Liquid-cooled insulated heat sink and system

Abstract

The application relates to the technical field of semiconductor heat dissipation, in particular to a liquid cooling insulation type radiator and system, a heat conduction assembly comprising a contact heat dissipation plate, a heat conduction medium layer, a plurality of heat conduction pipes, a connecting cavity, a plurality of magnet baffles, an electromagnet and a sliding driver; the contact heat dissipation plate is fixed on a support plate, the plurality of heat conduction pipes are installed on the contact heat dissipation plate through the heat conduction medium layer, the connecting cavity is in communication with liquid outlets of the plurality of heat conduction pipes, the plurality of magnet baffles are slidably arranged on one side of the plurality of heat conduction pipes, the sliding driver is arranged below the heat conduction pipes, the electromagnet is fixed on the sliding driver, and the opening degree of the liquid outlet is controlled by the electromagnet; the heat dissipation assembly is in communication with the connecting cavity and the liquid inlet of the heat conduction pipes, so that the cooling liquid flow of different regions can be adjusted to adjust the heat dissipation capacity in different regions, and the cooling efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor heat dissipation, in particular to a liquid cooling insulation type radiator and system. BACKGROUND

[0002] High-power semiconductor devices will generate heat during operation, in order to ensure its performance and prolong the service life, effective cooling method is essential. Common cooling methods include natural cooling, forced air cooling, liquid cooling and heat pipe heat dissipation. Natural cooling does not need additional energy input or mechanical parts, relying on the device surface and the surrounding environment temperature difference for heat transfer, suitable for low power consumption occasions. Forced air cooling is through the fan and other equipment to enhance the air flow, improve the heat dissipation efficiency, suitable for most ordinary application scenarios.

[0003] The existing high-power semiconductor devices in the working process of each region is different, but the existing cooling components can not be adjusted according to the cooling capacity of the heat dissipation degree, thereby reducing the cooling efficiency. SUMMARY

[0004] The purpose of the present application is to provide a liquid cooling insulation type radiator and system, which can adjust the flow of different cooling liquids for different regions to adjust the cooling capacity, thereby improving the cooling efficiency.

[0005] To achieve the above purpose, the first aspect, the present application provides a kind of liquid cooling insulation type radiator, including support plate and connecting structure, the connecting structure is connected with the support plate, and located in the side of the support plate, still including heat conduction component and heat dissipation component, the heat conduction component includes contact heat dissipation plate, heat conduction medium layer, multiple heat pipes, connecting cavity, multiple magnet baffle, electromagnet and sliding driver;The contact heat dissipation plate is fixed on the support plate, multiple heat pipes are installed on the contact heat dissipation plate by heat conduction medium layer, the connecting cavity is communicated with the liquid outlet of multiple heat pipes, multiple magnet baffles are slidably arranged on the side of multiple heat pipes, the sliding driver is arranged below the heat pipe, the electromagnet is fixed on the sliding driver, and the opening of the liquid outlet is controlled by the electromagnet through the magnet baffle;The heat dissipation component is communicated with the connecting cavity, and is communicated with the liquid inlet of the heat pipe.

[0006] Among them, the connecting cavity has multiple connecting holes, a first sealing ring is arranged in the connecting hole, the heat pipe is inserted into the connecting hole and in contact with the first sealing ring, a pressing plate is further arranged on the connecting cavity, multiple connecting blocks are arranged on the pressing plate, the connecting blocks are used to be inserted into the connecting groove in the connecting hole to complete locking, a lock ring is threadedly arranged on the connecting cavity, and the pressing plate is close to the connecting cavity by rotating the lock ring to install the heat pipe on the connecting cavity.

[0007] The magnet baffle comprises a baffle body, an elastic member and a protective layer, the baffle body is slidingly arranged in the connecting cavity, the elastic member is arranged between the baffle body and the connecting cavity, and the protective layer is arranged on the baffle body.

[0008] The sliding driver comprises a sliding closed shell, a sliding block, a gas pump and a gas storage shell, the sliding block is slidingly arranged in the sliding closed shell, and the sliding closed shell is divided into a first gas cavity and a second gas cavity by the sliding block, the gas pump is connected with the first gas cavity, the gas storage shell is connected with the second gas cavity, and the electromagnet is arranged on the sliding block.

[0009] The sliding driver further comprises a second sealing ring, and the second sealing ring is arranged on the sliding block.

