A packaging device for chip manufacturing processes

Abstract

The application discloses a packaging device for chip manufacturing and processing, and relates to the technical field of chip manufacturing and processing.The packaging device for chip manufacturing and processing comprises a packaging table, a sliding frame is fixedly installed on the top of the packaging table, a packaging plate one is slidingly installed on the inner wall of the sliding frame, a packaging liquid injection port penetrates through the top of the packaging plate one, and a sliding plate is slidingly installed on the top of the packaging table.The packaging device for chip manufacturing and processing moves the telescopic rod by moving the sliding rod, moves the correction diagonal clamp by moving the telescopic rod, and moves the correction diagonal clamp until the correction diagonal clamp contacts the surface of the chip, so that the chip is corrected under the action of the correction diagonal clamp, the effect and quality of packaging are avoided from being affected by the inclination of the chip in the subsequent packaging process, the poor packaging effect caused by the position deviation of the chip is avoided from the root, and the accuracy and reliability of the subsequent packaging process are ensured.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing and processing technology, specifically to a packaging device for chip manufacturing and processing. Background Technology

[0002] Packaging equipment in chip manufacturing is a key device that protects, connects, and integrates chips after they have been cut and tested into the final product. Packaging not only provides physical protection for the chip, but also ensures the electrical connection between the chip and external circuits. The packaging process is crucial to the chip's performance, lifespan, and reliability.

[0003] Patent publication number CN221239587U relates to a packaging device for chip manufacturing, including a base plate. A first round rod is fixedly connected to the upper surface of the base plate, and a first cooling fan is installed at the end of the first round rod away from the base plate. A second round rod is fixedly connected to the upper surface of the base plate, and a second cooling fan is installed at the end of the second round rod away from the base plate. A clamping mechanism is provided on the upper surface of the base plate, and a chip entity is disposed above the base plate. A third cylinder is fixedly connected to the upper surface of the base plate. The clamping mechanism includes a square column and a second clamping plate. The bottom surface of the square column is fixedly connected to the upper surface of the base plate, and a slide rail is provided inside the square column. A motor is installed on the upper surface of the square column. This patent provides a chip packaging device for chip processing. This packaging device is used to cool and package chips during chip processing. Through the set clamping mechanism, chips of different shapes can be clamped and fixed, thereby ensuring the adaptability of this device.

[0004] In the aforementioned patent, the clamping mechanism can clamp and fix chips of different shapes, thereby ensuring the adaptability of the device. However, when the chip is placed at an angle that is tilted, the rigid clamping may cause undue influence on the chip surface. Therefore, a packaging device for chip manufacturing and processing with flexible correction effect is designed. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a packaging apparatus for chip manufacturing, which solves the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a packaging apparatus for chip manufacturing, comprising a packaging stage, a slide fixedly mounted on the top of the packaging stage, a first packaging plate slidably mounted on the inner wall of the slide, a packaging liquid injection port fixedly penetrating the top of the first packaging plate, a correction device for correcting the chip provided on the top of the packaging stage, the correction device comprising a sliding plate slidably mounted on the top of the packaging stage, a first reciprocating lead screw rotatably penetrating the surface of the sliding plate, a sliding rod slidably mounted on the circumferential surface of the first reciprocating lead screw, a correction diagonal clamp slidably mounted on the top of the packaging stage, a first linkage rod rotatably mounted on the top of the sliding plate, a second packaging plate fixedly mounted on the top of the packaging stage, and a telescopic rod fixedly mounted on the end of the sliding rod away from the first reciprocating lead screw, thereby engaging the chip pins into the pin slots opened in the second and first packaging plates to achieve a chip fixation effect and prevent improper displacement during the packaging process.

[0007] According to the above technical solution, the sliding rod is slidably connected to the sliding plate, and the sliding rod is threadedly connected to the reciprocating lead screw. The end of the telescopic rod away from the sliding rod is fixedly connected to the corrective diagonal clamp. The bottom of the encapsulation plate is provided with a protrusion to facilitate close contact with the encapsulation platform. The corrective diagonal clamp is made of rubber to avoid the intersection of the movement trajectories of the sliding plate and the encapsulation plate, which would affect subsequent encapsulation operations.

