IPM module heat dissipation structure, air conditioner and control method

Abstract

The invention provides an IPM module heat dissipation structure, an air conditioner and a control method, the IPM module heat dissipation structure comprises a cover plate, and an IPM plate is arranged on one side of the cover plate; the shell is used for storing a heat exchange medium, and an opening of the shell faces the cover plate; and the plurality of heat dissipation pieces are arranged in the shell at intervals, one end of each heat dissipation piece extends out of the shell, and the end, extending out of the shell, of each heat dissipation piece is coupled with the other side of the cover plate. According to the invention, the technical problem that the IPM module in the prior art has no effective heat dissipation structure and influences the stable operation of the air conditioning unit in the machine room can be solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of air conditioners, and particularly relates to an IPM module heat dissipation structure, an air conditioner and a control method. BACKGROUND

[0002] PUE is the abbreviation of Power Usage Effectiveness, is an index for evaluating the energy efficiency of a data center, and is the ratio of all energy consumed by the data center to the energy consumed by the IT load. PUE = total energy consumption of the data center / energy consumption of the IT equipment, wherein the total energy consumption of the data center includes the energy consumption of the IT equipment and the energy consumption of the refrigeration, power distribution and other systems, and the value is greater than 1. The closer to 1, the less non-IT equipment energy consumption, that is, the better the energy efficiency level.

[0003] At present, the number of data centers is rapidly increasing, and the cooling technology of computer room air conditioners is continuously improving. Both the supply side and the demand side are pursuing lower PUE. Low PUE means that more of the total energy consumed by the data center during operation is directly used for IT equipment, rather than wasted on cooling, power distribution and other auxiliary facilities. This not only helps to reduce energy consumption, but also reduces carbon emissions, in line with the requirements of sustainable development. Pursuing low PUE requires the refrigeration equipment to better utilize the cold or heat generated by itself, thereby reducing the power consumption of the data center, thereby meeting the user's demand for low PUE.

[0004] In the existing computer room air conditioner, the IPM module does not have an effective heat dissipation structure, which leads to the problem that the temperature of the IPM module is too high during high-power operation, thereby affecting the stable operation of the computer room air conditioning unit.

[0005] Therefore, the IPM module heat dissipation structure, the air conditioner and the control method are researched and designed to solve the technical problems that the IPM module in the prior art does not have an effective heat dissipation structure and affects the stable operation of the computer room air conditioning unit. SUMMARY

[0006] Therefore, the IPM module heat dissipation structure, the air conditioner and the control method are provided to solve the technical problems that the IPM module in the prior art does not have an effective heat dissipation structure and affects the stable operation of the computer room air conditioning unit.

[0007] In order to solve the above problems, the IPM module heat dissipation structure comprises:

[0008] A cover plate, one side of the cover plate is provided with an IPM plate;

[0009] A shell for storing a heat exchange medium, the opening of the shell faces the cover plate;

[0010] A plurality of heat dissipation members are arranged in the casing at intervals, and one end of each of the heat dissipation members extends out of the casing and is coupled to the other side of the cover plate.

[0011] In some embodiments, the heat dissipation member comprises a fixing member, and a heat dissipation plate is arranged on the fixing member, one end of the heat dissipation plate extends out of the casing, the fixing member is located at the end of the heat dissipation plate extending out of the casing, and a recess is arranged on the side of the fixing member facing the cover plate, and a protrusion is arranged on the other side of the cover plate.

[0012] In some embodiments, the protrusion has a T-shaped structure, the recess has a structure of ┻, and the recess penetrates the fixing member along the extension direction of the fixing member.

[0013] In some embodiments, a plurality of fins are arranged on both sides of the heat dissipation plate at intervals along the extension direction of the heat dissipation plate.

[0014] In some embodiments, the fin has a first position and a second position, when the fin is in the first position, the fin is in close contact with the heat dissipation plate, and when the fin is in the second position, the fin has an included angle with the heat dissipation plate.

[0015] In some embodiments, a plurality of mounting grooves are arranged on the heat dissipation plate, and the mounting grooves are arranged one-to-one with the fins, when the fin is in the first position, the fin is located in the mounting groove, and the fin is in close contact with the groove bottom of the mounting groove.

[0016] In some embodiments, when the temperature of the IPM plate is not greater than a preset temperature, the fin is in the first position, and when the temperature of the IPM plate is greater than the preset temperature, the fin is in the second position.

[0017] The application also provides an air conditioner comprising the IPM module heat dissipation structure.

