Chip die bonding device and chip die bonding system

Abstract

The application relates to a chip die bonding device and a chip die bonding system, which comprise a bearing table, a needle cap assembly arranged on one side of the bearing table along a first direction, the needle cap assembly comprising a needle cap and a needle, the needle cap being provided with a cavity and an opening communicating with the cavity on an end face facing the bearing table, a light-transmitting part being arranged on a side wall of the needle cap close to the end of the bearing table, a light source assembly being configured to emit light to the needle cap, the light passing through the light-transmitting part and irradiating the opening, the light having an included angle with the first direction, and a vision assembly arranged on the same side of the bearing table as the needle cap assembly, the vision assembly being configured to collect image information reflected from the opening. According to the position design of the light source assembly and the vision assembly, the real-time relative position between the needle and the current chip to be fixed can be directly obtained before the die bonding operation, the center of the chip is beneficial to being adjusted to be aligned with the needle and the pad on the transfer substrate, and therefore the positioning precision of the die bonding is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip transfer, in particular to a chip die bonding device and a chip die bonding system. BACKGROUND

[0002] The semiconductor packaging process is a key process in the later stage of integrated circuit manufacturing. The die bonding (or patching) process is a core step of picking up a chip from a wafer and accurately mounting it on a specified pad of a substrate. The precision and efficiency of the die bonding process directly affect the performance and yield of the final packaged device. With the development of new display technologies such as Mini / Micro LED, the requirement for die bonding precision is increasing, and the miniaturization of chip size poses a severe challenge to the positioning and compensation capabilities of die bonding equipment.

[0003] In related die bonding technologies, especially in die bonding schemes based on the needle piercing method, the basic process is as follows: a die bonding probe (needle) pierces the back of a wafer film (such as a blue film or a UV film), causing the chip on the front of the film to be separated under pressure and bonded to the pads of a substrate coated with a medium (such as solder paste or conductive adhesive).

[0004] Related technologies usually perform a one-time global scan of the chip positions on the entire wafer film before die bonding to plan the die bonding path. However, during the die bonding process, the wafer film may deform due to stretching, temperature changes, or stress release, causing the actual position of the chip to deviate from the pre-scanned position information, thereby affecting the die bonding precision. SUMMARY

[0005] Therefore, it is necessary to provide a chip die bonding device and a chip die bonding system to solve the problem that the actual position of the chip deviates from the pre-scanned position information due to deformation of the wafer film caused by stretching, temperature changes, or stress release during the die bonding process.

[0006] In a first aspect, an embodiment of the present application provides a chip die bonding device, which comprises:

[0007] A carrying table for carrying a transfer substrate;

[0008] A needle cap assembly arranged on one side of the carrying table along a first direction, the needle cap assembly comprising a needle cap and a needle, the needle cap having a cavity and an end face facing the carrying table being configured with an opening communicating with the cavity; at least part of the needle is arranged in the cavity and can pass through the opening and be arranged outside the needle cap; the needle cap is provided with a light-transmitting portion on the side wall near the end of the carrying table;

[0009] A light source assembly is disposed on the same side of the carrier platform as the needle cap assembly, and is configured to emit light to the needle cap, the light passing through the light-transmitting portion and irradiating the opening; the light has an included angle with the first direction;

[0010] A vision assembly is disposed on the same side of the carrier platform as the needle cap assembly, and is configured to collect image information of the opening.

[0011] In one of the embodiments, the light-transmitting portion is a notch formed in the side wall of the needle cap, and the notch is in communication with the cavity.

[0012] In one of the embodiments, the light source assembly and the vision assembly are respectively disposed on opposite sides of the needle cap.

[0013] The needle cap is provided with at least two notches in the circumferential direction, one of the at least two notches is used for the light emitted by the light source assembly to pass through and irradiate the opening; the other of the at least two notches is used for the vision assembly to collect the image information, the image information at least including a projection of the opening and a projection of the needle tip;

[0014] A transfer film is arranged between the carrier platform and the needle cap, when the transfer film is tightly attached to the end face of the needle cap, the vision assembly is used to collect the projection of the opening and the projection of the needle tip projected on the transfer film; the transfer film is provided with a plurality of chips on the side facing the carrier platform.

[0015] In one of the embodiments, the light-transmitting portion further includes a transparent plate arranged at the notch.

[0016] In one of the embodiments, the light source assembly includes a first adjusting member and a light source member, the light source member is arranged in the first adjusting member, and the light source member includes one of an infrared light source, an ultraviolet light source, a point light source and a coaxial light source.

[0017] The included angle between the light emitted by the light source member and the first direction is 15°-75°.

[0018] In one of the embodiments, the vision assembly includes a second adjusting member and a camera, the camera is arranged in the second adjusting member, and the line connecting the lens of the camera and the notch has an included angle of 15°-75° with the first direction.