[0008] According to the above technical solution, the end of the linkage rod away from the sliding plate is rotatably connected to the packaging plate. The surface of the packaging plate is provided with a pin slot for placing chip pins. The end face of the reciprocating screw is connected to the motor output end, and the bottom of the packaging plate is connected to the motor output end. At this time, the chip is corrected under the action of the corrective diagonal clamp, so as to avoid the chip tilting in the subsequent packaging process from affecting the packaging effect and quality. This avoids the poor packaging effect caused by chip position deviation from the root, and ensures the accuracy and reliability of the subsequent packaging process.

[0009] According to the above technical solution, the bottom of the sliding plate is provided with an auxiliary demolding device for assisting demolding. The auxiliary demolding includes a connecting plate, which is fixedly installed at the bottom of the sliding plate. A toothed plate is fixedly installed on the surface of the connecting plate. A demolding template is slidably installed on the inner wall of the second packaging plate. A connecting block is fixedly installed at the bottom of the demolding template. A reciprocating screw 2 is rotatably inserted through the top of the packaging stage. A gear 1 is fixedly installed at the end of the reciprocating screw 2 near the toothed plate. A linkage rod 2 is rotatably installed on the surface of the first packaging plate. A striking block is rotatably installed at the end of the linkage rod 2 away from the first packaging plate. A strike block is fixedly installed on the surface of the second packaging plate. The demolding template moves upward to lift the chip, thus achieving the effect of assisted demolding of the chip. This avoids chip damage that may be caused by manual demolding, reduces the difficulty of operation, and improves the efficiency and safety of chip removal.

[0010] According to the above technical solution, the connecting block is slidably connected to the circumferential surface of the reciprocating lead screw two, the connecting block and the reciprocating lead screw two are connected by threads, the connecting plate is slidably connected to the inner wall of the packaging stage, the toothed plate meshes with the gear one, the impact block is fixedly connected to the packaging stage, and the packaging plate two vibrates under the action of the impact block, which improves the quality of chip packaging. At the same time, the vibration offsets the internal stress after packaging, avoiding cracking of the package or damage to chip performance due to stress concentration.

[0011] According to the above technical solution, the striking block is slidably connected to the top of the packaging platform. The surface of the striking block is provided with an arc surface one for contacting the struck block and generating vibration, and the surface of the struck block is provided with an arc surface two for assisting the striking block in receiving force. This improves the structural stability and long-term reliability of the packaged product and optimizes the packaging quality from a process perspective.

[0012] According to the above technical solution, the surface of the striking block is provided with a cleaning device for cleaning the chip surface. The cleaning device includes a connecting rod, which is fixedly installed on the surface of the striking block. A protective plate is slidably installed on the inner wall of the packaging stage. A fixed rod is slidably installed on the surface of the sliding rod. A sliding block is slidably installed on the surface of the fixed rod away from the sliding rod. An adhesive roller one is rotatably installed on the surface of the sliding block. A locking block is fixedly installed on the surface of the sliding block. An adhesive roller two is rotatably installed on the surface of the sliding block. This achieves protection of the processing area of ​​the chip during packaging, avoiding the influence of dust, debris, or accidental contact on the chip, ensuring the cleanliness and safety of the packaging environment, preventing external factors from interfering with the packaging accuracy and chip performance, and further ensuring the stability of packaging quality.

[0013] According to the above technical solution, the surface of the protective plate is provided with a sliding groove for the sliding and pressing of the connecting rod. The connecting rod is slidably connected to the inner wall of the sliding groove. The first adhesive roller is in contact with the second adhesive roller. The end of the fixed rod away from the sliding block is connected to the motor output end. The distance between the sliding block and the fixed rod is adjusted to accommodate chips of different thicknesses, thereby improving the versatility and adaptability of the equipment.

[0014] This invention provides a packaging apparatus for chip manufacturing. It has the following advantages:

[0015] (1) The chip manufacturing and processing packaging device allows the worker to place the chip on top of the second packaging board and simultaneously insert the chip's pins into the pin slots opened in the second and first packaging boards to achieve a chip fixation effect and avoid improper displacement during the packaging process. The first packaging board moves downward under the action of the motor output end. The downward movement of the first packaging board drives the sliding plate to move away from the second packaging board, thus avoiding the intersection of the movement trajectory of the sliding plate and the first packaging board, which would affect the subsequent packaging operation.

[0016] (2) The packaging device for chip manufacturing and processing moves the corrective diagonal clamp by moving the telescopic rod. The corrective diagonal clamp moves until it contacts the surface of the chip. At this time, the chip is corrected under the action of the corrective diagonal clamp, so as to avoid the chip tilting in the subsequent packaging process from affecting the packaging effect and quality. It avoids the poor packaging effect caused by chip position deviation from the root, and ensures the accuracy and reliability of the subsequent packaging process.

