Split type wafer chamfering processing equipment

Abstract

The invention discloses split type wafer chamfering processing equipment which comprises a feeding and discharging device and a chamfering processing device, and the feeding and discharging device and the chamfering processing device are detachably connected. The feeding and discharging device comprises a feeding and discharging support, a feeding and discharging unit and a main conveying device. The chamfering machining device comprises a chamfering machining support, a machining module, a transverse carrying device, a longitudinal carrying device and a third transverse carrying mechanism. The equipment has the technical effects that the equipment is divided into two modules, namely the feeding and discharging device and the chamfering device, adopts a split type detachable structure, and can be suitable for application scenes with limited space; the main transmission device, the transverse carrying device, the longitudinal carrying device and the third transverse carrying mechanism are matched with one another, so that a wafer transmission path is annular, the waiting time of circulation of wafers among stations is shortened, and the processing efficiency is improved; the main transmission device can be matched with the thickness measuring and position calibration device for detection, calibration of the center position of the wafer is achieved, an additional adjusting mechanism is not needed, and cost can be saved.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and specifically to a split-type wafer chamfering processing equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, wafers, as the carriers of integrated circuits, are crucial to the edge quality of subsequent processes such as photolithography, etching, and polishing. Wafer chamfering machines are key equipment used to precisely grind and polish wafer edges to eliminate sharp edges, cracks, and defects, effectively improving the mechanical strength and process yield of wafers.

[0003] Currently, mainstream wafer chamfering machines on the market typically adopt an integrated structural design, highly integrating all functional modules such as the loading unit, processing spindle unit, precision motion platform, detection unit, and control cabinet into a rigid frame. This integrated design has advantages such as compact structure, high rigidity, and ease of overall installation and debugging in standardized modern semiconductor factories.

[0004] However, with the continuous expansion of semiconductor production capacity and the iteration of process technology, many older factories are still undertaking important production tasks. These older factories, when planned and designed, failed to fully anticipate the size requirements of today's large-scale precision equipment, and generally suffer from problems such as narrow workshop entrances, winding internal passageways, and the lack of dedicated access channels for equipment. Meanwhile, to meet higher precision and automation requirements, wafer chamfering machines are becoming increasingly complex in structure and larger in size, leading to a sharp contradiction: traditional large-size integrated chamfering machines face the severe challenge of being unable to enter these space-constrained older workshops.

[0005] The difficulty of equipment relocation is not only reflected in the initial installation stage. When equipment needs to be moved due to process upgrades, maintenance, or plant layout adjustments, the same bottleneck will be encountered, which seriously affects the flexibility and reconfigurability of the production line.

[0006] To address these issues, the industry typically employs temporary measures, such as removing door frames and walls, or even using large hoisting equipment. These methods not only incur high renovation costs and extend downtime, but may also cause irreversible damage to the cleanroom environment and structural safety of the factory, along with significant safety risks.

[0007] Therefore, there is an urgent need for a new type of equipment structure to overcome the shortcomings of existing integrated designs in terms of spatial adaptability and to meet the stringent requirements of special industrial environments for equipment size and ease of access. Summary of the Invention

[0008] To address these issues, the present invention provides a split-type wafer chamfering processing device.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] According to a first aspect of the present invention, a split-type wafer chamfering processing equipment includes a loading and unloading device and a chamfering processing device, wherein the loading and unloading device and the chamfering processing device are detachably connected.

[0011] The loading and unloading device includes a loading and unloading bracket, a loading and unloading unit, and a main conveying device. The loading and unloading unit and the main conveying device are both mounted on the loading and unloading bracket, and the main conveying device is mounted on the side of the loading and unloading bracket closer to the chamfering processing device.

[0012] The chamfering device includes a chamfering support, a processing module, a transverse transport device, a longitudinal transport device, and a third transverse transport mechanism. The processing module, the transverse transport device, the longitudinal transport device, and the third transverse transport mechanism are all mounted on the chamfering support. The processing module includes a thickness measuring and position calibration device, a grinding device, and a cleaning unit. The thickness measuring and position calibration device, the grinding device, and the cleaning unit are sequentially distributed along a transverse straight line. The transverse transport device and the third transverse transport mechanism are both arranged transversely, and the longitudinal transport device is arranged longitudinally.

