A server with a mainboard module structure capable of being flipped

Abstract

This invention relates to a server with a flip-up motherboard module structure, comprising a support structure including a first support frame, a second support frame, and a roller track, the first and second support frames being movably connected; a chassis with fixing holes on its side walls, the first support frame being riveted to the fixing holes on the chassis side walls; a motherboard module disposed within the chassis, the motherboard module including a motherboard tray, the roller track being riveted to the bottom of the motherboard tray, one end of the roller track being riveted to the second support frame, and locking pins on both sides of the motherboard tray, the locking pins being aligned with the fixing holes on the chassis side walls; pressing the first support frame and moving the second support frame, and rotating the locking pins, causing the motherboard module to flip to a preset angle, achieving a flipped and flattened state. This invention effectively solves the problems existing in the maintenance, upgrade, and heat dissipation of traditional server motherboard modules.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a server with a flip-up motherboard module structure. Background Technology

[0002] With the rapid development of information technology, servers play a crucial role in data processing, storage, and transmission. However, maintenance and upgrades are unavoidable aspects of server use. Traditional server motherboard modules typically employ a fixed design, installed within the chassis. When maintenance or upgrades are needed, technicians often have to completely remove the entire motherboard from the chassis. This process is not only complex but also time-consuming and labor-intensive, significantly reducing maintenance efficiency. Furthermore, due to the limited internal space of the chassis, traditional fixed motherboard modules also have limitations in heat dissipation, affecting server performance and lifespan.

[0003] To address these issues, several improved server motherboard module structures have emerged in the market, such as detachable or removable motherboard module designs. However, most of these designs have some shortcomings. On the one hand, some detachable motherboard modules require multiple tools for disassembly and installation, making the process cumbersome and prone to damage to the motherboard or chassis due to improper handling. On the other hand, while some removable motherboard modules improve maintenance convenience to some extent, they lack a stable support structure during movement, making them prone to shaking or loosening, affecting the normal operation of the server, and also failing to effectively solve the heat dissipation problem. Summary of the Invention

[0004] This invention provides a server with a flip-up motherboard module structure, aiming to solve at least one of the technical problems existing in the prior art.

[0005] The technical solution of this invention is a server with a flip-up motherboard module structure, comprising:

[0006] The support structure includes a first support frame, a second support frame, and a roller slide, wherein the first support frame and the second support frame are movably connected.

[0007] The chassis has fixing holes on its side wall, and the first support frame is riveted to the fixing holes on the side wall of the chassis.

[0008] A motherboard module is disposed inside the chassis. The motherboard module includes a motherboard tray, a roller slide riveted to the bottom of the motherboard tray, one end of the roller slide riveted to a second support frame, and a lock-lock pin button provided on both sides of the motherboard tray. The lock-lock pin button is aligned with the fixing hole on the side wall of the chassis. Pressing the first support frame causes the second support frame to move relative to it, and rotating the lock-lock pin button causes the motherboard module to flip to a preset angle, achieving a flipped and flattened state.

[0009] According to some embodiments of the present invention, the non-detachable pin button includes a knob and a top shaft. During the process of rotating the knob of the non-detachable pin button, the top shaft is kept in the ejected state and engages with the fixing hole in the side wall of the chassis. The motherboard module rotates counterclockwise with the top shaft of the non-detachable pin button as the rotation axis.

[0010] According to some embodiments of the present invention, the support structure further includes a first rotating shaft and a second rotating shaft, the first support frame and the second support frame are connected in a first state or a second state through the first rotating shaft, and the first support frame is riveted to the fixing hole on the side wall of the chassis through the second rotating shaft.

[0011] According to some embodiments of the present invention, the first state is a folded state between the first support frame and the second support frame, and the second state is a flattened state between the first support frame and the second support frame.

[0012] According to some embodiments of the present invention, the support structure further includes rollers disposed within roller tracks. When the motherboard module rotates counterclockwise around the top axis of the non-detachable pin button, it drives the rollers to roll forward within the roller tracks. The first support frame and the second support frame generate rotational motion to make the motherboard module rotate synchronously. When the motherboard module rotates to a preset angle and reaches the flip-off fixed point, the first support frame and the second support frame are located on the same horizontal line and are in a flattened state.

[0013] According to some embodiments of the present invention, when the motherboard module rotates clockwise around the top axis of the non-detachable pin button, it drives the roller to roll back within the roller slide, and the first support frame and the second support frame generate rotational motion to make the motherboard module rotate synchronously. When the motherboard module rotates to a preset angle and reaches the end of the flipping state, the first support frame and the second support frame are in a folded state.

[0014] According to some embodiments of the present invention, the roller is provided with a top shaft. When the roller advances and rolls in the roller slide to the end of the roller slide, the top shaft of the roller pops out and engages with the limiting hole of the second support frame.

[0015] According to some embodiments of the present invention, the system further includes a hard disk module and a power supply module. The side wall of the chassis is provided with T-shaped pins. The hard disk module and the power supply module are positioned by the T-shaped pins on the side wall of the chassis and are connected to the chassis by screws.