[0017] (3) The packaging device for chip manufacturing and processing is connected to the connecting block by a reciprocating screw two through a threaded connection. The reciprocating screw two rotates under the action of gear one, which drives the connecting block to move upward. At this time, the connecting block moves upward, which drives the demolding template to move. At this time, the demolding template moves upward and lifts the chip. At this time, the chip is assisted in demolding, which avoids chip damage that may be caused by manual demolding, reduces the difficulty of operation, and improves the efficiency and safety of chip removal.

[0018] (4) The packaging device for chip manufacturing and processing drives the striking block to move by rotating the linkage rod 2. At the same time, the striking block moves to contact and collide with the surface of the striking block to generate vibration. At this time, the packaging plate 2 vibrates under the action of the striking block, which improves the quality of chip packaging. At the same time, the vibration offsets the internal stress after packaging, avoiding the cracking of the package or damage to the chip performance due to stress concentration, thus improving the structural stability and long-term reliability of the packaged product.

[0019] (5) The packaging device for chip manufacturing and processing moves upward through the sliding groove under the action of the connecting rod. The upward movement of the sliding groove drives the protective plate to move. The movement of the protective plate protects the processing area of ​​the chip during packaging, avoiding the influence of dust, debris or accidental contact on the chip. It moves towards the packaging plate two. At this time, the movement of the sliding plate drives the fixed rod to move, and the movement of the fixed rod drives the sliding block to move. The operator adjusts the distance between the sliding block and the fixed rod to adapt to chips of different thicknesses, thereby improving the versatility and adaptability of the equipment. The adhesive roller two adheres the dust to itself. Then, the operator pulls the adhesive roller one to disengage from the clamping position of the clamping block and then replaces the adhesive roller one. At this time, the quick replacement of the adhesive roller one is realized, thereby improving the operating efficiency of the equipment. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall internal structure of the present invention;

[0022] Figure 3 This is a schematic diagram showing the positional structure of the reciprocating lead screw and the sliding rod of the present invention;

[0023] Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the A-section of the structure;

[0024] Figure 5 This is a schematic diagram showing the positional structure of the linkage rod 2 and the striking block in this invention;

[0025] Figure 6 For the present invention Figure 5 Enlarged schematic diagram of the B-structure section;

[0026] Figure 7 This is a schematic diagram showing the positional structure of the connecting rod and the protective plate of the present invention;

[0027] Figure 8 This is a schematic diagram showing the positional structure of the first and second adhesive rollers of the present invention.

[0028] In the diagram: 1. Encapsulation platform; 2. Carriage; 3. Encapsulation plate one; 4. Encapsulation liquid inlet; 51. Sliding plate; 52. Reciprocating screw one; 53. Sliding rod; 54. Correcting diagonal clamp; 55. Linkage rod one; 56. Encapsulation plate two; 57. Telescopic rod; 61. Connecting plate; 62. Toothed plate; 63. Release plate; 64. Connecting block; 65. Reciprocating screw two; 66. Gear one; 67. Linkage rod two; 68. Impact block; 69. Impacted block; 71. Connecting rod; 72. Protective plate; 73. Fixing rod; 74. Sliding block; 75. Adhesive roller one; 76. Clamping block; 77. Adhesive roller two. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-8 One embodiment of the present invention is: a packaging apparatus for chip manufacturing and processing, including a packaging stage 1, a slide 2 fixedly mounted on the top of the packaging stage 1, a packaging plate 3 slidably mounted on the inner wall of the slide 2, a packaging liquid injection port 4 fixedly passing through the top of the packaging plate 3, a correction device for correcting the chip provided on the top of the packaging stage 1, the correction device including a sliding plate 51, the sliding plate 51 slidably mounted on the top of the packaging stage 1, a reciprocating lead screw 52 rotatably passing through the surface of the sliding plate 51, a sliding rod 53 slidably mounted on the circumferential surface of the reciprocating lead screw 52, ​​a correction diagonal clamp 54 slidably mounted on the top of the packaging stage 1, a linkage rod 55 rotatably mounted on the top of the sliding plate 51, a packaging plate 56 fixedly mounted on the top of the packaging stage 1, and a telescopic rod 57 fixedly mounted on the end of the sliding rod 53 away from the reciprocating lead screw 52, ​​the movement of the sliding rod 53 driving the telescopic rod 57 to move.

