Protective layer press with integrated electrical contact elements for coating and electrically conductive contacting semi-finished electronic products

Abstract

The invention relates to a protective layer press (10) having at least one integrated electrical contact element (11) for coating and electrically contacting a semi-finished electronic product (50), to a method for producing such a protective layer press (10) having at least one integrated electrical contact element (11), the invention further relates to a method for coating and electrically contacting a semi-finished electronic component (50) with such a protective layer press (10) comprising at least one integrated electrical contact element (11), and to the use of such a protective layer press (10) having at least one integrated electrical contact element (11) for coating and electrically contacting a semi-finished electronic component (50).

Description

Technical Field

[0001] The present invention relates to a protective laminate having at least one integrated electrical contact element for coating and conductively contacting semi-finished electronic products, a method for manufacturing such a protective laminate having at least one integrated electrical contact element, a method for coating and conductively contacting semi-finished electronic components using such a protective laminate including at least one integrated electrical contact element, and the use of such a protective laminate having at least one integrated electrical contact element for coating and conductively contacting semi-finished electronic components. Background Technology

[0002] Optoelectronics encompasses both the fields of optics and semiconductor electronics. This invention specifically includes systems and methods capable of converting energy generated by electrons into light emission or vice versa. Optoelectronic components, particularly organic photovoltaic (OPV) devices and organic light-emitting diodes (OLEDs), generate electrical energy or convert it into light emission. For the intended application, this light emission must be either extracted from or introduced into the optoelectronic component, requiring what is known as a bus. A bus is a point within the optoelectronic component where electrical energy is concentrated and continues to be transmitted as current.

[0003] In the field of photovoltaic (PV) devices, busbars are known to be applied to the front or back of the PV device. The cross-sectional dimensions of the busbar depend on the current density to be transmitted. However, for protection purposes, PV devices are typically provided with a protective layer or encapsulated in a protective layer, particularly for mechanical protection and to prevent environmental influences such as the diffusion of moisture and oxygen.

[0004] US7,635,810B2 discloses an interconnection arrangement of photovoltaic cells using interconnecting strips on a substrate with an adhesive. The strips include conductive fingers that contact the top light-incident surface of a first cell and extend into an interconnection region of the strip. The interconnection region may include through-holes that allow electrical communication between the top and bottom surfaces of the interconnection region.

[0005] WO2013 / 028591A2 discloses a polymer-coated busbar tape for photovoltaic systems, comprising a metal foil, an adhesive layer laminated on one surface of the metal foil, and a protective polymer coating laminated on the opposite second surface of the metal foil. This tape can be readily used as a busbar tape in photovoltaic cells.

[0006] However, the drawback of the prior art is that the method used to make conductive contact between electronic components and the protective layer can adversely affect the function of the protective layer and / or at least partially damage the underlying components. Furthermore, the known methods are particularly unsuitable for roll-to-roll processes. In addition, the lifespan of organic optoelectronic components is significantly shortened when they come into direct contact with air (especially oxygen) and / or moisture (especially water), therefore they must be adequately protected during manufacturing by barrier layers or windings. Summary of the Invention

[0007] Therefore, the object of the present invention is to provide a method for making conductive contact with electronic components through a protective layer, wherein the aforementioned disadvantages do not occur, and wherein a simple and reliable conductive contact for electronic components with a protective layer is particularly provided.

[0008] This objective is achieved through the subject matter of the independent claims. Advantageous embodiments are apparent from the dependent claims.

[0009] The object of the present invention is particularly achieved by providing a protective laminate for coating and conductively contacting semi-finished electronic products, having at least one integrated electrical contact element, preferably at least one busbar. The protective laminate comprises: at least one protective layer having a top side and a bottom side; a non-conductive adhesive layer on the bottom side of the at least one protective layer; at least one electrical contact element embedded in the non-conductive adhesive layer, wherein the bottom side of the at least one electrical contact element is at least partially not covered by the non-conductive adhesive layer, wherein a conductive adhesive is disposed on the bottom side of the at least one electrical contact element; and a release liner covering the non-conductive adhesive layer and the conductive adhesive on a side opposite to the at least one protective layer, wherein the adhesive strength of the non-conductive adhesive layer and the conductive adhesive is within the same range.

[0010] The protective layer should be understood as an ultraviolet protection layer, an anti-reflective layer, a barrier layer to prevent external influences (especially oxygen and / or moisture in the atmosphere) from passing through, or a filter layer (preferably a layer with an ultraviolet filter) and / or a mechanical protection layer (especially a scratch-resistant layer).

[0011] A busbar should be understood specifically as a device that acts as a central distributor of electrical energy, electrically connecting input and output lines for the purpose of electrical contact. The busbar is particularly implemented in planar form as a strip, bar, plate, or metal layer.

[0012] Semi-finished electronic components should be understood as the preparatory stage of electronic components, in which at least one additional process step is necessary, i.e., additional processing is required to obtain the final electronic component.

[0013] In the context of this invention, the top side or top surface of the protective laminate, or any portion of the protective laminate, is specifically understood as a side or surface facing away from the release liner or the semi-finished electronic component to which the protective laminate is intended to be applied. Therefore, the bottom side is the opposite side of the top side. The bottom side or bottom surface of the protective laminate, or any portion of the protective laminate, is specifically understood as a side or surface facing the release liner or the semi-finished electronic component to which the protective laminate is intended to be applied.

[0014] In a preferred embodiment, the protective laminate is substantially optically transparent or translucent. Specifically, at least one protective layer is optically transparent or translucent. Specifically, the non-conductive adhesive layer is optically transparent or translucent. Specifically, the conductive adhesive is optically transparent or translucent.

[0015] In a preferred embodiment, the protective laminate does not include electronic compounds.

[0016] In the context of this invention, the term "conductive" means that it can conduct electricity, while the term "non-conductive" means that it cannot conduct electricity. Therefore, conductive adhesives are understood to be adhesives that can conduct electricity, and non-conductive adhesives are understood to be adhesives that cannot conduct electricity.

[0017] Conductive adhesives are particularly adhesives that are conductive themselves or contain conductive materials. Conductive materials, especially particles, may be incorporated into the adhesive, thereby creating current flow paths within the adhesive. Preferably, the conductive material is silver, nickel, copper, or graphite. Partially, the conductive material is either granules of conductive material or granules coated with conductive material, preferably spherical conductive particles plated with metal.

[0018] In a preferred embodiment, at least one protective layer is non-conductive.

