5G miniaturized filter assembly integrated automatic line and control method

Abstract

The application relates to a 5G miniaturized filter accessory assembly integrated automatic line and a control method, which comprises an ink jet marking module for ink jet marking of a filter cavity; a flying rod assembly module for assembling a flying rod in the filter cavity; a resonant rod assembly module for locking a resonant rod in the filter cavity; a tin paste brushing module for brushing tin paste on the edge of the filter cavity and detecting defective products; a cover plate assembly module for locking a cover plate on the filter cavity; a connector assembly module for installing a connector on the filter cavity and spot gluing; a reflow soldering module for changing the state of tin paste; and a cooling module for cooling tin paste. The application controls each module to realize the assembly of filter accessories, and the degree of automation is high. The second recognition mechanism recognizes the mounting hole in the filter cavity, so that the flying rod is accurately assembled in the mounting hole. The third recognition mechanism recognizes the direction of the cover plate, so that the cover plate is accurately assembled on the filter cavity, and the assembly accuracy is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of filter technology, and more specifically, to an automated assembly line and control method for miniaturized 5G filter components. Background Technology

[0002] With the rapid development of fifth-generation mobile communication technology (5G), filters, as one of the core front-end devices of its base stations, are rapidly evolving towards higher frequency, smaller size, lighter weight, higher performance and higher reliability.

[0003] As the internal structure of 5G miniaturized filters becomes increasingly precise and complex, the size of key components is tiny, and the assembly accuracy requirements are high, which poses a huge challenge to the assembly process; existing technologies suffer from low automation and low assembly accuracy.

[0004] On the one hand, a filter automated assembly line disclosed in publication number CN111266859B describes a process where a first assembly machine completes operations such as sealing ring and housing snap-fitting, magnetic core insertion, PIN pin crimping, and end cap fastening. This is combined with static curing, electrical testing, PIN pin testing, coding identification, and a second assembly machine for snap-fitting, thus achieving automated filter assembly. However, this technical solution primarily focuses on optimizing the overall filter assembly process and lacks the capability for efficient integrated assembly of precision components for 5G miniaturized filters. Furthermore, this production line does not involve high-precision positioning and multi-station collaborative control methods, which may make it difficult to meet the stringent requirements for the assembly precision of tiny components in 5G miniaturized filters, thereby affecting product consistency and yield.

[0005] On the other hand, an automated assembly line for 5G dielectric filters, disclosed in publication number CN111872676B, utilizes a tooling transmission mechanism in conjunction with multiple modular assembly units, including modules for dielectric feeding, solder paste scraping, red glue and solder paste application, gasket installation, PIN connector installation, automatic assembly, reflow soldering, disassembly and cutting, dimensional inspection, and unloading. This achieves highly efficient automated assembly of 5G dielectric filters. However, this technical solution focuses on the step-by-step implementation of soldering and assembly processes, failing to fully address the high-precision dynamic adjustment and real-time feedback control required for the integrated assembly of miniaturized 5G filter components. Furthermore, the efficiency of this production line in grasping, positioning, and assembling small components still has room for improvement, potentially leading to an extended overall production cycle time and hindering further capacity increases.

[0006] In summary, existing 5G filter automated assembly lines still have shortcomings in terms of integrated assembly capabilities for miniaturized filter precision components, high-precision dynamic adjustment, real-time feedback control, and overall production efficiency. Summary of the Invention

[0007] The technical problem to be solved by this invention is low automation and low assembly accuracy. In view of the above-mentioned defects of the prior art, this invention provides an integrated automatic assembly line and control method for 5G miniaturized filter accessories.

[0008] The technical solution adopted by this invention to solve its technical problem is:

[0009] An automated assembly line for miniaturized 5G filter components is constructed, comprising multiple cabinets arranged in sequence, multiple modules and a control module for controlling the modules arranged in sequence within the cabinets, wherein the modules are, in sequence, an inkjet marking module, a fly rod assembly module, a resonant rod assembly module, a solder paste application module, a cover plate assembly module and a connector assembly module.

[0010] The interior of the cabinet is connected by a preset conveying module. The conveying module includes a first conveying line, a second conveying line and a third conveying line. The first conveying line and the second conveying line are used to convey preset carriers to each of the modules. The carriers are used to carry preset filter cavities.

[0011] The inkjet marking module is provided with a first identification mechanism, which is used to identify the direction of the filter cavity so that the inkjet marking module can perform inkjet marking on the same side of any filter cavity.

[0012] The fly stick assembly module is provided with a second identification mechanism, which is used to identify the preset mounting hole in the filter cavity so that the fly stick assembly module assembles the preset fly stick into the mounting hole;

[0013] The resonant rod assembly module is used to lock a preset resonant rod into the filter cavity;

[0014] The solder paste application module is used to apply solder paste to the opening edge of the filter cavity. The solder paste application module also includes a preset detection mechanism for detecting defective products.

[0015] The cover plate assembly module is provided with a third identification mechanism, which is used to identify the preset direction of the cover plate so that the cover plate is locked onto the filter cavity accordingly;

[0016] The connector assembly module is provided with a flipping mechanism for flipping and translating the filter cavity, and for installing a preset connector on the side of the filter cavity, and for applying adhesive to the bottom surface of the filter cavity.

[0017] It also includes a reflow soldering module and a cooling module. The third conveyor line connects the connector assembly module, the reflow soldering module, and the cooling module. The reflow soldering module is used to change the state of the solder paste, and the cooling module is used to cool the solder paste so that the cover plate is tightly connected to the filter cavity.

[0018] This invention also provides a control method for assembling miniaturized 5G filter components, comprising the following steps: controlling a preset conveying module via a preset control module to sequentially convey the filter cavity to a preset inkjet marking module, a preset fly rod assembly module, a preset resonant rod assembly module, a preset solder paste application module, a preset cover plate assembly module, a preset connector assembly module, a preset reflow soldering module, and a preset cooling module; controlling the inkjet marking module via the control module to perform inkjet marking on the same side of any of the filter cavities; controlling the fly rod assembly module via the control module to assemble the preset fly rod into the filter cavity; and controlling the resonant rod assembly module via the control module to... A preset resonant rod is locked into the filter cavity; the control module controls the solder paste application module to apply preset solder paste to the opening edge of the filter cavity and screen out defective products; the control module controls the cover plate assembly module to lock the cover plate onto the filter cavity; the control module controls the connector assembly module to press-fit the preset connector onto the side of the filter cavity and apply adhesive to the bottom surface of the filter cavity; the control module controls the reflow soldering module to change the state of the solder paste between the cover plate and the filter cavity; the control module controls the cooling module to cool the solder paste to ensure a tight connection between the cover plate and the filter cavity.

[0019] The beneficial effects of this invention are as follows: This invention achieves high automation and reduces labor costs by controlling each module throughout the assembly process via a control module; the invention includes a second identification mechanism and a third identification mechanism. The second identification mechanism identifies the preset mounting holes within the filter cavity, ensuring the fly rod is accurately assembled into the mounting holes. The third identification mechanism identifies the direction of the cover plate, ensuring the cover plate is accurately assembled onto the filter cavity, effectively improving assembly accuracy; the invention also includes a detection mechanism to detect and provide feedback on the assembly status. Based on this feedback, the control module controls a defective product rejection mechanism to remove defective products, further enhancing assembly accuracy. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:

[0021] Figure 1 This is an overall perspective view of an automated assembly line for miniaturized 5G filter components according to one embodiment of the present invention;

[0022] Figure 2 This is a perspective view of an inkjet marking module in one embodiment of the present invention;

[0023] Figure 3 This is a perspective view of the first lifting mechanism and the first blister box in one embodiment of the present invention;

[0024] Figure 4 This is a perspective view of the first fixing mechanism in one embodiment of the present invention;

[0025] Figure 5 This is a perspective view of the first material handling mechanism in one embodiment of the present invention;

[0026] Figure 6 This is a perspective view of the first identification mechanism in one embodiment of the present invention;

[0027] Figure 7 This is a perspective view of the inkjet platform mechanism in one embodiment of the present invention;

[0028] Figure 8 This is a perspective view of the first and second conveyor lines in one embodiment of the present invention;

[0029] Figure 9 This is a perspective view of the translation mechanism in one embodiment of the present invention;

[0030] Figure 10 This is a perspective view of the first recycling mechanism in one embodiment of the present invention;

[0031] Figure 11 This is a perspective view of the fly stick assembly module in one embodiment of the present invention;

[0032] Figure 12 This is a perspective view of the pushing mechanism, the reference platform, the first positioning mechanism, and the flattening mechanism in one embodiment of the present invention;

[0033] Figure 13 This is a perspective view of the discharge mechanism in one embodiment of the present invention;

[0034] Figure 14 This is a perspective view of the resonant rod assembly module in one embodiment of the present invention;

[0035] Figure 15 This is a perspective view of the first lifting mechanism in one embodiment of the present invention;

[0036] Figure 16 This is a perspective view of the solder paste application module in one embodiment of the present invention;

[0037] Figure 17 This is a perspective view of the mounting mechanism, the clamping mechanism, and the solder paste application mechanism in one embodiment of the present invention;

[0038] Figure 18 This is a bottom view of the mounting mechanism, clamping mechanism, and solder paste application mechanism in one embodiment of the present invention;

[0039] Figure 19 This is a perspective view of the cover plate assembly module in one embodiment of the present invention;

[0040] Figure 20 This is a perspective view of a connector assembly module according to an embodiment of the present invention;

[0041] Figure 21 This is a perspective view of the flipping mechanism and the pressing mechanism in one embodiment of the present invention;

[0042] Figure 22 This is a perspective view of a cooling module according to an embodiment of the present invention;

[0043] Figure 23 This is a flowchart of a control method for assembling 5G miniaturized filter components according to an embodiment of the present invention.

