Flat-topped beam substrate integrated waveguide mode reconfigurable horn antenna and communication equipment

Abstract

The invention discloses a reconfigurable horn antenna in a flat-topped beam substrate integrated waveguide mode and communication equipment, the antenna is composed of six antenna basic units which sequentially rotate by 60 degrees, a conduction switch device and five isolation switch devices, and beam coverage and reconfigurable characteristics are realized. The antenna basic unit comprises an upper dielectric substrate, a middle dielectric substrate and a lower dielectric substrate which are stacked in sequence. A substrate integrated waveguide feed structure, a substrate integrated waveguide H-face horn, a pair of triangular air slots and a plurality of pairs of gradient metal strips are loaded on the middle dielectric substrate. Metal through hole arrays are loaded at the front ends of the upper-layer dielectric substrate and the lower-layer dielectric substrate and are used for reflecting electromagnetic waves, reducing backward radiation and improving gain; and a soft surface formed by the metal through hole array and the rectangular metal strip is loaded at the rear end and is used for inhibiting backward radiation and improving gain. The antenna adopts coaxial feed, can provide 360-degree horizontal omnidirectional beam coverage, and has quasi-uniform power distribution with fluctuation less than 1dB and a mechanical reconfigurable characteristic.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and in particular to a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna and communication equipment. Background Technology

[0002] Horn antennas are widely used in communication systems, radar, imaging, radio astronomy, and other fields. While 3D horn antennas can be used in these systems, they are typically large, expensive, and difficult to integrate with other components and devices within the system. Substrate-integrated waveguide technology offers a promising approach to realizing horn antennas using PCB design processes or other manufacturing techniques, enabling the design and implementation of large-scale planar substrate integrated circuits. Summary of the Invention

[0003] The primary objective of this invention is to overcome the shortcomings and deficiencies of the prior art and provide a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna that simultaneously achieves flat-top beam and reconfigurable characteristics. It can provide 360° horizontal omnidirectional beam coverage, has a quasi-uniform power distribution with fluctuation of less than 1dB, and mechanical reconfigurability.

[0004] A second objective of this invention is to provide a communication device.

[0005] The first objective of this invention is achieved through the following technical solution: a flat-top beamforming substrate-integrated waveguide mode reconfigurable horn antenna, comprising six basic antenna units rotated sequentially by 60° around a feed probe, one on-switch device, and five off-switch devices; each basic antenna unit comprises a top dielectric substrate, a middle dielectric substrate, and a bottom dielectric substrate stacked sequentially; the upper and lower surfaces of the middle dielectric substrate are each provided with a metal layer, referred to as the upper metal layer and the lower metal layer; a pair of first metal via arrays, a pair of second metal via arrays, a substrate-integrated waveguide feed structure, and a substrate-integrated... The system comprises a waveguide H-plane horn, a pair of triangular air slots, and multiple pairs of gradient metal strips. A pair of first metal via arrays, along with a portion of the middle dielectric substrate and the upper and lower metal layers, form a substrate-integrated waveguide feeding structure for feeding the horn. A pair of second metal via arrays are horn-shaped and, together with a portion of the middle dielectric substrate and the upper and lower metal layers, constitute a substrate-integrated waveguide H-plane horn. A pair of triangular air slots are cut inside the substrate-integrated waveguide H-plane horn to achieve a flat-top beam. The upper and lower surfaces of the middle dielectric substrate located at the front end of the substrate-integrated waveguide H-plane horn are loaded with a width... Gradually decreasing pairs of gradient metal strips are used for impedance matching and reducing back radiation, thereby improving gain. Metal layers, referred to as the first inner metal layer and the second inner metal layer, are disposed on the inner surfaces of both the upper and lower dielectric substrates. A third metal via array is loaded at the front end of the upper dielectric substrate, covered by a first rectangular metal strip, for reflecting electromagnetic waves and reducing back radiation, thereby improving gain. A fourth metal via array is loaded at the front end of the lower dielectric substrate, covered by a second rectangular metal strip, for reflecting electromagnetic waves and reducing back radiation, thereby improving gain. The upper dielectric substrate... The rear end of the substrate is loaded with a multi-row fifth metal via array, which is covered with a third rectangular metal strip with the same number of vias as the fifth metal via array, forming a soft surface to suppress back radiation and improve gain; the rear end of the lower dielectric substrate is loaded with a multi-row sixth metal via array, which is covered with a fourth rectangular metal strip with the same number of vias as the sixth metal via array, forming a soft surface to suppress back radiation and improve gain; the switching device consists of an upper metal block and a lower dielectric block, the lower surface of which is covered with a metal layer; the five isolation switching devices are all T-shaped metal blocks to achieve reconfigurable characteristics.