[0019] In the context of this invention, a pressure-sensitive adhesive (PSA, self-adhesive adhesive, self-adhesive bonding agent) is a non-reactive adhesive that forms a bond when pressure is applied to bond the adhesive to a surface, particularly when no solvent, water, or heat is required to activate the adhesive. The degree of bond is affected by the magnitude of the pressure applied when the adhesive is applied to the surface. In particular, pressure-sensitive adhesives are designed to form a bond at room temperature and maintain it appropriately. The design of pressure-sensitive adhesives takes into account a balance between flowability and flow resistance. Bonding occurs because the adhesive is soft enough to flow on the adherend, and the bond has strength because the adhesive is hard enough to resist flow when stress is applied at the bond. Molecular interactions, such as van der Waals forces, also occur during the bonding process once the adhesive and the adherend are close together, which contributes to increasing the bond strength. In a preferred embodiment, the pressure-sensitive adhesive (PSA) is based on a liquid carrier, wherein an organic solvent or aqueous carrier evaporates after the adhesive is applied to the support.

[0020] The protective laminate with at least one integrated electrical contact element for coating and conductive contacting semi-finished electronic products according to the invention has advantages over the prior art. Advantageously, it ensures simple and reliable conductive contact of electronic components. Advantageously, the protective laminate allows for rapid application. Advantageously, the protective laminate can be prefabricated. This improves process reliability and reduces manufacturing costs. Advantageously, the protective laminate allows for low-temperature application, preferably in the range of 20°C to 30°C, so as not to damage the stack of electronic components to which the protective laminate is applied. Electronic components, particularly electrodes or layer systems, are protected for transport, from environmental influences, and / or from damage during additional processing. Advantageously, the protective laminate prevents the layer system from detaching from the substrate, especially during roll-to-roll unwinding processes or during long storage periods prior to additional processing. Advantageously, winding and unwinding can be performed during roll-to-roll processes. Advantageously, the protective laminate can be applied in a single process step, thereby saving internal process steps and time. Furthermore, organic layer systems can be protected from external influences more quickly. This is ultimately more cost-effective. Protective laminates are ideal for the conductive contacts of thin-film solar cells.

[0021] In a preferred embodiment, the adhesive strength of the non-conductive adhesive layer and the adhesive strength of the conductive adhesive are 0.3 N / 25 mm to 10 N / 25 mm, preferably 0.3 N / 25 mm to 9 N / 25 mm, preferably 1 N / 25 mm to 8 N / 25 mm, preferably 2 N / 25 mm to 8 N / 25 mm, preferably 10 N / 25 mm to 8 N / 25 mm, or preferably 4 N / 25 mm to 7 N / 25 mm, and / or the adhesive strength of the non-conductive adhesive layer and the adhesive strength of the conductive adhesive differ from each other by a maximum of 3 N / 25 mm, preferably a maximum of 2 N / 25 mm, or preferably a maximum of 1 N / 25 mm. The adhesive strength of the non-conductive adhesive layer and the conductive adhesive is adjusted according to the semi-finished electronic component to which it will be laminated. The adhesive strength is adjusted according to the material of the semi-finished electronic component to which the adhesive is applied, such that the adhesive ensures bonding on the electronic component and ensures conductive contact between at least one busbar and conductive element, particularly without damaging any component of the electronic component during the process.

[0022] In a preferred embodiment of the present invention, the non-conductive adhesive is an ultraviolet-curing, temperature-curing, or polymerization-curing adhesive. In a preferred embodiment of the present invention, the conductive adhesive is an ultraviolet-curing, temperature-curing, or polymerization-curing adhesive.

[0023] In a preferred embodiment, the release liner has a thickness of 20µm to 300µm, preferably 20µm to 200µm, preferably 20µm to 100µm, or preferably 20µm to 50µm, and / or the release liner includes a non-stick coating on the top side facing the non-conductive adhesive layer and the conductive adhesive, the non-stick coating being preferably a fluorinated silicone system. In another preferred embodiment, the release liner itself is made of a material having anti-adhesive properties to the adhesive.

[0024] In a preferred embodiment, the protective laminate comprises at least two protective layers, preferably at least three. Specifically, an adhesive is disposed between the protective layers.

[0025] In a preferred embodiment, at least one protective layer has a layer thickness of 10µm to 500µm, preferably 10µm to 300µm, preferably 10µm to 200µm, preferably 10µm to 100µm, preferably 20µm to 100µm, preferably 10µm to 50µm, preferably 20µm to 50µm, or preferably 20µm to 40µm.

[0026] In a preferred embodiment, at least one protective layer is formed of a polymer layer, which is preferably selected from the group consisting of ethylene tetrafluoroethylene (ETFE), polyethylene terephthalate (PET), polyolefins, polyetheretherketone (PEEK), polymethyl methacrylate (PMMA), polypropylene (PP), polyethylene (PE), polyethylene naphthalate (PEN), ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), and thermoplastic polyurethane (TPU). In a preferred embodiment, the thickness of the polymer layer is from 10 µm to 100 µm, preferably from 10 µm to 50 µm, or preferably from 10 µm to 30 µm.

[0027] In a preferred embodiment, at least one protective layer is formed of a metal layer, particularly a metal layer of Al, Cu, or alloys thereof. In a preferred embodiment, the thickness of the metal layer is 10 µm to 100 µm, preferably 10 µm to 50 µm, or preferably 10 µm to 30 µm. In a preferred embodiment, at least one protective layer is a film.

[0028] In a preferred embodiment, at least one protective layer comprises a getter material, or the protective laminate comprises a getter layer comprising getter material disposed between at least one protective layer and a non-conductive adhesive layer or between two protective layers. Specifically, the getter material is calcium oxide, phosphorus pentoxide, barium oxide, magnesium perchlorate, calcium sulfate, copper sulfate zeolite, alkaline earth metals and / or their chemical oxide compounds. The getter material is particularly a desiccant or desiccant with a gettering function to bind water. In a preferred embodiment, the getter layer has a layer thickness of 10 to 100 µm, preferably 10 µm to 50 µm, or preferably 10 µm to 30 µm.

[0029] In a preferred embodiment, the protective laminate includes a metal layer disposed on the top side of at least one protective layer facing away from the non-conductive adhesive layer, sandwiched between two protective layers, or disposed on the bottom side of at least one protective layer facing the non-conductive adhesive layer. Preferably, the thickness of the metal layer is 10µm to 100µm, more preferably 10µm to 50µm, or more preferably 10µm to 30µm. In a preferred embodiment of the invention, the metal layer is formed of a metal or an alloy thereof, preferably Al or an alloy thereof.

[0030] In a preferred embodiment, at least one protective layer forms a closed layer, particularly a closed layer without pores; preferably, the protective layer is formed by pressing the protective layer into a closed layer without pores. Specifically, at least one protective layer does not include through-holes. Therefore, no water can directly pass through at least one protective layer.

[0031] In a preferred embodiment, the surface formed by the non-conductive adhesive layer and the conductive adhesive on the side facing the release liner is substantially flat and coherent, particularly with transition areas or topological differences on the surface less than 5µm, preferably less than 3µm, or preferably less than 1µm.