[0016] According to some embodiments of the present invention, the support structure further includes a stopper slidably disposed between the first support frame and the second support frame.

[0017] According to some embodiments of the present invention, when the motherboard module is rotated to a preset angle and reaches the flipped fixed point state, when the first support frame and the second support frame are on the same horizontal line and in a flat state, the stop is slid to a preset position to prevent relative movement between the first support frame and the second support frame.

[0018] The server with a flip-up motherboard module structure provided in this invention embodiment has at least one of the following advantages or beneficial effects: A first support frame and a second support frame are movably connected, cooperating with the motherboard tray via roller tracks, allowing relative movement between the first and second support frames. A release-locking pin aligns with a fixing hole on the side wall of the chassis. The motherboard module, through the release-locking pin and the fixing hole on the side wall of the chassis, presses the first support frame and drives the second support frame to move, thereby enabling the motherboard module to move flexibly and flip to a preset angle within the chassis, achieving a flattened state and creating sufficient space. Maintenance personnel can easily flip the motherboard module to the preset angle, enabling rapid disassembly and flipping of the motherboard module, thus facilitating access to various components on the motherboard. Compared to traditional fixed motherboard modules, maintenance personnel do not need to completely remove the entire motherboard from the chassis, making the operation simple and intuitive, greatly saving time and effort, and improving maintenance efficiency. Furthermore, the design of the support structure and motherboard module allows the motherboard module to move and flip flexibly within the chassis, and can be replaced or upgraded through simple disassembly and installation.

[0019] Furthermore, under normal operating conditions, the motherboard module can be compactly placed inside the chassis without occupying extra space. When maintenance or upgrades are required, the motherboard module can be flipped open to make full use of the internal space of the chassis, avoiding maintenance difficulties caused by space constraints. This design achieves greater flexibility and operability within a limited space.

[0020] Furthermore, additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] Figure 1 This is a general schematic diagram of a server with a flip-up motherboard module structure provided in an embodiment of the present invention;

[0022] Figure 2 This is provided by the embodiments of the present invention. Figure 1 A cross-sectional view of the server with the flip motherboard module structure along direction A;

[0023] Figure 3 This is a first detailed schematic diagram of a server with a flip-up motherboard module structure provided in an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the non-detachable latch button provided in an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the non-detachable latch button in the ejected state according to an embodiment of the present invention;

[0026] Figure 6 This is a second detailed schematic diagram of a server with a flip-up motherboard module structure provided in an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of the stop device provided in an embodiment of the present invention at the first position of the support structure;

[0028] Figure 8 This is a schematic diagram of the stop device provided in an embodiment of the present invention in the second position of the support structure.

[0029] The above figures include the following reference numerals: 110, first support frame; 120, second support frame; 130, roller slide; 140, first pivot; 150, second pivot; 160, roller; 200, chassis; 210, fixing hole; 300, motherboard module; 310, motherboard tray; 320, non-detachable latch button; 321, knob; 322, top shaft; 400, hard disk module; 500, power supply module; 600, stop. Detailed Implementation

[0030] The following will provide a clear and complete description of the concept, specific structure, and technical effects of the present invention in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of the present invention. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0031] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," "right," "top," and "bottom" used in this invention are only relative to the relative positional relationships of the various components of the invention in the accompanying drawings.

[0032] Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and not for limiting the invention. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0033] It should be understood that although the terms first, second, third, etc., may be used to describe various elements in this invention, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from each other. For example, a first element may also be referred to as a second element without departing from the scope of this invention, and similarly, a second element may also be referred to as a first element.

[0034] In related technologies, traditional server motherboard modules typically employ a fixed design, installed inside the chassis. When maintenance or upgrades are required, technicians often need to completely remove the entire motherboard from the chassis. This process is not only complex but also time-consuming and labor-intensive, significantly reducing maintenance efficiency. Furthermore, due to the limited internal space of the chassis, traditional fixed motherboard modules also have limitations in heat dissipation, affecting server performance and lifespan.

[0035] To address these issues, several improved server motherboard module structures have emerged in the market, such as detachable or removable motherboard module designs. However, most of these designs have some shortcomings. On the one hand, some detachable motherboard modules require multiple tools for disassembly and installation, making the process cumbersome and prone to damage to the motherboard or chassis due to improper handling. On the other hand, while some removable motherboard modules improve maintenance convenience to some extent, they lack a stable support structure during movement, making them prone to shaking or loosening, affecting the normal operation of the server, and also failing to effectively solve the heat dissipation problem.

[0036] Based on this, the present invention provides a server with a flip-up motherboard module structure, which effectively solves the problems of traditional server motherboard modules in terms of maintenance, upgrades, and heat dissipation. The various components work together to allow the motherboard module to move flexibly and flip to a preset angle within the chassis, and to be in a flat state, which can create a certain space. Maintenance personnel can easily flip the motherboard module to the preset angle, realizing the quick disassembly and flipping of the motherboard module. Maintenance personnel do not need to completely remove the entire motherboard from the chassis, making the operation process simple and intuitive, greatly saving time and effort, and improving maintenance efficiency.