[0010] The electromagnet comprises an electromagnet body, a magnetic force control unit and a current flow direction switching unit, the electromagnet body is fixed on the sliding block, the magnetic force control unit is used for controlling the magnetic force of the electromagnet body, and the current flow direction switching unit is used for switching the alternating current connected with the electromagnet body to change the magnetic force direction.

[0011] The heat dissipation assembly comprises a liquid pump, a box body, a plurality of heat dissipation fins and a heat dissipation turbine, the liquid pump is in communication with liquid inlets of the plurality of heat conducting pipes, the box body is in communication with the liquid pump and the connecting cavity, the plurality of heat dissipation fins are fixed on the outside of the box body, and the heat dissipation turbine is arranged on one side of the plurality of heat dissipation fins.

[0012] The heat dissipation assembly further comprises a plurality of partitions, and the plurality of partitions are alternately arranged in the box body.

[0013] The electromagnet further comprises a plurality of temperature detection units, a temperature data conversion unit, a position control unit and an electromagnetic intensity control unit, the plurality of temperature detection units are distributed between the heat conducting medium layer and the contact heat dissipation plate, the temperature data conversion unit is used for converting data acquired by the temperature detection units into temperature values, the position control unit is used for controlling the position of the sliding block based on the temperature values, and the electromagnetic intensity control unit is used for controlling the magnetic force control unit based on the temperature values.

[0014] In the second aspect, the application further provides a liquid cooling insulation type heat dissipation system, which comprises the liquid cooling insulation type heat radiator.

[0015] The connecting structure is fixedly connected with the support plate and located on one side of the support plate.

[0016] The liquid outlet end of the heat pipe is in communication with the connecting cavity, so that the high-temperature cooling liquid flowing out of the heat pipe can flow into the connecting cavity and then enter the heat dissipation assembly for cooling circulation.

[0017] The heat dissipation assembly is in communication with the connecting cavity and also in communication with the liquid inlet of the heat pipe, forming a complete cooling liquid circulation system.

[0018] In summary, the liquid cooling insulation type radiator provided by the present application has compact structure, high heat dissipation efficiency and strong controllability, and is suitable for high-power electronic devices, data center servers, industrial frequency conversion devices and other scenes requiring efficient heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to make the technical solutions in the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only need to be some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0020] Figure 1 is a structure diagram of a liquid-cooled insulation type radiator of the present application.

[0021] Figure 2 is a right side structure diagram of a liquid-cooled insulation type radiator of the present application.

[0022] Figure 3 is a longitudinal section structure diagram of a liquid-cooled insulation type radiator of the present application.

[0023] Figure 4 is a transverse section structure diagram of a liquid-cooled insulation type radiator of the present application.

[0024] Figure 5 is Figure 4 is a partial enlarged view of detail A.

[0025] Figure 6 is a section structure diagram of a liquid-cooled insulation type radiator along the sliding block of the present application.

[0026] Figure 7 is Figure 6 is a partial enlarged view of detail B.

[0027] Figure 8 is a structure diagram of an electromagnet of the present application.

[0028] Support plate 101, connecting structure 102, contact heat dissipation plate 103, heat conduction medium layer 104, heat conduction pipe 105, connecting cavity 106, magnet stop sheet 107, electromagnet 108, sliding driver 109, connecting hole 110, first sealing ring 111, pressing plate 112, connecting block 113, lock ring 114, stop sheet body 115, elastic member 116, sliding closed shell 118, sliding block 119, air pump 120, gas storage shell 121, second sealing ring 122, electromagnet body 123, magnetic force control unit 124, current flow direction switching unit 125, liquid pump 126, box 127, heat dissipation fin 128, heat dissipation turbine 129, partition plate 130, temperature detection unit 131, temperature data conversion unit 132, position control unit 133, electromagnetic intensity control unit 134. DETAILED DESCRIPTION

[0029] Embodiments of the present application are described below in the detailed description and illustrated in the accompanying drawings by which like or similar elements, symbols and / or features are referred to by like or similar characters and / or numerals throughout the several views. The embodiments described below are exemplary in nature and are intended to be illustrative of the present application rather than to be limiting of the present application. Brief Description of the Drawings

[0030] In the description of the present application, it is to be understood that the orientations or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, in the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0031] First Embodiment

