A multi-chip package structure and a packaging method thereof

Abstract

The application discloses a multi-chip packaging structure and a packaging method thereof, relates to the technical field of chip packaging, and comprises a mounting seat, a packaging frame is fixedly connected to the upper side of the mounting seat, a partition plate is fixedly connected to the inner side of the packaging frame, an upper cover is arranged on the upper side of the partition plate, a clamping block is fixedly connected to the lower side of the upper cover, a plurality of chip bodies are arranged on the upper side of the mounting seat, radiating fins are arranged on the upper side of the chip bodies, a stabilizing unit is arranged on the outer side of the chip bodies, and the stabilizing unit comprises a plurality of mounting grooves. The multi-chip packaging structure is provided with the mounting seat, the packaging frame, the chip body, the pin contact block, the branch block, the radiating block and the screw rod, the screw rod is conveniently rotated, the radiating blocks on the plurality of branch blocks are controlled to be close to the chip body and to press down the pins, the chip body is quickly mounted on the mounting seat, the workload of workers in welding the pins is reduced, and the operation is simple.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a multi-chip packaging structure and its packaging method. Background Technology

[0002] A chip, also known as an integrated circuit, is a core component of modern electronic devices. It achieves complex circuit functions by integrating a large number of electronic components (such as transistors, resistors, and capacitors) onto a small piece of semiconductor material. When packaging multiple chips, multiple chips need to be placed on a mounting socket for packaging.

[0003] A search revealed a Chinese patent with application number "CN202311300886.7", which specifically describes a combined embedded multi-chip packaging structure. The structure includes a mounting base with a heat-conducting plate adhered to its upper part. A first welding base is attached to the upper part of the heat-conducting plate. Four sets of first chip mounting bases are disposed inside the first welding base. A second welding base is snap-fitted onto the upper part of the first welding base, and four sets of second chip mounting bases are disposed on the upper surface of the second welding base. Each set of second chip mounting bases contains a group of high-layer chips welded inside.

[0004] In the aforementioned patent, when the chip is packaged, it is placed on a mounting base. When installing the chip, multiple pins of the chip need to be soldered onto the mounting base. When installing multiple chips, this increases the workload of the staff in soldering multiple pins, making the chip packaging operation more cumbersome and complicated. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a multi-chip packaging structure and packaging method, which solves the problem of cumbersome pin packaging on multiple chips.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A multi-chip package structure includes a mounting base, a package frame fixedly connected to the upper side of the mounting base, a partition plate fixedly connected to the inner side of the package frame, an upper cover provided on the upper side of the partition plate, a locking block fixedly connected to the lower side of the upper cover, multiple chip bodies provided on the upper side of the mounting base, a heat sink provided on the upper side of the chip bodies, a stabilizing unit provided on the outer side of the chip bodies, the stabilizing unit including multiple mounting slots, the multiple mounting slots being formed on the upper side of the mounting base, a pin contact block provided on the inner side of the mounting slot, a pin limiting component provided above the pin contact block, the pin limiting component being used to limit the pins of the chip bodies for quick installation, and multiple support blocks fixedly connected to the inner wall of the partition plate, a top limiting component provided above the support blocks.

[0008] Preferably, the pin limiting assembly includes a guide plate 1, which is fixedly connected to the upper side of the mounting base and located on the left and right sides of the chip body. Guide blocks 1 are slidably connected to the outer sides of the guide plates 1 on both sides. A connecting plate 1 is fixedly connected between two guide blocks 1. A vertical plate is fixedly connected to the upper side of the connecting plate 1. A lifting groove is formed on the outer side of the vertical plate. A lifting block is slidably connected to the inner side of the lifting groove. A lifting plate is fixedly connected between two lifting blocks. A control block 1 is fixedly connected to the upper side of the lifting plate. A connecting plate 2 is fixedly connected to the lower side of the control block 1. Multiple branch blocks are fixedly connected to the lower side of the connecting plate 2. Multiple heat sinks are fixedly connected to the lower side of the branch blocks. A sliding rod is fixedly connected to the outer side of one of the lifting blocks. A fixing plate is fixedly connected to the upper side of the mounting base. An inclined groove is formed on the outer side of the fixing plate. The sliding rod is slidably connected to the inclined groove.

