Heat dissipation mechanism, heat dissipation module and antenna device comprising heat dissipation mechanism and heat dissipation module

Abstract

The present invention relates to a heat dissipation mechanism, a heat dissipation module, and an antenna device including the heat dissipation mechanism, the heat dissipation mechanism comprising: a heat storage part for collecting heat generated from a heat generating body; and a heat release unit that exchanges heat collected from the heating element with outside air, in which at least one of the heat storage units is coupled by a heat collection unit and is coupled to the case main body in which the heating element is provided, the heat collection unit comprising: a heat transfer body for coupling; a plurality of fixing slots into which a part of at least one heat accommodating part is inserted are formed; and a shield cover coupled to the coupling heat transfer body, forming a predetermined refrigerant filling space therein, and sealing the refrigerant filling space.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, and more particularly, to a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which can improve heat dissipation performance of an electronic device including an antenna device, which is severely operated. BACKGROUND

[0002] Wireless communication technology (for example, Multiple Input Multiple Output (MIMO) technology) is a technology that greatly increases data transmission capacity by using multiple antennas, and is a spatial multiplexing technology that transmits different data from each of the transmission antennas in the transmitter and distinguishes the transmitted data through appropriate signal processing in the receiver.

[0003] Therefore, as the number of transceiving antennas is simultaneously increased, the channel capacity is increased, so that more data can be transmitted. For example, if the number of antennas is increased to 10, about 10 times the channel capacity is obtained by using the same frequency band compared to the current single antenna system.

[0004] Up to 8 antennas are used in 4G-advanced Long Term Evolution (LTE-advanced), products installed with 64 or 128 antennas have been developed in the pre-5G stage, and base station equipment with a larger number of antennas is used in 5G, which is called Massive MIMO technology. In contrast to the current Cell operation, which is two-dimensional (2-Dimension), if the Massive MIMO technology is introduced, three-dimensional beamforming (3D-Beamforming) can be achieved, so it is also called Full Dimension Multiple Input Multiple Output technology (FD-MIMO).

[0005] In the Massive MIMO technology, as the number of ANT increases, the number of transmitters and filters also increases.

[0006] However, considering the space limitation of the installation site, the demand for reducing the weight and size of electronic devices such as a radio unit (RU) is increasing, and at the same time, in order to expand the coverage of Massive MIMO, the demand for a high-power RU having a transmission power of 320W or 640W is also increasing. However, the weight and size of the heat dissipation mechanism for coping with the power consumption and heat generation due to a high-power RF component (for example, a power amplifier (PA)) also have to be increased, which acts as a negative factor in reducing the weight and size of the electronic devices such as the RU.

[0007] In particular, recently, not only for the antenna device, but also for electronic devices and the like that are electrically driven, research for effectively cooling the operating system heat while optimizing the performance and preventing explosion accidents and the like caused by overheating is actively being conducted.

[0008] However, in order to facilitate heat exchange with external air, the operating system adopts a structure that dissipates heat by moving heat from a heat generating element (heat generating body) inside to a material having a high thermal conductivity to the outside and then exchanging heat with the external air, but there is a problem in that it is limited by the thermal conductivity of the material of the cooling medium itself.

[0009] Therefore, recently, in order to adjust the radiation direction of the radiation beam in a site where the antenna device is installed, the antenna unit as an object of tilting or steering operation is individually separated to achieve light weight, and the heat generating body is concentrated and disposed in a radio unit (RU) fixed to a fixed structure such as a support pole, and research for improving the heat dissipation performance is actively being conducted. SUMMARY

[0010] The present application has been made to solve the above technical problems, and aims to provide a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which effectively release heat generated from electronic devices such as an antenna device while preventing an increase in the weight and size of an antenna unit that needs to be directionally adjusted, thereby also improving the operability in the field.

[0011] Further, another object of the present application is to provide a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which can overcome the limitation of an increase in the heat dissipation surface area due to the thermal conductivity of the material itself and can design a heat dissipation structure of various shapes.

[0012] In addition, another object of the present application is to provide a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which can improve production efficiency of a product by performing bonding between a heat trapping portion and a heat accommodation portion and sealing bonding of a refrigerant through a simple process.

[0013] The technical problems of the present application are not limited to the above-mentioned technical problems, and other technical problems not mentioned above can be clearly understood by those skilled in the art to which the present application pertains through the following description.

[0014] The heat dissipation mechanism according to an embodiment of the present application includes a heat accommodation portion trapping heat generated from a heat generating body, and a heat release portion performing heat exchange between heat trapped from the heat generating body and external air, wherein at least one of the heat accommodation portions is bonded and mediates bonding to a housing body equipped with the heat generating body through a heat trapping portion including a bonding heat transfer body formed with a plurality of fixing slots into which a portion of the at least one heat accommodation portion is inserted, and a shield cover bonded to the bonding heat transfer body, forming a predetermined refrigerant filling space inside and sealing the refrigerant filling space.

[0015] In this case, when a portion of the at least one heat accommodation portion is joined in a state of being inserted into the plurality of fixing slots, the bonding heat transfer body and the shield cover seal the refrigerant filling space.

[0016] In addition, the joining can be performed through any one of a brazing process and a laser welding process.

[0017] In addition, the heat trapping portion can further include a plurality of support pins equipped to be supported at one end to the shield cover and at the other end to between the plurality of fixing slots adjacent to each other.

[0018] In addition, in the bonding heat transfer body, a welding rod can be applied along an inner side end portion of the fixing slots, and when joining is performed through the brazing process, the welding rod flows down in a direction of gravity to seal between the fixing slots and an outer side of the heat accommodation portion.

[0019] In addition, the bonding heat transfer body can be equipped with a plurality of rigid reinforcement site portions protruding toward the shield cover side along between the fixing slots, and the shield cover can be equipped with a plurality of welding site portions protruding toward the bonding heat transfer body side as positions corresponding to the plurality of rigid reinforcement site portions, and when joining is performed through the brazing process, the plurality of rigid reinforcement site portions and the plurality of welding site portions are joined to each other by a welding rod applied to the plurality of rigid reinforcement site portions.

[0020] Further, the welding rod can be further coated along the edge end of the heat transfer body in addition to the fixing slot or the rigid reinforcing site portion.

[0021] Further, the welding rod can be further coated along the edge end of the heat transfer body in addition to the fixing slot or the rigid reinforcing site portion.

[0022] Further, the welding rod can be further coated along the edge end of the heat transfer body in addition to the fixing slot or the rigid reinforcing site portion.

[0023] A heat dissipation module according to an embodiment of the present application includes a heat dissipation mechanism including a heat receiving portion that traps heat generated from a heat generating body and a heat releasing portion that exchanges heat trapped from the heat generating body with external air, and a heat trapping portion that forms a substrate receiving portion to receive a PA board at one surface, forms a plurality of fixing slots to dispose the heat dissipation mechanism at the other surface, and internally fills a heat transfer body capable of phase change, the heat trapping portion including a heat transfer body formed with a plurality of fixing slots into which a portion of at least one heat receiving portion is inserted, and a shield cover coupled to the heat transfer body, internally forming a predetermined refrigerant filling space, and sealing the refrigerant filling space.

[0024] In which, when a portion of at least one heat receiving portion is coupled in a state of being inserted into the plurality of fixing slots, the heat transfer body can seal the refrigerant filling space with the shield cover.

[0025] Further, in the heat transfer body, a welding rod can be coated along the inner end of the fixing slot, and when coupling is performed through the brazing process, the welding rod flows down in the direction of gravity to seal between the fixing slot and the outer side of the heat receiving portion.

[0026] Further, in the heat transfer body, a welding rod can be coated along the inner end of the fixing slot, and when coupling is performed through the brazing process, the welding rod flows down in the direction of gravity to seal between the fixing slot and the outer side of the heat receiving portion.

[0027] Further, in the heat transfer body, a welding rod can be coated along the inner end of the fixing slot, and when coupling is performed through the brazing process, the welding rod flows down in the direction of gravity to seal between the fixing slot and the outer side of the heat receiving portion.

[0028] An antenna device according to an embodiment of the present application includes a housing body formed with a disposition space in which an RF filter portion is disposed, and a heat dissipation module coupled to a front surface portion or a rear surface portion of the housing body, wherein the heat dissipation module includes a heat dissipation mechanism including a heat receiving portion that receives heat generated from a heat generating body and a heat releasing portion that exchanges heat received from the heat generating body with external air, and a heat receiving portion that forms a PA board receiving portion on one surface to receive a PA board, forms a plurality of fixing slots on another surface to dispose the heat dissipation mechanism, and is internally filled with a coupling heat transfer body in which a refrigerant capable of undergoing a phase change is filled, wherein the heat receiving portion includes a coupling heat transfer body formed with a plurality of fixing slots into which a portion of the heat receiving portion is inserted, and a shield cover coupled to the coupling heat transfer body, internally forms a predetermined refrigerant filling space, and seals the refrigerant filling space.