[0037] Reference Figures 1 to 3 As shown, a server with a flip-up motherboard module 300 structure includes a support structure, a chassis 200, and a motherboard module 300. The support structure includes a first support frame 110, a second support frame 120, and a roller track 130, with the first and second support frames 110 movably connected. The side wall of the chassis 200 has fixing holes 210, and the first support frame 110 is riveted to the fixing holes 210 on the side wall of the chassis 200. The motherboard module 300 is disposed inside the chassis 200 and includes a motherboard tray. The motherboard tray 310 and roller slide 130 are riveted to the bottom of the motherboard tray 310. One end of the roller slide 130 is riveted to the second support frame 120. The motherboard tray 310 is provided with a release pin button 320 on both sides. The release pin button 320 is aligned with the fixing hole 210 on the side wall of the chassis 200. Pressing the first support frame 110 will drive the second support frame 120 to move, causing them to move relative to each other. Rotating the release pin button 320 will cause the motherboard module 300 to flip to a preset angle, achieving a flipped and flattened state.

[0038] In some embodiments of the present invention, the support structure includes a first support frame 110, a second support frame 120, and a roller slide 130. The first support frame 110 and the second support frame 120 are movably connected and cooperate with the motherboard tray 310 through the roller slide 130, allowing the first support frame 110 and the second support frame 120 to move relative to each other. This enables the motherboard module 300 to move flexibly and rotate to a preset angle within the chassis 200, achieving a flattened state and creating a certain space. It is understood that when the motherboard module 300 is rotated and unfolded, its surface area in contact with the air increases, which is beneficial for heat dissipation. Furthermore, the rotated motherboard module 300 can better cooperate with the heat dissipation system within the chassis 200, further improving heat dissipation efficiency, thereby extending the server's lifespan and improving its operating performance.

[0039] Under normal operating conditions, the motherboard module 300 can be compactly placed inside the chassis 200 without occupying extra space. When maintenance or upgrades are required, the motherboard module 300 can be flipped open to make full use of the internal space of the chassis 200, avoiding maintenance difficulties caused by space constraints. This design achieves greater flexibility and operability within a limited space.

[0040] The side wall of the chassis 200 is provided with fixing holes 210. A lock-and-release button 320 aligns with the fixing holes 210 on the side wall of the chassis 200. The motherboard module 300 can be quickly disassembled and flipped by engaging the lock-and-release button 320 with the fixing holes 210 on the side wall of the chassis 200, pressing the first support bracket 110 and moving the second support bracket 120, and rotating the lock-and-release button 320. This allows maintenance personnel to easily flip the motherboard module 300 to a preset angle, making it easier to access the various components on the motherboard. Compared to traditional fixed motherboard modules 300, maintenance personnel do not need to completely remove the entire motherboard from the chassis 200, making the operation simple and intuitive, greatly saving time and effort, and improving maintenance efficiency. Furthermore, the design of the support structure and the motherboard module 300 allows the motherboard module 300 to move and flip flexibly within the chassis 200, and can be replaced or upgraded through simple disassembly and installation.

[0041] The first support frame 110 is riveted to the fixing hole 210 on the side wall of the chassis 200, and the roller slide 130 is riveted to the bottom of the motherboard tray 310, with one end riveted to the second support frame 120. This riveting and connection method makes the entire support structure more stable. During the flipping process of the motherboard module 300, the support structure can withstand a certain external force, ensuring that the motherboard module 300 will not loosen or be damaged due to flipping. At the same time, the design of the roller slide 130 also reduces friction, making the flipping process smoother and further enhancing the stability of the system.

[0042] In summary, the server with a flip motherboard module 300 structure provided by this invention, through its unique design, cleverly combines a non-detachable pin and a support frame structure, eliminating the need for screw tightening. This makes installation quick and convenient, and ensures reliable fixation, reducing labor intensity and greatly improving disassembly and maintenance efficiency. It has achieved significant technical effects in terms of maintenance convenience, space utilization, structural stability, heat dissipation efficiency, operational convenience, compatibility, and scalability, and can effectively improve the performance and service life of the server.

[0043] Reference Figure 4 As shown, in some embodiments of the present invention, the non-detachable latch button 320 includes a knob 321 and a top shaft 322. During the rotation of the knob 321 of the non-detachable latch button 320, the top shaft 322 remains in the extended position (see reference). Figure 5 (As shown) and maintains a hole-shaft fit with the fixing hole 210 on the side wall of the chassis 200, the motherboard module 300 rotates counterclockwise with the top shaft 322 of the non-detachable plug button 320 as the rotation axis.