[0006] Furthermore, the upper dielectric substrate and the lower dielectric substrate are symmetrical about the middle dielectric substrate, the three dielectric substrates have equal widths, and the ends of the upper dielectric substrate and the lower dielectric substrate are aligned with the ends of the upper metal layer and the lower metal layer.

[0007] Furthermore, the pair of triangular air slots are symmetrical about the central axis of the antenna basic unit, and their pair of sides are aligned with the ends of the upper and lower metal layers.

[0008] Furthermore, the pair of first metal via arrays consists of two rows of metal via arrays, symmetrical about the central axis of the antenna basic unit. Each row of metal via arrays consists of multiple metal vias of the same size and equal spacing. The upper and lower metal layers form the wide side of the substrate integrated waveguide, which is the H-plane of the substrate integrated waveguide H-plane horn. The pair of second metal via arrays are respectively connected to the upper and lower metal layers, forming the narrow side of the substrate integrated waveguide, which is the E-plane of the substrate integrated waveguide H-plane horn, with a height equal to the thickness of the middle dielectric substrate. The pair of second metal via arrays consists of two rows of metal via arrays tilted at a predetermined angle from the central axis of the antenna basic unit to both sides, symmetrical about the central axis of the antenna basic unit. Each row of metal via arrays consists of multiple metal vias of the same size and equal spacing. The third and fourth metal via arrays within the upper and lower dielectric substrates... The arrays are symmetrical about the middle dielectric substrate, and each row of the via array consists of multiple metal vias of the same size and with equal spacing. The fifth and sixth via arrays in the upper and lower dielectric substrates are symmetrical about the middle dielectric substrate, and each row of the via array consists of multiple metal vias of the same size and with equal spacing. The spacing between adjacent rows of via arrays is the same. The metal vias of a pair of first, second, third, and fourth via arrays are of the same size but with unequal spacing between adjacent vias, as are the metal vias of the fifth and sixth via arrays. The height of the first, second, third, fourth, fifth, and sixth via arrays is equal to the thickness of their respective dielectric substrates.

[0009] Furthermore, the gradient metal strips are located on the upper and lower surfaces of the middle dielectric substrate and are composed of multiple pairs of metal strips. The periodic length of the width of each pair of metal strips plus its gap width is the same. As the width of each pair of metal strips decreases arithmetically, the corresponding gap width increases arithmetically. The first inner metal layer and the second inner metal layer cover the inner surfaces of the upper and lower dielectric substrates and are symmetrical about the middle dielectric substrate. The first rectangular metal strip and the second rectangular metal strip are located on the outer surfaces of the upper and lower dielectric substrates and are symmetrical about the middle dielectric substrate, respectively covering the third metal via array, the fourth metal via array, and the outer surface of the front end portion of the dielectric substrate. The third rectangular metal strip and the fourth rectangular metal strip are located on the outer surfaces of the upper and lower dielectric substrates and are symmetrical about the middle dielectric substrate. Adjacent metal strips have equal widths and the same spacing, covering their respective fifth and sixth metal via arrays. The fifth and sixth metal via arrays are located at the center of their respective third and fourth rectangular metal strips.

[0010] Furthermore, the six basic antenna units are used to construct a multi-beam antenna by connecting the endpoints of the upper and lower dielectric substrates of adjacent basic antenna units. Each basic antenna unit extends inward into a first metal via array until it intersects with the first metal via array of the adjacent basic antenna units.

[0011] Furthermore, the one conducting switch and five isolating switches are located at the end of the first metal through-hole array extending from the six basic antenna units. That is, one switch corresponds to the end of the first metal through-hole array extending from one basic antenna unit. By changing the position of the conducting switch (by exchanging the position of the conducting switch with the isolating switch in the corresponding direction, the radiation beam in the corresponding direction can be realized), reconfigurable beam coverage, i.e., six beams, can be achieved.

