Bit slice long circle cooling hole distribution calculation method and system and storage medium

Abstract

The application discloses a kind of bit slice long circle cooling hole distribution calculation method, system and storage medium, including the basic parameter of long circular cooling hole distribution calculation being set, basic parameter includes the geometric parameter and material attribute of coil, and the setting parameter of cooling hole;According to the resistance of the electrically conductive ring band and the flow used for cooling the resistance calculated according to the basic parameter, wherein the conductor between the adjacent two circles of cooling hole of bit slice is an electrically conductive ring band;The position of the center radius of the outer circle cooling hole of electrically conductive ring band is adjusted, so that the product between the resistance of each electrically conductive ring band and the flow used for cooling the resistance is a same fixed value;The application adjusts the product between the resistance of each electrically conductive ring band and the cooling water flow used for cooling the resistance by adjusting the position of the inner and outer radius of electrically conductive ring band, and gives the cooling hole distribution calculation result for ensuring that the temperature of each ring band of bit slice is nearly uniform.

Description

Technical Field

[0001] This invention relates to the field of water-cooled magnet technology, specifically to a method, system, and storage medium for calculating the distribution of oblong cooling holes in a bit chip. Background Technology

[0002] Water-cooled magnets are fundamental devices for generating steady-state strong magnetic fields, characterized by rapid excitation speed and high magnetic field strength. Each water-cooled magnet consists of several concentric nested, axially cooled bit coils. For example, the WM6 water-cooled magnet consists of six bit coils: A, B, C, D, E, and F. Each bit coil is constructed by stacking hundreds or even thousands of bit sheets and insulating sheets in a specific assembly method. Each bit sheet has dozens or even hundreds of cooling holes distributed on it. During coil assembly, these cooling holes are aligned accordingly, forming dozens or even hundreds of cooling channels. High-speed deionized water flows from top to bottom through these cooling channels, carrying away the Joule heat generated by the magnet's bit coils when energized, ensuring stable magnet operation. To generate the highest possible stable magnetic field, the power consumption of water-cooled magnets is typically in the range of 20-33 megawatts, with each coil consuming several megawatts or even tens of megawatts. This necessitates that the distribution of cooling holes on the bit sheets adhere to certain design principles. The principle for distributing cooling holes is to ensure that the temperature on the bitter plate is nearly uniform and not too high, usually below 100 degrees Celsius. Only in this way can the stable operation of the magnet be guaranteed to the maximum extent. Otherwise, the local temperature of the bitter coil may become too high, causing the insulation sheet to burn through, which in turn will cause a short circuit in the coil and affect the operation of the magnet.

[0003] The external bitter coil of the water-cooled magnet has a low power density and typically uses a cross-distribution of circular cooling holes, such as... Figure 1 As shown, this type of cooling hole design typically uses the same number and size of cooling holes on each ring, and ensures that the resistance between any two adjacent rings of cooling holes is the same. However, the internal coils of water-cooled magnets have a higher power density, reaching 12 watts per cubic millimeter. Using a circular distribution of cooling holes makes it difficult to guarantee the cooling effect. Therefore, a cross-arrangement of elongated oval-shaped cooling holes is adopted to reduce stress and increase cooling effect. Under the same flow rate, this improves cooling efficiency and meets the high power density requirements of the coils. The bitter plates of the three coils inside the water-cooled magnet of the previous 40T hybrid magnet used this elongated oval cooling hole design. Figure 2 As shown, from the inside out, there are three-coil biter plates (A, B, and C), with cooling water holes arranged in multiple circles around the circumference on each biter plate. The biter plates of the three coils inside the water-cooled magnet of the 45T hybrid magnet, an upgrade from the 40T hybrid magnet, still adopt this cross-arrangement structure of elongated oval cooling holes. Figure 2The Bitter sheet of the long-circle cooling hole distribution type shown in the figure is named Florida-Bitter, but there is no specific introduction of the design implementation method of the long-circle cooling hole distribution of Florida-Bitter. SUMMARY

[0004] The technical problem to be solved by the present application is how to realize the optimization calculation of the Bitter sheet long-circle cooling hole distribution.

[0005] The present application solves the above technical problems by the following technical means:

[0006] A Bitter sheet long-circle cooling hole distribution calculation method is provided, which comprises:

[0007] Basic parameters for long-circle cooling hole distribution calculation are set, including the geometric parameters and material properties of the coil, and the set parameters of the cooling hole;

[0008] The resistance of the conductive ring band and the flow rate for cooling the resistance are calculated according to the basic parameters, wherein the conductor between the adjacent two cooling holes of the Bitter sheet is a conductive ring band;

[0009] The position of the outer cooling hole center radius of the conductive ring band is adjusted so that the product of the resistance of each conductive ring band and the flow rate for cooling the resistance is a fixed value.

[0010] Further, the geometric material and material properties of the coil include the resistivity of the Bitter sheet, the conductor thickness, and the inner radius and outer radius of the Bitter sheet;

[0011] The set parameters of the long-circle cooling hole include the number of turns of the cooling hole distribution arrangement and the number of cooling holes distributed on each turn, the hydraulic diameter of each cooling hole, the length of each cooling hole or the ring spacing between adjacent cooling holes on each turn, the center radius of the first cooling hole and the center radius of the last cooling hole.

[0012] Further, the resistance of the conductive ring band and the flow rate for cooling the resistance are calculated according to the basic parameters, comprising:

[0013] Based on the resistivity of the Bitter sheet, the conductor thickness, the number of cooling holes per turn, the length of the cooling hole per turn, the width of the cooling hole per turn, and the ring spacing between adjacent cooling holes on each turn, the resistance of each conductive ring band is calculated;

[0014] According to the flow velocity of the cooling hole, the hydraulic diameter of the cooling hole, the number of cooling holes per turn, the length of the cooling hole per turn, and the width of the cooling hole per turn, the flow rate for cooling the resistance of each conductive ring band is calculated;

[0015] The width of the cooling holes is calculated in advance based on the hydraulic diameter and length of the cooling holes, and the water flow velocity and hydraulic diameter of each ring of cooling holes are the same.

[0016] Furthermore, the resistance of the conductive ring is calculated using the following methods:

[0017] when , At that time, the first The resistance of each conductive ring The calculation formula is:

[0018]

[0019] when , At that time, the first The resistance of each conductive ring The calculation formula is:

[0020]

[0021] In the formula, For the first The number of cooling holes in the ring, For the first The number of cooling holes in the ring, , The resistivity of the bit chip. For conductor thickness, and The first The length of the cooling hole, the first The length of the cooling hole and The first Width of the cooling hole, the first The width of the cooling holes. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The center radius of the cooling hole For the first The center radius of the cooling hole The total number of cooling hole loops on the bit chip is [value], and the total number of conductive rings is [value]. .