[0013] The main conveying device is matched with the loading and unloading unit and the thickness measurement and position calibration device, respectively. The transverse conveying device is matched with the processing module and the cleaning unit, respectively. The longitudinal conveying device is matched with the cleaning unit, respectively. The third transverse conveying mechanism is matched with the longitudinal conveying device and the main conveying device, respectively.

[0014] Furthermore, the main transmission device includes a main fixed frame, a main slide rail, a main slide table, a guide frame, a robot arm, a mounting frame, and a main drive mechanism. The main fixed frame is mounted on the loading and unloading support, and the main fixed frame is provided with a channel, which is arranged longitudinally and passes through the main fixed frame.

[0015] There are two main slide rails, which are arranged parallel to each other on both sides of the channel width; the main slide table is located on the top of the mounting frame and is slidably connected to the main slide rails; the main drive mechanism is used to drive the main slide table to reciprocate along the main slide rails; the bottom of the mounting frame extends through the channel to the bottom of the main fixing frame.

[0016] The mounting frame is equipped with a lifting platform, and the lifting platform is equipped with a rotating mechanism. The output shaft of the rotating mechanism is connected to the guide frame. The robotic arm is slidably mounted on the guide frame, and the robotic arm is plate-shaped.

[0017] Furthermore, the end of the robotic arm is C-shaped, and the end of the robotic arm is provided with a vacuum nozzle.

[0018] Furthermore, there are multiple loading and unloading units, which are arranged sequentially along the length of the main slide rail.

[0019] Furthermore, the transverse transport device includes a transverse support, a first transverse slide rail, a first transverse transport mechanism, and a second transverse transport mechanism. The transverse support is arranged transversely on the chamfering support, and the first transverse slide rail is arranged on the transverse support along the length of the transverse support. The first transverse transport mechanism and the second transverse transport mechanism are both slidably arranged on the first transverse slide rail. The first transverse transport mechanism is matched with the grinding device and the thickness measuring and position calibration device, respectively, and the second transverse transport mechanism is matched with the grinding device and the cleaning unit, respectively.

[0020] Furthermore, the first transverse conveying mechanism includes a first transverse moving plate, a first vacuum suction cup, and a first transverse driving mechanism. The first transverse moving plate is slidably disposed on the first transverse slide rail, and the first transverse driving mechanism is used to drive the first transverse moving plate to reciprocate along the first transverse slide rail. The first vacuum suction cup is disposed on the first transverse moving plate and is vertically downward.

[0021] The second transverse conveying mechanism includes a second transverse moving plate, a first telescopic cylinder, a second vacuum suction cup, and a second transverse driving mechanism. The second transverse moving plate is slidably disposed on the first transverse slide rail, and the second transverse driving mechanism is used to drive the second transverse moving plate to reciprocate along the first transverse slide rail. The first telescopic cylinder is disposed on the second transverse moving plate, and the output shaft of the first telescopic cylinder is vertically downward. The second vacuum suction cup is disposed on the output shaft of the first telescopic cylinder.

[0022] Furthermore, the longitudinal conveying device includes a longitudinal support, a longitudinal slide rail, a longitudinal slide table, a second telescopic cylinder, a third vacuum suction cup, and a longitudinal drive mechanism. The longitudinal support is mounted on the chamfering support, the longitudinal slide rail is mounted on the longitudinal support, the longitudinal slide table is slidably mounted on the longitudinal slide rail, and the longitudinal drive mechanism is used to drive the longitudinal slide table to reciprocate along the longitudinal slide rail. The second telescopic cylinder is mounted on the longitudinal slide table, and the output shaft of the second telescopic cylinder is vertically downward. The third vacuum suction cup is mounted on the output shaft of the second telescopic cylinder.