[0029] The housing body can include a center housing formed with the disposition space in which the RF filter portion is disposed, a front heat dissipation housing coupled to a front surface portion of the center housing, and a rear heat dissipation housing coupled to a rear surface portion of the center housing, and the heat dissipation module can include a front heat dissipation module disposed in the front heat dissipation housing, and a rear heat dissipation module disposed in the rear heat dissipation housing, wherein a plurality of module coupling slots mediating coupling of the front heat dissipation module and the rear heat dissipation module can be formed in the front heat dissipation housing and the rear heat dissipation housing.

[0030] Further, when the heat receiving portion is arranged to overlap in a front-rear direction with respect to the front surface portion or the rear surface portion of the housing body, the heat releasing portion of the front heat dissipation module and the rear heat dissipation module can extend upward more than an upper end of the housing body, and extend to occupy at least a portion of a heat exchange region corresponding to a straight upward direction of a front-rear thickness direction of the housing body.

[0031] Further, the upper end portion of the housing body can further include a guide panel formed with a plurality of guide slots into which upper end portions of the heat dissipation mechanisms of the front heat dissipation module and the rear heat dissipation module are inserted.

[0032] The heat dissipation mechanism, the heat dissipation module, and the antenna device including the same according to an embodiment of the present application have an effect of effectively releasing heat generated from an electronic device including the antenna device while preventing an increase in weight of the entire product, thereby being capable of improving operability in the field.

[0033] In addition, the heat dissipation mechanism, the heat dissipation module, and the antenna device including the heat dissipation mechanism and the heat dissipation module according to an embodiment of the present application have the following effects: the heat dissipation mechanism can overcome the limitation of the heat conduction of the material itself, and when designed in a manner of increasing the heat dissipation surface area, the heat dissipation mechanism can inhibit the expansion of the size of the product.

[0034] In addition, the heat dissipation mechanism according to an embodiment of the present application can perform the combination between the heat trapping portion and the heat accommodation portion and the refrigerant sealing combination through a simple process, and thus the production efficiency of the product can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0036] Figure 2 are Figure 1a and Figure 1b front views.

[0037] Figure 3 are Figure 1a and Figure 1b side views.

[0038] Figure 4a and Figure 4b are front and rear perspective views showing a state in which the back clamping portion is mounted.

[0039] Figure 5a and Figure 5b are exploded perspective views of the back clamping portion of Figure 4a and Figure 4b

[0040] Figure 6 is a perspective view showing a state in which the side surface clamping portion is mounted.

[0041] Figure 7a and Figure 7b are Figure 1a and Figure 1b overall exploded perspective views.

[0042] Figure 8 is an exploded perspective view of a finger guard assembly in the structure of Figure 1a

[0043] Figure 9 is a front and rear perspective view showing an arrangement state of a heat dissipation mechanism according to an embodiment of the present application.

[0044] Figure 10a and Figure 10b are Figure 9 front and rear exploded perspective views.​​

[0045] Figure 11 is a perspective view showing a heat dissipation mechanism according to an embodiment of the present application.

[0046] Figure 12a and Figure 12b is a rear side and front side exploded perspective view for explaining a joining process of a heat dissipation mechanism according to another embodiment of the present application.

[0047] Figure 13 is a sectional view for explaining a joining state with a heat trapping portion generated by a brazing process.

[0048] Figure 14 is an exploded perspective view for explaining a joining state with a heat trapping portion achieved by a brazing process.

[0049] Figure 15 is a perspective view of a state in which a finger guard assembly is removed from a structure of Figure 8

[0050] Figure 16a and Figure 16b is a front side and rear side exploded perspective view of a front heat dissipation module combined with a front surface portion of a housing main body in a structure of Figure 15

[0051] Figure 17 is a sectional perspective view taken along the A-A line of Figure 2

[0052] Figure 18 as a sectional view taken along the line A-A of Figure 2

[0053] Figure 19 is an exploded perspective view showing a setting state of a front heat dissipation housing, a heat dissipation mechanism, and a front heat dissipation module with respect to a center housing in a structure of FIG. 1.

[0054] Symbol Explanation 1: Radio unit 10: Finger guard assembly 20: Back surface setting bracket 20h-1: Screw fastening hole 25: Screw through hole 27: Fixing screw 30: Clamping portion 30R: Back surface clamping portion 30S: Side surface clamping portion 31: First fixing plate portion 32: Second fixing plate portion 33: Clamping rod 34: Double head bolt 35: Bolt guide rod ​​​​40: guide panel 41: guide slot 50: heat exchange region 100: housing main body 110C: center housing 110F: front heat dissipation housing 10R: rear heat dissipation housing 120: RF filter section 121: filter main body 122: resonator 123: filter tuning cover 124: engraved portion 130F: front plate (PSU plate) 130R: rear plate (PBA) 140A: front plate setting groove 140B: rear plate setting groove 200: heat dissipation module 200A: front heat dissipation module 200B: rear heat dissipation module 205: refrigerant flow space 210: heat dissipation mechanism 210-1: one side heat conducting plate 210-2: other side heat conducting plate 210-F1: first refrigerant flow path 210-F2: second refrigerant flow path 210-F3: inclined guide 210-F4: joint portion 211: heat receiving portion 212: heat releasing portion 220: heat trapping portion 221: heat transfer body for bonding 222: shield cover 222b: spot for welding 223: PA plate 230: welding rod 230a: inner side welding rod 230b: edge welding rod 230c: welding rod for fixing slot DETAILED DESCRIPTION

[0055] Hereinafter, a heat dissipation mechanism, a heat dissipation module, and an antenna device including the heat dissipation mechanism and the heat dissipation module according to an embodiment of the present application will be described in detail with reference to the accompanying drawings.

[0056] Note that, when assigning reference numerals to constituent elements of each drawing, the same reference numeral is assigned as much as possible even if it is shown on different drawings. Further, in explaining the present application, in a case where it is judged that a detailed explanation of a related known structure or function hinders the understanding of the embodiment of the present application, the detailed explanation is omitted.

[0057] In describing the components of the embodiments of the present application, the terms first, second, A, B, (a), (b), and the like can be used. These terms are used only to distinguish one component from another component, and the nature, order, or sequence of the corresponding components is not limited by these terms. Also, unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meanings as those generally understood by those having ordinary knowledge in the art to which the present application pertains. The terms defined in commonly used dictionaries should be interpreted as having a meaning that is the same as, or similar to, the meaning of the relevant technology in the context of the present application, and are not to be interpreted as having ideal or over-abstracted meanings unless clearly defined in the present application.

[0058] Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 2 are Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 3 are Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 4a and Figure 4b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 5a and Figure 5b are exploded perspective views of the back clamping portion of Figure 4a and Figure 4b are exploded perspective views of the back clamping portion of Figure 6 are perspective views showing a state in which a side surface clamping portion is installed.

[0059] As shown in FIGS. 1 to Figure 9 A heat dissipation mechanism 210 according to an embodiment of the present application is provided in a radio unit 1 in an example of an electronic device, and performs a function of receiving and dissipating heat from a heat generating body (not shown) that generates system heat by being provided in the inside of the radio unit 1 and being operated.

[0060] Among them, if the electronic device has an internal configuration similar to the above-mentioned heat generating body, it is a concept including various devices, but hereinafter, for the convenience of explanation, an antenna device (or radio unit 1) as an important product in the business operated by the applicant of the present application is used as an application example and is explained.

[0061] In particular, before describing an embodiment of the present application, a combination of the plurality of heat dissipation devices 210 described later is defined as a "heat dissipation module 200", and thus a product provided with the plurality of heat dissipation devices 210 and the plurality of heat dissipation modules 200 is defined as an "antenna device (or radio unit 1)". However, the antenna device 1 therein can be understood to mean only a radio unit other than an antenna unit that is a collection of antenna radiating elements.

[0062] Further, as a kind of heat generating body equipped in the inside of the electronic device and electrically driven, a semiconductor can be exemplified as representative, but is not limited thereto, and each internal driving element of an RF part of an antenna device for communication, a display, an energy storage device (ESS), artificial intelligence (AI), and other electric and electronic devices is not excluded.

[0063] An electronic device to which the heat dissipation mechanism 210 according to an embodiment of the present application is applied is adopted as a radio unit 1 that is one of antenna devices, and as described later, is described by adopting a heat generating body as a PA (Power Amplifier) element 223a mounted on a PA board 223.

[0064] The radio unit 1 to which the heat dissipation mechanism 210 according to an embodiment of the present application is applied is a configuration that functions as a repeater in a base station antenna device, and can substantially separately provide an antenna unit (Antenna Unit) provided with an antenna radiating element that forms and emits an antenna beam, thereby reducing the weight of a single product and improving the operating environment on site.

[0065] Among them, unlike an antenna unit not shown, the radio unit 1 does not need tilting or turning adjustment for setting the direction of the radiating beam, but only needs to stably fix a structure such as a support pole P described later, and from this point of view, reflectively provides the benefit of being able to manufacture a lightweight antenna unit that requires installation at a higher place.

[0066] As Figures 1a to 2 As described above, the radio unit 1 can further include a finger guard plate assembly 10 equipped to surround the heat dissipation mechanism 210 according to an embodiment of the present application described later, thereby preventing injury such as burns of an operator. The specific configuration and coupling structure of the finger guard plate assembly 10 will be described in more detail later.

