Electrical connection unit

Abstract

The electrical connection unit includes an electronic component, a connection component, and a bus bar. The connection component is adjacent to the electronic component in the first direction, and is connected to the electronic component. The bus bar overlaps the connection member when viewed from a second direction orthogonal to the first direction, and is electrically connected to the electronic component via the connection member. The bus bar has a connection region located at the same position as the connection member in the first direction. The center of the connection region in the third direction is offset toward the first side of the third direction with respect to the center of the connection member in the third direction. The third direction is orthogonal to the first direction and the second direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, improvements in heat dissipation are expected for the electrical connection unit.

[0008] One implementation provides an electrical connection unit that enables improved heat dissipation.

[0009] Technical means for solving problems

[0010] One embodiment of the electrical connection unit includes an electronic component, a connecting component, and a busbar. The connecting component is adjacent to and connected to the electronic component in a first direction. The busbar overlaps with the connecting component when viewed from a second direction orthogonal to the first direction and is electrically connected to the electronic component via the connecting component. The busbar has a connection region located at the same position as the connecting component in the first direction. The center of the connection region in a third-direction direction is offset to a first side in the third-direction direction relative to the center of the connecting component in the third-direction direction. The third-direction direction is orthogonal to both the first and second directions. The busbar has an exposed portion that exposes space on the first side of at least one of the electronic component and the connecting component.

[0011] Invention Effects

[0012] According to one embodiment, the heat dissipation of the electrical connection unit can be improved. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the first embodiment.

[0014] Figure 2 This is a perspective view used to illustrate the main body of the first embodiment.

[0015] Figure 3 This is a perspective view used to illustrate the sub-units of the first embodiment.

[0016] Figure 4 This is a perspective view showing a portion of the subunit of the first embodiment.

[0017] Figure 5 This is a perspective view used to illustrate the electronic components and connecting components of the first embodiment.

[0018] Figure 6 This is a perspective view used to illustrate the electronic components and connecting components of the first embodiment.

[0019] Figure 7 This is a perspective view showing the connecting component of the first embodiment.

[0020] Figure 8 This is a perspective view showing the wiring substrate of the first embodiment.

[0021] Figure 9 This is a perspective view showing an exploded view of a portion of the wiring substrate of the first embodiment.

[0022] Figure 10 This is a top view showing the wiring substrate of the first embodiment.

[0023] Figure 11 This is a perspective view showing an exploded portion of the connecting unit of the first embodiment.

[0024] Figure 12 This is a bottom view showing the wiring substrate of the first embodiment.

[0025] Figure 13 It is along Figure 10 The cross-sectional view of the structure shown along line F13-F13.

[0026] Figure 14 This is a cross-sectional view showing a modified example of the first embodiment.

[0027] Figure 15 This is a cross-sectional view showing a modified example of the first embodiment.

[0028] Figure 16 for Figure 10 The structure shown is a cross-sectional view along line F16-F16.

[0029] Figure 17 This is a cross-sectional view used to illustrate the structure related to the connecting component in the first embodiment.

[0030] Figure 18 yes Figure 10 A magnified view of a portion of it.

[0031] Explanation of reference numerals in the attached figures

[0032] 1…Electrical connection unit 10A…Electronic component 20A…Connecting component 20B…Connecting component (other connecting components) 41…Base plate (base component) 42A…Busbar 51…Flat surface 51a…First surface 51b…Second surface 55A…Receiving part 65…Connecting area 65a…First exposed part 66…Adjacent area 66a…Second exposed part 67…Exposed part Detailed Implementation

[0033] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0034] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Orientation" refers to the overlapping of imaginary projections of two objects when viewed from a specific direction. That is, "orientation" is not limited to the case where two objects are directly facing each other, but may also include the case where two objects are facing each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0035] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 11 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 11 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1The -Z direction is the direction opposite to the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction". The X direction is an example of the "first direction". The Z direction is an example of the "second direction". The Y direction is an example of the "third direction".

[0036] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0037] (First Implementation)

[0038] <1. Structure of the electrical connection unit>

[0039] Figure 1 This is a cross-sectional view showing the electrical connection unit 1 according to the first embodiment. The electrical connection unit 1 is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0040] Electrical connection unit 1, for example, includes a main body MU, a metal plate 80, and an insulating sheet 91 (see reference). Figure 11 ), multiple heat-conducting components 92 and an insulating cover 93.

[0041] <2. Main Body>

[0042] First, let's explain the main body MU.

[0043] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has 3 sub-units SU (sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0044] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a first wiring substrate 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X.

[0045] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y.

[0046] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z.

[0047] In this embodiment, three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is positioned relative to sub-unit SUY in the +X direction. Sub-units SUX and SUY are electrically connected via multiple connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is positioned relative to sub-unit SUY in the -X direction. Sub-units SUZ and SUY are connected via multiple connecting busbars 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y (in... Figure 2 (Only one is shown in the figure) and electrically connected. The connecting busbar 75 is arranged on the side opposite to the metal plate 80 relative to the multiple sub-units SU.

[0048] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0049] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one subunit SU. Hereinafter, without distinguishing between the subunit SUX, subunit SUY, and subunit SUZ, they will be simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Additionally, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40".

[0050] Furthermore, instead of the above example, the main body MU may not be divided into multiple sub-units SU. That is, the main body MU may be formed from multiple electronic components 10 and a wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU with different functions, but may also be sub-units SU with the same function.

[0051] <3. Structure of Subunits>

[0052] Next, the structure of the subunit SU will be explained.

[0053] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 This is a perspective view showing a portion of a subunit SU exploded. The subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, and a wiring substrate 40. The connecting components 20 and 30 are components that form vertical power paths. The connecting components 20 and 30 can also be referred to as "vertical wiring components."

[0054] <3.1 Electronic components and connecting components for connecting components>

[0055] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0056] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Hereinafter, examples of electronic component 10 will be described, including a first type of electronic component 10M and a second type of electronic component 10N.

[0057] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 may also be referred to as a "metal component". Hereinafter, examples of the connecting member 20 will be described, including a first type of connecting member 20M and a second type of connecting member 20N.

