Thin film deposition micro-nano machining device and process
By using a protective shield, guide shield, and jet cleaning assembly in a thin film deposition equipment, and by bombarding the oxide layer on the target surface with high-purity argon gas, the problem of deposition inhomogeneity caused by target oxidation was solved, and high-quality thin film deposition was achieved.
Patent Information
- Application Number
- CN202511223291.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2025-12-02
AI Technical Summary
When existing thin film deposition equipment is turned on, the target surface is easily oxidized, leading to uneven deposition in subsequent processes.
The design incorporates a protective shield, a guide shield, an air jet cleaning component, and a sealing component. High-purity argon gas is used to bombard the oxide layer on the target surface, and the target is heated in a vacuum environment to ensure uniform deposition of ions or molecules on the target.
It improves the uniformity and quality of thin film deposition, avoids target oxidation, and ensures the consistency of deposition on the product surface.
Smart Images

Figure CN121046802A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of thin film deposition technology, and particularly relates to a thin film deposition micro / nano fabrication device and process. Background Technology
[0002] Thin film deposition is a technique that uses physical, chemical, or physicochemical methods to prepare one or more thin film materials with thicknesses ranging from nanometers (a few nanometers) to micrometers (tens of micrometers) on the surface of a solid substrate (such as silicon wafers, glass, metals, etc.). These thin films have different compositions, structures, or properties from the substrate material and can endow the substrate with specific functions (such as conductivity, insulation, wear resistance, optical transparency, etc.), making them one of the core technologies in fields such as micro-nano processing, semiconductor manufacturing, optoelectronic displays, and new energy.
[0003] When existing thin film deposition equipment processes products, the number of products processed at one time is limited. Therefore, when the deposition equipment is turned on, the target material, which is in a high-temperature state, comes into contact with the outside air. This causes the surface of the target material to be easily oxidized by oxygen. Consequently, during subsequent use, the target material cannot uniformly generate target material ions or molecules under heating conditions, thus affecting the uniformity of the deposition on the product surface. Summary of the Invention
[0004] To address the aforementioned problems, this invention provides a thin film deposition micro / nano fabrication apparatus and process, thereby resolving the issues raised in the background section.
[0005] To achieve the above objectives, the present invention provides the following technical solution: A thin film deposition micro / nano fabrication apparatus includes a deposition chamber, a mounting platform fixedly installed on the bottom inner wall of the deposition chamber, a target holder rotatably mounted at the top center of the mounting platform, a motor mounted at the bottom of the mounting platform, the output shaft of the motor rotatably penetrating and inserting into the mounting platform and drivingly connected to the bottom of the target holder, a target material placed on the top of the target holder, a retaining sleeve fitted on the outside of the target material for fastening the target material to the target holder, and the retaining sleeve having an opening at the top center, and a protective device provided on the outside of the target holder, the protective device including a protective cover, a guide cover, a sealing assembly, and an air jet cleaning assembly; The protective cover is detachably mounted on the top of the mounting platform, and a through hole is provided on the top of the protective cover. The target material and the target base are both located at the axial position inside the protective cover. The guide cover is conical and is detachably inserted into the through hole. The diameter of the guide cover gradually increases from bottom to top. The sealing assembly is located at the bottom of the guide cover and is used to control the closing or opening of the bottom opening of the guide cover. The jet cleaning assembly is located inside the protective cover and is used to introduce high-purity argon gas to clean the oxide layer on the top surface of the target material.
[0006] Furthermore, the sealing assembly includes a fixed plate, a sealing plate, a slider, and a driving mechanism; The fixed plates are numerous and evenly distributed in a ring inside the protective cover. The fixed plates are horizontally fixed to the side wall of the protective cover. The sealing plate is fan-shaped, and multiple sealing plates can be spliced to form a complete circle. The sealing plate is slidably mounted on the top of the fixed plate. The slider is fixedly connected to the bottom of the sealing plate. A strip-shaped limiting hole is opened through the fixed plate opposite to the slider, and the length direction of the limiting hole is the same as the diameter direction of the protective cover. The slider is slidably connected to the limiting hole. The driving mechanism is installed at the bottom of the multiple fixed plates and is used to drive the sealing plate to move when the target material rotates, thereby realizing the closing or opening of the bottom opening of the guide cover.