[0019] In one of the embodiments, the end face of the needle cap facing the carrier platform has a plurality of through holes, the cavity of the needle cap is configured with a negative pressure chamber in communication with the plurality of through holes, and the plurality of through holes are configured to adsorb a transfer film.

[0020] The plurality of through holes are arranged around the opening and are not in communication with the opening.

[0021] In one of the embodiments, the die bonding apparatus further comprises a ring-shaped light source, which is sleeved outside the needle cap and coaxially arranged with the needle cap; the ring-shaped light source is used for supplementing light to the transfer substrate.

[0022] In addition, the needle cap assembly further comprises a lifting mechanism, the needle is arranged on the lifting mechanism, and the lifting mechanism drives the needle to reciprocate relative to the needle cap along the first direction.

[0023] In one of the embodiments, the carrier table has a carrier surface which is shaped to match the transfer substrate, and the carrier surface is configured with a plurality of suction holes for fixing the transfer substrate.

[0024] The carrier surface is a plane, and the carrier table is translated relative to the needle cap assembly along a direction perpendicular to the first direction.

[0025] Alternatively, the carrier surface is a curved surface, and the carrier table is rotated relative to the needle cap assembly.

[0026] In a second aspect, the embodiments of the present application first provide a die bonding system, which comprises the die bonding apparatus of the first aspect; and

[0027] The processing unit is in communication connection with the vision assembly and the needle cap assembly.

[0028] The die bonding apparatus and the die bonding system described above have the following advantages: the light source assembly and the vision assembly are arranged on the same side of the carrier table, and the light-transmitting part is arranged on the side wall of the needle cap near the end of the carrier table, so that the light emitted by the light source assembly can irradiate the opening of the needle cap through the light-transmitting part, and the vision assembly can also collect the image information of the opening, thereby establishing the correlation between the image information and the position of the needle, and obtaining the real-time relative position of the needle and the current chip to be fixed before the die bonding operation, which is beneficial to adjusting the center of the chip to align with the needle and the pad on the transfer substrate, thereby improving the positioning accuracy of the die bonding. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 Part of the structure schematic diagram of the die bonding apparatus provided according to some embodiments of the present application.

[0030] Figure 2 The cross-sectional structure schematic diagram of a die bonding apparatus provided according to some embodiments of the present application.

[0031] Figure 3 The image schematic diagram collected by the vision assembly according to some embodiments of the present application.

[0032] Figure 4 Part structure schematic diagram of a chip die bonding device (without ring light source) according to some embodiments of the present application.

[0033] Figure 5 Structure schematic diagram of a needle cap assembly according to some embodiments of the present application.

[0034] Figure 6 End structure schematic diagram of a needle cap assembly according to some embodiments of the present application.

[0035] Figure 7 Section structure schematic diagram of a needle cap assembly according to some embodiments of the present application.

[0036] Figure 8 Process flow schematic diagram of a chip die bonding process according to some embodiments of the present application.

[0037] Figure 9 Section structure schematic diagram of another chip die bonding device according to some embodiments of the present application.

[0038] Reference signs:

[0039] 100, bearing table;

[0040] 200, needle cap assembly; 210, needle cap; 211, light-transmitting part; 212, opening; 213, through hole; 220, needle;

[0041] 300, light source assembly;

[0042] 400, visual assembly;

[0043] 500, transfer substrate; 510, pad;

[0044] 600, transfer film;

[0045] 700, chip;

[0046] 800, ring light source;

[0047] First direction - Z direction. DETAILED DESCRIPTION

[0048] In order to make the above objectives, features and advantages of the present application more apparent and comprehensible, the specific embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0049] In the description of the present application, it is necessary to understand that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0050] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0051] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0052] In the present application, unless otherwise explicitly specified and limited, if the first feature is described as "on" or "under" the second feature and the like, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0053] It is to be noted that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In addition, it is to be understood that when a method is referred to as comprising a step of doing something, it can include an equivalent step of doing the same thing except for possible differences in the quantity or order of doing the same thing. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0054] As the background art, the inventors found that during the die bonding process, the wafer film will be deformed (also known as film deformation) due to stretching, temperature change or stress release, etc., which will cause the actual position of the chip to deviate from the pre-scanned position information. Moreover, there is currently a lack of real-time detection and compensation of the chip position during the execution of the die bonding action, which makes it difficult for the die bonding bumps to accurately align with the target chip and the substrate pads, thereby affecting the die bonding precision. In other words, due to the inability to timely discover and handle defects such as missing die bonding and misalignment, it is necessary to rely on subsequent detection processes for screening, thereby increasing the cost and risk of subsequent repair.

