White light Mini-LED lamp panel and preparation method thereof

Abstract

The invention provides a white light Mini-LED lamp panel and a preparation method thereof, in the white light Mini-LED lamp panel, a plurality of white light Mini-LED light-emitting unit arrays are arranged on one side of a circuit board, and each white light Mini-LED light-emitting unit comprises a blue light Mini-LED chip and a color conversion layer; the liner layer is arranged on the circuit board and comprises a plurality of liner retaining walls which are arranged in a crossed manner; the box dam glue layer is arranged on the liner layer and is in contact with the circuit board, the box dam glue layer comprises a plurality of box dam glue retaining walls and a plurality of light-emitting unit areas, and a fixed number of white light Mini-LED light-emitting units are arranged in each light-emitting unit area; wherein the thickness of the box dam glue layer borne by the liner layer is smaller than that of the white light Mini-LED light-emitting unit, the height of the box dam glue layer is larger than that of the white light Mini-LED light-emitting unit, the white light Mini-LED lamp panel can avoid generation of strip-shaped shadows, and the anti-crosstalk effect of the box dam glue layer on the white light Mini-LED light-emitting unit is considered.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a white light Mini-LED lamp plate and a preparation method thereof. BACKGROUND

[0002] A light emitting diode (Light Emitting Diode, LED for short) is a kind of electroluminescent semiconductor light emitting device. At present, it has been widely used in lighting, display, medical treatment, optical communication and other fields because of its advantages of low energy consumption, small size, long service life, good stability, fast response and stable light emitting wavelength.

[0003] Taking the display field as an example, the backlight module of the display device usually uses an LED lamp plate as a backlight source. The LED lamp beads used by the white light Mini-LED lamp plate have smaller sizes, so that more LED lamp beads can be integrated to improve the distribution density of the LED lamp beads, and then through the cooperation of the driving dimming technology, the display device can realize the display effect with more vivid colors. In addition, since the LED lamp beads used by the white light Mini-LED lamp plate are attached with a color conversion layer, the white light emission of the lamp plate can be directly realized. Compared with the combination structure of the blue light Mini LED lamp plate + quantum dot film shown in Chinese invention patent application CN202111351994.8, the quantum dot film can be omitted, and the backlight module structure can be simplified.

[0004] However, the higher distribution density of the LED lamp beads also makes it easier for the optical crosstalk problem to occur between the adjacent LED lamp beads. In the related technology, in order to improve the optical crosstalk problem, a damming glue with light isolation effect is arranged on the periphery of the LED lamp bead, and the height of the damming glue is greater than the height of the light emitting surface of the LED lamp bead.

[0005] The thickness of the dam glue directly affects the height of the dam glue, but based on the material properties of the dam glue, the thickness and width of the dam glue are in a certain positive proportional relationship during the coating process of the dam glue, that is, if the height of the dam glue coated on the circuit board where the LED lamp beads are located is to be increased, the width of the dam glue will also be increased. Taking white light Mini-LED lamp panels and blue light Mini-LED lamp panels as examples, in the related technology, because the white light Mini-LED lamp panel uses LED lamp beads with a color conversion layer, the thickness of the LED lamp beads will be greater than that of the LED lamp beads without a color conversion layer in the blue light Mini-LED lamp panel. Correspondingly, in order to ensure the anti-crosstalk effect of the dam glue, the thickness of the dam glue adapted to the LED lamp beads in the white light Mini-LED lamp panel will be thicker, and the width will be wider. The increase in the width of the dam glue will produce strip-shaped shadows, which will deteriorate the light efficiency of the lamp panel. Therefore, how to avoid the generation of strip-shaped shadows in the white light Mini-LED lamp panel while taking into account the anti-crosstalk effect of the dam glue layer on the LED lamp beads containing a color conversion layer is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0006] The present application provides a white light Mini-LED lamp panel and a preparation method thereof, which can effectively solve the problem that the white light Mini-LED lamp panel in the related art cannot avoid the generation of strip-shaped shadows while taking into account the anti-crosstalk effect of the dam glue layer on the LED lamp beads containing a color conversion layer.

[0007] In a first aspect, the present application provides a white light Mini-LED lamp panel, which comprises: a circuit board; a plurality of white light Mini-LED light emitting units arranged on one side of the circuit board, the white light Mini-LED light emitting units comprising blue light Mini-LED chips and color conversion layers arranged on the blue light Mini-LED chips; a pad layer arranged on the circuit board, the pad layer comprising a plurality of pad barriers arranged in a cross shape; a dam glue layer arranged on the pad layer and in contact with the circuit board, the dam glue layer comprising a plurality of dam glue barriers and a plurality of light emitting unit areas defined by the plurality of dam glue barriers, and a fixed number of white light Mini-LED light emitting units are arranged in each light emitting unit area; wherein the thickness of the dam glue layer carried by the pad layer in the direction perpendicular to the bearing surface of the pad layer is less than the thickness of the white light Mini-LED light emitting unit in the direction perpendicular to the circuit board, and the height of the dam glue layer in the direction perpendicular to the circuit board is greater than the height of the white light Mini-LED light emitting unit in the direction perpendicular to the circuit board.

[0008] Optionally, a ratio of the thickness and the width of the dam rubber wall carried by the gasket retaining wall is m, and m≤0.4.

[0009] Optionally, a width of the gasket retaining wall in a direction parallel to the circuit board is a, and a width of the dam rubber wall in the direction parallel to the circuit board is b, wherein a≤b, and a and b are less than or equal to a preset value, and the preset value is a width of the dam rubber wall in a liquid state when the dam rubber wall in the liquid state is coated on the circuit board under a condition that the dam rubber wall in the liquid state has a same thickness as the blue light Mini-LED chip.

[0010] Optionally, a<b, wherein a cross-sectional shape of the gasket retaining wall is a trapezoid-like shape, a ratio of a height of the trapezoid-like shape and an absolute value of a difference between upper and lower bases of the trapezoid-like shape is n, and 1.75>n>m, and the dam rubber wall covers the gasket retaining wall.

[0011] Optionally, a material of the gasket layer is the same as a material of a base material of the circuit board.

[0012] Optionally, a=b, wherein the gasket retaining wall includes a connecting fixing groove penetrating through the gasket retaining wall in a direction perpendicular to the circuit board, a width of the connecting fixing groove is less than a width of the gasket retaining wall, the dam rubber wall includes a first part and a second part, the first part fills the connecting fixing groove, and the second part is arranged on a surface of a side of the gasket retaining wall away from the circuit board.

