Special-shaped heat dissipation assembly of multi-chip plastic package microcircuit module

Abstract

The invention discloses a special-shaped heat dissipation assembly of a multi-chip plastic package microcircuit module. The special-shaped heat dissipation assembly comprises a primary heat dissipation sheet and a plurality of secondary heat dissipation sheets connected with the primary heat dissipation sheet. According to the invention, a split structure of the mother cooling fin and the son cooling fin is adopted, the son cooling fin can be independently arranged above a heating device and only covers a key cooling area, and the whole module does not need to be covered; the mother cooling fin is connected with the son cooling fin through the bridging assembly, and the size of the mother cooling fin can be flexibly adjusted according to the top space of the module. According to the modular design, the use amount of redundant materials is greatly reduced, the heat-conducting property is guaranteed, meanwhile, the structural light weight is achieved, and the problem that in a traditional scheme, due to the fact that the size and the weight excessively depend on the module size, equipment is heavy is solved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of microcircuit module in the electronic industry, and relates to a special-shaped heat dissipation assembly of a multi-chip plastic package microcircuit module. BACKGROUND

[0002] Under the impetus of the trend of high performance and miniaturization of electronic equipment, plastic package modules have become the core components in the fields of 5G communication, automotive electronics, aerospace, etc. due to the advantages of high integration, low cost and reliability. With the progress of semiconductor technology, the transistor density inside the module increases exponentially, and the power density breaks through 100 W / cm 2 , and the local heat flux density even reaches 500 W / cm 2 . This extreme thermal environment leads to a sharp increase in module temperature, causing a series of reliability problems such as increased electromigration, thermal expansion mismatch of materials, increased leakage current, etc., which directly threatens the performance stability and service life of the module. According to statistics, 70% of the failures of electronic equipment are related to temperature, and the heat dissipation problem has become a key bottleneck restricting the development of plastic package modules.

[0003] The current heat dissipation solution for multi-chip package plastic microcircuit modules is still mainly based on traditional cover-type heat dissipation cover plates. This type of cover plate adopts a metal flat plate structure with the same size as the module body, and is directly attached to the upper surface of the module by adhesive means, relying on natural convection or external forced cooling to dissipate heat. This technology is simple in structure and easy to operate, but also has many problems. First, in multi-chip package plastic microcircuit modules, the volume and weight of the cover plate completely depend on the size of the module, resulting in a high proportion of heat dissipation components for high-power modules, which seriously restricts the lightweight of the equipment. Secondly, the adhesive bonding method is prone to stress concentration in thermal cycling, has poor stability, poor mechanical vibration resistance, and is prone to falling off. Thirdly, the flat plate structure leads to a single heat path, high thermal resistance at the edge of the module compared to the center, and local hot spots. SUMMARY

[0004] In view of the problems in the prior art, the present application provides a special-shaped heat dissipation assembly of a multi-chip plastic package microcircuit module, thereby solving the technical problems of the cover-type heat dissipation cover plate in the prior art, i.e., the volume and weight of the cover plate depend on the size of the module, the adhesive bonding method has poor vibration resistance, the flat plate structure leads to a single heat path and high thermal resistance at the edge, which limits the lightweight of the equipment, has poor stability and is prone to falling off, and local hot spots.

[0005] The present application is realized by the following technical solutions: A special-shaped heat dissipation assembly of a multi-chip plastic package microcircuit module, comprising a mother heat sink and a plurality of sub-heat sinks connected to the mother heat sink.

[0006] Preferably, the mother heat sink and the plurality of sub-heat sinks are connected through a bridge assembly.

[0007] Preferably, the bridging assembly comprises a plurality of bridging arms; the plurality of bridging arms are arranged at intervals.

[0008] Preferably, the bridging assembly comprises two bridging arms; the interval between the two bridging arms is 2.0 mm.

[0009] Preferably, the sub-fin comprises a first heat dissipation part and a second heat dissipation part arranged integrally; the two sides of the second heat dissipation part are provided with support parts; the lower surface of the support part is lower than the lower surface of the first heat dissipation part and the second heat dissipation part.