[0055] Based on the above-mentioned problems, the embodiments of the present application provide a chip die bonding device, by setting the light source assembly and the vision assembly on the same side of the bearing table, and setting a light-transmitting part on the side wall of the needle cap close to one end of the bearing table, so that the light emitted by the light source assembly can be irradiated to the opening of the needle cap through the light-transmitting part, and at the same time, the vision assembly can collect image information at the opening, thereby constructing the correlation between the image information and the position of the needle, and directly obtaining the real-time relative position of the needle and the current chip to be fixed before the die bonding action, which is beneficial to adjusting the center of the chip to align with the needle and the pad on the transfer substrate, thereby improving the positioning precision of die bonding.

[0056] Referring to Figure 1 and Figure 2 , Figure 1 Figure 1 is a partial structural schematic diagram of a chip die bonding device provided according to some embodiments of the present application. Figure 2 Figure 2 is a cross-sectional structural schematic diagram of a chip die bonding device provided according to some embodiments of the present application. The chip 700 die bonding device provided by an embodiment of the present application can include a bearing table 100, a needle cap assembly 200, a light source assembly 300 and a vision assembly 400.

[0057] The carrier table 100 is used to carry the transfer substrate 500; the pin cap assembly 200 is arranged on one side of the carrier table 100 along the first direction (Z direction), the pin cap assembly 200 includes a pin cap 210 and a pin 220, the pin cap 210 has a cavity, and the end face of the pin cap 210 facing the carrier table 100 is configured with an opening 212 communicating with the cavity; at least part of the pin 220 is arranged in the cavity and can pass through the opening 212 and be arranged outside the pin cap 210; the pin cap 210 is provided with a light-transmitting part 211 on the side wall near one end of the carrier table 100; the light source assembly 300 is arranged on the same side of the carrier table 100 as the pin cap assembly 200, and the light source assembly 300 is configured to emit light to the pin cap 210, the light passes through the light-transmitting part 211 and irradiates the opening 212; the light has an included angle with the first direction (Z direction); the visual assembly 400 is arranged on the same side of the carrier table 100 as the pin cap assembly 200, and the visual assembly 400 is configured to collect image information at the opening 212.

[0058] It can be understood that the carrier table 100 in the embodiment is mainly used to carry and fix the transfer substrate 500, so as to provide a stable support plane to ensure that the substrate does not shift during die bonding. For example, the carrier table 100 is a suction table, the surface of which can be provided with vacuum holes or vacuum grooves, or can be composed of microporous materials such as microporous ceramics, microporous carbon and microporous nickel, and the substrate can be adsorbed and fixed by applying negative pressure. In the embodiment, the form of the carrier table 100 is not limited to a plane, and can be designed as a roller according to the production process requirements, so as to adapt to the continuous production process of roll-to-roll. The carrier table 100 can be located on a fixed frame of a die bonding device (hereinafter referred to as the device) and arranged opposite to the pin cap assembly 200 along the first direction (Z direction) (usually the vertical direction).

[0059] The pin cap 210 is usually designed as a cylinder, has a cavity in the middle, and has an opening 212 at the lower end face close to the carrier table 100, the opening 212 communicates with the cavity and allows the pin 220 to extend out of the opening 212. At least part of the pin 220 in the embodiment is arranged in the cavity of the pin cap 210 and can reciprocate along the first direction (Z direction) under the driving of a driving mechanism (such as a motor or a pneumatic cylinder), so that the tip of the pin 220 can extend out of the pin cap 210 through the opening 212 to perform a pinching action. The diameter of the tip of the pin 220 can be adjusted according to the size of the chip 700, and the pin cap 210 can cooperate with the negative pressure adsorption function to adsorb the transfer film 600 (wafer film) in advance before pinching, so that the transfer film 600 is taut and flat, which is beneficial to improve the die bonding precision.

[0060] The light-transmitting part 211 can be a hollowed area formed in the side wall, or a side wall made of transparent or high-transmittance material, such as transparent quartz, sapphire or optical-grade glass. It is to be noted that in the present embodiment, the lower end of the entire needle cap 210 can be made of the above-mentioned transparent material, or can be a transparent window embedded in the side wall of the needle cap 210, which is not limited herein.

[0061] The needle cap assembly 200 can be connected to a driving mechanism to move in a plane perpendicular to the first direction (Z direction), which facilitates positioning and adjusting the position relative to the pads 510 on the transfer substrate 500.

[0062] In addition, the light source assembly 300 is arranged obliquely to ensure that the emitted light is not vertically downward, but directly passes through the light-transmitting part 211 to illuminate the area at the opening 212 of the needle cap 210, especially the tip of the needle 220 and the transfer film 600 attracted by the needle cap 210. The specific type of the light source assembly 300 can be adapted according to the characteristics of the chip 700 and the transfer film 600, and can be selected from, but not limited to, infrared light source, ultraviolet light source, point light source, coaxial light source or part of ring light source. In addition, the light source assembly 300 is usually equipped with an adjusting mechanism, which can be adjusted up and down, left and right, and angle, to optimize the lighting effect.

