A multifunctional photonic device based on a glass substrate

Abstract

This invention belongs to the field of semiconductor device technology, specifically relating to a multifunctional photonic device based on a glass substrate, comprising: a glass substrate, a transition layer disposed on a first surface of the glass substrate, a high refractive index functional material layer disposed on the first surface of the transition layer as a waveguide layer, wherein the high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.7, and a protective layer covering the waveguide layer, wherein the protective layer simultaneously covers the glass substrate, the transition layer, and the waveguide layer; wherein a first boundary layer is formed between the glass substrate and the transition layer, and a second boundary layer is formed between the transition layer and the waveguide layer. This application comprehensively provides an anti-warping photonic device with a multi-layer buffer structure, which, through specific partitioning design and multi-layer buffer structure design, can at least partially alleviate or solve the problem of increased warping caused by the "amplification effect" of large-size photonic devices.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device technology, and specifically relates to a multifunctional photonic device based on a glass substrate. Background Technology

[0002] As a core component of modern optical communication, optical sensing, and photonic integrated circuits (PICs), the performance and reliability of optical waveguide devices directly determine the quality of the entire optical system. In recent years, with the rapid development of data center interconnection, high-performance computing, and artificial intelligence, higher requirements have been placed on the transmission capacity, integration density, and physical size of optical waveguide devices.

[0003] Currently, silicon substrates (such as SOI-Siliconon Insulators) are the most commonly used substrate materials for fabricating optical waveguide devices in the industry. Silicon substrates have significant advantages such as high surface flatness, good compatibility with CMOS processes, and ease of micro / nano fabrication, making them the mainstream choice for high-performance, highly integrated optical waveguides. However, silicon substrates also have inherent limitations: for example, silicon itself has high absorption loss in the communication band, and while its high refractive index is beneficial for device miniaturization, it also leads to higher transmission loss and packaging alignment difficulties.

[0004] Therefore, people have considered using glass as a substrate to reduce the packaging difficulty of chips and improve chip performance. For example, the prior art CN119028829A proposes a glass substrate structure and its preparation method. This invention uses a glass substrate as a packaging substrate and takes advantage of the adjustable size, adjustable coefficient of thermal expansion, and low dielectric loss factor of the glass substrate to achieve smaller packaging size, reduce the risk of warping between the packaging substrate and the chip, and improve the dielectric performance of the packaging, thereby reducing the processing difficulty and processing cost. In other words, this application provides a small-size glass substrate packaging solution.

[0005] However, for certain applications requiring long transmission distances or large-area optical field operation (such as large optical phased arrays and certain types of biosensors), it is necessary to fabricate large-size optical waveguide devices on a single large-size glass substrate. Furthermore, for some multifunctional photonic devices, the integration of multiple devices on a single large-size glass substrate is also essential. Therefore, how to fully utilize the low-cost and high-performance advantages of glass substrates while suppressing package warpage in the fabrication of large-size optical waveguide devices remains a key technical challenge that urgently needs to be addressed in this field. Summary of the Invention

[0006] The purpose of this invention is to provide a multifunctional photonic device based on a glass substrate to partially alleviate or solve the above-mentioned problems and realize the manufacturing of large-size multifunctional optical waveguide devices that suppress package warping.

[0007] To solve the aforementioned technical problems, the present invention specifically adopts the following technical solution:

[0008] A multifunctional photonic device based on a glass substrate, comprising:

[0009] Glass substrate;

[0010] A transition layer is disposed on the first surface of the glass substrate, and a high refractive index functional material layer is disposed on the first surface of the transition layer as a waveguide layer. The high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.7. The waveguide layer is covered by a protective layer, which simultaneously covers the glass substrate, the transition layer, and the waveguide layer. A first boundary layer is formed between the glass substrate and the transition layer, and a second boundary layer is formed between the transition layer and the waveguide layer. The first boundary layer includes at least one first interface control structure, which includes at least one of a microcavity structure, a crack structure, and a sodium ion layer. The second boundary layer includes at least one second interface control structure, which includes at least one of a crack structure and a pore structure.

[0011] As an improvement, the transition layer is a SiO2 layer.