[0032] In a preferred embodiment, the non-conductive adhesive layer is formed of pressure-sensitive adhesive (PSA), and / or the non-conductive adhesive layer has a thickness of 50µm to 500µm, preferably 50µm to 300µm, preferably 50µm to 200µm, or preferably 50µm to 150µm.

[0033] In a preferred embodiment, the thickness of the non-conductive adhesive layer between the bottom side of at least one protective layer and the top side of at least one electrical contact element is between 2µm and 200µm, preferably between 4µm and 200µm, preferably between 4µm and 100µm, preferably between 4µm and 50µm, preferably between 10µm and 50µm, or preferably between 10µm and 30µm.

[0034] In a preferred embodiment, the pressure-sensitive adhesive (PSA) is formed from a silicone system, acrylate, or styrene block copolymer (SBC). The pressure-sensitive adhesive layer is specifically designed for permanent applications.

[0035] In a preferred embodiment, the conductive adhesive on the bottom side of at least one electrical contact element is formed of pressure-sensitive adhesive (PSA), and / or the conductive adhesive has a thickness of 4µm to 100µm, preferably 5µm to 80µm, preferably 5µm to 50µm, preferably 5µm to 30µm, or preferably 10µm to 40µm.

[0036] In a preferred embodiment, at least one electrical contact element has a layer thickness of 10µm to 200µm, preferably 10µm to 100µm, preferably 20µm to 100µm, preferably 10µm to 50µm, preferably 20µm to 50µm, or preferably 20µm to 40µm.

[0037] In a preferred embodiment, at least one electrical contact element is a strip or wire, wherein the strip preferably has a width of 1 mm to 50 mm, more preferably 2 mm to 30 mm, or more preferably 5 mm to 20 mm and / or a thickness of 10 µm to 100 µm, more preferably 10 µm to 80 µm, or more preferably 20 µm to 50 µm, and wherein the wire preferably has a thickness of 0.1 mm. 2 Up to 2mm 2 0.5mm is preferred 2 Up to 1mm 2The cross-sectional area. In a preferred embodiment, at least one electrical contact element is made of a metal or an alloy thereof, preferably Al, Cu, Sn or alloys thereof.

[0038] In a preferred embodiment, at least one electrical contact is completely covered by a non-conductive adhesive and / or a conductive adhesive.

[0039] In an alternative preferred embodiment, at least one electrical contact element is partially, particularly, covered by an insulating layer on its top side facing at least one protective layer.

[0040] In a preferred embodiment, the protective laminate includes at least two electrical contact elements, preferably two electrical contact elements, which are electrically isolated from each other.

[0041] In a preferred embodiment, the space between at least one protective layer and at least one electrical contact element, as well as between several electrical contact elements, is completely filled with a non-conductive adhesive.

[0042] In a preferred embodiment, the protective laminate is flexible. A flexible protective laminate should be understood, in particular, to bendable and / or stretchable in a specific area.

[0043] The object of the present invention is also achieved by providing a method for manufacturing a protective laminate having at least one integrated electrical contact element, preferably a protective laminate according to the present invention, particularly a protective laminate according to one of the above exemplary embodiments. The method comprises the following steps: a) providing a release liner; b) laminating at least one electrical contact element, preferably at least one busbar, onto the top side of the release liner, wherein a conductive adhesive is applied to the bottom side of the at least one electrical contact element or to the area on the top side of the release liner where the at least one electrical contact element is applied; c) providing at least one protective layer; d) applying a non-conductive adhesive layer to the bottom side of the at least one protective layer and / or to the top side of the release liner having at least one electrical contact element from step b); e) laminating the release liner having at least one electrical contact element from step b) on the top side with at least one protective layer having the non-conductive adhesive layer from step d) on the bottom side; and f) obtaining a protective laminate having at least one integrated electrical contact element. In this context, in particular, a method for manufacturing a protective laminate having at least one integrated electrical contact element is provided, combining the advantages described in the description of a protective laminate having at least one integrated electrical contact element.

[0044] In a preferred embodiment, in step e) of the method for manufacturing a protective laminate having at least one integrated electrical contact element, a release liner having at least one electrical contact element of step b) is laminated onto at least one protective layer having a non-conductive adhesive layer of step d), or at least one protective layer having a non-conductive adhesive layer of step b) is laminated onto a release liner having at least one electrical contact element of step d).

[0045] In step d), a non-conductive adhesive layer may be applied using a printing process, preferably a screen printing process, a drawing process, a spraying process, an inkjet printing process or a 3D printing process, a slot die process, a squeegee process or a scraping process.

[0046] In a preferred embodiment, between steps e) and f), in step e1), the non-conductive adhesive layer is preferably cured by ultraviolet curing, temperature curing, and / or polymerization curing. In a preferred embodiment, in step e), the non-conductive adhesive layer and the conductive adhesive are cured. In a more preferred embodiment, the non-conductive adhesive layer and the conductive adhesive are cured to different degrees, particularly by pre-curing the non-conductive adhesive layer after step e) or pre-curing the conductive adhesive after step b), or by different curing methods.

[0047] In a preferred embodiment, the non-conductive adhesive layer is cured at a temperature of 30°C to 200°C, preferably 50°C to 150°C, preferably 80°C to 150°C, preferably 30°C to 100°C, preferably 50°C to 100°C, preferably 50°C to 80°C, or more preferably 30°C to 60°C.

[0048] In a preferred embodiment, after step e), in step e2), the applied non-conductive adhesive layer and conductive adhesive are dried for a period of 10 to 300 seconds, preferably 10 to 200 seconds, preferably 10 to 100 seconds, preferably 10 to 50 seconds, or more preferably 10 to 20 seconds. In a preferred embodiment of the invention, the applied adhesive is dried at a temperature of 30°C to 70°C, preferably 30°C to 60°C, preferably 30°C to 50°C, preferably 30°C to 40°C, preferably 40°C to 60°C, or preferably 40°C to 50°C, or preferably dried by applying a vacuum.

[0049] In a preferred embodiment, the non-conductive adhesive layer has an adhesive strength of 0.3 N / 25 mm to 10 N / 25 mm, preferably 0.3 N / 25 mm to 9 N / 25 mm, preferably 1 N / 25 mm to 8 N / 25 mm, preferably 2 N / 25 mm to 8 N / 25 mm, preferably 10 N / 25 mm to 8 N / 25 mm, or preferably 4 N / 25 mm to 7 N / 25 mm. In a preferred embodiment, the adhesive strength of the non-conductive adhesive layer and the adhesive strength of the conductive adhesive are within the same range. Preferably, the adhesive strength of the non-conductive adhesive layer and the adhesive strength of the conductive adhesive differ by a maximum of 4 N / 25 mm, preferably a maximum of 3 N / 25 mm, preferably a maximum of 2 N / 25 mm, or preferably a maximum of 1 N / 25 mm.