[0067] In addition, as shown in FIGS. 1 to Figure 9As shown, the radio unit 1 may include an RF filter section 120, a fixed housing body 100 mediating the RF filter section 120, and a heat dissipation mechanism 210 according to an embodiment of the present invention, which is attached to the housing body 100.

[0068] Among them, such as Figures 4a to 5b and Figure 6 As shown, the radio unit 1 can be stably mounted on the support pole P via the clamping part 30.

[0069] like Figures 4a to 5b As shown, the clamping part 30 may include: a back clamping part 30R, which is provided on the back of the radio unit 1 and mounts the radio unit 1 to the support rod P; and a side surface clamping part 30S, which is provided on the side surface of the radio unit 1 and mounts the radio unit 1 to the support rod P.

[0070] The back of the housing body 100 is not exposed to the outside by the finger guard assembly 10, so the back clamping part 30R can be further equipped with a back mounting bracket 20, so that the finger guard assembly 10 in the housing body 100 can also mediate the setting of the exposed left and right surfaces.

[0071] For reference, the side surface clamping part 30S can be directly attached to either the left or right side surface of the housing body 100, which is exposed and not hidden by the finger guard assembly 10, without the aforementioned medium structure.

[0072] like Figure 5a As shown, the rear mounting bracket 20 is spaced parallel to the rear part of the radio unit 1 in the left and right horizontal direction and extends therefrom, and both ends are bent forward and extended. The rear mounting bracket 20 can be fixed to the radio unit 1 by means of clamp fixing screws 27 passing through the screw through holes 25 formed at both ends and fastening them into the screw fastening holes 117 formed on the left and right sides of the housing body 100.

[0073] Furthermore, since the only difference between the back clamping portion 30R and the side surface clamping portion 30S is whether or not the aforementioned back-side bracket 20 is mediated, while the rest of the structure is the same, the following will refer to... Figure 5a and Figure 5b Only the back clamping part 30R will be described in detail. The description of the side surface clamping part 30S will be replaced by a structural description of the back clamping part 30R.

[0074] like Figure 5a and Figure 5bAs shown, the back clamping part 30R may include: a first fixing plate part 31, which is fixed to the back of the bracket 20; a second fixing plate part 32, which is tightly connected to the back of the first fixing plate part 31; and a clamping rod 33, which is formed in four protrusions 32a at the four corners of the back of the second fixing plate part 32, and is connected to the left and right protrusions 32a by a pair of double-headed bolts 34, and is equipped to surround the support rod P.

[0075] The first fixing plate portion 31 is manufactured in a single specification that allows the bracket 20 provided on the back of the radio unit 1 or the side surface portion of the radio unit 1 (for the side surface clamping portion 30S) to be provided on the back of the radio unit 1. Regardless of the size (diameter, etc.) of the support rod P, the second fixing plate portion 32, which is manufactured in various specifications, can usually be fixed to the radio unit 1.

[0076] Unlike the first fixing plate part 31, which is manufactured in a single specification, the second fixing plate part 32 can be manufactured in multiple specifications according to the size (diameter, etc.) of the support rod P to which it is to be installed, as described above. It can be selected and combined with the first fixing plate part 31 according to the specification of the support rod P.

[0077] At least one pair of screw through holes 31h-1 are formed at the upper end and the lower end of the first fixing plate portion 31, respectively. By passing multiple assembly screws 37s-1 through the screw through holes 31h-1 and tightening the screw fastening holes 20h-1 pre-formed on the back support 20, the first fixing plate portion 31 can be fixed to the back support 20.

[0078] In addition, fitting grooves 31a are formed on the left and right ends of the back side of the first fixing plate portion 31 for fitting the fitting rib 32b protruding forward from the second fixing plate portion 32. With the fitting rib 32b fitted into the fitting groove 31a, the second fixing plate portion 32 is firmly fixed relative to the first fixing plate portion 31 by means of the plate assembly screws 37s-2.

[0079] Therefore, in the upper part of the first fixing plate portion 31, a screw through hole 31h-2 through which the plate assembly screw 37s-2 passes is formed in the upper part where the fitting groove 31a is formed, and a screw fastening hole 32h-2 for the plate assembly screw 37s-2 to be fastened is formed in the upper part of the fitting rib 32b of the second fixing plate portion 31.

[0080] In cases where the second fixing plate portion 32 is manufactured in various specifications according to the size of the support rod P, the aforementioned fitting rib 32b and fitting groove 31a will also be formed in the same specifications, and the first fixing plate portion 31 can be universally combined with the second fixing plate portion 32 in various specifications.

[0081] In addition, the clamping rod 33 may include an upper clamping rod 30U relatively located on the upper side and a lower clamping rod 30D relatively located on the lower side.

[0082] Among them, the upper clamping rod 30U and the lower clamping rod 30D are generally formed in a "C" shape with one side open, and surround one side of the outer peripheral surface of the support rod P. At the same time, a double-headed bolt 34 penetrating both end portions in the front-rear direction can fasten the bolt fastening bosses 32a formed at the respective corner end portions on the back surface side of the second fixed plate portion 32 through a bolt guide rod 35. Among them, the bolt guide rod 35 can be inserted into connection bosses 33a provided at both end portions of the clamping rod 33.

[0083] Clamping gears 36 for clamping the outer surface of the support rod P are respectively provided at the upper end portion and the lower end portion of the back surface of the second fixed plate portion 32, the upper clamping rod 30U, and the lower clamping rod 30D to adjust the amount of protrusion to the outside.

[0084] The clamping gears 36 are respectively provided as a pair at intervals in the up-down direction, so that clamping can be performed at four positions on the outer peripheral surface of at least one support rod P.

[0085] In addition, as Figure 6 shown, as described above, the side surface clamping portion 30S fastens the structure equivalent to the first fixed plate portion 31 to the screw fastening holes 117 formed in the left side surface and the right side surface of the housing body 100 by using assembly screws 27 without a direct mediating structure such as the back surface setting bracket 20. From this point of view, it has been explained that the side surface clamping portion 30S is different from the back surface clamping portion 30R.

[0086] Figure 7a and Figure 7b are Figure 1a and Figure 1b overall exploded perspective views of Figure 8 is an exploded Figure 1a exploded perspective view of the finger guard plate assembly in the structure of

[0087] As Figure 7a and Figure 7b shown, the housing body 100 may include: a central housing 110C equipped with a setting space for setting an RF filter unit 120 described later; a front heat dissipation housing 110F provided at the front surface portion of the central housing 110C and mediating the setting of a front heat dissipation module 200A configured in a module form by combining a plurality of heat dissipation mechanisms 210 according to an embodiment of the present invention; and a rear heat dissipation housing 110R provided at the back surface portion of the central housing 110C and mediating the setting of a rear heat dissipation module 200B configured in a module form by combining a plurality of heat dissipation mechanisms 210 according to an embodiment of the present invention.

[0088] That is, as shown in Figure 7a and Figure 7b The radio unit 1 includes a housing main body 100, a front heat dissipation module 200A arranged at a front portion of the housing main body 100, and a rear heat dissipation module 200B arranged at a rear portion of the housing main body 100, and thus it is known that the front heat dissipation module 200A and the rear heat dissipation module 200B are combined in a module form by a plurality of heat dissipation mechanisms 210 according to an embodiment of the present application.

[0089] Also, as shown in Figure 7a and Figure 7b The radio unit 1 can further include an RF filter portion 120.

[0090] The RF filter portion 120 can include a filter main body (refer to reference numeral "121" of FIG. 16) of a cavity filter type equipped with a plurality of resonators (refer to reference numeral "122" of FIG. 16) inside. However, the RF filter portion 120 is not necessarily limited to the cavity filter type, and it is also not problematic to be equipped as a waveguide filter type.

[0091] As a reference, as shown in FIG. 16 to be described later, one side of the filter main body 121 forming a cavity forms an opening, and one side of the opening can be shielded by a filter tuning cover 123 provided with a plurality of engraved portions 124 for micro-frequency tuning.

[0092] The housing main body 100 is formed in a quadrangular frame shape, and can include a center housing 110C formed to be penetrated in a front-rear direction to provide the RF filter portion 120, and a front heat dissipation housing 110F and a rear heat dissipation housing 110R coupled to a front surface portion and a rear surface portion of the center housing 110C, respectively.

[0093] The front heat dissipation housing 110F and the rear heat dissipation housing 110R are coupled to the front surface portion and the rear surface portion of the center housing 110C in which the RF filter portion 120 is provided, respectively, and a plurality of heat sink fins 115F, 115R for performing external heat dissipation by heat exchange with external air can be integrally formed at the front surface portion of the front heat dissipation housing 110F and the rear surface portion of the rear heat dissipation housing 110R, respectively.

[0094] The front heat dissipation housing 110F and the rear heat dissipation housing 110R can be equipped in a plate form having substantially the same size as that of the center housing 110C, and can be formed to have a size capable of completely covering the front surface and the rear surface of the center housing 110C penetrated in the front-rear direction.

[0095] At the lower end of each of the front surface of the same front heat sink 110F and the back surface of the same rear heat sink 110R, a plurality of heat sink fins 115F, 115R may be integrally formed.