[0007] Furthermore, the drive mechanism includes a rotating ring, a dial plate, a guide post, a stop bar, and a dial block; The rotating ring is rotatably mounted on the bottom of multiple fixed plates, and the rotating ring guide cover is coaxial. The number of the lever plates is the same as the number of fixed plates. Multiple lever plates are horizontally distributed on the bottom of multiple fixed plates and fixedly connected to the outside of the rotating ring. Each lever plate has a through-hole in the shape of a strip, and the guide hole is not parallel to the limiting hole. The guide post is vertically fixedly connected to the bottom of the slider and is inserted through the guide hole on the corresponding lever plate at the bottom of the fixed plate. There are multiple stop rods, which are evenly distributed in a ring at the bottom of the rotating ring, and the top of the stop rod is fixedly connected to the bottom of the rotating ring. The number of lever blocks is the same as the number of stop rods. The lever blocks are evenly distributed in a ring at the top of the sleeve and fixedly connected to the top of the sleeve. The lever blocks and the stop rods are located on the same ring motion trajectory, and the lever blocks can contact the stop rods.
[0008] Furthermore, the jet cleaning assembly includes an air intake pipe, a first annular pipe, a jet pipe, and a return mechanism; The air intake pipe is sequentially inserted through the inner rear wall of the deposition tank and the side wall of the mounting platform. The first annular pipe is horizontally arranged inside the mounting platform and is coaxial with the protective cover. The first annular pipe is connected to the air intake pipe. The number of jet pipes is the same as the number of levers, and multiple levers and multiple air intake pipes are alternately distributed. Multiple jet pipes are uniformly and vertically fixed to the top of the first annular pipe. The top of the jet pipe is inserted through the inner area of the protective cover and bends towards the top surface of the target material. The reflux mechanism is arranged inside the mounting platform and is used to remove oxides cleaned from the top surface of the target material.
[0009] Furthermore, the reflux mechanism includes a reflux pipe, a second annular pipe, and a suction pipe; The return pipe is sequentially inserted through the inner rear wall of the sedimentation tank and the side wall of the mounting platform, and a control valve is installed on both the return pipe and the air inlet pipe. The second annular pipe is horizontally arranged inside the mounting platform, and the second annular pipe is coaxial with the first annular pipe. There are multiple suction pipes, and multiple suction pipes are fixedly connected to the top of the second annular pipe. The top end of the suction pipe is inserted through the inner area of the protective cover, and the top end of the suction pipe is flush with the top surface of the mounting platform.
[0010] Furthermore, a control cabinet is provided on one side of the deposition tank, and a vacuum pump is connected between the control cabinet and the deposition tank.
[0011] Furthermore, a shelf is installed on the top inner wall of the deposition tank for placing the product to be deposited.
[0012] Furthermore, a rolling bearing is rotatably sleeved on the guide post, and the diameter of the rolling bearing matches the inner diameter of the guide hole.
[0013] Furthermore, the top of the sealing plate is fixedly connected with an arc-shaped sealing strip coaxial with the guide cover, and the arc-shaped sealing strips on multiple sealing plates can be spliced into a complete ring. The side of the guide cover and the side of the arc-shaped sealing strip are provided with an annular sealing groove that matches the arc-shaped sealing strip, and the arc-shaped sealing strip can be inserted into the annular sealing groove.
[0014] The present invention also provides a fabrication process using a thin film deposition micro / nano fabrication apparatus, comprising the following steps: Step 1: Place the product to be surface deposited on the shelf, then close the deposition chamber; Step 2: Start the vacuum pump through the control cabinet to perform a vacuuming operation on the deposition tank; Step 3: After the vacuuming is completed, the target base is rotated by the motor, which in turn drives multiple sealing plates to move synchronously toward the axis of the guide cover through the drive mechanism, thereby achieving the sealing operation of the bottom of the guide cover. Step 4: By opening the control valves on the inlet pipe and the return pipe, and introducing high-purity argon into the inlet pipe while the vacuum pump is in operation, the vacuum environment inside the deposition chamber is maintained. Argon ions are used to bombard the target material to remove the oxide layer on the target surface. The removed oxide layer can be discharged through the return pipe to the inside of the protective cover. Step 5: Reverse the rotation of the motor, thereby driving multiple sealing plates to move synchronously away from the axis of the guide cover through the drive mechanism, thus realizing the opening operation of the bottom of the guide cover; Step Six: The target holder can heat the target material in a vacuum environment, thereby heating the target material to a high temperature and causing it to evaporate. Subsequently, the gaseous target material atoms or molecules can migrate to the product surface to form a thin film, and the deposition is completed.