[0023] Furthermore, the third transverse conveying mechanism includes a second transverse slide rail, a third transverse moving plate, a fourth vacuum suction cup, and a third transverse driving mechanism. The second transverse slide rail is arranged transversely on the chamfering processing bracket. The third transverse moving plate is slidably arranged on the second transverse slide rail. The third transverse driving mechanism is used to drive the third transverse moving plate to reciprocate along the second transverse slide rail. The fourth vacuum suction cup is arranged on the third transverse moving plate and is vertically upward.

[0024] Furthermore, the thickness measurement and position calibration device includes a thickness measurement unit and a position calibration unit, which are arranged correspondingly to each other;

[0025] The grinding device includes a first grinding unit and a second grinding unit, which are arranged side by side.

[0026] Furthermore, the loading / unloading bracket and the chamfering processing bracket are respectively provided with outer covers, and the bottom of the loading / unloading bracket and the chamfering processing bracket are respectively provided with multiple support legs and rollers;

[0027] Multiple connecting components are provided between the loading / unloading bracket and the chamfering processing bracket. The connecting components include connecting plates and bolts.

[0028] The present invention has the following advantages: the equipment is divided into two main modules: a loading and unloading device and a chamfering processing device. The two modules adopt a split and detachable structure, which is suitable for applications with limited space. The main transmission device, the lateral conveying device, the longitudinal conveying device, and the third lateral conveying mechanism work together to make the wafer transmission path circular, reducing the waiting time for the wafer to flow between each station and improving processing efficiency. The main transmission device can be used with a thickness measurement and position calibration device to perform detection and achieve the calibration of the wafer center position without the need for an additional adjustment mechanism, which can save costs. Attached Figure Description

[0029] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0030] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0031] Figure 1 This is a first-view view of the internal structure of a split-type wafer chamfering processing device provided in some embodiments of the present invention.

[0032] Figure 2 This is a second-view view of the internal structure of a split-type wafer chamfering processing device provided for some embodiments of the present invention.

[0033] Figure 3 This is a first-view view of the overall structure of a split-type wafer chamfering processing device provided in some embodiments of the present invention.

[0034] Figure 4 This is a second-view view of the overall structure of a split-type wafer chamfering processing device provided in some embodiments of the present invention.

[0035] Figure 5 This is a first-view view of the internal structure of a chamfering device in a split-type wafer chamfering processing equipment provided in some embodiments of the present invention.

[0036] Figure 6 This is a second-view view of the internal structure of a chamfering device in a split-type wafer chamfering processing equipment, provided for some embodiments of the present invention.

[0037] Figure 7 This is a schematic diagram of the internal structure of the loading and unloading device of a split-type wafer chamfering processing equipment provided in some embodiments of the present invention.

[0038] Figure 8 This is a schematic diagram of the main transmission device of a split-type wafer chamfering processing equipment provided in some embodiments of the present invention.

[0039] Figure 9This is a schematic diagram of the structure of a horizontal transport device for a split-type wafer chamfering processing equipment provided in some embodiments of the present invention.

[0040] Figure 10 This is a structural schematic diagram of a longitudinal conveying device for a split-type wafer chamfering processing equipment provided in some embodiments of the present invention.

[0041] In the diagram: 1. Loading / unloading device; 2. Chamfering device; 3. Support leg; 4. Roller; 5. Loading / unloading bracket; 6. Chamfering bracket; 7. Loading / unloading unit; 8. Main transmission device; 9. First grinding unit; 10. Second grinding unit; 11. Cleaning unit; 12. Lateral conveying device; 13. Longitudinal conveying device; 14. Position calibration unit; 15. Thickness measuring unit; 16. First lateral conveying mechanism; 17. Second lateral conveying mechanism; 18. Third lateral conveying mechanism; 19. 20. Connector, Main Fixing Frame, 21. Channel, 22. Main Slide Rail, 23. Main Slide Table, 24. Guide Frame, 25. Robot Arm, 26. Mounting Frame, 27. Horizontal Support, 28. First Horizontal Slide Rail, 29. First Horizontal Moving Plate, 30. First Vacuum Suction Cup, 31. Second Horizontal Moving Plate, 32. First Telescopic Cylinder, 33. Second Vacuum Suction Cup, 34. Longitudinal Support, 35. Longitudinal Slide Rail, 36. Longitudinal Slide Table, 37. Second Telescopic Cylinder, 38. Third Vacuum Suction Cup. Detailed Implementation