[0096] The multiple radiator fins 115F and 115R formed on the front surface of the front heat dissipation housing 110F and the back surface of the rear heat dissipation housing 110R can be formed in a relatively long vertical direction, and are configured such that when the released heat forms an upward airflow, it will not be interfered with by the adjacent radiator fins 115F and 115R and thus will not generate flow resistance.

[0097] In addition, the plurality of radiator fins 115F, 115R may include a front radiator fin 115F that protrudes forward from the front surface of the plate-shaped front radiator housing 110F and a rear radiator fin 115R that protrudes rearward from the rear surface of the plate-shaped rear radiator housing 110R.

[0098] The front heat sink 110F and the rear heat sink 110R are made of a thermally conductive material (metallic material) that can transfer a predetermined amount of heat. The front heat sink fins 115F and the rear heat sink fins 115R are also integrated into one piece. Therefore, it should be made of a thermally conductive material.

[0099] However, even if the front radiator fins 115F and the rear radiator fins 115R are made of a metal material with good thermal conductivity, it is unreasonable to extend the heat dissipation surface infinitely from the point where the heat-generating element is located in order to increase the surface area for heat dissipation due to the inherent limitations of the material's thermal conductivity. Therefore, the design of the front end position or the rear end position and the lower end position should be optimally designed according to the surrounding environment.

[0100] Multiple module bonding slots 113A and 113B can be formed in the front heat dissipation housing 110F and the rear heat dissipation housing 110R, which are equipped to mediate the bonding of the front heat dissipation module 200A and the rear heat dissipation module 200B in a modular form composed of multiple heat dissipation mechanisms 210 according to an embodiment of the present invention.

[0101] like Figure 7a and Figure 7b As shown, multiple module connecting slots 113A and 113B are provided with four-corner through holes at the upper part of the front heat sink 110F and the rear heat sink 110R, and the multiple module connecting slots 113A and 113B can be formed to be separated along the left and right direction.

[0102] In the plurality of module combination grooves 113A, 113B, the combination grooves 113A, 113B are formed to penetrate in the front-rear direction of the front heat dissipation case 110F and the rear heat dissipation case 110R, but the flip cover 114 to be described later is combined and shielded in the front-rear direction, and thus the structure is given the name "combination groove" rather than "combination hole".

[0103] As an example, the four front heat dissipation modules 200A and the four rear heat dissipation modules 200B, which are arranged in the combined form of the plurality of heat dissipation mechanisms 210 according to an embodiment of the present application to be described later, are arranged in the front-rear direction, and the number of arrangements in the front-rear direction is provided with the plurality of module combination grooves 113A, 113B.

[0104] Also, if the arrangement of the front heat dissipation module 200A and the rear heat dissipation module 200B, which are composed of the combination of the heat dissipation mechanism 210 according to an embodiment of the present application, is completed for the front heat dissipation module 200A and the rear heat dissipation module 200B, the finger guard plate assembly 10 for preventing the operator or the external person from being scalded by the high temperature released from the heat dissipation mechanism 210 can be arranged to cover the entire heat dissipation mechanism 210 and the heat dissipation modules 200A, 200B.

[0105] In the finger guard plate assembly 10, the plurality of air flow holes 15 can be formed in a grill form to smoothly flow in or out of the heat exchange area 50 to be described later.

[0106] As shown in FIG. 1, Figures 7a to 8 The finger guard plate assembly 10 can be arranged to cover the center case 110C to be described later in the structure of the radio unit 1, the heat dissipation mechanism 210 according to an embodiment of the present application and the heat dissipation module 200 to be described later arranged in each of the front heat dissipation case 110F and the rear heat dissipation case 110R, or the upper end portion thereof.

[0107] More specifically, the finger guard plate assembly 10 can include a front finger guard plate 10A combined with the front portion of the front heat dissipation case 110F and a rear finger guard plate 10B combined with the rear portion of the rear heat dissipation case 110R.

[0108] The front finger guard plate 10A has a rectangular parallelepiped shape with the back portion and the lower surface portion open, and the rear finger guard plate 10B has a rectangular parallelepiped shape with the front surface portion and the lower surface portion open, and the plurality of air flow holes 15 can be formed in the front finger guard plate 10A and the rear finger guard plate 10B to enable the external air to exchange heat with the heat dissipation mechanism 210 according to an embodiment of the present application.

[0109] The front finger guard 10A has its lower end portion screwed to a plurality of heat sink fins 115F integrally formed at the lower end portion of the front heat sink housing 110F described later by means of the lower screw 11s-1, and has its left and right side portions screwed to screw fastening holes 110h-2 provided at the left and right side surface portions of the center housing 110C and screw fastening holes 40h-3 provided at the left and right side surface portions of the guide panel 40 described later by means of the first side screw 11s-2 and the second side screw 11s-3, respectively.

[0110] To this end, a screw fastening hole 115h for fastening the lower screw 11s-1 can be integrally formed at the upper end portion of at least any one of the plurality of heat sink fins 115F, and a lower screw through hole 11h-1 for the lower screw 11s-1 to pass through can be formed at a plurality of positions at the lower end portion of the front finger guard 10A.

[0111] Further, a plurality of screw through holes 11h-4 are formed at the upper rear end portion of the front finger guard 10A in a manner of passing through in the up-and-down direction, and screw fastening holes 40h-4 for the upper screws 11s-4 to pass through the plurality of screw through holes 11h-4 and then be fastened can be formed at the upper end portion of the guide panel 40 described later, which can be screwed by means of the plurality of upper screws 11s-4.

[0112] The rear heat sink housing 110R of the rear finger guard 10B not described and the coupling structure to the guide panel 40 are exactly the same as those of the front finger guard 10A described above, and thus the description thereof is replaced.

[0113] In addition, as shown in FIGS. 1 and 2, the front finger guard 10A is coupled to the front heat sink housing 110F of the RF filter unit 120 by means of the plurality of screws 11s-1 to 11s-4. Figure 7a and Figure 7b As shown in FIGS. 1 and 2, a front plate 130F (for example, a power supply unit (PSU) board or the like) on which a heat generating body (a heat generating element) generating predetermined driving heat is mounted is disposed between the front surface portion of the RF filter unit 120 and the front heat sink housing 110F, and heat generated by the heat generating body (for example, a PSU element or the like) mounted on the front plate 130F can be dissipated by the front heat sink fins 115F described above.

[0114] Further, as shown in FIGS. 1 and 2, a rear plate 130R (for example, a printed board assembly (PBA) or the like) on which a heat generating body (for example, an FPGA element or the like) generating heat can be disposed between the back surface portion of the RF filter unit 120 and the rear heat sink housing 110R, and heat generated by the heat generating body mounted on the rear plate 130R can be dissipated by the rear heat sink fins 115R described above. Figure 7a and Figure 7b Further, as shown in FIGS. 1 and 2, a rear plate 130R (for example, a printed board assembly (PBA) or the like) on which a heat generating body (for example, an FPGA element or the like) generating heat can be disposed between the back surface portion of the RF filter unit 120 and the rear heat sink housing 110R, and heat generated by the heat generating body mounted on the rear plate 130R can be dissipated by the rear heat sink fins 115R described above.

[0115] Among them, such as Figure 7b As shown, a front plate mounting groove 140A for stacking and mounting a front plate 130F (PSU plate) can be formed on the back side of the front heat sink housing 110F. Multiple PSU elements can be mounted on the front surface of the PSU plate, which serves as the front plate 130F. The heating surfaces of the PSU elements are closely disposed on the inner surface (front surface) of the front plate mounting groove 140A, and heat exchange between the front heat sink fins 115F and the external air is achieved through surface thermal contact with the front heat sink housing 110F, thereby enabling front heat dissipation.

[0116] And, as Figure 7a As shown, a rear plate mounting slot 140B for stacking rear plates 130R (or PBAs) can be formed on the front surface of the rear heat sink housing 110R. Multiple FPGA components can be mounted on the front surface of the PBA, which serves as the rear plate 130R. The heat-generating surfaces of the FPGA components are closely disposed on the inner surface (back side) of the rear plate mounting slot 140B, and heat exchange with the external air is achieved through surface thermal contact with the rear heat sink housing 110R using the rear heat sink fins 115R, thereby enabling rear heat dissipation.

[0117] Figure 9 This is a perspective view showing the front and rear portions of a heat dissipation mechanism according to an embodiment of the present invention. Figure 10a and Figure 10b yes Figure 9 An exploded three-dimensional view of the front and rear sides. Figure 11 This is a perspective view showing a heat dissipation mechanism according to an embodiment of the present invention. Figure 12a and Figure 12b These are exploded perspective views of the rear and front sides illustrating the assembly process of a heat dissipation mechanism according to another embodiment of the present invention. Figure 13 This is a cross-sectional view used to illustrate the exploded state of the bonding with the heat trapping part resulting from the brazing process. Figure 14 This is an exploded perspective view used to illustrate the bonding state between the heat trap and the heat collection unit achieved by the brazing process. Figure 15 It is to remove Figure 8 A three-dimensional view of the state of the finger guard plate assembly in the structure. Figure 16a and Figure 16b It is only decomposed Figure 15 The diagram shows the front and rear portions of a front heat dissipation module, which is composed of a heat dissipation mechanism according to an embodiment of the present invention, located on the front surface of the housing body.