[0063] The vision assembly 400 is arranged on the same side as the needle cap assembly 200, and is arranged on the left and right sides of the needle cap 210 with the above-mentioned light source assembly 300. For example, the vision assembly 400 is a CCD camera or a CMOS camera, and is equipped with a corresponding optical lens. The vision assembly 400 can collect image information reflected from the opening 212 of the needle cap 210. The image information in the present embodiment can include the contour information of the plurality of chips 700 on the transfer film 600, the projection information of the opening 212 and the needle tip projection information of the needle 220.

[0064] Specifically, the optical axis of the vision assembly 400 cooperates with the illumination light path, that is, through the light-transmitting part 211 of the needle cap 210, the light reflected from the illuminated opening 212 area, the needle tip 220, the transfer film 600 close to the opening 212 and the chip 700 on the transfer film 600 is received, so as to capture a clear image. Of course, the vision assembly 400 can also be installed on a micro-adjustable mechanism to realize focusing and field of view adjustment. The image information collected by the vision assembly 400 in the present embodiment can be transmitted to a processing unit for processing.

[0065] The specific operating principle of this device is as follows: Before die bonding begins, visual calibration is performed. The ejector cap 210 is moved to a calibration position. During this process, the tip of the ejector pin 220 can be controlled to move to a position flush with the lower end face of the ejector cap 210, that is, precisely abutting against the transfer film 600. The vision component 400 acquires an image through the light-transmitting part 211, establishes the image position of the tip of the ejector pin 220 in the image, and uses the position of the tip as a reference point M to facilitate the establishment of the correlation between the field of view area and the ejector pin 220. This reference point M can serve as the reference origin for all subsequent position calculations.

[0066] Subsequently, the ejector cap assembly 200, carrying the ejector pin 220, moves to the theoretical position above the next die-bonded chip 700. The ejector cap 210 moves down to press against the transfer film 600 and applies negative pressure to adsorb the transfer film 600, causing the transfer film 600 to be locally taut and fixed. At the same time, the light source assembly 300 emits light and illuminates the opening 212 area, and the vision assembly 400 simultaneously acquires an image, which includes the shadow or outline of the tip of the ejector pin 220; and the outline and position of the current die-bonded chip 700 on the adsorbed transfer film 600; as well as the outline and position of several adjacent die-bonded chips 700.

[0067] The processing unit processes the received image information, identifies the actual center position of the chip 700 to be bonded, compares this actual center position with the reference point M in the image (the position associated with the tip of the aforementioned ejector pin 220), calculates the positional deviation, and compares this deviation with a preset threshold. If the deviation is within the threshold, the ejector pin 220 will directly perform a downward insertion action to complete the die bonding. If the deviation exceeds the threshold, the processing unit generates a compensation command, driving the mechanism containing the transfer film 600 to move by a corresponding compensation amount in a plane perpendicular to the first direction (Z direction), so that the needle tip is precisely aligned with the center of the chip 700, and then the downward insertion action is performed.

[0068] Of course, in the same image, the actual position of a chip 700 to be bonded can be identified and recorded, and updated into the system's bonding path planning for the next movement and positioning, thereby compensating for the systemic position shift caused by film variation.

[0069] It should be noted that the image information acquired by the vision component 400 can also monitor the status of the ejector pin 220 in real time (such as wear or breakage). If the image of the tip of the ejector pin 220 shows abnormalities (such as disappearance or drastic changes in shape), the system can immediately alarm and stop the machine to avoid batch quality accidents. At the same time, it can also observe the situation at the moment of die bonding, providing a direct basis for process optimization.

[0070] In summary, the die bonding device of the chip 700 provided by the embodiments of the present application sets the light source assembly 300 and the vision assembly 400 on the same side of the bearing table 100, and sets the light-transmitting part 211 on the side wall of the needle cap 210 close to one end of the bearing table 100, so that the light emitted by the light source assembly 300 can irradiate the opening 212 of the needle cap 210 through the light-transmitting part 211, and the vision assembly 400 can also collect the image information at the opening 212, thereby obtaining the real-time relative position between the needle 220 and the chip 700 to be fixed currently before the die bonding operation by constructing the position association relationship between the image information and the needle 220, which is beneficial to adjusting the alignment between the center of the chip 700, the needle 220 and the pad 510 on the transfer substrate 500, thereby improving the positioning accuracy of die bonding.

[0071] In the following, the embodiments of the present application will be described in detail with reference to the accompanying drawings. Figure 1 -FIG. 1 is a structural schematic diagram of a die bonding device of a chip 700 provided by some embodiments of the present application. Figure 9 The specific structure of the die bonding device of the chip 700 provided by the embodiments of the present application will be described in detail.

