Large-range nanostructure surface imprinting method based on normal force control

Abstract

The invention discloses a large-range nanostructure surface imprinting method based on normal force control, and belongs to the technical field of nanostructure surface processing. The method comprises the following steps: leveling the surface of the structured pressure head and the surface of a workpiece; normal force control imprinting is carried out; carrying out in-situ detection, and evaluating the quality of the imprinting processing; and if the evaluated quality error exceeds a value, repeating the steps until the error is within a specified range, and then carrying out large-range imprinting until the processing is finished. The problems that an existing pressure head is single in geometrical configuration, poor in complex surface adaptability and poor in morphology defect caused by edge interference during large-range machining are solved, the manufacturing cost of a large-range nano-structure surface is reduced, and an industrialized solution is provided for high-precision nano functionalization of a complex curved surface substrate in the fields of energy, electronics and the like.

Description

Technical Field

[0001] This invention relates to a method for imprinting large-scale nanostructure surfaces based on normal force control, belonging to the field of nanostructure surface processing technology. Background Technology

[0002] In the fields of energy, electronics, and information, the demand for efficient and high-precision processing of large-scale nanostructured surfaces is increasingly prominent. Currently, mainstream nanofabrication methods such as photolithography, electron beam processing, and ion beam processing, while capable of manufacturing micro- and nanoscale structures, are limited by technical bottlenecks such as high equipment costs, low processing efficiency, and limited material applicability, making it difficult to meet the industrial processing needs of large-scale nanostructured surfaces. Overcoming these technical limitations to achieve efficient and high-precision processing of large-scale nanostructured surfaces has become a key technical problem urgently needing to be solved in this field.

[0003] Nanoindentation technology, as an important method for testing the properties of micro- and nano-scale materials, has been widely used in materials science, chemistry, and biomedicine. It involves using a diamond indenter to press into the surface of a specimen to create an indentation through plastic deformation, and can essentially be considered a nanostructure processing method. However, existing nanoindentation techniques suffer from the following significant drawbacks:

[0004] Firstly, the use of standardized diamond indenters results in a single shape for the imprinted structure, making it difficult to process complex nanostructures.

[0005] Secondly, the efficiency of a single imprint is low, which cannot meet the high-efficiency processing requirements of a large surface area.

[0006] Third, interference caused by material compression between adjacent indentation points can easily lead to problems such as incomplete edge replication and inconsistent imprinting depth, which seriously affects the processing quality of nanostructure arrays;

[0007] Fourth, the fixed geometry of the single-tip indenter makes it difficult to adapt to the processing requirements of complex curved or irregular surfaces, thus limiting its application in diverse micro-nano processing scenarios.

[0008] In summary, existing nanofabrication technologies and nanoindentation methods have significant shortcomings in terms of processing efficiency, structural complexity, processing range, and processing quality. There is an urgent need to develop a new method that can achieve efficient and high-precision imprinting on a wide range of complex nanostructure surfaces. Summary of the Invention

[0009] To address the problems existing in the background art, the present invention provides a method for large-scale nanostructure surface imprinting based on normal force control.

[0010] To achieve the above objectives, the present invention adopts the following technical solution: a method for imprinting large-scale nanostructure surfaces based on normal force control, wherein the imprinting method is performed using an imprinting device, and the method includes the following steps:

[0011] S1: Level the structured pressure head surface and the workpiece surface;

[0012] S101: Macroscopic leveling of the workpiece's large surface area is achieved through the three-point leveling method;

[0013] S10101: Controls the Z-axis micro-positioning stage to coarsely move from the starting point until the structured indenter contacts the workpiece surface; records the Z-axis coordinate when a force feedback signal is received. After the structured pressure head is lifted and reset, the workpiece is fed along the X-axis by controlling the distance. The structured pressure head repeatedly contacts the surface of the workpiece, and records the Z-axis coordinate when a force feedback signal appears. Based on the Z-axis coordinate and Z-axis coordinates Calculate the X-axis deflection angle :

[0014] (1)

[0015] S10102: Structured pressure head lifting and resetting, controlling the feed distance of the micro-force machining module along the Y direction. The structured pressure head repeatedly contacts the surface of the workpiece, and records the Z-axis coordinate when a force feedback signal appears. Based on the Z-axis coordinate and Z-axis coordinates Calculate the Y-axis deflection angle :

[0016] (2)

[0017] S10103: Based on the calibrated X-axis adjustment coefficients and Y-axis adjustment coefficients, and according to the X-axis deflection angle, the XY two-dimensional adjustment platform is used. and Y-axis deflection angle Adjust the large flat surface of the workpiece to be completely horizontal.

[0018] S102: Eliminate the torsion angle, deflection angle and pitch angle between the structured indenter and the workpiece, so that the surface of the structured indenter is parallel to the surface of the workpiece.

[0019] S10201: Single-point pressure testing of the workpiece using a structured pressure head;

[0020] S10202: After single-point pressure testing, the torsion angle between the indentation direction and the structured indenter orientation is measured using a CCD module. ;

[0021] S10203: The rotation mechanism of the control force measuring module drives the structured indenter to rotate, aligning the orientation of the structured indenter with the indentation direction and eliminating torsion angle. ;

[0022] S10204: Observe the pressure test surface using a CCD module and measure the X-axis projection length of the embossed pattern. and the Y-axis projection length of the embossed pattern Using geometric projection relationships to inversely deduce the pitch angle and deflection angle :

[0023] (3)

[0024] In formula (3):

[0025] Indicates the ideal length of the embossed pattern in the X direction;

[0026] Indicates the ideal length of the embossed pattern in the Y direction;

[0027] S10205: The pitch angle is adjusted via a two-degree-of-freedom rotation mechanism. and deflection angle Coarse adjustment to minimum;

[0028] S10206: Start the AFM module to scan the test surface and calculate the depth difference. :

[0029] (4)

[0030] In equation (4):

[0031] and This indicates the depth of two opposite points on the test surface of the workpiece;

[0032] S10207: Based on depth difference Calculate the deflection angle :

[0033] (5)

[0034] In equation (5):

[0035] This represents the horizontal distance between two opposite points on the test surface of the workpiece.

