Liquid cooling radiator based on modularized turbulent flow columns

Abstract

The invention discloses a liquid cooling radiator based on modular turbulent flow columns and a temperature uniformity optimization method thereof, and belongs to the technical field of heat dissipation of power electronic equipment. The liquid cooling radiator comprises a substrate, a cover plate and at least one replaceable turbulent flow column module. By designing the turbulent flow column modules with different geometric parameters and modularly installing the turbulent flow column modules in the installing grooves of the cover plate, flexible configuration of the flow resistance and the heat exchange capacity of the radiator is achieved. The invention further provides a corresponding temperature uniformity optimization method, the temperature difference of the IGBT module is monitored, the turbulent flow column module is dynamically replaced according to a preset strategy, and therefore the temperature field is actively optimized. The liquid cooling radiator solves the problems that a traditional liquid cooling radiator cannot be adjusted according to working conditions and is poor in temperature uniformity, has the advantages of being reconfigurable, easy to maintain, high in heat dissipation efficiency and the like, and is particularly suitable for heat dissipation of a high-power wind power converter IGBT module.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of heat dissipation of power electronic devices, and particularly relates to a liquid cooling radiator for a high-power wind power converter IGBT module and an optimization method thereof. BACKGROUND

[0002] As a clean energy, the annual installed capacity of wind power is increasing year by year. As one of the core components, the reliability of the converter determines whether the wind turbine can work normally. According to research data, among the main components of the wind power converter, the failure rate of IGBT is the highest, accounting for as high as 33%, far exceeding other components. With the development of large-capacity wind turbines, the power devices in the converter are subjected to increasing voltage and current impact. The equipment generates a large amount of heat and continuously accumulates when working, resulting in a substantial increase in the temperature of the internal chips. The increase in temperature reduces the stability of the components and makes them prone to failure. Designing an effective heat dissipation device can make the IGBT module dissipate heat more evenly and improve the working efficiency of the wind turbine.

[0003] The traditional liquid cooling radiator has a center-symmetrical or left-right symmetrical overall structure. The water temperature of the serpentine flow channel radiator gradually increases along the liquid flow direction, while the heat exchange area and flow field remain basically unchanged, resulting in that the temperature of the IGBT module near the inlet is significantly lower than that near the outlet. Therefore, the traditional liquid cooling radiator is not suitable for the liquid cooling plate for dissipating heat of multiple IGBT modules.

[0004] The power of the IGBT module varies due to its own manufacturing and working conditions. There is a large difference in IGBT module loss between low wind speed operation and high wind speed operation. The traditional liquid cooling radiator cannot be adjusted according to the actual working conditions and heat load changes, lacks flexibility, and is difficult to ensure the best temperature uniformity and appropriate pumping power under all working conditions. SUMMARY

[0005] The application aims to overcome the shortcomings of the prior art and provide a modular and reconfigurable liquid cooling radiator and an optimization method thereof. By replacing different specifications of the spoiler column module, the flow resistance and heat exchange capacity of the radiator can be actively controlled, thereby significantly improving the temperature uniformity in the multi-heat source scenario.

[0006] To achieve the above-mentioned purpose, the application provides the following technical solutions:

[0007] An IGBT module heat dissipation liquid cooling plate, characterized in that it comprises:

[0008] The heat sink aluminum base plate has separate liquid inlet and outlet on one lateral side, and the liquid inlet and outlet are connected by a rectangular serpentine liquid flow channel. A liquid cooling plate cover plate is installed on the base plate, and a module installation groove is designed on the liquid cooling plate cover plate. Each module installation groove is installed with a turbulence column module. The turbulence column module includes a carrier plate and a plurality of turbulence columns vertically distributed on the carrier plate. The geometric parameters of the turbulence columns of different turbulence column modules are different, and the geometric parameters include at least one of diameter, height, spacing and arrangement mode.

[0009] Preferably, the cover plate is provided with a stepped module installation groove and a threaded hole, and the turbulence column module is provided with a corresponding stepped protrusion and a threaded hole, and the sealing is ensured by threaded connection.

[0010] Preferably, the turbulence column module is divided into high-strength heat exchange module, balanced module and low-flow resistance module according to the number and diameter of the turbulence columns. The turbulence column accelerates the heat dissipation efficiency by generating vortex and flow separation phenomenon of the liquid.

[0011] Preferably, the serpentine liquid flow channel is divided into three groups according to the number of bends, and each installation groove contains four long flow channels, which is convenient for modular installation.

[0012] Preferably, the inlet and outlet of the base plate are circular grooves, and the grooves have internal threads. One end of the matching connector is provided with matching external threads, and the other end is connected with the pipeline.

[0013] Preferably, the cover plate and the base plate are fixedly connected by screws, which is lower in cost.

[0014] Preferably, the cover plate, the base plate and the turbulence column module are all made of aluminum plate to ensure the heat dissipation efficiency and reduce the weight of the liquid cooling plate.

[0015] Preferably, the cover plate, the base plate and the turbulence column module are designed to share the same threaded hole connection, which reduces the number of connecting screws, installation steps and cost.