[0042] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Example 1

[0044] like Figures 1 to 10 As shown, a split-type wafer chamfering processing device according to a first aspect embodiment of the present invention includes a loading and unloading device 1 and a chamfering processing device 2, wherein the loading and unloading device 1 and the chamfering processing device 2 are detachably connected.

[0045] The loading and unloading device 1 includes a loading and unloading bracket 5, a loading and unloading unit 7, and a main transmission device 8. The loading and unloading unit 7 and the main transmission device 8 are both mounted on the loading and unloading bracket 5, and the main transmission device 8 is mounted on the side of the loading and unloading bracket 5 closest to the chamfering processing device 2.

[0046] The chamfering processing device 2 includes a chamfering processing support 6, a processing module, a transverse conveying device 12, a longitudinal conveying device 13, and a third transverse conveying mechanism 18. The processing module, the transverse conveying device 12, the longitudinal conveying device 13, and the third transverse conveying mechanism 18 are all mounted on the chamfering processing support 6. The processing module includes a thickness measuring and position calibration device, a grinding device, and a cleaning unit 11. The thickness measuring and position calibration device, the grinding device, and the cleaning unit 11 are sequentially distributed along a transverse straight line. The transverse conveying device 12 and the third transverse conveying mechanism 18 are both arranged transversely, and the longitudinal conveying device 13 is arranged longitudinally.

[0047] The main conveying device 8 is matched with the loading and unloading unit 7 and the thickness measurement and position calibration device, respectively. The transverse conveying device 12 is matched with the processing module and the cleaning unit 11, respectively. The longitudinal conveying device 13 is matched with the cleaning unit 11, respectively. The third transverse conveying mechanism 18 is matched with the longitudinal conveying device 13 and the main conveying device 8, respectively.

[0048] In this embodiment, it should be noted that the thickness measurement and position calibration device includes a thickness measurement unit 15 and a position calibration unit 14. The thickness measurement unit 15 is used to measure the thickness of the wafer, and the position calibration unit 14 is used to calibrate the center position of the wafer. The position calibration unit 14 uses four sets of through-beam optical fibers to detect the wafer position and works in conjunction with the main transmission robot to calibrate the center position of the wafer. The thickness measurement unit 15 and the position calibration unit 14 are set up corresponding to each other.

[0049] The grinding device includes a first grinding unit 9 and a second grinding unit 10, which are arranged side by side. By setting up two grinding units, the processing efficiency can be effectively improved and continuous production can be achieved.

[0050] Furthermore, the loading / unloading support 5 and the chamfering support 6 are respectively provided with outer covers, which are used to provide dust protection and protection. The bottom of the loading / unloading support 5 and the chamfering support 6 are respectively provided with multiple support legs 3 and rollers 4. The support legs 3 are height-adjustable, and the rollers 4 are universal wheels. Specifically, the bottom of the loading / unloading support 5 and the chamfering support 6 are respectively provided with four support legs 3, and each support leg 3 is provided with a roller 4 next to it.

[0051] Multiple connectors 19 are provided between the loading / unloading bracket 5 and the chamfering processing bracket 6. Each connector 19 includes a connecting plate and bolts.

[0052] The technical effects achieved in this embodiment are as follows: the equipment is divided into two main modules: loading and unloading device 1 and chamfering processing device 2. The two modules adopt a split and detachable structure, which is suitable for space-constrained application scenarios. The main transmission device 8, the lateral conveying device 12, the longitudinal conveying device 13 and the third lateral conveying mechanism 18 cooperate with each other to make the wafer transmission path circular, reducing the waiting time for the wafer to flow between each station and improving processing efficiency. The main transmission device 8 can be used with the thickness measurement and position calibration device for detection. The wafer center position can be calibrated without additional adjustment mechanism, which can save costs.