[0058] <3.1.1 Type 1 Electronic Components>

[0059] Figure 5This is a perspective view showing a first type of electronic component 10M and a first type of connecting component 20M. The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged at one end. The electronic component 10M, for example, has a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0060] (case)

[0061] The housing 11 is the outer contour component that forms most of the external shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 houses the main body portion 12 of the component. Alternatively, the housing 11 and the main body portion 12 of the component can be formed integrally.

[0062] In this embodiment, the housing 11 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, plate-shaped along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates the terminals 13A and 13B from each other. Additionally, in this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting members 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates the first portions 21 of the two connecting members 20M connected to the electronic component 10M from each other.

[0063] (Main body of the component)

[0064] The main body 12 is the part that performs the main functions of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, if the electronic component 10M is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body 12 includes a part that stores charge.

[0065] (terminal)

[0066] Terminal 13 is an electrical connection portion exposed to the outside of housing 11. Terminal 13 is electrically connected to the main body 12 of component inside housing 11. In this embodiment, electronic component 10M includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a positive terminal. The other of terminals 13A and 13B is a negative terminal.

[0067] In this embodiment, terminals 13A and 13B are disposed at one end of the electronic component 10M in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 71 (e.g., a screw or bolt) as described later. The mounting hole 13h is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10M has a threaded groove.

[0068] (Installation Department)

[0069] Mounting section 14 is a part used to fix electronic component 10M. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 11 The mounting hole 14h is for installation. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. The object to be fastened to the mounting part 14 will be described later.

[0070] <3.1.2 Type 1 Connecting Components>

[0071] The first type of connecting member 20M is a member that electrically connects the first type of electronic component 10M to the wiring substrate 40. In this embodiment, the connecting member 20M connects the electronic component 10M to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The connecting member 20M extends in the X direction with a fixed width when viewed from the Z direction. The connecting member 20M has, for example, a first part 21 and a second part 22.

[0072] (Part 1)

[0073] The first portion 21 of the connecting member 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid portion extending along the Z direction. The first portion 21 extends along one end of the electronic component 10M (e.g., the end in the X direction). The first portion 21 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X direction) and connected to the terminal 13 of the electronic component 10M from the horizontal direction (e.g., the X direction).

[0074] The first portion 21 of the connecting member 20M has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) passes. The first mounting hole 21h is open in a horizontal direction (e.g., the X direction). Additionally, the first portion 21 has a recess 25 around the first mounting hole 21h. The recess 25 is a receiving portion that accommodates the head of the fastening member 71 inserted into the first mounting hole 21h. By engaging the fastening member 71 passing through the first mounting hole 21h with the mounting hole 13h of the terminal 13 of the electronic component 10M, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10M. Alternatively, the first portion 21 may not have the recess 25.

[0075] (Part Two)

[0076] The second part 22 of the connecting component 20M is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second part 22 of the connecting member 20M is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20M has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second mounting hole 22h of the second portion 22 is through which the fastening member 43 passes. And, by making the engaging member 44 (e.g., a nut, see...) Figure 3 The first part 21 engages with the end of the fastening member 43 passing through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42. In this embodiment, a connecting member 20M is formed in an L-shape by the first part 21 and the second part 22.

[0077] <3.1.3 Second Type of Electronic Components>

[0078] Figure 6 This is a perspective view showing a second type of electronic component 10N and a second type of connecting component 20N. The second type of electronic component 10N is an electronic component with two terminals 13 separately disposed at both ends in the horizontal direction. The electronic component 10N, for example, has a housing 11, a main body 12, and a plurality of terminals 13. Furthermore, in the structure of the electronic component 10N, structures having the same function as electronic component 10M are labeled with the same reference numerals. In this case, for the description of the electronic component 10N, "electronic component 10M" in the above description of electronic component 10M will be replaced with "electronic component 10N".

[0079] In electronic component 10N, terminals 13A and 13B are separately disposed at opposite ends of electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole 13h opens in the Z direction. For example, the mounting hole 13h of electronic component 10N is a through hole through which the fastening member 72 passes.

[0080] <3.1.4 Second type of connecting component>

[0081] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N to the wiring substrate 40. In this embodiment, the connection member 20N connects the electronic component 10N to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The connecting member 20M extends in the X direction with a fixed width when viewed from the Z direction. The connecting member 20N has, for example, a first part 21, a second part 22, and a third part 23.

[0082] (Part 1)

[0083] The first portion 21 of the connecting member 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a cuboid portion extending in the Z direction. The first portion 21 is an upright portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 21 is adjacent to the terminal 13 of the electronic component 10N in the Z direction and is connected to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting member 20N has a first mounting hole 21h for engaging with the fastening member 72. The first mounting hole 21h is open in the Z direction. The inner peripheral surface of the first mounting hole 21h of the connecting member 20N has a threaded groove. By engaging the fastening member 72, which passes through the mounting hole 13h of the terminal 13 of the electronic component 10N, with the first mounting hole 21h of the first portion 21, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10N.

[0084] (Part Two)

[0085] The second part 22 of the connecting component 20N is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second part 22 of the connecting member 20N is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20N has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h opens in the Z direction. In the second portion 22, the fastening member 43, described later, passes through the second mounting hole 22h. And, by engaging the engaging member 44 (e.g., a nut, see...) Figure 3 The second part 22 engages with the end of the fastening member 43 that passes through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42.

[0086] (Part Three)

[0087] The third part 23 is an upright wall (side wall) that rises from both ends of the second part 22 in the horizontal direction towards the +Z direction. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and to the second part 22. The third part 23 extends obliquely, for example, in a manner that widens in the X direction as it moves towards the -Z direction. Furthermore, the third part 23 may also be provided in the aforementioned connecting member 20M. On the other hand, the connecting member 20N may not have the third part 23.

[0088] <3.2 Connecting components for external connections>

[0089] Next, the connecting component 30 for external connection will be described.