[0022] Furthermore, the resistance of the conductive ring is calculated using the following methods:

[0023] when , , ( At that time, the first The resistance of each conductive ring The calculation formula is:

[0024]

[0025] when , , ( At that time, the first The resistance of each conductive ring The calculation formula is:

[0026]

[0027] In the formula, For the first The number of cooling holes in the ring, For the first The number of cooling holes in the ring, The resistivity of the bit chip. For conductor thickness, and The first The length of the cooling hole, the first The length of the cooling hole and The first Width of the cooling hole, the first The width of the cooling holes. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The center radius of the cooling hole For the first The center radius of the cooling hole The total number of cooling hole loops on the bit chip is [value], and the total number of conductive rings is [value]. .

[0028] Furthermore, the formula for calculating the flow rate used to cool the resistor is:

[0029]

[0030] In the formula, For use in cooling the first The resistance of each conductive ring The flow rate, the water flow velocity of each ring of cooling holes is The hydraulic diameter of each ring of cooling holes is , For the first the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, , the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle, the number of the cooling holes of the outer circle.

[0031] Further, the calculation formula of the cooling hole width is:

[0032]

[0033] In the formula, the number of the cooling holes of the outer circle, the hydraulic diameter of the cooling hole, the number of the cooling holes of the outer circle. Further, the position of the center radius of the outer circle cooling hole of the adjusting conductive ring is adjusted so that the product of the resistance of each conductive ring and the flow rate for cooling the resistance is a same fixed value, comprising:

[0034] for the mth conductive ring, the center radius of the outer circle cooling hole is continuously adjusted so that the product of the resistance of the mth conductive ring and the flow rate for cooling the resistance is the fixed value,

[0035] for the mth conductive ring, the center radius of the outer circle cooling hole is continuously adjusted so that the product of the resistance of the mth conductive ring and the flow rate for cooling the resistance is the fixed value, i and is an integer, is the total number of the cooling hole distribution on the chip, and the outer circle cooling hole of the mth conductive ring is the nth cooling hole; determining whether the center radius of the outer circle cooling hole of the mth conductive ring meets the set calculation error requirement; if yes, keeping the fixed value unchanged, and completing the cooling hole distribution optimization calculation;

[0036] determining whether the center radius of the outer circle cooling hole of the mth conductive ring meets the set calculation error requirement; if yes, keeping the fixed value unchanged, and completing the cooling hole distribution optimization calculation;

[0037] if yes, keeping the fixed value unchanged, and completing the cooling hole distribution optimization calculation;

[0038] ​​​If not, the fixed value is adjusted, and the center radius of the outer cooling hole of each conductive ring is re-adjusted based on the new fixed value, and the iteration is calculated until the product of the resistance of each conductive ring and the flow rate for cooling the resistance is the same, and the center radius of the outer cooling hole of the first conductive ring meets the set calculation error requirement, and the cooling hole distribution optimization calculation is completed. The center radius of the outer cooling hole of the first conductive ring meets the set calculation error requirement.

[0039] Further, the judgment of whether the center radius of the outer cooling hole of the first conductive ring meets the set calculation error requirement comprises:

[0040] Calculating the absolute value of the difference between the center radius of the outer cooling hole of the first conductive ring and the set center radius of the outer cooling hole of the first conductive ring.

[0041] Judging whether the absolute value is within the calculation error range.

[0042] Further, the center radius of the outer cooling hole of the conductive ring is iteratively approximated by using the bisection method until the set calculation error requirement is met.

[0043] Further, the fixed value is continuously adjusted by using the bisection method, comprising:

[0044] When the center radius of the outer cooling hole of the first conductive ring is less than the center radius of the outer cooling hole of the first conductive ring, the fixed value is continuously decreased by using the bisection method. When the center radius of the outer cooling hole of the first conductive ring is greater than the center radius of the outer cooling hole of the first conductive ring,

[0045] the fixed value is continuously increased by using the bisection method. In addition, the present application also provides a bit slice long circular cooling hole distribution calculation system, the system comprises:

[0046] A parameter setting module is configured to set the basic parameters of the long circular cooling hole distribution calculation, the basic parameters including the geometric parameters and material properties of the coil, and the set parameters of the cooling hole.

[0047] A calculation module is configured to calculate the resistance of the conductive ring and the flow rate for cooling the resistance according to the basic parameters, wherein the conductor between the adjacent two cooling holes of the bit slice is a conductive ring.

[0048]

[0049] ​​​​​​​​The adjustment module is used to adjust the position of the center radius of the cooling holes on the outer ring of the conductive ring so that the product between the resistance of each conductive ring and the flow rate used to cool that resistance is the same fixed value.

[0050] Furthermore, the present invention also proposes a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the bit chip oblong cooling hole distribution calculation method as described above.

[0051] The advantages of this invention are:

[0052] (1) This invention conducts a specific theoretical analysis and derivation of the Florida-Bitter model and analyzes the parameter relationship of the elongated cooling holes. It concludes that in order to ensure that the water temperature rise of each ring of cooling holes is the same, the product between the resistance of each conductive ring and the cooling water flow rate used to cool the resistor can be kept constant. Therefore, this invention further adjusts the product between the resistance of each conductive ring and the cooling water flow rate used to cool the resistor by freely adjusting the position of the outer radius of the conductive ring. This results in a cooling hole distribution calculation that ensures the temperature of each ring of the bit chip is nearly uniform while keeping the product between the ring resistance and the corresponding cooling water flow rate of each conductive ring unchanged.

[0053] (2) In the calculation of the resistance of the Florida-Bitter sheet ring conductor, the present invention replaces the rounded corner model of the ring conductor with a right-angle model of the ring conductor, realizing the calculation of the resistance of the conductive ring containing the elongated oval cooling holes using the theoretical resistance formula. The theoretical resistance calculation results are compared with the Ansys simulation calculation results to verify the feasibility and accuracy of the theoretical resistance formula calculation method; and according to the cross arrangement of the elongated oval cooling holes, the first Number of cooling holes For the first Number of cooling holes The value is an integer multiple of the value. In Florida-Bitter chip design, it is usually taken as 1 or 2 times. This invention provides calculation formulas for the ring resistance in the case of 1 times and the ring resistance in the case of 2 times, which are more in line with actual engineering applications.

[0054] (3) By analyzing the parameter relationship of the elongated oval cooling hole, the present invention realizes the calculation of the cooling water flow rate for cooling the conductive ring resistor using theoretical formula, and adjusts the size of the ring conductor resistance by adjusting the outer radius of the conductive ring. When the ring resistance decreases, the flow rate is increased to keep the product of the two constant.