[0053] Example 2

[0054] like Figures 1 to 10 As shown in the figure, another split-type wafer chamfering processing equipment provided in this embodiment has the same structure as in embodiment 1. Only the different parts are described below.

[0055] In this embodiment, the main transmission device 8 includes a main fixed frame 20, a main slide rail 22, a main slide table 23, a guide frame 24, a robot arm 25, a mounting frame 26, and a main drive mechanism. The main fixed frame 20 is mounted on the loading and unloading support 5. The main fixed frame 20 is provided with a channel 21, which is elongated and arranged longitudinally, and the channel 21 passes through the main fixed frame 20.

[0056] There are two main slide rails 22, which are arranged parallel to each other on both sides of the width of the channel 21; the main slide table 23 is located on the top of the mounting frame 26, and the main slide table 23 is slidably connected to the main slide rail 22. The main drive mechanism is used to drive the main slide table 23 to move back and forth along the main slide rail 22. The bottom of the mounting frame 26 extends through the channel 21 to the bottom of the main fixed frame 20.

[0057] The mounting frame 26 is equipped with a lifting platform, and a rotating mechanism is provided on the lifting platform. The output shaft of the rotating mechanism is connected to the guide frame 24. The robot arm 25 is slidably mounted on the guide frame 24. During operation, the robot arm 25 can reciprocate along the guide frame 24 after being driven by the drive mechanism, and the robot arm 25 is plate-shaped.

[0058] In this embodiment, it should be noted that the end of the robotic arm 25 is C-shaped and is equipped with a vacuum nozzle, which is used to adsorb and fix the wafer. The main transmission device 8 can realize longitudinal movement, rotation, lifting, extension and retraction of the robotic arm 25, vacuum adsorption and other actions. It is mainly used for wafer position scanning and recording in the material box, wafer gripping, wafer transfer from loading and unloading unit 7 to thickness measurement unit 15, wafer transfer from thickness measurement unit 15 to position calibration unit 14, wafer center position calibration, and wafer transfer from the third lateral conveying mechanism 18 to loading and unloading unit 7.

[0059] The loading and unloading unit 7 is used to place the material box. There are multiple loading and unloading units 7, which are arranged sequentially along the length of the main slide rail 22. The multiple loading and unloading units 7 are arranged in a straight line, which facilitates the track layout, positioning and loading and unloading of the material box of the overhead crane system in the automated factory, and also facilitates backward compatibility with manual loading and unloading.

[0060] The technical effect achieved by this embodiment is that the main transmission device 8 can move laterally, move longitudinally, lift, and rotate horizontally. It can be used in conjunction with the thickness measurement and position calibration device for detection. The wafer center position can be calibrated without additional adjustment mechanism, which can save costs.

[0061] Example 3

[0062] like Figures 1 to 10 As shown in the figure, another split-type wafer chamfering processing equipment provided in this embodiment has the same structure as in embodiment 2. Only the different parts are described below.

[0063] In this embodiment, the transverse transport device 12 includes a transverse support 27, a first transverse slide rail 28, a first transverse transport mechanism 16, and a second transverse transport mechanism 17. The transverse support 27 is arranged transversely on the chamfering support 6, and the first transverse slide rail 28 is arranged on the transverse support 27 along the length of the transverse support 27. The first transverse transport mechanism 16 and the second transverse transport mechanism 17 are both slidably arranged on the first transverse slide rail 28. The first transverse transport mechanism 16 is matched with the grinding device and the thickness measuring and position calibration device, respectively, and the second transverse transport mechanism 17 is matched with the grinding device and the cleaning unit 11, respectively.

[0064] In this embodiment, it should be noted that the first transverse slide rail 28 is disposed on the side of the transverse support 28, and there are two first transverse slide rails 28, which are arranged parallel to each other.