[0118] like Figures 7a to 7bAs shown, the heat dissipation mechanism 210 according to an embodiment of the present application can be formed by combining at least two or more of the plurality of front heat dissipation modules 200A provided on the front surface of the front heat dissipation housing 110F and the plurality of rear heat dissipation modules 200B provided on the front surface of the rear heat dissipation housing 110R.

[0119] As shown, the heat dissipation mechanism 210 according to an embodiment of the present application can be formed by combining at least two or more of the plurality of front heat dissipation modules 200A provided on the front surface of the front heat dissipation housing 110F and the plurality of rear heat dissipation modules 200B provided on the front surface of the rear heat dissipation housing 110R.

[0120] In addition, as shown in FIGS. 1 and 2, the antenna device (radio unit) 1 according to an embodiment of the present application can further include a guide panel 40 supporting the upper end portions of the respective heat dissipation mechanisms 210 of the front heat dissipation modules 200A and the rear heat dissipation modules 200B. Figure 7a Figure 7b As shown, the heat dissipation mechanism 210 according to an embodiment of the present application can be formed by combining at least two or more of the plurality of front heat dissipation modules 200A provided on the front surface of the front heat dissipation housing 110F and the plurality of rear heat dissipation modules 200B provided on the front surface of the rear heat dissipation housing 110R.

[0121] The guide panel 40 is provided in a substantially rectangular frame shape and is formed in a manner penetrating in the front-rear direction, thereby forming a heat exchange region 50 to be described later, and can be screw-assembled to the upper end of the center housing 110C using a plurality of panel assembly screws 43.

[0122] Further, screw fastening holes 40h-3 can be formed in the left and right side surface portions of the guide panel 40, which provide fastening sites of second side portion fixing screws 11s-3 screw-assembled through the side surface portions of the front and rear finger guard panels 10A and 10B.

[0123] Further, the upper end portion of the guide panel 40 can be provided in a lattice form to allow external air to smoothly ventilate to the heat exchange region 50, and at the front and rear end portions of the upper end portion, guide slots 41 into which the upper end portions of the respective heat dissipation mechanisms 210 are inserted can be formed when the front and rear heat dissipation modules 200A and 200B are coupled to the housing body 100.

[0124] The guide slots 41 of the guide panel 40 function to prevent the heat dissipation mechanisms 210 from being damaged by at least limiting the shaking (clearance distance) of the upper end portions of the plurality of heat dissipation mechanisms 210 with respect to the left-right direction, which extend farther than the upper end of the center housing 110C in the housing body 100.

[0125] Further, the guide panel 40 can provide screw assembly sites for stably coupling the finger guard panel assembly 10.

[0126] As shown, the heat dissipation mechanism 210 according to an embodiment of the present application can be formed by combining at least two or more of the plurality of front heat dissipation modules 200A provided on the front surface of the front heat dissipation housing 110F and the plurality of rear heat dissipation modules 200B provided on the front surface of the rear heat dissipation housing 110R. Figure 9 ​As shown, the front heat dissipation module 200A can include the bonding heat transfer body 221 and at least two or more heat dissipation mechanisms 210 bonded to the bonding heat transfer body 221.

[0127] The front heat dissipation module 200A configured as described above is bonded to the front heat dissipation housing 110F with the bonding heat transfer body 221 as a medium by inserting the bonding heat transfer body 221 into the plurality of module bonding grooves 113A, 113B formed in the front heat dissipation housing 110F (or the rear heat dissipation housing 110R).

[0128] At this time, in the bonding heat transfer body 221, the heat generating body attached to the front plate 130F and the heat generating body (for example, a PA element 223a having a large amount of heat generation among RF components) having a different property from the heat generating body attached to the rear plate 130R can be separated from the front plate 130F and the rear plate 130R, and the PA board-embedded substrate housing portion 222h can be formed in a groove shape.

[0129] In particular, the bonding heat transfer body 221 can be internally filled with a refrigerant and can be provided in a vapor chamber shape that transfers heat while phase changing and flowing by heat transferred from the heat generating body.

[0130] In general, the vapor chamber is in a state of being internally filled with a liquid refrigerant, and if heat is transferred from the outside, the refrigerant is evaporated from the liquid refrigerant to the gaseous refrigerant and flows by a wick structure formed in a manner of internally including a plurality of pores, and then is condensed in a region having a low temperature and is phase changed to the liquid refrigerant again, and the above process is repeatedly performed, and accordingly, the vapor chamber is configured as a heat transfer device that plays a mediating role of transferring heat from one side to the other side.

[0131] However, the bonding heat transfer body 221 does not necessarily have to be provided in a vapor chamber shape. That is, the bonding heat transfer body 221 can also be provided in a plate shape of a simple metal material (a heat conductive material) within a limit of being able to transfer heat generated from the heat generating body to the heat dissipation mechanism 210 according to an embodiment of the present application.

[0132] In the left side end and the right side end of each edge end portion (221c) of the coupling heat transfer body 221 and the shield cover 222 to be described later, a plurality of screw fastening grooves 225h-1, 225h-2 are provided in a semicircular cut shape, and in a state in which a plurality of module assembly screws 225s having a flat head shape are engaged in the plurality of screw fastening grooves 225h-1, 225h-2, the front heat dissipation housing 110F and screw fastening holes (not shown) formed in the edge end portions of the module coupling grooves 113A, 113B corresponding to the rear heat dissipation housing 110R are coupled in a screw coupling manner, so that the front heat dissipation module 200A and the rear heat dissipation module 200B can be stably fixed to the front heat dissipation housing 110F and the rear heat dissipation housing 110R, respectively.

[0133] In addition, one surface of the coupling heat transfer body 221 is formed to face the heat generating body (i.e., the PA element 223a) of the PA board 223, and a plurality of fixing slots 221a can be formed on the other surface of the coupling heat transfer body 221 to provide the heat dissipation mechanism 210 according to an embodiment of the present application. That is, the heat dissipation mechanism 210 according to an embodiment of the present application can receive heat from the heat generating body via the coupling heat transfer body 221.

[0134] On the other surface of the coupling heat transfer body 221, the heat dissipation mechanism 210 according to an embodiment of the present application can be orthogonally coupled to the other surface of the coupling heat transfer body 221 by two or more (six in this embodiment).

[0135] Among them, one surface of the coupling heat transfer body 221 is the front surface portion or the rear surface portion of the RF filter portion 120, which can be arranged to be in surface thermal contact with the heat generating body (PA element 223a) of the PA board 223 arranged independently from the front board 130F and the rear board 130R, and preferably, as shown in Figure 9 and Figure 10a the heat generating body (PA element 223a) of the PA board housed in the substrate housing portion 222h.

[0136] In more detail, a plurality of heat generating bodies can be attached to the front surface of the front board 130F and the rear surface of the rear board 130R, and for the radio unit 1, the front board 130F can be a PSU board, and the rear board 130R can be a PBA type main board, and various heat generating bodies such as digital driving elements such as FPGA elements and analog driving elements such as PA elements 223a can be concentratedly attached to the main board.

[0137] In the heat generating body as described above, the PA element 223a operates while consuming a relatively large amount of power, and thus belongs to a heat generating body having a relatively large amount of heat generation. In order to mount only the PA element 223a, each PA plate can be separated from the main plate serving as the rear plate 130R, and thus can be separately manufactured in a manner of being inserted and disposed in the substrate accommodation portion 222h of the base plate of the combined heat transfer body 221 provided in the plurality of front heat dissipation modules 200A and the rear heat dissipation module 200B, and the PA plate 223 can be accommodated and disposed in the substrate accommodation portion 222h of one surface of the combined heat transfer body 221, so that heat generated from the PA element 223a can be directly transferred to the heat dissipation mechanism 210 according to an embodiment of the present application through the combined heat transfer body 221 and dissipated.

[0138] The combined heat transfer body 221 and the substrate accommodation portion 222h can be distinguished by the shield 222, and the shield 222 can perform the function of transferring heat generated from the heat generating body to the combined heat transfer body 221.

[0139] In addition, on the other surface of the combined heat transfer body 221, a plurality of fixing slots 221a are cut in a left and right spaced apart manner, so that a plurality of heat dissipation mechanisms 210 according to an embodiment of the present application are combined, and thus the rigidity of the other surface of the combined heat transfer body 221 can be reduced.

[0140] In order to prevent the rigidity of the combined heat transfer body 221 as described above from being reduced, a plurality of support pins 226 can be further provided, one end of which is supported on the shield 222 and the other end of which is supported between adjacent fixing slots 221a.

[0141] The plurality of support pins 226 function to be pressed by external force transferred from one surface and the other surface side of the combined heat transfer body 221, and can enhance the rigidity thereof, and at the same time, can prevent leakage of the refrigerant filled therein.

[0142] The refrigerant flow space 205 formed in the plurality of heat dissipation mechanisms 210 can be formed to be in communication with each other via the plurality of fixing slots 221a, so that the inside of the combined heat transfer body 221 as described above shares the refrigerant.

[0143] In addition, the PA plate 223 can be shielded by the flip cover 114 covering the substrate accommodation portion 222h of the combined heat transfer body 221, and can block the intrusion and interference of external radio waves.