[0044] Label Explanation:

[0045] 110. Cabinet; 111. Machine base; 112. Upper cabinet; 120. Control module; 130. Conveyor module; 131. First conveyor line; 132. Second conveyor line; 133. Third conveyor line; 134. Conveyor belt; 135. Gap; 136. Carrier; 137. Filter cavity; 141. X-axis linear module; 142. Y-axis linear module; 143. Z-axis linear module; 150. Cylinder assembly; 160. Gripper module; 161. Gripper cylinder; 162. Gripper; 171. Mounting plate; 172. Mounting bracket; 173. Blocking mechanism; 174. Electric screwdriver; 175. Nozzle; 181. First assembly position; 182. Second assembly position; 183. Third assembly position; 184. Fourth assembly position 1. Assembly Position; 185. Fifth Assembly Position; 186. Sixth Assembly Position; 187. Pressing Position; 188. Dispensing Position; 191. First Material Picking Position; 192. Second Material Picking Position; 193. Third Material Picking Position; 2. Inkjet Marking Module; 21. First Lifting Mechanism; 211. Support Plate; 22. First Fixing Mechanism; 221. Pressing Component; 23. First Material Picking Mechanism; 231. First Blister Box; 232. Rotating Module; 24. First Identification Mechanism; 241. Identification Component; 25. Inkjet Platform Mechanism; 26. Inkjet Mechanism; 27. Translation Mechanism; 271. Clamping Component; 272. Clamping Auxiliary Plate; 28. First Material Dispensing Mechanism; 29. ​​First Recycling Mechanism; 292. First Recycling Frame; 3. Flying Rod Assembly Module; 31. 311. Pushing mechanism; 32. Pushing and discharging mechanism; 321. Second pushing component; 33. Reference platform; 34. First positioning mechanism; 341. Third pushing component; 35. Discharge mechanism; 351. First vibrator; 352. Second vibrator; 353. Discharge chamber; 354. Discharge pipe; 36. Assembly mechanism; 37. Second identification mechanism; 38. Flattening mechanism; 381. Flattening plate; 4. Resonant rod assembly module; 41. First lifting mechanism; 411. Lifting plate; 42. Sensing device; 43. Second positioning mechanism; 44. First feeder; 45. First locking mechanism; 451. Vacuum pump; 5. Solder paste application module; 51. Mounting mechanism; 511. Support frame; 512. Fixing component; 513. First 514. Reserved hole; 515. Stencil; 52. Second reserved hole; 53. Second lifting mechanism; 54. Pressing mechanism; 55. Solder paste application mechanism; 56. Scraper; 57. Detection mechanism; 58. Defective product rejection mechanism; 59. Initial screening position; 60. Defective product temporary storage bin; 61. Ultrasonic cleaning mechanism; 62. Cover plate assembly module; 63. Third positioning mechanism; 64. Second material handling mechanism; 65. Third identification mechanism; 66. Second feeder; 67. Third lifting mechanism; 68. Fourth positioning mechanism; 69. Second locking mechanism; 610. Second blister box; 611. Second recycling mechanism; 612. Second recycling frame; 7. Connector assembly module; 71. First stopping mechanism;72. Handling mechanism; 73. Tilting mechanism; 731. Tilting platform; 732. Tilting module; 74. Clamping mechanism; 741. Rotary telescopic cylinder; 742. Transmission rod; 743. Clamping component; 75. Third feeder; 76. Pressing mechanism; 77. Dispensing mechanism; 771. Dispensing nozzle; 78. Dispensing control module; 781. Second stop mechanism; 8. Reflow soldering module; 9. Cooling module; 92. Multiple heat dissipation mechanisms. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0047] Please refer to the attached document. Figures 1-22This invention proposes an integrated automated assembly line for miniaturized 5G filter components, comprising multiple cabinets 110 arranged in sequence, multiple modules sequentially disposed within the cabinets 110, and a control module 120 for control. The modules are, in sequence, an inkjet marking module 2, a fly rod assembly module 3, a resonant rod assembly module 4, a solder paste application module 5, a cover plate assembly module 6, and a connector assembly module 7. The interiors of the cabinets 110 are connected via a pre-set conveyor module 130, which includes a first conveyor line 131 and a second conveyor line. Conveyor lines 132 and 133, 131 and 132 are all used to transport preset carriers 136 to each module. The carriers 136 carry preset filter cavities 137. The inkjet marking module 2 is equipped with a first identification mechanism 24, which identifies the orientation of the filter cavity 137, enabling the inkjet marking module 2 to perform inkjet marking on the same side of any filter cavity 137. The flybar assembly module 3 is equipped with a second identification mechanism 37, which identifies the filter cavity. The filter housing 137 has pre-set mounting holes for the fly rod assembly module 3 to assemble the pre-set fly rod into the mounting holes; the resonant rod assembly module 4 is used to lock the pre-set resonant rod into the filter housing 137; the solder paste application module 5 is used to apply solder paste to the opening edge of the filter housing 137, and the solder paste application module 5 also includes a pre-set detection mechanism 55 for detecting defective products; the cover plate assembly module 6 is provided with a third identification mechanism 65 for identifying the orientation of the pre-set cover plate so that the cover plate is correspondingly locked into the filter housing 137. 37; the connector assembly module 7 is provided with a flipping mechanism 73 for flipping and translating the filter cavity 137, and for mounting a preset connector on the side of the filter cavity 137, and for applying adhesive to the bottom surface of the filter cavity 137; it also includes a reflow soldering module 8 and a cooling module 9, one end of the third conveyor line 133 is connected to the connector assembly module 7, and the other end is connected to the reflow soldering module 8 and the cooling module 9. The reflow soldering module 8 is used to change the state of the solder paste, and the cooling module 9 is used to cool the solder paste so that the cover plate is tightly connected to the filter cavity 137.

[0048] In this embodiment, the cabinet 110 includes a lower cabinet and an upper cabinet 112. The lower cabinet's machine base 111 is sequentially equipped with various modules, namely an inkjet marking module 2, a fly rod assembly module 3, a resonant rod assembly module 4, a solder paste application module 5, a cover plate assembly module 6, and a connector assembly module 7. Each module is connected via a conveying module 130 and controlled by a control module 120. The control module 120 is mounted on the upper cabinet 112 and includes a controller and a human-machine interface (HMI). Manual input is made through the HMI. The controller communicates with both the HMI and each module, and performs logical control on each module based on the input. The upper cabinet 112 covers all modules for dust protection. In this embodiment, the HMI can be a touchscreen, the controller can be a PLC (Programmable Logic Controller), and the upper cabinet 112 can be made of transparent material for easy observation of the module's operating status.

[0049] The inkjet marking module 2 includes a first identification mechanism 24, a first material handling mechanism 23, and an inkjet mechanism 26. The first identification mechanism 24 identifies the direction of the filter cavity 137 and obtains a first identification result. The control module 120 controls the first material handling mechanism 23 to rotate the filter cavity 137 according to the first identification result, so that the same side of any filter cavity 137 faces the inkjet mechanism 26. The inkjet mechanism 26 is used to perform inkjet marking on the same side of any filter cavity 137. The flybar assembly module 3 includes a second identification mechanism 37 and an assembly machine. The second identification mechanism 37 is used to identify the mounting holes in the filter cavity 137 and obtain a second identification result. The control module 120 controls the assembly mechanism 36 to assemble the fly rod into the mounting hole of the filter cavity 137 according to the second identification result. The resonant rod assembly module 4 is used to lock the preset resonant rod into the filter cavity 137. The solder paste application module 5 includes a detection mechanism 55 and a defective product rejection mechanism 56. The detection mechanism 55 detects whether the fly rod, resonant rod and solder paste are missing in the filter cavity 137. The control module controls the assembly mechanism 36 to assemble the fly rod into the mounting hole of the filter cavity 137 according to the detection result. The defective product rejection mechanism 56 rejects defective products; the cover plate assembly module 6 includes a third identification mechanism 65 and a second material handling mechanism 64. The third identification mechanism 65 is used to identify the orientation of the cover plate and obtain a third identification result. The control module 120 controls the second material handling mechanism 64 to rotate the cover plate according to the third identification result so that the cover plate is installed on the filter cavity 137; the connector assembly module 7 includes a flipping mechanism 73, a pressing mechanism 76, and a dispensing mechanism 77. The control module 120 controls the flipping mechanism 73 to rotate the filter cavity 137. The filter cavity 137 is rotated 90 degrees so that its side faces upward, allowing the pressing mechanism 76 to press the connector onto the side of the filter cavity 137. The control module 120 controls the flipping mechanism 73 to rotate the filter cavity 137 another 90 degrees so that its side faces upward, allowing the dispensing mechanism 77 to apply adhesive to the bottom surface of the filter cavity 137. The reflow soldering module 8 changes the state of the solder paste between the cover plate and the filter cavity 137, and the cooling module 9 cools the solder paste to make the connection between the cover plate and the filter cavity 137 tighter.

[0050] This invention achieves the assembly of filter components by controlling each module throughout the process through the control module 120, minimizing manual intervention and achieving a high degree of automation. The invention includes a second identification mechanism 37 and a third identification mechanism 65. The second identification mechanism 37 identifies the preset mounting holes within the filter cavity 137 to ensure the fly rod is accurately assembled into the mounting holes, and the third identification mechanism 65 identifies the direction of the cover plate to ensure the cover plate is accurately assembled onto the filter cavity 137, effectively improving assembly accuracy. Furthermore, the invention incorporates a detection mechanism 55 to detect and provide feedback on the assembly status. Based on this feedback, the control module 120 controls a defective product rejection mechanism 56 to remove defective products, further enhancing assembly accuracy.