[0055] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0056] The accompanying drawings, which form a part of this specification, are included to provide a further understanding of the application, and are incorporated herein by reference. The embodiments depicted herein, and described below, are presently preferred embodiments of the present application.

[0057] Figure 1 is a schematic diagram of the cross distribution of circular cooling holes described in the background section of the present application;

[0058] Figure 2 is a physical diagram of a 40T hybrid magnet internal three coil Florida-Bitter described in the background section of the present application;

[0059] Figure 3 is a flowchart of a method for calculating the distribution of long circular cooling holes of a bit slice according to an embodiment of the present application;

[0060] Figure 4 is a schematic diagram of a water-cooled magnet Florida-Bitter coil according to an embodiment of the present application;

[0061] Figure 5 is a schematic diagram of a discrete conductive ring band of a bit slice according to an embodiment of the present application;

[0062] Figure 6 is a schematic diagram of the basic parameters of a long circular cooling hole according to an embodiment of the present application;

[0063] Figure 7 is a schematic diagram of the parameter relationship of the first conductive ring band according to an embodiment of the present application;

[0064] Figure 8 is a schematic diagram of the ansys simulation calculation results of a conductive ring band when there is a cross between the inner and outer ring cooling holes according to an embodiment of the present application;

[0065] Figure 9 is a schematic diagram of the ansys simulation calculation results of a conductive ring band when there is no cross between the inner and outer ring cooling holes according to an embodiment of the present application;

[0066] Figure 10 is a schematic diagram of the cooling hole distribution calculated according to the equal resistance of a conductive ring band according to an embodiment of the present application;

[0067] Figure 11 is a schematic diagram of the cooling hole distribution calculated when the distance between each cooling hole is set to be the same constant value according to an embodiment of the present application;

[0068] Figure 12 is a schematic diagram of the cooling hole distribution calculated when the distance between each cooling hole is set to be different and fixed values according to an embodiment of the present application;

[0069] Figure 13 is a structural schematic diagram of a bit slice long circular cooling hole distribution calculation system according to an embodiment of the present application. DETAILED DESCRIPTION

[0070] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below in a clear and complete manner in conjunction with the embodiments of the present application. Obviously, the described embodiments are only some, but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0071] As shown in Figure 3 , the present application provides a bit slice long circular cooling hole distribution calculation method, which comprises the following steps:

[0072] S10, setting basic parameters for long circular cooling hole distribution calculation, the basic parameters including geometric parameters and material properties of the coil, and setting parameters of the cooling hole;

[0073] It should be noted that after the material of the coil is determined, the geometric parameters and material properties of the coil can be obtained, such as the numerical values of the inner and outer radii of the coil, the resistivity of the conductor and the thickness of the conductor, etc. The setting parameters of the long circular cooling hole can include the hydraulic diameter of the cooling hole, the circumferential spacing of adjacent cooling holes on each circle, the number of cooling hole distribution, etc.

[0074] It should be noted here that the cooling water holes on each bitter slice are arranged in multiple circles along the circumferential array, and a plurality of cooling holes are distributed on each circle, and the number of cooling holes on each circle, the size of the cooling hole, and the circumferential spacing of the cooling holes on each circle can be designed to be the same or different, which can be determined according to actual engineering application, and the present embodiment is not limited in detail.

[0075] S20, calculating the resistance of the conductive ring belt and the flow rate for cooling the resistance according to the basic parameters, wherein the conductor between the adjacent two circles of cooling holes of the bit slice is a conductive ring belt;

[0076] S30, adjusting the position of the center radius of the outer circle cooling hole of the conductive ring belt, so that the product of the resistance of each conductive ring belt and the flow rate for cooling the resistance is a fixed value.

[0077] It should be noted that this embodiment first conducts a specific theoretical analysis and derivation of the Florida-Bitter model, concluding that to ensure the same temperature rise of the water flowing through each ring of cooling holes, the product between the resistance of each conductive ring and the flow rate of the cooling water used to cool that resistor can be kept constant. Furthermore, the product between the resistance of each conductive ring and the flow rate of the cooling water used to cool that resistor can be adjusted by freely adjusting the position of the inner and outer radii of the conductive rings. Therefore, this embodiment automatically performs optimization and iterative calculations by inputting the basic parameters required to calculate the resistance of the conductive rings and the flow rate used to cool that resistor, while ensuring the same temperature rise of the water in each ring of cooling holes, and finally determines the center radius, size, and arrangement of the elongated oval cooling holes on the Bitter chip, providing the calculation results of the cooling hole distribution that ensures a nearly uniform temperature in each ring of the bit chip.

[0078] Furthermore, this embodiment provides a detailed theoretical analysis and derivation of the Florida-Bitter model, specifically including the calculation and analysis of Florida-Bitter coil power and steady-state heat transfer, the parameter relationship analysis of the elongated oval cooling holes, and the... i Resistance of the conductive ring The calculation process is as follows:

[0079] (1) Calculation of Florida-Bitter coil power and steady-state heat transfer

[0080] Figure 4 It features a water-cooled magnet Forida-Bitter coil structure. During operation, deionized cooling water flows at high speed through the coil from the top, carrying away the Joule heat generated when the coil is energized, thus ensuring that the coil generates a steady magnetic field.

[0081] Assume the deionized water pressure at the upper end of the magnet coil is The water pressure at the lower end is The coil height is , No. The hydraulic diameter of the cooling hole is The corresponding flow through the first The cooling water flow rate of each coil cooling hole is The local resistance loss at the end of the water flow channel is negligible compared to the friction loss along the coil length. According to the fluid mechanics friction loss formula, the following relationship exists, as shown in formula (1):

[0082] (1)

[0083] In the formula, The coefficient of friction resistance of the magnet cooling hole wall is given. The density of the deionized cooling water is a constant value.

[0084] Average heat transfer coefficient of each coil of the cooling hole of the magnet The flow rate of the deionized cooling water The following relationship exists:

[0085] (2)

[0086] In the formula, is a constant related to the surface roughness of the cooling hole, and for the same coil (related to the coil geometry factor) and (related to the coil roughness) are constants, The value range is [1, 2].

[0087] In the design of the long circular cooling hole compared to the Bitter coil, it is necessary to ensure that the heat transfer coefficients of the cooling hole wall surfaces on each coil of the Bitter sheet are the same, if the same is ensured, it can be known from formula (2) that the water flow rates of the cooling holes of each coil must be the same. And from formula (1), to ensure that the water flow rates of the cooling holes of each coil are the same, it is necessary to ensure that the hydraulic diameters of the cooling holes of each coil are the same, and the hydraulic diameter of each coil is calculated from formula (3):

[0088] (3)

[0089] In the formula, is the area of the cooling hole of the th coil, is the circumference of the cooling hole of the th coil.

