A multi-stage filter and bus capacitor integrated module

Abstract

The application discloses a kind of multistage filtering and bus capacitor integrated module, belong to capacitor technical field.A kind of multistage filtering and bus capacitor integrated module, including shell and with shell group connects platform support piece;Corner area inside shell is equipped with heat aggregation buffer assembly, heat aggregation buffer assembly includes heat aggregation prevention element and buffer piece, heat aggregation prevention element and buffer piece group connect into an organic whole, heat aggregation prevention element can prevent the electric field magnetic force line of shell interior component in the corner area inside shell aggregation, and then cut magnetic force line movement occurs, lead to form local high temperature zone in corner area;Buffer piece can prevent in vehicle environment, due to the damage of multistage filtering assembly and shell caused by car body jolt and break, make multistage filtering assembly damage.The application is protected by the setting of heat aggregation buffer assembly, can play the protection effect to capacitor interior component, effectively increase the service life of capacitor.

Description

Technical Field

[0001] This invention belongs to the field of capacitor technology, and in particular relates to a multi-stage filtering and bus capacitor integrated module. Background Technology

[0002] With the development of technology, electronic systems have increasingly higher requirements for power supply quality. Direct power supply can lead to voltage fluctuations and signal interference in circuits. In high-precision electronic systems, voltage fluctuations and signal interference can cause distortion or damage. Therefore, such electronic systems require power filtering via capacitors before connection to the power source. To address this, some capacitors have appeared on the market, such as those with announcement numbers CN118471694B and CN111640576B. However, these capacitors suffer from uneven internal temperatures, often experiencing localized overheating at the corners, which can melt the capacitor's encapsulation or affect the normal operation of internal components, reducing the capacitor's lifespan. In automotive environments, these capacitors are also prone to damage due to collisions between internal components and the casing caused by vehicle vibrations. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a multi-stage filtering and bus capacitor integrated module that can overcome or at least partially solve the above problems.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A multi-stage filtering and bus capacitor integrated module includes a housing and a platform support. The platform support is connected to the outside of the housing. A copper busbar assembly and a multi-stage filtering assembly are mounted inside the housing and on the upper part of the platform support. The multi-stage filtering assembly is in contact with the copper busbar assembly and has capacitor cores.

[0006] The interior corner areas of the housing are equipped with heat-resistant cushioning components.

[0007] The heat-resistant and buffer assembly includes a heat-resistant component and a buffer component, and the heat-resistant component and the buffer component are integrated into one unit;

[0008] The heat-resistant agglomerating component can prevent the heat generated by the housing and copper busbar assembly during the minute movement of cutting magnetic lines from accumulating in the corner area of ​​the housing and causing local high temperature.

[0009] The buffer component can prevent the capacitor core from being damaged by micro-vibration or close-range friction between the capacitor core and the casing due to vehicle vibration when the capacitor is installed and used.

[0010] Preferably, the buffer is annular and made of a soft, heat-resistant insulating material.

[0011] Preferably, the heat-resistant polymer component is square and is made of heat-resistant and non-magnetic material;

[0012] In addition, the heat-resistant polymer component can also be L-shaped or corrugated, and the overall shape of the heat-resistant polymer component can match the corner area of ​​the shell.

[0013] Furthermore, a temperature sensor is installed on the housing.

[0014] Preferably, the temperature sensor has a temperature sensing chip assembly, which is installed at the bottom of the capacitor core. Each capacitor core is equipped with a set of temperature sensing chip assemblies. Different temperature sensing chip assemblies are interconnected through a grouping circuit, and the sensed signal is transmitted to the temperature sensor through a connecting wire harness.

[0015] Preferably, the temperature sensing chip assembly and the interconnecting circuit are arranged in a rectangular shape. When the interconnecting circuit between any two temperature sensing chip assemblies is disconnected, the sensed signal can still be transmitted to the temperature sensor through the rectangular circuit.

