Modular heat sink apparatus for integrated circuit package
By using a modular heat sink system, combined with a base heat sink and optional auxiliary equipment, the size and cost issues of heat sink device design for integrated circuit devices in the prior art are solved, achieving efficient heat dissipation and flexibility at different power levels.
Patent Information
- Application Number
- CN202510489307.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-29
- Filing Date
- 2025-04-18
- Publication Date
- 2025-12-02
AI Technical Summary
In the prior art, the design of heat sink devices for integrated circuit devices is usually based on worst-case scenarios, which leads to increased size and cost in lower power modes, and maintaining an inventory of multiple heat dissipation solutions is expensive.
A modular heat sink system is adopted, including a base heat sink and optional auxiliary heat dissipation equipment. The auxiliary heat dissipation equipment is selectively provided according to the power consumption level of the integrated circuit device to achieve a flexible heat dissipation solution.
It achieves efficient heat dissipation at different power levels, reduces costs, and provides customization flexibility for specific scenarios, expanding heat dissipation capacity from 5W to over 70W.
Smart Images
Figure CN121054580A_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to a heat sink device comprising one or more modular components for dissipating heat from integrated circuit (IC) devices (e.g., processors, application-specific integrated circuits (ASICs), and programmable logic devices (PLDs) (e.g., field-programmable gate arrays (FPGAs)). Background Technology
[0002] This section is intended to introduce the reader to various aspects of the prior art that may relate to the aspects of this disclosure (which are described and / or claimed below). It is believed that this discussion will help provide the reader with background information to better understand the aspects of this disclosure. Therefore, it is understood that these statements will be interpreted in this light, rather than as an admission of prior art.
[0003] Integrated circuits are ubiquitous in modern electronics. To support diverse use cases for different customers, integrated circuit manufacturers often produce many versions of similar integrated circuit devices with varying performance and power consumption levels. For example, manufacturers may offer lower-power, lower-performance integrated circuit devices and higher-power, higher-performance integrated circuit devices. Because operating integrated circuit devices generates heat, heat sinks are typically attached to them for heat dissipation. Heat sinks are designed for worst-case scenarios to ensure that the integrated circuit device does not exceed specified temperature limits during operation. In many cases, this means that each version of a similar integrated circuit device may use a larger, more expensive heat sink designed for worst-case scenarios. Summary of the Invention
[0004] According to embodiments of this disclosure, a modular heat sink system is provided, comprising: a base heat sink for attachment to an integrated circuit package die; and an auxiliary heat dissipation device selectively attached to the base heat sink; wherein, when the auxiliary heat dissipation device is not connected to the base heat sink, the base heat sink dissipates a first amount of heat from the integrated circuit package die, and wherein, when the auxiliary heat dissipation device is connected to the base heat sink, the base heat sink and the auxiliary heat dissipation device together dissipate a second amount of heat from the integrated circuit package die, the second amount of heat being greater than the first amount of heat.
[0005] According to embodiments of this disclosure, a method is provided, comprising: providing an integrated circuit package die; providing a base heat sink system for coupling to the integrated circuit package die; and selectively providing or not providing auxiliary heat dissipation devices for coupling to the base heat sink system based on the power consumption level of the integrated circuit package die. Attached Figure Description
[0006] A better understanding of various aspects of this disclosure can be achieved by reading the following detailed description and referring to the accompanying drawings, in which:
[0007] Figure 1 This is a block diagram of a low-power integrated circuit system that uses a modular heat sink with a base heat sink for heat dissipation.
[0008] Figure 2 This is a block diagram of a medium-power integrated circuit system that uses a modular heat sink with a base heat sink and a fan for heat dissipation.
[0009] Figure 3 This is a block diagram of a high-power integrated circuit system that uses a modular heat sink device with a base heat sink, a fan, and an additional heat sink structure for heat dissipation.
[0010] Figure 4 This is a side view of a low-power integrated circuit system with a modular heat sink having a base heat sink for heat dissipation;
[0011] Figure 5 This is an exploded side view of a medium-power integrated circuit system with a modular heat sink, which has a base heat sink and a fan for heat dissipation.