[0031] The sliding rod 53 is slidably connected to the sliding plate 51. The sliding rod 53 is threadedly connected to the reciprocating lead screw 52. The end of the telescopic rod 57 away from the sliding rod 53 is fixedly connected to the correction diagonal clamp 54. The bottom of the packaging plate 3 is provided with a protrusion to facilitate close contact with the packaging platform 1. The correction diagonal clamp 54 is made of rubber. The movement of the telescopic rod 57 drives the correction diagonal clamp 54 to move until it contacts the surface of the chip.

[0032] The end of the linkage rod 55 away from the sliding plate 51 is rotatably connected to the packaging plate 3. The surface of the packaging plate 56 is provided with a pin slot for placing chip pins. The end face of the reciprocating screw 52 is connected to the motor output end. The bottom of the packaging plate 3 is connected to the motor output end. The packaging plate 3 moves upward, which drives the linkage rod 55 to rotate.

[0033] In this embodiment, during operation: When the packaging plate 3 moves to the middle position of the slide 2 under the action of the motor output, the operator places the chip on top of the packaging plate 56 and simultaneously inserts the chip's pins into the pin slots opened on the packaging plate 56 and the packaging plate 3, thus fixing the chip and preventing improper displacement during the packaging process. At this time, the packaging plate 3 moves upward, which drives the linkage rod 55 to rotate. The end of the linkage rod 55 near the sliding plate 51 rotates under the action of the packaging plate 3. At this time, the rotation of the linkage rod 55 drives the sliding plate 51 to move closer to the packaging plate 56. At this time, the reciprocating screw 52 rotates under the action of the motor output. Since the sliding rod 53 and the reciprocating screw 52 are connected by a thread, the rotation of the reciprocating screw 52 drives the sliding rod 53 to move to a suitable position. At this time, the movement of the sliding plate 51 drives the sliding rod 53 to move closer to the packaging plate 56. 3. The movement of the telescopic rod 57 causes the diagonal clamp 54 to move, which in turn moves the corrective diagonal clamp 54 until it contacts the chip surface. At this time, the chip is corrected under the action of the corrective diagonal clamp 54 to avoid affecting the packaging effect and quality due to chip tilt in subsequent packaging processes. This avoids poor packaging effect caused by chip position deviation from the root, ensuring the accuracy and reliability of subsequent packaging processes. Then, the packaging plate 3 moves downward under the action of the motor output. The downward movement of the packaging plate 3 causes the sliding plate 51 to move away from the packaging plate 2 56, avoiding the intersection of the movement trajectory of the sliding plate 51 and the packaging plate 3, which would affect subsequent packaging operations. Then, the packaging plate 3 moves downward until it is in contact with the packaging plate 2 56. Then, the packaging liquid injection port 4 is activated, and the packaging liquid is pumped into the packaging plate 3 through the packaging liquid injection port 4. Then, the packaging plate 3 moves upward under the action of the motor output. At this time, the chip packaging is completed.

[0034] Please see Figures 1-8 Based on the above embodiments, in another embodiment of the present invention, the bottom of the sliding plate 51 is provided with an auxiliary demolding device for assisting demolding. The auxiliary demolding includes a connecting plate 61, which is fixedly installed at the bottom of the sliding plate 51. A toothed plate 62 is fixedly installed on the surface of the connecting plate 61. A demolding template 63 is slidably installed on the inner wall of the encapsulation plate 56. A connecting block 64 is fixedly installed at the bottom of the demolding template 63. A reciprocating screw 65 is rotatably passed through the top of the encapsulation platform 1. A gear 66 is fixedly installed at the end of the reciprocating screw 65 near the toothed plate 62. A linkage rod 67 is rotatably installed on the surface of the encapsulation plate 3. A striking block 68 is rotatably installed at the end of the linkage rod 67 away from the encapsulation plate 3. A receiving block 69 is fixedly installed on the surface of the encapsulation plate 56. The striking block 68 moves to contact and collide with the surface of the receiving block 69 to generate vibration.

[0035] The connecting block 64 is slidably connected to the circumferential surface of the reciprocating lead screw 65, and the connecting block 64 and the reciprocating lead screw 65 are connected by threads. The connecting plate 61 is slidably connected to the inner wall of the packaging platform 1. The toothed plate 62 meshes with the gear 66. The rotation of the gear 66 drives the reciprocating lead screw 65 to rotate. The impact block 69 is fixedly connected to the packaging platform 1.