[0009] Preferably, a rectangular hole is provided on the outer side of the encapsulation frame, a fixing block is fixedly connected to the inner wall of the rectangular hole, a rotating block is fixedly connected to the outer side of another guide block, an inclined plate is rotatably connected to the outer side of both rotating blocks, a rotating block is rotatably connected to the outer side of the inclined plate, a moving block is fixedly connected to the outer side of the rotating block, and a screw is rotatably connected to the outer side of the fixing block.

[0010] Preferably, protective boxes are fixedly connected to both the front and rear sides of the encapsulation frame, the screw is threadedly connected to the movable block, the outer end of the screw passes through the outer side of the protective box and is fixedly connected to a rotating cap, a limit rod is fixedly connected to the outer side of the fixed block, and the limit rod is slidably connected to the movable block.

[0011] Preferably, the top limiting assembly includes two control rods, which are rotatably connected to the inner wall of the partition plate and located on the left and right sides of the chip body. Multiple limiting blocks are fixedly connected to the outer side of the control rods. The outer ends of the two control rods pass through the outer side of the packaging frame and are fixedly connected to control block two. Inclined plate two is rotatably connected to the outer side of the two control blocks two. Connecting block one is rotatably connected to the outer side of the inclined plate two. Push plate is fixedly connected to the outer side of the connecting block one. Side block is fixedly connected to the outer side of the packaging frame. Side block is slidably connected to push plate.

[0012] Preferably, a rotating shaft is rotatably connected to the outer side of the packaging frame, a turntable is fixedly connected to the outer end of the rotating shaft, two rotating blocks three are fixedly connected to the outer side of the turntable, and inclined plates three are rotatably connected to the outer side of each of the two rotating blocks three. The inclined plates three are rotatably connected to the push plate. A gear is fixedly connected to the outer side of the rotating shaft, a guide plate two is fixedly connected to the outer side of the packaging frame, a guide block two is slidably connected to the outer side of the guide plate two, an L-shaped block is fixedly connected to the outer side of the guide block two, a toothed plate that meshes with the gear is fixedly connected to the outer side of the L-shaped block, a rotating block four is fixedly connected to the side of the L-shaped block away from the fixed block, an inclined plate four is rotatably connected to the outer side of the rotating block four, and a rotating block five is fixedly connected to the side of the moving block close to the fixed block. The rotating block five is rotatably connected to the inclined plate four.

[0013] A packaging method for a multi-chip package structure includes the following steps:

[0014] S1. Place multiple chip bodies on the upper side of the mounting base, so that the pins on the chip bodies contact the pin contact blocks, and place the heat sink on the upper side of the chip bodies.

[0015] S2. Rotate the rotating cap to control the screw to rotate and connect. Under the action of the moving block, inclined plate one, and guide block one, control the branch blocks and heat sink on both sides to move closer to the pins of the chip body. At the same time, under the action of the upright plate, lifting block, slide bar and inclined slot, control the branch blocks and heat sink to press down on the pins of the chip body to quickly install the chip body. At the same time, control multiple limit blocks to limit the heat sink.

[0016] S3. Press the top cover down onto the upper side of the mounting base to complete the packaging of multiple chip bodies.

[0017] This invention provides a multi-chip packaging structure and its packaging method. Compared with the prior art, it has the following advantages:

[0018] (1) The multi-chip package structure is equipped with a mounting base, a package frame, a chip body, pin contact blocks, branch blocks, heat sinks, and screws. The screws can be rotated to control the heat sinks on multiple branch blocks to move closer to the chip body and press down the pins, so that the chip body can be quickly installed on the mounting base, reducing the workload of the staff in soldering the pins and making the operation simple.

[0019] (2) The multi-chip package structure is equipped with heat sink, support block, limit block, control rod, gear, and toothed plate, which facilitates the limit of the heat sink when the pin is limited, and facilitates the limit of the top of the chip body, thereby increasing the stability of the chip installation. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0022] Figure 3 This is an exploded view of the present invention;

[0023] Figure 4 This is a partial three-dimensional structural diagram of the internal structure of the present invention;

[0024] Figure 5 This is a three-dimensional structural diagram of the pin limiting component in this invention;

[0025] Figure 6 for Figure 5 Enlarged view of point A in the middle;

[0026] Figure 7 for Figure 5 Enlarged view of point B in the middle;

[0027] Figure 8 This is a three-dimensional structural diagram of the bottom limiting component in this invention;

[0028] Figure 9 for Figure 8 A magnified view of point C in the middle.

