Appearance detection device for semiconductor discrete device

Abstract

The invention discloses a semiconductor discrete device appearance detection device, which comprises a workbench and a protective cover arranged on the workbench, and also comprises a first adsorption assembly used for adsorbing a semiconductor discrete device to be detected; the second adsorption assembly is also used for adsorbing the semiconductor discrete device to be detected; the first linear conveying mechanism is arranged on the working table; the first supporting seat is arranged on the first linear conveying mechanism, and the first adsorption assembly is arranged on the first supporting seat; the second supporting seat is arranged on the second linear conveying mechanism, and the second adsorption assembly is arranged on the second supporting seat; the detection efficiency can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, specifically to a semiconductor discrete device for appearance inspection. Background Technology

[0002] In the production process of semiconductor discrete devices, multiple performance tests are required, such as electrical performance, appearance defects, and package integrity. For appearance inspection, traditional inspection methods often rely on manual inspection, which is inefficient and difficult to meet production requirements. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor discrete device for appearance inspection, which improves inspection efficiency and facilitates sorting.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a semiconductor discrete device for appearance inspection, comprising a worktable and a protective cover disposed on the worktable, and further comprising: a first adsorption component for adsorbing the semiconductor discrete device to be inspected; a first adsorption component and a second adsorption component for adsorbing the semiconductor discrete device to be inspected; a first linear conveying mechanism disposed on the worktable; a first support base disposed on the first linear conveying mechanism, and the first adsorption component disposed on the first support base; a second linear conveying mechanism disposed on the worktable; a second support base disposed on the second linear conveying mechanism, and the second adsorption component disposed on the second support base; a rotating mechanism disposed on the first support base, and the rotating mechanism for placing the semiconductor discrete device on the first adsorption component onto the second adsorption component; and a detection mechanism disposed inside the protective cover, the detection mechanism for detecting the front and back sides of the semiconductor discrete device.

[0005] Furthermore, the first adsorption component includes: a first support base, on which a plurality of first placement slots, a plurality of first hole groups, and a plurality of first cavities are evenly distributed, the plurality of first hole groups and the plurality of first cavities are arranged in a one-to-one correspondence, the plurality of first cavities and the plurality of first placement slots are arranged in a one-to-one correspondence, and each first cavity is connected to a corresponding first placement slot through a corresponding first hole group; and a first vacuum generator, the number of first vacuum generators is equal to the number of first cavities and their positions correspond, each first vacuum generator is connected to a corresponding first cavity, and each first vacuum generator is disposed on the first support base.

[0006] Furthermore, the first hole group includes a plurality of first connecting holes.

[0007] Furthermore, the rotating mechanism includes: a rotating shaft rotatably mounted on a first support base; a connecting plate fixedly sleeved on the outside of the rotating shaft and fixedly connected to a first bearing base; and a driving assembly mounted on the first support base and driving the rotating shaft to rotate.

[0008] Furthermore, the drive assembly employs a rotary cylinder.

[0009] Furthermore, the second adsorption component includes: a second support base, on which a plurality of second placement slots, a plurality of second hole groups, and a plurality of second cavities are evenly distributed, the plurality of second hole groups and the plurality of second cavities are arranged in a one-to-one correspondence, the plurality of second cavities and the plurality of second placement slots are arranged in a one-to-one correspondence, and each second cavity is connected to a corresponding second placement slot through a corresponding second hole group; and a second vacuum generator, the number of second vacuum generators being equal to the number of first cavities and their positions corresponding, each second vacuum generator being connected to a corresponding second cavity, and each second vacuum generator being disposed on the second support base.

[0010] Furthermore, the second hole group includes a plurality of second connection holes.

[0011] Furthermore, the detection mechanism includes: a first support, which is disposed inside the protective cover; a front detector, which is disposed on the first support; a second support, which is disposed inside the protective cover; and a back detector, which is disposed on the second support.

[0012] Furthermore, the first linear conveying mechanism adopts a linear module.

[0013] Furthermore, the second linear conveying mechanism employs a linear module.

[0014] Compared with the prior art, the beneficial effects achieved by the present invention are as follows.