[0032] Please refer to Figures 1-8 The present application provides a liquid-cooled insulation type radiator, comprising a support plate 101 and a connecting structure 102, the connecting structure 102 is connected with the support plate 101 and located on one side of the support plate 101, further comprising a heat conduction assembly and a heat dissipation assembly, the heat conduction assembly comprises a contact heat sink 103, a heat conduction medium layer 104, a plurality of heat conduction pipes 105, a connecting cavity 106, a plurality of magnet baffles 107, an electromagnet 108 and a sliding driver 109; the contact heat sink 103 is fixed on the support plate 101, a plurality of heat conduction pipes 105 are installed on the contact heat sink 103 through the heat conduction medium layer 104, the connecting cavity 106 is in communication with the liquid outlet of the plurality of heat conduction pipes 105, a plurality of magnet baffles 107 are slidingly arranged on one side of the plurality of heat conduction pipes 105, the sliding driver 109 is arranged below the heat conduction pipes 105, the electromagnet 108 is fixed on the sliding driver 109, and the opening degree of the liquid outlet is controlled by the electromagnet 108; the heat dissipation assembly is in communication with the connecting cavity 106 and in communication with the liquid inlet of the heat conduction pipes 105.

[0033] In the embodiment, the connecting structure 102 is fixedly connected with the support plate 101 and located on one side of the support plate 101. The heat sink further comprises a heat conduction component and a heat dissipation component, wherein the heat conduction component is mainly used for absorbing and transferring heat, and the heat dissipation component is responsible for efficiently dissipating heat to the environment. The contact heat dissipation plate 103 is fixedly installed on the surface of the support plate 101 and used for directly adhering to the heat generating device to quickly absorb the heat generated by the heat generating device. The heat conduction medium layer 104 is arranged above or inside the contact heat dissipation plate 103, has good heat conduction performance, can uniformly distribute heat, and serves as an intermediate medium to conduct heat to the plurality of heat conduction pipes 105. The plurality of heat conduction pipes 105 are arranged in an array and stably installed on the contact heat dissipation plate 103 through the heat conduction medium layer 104, and the inside of the heat conduction pipes 105 circulates cooling liquid to achieve a high-efficiency heat exchange effect.

[0034] The liquid outlet end of the heat conduction pipe 105 is in communication with the connecting cavity 106, so that the high-temperature cooling liquid flowing out of the heat conduction pipe 105 can be concentrated and flow into the connecting cavity 106, and then enter the heat dissipation component for cooling circulation. In addition, a slidable magnet baffle 107 is arranged on one side of each heat conduction pipe 105, and the magnet baffles 107 are adjusted in position through a sliding driver 109. The sliding driver 109 is arranged below the heat conduction pipe 105, and an electromagnet 108 is fixedly installed on the sliding driver 109. By controlling the on-off state of the electromagnet 108, the position of the magnet baffle 107 can be changed, so that the shielding degree of the liquid outlet opening of the heat conduction pipe 105 is accurately adjusted, and the flow of the cooling liquid is dynamically regulated. This design not only improves the heat dissipation efficiency, but also flexibly adjusts the cooling strength according to the real-time heat generation of the equipment, so as to achieve the purpose of energy saving.

[0035] The heat dissipation component is in communication with the connecting cavity 106 and also in communication with the liquid inlet of the heat conduction pipe 105, forming a complete cooling liquid circulation system. The heat dissipation component usually comprises a cooling channel, a fan, a cooling row and the like, and can quickly cool the high-temperature cooling liquid flowing out of the heat conduction pipe 105, and then re-deliver the cooling liquid back to the heat conduction pipe 105 for circulation. Since the liquid cooling mode is adopted, combined with the high-efficiency heat conduction capacity of the heat conduction pipe 105 and the heat conduction medium layer 104, the entire heat sink has excellent heat dissipation performance, and through the use of insulating cooling liquid, the electrical safety of the system is ensured.

[0036] In summary, the liquid cooling insulation type heat sink provided by the application has the advantages of compact structure, high heat dissipation efficiency and strong controllability, and is suitable for high-power electronic equipment, data center servers, industrial frequency conversion devices and other scenes requiring efficient heat dissipation.

[0037] The connecting cavity 106 has a plurality of connecting holes 110, a first sealing ring 111 is arranged in the connecting hole 110, the heat pipe is inserted into the connecting hole 110 and contacts the first sealing ring 111, and a pressing plate 112 is further arranged on the connecting cavity 106, a plurality of connecting blocks 113 are arranged on the pressing plate 112, the connecting blocks 113 are used for being inserted into connecting grooves in the connecting holes 110 to complete locking, and a lock ring 114 is threadedly arranged on the connecting cavity 106, and the pressing plate 112 is close to the connecting cavity 106 by rotating the lock ring 114 to mount the heat pipe on the connecting cavity 106.