[0036] S10208: Repeat S10206 multiple times to obtain multiple depth differences. and the corresponding horizontal distance Then calculate the pitch angle :

[0037] (6)

[0038] S10209: Pitch angle is eliminated microscopically through a two-degree-of-freedom rotation adjustment mechanism. and deflection angle .

[0039] S103: Repeat S102 until the surface of the structured indenter is completely parallel to the surface of the workpiece.

[0040] S2: Perform normal force controlled imprinting;

[0041] S201: Set machining parameters, including target load. The stiffness coefficient K of the flexible hinge and the deformation of the flexible hinge ;

[0042] S202: The UMAC controller synchronously drives the X-axis positioning stage, Y-axis positioning stage, and Z-axis micron positioning stage to position the test pressure point.

[0043] S203: The UMAC controller sends an elongation command to the PZT actuator; at the same time, the Z-axis micro-positioning stage and the PZT actuator move downwards in a macro-micro combination, driving the structured pressure head to contact the surface of the workpiece, and the displacement sensor of the PZT actuator collects the elongation data in real time and feeds it back to the UMAC controller.

[0044] S204: When the displacement sensor of the force measuring module detects the deformation of the flexible hinge. At this time, the Z-axis micron positioning stage stops moving, and the PZT actuator continues to extend, driving the structured indenter to press into the workpiece. The normal force of the structured indenter... The displacement sensor in the force measurement module gradually increases the amount of deformation of the flexible hinge in real time. This information is then fed back to the UMAC controller to continuously calculate the current normal force.

[0045] S205: Real-time judgment of UMAC controller Is it true or false?

[0046] If the conditions are met, the UMAC controller sends a retraction command to the PZT actuator, the structured pressure head retracts upward, the flexible hinge gradually returns to its original shape, and the normal force decreases;

[0047] If the conditions are not met, the PZT actuator will continue to extend until the normal force reaches the target load.

[0048] S206: The UMAC controller lifts the pressure head off the workpiece surface via the Z-axis micron positioning stage.

[0049] S3: Conduct in-situ testing to assess the quality of this embossing process;

[0050] S301: The Y-axis positioning stage moves the CCD module above the indentation area, and the Z-axis micron positioning stage descends to focus, allowing the CCD module to acquire a large-area high-magnification image;

[0051] S302: Raise the Z-axis micrometer positioning stage, and the Y-axis positioning stage drives the CCD module to retract;

[0052] S303: The Y-axis positioning stage moves the AFM module above the indentation area and lowers the Z-axis micron positioning stage. The AFM module scans the surface of the workpiece to obtain the indentation depth distribution and surface three-dimensional morphology information.

[0053] S304: Correlate the AFM data obtained by the AFM module with the images acquired by the CCD module to generate a real-time mapping report of imprinting process parameters and morphological deviations, which is used to evaluate the quality of this processing.

[0054] S4: If the quality error assessed in S3 exceeds the value, repeat S1-S3 until the error is within the specified range, then perform large-scale imprinting until the processing is completed.

[0055] The large-area imprinting described in S4 includes the following steps:

[0056] S401: Core parameters are set via the main control computer, including: imprinting frequency. The X-axis splicing spacing dx, Y-axis splicing spacing dy, X-axis indentation row number M, and Y-axis indentation column number N are calculated, and the X-axis indentation speed is also calculated. and Y-axis imprinting speed :

[0057] (7)

[0058] S402: The UMAC controller synchronously drives the X-axis positioning stage, the Y-axis positioning stage, and the Z-axis micron positioning stage to position the target imprinting point in the first row and first column for imprinting.

[0059] S403: The X-axis positioning stage repeatedly feeds along the X-axis for i times along the X-axis splicing spacing dx until i=M, completing the imprinting from the first row and first column to the Mth column;

[0060] UMAC controller triggers Y-axis feed, Y-axis splicing spacing dy;

[0061] S404: Imprint the second row, Mth column to the first column in the X direction;

[0062] S405: After the UMAC controller triggers the Y-axis feed N times, it covers the M×N array and completes the large-scale nanostructure array processing on the surface of the metal workpiece.

[0063] The imprinting device of the present invention S1 includes an X-axis positioning stage, a Y-axis positioning stage, a Z-axis micron positioning stage, a transfer plate, a micro-force processing module, an XY two-dimensional adjustment platform, a rotary worktable, and a control system. A rotary worktable is mounted on the slider of the X-axis positioning stage, and an XY two-dimensional adjustment platform is mounted on the rotary worktable. The fixed end of the Y-axis positioning stage is mounted on a gantry frame, and the slider of the Y-axis positioning stage is orthogonally and fixedly connected to the fixed end of the Z-axis micron positioning stage. A transfer plate is mounted on the slider of the Z-axis micron positioning stage, and a CCD module, a micro-force processing module, and an AFM module are sequentially mounted on the transfer plate. The micro-force processing module is correspondingly arranged with the XY two-dimensional adjustment platform. The X-axis positioning stage, CCD module, Y-axis positioning stage, Z-axis micron positioning stage, micro-force processing module, AFM module, and rotary worktable are all connected to the control system for signal transmission. A digital microscope is mounted on the side of the X-axis positioning stage.

