipment, it cannot be applied to ordinary electroplating equipment, which has limitations in terms of application. Therefore, it is necessary to develop a technology that can be applied to ordinary electroplating equipment, which can increase the workload of the workpiece in the electroplating tank and maximize the effect of the liquid supply section to achieve increased manufacturing yield and quality improvement.

[0014] Existing technical documents

[0015] Patent documents

[0016] Patent Document 1: KR10-2539090B1 (Announced on June 2, 2023) Summary of the Invention

[0017] This invention addresses the problems described above. The technical objective of this invention is to provide an electroplating apparatus for improving the electroplating quality of the plated object and preventing a decrease in gloss, in a vertical continuous electroplating bath or a conventional electroplating bath (Dip) for electrolytic plating of copper (Cu), gold (Au), or nickel (Ni). The workpiece moves within the electroplating tank in all directions: left and right (length direction, such as the x-axis), front and back (width direction, such as the y-axis), and up and down (depth direction, such as the z-axis). Pressure jetting is performed by a liquid supply section with nozzles of varying diameters or intensities, ensuring that workpieces with aspect ratio or thickness differences are affected by the liquid supply section as a whole. This maximizes the effectiveness of the liquid supply section. A variable shielding film (adjustable in size according to the workpiece size) can be installed in the electroplating tank, except at a location other than the workpiece size, to block the flow of metal ions around the workpiece. This improves electroplating quality and increases manufacturing yield by preventing gloss reduction caused by over-plating at the edges of the workpiece. Furthermore, multiple electroplating lines can be set up by improving the space utilization of the same area, making it effective for multi-variety, small-batch production and mass production.

[0018] To achieve the aforementioned objective, an electroplating apparatus according to one embodiment of the present invention for improving the electroplating quality of a plated object and preventing gloss reduction includes: an electroplating tank for filling with an electroplating solution; a supply unit, the upper end of which is supported by a supply unit bracket and movably disposed inside the side wall of the electroplating tank, connected via a connecting pipe to a circulation pump for drawing in and discharging the electroplating solution from the electroplating tank, and for high-pressure spraying the electroplating solution discharged from the circulation pump into the inner side of the electroplating tank; a substrate holder, which is mounted on the upper part of the electroplating tank and movable in the left-right and front-back directions, for holding the plated object so that the plated object moves in the left-right and front-back directions within the electroplating tank and is energized; and a holder moving part, disposed on the upper part of the substrate holder, which moves the substrate holder individually in the left-right and front-back directions of the electroplating tank to change the position of the plated object within the electroplating tank or the separation distance between the supply unit and the plated object.

[0019] In another embodiment of the present invention, the electroplating apparatus may further include a shielding film disposed in the electroplating tank at a distance from the front of the liquid supply section, and disposed at a position other than the size of the object to be plated, thereby preventing over-plating of the edges of the object to be plated by blocking the movement of metal ions due to the liquid supply section located at a position other than the size of the object to be plated.

[0020] This invention offers the following advantages: When a workpiece is moved along the x, y, and z axes of a vertical continuous electroplating tank or a standard dip-type electroplating tank for electroplating copper (Cu), gold (Au), or nickel (Ni), pressure jetting is performed by a liquid supply section with nozzles of different diameters or intensities arranged crosswise and moving left and right. This ensures that the workpiece, regardless of aspect ratio or thickness, is affected by the liquid supply section as a whole, thereby maximizing the effect of the liquid supply section. Furthermore, the flow of metal ions moving around the workpiece is blocked by a shielding film, thus preventing a decrease in gloss caused by over-plating at the edges of the workpiece, thereby improving electroplating quality and increasing manufacturing yield. Moreover, multiple electroplating lines can be set up by improving the space utilization of the same area, thus effectively applicable to multi-variety, small-batch production and mass production. Attached Figure Description

[0021] Figure 1 Parts (a) and (b) are schematic diagrams illustrating existing conventional electroplating apparatus and existing vertical continuous electroplating apparatus, respectively, and the affected area (glossy area) of the liquid supply section after electroplating by each apparatus.

[0022] Figure 2 A simplified top view of a series of substrates arranged in a conventional vertical continuous electroplating apparatus is shown as an example.

[0023] Figure 3 A simplified top view of the oblique arrangement of a substrate in an existing improved vertical continuous electroplating apparatus is shown as an example.