[0044] The non-detachable latch button 320 includes a knob 321 and a top shaft 322. By rotating the knob 321 counterclockwise, the top shaft 322 remains in the extended position and engages with the fixing hole 210 on the side wall of the chassis 200. This design ensures that the motherboard module 300 has a stable support point during flipping, guaranteeing structural stability. This design ensures that the motherboard module 300 remains in a stable structural state during flipping, and even after multiple flipping operations, the non-detachable latch button 320 and the top shaft 322 maintain a good fit without loosening or malfunctioning. Therefore, the precise engagement of the top shaft 322 and the fixing hole 210 prevents the motherboard module 300 from shaking or shifting during flipping, thus ensuring the smoothness and reliability of the flipping action. This precise positioning and stable support are crucial for protecting the components on the motherboard module 300 from damage.

[0045] Furthermore, the design of the non-detachable latch button 320 ensures that the motherboard module 300 remains connected to the chassis 200 during the flipping process, preventing accidental detachment. This design avoids the risk of damage caused by accidental detachment of the motherboard module 300 during flipping. Flipping the motherboard module 300 is achieved simply by rotating the non-detachable latch button 320, making the operation simple and intuitive. Maintenance personnel can complete the flipping of the motherboard module 300 with just a simple rotation. Compared to traditional disassembly and reinstallation methods, this design greatly simplifies the operation process, saving time and effort. This simplified operation design is particularly suitable for use in server environments requiring frequent maintenance or upgrades. In actual operation, maintenance personnel do not need to worry about the motherboard module 300 falling due to improper operation, thus improving operational safety. At the same time, this design also reduces the potential damage to other components inside the chassis 200 caused by the motherboard module 300 detaching.

[0046] In summary, the design of the non-detachable latch button 320, through its unique structure and function, achieves multiple technical benefits during the flipping process of the motherboard module 300, including precise positioning, stable support, flexible flipping, operational safety, simplified operation procedures, and enhanced structural reliability. This design not only improves the maintainability and ease of operation of the server but also provides strong support for the long-term stable operation and hardware upgrades of the server.

[0047] Reference Figures 1 to 3As shown, in some embodiments of the present invention, the support structure further includes a first rotating shaft 140 and a second rotating shaft 150. The first support frame 110 and the second support frame 120 are connected in a first state or a second state through the first rotating shaft 140. The first support frame 110 is riveted to the fixing hole 210 on the side wall of the chassis 200 through the second rotating shaft 150.

[0048] The first support frame 110 and the second support frame 120 are connected via a first pivot 140 in either a first state (e.g., a folded state) or a second state (e.g., a flattened state). This design allows the support structure to switch between different states as needed. For example, in normal operation, the first support frame 110 and the second support frame 120 can be folded together via the first pivot 140 to save space; while when the motherboard module 300 needs to be flipped, the support structure can be unfolded to the second state, providing sufficient support and enough space for the flipping operation. This flexibility allows the support structure to adapt to different usage scenarios and improves the overall performance of the system.

[0049] The first support frame 110 is riveted to the fixing hole 210 on the side wall of the chassis 200 via the second rotating shaft 150. Through the riveting connection of the second rotating shaft 150, the first support frame 110 can be quickly installed onto the fixing hole 210 on the side wall of the chassis 200. This connection method is not only convenient to install, but also very simple to disassemble. Maintenance personnel can complete the installation and disassembly of the support structure without using complicated tools, greatly improving work efficiency.

[0050] The use of the first hinge 140 and the second hinge 150 ensures the stability of the support structure under different conditions. During the flipping process of the motherboard module 300, the cooperation of the first hinge 140 and the second hinge 150 can effectively disperse the force and reduce stress concentration caused by flipping. This design makes the support structure more stable when subjected to external forces, reducing the risk of damage to the motherboard module 300 due to structural loosening.

[0051] Therefore, by introducing the first hinge 140 and the second hinge 150, the support structure has achieved significant technical improvements in terms of connection flexibility, installation and disassembly efficiency, structural stability, space utilization, operational reliability, and system scalability. This design not only enhances the convenience and reliability of the server motherboard module 300's flip-over operation but also provides strong support for the server's long-term stable operation and hardware upgrades.

[0052] In some embodiments of the present invention, the first state is that the first support frame 110 and the second support frame 120 are folded, and the second state is that the first support frame 110 and the second support frame 120 are flattened.

[0053] The first support frame 110 and the second support frame 120 can be switched between a folded state and a flattened state via a first hinge 140. When the server is running normally, the first support frame 110 and the second support frame 120 are folded together, minimizing space occupation. This design makes the internal space of the chassis 200 more compact, suitable for use in space-constrained environments. When it is necessary to flip the motherboard module 300, the first support frame 110 and the second support frame 120 unfold, providing sufficient support and space for the flipping of the motherboard module 300. This design ensures smooth flipping operations while avoiding operational difficulties caused by insufficient space.

[0054] In the flattened state (second state), the first support frame 110 and the second support frame 120 form a stable support structure through the first pivot 140. During the flipping process of the motherboard module 300, the flattened support structure can provide stable support force, ensuring that the motherboard module 300 will not shake or loosen. This design reduces the risk of damage caused by improper flipping operations. Therefore, the design of the first pivot 140 can effectively disperse the stress generated during the flipping process, avoid stress concentration, and thus extend the service life of the support structure. The first support frame 110 is riveted to the fixing hole 210 on the side wall of the chassis 200 through the second pivot 150, ensuring the stability of the support structure. The riveting connection of the second pivot 150 makes the first support frame 110 firmly installed on the side wall of the chassis 200 and will not loosen due to external forces. This design improves the reliability of the entire support structure. Through the precise cooperation of the first pivot 140 and the second pivot 150, the support structure can maintain good performance during long-term use, reducing the risk of system failure due to structural loosening or damage.