[0012] Furthermore, the multi-beam antenna is coaxially fed, and the length of the feed probe at the center of the antenna is less than the thickness of the middle dielectric substrate. The upper and lower metal layers are respectively etched with upper and lower circular slots of different diameters with the feed probe as the center.

[0013] The second objective of the present invention is achieved by the following technical solution: a communication device including the above-mentioned flat-top beam substrate integrated waveguide mode reconfigurable horn antenna.

[0014] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0015] 1. The antenna of this invention proposes a novel method and principle for achieving a flat-top beam by cutting air slots in a SIW H-plane horn antenna; and simultaneously achieves flat-top beam, multi-beam beam coverage and mechanically reconfigurable radiation pattern.

[0016] 2. The antenna of the present invention has a 1dB beamwidth covering ±30°, and can provide 360° horizontal omnidirectional beam coverage. It has a quasi-uniform power distribution with fluctuation of less than 1dB and mechanical reconfigurability. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to an embodiment of the present invention.

[0018] Figure 2 This is a three-dimensional structural exploded view of the basic antenna unit according to an embodiment of the present invention.

[0019] Figure 3 This is a top view of the dielectric substrate in the middle layer of the antenna basic unit according to an embodiment of the present invention.

[0020] Figure 4This is a bottom view of the dielectric substrate in the middle layer of the antenna basic unit according to an embodiment of the present invention.

[0021] Figure 5 This is an outer plan view of the upper and lower dielectric substrates in an embodiment of the present invention.

[0022] Figure 6 This is an inner plan view of the upper and lower dielectric substrates in an embodiment of the present invention.

[0023] Figure 7 This is a side view of the basic antenna unit according to an embodiment of the present invention.

[0024] Figure 8 This is a top view of a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to an embodiment of the present invention.

[0025] Figure 9 This is a schematic diagram of the S-parameters of a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to an embodiment of the present invention.

[0026] Figure 10 This is a schematic diagram of the gain of a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to an embodiment of the present invention.

[0027] Figure 11 The H-plane radiation pattern of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna in an embodiment of the present invention is shown at 19.15 GHz.

[0028] Figure 12 The radiation pattern of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna in the E-plane at 19.15 GHz is shown in this embodiment of the invention.

[0029] Figure 13 The H-plane multi-beam radiation pattern of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna in an embodiment of the present invention is shown at 19.15 GHz.

[0030] Figure 14 The radiation pattern of the H-plane beam coverage of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna in an embodiment of the present invention is shown in the figure. Detailed Implementation

[0031] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0032] Example 1

[0033] SIW H-plane horn antennas are increasingly favored by researchers in microwave and millimeter-wave applications. Most research focuses on improving the antenna's impedance bandwidth and gain, with less attention paid to other radiation characteristics. In recent years, to meet the needs of practical applications, more and more research has focused on antennas with specific radiation patterns to achieve better application results. Flat-top beam antennas are not only suitable for applications requiring beam coverage, but also achieve more uniform beam coverage compared to other antennas used for beam coverage, thus gaining increasing popularity. However, methods for achieving flat-top beams in SIW H-plane horn antennas are relatively limited, and new implementation methods and principles need further exploration. Pattern-reconfigurable antennas are also a type of antenna that has attracted widespread attention. They can achieve different beam switching by switching different switches using only a single feed source, conveniently realizing beam coverage. Therefore, this embodiment provides a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna.