[0029] In the diagram: 1. Mounting base; 2. Top cover; 3. Locking block; 4. Protective box; 5. Encapsulation frame; 6. Divider plate; 7. Stabilizing unit; 8. Chip body; 9. Heat sink; 71. Support block; 72. Mounting slot; 73. Pin contact block; 74. Pin limiting assembly; 75. Top limiting assembly; 76. Rectangular hole; 77. Fixing block; 741. Guide plate one; 742. Guide block one; 743. Connecting plate one; 744. Vertical plate; 745. Lifting slot; 746. Lifting block; 747. Lifting plate; 748. Control block one; 749. Connecting plate two; 7410. Branch block; 7411. Heat sink; 7412. Slide rod; 7413. Fixing plate; 7 414. Inclined groove; 7415. Rotating block one; 7416. Inclined plate one; 7417. Rotating block two; 7418. Moving block; 7419. Limiting rod; 7420. Screw; 7421. Rotating cap; 751. Control rod; 752. Limiting block; 753. Control block two; 754. Inclined plate two; 755. Connecting block one; 756. Push plate; 757. Side block; 758. Rotating shaft; 759. Turntable; 7510. Rotating block three; 7511. Inclined plate three; 7512. Gear; 7513. Gear plate; 7514. Guide plate two; 7515. Guide block two; 7516. L-shaped block; 7517. Rotating block four; 7518. Inclined plate four; 7519. Rotating block five. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] This invention provides the following technical solutions:

[0032] Example 1

[0033] Please see Figures 1-7 A multi-chip packaging structure includes a mounting base 1, a packaging frame 5 fixedly connected to the upper side of the mounting base 1, a partition plate 6 fixedly connected to the inner side of the packaging frame 5, an upper cover 2 provided on the upper side of the partition plate 6, a locking block 3 fixedly connected to the lower side of the upper cover 2, multiple chip bodies 8 provided on the upper side of the mounting base 1, a heat sink 9 provided on the upper side of the chip body 8, a stabilizing unit 7 provided on the outer side of the chip body 8, the stabilizing unit 7 including multiple mounting slots 72, the multiple mounting slots 72 being opened on the upper side of the mounting base 1, a pin contact block 73 provided on the inner side of the mounting slot 72, a pin limiting component 74 provided above the pin contact block 73, the pin limiting component 74 being used to limit the pins of the chip body 8 for quick installation of the chip body 8, multiple support blocks 71 fixedly connected to the inner wall of the partition plate 6, a top limiting component 75 provided above the support blocks 71. When packaging multiple chips, the chip body 8 is first placed on the upper side of the mounting base 1, and the heat sink 9 is used to dissipate heat from the chip body 8.

[0034] The pin limiting assembly 74 includes a guide plate 741, which is fixedly connected to the upper side of the mounting base 1 and located on the left and right sides of the chip body 8. Guide blocks 742 are slidably connected to the outer sides of both guide plates 741. A connecting plate 743 is fixedly connected between the two guide blocks 742. A vertical plate 744 is fixedly connected to the upper side of the connecting plate 743. A lifting groove 745 is formed on the outer side of the vertical plate 744, and a lifting block 745 is slidably connected to the inner side of the lifting groove 745. 46. ​​A lifting plate 747 is fixedly connected between two lifting blocks 746. A control block 1 748 is fixedly connected to the upper side of the lifting plate 747. A connecting plate 2 749 is fixedly connected to the lower side of the control block 1 748. Multiple branch blocks 7410 are fixedly connected to the lower side of the connecting plate 2 749. Multiple heat dissipation blocks 7411 are fixedly connected to the lower side of the branch blocks 7410. A slide rod 7412 is fixedly connected to the outer side of one of the lifting blocks 746. The upper side of the mounting base 1 is fixedly connected to... A fixing plate 7413 is attached, and a slanted groove 7414 is formed on the outer side of the fixing plate 7413. The sliding rod 7412 is slidably connected to the slanted groove 7414. A rectangular hole 76 is formed on the outer side of the encapsulation frame 5, and a fixing block 77 is fixedly connected to the inner wall of the rectangular hole 76. A rotating block 7415 is fixedly connected to the outer side of another guide block 742. A slanted plate 7416 is rotatably connected to the outer side of both rotating blocks 7415, and a rotating block 741 is rotatably connected to the outer side of the slanted plate 7416. 7. A movable block 7418 is fixedly connected to the outer side of the rotating block 7417. A screw 7420 is rotatably connected to the outer side of the fixed block 77. Protective boxes 4 are fixedly connected to both the front and rear sides of the encapsulation frame 5. The screw 7420 is threadedly connected to the movable block 7418. The outer end of the screw 7420 passes through the outer side of the protective box 4 and is fixedly connected to a rotating cap 7421. A limit rod 7419 is fixedly connected to the outer side of the fixed block 77. The limit rod 7419 is slidably connected to the movable block 7418.