[0010] Preferably, the lower surface of the first heat dissipation part and the lower surface of the second heat dissipation part are located in the same plane, and the height difference between the lower surface of the support part and the lower surface of the second heat dissipation part is 0.1 mm.

[0011] Preferably, a plurality of through holes are uniformly arranged on the sub-fin.

[0012] Preferably, the diameter of the through hole is 0.7 mm.

[0013] A plastic package module comprising the special-shaped heat dissipation assembly of the multi-chip plastic package microcircuit module.

[0014] The assembly method of the plastic package module comprises the following steps: fixing the sub-fin on the heat generating device by using heat conductive glue, and then performing plastic packaging; during the plastic packaging process, the upper surface of the mother fin is exposed, and the plastic package module is prepared.

[0015] Compared with the prior art, the present application has the following beneficial technical effects: The application discloses a special-shaped heat dissipation assembly of a multi-chip plastic-sealed microcircuit module, which comprises a mother heat dissipation fin and a plurality of sub heat dissipation fins connected with the mother heat dissipation fin. A traditional heat dissipation cover plate is in an integral flat structure and needs to completely cover the surface of the module, and the volume and weight of the heat dissipation cover plate are directly determined by the size of the module, thereby limiting the lightweight design. The application adopts a split structure of "mother heat dissipation fin + sub heat dissipation fin", the sub heat dissipation fin can be independently arranged above a heating device and only covers a key heat dissipation area without needing to completely cover the module, and the size of the mother heat dissipation fin can be flexibly adjusted according to the space on the top of the module. The modular design greatly reduces the amount of redundant materials, realizes the lightweight structure while ensuring the heat conduction performance, and solves the problem of heavy equipment caused by the excessive dependence of the volume and weight on the size of the module in the traditional scheme. The application adopts an internal special-shaped heat dissipation fin structure, and a sub heat dissipation fin is arranged above each type of device with different heights before the module is packaged. The sub heat dissipation fin is connected to the mother heat dissipation fin through a connecting bridge to form a "stepped" structure, and only the mother heat dissipation fin is exposed after the module is packaged. The structure can significantly increase the stability of the heat dissipation cover plate in the module, does not affect the overall height of the module, and the segmented heat dissipation fin can better integrate the temperature in the module and be more conducive to overall heat dissipation.

[0016] Further, the mother heat dissipation fin and the plurality of sub heat dissipation fins are connected through a connecting bridge assembly, a heat conduction path between the mother heat dissipation fin and the sub heat dissipation fins is established through the connecting bridge assembly, the heat of the heating device collected by the sub heat dissipation fin is quickly transmitted to the mother heat dissipation fin, and then the heat is dissipated to the outside of the module through the mother heat dissipation fin. The design avoids the problem that the heat needs to be conducted through low-thermal-conductivity plastic sealing material in the traditional heat dissipation scheme, significantly reduces the thermal resistance, and improves the heat dissipation efficiency.

[0017] Further, the connecting bridge assembly comprises a plurality of connecting arms, the plurality of connecting arms are arranged at intervals and work in parallel to form a plurality of parallel heat conduction channels, the thermal resistance of the connecting bridge assembly is further reduced, the total cross-sectional area is increased by the parallel connection of the plurality of connecting arms, and meanwhile, the interval arrangement of the connecting arms forms a structure similar to "glue nails" when fixed later, thereby improving the stability of the structure.

[0018] Further, the connecting bridge assembly comprises two connecting arms, and the interval between the two connecting arms is 2.0 mm. The interval between the two connecting arms is optimized to be 2.0 mm, and the heat conduction efficiency and mechanical reliability are considered. The welding strength between the connecting arms and the mother heat dissipation fin and the sub heat dissipation fin can be ensured by the interval of 2.0 mm.

[0019] Furthermore, the sub-heat sink includes an integrally formed first heat dissipation part and a second heat dissipation part; support parts are provided on both sides of the second heat dissipation part; the lower surface of the support part is lower than the lower surfaces of the first heat dissipation part and the second heat dissipation part. The integrated structure design avoids contact thermal resistance; the first heat dissipation part directly contacts the heat-generating device, the second heat dissipation part expands the contact area with the bridging component, and the support parts provide mechanical support and control the thickness of the thermally conductive adhesive to ensure reliable contact between the sub-heat sink and the device.