[0090] Assuming that the hydraulic diameters of the cooling holes of each coil are the same, formula (4) is obtained:

[0091] (4)

[0092] By dividing the Florida-Bitter sheet into many conductive ring bands along the circumferential direction according to the center radius of the cooling hole ring, that is, the conductor between the adjacent two cooling holes on the Bitter sheet is called a conductive ring band, and the adjacent two cooling holes are the inner and outer cooling holes of the conductive ring band, so that the Bitter sheet is divided into multiple conductive ring bands; one end of the conductive ring band is applied with a voltage and the other end is applied with a voltage (as shown in Figure 5 ), and the conductive ring band between the cooling holes of the th coil and the th coil of the Florida-Bitter sheet is taken out as the Heat transfer calculations were performed on the first conductive ring (where the first... The cooling holes are the first The inner ring cooling hole of the conductive ring, the first The cooling holes are the first (The outer ring of the conductive ring has cooling holes). Assume the resistance of this conductive ring is... The potential difference between the two ends is According to Ohm's law, the heat generated by this conductive ring... As in formula (5):

[0093] (5)

[0094] Based on the heat transfer balance of the coil in steady state, it can be seen that the heat of this conductive ring is carried away by the deionized water flowing from top to bottom. Formulas (6) and (7) can be established:

[0095] (6)

[0096] (7)

[0097] In the formula, The density of deionized water, Specific heat capacity of deionized water For use in cooling conductive ring resistors Traffic, This refers to the inlet temperature when deionized cooling water enters the upper part of the magnet coil. The outlet temperature is the temperature at which deionized cooling water flows out of the lower end of the magnet coil.

[0098] Based on the characteristics of the Florida-Bitter sheet, it can be known that the flow rate of each ring of elongated cooling holes is used to cool the conductive rings on both sides. Therefore, the cooling water flow rate allocated to each conductive ring can be approximated as half the flow rate of the inner and outer ring cooling holes. Based on this assumption, formula (8) can be obtained:

[0099] (8)

[0100] in, , The first Circle and the first The number of cooling holes in the ring, , The first Circle and the first The area of ​​the cooling holes is circled. , The first Circle and the first Water flow rate through the cooling holes.

[0101] Substituting formula (3) into formula (8) yields the following formula (9):

[0102] (9)

[0103] The hydraulic diameter of each cooling hole can be determined from formula (4). All for Under this premise, it can be seen from formula (1) that the water flow rate of each ring of cooling holes is the same. Assuming the water flow rate of each ring of cooling holes is... All for ,Bundle , Substituting into formula (9), we get formula (10):

[0104] (10)

[0105] In the formula, For the first The circumference of the cooling holes. For the first The circumference of the cooling holes.

[0106] According to the heat transfer formula in steady state We can obtain the following formula (11):

[0107] (11)

[0108] Transform formula (11) into formula (12):

[0109] (12)

[0110] From formula (12), it can be seen that in order to ensure the water temperature rise through each cooling hole, Same, must be maintained The product is a constant value.

[0111] (2) Calculation of the parameter relationship of cooling holes

[0112] Assuming the first The center radius of the cooling hole is The number of cooling holes is The circumferential spacing of the cooling holes is ;No. The center radius of +1 ring of cooling holes is The number of cooling holes is The circumferential spacing of the cooling holes is The conductor thickness of the conductive ring is The basic parameters for the cooling holes are shown in [link / reference]. Figure 6 As shown, For the first The length of the cooling hole For the first The width of the cooling hole, the perimeter and area of the cooling hole are calculated by equation (13) and equation (14) respectively:

[0113] (13)

[0114] (14)

[0115] The hydraulic diameter is calculated by equation (15):

[0116] (15)

[0117] Design of the hydraulic diameter of the cooling hole of Florida-Bitter sheet is a constant value, and the length of the cooling hole is known, equation (15) can be transformed into a quadratic equation about , and the coefficients of each term are shown in equation (16). The width of the cooling hole can be calculated by equation (17):

[0118] (16)

[0119] (17)

[0120] (3) The resistance of the first The resistance of the first The resistance is calculated by simplifying the rounded corners to straight corners.

[0121] The first The first Figure 7 The first The first The first The first The first The first The first The first The first Figure 7 The resistance of the first one cooling hole and one hole spacing arc length can be divided into four parts, which are , , and . According to the cross arrangement of the cooling hole, the number of the first The first The first The first integer multiples of 1, 2, or 3, and the Florida-Bitter design usually takes 1 or 2, i.e. or , According to the geometric parameter relationship, the length of the cooling hole can be calculated as formula (18) and formula (19):

[0122] (18)

[0123] (19)

[0124] When , (i.e. the cooling holes in the inner and outer rings of the conductor ring belt intersect), according to the pair of properties shown in Figure 7 , the resistance calculation formula (20) of the conductor ring belt is:

[0125] (20)

[0126] Assuming the total central angle corresponding to this part of the resistance is , then there are formula (21) and formula (22):

[0127] (21)

[0128] (22)

[0129] Assuming the total central angle corresponding to this part of the resistance is , then there are formula (23) and formula (24):

[0130] (23)

[0131] (24)

[0132] Assuming the total central angle corresponding to this part of the resistance is , then there are formula (25) and formula (26):

[0133] (25)

[0134] (26)

[0135] Substituting formula (21)-(26) into formula (20) can obtain formula (27.1):

[0136] (27.1)

[0137] ​Similarly, when , , the resistance calculation formula of the conductor ring band is (27.2):

[0138] (27.2)

[0139] Similarly, when , , , the resistance calculation formula (27.3) of the conductor ring band is:

[0140] (27.3)

[0141] When , , , the resistance calculation formula (27.4) of the conductor ring band is:

[0142] (27.4)

[0143] Substitute formula (16) into formula (17) to obtain formula (28) and formula (29):

[0144] (28)

[0145] (29)

[0146] Substitute formula (13) into formula (10) to obtain formula (30):

[0147] (30)

[0148] Therefore, under the condition of ensuring , the value of and can be adjusted by adjusting the position of and , and the product of and remains unchanged during the adjustment process to ensure that the water temperature rise of each cooling hole is the same.

[0149] Therefore, through specific theoretical analysis and derivation of the Florida-Bitter model, according to formulas (27)-(30), under the condition that , , , , are constant values, the value of To adjust the resistance of the conductive ring belt Size, Increasing the resistance of the ring belt Decrease, flow Increase, keep Invariable, then And Inverse proportional relationship.