[0050] The object of the present invention is also achieved by providing a method for coating and conductively contacting a semi-finished electronic component by means of a protective laminate or by means of a protective laminate manufactured according to the invention, particularly according to one of the exemplary embodiments described above. The method includes the following steps: g) providing a semi-finished electronic component including at least one electrode on a top side of the semi-finished electronic component; h) providing a protective laminate having at least one integrated electrical contact element; i) removing a release liner from the protective laminate; j) aligning the bottom side of the protective laminate with the top side of the semi-finished electronic component, wherein at least one electrical contact element of the protective laminate is positioned relative to at least one electrode of the semi-finished electronic component; k) laminating the protective laminate without the release liner from step i) to the semi-finished electronic component by applying pressure, such that the protective laminate is fixed to the semi-finished electronic component, and at least one electrical contact element is in conductive contact with at least one electrode of the semi-finished electronic component; and l) obtaining a coated and conductively contacted electronic component. In this context, in particular, the advantages described in the combination of a protective laminate having at least one integrated electrical contact element and a method for manufacturing a protective laminate having at least one integrated electrical contact element are provided for coating and conductively contacting semi-finished electronic components. Specifically, at least one electrical contact element is arranged on the electrodes of the semi-finished electronic component. The lamination method ensures firm and effective contact between the conductive element and the electrodes of the semi-finished electronic component.

[0051] In a preferred embodiment, the electronic component is an optoelectronic component, particularly a light-emitting element or a light-absorbing element. In a preferred embodiment, the optoelectronic component is an LED, OLED, photovoltaic element (particularly a solar cell), organic photovoltaic element (particularly an organic solar cell), or photodetector (particularly an organic photodetector). The photovoltaic element is particularly a photovoltaic cell, especially a solar cell. The photovoltaic element preferably consists of multiple photovoltaic cells, which can be connected in series or parallel. The photovoltaic cell has at least one photosensitive layer, particularly CIS, CIGS, GaAs, or Si cells, perovskite cells, or organic photovoltaic elements (OPVs), i.e., so-called organic solar cells. Organic photovoltaic elements should be understood to specifically refer to photovoltaic elements having at least one organic photosensitive layer, particularly polymer organic photovoltaic layers or organic photovoltaic layers based on small molecules or polymers.

[0052] In a preferred embodiment, the method is performed using a roll-to-roll process. Specifically, a semi-finished electronic component disposed on one roll is unwound parallel to a protective laminate disposed on another roll, the two components are aligned and brought together by pressure (e.g., through a cylinder or roll). The electronic component with the applied protective laminate is wound onto a roll and can thus be stored and further processed.

[0053] In an alternative implementation, the protective laminate is applied to the semi-finished electronic component using a roll-to-roll or sheet-to-sheet process.

[0054] In a preferred embodiment, the protective laminate is applied to the semi-finished electronic component at a temperature of 20°C to 60°C, preferably 20°C to 50°C, preferably 20°C to 40°C, preferably 20°C to 30°C, preferably 25°C to 50°C, preferably 25°C to 40°C, or preferably 30°C to 50°C.

[0055] In an alternative embodiment, a protective laminate is applied to the light-incident surface of the electronic component, preferably the optoelectronic component.

[0056] In a preferred embodiment, the electronic semi-finished component has a first electrode, a second electrode, and a stack including at least one photosensitive layer on a substrate, a so-called layer system, wherein the stack is disposed between the first and second electrodes, and wherein at least one electrical contact element is in conductive contact with the first and / or second electrodes. The electrodes and the various layers of the stack can be applied by different processes, particularly sputtering, vapor deposition, vacuum deposition, or printing.

[0057] In a preferred embodiment, the electronic component is a flexible electronic component. In a preferred embodiment, the flexible electronic component is a flexible optoelectronic component, preferably a flexible photovoltaic element. A flexible optoelectronic component should be understood, in particular, as an optoelectronic component that is bendable and / or stretchable in a specific area.

[0058] In a preferred embodiment, the stack of the first electrode, the second electrode, and the electronic component is laser-structured so that the first and second electrodes can be electrically contacted from one side of the electronic component. Specifically, a first conductive element is assigned to the first electrode having a first potential, and a second conductive element is assigned to the second electrode having a second potential.

[0059] In a preferred embodiment, a first conductive element electrically contacts a first electrode, and a second conductive element electrically contacts a second electrode. In a preferred embodiment, the first conductive element and / or the second conductive element are configured to make conductive contact with an external junction box. The junction box should be understood, in particular, as an element used to electrically connect at least one busbar of an electronic component to a circuit.

[0060] The object of the present invention is also achieved by providing a protective laminate having at least one integrated electrical contact element for coating and conductively contacting semi-finished electronic components, particularly according to one of the above exemplary embodiments. In this case, in particular, the advantages described in combination with the protective laminate having at least one integrated electrical contact element, the method for manufacturing the protective laminate having at least one integrated electrical contact element, and the method for coating and conductively contacting semi-finished electronic components are provided for use in a protective laminate having at least one integrated electrical contact element.

[0061] In a preferred embodiment, the protective laminate serves as winding protection for the electronic components. Winding protection should be understood in particular as a coating used to protect the electronic components from environmental influences and / or damage. After the coating is applied as winding protection, the electronic components coated with this coating can be transferred to another system where further processing steps are performed. Attached Figure Description

[0062] The present invention will now be described in detail with reference to the accompanying drawings, wherein:

[0063] Figure 1 A schematic diagram of an exemplary embodiment of a protective laminate having a protective layer and an integrated electrical contact element is shown in a side view.

[0064] Figure 2 A schematic diagram of an exemplary embodiment of a protective laminate having two protective layers and two integrated electrical contact elements is shown in a side view.

[0065] Figure 3A schematic diagram of an exemplary embodiment of a protective laminate having a protective layer and two integrated electrical contact elements is shown in a side view.

[0066] Figure 4 A schematic diagram of an exemplary embodiment of a protective laminate having a getter layer and two integrated electrical contact elements is shown in a side view.

[0067] Figure 5 A schematic diagram of an exemplary embodiment of a protective laminate in which a metal layer is sandwiched between two protective layers is shown in a side view;

[0068] Figure 6 A schematic diagram of an exemplary embodiment of a protective laminate with three protective layers is shown in a side view;

[0069] Figure 7 The process steps for manufacturing a protective laminate with integrated electrical contact elements are schematically illustrated; and

[0070] Figure 8 A method for coating and conductively contacting semi-finished electronic components is illustrated schematically. Detailed Implementation

[0071] Exemplary Implementation Scheme 1

[0072] Figure 1 A schematic diagram of an exemplary embodiment of a protective laminate 10 having a protective layer 12 and an integrated electrical contact element 11 is shown in a side view. In this exemplary embodiment, the protective laminate 10 is flexible.