[0034] like Figures 1 to 8As shown, this embodiment discloses a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna that can be applied in communication equipment. It includes six basic antenna elements 27, 28, 29, 30, 31, and 32 rotated sequentially by 60° around a feed probe 9, one on-switch device 33, and five off-switch devices 34, 35, 36, 37, and 38. Each basic antenna element comprises a top dielectric substrate 2, a middle dielectric substrate 1, and a bottom dielectric substrate 3 stacked sequentially. The upper and lower surfaces of the middle dielectric substrate 1 are each provided with a metal layer, referred to as the upper metal layer 4 and the lower metal layer 5. A pair of first metal via arrays 7 and a pair of second metal via arrays 7 are loaded onto the middle dielectric substrate 1. The system comprises a via array 8, a substrate integrated waveguide feeding structure 15, a substrate integrated waveguide H-plane horn 16, a pair of triangular air slots 12, and three pairs of gradient metal strips 13 and 14. A pair of first metal via arrays 7, together with a portion of the middle dielectric substrate 1 and the upper and lower metal layers 4 and 5, form the substrate integrated waveguide feeding structure 15, used to feed the horn. A pair of second metal via arrays 8 are horn-shaped and, together with a portion of the middle dielectric substrate 1 and the upper and lower metal layers 4 and 5, constitute the substrate integrated waveguide H-plane horn 16. A pair of triangular air slots 12 are cut within the substrate integrated waveguide H-plane horn 16 to achieve a flat-top beam. The middle dielectric substrate 1 is located within the substrate integrated waveguide. The upper and lower surfaces of the substrate at the front end of the H-face speaker 16 are loaded with three pairs of gradually decreasing width metal strips 13 and 14 for impedance matching and reducing back radiation, thereby improving gain. Metal layers, referred to as the first inner metal layer 17 and the second inner metal layer 18, are disposed on the inner surfaces of both the upper dielectric substrate 2 and the lower dielectric substrate 3. A third metal via array 19 is loaded at the front end of the upper dielectric substrate 2, covered by a first rectangular metal strip 21, for reflecting electromagnetic waves and reducing back radiation, thereby improving gain. A fourth metal via array 20 is loaded at the front end of the lower dielectric substrate 3, covered by a second rectangular metal strip 22, for reflecting electromagnetic waves and reducing back radiation. Backward radiation is used to improve gain; the rear end of the upper dielectric substrate 2 is loaded with a five-row fifth metal via array 23, which is covered with five third rectangular metal strips 25 to form a soft surface, used to suppress backward radiation to improve gain; the rear end of the lower dielectric substrate 3 is loaded with a five-row sixth metal via array 24, which is covered with five fourth rectangular metal strips 26 to form a soft surface, used to suppress backward radiation to improve gain; the switching device 33 is composed of an upper metal block 39 and a lower dielectric block 6, the lower surface of the dielectric block 6 is covered with a metal layer; the five isolation switching devices 34, 35, 36, 37, and 38 are all T-shaped metal blocks, used to achieve reconfigurable characteristics.

[0035] Specifically, the upper dielectric substrate 2 and the lower dielectric substrate 3 are symmetrical about the middle dielectric substrate 1, the three dielectric substrates have equal widths, and the ends of the upper dielectric substrate 2 and the lower dielectric substrate 3 are aligned with the ends of the upper metal layer 4 and the lower metal layer 5.

[0036] Specifically, the pair of triangular air slots 12 are symmetrical about the central axis of the antenna basic unit, and their pair of sides are aligned with the ends of the upper metal layer 4 and the lower metal layer 5.

[0037] Specifically, the pair of first metal via arrays 7 consists of two rows of metal via arrays, symmetrical about the central axis of the antenna basic unit. Each row of metal via arrays consists of multiple metal vias of the same size and equal spacing. The upper metal layer 4 and the lower metal layer 5 form the wide side of the substrate integrated waveguide, which is the H-plane of the substrate integrated waveguide H-plane horn. The pair of second metal via arrays 8 are connected to the upper metal layer 4 and the lower metal layer 5 respectively, forming the narrow side of the substrate integrated waveguide, which is the E-plane of the substrate integrated waveguide H-plane horn. The height is the thickness of the middle dielectric substrate 1. The pair of second metal via arrays 8 consists of two rows of metal via arrays tilted at a predetermined angle from the central axis of the antenna basic unit to both sides, symmetrical about the central axis of the antenna basic unit. Each row of metal via arrays consists of multiple metal vias of the same size and equal spacing. The third metal via array 19 and the fourth metal via array 20 in the upper dielectric substrate 2 and the lower dielectric substrate 3 are symmetrical about the central axis of the antenna basic unit. The substrate 1 is symmetrical, and each row of metal via arrays consists of multiple metal vias of the same size and with equal spacing. The fifth metal via array 23 and the sixth metal via array 24 in the upper dielectric substrate 2 and the lower dielectric substrate 3 are symmetrical about the middle dielectric substrate 1. Each row of metal via arrays consists of multiple metal vias of the same size and with equal spacing, and the spacing between adjacent rows of metal via arrays is the same. The metal vias of a pair of first metal via arrays 7, a pair of second metal via arrays 8, a third metal via array 19, and a fourth metal via array 20 have the same size but unequal spacing between adjacent metal vias, and the metal vias of the fifth metal via array 23 and the sixth metal via array 24 have unequal size and unequal spacing between adjacent metal vias. The height of the first metal via array 7, the second metal via array 8, the third metal via array 19, the fourth metal via array 20, the fifth metal via array 23, and the sixth metal via array 24 is equal to the thickness of their respective dielectric substrates.