[0072] As shown in FIG. 1, the die bonding device of the chip 700 provided by some embodiments of the present application comprises a bearing table 100, a needle cap 210, a light source assembly 300, a vision assembly 400 and a transfer substrate 500. Figure 5 and Figure 6 As shown in FIG. 2, the needle cap 210 is arranged on the bearing table 100, and the needle 220 is arranged in the cavity of the needle cap 210. Figure 5 As shown in FIG. 3, the light source assembly 300 is arranged on the bearing table 100, and the light-transmitting part 211 is arranged on the side wall of the needle cap 210 close to one end of the bearing table 100. Figure 6 As shown in FIG. 4, the vision assembly 400 is arranged on the bearing table 100.

[0073] It can be understood that the hollowed-out area can be formed directly on the side wall of the needle cap 210 by turning or etching, so that the cavity of the needle cap 210 is in communication with the external environment. Then, the light emitted by the light source assembly 300 can directly irradiate the opening 212 through the gap without penetrating the solid material, especially irradiate the transfer film 600 at the opening 212. Similarly, the vision assembly 400 can also collect the image at the opening 212 area through the above-mentioned gap without obstacles.

[0074] It should be noted that the transfer film 600 in the present embodiment is a wafer film, which can be a blue film or a UV film, which is not limited here.

[0075] The present embodiment designs the light-transmitting part 211 as a gap, which eliminates the step of installing a transparent optical element, and also simplifies the manufacturing process of the needle cap 210 and reduces the production cost. In addition, since the light directly passes through, the refraction, scattering or light energy loss caused by passing through the transparent material is avoided, which helps to obtain higher contrast and clearer images, thereby improving the recognition accuracy and reliability of the vision system.

[0076] As shown in FIG. 1, the die bonding device of the chip 700 provided by some embodiments of the present application comprises a bearing table 100, a needle cap 210, a light source assembly 300, a vision assembly 400 and a transfer substrate 500. Figure 4 As shown in FIG. 2, the needle cap 210 is arranged on the bearing table 100, and the needle 220 is arranged in the cavity of the needle cap 210. Figure 4FIG. 1 shows a schematic diagram of a part of a chip die bonding device (without ring light source) according to some embodiments of the present application. In some embodiments, the light source assembly 300 and the vision assembly 400 are arranged on opposite sides of the needle cap 210; the needle cap 210 is provided with at least two notches around the circumference, one of the notches is used for the light emitted by the light source assembly 300 to pass through and irradiate to the opening 212, and the other notch is used for the vision assembly 400 to collect image information, which at least includes the projection of the opening 212 and the projection of the needle tip of the needle 220; the transfer film 600 is arranged between the carrier 100 and the needle cap 210, when the transfer film 600 is tightly attached to the end face of the needle cap 210, the vision assembly 400 is used to collect the projection of the opening 212 and the projection of the needle tip projected on the transfer film 600; the transfer film 600 is provided with a plurality of chips 700 on the side facing the carrier 100.

[0077] Specifically, the needle cap 210 is provided with at least two notches around the circumference, one of the notches is used as an illumination channel for the light emitted by the light source assembly 300 to pass through and irradiate to the opening 212 area, and the other opposite notch is used as an imaging channel for the vision assembly 400 to collect image information. When the transfer film 600 is adsorbed by the needle cap 210 and tightly attached to the end face thereof, the image information collected by the vision assembly 400, i.e. the image information is the light shadow diagram projected on the transfer film 600, which at least includes the projection of the opening 212 and the projection of the needle tip of the needle 220, as shown in FIG. 2. Figure 3 At this time, the profiles of the plurality of chips 700 carried on the side of the transfer film 600 facing the carrier 100 are also imaged.

[0078] The present embodiment adopts a side light side view arrangement on opposite sides, which constitutes a bright field or dark field illumination environment, can most effectively highlight the tip of the needle 220 and the edge features of the chip 700, and avoids the mirror reflection interference that may be caused by the same side arrangement.

[0079] In some embodiments, the light-transmitting portion 211 further comprises a transparent plate arranged at the notch. Specifically, in order to balance the direct light transmission and structural integrity, a transparent plate is additionally arranged at the notch. Exemplarily, the transparent plate is made of transparent quartz, sapphire or optical grade glass, etc. and is fixed on the notch by sealing method (such as adhesive or compression), which seals the notch. The arrangement of the transparent plate can effectively isolate dust, flux volatiles and other pollutants from entering the cavity of the needle cap 210, so as to avoid its adhesion on the needle 220 or pollution of the optical path. In addition, when the cavity of the needle cap 210 needs to be used as a negative pressure chamber to adsorb the transfer film 600, the presence of the transparent plate is beneficial to form an adsorption channel.