[0016] A temperature uniformity optimization method for the above-mentioned liquid cooling heat sink, characterized in that it comprises the following steps:

[0017] Monitoring step: real-time or periodic monitoring of the temperature or junction temperature of each IGBT module.

[0018] Judgment step: calculating the temperature difference (ΔT_inter) between each IGBT module and judging whether it exceeds the preset threshold.

[0019] Decision and execution step: if the temperature difference exceeds the threshold, the corresponding turbulence column module is selected and replaced according to the predetermined strategy.

[0020] Strategy 1: If the downstream module temperature is too high, install low-density / non-turbulent column modules in the upstream area of ​​the flow channel and high-density / large-diameter (high-intensity heat exchange) modules in the downstream area to balance the heat exchange capacity reduction caused by the rise in coolant temperature.

[0021] Strategy 2: Under conditions where heat dissipation requirements are not high, replace the entire system with low-density turbulence column modules or turbulence-free modules to reduce system pump power and improve system efficiency.

[0022] Strategy 3: In operating conditions with extremely high heat dissipation requirements, replace the entire system with high-density turbulence column modules, sacrificing some flow resistance in exchange for the highest heat dissipation capacity.

[0023] This invention patent provides a liquid-cooled heat sink based on modular baffle columns, which has the following effects:

[0024] 1. A basic heat sink can be adapted to different power levels and operating conditions by changing modules, achieving "one board for multiple uses" and reducing spare parts and inventory costs.

[0025] 2. It transforms from passive "uniform heat dissipation" to active "on-demand heat dissipation", which can dynamically optimize the temperature field and significantly improve the temperature uniformity and reliability of multi-heat source systems.

[0026] 3. Individual modules that are damaged or blocked can be replaced separately, resulting in low maintenance costs and eliminating the need to scrap the entire radiator.

[0027] 4. The method of the present invention can effectively reduce the maximum temperature difference between IGBT modules. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall installation structure of the present invention.

[0029] Figure 2 This is a schematic diagram of the substrate structure of the present invention.

[0030] Figure 3 This is a schematic diagram of the cover plate structure of the present invention.

[0031] Figure 4 This is a schematic diagram of the undisturbed column module structure of the present invention.

[0032] Figure 5 This is a schematic diagram of the low-density turbulence column module structure of the present invention.

[0033] Figure 6 This is a schematic diagram of the high-density turbulence column module structure of the present invention.

[0034] Figure 7 This is an exploded view of the entire invention.

[0035] Figure 8This is a diagram illustrating the uniformity optimization strategy of the present invention.

[0036] In the diagram: 1-cross-groove cylindrical head screw, 2-IGBT module, 3-cover plate, 4-substrate, 5-rectangular serpentine flow channel, 6-substrate threaded hole, 7-inlet / outlet, 8-module mounting slot, 9-cover plate threaded hole, 10-stepped protrusion, 11-non-turbulent column module, 12-module threaded hole, 13-turbulent column, 14-low-density turbulent column module, 15-high-density turbulent column module. Detailed Implementation

[0037] Reference Figure 1 and Figure 2 This invention provides a liquid-cooled heat sink based on modular turbulence columns.

[0038] The liquid-cooled heat sink is mainly composed of three parts: a base plate (4), a cover plate (3), and three types of turbulence column modules (11)(14)(15).

[0039] The substrate (4) of the liquid-cooled heat sink is made of aluminum by CNC milling. Its dimensions are 440mm in length, 170mm in width, and 25mm in thickness. A rectangular serpentine liquid flow channel (5) is milled inside the substrate (4). The rectangular serpentine liquid flow channel has a rectangular cross-section and a depth of 10mm. Coolant inlet and outlet ports (7) are machined at both ends of the substrate (4). The interfaces are internally threaded for connecting external pump pipes. Six M6 substrate threaded holes (6) are machined outside the flow channels of the substrate (4).

[0040] The cover plate (3) of the liquid cooling heat sink is made of aluminum and its size matches that of the substrate (4). The thickness is 4mm. The cover plate (3) has six Φ6mm through holes (9) corresponding to the six M6 substrate thread holes (6) of the substrate (4).

[0041] The turbulence-dissipating column modules (11)(14)(15) of the liquid-cooled heat sink are divided into low-density turbulence-dissipating column modules (14), high-density turbulence-dissipating column modules (15), and turbulence-free column modules (11). Each module includes a carrier plate and multiple cylindrical turbulence-dissipating columns (13) arranged perpendicularly to the carrier plate. This invention provides three specifications of modules:

[0042] Low-density turbulence column module (14): The diameter of the turbulence column is Φ=3.0mm. There are 5 turbulence columns in each long flow channel and 20 turbulence columns in one module.

[0043] High-density turbulence column module (15): The diameter of the turbulence column is Φ=3.0mm. There are 10 turbulence columns in each long flow channel and 40 turbulence columns in one module.

[0044] Unobstructed column module (11): It has no obstructed columns.

[0045] Each spoiler module has two Φ6mm module threaded holes (12), which are located corresponding to the substrate threaded holes (6) on the substrate (4).