[0012] As an improvement, the high refractive index functional material layer includes at least one of niobium oxide (Nb2O5) material layer, tantalum oxide (Ta2O5) material layer, and polymer waveguide material layer.

[0013] As an improvement, the refractive index of the niobium oxide (Nb2O5) material layer is 2.1-2.3, the refractive index of the tantalum oxide (Ta2O5) material layer is 2-2.3, and the refractive index of the polymer waveguide material layer is 1.7-1.9.

[0014] As an improvement, the polymer waveguide material layer is a high-refractive-index lithography layer.

[0015] As an improvement, the thickness of the glass substrate is 300 μm - 1 mm, the thickness of the transition layer is 50 nm - 200 nm, the thickness of the waveguide layer is 300 nm - 400 nm, the thickness of the first boundary layer is 10 nm - 50 nm, and the thickness of the second boundary layer is 10 nm - 50 nm.

[0016] As an improvement, a heterogeneous material chip structure is integrated on the waveguide layer. The heterogeneous material chip structure includes at least one of the following functional units: a III-V compound semiconductor active device, a phase change material unit, a two-dimensional material unit, a piezoelectric material unit, or a sensing material unit.

[0017] As an improvement, the glass substrate is divided into at least three functional regions, which include at least a first functional region with a tantalum oxide (Ta2O5) material layer, a second functional region with a niobium oxide (Nb2O5) material layer, and a third functional region with a polymer waveguide material layer.

[0018] As an improvement, the first functional region is located at the external light source entrance of the photonic device. The tantalum oxide (Ta2O5) material layer is configured to receive external input light and perform filtering or wavelength division multiplexing functions. The second and third functional regions are arranged sequentially on the side of the first functional region away from the light source entrance. The second functional region is optically coupled to the first functional region. The niobium oxide (Nb2O5) material layer is configured to receive filtered light and achieve low-loss optical signal distribution and routing. The third functional region is optically coupled to the second functional region. The polymer waveguide material layer is configured to achieve optical sensing or beam shaping functions.

[0019] The optical signal is transmitted sequentially along the path of the first functional area, the second functional area, and the third functional area.

[0020] As an improvement, the third functional region is located at the center of the photonic device, the second functional region is located on the opposite first and / or third side of the third functional region, and the first functional region is located on the second side of the third functional region.

[0021] The principle and beneficial technical effects of this invention are as follows:

[0022] In existing technologies, limitations in material properties and process compatibility make it difficult to achieve large-size, multi-material photonic integration on a single substrate. The preferred approach is typically small-size chip-level integration or a single-material platform to avoid problems such as warping, stress concentration, and interface delamination caused by thermal expansion coefficient mismatch. However, this limits the expansion of photonic devices in terms of functional complexity and scale.

[0023] This application overcomes the above-mentioned design constraints and provides a solution for multi-material heterogeneous integration on a large-size glass substrate. Through specific partitioning design and multi-layer buffer structure design, it can at least partially alleviate or solve the problem of increased warping caused by the "amplification effect" of large-size photonic devices, thereby realizing the feasibility and reliability of large-size multifunctional devices.

[0024] Specifically, firstly, this solution provides a waveguide partitioning arrangement scheme. By partitioning optical waveguide materials with different functions (such as niobium oxide, tantalum oxide, and polymer waveguides) and optimizing their relative positions based on their stress characteristics, local stress accumulation is alleviated to a certain extent, preventing further amplification of warpage. Secondly, unlike the approach of using integrated components in existing technologies, this application adopts a split design for complex structures, distributing them across different functional areas. For example, optical signal distribution and optical sensing functions are assigned to the second and third functional areas respectively. This allows the photonic device to achieve multifunctional integration through large-scale synchronous processing without excessively increasing structural complexity and design difficulty.