[0024] Figure 4 Parts (a) and (b) are reference diagrams used to illustrate the difference in the liquid supply section effect of the existing improved vertical continuous electroplating apparatus as the substrate thickness changes.

[0025] Figure 5 A perspective view of the main structure of the vertical continuous electroplating apparatus of the applicant's prior application, which allows for adjustment of electroplating deviations based on differences in the thickness of the plated object.

[0026] Figure 6 An example is shown in a perspective view of the structure of the electroplating apparatus of the present invention for improving the electroplating quality of the plated object and preventing the reduction of gloss.

[0027] Figures 7a to 7d Brief perspective views, top views, and detailed views are provided to select and illustrate the main parts of the invention.

[0028] Figure 8 To select and illustrate Figure 6 Detailed diagram of the nozzle structure of the liquid supply section.

[0029] Figure 9 To select and illustrate Figure 6 Detailed diagram of the masking film.

[0030] Figure 10 Parts (a) and (b) are enlarged cross-sectional photographs of the upper, middle and lower ends of the first and second sample substrates of the first embodiment of the present invention.

[0031] Figure 11 Parts (a) and (b) are magnified photographs of the surfaces of the third and fourth sample substrates of the second embodiment of the present invention. Detailed Implementation

[0032] Hereinafter, with reference to the accompanying drawings, we will describe in detail the structure, operation, and effects of an electroplating apparatus of preferred embodiments of the present invention for improving the electroplating quality of the plated object and preventing a decrease in gloss.

[0033] In this specification and claims, the terms or words used should not be limited to their ordinary or dictionary meanings. Based on the principle that the inventors can appropriately define the probability of terms in order to best describe their invention, they should be interpreted as meanings and concepts consistent with the technical spirit of the invention. Therefore, it should be understood that the embodiments described in this specification and the structures shown in the accompanying drawings are merely the most preferred embodiments of the invention, and at the time of filing this application, various equivalent technical solutions and modifications may exist that can replace them.

[0034] Figure 6 A perspective view of the structure of the electroplating apparatus of the present invention for improving the electroplating quality of the plated object and preventing the reduction of gloss is shown as an example. Figures 7a to 7d To illustrate and select simplified perspective views, top views, and detailed views of the main parts of the present invention, Figure 8 To select and illustrate Figure 6 Detailed diagram of the nozzle structure of the liquid supply section. Figure 9 To select and illustrate Figure 6 Detailed diagram of the shielding film, such as Figure 6 and Figures 7a to 7c As shown, the electroplating apparatus of the present invention for improving the electroplating quality of the workpiece and preventing gloss reduction may include an electroplating tank 110, a liquid supply unit 120, a substrate mounting bracket 130, and a mounting bracket moving part 140. In another embodiment, it may also include a masking film 150. In particular, these various embodiments of the present invention can be applied to electroplating apparatuses including an electroplating tank 110, wherein the electroplating tank 110 is provided with a liquid supply unit 120 for circulating the electroplating solution, removing air adhering to the workpiece, and maximizing electroplating within the holes.

[0035] The electroplating tank 110, as a container for filling the electroplating solution, refers to a conventional electroplating tank (dip type) or a vertical continuous electroplating tank used for electrolytically plating copper (Cu), gold (Au), or nickel (Ni) onto one or more objects 101. For example, in the case of copper (Cu) electroplating, such an electroplating tank 110 may have phosphorus-containing ball bags 102 on its left and right side walls for filling with phosphorus-containing copper balls 102a that act as a source. The tank may be filled with an electroplating solution containing sulfuric acid, copper sulfate, chloride ions, brighteners, wetting agents, etc. The electrodes used for energizing may be anodes made of phosphorus-containing copper balls or insoluble anodes made of iridium. In the case of gold (Au) or nickel (Ni) electroplating, individual ball bags or electrodes that perform the source function may be used, and of course, suitable electroplating solutions may be filled.