[0015] The technical effects and advantages of this invention are as follows: 1. This invention, by incorporating a jet cleaning component, allows high-purity argon gas to be introduced into the air inlet pipe before use, provided that the bottom of the guide cover is sealed by a sealing plate. This utilizes argon ions to bombard the target material, removing the oxide layer on the target surface, ensuring consistency in the deposition of all products on the shelf, and improving the product deposition quality. Furthermore, before opening the deposition chamber, the bottom of the guide cover can be sealed by a sealing plate to prevent oxygen in the outside air from contacting the target surface after the deposition chamber is opened, thus ensuring that the target material is not oxidized. 2. The present invention has a guide cover, which not only allows the target material ions or molecules to be dispersed in a uniform cone-shaped area along the inner side of the guide cover, but also blocks the ions or molecules that are gathered at the edge of the target material, ensuring the consistency of deposition of all products on the shelf and improving the product deposition quality. 3. By providing an arc-shaped sealing strip, when multiple sealing plates are fully spliced together under the pushing force of the deflector plate on the stop bar, the arc-shaped sealing strip on the sealing plate can be inserted into the annular sealing groove of the guide cover, thereby improving the sealing performance of the sealing plate to the bottom of the guide cover and preventing outside air from entering the inner area of the protective cover. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the first overall structure of the present invention; Figure 2 This is a schematic diagram of the second overall structure of the present invention; Figure 3 This is a three-dimensional schematic diagram of the deposition box and its internal structure in this invention; Figure 4 This is a three-dimensional sectional view of the mounting platform, protective cover, and guide cover structures in this invention. Figure 5 This is a first three-dimensional structural diagram of the fixing plate and sealing assembly in this invention; Figure 6 This is a second three-dimensional structural diagram of the fixing plate and sealing assembly in this invention; Figure 7 This is a three-dimensional schematic diagram of the structure of the jet cleaning component, target material, target base, and motor in this invention; Figure 8 This is a three-dimensional schematic diagram of the guide cover and some sealing components in this invention; Figure 9 This is a physical image of the present invention.
[0017] In the diagram: 1. Deposition tank; 2. Mounting platform; 3. Target holder; 4. Target material; 5. Sleeve; 6. Protective cover; 7. Guide cover; 8. Fixing plate; 9. Sealing plate; 10. Slider; 11. Rotary ring; 12. Pulley; 13. Guide column; 14. Stop bar; 15. Pulley block; 16. Guide hole; 17. Inlet pipe; 18. First annular pipe; 19. Jet pipe; 20. Return pipe; 21. Second annular pipe; 22. Suction pipe; 23. Control valve; 24. Control cabinet; 25. Vacuum pump; 26. Shelf; 27. Rolling bearing; 28. Arc-shaped sealing strip; 29. Annular sealing groove; 30. Motor. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.
[0019] This invention provides, for example Figures 1 to 9 The thin film deposition micro / nano fabrication apparatus shown includes a deposition chamber 1, a mounting platform 2 fixedly mounted on the bottom inner wall of the deposition chamber 1, a target base 3 rotatably mounted at the top center of the mounting platform 2, a motor 30 mounted at the bottom of the mounting platform 2, the output shaft of the motor 30 rotatably passing through and inserting into the mounting platform 2 and being connected to the bottom of the target base 3, a target material 4 placed on the top of the target base 3, a retaining sleeve 5 sleeved on the outside of the target material 4 for fastening the target material 4 onto the target base 3, and the retaining sleeve 5 has an opening at the top center, and a protective device is provided on the outside of the target base 3, the protective device including a protective cover 6, a guide cover 7, a sealing assembly and an air jet cleaning assembly; The protective cover 6 is detachably mounted on the top of the mounting platform 2, and a through hole is provided on the top of the protective cover 6. The target material 4 and the target base 3 are both located at the axial position inside the protective cover 6. The guide cover 7 is conical and is detachably inserted into the through hole. The diameter of the guide cover 7 gradually increases from bottom to top. The bottom opening of the guide cover 7 is slightly smaller than the diameter of the target material 4, which is used to shield ions gathered at the edge of the