[0016] Here, the temperature sensing chip assembly and the interconnecting circuit can also be arranged in a star or triangle configuration, depending on the number and arrangement of the capacitor cores. This is to ensure that when the interconnecting circuit between any two temperature sensing chip assemblies is disconnected, the sensed temperature signal can still be transmitted to the temperature sensor through the interconnecting circuit.

[0017] Preferably, the temperature sensor includes a temperature sensing chip assembly, an external connecting wire, and a connector, with one end of the external connecting wire connected to the temperature sensing chip assembly and the other end of the external connecting wire connected to the connector.

[0018] The temperature sensor extends to the outside of the housing through multiple bends, and the end of the temperature sensor is provided with a connector for connection to the vehicle's central control system.

[0019] Furthermore, a partition is provided on the side of the housing that contacts the platform support, and a square through groove is provided on the partition, through which the copper busbar assembly can be installed.

[0020] Furthermore, the copper busbar assemblies are arranged in an alternating pattern with gaps, and the densely packed areas of the copper busbar assemblies are equipped with positioning plates.

[0021] Furthermore, the multi-stage filtering assembly also includes an X1 capacitor bank, a Y2 capacitor bank, a magnetic ring, and a reserved magnetic ring mounting part; the multi-stage filtering assembly is assembled inside the housing and above the platform support using a printed circuit board.

[0022] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0023] 1. By incorporating heat-resistant components, this invention prevents the heat generated when the housing and copper busbar assembly cut magnetic lines of force from accumulating in the corner areas of the housing, thus preventing localized high temperatures and burning out internal components. Furthermore, by incorporating buffer components, it prevents damage to the capacitor core caused by friction between the capacitor core and the housing due to vehicle vibrations in a vehicle environment.

[0024] 2. By using a temperature sensor, the temperature of the capacitor core can be sensed in real time. When the temperature exceeds the safe temperature, an alarm can be issued to remind the user to reduce the power supply or disconnect the power supply to protect the capacitor core from damage due to overheating.

[0025] 3. Through the design of multiple sets of temperature sensing chip components, the real-time temperature of all capacitor cores can be sensed, avoiding the situation of missing the measurement of local high temperature caused by individual capacitor cores;

[0026] By designing a rectangular interconnect circuit, when the interconnect circuit between any two temperature sensing chip components is broken, the sensed temperature signal can still be transmitted to the temperature sensor through the rectangular circuit.

[0027] 4. The use of the positioning plate can lock the copper busbar assembly in place, preventing it from shifting due to vehicle bumps during installation and use; it also prevents short circuits caused by contact between the copper busbar assemblies.

[0028] 5. The multi-stage filtering assembly includes multiple electronic components such as magnetic rings and capacitors, which are assembled inside the housing and above the platform support via a printed circuit board (PCBA). This allows for highly integrated assembly of electronic components, reducing the size of the invention. At the same time, it also facilitates the cooperation between the various electronic components, resulting in good filtering performance.

[0029] In summary, the present invention, through the setting of the heat-resistant buffer component, can avoid damage to the present invention due to high temperature or impact; through the setting of the temperature sensor, the temperature of each capacitor core inside the housing can be sensed in real time; through the setting of the positioning plate, the copper busbar component can be positioned and protected to ensure the normal operation of the circuit; by assembling the multi-stage filtering component in the present invention through the printed circuit board, the integration can be improved and the filtering effect can be improved. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a multi-stage filtering and bus capacitor integrated module proposed in this invention. Figure 1 ;

[0031] Figure 2 This is a circuit diagram of a multi-stage filtering and bus capacitor integrated module proposed in this invention;

[0032] Figure 3 This is a schematic diagram of the structure of a multi-stage filtering and bus capacitor integrated module proposed in this invention after removing the capacitor core and part of the copper busbar assembly;

[0033] Figure 4 This is a schematic diagram of the structure of a heat-resistant buffer component in a multi-stage filtering and bus capacitor integrated module proposed in this invention;

[0034] Figure 5 This is a schematic diagram of the structure of a multi-stage filtering and bus capacitor integrated module proposed in this invention. Figure 2 ;

[0035] Figure 6 This is a schematic diagram of the structure of a multi-stage filtering and bus capacitor integrated module after removing the magnetic ring, as proposed in this invention.