[0020] Furthermore, the lower surfaces of the first heat dissipation part and the second heat dissipation part are located on the same plane, and the height difference between the lower surface of the support part and the lower surface of the second heat dissipation part is 0.1mm. The height difference of 0.1mm precisely controls the thickness of the thermally conductive adhesive layer, which ensures heat conduction efficiency, because an excessively thick adhesive layer will increase thermal resistance, and avoids poor contact caused by an excessively thin adhesive layer; at the same time, the support part also improves structural stability.

[0021] Furthermore, the sub-heat sink is provided with several through holes evenly distributed on it. The through holes allow the thermally conductive adhesive to penetrate to the lower surface of the sub-heat sink, forming an "adhesive nail" structure, which enhances the bonding strength between the sub-heat sink and the device. At the same time, the through holes break the air layer on the surface of the sub-heat sink, reducing the interfacial thermal resistance in the heat conduction path.

[0022] Preferably, the diameter of the through hole is 0.7 mm. The 0.7 mm hole diameter is optimized to balance the penetration amount of thermally conductive adhesive and the mechanical strength of the sub-heat sink: if the hole diameter is too small, the amount of adhesive will be insufficient, affecting the bonding; if it is too large, it will weaken the strength of the sub-heat sink. 0.7 mm can ensure the adhesive fixation effect, so that the thermally conductive adhesive is fully filled, while maintaining the rigidity of the sub-heat sink.

[0023] In addition, this invention also discloses an assembly method for a plastic-encapsulated module. A sub-heat sink is fixed to a heat-generating device using thermally conductive adhesive, and then plastic-encapsulated. During the plastic-encapsulation process, the upper surface of the mother heat sink is exposed, thus obtaining the plastic-encapsulated module. The assembly process is synchronized with module manufacturing, avoiding efficiency losses caused by secondary installation. The mother heat sink is exposed outside the plasticizing material, enhancing convective heat transfer with the air. The plasticizing material fills the gap between the heat dissipation component and the substrate, making the heat dissipation component and the module integrated, improving vibration resistance. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Fig. 1 This is a schematic diagram of the heterogeneous heat dissipation component in Embodiment 1 of the present invention; Fig. 2 This is a top view of the heterogeneous heat dissipation component in Embodiment 1 of the present invention; Fig. 3 This is a schematic diagram of the heterogeneous heat dissipation component from another perspective in Embodiment 1 of the present invention; Fig. 4 This is a schematic diagram of the heterogeneous heat dissipation component from one perspective in Embodiment 1 of the present invention; Fig. 5 This is a schematic diagram of the component layout of the microcircuit module in Embodiment 2 of the present invention; Fig. 6 This is a schematic diagram of the heterogeneous heat dissipation component in the microcircuit module in Embodiment 2 of the present invention.

[0026] Among them: 1. Mother heat sink, 2. Daughter heat sink, 21. Through hole, 22. First heat dissipation part, 23. Second heat dissipation part, 24. Support part, 3. Bridge assembly, 31. Bridge arm, 4. Molding material, 5. Substrate, 6. MOSFET device, 7. MOS driver. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0033] The present invention will now be described in further detail with reference to the accompanying drawings: Example 1 like Figs. 1-4 As shown, this invention discloses an irregularly shaped heat dissipation component for a multi-chip molded microcircuit module, including a mother heat sink 1 and a plurality of sub-heat sinks 2 connected to the mother heat sink 1. Preferably, the mother heat sink 1 and the plurality of sub-heat sinks 2 are connected by a bridging component 3.