target material 4. A sealing assembly is provided at the bottom of the guide cover 7 to control the closing or opening of the bottom opening of the guide cover 7. Jet cleaning The component is located inside the protective cover 6 and is used to introduce high-purity argon gas to clean the oxide layer on the top surface of the target material 4. A control cabinet 24 is provided on one side of the deposition box 1. A vacuum pump 25 is connected between the control cabinet 24 and the deposition box 1. A shelf 26 is installed on the top inner wall of the deposition box 1 for placing the product to be deposited. The shelf 26 is shaped like an inverted funnel and is used to collect the evaporated ions or molecules of the target material 4 to improve the deposition efficiency of the ions or molecules of the target material 4 on the product surface. The shelf 26 is provided with several placement holes. In use, the target material 4 is first pressed onto the top of the target holder 3 by the clamp 5. Then, the protective cover 6, guide cover 7, and sealing components are installed on the top of the mounting platform 2. After installation, the workpiece to be processed is installed into the placement hole on the shelf 26. After the workpiece is installed, the deposition chamber 1 is closed and the vacuum pump 25 is started to evacuate the deposition chamber 1. After evacuation, the bottom of the guide cover 7 is sealed by the sealing components to separate the target material 4 from the workpiece on the shelf 26. Then, high-purity argon gas is introduced into the inside of the protective cover 6 through the jet cleaning component to bombard the target material 4 with argon ions and remove the oxide layer on the surface of the target material 4. At the same time, while the jet cleaning component sprays high-purity argon gas onto the top surface of the target material 4, the motor 30 can drive the target holder 3 to rotate back and forth within a certain range to ensure that the high-purity argon gas sprayed by the jet cleaning component can be evenly contacted with the top surface of the target material 4. Then, the oxide layer that has been cleaned off the surface of the target material 4 can be discharged from the protective cover 6 under the action of the jet cleaning component. Once the oxide layer on the surface of the target material 4 is cleaned, the sealing component can be completely removed from the bottom of the guide cover 7, thus preventing obstruction of the bottom of the guide cover 7. Subsequently, the heated target material 4 can release target material 4 ions or molecules, which are deposited on the workpiece surface to form a thin film under the guidance of the guide cover 7. After the workpiece has completed the deposition operation, before opening the deposition chamber 1, the bottom of the guide cover 7 can be sealed again by the sealing component, so as to prevent oxygen in the outside air from contacting the surface of the target material 4 after the deposition chamber 1 is opened, and ensure that the target material 4 will not be oxidized. Furthermore, since the existing target material 4 is generally fixed to the target base 3 by the sleeve 5, and the edge of the target material 4 is thinner than the middle part, the edge is more easily heated, resulting in more ions or molecules evaporating at the edge of the target material 4 at high temperature. Therefore, the product at the edge of the shelf 26 is deposited with ions or molecules of the target material 4 more efficiently, which can easily lead to excessively thick deposition on the surface of the product at the edge. At this time, by setting the guide cover 7, the ion or molecule of the target material 4 can not only be dispersed in a uniform cone-shaped area along the inner side of the guide cover 7, but also the ion or molecule that gathers at the edge of the target material 4 can be blocked, ensuring the consistency of deposition of all products on the shelf 26 and improving the product deposition quality.
[0020] like Figures 4 to 8As shown, the sealing assembly includes a fixed plate 8, a sealing plate 9, a slider 10, and a driving mechanism. There are multiple fixed plates 8, which are evenly distributed in a ring inside the protective cover 6. The fixed plates 8 are horizontally fixed to the side wall of the protective cover 6. The sealing plate 9 is fan-shaped, and multiple sealing plates 9 can be spliced to form a complete circle. The sealing plate 9 is slidably installed on the top of the fixed plate 8, and the top of the sealing plate 9 is in contact with the bottom of the guide cover 7. The slider 10 is fixedly connected to the bottom of the sealing plate 9. A strip-shaped limiting hole is opened through the fixed plate 8 at the position directly opposite to the slider 10. The length direction of the limiting hole is the same as