[0073] A protective laminate 10 for coating and conductive contacting a semi-finished electronic product 50, having an integrated electrical contact element 11, preferably a busbar, comprises: a protective layer 12 having a top side and a bottom side; a non-conductive adhesive layer 15 on the bottom side of the protective layer 12; an electrical contact element 11 embedded in the non-conductive adhesive layer 15, wherein the bottom side of the electrical contact element 11 is at least partially not covered by the non-conductive adhesive layer 15, wherein a conductive adhesive 16 is disposed on the bottom side of the electrical contact element 11; and a release liner 17 covering the non-conductive adhesive layer 15 and the conductive adhesive 16 on the side opposite to the protective layer 12, wherein the adhesive strength of the non-conductive adhesive layer 15 and the conductive adhesive 16 is within the same range. In this exemplary embodiment, the release liner 17 includes a non-stick coating 18 on the top side facing the non-conductive adhesive layer 15 and the conductive adhesive 16. In one configuration of the invention, the non-stick coating 18 is formed of a fluorinated silicone system.

[0074] By protecting the laminate 10, simple and reliable conductive contact is ensured. Furthermore, damage to the sensitive stack 60 and / or electrodes 52, 56 of the electronic component 100 is avoided. Advantageously, a ready-to-use solution for conductive contact of a semi-finished electronic component 50 is provided, wherein, particularly since the layers are not deposited layer by layer, they can be applied rapidly.

[0075] In one embodiment of the invention, the adhesive strength of the non-conductive adhesive layer 15 and the adhesive strength of the conductive adhesive 16 are 0.3 N / 25 mm to 9 N / 25 mm, preferably 2 N / 25 mm to 8 N / 25 mm, or preferably 4 N / 25 mm to 7 N / 25 mm, and / or the adhesive strength of the non-conductive adhesive layer 15 and the adhesive strength of the conductive adhesive 16 differ from each other by a maximum of 3 N / 25 mm, preferably a maximum of 2 N / 25 mm, or preferably a maximum of 1 N / 25 mm.

[0076] In another configuration of the invention, the release liner 17 has a thickness of 20µm to 300µm, preferably 20µm to 200µm, preferably 20µm to 100µm, or preferably 20µm to 50µm.

[0077] In another configuration of the invention, at least one protective layer 12 forms a closed layer, particularly a closed layer without pores, and preferably, the protective layer pressing member 10 forms a closed layer without pores.

[0078] In another embodiment of the invention, the surface formed by the non-conductive adhesive layer 15 and the conductive adhesive 16 on the side facing the release liner 17 is substantially flat and coherent, particularly with transition areas or topological differences on the surface less than 5µm, preferably less than 3µm.

[0079] In another configuration of the invention, the non-conductive adhesive layer 15 is formed of pressure-sensitive adhesive (PSA), and / or the non-conductive adhesive layer 15 has a thickness of 50µm to 200µm.

[0080] In another configuration of the invention, the conductive adhesive 16 on the bottom side of the electrical contact element 11 is formed of pressure-sensitive adhesive (PSA), and / or the conductive adhesive 16 has a thickness of 5µm to 50µm, preferably 10µm to 40µm.

[0081] In another embodiment of the invention, the electrical contact element 11 is a strip or wire, wherein the strip preferably has a width of 2 mm to 30 mm, more preferably 5 mm to 20 mm, and a thickness of 10 µm to 80 µm. In another embodiment of the invention, the electrical contact element 11 is made of a metal or an alloy thereof, preferably Al, Cu, Sn, or alloys thereof.

[0082] In exemplary embodiment 1, the protective laminate 10 includes a release liner 17 with a thickness of 40 µm. An electrical contact element 11 is laminated on the top side of the release liner 17, and a conductive adhesive 16 is present on its bottom side. The electrical contact element 11 has a thickness of 35 µm and a width of 16 mm, and is formed of copper. The conductive adhesive 16 is formed of a pressure-sensitive adhesive (PSA) comprising conductive particles and has a layer thickness of 23 µm. The release liner 17 and the electrical contact element 11 are covered from the top side by a non-conductive adhesive layer 15, such that the space between the electrical contact element 11 and the release liner 17 is filled. The non-conductive adhesive layer 15 has a layer thickness of 100 µm and is formed of a pressure-sensitive adhesive (PSA) (e.g., a silicone system). A protective layer 12 is disposed on top of the protective laminate 10. The protective layer 12 is a polymer film, such as a PET film. The release liner 17 covers the adhesives 15 and 16 and prevents accidental application before use. The adhesive strength of the non-conductive adhesive layer 15 and the adhesive strength of the conductive adhesive 16 are coordinated to be within the range of 5 N / 25 mm to 6 N / 25 mm, and measured according to DIN EN ISO 29862, by peeling a 25 mm wide strip from an aluminum plate at a 90° angle at a speed of 300 mm / min. The strip is pre-laminated onto the aluminum plate and the measurement is performed after 24 hours.

[0083] The non-conductive adhesive layer 15 and the conductive adhesive 16 are thermocured at a temperature of 40°C to 150°C, or alternatively cured by ultraviolet radiation, for example in the wavelength range of 350 nm to 430 nm, particularly in the range of 365 nm to 410 nm, for example, with an ultraviolet radiation dose of 0.150 J / cm² to 1.20 J / cm². Alternatively, in another step, the non-conductive adhesive layer 15 and the conductive adhesive 16 are preferably dried at a temperature of 30°C to 60°C.

[0084] Exemplary Implementation Scheme 2

[0085] Figure 2 A schematic diagram of an exemplary embodiment of a protective laminate 10 having two protective layers 12, 13 and two integrated electrical contact elements 11 is shown in a side view. Identical and functionally identical elements have the same reference numerals, and thus refer to the description above for this purpose. In this exemplary embodiment, the protective laminate 10 is flexible.

[0086] In another configuration of the invention, the protective laminate 10 includes at least two protective layers 12, 13, and preferably at least three protective layers 12, 13, 14.

[0087] In another embodiment of the invention, at least one protective layer 12 is formed of a polymer layer, which is preferably selected from the group consisting of polyethylene terephthalate (PET), polyolefin, polyether ether ketone (PEEK), polyethylene naphthalate (PEN), and polycarbonate (PC), wherein preferably, the thickness of the polymer layer is from 10 µm to 100 µm, more preferably from 10 µm to 30 µm.

[0088] In another embodiment of the invention, at least one protective layer 12 is formed of a metal layer, particularly a metal layer of Al, Cu or alloys thereof, wherein preferably, the thickness of the metal layer is from 10 µm to 100 µm, more preferably from 10 µm to 30 µm.

[0089] In an alternative configuration, the second protective layer 13 may be a polymer film formed of a polymer that is different from the polymer of the first protective layer 12.