[0055] In summary, by introducing the first hinge 140 and the second hinge 150, the first support frame 110 and the second support frame 120 can switch between folded and flattened states. This design has achieved significant technical benefits in terms of space optimization, ease of operation, structural stability, system scalability, system reliability, and simplified maintenance procedures. This design not only improves the convenience and reliability of the server motherboard module 300's flip operation, but also provides strong support for the long-term stable operation and hardware upgrades of the server.

[0056] In some embodiments of the present invention, the support structure further includes a roller 160, which is disposed in a roller slide 130. When the motherboard module 300 rotates counterclockwise around the top shaft 322 of the release pin button 320, it drives the roller 160 to roll forward in the roller slide 130. The first support frame 110 and the second support frame 120 generate rotational motion to make the motherboard module 300 rotate synchronously. When the motherboard module 300 rotates to a preset angle and reaches the flipping fixed point state, the first support frame 110 and the second support frame 120 are located on the same horizontal line and are in a flattened state.

[0057] When the motherboard module 300 rotates counterclockwise around the top shaft 322 of the non-detachable latch button 320, it drives the roller 160 to roll forward within the roller track 130. The rolling motion of the roller 160 within the roller track 130 significantly reduces friction during the flipping process of the motherboard module 300, making the flipping smoother and reducing wear and energy loss caused by friction. This rolling design allows the motherboard module 300 to remain stable during flipping, avoiding shaking or damage caused by sudden forces and improving the reliability of the flipping process.

[0058] The first support frame 110 and the second support frame 120 rotate during the flipping process of the motherboard module 300, enabling the motherboard module 300 to rotate synchronously. Through the synchronous rotation of the support frames, the motherboard module 300 can be precisely rotated to a preset angle, ensuring the accuracy of the flipping operation. This design allows maintenance personnel to flip the motherboard module 300 to the optimal position as needed, facilitating repair, upgrades, or other operations. The synchronous rotation of the support frames ensures the stability of the motherboard module 300 throughout the flipping process, reducing structural stress concentration caused by asynchrony and extending the service life of the equipment.

[0059] When the motherboard module 300 rotates to a preset angle and reaches the flipping fixed point, the first support frame 110 and the second support frame 120 are on the same horizontal line, forming a flattened state. This design ensures that the motherboard module 300 is in a horizontal and stable state after flipping to the preset angle, facilitating operation by maintenance personnel. This flattened state provides the optimal working position for the maintenance and upgrade of the motherboard module 300. At the final flipping point, the support frames are on the same horizontal line; this structural design further enhances the stability of the entire system and reduces the risk of the motherboard module 300 shaking or being damaged due to the tilting of the support frames.

[0060] By introducing the design of rollers 160 and roller slides 130, as well as the synchronous rotation and flattening of the support frame, this flip structure of the server motherboard module 300 has achieved significant technical improvements in terms of stability, precise control, ease of operation, reliability, and space utilization. This design not only improves the efficiency and reliability of the motherboard module 300's flip operation but also provides strong support for the long-term stable operation and hardware upgrades of the server.

[0061] In some embodiments of the present invention, when the motherboard module 300 rotates clockwise around the top shaft 322 of the non-detachable pin button 320, it drives the roller 160 to roll back within the roller slide 130, and the first support frame 110 and the second support frame 120 generate rotational motion to make the motherboard module 300 rotate synchronously. When the motherboard module 300 rotates to a preset angle and reaches the end of the flipping state, the first support frame 110 and the second support frame 120 are in a folded state.

[0062] When the motherboard module 300 rotates clockwise around the top shaft 322 of the non-detachable latch button 320, it drives the roller 160 to roll backward within the roller track 130. The rolling motion of the roller 160 within the roller track 130 greatly reduces friction during folding, making folding smoother and reducing wear and energy loss caused by friction. This rolling design allows the motherboard module 300 to remain stable during folding, avoiding shaking or damage caused by sudden forces and improving the reliability of the folding process.

[0063] When the motherboard module 300 rotates to a preset angle and reaches the final flipping state, the first support frame 110 and the second support frame 120 are in a folded state. This folded state allows the motherboard module 300 to be in a compact position after the flipping is complete, saving space inside the chassis 200. This design is particularly suitable for use in space-constrained server environments. The folded support frame design further enhances the stability of the entire system, reducing the risk of the motherboard module 300 shaking or being damaged due to loose support frames.