[0090] Figure 7 This is a perspective view showing the connection member 30 for external connection. The connection member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connection member 30 connects the external connection busbar 76 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The external connection is electrically connected to the external device via busbar 76. In this disclosure, "external device" refers to an electrical device located outside the electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples. The connection component 30 may have, for example, a first portion 31, a second portion 32, and a third portion 33.

[0091] (Part 1)

[0092] The first part 31 is the portion connected to the external connection busbar 76. The first part 31 is a cuboid portion extending along the Z direction. The first part 31 is an erected portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first part 31 is adjacent to and connected to the external connection busbar 76 in the Z direction. The first part 31 has a first mounting hole 31h through which a fastening member 73 (e.g., a screw or bolt) passes. The first mounting hole 31h is open in the Z direction. The inner circumferential surface of the first mounting hole 31h has a threaded groove. By engaging the fastening member 73, which passes through the mounting hole 76h of the external connection busbar 76, with the first mounting hole 31h of the first part 31, the first part 31 is physically and electrically connected to the external connection busbar 76.

[0093] (Part Two)

[0094] Part 2, 32, is related to busbar 42 (see reference). Figure 8 The second part 32 protrudes horizontally (e.g., in the X direction) from the end of the first part 31 on the -Z direction side. The second part 32 is a plate portion along the horizontal direction. The second part 32 is adjacent to and connected to the busbar 42 in the Z direction. The second part 32 is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 42) protruding in the +Z direction from the busbar 42. Figure 8 The second part 32 is physically and electrically connected to the busbar 42. In this embodiment, the second part 32 has a second mounting hole 32h through which the fastening member 43 passes. The second mounting hole 32h opens in the Z direction. In the second part 32, the fastening member 43, described later, passes through the second mounting hole 32h. And, by engaging the locking member 44 (e.g., a nut, see...) Figure 3 The second part 32 engages with the end of the fastening member 43 that passes through the second mounting hole 32h, thereby fixing the second part 32 to the busbar 42.

[0095] (Part Three)

[0096] The third part 33 is an upright wall that rises from both ends of the second part 32 in the horizontal direction towards the +Z direction. The third part 33 is a wall along the Z direction. The third part 33 is connected to the first part 31 and to the second part 32. The third part 33 extends obliquely, for example, in a manner that widens in the X direction (or Y direction) as it moves towards the -Z direction. Alternatively, the connecting member 30 may not have the third part 33.

[0097] <3.3 Substrate for Wiring>

[0098] Next, the wiring substrate 40 will be described.

[0099] Figure 8 This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between an electronic component 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped," "sheet-shaped," or "plane" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction locally, or cases where there are uneven shapes on the surface that follow the thickness of the busbar, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0100] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and a plurality of fastening members 43. In this embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Furthermore, the wiring substrate 40 may also be formed by other structures instead of insert molding. A variation of the wiring substrate 40 formed by another structure will be described later.

[0101] Figure 9 This is a partially exploded perspective view of the wiring substrate 40. Hereinafter, for ease of explanation, the substrate 41, busbar 42, and fastening member 43 will be described with reference to the partially exploded view of the wiring substrate 40.

[0102] (Substrate board)

[0103] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 may also be referred to as an "insulating substrate". The substrate 41 has, for example, a planar portion 51 and a plurality of fixing portions 52. The fixing portions 52 will be described later.

[0104] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0105] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0106] The planar portion 51 may have one or more receiving portions 55, for example, each receiving a busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole penetrating the planar portion 51 in the Z direction. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction, rather than a through hole. It should also be noted that in this disclosure, "the receiving portion penetrating the planar portion in the first direction (Z direction)" may also include a portion of the total length of the receiving portion 55 penetrating the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole that penetrates the planar portion 51 in the Z direction, or it may be a form that is provided inside the base plate 41 and does not expose to the outside of the base plate 41).

[0107] Viewed from the Z direction, each receiving portion 55 has a shape corresponding to the shape of the received busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55. Receiving portion 55A is provided corresponding to busbar 42A (described later) and receives busbar 42A. Receiving portion 55B is provided corresponding to busbar 42B (described later) and receives busbar 42B. Receiving portion 55C is provided corresponding to busbar 42C (described later) and receives busbar 42C. Receiving portion 55D is provided corresponding to busbar 42D (described later) and receives busbar 42D. Receiving portion 55E is provided corresponding to busbar 42E (described later) and receives busbar 42E.

[0108] (Busbar)

[0109] Busbar 42 is a wiring component included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 can also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0110] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is housed in a housing portion 55 and extends along the planar portion 51 along its entire length. Hereinafter, the portion of each busbar 42 housed in the housing portion 55 and extending along the planar portion 51 is sometimes referred to as "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component".

[0111] Figure 10 This is a top view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 on its plate portion 42p.

[0112] The first connecting portion 61 is the portion that contacts a connecting member 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is a connecting member that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction and is connected to the first connecting member 20 from the Z direction.

[0113] The second connecting portion 62 is the portion that contacts other connecting members 20 (hereinafter referred to as "second connecting members 20"). The second connecting member 20 is a connecting member that connects other electronic components 10 (hereinafter referred to as "second electronic components 10") included in a plurality of electronic components 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction and is connected to the second connecting member 20 from the Z direction.

[0114] Alternatively, the second connecting portion 62 may be a portion that contacts other connecting members 30 (hereinafter referred to as "second connecting member 30") instead of the example described above. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 30 in the Z direction and is connected to the second connecting member 30 from the Z direction.

[0115] Alternatively, the second connecting portion 62 may be a portion that contacts the connecting busbar 75 for connecting to other subunits SU without contacting the connecting members 20 and 30. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to and connected to the connecting busbar 75 in the Z direction.

[0116] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0117] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51, at least covering the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0118] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing 55, extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extensions 63 extend in a straight line along the X direction. The extensions 63 extend through the region R that overlaps with the electronic component 10 when viewed from the Z direction, crossing the +X and -X direction sides of the region R. That is, since the busbars 42 are housed in the housing 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0119] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension portion 63. The extension portion 64 is a portion of the busbar 42 extended for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connecting portion 61 (or the second connecting portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10 when viewed from the Z direction.