[0013] Optionally, a material of the gasket layer is a transparent material, and an included angle between a side wall of the connecting fixing groove and a normal projection of the side wall of the connecting fixing groove on the circuit board is an acute angle.

[0014] Optionally, the gasket layer includes a base material in an opaque state and a reflective coating layer arranged on a side wall of the base material, and the side wall of the connecting fixing groove is perpendicular to the circuit board.

[0015] In a second aspect, the present application provides a preparation method of a white light Mini-LED lamp panel, and the preparation method of the white light Mini-LED lamp panel comprises the following steps: arranging a plurality of white light Mini-LED lamp panel arrays on a circuit board, wherein the white light Mini-LED light emitting unit includes a blue light Mini-LED chip and a color conversion layer arranged on the blue light Mini-LED chip; Form positioning holes at at least two corner positions of a circuit board, set a gasket layer on the circuit board, and embed positioning columns on the gasket layer into the positioning holes, wherein the gasket layer comprises a plurality of gasket barriers arranged in a cross shape; Form a dam glue layer on the gasket layer and cure, wherein the dam glue layer comprises a plurality of dam glue barriers and a plurality of light emitting unit areas defined by the plurality of dam glue barriers, a fixed number of white light Mini-LED light emitting units are arranged in each of the light emitting unit areas, the thickness of the dam glue layer carried by the gasket layer in a direction perpendicular to the bearing surface of the gasket layer is less than the thickness of the white light Mini-LED light emitting unit in a direction perpendicular to the circuit board, and the height of the dam glue layer in a direction perpendicular to the circuit board is greater than the height of the white light Mini-LED light emitting unit in a direction perpendicular to the circuit board.

[0016] In a third aspect, the present application provides a white light Mini-LED lamp panel, comprising: A circuit board comprising a circuit board body and a gasket layer, the gasket layer comprising a plurality of gasket barriers arranged in a cross shape; A plurality of white light Mini-LED light emitting units arranged in an array on one side of the circuit board, the white light Mini-LED light emitting units comprising blue light Mini-LED chips and color conversion layers arranged on the blue light Mini-LED chips; A dam glue layer arranged on the gasket layer and covering the gasket layer, the dam glue layer comprising a plurality of dam glue barriers and a plurality of light emitting unit areas defined by the plurality of dam glue barriers, a fixed number of white light Mini-LED light emitting units being arranged in each of the light emitting unit areas; The thickness of the dam glue layer carried by the gasket layer in a direction perpendicular to the bearing surface of the gasket layer is less than the thickness of the white light Mini-LED light emitting unit in a direction perpendicular to the circuit board, and the height of the dam glue layer in a direction perpendicular to the circuit board is greater than the height of the white light Mini-LED light emitting unit in a direction perpendicular to the circuit board.

[0017] This application provides a white Mini-LED light panel and its fabrication method. The white Mini-LED light panel includes a circuit board, multiple white Mini-LED light-emitting units, a padding layer, and a damming adhesive layer. The multiple white Mini-LED light-emitting units are arrayed on one side of the circuit board. Each white Mini-LED light-emitting unit includes a blue Mini-LED chip and a color conversion layer disposed on the blue Mini-LED chip. The padding layer is disposed on the circuit board and includes multiple intersecting padding barriers. The damming adhesive layer is disposed on the padding layer. In contact with the circuit board, the dammed adhesive layer includes multiple dammed adhesive barriers and multiple light-emitting unit areas defined by the multiple dammed adhesive barriers. Each light-emitting unit area is provided with a fixed number of white Mini-LED light-emitting units. The thickness of the dammed adhesive layer supported by the padding layer in the direction perpendicular to the bearing surface of the padding layer is less than the thickness of the white Mini-LED light-emitting units in the direction perpendicular to the circuit board, and the height of the dammed adhesive layer in the direction perpendicular to the circuit board is greater than the height of the white Mini-LED light-emitting units in the direction perpendicular to the circuit board. The white Mini-LED light board provided in this application can avoid the generation of strip-shaped shadows on the white Mini-LED light board while also ensuring the anti-crosstalk effect of the dammed adhesive layer on the LED beads containing the color conversion layer, thereby improving the optical effect of the white Mini-LED light board. Attached Figure Description

[0018] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0019] Figure 1 This is a top view schematic diagram of a white Mini-LED light panel provided in some embodiments of this application.

[0020] Figure 2 This is a cross-sectional schematic diagram of a white Mini-LED light panel provided in some embodiments of this application.

[0021] Figure 3 yes Figure 2 A magnified view of a portion of region M2.

[0022] Figure 4 This is a cross-sectional schematic diagram of another white Mini-LED light panel provided in some embodiments of this application.

[0023] Figure 5 yes Figure 4 A magnified view of a portion of region M3.

[0024] Figure 6is a cross-sectional schematic view of a white light Mini-LED lamp panel provided by some embodiments of the present application.

[0025] Figure 7 is Figure 6 is a partial enlarged view of the M4 region in FIG. 6.

[0026] Figure 8 is a schematic diagram of a preparation process of a white light Mini-LED lamp panel provided by some embodiments of the present application.

[0027] Figure 9 is a cross-sectional schematic view of a white light Mini-LED lamp panel provided by some embodiments of the present application.

[0028] Figure 10 is Figure 9 is a partial enlarged view of the M5 region in FIG. 8.

[0029] Explanation of reference signs: circuit board 10; white light Mini-LED light emitting unit 20; blue light Mini-LED chip 21; color conversion layer 22; cushion layer 30; cushion barrier 31; connecting and fixing groove 310; reflective coating 311; dam glue layer 40; dam glue barrier 41; first part 411; second part 412; light emitting unit region M1. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative labor fall within the scope of protection of the present application.

[0031] The terms "first", "second" in the text are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0032] In the description of the application, it should be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection or can communicate with each other; can be directly connected, can also be indirectly connected through intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0033] The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the application. In addition, reference numerals and / or reference letters can be repeated in different examples in the application. Such repetition is for the purpose of simplification and clarity, and in itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0034] In a first aspect, the embodiments of the application provide a white light Mini-LED lamp plate, which can effectively solve the problem that the white light Mini-LED lamp plate in the related art is difficult to avoid producing strip-shaped dark shadows while taking into account the anti-crosstalk effect of the dam adhesive layer 40 on the LED lamp bead containing the color conversion layer 22.