[0064] Understandably, the motherboard module 300 can be rotated clockwise or counterclockwise via the top axis 322 of the release-locking pin button 320 to achieve unfolding and folding operations respectively. This design makes the bidirectional flipping operation of the motherboard module 300 more flexible, allowing maintenance personnel to choose the unfolding or folding direction as needed without worrying about operational direction limitations. The bidirectional flipping function enables the server to adapt to different maintenance and operation scenarios. For example, in space-constrained situations, the folding direction can be selected to save space; when detailed repairs are required, the unfolding direction can be selected to provide better operating space.

[0065] In summary, by introducing a bidirectional flipping function (counter-clockwise unfolding and clockwise folding), this flip structure of the server motherboard module 300 achieves significant technical improvements in terms of bidirectional operational flexibility, smooth folding process, precise folding endpoint, system reliability, ease of operation, space utilization, and system scalability. This design not only improves the efficiency and reliability of the motherboard module 300's flipping operation but also provides strong support for the long-term stable operation and hardware upgrades of the server.

[0066] In some embodiments of the present invention, the roller 160 is provided with a top shaft 322. When the roller 160 rolls forward in the roller slide 130 to the end of the roller slide 130, the top shaft of the roller 160 pops out and is engaged with the limiting hole of the second support frame 120.

[0067] The roller 160 is equipped with a top shaft 322. When the roller 160 rolls to its end within the roller slide 130, the top shaft 322 pops out and engages with the limiting hole of the second support frame 120. The top shaft of the roller 160 pops out at the end of the roller slide 130 and engages with the limiting hole, ensuring that the motherboard module 300 accurately reaches the flipping endpoint. This design allows the motherboard module 300 to automatically lock when it reaches the preset flipping endpoint, ensuring that the motherboard module 300 remains stable after flipping and will not move or shake accidentally due to external forces. The cooperation between the top shaft 322 and the limiting hole provides additional support for the motherboard module 300, further enhancing the stability of the system and reducing the risk of damage due to insufficient support. Simultaneously, the cooperation between the top shaft 322 and the limiting hole reduces wear caused by shaking or loosening during flipping, extending the service life of the equipment.

[0068] It should be noted that the top shaft of the roller 160 automatically pops out at the end of the roller slide 130 and engages with the limit hole. Maintenance personnel do not need to manually lock the motherboard module 300, which reduces the number of operation steps and improves the operation efficiency. This design makes the flipping operation simpler and more intuitive. Maintenance personnel can easily flip and lock the motherboard module 300 without additional tools or complicated operations.

[0069] By incorporating the top shaft and limiting hole design of the roller 160, this server motherboard module 300's flip structure achieves significant technical benefits in terms of reliable locking mechanisms, precise flip endpoint control, simplified operation procedures, enhanced system reliability, optimized space utilization, improved system scalability, and enhanced operational safety. This design not only improves the efficiency and reliability of the motherboard module 300's flip operation but also provides strong support for the server's long-term stable operation and hardware upgrades.

[0070] Reference Figure 6As shown, in some embodiments of the present invention, the server with the flip motherboard module 300 structure also includes a hard disk module 400 and a power supply module 500. The side wall of the chassis 200 is provided with T-shaped pins. The hard disk module 400 and the power supply module 500 are positioned by the T-shaped pins on the side wall of the chassis 200 and are connected to the chassis 200 by screws.

[0071] The hard drive module 400 and power supply module 500 are positioned using H-beams on the side wall of the chassis 200 and connected to the chassis 200 using screws. The H-beam design ensures precise positioning of the hard drive module 400 and power supply module 500, guaranteeing accurate installation within the chassis 200. This design reduces the risk of poor contact or overheating due to inaccurate installation. The screws secure the hard drive module 400 and power supply module 500 to the chassis 200, preventing loosening due to vibration or external forces during operation. This robust connection improves system reliability and reduces the risk of poor contact or short circuits caused by loose hard drive module 400 and power supply module 500. The screw design also facilitates the removal and reinstallation of the hard drive module 400 and power supply module 500, allowing maintenance personnel to easily perform repairs or replacements, reducing maintenance time and workload.

[0072] By incorporating hard drive module 400 and power supply module 500, and using I-beams and screws for precise positioning and secure connection, this server achieves significant technical improvements in areas such as precise positioning, secure connection, system stability, installation and maintenance processes, scalability, reliability, and space utilization. This design not only enhances the overall performance and reliability of the server but also provides strong support for its long-term stable operation and hardware upgrades.

[0073] In some embodiments of the present invention, the support structure further includes a stopper 600, which is slidably disposed between the first support frame 110 and the second support frame 120.

[0074] The stop device 600 is slidably disposed between the first support frame 110 and the second support frame 120. The stop device 600 can effectively limit the flip angle of the motherboard module 300 and ensure that the motherboard module 300 will not exceed the preset angle range during the flipping process. This design enables the motherboard module 300 to accurately reach the flipping endpoint and avoid damage caused by excessive flipping.

[0075] Understandably, the stopper 600 slides between the first support frame 110 and the second support frame 120, and can also play a limiting role. The stopper 600 can prevent the motherboard module 300 from over-rotating, avoiding problems such as pulling of connecting cables, damage to components or deformation of support structure caused by over-rotation.