[0018] In some embodiments, the air conditioner further comprises a circulation system formed by a compressor, a second heat exchanger, a throttling member and a first heat exchanger connected in sequence, and a water pan is arranged below the first heat exchanger, and a water outlet of the water pan is in communication with the casing.

[0019] In some embodiments, the air conditioner further comprises a liquid storage member, the water outlet of the water pan is in communication with the liquid storage member, and the liquid storage member is in communication with the casing through a first pipeline; a first valve body is arranged on the first pipeline, and / or a pump body is arranged on the first pipeline.

[0020] In some embodiments, the liquid storage device is connected to the water inlet via a second pipe. The water inlet is located outside the air conditioner and is connected to an external water source. The second pipe extends from the air outlet of the air conditioner into the air conditioner. A third pipe is connected to the second pipe, and a second valve body is installed on the third pipe. A first liquid level sensor is installed inside the liquid storage device.

[0021] In some embodiments, the housing is connected to an electrode humidifier, the medium after heat exchange in the housing can flow into the electrode humidifier, the electrode humidifier is provided with a second liquid level sensor, and the outlet of the electrode humidifier is provided with a third valve body.

[0022] The present invention also provides a control method for the above-mentioned air conditioner, which is implemented in the following manner:

[0023] The detection step involves detecting the liquid level H1 inside the storage device.

[0024] The judgment step is to determine the relationship between H1 and the first preset liquid level H2 and the second preset liquid level H3, where H2 < H3;

[0025] The control steps are as follows: when H1≤H2, the water inlet is opened; when H2

[0026] The IPM module heat dissipation structure, air conditioner, and control method provided by this invention have the following beneficial effects:

[0027] The heat exchange medium is stored in the casing. The temperature of the IPM board is transferred to the heat sink through the cover plate. The heat sink exchanges heat with the heat exchange medium in the casing, thereby regulating the temperature of the IPM board. This prevents the IPM board from overheating during high-power operation, which could affect the stable operation of the computer room air conditioning unit and extend the service life of the IPM board. Attached Figure Description

[0028] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the heat dissipation structure of the IPM module of the present invention;

[0030] Figure 2 This is a schematic diagram of the heat sink component in the IPM module heat dissipation structure of the present invention. Figure One ;​

[0031] Figure 3 This is a schematic diagram of the heat sink component in the IPM module heat dissipation structure of the present invention. Figure Two ;

[0032] Figure 4 This is a schematic diagram of the structure of an air conditioner according to another embodiment of the present invention.

[0033] The attached figures are labeled as follows:

[0034] 1. IPM plate; 2. Cover plate; 3. Housing; 4. Heat sink; 5. Fin; 6. Heat sink plate; 7. Fixing component; 8. Protrusion; 9. First valve body; 10. Liquid storage container; 11. First liquid level sensor; 12. Second valve body; 13. Electrode humidifier; 14. First heat exchanger; 15. Water inlet; 16. Third valve body; 17. Second liquid level sensor; 18. Compressor; 19. Second heat exchanger; 20. Throttling device; 21. Pump body. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0037] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0038] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0039] See also Figures 1-4 As shown, according to an embodiment of the present invention, an IPM module heat dissipation structure is provided, comprising:

[0040] Cover plate 2, with an IPM plate 1 provided on one side of the cover plate 2;

[0041] The housing 3 is used to store the heat exchange medium, and the opening of the housing 3 faces the cover plate 2;

[0042] Multiple heat sinks 4 are arranged at intervals inside the housing 3. One end of each heat sink 4 extends out of the housing 3 and is coupled to the other side of the cover plate 2.

[0043] In this technical solution, the heat exchange medium is stored in the shell 3. The temperature of the IPM plate 1 is transferred to the heat sink 4 through the cover plate 2. The heat sink 4 exchanges heat with the heat exchange medium in the shell 3, thereby regulating the temperature of the IPM plate 1 and preventing the IPM plate 1 from getting too hot during high-power operation, which would affect the stable operation of the computer room air conditioning unit and improve the service life of the IPM plate 1.

[0044] In some embodiments, the heat sink 4 includes a fixing member 7, on which a heat sink 6 is provided. One end of the heat sink 6 extends out of the housing 3. The fixing member 7 is located at the end of the heat sink 6 that extends out of the housing 3. The fixing member 7 has a groove on one side facing the cover plate 2, and a protrusion on the other side of the cover plate 2.

[0045] In this technical solution, the heat sink 6 is mounted on the cover plate 2 by means of the cooperation of the protrusion and the groove, thereby transferring the heat of the IPM plate 1.