[0035] During the encapsulation of the chip body 8, multiple pins on the chip body 8 contact the pin contact block 73 to facilitate normal communication of the chip body 8. The heat sink 9 is placed on the upper side of the chip body 8, and then the rotating cap 7421 is rotated. The rotating cap 7421 drives the screw 7420 to rotate, and the screw 7420 drives the moving block 7418 to move away from the encapsulation frame 5. The moving block 7418 drives the inclined plate 7416 to rotate. Since the two inclined plates 7416 are symmetrically distributed, the two guide blocks 742 move closer to each other. The guide blocks 742 drive the upright plate 7 44 moves, the upright plate 744 drives the branch block 7410 on the connecting plate 749 to move, the branch block 7410 drives the heat sink 7411 to move, at the same time the lifting block 746 drives the slide bar 7412 to move, the slide bar 7412 under the action of the inclined slot 7414, the lifting block 746 descends, the lifting block 746 drives the branch block 7410 and the heat sink 7411 to descend and press down on the pins on the chip body 8, so that the pins on the chip body 8 can be quickly limited, reducing the workload of the staff to solder the pins, and facilitating the rapid packaging of multiple chip bodies 8.

[0036] Example 2

[0037] Based on Example 1, such as Figure 8 , Figure 9 As shown, the top limiting assembly 75 includes two control levers 751, which are rotatably connected to the inner wall of the partition plate 6 and located on the left and right sides of the chip body 8. Multiple limiting blocks 752 are fixedly connected to the outer sides of the control levers 751. The outer ends of both control levers 751 pass through the outer side of the encapsulation frame 5 and are fixedly connected to control block 753. An inclined plate 754 is rotatably connected to the outer side of the two control blocks 753. A connecting block 755 is rotatably connected to the outer side of the inclined plate 754. A push plate 756 is fixedly connected to the outer side of the connecting block 755. A side block 757 is fixedly connected to the outer side of the encapsulation frame 5 and is slidably connected to the push plate 756. A rotating shaft 758 is rotatably connected to the outer side of the encapsulation frame 5. A turntable 759 is fixedly connected to the outer end of the rotating shaft 758. Two rotating blocks 752 are fixedly connected to the outer side of the turntable 759. 510, both rotating blocks 3 7510 are rotatably connected to inclined plates 3 7511 on their outer sides. Inclined plates 3 7511 are rotatably connected to push plates 756. Gear 7512 is fixedly connected to the outer side of rotating shaft 758. Guide plate 2 7514 is fixedly connected to the outer side of encapsulation frame 5. Guide block 2 7515 is slidably connected to the outer side of guide plate 2 7514. L-shaped block 7516 is fixedly connected to the outer side of guide block 2 7515. Toothed plate 7513, which meshes with gear 7512, is fixedly connected to the outer side of L-shaped block 7516 away from fixed block 77. Rotating block 4 7517 is fixedly connected to the outer side of rotating block 4 7517. Inclined plate 4 7518 is rotatably connected to the outer side of rotating block 4 7517. Rotating block 5 7519 is fixedly connected to the side of moving block 7418 close to fixed block 77. Rotating block 5 7519 is rotatably connected to inclined plate 4 7518.