[0080] As shown in FIG. 3, Figure 1 and Figure 2As shown, in some embodiments, the light source assembly 300 comprises a first adjusting member and a light source member, the light source member is disposed on the first adjusting member, and the light source member comprises one of an infrared light source, an ultraviolet light source, a point light source, and a coaxial light source; the angle between the light emitted by the light source member and the first direction (Z direction) is 15°-75°.

[0081] It can be understood that the light source assembly 300 comprises a first adjusting member (such as a multi-dimensional sliding table, a universal joint, or a spherical hinge) and a light source member mounted thereon, the light source member can be one of an infrared light source, an ultraviolet light source, a point light source, and a coaxial light source, and through the first adjusting member, the spatial position and the irradiation angle of the light source member can be finely adjusted to ensure that the light is incident on the light-transmitting part 211 at an optimal angle of 15°-75°. For example, the angle between the light emitted by the light source member and the first direction (Z direction) is 15°, 20°, 30°, 45°, 55°, 75°, etc.

[0082] As shown in Figure 1 and Figure 2 In some embodiments, the visual assembly 400 comprises a second adjusting member and a camera, the camera is disposed on the second adjusting member, and the angle between the line connecting the lens of the camera and the gap and the first direction (Z direction) is 15°-75°.

[0083] Similar to the setting mode of the light source assembly 300 described above, through the second adjusting member, the position and angle of the camera can be adjusted so that the angle between the line connecting the lens of the camera and the gap and the first direction (Z direction) is also within the preferred range of 15°-75°, so as to obtain an undistorted and in-focus image. For example, the angle between the line connecting the lens of the camera and the gap and the first direction (Z direction) is 15°, 20°, 30°, 45°, 55°, 75°, etc.

[0084] The design of the first adjusting member and the second adjusting member in the light source assembly 300 and the visual assembly 400 described above allows fine adjustment of the light path on site according to the actual size of the chip 700 and the characteristics of the film material, ensures uniform illumination and imaging field coverage of the key area, and greatly improves the adaptability and imaging quality of the device.

[0085] As shown in Figure 6 and Figure 7 As shown, Figure 7 is a cross-sectional structure schematic diagram of a needle cap assembly according to some embodiments of the present application. In some embodiments, the end surface of the needle cap 210 facing the bearing table 100 has a plurality of through holes 213, the cavity of the needle cap 210 is configured with a negative pressure chamber communicating with the plurality of through holes 213, and the plurality of through holes 213 are configured to adsorb the transfer film 600; the plurality of through holes 213 are arranged around the opening 212 and do not communicate with the opening 212.

[0086] It can be understood that the negative pressure chamber is in communication with the external vacuum system, and when the external vacuum system works, the negative pressure is transmitted to all the through holes 213 through the chamber, so as to collectively adsorb the transfer film 600. It should be noted that the through holes 213 for adsorption are arranged around the central opening 212 and are not in communication with the central opening 212 in which the thimble 220 moves, so as to avoid leakage of negative pressure gas from the opening 212.

[0087] In the embodiment, by adopting the porous ring layout, uniform and stable adsorption force can be applied to the transfer film 600, so that the film surface of the transfer film 600 is effectively ensured to be tightly flat before being pricked, and the die bonding reliability is improved.

[0088] As shown in FIGS. 1 and 2, in some embodiments, the chip 700 die bonding device further comprises a thimble cap assembly 200, the thimble cap assembly 200 is arranged on the chip 700, and the thimble cap assembly 200 is coaxially arranged on the chip 700. Figure 1 and Figure 2 As shown in FIGS. 1 and 2, in some embodiments, the chip 700 die bonding device further comprises a thimble cap assembly 200, the thimble cap assembly 200 is arranged on the chip 700, and the thimble cap assembly 200 is coaxially arranged on the chip 700.

[0089] Specifically, the illumination direction of the ring light source 800 in the embodiment mainly faces the transfer film 600 and the transfer substrate 500 side, which can provide bright ambient light, so as to clearly illuminate the patterns such as the chip 700 and the pad 510, and facilitate the positioning work of other vision systems before die bonding.

[0090] In some embodiments, the thimble cap assembly 200 further comprises a lifting mechanism, the thimble 220 is arranged on the lifting mechanism, and the lifting mechanism drives the thimble 220 to reciprocate relative to the thimble cap 210 along the first direction (Z direction).

[0091] Specifically, the lifting mechanism can be a micro motor driven lead screw sliding table or a pneumatic cylinder, which can be fixedly installed on the base body of the thimble cap assembly 200, and the thimble 220 is installed on the output end of the lifting mechanism, so as to independently drive the thimble 220 to accurately reciprocate relative to the thimble cap 210 along the first direction (Z direction) through the lifting mechanism. This kind of setting can ensure the controllable speed and stroke of the thimble 220 to perform the pricking and retraction actions.