[0012] Figure 6 This is an accessory side view of a medium-power integrated circuit system with a modular heat sink, which has a base heat sink and a fan for heat dissipation.
[0013] Figure 7 This is an exploded side view of a high-power integrated circuit system with a modular heat sink, which has a base heat sink, a fan, and additional heat sink structures for heat dissipation.
[0014] Figure 8 This is an accessory side view of a high-power integrated circuit system with a complete assembly of a modular heat sink device, which has a base heat sink, a fan, and additional heat sink structures for heat dissipation.
[0015] Figure 9 It is a perspective view of a fan with an additional heat sink structure, with the additional heat sink structure shown in close-up view;
[0016] Figure 10 This is a flowchart of a method for manufacturing an integrated circuit system with a modular heat sink based on the power level of the integrated circuit system; and
[0017] Figure 11It is a block diagram of a data processing system that includes an integrated circuit system. Detailed Implementation
[0018] One or more specific embodiments will now be described. To provide a concise description of these embodiments, not all features of the actual implementation are described in the specification. It should be understood that, as in any engineering or design project, the development of any such actual implementation requires numerous implementation-specific decisions to achieve the developer's specific goals, such as adhering to system-related and business-related constraints, which may differ from implementation to implementation. Furthermore, it should be understood that such development work can be complex and time-consuming, but remains a routine task of design, manufacture, and production for those skilled in the art who benefit from this disclosure.
[0019] When describing elements of various embodiments of this disclosure, the terms "a," "an," and "the" are intended to indicate the presence of one or more elements. The terms "comprising," "including," and "having" are intended to be inclusive and mean that additional elements may be present in addition to those listed. Furthermore, it should be understood that references to "an embodiment" or "an embodiment" of this disclosure are not intended to exclude the existence of other embodiments that also include the described features.
[0020] This disclosure relates to a modular heat sink that can be easily expanded to dissipate heat from integrated circuit devices ranging from low to high power. Many types of integrated circuit devices (including processors, memory, network interface devices, and field-programmable gate arrays (FPGAs)) with form factors for server Fast Peripheral Component Interconnect (PCIe) cards have gained significant appeal in the data center and server industries. The wide range of applications and diverse use cases means that many of these products (e.g., FPGA products) come in various performance and power levels. This is especially true for devkit designs where vendors must support a wide range of end-customer use cases. Currently, customers often design their heat sinks based on maximum operating conditions, resulting in increased size and cost when using the same device in lower power modes. Another option is to maintain an inventory of multiple different thermal heat sink solutions, which is also expensive.
[0021] To achieve efficient heat dissipation across a wide range of performance and power levels, low-cost modular heatsink solutions offer customers the flexibility to tailor solutions to specific scenarios. In fact, the low-cost modular heatsink units disclosed herein can be expanded to support component power consumption ranging from a lower range of 5W-10W to a higher range of 50W-70W or more. For products with relatively low power levels, the modular heatsink unit can comprise a simple heatsink or an anodized substrate heatsink with sparsely placed, thicker fins for passive heat dissipation. For products with relatively high power levels, fans and / or additional heatsink structures can be docked to the substrate heatsink to dissipate more heat. Furthermore, the substrate heatsink of the modular heatsink unit disclosed herein can help increase low-end capabilities by 50% or more from the typical 3W-5W range.
[0022] Figure 1 A modular heat sink system 10 is shown for a lower-power integrated circuit package die 12A having a first power level. For example, the lower-power integrated circuit package die 12A can generate less than 8 watts (W) of heat. A base heat sink 14 can be attached to the lower-power integrated circuit package die 12A for passive heat dissipation. The overall height of the base heat sink 14 and the lower-power integrated circuit package die 12A can be less than the height of a server rack unit (1U) (approximately 1.75 inches).