[0120] The following describes several layout examples of busbar 42. Furthermore, the plurality of electronic components 10 includes three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B are, for example, first-type electronic components 10M. Electronic component 10C is, for example, second-type electronic components 10N. Moreover, the types of electronic components 10 are not limited to the examples described above. Additionally, the plurality of connecting components 20 includes six connecting components 20A, 20B, 20C, 20D, 20E, and 20F. The plurality of connecting components 30 includes two connecting components 30A and 30B. The plurality of connecting busbars 75 includes two connecting busbars 75A and 75B. The plurality of external connection busbars 76 includes two external connection busbars 76A and 76B.

[0121] (First deployment example)

[0122] First, a layout example related to busbar 42A will be described. Busbar 42A has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. When viewed from the Z direction, the first connecting portion 61 is located on the +X direction side relative to the electronic component 10A. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10A via a connecting member 20A, which serves as a first connecting member 20. When viewed from the Z direction, the second connecting portion 62 is located on the -X direction side relative to the electronic component 10A. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75A.

[0123] Since the extension 63 is housed in the housing 55, it extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction and across both sides of the region R. For example, the extension 63 extends in a straight line along the X direction. The extension 63 extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction, covering both the +X and -X direction sides of the region R. The busbar 42A is an example of a "busbar". The busbar 42A is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0124] (Second deployment example)

[0125] Next, an example of the arrangement related to busbar 42B will be described. Busbar 42B has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10A via a connecting member 20B, which is a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76A via a connecting member 30A, which is a second connecting member 30. When viewed from the Z direction, the extension portion 64 extends to the region R that overlaps with the electronic component 10A, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10A. Furthermore, busbar 42B may also have an extension portion 63 similar to busbar 42A, which extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. Busbar 42B is, for example, a busbar included in the positive line PL of the electrical connection unit 1.

[0126] (Third deployment example)

[0127] Next, a layout example related to busbar 42C will be described. Busbar 42C has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10B via a connecting member 20C, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75B. The extension portion 64 extends to a region R that overlaps with the electronic component 10B when viewed from the Z direction, and has an end portion 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10B when viewed from the Z direction.

[0128] (Fourth deployment example)

[0129] Next, a layout example related to busbar 42D will be described. Busbar 42D has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to terminal 13A of electronic component 10B via connecting member 20D, which serves as first connecting member 20. The second connecting portion 62 is electrically connected to terminal 13B of electronic component 10C via connecting member 20E, which serves as second connecting member 20.

[0130] (Fifth Layout Example)

[0131] Next, a layout example related to busbar 42E will be described. Busbar 42E has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10C via a connecting member 20F, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76B via a connecting member 30B, which serves as a second connecting member 30.

[0132] (Fastening components)

[0133] Next, refer to again Figure 9 The fastening component 43 will now be described. The fastening component 43 is a component used to secure the busbar 42 to a connecting component (connecting component 20, connecting component 30, or connecting busbar 75) of the busbar 42. The fastening component 43 is, for example, a riveting bolt fixed to the busbar 42.

[0134] In this embodiment, the first connecting portion 61 and the second connecting portion 62 of the busbar 42 each have a through hole 42h. The through hole 42h penetrates the busbar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head 43b. The circumferential surface of the shaft portion 43a has a threaded groove. The diameter of the head 43b is larger than the diameter of the shaft portion 43a. With the shaft portion 43a passing through the through hole 42h of the busbar 42, the head 43b of the fastening member 43 is riveted to the busbar 42. Through this fixation, with the shaft portion 43a protruding from the through hole 42h of the busbar 42 in the +Z direction, the fastening member 43 is electrically and physically connected to the busbar 42. Furthermore, the fastening member 43 is not limited to riveting; it can also be fixed to the busbar 42 by welding or other methods.

[0135] In this embodiment, the connecting member 20 is first fixed to the electronic component 10 by the fastening member 71 or the fastening member 72, and then mounted to the fastening member 43 in the Z direction. For example, the connecting member 20 is used to insert the shaft portion 43a of the fastening member 43 into the second mounting hole 22h of the second part 22. Then, the engaging member 44 (e.g., a nut) engages with the shaft portion 43a of the fastening member 43, which protrudes from the second mounting hole 22h of the second part 22 of the connecting member 20. The engaging member 44 is mounted to the shaft portion 43a, for example, along the Z direction. Through this engagement, the second part 22 of the connecting member 20 is fixed to the fastening member 43.

[0136] <4. Metal plates, insulating sheets, heat-conducting components, and insulating covers>

[0137] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0138] <4.1 Metal Plate>

[0139] Figure 11 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 may also be referred to as a "rigid component".

[0140] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the length of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0141] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 has a gap S1 (see reference) between it and the second surface 51b of the planar portion 51 of each sub-unit SU. Figure 13 ), and the second surface 51b of the planar portion 51 facing each subunit SU.

[0142] The fixing part 82 is used to fix the base plate 41 of each sub-unit SU to the metal plate 80. Viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss protruding from the flat portion 81 of the metal plate 80 in the +Z direction. The fixing part 82 will be described in detail later.

[0143] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction. The fixing part 83 will be described in detail later.

[0144] <4.2 Insulating Sheets>

[0145] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0146] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be provided between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above. Furthermore, if the heat-conducting components 92 are insulating and the necessary insulation is ensured by the heat-conducting components 92, the insulating sheet 91 may be omitted.

[0147] <4.3 Thermal Conductive Components>

[0148] The thermally conductive component 92 is a component used to transfer heat generated by the electronic component 10 when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 80. The thermally conductive component 92 is, for example, a flexible thermally conductive sheet (e.g., a thermally conductive silicone sheet). However, the thermally conductive component 92 is not limited to the above example and may also be a thermally conductive component formed of thermally conductive gel or other materials.

[0149] Figure 12 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of heat-conducting components 92 are partially disposed in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged near the electronic components 10 (e.g., electronic components 10A, 10B) at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0150] Figure 13 It is along Figure 10 The diagram shows a cross-sectional view along line F13-F13 of the structure. In this embodiment, a heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80.