[0036] Figure 7 This is a schematic diagram of the partition structure in a multi-stage filter and bus capacitor integrated module proposed in this invention;

[0037] Figure 8 This is a right view of a multi-stage filtering and bus capacitor integrated module proposed in this invention;

[0038] Figure 9 This is an enlarged schematic diagram of a local structure at point A in this invention 8.

[0039] In the diagram: 1. Housing; 2. Platform support; 3. Copper busbar assembly; 4. Capacitor core; 5. Heat-resistant buffer assembly; 6. Heat-resistant component; 7. Buffer component; 8. Temperature sensor; 9. Connector assembly; 10. Partition plate; 11. Positioning plate; 12. X1 capacitor bank; 13. Y2 capacitor bank; 14. Magnetic ring; 15. Reserved magnetic ring mounting part. Detailed Implementation

[0040] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0041] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] Example 1:

[0043] Reference Figures 1-4 A multi-stage filtering and busbar capacitor integrated module includes a housing 1 and a platform support 2. The platform support 2 is connected to the outside of the housing 1. A copper busbar assembly 3 and a multi-stage filtering assembly are installed inside the housing 1 and on the upper part of the platform support 2. The multi-stage filtering assembly is in contact with the copper busbar assembly 3 and has a capacitor core 4. A heat-resistant buffer assembly 5 is provided in the corner area inside the housing 1. The heat-resistant buffer assembly 5 includes a heat-resistant element 6 and a buffer element 7, which are integrated together. The heat-resistant element 6 can prevent the heat generated by the housing 1 and the copper busbar assembly 3 when they make a small movement to cut magnetic lines of force from accumulating in the corner area inside the housing 1 and causing local high temperature.

[0044] The buffer 7 can prevent the capacitor core 4 from being damaged by micro-vibration or close-range friction between the capacitor core 4 and the shell 1 due to vehicle vibration when the capacitor is installed and used.

[0045] The buffer 7 is ring-shaped and made of soft, heat-resistant insulating material;

[0046] The heat-resistant polymer component 6 is square and is made of heat-resistant and magnetically insulated material.

[0047] Among them, the heat-resistant polymer component 6 can also be L-shaped or corrugated, and the overall shape of the heat-resistant polymer component 6 matches the corner area of ​​the shell 1;

[0048] Reference Figure 2 In use, the present invention is connected to a DC power supply through ports T1 and T2, and connected to the subsequent electronic system through ports T3 and T4. The DC power input is filtered by capacitor bank X1 12 and capacitor bank Y2 13 to provide a cleaner DC power supply to the subsequent circuit.

[0049] When the current input from the power supply passes through this invention, the heat-resistant agglomerating component 6 can prevent the heat generated by the housing 1 and the copper busbar assembly 3 during the cutting of magnetic lines of force from accumulating in the corner area of ​​the housing 1 and causing local high temperature, which could burn out the internal components. The buffer component 7 can prevent the capacitor core 4 from being damaged due to friction between the capacitor core 4 and the housing 1 caused by vehicle vibration in a vehicle environment.

[0050] Example 2:

[0051] Reference Figure 5 Based on Example 1, the difference is that a temperature sensor 8 is installed on the housing 1;

[0052] Temperature sensor 8 extends to the outside of housing 1 through multiple bends, and a connector 9 for connecting to the vehicle's central control system is provided at the end of temperature sensor 8.

[0053] By using the temperature sensor 8, the temperature of the capacitor core 4 can be sensed in real time and the temperature signal can be transmitted to the vehicle's main control system. When the temperature exceeds the safe temperature, an alarm can be issued to remind the user.

[0054] Temperature sensor 8 can sometimes be an NTC sensor.

[0055] Example 3:

[0056] Temperature sensor 8 has a temperature sensing chip assembly, which is installed at the bottom of capacitor core 4. Each capacitor core 4 is equipped with a set of temperature sensing chip assemblies. The temperature sensing chip assemblies are interconnected through a grouping circuit and transmitted to temperature sensor 8 through a wire harness.