[0076] By introducing the stop device 600, the flip structure of the server motherboard module 300 has achieved significant technical benefits in terms of precisely controlling the flip angle, preventing over-flipping, enhancing system stability, simplifying operation procedures, optimizing space utilization, enhancing system scalability, and improving system reliability. This design not only improves the efficiency and reliability of the motherboard module 300's flip operation but also provides strong support for the long-term stable operation and hardware upgrades of the server.

[0077] Reference Figure 7 As shown, in some embodiments of the present invention, when the motherboard module 300 rotates to a preset angle and reaches the flipping fixed point state, the first support frame 110 and the second support frame 120 are on the same horizontal line and in a flat state, the sliding stop 600 moves to a preset position to prevent relative movement between the first support frame 110 and the second support frame 120.

[0078] Understandably, when the motherboard module 300 rotates to a preset angle and reaches the flipping fixed point, the first support frame 110 and the second support frame 120 are on the same horizontal line and in a flat state. The sliding stop 600 moves to a preset position to prevent relative movement between the first support frame 110 and the second support frame 120. The preset position is the connection point of the first support frame 110 and the second support frame 120. The stop 600 prevents relative movement between the support frames at the flipping endpoint (i.e., the connection point of the first support frame 110 and the second support frame 120), ensuring that the first support frame 110 and the second support frame 120 remain on the same horizontal line and maintain a flat state. This design allows the motherboard module 300 to be stably maintained in the predetermined position after flipping, without shaking or tilting due to external forces.

[0079] The fixing function of the stop device 600 effectively prevents relative movement between the first support frame 110 and the second support frame 120 due to unexpected external forces (such as collisions, vibrations, etc.), thereby avoiding accidental detachment of the motherboard module 300 from the flattened state and reducing the risk of equipment damage caused by accidental movement. This design improves the stability of the entire system at the end of the flipping process, reduces safety hazards caused by loose support frames, and ensures the safety of the operation process.

[0080] By introducing a sliding stop 600 and fixing the support frame position at the end of the flip, this flip structure of the server motherboard module 300 achieves significant technical benefits in terms of enhanced stability, prevention of accidental movement, precise control, optimized space utilization, simplified operation procedures, and extended equipment lifespan. This design not only improves the efficiency and reliability of the motherboard module 300's flip operation but also provides strong support for the long-term stable operation and hardware upgrades of the server.

[0081] In one embodiment, refer to Figures 1 to 8 The motherboard module 300 slides into the chassis 200 from the outside. The retaining pins on both sides of the chassis 200 are pressed down, aligning with the mounting holes 210 on the side wall of the chassis 200. The retaining pin button 320 is then rotated counterclockwise to keep it in the extended position, maintaining a hole-axis engagement with the mounting holes 210 on the side wall of the chassis 200. When maintenance of the hard drive module 400 and power supply module 500 is required, the motherboard module 300 rotates around the top axis 322 of the retaining pin. When it rotates to a certain angle, the first support bracket 110 and the second support bracket 120 move relative to each other and provide support for the motherboard module 300. The first support bracket 110 and the second support bracket 120 support the motherboard module 300, providing sufficient maintenance space for the hard drive module 400 and power supply module 500 below, without needing to remove the upper motherboard module 300 and cables, thus facilitating installation and subsequent maintenance. The hard drive module 400 and power supply module 500 are positioned by I-beams on the side wall of the chassis 200 and then connected to the chassis 200 by screws. The first pivot 140 corresponding to the first support frame 110 is riveted to the side wall of the chassis 200, and additional pins are added to the side wall of the chassis 200 to support the first support frame 110. The second pivot 150 is used to connect the first support frame 110 and the second support frame 120. The roller slide 130 is riveted to the bottom of the motherboard tray 310. The roller slide 130 facilitates the positioning and limiting of the roller 160. The roller 160 rolls along the roller slide 130. When the motherboard module 300 rotates to a certain angle and reaches the end point of the flip, the first support frame 110 and the second support frame 120 are on the same straight line and in a flat state. The sliding stop 600 moves to a preset position to prevent the first support frame 110 and the second support frame 120 from rotating relative to each other and to prevent the motherboard module 300 from falling. At this time, maintenance operations such as plugging and unplugging cables and replacing backplanes can be performed on hard drive module 400 and power supply module 500; the motherboard module 300 can be quickly disassembled and flipped, allowing maintenance personnel to easily flip the motherboard module 300 to a preset angle, thus making it easier to access the various components on the motherboard.

[0082] After the maintenance and assembly are completed, press the first support frame 110, which will cause the second support frame 120 to rotate and the roller 160 to slide. The motherboard module 300 will rotate downwards simultaneously. When the motherboard module 300 rotates to the preset angle and reaches the end of the flipping state, refer to... Figure 8 As shown, the first support frame 110 and the second support frame 120 return to their initial state, i.e., the folded state, completing the operation and maintenance of the server.