[0151] In this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 via the busbar 42 from the connecting component 20 to the metal plate 80.

[0152] In this embodiment, a portion of the heat-conducting component 92 is positioned to overlap with and contact the head 43b of the fastening component 43 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0153] Furthermore, in this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 13 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0154] (Modified Example)

[0155] Figure 14 This is a cross-sectional view showing a modified example. In this modified example, a heat-conducting component 98 is provided between the busbar 42 and the electronic component 10. The heat-conducting component 98 is located between the busbar 42 and the electronic component 10 in the Z direction. The busbar 42 is thermally connected to the electronic component 10 via the heat-conducting component 98. The heat-conducting component 98 allows heat generated by the electronic component 10 to move towards the busbar 42. The heat-conducting component 98 is, for example, a flexible heat-conducting sheet (e.g., a thermally conductive silicone sheet). However, the heat-conducting component 98 is not limited to the above example and may also be a heat-conducting component formed of thermally conductive gel or other materials. According to this structure, the heat generated by the electronic component 10 moves efficiently towards the busbar 42 via the heat-conducting component 98. The heat that has moved to the busbar 42 is dissipated by moving towards the metal plate 80 via the heat-conducting component 92.

[0156] <4.4 Insulating Cover>

[0157] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to prevent the electrical path of the contact finger body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the electrical path of the body MU.

[0158] <5. Exposed Structure of Busbars>

[0159] Next, the exposed structure of the busbar 42 will be described.

[0160] <5.1 Exposed structure on the upper surface side of the busbar>

[0161] First, refer to Figure 8The exposed structure on the upper surface side of the busbar 42 will be described. In this embodiment, at least a portion of the busbar 42 is exposed to the outside of the base plate 41 on the upper surface side (the first surface 51a side of the planar portion 51). In this embodiment, the busbar 42 is housed in the housing portion 55 and extends along the first surface 51a of the planar portion 51, covering at least its entire length between the first connecting portion 61 and the second connecting portion 62. In this embodiment, the busbar 42 is housed in the housing portion 55 and extends along the first surface 51a of the planar portion 51, covering its entire length. The busbar 42 is exposed to the outside of the base plate 41 on the upper surface side, covering its entire length.

[0162] like Figure 13 As shown, at least a portion of the busbar 42, in addition to the upper surface side, also exposes to the outside of the substrate plate 41 on the lower surface side (second surface 51b side). For example, the busbar 42 exposes to the outside of the substrate plate 41 on the lower surface side along its entire length.

[0163] (Modified Example)

[0164] Figure 15 This is a cross-sectional view showing a modified example. In this modified example, the planar portion 51 of the base plate 41 has a cover 51v on the lower surface side (second surface 51b side) that covers at least a portion of the busbar 42. In the area covered by the cover 51v, the busbar 42 is not exposed on the lower surface side. The cover 51v may also be provided along the entire length of the busbar 42. In addition, when viewed from the Z direction, the cover 51v may, for example, not be provided in the area overlapping with the heat-conducting member 92.

[0165] <5.2 Exposed Structure on the Lower Surface Side of the Busbar>

[0166] Next, refer to Figure 13 The exposed structure on the lower surface side of the busbar 42 will be described. In this embodiment, the plate portion 42p of the busbar 42 includes a lower surface exposed portion 42u that exposes to the outside of the base plate 41 on the lower surface side (the second surface 51b side of the planar portion 51). In this embodiment, the lower surface exposed portion 42u of the busbar 42 extends along the entire length of the busbar 42. In this embodiment, a heat-conducting member 92 is disposed between the lower surface exposed portion 42u of the busbar 42 and the metal plate 80. For example, the heat-conducting member 92 is in contact with the lower surface exposed portion 42u of the busbar 42.

[0167] In this embodiment, at least a portion of the exposed lower surface portion 42u of the busbar 42 is disposed in the region that overlaps with the connecting member 20 when viewed from the Z direction. At least a portion of the heat-conducting member 92 overlaps with the exposed lower surface portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction. For example, at least a portion of the heat-conducting member 92 contacts the exposed lower surface portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction.

[0168] In this embodiment, the exposed portion 42u of the lower surface of the busbar 42 includes a first portion 42ua disposed in the region overlapping with the connecting member 20 when viewed from the Z direction and a second portion 42ub disposed in the region overlapping with the electronic component 10 when viewed from the Z direction.

[0169] The heat-conducting component 92 includes a first heat-conducting portion 92a and a second heat-conducting portion 92b. When viewed from the Z direction, the first heat-conducting portion 92a overlaps with the first portion 42ua of the exposed lower surface of the busbar 42 in the region where it overlaps with the connecting component 20. For example, the first heat-conducting portion 92a is in contact with the first portion 42ua of the exposed lower surface of the busbar 42. On the other hand, when viewed from the Z direction, the second heat-conducting portion 92b overlaps with the second portion 42ub of the exposed lower surface of the busbar 42 in the region where it overlaps with the electronic component 10. For example, the second heat-conducting portion 92b is in contact with the second portion 42ub of the exposed lower surface of the busbar 42.

[0170] Furthermore, as described above, a portion of the busbar 42 is exposed to the outside of the substrate plate 41 on both the lower and upper surfaces (first surface 51a side). For example, the entire length of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side. For example, the second portion 42ub of the lower surface exposed portion 42u of the busbar 42 is also exposed to the outside of the substrate plate 41 on both the lower and upper surfaces, facing the electronic component 10.

[0171] <6. Fixed Structure>

[0172] Next, the fixed structure of the subunit SU will be explained.

[0173] <6.1 Structure of Metal Plates>

[0174] Figure 16 It is along Figure 10 The structure shown is a cross-sectional view along line F16-F16. As described above, the metal plate 80 has a fixing part 82 and a fixing part 83.

[0175] The fixing part 82 is a boss that protrudes from the planar part 81 of the metal plate 80 in the +Z direction. The fixing part 82 protrudes further in the +Z direction than, for example, the first surface 51a of the planar part 51 of the base plate 41. In this embodiment, the fixing part 82 protrudes further in the +Z direction than the fixing part 83 described later. The fixing part 82 faces the fixing part 52 of the base plate 41 in the Z direction. The fixing part 82 has a locking hole 82h that opens in the +Z direction. The inner circumferential surface of the locking hole 82h has a threaded groove.