[0150] Further, the embodiment will use the theoretical resistance formula to calculate the resistance of the conductive ring belt containing the long circular cooling hole and compare it with the Ansys simulation calculation result to verify the feasibility and accuracy of the theoretical resistance formula calculation method, as follows:

[0151] (1) Meet the condition ( ) Ring belt model parameters and ring belt resistance (Ring belt resistance is calculated by formula (27.1), where ) and Figure 8 Ansys simulation calculation result (Where ) Comparison is shown in Table 1:

[0152] Table 1 Ring belt resistance when the inner and outer ring cooling holes of the conductor ring belt intersect Comparison of calculation results

[0153]

[0154] Meet the condition ( ) Ring belt model parameters and ring belt resistance (Ring belt resistance is calculated by formula (27.2), where ) and Figure 9 Ansys simulation calculation result (Where ) Comparison is shown in Table 2:

[0155] Table 2 Ring belt resistance when the inner and outer ring cooling holes of the conductor ring belt intersect Comparison of calculation results

[0156] It should be noted that by comparing the theoretical resistance calculation result with the Ansys simulation calculation result, the ring belt resistance

[0157] calculated by the theoretical calculation is consistent with the ring belt conductor fillet model calculated by Ansys simulation ​The error is about 1%, which fully meets the engineering magnet design requirements, verifies the feasibility and accuracy of the theoretical resistance formula calculation method, and determines that the straight corner model of the ring conductor can be used instead of the Ansys simulated ring conductor round corner model for corresponding ring resistance calculation.

[0158] Through the above specific theoretical analysis and derivation of the Florida-Bitter model, it can be known that the embodiment can maintain the product of the resistance of each conductive ring and the cooling water flow rate for cooling the resistance as a constant value, to ensure that the water temperature rise through each cooling hole is the same, so the embodiment can adjust the product of the resistance of each conductive ring and the cooling water flow rate for cooling the resistance by freely adjusting the position of the inner and outer radii of the conductive ring, after inputting the inner and outer radii of the Bitter sheet, the hydraulic diameter of the cooling hole, the number of rings, the number of cooling holes per ring, and the hole spacing, the product of the resistance of each conductive ring and the corresponding cooling water flow rate is maintained, and the optimization iteration calculation is automatically performed under the condition that the product of the resistance of each conductive ring and the corresponding cooling water flow rate is maintained, and finally the center radius of the long circular cooling hole, the cooling hole size, and the arrangement mode of each ring of the Bitter sheet are determined, and the calculation result of the cooling hole distribution for ensuring the temperature of each ring of the Bitter sheet is nearly uniform is given.

[0159] As a further preferred technical solution, in the step S10, the geometric material and material attribute of the coil include the resistivity of the Bitter sheet , the conductor thickness , and the inner radius a1 and the outer radius a2 of the Bitter sheet;

[0160] The set parameters of the long circular cooling hole include the total number of cooling hole distribution arrangements , the number of cooling holes distributed on each ring, the hydraulic diameter of each cooling hole, the length of each cooling hole, or the ring spacing between adjacent cooling holes on each ring, the center radius of the first cooling hole , and the center radius of the last cooling hole .

[0161] As a further preferred technical solution, the step S20 of calculating the resistance of the conductive ring and the flow rate for cooling the resistance according to the basic parameters specifically includes the following steps:

[0162] S21, based on the resistivity of the Bitter sheet , the conductor thickness , the number of cooling holes of the first ring , the number of cooling holes of the first ring , the length of the first cooling hole , the length of the first cooling hole , the length of the first cooling hole , the length of the first cooling hole , the length of the first cooling hole , the length of the first cooling hole , the length of the first cooling hole Width of the cooling hole , No. Width of the cooling hole , No. Circumferential spacing between adjacent cooling holes , No. Circumferential spacing between adjacent cooling holes Calculate the first The resistance of each conductive ring;

[0163] S22, Based on the water flow velocity of the cooling holes Hydraulic diameter of cooling holes , No. Number of cooling holes , No. +1 ring of cooling holes , No. Length of cooling hole , No. Length of cooling hole , No. Width of the cooling hole , No. Width of the cooling hole Calculations for cooling the first The current flow rate of the resistance of each conductive ring;

[0164] The width of the cooling holes is calculated in advance based on the hydraulic diameter and length of the cooling holes, and the water flow velocity and hydraulic diameter of each ring of cooling holes are the same.

[0165] It should be noted here that the bit slice number 1 Circle and the first The conductor between +1 turns serves as the first... There are two conductive loops, but the range of values ​​differs, and the total number of loops is... The total number of conductive rings is .

[0166] As a further preferred technical solution, step S30: adjusting the position of the center radius of the cooling holes on the outer ring of the conductive ring so that the product between the resistance of each conductive ring and the flow rate used to cool the resistor is the same fixed value, specifically includes the following steps:

[0167] S31, Regarding the first The first conductive ring continuously adjusts the center radius of its outer cooling holes to make the first... The product of the resistance of each conductive ring and the flow rate used to cool that resistor is the fixed value, 1. and It is an integer. The total number of cooling hole rings on the bit chip, the th The outer ring cooling hole of the conductive ring is the first Cooling holes;

[0168] S32, Determine the first If the center radius of the outer ring cooling hole of each conductive ring meets the set calculation error requirement, proceed to step S34 if yes, otherwise proceed to step S33.

[0169] S33. Adjust the fixed value, and repeat steps S31-S32 based on the new fixed value;

[0170] S34. Complete the optimization calculation of cooling hole distribution.

[0171] It should be noted that the cooling hole distribution calculation in this embodiment can be implemented using Fortran programming, specifically by using the derived formulas (27)-(30) to calculate the specific annular resistance. With traffic , calculate Numerical value. When using this program, you must first set the number of cooling hole rings. Give the distribution radius of the first ring of cooling holes. Radius of the last ring of cooling holes After determining the annular spacing values ​​of each ring of cooling holes, because Given that, then The value is only related to Related to continuously adjusting the radius The value size can ultimately make It reaches a preset fixed value. Within the radius... Once determined, the radius can be adjusted using the same method. The magnitude of the value can ultimately make Once a preset fixed value is reached, the same result can be obtained by analogy. Value; thereby ensuring the value of each ring zone Constant.

[0172] When the calculated number If the center radius of the outer ring cooling hole of a conductive ring does not meet the set calculation error requirement, the fixed value is adjusted, and then the position of the center radius of the outer ring cooling hole of the conductive ring is readjusted so that the product between the resistance of each conductive ring and the flow rate used to cool that resistance is a new fixed value. Then, the calculation is performed again to determine the value of the first ring. The center radius of the cooling holes meets the set calculation error requirement. This iterative calculation is repeated until the product between the resistance of each conductive ring and the flow rate used to cool that resistor is the same, and the... When the center radius of the cooling holes meets the set calculation error requirements, the cooling hole distribution optimization calculation is completed.