[0036] The striking block 68 is slidably connected to the top of the packaging platform 1. The surface of the striking block 68 is provided with an arc surface 1 for contacting the striking block 69 and generating vibration. The surface of the striking block 69 is provided with an arc surface 2 for assisting the striking block 68 in receiving force.

[0037] The surface of the striking block 68 is provided with a cleaning device for cleaning the chip surface. The cleaning device includes a connecting rod 71, which is fixedly installed on the surface of the striking block 68. A protective plate 72 is slidably installed on the inner wall of the packaging stage 1. A fixing rod 73 is slidably installed on the surface of the sliding rod 53. A sliding block 74 is slidably installed on the surface of the fixing rod 73 away from the sliding rod 53. An adhesive roller 75 is rotatably installed on the surface of the sliding block 74. A locking block 76 is fixedly installed on the surface of the sliding block 74. An adhesive roller 77 is rotatably installed on the surface of the sliding block 74. The adhesive roller 77 rotates under the action of the chip surface.

[0038] The protective plate 72 has a sliding groove on its surface for the sliding and pressing of the connecting rod 71. The connecting rod 71 is slidably connected to the inner wall of the sliding groove. The first adhesive roller 75 is in contact with the second adhesive roller 77. The end of the fixed rod 73 away from the sliding block 74 is connected to the motor output end. The movement of the sliding plate 51 drives the fixed rod 73 to move, and the movement of the fixed rod 73 drives the sliding block 74 to move.

[0039] In this embodiment, during operation: when the packaging plate 3 moves upward under the action of the motor output to complete the chip packaging, the upward movement of the packaging plate 3 simultaneously drives the connecting plate 61 to move closer to the packaging plate 56 via the linkage rod 55. The movement of the connecting plate 61 drives the toothed plate 62 to move. Since the toothed plate 62 meshes with the gear 66, the movement of the toothed plate 62 drives the gear 66 to rotate. At the same time, the rotation of the gear 66 drives the reciprocating screw 65 to rotate. Since the reciprocating screw 65 is connected to the connecting block 64 by a thread, the rotation of the reciprocating screw 65 under the action of the gear 66 drives the connecting block 64 to move upward. At this time, the upward movement of the connecting block 64 drives the ejector plate 63 to move, and the upward movement of the ejector plate 63 lifts the chip. This process achieves assisted chip demolding, avoiding potential chip damage from manual demolding, reducing operational difficulty, and improving chip removal efficiency and safety. Simultaneously, when the packaging plate 3 moves under the action of the motor output, it drives the linkage rod 67 to rotate. The rotation of the linkage rod 67 then moves the striking block 68, which in turn contacts and collides with the surface of the impact block 69, generating vibration. At this time, the packaging plate 56 vibrates under the action of the impact block 69, improving the quality of chip packaging. Furthermore, the vibration counteracts internal stress after packaging, preventing stress concentration from causing package cracking or chip performance damage. This enhances the structural stability and long-term reliability of the packaged product, optimizing packaging quality from a process perspective.