[0092] In some embodiments, the carrier table 100 has a carrier surface which is adapted to the shape of the transfer substrate 500, and the carrier surface is configured with a plurality of adsorption holes for fixing the transfer substrate 500; the carrier surface is a plane, and the carrier table 100 translates relative to the thimble cap assembly 200 along a direction perpendicular to the first direction (Z direction).

[0093] Specifically, as shown in FIGS. 1 and 2, in some embodiments, the carrier table 100 is arranged on the chip 700, and the carrier table 100 is coaxially arranged on the chip 700. Figure 2As shown, the carrier table 100 can be configured as a plate with a flat carrier surface, on which a plurality of suction holes can be distributed for fixing the substrate. In this state, the carrier table 100 can perform translational motion in a plane perpendicular to the first direction (Z direction) relative to the transfer film 600 to realize movement between different die bonding points. The flat carrier table 100 in the present example can be suitable for die bonding of rigid substrates such as PCBs and glass plates.

[0094] In addition to the above design, it can also be that, as shown, Figure 9 As shown, Figure 9 Another cross-sectional structure schematic diagram of a chip die bonding device according to some embodiments of the present application is shown. In one example, the carrier surface is a curved surface, and the carrier table 100 rotates relative to the needle cap assembly 200.

[0095] Specifically, the carrier table 100 can be a roller structure, and the carrier surface corresponds to a curved surface. During the die bonding process, the position of the needle cap assembly 200 is relatively fixed, and different pads 510 on the substrate are sequentially sent to the die bonding station by rotating the carrier table 100. The roller type carrier table 100 in the present example can be suitable for continuous production processes such as roll-to-roll, and can efficiently die bond flexible film substrates, greatly improving the efficiency of large-scale production.

[0096] Based on the same application concept, the embodiments of the present application also provide a chip 700 die bonding system, which can include the chip 700 die bonding device in the above embodiments and a processing unit, which is in communication connection with the vision assembly 400 and the needle cap assembly 200.

[0097] It can be understood that the processing unit is usually realized by an industrial computer, a programmable logic controller (PLC) or an embedded system with a special processing algorithm, and can be in communication connection with the vision assembly 400 and the needle cap assembly 200 through wired or wireless communication, specifically, in communication connection with the mechanism for moving the needle cap 210 and the needle 220, so as to receive the raw image data collected by the vision assembly 400; and send control instructions to drive the needle cap assembly 200 to move, adsorb and perform the needle piercing action.

[0098] More specifically, as shown, Figure 8 In the initial stage, the processing unit can control the needle cap assembly 200 to move to a calibration position and instruct the vision assembly 400 to collect images. Through image processing algorithms such as edge extraction and center fitting, the projection position of the tip of the needle 220 in the image is accurately identified, and this position is set as a reference point M in the machine vision coordinate system. The reference point M establishes a mapping relationship with the actual physical center position of the needle 220 and can be used as the root of all subsequent real-time calculations.

[0099] Subsequently, before each die bonding operation, the processing unit triggers the vision component 400 to capture an image of the current field of view, which is transmitted to the processing unit via the communication link. The processing unit runs a vision algorithm to analyze the image in real time. This includes calculating the actual center coordinates of the current die 700 to be bonded; the current coordinates of the reference point M (the tip of the probe 220) in the image; and the processing unit calculates the positional deviation between the actual center of the die 700 and the reference point M. Then, the deviation is compared with the preset accuracy threshold.

[0100] If the deviation is within the threshold, the processing unit directly issues an instruction to the drive mechanism of the probe cap assembly 200 to drive the probe 220 to perform the stabbing operation to complete the die bonding.

[0101] If the deviation exceeds the threshold, the processing unit immediately generates a position compensation instruction, which includes the compensation amount that needs to be moved. The instruction is sent to the mechanism that controls the transfer film 600 to move to eliminate the deviation. After the compensation is completed, the probe 220 is instructed to stab.

[0102] It should be noted that while the processing unit is analyzing the same image, it also identifies and records the actual position of the next die 700 to be bonded. The processing unit can use this new actual position to dynamically update its internal die bonding path planning table. In other words, the system is already preparing for the accurate positioning of the n+1 die 700 when it is bonding the nth die 700, effectively compensating for the cumulative error caused by film variation and avoiding the inefficient operation of pausing and rescanning the entire wafer in traditional methods.

[0103] In addition, the processing unit can also continuously monitor the projection shape of the tip of the probe 220 in the image, and through preset template comparison or morphological analysis, it can determine whether the probe 220 has abnormal wear, bending or breakage. Once an abnormality is detected, the processing unit can immediately issue an alarm signal and stop the system from running to prevent the production of a large number of defective products.