the diameter direction of the protective cover 6. The slider 10 is slidably connected to the limiting hole. The driving mechanism is installed at the bottom of the multiple fixed plates 8 and is used to drive the sealing plate 9 to move when the target material 4 rotates, thereby realizing the closing or opening of the bottom opening of the guide cover 7. The driving mechanism includes a rotating ring 11, a lever 12, a guide post 13, a stop bar 14, and a lever block 15. The rotating ring 11 is rotatably mounted on the bottom of multiple fixed plates 8, and the guide cover 7 of the rotating ring 11 is coaxial. The number of levers 12 is the same as the number of fixed plates 8. The multiple levers 12 are horizontally distributed on the bottom of the multiple fixed plates 8, and the multiple levers 12 are fixedly connected to the outside of the rotating ring 11. A strip-shaped guide hole 16 is opened through the lever 12, and the guide hole 16 is not parallel to the limiting hole. The guide post 13 is vertically fixedly connected to the bottom of the slider 10, and the guide post 13 is inserted through the guide hole 16 on the corresponding lever 12 at the bottom of the fixed plate 8. The stop bar 15... There are multiple 4, multiple stop rods 14 are evenly distributed in a ring at the bottom of the rotating ring 11, and the top of the stop rod 14 is fixedly connected to the bottom of the rotating ring 11. The number of toggle blocks 15 is the same as the number of stop rods 14. The toggle blocks 15 are evenly distributed in a ring at the top of the sleeve 5. The toggle blocks 15 are fixedly connected to the top of the sleeve 5. The toggle blocks 15 and the stop rods 14 are located on the same ring motion trajectory, and the toggle blocks 15 can contact the stop rods 14. A rolling bearing 27 is rotatably sleeved on the guide post 13, and the diameter of the rolling bearing 27 matches the inner diameter of the guide hole 16. It is used to reduce the friction between the guide post 13 and the guide hole 16 when the guide hole 16 pushes the guide post 13. After the deposition chamber 1 is closed, as the inside of the deposition chamber 1 is evacuated by the vacuum pump 25, the motor 30 can drive the target 3 and the ferrule 5 to rotate. When the push block 15 on the top of the ferrule 5 contacts the stop bar 14 at the bottom of the rotating ring 11, the push block 15 can drive the rotating ring 11 and the push plate 12 to rotate together by pushing the stop bar 14. As the push plate 12 rotates, the push plate 12 can push the guide post 13 through the guide hole 16, so that the guide post 13 can drive the slider 10 and the sealing plate 9 to gradually approach the guide cover 7 along the direction of the limiting hole. When the multiple sealing plates 9 are completely spliced together, the multiple sealing plates 9 can seal the bottom opening of the guide cover 7, thereby isolating the workpiece from the target material 4. Then, high-purity argon gas can be introduced into the inner area of the protective cover 6 through the jet cleaning assembly. During the process of the jet cleaning assembly introducing high-purity argon gas into the inner side of the protective cover 6 to clean the oxide layer on the surface of the target material 4, the motor 30 can drive the target base 3 to rotate back and forth within a certain range. This ensures that the paddle block 15 does not contact the stop bar 14, allowing the top surface of the target material 4 to contact the high-purity argon gas more evenly, thereby improving the cleaning effect of the high-purity argon gas on the target material 4. After the surface of the target material 4 is cleaned, the motor 30 drives the target base 3 to rotate in the opposite direction, which causes the sleeve 5 to drive the lever 15 to contact the adjacent stop bar 14 from the opposite direction. This causes the rotating ring 11 and the lever 12 to rotate in the opposite direction under the pushing force of the lever 15 on the stop bar 14. As the lever 12 rotates in the opposite direction, the guide hole 16 on the lever 12 can push the guide post 13 to make the slider 10 and the sealing plate 9 move away from the guide cover 7 along the limiting hole. When the sealing plate 9 is completely removed from the bottom of the guide cover 7, the heated target material 4 can release target material 4 ions or molecules, which are deposited on the surface of the workpiece under the guidance of the guide cover 7 to form a thin film. After the workpiece completes the surface film deposition operation, before opening the deposition box 1, the bottom of the guide cover 7 can be sealed again according to the above operation to prevent oxygen in the outside air from contacting the surface of the target material 4 after the deposition box 1 is opened, thus ensuring that the target material 4 is not oxidized.