[0046] The assembly process of the liquid-cooled heat sink is as follows:

[0047] Place the cover plate on the substrate, aligning the threaded holes. Place the selected spoiler modules (11), (14), and (15) into the module mounting slots (8) of the cover plate, ensuring the stepped protrusions (10) are fully inserted into the module mounting slots (8). Connect the components by inserting a cross-head screw (1) (Φ6mm x 12mm) through the threaded holes (12) of the module and (9) of the cover plate into the threaded holes (6) of the substrate.

[0048] The liquid cooling plate decision-making and execution strategy described in this invention refers to... Figure 8 As shown:

[0049] Scenario A: If the system load is reduced and the heat dissipation requirements are not high, but it is desirable to reduce pump power to improve system efficiency.

[0050] Implementation strategy: Replace all modules within the flow channel with low-flow-resistance modules. While meeting basic heat dissipation requirements, significantly reduce flow resistance, thereby increasing flow rate while maintaining the same pump power, or significantly reducing pump power while maintaining the same flow rate.

[0051] Scenario B: If the system experiences a sudden overload, the heat dissipation demand increases dramatically.

[0052] Implementation strategy: Replace all modules within the flow channel with high-strength heat exchange modules, sacrificing pump power in exchange for maximum heat dissipation capacity, ensuring the safety of core equipment.

[0053] Scenario C: If the downstream module (near the outlet) has a significantly higher temperature than the upstream module, this indicates that the coolant temperature rise is causing insufficient heat exchange capacity downstream.

[0054] Implementation strategy: Shut down the system and open the radiator. Replace the equalization module in the downstream 1 / 3 of the flow channel with a high-intensity heat exchange module, while leaving the upstream area unchanged. Utilize the stronger heat exchange capacity downstream to compensate for the negative impact of coolant temperature rise.

[0055] Verification and Iteration: After replacing the modules, rerun the system and monitor the temperature again. If the temperature still does not meet the requirements, continue to fine-tune the module configuration strategy (such as adjusting the coverage of the high-intensity modules) until the optimal temperature uniformity is achieved.

Claims

1. A liquid-cooled heat sink based on modular baffle columns, characterized in that, include: The heat sink base plate (4) has a rectangular serpentine liquid flow channel (5) inside and is provided with liquid inlet and outlet (7); A cover plate (3) is connected to the substrate (4) to seal the serpentine liquid flow channel (5), and a module mounting slot (8) is provided on the cover plate (3); At least one spoiler column module (11, 14, 15) is detachably installed in the module mounting slot (8); the spoiler column module includes a carrier plate and a plurality of spoiler columns (13) disposed thereon; the geometric parameters of the spoiler columns of the different spoiler column modules are different from each other.

2. The liquid-cooled radiator according to claim 1, characterized in that: The module mounting slot (8) is a stepped slot, and the turbulence column module is provided with stepped protrusions (10) that cooperate with the stepped slot.

3. The liquid-cooled radiator according to claim 1 or 2, characterized in that: The turbulence column module is connected and fixed to the cover plate (3) and the base plate (4) by screws (1); the screws pass through the module thread hole (12) on the turbulence column module and the cover plate thread hole (9) on the cover plate in sequence, and then screw into the base plate thread hole (6) on the base plate.

4. The liquid-cooled radiator according to claim 1, characterized in that: The turbulence column module includes a non-turbulence column module (11), a low-density turbulence column module (14), and a high-density turbulence column module (15).

5. The liquid-cooled radiator according to claim 1, characterized in that: The serpentine flow channel (5) is divided into multiple groups according to the number of bends, and each group of flow channels corresponds to one of the module mounting slots (8).

6. The liquid-cooled radiator according to claim 1, characterized in that: The inlet / outlet (7) is a circular groove with internal threads.

7. The liquid-cooled radiator according to claim 1, characterized in that: The substrate (4), cover plate (3) and turbulence column module are all made of aluminum.

8. A method for optimizing temperature uniformity using a liquid-cooled heat sink as described in any one of claims 1-7, characterized in that, Includes the following steps: Monitoring steps: Monitor the temperature of each IGBT module (2) in real time or periodically; Judgment steps: Calculate the temperature difference (ΔT_inter) between each IGBT module and determine whether it exceeds the preset threshold; Decision and execution steps: If the temperature difference exceeds the threshold, select and replace the corresponding turbulence column module according to the predetermined strategy.

9. The temperature uniformity optimization method according to claim 8, characterized in that, The strategy includes: If the downstream IGBT module temperature is too high, install low-density or non-turbulent column modules in the upstream area of ​​the flow channel and high-density turbulent column modules in the downstream area; if the system heat dissipation requirements are not high, replace all modules in the flow channel with low-density or non-turbulent column modules; if the system heat dissipation requirements are extremely high, replace all modules in the flow channel with high-density turbulent column modules.

10. The temperature uniformity optimization method according to claim 8 or 9, characterized in that, Also includes: After replacing the module, rerun the system and monitor the temperature. If the temperature still does not meet the requirements, continue to fine-tune the module configuration strategy.

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