[0083] Under normal operating conditions, the motherboard module 300 can be compactly placed inside the chassis 200 without occupying extra space. When maintenance or upgrades are required, the motherboard module 300 can be flipped open to make full use of the internal space of the chassis 200, avoiding maintenance difficulties caused by space constraints. This design achieves greater flexibility and operability within a limited space.

[0084] Compared to traditional fixed motherboard modules 300, maintenance personnel do not need to completely remove the entire motherboard from the chassis 200, making the operation simple and intuitive, greatly saving time and effort, and improving maintenance efficiency. Furthermore, the support structure and the design of the motherboard module 300 allow it to move and rotate flexibly within the chassis 200, and it can be replaced or upgraded through simple disassembly and installation. In addition, the space created when flattened increases the surface area of ​​the motherboard module 300 in contact with the air, which is beneficial for heat dissipation.

[0085] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the above-described embodiments. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention, as long as they achieve the technical effects of the present invention by the same means, should be included within the scope of protection of the present invention. Within the scope of protection of the present invention, the technical solutions and / or implementation methods can have various modifications and variations.

Claims

1. A server with a flip-up motherboard module structure, characterized in that, include: The support structure includes a first support frame (110), a second support frame (120), and a roller slide (130), wherein the first support frame (110) and the second support frame (120) are movably connected; The chassis (200) has fixing holes (210) on its side wall, and the first support frame (110) is riveted to the fixing holes (210) on the side wall of the chassis (200). A motherboard module (300) is disposed inside the chassis (200). The motherboard module (300) includes a motherboard tray (310). A roller slide (130) is riveted to the bottom of the motherboard tray (310). One end of the roller slide (130) is riveted to the second support frame (120). The motherboard tray (310) is provided with a non-detachable pin button (320) on both sides. The non-detachable pin button (320) is aligned with the fixing hole (210) on the side wall of the chassis (200). Pressing the first support frame (110) causes the second support frame (120) to move relative to each other. Rotating the non-detachable pin button (320) causes the motherboard module (300) to flip to a preset angle, achieving a flipped and flattened state. The non-detachable pin button (320) includes a knob (321) and a top shaft (322). When the knob (321) of the non-detachable pin button (320) is rotated, the top shaft (322) is kept in the ejected state and maintains a hole-shaft engagement with the fixing hole (210) on the side wall of the chassis (200). The motherboard module (300) rotates counterclockwise with the top shaft (322) of the non-detachable pin button (320) as the rotation axis. The support structure also includes a roller (160), which is disposed in the roller slide (130). When the motherboard module (300) rotates counterclockwise around the top shaft (322) of the release pin button (320), it drives the roller (160) to roll forward in the roller slide (130). The first support frame (110) and the second support frame (120) generate rotational motion to make the motherboard module (300) rotate synchronously. When the motherboard module (300) rotates to a preset angle and reaches the flipping fixed point state, the first support frame (110) and the second support frame (120) are located on the same horizontal line and are in a flattened state.

2. The server with a flip-up motherboard module structure according to claim 1, characterized in that, The support structure also includes a first rotating shaft (140) and a second rotating shaft (150). The first support frame (110) and the second support frame (120) are connected in a first state or a second state through the first rotating shaft (140). The first support frame (110) is riveted to the fixing hole (210) on the side wall of the chassis (200) through the second rotating shaft (150).

3. The server with a flip-up motherboard module structure according to claim 2, characterized in that, The first state is that the first support frame (110) and the second support frame (120) are folded, and the second state is that the first support frame (110) and the second support frame (120) are flattened.

4. The server with a flip-up motherboard module structure according to claim 3, characterized in that, When the motherboard module (300) rotates clockwise around the top shaft (322) of the non-detachable pin button (320), it drives the roller (160) to roll back within the roller slide (130), and the first support frame (110) and the second support frame (120) generate rotational motion to make the motherboard module (300) rotate synchronously. When the motherboard module (300) rotates to a preset angle and reaches the end of the flipping state, the first support frame (110) and the second support frame (120) are in a folded state.

5. The server with a flip-up motherboard module structure according to claim 1, characterized in that, The roller (160) is provided with a top shaft. When the roller (160) rolls forward in the roller slide (130) to the end of the roller slide (130), the top shaft of the roller (160) pops out and is engaged with the limiting hole of the second support frame (120).

6. The server with a flip-up motherboard module structure according to claim 1, characterized in that, It also includes a hard disk module (400) and a power supply module (500). The side wall of the chassis (200) is provided with T-shaped pins. The hard disk module (400) and the power supply module (500) are positioned by the T-shaped pins on the side wall of the chassis (200) and connected to the chassis (200) by screws.

7. The server with a flip-up motherboard module structure according to claim 1, characterized in that, The support structure also includes a stop (600), which is slidably disposed between the first support frame (110) and the second support frame (120).

8. The server with a flip-up motherboard module structure according to claim 7, characterized in that, When the motherboard module (300) rotates to a preset angle and reaches the flipped fixed point state, the first support frame (110) and the second support frame (120) are on the same horizontal line and in a flat state. The stop (600) is slid to a preset position to prevent relative movement between the first support frame (110) and the second support frame (120).

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