[0046] In some embodiments, the protrusion is T-shaped and the groove is U-shaped, extending through the fixing member 7 along its extension direction.

[0047] In this technical solution, see [reference] Figures 1 to 3 As shown, along the extending direction of the fixing member 7, the groove penetrates the fixing member 7. During installation, the protrusion is slid into the groove along the extending direction of the groove. The protrusion has a T-shaped structure, and the groove has a ┻ structure, so that the protrusion and the groove form a snap-fit, which facilitates the installation between the cover plate 2 and the fixing member 7.

[0048] In some embodiments, multiple ribs 5 are provided on both sides of the heat sink 6, and the multiple ribs 5 are arranged at intervals on the heat sink 6 along the extending direction of the heat sink 6.

[0049] In this technical solution, by setting multiple fins 5 on the heat sink 6, the heat exchange area between the heat sink 6 and the heat exchange medium is increased, thereby improving the heat exchange efficiency.

[0050] In some implementations, fins 5 can be provided on the heat sink 6 for the parts with high temperatures, while fins 5 can be omitted on the heat sink 6 for the parts with low temperatures, thereby reasonably dissipating heat from the IPM module and reducing the cost of the heat dissipation structure of the IPM module.

[0051] In some embodiments, the rib 5 has a first position and a second position. When the rib 5 is in the first position, the rib 5 is in contact with the heat sink 6. When the rib 5 is in the second position, there is an angle between the rib 5 and the heat sink 6.

[0052] In this technical solution, the heat exchange efficiency of the heat sink 4 can be adjusted according to the real-time temperature of the IPM module through the first position and the second position. When the temperature is high, the fin 5 is located in the second position, and when the temperature is low, the fin 5 is located in the first position.

[0053] In some embodiments, the heat sink 6 is provided with a plurality of mounting slots, and the mounting slots are arranged in a one-to-one correspondence with the ribs 5. When the ribs 5 are in the first position, the ribs 5 are located in the mounting slots, and the ribs 5 are in contact with the bottom of the mounting slots.

[0054] In this technical solution, the mounting groove facilitates the storage of the rib 5. One end of the rib 5 can be connected to the side wall of the mounting groove via a rotating shaft. Specifically, a rotating shaft can be set between the two side walls of the mounting groove, with both ends of the rotating shaft rotatably mounted on the side wall of the mounting groove. The rib 5 is connected to the rotating shaft, and a motor can be set at one end of the rotating shaft. The motor drives the rotating shaft to rotate, thereby moving the rib 5 between the first position and the second position.

[0055] In some embodiments, when the temperature of the IPM plate is not greater than a preset temperature, the rib 5 is located in the first position, and when the temperature of the IPM plate is greater than the preset temperature, the rib 5 is located in the second position.

[0056] In this technical solution, the preferred preset temperature is 45 degrees Celsius. Of course, the preset temperature can be adjusted according to actual needs. When the temperature of the IPM board is not higher than the preset temperature, that is, when the temperature of the IPM board is at normal temperature, the fin 5 is located in the first position, that is, the fin 5 is in contact with the heat sink 6. At this time, a high heat dissipation efficiency is not required, and the heat exchange of the IPM module is carried out through the heat sink 6. When the temperature of the IPM board is higher than the preset temperature, that is, when the temperature of the IPM module is too high, the fin 5 is located in the second position, and the fin 5 and the heat sink 6 form an angle. The heat exchange area of ​​the heat sink 4 increases, the heat exchange efficiency is improved, and the IPM module is cooled down quickly.

[0057] The present invention also provides an air conditioner including the aforementioned IPM module heat dissipation structure.

[0058] In some embodiments, the air conditioner further includes a circulation system formed by sequentially connecting a compressor 18, a second heat exchanger 19, a throttling device 20, and a first heat exchanger 14, wherein a water receiving tray is provided below the first heat exchanger 14, and the drain outlet of the water receiving tray is connected to the housing 3.

[0059] In this technical solution, the first heat exchanger 14 is an evaporator and the second heat exchanger 19 is a condenser. By transporting the condensate on the evaporator to the casing 3 through the water receiving pan, heat exchange is performed on the IPM module, thereby improving the energy utilization rate of the air conditioner.

[0060] In some embodiments, the air conditioner further includes a liquid storage device 10, the drain outlet of the water receiving tray is connected to the liquid storage device 10, and the liquid storage device 10 is connected to the housing 3 through a first pipeline; a first valve body 9 is provided on the first pipeline, and / or a pump body 21 is provided on the first pipeline.