[0036] The liquid supply unit 120 is vertically spaced from the electroplating tank 110 by a four-corner frame-shaped liquid supply unit bracket 121 suspended on the upper part of the electroplating tank 110, and is located inside the front and rear side walls of the electroplating tank 110, spraying electroplating liquid into the electroplating tank 110 under high pressure. In this case, as... Figure 7b As shown, the liquid supply units 120 are arranged facing each other on the inner sides of the front, rear, or left and right side walls of the electroplating tank 110 to enhance the ability to remove air adhering to the workpiece 101 or to agitate, filter, and circulate the electroplating solution. For example... Figure 6 For example, in order to enable the liquid supply unit 120 to spray the electroplating solution under high pressure, a circulation pump 122 is provided on the lower side of the electroplating tank 110 for drawing in the electroplating solution in the electroplating tank 110 and discharging it to the outside. The circulation pump 122 is connected to a connecting pipe 123, and the end of the connecting pipe 123 is connected to the liquid supply unit 120, so that the liquid supply unit 120 sprays the electroplating solution under high pressure.

[0037] In particular, in the electroplating apparatus of the present invention, the liquid supply unit 120 is arranged inside the electroplating tank 110 in a manner that allows horizontal movement, so as to improve the electroplating effect on the pores of the workpiece 101 by agitation, filtration and circulation of the electroplating solution in the electroplating tank. For this purpose, as... Figure 6 and Figure 7aIn this example, the liquid supply unit 120 is supported by a liquid supply unit bracket 121 on the upper part of the electroplating tank 110, enabling it to move horizontally along the first x-axis direction (the left-right direction of the electroplating tank). It is vertically mounted on the liquid supply unit bracket 121, with the nozzle portion submerged in the electroplating solution within the electroplating tank 110. The liquid supply unit bracket 121 is supported on both sides of the base frame 141 of the mounting bracket moving part 140; specifically, both sides are supported by horizontal supports 141b of the base frame 141. A first motor 121a and a first cam 121b are provided on one side to provide the power required for horizontal movement along the first x-axis. Multiple first cylinders 121c reciprocate along the first x-axis between the liquid supply unit bracket 121 and the horizontal supports 141b. The liquid supply unit 120 can move horizontally along the first x-axis (left-right direction) through the rotational movement of the first motor 121a and the resulting linear movement of the first cam 121b and the reciprocating movement of the first cylinders 121c. The first x-axis is used to distinguish the x-axis that faces the left and right directions of the electroplating tank and has a different height from the second x-axis described later. In the following text, the x-axis direction refers to the left and right direction (or length direction) of the electroplating tank, the y-axis direction refers to the front and back direction (or width direction) of the electroplating tank, and the z-axis direction refers to the up and down direction of the electroplating tank.

[0038] Furthermore, in order to enable the liquid supply section 120 to move horizontally, the connecting pipe 123 is preferably made of a flexible material, which allows the liquid supply section support 121 to move horizontally flexibly, and can be easily bent and rolled without affecting the chemical agents used for electroplating copper (Cu), gold (Au) or nickel (Ni).

[0039] Specifically, the liquid supply section 120 is composed of a combination of different types of first nozzles 120a and second nozzles 120b, with different diameters of the injection ports or different injection pressures. The first nozzles 120a and second nozzles 120b are as follows: Figure 8 As shown, two or more nozzles with different nozzle diameters or spray pressures are arranged alternately, so that the different sizes of the holes in the workpiece 101 with different aspect ratios or thicknesses are uniformly applied to the entire workpiece by the spray pressure of the liquid supply section with different speeds or intensities. In this case, preferably, the inner diameter of the nozzle of each nozzle in the liquid supply section 120 of the present invention is 0.5 mm to 3.0 mm.

[0040] The substrate mounting bracket 130 is equipped with one or more clamps 131 for holding and fixing the substrate. The substrate to be plated 101 is held by the clamps 131 and moved from other processes to the upper part of the electroplating tank 110 and placed on a V-shaped saddle via an additional mounting bracket carrier (not shown), or it can be separated from the electroplating tank 110 and moved to other processes. The two ends of this substrate mounting bracket 130 are supported by V-shaped saddles 132. As the mounting bracket moving part 140 moves from the upper part of the electroplating tank 110 along the second x-axis (left-right direction) and y-axis (front-back direction), the substrate to be plated 101 moves and is energized within the electroplating tank 110 along the second x-axis (left-right direction) and y-axis (front-back direction). Similar to the first x-axis, the second x-axis is used to distinguish it from the first x-axis, which is parallel to the first x-axis at a different height.

[0041] like Figure 6 As shown, the mounting bracket moving part 140 includes a base frame 141, an upper bracket 142, left and right y-axis moving brackets 143, left and right y-axis drive cylinders 144, y-axis moving stage 145, y-axis moving stage 146, and left and right V-shaped saddle assemblies 147. The substrate mounting bracket 130 is moved separately along the second x-axis (left-right direction) and y-axis (front-back direction) of the electroplating tank 110 to change the position of the plated object 101 in the electroplating tank 110 or the separation distance between the liquid supply part 120 and the plated object 101.