[0057] Since the present invention contains multiple capacitor cores 4, each capacitor core 4 has a different surface temperature due to different working states. By installing a temperature sensing chip assembly at the bottom of each capacitor core 4, the real-time temperature of each capacitor core 4 can be sensed, avoiding the situation of missing the local high temperature generated by individual capacitor cores 4.

[0058] The temperature sensing chip assembly and the interconnection circuit are arranged in a rectangular shape. When the interconnection circuit between any two temperature sensing chip assemblies is broken, the sensed temperature signal can still be transmitted to the temperature sensor 8 through the rectangular circuit.

[0059] Here, the temperature sensing chip assembly and the interconnecting circuit can also be arranged in a star or triangle configuration, depending on the number and arrangement of the capacitor cores 4. This is to ensure that when the interconnecting circuit between any two temperature sensing chip assemblies is disconnected, the sensed temperature signal can still be transmitted to the temperature sensor 8 through the interconnecting circuit.

[0060] Example 4:

[0061] Reference Figure 6 and Figure 7 Based on Embodiment 1, the difference is that: a partition 10 is provided on the side of the housing 1 that contacts the platform support 2, and a square through groove is provided on the partition 10, in which the copper busbar assembly 3 can be installed;

[0062] Since the copper busbar assembly 3 is installed in the through groove on the partition plate 10, the assembly of the present invention is more convenient by setting the partition plate 10. At the same time, the copper busbar assembly 3 installed in the through hole will not shift or rub against each other due to vehicle vibration, thus shortening the service life of the copper busbar assembly 3. The partition plate 10 can also be made of a more insulating and heat-resistant material to prevent the high temperature generated by the copper busbar assembly 3 from deforming the partition plate 10 and affecting the overall function of the present invention.

[0063] Example 5:

[0064] Reference Figure 8 and Figure 9 Based on Example 4, the difference is that the copper busbar assemblies 3 are arranged in an alternating manner with gaps, and the densely packed areas of the copper busbar assemblies 3 are provided with positioning plates 11.

[0065] The positioning plate 11 serves to hold the copper busbar assembly 3 in place, preventing it from shifting due to vehicle bumps during installation. Simultaneously, since the copper busbar assembly 3 becomes magnetic when energized, it may attract each other due to differing magnetic properties, potentially causing a short circuit. The positioning plate 11 prevents this, thus preventing short circuits. Furthermore, the copper busbar assembly 3 may repel each other due to similar magnetic properties, causing misalignment and friction. This staggered arrangement effectively avoids misalignment and friction, increasing the lifespan of the copper busbar assembly 3.

[0066] Example 6:

[0067] Reference Figure 2 , Figure 5 and Figure 6 Based on Embodiment 1, the difference is that the multi-stage filter assembly also includes an X1 capacitor bank 12, a Y2 capacitor bank 13, a magnetic ring 14, and a reserved magnetic ring mounting part 15. The multi-stage filter assembly is assembled inside the housing 1 and above the platform support 2 using a printed circuit board.

[0068] X1 capacitor bank 12 includes four 1-4.7nF and three 0.5-3.3nF capacitors for suppressing differential mode interference signals. Y2 capacitor bank 13 includes four 0.5-3.3nF, two 1-4.7nF and two 100-470nF capacitors for suppressing common mode interference signals.

[0069] The use of 0.5-3.3nF and 1-4.7nF capacitors in capacitor bank X1 (12) and capacitor bank Y2 (13) effectively filters high-frequency noise; while the 100-470nF capacitors in capacitor bank Y2 (13) provide good filtering for low-frequency noise. The combination of large and small capacitance capacitors can cover a wide range of power supply interference, improve power quality, ensure stable operation of downstream circuits, and extend the service life of equipment.

[0070] The combination of capacitors and magnetic ring 14 forms a multi-stage filter. First, it undergoes preliminary filtering at the front end, and then further fine processing at the back end to gradually attenuate noise in different frequency bands, making the filtering more thorough.