[0038] Specifically, the gradient metal strips 13 and 14 are located on the upper and lower surfaces of the intermediate dielectric substrate 1, and are composed of three pairs of metal strips. The periodic length of the width of each pair of metal strips plus the width of its gap is the same. As the width of each pair of metal strips decreases at equal intervals, the corresponding gap width increases at equal intervals. The first inner metal layer 17 and the second inner metal layer 18 cover the inner surfaces of the upper dielectric substrate 2 and the lower dielectric substrate 3, and are symmetrical about the intermediate dielectric substrate 1. The first rectangular metal strip 21 and the second rectangular metal strip 22 are located on the outer surfaces of the upper dielectric substrate 2 and the lower dielectric substrate 3, and are symmetrical about the intermediate dielectric substrate 1. Symmetrical, respectively covering the outer surface of the third metal via array 19, the fourth metal via array 20, and the front end portion of the dielectric substrate; the third rectangular metal strip 25 and the fourth rectangular metal strip 26 are located on the outer surface of the upper dielectric substrate 2 and the lower dielectric substrate 3, symmetrical about the middle dielectric substrate 1, with adjacent metal strips having equal width and the same spacing, covering their respective fifth metal via array 23 and sixth metal via array 24, the fifth metal via array 23 and the sixth metal via array 24 being located at the center of their respective third rectangular metal strip 25 and fourth rectangular metal strip 26.

[0039] Specifically, the six basic antenna units 27, 28, 29, 30, 31, and 32 are used to construct a multi-beam antenna by connecting the endpoints of the upper dielectric substrate 2 and the lower dielectric substrate 3 of adjacent basic antenna units. Each basic antenna unit extends inward into a first metal through-hole array 7 until it intersects with the first metal through-hole array 7 of the adjacent basic antenna unit.

[0040] Specifically, the one conducting switch device 33 and the five isolating switches 34, 35, 36, 37, and 38 are located at the end of the first metal through-hole array 7 extending from the six antenna basic units 27, 28, 29, 30, 31, and 32. That is, one switch device corresponds to the end of the first metal through-hole array 7 extending from one antenna basic unit. By changing the position of the conducting switch device 33 (by exchanging the position of the conducting switch device 33 with the isolating switch device in the corresponding direction, the radiation beam in the corresponding direction can be realized), reconfigurable beam coverage, i.e., six beams, can be achieved.

[0041] Specifically, the multi-beam antenna is coaxially fed, and the length of the feed probe 9 at the center of the antenna is less than the thickness of the middle dielectric substrate 1. The upper metal layer 4 and the lower metal layer 5 are respectively etched with the feed probe 9 as the center, with upper circular slots 10 and lower circular slots 11 of different diameters.

[0042] Specifically, the middle dielectric substrate 1 has a width of 29.86 mm and a length of 44.74 mm; the upper and lower dielectric substrates 2 and 3 have the same width and a length of 19.05 mm; the diameter of the metal vias in the pair of first metal via arrays 7, 8, 19, and 20 is 1 mm, and the spacing between adjacent metal vias is 1.336 mm, 1.5 mm, 1.595 mm, and 1.3 mm, respectively; the array spacing of the pair of first metal via arrays 7 is 6.68 mm; and the distance between the third and fourth metal via arrays 19 and 20 is 2.75 mm from the end of the dielectric substrate; the diameter of the metal vias in the five rows of fifth metal via arrays 23 and 24 is 0.39 mm, the spacing between adjacent metal via arrays is 2.86 mm, and the spacing between adjacent metal vias is 1.95 mm.

[0043] Specifically, the triangular air groove 12 is 9mm wide, 17.45mm long, 4.67mm apart at its endpoints, and 6mm apart at its edges.

[0044] Specifically, the upper metal layer 4 and the lower metal layer 5 have a length of 34.54 mm; the three pairs of gradient metal strips 13 and 14 have lengths of 2.8 mm, 2.7 mm, and 2.6 mm respectively, with corresponding gap lengths of 0.6 mm, 0.7 mm, and 0.8 mm respectively; the first rectangular metal strip 21 and the second rectangular metal strip 22 have a length of 3.5 mm; the five third rectangular metal strips 25 and the five fourth rectangular metal strips 26 have a length of 2.47 mm, with corresponding gap lengths of 0.39 mm.