[0025] Furthermore, contrary to the idea of ​​pursuing an ideal and complete interface (in the prior art, in order to ensure the connection strength between adjacent components, such as the substrate and the waveguide layer, it is necessary to ensure that the upper surface of the substrate and the lower surface of the waveguide layer can be directly attached as much as possible), this application sets a transition layer and a boundary layer with specific thickness and structure between the glass substrate and the waveguide layer. At the same time, the micro-nano structures such as microcavities, cracks or sodium ion layers introduced in the boundary layer can absorb and release some stress to a certain extent, thereby suppressing the overall warping amplitude to a certain extent.

[0026] In summary, this application provides a split partitioning scheme with a multi-layer transition structure. The transition structure reduces the warpage between the glass substrate and the waveguide layer, enabling partitioning. Furthermore, the partitioning enables multi-functional integration. At the same time, by rationally dividing the functional areas, the possibility of warpage can be reduced through the partitioning itself, thereby improving the stability of the entire photonic device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. The elements or parts in the drawings are not necessarily drawn to scale. Obviously, the drawings described below are some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0028] Figure 1 This is a schematic diagram of the first structure of a photonic device in an exemplary embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of the second structure of a photonic device in an exemplary embodiment of the present invention;

[0030] Figure 3This is a schematic diagram of the third structure of a photonic device in an exemplary embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the optical waveguides arranged in sections on a glass substrate in an exemplary embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the specific structure of the waveguide layer in an exemplary embodiment of the present invention.

[0033] In the diagram, the markings are as follows: 100, glass substrate; 200, transition layer; 300, waveguide layer; 310, tantalum oxide (Ta2O5) material layer; 320, niobium oxide (Nb2O5) material layer; 330, polymer waveguide material layer; 331, computing unit; 332, row waveguide; 500, protective layer; 600, first boundary layer; 700, second boundary layer; 800, substrate contact layer; 900, external light source. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0035] In this document, suffixes such as "module," "component," or "unit" used to denote elements are used solely for the purpose of illustrative purposes and have no specific meaning in themselves. Therefore, "module," "component," or "unit" may be used interchangeably. In this document, terms such as "upper," "lower," "inner," "outer," "front," "rear," "one end," and "the other end," indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] In this document, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. In this document, "multiple" means two or more, that is, it includes two, three, four, five, etc.

[0037] Example 1

[0038] Large-size glass substrates typically range in size from 100mm to 2000mm², or even larger. Compared to commonly used silicon wafers, glass panels have lower surface flatness due to their roughness. Furthermore, the significant difference in thermal expansion coefficients between glass and waveguide layers (such as silicon nitride (Si3N4) waveguides) makes them more prone to localized cracking, warping, and film delamination. Based on this, this application addresses the design requirements of large-size optical waveguide devices by providing a multifunctional photonic device based on a glass substrate. This device achieves integration of multifunctional devices on a large glass substrate while reducing the possibility of warping.

[0039] See Figures 1-5 This invention provides a multifunctional photonic device based on a glass substrate, comprising:

[0040] Glass substrate 100;

[0041] A transition layer 200 is disposed on the first surface (i.e., the upper surface) of the glass substrate 100. A high refractive index functional material layer is disposed on the first surface of the transition layer 200 as a waveguide layer 300. The high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.7. The waveguide layer 300 is covered by a protective layer 500, which simultaneously covers the glass substrate 100, the transition layer 200, and the waveguide layer 300. A first boundary layer 600 is formed between the glass substrate 100 and the transition layer 200, and a second boundary layer 700 is formed between the transition layer 200 and the waveguide layer 300 (see details). Figure 2 ).

[0042] The first boundary layer 600 includes at least one first interface control structure, which includes at least one of a microcavity structure, a crack structure, and a sodium ion layer; the second boundary layer 700 includes at least one second interface control structure, which includes at least one of a crack structure and a pore structure. Here, "microcavity structure" refers to a closed or semi-closed cavity formed within the first boundary layer, with a scale ranging from nanometers to submicrometers, such as a cavity formed by a bubble structure; and "sodium ion layer" refers to a layer formed within the first boundary layer region by sodium ions (Na+) in the glass substrate. + A chemically modified transition zone is formed by the outward migration and enrichment of substances.