[0015] 1. The present invention facilitates the adsorption of semiconductor discrete devices through the first adsorption component and the second adsorption component, and facilitates the placement of semiconductor discrete devices on the first adsorption component onto the second adsorption component through the combined action of the first linear conveying mechanism, the second linear conveying mechanism and the rotating mechanism.

[0016] 2. This invention can conveniently inspect the front and back sides of semiconductor discrete devices, greatly improving inspection efficiency. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0018] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0019] Figure 2 This is a schematic diagram of the location of the detection mechanism in Embodiment 1 of the present invention.

[0020] Figure 3 This is a schematic diagram of the installation of the first adsorption component in Embodiment 1 of the present invention.

[0021] Figure 4 This is a schematic diagram of the structure of the first adsorption component in Embodiment 1 of the present invention.

[0022] Figure 5 This is a schematic cross-sectional view of the first adsorption component in Embodiment 1 of the present invention.

[0023] Figure 6 This is a schematic diagram of the installation of the second adsorption component in Embodiment 1 of the present invention.

[0024] Figure 7 This is a schematic cross-sectional view of the second adsorption component in Embodiment 1 of the present invention.

[0025] Figure 8 This is an overall side view of Embodiment 1 of the present invention.

[0026] Figure 9 This is a schematic diagram showing the positions of the first and second supports in Embodiment 3 of the present invention.

[0027] In the diagram: 1. Workbench; 11. Protective cover; 2. First linear conveyor mechanism; 21. First support base; 3. Second linear conveyor mechanism; 31. Second support base; 4. First adsorption assembly; 41. First carrier; 42. First placement slot; 43. First hole group; 431. First connecting hole; 44. First vacuum generator; 45. First cavity; 5. Second adsorption assembly; 51. Second carrier; 52. Second placement slot; 53. Second hole group; 531. Second connecting hole; 54. Second vacuum generator; 55. Second cavity; 6. Rotating mechanism; 61. Rotating shaft; 62. Connecting plate; 63. Drive assembly; 631. Rotary cylinder; 7. Detection mechanism; 71. First bracket; 72. Front detector; 73. Second bracket; 74. Back detector. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1 Please see Figures 1-8 The present invention provides a technical solution: a semiconductor discrete device for appearance inspection, comprising a worktable 1, on which a protective cover 11 is provided; further comprising a first linear conveying mechanism 2 and a second linear conveying mechanism 3 disposed on the worktable 1, wherein a first support base 21 is disposed on the first linear conveying mechanism 2, and a rotating mechanism 6 is disposed on the first support base 21, the rotating mechanism 6 being connected to a first adsorption component 4, the first adsorption component 4 being used to adsorb the semiconductor discrete device to be inspected; a second support base 31 is disposed on the second linear conveying mechanism 3, and a second adsorption component 5 is disposed on the second support base 31, the second adsorption component 5 being... It is also used to adsorb semiconductor discrete devices to be tested; a detection mechanism 7 is provided inside the protective cover 11, which is used to detect the front and back of the semiconductor discrete device; the semiconductor discrete device is used to be placed on the first adsorption component 4, and the first linear conveying mechanism 2 drives the semiconductor discrete device on the first adsorption component 4 to pass through the detection mechanism 7 for front detection; after the semiconductor discrete device is front detected, the rotating mechanism 6 is used to place the semiconductor discrete device on the first adsorption component 4 on the second adsorption component 5, and the second linear conveying mechanism 3 drives the semiconductor discrete device on the second adsorption component 5 to pass through the detection mechanism 7 for back detection.

[0030] The first adsorption assembly 4 includes a first support base 41, on which a plurality of first placement slots 42, a plurality of first hole groups 43, and a plurality of first cavities 45 are evenly distributed. The plurality of first hole groups 43 are arranged in a one-to-one correspondence with the plurality of first cavities 45, and the plurality of first cavities 45 are arranged in a one-to-one correspondence with the plurality of first placement slots 42. Each first cavity 45 is connected to a corresponding first placement slot 42 through a corresponding first hole group 43. The first adsorption assembly 4 also includes a first vacuum generator 44. The number of first vacuum generators 44 is equal to the number of first cavities 45 and their positions correspond. Each first vacuum generator 44 is connected to a corresponding first cavity 45, and each first vacuum generator 44 is disposed on the first support base 41. Specifically, the first hole group 43 includes a plurality of first connecting holes 431. When a semiconductor discrete device is placed in the first placement slot 42, a negative pressure is generated by the first vacuum generator 44, causing the semiconductor discrete device to be adsorbed into the first placement slot 42.