[0045] Specifically, the distance between the one conducting switch device 33 and the five isolating switches 34, 35, 36, 37, and 38 and the center of the antenna is 7 mm.

[0046] Specifically, the length of the power supply probe 9 is 1 mm; the diameter of the upper circular slit 10 is 0.7 mm, and the diameter of the lower circular slit 11 is 0.5 mm.

[0047] Specifically, the upper dielectric substrate 2, the lower dielectric substrate 3, and the middle dielectric substrate 1 are made of Rogers RO4003, which has a dielectric constant of 3.55 and a loss tangent of 0.0027. The thickness of the middle dielectric substrate 1 is 1.524 mm, and the thicknesses of the upper dielectric substrate 2 and the lower dielectric substrate 3 are 0.813 mm.

[0048] The antenna basic unit in this embodiment achieves flat-top beam characteristics by cutting a pair of triangular air slots on both sides of the horn, utilizing their slow-wave and capacitive effects to adjust the electric field distribution at the horn aperture. By loading three pairs of gradient metal strips in front of the horn aperture, impedance matching is improved and back radiation is reduced, increasing gain. Back radiation is further reduced and gain is increased by loading a reflective metal through-hole array and a soft surface. Beam coverage is achieved by rotating six antenna basic units sequentially by 60°. Reconfigurability is achieved by loading metal blocks and dielectric blocks as switching devices. This antenna uses coaxial feeding and simultaneously achieves flat-top beam and reconfigurability, providing 360° horizontal omnidirectional beam coverage with a quasi-uniform power distribution and mechanical reconfigurability with fluctuations less than 1dB.

[0049] like Figure 9 The figure shows the S-parameters of a flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to an embodiment of the present invention. As can be seen from the figure, the impedance bandwidth of the antenna is 0.78% (19.08-19.23GHz).

[0050] like Figure 10 As shown in the figure, the gain of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to an embodiment of the present invention is displayed. As can be seen from the figure, the peak gain of the antenna is 4.79dB.

[0051] like Figure 11 and Figure 12 The figure shows the radiation field patterns of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna of the present invention in the H-plane and E-plane at 19.15 GHz. As can be seen from the figure, a flat-top beam is achieved, with a 1 dB beamwidth of 66.9° at 19.15 GHz, covering a range of ±30°, and a cross-polarization level of less than -30 dB.

[0052] like Figure 13 and Figure 14 The figure shows the radiation field pattern of the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna of the present invention at 19.15 GHz in the H plane with multi-beam and beam coverage. As can be seen from the figure, beam coverage and reconfigurable pattern of 6 beams are achieved, providing 360° horizontal omnidirectional beam coverage and quasi-uniform power distribution with fluctuation of less than 1 dB.

[0053] In summary, the antenna of this invention comprises six basic antenna units rotated 60° sequentially, one on-switch device, and five off-switch devices, achieving beam coverage and reconfigurability. The basic antenna unit comprises upper, middle, and lower dielectric substrates stacked sequentially: the middle dielectric substrate has a substrate-integrated waveguide feed structure for feeding the horn; a substrate-integrated waveguide H-plane horn; a pair of triangular air slots for achieving a flat-top beam; and three pairs of gradient metal strips for impedance matching, reducing back radiation, and improving gain. The front ends of the upper and lower dielectric substrates are loaded with metal via arrays to reflect electromagnetic waves, reduce back radiation, and improve gain; the rear ends are loaded with a soft surface composed of metal via arrays and rectangular metal strips to suppress back radiation and improve gain. The antenna is coaxially fed, with a 1dB beamwidth of 66° at 19.15 GHz, covering ±30°, an impedance bandwidth of 0.78% (19.08-19.23 GHz), and a peak gain of 4.79 dB. The antenna can provide 360° horizontal omnidirectional beam coverage, with a quasi-uniform power distribution with fluctuations of less than 1 dB and mechanical reconfigurability.

[0054] Example 2

[0055] This embodiment provides a communication device, including the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna described in Embodiment 1.