[0035] In combination Figures 1 to 7As shown, some embodiments of the present application provide a white light Mini-LED lamp panel, which comprises a circuit board 10, a plurality of white light Mini-LED light emitting units 20, a cushion layer 30 and a dam glue layer 40, a plurality of the white light Mini-LED light emitting units 20 are arranged in an array on one side of the circuit board 10, the white light Mini-LED light emitting unit 20 comprises a blue light Mini-LED chip 21 and a color conversion layer 22 arranged on the blue light Mini-LED chip 21; the cushion layer 30 is arranged on the circuit board 10, the cushion layer 30 comprises a plurality of cushion barrier walls 31 arranged in cross; the dam glue layer 40 is arranged on the cushion layer 30 and in contact with the circuit board 10, the dam glue layer 40 comprises a plurality of dam glue barrier walls 41 and a plurality of light emitting unit areas M1 defined by the plurality of dam glue barrier walls 41, a fixed number of white light Mini-LED light emitting units 20 are arranged in each of the light emitting unit areas M1; wherein the thickness of the dam glue layer 40 carried by the cushion layer 30 in the direction perpendicular to the bearing surface of the cushion layer 30 is less than the thickness of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10, and the height of the dam glue layer 40 in the direction perpendicular to the circuit board 10 is greater than the height of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10.

[0036] In the white light Mini-LED lamp panel provided by the embodiments of the present application, since the white light Mini-LED unit comprises a blue light Mini-LED chip 21 and a color conversion layer 22 arranged on the blue light Mini-LED chip 21, the thickness of the white light Mini-LED unit will increase significantly compared with the blue light Mini-LED lamp bead without the color conversion layer 22, and thus the height of the light emitting surface of the white light Mini-LED unit will also increase. This means that, assuming that the white light Mini-LED unit and the blue light Mini-LED lamp bead are prepared on the circuit board 10 with a flat surface at the same time, and the dam glue layer 40 of the same material is coated, based on the thixotropic properties of the glue used by the dam glue layer 40, the width of the dam glue barrier wall 41 of the dam glue layer 40 is proportional to its thickness, and when the width of the dam glue barrier wall 41 of the dam glue layer 40 is fixed, the phenomenon that the anti-crosstalk effect of the dam glue layer 40 on the white light Mini-LED unit is worse than that on the blue light Mini-LED lamp bead will occur.

[0037] This application, by additionally providing a padding layer 30 on the circuit board 10, can utilize the padding layer 30 to increase the height of the damming adhesive layer 40 relative to the white light Mini-LED unit. This results in the thickness of the damming adhesive layer 40 supported by the padding layer 30 in the direction perpendicular to the bearing surface of the padding layer 30 being less than the thickness of the white light Mini-LED unit 20 in the direction perpendicular to the circuit board 10. In other words, without changing the material of the damming adhesive layer 40 or increasing the width of the damming adhesive barrier 41, the top surface height of the damming adhesive layer 40 is higher than the top surface light emission height of the white light Mini-LED unit 20. This achieves the goal of avoiding striped shadows on the white light Mini-LED light board while also ensuring the anti-crosstalk effect of the damming adhesive layer 40 on the LED beads including the color conversion layer 22.

[0038] In addition, since the dammed adhesive layer 40 is in contact with the circuit board 10, the padding layer 30 disposed between the dammed adhesive layer 40 and the circuit board 10 can be used to keep the dammed adhesive layer 40 and the circuit board 10 relatively fixed, thereby ensuring the assembly stability between the structural components in the white light Mini-LED lamp board.

[0039] It should be noted that the damming adhesive layer 40 supported by the padding layer 30 specifically refers to the damming adhesive layer 40 directly supported by the padding layer 30. For example, in Figures 4 to 7 In the white Mini-LED light panel shown, the dammed adhesive layer 40 includes a first portion 411 disposed in the connecting and fixing groove 310. The first portion 411 is not directly supported by the padding layer 30, but is supported by the circuit board 10 and defined by the side wall of the connecting and fixing groove 310. Therefore, the first portion 411 does not belong to the dammed adhesive layer 40 supported by the padding layer 30.

[0040] In some embodiments of this application, the thickness to width ratio of the dam retaining wall 41 supported by the pad retaining wall 31 is m, where m ≤ 0.4.

[0041] The white light Mini-LED lamp panel provided by the embodiment of the present application, in order to ensure the reflection effect of the dam glue layer 40, the composition of the white wall glue used by the dam glue layer 40 needs to be adjusted, and the reflection particles in the white wall glue need to be fully dispersed. The composition of the white wall glue includes but is not limited to organic silicon resin and reflection particles. In order to ensure that the reflection particles in the white wall glue are fully dispersed, the reflection particles need to be fully mixed with liquid organic silicon resin first, and then further coated and cured to prepare a structure-stable dam glue layer 40. During the coating stage, the white wall glue is still in a liquid state. Based on the thixotropy of the material, the thickness of the white wall glue is proportional to the width, and when the width of the white wall glue is 1r (r is a variable), the maximum thickness of the white wall glue is 0.4r. Therefore, by making the ratio of the thickness to the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 less than or equal to 0.4, the dam glue layer 40 can improve the uniformity of the reflection particles through the liquid mixing process, improve the reflection effect, and also enable the dam glue layer 40 to be prepared on the gasket layer 30 through a coating process which has lower preparation cost and is more mature in technology, thereby reducing the process cost and taking into account the yield.

[0042] In addition, it should be noted that the ratio of the thickness to the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is less than or equal to 0.4, which is also the fundamental reason why the dam glue retaining wall 41 cannot be prepared to have an arbitrary thickness under the condition of width limitation. The thickness and width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 are described below. Referring to FIG. 6, the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the width of the top surface (parallel to the surface of the circuit board 10) of the gasket retaining wall 31, and the thickness of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the thickness of the dam glue retaining wall 41 on the top surface (parallel to the surface of the circuit board 10) of the gasket retaining wall 31, that is, the thickness of the second part 412. Figure 3 Figure 5 Figure 7 , the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the width a of the gasket retaining wall 31 in the direction parallel to the circuit board 10, and the thickness of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the thickness of the dam glue retaining wall 41 on the top surface (parallel to the surface of the circuit board 10) of the gasket retaining wall 31, that is, the thickness of the second part 412.

[0043] ​​In some embodiments of the present application, the width of the gasket barrier 31 in the direction parallel to the circuit board 10 is a, and the width of the dam adhesive barrier 41 in the direction parallel to the circuit board 10 is b, where a≤b, and a and b are less than or equal to a preset value, which is the width of the liquid state dam adhesive barrier 41 when the liquid state dam adhesive barrier 41 is coated on the circuit board 10, and the thickness of the liquid state dam adhesive barrier 41 is the same as that of the blue light Mini-LED chip 21.