[0043] The photonic device with the above structure is actually a warp-resistant photonic device with a multi-layered buffer structure (including a transition layer, a first boundary layer, and a second boundary layer). First, the transition layer 200 alleviates the problem of poor adhesion between the glass substrate 100 and the waveguide layer 300 caused by material differences. Second, the first boundary layer 600 between the transition layer 200 and the glass substrate 100 and the second boundary layer 700 between the transition layer 200 and the waveguide layer 300 strengthen the connection between the transition layer 200 and adjacent components, further reducing the possibility of warping. In other words... Conversely, in contrast to the existing technology that pursues an ideal and complete interface (in the existing technology, in order to ensure the connection strength between adjacent components, such as the substrate and the waveguide layer 300, it is necessary to ensure that the upper surface of the substrate and the lower surface of the waveguide layer 300 can be directly attached as much as possible), this application introduces a transition layer 200 and a boundary layer with a specific thickness and structure between the glass substrate 100 and the waveguide layer 300. At the same time, micro- and nano-structures such as microcavities, cracks, or sodium ion layers are formed in the boundary layer. This can absorb and release some stress to a certain extent, thereby suppressing the overall warping amplitude to a certain extent.

[0044] In some embodiments, the refractive index of the high refractive index functional material layer is 1.7-3.5.

[0045] In some embodiments, the thickness of the glass substrate 100 is 300 μm - 1 mm, the thickness of the transition layer 200 is 50 nm - 200 nm, the thickness of the waveguide layer 300 is 300 nm - 400 nm, the thickness of the first boundary layer 600 is 10 nm - 50 nm, and the thickness of the second boundary layer 700 is 10 nm - 50 nm.

[0046] In some embodiments, a substrate contact layer 800 is further provided between the transition layer 200 and the glass substrate 100 (see [reference]). Figure 3The thickness of the substrate contact layer 800 is 5 nm-50 nm.

[0047] In some embodiments, the substrate contact layer 800 is a silicon oxide layer. By providing the substrate contact layer 800, the rough surface of the glass substrate 100, or the unevenness caused by the large area span of a large glass substrate, can be smoothed. In other words, the surface of the glass substrate 100 is interface-optimized by the substrate contact layer 800, improving its flatness and thus enhancing its bonding with the waveguide layer. In this embodiment, the first boundary layer 600 is (directly) located between the substrate contact layer 800 and the transition layer 200. It should be noted that the first boundary layer 600 is still (indirectly) located between the glass substrate 100 and the transition layer 200.

[0048] In some embodiments, the transition layer 200 is a SiO2 (silicon dioxide) layer.

[0049] In some embodiments, the high refractive index functional material layer includes at least three different material layers. Taking three material layers as an example, the high refractive index functional material layer includes a first refractive index material layer, a second refractive index material layer, and a third refractive index material layer, wherein the refractive indices of the first refractive index material layer and the third refractive index material layer are greater than those of the second refractive index material layer.

[0050] In some embodiments, the high refractive index functional material layer includes at least one of niobium oxide (Nb2O5) material layer 320, tantalum oxide (Ta2O5) material layer 310, and polymer waveguide material layer 330.

[0051] In some embodiments, the refractive index of the niobium oxide (Nb2O5) material layer 320 is 2.1-2.3, the refractive index of the tantalum oxide (Ta2O5) material layer 310 is 2-2.3, and the refractive index of the polymer waveguide material layer 330 is 1.7-1.9.

[0052] In some embodiments, the polymer waveguide material layer 330 is a high-refractive-index lithography layer.

[0053] In some embodiments, a heterogeneous material chip structure is integrated on the waveguide layer 300. The heterogeneous material chip structure includes at least one of the following functional units: a III-V compound semiconductor active device, a phase change material unit, a two-dimensional material unit, a piezoelectric material unit, or a sensing material unit. By integrating different heterogeneous material chip structures, photonic devices can meet different application requirements. Furthermore, the multi-layer buffer structure allows for the simultaneous integration of multiple heterogeneous materials on the waveguide layer 300, while also preventing the waveguide layer 300 from experiencing significant warping.