[0144] Among them, although not shown in the drawings, the flip cover 114 can be combined to the combined heat transfer body 221 to cover the entire PA plate accommodated in the substrate accommodation portion 222h of the combined heat transfer body 221, as Figure 7a and Figure 7bAs shown, it can also be equipped with module mounting slots 113A and 113B that are combined with the front heat sink 110F and the rear heat sink 110R.

[0145] As described above, according to an embodiment of the present invention, the heat dissipation mechanism 210 is manufactured as a modular front heat dissipation module 200A or rear heat dissipation module 200B by being combined with a plurality of PA plates 223 attached to a surface of the heat transfer body 221. Depending on the variable design environment such as the heat output of the heat source, the product can be easily set up and applied after the design is actively changed.

[0146] The heat transfer element 221, PA plate 223 and flip cover 114 (only when the flip cover 114 is not equipped with modular bonding slots 113A, 113B that are combined with the front heat dissipation housing 110F and the rear heat dissipation housing 110R) can be modularly manufactured and can be defined as a heat collection part 220 corresponding to the heat dissipation mechanism 210 according to an embodiment of the present invention.

[0147] like Figures 9 to 11 As shown, a heat dissipation mechanism 210 according to an embodiment of the present invention may include: a heat containment section 211 for capturing heat generated from a heat source (in particular, PA element 223a); and a heat release section 212 for diffusing the heat captured in the heat containment section 211 and exchanging heat with the outside air, and for extending at least the front end to the heat exchange area outside the upper end of the housing body 100 equipped with the heat source (see below). Figure 18 The reference numeral 50 is used to occupy at least a portion of the heat exchange area 50 directly above the housing body 100.

[0148] That is, even when the heat-receiving portion 211 is arranged to overlap with the front surface portion of the front heat dissipation housing 110F or the rear surface portion (back side portion) of the rear heat dissipation housing 110R in the housing body 100 in the front-rear direction, the heat dissipation mechanism 210 according to an embodiment of the present invention may be formed such that the heat release portion 212 extends upward beyond the upper end of the housing body 100. In this case, the heat release portion 212 may be arranged such that at least a portion of it occupies at least a portion of the heat exchange region 50 directly above the front-rear thickness direction of the housing body 100.

[0149] According to the heat dissipation mechanism 210 of an embodiment of the present invention as described above, even when the heat dissipation area of ​​the heat release section 212 that performs the substantial heat dissipation function is increased, the heat dissipation area can be increased by the heat exchange region 50 directly above the front and rear thickness direction of the housing body 100 without extending it in the front and rear thickness direction of the housing body 100, thereby providing the advantage of avoiding the design of product size expansion.

[0150] Here, the heat accommodation portion 211 and the heat release portion 212 are distinguished in terms of their functions, but cannot be interpreted as having a physically complete dividing line (point).

[0151] For example, the heat accommodation portion 211 and the heat release portion 212 can be integrally manufactured by molding. In this case, the boundary of the heat accommodation portion 211 and the heat release portion 212 is not physically distinguished, but as described above, it is preferable that the heat release portion 212 be interpreted as a portion protruding and extending toward the heat exchange region 50 corresponding to the upper end portion of the case main body 100.

[0152] Here, it is preferable that the heat accommodation portion 211 be formed to have a thickness and a length inserted into the fixing slot 221a formed in the other surface of the coupling heat transfer body 221. That is, the thickness and the length of the heat accommodation portion 211 can be understood as being simply fixed to the fixing slot 221a by an interference insertion or a press-in insertion method. However, the coupling method of the fixing slot 221a with respect to the heat accommodation portion 211 is not necessarily limited to the interference insertion method or the press-in insertion method, and can be coupled by a welding coupling method or a brazing coupling method as in the heat dissipation module 200' according to another embodiment of the present application, which will be described later. This will be described in more detail later.

[0153] Especially, as shown in FIG. 2B, in the heat accommodation portion 211, a protruding insertion end 211a can be formed toward the fixing slot 221a of a predetermined length with reference to a virtual straight line B identical to the end portion of the neck portion 211b corresponding to a virtual boundary point T of the start point of the extension of the heat release portion 212, so as to be inserted in a partially inserted manner with respect to the fixing slot 221a. Figure 11

[0154] Here, as shown in FIG. 2B, the heat dissipation mechanism 210 according to an embodiment of the present application is equipped with a refrigerant flow space 205 in which a refrigerant is filled inside. Figure 11 In this case, the heat dissipation mechanism 210 can be manufactured by previously preparing a single metal plate member having a predetermined thermal conductivity by a press process using a die, and then forming a sealed refrigerant flow space 205 by bending at least one side and joining the edge end portions, and separately manufacturing two metal plate members having a predetermined thermal conductivity by a press process, and then joining along the edge end portions so that the refrigerant flow space 205 is formed inside in a sealed manner.

[0155]

[0156] ​​At this time, the part that forms one side surface of the refrigerant flow space 205 is called the one side heat-conducting plate 210-1, and the part that forms the other side surface of the refrigerant flow space 205 is called the other side heat-conducting plate 210-2.

[0157] In the case where the heat dissipation mechanism 210 according to an embodiment of the present invention is arranged vertically in the up-down direction with reference to the direction of gravity, liquid refrigerant is stored on the side of the heat storage portion 211 formed by inserting and fixing the fixed end 211a to the fixed slot 221a corresponding to the heat collection portion 220, and the evaporated gaseous refrigerant is diffused at the heat release portion 212 corresponding to the upper part with reference to the remaining upper boundary point T, thereby realizing the condensation of liquid refrigerant through heat exchange with the outside air in the heat exchange region 50.

[0158] like Figure 11 As shown, although it is not possible to completely distinguish the refrigerant flow space 205 physically, as a functional classification based on the phase change of the refrigerant, the part formed near the insertion end 211a of the heat storage section 211 is defined as the first refrigerant flow path 210-F1, and the part that is divided by the inclined guide 210-F3 described later and induces the inclined flow of liquid refrigerant is defined as the second refrigerant flow path 210-F2.

[0159] If the gaseous refrigerant diffused through the heat containment section 211 and the heat release section 212 condenses and transforms into a liquid refrigerant by exchanging heat with the outside air in the heat exchange region 50, it is then uniformly distributed through the second refrigerant flow path 210-F2. The second refrigerant flow path 210-F2 is formed by a plurality of inclined guides 210-F3 that are formed downward toward the first refrigerant flow path 210-F1, thereby inducing its flow toward the first refrigerant flow path 210-F1 to achieve a smoother gas-liquid circulation.

[0160] In addition, for the heat dissipation mechanism 210 according to an embodiment of the present invention, the metal plate component of SUS material with a very thin thickness is manufactured by the above-described stamping process. At this time, the internal pressure change caused by the phase change in the refrigerant flow space 205 may induce sloshing (flow). Therefore, multiple joints 210-F4 for preventing this phenomenon can be formed simultaneously during the stamping process.

[0161] Multiple joints 210-F4 are formed to protrude a predetermined depth from one side heat-conducting plate 210-1 and the other side heat-conducting plate 210-2 toward the refrigerant flow space 205. During the joining process for sealing the refrigerant flow space 205, they are joined together by using a joining method including welding, thereby strengthening the rigidity of one side heat-conducting plate 210-1 and the other side heat-conducting plate 210-2.

[0162] As described above, the heat dissipating mechanism 210 according to an embodiment of the present application provides an advantage that can be designed in such a manner that heat exchange in the heat exchange region 50 is also effectively achieved by the heat releasing portion 212 extending above the upper end of the center case 110C in the case body 100 by the refrigerant that can be actively phase-changed by the heat transferred from the heat generating body, rather than relying on the heat conductivity of the metal material itself.

[0163] In addition, the heat accommodating portion 211 and the heat releasing portion 212 do not necessarily have to be integrally formed as described above, although not shown, the heat accommodating portion 211 is a heat pipe in which the refrigerant that is flowing while being phase-changed in the inside is filled, and the heat releasing portion 212 can be a heat sink fin that is combined in thermal contact with the front end of the heat pipe.

[0164] Among them, the heat pipe is provided with a wick structure in the inside as in the above-described vapor chamber, but its appearance is equipped in a pipe shape, so that a structure that can perform a function of a heat transfer medium that remotely transfers heat supplied to one end to the other end can be implemented.

[0165] In addition, preferably, a structure that transfers heat using the heat conductivity of the material itself without the help of a phase-change material such as a refrigerant is integrally explained as the above-described heat sink fin.

[0166] Also, in the heat dissipating mechanism 210 according to an embodiment of the present application, the heat accommodating portion 211 can be adopted as a heat pipe in which the refrigerant that is flowing while being phase-changed in the inside is filled, and the heat releasing portion 212 can also be adopted as a vapor chamber in which the refrigerant that is flowing while being phase-changed in the inside is filled.

[0167] However, the heat dissipating mechanism 210 according to an embodiment of the present application is not necessarily limited to being adopted as a structure that increases the heat transfer rate by the phase change of the refrigerant, and the heat accommodating portion 211 and the heat releasing portion 212 can be adopted as a general heat sink fin that is integrally formed of a predetermined metal material.