[0021] like Figures 2 to 7As shown, the jet cleaning assembly includes an air inlet pipe 17, a first annular pipe 18, a jet pipe 19, and a reflux mechanism. The air inlet pipe 17 is sequentially inserted through the inner rear wall of the deposition tank 1 and the side wall of the mounting platform 2. The first annular pipe 18 is horizontally arranged inside the mounting platform 2 and is coaxial with the protective cover 6. The first annular pipe 18 is connected to the air inlet pipe 17. The number of jet pipes 19 is the same as the number of deflectors 12, and the multiple deflectors 12 and multiple air inlet pipes 17 are alternately distributed. The multiple jet pipes 19 are uniformly and vertically fixed to the top of the first annular pipe 18. The top of the jet pipe 19 is inserted through the inner area of the protective cover 6, and the top of the jet pipe 19 is bent towards the top surface of the target material 4. The reflux mechanism is arranged inside the mounting platform 2 and is used to remove the oxides cleaned from the top surface of the target material 4. The reflux mechanism includes a reflux pipe 20, a second annular pipe 21, and a suction pipe 22. The reflux pipe 20 is sequentially inserted into the inner rear wall of the sedimentation tank 1 and the side wall of the mounting platform 2. Both the reflux pipe 20 and the air inlet pipe 17 are equipped with control valves 23. The reflux pipe 20 needs to be connected to the air pump during use. The second annular pipe 21 is horizontally set inside the mounting platform 2 and is coaxial with the first annular pipe 18. There are multiple suction pipes 22. Multiple suction pipes 22 are fixedly connected to the top of the second annular pipe 21. The top end of the suction pipe 22 is inserted into the inner area of the protective cover 6 and is flush with the top surface of the mounting platform 2. By incorporating a jet cleaning assembly, after multiple sealing plates 9 seal the bottom of the guide cover 7, the control valve 23 on the inlet pipe 17 and the return pipe 20 can be opened. Then, high-purity argon gas is introduced into the inlet pipe 17. Subsequently, the high-purity argon gas can be sprayed onto the top surface of the target material 4 through multiple jet pipes 19 on the first annular pipe 18, thereby using argon ions to bombard the target material 4 and remove the oxide layer on the surface of the target material 4. At the same time, while the jet pipes 19 spray high-purity argon gas onto the top surface of the target material 4, the motor 30 can drive the target base 3 to rotate back and forth within a certain range, thereby ensuring that the high-purity argon gas sprayed from the jet pipes 19 can make uniform contact with the top surface of the target material 4. In addition, the vacuum pump connected to the return pipe 20 can extract the oxide layer and gas that have been cleaned off inside the protective cover 6, preventing the cleaned-off oxide layer from remaining in the inner area of the protective cover 6, thereby ensuring the consistency of all products deposited on the subsequent shelf 26 and improving the product deposition quality. After the oxide layer on the top surface of the target 4 is cleaned, stop the introduction of high-purity argon into the inlet pipe 17, and at the same time close the pump and the valves on the return pipe 20 and the inlet pipe 17. Then the sealing plate 9 can be opened to carry out subsequent deposition operations on the surface of the workpiece.
[0022] like Figures 4 to 8As shown, an arc-shaped sealing strip 28 coaxial with the guide cover 7 is fixedly connected to the top of the sealing plate 9, and the arc-shaped sealing strips 28 on multiple sealing plates 9 can be spliced into a complete ring. An annular sealing groove 29 matching the arc-shaped sealing strip 28 is opened on the side of the guide cover 7 and the side of the arc-shaped sealing strip 28, and the arc-shaped sealing strip 28 can be inserted into the annular sealing groove 29. By providing an arc-shaped sealing strip 28, when multiple sealing plates 9 are fully spliced together under the pushing force of the lever 12 on the stop bar 14, the arc-shaped sealing strip 28 on the sealing plate 9 can be inserted into the annular sealing groove 29 of the guide cover 7, thereby improving the sealing performance of the sealing plate 9 to the bottom of the guide cover 7 and preventing outside air from entering the inner area of the protective cover 6.
[0023] The present invention also provides a fabrication process using a thin film deposition micro / nano fabrication apparatus, comprising the following steps: Step 1: Place the product to be surface deposited on shelf 26, and then close deposition chamber 1; Step 2: Start the vacuum pump 25 through the control cabinet 24 to perform a vacuuming operation on the deposition tank 1; Step 3: After the vacuuming is completed, the target base 3 is rotated by the motor 30, which in turn drives multiple sealing plates 9 to move synchronously toward the axis of the guide cover 7 through the drive mechanism, thereby achieving the sealing operation of the bottom of the guide cover 7. Step 4: By opening the control valve 23 on the inlet pipe 17 and the return pipe 20, high-purity argon gas is introduced into the inlet pipe 17 (during which the vacuum pump 25 is in operation to maintain the vacuum environment in the deposition chamber 1), the target material 4 is bombarded with argon ions to remove the oxide layer on the surface of the target material 4, and the removed oxide layer can be discharged through the return pipe 20 to the inside of the protective cover 6. Step 5: Rotate the motor 30 in reverse, thereby driving multiple sealing plates 9 to move synchronously away from the axis of the guide cover 7 through the drive mechanism, thus realizing the opening operation of the bottom of the guide cover 7; Step 6: The target holder 3 can heat the target material 4 in a vacuum environment, thereby heating the target material 4 to a high temperature and evaporating it. Then, the gaseous atoms or molecules of the target material 4 can migrate to the product surface to form a thin film, and the deposition is completed.