[0065] The first transverse conveying mechanism 16 includes a first transverse moving plate 29, a first vacuum suction cup 30, and a first transverse driving mechanism. The first transverse moving plate 29 is slidably disposed on the first transverse slide rail 28. The first transverse driving mechanism is used to drive the first transverse moving plate 29 to reciprocate along the first transverse slide rail 28. The first vacuum suction cup 30 is disposed on the first transverse moving plate 29 and is vertically downward.

[0066] The second transverse conveying mechanism 17 includes a second transverse moving plate 31, a first telescopic cylinder 32, a second vacuum suction cup 33, and a second transverse driving mechanism. The second transverse moving plate 31 is slidably mounted on the first transverse slide rail 28. The second transverse driving mechanism is used to drive the second transverse moving plate 31 to reciprocate along the first transverse slide rail 28. The first telescopic cylinder 32 is mounted on the second transverse moving plate 31, and the output shaft of the first telescopic cylinder 32 is vertically downward. The second vacuum suction cup 33 is mounted on the output shaft of the first telescopic cylinder 32, and the second vacuum suction cup 33 is vertically downward.

[0067] The technical effects achieved in this embodiment are as follows: the first lateral transport mechanism 16 can realize lateral movement and vacuum adsorption. The first lateral transport mechanism 16 is used to transport the wafer from the thickness measurement and position calibration device to the grinding device. The first lateral transport mechanism 16 only realizes two actions: lateral movement and vacuum adsorption, which can ensure the accuracy of wafer transfer; the second lateral transport mechanism 17 can realize lateral movement, lifting, vacuum adsorption and other actions, and is used to transport the wafer from the grinding device to the cleaning unit 11; the first lateral transport mechanism 16 and the second lateral transport mechanism 17 have different functions and do not interfere with each other, which facilitates precise control.

[0068] Example 4

[0069] like Figures 1 to 10 As shown in the figure, another split-type wafer chamfering processing equipment provided in this embodiment has the same structure as in embodiment 3. Only the different parts are described below.

[0070] In this embodiment, the longitudinal conveying device 13 includes a longitudinal support 34, a longitudinal slide rail 35, a longitudinal slide table 36, a second telescopic cylinder 37, a third vacuum suction cup 38, and a longitudinal drive mechanism. The longitudinal support 34 is mounted on the chamfering support 6, the longitudinal slide rail 35 is mounted on the longitudinal support 34, the longitudinal slide table 36 is slidably mounted on the longitudinal slide rail 35, and the longitudinal drive mechanism is used to drive the longitudinal slide table 36 to reciprocate along the longitudinal slide rail 35. The second telescopic cylinder 37 is mounted on the longitudinal slide table 36, and the output shaft of the second telescopic cylinder 37 is vertically downward. The third vacuum suction cup 38 is mounted on the output shaft of the second telescopic cylinder 37, and the third vacuum suction cup 38 is vertically downward.

[0071] In this embodiment, it should be noted that the third transverse conveying mechanism 18 includes a second transverse slide rail, a third transverse moving plate, a fourth vacuum suction cup, and a third transverse driving mechanism. The second transverse slide rail is arranged transversely on the chamfering processing bracket 6, the third transverse moving plate is slidably arranged on the second transverse slide rail, and the third transverse driving mechanism is used to drive the third transverse moving plate to reciprocate along the second transverse slide rail. The fourth vacuum suction cup is arranged on the third transverse moving plate and is arranged vertically upward.

[0072] Furthermore, the wafer's movement path during the entire equipment operation is as follows:

[0073] First, the main transport device 8 transports the wafer to be processed from the loading / unloading unit 7 to the thickness measurement unit 15 for thickness measurement. After the thickness measurement is completed, the main transport device 8 transports the wafer from the thickness measurement unit 15 to the position calibration unit 14 for wafer center position calibration. After calibration, the first lateral transport mechanism 16 transports the wafer from the position calibration unit 14 to the grinding unit for grinding. After grinding, the second lateral transport mechanism 17 transports the wafer to the cleaning unit 11 for cleaning. After cleaning, the longitudinal transport device 13 transports the wafer from the cleaning unit 11 to the third lateral transport mechanism 18 for transfer. Subsequently, the third lateral transport mechanism 18 transports the wafer to the main transport device 8. Finally, the main transport device 8 transports the processed wafer to the loading / unloading unit 7, completing the entire processing process.