[0090] Compared to exemplary embodiment 1, the protective laminate 10 has two protective layers 12, 13 laminated together on top of the laminate 10 by means of an adhesive, and two integrated electrical contact elements 11. The first protective layer 12 facing away from the non-conductive adhesive layer 15 is a polymer film, such as a PET film. The second protective layer 13 facing the non-conductive adhesive layer 15 is a polymer film including a getter material (e.g., CaO) with a layer thickness of 40 µm. The getter material can bind water trapped in the electronic component 100 or water diffused into the electronic component 100 from the outside. The release liner 17 and the electrical contact elements 11 are covered from the top side by the non-conductive adhesive layer 15, such that the space between the two electrical contact elements 11 and the space between the electrical contact elements 11 and the release liner 17 are filled.

[0091] Exemplary Implementation Scheme 3

[0092] Figure 3 A schematic diagram of an exemplary embodiment of a protective laminate 10 having a protective layer 12 and two integrated electrical contact elements 11 is shown in a side view. Identical and functionally identical elements have the same reference numerals, and thus refer to the description above for this purpose. In this exemplary embodiment, the protective laminate 10 is flexible.

[0093] Compared to exemplary embodiment 1, the protective laminate 10 has a protective layer 12, which is a metal layer, such as a layer formed of Al, with a layer thickness of 20 µm. Furthermore, the protective laminate 10 has two integrated electrical contact elements 11.

[0094] Exemplary Implementation Scheme 4

[0095] Figure 4A schematic diagram of an exemplary embodiment of a protective laminate 10 having a getter layer 19 and two integrated electrical contact elements 11 is shown in a side view. Identical and functionally identical elements have the same reference numerals, and thus refer to the description above for this purpose. In this exemplary embodiment, the protective laminate 10 is flexible.

[0096] In another embodiment of the invention, at least one protective layer 12 comprises a getter material, or the protective layer 10 comprises a getter layer 19 comprising getter material disposed between at least one protective layer 12 and a non-conductive adhesive layer 15 or between two protective layers 12, 13. The getter material may be calcium oxide, phosphorus pentoxide, barium oxide, magnesium perchlorate, calcium sulfate, copper sulfate zeolite, alkaline earth metals, and / or their chemical oxide compounds.

[0097] Compared to exemplary embodiment 1, an additional getter layer 19 for binding water is present between the protective layer 12 and the non-conductive adhesive layer 15. The getter layer 19 is a polymer film comprising a getter material (e.g., CaO) having a layer thickness of 50 µm. Furthermore, the protective laminate 10 has two integrated electrical contact elements 11. In an alternative configuration, the protective layer 12 is formed of a metallic layer, such as a layer formed of Al.

[0098] Exemplary Implementation Scheme 5

[0099] Figure 5 A schematic diagram of an exemplary embodiment of a protective laminate 10, in which a metal layer 20 is sandwiched between two protective layers 12, 13, is shown in a side view. Identical and functionally identical elements have the same reference numerals, and thus refer to the description above for this purpose. In this exemplary embodiment, the protective laminate 10 is flexible.

[0100] In another embodiment of the invention, the protective laminate 10 includes a metal layer 20 disposed on the top side of at least one protective layer 12 facing away from the non-conductive adhesive layer 15, sandwiched between two protective layers 12, 13, or disposed on the bottom side of at least one protective layer 12 facing the non-conductive adhesive layer 15. Preferably, the thickness of the metal layer 20 is from 10 µm to 100 µm, more preferably from 10 µm to 30 µm.

[0101] In exemplary embodiment 5, the protective laminate 10 includes a release liner 17 with a thickness of 100 µm formed of a silicone system. Two electrical contact elements 11 are laminated on the top side of the release liner 17, and a conductive adhesive 16 is present on their bottom sides. The electrical contact elements 11 have a thickness of 20 µm and a width of 10 mm, and are formed of Al. The conductive adhesive 16 is formed of a pressure-sensitive adhesive (PSA) including conductive particles and has a layer thickness of 16 µm. The release liner 17 and the electrical contact elements 11 are covered from the top side by a non-conductive adhesive layer 15 with a layer thickness of 150 µm, which is formed of a pressure-sensitive adhesive (PSA) (e.g., a silicone system). Two protective layers 12 and 13 are arranged on the top of the laminate. The first protective layer 12, facing away from the non-conductive adhesive layer 15, is a polymer film, such as a PET film. The second protective layer 13 facing the non-conductive adhesive layer 15 is a polymer film including a getter material (e.g., CaO) with a layer thickness of 40 µm. A metal layer 20 is laminated between the two protective layers 12 and 13. A release liner 17 covers the adhesives 15 and 16. The adhesive strength of the non-conductive adhesive layer 15 and the adhesive strength of the conductive adhesive 16 are in the range of 5 N / 25 mm to 6 N / 25 mm.

[0102] Exemplary Implementation Scheme 6

[0103] Figure 6 A schematic diagram of an exemplary embodiment of a protective laminate 10 having three protective layers 12, 13, and 14 is shown in a side view. Identical and functionally identical elements have the same reference numerals, and thus refer to the description above for this purpose. In this exemplary embodiment, the protective laminate 10 is flexible.

[0104] Compared to exemplary embodiment 2, the protective laminate 10 includes three protective layers 12, 13, and 14 laminated together by means of an adhesive. Protective layer 12, facing away from the non-conductive adhesive layer 15, is formed of a polymer film (e.g., PET) with a layer thickness of 100 µm. Protective layer 13, having a layer thickness of 10 µm, is formed of a metal layer (e.g., Al) sandwiched between protective layers 12 and 14. Protective layer 14, facing the non-conductive adhesive layer 15, is a getter layer formed of a polymer layer including a getter material (e.g., CaO) with a layer thickness of 20 µm.

[0105] Exemplary Implementation Scheme 7

[0106] Figure 7The process steps for manufacturing a protective laminate 10 having integrated electrical contact elements 11 are schematically illustrated. Identical and functionally identical elements have the same reference numerals, and thus refer to the description above for this purpose. In this exemplary embodiment, the semi-finished electronic component 50 is a semi-finished flexible photovoltaic element.

[0107] A method for manufacturing a protective laminate 10 having at least one integrated electrical contact element 11 includes the following steps: a) providing a release liner 17; b) laminating at least one electrical contact element 11, preferably at least one busbar, onto the top side of the release liner 17, wherein a conductive adhesive 16 is applied to the bottom side of the at least one electrical contact element 11 or to the area on the top side of the release liner 17 where the at least one electrical contact element 11 is applied; c) providing at least one protective layer 12; d) applying a non-conductive adhesive layer 15 onto the bottom side of the at least one protective layer 12 and / or the top side of the release liner 17 having the at least one electrical contact element 11 from step b); e) laminating the release liner 17 having the at least one electrical contact element 11 from step b) on the top side together with at least one protective layer 12 having the non-conductive adhesive layer 15 from step d) on the bottom side. At least one electrical contact element 11 is covered by the non-conductive adhesive layer 15. After step e), the non-conductive adhesive layer 15 is cured by ultraviolet light in step e1). Alternatively, the adhesive may also be cured by temperature curing and / or polymerization curing. In step f), a protective laminate 10 having at least one integrated electrical contact element 11 is obtained and may be wound onto a spool.