[0024] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it.
Claims
1. A thin film deposition micro / nano fabrication apparatus, comprising a deposition chamber (1), characterized in that: A mounting platform (2) is fixedly installed on the bottom inner wall of the sedimentation tank (1). A target seat (3) is rotatably installed at the top center of the mounting platform (2). A motor (30) is installed at the bottom of the mounting platform (2). The output shaft of the motor (30) is rotatably inserted into the mounting platform (2) and connected to the bottom of the target seat (3). A target material (4) is placed on the top of the target seat (3). A retainer (5) is fitted on the outside of the target material (4) to fasten the target material (4) to the target seat (3). The retainer (5) has an opening at the top center. A protective device is provided on the outside of the target seat (3). The protective device includes a protective cover (6) and a guide cover (6). 7) Sealing assembly and jet cleaning assembly; The protective cover (6) is detachably installed on the top of the mounting platform (2), and the top of the protective cover (6) is provided with a through hole. The target material (4) and the target seat (3) are both located at the axial position inside the protective cover (6). The guide cover (7) is conical. The guide cover (7) is detachably inserted into the through hole, and the diameter of the guide cover (7) gradually increases from bottom to top. The sealing assembly is set at the bottom of the guide cover (7) and is used to control the closing or opening of the bottom opening of the guide cover (7). The jet cleaning assembly is set inside the protective cover (6) and is used to introduce high-purity argon gas to clean the oxide layer on the top surface of the target material (4).
2. The thin film deposition micro / nano fabrication apparatus according to claim 1, characterized in that: The sealing assembly includes a fixed plate (8), a sealing plate (9), a slider (10), and a driving mechanism. There are multiple fixed plates (8), which are evenly distributed in a ring inside the protective cover (6). The fixed plates (8) are horizontally fixed to the side wall of the protective cover (6). The sealing plate (9) is fan-shaped, and multiple sealing plates (9) can be spliced into a complete circle. The sealing plate (9) is slidably installed on the top of the fixed plate (8). The slider (10) is fixedly connected to the bottom of the sealing plate (9). A strip-shaped limiting hole is opened through the fixed plate (8) at the position directly opposite to the slider (10). The length direction of the limiting hole is the same as the diameter direction of the protective cover (6). The slider (10) is slidably connected to the limiting hole. The driving mechanism is installed at the bottom of the multiple fixed plates (8) and is used to drive the sealing plate (9) to move when the target material (4) rotates, thereby realizing the closing or opening of the bottom opening of the guide cover (7).
3. The thin film deposition micro / nano fabrication apparatus according to claim 2, characterized in that: The driving mechanism includes a rotating ring (11), a lever (12), a guide post (13), a stop bar (14), and a lever block (15). The rotating ring (11) is rotatably mounted on the bottom of multiple fixed plates (8), and the rotating ring (11) is coaxial with the guide cover (7). The number of levers (12) is the same as the number of fixed plates (8). Multiple levers (12) are horizontally distributed on the bottom of multiple fixed plates (8), and multiple levers (12) are fixedly connected to the outside of the rotating ring (11). A strip-shaped guide hole (16) is opened through the lever (12), and the guide hole (16) is not parallel to the limiting hole. The guide post (13) is vertically fixedly connected to the slider (10). The bottom of the fixed plate (8) is connected to the guide hole (16) on the corresponding dial plate (12). There are multiple stop bars (14). Multiple stop bars (14) are evenly distributed in a ring at the bottom of the rotating ring (11). The top of the stop bar (14) is fixedly connected to the bottom of the rotating ring (11). The number of dial blocks (15) is the same as the number of stop bars (14). The dial blocks (15) are evenly distributed in a ring at the top of the sleeve (5). The dial blocks (15) are fixedly connected to the top of the sleeve (5). The dial blocks (15) and the stop bars (14) are located on the same ring motion trajectory. The dial blocks (15) can contact the stop bars (14).