[0051] Please refer to Figures 2-10The inkjet marking module 2 includes a first lifting mechanism 21, a first fixing mechanism 22, a first material picking mechanism 23, a first identification mechanism 24, an inkjet platform mechanism 25, an inkjet mechanism 26, a first material dispensing mechanism 28, a first recycling mechanism 29, a first recycling frame 292, and multiple first blister packs 231. Each first blister pack 231 contains a filter cavity 137 and is stacked on a preset first material picking position 191. The first lifting mechanism 21 is located below the first blister packs 231 and is used to lift and lower the first blister packs 231 so that the top layer of the first blister pack 231 is at a set height. The first fixing mechanism 22 is located to the side of the first material picking position 191 and is used to fix the top layer of the first blister pack 231 to the first material picking position 191. The first material picking mechanism 23... The first material handling mechanism 23 is movably positioned above the first blister pack 231, the first identification mechanism 24, and the inkjet platform mechanism 25. The first material handling mechanism 23 picks up the filter cavity 137 from the first blister pack 231 and places it above the first identification mechanism 24. The first identification mechanism 24 is used to identify the orientation of the filter cavity 137. If the orientation of the filter cavity 137 is a preset positive orientation, the first material handling mechanism 23 directly places the filter cavity 137 on the inkjet platform mechanism 25. If the orientation of the filter cavity 137 is a preset negative orientation, the first material handling mechanism 23 rotates the filter cavity 137 180 degrees and places it on the inkjet platform mechanism 25. The inkjet platform mechanism 25 is movably positioned in front of the inkjet mechanism 26, which is used to perform inkjet marking on the side of the filter cavity 137.

[0052] In practical implementation: Inkjet marking module 2 is installed on machine base 111, such as... Figure 3The diagram shows a perspective view of the first lifting mechanism 21 and the first blister box 231. Both the first lifting mechanism 21 and the first blister box 231 are located at a preset first material handling position 191. The first lifting mechanism 21 includes a linear module and a support plate 211. The number and direction of the linear module depend on which dimensional directions of movement need to be achieved. In this embodiment, the direction parallel to the first conveyor line 131 is the X-axis direction, the direction on the same horizontal plane as the X-axis and perpendicular to the first conveyor line 131 is the Y-axis direction, and the direction perpendicular to the machine platform 111 is the Z-axis direction. The first lifting mechanism 21 includes a Z-axis linear module 143. The support plate 211 is connected to the Z-axis linear module 143, and multiple first blister boxes 231 are stacked on the support plate 211. The linear module 143 drives the support plate 211 to move up and down, and the support plate 211 drives the first blister box 231 to move up and down. The control module 120 controls the lifting mechanism 21 to keep the top first blister box 231 at the set height. In this embodiment, every 30 minutes, ten trays of first blister boxes 231 are placed on the support platform. Each tray of first blister boxes 231 contains multiple filter cavities 137. When the filter cavities in the top first blister box 231 are all removed, the empty top first blister box 231 is removed and recycled. At this time, the control module 120 controls the first lifting mechanism 21 to raise the first blister box 231 so that the top first blister box 231 is always at the set height.

[0053] Specifically, common linear modules can be divided into electric linear modules and pneumatic linear modules according to their driving method. Among them, the common transmission method of electric linear modules is ball screw drive. In this case, the linear module includes a motor, a lead screw, and a slider. The motor drives the lead screw to rotate, and the slider is mounted on the lead screw. The slider has balls inside, which convert the rotational motion of the lead screw into linear motion of the slider along the direction of the lead screw. The advantages are high precision, high rigidity, and strong load capacity. Pneumatic linear modules refer to modules that use solenoid valves to control compressed air to enter different chambers of a cylinder, directly pushing the piston rod to make linear motion or directly pushing the slider to make linear motion. They have the advantages of simple structure and fast response. This invention includes multiple linear modules, and the type of linear module is selected according to the requirements without limitation. The specific structure of the linear module will not be repeated.

[0054] Furthermore, the inkjet marking module 2 includes multiple first fixing mechanisms 22, such as... Figure 4The figure shown is a perspective view of the first fixing mechanism 22. Each of the first fixing mechanisms 22 includes a mounting plate 171, a cylinder assembly 150, and a pressing member 221. The positioning cylinder clamping includes a cylinder and a stop rod. The positioning cylinder assembly 150 is installed on the side of the first material picking position 191 through the mounting plate 171. The input end of the stop rod is connected to the cylinder, and the output end is connected to the pressing member 221. The cylinder drives the stop rod to perform telescopic movement. The stop rod drives the pressing member 221 to press the first blister box 231 from multiple directions so that the top layer of the first blister box 231 is fixed on the first material picking position 191. In this embodiment, the shape of the pressing member 221 is not fixed and is determined according to the shape of the outer periphery of the first blister box 231 being pressed, such as a rectangle or a right angle.

[0055] Furthermore, the first material handling mechanism 23 is movably positioned above the first blister pack 231, the first identification mechanism 24, and the inkjet platform mechanism 25, such as... Figure 5 The diagram shows a perspective view of the first material handling mechanism 23. The first material handling mechanism 23 includes a rotary module 232, a gripper module 160, and multiple linear modules. The three-dimensional space can be divided into three dimensions: X-axis, Y-axis, and Z-axis. In this embodiment, the first material handling mechanism 23 includes three linear modules: an X-axis linear module 141, a Y-axis linear module 142, and a Z-axis linear module 143. The Y-axis linear module 142 is vertically mounted on the X-axis linear module 141, and the Z-axis linear module 143 is mounted on the Y-axis linear module 142. The input end of the rotary module 232 is mounted on the Z-axis module, and the output end of the rotary module 232 is connected to the gripper module 160. The gripper module 160 includes a gripper cylinder. The clamping module 160 consists of a clamping cylinder 161 and two grippers 162, located on the same side of the clamping cylinder 161. The clamping cylinder 161 controls the two grippers 162 to move closer or further away. When the two grippers 162 move closer, they clamp the object; when they move further away, they release the object. Therefore, the clamping module 160, driven by the linear module and the rotary module 232, achieves lifting and rotating movements in the X, Y, and Z axes. The grippers 162, driven by the clamping cylinder 161, clamp and release the object, thereby enabling the first material handling mechanism 23 to grip the filter cavity 137 inside the first blister box 231 and move it above the first blister box 231, the first identification mechanism 24, and the inkjet platform mechanism 25.

[0056] Furthermore, the first material handling mechanism 23 picks up the filter cavity 137 inside the first blister pack 231 and places it above the first identification mechanism 24, such as... Figure 6The first identification mechanism 24 includes a mounting frame 172 and an identification element 241. The identification element 241 is mounted on the machine base 111 via the mounting frame 172. The identification element 241 is a CCD (Charge Coupled Device), a semiconductor element that converts images into electrical signals. The detection direction of the identification element 241 is upward and it is communicatively connected to the control module 120. The identification element 241 identifies the direction of the filter cavity 137 and converts it into an electrical signal, which is then sent to the control module 120. The control module 120 determines the direction of the filter cavity 137 based on the first identification result. If it is the preset positive direction, the first material handling mechanism 23 directly places the filter cavity 137 on the inkjet platform mechanism 25. If the direction of the filter cavity 137 is the preset negative direction, the first material handling mechanism 23 rotates the filter cavity 137 horizontally by 180 degrees and then places it on the inkjet platform mechanism 25 so that the same side of the filter cavity 137 faces the inkjet mechanism 26.

[0057] Furthermore, such as Figure 7 This is a perspective view of the inkjet platform mechanism 25, which includes a linear module and a gripper module 160. The linear module is installed in front of the inkjet mechanism 26. The gripper cylinder 161 of the gripper module 160 is installed on the linear module, and the gripper 162 is installed on the gripper cylinder 161 with its opening facing upward. After the gripper cylinder 161 controls the gripper 162 to clamp the filter cavity 137, the linear module drives the gripper module 160 to move the filter cavity 137 through the inkjet mechanism 26 at a constant speed. The inkjet mechanism 26 performs inkjet marking on the same side of the filter cavity 137. Inkjet marking refers to the process of printing specific information onto the surface of an object quickly and clearly in a non-contact manner, including information such as model, date, and polarity.

[0058] Please refer to Figures 8-10The first conveyor line 131 includes two synchronously moving conveyor belts 134, with a gap 135 between the conveyor belts 134. The width of the gap 135 is smaller than the width of the carrier 136. The conveyor belts 134 are used to sequentially transport the carrier 136 containing the filter cavity 137 from the inkjet marking module 2 to the connector assembly module 7. The second conveyor line 132 is used to return the empty carrier 136 from the connector assembly module 7 to the inkjet marking module 2. The inkjet marking module 2 also includes a translation mechanism 27, which moves between the second conveyor line 132 and the first conveyor line 131, and is used to transport the carrier 136 back from the connector assembly module 7 to the inkjet marking module 2. 36. The material is moved from the second conveyor line 132 to the preset first assembly position 181 on the first conveyor line 131; the first unloading mechanism 28 is movable above the inkjet platform mechanism 25 and the first assembly position 181, and is used to clamp the filter cavity 137 on the inkjet platform mechanism 25 and place it on the carrier 136; the first recycling mechanism 29 is movable above the first picking position 191 and the first recycling frame 292. When the filter cavity 137 in the first blister box 231 of the top layer is completely clamped, the first recycling mechanism 29 clamps the first blister box 231 of the top layer and places it in the first recycling frame 292.

[0059] In practical implementation: such as Figure 8 The diagram shows a perspective view of the first conveyor line 131 and the second conveyor line 132. Both the first conveyor line 131 and the second conveyor line 132 are double-row synchronous belt conveyors, that is, two conveyor belts 134 are driven synchronously by servo motors. A gap 135 is provided between the two conveyor belts 134, and the width of the gap 135 is smaller than the width of the carrier 136. The second conveyor line 132 is arranged parallel to the outside of the first conveyor line 131 and is connected in sequence to the inkjet marking module 2, the fly rod assembly module 3, the resonant rod assembly module 4, the solder paste application module 5, the cover plate assembly module 6, and the connector assembly module 7. The first conveyor line 131 is used to transport the carrier 136 containing the filter cavity 137 from the inkjet marking module 2 to the connector assembly module 7 in sequence. The second conveyor line 132 is used to return the empty carrier 136 from the connector assembly module 7 to the inkjet marking module 2.