[0042] like Figure 6 As shown, the base frame 141 consists of multiple vertical supports 141a and multiple horizontal supports 141b. The multiple vertical supports 141a are respectively arranged on the left and right sides in front and behind the electroplating tank in a left-right facing manner to support the vertical direction. The multiple horizontal supports 141b are horizontally connected to each vertical support along the front-back and left-right directions. The base frame 141 performs the function of supporting the movable part 140 of the hanging frame as a whole.

[0043] The upper supports 142 are vertically erected on the left and right horizontal supports 141b of the base frame 141, and are set at a predetermined distance back from the front in a left-right facing manner.

[0044] The y-axis moving brackets 143 are respectively set on the left and right sides, so that the middle part of the upper bracket 142 is horizontally connected along the front and back direction.

[0045] The y-axis drive cylinder 144 is arranged along the length direction at the lower part of the y-axis moving bracket 143 on the left and right sides, and is connected to the second motor 144a and the second cam 144b. It moves back and forth along the y-axis (front and back direction) of the electroplating tank in conjunction with the rotational movement of the second electrode 144a and the linear movement of the second cam 144b caused thereby. The cylinders are respectively arranged on the left and right sides.

[0046] The y-axis moving stage 145 is horizontally set at the top of the electroplating tank, and its two ends are vertically fixed to the left and right y-axis drive cylinders 144 respectively. Due to the simultaneous reciprocating motion of the left and right y-axis drive cylinders 144, it moves horizontally along the y-axis (front and back) of the electroplating tank.

[0047] like Figure 7c As shown in the detailed diagram of the main parts, the x-axis moving stage 146 is attached to the lower part of the y-axis moving stage 145 and is connected by the third motor 146a, the third cam 146b and the x-axis drive cylinder 146c. As it moves horizontally along the y-axis (front and back) of the electroplating tank together with the y-axis moving stage 145, it reciprocates along the second x-axis (left and right direction) of the electroplating tank by being linked with the linear motion of the third cam 146b caused by the rotational motion of the third motor 146a and the reciprocating motion of the x-axis drive cylinder 146c.

[0048] The V-shaped saddle assembly 147 is attached or hung on the left and right ends of the x-axis moving stage 146 in a detachable manner. The substrate mounting bracket 130 is supported on the left and right ends respectively so that it can move from a position higher than the liquid supply bracket 121 toward the second x-axis of the electroplating tank 110.

[0049] Although Figure 6 It is omitted in the text, but as Figure 7d As shown in the detailed drawing of the main parts, this mounting bracket moving part 140 may also include a z-axis moving stage 148.

[0050] like Figure 7d As shown, the z-axis moving stage 148 is attached to the upper part of the y-axis moving stage 145. With both ends supported by the upper bracket 142 in a way that allows for orthogonal lifting, it is connected by the fourth motor 148a, the fourth cam 148b and the z-axis drive cylinder 148c. It reciprocates along the z-axis (vertical direction) of the electroplating tank in conjunction with the linear motion of the fourth cam 148b caused by the rotational motion of the fourth motor 148a and the reciprocating motion of the z-axis drive cylinder 148c. Thus, the z-axis moving stage 148, together with the y-axis moving stage 145, the x-axis moving stage 146 and the substrate mounting bracket 130, reciprocates along the z-axis (vertical direction) of the electroplating tank. For example, the fourth motor 148a and the fourth cam 148b can be fixed to the top using an additional auxiliary bracket 148d. In this case, the mounting bracket moving part 140 can make the substrate mounting bracket 130 move along the x-axis, y-axis and z-axis directions on the upper part of the electroplating tank 110.

[0051] Therefore, the mounting bracket moving part 140 causes the substrate mounting bracket 130 to move along the x-axis (left-right direction), y-axis (front-back direction), and z-axis (up-down direction) according to the size or thickness of the object to be plated 101, or along the xy plane, yz plane, and xz plane. By adjusting the position of the object to be plated 101 in the electroplating tank or the spacing between the liquid supply part 120 and the object to be plated 101, the object to be plated in the electroplating tank can be uniformly affected by the liquid supply part, thereby reducing the electroplating deviation of the object to be plated 101.