[0023] The base heat sink 14 can serve as a component of a modular heat sink assembly, which, when paired with auxiliary cooling equipment, can be expanded to accommodate the heat dissipation of integrated circuit devices with high power consumption. For example, Figure 2 A modular heat sink system 10 is shown for use with a medium-power integrated circuit package die 12B having a higher second power level. For example, the medium-power integrated circuit package die 12B can generate less than about 20W of power. To dissipate the heat generated by the medium-power integrated circuit package die 12B, a base heat sink 14 can be attached to the medium-power integrated circuit package die 12B. An auxiliary heat dissipation device in the form of a mating assembly and a fan structure 16 can be attached to the base heat sink 14. Air circulating from the mating assembly and fan structure 16 can dissipate heat on the base heat sink 14. The overall height of the base heat sink 14, the mating assembly and fan structure 16, and the medium-power integrated circuit package die 12B can be less than the height of two server rack units (2U) (approximately 3.5 inches).
[0024] Similarly, Figure 3A modular heat sink system 10 is shown for a higher-power integrated circuit package die 12C with a higher third power level. For example, the higher-power integrated circuit package die 12C can generate less than approximately 65W of power. To dissipate the heat generated by the higher-power integrated circuit package die 12C, a base heat sink 14 can be attached to the higher-power integrated circuit package die 12C. Auxiliary heat dissipation devices in the form of mating assemblies, additional heat sink structures, and fan structures 18 can be attached to the base heat sink 14. Air circulating from the mating assemblies, additional heat sink structures, and fan structures 18 can dissipate heat on the base heat sink 14. In general, the height of the base heat sink 14, mating assemblies, additional heat sink structures, fan structures 18, and the higher-power integrated circuit package die 12C can be less than the height of two server rack units (2U) (approximately 3.5 inches).
[0025] Although the integrated circuit package dies 12A, 12B, and 12C are described as having certain power levels, it should be understood that the modular heat sink system 10 may have modular heat sink assemblies that can dissipate more or less heat depending on specific design and implementation (e.g., size, materials). Therefore, in some embodiments based on the modular heat sink system 10 design, the integrated circuit package dies 12A, 12B, and 12C may operate at different power levels than described above.
[0026] Figure 4 A side view of a base heatsink 14 on a low-power integrated circuit package die 12A is shown. The low-power integrated circuit package die 12A is mounted on a printed circuit board 40. A thermal coupling material 42 bonds the low-power integrated circuit package die 12A to the base heatsink 14. The thermal coupling material 42 can be any suitable substance that allows efficient heat transfer from the low-power integrated circuit package die 12A to the base heatsink 14, and can include any suitable thermal interface material (e.g., thermal epoxy, thermal grease, and / or gap filler).
[0027] The base heat sink 14 can take any suitable form and can be made of any suitable thermally conductive material. For example, the base heat sink 14 can be made of anodized aluminum, non-anodized aluminum, copper, steel, or any other suitable material. Fins 44 can further increase the surface area of the base heat sink 14, allowing the base heat sink 14 to passively dissipate heat. The number, thickness, and spacing of the fins 44 can be selected to allow efficient radiative cooling for a desired amount of heat. For example, there may be 6 to 8 fins 44 with a thickness 46 between approximately 0.4 and 2.0 mm and a spacing 48 between 10 and 15 mm. In fact, a relatively high thickness 46 allows the base heat sink 14 to be die-cast or machined at a relatively low cost. To save on manufacturing and material costs, the base heat sink 14 can have fins 44 with a thickness 46 between 0.4 and 0.7 mm. The height 50 of the fins 44 of the base heat sink 14 can be between 7 and 10 mm, and the height 52 of the base of the base heat sink 14 can be between 3 and 5 mm. The total width 54 of the base heat sink 14 can be approximately three to five times the width 56 of the integrated circuit package die to which it is attached. For example, if the width 56 of the lower power integrated circuit package die 12A is 30 mm, the width 54 of the base heat sink 14 can be between approximately 90 and 150 mm. If the width 56 of the lower power integrated circuit package die 12A is 40 mm, the width 54 of the base heat sink 14 can be between approximately 120 and 200 mm. The base heat sink 14 can be manufactured in any suitable manner. For example, the base heat sink can be manufactured using die casting, machining, additive manufacturing, forging, scraping, or stamping and welding.