[0168] Among them, in the case where the heat dissipating mechanism 210 according to an embodiment of the present application uses a refrigerant as a heat transfer and heat exchange medium thereof, the heat accommodating portion 211 can include an evaporation region that phase-changes the refrigerant into a gaseous refrigerant, and the heat releasing portion 212 can include a condensation region that phase-changes the refrigerant into a liquid refrigerant by heat exchange with the outside air of the heat exchange region 50.

[0169] In addition, as Figure 12a and Figure 12bAs shown, the heat dissipation module 200' according to another embodiment of the present application can achieve mediation of the bonding to the back surface portion of the housing main body 100 via the heat trapping portion 220 as a medium.

[0170] As described above, the heat trapping portion 220 can include the heat transfer body 221 and the shield 222. Among them, the heat trapping portion 220 can be equipped in a form of a vapor chamber in which a refrigerant filling space filled with a predetermined refrigerant is provided inside the heat transfer body 221.

[0171] Hereinafter, as the inside of the heat dissipation mechanism 210 according to an embodiment of the present application, the space in which the refrigerant is filled and flows is referred to as a "refrigerant flow space 205", and the space equipped in a manner that the refrigerant is filled in the heat trapping portion is referred to as a "refrigerant filling space 205'".

[0172] At this time, another surface of the bonding heat transfer body 221 can be formed with a plurality of fixing slots 221a provided for insertion of a part (for example, the insertion end 211a) of the heat accommodation portion 211 in the structure of the heat dissipation mechanism 210, so that a plurality of heat dissipation mechanisms 210 are modularly bonded and form a heat dissipation fin module 200.

[0173] Among them, preferably, the insertion end 211a of the heat accommodation portion 211 is protrudingly inserted in a manner exposed to the refrigerant filling space 205' through the plurality of fixing slots 221a, so as to be directly exposed to the gaseous refrigerant evaporated in the refrigerant filling space 205'.

[0174] However, the refrigerant filling space 205' is a space in which the refrigerant is filled and flows, and in order to prevent the refrigerant from leaking to the outside, there is a problem that it is necessary to completely seal between the fixing slot 221a and the insertion end 211a of the heat accommodation portion 211. In order to perform the above sealing, a method of interposing a separate sealing member (rubber or the like) can be considered, but it is difficult to completely seal due to thermal deformation caused by repeated thermal contraction / expansion, and in addition, while considering the selection of a strong material in consideration of thermal deformation and corrosion resistance, strength, and oxidation or not, not only the number of components and the resulting operation man-hours will increase, but also the weight of the product will increase, and will become a factor of cost increase.

[0175] For the heat dissipation mechanism 210 according to an embodiment of the present application, in order to solve the above problem, the following technical features are proposed: when the insertion end 211a of at least one heat accommodation portion 211 is engaged in the plurality of fixing slots 221a in an inserted state, the bonding heat transfer body 221 and the shield 222 seal and bond the refrigerant filling space.

[0176] The joint can be performed using either brazing or laser welding. The following explanation assumes the application of brazing.

[0177] More specifically, such as Figures 12a to 14 As shown, in the heat transfer body 221, a plurality of rigid reinforcing points 221b may also be formed that protrude toward the shield 222 side along the fixed slots 221a.

[0178] For example, the fixed slot 221a can be formed to be elongated in the vertical direction and communicate with the refrigerant filling space 205' in the heat transfer body 221, and multiple slots can be provided at predetermined distances to connect multiple heat dissipation mechanisms 210 in the horizontal direction. Multiple rigid reinforcing points 221b can be provided between each fixed slot 221a at predetermined distances in the vertical direction.

[0179] The multiple rigid reinforcement points 221b are structures that enhance the rigidity of the combined heat transfer body 221, which has been weakened, by forming an opening in a portion through multiple fixed slots 221a.

[0180] However, the function of the multiple rigid reinforcement sites 221b is not limited to enhancing rigidity, but may also have the additional function of being a joint that contacts and welds together with the multiple welding sites 222b formed in the shield 222 described later.

[0181] That is, in order to prevent thermal deformation that may occur during the contraction / expansion process due to repeated thermal changes, the multiple rigid reinforcement sites 221b are welded together with the welding sites 222b formed on the shield 222 (described later), thereby increasing the rigidity of the connection with the shield 222.

[0182] In the shield 222, a plurality of welding point portions 222b protruding along the side of the bonding heat transfer body 221 can be provided at positions corresponding to the plurality of rigid reinforcement point portions 221b.

[0183] For reference, when multiple rigid reinforcing points 221b and multiple welding points 222b are provided, the aforementioned multiple support pins 226 may not be necessary. That is, the multiple rigid reinforcing points 221b and multiple welding points 222b can be understood as alternative structures to the multiple support pins 226.

[0184] When the shield 222 for the heat transfer body 221 is joined by brazing, welding rods 230 can be applied along the multiple rigid reinforcement points 221b and the edge ends 221c of the heat transfer body 221.

[0185] The welding rod 230 as described above can include a nickel component. More specifically, in the case of the welding rod 230 being mainly composed of nickel, in order to facilitate coating of the plurality of rigid reinforcement site portions 221b, the edge end portion 221c of the coupling heat transfer body 221, and the fixing slot 221a, it can be provided in a paste type or an alloy form. For reference, although the welding rod 230 can also be used in an Ag paste form, there are problems in that corrosion resistance is poor, oxidation can occur, and the cost increases compared to the case of being mainly composed of nickel.

[0186] Hereinafter, as shown in Figure 13 and Figure 14 , the welding rod in which the plurality of rigid reinforcement site portions 221b are respectively coated in the welding rod 230 is referred to as an inner side welding rod 230a, the welding rod in which the edge end portion 221c of the coupling heat transfer body 221 is coated in the welding rod 230 is referred to as an edge welding rod 230b, and the welding rod in which the inner side end portion along the fixing slot 221a is coated is referred to as a fixing slot welding rod 230c.

[0187] As shown in Figure 13 and Figure 14 , the edge welding rod 230b is coated along the edge end portion 221c of the coupling heat transfer body 221 in advance before joining by the brazing process for the shield 222 of the coupling heat transfer body 221, and if joining by the brazing process is performed, it can be solidified and sealed along the edge end portion 221c between the coupling heat transfer body 221 and the shield 222 while being melted at a high temperature and closely adhering the shield 222.

[0188] In addition, if the inner side welding rod 230a is coated to each of the rigid reinforcement site portions 221b, the shield 222 is closely adhered to the correct position from the upper portion to the lower portion, and then joining by the brazing process is performed, the welding site portion 222b of the plurality of rigid reinforcement site portions 221b and the shield 222 can be joined to each other in the process of being melted and solidified at a high temperature.

[0189] Also, when joining by the brazing process is performed, the fixing slot welding rod 230c naturally remains in the direction of gravity and flows to the inside of the fixing slot 221a, is solidified after filling the gap between the fixing slot 221a and the insertion end 211a of the heat accommodation portion 211, and thus can seal the refrigerant filling space 205'.

[0190] To this end, the fixing slot welding rod 230c can be pre-coated at the inner side end portion of the fixing slot 221a of the coupling heat transfer body 221 in a state in which the insertion end 211a of the heat accommodation portion 211 is inserted into the fixing slot 221a.

[0191] As described above, the heat dissipation module 200' according to another embodiment of the present application performs the joining process with the heat trapping portion 220 equipped in the vapor chamber form by the joining through the brazing process, in which the welding rod, particularly the welding rod 230c for the fixing slot, is naturally melted and flows to the fixing slot 221a side, so that a separate sealing member is not required to be provided, and thus the assembly process can be reduced, the weight increase of the product can be prevented, and the benefit of reducing the product cost can be brought.

[0192] Figure 17 is a sectional perspective view taken along Figure 2 the line A-A of Figure 18 , as a sectional view taken along the line A-A of Figure 2 , is a sectional view showing the heat dissipation mechanism and the heat dissipation module according to various embodiments, Figure 19 is an exploded perspective view showing the setting state of the front heat dissipation case, the heat dissipation mechanism, and the front heat dissipation module with respect to the center case in the structure of FIG. 1.

[0193] Referring to Figures 17 to 19 , the heat releasing portion 212 in the structure of the heat dissipation mechanism 210 extends further than the upper end 110C-U of the center case 110C in the structure of the case main body 100, and extends at least to occupy the heat exchange region 50 corresponding to the upper portion in the front-rear thickness direction of the case main body 100. At this time, the direction in which the heat releasing portion 212 extends can be the upper end or the lower end among the edge end portions of the case main body 100, or can be the left or right side end among the edge end portions of the case main body 100.

[0194] At this time, the outer side end of the heat releasing portion 212 is equipped to have a protruding amount matching the outer side end of the plurality of heat sink fins 115F, 115R formed in each of the front heat dissipation case 110F and the rear heat dissipation case 110R, and the inner side end of the heat releasing portion 212 is extended to increase the area thereof so as to occupy the heat exchange region 50 corresponding to the front-rear thickness direction of the case main body 100 from the portion where the edge end portion 212a described below is formed.

[0195] In addition, the heat exchange region 50 is a region protected from the outside by the finger guard plate assembly 10, and since the flow of external air can be restricted, an external air flow fan (not shown) can be provided inside the heat exchange region 50. Although not shown, it is preferable that the external air flow fan be provided in the heat exchange region 50 corresponding to the heat releasing portion 212 of the heat dissipation mechanism 210 provided between the front heat dissipation case 110F and the rear heat dissipation case 110R, respectively.