[0034] The heat dissipation component disclosed in this invention consists of three parts: a mother heat sink 1, a daughter heat sink 2, and a bridging component 3. The mother heat sink 1 is located at the top of the module and serves as the main heat dissipation channel, exposing itself to the outside of the module for convective heat exchange with the air. The daughter heat sink 2 is in direct contact with heat-generating devices inside the module, such as MOSFETs and driver chips, serving as a primary heat conduction unit. The bridging component 3 connects the mother heat sink and the daughter heat sink, serving as a secondary heat conduction channel, responsible for quickly transferring the heat collected by the daughter heat sink to the mother heat sink.

[0035] More preferably, the bridging assembly 3 includes multiple bridging arms 31; the multiple bridging arms 31 are spaced apart, and the bridging assembly 3 is a key channel connecting the mother heat sink and the daughter heat sink. Its design needs to balance heat conduction efficiency and mechanical adaptability, such as...Figs. 1-4 As shown, the bridging assembly 3 is composed of multiple bridging arms 31 arranged at intervals. These multiple bridging arms operate in parallel, significantly reducing the thermal resistance of the bridging assembly and ensuring rapid heat transfer to the mother heat sink. The spacing between the multiple bridging arms 31 is designed to act like "glue nails" when fixed with conductive adhesive, enhancing the structural stability. Furthermore, the number of bridging arms 31 is determined based on the number and layout of the heat-generating devices within the module. In a specific embodiment, the bridging assembly 3 includes two bridging arms 31; the distance between the two bridging arms 31 is 2.0 mm.

[0036] Sub-heat sink 2 is a key component that directly contacts the heat-generating device, and its design must balance thermal conductivity, structural stability, and manufacturing feasibility. For example... Figs. 1-4 As shown, in a preferred embodiment, the sub-heat sink 2 includes an integrally formed first heat dissipation part 22 and a second heat dissipation part 23; support parts 24 are provided on both sides of the second heat dissipation part 23; the lower surface of the support part 24 is lower than the lower surface of the first heat dissipation part 22 and the second heat dissipation part 23.

[0037] The first heat dissipation part 22 is a planar structure that directly covers the surface of the heat-generating device. The second heat dissipation part 23 is an extension structure that increases the heat dissipation area of ​​the heat dissipation part and provides mechanical support through the support parts 24 on both sides.

[0038] Preferably, the lower surface of the first heat dissipation part 22 and the lower surface of the second heat dissipation part 23 are located on the same plane, and the height difference between the lower surface of the support part 24 and the lower surface of the second heat dissipation part 23 is 0.1 mm. The height difference ensures that the thermally conductive adhesive forms a uniform thin layer with a thickness of about 0.1 mm between the sub-heat sink and the device, which ensures heat conduction efficiency and avoids an increase in thermal resistance due to an excessively thick adhesive layer.

[0039] The sub-heat sink 2 has a plurality of through holes 21 evenly distributed on it. Preferably, the diameter of the through holes 21 is 0.7 mm. During assembly, the thermally conductive adhesive penetrates to the lower surface of the sub-heat sink through the through holes, forming a "pick" structure to firmly bond the sub-heat sink to the device and reduce contact thermal resistance. At the same time, the cured thermally conductive adhesive forms mechanical anchor points in the through holes, enhancing the bonding strength between the sub-heat sink and the device and improving the module's vibration resistance. This through-hole design breaks the air layer on the surface of the sub-heat sink, allowing heat to be directly transferred to the sub-heat sink through the thermally conductive adhesive, reducing the interfacial thermal resistance in the heat conduction path.

[0040] This invention first changes the shape of the heat sink, such as... Fig. 1As shown, the heat sinks are divided into a mother heat sink 1 and a daughter heat sink 2 based on their vertical distribution. The daughter heat sink 2 is located at the bottom of the module and is bonded to the upper surface of the device to be cooled using thermally conductive adhesive. Devices of the same height and power can use the same daughter heat sink 2 for unified mounting, forming an isothermal surface. The mother heat sink 1 is located at the top of the module and is connected to the daughter heat sink 2 via a bridging assembly 3, allowing for the design of daughter heat sinks compatible with devices of various heights. The heat generated by the device is transferred to the mother heat sink 1 through the bridging assembly 3 and then dissipated to the outside of the module, reducing the impact of the molding compound on the module's heat dissipation characteristics.