[0040] In this embodiment, during operation: When the second linkage rod 67 rotates under the action of the first packaging plate 3, the rotation of the second linkage rod 67 drives the striking block 68 to move. At this time, the end of the second linkage rod 67 near the striking block 68 moves, driving the connecting rod 71 to move. The connecting rod 71 moves to contact and press the sliding groove. Simultaneously, the sliding groove moves upward under the action of the connecting rod 71. The upward movement of the sliding groove drives the protective plate 72 to move. The movement of the protective plate 72 protects the processing area during chip packaging, preventing dust, debris, or accidental contact from affecting the chip, ensuring the cleanliness and safety of the packaging environment, and preventing external factors from interfering with packaging accuracy and chip performance, further ensuring the stability of packaging quality. When the sliding plate 51 moves towards the second packaging plate 56, the fixing rod 73 moves towards the second packaging plate 56 under the action of the motor output end. At this time, the movement of the sliding plate 51 drives the fixed rod 73 to move, and the movement of the fixed rod 73 drives the sliding block 74 to move. The operator can adjust the distance between the sliding block 74 and the fixed rod 73 to accommodate chips of different thicknesses, thereby improving the versatility and adaptability of the equipment. Subsequently, the second adhesive roller 77 cleans the top of the chip and sticks the dust attached to its surface under the action of the sliding block 74. At the same time, the second adhesive roller 77 rotates under the action of the chip surface. Because the second adhesive roller 77 is in contact with the first adhesive roller 75, the rotation of the second adhesive roller 77 drives the first adhesive roller 75 to rotate. The second adhesive roller 77 adheres the dust to itself. Then, the operator pulls the first adhesive roller 75 to disengage it from the position of the clamping block 76 and then replaces the first adhesive roller 75. This realizes the quick replacement of the first adhesive roller 75, thereby improving the operating efficiency of the equipment.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging apparatus for chip manufacturing, comprising a packaging stage, characterized in that: A slide is fixedly installed on the top of the packaging stage. A first packaging plate is slidably installed on the inner wall of the slide. A packaging liquid injection port is fixedly inserted through the top of the first packaging plate. A correction device for correcting the chip is provided on the top of the packaging stage. The correction device includes a sliding plate. The sliding plate is slidably installed on the top of the packaging stage. A first reciprocating screw is rotatably inserted through the surface of the sliding plate. A sliding rod is slidably installed on the circumferential surface of the first reciprocating screw. A correction diagonal clamp is slidably installed on the top of the packaging stage. A first linkage rod is rotatably installed on the top of the sliding plate. A second packaging plate is fixedly installed on the top of the packaging stage. A telescopic rod is fixedly installed at the end of the sliding rod away from the first reciprocating screw. The bottom of the sliding plate is provided with an auxiliary demolding device for assisting demolding. The auxiliary demolding device includes a connecting plate, which is fixedly installed at the bottom of the sliding plate. A toothed plate is fixedly installed on the surface of the connecting plate. A demolding template is slidably installed on the inner wall of the second packaging plate. A connecting block is fixedly installed at the bottom of the demolding template. A reciprocating screw 2 is rotatably inserted through the top of the packaging platform. A gear 1 is fixedly installed at the end of the reciprocating screw 2 near the toothed plate. A linkage rod 2 is rotatably installed on the surface of the first packaging plate. A striking block is rotatably installed at the end of the linkage rod 2 away from the first packaging plate. A receiving block is fixedly installed on the surface of the second packaging plate. The connecting block is slidably connected to the circumferential surface of the reciprocating lead screw two, and the connecting block and the reciprocating lead screw two are connected by threads. The connecting plate is slidably connected to the inner wall of the packaging platform. The toothed plate meshes with the gear one. The impact block is fixedly connected to the packaging platform.

2. The packaging apparatus for chip manufacturing and processing according to claim 1, characterized in that: The sliding rod is slidably connected to the sliding plate, and the sliding rod is threadedly connected to the reciprocating lead screw. The end of the telescopic rod away from the sliding rod is fixedly connected to the corrective diagonal clamp. The bottom of the encapsulation plate is provided with a protrusion to facilitate close contact with the encapsulation platform. The corrective diagonal clamp is made of rubber.

3. The packaging apparatus for chip manufacturing according to claim 2, characterized in that: The end of the linkage rod away from the sliding plate is rotatably connected to the first packaging plate. The surface of the second packaging plate is provided with a pin slot for placing chip pins. The end face of the reciprocating screw is connected to the motor output end. The bottom of the first packaging plate is connected to the motor output end.

4. The packaging apparatus for chip manufacturing and processing according to claim 3, characterized in that: The striking block is slidably connected to the top of the packaging platform. The surface of the striking block is provided with an arc surface one for contacting the struck block and generating vibration, and the surface of the struck block is provided with an arc surface two for assisting the striking block in receiving force.

5. The packaging apparatus for chip manufacturing according to claim 4, characterized in that: The surface of the striking block is provided with a cleaning device for cleaning the chip surface. The cleaning device includes a connecting rod, which is fixedly installed on the surface of the striking block. A protective plate is slidably installed on the inner wall of the packaging stage. A fixing rod is slidably installed on the surface of the sliding rod. A sliding block is slidably installed on the surface of the fixing rod away from the sliding rod. An adhesive roller one is rotatably installed on the surface of the sliding block. A locking block is fixedly installed on the surface of the sliding block. An adhesive roller two is rotatably installed on the surface of the sliding block.

6. The packaging apparatus for chip manufacturing according to claim 5, characterized in that: The protective plate has a sliding groove on its surface for the sliding and pressing of the connecting rod. The connecting rod is slidably connected to the inner wall of the sliding groove. The first adhesive roller is in contact with the second adhesive roller. The end of the fixed rod away from the sliding block is connected to the motor output end.

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