[0052] The first motor 121a, second motor 144a, fourth motor 146a, and fourth motor 148a of the mounting bracket moving part 140 are additionally equipped with detachable reducers, which allow each moving stage to move within a range of 0 mm / sec to 500 mm / sec in the left-right, forward-backward, or up-down direction. Based on the size or thickness value of the object to be plated 101 input by the user, a motor control unit may also be included to input drive signals to each motor to cause the substrate mounting bracket 130 to move along the x-axis, y-axis, and z-axis or along the xy-plane, yz-plane, and xz-plane.

[0053] Therefore, as the electroplating apparatus of the present invention causes the substrate holder 130 to move up and down (height direction of the electroplating tank), left and right (length direction of the electroplating tank), and back and forth (width direction of the electroplating tank) or along the xy plane, yz plane, and xz plane at the upper part of the electroplating tank 110, the effect of the liquid supply section can be improved by adjusting the position of the workpiece 101 in the electroplating tank 110 or the distance between the liquid supply section 120 and the workpiece 101. Furthermore, the effect of the liquid supply section can be maximized by moving the liquid supply section 120 together along the left and right (length direction of the electroplating tank).

[0054] A masking film 150 is disposed inside the electroplating tank 110, in front of the liquid supply section 120, spaced apart from the liquid supply section 120, and positioned outside the dimensions of the object to be plated 101. It prevents over-plating of the edges of the object 101 by blocking metal ions from moving through the liquid supply section 120 located outside the dimensions of the object. This masking film 150 can be moved horizontally via a four-corner frame-shaped masking plate holder 151 that is hung at both ends on the V-shaped saddle assembly 147. Figure 7a and Figure 7b As shown, the components are respectively installed in the front and rear directions of the substrate mounting bracket 130 to block the flow of electroplating liquid due to the high pressure sprayed from the liquid supply section 120 installed on the inner side wall of the front and rear sides of the electroplating tank 110.

[0055] like Figure 9As shown, this masking film 150 is composed of multiple masking plates 150a and 150b, and is provided with multiple fastening components 153, so that the multiple masking plates 150a and 150b are fastened to the masking plate hanger 151 in a horizontally movable manner. This masking film 150 can be arranged in pairs on the left and right sides of the electroplating tank 110 and / or arranged in pairs facing each other in front and behind the substrate hanger 130 in the electroplating tank 110.

[0056] Specifically, such as Figure 9 As shown, in this masking film 150, masking plate fixing holes 151a for fixing and horizontally moving multiple masking plates 150a, 150b are rectangularly formed along the length direction in the main body of the masking plate hanger 151. Rectangular fastening member through holes 150c are formed at the upper end of each masking plate 150a, 150b. Multiple masking plates 150a, 150b are continuously assembled together in the masking plate fixing holes 151a and fastening member through holes 150c of the masking plate hanger 151 via multiple fastening members 153. Therefore, in order to adjust the width or size according to the size of the object to be coated 101, the masking film 150 can be foldable, by folding (see reference...). Figure 9 (on the right side) or expand (see reference) Figure 9 Multiple shielding plates 150a and 150b (on the left side) are used to adjust the overall width or size of each shielding film.

[0057] The following describes comparative examples and embodiments of the present invention.

[0058] The comparative examples and embodiments described are merely examples of the present invention. It will be apparent to those skilled in the art that the scope of the present invention should not be construed as limited to such comparative examples and embodiments.

[0059] Example 1: Comparison of electroplating quality within holes based on nozzle structure and substrate movement in the liquid supply section.

[0060] (a1) Prepare electroplating tank A with a 1.5mm nozzle orifice and electroplating tank B with 1.0mm and 1.5mm nozzle orifices arranged alternately. Add 120g / L sulfuric acid, 60g / L copper sulfate, 45ppm chloride ions, 2ml / L brightener, and 20ml / L wetting agent to electroplating solutions A and B respectively to form electroplating solutions with the same composition and conditions. The bath temperature for each electroplating solution A and B is 22℃, and the current density is 0.8A / dm³. 2 The electroplating time was 350 minutes, and the anode was made of phosphorus copper balls as the electroplating condition.

[0061] (a2) Prepare substrate 1 and substrate 2 with a thickness of 6.2 mm and a size of 410*340 mm by a perforation process to form electroplated holes with a hole thickness of 0.15 mm (aspect ratio 41:1).