[0071] The design of the reserved magnetic ring mounting part 15 allows for the addition of an adaptive magnetic ring to optimize filtering according to the actual interference situation. It also facilitates the adjustment of parameters as needed to adapt to different power purification requirements.

[0072] The multi-stage filtering assembly includes multiple electronic components such as a magnetic ring 14 and a capacitor. It is assembled inside the housing 1 and above the platform support 2 via a printed circuit board (PCBA). This allows for highly integrated assembly of electronic components, reducing the size of the invention. At the same time, it also facilitates the cooperation between the various electronic components, resulting in a good filtering effect.

[0073] The advantages and benefits of the above design are: 1. Extremely optimized high-frequency performance and parasitic parameter control: The filter PCBA is directly integrated inside the capacitor, achieving the shortest interconnection path; the electrical connection between components is achieved through precision PCB copper foil, with extremely short distances, thereby minimizing lead inductance and loop resistance;

[0074] This allows the filter circuit to maintain its theoretical high-frequency filtering characteristics, and its ability to suppress high-frequency switching noise and radio frequency interference (RFI) far exceeds that of discrete solutions. It is particularly suitable for high-speed digital circuits, switching power supplies and other applications with high di / dt and high dv / dt.

[0075] 2. Achieve cleaner and more precise filtering: PCBA allows for flexible design of multi-stage (e.g., π-type, T-type) filter circuits. Combined with capacitors of different materials (e.g., X2Y capacitors suppress differential-mode noise, film capacitors provide low ESR / ESL decoupling) and ferrite beads / inductors, precise attenuation of interference in specific frequency bands can be achieved. The metal casing of the film capacitor itself acts as a natural shielding layer. Encapsulating sensitive filter circuits within this casing effectively prevents interference from external electromagnetic fields while also suppressing the outward radiation of electromagnetic fields generated by the filter circuit itself, thus improving the overall EMC performance of the system.

[0076] 3. Extremely high space utilization and miniaturization: Integrating multiple filtering components that were originally scattered across the motherboard into a compact module significantly saves valuable space on the main PCB board. This is crucial for modern electronic devices that pursue high power density and miniaturization (such as servers, communication equipment, and electric control systems for new energy vehicles).

[0077] 4. Modularization and Simplified System Design: The "plug-and-play" solution transforms the integrated module into a standard, performance-known black box for system design engineers. They no longer need to spend a lot of time on complex EMC simulations and filter circuit layout designs; they only need to reserve an interface position on the motherboard. The motherboard layout becomes simpler, reducing the challenges of high-frequency layout and routing, and lowering the complexity and design risk of the motherboard.

[0078] 5. Significantly improved mechanical reliability and stability: The PCBA is well mechanically protected inside the capacitor casing, avoiding solder joint cracking or component damage caused by vibration or impact during transportation, installation or use; the internal connection is stable and unaffected by the external environment (such as oxidation or pollution).

[0079] 6. Simplified production assembly process and consistency assurance: Reduced SMT placement steps simplify the motherboard's SMT placement process, reduce the number of components, improve placement efficiency, and potentially increase first-pass yield (FPY); ensure performance consistency, as the filter module as a whole can undergo 100% testing and screening before leaving the factory to ensure that its filtering performance parameters (such as insertion loss) meet standards; this avoids batch performance inconsistencies caused by component tolerances, soldering process differences, and other factors in discrete solutions; reduce the risk of assembly errors, as the number and types of components on the motherboard are reduced, lowering the risk of assembly errors such as incorrect components, missing solder joints, and reverse soldering.

[0080] Furthermore, this highly integrated solution is particularly suitable for the following fields with stringent EMC and space requirements: new energy vehicles, electric drive inverters, on-board chargers (OBC), DC-DC converters; industrial drives and automation, frequency converters, servo drives; renewable energy, photovoltaic inverters, wind power converters; high-end communication equipment, base station power supplies, server power supplies.