[0176] The fixing part 83 is a boss protruding from the planar part 81 in the +Z direction. The fixing part 83 is inserted into the through hole 51h of the planar part 51 of the base plate 41 (described later). The fixing part 83 protrudes through the through hole 51h of the planar part 51 to a position at the same level as the first surface 51a of the planar part 51, or to a position beyond the first surface 51a of the planar part 51 (a position on the +Z direction side compared to the first surface 51a). The fixing part 83 faces the mounting part 14 of the electronic component 10 in the Z direction. The fixing part 83 has a locking hole 83h that opens in the +Z direction. The inner peripheral surface of the locking hole 83h has a threaded groove.

[0177] Fastening member 112 (e.g., screw or bolt) passes through mounting hole 14h of mounting portion 14 of electronic component 10 from the +Z direction side. When fastening member 112 passing through mounting hole 14h of mounting portion 14 of electronic component 10 engages with engagement hole 83h of fixing portion 83 of metal plate 80, electronic component 10 is fixed to metal plate 80 without passing through base plate 41.

[0178] <6.2 Structure of the substrate for wiring>

[0179] The base plate 41 has a fixing part 52 that is fixed to the fixing part 82 of the metal plate 80. The fixing part 52 has, for example, an upright plate part 52a and a horizontal plate part 52b.

[0180] The upright plate portion 52a rises from the end of the flat portion 51 of the base plate 41 toward the +Z direction. The upright plate portion 52a is a plate portion along the Y and Z directions. The thickness direction of the upright plate portion 52a is the X direction.

[0181] The horizontal plate portion 52b extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is a plate portion along the horizontal direction. The horizontal plate portion 52b faces the fixing portion 82 of the metal plate 80 in the Z direction. The horizontal plate portion 52b has an insertion hole 52h for the engaging hole 82h facing the fixing portion 82 of the metal plate 80. A fastening member 111 (e.g., a screw or bolt) passes through the insertion hole 52h. When the fastening member 111, passing through the insertion hole 52h of the fixing portion 52 of the base plate 41, engages with the engaging hole 82h of the fixing portion 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80.

[0182] Furthermore, the planar portion 51 of the substrate 41 has the aforementioned through hole 51h. The through hole 51h penetrates the planar portion 51 in the Z direction. When viewed from the Z direction, the through hole 51h is located at a position corresponding to the fixing portion 83 of the metal plate 80. The fixing portion 83 of the metal plate 80 protrudes through the through hole 51h of the substrate 41 to a position at the same level as the first surface 51a of the planar portion 51, or at a position closer to the +Z direction side than the first surface 51a of the planar portion 51. The mounting portion 14 of the electronic component 10 is fixed to the fixing portion 83 at a position at the same level as the first surface 51a of the planar portion 51, or at a position closer to the +Z direction side than the first surface 51a of the planar portion 51.

[0183] <7. Structure of Connecting Components>

[0184] Next, the structure related to the connecting component 20 will be described.

[0185] Figure 17 This is a cross-sectional view illustrating the structure related to the connecting member 20. In this embodiment, the connecting member 20 (e.g., connecting member 20M and connecting member 20N) is a heat storage member (heat absorption member) that increases the heat capacity of the energized path of the electrical connection unit 1. The connecting member 20, for example, stores (absorbs) at least a portion of the heat emitted by the electronic component 10. Alternatively / otherwise, the metal component 20 may also store (absorb) at least a portion of the heat emitted by the busbar 42 itself through energization. The connecting member 20 may also be referred to as a "heat storage member" or a "heat absorption member".

[0186] In this embodiment, the busbar 42 is positioned away from the terminal 13 of the electronic component 10 (e.g., away in the Z direction). The connecting member 20 is positioned between the electronic component 10 and the busbar 42. In this invention, "the connecting member is positioned between the electronic component and the busbar" is not limited to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting member is positioned between the electronic component and the busbar" can also be equivalent to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from a direction inclined relative to the X or Y direction. The connecting member 20 electrically connects the terminal 13 of the electronic component 10 to the busbar 42.

[0187] In this embodiment, the thickness of at least a portion of the connecting member 20 is greater than the thickness (Z-direction thickness) T3 of the busbar 42. For example, the thickness T1 in the X-direction of at least a portion of the connecting member 20 is greater than the thickness T3 of the busbar 42. In this embodiment, the thickness T1 in the X-direction of the first portion 21 of the connecting member 20 is greater than the thickness T3 of the busbar 42. In this embodiment, the first portion 21 has a thickness T1 in the X-direction that is greater than the thickness T3 of the busbar 42 along its entire Z-direction length. The thickness T1 in the X-direction of the first portion 21 of the connecting member 20 is, for example, more than twice the thickness T3 of the busbar 42. Alternatively, in other views, the thickness T2 in the Z-direction of the second portion 22 of the connecting member 20 may also be greater than the thickness T3 of the busbar 42.

[0188] In this embodiment, the thickness T1 in the X direction of the first portion 21 of the connecting member 20 is greater than the thickness T2 in the Z direction of the second portion 22 of the connecting member 20. In this embodiment, the first portion 21 has a thickness T1 in the X direction that is greater than the thickness T2 in the Z direction of the second portion 22, which is the thickness of the first portion 21 extending along its entire length in the Z direction.

[0189] Furthermore, the aforementioned dimensional relationships also apply to the connecting member 30 for connecting the external busbar 76 and / or the connecting member 100 for connecting the busbar 75. For example, regarding the description of the connecting member 30, in the above description of the connecting member 20, simply replace "connecting member 20" with "connecting member 30", "first part 21" with "first part 31", and "second part 22" with "second part 32". Similarly, regarding the description of the connecting member 100, in the above description of the connecting member 20, simply replace "connecting member 20" with "connecting member 100", "first part 21" with "first part 101", and "second part 22" with "second part 102".