[0031] The rotating mechanism 6 includes a rotating shaft 61 rotatably disposed on the upper left of the first support; a driving assembly 63 is disposed on the first support seat 21, and the driving assembly 63 drives the rotating shaft 61 to rotate; specifically, the driving assembly 63 is a rotary cylinder 631; a connecting plate 62 is fixedly connected to the outside of the rotating shaft 61, and the connecting plate 62 is connected to the first bearing seat 41.

[0032] In this embodiment, both the first support seat 41 and the second support seat 51 are inclined, and the inclination directions of the first support seat 41 and the second support seat 51 are opposite, such as... Figure 8 As shown, the first support 41 and the second support 51 are arranged perpendicularly to each other. When the first placement groove 42 and the second placement groove 52 are arranged in a one-to-one correspondence, the semiconductor discrete device can be covered in the first placement groove 42 and the second placement groove 52 by rotating the rotary cylinder 631 by 90 degrees (the rotary cylinder 631 can be a 90-degree rotary cylinder). At this time, the adsorption effect on the semiconductor discrete device is released by the first vacuum generator 44, and the second vacuum generator 54 generates negative pressure, so that the semiconductor discrete device is adsorbed in the second placement groove 52.

[0033] The second adsorption assembly 5 includes a second support base 51, on which a plurality of second placement slots 52, a plurality of second hole groups 53, and a plurality of second cavities 55 are evenly distributed. The plurality of second hole groups 53 are arranged in a one-to-one correspondence with the plurality of second cavities 55, and the plurality of second cavities 55 are arranged in a one-to-one correspondence with the plurality of second placement slots 52. Each second cavity 55 is connected to a corresponding second placement slot 52 through a corresponding second hole group 53. The second adsorption assembly 5 also includes a second vacuum generator 54. The number of second vacuum generators 54 is equal to that of the first cavities 45 and their positions correspond. Each second vacuum generator 54 is connected to a corresponding second cavity 55, and each second vacuum generator 54 is disposed on the second support base 51. Specifically, the second hole group 53 includes a plurality of second connecting holes 531.

[0034] In this embodiment, a semiconductor discrete device is first placed in each of the first placement slots 42 by means of an external robotic arm or manual placement. Then, the first support base 21 is moved into the protective cover 11 by the first linear conveyor mechanism 2. After passing through a part of the detection mechanism 7, the front of the semiconductor discrete device is inspected. After the front inspection is completed, the first support base 21 and the second support base 31 are aligned by the first linear conveyor mechanism 2 and the second linear conveyor mechanism 3, and each of the first placement slots 42 and each of the second placement slots 52 are set in a one-to-one correspondence. At this time, the rotary cylinder 631 drives the first carrier 41 to rotate, thereby placing the semiconductor discrete device into the second placement slot 52. The semiconductor discrete device is secured in the second placement slot 52 by releasing the adsorption effect of the first vacuum generator 44 and adsorbing it by the second vacuum generator 54. Then, the semiconductor discrete device is inspected on the other side of the detection mechanism 7 by the second linear conveyor 3 and moved out of the protective cover 11. If either the front or back side of the semiconductor discrete device fails the inspection, qualified products can be sorted out by manual or robotic arms for subsequent collection when the second conveyor moves the semiconductor discrete device out of the protective cover 11. Unqualified products can be picked out for subsequent processing.

[0035] Example 2 Please see Figure 9 Based on Embodiment 1, the detection mechanism 7 includes a first support 71, which is disposed inside the protective cover 11. A front detector 72 is disposed on the first support 71. The front detection mechanism 7 is used to detect the front of the semiconductor discrete device. At the same time, a second support 73 is also disposed inside the protective cover 11. A back detector 74 is disposed on the second support 73. The back detector 74 is used to detect the back of the semiconductor discrete device.

[0036] Specifically, the front detector 72 and the back detector 74 can employ existing technologies such as industrial cameras.