[0064] The micro-force processing module includes a PZT actuator, a force measuring module, a structured indenter, and a two-degree-of-freedom rotation adjustment mechanism. The two-degree-of-freedom rotation adjustment mechanism integrates a pitch angle adjustment controller and a yaw angle adjustment controller. The rear end of the two-degree-of-freedom rotation adjustment mechanism is fixedly connected to an adapter plate, and the adjustment end of the two-degree-of-freedom rotation adjustment mechanism is fixedly connected to the fixed end of the PZT actuator. The movable end of the PZT actuator is fixedly connected to the force measuring module, and the output end of the rotation mechanism of the force measuring module is fixedly connected to the structured indenter. The working end of the structured indenter is a diamond indenter with a planar nanostructure array, and the upper end of the structured indenter is connected to a flexible hinge.

[0065] The control system includes:

[0066] The main control computer is connected to the CCD module, UMAC controller and AFM controller for signal transmission. It is used to send processing instructions to the UMAC controller and receive its real-time feedback results, send detection commands to the AFM controller and receive its real-time feedback results, and receive the processing sample surface change signal input from the CCD module.

[0067] The UMAC controller is connected to the main control computer, X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micron positioning stage driver, rotary table driver, PZT actuator driver, displacement sensor of PZT actuator, and displacement sensor of force measurement module for signal transmission. It is used to receive machining instructions from the main control computer and then perform the following tasks:

[0068] Task 1: Send displacement commands to the X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micron positioning stage driver, and rotary table driver via the D / A module for machining;

[0069] Task 2: Receive the real-time positions of the X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micrometer positioning stage driver, and rotary table and feed them back to the main control computer;

[0070] Task 3: Send commands to the PZT actuator driver via the D / A module;

[0071] Task 4: Receive displacement sensor signals from the force measurement module and the PZT actuator via the A / D axis card and feed them back to the main control computer;

[0072] The AFM controller is connected to both the main control computer and the AFM module for signal transmission. It is used to receive detection commands from the main control computer, control the AFM module to perform detection, and feed back the test results of the AFM module to the main control computer in real time.

[0073] The PZT actuator driver is connected to both the UMAC controller and the PZT actuator for signal transmission. It is used to receive instructions from the UMAC controller and drive the PZT actuator to move, while feeding back the displacement sensor signal of the PZT actuator to the UMAC controller.

[0074] The X-axis positioning stage driver is connected to both the UMAC controller and the X-axis positioning stage for signal transmission. It is used to receive displacement commands from the UMAC controller and drive the X-axis positioning stage to move, while also feeding back the real-time position of the X-axis positioning stage to the UMAC controller.

[0075] The Y-axis positioning stage driver is connected to both the UMAC controller and the Y-axis positioning stage for signal transmission. It is used to receive displacement commands from the UMAC controller and drive the Y-axis positioning stage to move, while simultaneously feeding back the real-time position of the Y-axis positioning stage to the UMAC controller.

[0076] The Z-axis micrometer positioning stage driver is connected to both the UMAC controller and the Z-axis micrometer positioning stage for signal transmission. It is used to receive displacement commands from the UMAC controller and drive the Z-axis micrometer positioning stage to move, while feeding back the real-time position of the Z-axis micrometer positioning stage to the UMAC controller.

[0077] The rotary table driver is connected to both the UMAC controller and the rotary table via signal transmission. It is used to receive displacement commands from the UMAC controller and drive the rotary table to move, while also feeding back the real-time position of the rotary table to the UMAC controller.

[0078] The monitor is connected to the main control computer for signal transmission and is used to display relevant information.

[0079] Compared with the prior art, the beneficial effects of the present invention are:

[0080] This invention eliminates planar tilt error between the structured indenter and the workpiece through a three-point leveling method, ensuring consistent height of the imprinting reference surface. Real-time feedback of flexible hinge deformation enables precise control of the imprinting depth, avoiding over- or under-imprinting. The in-situ detection module (CCD+AFM) rapidly assesses imprinting quality and corrects process parameters through image correlation analysis. The large-scale splicing strategy, through alternating path planning of marching and column feeds, achieves efficient coverage processing of M×N arrays while maintaining single-point imprinting accuracy. This solves the problems of existing indenters' single geometric configuration, poor adaptability to complex surfaces, and morphological defects caused by edge interference during large-scale processing. It reduces the manufacturing cost of large-scale nanostructured surfaces and provides an industrially feasible solution for the high-precision nanofunctionalization of complex curved substrates in energy, electronics, and other fields. Attached Figure Description

[0081] Figure 1 This is a flowchart of the present invention;

[0082] Figure 2 This is a schematic diagram of the imprinting device;

[0083] Figure 3 This is a structural diagram of the micro-force processing module;

[0084] Figure 4 This is a schematic diagram illustrating the principle and implementation process of the three-point balancing method;

[0085] Figure 5 This is a flowchart of the structured pressure head leveling process;

[0086] Figure 6 This is a schematic diagram illustrating the principle of adjusting the orientation of the structured pressure head;

[0087] Figure 7 This is a schematic diagram of the structured pressure head deviation angle adjustment;

[0088] Figure 8 This is a schematic diagram of a CCD image of the pressure test surface;

[0089] Figure 9 This is a flowchart of the normal force controlled imprinting process;

[0090] Figure 10 This is a schematic diagram of a micro-force processing module;

[0091] Figure 11 This is a flowchart illustrating the workflow of the AFM module;

[0092] Figure 12 It is a flowchart of large-scale imprinting and splicing process;

[0093] Figure 13 This is a schematic diagram of a large-scale imprinting and splicing process;

[0094] Figure 14 This is a schematic diagram of the structured pressure head;

[0095] Figure 15 This is a schematic diagram of the fabrication process for a structured pressure head;

[0096] Figure 16 This is a block diagram of the control system. Detailed Implementation

[0097] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the invention, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0098] A method for imprinting large-scale nanostructures onto surfaces based on normal force control, wherein the imprinting method is performed using an imprinting device, and the method includes the following steps:

[0099] S1: Level the surface of the structured pressure head 16 with the surface of the workpiece 11;