[0060] Furthermore, such as Figure 9The diagram shows a perspective view of the translation mechanism 27. The translation mechanism 27 includes a mounting plate 171, a cylinder assembly 150, a clamping component 271, a clamping auxiliary plate 272, and multiple linear modules. In this embodiment, the linear modules include an X-axis linear module 141 and a Y-axis linear module 142. The Y-axis linear module 142 connects the second conveyor line 132 and the first conveyor line 131. The X-axis linear module 141 is mounted on the Y-axis linear module 142. The mounting plate 171 is mounted on the X-axis linear module 141. The clamping auxiliary plate 272 and the cylinder assembly 150 are respectively mounted on the mounting plate 171. At both ends of 71, the output end of the piston rod in the cylinder assembly 150 is connected to the clamping member 271, and drives the clamping member 271 to extend and retract. The clamping member 271 cooperates with the clamping auxiliary plate 272 to clamp the carrier 136 above the second conveyor line 132. The Y-axis linear module 142 transports the empty carrier 136 from the second conveyor line 132 to the first conveyor line 131. The X-axis linear module 141 transports the empty carrier 136 to the preset first assembly position 181. In this embodiment, every three carriers 136 form a group, and each time a group of empty carriers 136 is transported to the first assembly position 181.

[0061] Furthermore, the first unloading mechanism 28 is located above the inkjet platform mechanism 25 and the first assembly position 181, and includes a gripper module 160 and multiple linear modules. Its structure is similar to that of the first picking mechanism 23. In this embodiment, it includes linear modules in three directions: X-axis, Y-axis and Z-axis. The linear modules are vertically connected to each other. The gripper module 160 is connected to the Z-axis linear module 143. The driving component drives the linear modules and the gripper module 160 to achieve the clamping and releasing of the gripper 162, as well as the lifting and lowering movement in the X-axis, Y-axis and Z-axis directions. This enables the first unloading mechanism 28 to pick up the filter cavity 137 on the inkjet platform mechanism 25 and place it on the carrier 136.

[0062] Furthermore, the first recycling box 292 is located to the side of the first material handling position 191, such as... Figure 10 The diagram shows a perspective view of the first recycling mechanism 29. The first recycling mechanism 29 includes an X-axis linear module 141, a cylinder assembly 150, a mounting plate 171, and multiple suction nozzles 175. In this embodiment, the X-axis linear module 141 is located above the first recycling frame 292. The cylinder assembly 150 is mounted on the X-axis linear module 141. The mounting plate 171 is mounted on the output end of the piston rod in the cylinder assembly 150. Multiple suction nozzles 175 are evenly distributed on the mounting plate 171. The cylinder assembly 150 drives the suction nozzles 175 to move up and down. The suction nozzles 175 pick up the first blister box 231. The X-axis linear module 141 transports the first blister box 231 from the first material picking position 191 to the first recycling frame 292, where it waits to be taken away. In this embodiment, the empty blister boxes in the first recycling frame 292 are manually collected every 30 minutes.

[0063] Please refer to Figures 11-13 The fly stick assembly module 3 includes a flattening mechanism 31, a pushing mechanism 32, a reference platform 33, a first positioning mechanism 34, multiple discharge mechanisms 35, multiple assembly mechanisms 36, multiple second identification mechanisms 37, and a flattening mechanism 38. The first conveyor line 131 transports the carrier 136, containing the filter cavity 137, from the inkjet marking module 2 to the fly stick assembly module 3. The flattening mechanism 31 moves above the first conveyor line 131, and the pushing mechanism 32 moves within the gap 135. The flattening mechanism 31 is used to push the carrier 136 from the first conveyor line 131 onto the pushing mechanism 32, and the pushing mechanism 32 is used to sequentially push the carrier 136 to a preset second assembly position 182 and a preset flattening position. The reference platform 33 and... The first positioning mechanism 34 is located on both sides of the second assembly position 182. The first positioning mechanism 34 is used to push the filter cavity 137 on the carrier 136 to fit tightly against the reference platform 33, so that the filter cavity 137 is fixed in the second assembly position 182. The discharge mechanism 35 is used to arrange multiple fly rods on the preset second picking position 192. The second identification mechanism 37 is installed on the assembly mechanism 36 and is used to identify the mounting hole in the filter cavity 137. The assembly mechanism 36 is movable above the first picking position 191 and the second assembly position 182 and is used to clamp the fly rod and insert it into the mounting hole. The flattening mechanism 38 is movable above the flattening position and is used to flatten the fly rod so that the fly rod is fully inserted into the mounting hole.

[0064] In specific implementation: the first conveyor line 131 transports the carrier 136 containing the filter cavity 137 from the inkjet marking module 2 to the fly rod assembly module 3. The flat pushing mechanism 31 is located at the entrance of the fly rod assembly module 3 and includes a cylinder assembly 150 and a first pusher 311. The cylinder assembly 150 is installed parallel above the first conveyor line 131, and the first pusher 311 is installed at the output end of the telescopic rod in the cylinder assembly 150. In this embodiment, the first pusher 311 is gate-shaped and clamps both sides of the carrier 136. The cylinder assembly 150 drives the first pusher 311 to push two sets of carriers 136 from the first conveyor line 131 to the push-and-place mechanism 32 each time, that is, pushes 6 filter cavities 137 onto the push-and-place mechanism 32 each time.

[0065] Furthermore, such as Figure 12The diagram shows a perspective view of the pushing mechanism 32, the reference platform 33, the first positioning mechanism 34, and the flattening mechanism 38. The pushing mechanism 32 includes a mounting plate 171, multiple second pushing members 321, and multiple linear modules. In this embodiment, the linear modules are pneumatic linear modules, including an X-axis linear module 141 and a Z-axis linear module 143. The second pushing members 321 are columnar. The X-axis linear module 141 is installed parallel to the bottom of the first conveyor line 131, and the Z-axis linear module 143 is installed vertically above the X-axis linear module. At the output end of 141, mounting plate 171 is mounted on the output end of Z-axis linear module 143. Multiple second pushers 321 are mounted on mounting plate 171 at one end and pass through the gap 135 between the first conveyor lines 131 to connect to carrier 136 at the other end. Z-axis linear module 143 drives second pushers 321 to move up and down. X-axis linear module 141 drives second pushers 321 to push filter cavity 137 on carrier 136 to sequentially reach preset second assembly position 182 and preset flattening position. The reference platform 33 and the first positioning mechanism 34 are located on both sides of the second assembly position 182. In this embodiment, the first positioning mechanism 34 includes two sets of cylinder assemblies 150 and a third pusher 341 located on the same side. The output ends of the cylinder assemblies 150 are all perpendicular to the second assembly position 182. The third pusher 341 is installed on the output ends of the cylinder assemblies 150. The cylinder assemblies 150 push the third pusher 341 to push the filter cavity 137 on the carrier 136 to be in close contact with the reference platform 33, so that the filter cavity 137 is fixed in the second assembly position 182.

[0066] Furthermore, such as Figure 13 The diagram shows a perspective view of the discharge mechanism 35, which includes a first vibrator 351, a second vibrator 352, a discharge chamber 353, and a discharge pipe 354. The discharge chamber 353 is mounted on the first vibrator 351, with its inlet opening upwards. The outlet of the discharge chamber 353 is connected to the inlet of the discharge pipe 354, and the outlet of the discharge pipe 354 is located at a preset second material receiving position 192. The first vibrator 351 vibrates the discharge chamber 353 to allow the fly rod inside the discharge chamber 353 to enter the discharge pipe 354. The second vibrator 352 vibrates the discharge pipe 354 to arrange the fly rod at the preset second material receiving position 192. In this embodiment, two discharge mechanisms 35 are provided. The fly rod is manually added to the discharge chamber 353 at a set cycle. The first vibrator 351 and the second vibrator 352 arrange the fly rod at the preset second material receiving position 192 through a combination of circular and linear vibration.

[0067] Furthermore, the assembly mechanism 36 includes a mounting plate 171, a gripper module 160, and multiple linear modules. In this embodiment, the assembly mechanism 36 includes two modules, which are located to the side of the discharge mechanism 35. The linear modules include three linear modules in the X-axis, Y-axis, and Z-axis directions, which are vertically connected. The mounting plate 171 is mounted on the Z-axis linear module 143. The gripper module 160 and the second identification mechanism 37 are mounted on the mounting plate 171. The second identification mechanism 37 is a CCD and is located to the side of the gripper module 160. The second identification mechanism 37 is used to identify the position of the mounting hole in the filter cavity 137. The control component controls the movement of the linear module and the gripper module 160 according to the second identification result. The linear module drives the gripper module 160 to grip the fly rod on the second material picking position 192 and insert it into the mounting hole in the filter cavity 137.

[0068] Furthermore, after the two assembly mechanisms 36 insert the 6 PCS fly rods into the mounting holes of the 6 filter cavities 137 respectively, the pushing mechanism 32 transports the carrier 136 from the second assembly position 182 to the flattening position. Here, PCS is an abbreviation for pieces, used as a plural unit of measurement to represent units such as "pieces", "units", or "sets". The flattening mechanism 38 includes a cylinder assembly 150 and a flattening plate 381. The cylinder assembly 150 is located above the flattening position, and the flattening plate 381 is installed at the output end of the compression rod in the cylinder assembly 150. The cylinder assembly 150 drives the flattening plate 381 to move up and down to flatten the 6 PCS fly rods and fully insert them into the mounting holes.

[0069] Please refer to Figure 14 and Figure 15 The resonant rod assembly module 4 includes a first lifting mechanism 41, a sensing device 42, a second positioning mechanism 43, a first feeder 44, a first locking mechanism 45, and a blocking mechanism 173. A first conveyor line 131 transports the carrier 136, containing the filter cavity 137, from the flying rod assembly module 3 to a preset third assembly position 183 in the resonant rod assembly module 4. The first lifting mechanism 41 is located between gaps 135 and below the third assembly position 183, and is used to lift the carrier 136. The sensing device 42 is located to the side of the third assembly position 183 and is used to detect the filter cavity in the carrier 136. Whether the body 137 has reached the set height; the second positioning mechanism 43 is located on both sides of the third assembly position 183 and is used to fix the filter cavity 137 on the third assembly position 183; the first feeder 44 is used to automatically provide the resonant rod to the first locking mechanism 45, the first locking mechanism 45 is movable above the third assembly position 183; the first locking mechanism 45 is provided with an electric screwdriver 174 and is used to pick up the resonant rod and lock the resonant rod into the filter cavity 137; the blocking mechanism 173 is provided on the first conveyor line 131 and is used to block multiple sets of carriers 136 from entering the resonant rod assembly module 4 at the same time.