[0038] When limiting the pins of the chip body 8, the moving block 7418 drives the inclined plate 7518 to rotate, the inclined plate 7518 drives the L-shaped block 7516 to descend, the L-shaped block 7516 drives the toothed plate 7513 to descend, the toothed plate 7513 drives the gear 7512 to rotate, the gear 7512 drives the rotating shaft 758 to rotate, the rotating shaft 758 drives the turntable 759 to rotate, the turntable 759 drives the rotating block 7510 to rotate, and the rotating block 7510 drives the inclined plate 7511 to rotate. Because the two inclined plates 7511... 11 is a parallel structure. The inclined plate 3 7511 drives the push plate 756 to move. The two push plates 756 drive the inclined plate 2 754 to rotate. The inclined plate 2 754 drives the control block 2 753 to rotate. The control block 2 753 drives the control rod 751 to rotate. Since the two push plates 756 move in opposite directions, the two control rods 751 rotate in opposite directions. This causes the control rod 751 to drive the limit block 752 to press down on the heat sink 9, which facilitates the limiting of the heat sink 9 and increases the stability of the chip body 8 installation.

[0039] A packaging method for a multi-chip package structure includes the following steps:

[0040] S1. Place multiple chip bodies 8 on the upper side of the mounting base 1, so that the pins on the chip bodies 8 contact the pin contact block 73, and place the heat sink 9 on the upper side of the chip bodies 8.

[0041] S2. Rotate the rotating cap 7421 to control the screw 7420 to rotate and connect. Under the action of the moving block 7418, the inclined plate 7416, and the guide block 742, control the branch blocks 7410 and the heat sink 7411 on both sides to move closer to the pins of the chip body 8. At the same time, under the action of the upright plate 744, the lifting block 746, the slide bar 7412 and the inclined groove 7414, control the branch blocks 7410 and the heat sink 7411 to press down on the pins of the chip body 8, and quickly install the chip body 8. At the same time, control multiple limit blocks 752 to limit the heat sink 9.

[0042] S3. Press the upper cover 2 down onto the upper side of the mounting base 1 to complete the encapsulation of multiple chip bodies 8.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-chip package structure comprising a mounting base (1), characterized in that: A packaging frame (5) is fixedly connected to the upper side of the mounting base (1). A partition plate (6) is fixedly connected to the inner side of the packaging frame (5). An upper cover (2) is provided on the upper side of the partition plate (6). A locking block (3) is fixedly connected to the lower side of the upper cover (2). Multiple chip bodies (8) are provided on the upper side of the mounting base (1). A heat sink (9) is provided on the upper side of the chip body (8). A stabilizing unit (7) is provided on the outer side of the chip body (8). The stabilizing unit (7) includes multiple mounting slots (72). Multiple mounting slots (72) are provided on the upper side of the mounting base (1). A pin contact block (73) is provided on the inner side of the mounting slot (72). A pin limiting component (74) is provided above the pin contact block (73). The pin limiting component (74) is used to limit the pins of the chip body (8) for quick installation. Multiple support blocks (71) are fixedly connected to the inner wall of the partition plate (6). A top limiting component (75) is provided above the support block (71). The pin limiting assembly (74) includes a guide plate (741), which is fixedly connected to the upper side of the mounting base (1) and located on the left and right sides of the chip body (8). Guide blocks (742) are slidably connected to the outer sides of the guide plates (741) on both sides. A connecting plate (743) is fixedly connected between the two guide blocks (742). A vertical plate (744) is fixedly connected to the upper side of the connecting plate (743). A lifting groove (745) is provided on the outer side of the vertical plate (744). A lifting block (746) is slidably connected to the inner side of the lifting groove (745). A lifting plate (747) is fixedly connected between the two lifting blocks (746). The upper side of the lifting plate (747) is fixedly connected to a control block 1 (748), the lower side of the control block 1 (748) is fixedly connected to a connecting plate 2 (749), the lower side of the connecting plate 2 (749) is fixedly connected to multiple branch blocks (7410), the lower side of the branch blocks (7410) is fixedly connected to multiple heat dissipation blocks (7411), one of the lifting blocks (746) is fixedly connected to a slide rod (7412), the upper side of the mounting base (1) is fixedly connected to a fixing plate (7413), the outer side of the fixing plate (7413) is provided with a slanted groove (7414), and the slide rod (7412) is slidably connected to the slanted groove (7414). A rectangular hole (76) is provided on the outer side of the encapsulation frame (5). A fixing block (77) is fixedly connected to the inner wall of the rectangular hole (76). A rotating block (7415) is fixedly connected to the outer side of another guide block (742). An inclined plate (7416) is rotatably connected to the outer side of both rotating blocks (7415). A rotating block (7417) is rotatably connected to the outer side of the inclined plate (7416). A moving block (7418) is fixedly connected to the outer side of the rotating block (7417). A screw (7420) is rotatably connected to the outer side of the fixing block (77).