[0100] S101: Macroscopic leveling of the large plane of workpiece 11 is achieved by the three-point leveling method;

[0101] S10101: Control the Z-axis micrometer positioning stage 5 to coarsely move from the starting point (coarse displacement). When the structured pressure head 16 contacts the surface of the workpiece 11, the Z-axis coordinate is recorded when a force feedback signal is generated. After the structured pressure head 16 is raised and reset, the workpiece 11 is fed along the X direction by a controlled distance. The structured pressure head 16 repeatedly contacts the surface of the workpiece 11, and records the Z-axis coordinate when a force feedback signal appears. Based on the Z-axis coordinate and Z-axis coordinates Calculate the X-axis deflection angle :

[0102] (1)

[0103] S10102: The structured pressure head 16 is raised and reset, controlling the feed distance of the micro-force processing module 7 along the Y direction. The structured pressure head 16 repeatedly contacts the surface of the workpiece 11, and records the Z-axis coordinate when a force feedback signal appears. Based on the Z-axis coordinate and Z-axis coordinates Calculate the Y-axis deflection angle :

[0104] (2)

[0105] S10103: Using the XY two-dimensional adjustment platform 9 (manual two-dimensional tilt stage), based on the calibrated X-axis adjustment coefficient (0.611347mm / deg) and Y-axis adjustment coefficient (0.633592mm / deg), according to the X-axis deflection angle... and Y-axis deflection angle Adjust the large flat surface of workpiece 11 to be completely horizontal.

[0106] S102: Eliminate the torsion angle, deflection angle and pitch angle between the structured indenter 16 and the workpiece 11, so that the surface of the structured indenter 16 is parallel to the surface of the workpiece 11, and ensure that the nanostructure array at the tip of the structured indenter 16 can be uniformly copied onto the surface of the workpiece.

[0107] S10201: Single-point pressure test is performed on workpiece 11 using structured pressure head 16;

[0108] S10202: After single-point pressure testing, the torsion angle between the indentation direction and the orientation of the structured indenter 16 is measured using CCD module 3. ;

[0109] S10203: The rotation mechanism of the control force measuring module 15 drives the structured indenter 16 to rotate, so that the orientation of the structured indenter 16 is consistent with the indentation direction, eliminating the torsion angle. ;

[0110] S10204: Observe the pressure test surface through CCD module 3 and measure the X-axis projection length of the embossed pattern. and the Y-axis projection length of the embossed pattern Using geometric projection relationships to inversely deduce the pitch angle and deflection angle :

[0111] (3)

[0112] In formula (3):

[0113] Indicates the ideal length of the embossed pattern in the X direction;

[0114] Indicates the ideal length of the embossed pattern in the Y direction;

[0115] S10205: The pitch angle is adjusted via the two-degree-of-freedom rotation adjustment mechanism 18. and deflection angle Coarse adjustment to minimum;

[0116] S10206: To further eliminate minor deflections, activate AFM module 8 to scan the test surface and calculate the depth difference. :

[0117] (4)

[0118] In equation (4):

[0119] and This indicates the depth of two opposite points on the test surface of the workpiece;

[0120] S10207: Based on depth difference Calculate the deflection angle :

[0121] (5)

[0122] In equation (5):

[0123] This represents the horizontal distance between two opposite points on the test surface of the workpiece.

[0124] S10208: Repeat S10206 multiple times to obtain multiple depth differences. and the corresponding horizontal distance Then calculate the pitch angle :

[0125] (6)

[0126] S10209: Pitch angle is eliminated microscopically through a two-degree-of-freedom rotation adjustment mechanism 18. and deflection angle .

[0127] S103: Based on the morphology of the indentation pattern generated by the embossing test, repeat S102 until the surface of the structured indenter 16 is completely parallel to the surface of the workpiece 11.

[0128] S2: Perform normal force controlled imprinting;

[0129] S201: Set machining parameters, including target load. The stiffness coefficient K of the flexible hinge and the deformation of the flexible hinge ;

[0130] S202: The UMAC controller synchronously drives the X-axis positioning stage 1, the Y-axis positioning stage 4, and the Z-axis micron positioning stage 5 to accurately position the test pressure point.

[0131] The micro-force machining module 7 is driven to move along the Y direction by the Y-axis positioning stage 4, so that the structured indenter 16 is positioned directly above the workpiece 11 under real-time observation by the digital microscope 2; the micro-force machining module 7 is driven to move downward along the Z direction by the Z-axis micro-positioning stage 5, so that the structured indenter 16 is close to the surface of the workpiece 11; when the tip of the structured indenter 16 coincides with its reflection on the surface of the workpiece 11 as observed by the digital microscope 2, the nano-machining program is started.

[0132] S203: The UMAC controller sends an elongation command to the PZT actuator 14; at the same time, the Z-axis micron positioning stage 5 and the PZT actuator 14 move downward in a combination of macro-micro motion, Z-axis coarse motion + PZT nano-level fine motion, driving the structured pressure head 16 to contact the surface of the workpiece 11, and the displacement sensor of the PZT actuator collects the elongation data in real time, which is fed back to the UMAC controller through the D / A module, forming a "command-execution-feedback" closed loop;

[0133] S204: When the displacement sensor of the force measuring module 15 detects the deformation of the flexible hinge. When the structured indenter 16 has contacted the surface of the workpiece 11, the Z-axis micron positioning stage 5 stops moving, and the PZT actuator 14 continues to extend to drive the structured indenter 16 to press into the workpiece 11. The normal force of the structured indenter 16... As the load increases, the displacement sensor in the force measurement module 15 collects the deformation of the flexible hinge in real time. And feeds back to the UMAC controller via the A / D axis card to continuously calculate the current normal force;

[0134] S205: Real-time judgment of UMAC controller Is it true or false?