[0070] In specific implementation: the first conveyor line 131 transports a set of carriers 136 containing the filter cavity 137 from the flying rod assembly module 3 to the preset third assembly position 183 in the resonant rod assembly module 4; such as Figure 15 This is a perspective view of the first lifting mechanism 41. The first lifting mechanism 41 includes a Z-axis linear module 143 and a lifting plate 411. The Z-axis linear module 143 is vertically mounted below the third assembly position 183. One end of the lifting plate 411 is mounted on the Z-axis linear module 143, and the other end passes through a gap 135 and connects to the carrier 136 on the third assembly position 183. The Z-axis linear module 143 drives the lifting plate 411 to lift the carrier 136. A sensing device 42 is installed between the first conveyor line 131 and the second conveyor line 132, and is located to the side of the third assembly position 183, for measuring... The height of the filter cavity 137 in the carrier 136 is controlled by the first lifting mechanism 41 according to the measurement results, so that the height of the filter cavity 137 in the carrier 136 reaches the set height; the second positioning mechanism 43 includes two, and is located on both sides of the third assembly position 183 respectively. In this embodiment, the structure of the second positioning mechanism 43 is similar to that of the first positioning mechanism 34, and will not be described again. The second positioning mechanism 43 pushes the carrier 136 from the opposite sides of the third assembly position 183 so that the filter cavity 137 is fixed on the third assembly position 183.

[0071] Furthermore, the first feeder 44 and the first locking mechanism 45 are both located above the third assembly position 183. The first feeder 44 is used to automatically supply the resonant rod to the first locking mechanism 45. The first locking mechanism 45 includes a vacuum pump 451, multiple electric screwdrivers 174, and multiple linear modules. The vacuum pump 451 and the electric screwdrivers 174 are both located at the output end of the linear modules. The linear modules include an X-axis linear module 141, a Y-axis linear module 142, and a Z-axis linear module 143, which work together to drive the electric screwdrivers 174 to achieve spatial movement in the X, Y, and Z axes. The vacuum pump 451 is used to provide vacuum adsorption for the suction nozzle 175 of the electric screwdrivers 174. After the electric screwdrivers 174 suction nozzle 175 adsorbs the resonant rod, it locks the resonant rod into the filter cavity 137. In this embodiment, there are 3 sets of electric screwdrivers 174, and each set of electric screwdrivers 174 locks 8 resonant rods.

[0072] Furthermore, the blocking mechanism 173 is located at the input end of the resonant rod assembly module 4 and is used to block multiple sets of carriers 136 from entering the resonant rod assembly module 4 at the same time. That is, one set of carriers 136 is allowed to be in the resonant rod assembly module 4 at the same time. In this embodiment, the solder paste application module 5, the cover plate assembly module 6 and the connector assembly module 7 are all equipped with the blocking mechanism 173. The structure and function are the same, and will not be described again.

[0073] Please refer to Figures 16-18The solder paste application module 5 includes an installation mechanism 51, a second lifting mechanism 52, a clamping mechanism 53, a solder paste application mechanism 54, a detection mechanism 55, a defective product rejection mechanism 56, a defective product storage bin 57, and an ultrasonic cleaning mechanism 58. A first conveyor line 131 transports a carrier 136 containing a filter cavity 137 from the resonant rod assembly module 4 to a preset fourth assembly position 184 in the solder paste application module 5. The installation mechanism 51 is located above the fourth assembly position 184 and is used to install a preset stencil 514. The second lifting mechanism 52 is located between gaps 135 and below the fourth assembly position 184, and is used to lift the carrier 136 so that the filter cavity 137 reaches a set height. The clamping mechanism 53 is located above the stencil 514 and is used to press the stencil 514 so that the stencil 514 fits tightly against the filter cavity 137. The solder paste application mechanism 54 is equipped with a scraper that moves on the stencil 514. The filter cavity 137 is brushed with solder paste by a scraper; the first conveyor line 131 conveys the filter cavity 137 to the area below the detection mechanism 55; the detection mechanism 55 is used to detect whether the fly rod, resonant rod and solder paste in the filter cavity 137 are missing, and obtain the detection result; the first conveyor line 131 conveys the filter cavity 137 to the preset initial screening position 561; the defective product rejection mechanism 56 and the defective product temporary storage bin 57 are located on both sides of the initial screening position 561; if the detection result is that there is a missing part, the defective product rejection mechanism 56 pushes the filter cavity 137 into the defective product temporary storage bin 57; if the detection result is that there is no missing part, the first conveyor line 131 transports the carrier 136 containing the filter cavity 137 from the solder paste brushing module 5 to the preset fifth assembly position 185 in the cover plate assembly module 6; the ultrasonic cleaning mechanism 58 is located to the side of the solder paste brushing mechanism 54 and is used to clean the stencil 514.

[0074] In specific implementation: the first conveyor line 131 transports the carrier 136 containing the filter cavity 137 from the resonant rod assembly module 4 to the preset fourth assembly position 184 in the solder paste application module 5; such as Figure 18 and Figure 19The figures shown are perspective and bottom views of the mounting mechanism 51, the clamping mechanism 53, and the solder paste application mechanism 54. The mounting mechanism 51 includes a support frame 511 and a fastener 512. The support frame 511 has a first reserved hole 513, the position of which corresponds to the fourth assembly position 184. The stencil 514 is mounted on the support frame 511 by the fastener 512. In this embodiment, the fastener 512 can be a bolt. The clamping mechanism 53 includes a mounting plate 171 and a cylinder assembly 150. The cylinder assembly 150 is mounted on top of the support frame 511 via the mounting plate 171. The telescopic rod in the cylinder assembly 150 presses down on the steel mesh 514 so that the steel mesh 514 is tightly attached to the first pre-drilled hole 513. The second lifting mechanism 52 is located below the fourth assembly position 184 and has a similar structure to the first lifting mechanism 41, so it will not be described again. The second lifting mechanism 52 lifts the carrier 136 so that the filter cavity 137 reaches the set height. The filter cavity 137 passes through the first pre-drilled hole 513. 13 abuts against stencil 514; stencil 514 is provided with a plurality of second reserved holes 515, the second reserved holes 515 corresponding to the opening edge of filter cavity 137; solder paste brushing mechanism 54 is located on the side of fourth assembly position 184, including mounting bracket 172, cylinder assembly 150, scraper 541 and a plurality of linear modules. In this embodiment, the linear modules include Y-axis linear module 142 and Z-axis linear module 143. Mounting bracket 172 is mounted on Y-axis linear module 142 and Z-axis linear module 143. Line module 143 is mounted on mounting bracket 172, cylinder assembly 150 is mounted on Z-axis linear module 143, scraper 541 is mounted on the output end of the telescopic rod in cylinder assembly 150, cylinder assembly 150 and linear module cooperate to drive scraper 541 to move back and forth and up and down relative to stencil 514, scraper 541 applies solder paste to the edge of the opening of filter cavity 137 through second reserved hole 515; in this embodiment, solder paste is manually applied to stencil 514 every 30 minutes.

[0075] Furthermore, the first conveyor line 131 transports a set of carriers 136 containing filter cavities 137 to below the detection mechanism 55; the detection mechanism 55 uses a CCD to detect whether the fly rod and resonant rod in the filter cavity 137 are assembled in place and whether the solder paste path at the opening edge is missing, and obtains the detection results; the first conveyor line 131 transports the filter cavity 137 to the preset initial screening position 561; the defective product rejection mechanism 56 and the defective product temporary storage bin 57 are located on both sides of the initial screening position 561, and the control module 120 controls the defective product rejection mechanism 56 to perform initial screening on the filter cavity 137 according to the detection results; in this embodiment, if the detection result is that there is a missing part, the defective product rejection mechanism 56 pushes the filter cavity 137 into the defective product temporary storage bin 57; if the detection result is that there is no missing part, the first conveyor line 131 transports the carriers 136 containing filter cavities 137 from the solder paste application module 5 to the preset fifth assembly position 185 in the cover plate assembly module 6.

[0076] Please refer to Figure 19 The cover plate assembly module 6 includes a third positioning mechanism 61, a second lifting mechanism 62, a second fixing mechanism 63, a second material picking mechanism 64, a third identification mechanism 65, a second feeder 66, a third lifting mechanism 67, a fourth positioning mechanism 68, a second locking mechanism 69, and multiple second blister packs 610. The third positioning mechanism 61 is located on both sides of the fifth assembly position 185 and is used to fix the filter cavity 137 to the fifth assembly position 185. The second blister packs 610 are equipped with preset cover plates and are stacked in the preset third material picking position 19. 3. The second lifting mechanism 62 is located below the third material picking position 193 and is used to lift the second blister box 610 so that the top layer of the second blister box 610 is at a set height; the second fixing mechanism 63 is located to the side of the third material picking position 193 and is used to fix the top layer of the second blister box 610 to the third material picking position 193; the second picking mechanism 64 is movable above the third material picking position 193, the third identification mechanism 65 and the fifth assembly position 185. The second picking mechanism 64 clamps the cover plate above the third identification mechanism 65, and the third identification mechanism 65 uses... The second material handling mechanism 64 identifies the direction of the cover plate and obtains a third identification result. If the third identification result is a preset positive direction, the second material handling mechanism 64 directly places the cover plate on the filter cavity 137. If the third identification result is a preset negative direction, the second material handling mechanism 64 rotates the cover plate 180 degrees and places it on the filter cavity 137. The first conveyor line 131 conveys the carrier 136 containing the filter cavity 137 and the cover plate to the preset sixth assembly position 186. The third lifting mechanism 67 is located within the gap 135 and below the sixth assembly position 186. The fourth positioning mechanism 68 is located on both sides of the sixth assembly position 186 and is used to fix the filter cavity 137 and the cover plate to the sixth assembly position 186. The second feeder 66 is used to automatically provide the preset screws to the second fastening mechanism 69. The second fastening mechanism 69 is movable above the sixth assembly position 186 and is equipped with an electric screwdriver 174, which is used to fasten the screws into the cover plate and the filter cavity 137 so that the cover plate and the filter cavity 137 are fixedly connected.