2. The multi-chip package structure of claim 1, wherein: The front and rear sides of the encapsulation frame (5) are fixedly connected to protective boxes (4). The screw (7420) is threadedly connected to the moving block (7418). The outer end of the screw (7420) passes through the outer side of the protective box (4) and is fixedly connected to a rotating cap (7421). The outer side of the fixed block (77) is fixedly connected to a limiting rod (7419). The limiting rod (7419) is slidably connected to the moving block (7418).

3. The multi-chip package structure of claim 2, wherein: The top limiting assembly (75) includes two control rods (751). The two control rods (751) are rotatably connected to the inner wall of the partition plate (6) and located on the left and right sides of the chip body (8). Multiple limiting blocks (752) are fixedly connected to the outer side of the control rods (751). The outer ends of the two control rods (751) pass through the outer side of the packaging frame (5) and are fixedly connected to control block two (753). The outer side of the two control blocks two (753) is rotatably connected to inclined plate two (754). The outer side of the inclined plate two (754) is rotatably connected to connecting block one (755). The outer side of the connecting block one (755) is fixedly connected to push plate (756). The outer side of the packaging frame (5) is fixedly connected to side block (757). The side block (757) is slidably connected to push plate (756).

4. The multi-chip package structure of claim 3, wherein: A rotating shaft (758) is rotatably connected to the outer side of the encapsulation frame (5). A turntable (759) is fixedly connected to the outer end of the rotating shaft (758). Two rotating blocks (7510) are fixedly connected to the outer side of the turntable (759). An inclined plate (7511) is rotatably connected to the outer side of each of the two rotating blocks (7510). The inclined plate (7511) is rotatably connected to the push plate (756). A gear (7512) is fixedly connected to the outer side of the rotating shaft (758). A guide plate (7514) is fixedly connected to the outer side of the encapsulation frame (5). A guide block (2) is slidably connected to the outer side of the guide plate (7514). (7515), an L-shaped block (7516) is fixedly connected to the outer side of the guide block two (7515), a toothed plate (7513) that meshes with the gear (7512) is fixedly connected to the outer side of the L-shaped block (7516), a rotating block four (7517) is fixedly connected to the side of the L-shaped block (7516) away from the fixed block (77), an inclined plate four (7518) is rotatably connected to the outer side of the rotating block four (7517), a rotating block five (7519) is fixedly connected to the side of the moving block (7418) close to the fixed block (77), and the rotating block five (7519) is rotatably connected to the inclined plate four (7518).

5. A packaging method of a multi-chip package structure for the multi-chip package structure of claim 4, wherein, Includes the following steps: S1. Place multiple chip bodies (8) on the upper side of the mounting base (1), so that the pins on the chip bodies (8) contact the pin contact block (73), and place the heat sink (9) on the upper side of the chip bodies (8); S2. Rotate the rotating cap (7421) and control the screw (7420) to rotate and connect. Under the action of the moving block (7418), the inclined plate (7416), and the guide block (742), control the branch blocks (7410) and heat sink (7411) on both sides to move closer to the pins of the chip body (8). At the same time, under the action of the upright plate (744), the lifting block (746), the slide bar (7412), and the inclined groove (7414), control the branch blocks (7410) and heat sink (7411) to press down on the pins of the chip body (8) and quickly install the chip body (8). At the same time, control multiple limit blocks (752) to limit the heat sink (9). S3. Press the upper cover (2) down onto the upper side of the mounting base (1) to complete the encapsulation of multiple chip bodies (8).

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