[0038] The connecting cavity 106 has a plurality of connecting holes 110 for connecting the heat pipe, the connecting holes 110 are uniformly distributed or rationally arranged on corresponding positions of the connecting cavity 106 according to the layout of the heat pipe 105, so that the cooling liquid can smoothly flow from the heat pipe 105 into the connecting cavity 106. A first sealing ring 111 is arranged on the inner wall of each connecting hole 110, the first sealing ring 111 is made of a material with high temperature resistance, corrosion resistance and good elasticity, such as silicone rubber or fluororubber, and is used for realizing sealed connection between the heat pipe and the connecting cavity 106, and preventing leakage of the cooling liquid during high pressure or long time operation.

[0039] When the heat pipe is installed, one end of the heat pipe is inserted into the corresponding connecting hole 110 and tightly contacts the first sealing ring 111 arranged inside the connecting hole 110, so as to form a preliminary sealing structure. In order to further enhance the stability and sealing property of the connection, the connecting cavity 106 is further provided with a pressing plate 112 assembly. The pressing plate 112 is a ring-shaped or multi-segment structure, and a plurality of connecting blocks 113 are arranged on the pressing plate 112, the positions of the connecting blocks 113 correspond to connecting grooves in the connecting holes 110. The connecting blocks 113 can be inserted into the connecting holes 110 along the guide portions of the connecting holes 110 and embedded into the preset connecting grooves, so as to realize mechanical locking between the heat pipe and the connecting cavity 106, and prevent the heat pipe from loosening and falling off due to vibration or pressure change.

[0040] In addition, a lock ring 114 is arranged outside the connecting cavity 106, and the lock ring 114 is threadedly screwed on the connecting cavity 106. When all the heat pipes are preliminarily inserted and positioned, the lock ring 114 is rotated to move towards the connecting cavity 106, and the pressing plate 112 is pushed to close to the connecting cavity 106. With the pressing action of the pressing plate 112, the connecting blocks 113 thereon are further pressed into the connecting grooves, so that the heat pipe is firmly fixed on the connecting cavity 106, and the first sealing ring 111 is more closely attached to the outer wall of the heat pipe, improving the sealing reliability.

[0041] The magnet baffle 107 comprises a baffle body 115, an elastic member 116 and a protective layer, the baffle body is slidingly arranged in the connecting cavity 106, the elastic member 116 is arranged between the baffle body 115 and the connecting cavity 106, and the protective layer is arranged on the baffle body 115.

[0042] The baffle body 115 is a metal member with rigidity and magnetism, slidingly arranged in the connecting cavity 106 or on one side of the outlet end of the heat conduction pipe 105, and has a shape matching the outlet of the heat conduction pipe 105, usually a rectangular, circular or polygonal thin plate structure, capable of shielding different proportions of the outlet of the heat conduction pipe 105 as needed, thereby adjusting the flow of the cooling liquid.

[0043] The elastic member 116 is arranged between the baffle body 115 and the connecting cavity 106, and is usually made of a material with buffering performance such as a spring, a corrugated spring or an elastic rubber pad. The main function of the elastic member 116 is to provide a certain initial pre-tightening force, so that the baffle body 115 remains in the default position when not driven by the electromagnet 108, and automatically resets to the initial opening state set after the electromagnet 108 is powered off. In addition, the elastic member 116 can also absorb the slight displacement caused by system vibration or temperature change, ensuring smooth operation and sensitive response of the magnet baffle 107.

[0044] A protective layer is arranged on the surface of the baffle body 115 to improve its corrosion resistance, wear resistance and chemical stability, prevent oxidation, rusting or surface peeling caused by long-term contact with the cooling liquid, etc. The protective layer can be formed by electroplating (such as nickel, chromium), spraying (such as polytetrafluoroethylene PTFE) or anodic oxidation treatment, etc. Not only can it enhance the service life of the baffle body 115, but also ensure its stable operation under complex working conditions.

[0045] The sliding driver 109 comprises a sliding closed shell 118, a sliding block 119, a gas pump 120 and a gas storage shell 121, the sliding block 119 is slidingly arranged in the sliding closed shell 118, and divides the sliding closed shell 118 into a first gas cavity and a second gas cavity, the gas pump 120 is connected with the first gas cavity, the gas storage shell 121 is connected with the second gas cavity, and the electromagnet 108 is arranged on the sliding block 119.