[0044] In related technologies, when preparing a blue light Mini-LED lamp panel, in order to ensure the anti-crosstalk effect, a dam adhesive barrier is arranged around the blue light Mini-LED chip on the circuit board, and the height of the dam adhesive barrier is slightly greater than the height of the blue light Mini-LED chip (e.g., greater than 1 / 10 to 1 / 5 of the height of the blue light Mini-LED chip). At this time, the width of the dam adhesive barrier is a first width, and when the dam adhesive barrier has the first width, the strip-shaped shadow problem can be better improved, and the light efficiency of the blue light Mini-LED lamp panel can be avoided from deteriorating.

[0045] Similarly, in the white light Mini-LED lamp panel provided in the embodiments of the present application, according to the aforementioned proportional relationship between the width and the height of the dam adhesive barrier, when the height of the dam adhesive barrier 41 is equal to the height of the blue light Mini-LED chip 21, the second width of the dam adhesive barrier 41 is smaller than the first width, and the second width can further improve the strip-shaped shadow problem and improve the light efficiency of the lamp panel. In the white light Mini-LED lamp panel provided in the embodiments of the present application, the preset value is the width of the liquid state dam adhesive barrier 41 when the liquid state dam adhesive barrier 41 is coated on the circuit board 10, and the thickness of the liquid state dam adhesive barrier 41 is the same as that of the blue light Mini-LED chip 21, that is, the preset value is equal to the second width and smaller than the first width. Therefore, by arranging the gasket layer 30, and by making the width of the gasket layer 30 and the width of the dam adhesive barrier 41 in the direction parallel to the circuit board 10 less than or equal to the preset value, the strip-shaped shadow problem can be further improved, and the light efficiency of the lamp panel can be improved. In addition, it should be noted that the width of the gasket barrier 31 in the direction parallel to the circuit board 10 is less than or equal to the width of the dam adhesive barrier 41 in the direction parallel to the circuit board 10, because the width of the additionally arranged gasket layer 30 is too large, which may cause a new strip-shaped shadow problem.

[0046] In combination Figure 2 and Figure 3In some embodiments of the present application, a < b, wherein the cross-sectional shape of the cushion barrier 31 is a trapezoid-like shape, the ratio of the height of the trapezoid-like shape to the absolute value of the difference between the upper and lower bases is n, 1.75 > n > m, and the damming glue barrier 41 covers the cushion barrier 31.

[0047] In the white light Mini-LED lamp panel provided by the embodiments of the present application, a < b, that is, the width of the cushion barrier 31 in the direction parallel to the circuit board 10 is smaller than the width of the damming glue barrier 41 in the direction parallel to the circuit board 10. Therefore, the damming glue layer 40 on the cushion layer 30 can be in contact with the circuit board 10 by covering the cushion barrier 31 with the damming glue barrier 41, so as to keep the damming glue layer 40, the circuit board 10 and the cushion layer 30 relatively fixed, thereby improving the assembly stability between the structural components in the white light Mini-LED lamp panel.

[0048] In addition, in the white light Mini-LED lamp panel provided by the embodiments of the present application, the cross-sectional shape of the cushion barrier 31 is a trapezoid-like shape, and the ratio of the height of the trapezoid-like shape to the absolute value of the difference between the upper and lower bases is greater than the ratio of the thickness to the width of the damming glue barrier 41 and less than 1.75, that is, the average inclination of the side wall of the cushion barrier 31 is greater than the average inclination of the side wall of the damming glue barrier 41 in a fluid state. Therefore, the width of the damming glue barrier 41 arranged on the top surface of the cushion barrier 31 can be as large as possible, and the covering effect of the damming glue barrier 41 on the cushion barrier 31 and the contact area between the damming glue barrier 41 and the circuit board 10 can be considered at the same time, thereby ensuring the reflection effect and structural stability.

[0049] It should be noted that the trapezoid-like shape means that the cushion barrier 31 has upper and lower bases consistent with a trapezoid, and the "waist" of the trapezoid-like shape can be an arc (see Figure 2 and Figure 3 ) or a multi-segment arc (not shown in the figure), that is, the side wall of the cushion barrier 31 can be an arc surface or an uneven surface including multiple arc surfaces. Such an arc surface design helps to improve the adhesion stability of the damming glue barrier 41 on the side wall of the cushion barrier 31 in the case that the side wall of the cushion barrier 31 has a large inclination angle, thereby improving the reflection effect of the damming glue barrier 41 and the light extraction efficiency of the white light Mini-LED lamp panel.

[0050] In some embodiments of the present application, the material of the cushion layer 30 is the same as the material of the base material of the circuit board 10.

[0051] The base material of the circuit board 10 can be understood as an insulating layer in the circuit board 10. The material of the pad layer 30 is the same as that of the base material of the circuit board 10. On the one hand, the cost of material development can be reduced. On the other hand, the performance of the pad layer 30 and the circuit board 10 in contact with the pad layer 30 in the dam glue stop wall 41 in response to environmental variables tends to be consistent, which is conducive to improving the assembly stability between the structural components in the white light Mini-LED lamp panel. On the other hand, in the low version product (blue light Mini-LED lamp panel) corresponding to the white light Mini-LED lamp panel, the dam glue layer 40 is directly arranged on the circuit board 10. When the material of the pad layer 30 is the same as that of the base material of the circuit board 10, the experimental parameters of the adhesion flowability of the dam glue layer 40 on the surface of the circuit board 10 can be directly called, and the process development cost is reduced.

[0052] In combination Figures 4 to 7 In some embodiments of the present application, a=b, wherein the pad stop wall 31 comprises a connecting fixing groove 310 penetrating the pad stop wall 31 in a direction perpendicular to the circuit board 10, the width of the connecting fixing groove 310 is smaller than the width of the pad stop wall 31, the dam glue stop wall 41 comprises a first part 411 and a second part 412, the first part 411 fills the connecting fixing groove 310, and the second part 412 is arranged on the surface of the side of the pad stop wall 31 away from the circuit board 10.