[0173] It should be noted that other programming languages ​​can also be used to program and calculate the distribution of cooling holes in this embodiment, but this embodiment does not make any specific limitations.

[0174] As a further preferred technical solution, step S32: determine the first Whether the center radius of the outer ring cooling hole of each conductive ring meets the set calculation error requirements, specifically including:

[0175] S321, Calculate the first The center radius of the outer ring cooling hole of the conductive ring is related to the set first Radius of the center of the cooling hole The absolute value of the difference;

[0176] S322. Determine whether the absolute value is within the calculation error range.

[0177] As a further preferred technical solution, this embodiment uses a bisection method to iteratively approximate the center radius of the outer ring cooling hole of the conductive ring until the set calculation error requirement is met.

[0178] As a further preferred technical solution, step S33 specifically employs a binary search method to continuously adjust the fixed value, including:

[0179] In the The center radius of the outer ring cooling hole of the first conductive ring is smaller than that of the second. Center radius of the cooling hole When this happens, the binary search method is used to continuously decrease the fixed value;

[0180] In the The center radius of the outer ring cooling hole of the first conductive ring is greater than that of the first. Center radius of the cooling hole When this happens, the fixed value is continuously increased using a binary search method.

[0181] It should be noted that when the calculated number of... The center radius of the cooling holes on the outer ring of each conductive ring is larger than the distribution radius of the cooling holes on the last ring. When setting a value, increase The set value; when the calculated first The center radius of the cooling holes on the outer ring of each conductive ring is smaller than the distribution radius of the cooling holes on the last ring. When setting a value, decrease The set value. It should be noted that... The increase and decrease of the set value is also achieved by the bisection method, and finally the cooling hole distribution of each circle can be obtained satisfies the same value, and the first circle cooling hole distribution radius satisfies the last circle cooling hole distribution radius satisfies the pre-set value.

[0182] As a further preferred technical solution, the adjustment method of the outer radius of the conductive ring belt and the adjustment method of the set value can be adjusted by the bisection method, until the set error requirement is met.

[0183] It should be noted that the bisection method is preferably used for iterative adjustment in this embodiment, but those skilled in the art can also adjust the radius and set value in other ways, which is not limited in this embodiment.

[0184] The following is an explanation of the optimization distribution process of the three kinds of bit slices using the long circle cooling hole distribution calculation method:

[0185] (1) Ensure that the resistance of each conductive ring belt is equal

[0186] In this Florida-Bitter ring belt model, the number of inner and outer ring cooling holes of each conductive ring belt is the same and the length of the cooling holes is the same. At this time, the Fortran program implementation method is to ensure that the length of each conductive ring belt cooling hole is the same, and then through the bisection method, the distribution radius of each circle cooling hole is finally determined, and the resistance of each conductive ring belt is ensured to be the same. Among them, Table 3 is the given set parameter condition of the bit slice design, and Table 4 is the cooling hole distribution parameter optimized by the method of this embodiment, Figure 10 is the optimized cooling hole distribution diagram:

[0187] Table 3 Given set parameters )

[0188]

[0189] Table 4 Cooling hole optimization distribution parameters

[0190]

[0191] (2) Ensure that the cooling hole spacing of each circle of the bit slice is a constant value

[0192] In the Florida-Bitter ring belt model, the length of each cooling hole is not necessarily the same, and the ring belt resistance needs to be adjusted. The Fortran program implementation method is to ensure that the spacing of each cooling hole of the conductive ring belt is the same, and on this basis, the center radius of the cooling hole is continuously moved through the bisection method to calculate the resistance and the flow The iterative calculation finally determines the temperature of each ring belt The results are the same. Table 5 is the given set parameter condition of the bit slice design, Table 6 is the cooling hole distribution parameter optimized by the method of the embodiment, and the cooling hole distribution is as shown in Figure 11

[0193] Table 5 Given set parameter condition

[0194]

[0195] Table 6 Cooling hole optimization distribution parameter

[0196]

[0197] (3) Set the spacing of each cooling hole to different values, and all are fixed values

[0198] The Fortran program implementation method is to ensure that the spacing of each cooling hole of the conductive ring belt is the initial set value, and on this basis, the center radius of the cooling hole is continuously moved through the bisection method to calculate the resistance and the flow The iterative calculation finally determines the temperature of each ring belt The results are the same. Table 7 is the given set parameter condition of the bit slice design, Table 8 is the cooling hole distribution parameter optimized, and the cooling hole distribution is as shown in Figure 12

[0199] Table 7 Given set parameter condition

[0200]

[0201] Table 8 Cooling hole optimization distribution parameter

[0202]

[0203] It should be noted that the bit slice long circle cooling hole optimization calculation method proposed in the embodiment can realize the long circle cooling hole distribution optimization calculation of the three Florida-Bitter ring belt models under the given bit slice parameter limit condition, and ensure that the temperature of each conductive ring belt of the bit slice is nearly uniform. ​​​​

[0204] In addition, as Figure 13 shown, the second embodiment of the present application also proposes a system for calculating the distribution of long-circular cooling holes, which comprises:

[0205] a parameter setting module 10 for setting the basic parameters for calculating the distribution of long-circular cooling holes, the basic parameters including the geometric parameters and material properties of the coil, and the setting parameters of the cooling holes;

[0206] a calculation module 20 for calculating the resistance of the conductive ring belt and the flow rate for cooling the resistance according to the basic parameters, wherein the conductor between the adjacent two cooling holes of the bit slice is a conductive ring belt;

[0207] an adjustment module 30 for adjusting the position of the center radius of the outer cooling hole of the conductive ring belt, so that the product of the resistance of each conductive ring belt and the flow rate for cooling the resistance is a same fixed value.

[0208] As a further preferred technical solution, the geometric parameters and material properties of the coil include the resistivity of the bit slice , the thickness of the conductor , and the inner radius a1 and the outer radius a2 of the bit slice;

[0209] The setting parameters of the long-circular cooling holes include the total number of the distribution of the cooling holes , the number of the cooling holes distributed on each circle, the hydraulic diameter of each cooling hole, the length of each cooling hole or the ring spacing between the adjacent cooling holes on each circle, the distribution radius of the first cooling hole , and the distribution radius of the last cooling hole .