[0108] In exemplary embodiment 7, release liner 17 is provided as a base material on which other components are deposited. In step e), release liner 17, having the two electrical contact elements 11 of step b) on the top side, is laminated together with protective layer 12, having the non-conductive adhesive layer 15 of step d) on the bottom side. During lamination in or after step e), additional pressure is applied to at least one side of the protective laminate 10 to be obtained.

[0109] In another embodiment of the invention, the non-conductive adhesive layer 15 has an adhesive strength of 0.3 N / 25 mm to 9 N / 25 mm, preferably 4 N / 25 mm to 7 N / 25 mm.

[0110] In another configuration of the invention, the adhesive strength of the non-conductive adhesive layer 15 and the adhesive strength of the conductive adhesive 16 are within the same range. Preferably, the adhesive strength of the non-conductive adhesive layer 15 and the adhesive strength of the conductive adhesive 16 differ by a maximum of 3 N / 25 mm.

[0111] Exemplary Implementation Scheme 8

[0112] Figure 8 Side view ( Figure 8 A) and top view ( Figure 8 B) A method for coating and conductively contacting a semi-finished electronic component 50 is schematically illustrated. Identical and functionally identical elements have the same reference numerals, thus referring to the description above for this purpose. In this exemplary embodiment, the electronic component 100 is a flexible photovoltaic element. In particular, the photovoltaic element is laser-structured.

[0113] A method for coating and conductively contacting a semi-finished electronic component 50 with a protective laminate 10 including at least one integrated electrical contact element 11 includes the following steps: g) providing a semi-finished electronic component 50, the semi-finished electronic component 50 including at least one electrode on the top side of the semi-finished electronic component; h) providing a protective laminate 10 having at least one integrated electrical contact element 11; i) removing the release liner 17 of the protective laminate 10; j) aligning the bottom side of the protective laminate 10 with the top side of the semi-finished electronic component 50, wherein at least one electrical contact element 11 of the protective laminate 10 is positioned relative to at least one electrode 52, 56 of the semi-finished electronic component 50; k) laminating the protective laminate 10 without the release liner 17 from step i) to the semi-finished electronic component 50 by applying pressure, such that the protective laminate 10 is fixed to the semi-finished electronic component 50, and at least one electrical contact element 11 is in conductive contact with at least one electrode of the semi-finished electronic component 50; and l) obtaining a coated and conductively contacted electronic component 100. Specifically, this method is used to laminate a protective laminate 10 onto a semi-finished electronic component 50. Specifically, the protective laminate 10 completely covers the top side of the electronic component 100.

[0114] In another configuration of the invention, the method is performed using a roll-to-roll process.

[0115] In another configuration of the invention, the semi-finished electronic component 50 has a first electrode 52, a second electrode 56 and a stack 60 including at least one photosensitive layer 54 on a substrate 51, wherein the stack 60 is arranged between the first electrode 52 and the second electrode 56, and wherein at least one electrical contact element 11 is in conductive contact with the first electrode 52 and / or the second electrode 56. Preferably, the electronic component 100 is a flexible electronic component, more preferably a flexible photovoltaic element.

[0116] In an exemplary embodiment, the semi-finished electronic component 50 is a semi-finished optoelectronic element, particularly a semi-finished photovoltaic element. The semi-finished photovoltaic element includes a substrate 51, such as a foil, on which a first electrode 52, such as indium tin oxide (ITO), is located. A layer system 60 is disposed thereon, having at least one photosensitive layer 54 comprising an absorber material, preferably a donor / acceptor heterojunction, followed by a second electrode 56, such as Al. The semi-finished electronic component 50 may also be a laser-structured electronic component.

[0117] Figure 8 A side view illustrates the lamination of a protective laminate 10 and a semi-finished electronic component 50 using spools 201 with different Shore hardnesses. To laminate the protective laminate 10 onto the semi-finished electronic component 50, two different Shore hardnesses are used in the spool 201, for example, located in different regions 202 and 203 of the spool. While the spool 201 has a first region 202 with lower hardness, specifically providing lower pressure, there is a second region 203 with higher hardness, specifically providing higher pressure, thus applying pressure of different intensities during lamination. During lamination, the second region 203 with higher pressure is positioned on at least one electrical contact element 11.

[0118] Figure 8 B, in top view, illustrates the lamination of a protective laminate 10 and a semi-finished electronic component 50 using two rollers 204 and 205 with different Shore hardnesses. During lamination, pressure is applied using the two rollers 204 and 205 with different Shore hardnesses. The first roller 204, with lower hardness (lower pressure), is used across the entire width of the protective laminate 10 that must be laminated onto the semi-finished electronic component 50, while the second roller 205, with higher hardness (higher pressure), is used across a smaller width, particularly in the area where the electrical contact element 11 is located, and this second roller is applied to the electrodes 52 and 56 of the semi-finished electronic component 50.

[0119] This allows the protective laminate 10 and the semi-finished electronic component 50 to be uniformly laminated across the entire width of the semi-finished electronic component 50. Furthermore, applying high pressure in the region of the electrical contact element 11 is to establish a secure conductive connection between at least one electrical contact element 11 and the electrodes 52, 56.

Claims

1. A protective laminate (10) for coating and conductive contacting a semi-finished electronic product (50) having at least one integrated electrical contact element (11) and preferably at least one busbar, said protective laminate (10) comprising: It has at least one protective layer (12) with a top side and a bottom side. A non-conductive adhesive layer (15) on the bottom side of the at least one protective layer (12); at least one electrical contact element (11) embedded in the non-conductive adhesive layer (15), wherein the bottom side of the at least one electrical contact element (11) is at least partially not covered by the non-conductive adhesive layer (15), wherein a conductive adhesive (16) is disposed on the bottom side of the at least one electrical contact element (11); And a release liner (17) covering the non-conductive adhesive layer (15) and the conductive adhesive (16) on the side opposite to the at least one protective layer (12), wherein the adhesive strength of the non-conductive adhesive layer (15) and the conductive adhesive (16) is in the same range.

2. The protective laminate (10) according to claim 1, wherein the adhesive strength of the non-conductive adhesive layer (15) and the adhesive strength of the conductive adhesive (16) are 0.3 N / 25 mm to 9 N / 25 mm, preferably 4 N / 25 mm to 7 N / 25 mm, and / or the adhesive strength of the non-conductive adhesive layer (15) and the adhesive strength of the conductive adhesive (16) differ from each other by a maximum of 3 N / 25 mm, preferably by a maximum of 1 N / 25 mm.

3. The protective laminate (10) according to claim 1 or 2, wherein the release liner (17) has a thickness of 20µm to 300µm, and / or the release liner (17) includes a non-stick coating (18) on the top side facing the non-conductive adhesive layer (15) and the conductive adhesive (16), the non-stick coating (18) preferably being a fluorinated silicone system.