[0053] In the white light Mini-LED lamp panel provided by the embodiment of the present application, a=b, that is, the width of the dam glue retaining wall 41 in the direction parallel to the circuit board 10 is the same as the width of the gasket retaining wall 31 in the direction parallel to the circuit board 10, and accordingly, the dam glue retaining wall 41 cannot completely cover the gasket retaining wall 31. Therefore, how to ensure that the gasket layer 30 is stably fixed between the circuit board 10 and the dam glue layer 40 is a problem that the applicant needs to consider. In view of the above problem, the applicant sets a connecting fixing groove 310 penetrating the gasket retaining wall 31, so that a part of the dam glue layer 40 (i.e., the first part 411) can flow into and fill the connecting fixing groove 310 during the coating process, thereby realizing the relative fixation among the dam glue layer 40, the gasket layer 30 and the circuit board 10, and when the first part 411 fills the connecting fixing groove 310, the liquid first part 411 can combine with the solid gasket layer 30 to provide support for the second part 412 of the dam retaining wall arranged on the surface of the side of the gasket retaining wall 31 away from the circuit board 10, thereby ensuring that the second part 412 has a stable form, and thereby ensuring that the dam glue layer 40 has good reflection effect in the subsequent curing process.

[0054] In some embodiments of the present application, the curing time of the first part 411 is different from the curing time of the second part 412.

[0055] In the white light Mini-LED lamp panel provided by the embodiment of the present application, in order to avoid the problem that incomplete curing of the first part 411 caused by simultaneous curing of the first part 411 and the second part 412 affects the combination effect of the first part 411 and the gasket retaining wall 31, and to avoid the problem that the surface form of the second part 412 changes too much due to the curing deformation of the first part 411, thereby affecting the overall height and surface form of the dam glue layer 40 and causing the anti-crosstalk effect and the reflection effect to decrease, the present application can set the curing time of the first part 411 to be different from the curing time of the second part 412, for example, the first part 411 can be filled in the connecting fixing groove 310 first, and the first part 411 is cured, and then the second part 412 is further formed on the first part 411 and the gasket layer 30, and the second part 412 is cured.

[0056] In some embodiments of the present application, the connecting fixing grooves 310 in the plurality of adjacent cushion retaining walls 31 are in communication with each other, so that the liquid colloidal material arranged in the connecting fixing grooves 310 can realize self-leveling, thereby better combining with the solid cushion layer 30, so as to subsequently provide support for the second part 412 of the dam retaining wall arranged on the surface of the cushion retaining wall 31 away from the circuit board 10.

[0057] In combination Figure 4 and Figure 5 As shown in the drawings, in some embodiments of the present application, the material of the cushion layer 30 is transparent material; the included angle between the side wall of the connecting fixing groove 310 and the orthogonal projection of the side wall of the connecting fixing groove 310 on the circuit board 10 is an acute angle.

[0058] In the white light Mini-LED lamp panel provided by the embodiments of the present application, the applicant finds that when a=b, the damming glue retaining wall 41 cannot cover the cushion retaining wall 31, which will cause the side surface of the cushion retaining wall 31 to be directly exposed. That is, part of the emitted light of the white light Mini-LED light emitting unit 20 will irradiate on the side surface of the cushion retaining wall 31. When the cushion retaining wall 31 does not have a light reflection effect, it will cause light loss and reduce the light emitting efficiency of the white light Mini-LED lamp panel. By setting the material of the cushion layer 30 as transparent material, the present application can make part of the emitted light of the white light Mini-LED light emitting unit 20 pass through the cushion retaining wall 31 and further irradiate on the first part 411 of the damming glue retaining wall 41 in the connecting fixing groove 310, thereby reflecting part of the emitted light of the white light Mini-LED light emitting unit 20 by means of the damming glue retaining wall 41, reducing light loss and improving the light emitting efficiency of the white light Mini-LED lamp panel. In addition, since the included angle between the side wall of the connecting fixing groove 310 and the orthogonal projection of the side wall of the connecting fixing groove 310 on the circuit board 10 is an acute angle, the first part 411 with the inclined side wall can be used to adjust the angle of part of the emitted light of the white light Mini-LED light emitting unit 20, thereby further improving the light emitting efficiency of the white light Mini-LED lamp panel.

[0059] In combination Figure 6 and Figure 7 As shown in the drawings, in some embodiments of the present application, the cushion layer 30 includes an opaque base material and a reflective coating 311 arranged on the side wall of the base material, and the side wall of the connecting fixing groove 310 is perpendicular to the circuit board 10.

[0060] In the white light Mini-LED lamp panel provided by the embodiment of the present application, the applicant finds that when a=b, the dam glue retaining wall 41 cannot cover the gasket retaining wall 31, which will cause the side of the gasket retaining wall 31 to be directly exposed. That is, part of the light emitted by the white light Mini-LED light emitting unit 20 will irradiate on the side of the gasket retaining wall 31. Since the substrate of the gasket layer 30 is in an opaque state, the present application can also greatly reduce the light efficiency loss and improve the light emitting efficiency of the white light Mini-LED lamp panel by setting a reflective coating 311 on the side wall of the opaque substrate of the gasket layer 30; and since the side wall of the connecting fixing groove 310 is perpendicular to the circuit board 10, it is beneficial to the full filling of the dam glue retaining wall 41 in the connecting fixing groove 310, thereby helping to improve the relative stability between the dam glue layer 40, the gasket layer 30 and the circuit board 10.

[0061] In some embodiments of the present application, at least two corner positions of the circuit board 10 are provided with positioning holes (not shown in the figure), and the gasket layer 30 is provided with positioning columns (not shown in the figure) matched in number and shape with the positioning holes.

[0062] In the white light Mini-LED lamp panel provided by the embodiment of the present application, when the dam glue layer 40 in a liquid state is coated on the gasket layer 30, if the gasket layer 30 is displaced, it may affect the coating effect of the dam glue layer 40, thereby affecting the subsequent anti-crosstalk effect of the dam glue layer 40 and reducing the yield of the lamp panel. In order to improve this problem, the present application provides positioning holes at at least two corner positions of the circuit board 10 and positioning columns on the gasket layer 30 matched in number and shape with the positioning holes. In addition, this positioning method for the gasket layer 30 does not need to open a separate film, which has the advantages of low cost, high positioning accuracy, etc.

[0063] In some embodiments of the present application, at least two corner positions of the circuit board 10 are provided with positioning columns (not shown in the figure), and the gasket layer 30 is provided with positioning holes (not shown in the figure) matched in number and shape with the positioning columns.

[0064] The white light Mini-LED lamp panel provided by the embodiment of the present application, when the dam glue layer 40 in a liquid state is coated on the gasket layer 30, if the gasket layer 30 is displaced, the coating effect of the dam glue layer 40 may be affected, and then the subsequent anti-crosstalk effect of the dam glue layer 40 is affected, and the yield of the lamp panel is reduced. In order to improve this problem, the present application is provided with a positioning column at at least two corner positions of the circuit board 10, and a positioning hole matched with the number and shape of the positioning column is arranged on the gasket layer 30. In addition, this positioning method of the gasket layer 30 does not need to open a film separately, has the advantages of low cost, high positioning accuracy, and the like, and since the circuit board 10 does not need to be provided with an opening structure, the design requirements of the circuit wiring in the circuit board 10 can be reduced.