[0028] Figure 5 An exploded side view of a modular heat sink system 10 with a medium-power integrated circuit package die 12B is shown, the die 12B having a base heat sink 14, a mating assembly, and a fan structure 16. The base heat sink 14 can be configured as described above. Figure 4 To dissipate more power than the base heatsink 14 alone can, the base heatsink 14 may be attached to a mating assembly and fan structure 16. The mating assembly and fan structure 16 includes a mating assembly 60 (e.g., a shroud) and a fan 62. The width 64 of the mating assembly 60 is at least as wide as the width 54 of the base heatsink 14 (e.g., as described above). Figure 4(As shown). In some embodiments, the width 64 of the mating assembly 60 may be sufficiently close to the width 54 of the base heatsink 14 to be attached to the outer fins 44 of the base heatsink 14 by an adhesive (e.g., thermal epoxy, thermal grease). The height 66 of the mating assembly 60 to the fan 62 may be substantially high enough to be equal to or greater than the height 50 of the fins 44 of the base heatsink 14. In one example, the height 66 is approximately 12 mm. The height 68 of the fan 62 may be approximately 12-14 mm. The fan 62 allows the base heatsink 14 to dissipate more heat (e.g., if the base heatsink 14 passively dissipates approximately 8 W of heat, then by actively directing air through the fins 44 of the base heatsink 14 using the fan 62, the base heatsink 14 can dissipate approximately 20 W of heat). Figure 6 A side view of the modular heat sink system 10 is shown, in which the docking assembly and fan structure 16 are fully attached to the base heat sink 14. The total height 70 can be less than or equal to the height of two rack units (2U).
[0029] Figure 7 An exploded side view of a modular heat sink system 10 with a high-power integrated circuit package die 12C is shown, the high-power integrated circuit package die 12C having a base heat sink 14 that docks with a mating assembly, an additional heat sink structure, and a fan structure 18. The base heat sink 14 can be configured as described above. Figure 4 To dissipate more power than that dissipated solely by the base heatsink 14 or by the base heatsink 14 together with the fan 62, an additional heat sink structure 80 capable of dissipating more heat may be present. The mating assembly, additional heat sink structure, and fan structure 18 include the mating assembly 60 (e.g., a shroud), the fan 62, and the additional heat sink structure 80. The width 64 of the mating assembly 60 is at least as wide as the width 54 of the base heatsink 14 (e.g., as described above). Figure 4 (As shown in the reference above). Figure 5 In some embodiments, the width 64 of the mating assembly 60 may be sufficiently close to the width 54 of the base heat sink 14 to be attached to the outer fins 44 of the base heat sink 14 by an adhesive (e.g., thermal epoxy resin, thermal grease). Alternatively, no adhesive may be used between the outer fins 44 and the mating assembly 60.
[0030] The additional heat sink structure 80 may include a base plate 82 attached to a plurality of relatively thin fins 84 (e.g., less than about 0.4 mm thick). The base plate 82 and the thin fins 84 may be made of any suitable thermally conductive material, such as anodized aluminum, non-anodized aluminum, copper, steel, or any other suitable material. To reduce manufacturing costs, in some cases, the base plate 82 and the thin fins 84 may be made of non-anodized aluminum, and the base heat sink 14 may be made of anodized aluminum. The width 86 of the base plate 82 may be smaller than the spacing 48 between the thicker fins 44 of the base heat sink 14. The spacing 88 between the base plates 82 may be at least as wide as the thickness 46 of the fins 44 of the base heat sink 14. The height 90 of the base plate 82 and the thin fins 84 may be at least as large as the height 50 of the fins 44 of the base heat sink 14. A thermal interface material 92 may be used to attach the base plate 82 of the additional heat sink structure 80 to the base heat sink 14.
[0031] The fan 62 and the additional heat sink structure 80 allow the base heat sink 14 to dissipate more heat (e.g., if the base heat sink 14 passively dissipates about 8W of heat, then the fan 62 actively directs air through the thin fins 84 of the additional heat sink structure 80 and the fins 44 of the base heat sink 14, which can dissipate more than 65W of heat). Figure 8 A side view of the modular heat sink system 10 is shown, in which the docking assembly, fan, and additional heat sink structure 18 are fully attached to the base heat sink 14. The total height 70 can be less than or equal to the height of two rack units (2U).