4. The protective laminate (10) according to any one of the preceding claims, wherein the protective laminate (10) comprises at least two protective layers (12, 13), preferably at least three protective layers (12, 13, 14).

5. The protective laminate (10) according to any one of the preceding claims, wherein at least one protective layer (12) is formed of a polymer layer and / or at least one metal layer, particularly a metal layer of Al, Cu or alloys thereof, wherein the polymer layer is preferably selected from the group consisting of polyethylene terephthalate (PET), polyolefin, polyether ether ketone (PEEK), polyethylene naphthalate (PEN) and polycarbonate (PC), wherein preferably, the thickness of the polymer layer is from 10 µm to 100 µm, wherein preferably, the thickness of the metal layer is from 10 µm to 100 µm.

6. The protective laminate (10) according to any one of the preceding claims, wherein at least one protective layer (12) comprises a getter material, or the protective laminate (10) comprises a getter layer (19) comprising getter material disposed between the at least one protective layer (12) and the non-conductive adhesive layer (15) or between two protective layers (12, 13), wherein, in particular, the getter material is calcium oxide, phosphorus pentoxide, barium oxide, magnesium perchlorate, calcium sulfate, copper sulfate, zeolite, alkaline earth metals and / or their chemical oxide compounds.

7. The protective laminate (10) according to any one of the preceding claims, wherein the protective laminate (10) comprises a metal layer (20) disposed on the top side of the at least one protective layer (12) facing away from the non-conductive adhesive layer (15), sandwiched between two protective layers (12, 13), or disposed on the bottom side of the at least one protective layer (12) facing the non-conductive adhesive layer (15), preferably, the thickness of the metal layer (20) is 10µm to 100µm.

8. The protective laminate (10) according to any one of the preceding claims, wherein the at least one protective layer (12) forms a closed layer, particularly a closed layer without pores, preferably, the protective laminate (10) forms a closed layer without pores.

9. The protective laminate (10) according to any one of the preceding claims, wherein the surface formed by the non-conductive adhesive layer (15) and the conductive adhesive (16) on the side facing the release liner (17) is substantially flat and coherent, and in particular, the transition area or topological difference on the surface is less than 5µm, preferably less than 3µm.

10. The protective laminate (10) according to any one of the preceding claims, wherein the non-conductive adhesive layer (15) is formed of pressure-sensitive adhesive (PSA), and / or the non-conductive adhesive layer (15) has a thickness of 50µm to 500µm, preferably 50µm to 150µm.

11. The protective laminate (10) according to any one of the preceding claims, wherein the conductive adhesive (16) is formed of pressure-sensitive adhesive (PSA), and / or the conductive adhesive (16) has a thickness of 4µm to 100µm, preferably 5µm to 30µm.

12. The protective laminate (10) according to any one of the preceding claims, wherein the at least one electrical contact element (11) is a strip or wire, wherein the strip preferably has a width of 1 mm to 50 mm and / or a thickness of 10 µm to 100 µm, preferably 20 µm to 50 µm, wherein preferably, the at least one electrical contact element (11) is made of metal or an alloy thereof, preferably made of Al, Cu, Sn or alloys thereof.

13. The protective laminate (10) according to any one of the preceding claims, wherein the protective laminate (10) is flexible.

14. A method for manufacturing a protective laminate (10) having at least one integrated electrical contact element (11), particularly a protective laminate according to any one of claims 1 to 13, the method comprising the steps of: a) Provide release liner (17); b) Laminating the at least one electrical contact element (11), preferably at least one busbar, onto the top side of the release liner (17), wherein conductive adhesive (16) is applied to the bottom side of the at least one electrical contact element (11) or to the area on the top side of the release liner (17) where the at least one electrical contact element (11) is applied. c) Provide at least one protective layer (12); d) Apply a non-conductive adhesive layer (15) to the bottom side of the at least one protective layer (12) and / or the top side of the release liner (17) having the at least one electrical contact element (11) of step b); e) laminating the release liner (17) having at least one electrical contact element (11) of step b) on the top side with at least one protective layer (12) having the non-conductive adhesive layer (15) of step d) on the bottom side; and f) Obtain the protective laminate (10) having at least one integrated electrical contact element (11).

15. The method according to claim 14, wherein between step e) and step f), in step e1), the non-conductive adhesive layer (15) is preferably cured by ultraviolet curing, temperature curing and / or polymerization curing.

16. The method according to claim 14 or 15, wherein the non-conductive adhesive layer (15) has an adhesive strength of 0.3 N / 25 mm to 9 N / 25 mm, preferably 4 N / 25 mm to 7 N / 25 mm.

17. The method according to any one of claims 14 to 16, wherein the adhesive strength of the non-conductive adhesive layer (15) and the adhesive strength of the conductive adhesive (16) are within the same range, preferably, the adhesive strength of the non-conductive adhesive layer (15) and the adhesive strength of the conductive adhesive (16) differ by a maximum of 3N / 25mm, preferably by a maximum of 1N / 25mm.

18. A method for coating and conductively contacting a semi-finished electronic component (50), preferably a laser-structured electronic component, with a protective laminate (10) comprising at least one integrated electrical contact element (11) manufactured according to claims 1 to 13 or by the method according to claims 14 to 17, the method comprising the steps of: g) Provide the semi-finished electronic component (50), the semi-finished electronic component (50) including at least one electrode on the top side of the semi-finished electronic component; h) Provide the protective laminate (10) having at least one integrated electrical contact element (11). i) Remove the release liner (17) of the protective laminate (10). j) Align the bottom side of the protective laminate (10) with the top side of the semi-finished electronic component (50), wherein at least one electrical contact element (11) of the protective laminate (10) is positioned opposite to at least one electrode of the semi-finished electronic component (50). k) By applying pressure, the protective laminate (10) without release liner (17) from step i) is laminated together with the semi-finished electronic component (50), such that the protective laminate (10) is fixed to the semi-finished electronic component (50), and at least one electrical contact element (11) is in conductive contact with at least one electrode of the semi-finished electronic component (50). as well as l) Obtain an electronic component (100) that is coated and has conductive contact.

19. The method of claim 18, wherein the method is performed in a roll-to-roll process.

20. The method according to claim 18 or 19, wherein the semi-finished electronic component (50) has a first electrode (52), a second electrode (56) and a stack (60) including at least one photosensitive layer (54) on a substrate (51), wherein the stack (60) is arranged between the first electrode (52) and the second electrode (56), wherein the at least one electrical contact element (11) is in conductive contact with the first electrode (52) and / or the second electrode (56), preferably, the electronic component (100) is a flexible electronic component, more preferably a flexible photovoltaic element.

21. Use of a protective laminate (10) having at least one integrated electrical contact element (11) manufactured according to any one of claims 1 to 13 or by the method according to any one of claims 14 to 17 for coating and conductive contacting semi-finished electronic components (50).

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