[0062] (a3) Substrate 1 and substrate 2 were placed in electroplating tank A and electroplating tank B, respectively. In electroplating tank A, substrate 1 was subjected to vibration and shock only while in a static state for electroplating. In electroplating tank B, substrate 2 was moved back and forth at a speed of 50 mm / min and then moved left and right at a speed of 20 mm / sec while vibration and shock were applied for electroplating. Thus, sample substrate 1 of Comparative Example 1 and sample substrate 2 of Example 1 with electroplated layers were prepared. Subsequently, cross-sections of the electroplated layers of sample substrate 1 and sample substrate 2 were magnified and photographed using a microscope.

[0063] Figure 10 Parts (a) and (b) are magnified cross-sectional photographs of the upper, middle, and lower ends of sample substrate 1 and sample substrate 2, respectively. From this, it can be seen that, compared to... Figure 10 The case of Comparative Example 1 shown in part (a) (using a nozzle in a static state, with a hole plating thickness of approximately 13 μm), Figure 10 The embodiment 1 shown in part (b) (using the electroplating apparatus of the present invention, using two nozzles to move the substrate back and forth along the length direction of the electroplating tank while moving the substrate left and right along the width direction of the electroplating tank to form an electroplating layer, with a hole electroplating thickness of about 27 μm) can significantly and effectively adjust the influence of the liquid supply section. In addition to the electroplating layer at the upper and lower ends of the hole, the electroplating layer thickness in the middle part is also good, and the electroplating time is also reduced by half.

[0064] Example 2: Comparison of electroplating quality inside holes based on whether or not a masking film is used.

[0065] (a1) Prepare electroplating tanks C and D, each equipped with a supply section containing nozzles of 1.0 mm and 1.5 mm diameter. Add 120 g / L sulfuric acid, 60 g / L copper sulfate, 45 ppm chloride ions, 2 ml / L brightener, and 20 ml / L wetting agent to electroplating solutions C and D respectively to form electroplating solutions with identical composition and conditions. For each electroplating solution C and D, a bath temperature of 22℃ and a current density of 0.8 A / dm³ are established. 2 The electroplating time is 350 minutes. The anode is made of phosphorus copper balls and moves back and forth at a speed of 50 mm / min and back and forth at a speed of 20 mm / sec. Vibration and shock are applied as electroplating conditions.

[0066] (a2) Prepare substrate 3 and substrate 4 with electroplated holes of 0.15 mm in diameter, 1.6 mm in thickness, and 410*340 mm in size by a perforation process.

[0067] (a3) Substrate 3 and substrate 4 were placed in electroplating tank C and electroplating tank D respectively. In electroplating tank C, substrate 3 was electroplated without a masking film. In electroplating tank D, substrate 4 was electroplated after a masking film was placed at a position other than the substrate size. Thus, the sample substrate 3 of Comparative Example 2 and the sample substrate 4 of Example 2 with electroplated layers were prepared. Subsequently, the electroplated surfaces of sample substrate 3 and sample substrate 4 were magnified and photographed respectively.

[0068] Figure 11 Parts (a) and (b) are magnified photographs of the surfaces of the sample substrate 3 and sample substrate 4 in the second embodiment of the present invention. Figure 11 As can be seen in Comparative Example 2 shown in part (a), due to excessive electroplating at the substrate edge, not only is the gloss reduced, but the reduction in gloss extends from the substrate edge to the inner side. Figure 11 As can be seen in Example 2 (using the electroplating apparatus of the present invention with a masking film) shown in part (b), the overall electroplating is clean and neat, and has a glossy finish, because there is no over-plating.

[0069] According to the present invention as described above, when a workpiece is moved along the front-to-back and left-to-right sides of a vertical continuous electroplating tank or a conventional electroplating tank (Dip type) for electrolytic plating of copper (Cu), gold (Au), or nickel (Ni), pressure jetting is performed by a liquid supply section with nozzles of different diameters or intensities arranged in a crisscross pattern and moving left-to-right, so that the workpiece with aspect ratio differences or thickness differences is affected by the liquid supply section as a whole, thereby maximizing the effect of the liquid supply section.