[0061] In this technical solution, depending on the height between the housing 3 and the liquid storage component 10, when the housing 3 is not higher than the liquid storage component 10, the pump body 21 provides driving force for the condensate. When the housing 3 is lower than the liquid storage component 10, there is no need to install the pump body 21, and the condensate flows into the housing 3 by its own weight.

[0062] In some embodiments, the liquid storage device 10 is connected to the water inlet 15 via a second pipe. The water inlet 15 is located outside the air conditioner and is connected to an external water source. The second pipe extends from the air outlet of the air conditioner into the air conditioner. A third pipe is connected to the second pipe, and a second valve body 12 is provided on the third pipe. A first liquid level sensor 11 is provided inside the liquid storage device 10.

[0063] In this technical solution, the height of the liquid level in the liquid storage container 10 is detected by the first liquid level sensor 11. When the liquid level is low, there is less condensate. In order to meet the heat exchange of the IPM module, external water is injected into the liquid storage container 10 through the water inlet 15 to provide heat exchange medium in the housing 3. When the liquid level in the liquid storage container 10 is high, the liquid level in the liquid storage container 10 is higher. In order to prevent the water in the liquid storage container 10 from overflowing, the water in the liquid storage container 10 is discharged through the second valve body 12. The second pipeline extends from the air outlet of the air conditioner into the air conditioner, which can also reduce the temperature of the heat exchange medium and improve the heat exchange efficiency of the IPM heat dissipation structure. During operation, the air conditioner in the computer room produces condensate. This condensate usually collects in a drip tray and is then drained to the outside through a drain pipe. This results in a waste of some of the cooling capacity generated by the air conditioner and a waste of condensate resources. At the same time, the IPM board generates heat when the air conditioner is running. In order to maintain the IPM board at its normal operating temperature, a refrigerant bypass is usually used to cool the IPM board. This mode will reduce the cooling capacity generated by the unit and reduce the unit's energy efficiency.

[0064] The air conditioner of the present invention can use the condensate generated during the operation of the computer room air conditioner to dissipate heat on the IPM module of the unit, thereby improving energy utilization. When the cooling capacity of the condensate is insufficient, an external water source can be connected through the water inlet to dissipate heat on the IPM module. The external water source is cooled by the air supply of the air conditioner and then exchanges heat with the IPM module to reduce the temperature of the IPM module.

[0065] In some embodiments, the housing 3 is connected to an electrode humidifier 13, and the medium after heat exchange in the housing 3 can flow into the electrode humidifier 13. A second liquid level sensor 17 is provided in the electrode humidifier 13, and a third valve body 16 is provided at the outlet of the electrode humidifier 13.

[0066] In this technical solution, the water after heat exchange inside the casing 3 is transported to the electrode humidifier 13, which reduces the heat required for the electrode humidifier to operate and further improves the energy utilization rate of the air conditioner.

[0067] It should be noted that the valve body in the air conditioner of this invention can be a solenoid valve.

[0068] The air conditioner of the present invention can use the heat generated by the IPM module during operation and the condensate generated during the unit operation to provide a water source for the electrode humidifier, thereby reducing the electricity and water resources required for the electrode humidifier to heat water.

[0069] The air conditioner of this invention uses the cooling capacity of condensate water to dissipate heat from the unit's IPM module, and simultaneously utilizes the heat generated during the operation of the IPM module to heat the water source required by the electrode humidifier. This invention employs... Figure 3 The enclosed housing with internal heat dissipation fins, as shown, serves as the heat dissipation structure for the IPM module. The fins increase heat exchange efficiency, and the enclosed housing prevents the IPM module from directly contacting the condensate, thus avoiding damage. During unit operation, condensate, once generated, flows into the condensate storage tank under gravity. If the storage tank is higher than the IPM heat dissipation module, and the heat dissipation module is higher than the electrode humidifier, the condensate can pass through the IPM heat dissipation module under gravity to complete heat exchange before entering the electrode humidifier. If the IPM module is higher than the storage tank, or the electrode humidifier is higher than the IPM module, a circulating water pump needs to be added to the system to allow the condensate to circulate in the pipeline.

[0070] The present invention also provides a control method for the above-mentioned air conditioner, which is implemented in the following manner:

[0071] The detection step involves detecting the liquid level H1 within the liquid storage device 10.