[0190] <8. Positional Relationship of Busbars, Electronic Components, and Connecting Components>

[0191] Next, the positional relationship between busbar 42A, electronic component 10A, and connecting components 20A and 20B will be explained.

[0192] Figure 18 yes Figure 10A magnified view of a portion. Electronic component 10A is an example of an "electronic component". A pair of connecting components 20A and 20B are connected to electronic component 10A. The pair of connecting components 20A and 20B are adjacent to electronic component 10A in the X direction. The pair of connecting components 20A and 20B are arranged in the +X direction of electronic component 10A. Connecting component 20A is an example of a "connecting component". Connecting component 20B is an example of a "other connecting component". Connecting components 20A and 20B are arranged relative to each other in the Y direction. Connecting component 20B is arranged in the +Y direction (second side) of connecting component 20A. When viewed from the Z direction, connecting component 20A protrudes in the -Y direction beyond the housing 11 of electronic component 10A. However, the housing 11 of electronic component 10A may also protrude in the -Y direction beyond connecting component 20A when viewed from the Z direction.

[0193] Busbar 42A is connected to connector 20A. Busbar 42A is electrically connected to electronic component 10A via connector 20A. Busbar 42A has a connecting region 65 and an adjacent region 66. The connecting region 65 is positioned in the X direction the same as that of connector 20A, and the adjacent region 66 is continuous with the connecting region 65 in the X direction on the side of electronic component 10A (-X direction).

[0194] The connection region 65 is the portion of the busbar 42A located in the X direction within the area where the connection member 20A is disposed. The connection region 65 includes a first connection portion 61. The connection region 65 extends in the X direction. The connection region 65 has a constant width in the Y direction. The two end edges of the connection region 65 in the Y direction extend linearly in the X direction. The width of the connection region 65 in the Y direction is less than the width of the connection member 20A in the Y direction. The center C1 of the connection region 65 in the Y direction is offset in the -Y direction relative to the center C2 of the connection member 20A in the Y direction. The -Y direction is the direction in the Y direction away from the center of the electronic component 10A, based on the center C2 of the connection member 20A in the Y direction. For example, the center C2 of the connection member 20A in the Y direction is the center of the second portion 22 of the connection member 20A in the Y direction. The connection member 20A extends in the +Y direction beyond the connection region 65 when viewed from the Z direction.

[0195] The adjacent region 66 is a portion of the busbar 42A that is continuous with the connecting region 65 and located in the X direction within the area where the electronic component 10A is disposed. The adjacent region 66 is part of the extension 63. The adjacent region 66 extends from the connecting region 65 in the -X direction. The adjacent region 66 has a shape that extends the connecting region 65 in the -X direction. At least the end of the adjacent region 66 on the connecting region 65 side has a constant width in the Y direction. In the illustrated example, the adjacent region 66, when viewed from the Z direction, bends at the midpoint in the X direction such that the center of its width is offset in the Y direction. Alternatively, the adjacent region 66 may extend in such a way that its width in the Y direction varies at the midpoint in the X direction. Alternatively, the adjacent region 66 may extend along the Y direction with a constant width throughout its entire length in the X direction. A portion of the adjacent region 66 overlaps with the electronic component 10A when viewed from the Z direction. The adjacent region 66, when viewed from the Z direction, overlaps with the electronic component 10A throughout its entire length in the X direction. It should be noted that the adjacent region 66 can also be defined as the range in the busbar 42A that is continuous with the connecting region 65 and has the first exposed portion 65a (described later) formed in the X direction.

[0196] Busbar 42A has an exposed portion 67 that exposes space in the Y direction (first side) of at least one of the electronic component 10A and the connecting component 20A. The exposed portion 67 includes a first exposed portion 65a formed in the connecting region 65 and a second exposed portion 66a formed in the adjacent region 66.

[0197] The first exposed portion 65a is exposed in the space of the connecting member 20A in the -Y direction. When viewed from the Z direction, the first exposed portion 65a extends beyond the connecting member 20A in the -Y direction. When viewed from the Z direction, the first exposed portion 65a is formed throughout the entire length of the connecting region 65 in the X direction. The end edge of the first exposed portion 65a in the -Y direction is the end edge of the connecting region 65 in the -Y direction. The end edge of the first exposed portion 65a in the -Y direction extends along the X direction when viewed from the Z direction.

[0198] The second exposed portion 66a is exposed in the space of the electronic component 10A in the -Y direction. When viewed from the Z direction, the second exposed portion 66a extends further into the -Y direction than the electronic component 10A. When viewed from the Z direction, the second exposed portion 66a is formed over the entire length of the adjacent region 66 in the X direction. The end edge of the second exposed portion 66a in the -Y direction is the end edge of the adjacent region 66 in the -Y direction. The second exposed portion 66a is continuous with the first exposed portion 65a. At least one end edge of the second exposed portion 66a in the -Y direction on the side of the first exposed portion 65a extends in the X direction when viewed from the Z direction by extending the end edge of the first exposed portion 65a in the -Y direction. Alternatively, the end edge of the second exposed portion 66a in the -Y direction may extend over its entire length in the X direction.

[0199] As a comparative example, consider a structure in which the center of the connection region of the busbar in the Y direction is not offset in the -Y direction relative to the center C2 of the connection member 20A in the Y direction. In the comparative example structure, when viewed from the Z direction, the area of ​​the portion of the connection region of the busbar extending from the connection member 20A in the -Y direction is smaller than that in the embodiment. Furthermore, in the comparative example structure, when viewed from the Z direction, the area of ​​the portion of the adjacent region of the busbar extending from the electronic component 10A in the -Y direction is smaller than that in the embodiment. In such a comparative example structure, it is sometimes impossible to sufficiently ensure the area of ​​the exposed portion of the busbar used for heat dissipation, making it difficult to improve the heat dissipation of the electrical connection unit.

[0200] In this embodiment, the center of the connection region 65 in the Y direction is offset in the -Y direction relative to the center of the connection member 20A in the Y direction. With this structure, it is easy to increase the area of ​​the exposed portion 67. Therefore, when the exposed portion 67 functions as a heat dissipation portion, the heat dissipation performance of the electrical connection unit 1 can be improved.