[0054] In some embodiments, the glass substrate 100 is divided into at least three functional regions, including at least a first functional region, a second functional region, and a third functional region. The first functional region is provided with a first refractive index material layer, the second functional region is provided with a second refractive index material layer, and the third functional region is provided with a third refractive index material layer. The first refractive index material layer is configured at least to receive external input light and perform filtering or wavelength division multiplexing functions. The second refractive index material layer is configured at least to receive filtered light and achieve low-loss optical signal distribution and routing. The third refractive index material layer is configured to achieve optical sensing or beam shaping functions.

[0055] In some specific embodiments, the at least three functional regions include at least a first functional region with a tantalum oxide (Ta2O5) material layer 310, a second functional region with a niobium oxide (Nb2O5) material layer 320, and a third functional region with a polymer waveguide material layer 330. That is, the first refractive index material layer can be a tantalum oxide (Ta2O5) material layer 310, the second refractive index material layer can be a niobium oxide (Nb2O5) material layer 320, and the third refractive index material layer can be a polymer waveguide material layer 330.

[0056] The first functional region is located at the entrance of the external light source 900 of the photonic device. The tantalum oxide (Ta2O5) material layer 310 is configured to receive external input light and perform filtering or wavelength division multiplexing functions. The second and third functional regions are arranged sequentially on the side of the first functional region away from the light source entrance. The second functional region is optically coupled to the first functional region. The niobium oxide (Nb2O5) material layer 320 is configured to receive filtered light and achieve low-loss optical signal distribution and routing. The third functional region is optically coupled to the second functional region. The polymer waveguide material layer 330 is configured to achieve optical sensing or beam shaping functions. The optical signal is transmitted sequentially along the path of the first functional region, the second functional region, and the third functional region.

[0057] In some embodiments, the first functional area is provided with at least a filter, the second functional area is provided with at least a beam splitter and a microring, and the third functional area is provided with at least a sensor and a microlens.

[0058] Exemplary (see details) Figure 5The external light source A (single-wavelength signal) first enters the tantalum oxide (Ta2O5) material layer 310, exciting a series of light with different wavelengths a1, a2, a3..., and then enters the niobium oxide (Nb2O5) material layer 320 and is distributed into multiple light sources. The multiple light sources enter different traveling waveguides 332, and then are calculated by different computing units 331, and finally integrated and output.

[0059] In other words, this application also provides a split-partition scheme with a transition structure. The partition design can be realized through a multi-layer buffer structure. In the specific partitioning process, high refractive index functional material layers with different functions are first set in different regions to achieve different functions. At the same time, complex components are externalized (for example, components such as beam splitters and sensors are set in the second and third regions respectively). This can avoid component concentration caused by partitioning to a certain extent, thereby avoiding stress concentration and warping problems.

[0060] In some embodiments, the third functional region is located at the center of the photonic device, the second functional region is located on a first and / or third side opposite to the third functional region, and the first functional region is located on a second side of the third functional region. By rationally dividing the functional regions, the distribution of each component can be made more uniform, reducing stress concentration caused by excessive component concentration, which can lead to severe warping.

[0061] In summary, this application provides a split-partition scheme with a multi-layer transition structure, which can at least partially alleviate or solve the problem of increased warping caused by the "amplification effect" of large-size photonic devices, thereby realizing the feasibility and reliability of large-size multifunctional devices. Specifically, the "amplification effect" refers to the fact that, compared to wafers, the probability of thermal stress and structural defects in glass substrates increases significantly with their size and area, leading to reduced performance or even malfunction of the photonic devices (especially optical waveguides and heterogeneous material chip structures) on top.

[0062] Example 2

[0063] This embodiment provides a multifunctional photonic device based on a glass substrate. Unlike Embodiment 1, the substrate in this embodiment includes, but is not limited to, a glass substrate. Specifically, the optical waveguide device includes:

[0064] A substrate; a transition layer 200 is disposed on the first surface of the substrate, an X-based silicon waveguide layer 300 is disposed on the first surface of the transition layer 200, a heterogeneous material chip layer is integrated on the X-based silicon waveguide layer 300, and a protective layer 500 is covered on the first surface of the X-based silicon waveguide layer 300, the protective layer 500 simultaneously covering the substrate, the X-based silicon waveguide layer 300 and the heterogeneous material chip layer; wherein, the transition layer 200 contains the same X element as the X-based silicon waveguide layer 300.