[0046] The sliding closed shell 118 is a closed structure, and a sliding channel is arranged in the sliding closed shell 118, the sliding block 119 can slide axially along the channel, and divides the sliding closed shell 118 into two independent gas cavities: a first gas cavity and a second gas cavity.

[0047] In the working process, the air pump 120 is connected with the first air cavity, and the internal pressure of the first air cavity is changed by filling or extracting gas; and the gas storage shell 121 is connected with the second air cavity, and serves as a buffer storage device of the gas, and provides or recovers a certain amount of gas when the sliding block 119 moves, so that the stability and response speed of the system operation are maintained. By controlling the working state of the air pump 120, the pressure difference between the two air cavities can be accurately adjusted, and then the sliding block 119 is driven to reciprocate in the sliding closed shell 118, and the electromagnet 108 fixed on the sliding block 119 is synchronously moved.

[0048] The electromagnet 108 is arranged on the sliding block 119 and moves with the sliding block 119. When the electromagnet 108 is powered on to generate a magnetic field, magnetic attraction or repulsion is formed between the electromagnet 108 and the magnet baffle 107, so that the position of the magnet baffle 107 is further adjusted, and the opening degree of the liquid outlet of the heat pipe 105 is finely controlled. The combined driving mode of the gas and the electromagnet not only has fast response speed and high control precision, but also has compact structure and stable operation, and is suitable for automatic adjustment requirements under complex working conditions.

[0049] The sliding driver 109 further comprises a second sealing ring 122 arranged on the sliding block 119.

[0050] In addition, in order to ensure the sealing performance of the sliding block 119 during the sliding process in the sliding closed shell 118, and prevent the gas leakage from affecting the stability of the air cavity pressure and the driving effect, the sliding driver 109 further comprises a second sealing ring 122. The second sealing ring 122 is installed on the outer peripheral surface of the sliding block 119, and is usually made of wear-resistant and elastic materials such as silicone rubber or polyurethane.

[0051] The electromagnet 108 comprises an electromagnet body 123, a magnetic force control unit 124 and a current flow direction switching unit 125; the electromagnet body 123 is fixed on the sliding block 119, the magnetic force control unit 124 is used for controlling the magnetic force of the electromagnet body 123, and the current flow direction switching unit 125 is used for switching the alternating current connected with the electromagnet body 123 to change the magnetic force direction.

[0052] The electromagnet body 123 is fixedly installed on the sliding block 119 and moves with the sliding block 119. The structure is usually composed of a core made of high-permeability material and a coil wound outside the core. When the coil is powered on, the electromagnet body 123 generates a controllable magnetic field, which acts on the magnet baffle 107 with magnetism, so as to drive or attract the magnet baffle 107 to displace, so as to adjust the opening degree of the liquid outlet of the heat pipe 105. The design of the electromagnet body 123 has the advantages of fast response speed, strong magnetic force adjustability and compact structure, and is suitable for liquid cooling system applications with high frequency and high precision.

[0053] The magnetic force control unit 124 is electrically connected with the electromagnet body 123, for adjusting the current size flowing through the coil according to the system instruction, so as to control the magnetic force strength generated by the electromagnet body 123. The magnetic force control unit 124 is internally integrated with a power regulation module and a feedback detection circuit, which can monitor the working state of the electromagnet 108 in real time, and dynamically adjust the output current according to the preset program or the temperature, pressure and other parameters fed back by the external sensor, so as to ensure the stability and reliability of the magnetic force output. This control mode not only improves the intelligent level of the system, but also effectively avoids the problems of misoperation or control failure caused by excessive or insufficient magnetic force.

[0054] The current flow direction switching unit 125 is connected with the electromagnet body 123, for switching the alternating current direction supplied to the electromagnet body 123, so as to change the magnetic pole direction (i.e. the conversion of N pole and S pole) generated thereby. This function is crucial for realizing the bidirectional control of the magnet blocking piece 107: for example, when it is needed to attract the magnet blocking piece 107, the electromagnet 108 generates magnetic force of the same polarity as the blocking piece to repel; and when it is needed to release the blocking piece, the current direction is switched to make it generate opposite polarity to form an attractive force or release the magnetic force. In this way, the movement direction and stroke range of the magnet blocking piece 107 can be flexibly controlled, and the control accuracy and adaptability of the system are improved.