[0032] Figure 9 This is a perspective view of the docking assembly, the additional heat sink structure, and the fan structure 18. (See diagram below.) Figure 9 As shown, the fan 62 can be surrounded and attached to the mating assembly 60. Thin fins 84 can be attached to a base plate 82, which can be spaced apart by a pitch 88. When the mating assembly, the additional heat sink structure, and the fan structure 18 are assembled on top of the base heatsink 14, the base plates 82 rest against the base heatsink 14. Grooves formed between the base plates 82 (e.g., having a pitch 88) facilitate the proper insertion of the extended thick fins 44 of the base heatsink 14. Furthermore, a soft gap pad thermal interface material 92 (e.g., such as...) Figure 7 and Figure 8 (As shown) is placed between the base heat sink 14 and the base plate 82 of the mating assembly, additional heat sink structure and fan structure 18 to promote efficient heat transfer.
[0033] The additional heat sink structure 80 can be fabricated from stacked zipper fins 84, which are welded to the base plate 82 and joined on top to form a single component. The additional heat sink structure 80 can then be assembled onto the mating assembly 60 (e.g., a shroud) and the fan 62 sub-assembly to create an additional solution as a plug-in option for high-end applications.
[0034] Figure 10 The flowchart 100 shown illustrates one method of manufacturing a modular heat sink system 10. The manufacturer can receive customer orders specifying products with particular power levels (block 102). A base heat sink can be attached to an integrated circuit package die 12 (block 104). If the ordered integrated circuit package die is a relatively low-power integrated circuit device, the base heat sink may be sufficient to dissipate the power. Otherwise, auxiliary cooling devices (e.g., fans, additional heat sink structures, and fans) can be attached to the base heat sink (block 106). This allows for scalable and cost-effective power dissipation across a range of products with different power levels.
[0035] The integrated circuit of the modular heat sink system disclosed herein can be a data processing system (e.g., as shown in the original text). Figure 11The data processing system 500 shown includes the following components. The data processing system 500 may include an integrated circuit system 12 (e.g., a programmable logic device, ASIC, processor), a host processor 502, memory and / or storage circuitry 504, or a network interface 506. The modular heat sink system of this disclosure may be part of the following: an integrated circuit system 12 (e.g., a programmable logic device), a host processor 502, memory and / or storage circuitry 504, or a network interface 506, or other integrated circuits such as a graphics processing unit (GPU) or an AI application-specific integrated circuit (ASIC). The data processing system 500 may include more or fewer components (e.g., an electronic display, a user interface structure, an application-specific integrated circuit (ASIC)). The host processor 502 may include any processor capable of managing data processing requests from the data processing system 500 (e.g., performing encryption, decryption, machine learning, video processing, speech recognition, image recognition, data compression, database search ranking, bioinformatics, network security pattern recognition, space navigation, cryptocurrency operations, etc.). The memory and / or storage circuitry 504 may include random access memory (RAM), read-only memory (ROM), one or more hard disk drives, flash memory, etc. Memory and / or storage circuitry 504 may hold data to be processed by data processing system 500. In some cases, memory and / or storage circuitry 504 may also store configuration programs (e.g., bitstreams, mapping functions) for programming integrated circuit device 12. Network interface 506 may allow data processing system 500 to communicate with other electronic devices. Data processing system 500 may include several different packages, or may be contained within a single package on a single package substrate. For example, components of data processing system 500 may be located in several different packages at one location (e.g., a data center) or multiple locations. For example, components of data processing system 500 may be located in separate geographical locations or regions, such as different cities, states, or countries.
[0036] The data processing system 500 can be part of a data center that handles various requests. For example, the data processing system 500 can receive data processing requests via a network interface 506 to perform encryption, decryption, machine learning, video processing, speech recognition, image recognition, data compression, database search ranking, bioinformatics, network security pattern recognition, space navigation, digital signal processing, or other specialized tasks.
[0037] While the embodiments set forth in this disclosure may be readily modified and alternatively adapted, specific embodiments have been shown by way of example in the accompanying drawings and described in detail herein. However, it should be understood that this disclosure is not intended to be limited to the particular forms disclosed. This disclosure is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of this disclosure as defined by the appended claims.