[0070] Furthermore, according to the present invention, a shielding film of adjustable size is provided in the electroplating tank at a position other than the size of the object to be plated. Therefore, the flow of metal ions moving around the object to be plated can be blocked. Thus, the electroplating quality can be improved and the manufacturing yield can be increased by preventing the reduction of gloss caused by over-plating at the edge of the object to be plated. Moreover, multiple electroplating lines can be set up by improving the space utilization of the same space. Therefore, it can be effectively applied to multi-variety small-batch production and mass production.

[0071] While the present invention has been described above with reference to specific embodiments and accompanying drawings, it is not limited to these embodiments. Those skilled in the art can make various modifications and variations based on the described content. Therefore, the concept of the present invention is only understood based on the following claims, and equivalent technical solutions or variations fall within the scope of the present invention.

Claims

1. An electroplating apparatus for improving the electroplating quality of a plated object and preventing a decrease in gloss, characterized in that, include: Electroplating tank, used to fill electroplating solution; The liquid supply unit is supported at its upper end by a liquid supply unit bracket located at the upper part of the electroplating tank. It is installed inside the side wall of the electroplating tank in a manner that allows it to move along the left and right direction of the electroplating tank. It is connected to a circulation pump for sucking in and discharging electroplating liquid from the electroplating tank via a connecting pipe. The electroplating liquid discharged from the circulation pump is sprayed at high pressure into the inside of the electroplating tank. The left and right direction is the x-axis direction. A substrate mounting bracket is suspended on the upper part of the electroplating tank in a manner that allows it to move along the left-right and front-back directions of the electroplating tank. It holds the object to be plated, enabling it to move and be energized within the electroplating tank along the left-right and front-back directions, where the left-right direction is the x-axis and the front-back direction is the y-axis. The mounting bracket movable part is provided on the upper part of the substrate mounting bracket. It can move the substrate mounting bracket independently along the left-right direction and the front-back direction of the electroplating tank to change the position of the object to be plated in the electroplating tank or the separation distance between the liquid supply part and the object to be plated. The movable part of the mounting bracket includes: The base frame consists of multiple vertical supports and multiple horizontal supports. The multiple vertical supports are respectively arranged on the left and right sides in front and behind the electroplating tank in a left-right facing manner to support the vertical direction. The multiple horizontal supports are horizontally connected to each vertical support along the front-back direction and the left-right direction. The upper supports are vertically erected on the left and right horizontal supports of the base frame, and are set at a specified distance back from the front in a left-right facing manner; The left and right y-axis moving brackets make the middle part of the upper bracket horizontally connected along the front and back direction; Left and right y-axis drive cylinders are set at the lower part of the left and right y-axis moving brackets along the length direction and are connected to the second motor and the second cam. They move back and forth along the front and back direction of the electroplating tank in conjunction with the rotational movement of the second motor and the linear movement of the second cam caused thereby. The front and back direction is the y-axis direction. The y-axis moving stage is horizontally set at the top of the electroplating tank, with its two ends fixed to the left and right y-axis drive cylinders respectively. It moves horizontally along the front-back direction of the electroplating tank due to the simultaneous reciprocating motion of the left and right y-axis drive cylinders. The front-back direction is the y-axis direction. The x-axis moving stage, coupled to the lower part of the y-axis moving stage, is connected via a third motor, a third cam, and an x-axis drive cylinder. As it moves horizontally along the front-back direction of the electroplating tank together with the y-axis moving stage, it reciprocates along the second x-axis direction of the electroplating tank through a linkage between the linear motion of the third cam caused by the rotational motion of the third motor and the reciprocating motion of the x-axis drive cylinder. The front-back direction of the electroplating tank is the y-axis direction, and the second x-axis is an x-axis pointing towards the left-right direction of the electroplating tank and with a different height than the first x-axis. The left and right V-shaped saddle assemblies are detachably mounted on the x-axis moving stage, and the left and right sides respectively support the substrate mounting brackets so that they can move from a position higher than the liquid supply section bracket toward the second x-axis of the electroplating tank. The substrate holder can be moved separately along the second x-axis and y-axis of the electroplating tank to change the position of the object to be plated in the electroplating tank or the distance between the liquid supply unit and the object to be plated.

2. The electroplating apparatus for improving the electroplating quality and preventing gloss reduction of the plated object according to claim 1, characterized in that, The electroplating tank is one of a general electroplating tank or a vertical continuous electroplating tank used for electroplating copper, gold or nickel on one or more objects.