[0065] In some embodiments, the substrate may be one of a sapphire substrate (single-crystal alumina, Al2O3), an aluminum nitride substrate, or a polymer substrate.

[0066] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0067] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

Claims

1. A multifunctional photonic device based on a glass substrate, characterized in that, Comprise: A glass substrate (100); A first surface of the glass substrate (100) is provided with a transition layer (200), a first surface of the transition layer (200) is provided with a high refractive index functional material layer as a waveguide layer (300), the high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.7, the waveguide layer (300) is coated with a protective layer (500), and the protective layer (500) covers the glass substrate (100), the transition layer (200) and the waveguide layer (300) at the same time; wherein A first boundary layer (600) is formed between the glass substrate (100) and the transition layer (200), and a second boundary layer (700) is formed between the transition layer (200) and the waveguide layer (300); The first boundary layer (600) comprises at least one first interface control structure, and the first interface control structure comprises at least one of a microcavity structure, a crack structure and a sodium ion layer; the second boundary layer (700) comprises at least one second interface control structure, and the second interface control structure comprises at least one of a crack structure and a hole structure.

2. The glass substrate based multifunctional photonic device of claim 1, wherein, The transition layer (200) is a SiO2 layer.

3. The glass substrate based multifunctional photonic device of claim 1, wherein The high refractive index functional material layer comprises at least one of an Nb2O5 material layer, a Ta2O5 material layer and a polymer waveguide material layer (330).

4. The glass substrate based multifunctional photonic device of claim 3, wherein, The refractive index of the Nb2O5 material layer is 2.1-2.3, the refractive index of the Ta2O5 material layer is 2-2.3, and the refractive index of the polymer waveguide material layer (330) is 1.7-1.

9.

5. The glass substrate based multifunctional photonic device of claim 4, wherein, The polymer waveguide material layer (330) is a photoresist layer with a refractive index of 1.7-1.

9.

6. The glass substrate based multifunctional photonic device according to any one of claims 1-5, wherein, The thickness of the glass substrate (100) is 300 um -1mm, the thickness of the transition layer (200) is 50 nm -200nm, the thickness of the waveguide layer (300) is 300nm-400nm, the thickness of the first boundary layer (600) is 10nm-50nm, and the thickness of the second boundary layer (700) is 10nm-50nm.

7. The glass substrate based multifunctional photonic device of claim 1, wherein, A heterogeneous material chip structure is integrated on the waveguide layer (300), and the heterogeneous material chip structure comprises at least one functional unit of the following: a III-V compound semiconductor active device, a phase change material unit, a two-dimensional material unit, a piezoelectric material unit or a sensing material unit.

8. The glass substrate based multifunctional photonic device of claim 1, wherein, The glass substrate (100) is divided into at least three functional areas, and the at least three functional areas at least include a first functional area provided with a Ta2O5 material layer, a second functional area provided with an Nb2O5 material layer, and a third functional area provided with a polymer waveguide material layer (330).

9. The glass substrate based multifunctional photonic device of claim 8, wherein, The first functional region is arranged at the entrance of an external light source (900) of the photonic device, the Ta2O5 material layer is configured to receive external input light and perform filtering or wavelength division multiplexing function, the second functional region and the third functional region are arranged in sequence on the side of the first functional region away from the entrance of the external light source (900), wherein the second functional region is optically coupled with the first functional region, the Nb2O5 material layer is configured to receive filtered light and realize low-loss optical signal distribution and routing; the third functional region is optically coupled with the second functional region, and the polymer waveguide material layer (330) is configured to realize optical sensing or beam shaping function. Wherein, the optical signal is sequentially transmitted along the paths of the first functional region, the second functional region and the third functional region.

10. The glass substrate based multifunctional photonic device according to claim 8 or 9, wherein The third functional region is located at the center of the photonic device, the second functional region is located at the first side and / or the third side opposite to the third functional region, and the first functional region is located at the second side of the third functional region.

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