[0038] The techniques proposed and claimed herein are referenced and applied to physical objects and concrete examples of a practical nature that clearly improve upon the art and are therefore not abstract, intangible, or purely theoretical. Furthermore, if any claim appended to this specification contains one or more elements designated as “means for [performing] [function]…” or “steps for [performing] [function]…”, those elements shall be interpreted pursuant to 35.112(f) of the United States Code. However, for any claim containing elements designated in any other manner, those elements are not intended to be interpreted pursuant to 35.112(f) of the United States Code.
[0039] Example Implementation
[0040] Example 1. A modular heat sink system, comprising:
[0041] A base heat sink for attaching to an integrated circuit package die; and
[0042] An auxiliary heat dissipation device is available to be selectively attached to the base heat sink.
[0043] Wherein, when the auxiliary heat dissipation device is not connected to the base heat sink, the base heat sink dissipates a first amount of heat from the integrated circuit package die, and wherein, when the auxiliary heat dissipation device is connected to the base heat sink, the base heat sink and the auxiliary heat dissipation device together dissipate a second amount of heat from the integrated circuit package die, the second amount of heat being greater than the first amount of heat.
[0044] Example 2. The modular heat sink system according to Example 1, wherein the base heat sink includes fins having a first thickness, and the auxiliary heat dissipation device includes fins having a second thickness, the second thickness being thinner than the first thickness.
[0045] Example 3. The modular heat sink system according to Example 2, wherein the first thickness is greater than 0.4 mm and the second thickness is 0.4 mm or thinner.
[0046] Example 4. The modular heat sink system according to Example 1, wherein the base heat sink comprises anodized aluminum.
[0047] Example 5. The modular heat sink system according to Example 1, wherein the base heat sink includes a die-cast module.
[0048] Example 6. The modular heat sink system according to Example 1, wherein the base heat sink includes fins spaced at least 10 mm apart from each other.
[0049] Example 7. A modular heat sink system according to Example 1, wherein the base heat sink includes fins having a first thickness, and the auxiliary heat dissipation device includes a plurality of plates spaced apart at a distance equal to or greater than the first thickness, wherein the plurality of plates can be configured to be mounted between the fins of the base heat sink and to dock with the base heat sink between the fins of the base heat sink.
[0050] Example 8. According to the modular heat sink system of Example 1, when the auxiliary heat dissipation device is connected to the base heat sink, the base heat sink and the auxiliary heat dissipation device actively dissipate the second amount of heat using the fan of the auxiliary heat dissipation device.
[0051] Example 9. The modular heat sink system according to Example 1, wherein the height of the substrate heat sink attached to the integrated circuit package die is less than or equal to one rack unit (1U).
[0052] Example 10. The modular heat sink system according to Example 1, wherein the auxiliary heat dissipation device is attached to the base heat sink and to the integrated circuit package die at a height of less than or equal to two rack units (2U).
[0053] Example 11. The modular heat sink system according to Example 1, wherein the first amount of heat includes less than or equal to 8W, and the second amount of heat includes greater than or equal to 20W.
[0054] Example 12. A method comprising:
[0055] Provide integrated circuit packaging dies;
[0056] A base heat sink for providing a modular heat sink system to be coupled to the integrated circuit package die; and
[0057] Based on the power consumption level of the integrated circuit package die, auxiliary heat dissipation equipment for coupling to the base heat sink system may be selectively provided or not provided.
[0058] Example 13. The method according to Example 12, wherein the base heat sink comprises:
[0059] Anodized aluminum; or
[0060] Copper; or
[0061] Both of these.
[0062] Example 14. The method according to Example 13, wherein the base heat sink comprises a single die-cast object or a single machined object.
[0063] Example 15. The method according to Example 12, wherein the auxiliary heat dissipation device includes a docking assembly, an additional heat sink structure, and a fan.
[0064] Example 16. A modular heat sink system, comprising:
[0065] The die-cast substrate heat sink includes anodized aluminum and includes multiple fins for heat dissipation from the integrated circuit package die.
[0066] Example 17. The modular heat sink system according to Example 16, wherein the plurality of fins have a thickness greater than 0.4 mm.
[0067] Example 18. The modular heat sink system according to Example 16, wherein the plurality of fins are spaced at least 10 mm apart.