[0072] The judgment step is to determine the relationship between H1 and the first preset liquid level H2 and the second preset liquid level H3, where H2 < H3;

[0073] The control steps are as follows: when H1≤H2, the water inlet 15 is opened; when H2

[0074] ​In the air conditioner of this invention, when the condensate drain pan is higher than the IPM heat dissipation module and the IPM heat dissipation module is higher than the electrode humidifier, the condensate circulates in the pipeline by gravity. After the condensate enters the IPM heat dissipation module and exchanges heat with the heat dissipation fins, the heated condensate enters the electrode humidifier, effectively utilizing the cooling capacity of the condensate, the heat generated by the IPM module, and the condensate resource. When the condensate drain pan is lower than the IPM heat dissipation module, a circulating water pump needs to be added to the pipeline system. The condensate circulates in the pipeline using the power provided by the circulating water pump. Driven by the pump, the condensate enters the IPM heat dissipation module and exchanges heat with the heat dissipation fins, then the heated condensate enters the electrode humidifier, effectively utilizing the cooling capacity of the condensate, the heat generated by the IPM module, and the condensate resource. When the cooling capacity of the condensate cannot meet the system requirements, an external water source can be connected to dissipate heat from the IPM module. The external water source pipeline flows through the air conditioning air supply channel and cools the IPM module after cooling.

[0075] The control method of the air conditioner of the present invention is as follows: when the condensate drip tray is higher than the IPM heat dissipation module and the IPM heat dissipation module is higher than the electrode humidifier;

[0076] In a system where the condensate drain pan is higher than the IPM heat dissipation module, and the IPM heat dissipation module is higher than the electrode humidifier, the condensate drain line extends from the bottom of the condensate drain pan into the storage tank, then flows through a solenoid valve into the IPM heat dissipation module. There, the condensate comes into contact with the heat dissipation fins of the IPM heat dissipation module for heat exchange. After heat exchange, the condensate flows through a pipe into the electrode humidifier. When the IPM module needs cooling, the solenoid valve is opened first. Under the influence of gravity, condensate flows through the pipes into the IPM heat dissipation module. The low-temperature condensate comes into contact with the high-temperature heat dissipation fins for heat exchange, heating the condensate and lowering the IPM module temperature. The heated condensate then enters the electrode humidifier. When the level gauge in the electrode humidifier detects that the water level is too high, the drain valve is opened, allowing water to drain out through the drain pipe. When too much condensate is produced, the level gauge in the storage tank detects that the water level is too high, and the drain valve is opened, allowing water to drain out through the drain pipe. If the level gauge in the storage tank detects that the water level is too low and cannot meet the heat dissipation requirements of the IPM module, the drain valve is closed, and an external water source is connected through the water inlet. The external water source, after passing through the air supply channel and exchanging heat with the low-temperature air, increases the circulating water volume in the system, enabling the IPM module to cool down to its normal operating temperature.

[0077] When the condensate drain pan is lower than the IPM heat dissipation module

[0078] In systems where the condensate drain pan is lower than the IPM cooling module, the condensate pump cannot rely on gravity; the piping should extend from the bottom of the condensate reservoir to prevent air from being drawn into the pump. When the IPM module needs cooling, first open the solenoid valve. Then, the circulating water pump is turned on. Driven by the pump, the condensate enters the IPM heat dissipation module through the pipes. The low-temperature condensate comes into contact with the high-temperature heat dissipation fins for heat exchange, and the condensate is heated, thus lowering the temperature of the IPM module. The heated condensate then enters the electrode humidifier. When the level gauge in the electrode humidifier detects that the water level is too high, the drain valve is opened, allowing the water to drain out through the drain pipe. When too much condensate is produced, the level gauge in the storage tank detects that the water level is too high, and drain valve A is opened, allowing the water to drain out through the drain pipe. If the level gauge in the storage tank detects that the water level is too low and cannot meet the heat dissipation requirements of the IPM module, the drain valve is closed, and an external water source is connected through the water inlet. The external water source exchanges heat with the low-temperature air through the air supply channel, increasing the circulating water volume in the system, so that the IPM module can be cooled down to its normal operating temperature.

[0079] Intelligent Power Module (IPM) employs Insulated Gate Bipolar Transistors (IGBTs) as its power switching devices. IPMs combine the advantages of IGBTs (High Current Density, Low Saturation Voltage, and High Voltage Tolerance) with those of MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), offering high input impedance, high switching frequency, and low drive power. IPMs integrate logic, control, detection, and protection circuits, making them user-friendly. They reduce system size and development time while significantly enhancing system reliability, aligning with the current trend in power device development—modularization, composite design, and power integrated circuits (PICs)—and leading to their increasingly widespread application in power electronics.