[0210] As a further preferred technical solution, the calculation module 20 specifically comprises:

[0211] a resistance calculation unit for calculating the resistance of the conductive ring belt based on the resistivity of the bit slice , the thickness of the conductor , the number of the first cooling hole , the number of the first cooling hole , the length of the first cooling hole , the length of the first cooling hole , the width of the first cooling hole , the width of the first cooling hole , the ring spacing between the adjacent cooling holes on the first circle , the ring spacing between the adjacent cooling holes on the first circle . ​​​​​​Circumferential spacing between adjacent cooling holes Calculate the first The resistance of each conductive ring;

[0212] The flow calculation unit is used to calculate the water flow rate from the cooling holes. Hydraulic diameter of cooling holes , No. Number of cooling holes , No. Number of cooling holes , No. Length of cooling hole , No. Length of cooling hole , No. Width of the cooling hole , No. Width of the cooling hole Calculations for cooling the first The current flow rate of the resistance of each conductive ring;

[0213] The width of the cooling holes is calculated in advance based on the hydraulic diameter and length of the cooling holes, and the water flow velocity and hydraulic diameter of each ring of cooling holes are the same.

[0214] It should be noted that the calculation methods for the resistance of the conductive ring and the cooling water flow rate used to cool the ring resistance can be found in the theoretical derivation section of the first embodiment above, and will not be repeated here.

[0215] As a further preferred technical solution, the adjustment module 30 is specifically used to perform the following steps:

[0216] Radius adjustment unit, used for the first The first conductive ring continuously adjusts the center radius of its outer cooling holes to make the first... The product of the resistance of each conductive ring and the flow rate used to cool that resistor is the fixed value. and It is an integer. The total number of rings of cooling holes on the bit chip, the th The outer ring cooling hole of the conductive ring is the first Cooling holes;

[0217] The judgment unit is used to judge the first... Does the center radius of the outer ring cooling hole of each conductive ring meet the set calculation error requirements?

[0218] The distribution optimization determination unit is used to keep the fixed value unchanged when the output result of the determination unit is yes, and to complete the cooling hole distribution optimization calculation.

[0219] The product adjustment unit is used to adjust the fixed value when the output result of the judgment unit is negative, and to make the radius adjustment unit readjust the center radius of the outer ring cooling hole of each conductive ring based on the new fixed value, so that the product between the resistance of each conductive ring and the flow rate used to cool the resistance is the same in the iterative calculation and the first... m When the center radius of the cooling holes meets the set calculation error requirements, the cooling hole distribution optimization calculation is completed.

[0220] As a further preferred technical solution, the judgment unit is specifically used for:

[0221] Calculate the first The center radius of the outer ring cooling hole of the conductive ring is related to the set first Radius of the center of the cooling hole The absolute value of the difference;

[0222] Determine whether the absolute value is within the calculation error range.

[0223] As a further preferred technical solution, the radius adjustment unit is specifically used to iteratively adjust the center radius of the outer ring cooling hole of the conductive ring using a bisection method until the set calculation error requirement is met.

[0224] As a further preferred technical solution, the product adjustment unit specifically employs a binary search method to adjust the fixed value, specifically including:

[0225] In the The center radius of the outer ring cooling hole of the first conductive ring is smaller than that of the second. Center radius of the cooling hole When this happens, the binary search method is used to continuously decrease the fixed value;

[0226] In the The center radius of the outer ring cooling hole of the first conductive ring is greater than that of the first. Center radius of the cooling hole When this happens, the fixed value is continuously increased using a binary search method.

[0227] It should be noted that other embodiments or specific implementation methods of the bit chip elongated cooling hole distribution calculation system of the present invention can refer to the above-described method embodiments, and will not be repeated here.

[0228] Furthermore, the third embodiment of the present invention also proposes a computer-readable storage medium storing a computer program thereon, wherein when the computer program is executed by a processor, it implements the bit chip oblong cooling hole distribution calculation method as described in the first embodiment above.

[0229] It should be noted that the computer-readable medium disclosed in this embodiment may be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable storage medium may be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, and portable compact disk read-only memory (CD-ROM). ROM, optical storage devices, magnetic storage devices, or any suitable combination thereof. In this disclosure, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in connection with an instruction execution system, apparatus, or device. In this disclosure, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.

[0230] The aforementioned computer-readable medium may be included in the aforementioned electronic device; or it may exist independently and not assembled into the electronic device. The aforementioned computer-readable medium carries one or more programs, which, when executed by the electronic device, cause the electronic device to perform a zero-sample image anomaly detection method according to the above embodiments.

[0231] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server.

[0232] In situations in which the remote computer is connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the computer is connected to the Internet through an Internet Service Provider (ISP), the remote computer can be a server computer, a printer server, or any other network node.

[0233] It should be understood that various parts of the present application can be implemented in hardware, software, firmware or a combination thereof. In the above embodiments, various steps or methods can be implemented in software or firmware which is stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any of the following technologies, known in the art, or their combinations can be used: discrete logic circuitry having logic gates for implementing logic functions upon data signals, application specific integrated circuits having appropriate combinational logic gates, programmable gate arrays (PGA), field programmable gate arrays (FPGA), and the like.

[0234] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the present application. The illustrative appearance of the above terms in various places in the description are not necessarily intended to refer to the same embodiment or example. Moreover, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0235] In addition, the terms "first", "second", etc. are used only to describe various terms and are not used to denote or imply relative importance or a number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of", "several" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0236] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and are not to be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A method for calculating a distribution of long cooling holes in a bit slice, characterized by, include: The basic parameters for calculating the distribution of the elongated oval cooling holes are set. These basic parameters include the geometric parameters and material properties of the coil, as well as the setting parameters for the cooling holes. The resistance of the conductive ring and the flow rate used to cool it are calculated based on basic parameters, including the resistivity of the bit sheet, conductor thickness, number of cooling holes per ring, length of cooling holes per ring, width of cooling holes per ring, and circumferential spacing between adjacent cooling holes on each ring. The flow rate used to cool the resistance of each conductive ring is calculated based on the water flow velocity, hydraulic diameter of the cooling holes, number of cooling holes per ring, length of cooling holes per ring, and width of cooling holes per ring. The width of the cooling holes is pre-calculated based on the hydraulic diameter and length of the cooling holes, and the water flow velocity and hydraulic diameter of each ring of cooling holes are the same. The conductor between two adjacent rings of cooling holes on the bit sheet constitutes one conductive ring. Adjust the position of the center radius of the cooling holes on the outer ring of the conductive ring so that the product between the resistance of each conductive ring and the flow rate used to cool that resistor is the same fixed value.