[0077] In specific implementation: the third positioning mechanism 61 is located on both sides of the fifth assembly position 185 and is used to fix the filter cavity 137 on the fifth assembly position 185; any second blister box 610 is equipped with multiple cover plates and stacked on the preset third material picking position 193; the second lifting mechanism 62 is located below the third material picking position 193 and is used to lift the second blister box 610 so that the top layer second blister box 610 is always at the set height; the second fixing mechanism 63 is located on the side of the third material picking position 193 and is used to fix the top layer second blister box 610 to the third material picking position 193; in this embodiment, the second fixing mechanism 63 positions the second blister box 610 of the top layer material picking position from four directions; the third positioning mechanism 61 has a similar structure to the second positioning mechanism 43; the second lifting mechanism 62 has a similar structure to the first lifting mechanism 21; and the second fixing mechanism 63 has a similar structure to the first fixing mechanism 22. These will not be described again.

[0078] Furthermore, the second picking mechanism 64 is located above the third picking position 193, the third identification mechanism 65, and the fifth assembly position 185. In this embodiment, the second picking mechanism 64 has a similar structure to the first picking mechanism 23, and will not be described again. The second picking mechanism 64 picks up the cover plate and places it above the third identification mechanism 65. The third identification mechanism 65 uses a CCD and is used to identify the direction of the cover plate. The control component controls the second picking mechanism 64 according to the third identification result. In this embodiment, if the third identification result is a preset positive direction, the second picking mechanism 64 directly places the cover plate on the filter cavity 137. If the third identification result is a preset negative direction, the second picking mechanism 64 rotates the cover plate 180 degrees and places it on the filter cavity 137 so that the direction of the cover plate is consistent with that of the filter.

[0079] Furthermore, the first conveyor line 131 transports the carrier 136 containing the filter cavity 137 and the cover plate to the preset sixth assembly position 186; the third lifting mechanism 67 is located below the sixth assembly position 186 and is used to lift the carrier 136 so that the cover plate and the filter cavity 137 reach a set height; the fourth positioning mechanism 68 is located on both sides of the sixth assembly position 186 and is used to fix the filter cavity 137 and the cover plate to the sixth assembly position 186; the second feeder 66 is used to automatically provide preset screws to the second fastening mechanism 69; the second fastening mechanism 69 is movable above the sixth assembly position 186, the second The fastening mechanism 69 includes an electric screwdriver 174, whose suction nozzle 175 vacuum-adsorbs screws and is used to fasten screws into the cover plate and filter cavity 137, so that the cover plate and filter cavity 137 are fixedly connected. In this embodiment, the third lifting mechanism 67 is similar in structure to the second lifting mechanism 52, the fourth positioning mechanism 68 is similar in structure to the third positioning mechanism 61, the second feeder 66 is similar in structure to the first feeder 44, and the second fastening mechanism 69 is similar in structure to the first fastening mechanism 45. These will not be described again. The second fastening mechanism 69 includes 3 sets of electric screwdrivers 174, and each set of electric screwdrivers 174 fastens 5 screws at a time.

[0080] Furthermore, the cover assembly module 6 includes a second recycling mechanism 611 and a second recycling frame 612. The second recycling mechanism 611 is movable above the third material picking position 193 and the second recycling frame 612. When the cover in the second blister box 610 of the top layer is completely picked up, the second recycling mechanism 611 picks up the second blister box 610 of the top layer and places it in the second recycling frame 612. In this embodiment, the second recycling mechanism 611 is similar in structure to the first recycling mechanism 29, and the second recycling frame 612 is similar in structure to the first recycling frame 292, and will not be described again.

[0081] Please refer to Figure 20 and Figure 21The connector assembly module 7 includes a first stop mechanism 71, a conveying mechanism 72, a flipping mechanism 73, a clamping mechanism 74, a third feeder 75, a pressing mechanism 76, a dispensing mechanism 77, a dispensing control module 78, and a second stop mechanism 781. A first conveyor line 131 transports a carrier 136 containing a filter cavity 137 from the cover plate assembly module 6 to the connector assembly module 7. The first stop mechanism 71 is located to the side of a preset first stop position and is used to stop the carrier 136 at the first stop position. The conveying mechanism 72 is movable above the first stop position and the flipping mechanism 73 and is used to move the carrier 136 and the filter cavity 137 from the first stop position onto the flipping mechanism 73. The clamping mechanism 74 is mounted on the flipping mechanism 73 and is used to move the carrier 136 and the filter cavity 137 from the first stop position onto the flipping mechanism 73. The filter cavity 137 is pressed against the flipping mechanism 73; the flipping mechanism 73 is used to translate and flip the filter cavity 137, and sequentially convey it to the preset pressing position 187 and the preset dispensing position 188; when the filter cavity 137 reaches the pressing position 187, the third feeder 75 is used to automatically provide the preset connector to the pressing mechanism 76; the pressing mechanism 76 is equipped with an electric screwdriver 174, and is used to press the connector onto the side of the filter cavity 137; when the filter cavity 137 reaches the dispensing position 188, the dispensing control module 78 is used to control the dispensing mode and dispensing amount of the dispensing mechanism 77; the dispensing mechanism 77 is used to apply the adhesive to the bottom surface of the filter cavity 137; the second stop mechanism 781 is used to stop the filter cavity 137 at the preset second stop position.

[0082] In specific implementation: the first conveyor line 131 transports the carrier 136 containing the filter cavity 137 from the cover plate assembly module 6 to the connector assembly module 7; the first stop mechanism 71 is located to the side of the preset first stop position and is used to stop the carrier 136 at the first stop position; the conveying mechanism 72 includes multiple linear modules and gripper modules 160. In this embodiment, the linear modules include a Y-axis linear module 142 and a Z-axis linear module 143. The gripper module 160 is installed at the output end of the Z-axis linear module 143. The linear modules and the gripper module 160 cooperate to grip the carrier 136 at the first stop position and place it on the preset flipping platform 731 on the flipping mechanism 73.

[0083] Furthermore, such as Figure 21The diagram shows a perspective view of the flipping mechanism 73 and the clamping mechanism 74. Multiple clamping mechanisms 74 are located on the side of the flipping platform 731, including a rotary telescopic cylinder 741, a transmission rod 742, and a clamping member 743. One end of the transmission rod 742 is connected to the rotary telescopic cylinder 741, and the other end is connected to the clamping member 743. The rotary telescopic cylinder 741 drives the transmission rod 742 to move the clamping member 743 in lifting and rotating motions. In this embodiment, when the filter cavity 137 needs to be flipped, the rotary telescopic cylinder 741 drives the clamping member 743 to rotate above the filter cavity 137 and drives the clamping member 743 to press down on the filter cavity to prevent it from falling. When the filter cavity 137 needs to be removed, the rotary telescopic cylinder 741 drives the clamping member 743 to rotate away from the filter cavity 137. The flipping mechanism 73 includes a linear module, a mounting frame 172, a flipping platform 731, and a flipping module 732. The mounting frame 172 is mounted on the linear module, and the flipping platform 731 is mounted on the mounting frame 172 via the flipping module 732. In this embodiment, the linear module is an X-axis linear module 141, which is used to drive the filter cavity 137 on the flipping platform 731 to translate, and the flipping module 732 is used to drive the filter cavity 137 on the flipping platform 731 to flip.

[0084] Furthermore, when the linear module drives the filter cavity 137 to translate to the preset pressing position 187, the flipping module 732 drives the filter cavity 137 to rotate 90 degrees clockwise so that the side of the filter cavity 137 faces upward; the third feeder 75 is similar in structure to the second feeder 66 and is used to automatically provide the preset connectors to the pressing mechanism 76. The pressing mechanism 76 includes a Z-axis linear module 143, a cylinder assembly 150 and an electric screwdriver 174. The cylinder assembly 150 is mounted on the Z-axis linear module 143, and the electric screwdriver 174 is mounted on the output end of the cylinder assembly 150. The Z-axis linear module 143 and the cylinder assembly 150 cooperate to drive the electric screwdriver 174 to move up and down. The suction nozzle 175 of the electric screwdriver 174 picks up the connector and presses it onto the side of the filter cavity 137. In this embodiment, the electric screwdriver 174 includes 3 sets, pressing 2 connectors at a time. When the linear module drives the filter cavity 137 to translate to the preset dispensing position 188, the flipping module 732 drives the filter cavity 137 to rotate 90 degrees clockwise again so that the bottom surface of the filter cavity 137 faces upward; the dispensing mechanism 77 includes a Z-axis linear module 143 and a dispensing nozzle 771. The dispensing nozzle 771 is mounted on the Z-axis linear module 143, and the Z-axis linear module 143 drives the dispensing nozzle 771 to perform lifting and lowering movements; the dispensing control module 78 is used to control the dispensing mode and dispensing amount of the dispensing nozzle 771, and the dispensing nozzle 771 applies the adhesive to the bottom surface of the filter cavity 137.

[0085] Please refer to Figure 1 and Figure 22The filter cavity 137 at the second stop position is manually transported to the third conveyor line 133 via a preset method. The third conveyor line 133 is used to transport the filter cavity 137 to the reflow soldering module 8. The reflow soldering module 8 is equipped with a heating element, which is used to melt the solder paste between the filter cavity 137 and the cover plate. The cooling module 9 includes a cooling speed-regulating conveying mechanism and a heat dissipation mechanism, with the heat dissipation mechanism located above the conveying mechanism. The cooling speed-regulating conveying mechanism is connected to the third conveyor line 133 and is used to transport the filter cavity 137 through the heat dissipation mechanism. The cooling speed-regulating conveying mechanism adjusts the conveying speed according to the temperature of the filter cavity 137 and the target temperature, so that the heat dissipation mechanism cools and solidifies the solder paste between the filter cavity 137 and the cover plate, and the filter cavity 137 and the cover plate are tightly connected.