[0056] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A flat-top beamforming substrate integrated waveguide mode reconfigurable horn antenna, characterized in that, The antenna includes six basic antenna units (27), (28), (29), (30), (31), and (32) that rotate 60° around the feed probe (9) in sequence, one on-switch device (33), and five off-switch devices (34), (35), (36), (37), and (38); each basic antenna unit includes an upper dielectric substrate (2), a middle dielectric substrate (1), and a lower dielectric substrate (3) stacked in sequence; the upper and lower surfaces of the middle dielectric substrate (1) are provided with metal layers, referred to as the upper metal layer (4). The middle dielectric substrate (1) is loaded with a pair of first metal via arrays (7), a pair of second metal via arrays (8), a substrate integrated waveguide feeding structure (15), a substrate integrated waveguide H-plane horn (16), a pair of triangular air slots (12), and multiple pairs of gradient metal strips (13) and (14); the pair of first metal via arrays (7), together with part of the substrate of the middle dielectric substrate (1) and the upper metal layer (4) and the lower metal layer (5), form a substrate integrated waveguide feeding structure (15) for feeding the horn; A pair of second metal via arrays (8) are horn-shaped, forming a substrate integrated waveguide H-plane horn (16) together with a portion of the middle dielectric substrate (1) and the upper metal layer (4) and lower metal layer (5); a pair of triangular air slots (12) are cut inside the substrate integrated waveguide H-plane horn (16) to achieve a flat-top beam; multiple pairs of gradually decreasing width metal strips (13) and (14) are loaded on the upper and lower surfaces of the portion of the middle dielectric substrate (1) located at the front end of the substrate integrated waveguide H-plane horn (16) for impedance matching and reducing back radiation, thereby improving gain; metal layers are provided on the inner surfaces of the upper dielectric substrate (2) and the lower dielectric substrate (3), referred to as the first inner metal layer (17) and the second inner metal layer (18); a third metal via array (19) is loaded at the front end of the upper dielectric substrate (2), which is covered with a first rectangular metal strip (21) for reflecting electromagnetic waves and reducing back radiation, thereby improving gain; the lower dielectric substrate (3) The front end of the upper dielectric substrate (2) is loaded with a fourth metal via array (20), which is covered with a second rectangular metal strip (22) to reflect electromagnetic waves and reduce back radiation, thereby improving gain; the rear end of the upper dielectric substrate (2) is loaded with multiple rows of fifth metal via arrays (23), which is covered with a third rectangular metal strip (25) with the same number as the fifth metal via array (23), forming a soft surface to suppress back radiation and improve gain; the rear end of the lower dielectric substrate (3) is loaded with multiple rows of sixth metal via arrays (24), which is covered with a fourth rectangular metal strip (26) with the same number as the sixth metal via array (24), forming a soft surface to suppress back radiation and improve gain; the conducting switch device (33) is composed of an upper metal block (39) and a lower dielectric block (6), the lower surface of which is covered with a metal layer; the five isolating switch devices (34), (35), (36), (37), and (38) are all T-shaped metal blocks to achieve reconfigurable characteristics.

2. The flat-top beamforming substrate integrated waveguide mode reconfigurable horn antenna according to claim 1, characterized in that, The upper dielectric substrate (2) and the lower dielectric substrate (3) are symmetrical about the middle dielectric substrate (1), and the three dielectric substrates have equal widths. The ends of the upper dielectric substrate (2) and the lower dielectric substrate (3) are aligned with the ends of the upper metal layer (4) and the lower metal layer (5).

3. The flat-top beamforming substrate integrated waveguide mode reconfigurable horn antenna according to claim 2, characterized in that, The pair of triangular air slots (12) are symmetrical about the central axis of the antenna basic unit, and their pair of sides are aligned with the ends of the upper metal layer (4) and the lower metal layer (5).