2. The method of claim 1, wherein, The geometry and material properties of the coil include the resistivity of the bit sheet, the conductor thickness, and the inner and outer radii of the bit sheet; The setting parameters for the oblong cooling holes include the number of rings in which the cooling holes are distributed and the number of cooling holes distributed on each ring, the hydraulic diameter of the cooling holes on each ring, the length of the cooling holes on each ring or the circumferential spacing between adjacent cooling holes on each ring, the center radius of the cooling holes on the first ring, and the center radius of the cooling holes on the last ring.

3. The method for calculating the distribution of oblong cooling holes in a bit chip as described in claim 1, characterized in that, The resistance of the conductive ring is calculated using the following methods: When , the first resistance of the electrically conductive ring band is calculated as follows: When , the first resistance of the first conductive ring belt is calculated as follows: In the formula, For the first The number of cooling holes in the ring, For the first The number of cooling holes in the ring, The number set, The resistivity of the bit chip. For conductor thickness, and The first The length of the cooling hole, the first The length of the cooling hole and The first Width of the cooling hole, the first The width of the cooling holes. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The center radius of the cooling hole For the first The center radius of the cooling hole The total number of cooling hole loops on the bit chip is [value], and the total number of conductive rings is [value]. .

4. The method of claim 1, wherein, The resistance of the conductive ring is calculated using the following methods: When , the first conductive ring belt resistance calculation formula: when , At that time, the first The resistance of each conductive ring The calculation formula is: In the formula, For the first The number of cooling holes in the ring, For the first The number of cooling holes in the ring, The resistivity of the bit chip. For conductor thickness, and The first The length of the cooling hole, the first The length of the cooling hole and The first Width of the cooling hole, the first The width of the cooling holes. For the first The circumferential spacing between adjacent cooling holes on the ring. For the first The ring spacing between adjacent cooling holes on the ring. For the first The center radius of the cooling hole For the first The center radius of the cooling hole The total number of cooling hole loops on the bit chip is [value], and the total number of conductive rings is [value]. .

5. The method of claim 1, wherein, The formula for calculating the flow rate used to cool the resistor is: wherein Q is the flow rate of the coolant for cooling the first electrically conductive toroidal band, V is the flow velocity of the water through each cooling hole, D is the hydraulic diameter of each cooling hole, N is the number of cooling holes in the first toroidal band, N is the number of cooling holes in the first toroidal band, N is the number of cooling holes provided, L is the length of the first cooling hole, L is the length of the first cooling hole, W is the width of the first cooling hole, W is the width of the first cooling hole, C is the circumference of the first cooling hole, C is the circumference of the first cooling hole.​​ 6. The method of calculating the distribution of bit slice length round cooling holes according to any one of claims 1-5, wherein, The formula for calculating the width of the cooling hole is: wherein is the first width of the cooling hole of the first is the hydraulic diameter of the cooling hole, is the first length of the cooling hole of the first 7. The method of calculating bit slice length cooling hole distribution of claim 1, wherein, The adjustment of the position of the center radius of the cooling holes on the outer ring of the conductive ring, so that the product between the resistance of each conductive ring and the flow rate used to cool that resistance is the same fixed value, includes: For the The first conductive ring continuously adjusts the center radius of its outer cooling holes to make the first... The product of the resistance of each conductive ring and the flow rate used to cool that resistor is the fixed value. and It is an integer. The total number of cooling hole rings on the bit chip, the th The outer ring cooling hole of the conductive ring is the first Cooling holes; determining whether the outer cooling hole center radius of the first conductive ring satisfies the set calculation error requirement; determining whether the outer cooling hole center radius of the first conductive ring satisfies the set calculation error requirement; If so, keep the fixed value unchanged and complete the cooling hole distribution optimization calculation; If not, the fixed value is adjusted, and the center radius of the outer ring cooling hole of each conductive ring belt is re-adjusted based on the new fixed value, and the iteration calculation is performed until the product of the resistance of each conductive ring belt and the flow rate for cooling the resistance is the same, and the center radius of the outer ring cooling hole of each conductive ring belt satisfies the set calculation error requirement. When the center radius of the outer ring cooling hole satisfies the set calculation error requirement, the cooling hole distribution optimization calculation is completed.

8. The method of calculating bit slice length cooling hole distribution of claim 7, wherein, The judgment of the first Does the center radius of the outer ring cooling hole of each conductive ring meet the set calculation error requirements, including: calculating the absolute value of the difference between the center radius of the outer race cooling hole of the first conductive ring belt and the set first race cooling hole center radius ​​​ Determine whether the absolute value is within the calculation error range.

9. The method for calculating the distribution of oblong cooling holes in a bit chip as described in claim 7, characterized in that, The center radius of the outer ring cooling holes of the conductive ring is iteratively approximated using the bisection method until the set calculation error requirement is met.

10. The method for calculating the distribution of oblong cooling holes in a bit chip as described in claim 8, characterized in that, The fixed value is continuously adjusted using a binary search method, including: In the The center radius of the outer ring cooling hole of the first conductive ring is smaller than that of the second. Center radius of the cooling hole When this happens, the binary search method is used to continuously decrease the fixed value; When the center radius of the cooling hole of the outer ring of the first conductive ring belt is greater than the center radius of the cooling hole of the second conductive ring belt , the fixed value is increased by bisection. When the center radius of the cooling hole of the outer ring of the first conductive ring belt is greater than the center radius of the cooling hole of the second conductive ring belt , the fixed value is increased by bisection.

11. A bit slice long round cooling hole distribution computing system, comprising: include: The parameter setting module is used to set the basic parameters for calculating the distribution of the elongated oval cooling holes. The basic parameters include the geometric parameters and material properties of the coil, as well as the setting parameters for the cooling holes. The computing module is configured to calculate the resistance of each conductive ring belt based on the specific resistance of the bit slice, the conductor thickness, the number of cooling holes per circle, the length of cooling holes per circle, the width of cooling holes per circle, and the circumferential spacing between adjacent cooling holes per circle, and to calculate the flow rate for cooling the resistance of each conductive ring belt based on the water flow velocity of the cooling holes, the hydraulic diameter of the cooling holes, the number of cooling holes per circle, the length of cooling holes per circle, and the width of cooling holes per circle. The width of the cooling holes is calculated in advance based on the hydraulic diameter of the cooling holes and the length of the cooling holes, and the water flow velocity of each circle of cooling holes is the same, the hydraulic diameter of each circle of cooling holes is the same, and the conductor between two adjacent circles of cooling holes of the bit slice is one conductive ring belt. The adjusting module is configured to adjust the position of the center radius of the outer circle of cooling holes of each conductive ring belt so that the product of the resistance of each conductive ring belt and the flow rate for cooling the resistance is a same fixed value.

12. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program, when executed by a processor, implements the bit slice long circle cooling hole distribution calculation method of any one of claims 1-10.

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