[0135] If the conditions are met, the UMAC controller sends a retraction command to the PZT actuator 14, the structured indenter 16 retracts upward, the flexible hinge 17 gradually restores its original shape, and the normal force decreases; finally, the PZT actuator 14 completely stops outputting displacement, the structured indenter 16 returns to its initial position, and a single indentation processing cycle is completed.

[0136] If the conditions are not met, the PZT actuator 14 will continue to extend until the normal force reaches the target load.

[0137] S206: The UMAC controller lifts the pressure head through the Z-axis micron positioning stage 5, detaching it from the surface of the workpiece 11.

[0138] S3: Conduct in-situ testing to assess the quality of this embossing process;

[0139] S301: The Y-axis positioning stage 4 moves the CCD module 3 above the indentation area and lowers the Z-axis micron positioning stage 5 to focus, and the CCD module 3 acquires a large-area high-magnification image.

[0140] S302: Raise the Z-axis micron positioning stage 5, and the Y-axis positioning stage 4 drives the CCD module 3 to retract;

[0141] S303: The Y-axis positioning stage 4 moves the AFM module 8 above the indentation area and lowers the Z-axis micron positioning stage 5. The AFM module 8 scans the surface of the workpiece 11 to obtain the indentation depth distribution and surface three-dimensional morphology information.

[0142] S304: Correlate the AFM data obtained by AFM module 8 with the images acquired by CCD module 3 to generate a real-time mapping report of imprinting process parameters and morphological deviations, which is used to evaluate the quality of this processing.

[0143] In-situ testing can be used for leveling during processing and for quality inspection of samples after processing.

[0144] Before processing, the Y-axis positioning stage 4 is first moved, and the CCD module 3 is used to locate the target position. Then, the Y-axis positioning stage 4 is moved to the positioning position, and the Z-axis micro-positioning stage 5 is lowered to the target position to begin the imprinting process controlled by normal force. During processing, if an abnormal normal force occurs, the current processing coordinate position is recorded, the micro-force processing module 7 is quickly lifted, the Y-axis positioning stage 4 is moved, and the processing result is observed using the CCD module 3. If a large number of nanostructures are found to be incompletely replicated, it is determined that the indenter has adhered, and the indenter can be quickly replaced before returning to the previous processing position to continue processing. After processing is completed, the Z-axis micro-positioning stage 5 is lifted first, and then the Y-axis positioning stage 4 is moved. The CCD module 3 is moved above the processing target to characterize the processing result, find areas with significant deformation, and use the AFM module 8 for fine characterization to obtain its three-dimensional microstructure and depth distribution.

[0145] S4: If the quality error assessed in S3 exceeds the value, repeat S1-S3 until the error is within the specified range, then perform large-scale imprinting until the processing is completed.

[0146] The large-area imprinting described in S4 includes the following steps:

[0147] S401: Core parameters are set via the main control computer, including: imprinting frequency. The X-axis splicing spacing dx, Y-axis splicing spacing dy, X-axis indentation row number M, and Y-axis indentation column number N are calculated, and the X-axis indentation speed is also calculated. and Y-axis imprinting speed :

[0148] (7)

[0149] S402: The UMAC controller synchronously drives the X-axis positioning stage 1, the Y-axis positioning stage 4, and the Z-axis micron positioning stage 5 to position them to the target imprinting point in the first row and first column for imprinting.

[0150] S403: The X-axis positioning stage 1 repeatedly feeds along the X-axis to the X-axis splicing spacing dx i times until i=M, completing the imprinting from the first row and first column to the Mth column;

[0151] UMAC controller triggers Y-axis feed, Y-axis splicing spacing dy;

[0152] S404: Imprint the second row, Mth column to the first column in the X direction;

[0153] S405: After the UMAC controller triggers the Y-axis feed N times (serpentine splicing logic), it covers the M×N array and completes the large-scale nanostructure array processing on the surface of the metal workpiece.

[0154] The imprinting device of the present invention S1 includes an X-axis positioning stage 1, a Y-axis positioning stage 4, a Z-axis micron positioning stage 5, a transition plate 6, a micro-force processing module 7, an XY two-dimensional adjustment platform 9, a rotary worktable 10, and a control system. The rotary worktable 10 is mounted on the slider of the X-axis positioning stage 1, and the XY two-dimensional adjustment platform 9 is mounted on the rotary worktable 10. The fixed end of the Y-axis positioning stage 4 is mounted on a gantry frame, and the slider of the Y-axis positioning stage 4 is orthogonally fixedly connected to the fixed end of the Z-axis micron positioning stage 5. The transition plate 6 is mounted on the slider of the Z-axis micron positioning stage 5, and a CCD module 3, a micro-force processing module 7, and an AFM module 8 are sequentially mounted on the transition plate 6. The micro-force processing module 7 is correspondingly arranged with the XY two-dimensional adjustment platform 9. The X-axis positioning stage 1, CCD module 3, Y-axis positioning stage 4, Z-axis micron positioning stage 5, micro-force processing module 7, AFM module 8, and rotary worktable 10 are all connected to the control system for signal transmission. A digital microscope 2 is mounted on the side of the X-axis positioning stage 1.

[0155] The micro-force processing module 7 includes a PZT actuator 14, a force measuring module 15, a structured indenter 16, and a two-degree-of-freedom rotation adjustment mechanism 18. The two-degree-of-freedom rotation adjustment mechanism 18 integrates a pitch angle adjustment controller 12 and a yaw angle adjustment controller 13. The rear end of the two-degree-of-freedom rotation adjustment mechanism 18 is fixedly connected to the adapter plate 6, and the adjustment end of the two-degree-of-freedom rotation adjustment mechanism 18 is fixedly connected to the fixed end of the PZT actuator 14. The movable end of the PZT actuator 14 is fixedly connected to the force measuring module 15, and the output end of the rotation mechanism of the force measuring module 15 is fixedly connected to the structured indenter 16. The working end of the structured indenter 16 is a diamond indenter with a planar nanostructure array. The nanostructure array is fabricated on the surface of a standard diamond indenter using a focused ion beam method. The indenter period is T, the diameter is d, and the amplitude is H. A total of N×M tips form the structured indenter array. The shape of the nanostructure at the working end of the structured indenter 16 can be arbitrarily changed according to target requirements. Figure 2 The image shows the tip of a parabolic body, primarily used for fabricating microlens arrays. The upper end of the structured pressure head 16 is connected to a flexible hinge 17.