[0086] In specific implementation: the second stop mechanism 781 stops the filter cavity 137 at a preset second stop position. The filter cavity 137 at the second stop position is then manually moved to the third conveyor line 133, and an empty carrier 136 is placed on the second conveyor line 132 so that the empty carrier 136 can be transported back to the inkjet marking module 2. The filter cavity 137 is stabilized on the third conveyor line 133 by the adhesive on its bottom surface. The third conveyor line 133 is used to transport the filter cavity 137 to the reflow soldering module 8. The reflow soldering module 8 is equipped with a heating element used to melt the filter. Solder paste between the cavity 137 and the cover plate; the cooling module 9 includes a cooling speed-regulating conveying mechanism and multiple heat dissipation mechanisms 92. The heat dissipation mechanisms are located above the conveying mechanism. The cooling speed-regulating conveying mechanism is connected to the third conveying line 133 and is used to convey the filter cavity 137 through the heat dissipation mechanism. The cooling speed-regulating conveying mechanism adjusts the conveying speed according to the temperature of the filter cavity 137 and the target temperature so that the heat dissipation mechanism cools and solidifies the solder paste between the filter cavity 137 and the cover plate, thereby making the connection between the filter cavity 137 and the cover plate tighter. In this embodiment, the heat dissipation mechanism adopts a fan.

[0087] Please refer to Figure 23 This invention provides a control method for assembling miniaturized 5G filter components, comprising the following steps:

[0088] S1, the preset control module 120 controls the preset conveying module 130 to sequentially convey the filter cavity 137 to the preset inkjet marking module 2, the preset flying rod assembly module 3, the preset resonant rod assembly module 4, the preset solder paste application module 5, the preset cover plate assembly module 6, the preset connector assembly module 7, the preset reflow soldering module 8 and the preset cooling module 9.

[0089] S2, the inkjet marking module 2 is controlled by the control module 120 to perform inkjet marking on the same side of any filter cavity 137;

[0090] S3, the control module 120 controls the fly stick assembly module 3 to assemble the preset fly stick into the filter cavity 137;

[0091] S4, the control module 120 controls the resonant rod assembly module 4 to lock the preset resonant rod into the filter cavity 137;

[0092] S5, the control module 120 controls the solder paste application module 5 to apply preset solder paste to the opening edge of the filter cavity 137 and screen out defective products.

[0093] S6, the control module 120 controls the cover plate assembly module 6 to lock the cover plate onto the filter cavity 137 accordingly;

[0094] S7, the control module 120 controls the connector assembly module 7 to install the preset connector on the side of the filter cavity 137, and applies adhesive to the bottom surface of the filter cavity 137.

[0095] S8, the reflow soldering module 8 is controlled by the control module 120 to change the state of the solder paste between the cover plate and the filter cavity 137;

[0096] S9, the cooling module 9 is controlled by the control module 120 to cool the filter cavity 137 so that the cover plate is tightly connected to the filter cavity 137.

[0097] In this embodiment, firstly, the preset control module 120 controls the preset conveying module 130 to sequentially convey the filter cavity 137 to the preset inkjet marking module 2, the preset flying rod assembly module 3, the preset resonant rod assembly module 4, the preset solder paste application module 5, the preset cover plate assembly module 6, the preset connector assembly module 7, the preset reflow soldering module 8, and the preset cooling module 9. Next, the control module 120 controls the inkjet marking module 2 to perform inkjet marking on the same side of any filter cavity 137. In one specific embodiment, the inkjet marking module 2 is equipped with a first identification mechanism 2. 4. The first material handling mechanism 23 and the inkjet mechanism 26, the first identification mechanism 24 identify the direction of the filter cavity 137 and obtain a first identification result. The control module 120 controls the first material handling mechanism 23 to rotate the filter cavity 137 according to the first identification result, so that the same side of any filter cavity 137 faces the inkjet mechanism 26. The inkjet mechanism 26 is used to perform inkjet marking on the filter cavity 137. Then, the control module 120 controls the fly stick assembly module 3 to assemble the preset fly stick into the filter cavity 137. In this embodiment, the fly stick assembly module 3 includes a second identification mechanism 37 and an assembly mechanism. 36. The second identification mechanism 37 is used to identify the mounting holes in the filter cavity 137 and obtain a second identification result. The control module 120 controls the assembly mechanism 36 to assemble the flying rod into the mounting hole of the filter cavity 137 according to the second identification result. Then, the control module 120 controls the resonant rod assembly module 4 to lock the preset resonant rod into the filter cavity 137. Next, the control module 120 controls the solder paste application module 5 to apply preset solder paste to the opening edge of the filter cavity 137 and screen out defective products. In this embodiment, the solder paste application module 5 includes a detection mechanism 55 and a defective product rejection mechanism 56. Mechanism 55 detects whether the fly rod, resonant rod, and solder paste are missing in the filter cavity 137. The control module controls the defective product rejection mechanism 56 to reject the defective products based on the detection results. Then, the control module 120 controls the cover plate assembly module 6 to lock the cover plate onto the filter cavity 137. In this embodiment, the cover plate assembly module 6 includes a third identification mechanism 65 and a second material handling mechanism 64. The third identification mechanism 65 is used to identify the direction of the cover plate and obtain a third identification result. The control module 120 controls the second material handling mechanism 64 to rotate the cover plate according to the third identification result so that the cover plate corresponds to the direction of the filter cavity 137.Next, the control module 120 controls the connector assembly module 7 to install the preset connector on the side of the filter cavity 137, and applies adhesive to the bottom surface of the filter cavity 137. In this embodiment, the connector assembly module 7 includes a flipping mechanism 73, a pressing mechanism 76, and an adhesive dispensing mechanism 77. The control module 120 controls the flipping mechanism 73 to rotate the filter cavity 137 by 90 degrees so that the pressing mechanism 76 presses the connector onto the side of the filter cavity 137. The control module 120 then controls the flipping mechanism 73 to rotate the filter cavity 137 by another 90 degrees so that the adhesive dispensing mechanism 77 applies adhesive to the bottom surface of the filter cavity 137. Next, the control module 120 controls the reflow soldering module 8 to change the state of the solder paste between the cover plate and the filter cavity 137. Finally, the control module 120 controls the cooling module 9 to cool the filter cavity 137, so that the cover plate and the filter cavity 137 are more tightly connected.

[0098] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0099] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An automated assembly line for miniaturized 5G filter components, comprising multiple cabinets arranged sequentially, characterized in that, It includes multiple modules arranged sequentially in the cabinet and a control module for controlling the modules. The modules are, in sequence, an inkjet marking module, a fly rod assembly module, a resonant rod assembly module, a solder paste application module, a cover plate assembly module, and a connector assembly module. The interior of the cabinet is connected by a preset conveying module. The conveying module includes a first conveying line, a second conveying line and a third conveying line. The first conveying line and the second conveying line are used to convey preset carriers to each of the modules. The carriers are used to carry preset filter cavities. The inkjet marking module is provided with a first identification mechanism, which is used to identify the direction of the filter cavity so that the inkjet marking module can perform inkjet marking on the same side of any filter cavity. The fly stick assembly module is provided with a second identification mechanism, which is used to identify the preset mounting hole in the filter cavity so that the fly stick assembly module assembles the preset fly stick into the mounting hole; The resonant rod assembly module is used to lock a preset resonant rod into the filter cavity; The solder paste application module is used to apply solder paste to the opening edge of the filter cavity. The solder paste application module also includes a preset detection mechanism for detecting defective products. The cover plate assembly module is provided with a third identification mechanism, which is used to identify the preset direction of the cover plate so that the cover plate is locked onto the filter cavity accordingly; The connector assembly module is provided with a flipping mechanism for flipping and translating the filter cavity, and for installing a preset connector on the side of the filter cavity, and for applying adhesive to the bottom surface of the filter cavity. It also includes a reflow soldering module and a cooling module. The third conveyor line connects the connector assembly module, the reflow soldering module, and the cooling module. The reflow soldering module is used to change the state of the solder paste, and the cooling module is used to cool the solder paste so that the cover plate is tightly connected to the filter cavity.

2. The 5G miniaturized filter component assembly integrated automatic line according to claim 1, characterized in that, The first conveyor line includes two synchronously moving conveyor belts with a gap between them. The width of the gap is smaller than the width of the carrier. The conveyor belts are used to sequentially transport the carrier containing the filter cavity from the inkjet marking module to the connector assembly module. The second conveyor line is used to return the empty carrier from the connector assembly module to the inkjet marking module.

3. The 5G miniaturized filter component assembly integrated automated line according to claim 2, characterized in that, The inkjet marking module includes a first lifting mechanism, a first fixing mechanism, a first material picking mechanism, a first identification mechanism, an inkjet platform mechanism, an inkjet mechanism, a first material dispensing mechanism, a first recycling mechanism, a first recycling frame, and multiple first blister packs; The first blister pack contains the filter cavity and is stacked on a preset first material handling position; The first lifting mechanism is located below the first material picking position and is used to lift the first blister box so that the top layer of the first blister box is at a set height; The first fixing mechanism is located to the side of the first material picking position and is used to fix the first blister box of the top layer to the first material picking position; The first material handling mechanism is movably positioned above the first material handling position, the first identification mechanism, and the inkjet platform mechanism. The first material handling mechanism picks up the filter cavity from the first blister pack and places it above the first identification mechanism. The first identification mechanism is used to identify the orientation of the filter cavity. If the orientation of the filter cavity is a preset positive direction, the first material handling mechanism directly places the filter cavity on the inkjet platform mechanism. If the orientation of the filter cavity is a preset negative direction, the first material handling mechanism rotates the filter cavity 180 degrees and places it on the inkjet platform mechanism so that the same side of any filter cavity faces the inkjet mechanism. The inkjet platform mechanism is movably disposed in front of the inkjet mechanism, and the inkjet mechanism is used to perform inkjet marking on the side of the filter cavity.