[0104] In addition, the processing unit can also communicate with the upper management system, read the wafer two-dimensional code information, and integrate the upstream chip 700 sorting data, so that when executing the die bonding path planning, it can intelligently skip the chips 700 marked as NG (such as broken or scratched) to achieve selective die bonding and further improve the overall yield.

[0105] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0106] The above embodiments only express several implementation ways of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A chip die bonding device, characterized in that, The chip bonding device includes: A support stage (100) is used to support a transfer substrate (500). A pin cap assembly (200) is disposed on one side of the support platform (100) along a first direction. The pin cap assembly (200) includes a pin cap (210) and a pin (220). The pin cap (210) has a cavity and an opening (212) communicating with the cavity is formed on the end face facing the support platform (100). At least a portion of the pin (220) is disposed in the cavity and can pass through the opening (212) and is located outside the pin cap (210). The pin cap (210) has a light-transmitting portion (211) on the side wall near the end of the support platform (100). A light source assembly (300) and the pin cap assembly (200) are located on the same side of the support platform (100). The light source assembly (300) is configured to emit light towards the pin cap (210), the light passing through the light-transmitting part (211) and illuminating the opening (212); the light has an angle with the first direction. A vision component (400) is located on the same side of the support platform (100) as the pin cap assembly (200), and the vision component (400) is configured to acquire image information at the opening (212).

2. The chip bonding apparatus according to claim 1, characterized in that, The light-transmitting part (211) is a notch formed on the side wall of the pin cap (210), and the notch communicates with the cavity.

3. The chip bonding apparatus according to claim 2, characterized in that, The light source assembly (300) and the vision assembly (400) are respectively disposed on opposite sides of the pin cap (210); The thimble cap (210) has at least two notches circumferentially, one of which allows light emitted from the light source assembly (300) to pass through and illuminate the opening (212); the other of the notches is used by the vision assembly (400) to acquire the image information, which includes at least the projection of the opening (212) and the tip projection of the thimble (220). A transfer membrane (600) is disposed between the support platform (100) and the pin cap (210). When the transfer membrane (600) is in close contact with the end face of the pin cap (210), the vision component (400) is used to collect the projection of the opening (212) and the projection of the pin tip projected onto the transfer membrane (600). The transfer membrane (600) has a plurality of chips (700) on the side facing the support platform (100).

4. The chip bonding apparatus according to claim 2, characterized in that, The light-transmitting part (211) also includes a transparent plate disposed at the notch.

5. The chip bonding apparatus according to any one of claims 1-4, characterized in that, The light source assembly (300) includes a first adjustment member and a light source member, wherein the light source member is disposed on the first adjustment member, and the light source member includes one of an infrared light source, an ultraviolet light source, a point light source, and a coaxial light source; The angle between the light emitted by the light source and the first direction is 15°-75°.

6. The chip bonding apparatus according to any one of claims 2-4, characterized in that, The vision component (400) includes a second adjustment member and a camera, the camera being disposed on the second adjustment member, and the line connecting the lens of the camera and the notch forming an angle of 15°-75° with the first direction.

7. The chip bonding apparatus according to claim 6, characterized in that, The end face of the ejector cap (210) facing the support platform (100) has a plurality of through holes (213), and the cavity of the ejector cap (210) has a negative pressure chamber communicating with the plurality of through holes (213), and the plurality of through holes (213) are configured as an adsorption transfer membrane (600). The plurality of through holes (213) are arranged around the opening (212) and are not connected to the opening (212).

8. The die bonding apparatus according to any one of claims 1-4, characterized in that, The chip bonding device further includes an annular light source (800), which is sleeved outside the ejector cap (210) and coaxially arranged with the ejector cap (210); the annular light source (800) is used to provide supplemental lighting to the transfer substrate (500); And / or, the ejector cap assembly (200) further includes a lifting mechanism, on which the ejector pin (220) is disposed, and the lifting mechanism drives the ejector pin (220) to reciprocate relative to the ejector cap (210) in the first direction.

9. The die bonding apparatus according to any one of claims 1-4, characterized in that, The support platform (100) has a support surface adapted to the shape of the transfer substrate (500), and the support surface is constructed with a plurality of adsorption holes for fixing the transfer substrate (500). The bearing surface is a plane, and the bearing platform (100) translates relative to the pin cap assembly (200) in a direction perpendicular to the first direction; Alternatively, the bearing surface is an arc surface, and the bearing platform (100) rotates relative to the pin cap assembly (200).

10. A chip die bonding system, characterized in that, Includes the die bonding apparatus according to any one of claims 1-9; and, The processing unit is communicatively connected to the vision component (400) and the pin cap component (200).

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