[0074] The technical effects achieved in this embodiment are as follows: the longitudinal transport device 13 can realize longitudinal movement, lifting, vacuum adsorption and other actions, and is used to transport the wafer from the cleaning unit 11 to the third transverse transport mechanism 18; the third transverse transport mechanism 18 can realize transverse movement and vacuum adsorption actions, and is used to transport the wafer from the longitudinal transport device 13 to the main transport device 8.

[0075] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

[0076] The terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

Claims

1. A split-type wafer chamfering processing equipment, characterized in that, It includes a loading and unloading device (1) and a chamfering device (2), wherein the loading and unloading device (1) and the chamfering device (2) are detachably connected; The loading and unloading device (1) includes a loading and unloading bracket (5), a loading and unloading unit (7), and a main transmission device (8). The loading and unloading unit (7) and the main transmission device (8) are both mounted on the loading and unloading bracket (5), and the main transmission device (8) is mounted on the side of the loading and unloading bracket (5) close to the chamfering processing device (2). The chamfering processing device (2) includes a chamfering processing bracket (6), a processing module, a transverse conveying device (12), a longitudinal conveying device (13), and a third transverse conveying mechanism (18). The processing module, the transverse conveying device (12), the longitudinal conveying device (13), and the third transverse conveying mechanism (18) are all mounted on the chamfering processing bracket (6). The processing module includes a thickness measuring and position calibration device, a grinding device, and a cleaning unit (11). The thickness measuring and position calibration device, the grinding device, and the cleaning unit (11) are sequentially distributed along a transverse straight line. The transverse conveying device (12) and the third transverse conveying mechanism (18) are both arranged in the transverse direction, and the longitudinal conveying device (13) is arranged in the longitudinal direction. The main conveying device (8) is matched with the loading and unloading unit (7) and the thickness measurement and position calibration device respectively. The transverse conveying device (12) is matched with the processing module and the cleaning unit (11) respectively. The longitudinal conveying device (13) is matched with the cleaning unit (11) respectively. The third transverse conveying mechanism (18) is matched with the longitudinal conveying device (13) and the main conveying device (8) respectively.

2. The split-type wafer chamfering processing equipment according to claim 1, characterized in that, The main transmission device (8) includes a main fixed frame (20), a main slide rail (22), a main slide table (23), a guide frame (24), a robot arm (25), a mounting frame (26), and a main drive mechanism. The main fixed frame (20) is mounted on the loading and unloading support (5). The main fixed frame (20) is provided with a channel (21), which is arranged longitudinally and passes through the main fixed frame (20). There are two main slide rails (22), which are arranged parallel to each other on both sides of the width of the channel (21); the main slide table (23) is located on the top of the mounting frame (26), and the main slide table (23) is slidably connected to the main slide rail (22); the main drive mechanism is used to drive the main slide table (23) to reciprocate along the main slide rail (22); the bottom of the mounting frame (26) extends through the channel (21) to the bottom of the main fixing frame (20); The mounting frame (26) is provided with a lifting platform, and the lifting platform is provided with a rotating mechanism. The output shaft of the rotating mechanism is connected to the guide frame (24). The robotic arm (25) is slidably mounted on the guide frame (24), and the robotic arm (25) is plate-shaped.

3. The split-type wafer chamfering processing equipment according to claim 2, characterized in that, The end of the robotic arm (25) is C-shaped, and the end of the robotic arm (25) is provided with a vacuum nozzle.

4. The split-type wafer chamfering processing equipment according to claim 2, characterized in that, The number of loading and unloading units (7) is multiple, and the multiple loading and unloading units (7) are arranged sequentially along the length direction of the main slide rail (22).