3. The electroplating apparatus for improving the electroplating quality and preventing gloss reduction of the plated object according to claim 1, characterized in that, The liquid supply section is separated from the electroplating tank by a liquid supply section bracket at the same intervals along the vertical direction. A first nozzle and a second nozzle with different diameters or injection pressures are arranged adjacent to each other in the liquid supply section.

4. The electroplating apparatus for improving the electroplating quality and preventing gloss reduction of an object according to claim 1, characterized in that, In order to enhance the ability to remove air adhering to the object being plated, or to agitate, filter, and circulate the electroplating solution, the liquid supply units are arranged facing each other on the inner sides of the front and rear side walls of the electroplating tank.

5. The electroplating apparatus according to claim 1 for improving the electroplating quality of the plated object and preventing gloss reduction, characterized in that, The liquid supply unit is connected to the circulation pump via a flexible connecting pipe, enabling the liquid supply unit support to move flexibly.

6. The electroplating apparatus according to claim 1 for improving the electroplating quality of the plated object and preventing gloss reduction, characterized in that, The liquid supply bracket is supported on both sides by the mounting bracket moving part. On one side, there is a first motor, a first cam, and multiple cylinders that reciprocate along the first x-axis to provide the power required for horizontal movement to the first x-axis. Horizontal movement toward the first x-axis is achieved by the rotational movement of the first motor, the linear movement of the first cam caused by it, and the reciprocating movement of the cylinders. The first x-axis is an x-axis that faces the left and right direction of the electroplating tank and has a different height than the second x-axis.

7. The electroplating apparatus according to claim 1 for improving the electroplating quality of the plated object and preventing gloss reduction, characterized in that, The mounting bracket moving part also includes a Z-axis moving stage, which is coupled to the upper part of the Y-axis moving stage. Supported by the upper bracket at both ends in a manner that allows for orthogonal lifting and lowering, the Z-axis moving stage is connected to a fourth motor, a fourth cam, and a Z-axis drive cylinder. It reciprocates along the Z-axis direction of the electroplating tank, in conjunction with the linear motion of the fourth cam caused by the rotational motion of the fourth motor and the reciprocating motion of the Z-axis drive cylinder. The Z-axis direction is the vertical direction. This allows the substrate mounting bracket to move along the x-axis, y-axis, and z-axis directions at the top of the electroplating tank.

8. The electroplating apparatus according to claim 1 for improving the electroplating quality of the plated object and preventing a decrease in gloss, characterized in that, It also includes a shielding film, which is disposed in front of the liquid supply section inside the electroplating tank, spaced apart from the liquid supply section, and located outside the size of the object to be plated. It prevents over-plating of the edges of the object by blocking the movement of metal ions due to the liquid supply section located outside the size of the object to be plated.

9. The electroplating apparatus according to claim 8 for improving the electroplating quality of the plated object and preventing gloss reduction, characterized in that, The shielding film is arranged in pairs on the left and right sides inside the electroplating tank.

10. The electroplating apparatus for improving the electroplating quality and preventing gloss reduction of an object according to claim 8, characterized in that, The shielding films are arranged in pairs facing each other on the front and back sides inside the electroplating tank.

11. The electroplating apparatus for improving the electroplating quality and preventing gloss reduction of an object according to claim 8, characterized in that, The shielding film includes: The shielding plate mounting bracket is in the shape of a quadrilateral frame, with both ends hanging on the V-shaped saddle assembly of the electroplating tank; Multiple shielding plates, supported and fixed by the shielding plate holder in a manner that allows them to move horizontally along the x-axis of the electroplating tank, are respectively arranged in the front and rear directions of the substrate holder to block the flow of electroplating liquid due to high pressure sprayed from the liquid supply sections respectively located on the inner sides of the front and rear side walls of the electroplating tank; and Multiple fastening components allow the multiple shielding panels to be fastened to the shielding panel mounting bracket in a manner that enables horizontal movement.

12. The electroplating apparatus for improving the electroplating quality and preventing gloss reduction of an object according to claim 11, characterized in that, The shielding film has rectangular fastening component through holes formed laterally at the upper end of each shielding plate. Rectangular mounting holes for the shielding panels are formed along the length of the shielding panel mounting bracket. The shielding film is a foldable type that can adjust the overall width or size of the shielding film by folding or unfolding multiple shielding plates, so that the width or size can be adjusted according to the size of the object to be coated by through holes of fastening components, fixing holes of shielding plates and multiple fastening components.

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