[0156] The control system includes:

[0157] The main control computer is connected to the CCD module 3, UMAC controller and AFM controller for signal transmission. It is used to send processing instructions to the UMAC controller and receive its real-time feedback results, send detection commands to the AFM controller and receive its real-time feedback results, and receive the processing sample surface change signal input from the CCD module 3.

[0158] The UMAC controller is connected to the main control computer, X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micron positioning stage driver, rotary table driver, PZT actuator driver, displacement sensor of PZT actuator, and displacement sensor of force measurement module 15 for signal transmission. It is used to receive machining instructions from the main control computer and complete the following tasks:

[0159] Task 1: Send displacement commands to the X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micron positioning stage driver, and rotary table driver via the D / A module for machining;

[0160] Task 2: Receive the real-time positions of the X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micrometer positioning stage driver, and rotary table and feed them back to the main control computer;

[0161] Task 3: Send commands to the PZT actuator driver via the D / A module;

[0162] Task 4: Receive displacement sensor signals from force measurement module 15 and PZT actuator via A / D axis card and feed them back to the main control computer;

[0163] The AFM controller is connected to both the main control computer and the AFM module 8 via signal transmission. It is used to receive detection commands from the main control computer, control the AFM module 8 to perform detection, and feed back the test results of the AFM module 8 to the main control computer in real time.

[0164] The PZT actuator driver is connected to both the UMAC controller and the PZT actuator 14 via signal transmission. It is used to receive instructions from the UMAC controller and drive the PZT actuator to move, while feeding back the displacement sensor signal of the PZT actuator to the UMAC controller.

[0165] The X-axis positioning stage driver is connected to the UMAC controller and the X-axis positioning stage 1 for signal transmission. It is used to receive displacement commands from the UMAC controller and drive the X-axis positioning stage 1 to move, while feeding back the real-time position of the X-axis positioning stage 1 to the UMAC controller.

[0166] The Y-axis positioning stage driver is connected to the UMAC controller and the Y-axis positioning stage 4 for signal transmission. It is used to receive displacement commands from the UMAC controller and drive the Y-axis positioning stage 4 to move, while feeding back the real-time position of the Y-axis positioning stage 4 to the UMAC controller.

[0167] The Z-axis micrometer positioning stage driver is connected to the UMAC controller and the Z-axis micrometer positioning stage 5 for signal transmission. It is used to receive displacement commands from the UMAC controller and drive the Z-axis micrometer positioning stage 5 to move, while feeding back the real-time position of the Z-axis micrometer positioning stage 5 to the UMAC controller.

[0168] The rotary table driver is connected to both the UMAC controller and the rotary table 10 via signal transmission. It is used to receive displacement commands from the UMAC controller and drive the rotary table 10 to move, while also feeding back the real-time position of the rotary table 10 to the UMAC controller.

[0169] The monitor is connected to the main control computer for signal transmission and is used to display relevant information.

[0170] This invention utilizes a structured indenter as an imprinting tool, enabling the fabrication of hundreds of nanostructures in a single pass, achieving a hundredfold increase in efficiency compared to single-tipped indenters. Furthermore, the nanostructures can be tailored to specific needs, taking shapes such as cylinders, parabolic curves, pyramids, and complex optical nanostructures, allowing for the fabrication of various structures on metal surfaces that are impossible with conventional indenters. This process elevates the machining capabilities of traditional micron-scale commercial diamond indenters to the nanoscale, while simultaneously ensuring high precision and consistency of the nanostructures on the processed surface.

[0171] This invention can completely level the plane of the indenter and the plane of the workpiece. The leveling process is relatively simple, does not require disassembling the sample, and does not require other auxiliary processes. It can effectively avoid problems such as incomplete imprinting and breakage of the nanostructure of the indenter due to tilting.

[0172] This invention can control the normal force between the indenter and the workpiece surface to precisely control the processing depth. Without complex procedures, the indenter can accurately follow the sample surface during the imprinting process. The displacement sensor in the force measuring module 15 can accurately detect deformation during processing, thereby providing feedback on load changes and avoiding problems such as scratching and indenter tilting.

[0173] This invention enables rapid assessment of embossing quality through in-situ detection, avoiding incomplete transfer of large-area structures due to indenter adhesion during processing. When indenters adhere, they can be quickly replaced to achieve continuous and stable processing, ensuring splicing accuracy after indenter replacement.

[0174] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0175] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A method for imprinting large-scale nanostructure surfaces based on normal force control, wherein the imprinting method is performed using an imprinting device, characterized in that: The method includes the following steps: S1: Level the surface of the structured pressure head (16) and the surface of the workpiece (11); S2: Perform normal force controlled imprinting; S3: Conduct in-situ testing to assess the quality of this embossing process; S4: If the quality error assessed in S3 exceeds the value, repeat S1-S3 until the error is within the specified range, then perform large-scale imprinting until the processing is completed.

2. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 1, characterized in that: S1 includes the following steps: S101: Macroscopic leveling of the large plane of workpiece (11) is achieved by the three-point leveling method; S102: Eliminate the torsion angle, deflection angle and pitch angle between the structured pressure head (16) and the workpiece (11) so that the surface of the structured pressure head (16) is parallel to the surface of the workpiece (11); S103: Repeat S102 until the surface of the structured indenter (16) is completely parallel to the surface of the workpiece (11).

3. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 2, characterized in that: S101 includes the following steps: S10101: Control the Z-axis micro-positioning stage (5) to coarsely move from the starting point to make the structured indenter (16) contact the surface of the workpiece (11). When a force feedback signal appears, record the Z-axis coordinate. After the structured pressure head (16) is lifted and reset, the workpiece (11) is controlled to feed along the X direction. The structured pressure head (16) repeatedly contacts the surface of the workpiece (11), and records the Z-axis coordinate when a force feedback signal appears. Based on the Z-axis coordinate and Z-axis coordinates Calculate the X-axis deflection angle : (1) S10102: The structured pressure head (16) is lifted and reset, controlling the feed distance of the micro-force processing module (7) along the Y direction. The structured pressure head (16) repeatedly contacts the surface of the workpiece (11), and records the Z-axis coordinate when a force feedback signal appears. Based on the Z-axis coordinate and Z-axis coordinates Calculate the Y-axis deflection angle : (2) S10103: Using the XY two-dimensional adjustment platform (9), based on the calibrated X-direction adjustment coefficient and Y-direction adjustment coefficient, according to the X-direction deflection angle... and Y-axis deflection angle Adjust the large plane of the workpiece (11) to be completely horizontal.

4. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 3, characterized in that: S102 includes the following steps: S10201: Single-point pressure test is performed on the workpiece (11) using a structured pressure head (16); S10202: After single-point pressure testing, the torsion angle between the indentation direction and the orientation of the structured indenter (16) is measured by the CCD module (3). ; S10203: The rotation mechanism of the control force measuring module (15) drives the structured indenter (16) to rotate, so that the orientation of the structured indenter (16) is consistent with the indentation direction, eliminating the torsion angle. ; S10204: Observe the test surface through the CCD module (3) and measure the X-direction projection length of the imprint pattern. and the Y-axis projection length of the embossed pattern Using geometric projection relationships to inversely deduce the pitch angle and deflection angle : (3) In formula (3): Indicates the ideal length of the embossed pattern in the X direction; Indicates the ideal length of the embossed pattern in the Y direction; S10205: The pitch angle is adjusted by a two-degree-of-freedom rotational adjustment mechanism (18). and deflection angle Coarse adjustment to minimum; S10206: Start the AFM module (8) to scan the test surface and calculate the depth difference. : (4) In equation (4): and This indicates the depth of two opposite points on the test surface of the workpiece; S10207: Based on depth difference Calculate the deflection angle : (5) In equation (5): This represents the horizontal distance between two opposite points on the test surface of the workpiece. S10208: Repeat S10206 multiple times to obtain multiple depth differences. and the corresponding horizontal distance Then calculate the pitch angle : (6) S10209: Pitch angle is eliminated microscopically through a two-degree-of-freedom rotation adjustment mechanism (18). and deflection angle .

5. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 1, characterized in that: S2 includes the following steps: S201: Set machining parameters, including target load. The stiffness coefficient K of the flexible hinge and the deformation of the flexible hinge ; S202: The UMAC controller synchronously drives the X-axis positioning stage (1), the Y-axis positioning stage (4) and the Z-axis micron positioning stage (5) to position them to the test pressure point; S203: The UMAC controller sends an elongation command to the PZT actuator (14); at the same time, the Z-axis micro-positioning stage (5) and the PZT actuator (14) move downwards in a macro-micro combination, driving the structured pressure head (16) to contact the surface of the workpiece (11), and the displacement sensor of the PZT actuator collects the elongation data in real time and feeds it back to the UMAC controller. S204: When the displacement sensor of the force measuring module (15) detects the deformation of the flexible hinge. At this time, the Z-axis micron positioning stage (5) stops moving, and the PZT actuator (14) continues to extend to drive the structured indenter (16) to press into the workpiece (11). The normal force of the structured indenter (16) As the force is gradually increased, the displacement sensor of the force measuring module (15) collects the deformation of the flexible hinge in real time. This information is then fed back to the UMAC controller to continuously calculate the current normal force. S205: Real-time judgment of UMAC controller Is it true or false? If the conditions are met, the UMAC controller sends a retraction command to the PZT actuator (14), the structured pressure head (16) retracts upward, the flexible hinge (17) gradually restores its original shape, and the normal force decreases; If the conditions are not met, the PZT actuator (14) will continue to be extended until the normal force reaches the target load; S206: The UMAC controller lifts the pressure head through the Z-axis micron positioning stage (5) to detach it from the surface of the workpiece (11).

6. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 5, characterized in that: S3 includes the following steps: S301: The Y-axis positioning stage (4) moves the CCD module (3) above the indentation area and lowers the Z-axis micron positioning stage (5) to focus, and the CCD module (3) acquires a large-area high-magnification image; S302: Raise the Z-axis micrometer positioning stage (5), and the Y-axis positioning stage (4) drives the CCD module (3) to retract; S303: The Y-axis positioning stage (4) moves the AFM module (8) above the indentation area and lowers the Z-axis micron positioning stage (5). The AFM module (8) scans the surface of the workpiece (11) to obtain the indentation depth distribution and surface three-dimensional morphology information. S304: The AFM data obtained by the AFM module (8) is correlated with the image acquired by the CCD module (3) to generate a real-time mapping report of the imprinting process parameters and morphological deviations, which is used to evaluate the quality of this processing.

7. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 6, characterized in that: The large-area imprinting described in S4 includes the following steps: S401: Core parameters are set via the main control computer, including: imprinting frequency. The X-axis splicing spacing dx, Y-axis splicing spacing dy, X-axis indentation row number M, and Y-axis indentation column number N are calculated, and the X-axis indentation speed is also calculated. and Y-axis imprinting speed : (7) S402: The UMAC controller synchronously drives the X-axis positioning stage (1), the Y-axis positioning stage (4) and the Z-axis micron positioning stage (5) to position the target imprinting point in the first row and first column for imprinting; S403: X-direction positioning stage (1) repeatedly feeds along the X direction i times for the X-direction splicing spacing dx until i=M, completing the imprinting from the first row and first column to the Mth column; UMAC controller triggers Y-axis feed, Y-axis splicing spacing dy; S404: Imprint the second row, Mth column to the first column in the X direction; S405: After the UMAC controller triggers the Y-axis feed N times, it covers the M×N array and completes the large-scale nanostructure array processing on the surface of the metal workpiece.

8. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 1, characterized in that: The imprinting device described in S1 includes an X-axis positioning stage (1), a Y-axis positioning stage (4), a Z-axis micrometer positioning stage (5), a transfer plate (6), a micro-force processing module (7), an XY two-dimensional adjustment platform (9), a rotary worktable (10), and a control system; the rotary worktable (10) is mounted on the slider of the X-axis positioning stage (1), and the XY two-dimensional adjustment platform (9) is mounted on the rotary worktable (10); the fixed end of the Y-axis positioning stage (4) is mounted on a gantry, and the slider of the Y-axis positioning stage (4) is orthogonally fixedly connected to the fixed end of the Z-axis micrometer positioning stage (5), and the Z-axis micrometer positioning stage (5) is fixedly connected to the fixed end of the Z-axis micrometer positioning stage (5). A transition plate (6) is installed on the slider of the positioning stage (5). A CCD module (3), a micro-force machining module (7), and an AFM module (8) are installed on the transition plate (6) in sequence. The micro-force machining module (7) is set in correspondence with the XY two-dimensional adjustment platform (9). The X-axis positioning stage (1), CCD module (3), Y-axis positioning stage (4), Z-axis micro-positioning stage (5), micro-force machining module (7), AFM module (8), and rotary table (10) are all connected to the control system for signal transmission. A digital microscope (2) is installed on the side of the X-axis positioning stage (1).

9. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 8, characterized in that: The micro-force processing module (7) includes a PZT actuator (14), a force measuring module (15), a structured indenter (16), and a two-degree-of-freedom rotation adjustment mechanism (18). The two-degree-of-freedom rotation adjustment mechanism (18) integrates a pitch angle adjustment controller (12) and a yaw angle adjustment controller (13). The rear end of the two-degree-of-freedom rotation adjustment mechanism (18) is fixedly connected to the adapter plate (6). The adjustment end of the two-degree-of-freedom rotation adjustment mechanism (18) is fixedly connected to the fixed end of the PZT actuator (14). The movable end of the PZT actuator (14) is fixedly connected to the force measuring module (15). The output end of the rotation mechanism of the force measuring module (15) is fixedly connected to the structured indenter (16). The working end of the structured indenter (16) is a diamond indenter with a planar nanostructure array, and the upper end of the structured indenter (16) is connected to a flexible hinge (17).

10. The method for large-scale nanostructure surface imprinting based on normal force control according to claim 9, characterized in that: The control system includes: The main control computer is connected to the CCD module (3), UMAC controller and AFM controller for signal transmission. It is used to send processing instructions to the UMAC controller and receive its real-time feedback results, send detection commands to the AFM controller and receive its real-time feedback results, and receive the processing sample surface change signal input by the CCD module (3). The UMAC controller is connected to the main control computer, the X-axis positioning stage driver, the Y-axis positioning stage driver, the Z-axis micrometer positioning stage driver, the rotary table driver, the PZT actuator driver, the displacement sensor of the PZT actuator, and the displacement sensor of the force measuring module (15) for signal transmission. It is used to receive the machining instructions from the main control computer and then complete the following tasks: Task 1: Send displacement commands to the X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micron positioning stage driver, and rotary table driver via the D / A module for machining; Task 2: Receive the real-time positions of the X-axis positioning stage driver, Y-axis positioning stage driver, Z-axis micrometer positioning stage driver, and rotary table and feed them back to the main control computer; Task 3: Send commands to the PZT actuator driver via the D / A module; Task 4: Receive displacement sensor signals from the force measurement module (15) and the PZT actuator via the A / D axis card and feed them back to the main control computer; The AFM controller is connected to the main control computer and the AFM module (8) for signal transmission. It is used to receive the detection command from the main control computer, control the AFM module (8) to perform detection, and feed back the test results of the AFM module (8) to the main control computer in real time. The PZT actuator driver is connected to the UMAC controller and the PZT actuator (14) for signal transmission. It is used to receive the instructions of the UMAC controller and drive the PZT actuator to move, and at the same time feed back the displacement sensor signal of the PZT actuator to the UMAC controller. The X-axis positioning stage driver is connected to the UMAC controller and the X-axis positioning stage (1) for signal transmission. It is used to receive the displacement command of the UMAC controller and drive the X-axis positioning stage (1) to move, and at the same time feed back the real-time position of the X-axis positioning stage (1) to the UMAC controller. The Y-axis positioning stage driver is connected to the UMAC controller and the Y-axis positioning stage (4) for signal transmission. It is used to receive the displacement command from the UMAC controller and drive the Y-axis positioning stage (4) to move, and at the same time feed back the real-time position of the Y-axis positioning stage (4) to the UMAC controller. The Z-axis micrometer positioning stage driver is connected to the UMAC controller and the Z-axis micrometer positioning stage (5) for signal transmission. It is used to receive the displacement command from the UMAC controller and drive the Z-axis micrometer positioning stage (5) to move, and at the same time feed back the real-time position of the Z-axis micrometer positioning stage (5) to the UMAC controller. The rotary table driver is connected to the UMAC controller and the rotary table (10) for signal transmission. It is used to receive the displacement command of the UMAC controller and drive the rotary table (10) to move, and at the same time feed back the real-time position of the rotary table (10) to the UMAC controller. The monitor is connected to the main control computer for signal transmission and is used to display relevant information.

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