[0055] The heat dissipation assembly comprises a liquid pump 126, a box body 127, a plurality of heat dissipation fins 128 and a heat dissipation turbine 129. The liquid pump 126 is in communication with the liquid inlets of the plurality of heat conduction pipes. The box body 127 is in communication with the liquid pump 126 and the connecting cavity 106. The plurality of heat dissipation fins 128 are fixed to the outside of the box body 127. The heat dissipation turbine 129 is arranged on one side of the plurality of heat dissipation fins 128.

[0056] The liquid pump 126 is arranged at a key position of the cooling circuit as a power core of the cooling liquid circulation. The inlet end of the liquid pump 126 is in communication with the connecting cavity 106, and the outlet end is connected with the liquid inlets of the plurality of heat conduction pipes, so as to ensure that the cooling liquid can be pressurized and delivered back to the inside of the heat conduction pipe 105 to form a closed circulation. The liquid pump 126 is made of high-efficiency, low-noise and corrosion-resistant materials, has good pressure resistance and stability for long-time continuous work, and is suitable for liquid cooling system applications under various complex working conditions.

[0057] The box 127 is the main structural carrier of the heat dissipation assembly, with cooling liquid flow channels inside, and forms a complete fluid path with the liquid pump 126 and the connection cavity 106. The box 127 is usually made of metal materials with good thermal conductivity, such as aluminum or copper alloy, and can also be coated with an insulating coating on the inner wall to prevent corrosion and leakage, to improve the safety and durability of the system. The box 127 not only bears the temporary storage and distribution function of the cooling liquid, but also is the installation base of the heat dissipation fins 128 and the partition plates 130.

[0058] A plurality of heat dissipation fins 128 are fixedly installed on the outer side surface of the box 127, arranged in parallel or honeycomb shape, to increase the surface area in contact with air and improve the overall heat exchange efficiency. The heat dissipation fins 128 are usually made of metal materials with high thermal conductivity, and their surfaces can be further oxidized or sprayed with black heat-absorbing coating to enhance the radiation heat dissipation capacity. Through reasonable air flow design, external air flows between the heat dissipation fins 128 to take away the heat in the cooling liquid, realizing a high-efficiency heat exchange process.

[0059] The heat dissipation turbine 129 is arranged on one side of the plurality of heat dissipation fins 128, usually in the structure of an axial flow fan or a centrifugal fan, which accelerates air flow and improves the heat exchange rate between the heat dissipation fins 128 and the environment. The heat dissipation turbine 129 can automatically adjust the speed according to the system temperature, so as to ensure sufficient cooling effect while saving energy. In addition, the heat dissipation turbine 129 can also be equipped with a silencing device to reduce the noise generated during operation and improve the user experience.

[0060] The heat dissipation assembly also includes a plurality of partition plates 130, which are alternately arranged in the box 127.

[0061] In order to further optimize the flow path of the cooling liquid in the box 127 and improve the heat exchange efficiency, the heat dissipation assembly also includes a plurality of partition plates 130, which are alternately arranged inside the box 127 to form a zigzag flow channel structure. This design can prolong the residence time of the cooling liquid in the box 127, allowing it to fully exchange heat with the inner wall of the box 127 and the heat dissipation fins 128, while also preventing the cooling liquid from flowing short-circuit and avoiding local temperature overheating, thereby improving the overall heat dissipation efficiency.

[0062] The electromagnet 108 further comprises a plurality of temperature detection units 131, a temperature data conversion unit 132, a position control unit 133, and an electromagnetic intensity control unit 134. The plurality of temperature detection units 131 are distributed between the heat-conducting medium layer 104 and the contact heat dissipation plate 103. The temperature data conversion unit 132 is configured to convert data obtained by the temperature detection units 131 into temperature values. The position control unit 133 is configured to control the position of the sliding block 119 based on the temperature values. The electromagnetic intensity control unit 134 is configured to control the magnetic force control unit 124 based on the temperature values.

[0063] The plurality of temperature detection units 131 are distributed between the heat-conducting medium layer 104 and the contact heat dissipation plate 103, and are configured to monitor the temperature changes of the contact heat dissipation plate 103 and the heat-conducting medium layer 104 below the contact heat dissipation plate 103 in real time. The temperature detection units 131 usually employ high-precision thermistors (such as NTC or PTC) or infrared temperature sensors, which have the characteristics of fast response speed, high measurement accuracy, and strong anti-interference ability, and can accurately capture the changes in heat conducted from the heat-generating equipment to the heat-conducting medium layer 104 through the contact heat dissipation plate 103.