4. The flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to claim 3, characterized in that, The pair of first metal via arrays (7) consists of two rows of metal via arrays, symmetrical about the central axis of the antenna basic unit. Each row of metal via arrays consists of multiple metal vias of the same size and with equal spacing. The upper metal layer (4) and the lower metal layer (5) form the wide side of the substrate integrated waveguide, which is the H-plane of the substrate integrated waveguide H-plane horn. The pair of second metal via arrays (8) are respectively connected to the upper metal layer (4) and the lower metal layer (5), forming the narrow side of the substrate integrated waveguide, which is the H-plane horn of the substrate integrated waveguide. The height of the E-side of the antenna is equal to the thickness of the middle dielectric substrate (1); the pair of second metal via arrays (8) consists of two rows of metal via arrays tilted at a predetermined angle from the central axis of the antenna basic unit to both sides, symmetrical about the central axis of the antenna basic unit, and each row of metal via arrays consists of multiple metal vias of the same size and equal spacing; the third metal via array (19) and the fourth metal via array (20) in the upper dielectric substrate (2) and the lower dielectric substrate (3) are symmetrical about the middle dielectric substrate (1). Each row of via arrays consists of multiple vias of the same size and equal spacing; the fifth via array (23) and the sixth via array (24) in the upper dielectric substrate (2) and the lower dielectric substrate (3) are symmetrical about the middle dielectric substrate (1), each row of via arrays consists of multiple vias of the same size and equal spacing, and the spacing between adjacent rows of via arrays is the same; a pair of first via arrays (7), a pair of second via arrays (8), and a third via array (1 9) The metal vias of the fourth metal via array (20) have the same size and the spacing between adjacent metal vias are different. The metal vias of the fifth metal via array (23) and the sixth metal via array (24) have different sizes and the spacing between adjacent metal vias. The height of the first metal via array (7), the second metal via array (8), the third metal via array (19), the fourth metal via array (20), the fifth metal via array (23) and the sixth metal via array (24) is the thickness of their respective dielectric substrates.

5. The flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to claim 4, characterized in that, The gradient metal strips (13) and (14) are located on the upper and lower surfaces of the middle dielectric substrate (1), and are composed of multiple pairs of metal strips. The periodic length of the width of each pair of metal strips plus the width of its gap is the same. As the width of each pair of metal strips decreases at equal intervals, the corresponding gap width increases at equal intervals. The first inner metal layer (17) and the second inner metal layer (18) cover the inner surfaces of the upper dielectric substrate (2) and the lower dielectric substrate (3), and are symmetrical about the middle dielectric substrate (1). The first rectangular metal strip (21) and the second rectangular metal strip (22) are located on the outer surfaces of the upper dielectric substrate (2) and the lower dielectric substrate (3), and are symmetrical about the middle dielectric substrate (1). The third rectangular metal strip (25) and the fourth rectangular metal strip (26) cover the outer surface of the upper dielectric substrate (2) and the lower dielectric substrate (3), respectively. They are symmetrical about the middle dielectric substrate (1). The adjacent metal strips have the same width and the same spacing, and cover their respective fifth and sixth metal strip arrays (23 and 24). The fifth and sixth metal strip arrays (23 and 24) are located at the center of their respective third rectangular metal strips (25) and fourth rectangular metal strips (26).

6. The flat-top beamforming substrate integrated waveguide mode reconfigurable horn antenna according to claim 5, characterized in that, The six basic antenna units (27), (28), (29), (30), (31), and (32) are used to construct a multi-beam antenna by connecting the endpoints of the upper dielectric substrate (2) and the lower dielectric substrate (3) of the adjacent basic antenna units. Each basic antenna unit extends inward to form a first metal through-hole array (7) until it intersects with the first metal through-hole array (7) of the adjacent basic antenna unit.

7. The flat-top beamforming substrate integrated waveguide mode reconfigurable horn antenna according to claim 6, characterized in that, The one conducting switch (33) and five isolating switches (34), (35), (36), (37), and (38) are located at the end of the first metal through-hole array (7) extending from the six basic antenna units (27), (28), (29), (30), (31), and (32). That is, one switch corresponds to the end of the first metal through-hole array (7) extending from one basic antenna unit. By changing the position of the conducting switch (33), reconfigurable beam coverage, i.e., six beams, can be achieved.

8. The flat-top beam substrate integrated waveguide mode reconfigurable horn antenna according to claim 7, characterized in that, The multi-beam antenna is coaxially fed, and the length of the feed probe (9) at the center of the antenna is less than the thickness of the middle dielectric substrate (1). The upper metal layer (4) and the lower metal layer (5) are respectively etched with the feed probe (9) as the center, with different diameters of upper circular slots (10) and lower circular slots (11).

9. A communication device, characterized in that, Includes the flat-top beam substrate integrated waveguide mode reconfigurable horn antenna as described in any one of claims 1-8.

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