[0068] Example 19. The modular heat sink system according to Example 16 includes an auxiliary heat dissipation device, the auxiliary heat dissipation device including a docking assembly and a fan, the docking assembly being used for coupling to the die-cast substrate heat sink.
[0069] Example 20. The modular heat sink system according to Example 19, wherein the auxiliary heat dissipation device includes a plurality of thin fins having a thickness of less than 0.4 mm.
Claims
1. A modular heat sink system, comprising: Base heat sink, used to attach to integrated circuit package die; as well as An auxiliary heat dissipation device is available to be selectively attached to the base heat sink. Wherein, when the auxiliary heat dissipation device is not connected to the base heat sink, the base heat sink dissipates a first amount of heat from the integrated circuit package die, and wherein, when the auxiliary heat dissipation device is connected to the base heat sink, the base heat sink and the auxiliary heat dissipation device together dissipate a second amount of heat from the integrated circuit package die, the second amount of heat being greater than the first amount of heat.
2. The modular heat sink system according to claim 1, wherein, The base heat sink includes fins with a first thickness, and the auxiliary heat dissipation device includes fins with a second thickness, the second thickness being thinner than the first thickness.
3. The modular heat sink system according to claim 2, wherein, The first thickness is greater than 0.4 mm, and the second thickness is 0.4 mm or thinner.
4. The modular heat sink system according to claim 1, wherein, The base heat sink comprises anodized aluminum.
5. The modular heat sink system according to claim 1, wherein, The base heat sink includes a die-casting module.
6. The modular heat sink system according to claim 1, wherein, The base heat sink includes fins spaced at least 10 mm apart.
7. The modular heat sink system according to claim 1, wherein, The base heat sink includes fins having a first thickness, and the auxiliary heat dissipation device includes a plurality of plates spaced apart at a distance equal to or greater than the first thickness, wherein the plurality of plates can be configured to be mounted between the fins of the base heat sink and to dock with the base heat sink between the fins of the base heat sink.
8. The modular heat sink system according to any one of claims 1 to 7, wherein, When the auxiliary heat dissipation device is connected to the base heat sink, the base heat sink and the auxiliary heat dissipation device actively dissipate the second amount of heat using the fan of the auxiliary heat dissipation device.
9. The modular heat sink system according to any one of claims 1 to 7, wherein, The height of the substrate heat sink attached to the integrated circuit package die is less than or equal to that of a rack unit (1U).
10. The modular heat sink system according to any one of claims 1 to 7, wherein, The auxiliary heat dissipation device is attached to the base heat sink and to the integrated circuit package die at a height of less than or equal to two rack units (2U).
11. The modular heat sink system according to any one of claims 1 to 7, wherein, The first amount of heat includes less than or equal to 8W, and the second amount of heat includes greater than or equal to 20W.
12. A method comprising: Provide integrated circuit packaging dies; A base heat sink for a modular heat sink system is provided to be coupled to the integrated circuit package die; as well as Based on the power consumption level of the integrated circuit package die, auxiliary heat dissipation devices for coupling to the base heat sink system may be selectively provided or not provided.
13. The method according to claim 12, wherein, The base heat sink includes: Anodized aluminum; or Copper; or Both of these.
14. The method according to claim 13, wherein, The base heat sink may be a single die-cast object or a single machined object.
15. The method according to any one of claims 12 to 14, wherein, The auxiliary heat dissipation equipment includes docking assembly components, additional heat sink structure, and fan.
16. A modular heat sink system, comprising: The die-cast substrate heat sink includes anodized aluminum and includes multiple fins for heat dissipation from the integrated circuit package die.
17. The modular heat sink system according to claim 16, wherein, The plurality of fins have a thickness greater than 0.4 mm.
18. The modular heat sink system according to claim 16 or 17, wherein, The multiple fins are spaced at least 10 mm apart.
19. The modular heat sink system according to claim 16 or 17, comprising: An auxiliary heat dissipation device, comprising a docking assembly and a fan, the docking assembly being used to couple to the die-cast substrate heat sink.
20. The modular heat sink system according to claim 19, wherein, The auxiliary heat dissipation device includes multiple thin fins, each having a thickness of less than 0.4 mm.