4. The 5G miniaturized filter component integrated automated assembly line according to claim 3, characterized in that, The second conveyor line is used to transport the empty carrier from the connector assembly module to the inkjet marking module; The inkjet marking module also includes a translation mechanism, which is movably disposed between the second conveyor line and the first conveyor line, and is used to translate the carrier from the second conveyor line to a preset first assembly position on the first conveyor line; The first feeding mechanism is movably disposed above the inkjet platform mechanism and the first assembly position, and is used to clamp the filter cavity on the inkjet platform mechanism and place it on the carrier; The first recycling mechanism is movably positioned above the first material picking position and the first recycling frame. When the filter cavity inside the first blister box at the top layer is completely picked up, the first recycling mechanism picks up the first blister box and places it in the first recycling frame.

5. The 5G miniaturized filter component integrated automated assembly line according to claim 4, characterized in that, The flying rod assembly module includes a flat pushing mechanism, a pushing and distributing mechanism, a reference platform, a first positioning mechanism, multiple material discharging mechanisms, multiple assembly mechanisms, multiple second identification mechanisms, and a flattening mechanism; The first conveyor line transports the carrier containing the filter cavity from the inkjet marking module to the fly rod assembly module; The flat pushing mechanism is movably disposed above the first conveyor line, and the push-and-place mechanism is movably disposed within the gap. The flat pushing mechanism is used to push the carrier from the first conveyor line to the push-and-place mechanism, and the push-and-place mechanism is used to push the carrier sequentially to a preset second assembly position and a preset flattening position. The reference platform and the first positioning mechanism are located on both sides of the second assembly position. The first positioning mechanism is used to push the carrier to fit tightly against the reference platform so that the filter cavity is fixed in the second assembly position. The discharge mechanism is used to arrange multiple flying rods at a preset second material picking position; The second identification mechanism is mounted on the assembly mechanism and is used to identify the mounting holes in the filter cavity; The assembly mechanism is movably positioned above the second material picking position and the second assembly position, and is used to clamp the flying rod and insert it into the mounting hole; The flattening mechanism is movably disposed above the flattening position. The flattening mechanism is used to flatten the fly rod so that the fly rod is fully inserted into the mounting hole.

6. The 5G miniaturized filter component assembly integrated automated line according to claim 5, characterized in that, The resonant rod assembly module includes a first lifting mechanism, a sensing device, a second positioning mechanism, a first feeder, a first locking mechanism, and a blocking mechanism; The first conveyor line transports the carrier containing the filter cavity from the flying rod assembly module to a preset third assembly position in the resonant rod assembly module; The first lifting mechanism is located between the gaps and below the third assembly position, and is used to lift the vehicle; The sensing device is located to the side of the third assembly position and is used to measure whether the filter cavity has reached the set height; The second positioning mechanism is located on both sides of the third assembly position and is used to fix the filter cavity to the third assembly position; The first feeder is used to automatically supply the resonant rod to the first locking mechanism; The first locking mechanism is movably disposed above the third assembly position; the first locking mechanism is equipped with an electric screwdriver and is used to pick up the resonant rod and lock the resonant rod into the filter cavity; The blocking mechanism is located on the first conveyor line and is used to prevent multiple sets of vehicles from entering the resonant rod assembly module at the same time.

7. The 5G miniaturized filter component integrated automated assembly line according to claim 6, characterized in that, The solder paste application module includes a stencil, an installation mechanism, a second lifting mechanism, a pressing mechanism, a solder paste application mechanism, an inspection mechanism, a defective product rejection mechanism, and a defective product temporary storage bin. The first conveyor line transports the carrier from the resonant rod assembly module to the preset fourth assembly position in the solder paste application module; The installation mechanism is located above the fourth assembly position and is used to install the preset steel mesh; The second lifting mechanism is located between the gaps and below the fourth assembly position, and is used to lift the carrier so that the filter cavity reaches a set height; A clamping mechanism is located above the steel mesh and is used to clamp the steel mesh so that the steel mesh fits tightly against the filter cavity; The solder paste application mechanism is equipped with a scraper, and the scraper moves to apply solder paste to the opening edge of the filter cavity. The first conveyor line transports the filter cavity to the area below the detection mechanism; The detection mechanism is used to detect whether the fly rod, the resonant rod, and the solder paste are missing in the filter cavity, and to obtain the detection results; The first conveyor line transports the filter cavity to a preset initial screening position; The defective product rejection mechanism and the defective product temporary storage bin are located on both sides of the initial screening position, respectively. If the detection result indicates that there is a missing item, the defective product rejection mechanism pushes the filter cavity into the defective product temporary storage bin; If the test result indicates that there are no missing parts, the first conveyor line will transport the carrier from the solder paste application module to the preset fifth assembly position in the cover plate assembly module.

8. The 5G miniaturized filter component assembly integrated automatic line according to claim 7, characterized in that, The cover plate assembly module includes a third positioning mechanism, a second lifting mechanism, a second fixing mechanism, a second material picking mechanism, a third identification mechanism, a second feeder, a third lifting mechanism, a fourth positioning mechanism, a second locking mechanism, and multiple second blister boxes; The third positioning mechanism is located on both sides of the fifth assembly position and is used to fix the filter cavity to the fifth assembly position; The second blister pack is equipped with a pre-set cover and is stacked on a pre-set third material handling position; The second lifting mechanism is located below the third material handling position and is used to lift the second blister box so that the top layer of the second blister box is at a set height; The second fixing mechanism is located to the side of the third material picking position and is used to fix the top layer of the second blister box to the third material picking position; The second material handling mechanism is movably positioned above the third material handling position, the third identification mechanism, and the fifth assembly position. The second material handling mechanism picks up the cover plate and places it above the third identification mechanism, which is used to identify the orientation of the cover plate. If the orientation of the cover plate is a preset positive direction, the second material handling mechanism directly places the cover plate on the filter cavity. If the orientation of the cover plate is a preset negative direction, the second material handling mechanism rotates the cover plate 180 degrees and places it on the filter cavity so that the cover plate and the filter cavity are aligned. The first conveyor line transports the vehicle to a preset sixth assembly position; The third lifting mechanism is located within the gap and below the sixth assembly position, and is used to lift the carrier so that the cover plate and the filter cavity reach a set height; The fourth positioning mechanism is located on both sides of the sixth assembly position and is used to fix the filter cavity and the cover plate to the sixth assembly position; The second feeder is used to automatically supply the preset screws to the second fastening mechanism; The second locking mechanism is movably disposed above the sixth assembly position and is equipped with an electric screwdriver, which is used to lock the screws into the cover plate and the filter cavity so that the cover plate and the filter cavity are fixedly connected.

9. The 5G miniaturized filter component integrated automated assembly line according to claim 8, characterized in that, The connector assembly module includes a first stop mechanism, a conveying mechanism, a flipping mechanism, a pressing mechanism, a third feeder, a pressing mechanism, a dispensing mechanism, a dispensing control module, and a second stop mechanism. The first conveyor line transports the carrier from the cover plate assembly module to the connector assembly module; The first stopping mechanism is located to the side of a preset first stopping position and is used to stop the vehicle at the first stopping position; The transport mechanism is movably disposed above the first stop position and the tilting mechanism, and is used to transport the vehicle from the first stop position to the tilting mechanism; The clamping mechanism is mounted on the flipping mechanism and is used to clamp the filter cavity onto the flipping mechanism; The flipping mechanism is used to translate and flip the filter cavity, and sequentially deliver it to the preset pressing position and the preset dispensing position; When the filter cavity reaches the pressing position, the third feeder is used to automatically provide a preset connector to the pressing mechanism; the pressing mechanism is equipped with an electric screwdriver and is used to press the connector onto the side of the filter cavity; When the filter cavity reaches the dispensing position, the dispensing control module controls the dispensing mode and dispensing amount of the dispensing mechanism; the dispensing mechanism applies the adhesive to the bottom surface of the filter cavity. The second stop mechanism is used to stop the filter cavity at a preset second stop position.

10. The 5G miniaturized filter component assembly integrated automatic line according to claim 9, characterized in that, The filter cavity at the second stop position is manually transported to the third conveyor line; The third conveyor line is used to convey the filter cavity to the reflow soldering module; The reflow soldering module is equipped with a heating element, which is used to melt the solder paste between the filter cavity and the cover plate.

11. The 5G miniaturized filter component assembly integrated automated line according to claim 10, characterized in that, The cooling module includes a cooling speed-regulating conveying mechanism and a heat dissipation mechanism, with the heat dissipation mechanism located above the conveying mechanism; The cooling speed-regulating conveying mechanism is connected to the third conveying line and is used to convey the filter cavity through the heat dissipation mechanism. The heat dissipation mechanism cools and solidifies the solder paste between the filter cavity and the cover plate to ensure a tight connection between the filter cavity and the cover plate.

12. A control method for assembling miniaturized 5G filter components, characterized in that, Includes the following steps: The preset control module controls the preset conveying module to sequentially convey the preset filter cavity to the preset inkjet marking module, preset fly rod assembly module, preset resonant rod assembly module, preset solder paste application module, preset cover plate assembly module, preset connector assembly module, preset reflow soldering module and preset cooling module. The control module controls the inkjet marking module to perform inkjet marking on the same side of any of the filter cavities. The control module controls the fly stick assembly module to assemble the preset fly stick into the filter cavity; The control module controls the resonant rod assembly module to lock the preset resonant rod into the filter cavity; The control module controls the solder paste application module to apply a preset amount of solder paste to the opening edge of the filter cavity and to screen out defective products. The control module controls the cover plate assembly module to lock the cover plate onto the filter cavity accordingly; The control module controls the connector assembly module to press-fit the preset connector onto the side of the filter cavity and apply adhesive to the bottom surface of the filter cavity. The control module controls the reflow soldering module to change the state of the solder paste between the cover plate and the filter cavity; The control module controls the cooling module to cool the solder paste, so that the cover plate is tightly connected to the filter cavity.

Images