[0065] In a second aspect, the embodiment of the present application provides a preparation method of a white light Mini-LED lamp panel, which is used for preparing the white light Mini-LED lamp panel.

[0066] Figure 8 The figure is a preparation flowchart of the white light Mini-LED lamp panel provided by some embodiments of the present application. As shown in the figure, the preparation method of the white light Mini-LED lamp panel includes steps S01, S02 and S03. Figures 1 to 8

[0067] Step S01 includes: arranging a plurality of white light Mini-LED lamp panel arrays on a circuit board 10, wherein the white light Mini-LED light emitting unit 20 includes a blue light Mini-LED chip 21 and a color conversion layer 22 arranged on the blue light Mini-LED chip 21.

[0068] Step S02 includes: forming a positioning hole at at least two corner positions of the circuit board 10, arranging a gasket layer 30 on the circuit board 10, and embedding a positioning column on the gasket layer 30 into the positioning hole, wherein the gasket layer 30 includes a plurality of gasket retaining walls 31 arranged in cross.

[0069] ​Step S03 includes: forming a dam glue layer 40 on the cushion layer 30 and curing, wherein the dam glue layer 40 includes a plurality of dam glue retaining walls 41 and a plurality of light emitting unit areas M1 defined by the plurality of dam glue retaining walls 41, a fixed number of white light Mini-LED light emitting units 20 are arranged in each light emitting unit area M1, the thickness of the dam glue layer 40 carried by the cushion layer 30 in the direction perpendicular to the carrying surface of the cushion layer 30 is less than the thickness of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10, and the height of the dam glue layer 40 in the direction perpendicular to the circuit board 10 is greater than the height of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10.

[0070] The white light Mini-LED lamp panel prepared by the preparation method of the white light Mini-LED lamp panel provided by the embodiments of the present application can avoid the generation of strip-shaped dark shadows while taking into account the anti-crosstalk effect of the dam glue layer 40 on the LED lamp beads containing the color conversion layer 22. Moreover, the preparation method of the white light Mini-LED lamp panel provided by the present application can utilize the existing dam glue dispensing process and equipment, and does not require additional manufacturing of other molds, thereby having the advantages of low preparation cost and simple process.

[0071] In a third aspect, the embodiments of the present application provide a white light Mini-LED lamp panel, which can effectively solve the problem that the white light Mini-LED lamp panel in the related art is difficult to avoid the generation of strip-shaped dark shadows while taking into account the anti-crosstalk effect of the dam glue layer on the LED lamp beads containing the color conversion layer.

[0072] Figure 9 is a cross-sectional view of a white light Mini-LED lamp panel provided by some embodiments of the present application; Figure 10 is Figure 9 is a local enlarged view of the M5 area in Figure 1 , Figure 9 and Figure 10As shown, some embodiments of the present application provide a white light Mini-LED lamp panel, which comprises a circuit board 10, a plurality of white light Mini-LED light emitting units 20 and a dam glue layer 40, wherein the circuit board 10 comprises a circuit board body and a spacer layer 30, the spacer layer 30 comprises a plurality of spacer barriers 31 arranged in cross; a plurality of white light Mini-LED light emitting units 20 are arranged on one side of the circuit board 10, the white light Mini-LED light emitting unit 20 comprises a blue light Mini-LED chip 21 and a color conversion layer 22 arranged on the blue light Mini-LED chip 21; the dam glue layer 40 is arranged on the spacer layer 30 and covers the spacer layer 30, the dam glue layer 40 comprises a plurality of dam glue barriers 41 and a plurality of light emitting unit areas M1 formed by the plurality of dam glue barriers 41, and a fixed number of white light Mini-LED light emitting units 20 are arranged in each light emitting unit area M1; wherein the thickness of the dam glue layer 40 carried by the spacer layer 30 in the direction perpendicular to the bearing surface of the spacer layer 30 is less than the thickness of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10, and the height of the dam glue layer 40 in the direction perpendicular to the circuit board 10 is greater than the height of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10.

[0073] The white light Mini-LED lamp panel provided by the embodiments of the present application can effectively solve the fixing problem of the spacer layer 30 by directly forming the spacer layer 30 as part of the circuit board 10, and can use the spacer layer 30 to increase the height of the dam glue layer 40 relative to the white light Mini-LED unit, so that the height of the dam glue layer 40 in the direction perpendicular to the circuit board 10 is greater than the height of the white light Mini-LED light emitting unit 20 in the direction perpendicular to the circuit board 10, that is, without changing the material of the dam glue layer 40 and increasing the width of the dam glue barrier 41, the top surface height of the dam glue layer 40 is higher than the top surface light emitting height of the white light Mini-LED light emitting unit 20, and the purpose of avoiding strip-shaped shadows of the white light Mini-LED lamp panel while considering the anti-crosstalk effect of the dam glue layer 40 on the LED lamp bead containing the color conversion layer 22 is achieved.

[0074] In some embodiments of the present application, the ratio of the thickness to the width of the dam glue barrier 41 carried by the spacer barrier 31 is m, and m≤0.4.

[0075] The white light Mini-LED lamp panel provided by the embodiment of the present application, in order to ensure the reflection effect of the dam glue layer 40, the composition of the white wall glue used by the dam glue layer 40 needs to be adjusted, and the reflection particles in the white wall glue need to be fully dispersed. The composition of the white wall glue includes but is not limited to organic silicon resin and reflection particles. In order to ensure that the reflection particles in the white wall glue are fully dispersed, the reflection particles need to be fully mixed with liquid organic silicon resin first, and then further coated and cured to prepare a structure-stable dam glue layer 40. During the coating stage, the white wall glue is still in a liquid state. Based on the thixotropy of the material, the thickness of the white wall glue is proportional to the width, and when the width of the white wall glue is 1r (r is a variable), the maximum thickness of the white wall glue is 0.4r. Therefore, by making the ratio of the thickness to the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 less than or equal to 0.4, the dam glue layer 40 can improve the uniformity of the reflection particles through the liquid mixing process, improve the reflection effect, and also enable the dam glue layer 40 to be prepared on the gasket layer 30 through a coating process which has lower preparation cost and is more mature in technology, thereby reducing the process cost and taking into account the yield.