[0080] It will be readily understood by those skilled in the art that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0081] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the protection scope of the present invention.

Claims

1. A heat dissipation structure for an IPM module, characterized in that: include: Cover plate (2), one side of which is provided with IPM plate (1); A housing (3) for storing a heat exchange medium, the opening of the housing (3) facing the cover plate (2); Multiple heat sinks (4) are arranged at intervals inside the housing (3). One end of each heat sink (4) extends out of the housing (3), and the end of each heat sink (4) extending out of the housing (3) is coupled to the other side of the cover plate (2).

2. The IPM module heat dissipation structure according to claim 1, characterized in that: The heat dissipation component (4) includes a fixing component (7), on which a heat dissipation plate (6) is provided. One end of the heat dissipation plate (6) extends out of the housing (3). The fixing component (7) is located at the end of the heat dissipation plate (6) that extends out of the housing (3). The fixing component (7) has a groove on one side facing the cover plate (2), and a protrusion on the other side of the cover plate (2).

3. The IPM module heat dissipation structure according to claim 2, characterized in that: The protrusion has a T-shaped structure, and the groove has a ┻ structure. Along the extension direction of the fixing member (7), the groove penetrates the fixing member (7).

4. The IPM module heat dissipation structure according to claim 2, characterized in that: Multiple ribs (5) are provided on both sides of the heat sink (6). Along the extension direction of the heat sink (6), the multiple ribs (5) are arranged at intervals on the heat sink (6).

5. The IPM module heat dissipation structure according to claim 4, characterized in that: The rib (5) has a first position and a second position. When the rib (5) is in the first position, the rib (5) is in contact with the heat sink (6). When the rib (5) is in the second position, there is an angle between the rib (5) and the heat sink (6).

6. The IPM module heat dissipation structure according to claim 5, characterized in that: The heat sink (6) is provided with a plurality of mounting slots, and the mounting slots are arranged in a one-to-one correspondence with the ribs (5). When the ribs (5) are in the first position, the ribs (5) are located in the mounting slots, and the ribs (5) are in contact with the bottom of the mounting slots.

7. The IPM module heat dissipation structure according to claim 5, characterized in that: When the temperature of the IPM plate is not greater than the preset temperature, the rib (5) is located in the first position; when the temperature of the IPM plate is greater than the preset temperature, the rib (5) is located in the second position.

8. An air conditioner, characterized in that, The heat dissipation structure of the IPM module includes any one of claims 1 to 9.

9. The air conditioner according to claim 8, characterized in that: The air conditioner also includes a circulation system formed by a compressor (18), a second heat exchanger (19), a throttling device (20) and a first heat exchanger (14) connected in sequence. The first heat exchanger (14) has a water receiving tray below it, and the drain outlet of the water receiving tray is connected to the housing (3).

10. The air conditioner according to claim 9, characterized in that: The air conditioner also includes a liquid storage unit (10), the drain outlet of the water receiving tray is connected to the liquid storage unit (10), and the liquid storage unit (10) is connected to the housing (3) through a first pipeline; a first valve body (9) is provided on the first pipeline, and / or a pump body (21) is provided on the first pipeline.

11. The air conditioner according to claim 10, characterized in that: The liquid storage device (10) is connected to the water inlet (15) through a second pipeline. The water inlet (15) is located outside the air conditioner and is connected to an external water source. The second pipeline extends from the air outlet of the air conditioner into the air conditioner. A third pipeline is connected to the second pipeline. A second valve body (12) is provided on the third pipeline. A first liquid level sensor (11) is provided inside the liquid storage device (10).

12. The air conditioner according to claim 10, characterized in that: The housing (3) is connected to an electrode humidifier (13). The medium after heat exchange in the housing (3) can flow into the electrode humidifier (13). A second liquid level sensor (17) is provided in the electrode humidifier (13). A third valve body (16) is provided at the outlet of the electrode humidifier (13).

13. The control method for an air conditioner according to claim 11, characterized in that, The specific implementation shall be carried out in the following manner: The detection step involves detecting the liquid level H1 inside the liquid storage device (10); The judgment step is to determine the relationship between H1 and the first preset liquid level H2 and the second preset liquid level H3, where H2 < H3; The control steps are as follows: when H1≤H2, the water inlet (15) is opened; when H2<H1<H3, the water inlet (15) is closed; when H3≤H1, the water inlet (15) is closed and the second valve body (12) is opened.

Images