5. A split-type wafer chamfering processing equipment according to claim 1, characterized in that, The transverse transport device (12) includes a transverse support (27), a first transverse slide rail (28), a first transverse transport mechanism (16), and a second transverse transport mechanism (17). The transverse support (27) is arranged transversely on the chamfering support (6). The first transverse slide rail (28) is arranged on the transverse support (27) and is arranged along the length direction of the transverse support (27). The first transverse transport mechanism (16) and the second transverse transport mechanism (17) are both slidably arranged on the first transverse slide rail (28). The first transverse transport mechanism (16) is matched with the grinding device and the thickness measuring and position calibration device, respectively. The second transverse transport mechanism (17) is matched with the grinding device and the cleaning unit (11), respectively.

6. A split-type wafer chamfering processing equipment according to claim 5, characterized in that, The first transverse conveying mechanism (16) includes a first transverse moving plate (29), a first vacuum suction cup (30), and a first transverse driving mechanism. The first transverse moving plate (29) is slidably disposed on the first transverse slide rail (28). The first transverse driving mechanism is used to drive the first transverse moving plate (29) to reciprocate along the first transverse slide rail (28). The first vacuum suction cup (30) is disposed on the first transverse moving plate (29) and the first vacuum suction cup (30) is vertically downward. The second transverse conveying mechanism (17) includes a second transverse moving plate (31), a first telescopic cylinder (32), a second vacuum suction cup (33), and a second transverse driving mechanism. The second transverse moving plate (31) is slidably disposed on the first transverse slide rail (28). The second transverse driving mechanism is used to drive the second transverse moving plate (31) to reciprocate along the first transverse slide rail (28). The first telescopic cylinder (32) is disposed on the second transverse moving plate (31), and the output shaft of the first telescopic cylinder (32) is vertically downward. The second vacuum suction cup (33) is disposed on the output shaft of the first telescopic cylinder (32).

7. A split-type wafer chamfering processing equipment according to claim 1, characterized in that, The longitudinal conveying device (13) includes a longitudinal support (34), a longitudinal slide rail (35), a longitudinal slide table (36), a second telescopic cylinder (37), a third vacuum suction cup (38), and a longitudinal drive mechanism. The longitudinal support (34) is mounted on the chamfering support (6), the longitudinal slide rail (35) is mounted on the longitudinal support (34), the longitudinal slide table (36) is slidably mounted on the longitudinal slide rail (35), and the longitudinal drive mechanism is used to drive the longitudinal slide table (36) to reciprocate along the longitudinal slide rail (35). The second telescopic cylinder (37) is mounted on the longitudinal slide table (36), and the output shaft of the second telescopic cylinder (37) is vertically downward. The third vacuum suction cup (38) is mounted on the output shaft of the second telescopic cylinder (37).

8. A split-type wafer chamfering processing equipment according to claim 1, characterized in that, The third transverse conveying mechanism (18) includes a second transverse slide rail, a third transverse moving plate, a fourth vacuum suction cup, and a third transverse driving mechanism. The second transverse slide rail is arranged transversely on the chamfering support (6). The third transverse moving plate is slidably arranged on the second transverse slide rail. The third transverse driving mechanism is used to drive the third transverse moving plate to reciprocate along the second transverse slide rail. The fourth vacuum suction cup is arranged on the third transverse moving plate and is arranged vertically upward.

9. A split-type wafer chamfering processing equipment according to claim 1, characterized in that, The thickness measurement and position calibration device includes a thickness measurement unit (15) and a position calibration unit (14), which are arranged correspondingly to each other; The grinding device includes a first grinding unit (9) and a second grinding unit (10), which are arranged side by side.

10. A split-type wafer chamfering processing equipment according to claim 1, characterized in that, The loading and unloading support (5) and the chamfering support (6) are respectively provided with outer covers, and the bottom of the loading and unloading support (5) and the chamfering support (6) are respectively provided with multiple support legs (3) and rollers (4). Multiple connectors (19) are provided between the loading / unloading bracket (5) and the chamfering bracket (6), and the connectors (19) include connecting plates and bolts.

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