[0076] In addition, it should be noted that the ratio of the thickness to the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is less than or equal to 0.4, which is also the fundamental reason why the dam glue retaining wall 41 cannot be prepared to have an arbitrary thickness under the condition of width limitation. The thickness and width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 are described below. Referring to FIG. 1, Figure 3 , the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the width of the top surface (parallel to the surface of the circuit board 10) of the gasket retaining wall 31, and the thickness of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the thickness of the dam glue retaining wall 41 on the top surface (parallel to the surface of the circuit board 10) of the gasket retaining wall 31, that is, the thickness of the second part 412. Figure 5 Figure 7 , the width of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the width a of the gasket retaining wall 31 in the direction parallel to the circuit board 10, and the thickness of the dam glue retaining wall 41 carried by the gasket retaining wall 31 is the thickness of the dam glue retaining wall 41 on the top surface (parallel to the surface of the circuit board 10) of the gasket retaining wall 31, that is, the thickness of the second part 412.

[0077] ​In some embodiments of the present application, the width of the gasket barrier 31 in the direction parallel to the circuit board 10 is a, and the width of the dam adhesive barrier 41 in the direction parallel to the circuit board 10 is b, where a < b, and both a and b are less than or equal to a preset value, which is the width of the liquid state dam adhesive barrier 41 when the liquid state dam adhesive barrier 41 is coated on the circuit board 10, and the thickness of the liquid state dam adhesive barrier 41 is the same as that of the blue light Mini-LED chip 21.

[0078] In related technologies, when preparing a blue light Mini-LED lamp panel, in order to ensure the anti-crosstalk effect, a dam adhesive barrier is arranged around the blue light Mini-LED chip on the circuit board, and the height of the dam adhesive barrier is slightly greater than the height of the blue light Mini-LED chip (e.g., greater than 1 / 10 to 1 / 5 of the height of the blue light Mini-LED chip). At this time, the width of the dam adhesive barrier is a first width, and when the dam adhesive barrier has the first width, the strip-shaped shadow problem can be better improved, and the light efficiency of the blue light Mini-LED lamp panel can be avoided. According to the aforementioned proportional relationship between the width and the height of the dam adhesive barrier 41, when the height of the dam adhesive barrier 41 is equal to the height of the blue light Mini-LED chip 21, the second width of the dam adhesive barrier 41 is less than the first width, and the second width can further improve the strip-shaped shadow problem and improve the light efficiency of the lamp panel.

[0079] In the white light Mini-LED lamp panel provided by the embodiments of the present application, the preset value is the width of the liquid state dam adhesive barrier 41 when the liquid state dam adhesive barrier 41 is coated on the circuit board 10, and the thickness of the liquid state dam adhesive barrier 41 is the same as that of the blue light Mini-LED chip 21, that is, the preset value is equal to the second width, and less than the first width. Therefore, by arranging the gasket layer 30, and by making the width of the gasket layer 30 and the width of the dam adhesive barrier 41 in the direction parallel to the circuit board 10 less than or equal to the preset value, the strip-shaped shadow problem can be further improved, and the light efficiency of the lamp panel can be improved. In addition, it should be noted that the width of the gasket barrier 31 in the direction parallel to the circuit board 10 is less than or equal to the width of the dam adhesive barrier 41 in the direction parallel to the circuit board 10, because the width of the additionally arranged gasket layer 30 is too large, which can cause a new strip-shaped shadow problem.

[0080] In some embodiments of the present application, a < b, wherein the cross-sectional shape of the cushion barrier wall 31 is a trapezoid-like shape, the ratio of the height of the trapezoid-like shape to the absolute value of the difference between the upper and lower bases is n, 1.75 > n > m, and the damming glue barrier wall 41 covers the cushion barrier wall 31.

[0081] In the white light Mini-LED lamp panel provided by the embodiments of the present application, a < b, that is, the width of the cushion barrier wall 31 in the direction parallel to the circuit board 10 is smaller than the width of the damming glue barrier wall 41 in the direction parallel to the circuit board 10, so that the damming glue layer 40 on the cushion layer 30 can be in contact with the circuit board 10 by covering the cushion barrier wall 31 with the damming glue barrier wall 41, thereby keeping the damming glue layer 40, the circuit board 10 and the cushion layer 30 relatively fixed and improving the assembly stability between the structural components in the white light Mini-LED lamp panel.

[0082] In addition, in the white light Mini-LED lamp panel provided by the embodiments of the present application, the cross-sectional shape of the cushion barrier wall 31 is a trapezoid-like shape, and the ratio of the height of the trapezoid-like shape to the absolute value of the difference between the upper and lower bases is greater than the ratio of the thickness to the width of the damming glue barrier wall 41 and less than 1.75, that is, the average inclination of the side wall of the cushion barrier wall 31 is greater than the average inclination of the side wall of the damming glue barrier wall 41 in a fluid state, so that the width of the damming glue barrier wall 41 arranged on the top surface of the cushion barrier wall 31 is as large as possible, and the covering effect of the damming glue barrier wall 41 on the cushion barrier wall 31 and the contact area between the damming glue barrier wall 41 and the circuit board 10 are taken into account, thereby ensuring the reflection effect and structural stability.

[0083] It should be noted that the trapezoid-like shape means that the cushion barrier wall 31 has upper and lower bases consistent with a trapezoid, and the "waist" of the trapezoid-like shape can be an arc (see Figure 10 ) or a multi-segment arc (not shown in the figure), that is, the side wall of the cushion barrier wall 31 can be an arc surface or an uneven surface including multiple arc surfaces, and such an arc surface design helps to improve the adhesion stability of the damming glue barrier wall 41 on the side wall of the cushion barrier wall 31 in the case that the side wall of the cushion barrier wall 31 has a large inclination angle, thereby improving the reflection effect of the damming glue barrier wall 41 and the light extraction efficiency of the white light Mini-LED lamp panel.