[0041] In this invention, the mother heat sink 1, the daughter heat sink 2, and the bridging component 3 are all made of copper, effectively ensuring heat conduction. Furthermore, the surfaces are nickel-plated, further enhancing the reliability and durability of the heat dissipation assembly. Additionally, the shape of the daughter heat sink 2 can match the shape of the device to be cooled, ensuring sufficient heat dissipation.

[0042] Furthermore, in terms of assembly process, traditional heat sink covers are installed after the module is plastic-encapsulated. Since the plasticizing material itself has poor thermal conductivity, this affects the overall heat dissipation efficiency. The heat dissipation component of this invention is installed during the assembly stage, with thermally conductive adhesive between the heat sink and the components to be cooled, greatly increasing the module's heat dissipation efficiency. Simultaneously, because the heat sink and internal components are filled with plastic together, they form a single unit, increasing structural stability.

[0043] Traditional heat sinks are monolithic flat structures that must completely cover the module surface. Their size and weight are directly determined by the module dimensions, limiting lightweight design options. This invention employs a split structure of "mother heat sink + daughter heat sink." The daughter heat sink can be independently positioned above the heat-generating components, covering only critical heat dissipation areas without requiring complete module coverage. The mother heat sink is connected to the daughter heat sink via bridging components, and its size can be flexibly adjusted according to the top space of the module. This modular design significantly reduces redundant material usage. Combined with the high strength of the copper substrate, it achieves lightweight construction while maintaining thermal conductivity, solving the problem of bulky equipment caused by the excessive reliance on module size for size and weight in traditional solutions.

[0044] Furthermore, traditional heat sink covers are bonded to the module surface with adhesive, which is prone to detachment due to adhesive cracking or aging under vibration or thermal expansion conditions. This invention improves vibration resistance through a triple design: First, the sub-heat sink has a support portion, with its lower surface 0.1mm lower than the heat sink portion, directly contacting the module substrate to form mechanical support and disperse vibration stress; second, the sub-heat sink has through-holes, allowing thermally conductive adhesive to penetrate and cure, forming a "glue nail" structure that significantly enhances bonding strength, far exceeding traditional adhesive solutions; third, the elastic bridge arms of the bridging component can further construct the "glue nail" structure. In addition, traditional flat panel heat sinks require heat to be conducted from the contact surface to the edge before dissipating, resulting in a long thermal path and high edge thermal resistance, which easily leads to localized hot spots. This invention constructs a multi-path parallel heat dissipation channel through a three-stage heat conduction structure: sub-heat sink - bridging component - mother heat sink. The sub-heat sink directly contacts the heat-generating device (first-stage conduction), the bridging component quickly transfers heat to the mother heat sink (second-stage conduction), and the mother heat sink allows for air convection through its exposed surface (tertiary conduction). The high thermal conductivity of the copper substrate, combined with the parallel design of the bridging arms, allows heat to be transferred directly from the heat source to the outside without a long conduction path, avoiding the accumulation of edge thermal resistance and completely eliminating localized hot spots.

[0045] In summary, this invention, through innovations such as a split structure, mechanical support and adhesive reinforcement, and multi-level heat conduction channels, simultaneously solves the technical bottlenecks of traditional heat dissipation solutions in terms of lightweighting, vibration resistance, and thermal uniformity, significantly improving the reliability and power density of the module. This invention can be widely applied to multi-chip packaged plastic-encapsulated microcircuit modules, providing a unified heat dissipation channel for internal components. It has a very broad application prospect and market potential, and is of significant strategic importance and social benefits for improving the heat dissipation performance of microcircuit modules and increasing power density per unit area.

[0046] Example 2 This embodiment takes an H-bridge drive control microcircuit module that provides integrated drive for motors and the like as an example to further illustrate the technical solution of the present invention.

[0047] Fig. 5 This is a schematic diagram of the component layout of the microcircuit module in this embodiment. The module includes a substrate 5, on which a power section and a driving section are provided. The power section includes a single-channel H-bridge circuit, which consists of four MOSFET devices 6 and a power resistor. The driving section includes two dual-channel gate drivers, namely MOS drivers 7, and their peripheral circuits.