4. The thin film deposition micro / nano fabrication apparatus according to claim 3, characterized in that: The jet cleaning assembly includes an air inlet pipe (17), a first annular pipe (18), jet pipes (19), and a reflux mechanism; the air inlet pipe (17) is sequentially inserted through and connected to the rear inner wall of the sedimentation tank (1) and the side wall of the mounting platform (2); the first annular pipe (18) is horizontally arranged on the inner side of the mounting platform (2), and the first annular pipe (18) is coaxial with the protective cover (6); the first annular pipe (18) is connected to the air inlet pipe (17); the number of jet pipes (19) is related to the number of levers ( 12) The number of the same, and the multiple dials (12) and multiple air inlet pipes (17) are alternately distributed. Multiple jet pipes (19) are uniformly and vertically fixed to the top of the first annular pipe (18). The top of the jet pipe (19) is inserted through the inner area of the protective cover (6), and the top of the jet pipe (19) is bent toward the top surface of the target material (4). The reflux mechanism is set inside the mounting platform (2) for sucking away the oxides cleaned from the top surface of the target material (4).
5. The thin film deposition micro / nano fabrication apparatus according to claim 4, characterized in that: The reflux mechanism includes a reflux pipe (20), a second annular pipe (21), and a suction pipe (22). The reflux pipe (20) is inserted into the inner wall of the rear side of the sedimentation tank (1) and the side wall of the mounting platform (2) in sequence. Control valves (23) are installed on both the reflux pipe (20) and the air inlet pipe (17). The second annular pipe (21) is horizontally arranged inside the mounting platform (2). The second annular pipe (21) is coaxial with the first annular pipe (18). There are multiple suction pipes (22). Multiple suction pipes (22) are fixedly connected to the top of the second annular pipe (21). The top end of the suction pipe (22) is inserted into the inner area of the protective cover (6). The top end of the suction pipe (22) is flush with the top surface of the mounting platform (2).
6. The thin film deposition micro / nano fabrication apparatus according to claim 5, characterized in that: A control cabinet (24) is provided on one side of the sedimentation tank (1), and a vacuum pump (25) is connected between the control cabinet (24) and the sedimentation tank (1).
7. The thin film deposition micro / nano fabrication apparatus according to claim 6, characterized in that: A shelf (26) is installed on the top inner wall of the deposition box (1) for placing the product to be deposited.
8. The thin film deposition micro / nano fabrication apparatus according to claim 7, characterized in that: A rolling bearing (27) is rotatably sleeved on the guide post (13), and the diameter of the rolling bearing (27) matches the inner diameter of the guide hole (16).
9. The thin film deposition micro / nano fabrication apparatus according to claim 8, characterized in that: The top of the sealing plate (9) is fixedly connected to an arc-shaped sealing strip (28) coaxial with the guide cover (7), and the arc-shaped sealing strips (28) on multiple sealing plates (9) can be spliced into a complete ring. The side of the guide cover (7) is provided with an annular sealing groove (29) that matches the arc-shaped sealing strip (28) at the position directly opposite to the side of the arc-shaped sealing strip (28), and the arc-shaped sealing strip (28) can be inserted into the annular sealing groove (29).
10. A processing method for a thin film deposition micro / nano fabrication apparatus according to claim 9, characterized in that, Includes the following steps: Step 1: Place the product to be surface deposited on the shelf (26), and then close the deposition chamber (1); Step 2: Start the vacuum pump (25) through the control cabinet (24) to perform a vacuuming operation on the deposition tank (1); Step 3: After the vacuuming is completed, the target base (3) is rotated by the motor (30), thereby driving multiple sealing plates (9) to move synchronously towards the axis of the guide cover (7) through the drive mechanism, thereby achieving the sealing operation of the bottom of the guide cover (7); Step 4: By opening the control valve (23) on the inlet pipe (17) and the return pipe (20), and introducing high-purity argon into the inlet pipe (17) (during which the vacuum pump (25) is in operation to maintain the vacuum environment in the deposition chamber (1), the target material (4) is bombarded with argon ions to remove the oxide layer on the surface of the target material (4), and the removed oxide layer is discharged through the return pipe (20) to the inside of the protective cover (6); Step 5: Make the motor (30) rotate in the opposite direction, thereby driving multiple sealing plates (9) to move synchronously away from the axis of the guide cover (7) through the drive mechanism, thereby realizing the opening operation of the bottom of the guide cover (7); Step 6: The target holder (3) can heat the target material (4) in a vacuum environment, thereby heating the target material (4) to a high temperature and evaporating it. Then, the gaseous target material (4) atoms or molecules can migrate to the product surface to form a thin film, and the deposition is completed.