[0084] In summary, the application provides a white light Mini-LED lamp panel and a preparation method thereof. The white light Mini-LED lamp panel comprises a circuit board, a plurality of white light Mini-LED light emitting units, a pad layer and a dam glue layer. The plurality of white light Mini-LED light emitting units are arranged in an array on one side of the circuit board. The white light Mini-LED light emitting unit comprises a blue light Mini-LED chip and a color conversion layer arranged on the blue light Mini-LED chip. The pad layer is arranged on the circuit board. The pad layer comprises a plurality of pad barrier walls arranged in a cross shape. The dam glue layer is arranged on the pad layer and in contact with the circuit board. The dam glue layer comprises a plurality of dam glue barrier walls and a plurality of light emitting unit areas defined by the plurality of dam glue barrier walls. A fixed number of white light Mini-LED light emitting units are arranged in each light emitting unit area. The thickness of the dam glue layer carried by the pad layer in the direction perpendicular to the bearing surface of the pad layer is less than the thickness of the white light Mini-LED light emitting unit in the direction perpendicular to the circuit board. The height of the dam glue layer in the direction perpendicular to the circuit board is greater than the height of the white light Mini-LED light emitting unit in the direction perpendicular to the circuit board. The white light Mini-LED lamp panel provided by the application can avoid the generation of strip-shaped dark shadows in the white light Mini-LED lamp panel, while taking into account the anti-crosstalk effect of the dam glue layer on the LED lamp beads containing the color conversion layer, thereby improving the optical effect of the white light Mini-LED lamp panel.

[0085] The above describes in detail a white light Mini-LED lamp panel and a preparation method thereof provided by the application. The principles and implementation modes of the application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation mode and application range will be changed. In summary, the content of the specification should not be understood as a limitation of the application.

Claims

1. A white Mini-LED light panel, characterized in that, The white Mini-LED light panel includes: Circuit board; Multiple white Mini-LED light-emitting units are arrayed on one side of the circuit board. Each white Mini-LED light-emitting unit includes a blue Mini-LED chip and a color conversion layer disposed on the blue Mini-LED chip. A padding layer is disposed on the circuit board, the padding layer comprising a plurality of padding barriers arranged in a cross manner; A dammed adhesive layer is disposed on the padding layer and in contact with the circuit board. The dammed adhesive layer includes multiple dammed adhesive barriers and multiple light-emitting unit areas defined by the multiple dammed adhesive barriers. Each light-emitting unit area is provided with a fixed number of white Mini-LED light-emitting units. Wherein, the thickness of the dammed adhesive layer supported by the padding layer in the direction perpendicular to the bearing surface of the padding layer is less than the thickness of the white Mini-LED light-emitting unit in the direction perpendicular to the circuit board, and the height of the dammed adhesive layer in the direction perpendicular to the circuit board is greater than the height of the white Mini-LED light-emitting unit in the direction perpendicular to the circuit board.

2. The white Mini-LED light panel according to claim 1, characterized in that, The thickness to width ratio of the dam retaining wall supported by the pad retaining wall is m, where m ≤ 0.

4.

3. The white Mini-LED light panel according to claim 2, characterized in that, The width of the padding barrier in the direction parallel to the circuit board is 'a', and the width of the damming adhesive barrier in the direction parallel to the circuit board is 'b', where a ≤ b, and both a and b are less than or equal to a preset value. The preset value is the width of the liquid damming adhesive barrier when it is coated on the circuit board and the thickness of the liquid damming adhesive barrier is the same as that of the blue Mini-LED chip.

4. The white Mini-LED light panel according to claim 3, characterized in that, a < b, wherein the cross-sectional shape of the pad retaining wall is trapezoidal, the ratio of the absolute value of the difference between the height and the upper and lower bases of the trapezoidal shape is n, 1.75 > n > m, and the dam retaining wall covers the pad retaining wall.

5. The white Mini-LED light panel according to claim 4, characterized in that, The material of the padding layer is the same as that of the substrate of the circuit board.

6. The white Mini-LED light panel according to claim 3, characterized in that, a=b, wherein the padding retaining wall includes a connecting and fixing groove, the connecting and fixing groove penetrates the padding retaining wall in a direction perpendicular to the circuit board, the width of the connecting and fixing groove is less than the width of the padding retaining wall, the dam retaining wall includes a first part and a second part, the first part fills the connecting and fixing groove, and the second part is disposed on the surface of the padding retaining wall on the side away from the circuit board.

7. The white Mini-LED light panel according to claim 6, characterized in that, The padding layer is made of a transparent material; the angle between the sidewall of the connecting and fixing groove and the orthographic projection of the sidewall of the connecting and fixing groove on the circuit board is an acute angle.

8. The white Mini-LED light panel according to claim 6, characterized in that, The padding layer includes an opaque substrate and a reflective coating disposed on the sidewall of the substrate, wherein the sidewall of the connecting and fixing groove is perpendicular to the circuit board.

9. A method for preparing a white Mini-LED light panel, characterized in that, The method for preparing the white Mini-LED lamp board includes the following steps: Multiple white Mini-LED light panel arrays are arranged on a circuit board, wherein the white Mini-LED light-emitting unit includes a blue Mini-LED chip and a color conversion layer disposed on the blue Mini-LED chip; Positioning holes are formed at at least two corners of the circuit board, a padding layer is disposed on the circuit board, and positioning posts on the padding layer are embedded in the positioning holes, wherein the padding layer includes a plurality of padding walls arranged in a cross pattern. A dammed adhesive layer is formed on the padding layer and cured. The dammed adhesive layer includes multiple dammed adhesive walls and multiple light-emitting unit areas defined by the multiple dammed adhesive walls. Each light-emitting unit area is provided with a fixed number of white Mini-LED light-emitting units. The thickness of the dammed adhesive layer supported by the padding layer in the direction perpendicular to the bearing surface of the padding layer is less than the thickness of the white Mini-LED light-emitting units in the direction perpendicular to the circuit board. The height of the dammed adhesive layer in the direction perpendicular to the circuit board is greater than the height of the white Mini-LED light-emitting units in the direction perpendicular to the circuit board.

10. A white Mini-LED light panel, characterized in that, The white Mini-LED chip includes: A circuit board, comprising a circuit board body and a padding layer, the padding layer comprising a plurality of padding barriers arranged in a cross manner; Multiple white Mini-LED light-emitting units are arrayed on one side of the circuit board. Each white Mini-LED light-emitting unit includes a blue Mini-LED chip and a color conversion layer disposed on the blue Mini-LED chip. A dammed adhesive layer is disposed on the padding layer and covers the padding layer. The dammed adhesive layer includes a plurality of dammed adhesive retaining walls and a light-emitting unit area defined by the plurality of dammed adhesive retaining walls. A fixed number of white Mini-LED light-emitting units are disposed in each light-emitting unit area. Wherein, the thickness of the dammed adhesive layer supported by the padding layer in the direction perpendicular to the bearing surface of the padding layer is less than the thickness of the white Mini-LED light-emitting unit in the direction perpendicular to the circuit board, and the height of the dammed adhesive layer in the direction perpendicular to the circuit board is greater than the height of the white Mini-LED light-emitting unit in the direction perpendicular to the circuit board.

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