[0064] The temperature data conversion unit 132 is electrically connected to each temperature detection unit 131. The main function of the temperature data conversion unit 132 is to convert the analog signals or digital signals collected by the temperature detection units 131 into recognizable temperature values, and to perform filtering, calibration, and normalization processing to eliminate environmental interference and system errors, thereby ensuring the accuracy and stability of the output data. The temperature data conversion unit 132 is usually integrated into the main control module of the system, or can exist as an independent data processing unit.

[0065] The position control unit 133 calculates the target position of the sliding block 119 based on the temperature values output by the temperature data conversion unit 132, in combination with a pre-set control logic and algorithm model. For example, when the temperature of the equipment is detected to be rising, the position control unit 133 will issue a command to drive the sliding block 119 to move in a certain direction, thereby driving the magnet shutter 107 to adjust the opening degree of the liquid outlet of the heat pipe 105, so as to increase the flow of cooling liquid and improve the heat dissipation efficiency. Conversely, when the temperature is decreasing, the opening degree is reduced to reduce energy consumption. The control process can adopt advanced control strategies such as PID control and fuzzy control to achieve smooth and rapid response.

[0066] The electromagnetic intensity control unit 134 further adjusts the magnetic force intensity of the electromagnet body 123 according to the change trend of the temperature value. The unit works in linkage with the magnetic force control unit 124, and can accurately control the magnetic field size generated by the electromagnet 108 under different working conditions, so as to affect the action sensitivity and stability of the magnet baffle 107. For example, in the high-temperature emergency situation, the electromagnetic intensity control unit 134 can instantaneously increase the magnetic force, so that the magnet baffle 107 is quickly opened to the maximum opening degree; and in the low-temperature and low-load state, the magnetic force is appropriately reduced to avoid excessive response, and the energy saving and reliability of the system operation are improved.

[0067] Specifically, the heat-conducting medium layer 104 adopts a high-thermal-conductivity graphene material and covers the CPU and GPU chips. The contact heat sink 103 adopts an aluminum alloy heat sink and is in close contact with the heat-conducting medium layer 104 to conduct the heat of the chips to the heat dissipation module. The temperature detection unit 131 is four NTC thermistors (accuracy ±0.5℃) embedded in the four corners and the center of the heat sink to monitor the chip hotspot temperature in real time.

[0068] The liquid outlet of the heat-conducting pipe 105 is located at the end of the heat sink and is controlled by the magnet baffle 107 (neodymium magnet) to adjust the flow of the cooling liquid (liquid metal).

[0069] The electromagnet body 123 is installed on the side of the baffle and adjusts the magnetic force intensity (0-1T adjustable) through current.

[0070] The CPU temperature is suddenly increased from 50℃ to 85℃. The center thermistor detects that the temperature is increased from 50℃ to 85℃ (within 2 seconds), and other sensors synchronously feedback the temperature gradient (70℃ at the edge). The temperature data conversion unit 132 filters the signal and removes the environmental noise to output the calibrated temperature value (84.2℃). According to the temperature difference (ΔT=35℃) and the historical temperature rising rate, the output slide block 119 target position (the opening degree needs to be increased by 60%) is output. The step motor drives the slide block 119 to move right, and the magnet baffle 107 opens the heat-conducting pipe 105 outlet, and the cooling liquid flow is increased from 20% to 80%. When the temperature change rate is detected to be >10℃ / s, the “emergency mode” is triggered, the current of the electromagnet 108 is increased from 0.5A to 1.2A, the magnetic force is increased to make the baffle fully open (100% opening degree). After the temperature is stable (80℃ is maintained for 5 seconds), the magnetic force is gradually reduced to 0.8A to avoid excessive oscillation.

[0071] Second embodiment

[0072] The application also provides a liquid-cooled insulation type heat dissipation system comprising the liquid-cooled insulation type heat radiator.

[0073] In addition, the system is provided with a safety monitoring module for real-time monitoring of the coolant pressure, leakage, electrical insulation state and the working state of each key component. Once an abnormality is found (such as coolant leakage, temperature overrun, excessive pressure), the system will automatically start the protection mechanism, such as reducing the device power, switching to the standby cooling channel or issuing a warning prompt, so as to ensure the operation safety of the whole system and the long-term stability of the device.

[0074] To further improve the scalability and integration capability of the system, the liquid-cooled insulation type heat dissipation system also includes a standardized interface design, which supports seamless docking with other cooling devices, power management systems or central control systems, facilitating flexible deployment and centralized management in different application scenarios.