[0081] In summary, integrating multi-stage filter components (PCBAs) into thin-film capacitors represents a shift from a "component-centric" to a "systems-centric" approach. By sacrificing some maintainability, it achieves comprehensive improvements in electrical performance, space efficiency, production efficiency, and reliability, representing a significant trend in power electronics technology towards high performance, high density, and high reliability.

[0082] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A multi-stage filter and bus capacitor integrated module, comprising a shell (1) and a platform support (2) connected to the outside of the shell (1), a copper bar assembly (3) and a multi-stage filter assembly being arranged in the inside of the shell (1) and on the upper part of the platform support (2), the multi-stage filter assembly being in contact with the copper bar assembly (3), the multi-stage filter assembly having capacitor cores (4), characterized in that: a heat accumulation prevention and buffering assembly (5) is arranged at the corner area in the inside of the shell (1), the heat accumulation prevention and buffering assembly (5) comprises a heat accumulation prevention element (6) and a buffering element (7), and the heat accumulation prevention element (6) and the buffering element (7) are connected as a whole; the heat accumulation prevention element can be L-shaped or zigzag-shaped, and the overall shape of the heat accumulation prevention element matches the corner area of the shell; the heat accumulation prevention element (6) can prevent the heat generated by the shell (1) and the copper bar assembly (3) when cutting the magnetic force lines from gathering and causing local high temperature at the corner area in the inside of the shell (1); the buffering element (7) can prevent the capacitor cores (4) from being damaged due to the friction between the capacitor cores (4) and the shell (1) caused by the shaking of the vehicle body in the vehicle environment; a partition (10) is arranged on the side of the shell (1) in contact with the platform support (2), the partition (10) is provided with a square through slot, and the copper bar assembly (3) can be arranged in the through slot. the buffering element (7) is annular, and the buffering element (7) is made of soft heat-resistant insulating material.

2. The multi-stage filter and bus capacitor integrated module of claim 1, wherein, the heat accumulation prevention element (6) is square, and the heat accumulation prevention element (6) is made of heat-resistant non-magnetic material.

3. The multi-stage filter and bus capacitor integrated module of claim 2, wherein, a temperature sensor (8) is arranged on the shell (1).

4. The multi-stage filter and bus capacitor integrated module of claim 1, wherein, the temperature sensor (8) has temperature sensing chip assemblies, the temperature sensing chip assemblies are arranged at the bottom of the capacitor cores (4), each capacitor core (4) is correspondingly provided with a group of temperature sensing chip assemblies, different temperature sensing chip assemblies are connected to each other through connecting circuits, and the sensed signals are transmitted to the temperature sensor (8) through a connecting wire harness.

5. The multi-stage filter and bus capacitor integrated module of claim 4, wherein, the temperature sensing chip assemblies and the connecting circuits are arranged in a rectangular shape, and when the connecting circuit between any two temperature sensing chip assemblies is disconnected, the sensed signals can still be transmitted to the temperature sensor (8) through the rectangular circuit.

6. The multi-stage filter and bus capacitor integrated module of claim 5, wherein, the temperature sensor (8) has temperature sensing chip assemblies, external connecting wires and a plug connector (9), one end of the external connecting wire is connected to the temperature sensing chip assembly, and the other end of the external connecting wire is connected to the plug connector (9); 7. The multi-stage filter and bus capacitor integrated module of claim 6, wherein, the temperature sensor (8) extends to the outside of the shell (1) through multiple bends, and the temperature sensor (8) is provided with a plug connector (9) connected to the vehicle master control system at the end. the copper bar assembly (3) is arranged in a staggered manner with gaps, and a clamping plate (11) is arranged at the dense area of the copper bar assembly (3).

8. The multi-stage filter and bus capacitor integrated module of claim 1, wherein, the multi-stage filter assembly further comprises X1 capacitor groups (12), Y2 capacitor groups (13), magnetic rings (14) and reserved magnetic ring mounting portions (15); the multi-stage filter assembly is assembled in the inside of the shell (1) and above the platform support (2) by using a printed circuit board.

9. The multi-stage filter and bus capacitor integrated module of claim 1, wherein, ​

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