[0048] During normal operation, the main heat-generating components inside the module are MOSFET devices 6 and MOS drivers 7. Thermal simulation of the module was performed at an ambient temperature of 125℃. The total power consumption of the module was 2W, and the highest junction temperature of the internal components during normal operation was 148.85℃, a temperature rise of approximately 23℃, occurring in the four MOSFET devices 6. Since the module temperature is approaching the safe limit of 150℃, additional heat dissipation measures are required.

[0049] The module adopts a single-sided assembly structure. The MOSFET device 6 is a bare chip assembled using wire bonding, while the MOS driver 7 is a QFN package assembled using soldering. The MOSFET device 6 has a chip thickness of 0.3mm, and the MOS driver 7 has a thickness of 1mm. During assembly, thermally conductive adhesive is used to fix the sub-heat sink 2 to the upper surfaces of both devices, and then molding compound 4 is filled for encapsulation. During the encapsulation process, the upper surface of the mother heat sink 1 is exposed. After installing the heat dissipation assembly of this invention, the cross-sectional view of the internal structure of the microcircuit module is shown below. Fig. 6 As shown.

[0050] To ensure that the heat sink can fully contact the heat-generating device, several through holes 21 are evenly distributed on the sub-heat sink 2 during the heat sink design. During assembly, thermally conductive adhesive is wrapped around the entire sub-heat sink 2 through the holes, allowing the heat-generating device to fully contact the sub-heat sink 2 and improving thermal conductivity. At the same time, after the thermally conductive adhesive in the through holes 21 cures, it can form a "nail"-like structure, increasing the stability of the overall structure.

[0051] Thermal simulation was performed on the microcircuit module after the heat dissipation component was added. Under an ambient temperature of 125℃, the highest junction temperature inside the device during normal operation of the module was 133.1℃, with a temperature rise of about 8℃, which did not exceed the safe limit temperature of 150℃. Compared with the temperature before the addition, the temperature dropped by about 15℃.

[0052] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A non-standard heat dissipation component for a multi-chip plastic-encapsulated microcircuit module, characterized in that, It includes a mother heat sink (1) and several sub-heat sinks (2) connected to the mother heat sink (1).

2. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 1, characterized in that, The mother heat sink (1) and several child heat sinks (2) are connected by a bridging assembly (3).

3. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 2, characterized in that, The bridging assembly (3) includes a plurality of bridging arms (31); the plurality of bridging arms (31) are spaced apart.

4. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 2, characterized in that, The bridging assembly (3) includes two bridging arms (31); the distance between the two bridging arms (31) is 2.0 mm.

5. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 1, characterized in that, The sub-heat sink (2) includes an integrally formed first heat sink (22) and second heat sink (23); the second heat sink (23) has support portions (24) on both sides; the lower surface of the support portion (24) is lower than the lower surfaces of the first heat sink (22) and the second heat sink (23).

6. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 5, characterized in that, The lower surface of the first heat dissipation part (22) and the lower surface of the second heat dissipation part (23) are located on the same plane, and the height difference between the lower surface of the support part (24) and the lower surface of the second heat dissipation part (23) is 0.1mm.

7. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 1, characterized in that, The sub-heat sink (2) is provided with several through holes (21) evenly distributed.

8. The irregularly shaped heat dissipation component for a multi-chip plastic-encapsulated microcircuit module according to claim 1, characterized in that, The diameter of the through hole (21) is 0.7 mm.

9. A plastic-encapsulated module, characterized in that, An irregularly shaped heat dissipation component comprising a multi-chip plastic-encapsulated microcircuit module as described in any one of claims 1 to 8.

10. The assembly method of a plastic-encapsulated module as described in claim 9, characterized in that, The sub-heat sink (2) is fixed to the heat-generating device using thermally conductive adhesive, and then plastic-encapsulated. During the plastic-encapsulation process, the upper surface of the mother heat sink (1) is exposed to obtain the plastic-encapsulated module.

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