[0075] The above only discloses a preferred embodiment of the present application, of course, cannot be limited by the scope of the present application, those skilled in the art can understand that the implementation of all or part of the above-mentioned embodiments, and the equivalent changes made according to the claims of the present application, still belong to the scope covered by the present application.

Claims

1. A liquid cooling insulation heat sink, comprising a support plate and a connecting structure, the connecting structure is connected with the support plate and located on one side of the support plate, characterized in that, further comprising a heat conduction assembly and a heat dissipation assembly, the heat conduction assembly comprises a contact heat sink, a heat conduction medium layer, a plurality of heat conduction pipes, a connecting cavity, a plurality of magnet baffles, an electromagnet and a sliding driver; the contact heat sink is fixed on the support plate, a plurality of heat conduction pipes are installed on the contact heat sink through the heat conduction medium layer, the connecting cavity is in communication with the liquid outlet of the plurality of heat conduction pipes, a plurality of magnet baffles are slidingly arranged on one side of the plurality of heat conduction pipes, the sliding driver is arranged below the heat conduction pipes, the electromagnet is fixed on the sliding driver, and the opening degree of the liquid outlet by the magnet baffle is controlled through the electromagnet; the heat dissipation assembly is in communication with the connecting cavity and the liquid inlet of the heat conduction pipe; the sliding driver comprises a sliding closed shell, a sliding block, an air pump and a gas storage shell, the sliding block is slidingly arranged in the sliding closed shell, and the sliding closed shell is divided into a first gas cavity and a second gas cavity by the sliding block, the air pump is connected with the first gas cavity, the gas storage shell is connected with the second gas cavity, and the electromagnet is arranged on the sliding block; the electromagnet comprises an electromagnet body, a magnetic force control unit and a current flow direction switching unit; the electromagnet body is fixed on the sliding block, the magnetic force control unit is used for controlling the magnetic force of the electromagnet body, and the current flow direction switching unit is used for switching the alternating current connected with the electromagnet body to change the magnetic force direction; the electromagnet further comprises a plurality of temperature detection units, a temperature data conversion unit, a position control unit and an electromagnetic intensity control unit, the plurality of temperature detection units are distributed between the heat conduction medium layer and the contact heat sink, the temperature data conversion unit is used for converting the data obtained by the temperature detection unit into temperature values; the position control unit is used for controlling the position of the sliding block based on the temperature values, and the electromagnetic intensity control unit is used for controlling the magnetic force control unit based on the temperature values. 2.The liquid cooling insulation heat sink according to claim 1, characterized in that, the connecting cavity has a plurality of connecting holes, a first sealing ring is arranged in the connecting hole, the heat conduction pipe is inserted into the connecting hole and in contact with the first sealing ring, a pressing plate is further arranged on the connecting cavity, a plurality of connecting blocks are arranged on the pressing plate, the connecting blocks are used for being inserted into the connecting grooves in the connecting holes to complete locking, a lock ring is threadedly arranged on the connecting cavity, and the pressing plate is close to the connecting cavity by rotating the lock ring to install the heat conduction pipe on the connecting cavity. 3.The liquid cooling insulation heat sink according to claim 2, characterized in that, the magnet baffle comprises a baffle body, an elastic member and a protective layer, the baffle body is slidingly arranged in the connecting cavity, the elastic member is arranged between the baffle body and the connecting cavity, and the protective layer is arranged on the baffle body.

4. The liquid-cooled insulation type radiator according to claim 3, wherein The sliding driver further comprises a second sealing ring, which is arranged on the sliding block.

5. The liquid-cooled insulation type radiator according to claim 4, wherein The heat dissipation assembly comprises a liquid pump, a box, a plurality of heat dissipation fins and a heat dissipation turbine, the liquid pump is in communication with the liquid inlet of the plurality of heat conduction pipes, the box is in communication with the liquid pump and the connecting cavity, the plurality of heat dissipation fins are fixed on the outside of the box, and the heat dissipation turbine is arranged on one side of the plurality of heat dissipation fins.

6. The liquid-cooled insulation type radiator according to claim 5, wherein The heat dissipation assembly further comprises a plurality of partitions, and the plurality of partitions are alternately arranged in the box.

7. A liquid-cooled, insulated heat dissipation system, characterized by, The liquid-cooled insulation type radiator comprises any one of claims 1-6.

Images