[0201] Busbar 42A is housed in housing portion 55A of substrate plate 41. Exposed portion 67 is exposed from housing portion 55A. With this structure, the wiring path is held in a plane by substrate plate 41, thus enabling the electrical connection unit 1 to be made thinner.

[0202] The exposed portion 67 has a first exposed portion 65a, which is formed in the connection region 65 in the busbar 42A at the same position as the connecting member 20A in the X direction. With this structure, the first exposed portion 65a can easily function as a heat dissipation portion that moves heat away from the connecting member 20A. In this case, the heat dissipation performance of the electrical connection unit 1 can be improved.

[0203] The exposed portion 67 has a second exposed portion 66a, which is formed in an adjacent region 66 of the busbar 42A that is continuous with the connection region 65 on the side of the electronic component 10A. The second exposed portion 66a is exposed in the space of the electronic component 10A in the -Y direction. With this structure, the second exposed portion 66a can easily function as a heat dissipation part to move heat from the electronic component 10A or the connection region 65. In this case, the heat dissipation performance of the electrical connection unit 1 can be improved.

[0204] Furthermore, the adjacent region 66 is in contact with the electronic component 10A. This structure allows heat to move directly from the electronic component 10A to the adjacent region 66. Therefore, the busbar 42A can efficiently dissipate heat from the electronic component 10A from the second exposed portion 66a.

[0205] The electrical connection unit 1 also includes a connecting member 20B disposed in the +Y direction of the connecting member 20A and connected to the electronic component 10A. With this structure, the exposed portion 67, when viewed from the Z direction, is formed on the opposite side of the connecting member 20B across the connecting member 20A, thus heat dissipation from the exposed portion 67 is less likely to be obstructed by the connecting member 20B. Therefore, the heat dissipation performance of the electrical connection unit 1 can be further improved.

[0206] <15. Variations>

[0207] Next, several variations will be described. Furthermore, in each variation, the structure except as described below is the same as that of the first embodiment.

[0208] (First variation)

[0209] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0210] (Second variation)

[0211] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42. It should be noted that in the present invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0212] (Third variation)

[0213] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged such that multiple busbars 42 arranged horizontally are sandwiched between, for example, both sides in the Z direction. For example, the multiple components may be integrally formed by sandwiching the multiple busbars 42 together through lamination. The multiple components form a planar portion 51. In this case, a receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. A sheet component may, for example, be a flexible sheet component. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42. For example, in this case, the receiving portion 55 formed between the multiple components is equivalent to an example of a "receiving portion recessed in the first direction (Z direction)".

[0214] (Fourth variation)

[0215] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0216] In the above embodiments, the present invention is applied to electronic component 10A, which is an electronic component 10M of the first type, and to connection component 20A, which is a connection component 20M of the first type. However, the present invention can also be applied to other types of electronic components and connection components.

[0217] In the above embodiment, the exposed portion 67 of the busbar 42A has a first exposed portion 65a and a second exposed portion 66a. However, the exposed portion of the busbar may also have only one of the first exposed portion and the second exposed portion.

[0218] In the above embodiment, the width of the connecting region 65 in the Y direction is less than or equal to the width of the connecting member 20A in the Y direction. However, the width of the connecting region in the Y direction may also be greater than the width of the connecting member 20A in the Y direction.

[0219] In the above embodiment, the connecting member 20A extends beyond the connecting region 65 in the +Y direction when viewed from the Z direction. However, the connecting region may also extend beyond the connecting member 20A in the +Y direction when viewed from the Z direction.

[0220] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0221] [Potential for Industrial Applications]

[0222] According to the present invention, the heat dissipation of the electrical connection unit can be improved.

Claims

1. An electrical connection unit, characterized in that, have: Electronic components; A connecting component, which is adjacent to and connected to the electronic component in a first direction; as well as A busbar, which overlaps with the connecting member when viewed from a second direction orthogonal to the first direction, and is electrically connected to the electronic component via the connecting member. The busbar has a connecting area, and the position of the connecting area in the first direction is the same as that of the connecting component. The center of the third direction of the connecting region is offset relative to the center of the third direction of the connecting component towards a first side in the third direction, and the third direction is orthogonal to the first direction and the second direction. The busbar has an exposed portion that is exposed in the space on the first side of at least one of the electronic components and the connecting components.

2. The electrical connection unit according to claim 1, characterized in that, The electrical connection unit also includes an insulating base component, which comprises a plate-like or sheet-like planar portion having a first surface facing the electronic component and a second surface located on the side opposite to the first surface. The planar portion has a receiving portion, which is recessed in the second direction or extends through the planar portion in the second direction. The receiving portion receives at least a portion of the busbar, including the connecting region. The exposed portion is exposed from the receiving portion into the space on the first side of at least one of the electronic component and the connecting component.

3. The electrical connection unit according to claim 1 or 2, characterized in that, The exposed portion has a first exposed portion, which is formed in the connection area and exposed in the space on the first side of the connection member.

4. The electrical connection unit according to claim 1 or 2, characterized in that, The busbar has adjacent regions that are continuous with the connecting region on the electronic component side in the first direction. A portion of the adjacent region overlaps with the electronic component when viewed from the second direction, and The exposed portion has a second exposed portion, which is formed in the adjacent region and exposed in the space on the first side of the electronic component.

5. The electrical connection unit according to claim 4, characterized in that, The adjacent areas are in direct contact with the electronic components or via thermally conductive components.

6. The electrical connection unit according to claim 1 or 2, characterized in that, The electrical connection unit also includes other connection components that are adjacent to the electronic component in the first direction and are disposed on the second side of the third direction of the connection component and connected to the electronic component.

7. The electrical connection unit according to claim 1 or 2, characterized in that, When viewed from the second direction, the connecting member extends to the second side of the third direction beyond the connecting area.

8. The electrical connection unit according to claim 1 or 2, characterized in that, The width of the third direction of the connection area is less than or equal to the width of the third direction of the connection component.

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