[0037] Example 3 See again Figures 1-8 Based on Embodiment 1, this embodiment adopts linear modules for both the first linear conveying mechanism 2 and the second linear conveying mechanism 3. The two linear modules are installed on the workbench 1 and are arranged in parallel. The two linear modules drive the first support seat 21 and the second support seat 31 to move horizontally in a linear manner, respectively.

[0038] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor discrete device appearance inspection apparatus, comprising a worktable (1) and a protective cover (11) disposed on the worktable (1), characterized in that, Also includes: The first adsorption component (4) is used to adsorb the semiconductor discrete device to be tested; The second adsorption component (5) is also used to adsorb the semiconductor discrete device to be tested; The first linear conveyor mechanism (2) is mounted on the workbench (1); The first support base (21) is disposed on the first linear conveying mechanism (2), and the first adsorption component (4) is disposed on the first support base (21); The second linear conveyor (3) is mounted on the workbench (1); The second support base (31) is disposed on the second linear conveying mechanism (3), and the second adsorption component (5) is disposed on the second support base (31); A rotating mechanism (6) is disposed on a first support (21) and is used to place the semiconductor discrete device on the first adsorption assembly (4) onto the second adsorption assembly (5). The testing mechanism (7) is set inside the protective cover (11) and is used to test the front and back of the semiconductor discrete device.

2. The semiconductor discrete device appearance inspection apparatus according to claim 1, characterized in that, The first adsorption component (4) includes: The first support (41) has a plurality of first placement slots (42), a plurality of first hole groups (43) and a plurality of first cavities (45) evenly distributed on it. The plurality of first hole groups (43) and the plurality of first cavities (45) are arranged in a one-to-one correspondence. The plurality of first cavities (45) and the plurality of first placement slots (42) are arranged in a one-to-one correspondence. Each first cavity (45) is connected to the corresponding first placement slot (42) through the corresponding first hole group (43). The number of first vacuum generators (44) is equal to that of first cavities (45) and their positions correspond. Each first vacuum generator (44) is connected to the corresponding first cavity (45), and each first vacuum generator (44) is mounted on a first support (41).

3. The semiconductor discrete device appearance inspection apparatus according to claim 2, characterized in that, The first hole group (43) includes a plurality of first connecting holes (431).

4. The semiconductor discrete device appearance inspection apparatus according to claim 2, characterized in that, The rotating mechanism (6) includes: A rotating shaft (61) is rotatably mounted on a first support (21); A connecting plate (62) is fixedly sleeved on the outside of the rotating shaft (61), and the connecting plate (62) is fixedly connected to the first bearing seat (41). A drive assembly (63) is disposed on a first support base (21) and drives the rotating shaft (61) to rotate.

5. The semiconductor discrete device appearance inspection apparatus according to claim 4, characterized in that, The drive assembly (63) employs a rotary cylinder (631).

6. The semiconductor discrete device appearance inspection apparatus according to claim 1, characterized in that, The second adsorption component (5) includes: The second support (51) has a plurality of second placement slots (52), a plurality of second hole groups (53) and a plurality of second cavities (55) evenly distributed on it. The plurality of second hole groups (53) and the plurality of second cavities (55) are arranged in a one-to-one correspondence. The plurality of second cavities (55) and the plurality of second placement slots (52) are arranged in a one-to-one correspondence. Each second cavity (55) is connected to the corresponding second placement slot (52) through the corresponding second hole group (53). The number of second vacuum generators (54) is equal to that of the first cavity (45) and their positions correspond. Each second vacuum generator (54) is connected to the corresponding second cavity (55), and each second vacuum generator (54) is mounted on the second support (51).

7. The semiconductor discrete device appearance inspection apparatus according to claim 6, characterized in that, The second hole group (53) includes a plurality of second connecting holes (531).

8. The semiconductor discrete device appearance inspection apparatus according to claim 1, characterized in that, The testing organization (7) includes: The first bracket (71) is disposed inside the protective cover (11); A front detector (72) is mounted on a first bracket (71); The second bracket (73) is disposed inside the protective cover (11); A reverse detector (74) is mounted on a second support (73).

9. The semiconductor discrete device appearance inspection apparatus according to claim 1, characterized in that, The first linear conveying mechanism (2) adopts a linear module.

10. A semiconductor discrete device appearance inspection apparatus according to claim 1, characterized in that, The second linear conveying mechanism (3) adopts a linear module.

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