[0196] As described above, when the plurality of heat dissipating mechanisms 210 according to an embodiment of the present application are combined as the front heat dissipation module 200A and the rear heat dissipation module 200B at the front surface portion and the rear surface portion of the housing main body 100 and are combined with a plurality of heat exchange areas 50, the rear end of the heat releasing portion 212 of the heat dissipating mechanism 210 provided at the front surface portion of the front heat dissipation housing 110F and the front end of the heat releasing portion 212 of the heat dissipating mechanism 210 provided at the rear surface portion of the rear heat dissipation housing 110R can be arranged to have a predetermined interval distance (refer to reference numerals D1 and D2 of FIG. 10) in the front-rear direction across the heat exchange area 50. Figure 18

[0197] As shown in (a) and (b) of FIG. 11, in the housing main body 100 of the heat releasing portion 212, the length of the extension toward the upper portion is designed differently according to the heat generation amount of the heat generating body, but for example, in the case where the heat generation amount of the heat generating body is relatively small, the extension length can be designed to be reduced by a length corresponding to "L1". That is, the interval distance between the front end of the extension of the heat releasing portion 212 and the edge end portion of the housing main body 100 can be designed differently according to the amount of heat generated from the heat generating body. Figure 18 Further, as shown in (c) of FIG. 11, the inner side end of the heat releasing portion 212 of the heat dissipating mechanism 210 provided at the front heat dissipation housing 110F and the rear heat dissipation housing 110R, respectively, can be designed to further extend from "D1" to "D2" with respect to the interval distance therebetween.

[0198] Figure 18 To this end, the heat releasing portion 212 can have an edge end portion 212a bent at a predetermined angle from the heat receiving portion 211 to occupy the heat exchange area 50.

[0199] As described above, the heat dissipating mechanism 210 according to an embodiment of the present application has the advantage of improving the overall heat dissipation performance by being provided with the heat releasing portion 212 extending toward the heat exchange area 50 outside the edge end portion 221c of the housing main body 100 or the coupling heat transfer body 221 having the heat generating body as a heat dissipation object, thereby reducing the interference of the upward airflow at the time of heat dissipation and enabling more sufficient heat exchange with the external air in the heat exchange area 50 at the extended portion.

[0200] The advantage provided by this is that even without changing the radio unit 1 manufactured in a predetermined size, the size and shape of the heat releasing portion 212 can be changed according to the heat generation amount of the heat generating body or the like, and a corresponding design can be made.

[0201] The advantage provided by this is that even without changing the radio unit 1 manufactured in a predetermined size, the size and shape of the heat releasing portion 212 can be changed according to the heat generation amount of the heat generating body or the like, and a corresponding design can be made.

[0202] ​​In addition, the heat release portion 212 can be designed and manufactured in consideration of the heat generation amount of the heat generating body, and the design diversity can be improved since the product can be easily applied according to the specifications of the heat generating body through modular manufacturing.

[0203] The heat dissipation mechanism according to an embodiment of the present application has been described in detail above with reference to the drawings. However, the embodiment of the present application is not limited to the above-described embodiment, and it is obvious that a person having ordinary knowledge in the technical field to which the present application pertains can make various modifications and implement them within the equivalent scope. Accordingly, the true scope of the present application should be determined by the claims.

Claims

1. A heat dissipation mechanism, comprising: The heat containment section traps heat generated from the heat source. as well as The heat release section exchanges heat captured by the heating element with the outside air. Specifically, at least one of the heat-receiving portions is coupled to and mediates the coupling with the housing body equipped with the heating element via a heat-collecting portion. The heat collection unit includes: The heat transfer element is combined with a plurality of fixed slots for insertion of at least one portion of the heat-receiving portion; and A shield, combined with the heat transfer body, forms a predetermined refrigerant filling space inside and seals the refrigerant filling space.

2. The heat dissipation mechanism as described in claim 1, wherein, When at least a portion of the heat-receiving section is engaged in a state of insertion into the plurality of fixed slots, the heat transfer element used for engagement seals the refrigerant-filled space with the shield.

3. The heat dissipation mechanism as described in claim 2, wherein, The joining is performed by either brazing or laser welding.

4. The heat dissipation mechanism as described in claim 1, wherein, The heat collection unit also includes: Multiple support pins are configured such that one end is supported on the shield and the other end is supported between adjacent fixed slots.

5. The heat dissipation mechanism as described in claim 2, wherein, In the heat transfer body for bonding, welding rods are coated along the inner end of the fixed slot. When the joining is performed by the brazing process, the welding rod flows down in the direction of gravity to seal between the fixed slot and the outer side of the heat-receiving portion.

6. The heat dissipation mechanism as described in claim 2, wherein, The heat transfer element for use is equipped with a plurality of rigid reinforcing points that protrude toward the shield side between the fixed slots. The shielding cover is equipped with a plurality of welding points that protrude toward the heat transfer element for bonding, corresponding to the positions of the plurality of rigid reinforcing points. When the joining is performed by the brazing process, the plurality of rigid reinforcing sites and the plurality of welding sites are joined together by means of welding rods coated on the plurality of rigid reinforcing sites.

7. The heat dissipation mechanism as described in claim 5 or 6, wherein, In addition to the fixed slot or the rigid reinforcement point, the welding rod is further coated along the edge end of the bonding heat transfer body.

8. The heat dissipation mechanism as described in claim 5 or 6, wherein, The welding electrode is provided in a paste or alloy form with nickel as the main component.

9. The heat dissipation mechanism as described in claim 2, wherein, At the inner end of the fixed slot, the welding rod is pre-coated while a portion of the heat-receiving part is inserted into the fixed slot.

10. A heat dissipation module, comprising: A heat dissipation mechanism includes a heat containment section and a heat release section. The heat containment section captures heat generated from a heat-generating element, and the heat release section exchanges the heat captured from the heat-generating element with the outside air. as well as The heat collection section has a substrate receiving section formed on one surface to receive the PA plate, and multiple fixing slots formed on the other surface to house the heat dissipation mechanism. It is also filled internally with a heat transfer medium containing a refrigerant capable of undergoing a phase change. The heat collection unit includes: The heat transfer element is combined with a plurality of fixed slots for inserting at least one portion of the heat-receiving portion; as well as A shield, combined with the heat transfer body, forms a predetermined refrigerant filling space inside and seals the refrigerant filling space.

11. The heat dissipation module as described in claim 10, wherein, When at least a portion of the heat-receiving section is engaged in a state of insertion into the plurality of fixed slots, the heat transfer element used for engagement seals the refrigerant-filled space with the shield.

12. The heat dissipation module as described in claim 11, wherein, The heat transfer element for use is equipped with a plurality of rigid reinforcing points that protrude toward the shield side between the fixed slots. Within the shielding cover, at positions corresponding to the plurality of rigid reinforcing points, a plurality of welding points protruding toward the bonding heat transfer element are provided. When the joining is performed by the brazing process, the plurality of rigid reinforcing sites and the plurality of welding sites are joined together by means of welding rods coated on the plurality of rigid reinforcing sites.

13. An antenna device, comprising: The housing body has a space for mounting the RF filter section; as well as The heat dissipation module is integrated into the front or back surface of the housing body. The heat dissipation module includes: A heat dissipation mechanism includes a heat containment section and a heat release section. The heat containment section traps heat generated from a heat-generating element, and the heat release section exchanges the heat trapped by the heat-generating element with external air. The heat collection section has a substrate receiving section formed on one surface to receive the PA plate, and multiple fixing slots formed on the other surface to house the heat dissipation mechanism. It is also filled internally with a heat transfer medium containing a refrigerant capable of undergoing a phase change. The heat collection unit includes: The heat transfer element is combined with a plurality of fixed slots for insertion of at least one portion of the heat-receiving portion; and A shield, combined with the heat transfer body, forms a predetermined refrigerant filling space inside and seals the refrigerant filling space.

14. The antenna device as claimed in claim 13, wherein, The main body of the shell includes: The central housing has a mounting space for the RF filter section. The front heat dissipation housing is attached to the front surface portion of the central housing; and The rear heat dissipation housing is attached to the back of the central housing. The heat dissipation module includes: A front heat dissipation module is disposed on the front heat dissipation housing; and The rear heat dissipation module is located in the rear heat dissipation housing. The front heat dissipation housing and the rear heat dissipation housing are provided with multiple module bonding slots that facilitate the bonding of the front heat dissipation module and the rear heat dissipation module.

15. The antenna device as claimed in claim 14, wherein, When the heat-receiving portion is arranged to overlap with the front or back surface portion of the housing body in the front-rear direction, the heat release portions of the front heat dissipation module and the rear heat dissipation module extend upwards relative to the upper end of the housing body, and extend to form at least a portion of the heat exchange area directly above the front-rear thickness direction of the housing body.

16. The antenna device as claimed in claim 14, wherein, The upper end of the housing body also includes: The guide panel has multiple guide slots into which the upper ends of the heat dissipation mechanisms of the front heat dissipation module and the rear heat dissipation module are inserted.

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