Electrical connection unit

Abstract

The electrical connection unit has a plurality of circuit structures and a support member that supports the plurality of circuit structures. Each circuit structure has: a plurality of electronic components; a bus bar that electrically connects the plurality of electronic components; and an insulating base member that holds the bus bar. When the direction in which the plurality of electronic components face the base member is set as a first direction, each base member has an opposing region that opposes the plurality of electronic components when viewed from the first direction. The fixing member is fixed to the support member by a plurality of fixing portions disposed separately so as to surround the outside of the facing region when viewed from the first direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, improvements in thermal properties are expected for electrical connection units.

[0008] One implementation provides an electrical connection unit capable of improving thermal properties.

[0009] Technical means for solving problems

[0010] One embodiment of the electrical connection unit includes a plurality of circuit structures and a support member supporting the plurality of circuit structures. Each circuit structure includes: a plurality of electronic components; a busbar that electrically connects the plurality of electronic components; and an insulating base member that holds the busbar. When the direction in which the plurality of electronic components are opposed to the base member is set as a first direction, each base member has an opposing region that is opposed to the plurality of electronic components when viewed from the first direction, and is fixed to the support member by a plurality of fixing portions separately arranged to surround the outer side of the opposing region when viewed from the first direction.

[0011] Invention Effects

[0012] According to one implementation, the thermal characteristics of the electrical connection unit can be improved. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the embodiment.

[0014] Figure 2 This is a perspective view of the main body used to illustrate the implementation method.

[0015] Figure 3 This is a perspective view of a subunit used to illustrate the implementation method.

[0016] Figure 4 This is a perspective view showing a partial decomposition of the sub-units of the implementation method.

[0017] Figure 5 This is a perspective view showing the wiring substrate according to the embodiment.

[0018] Figure 6 This is a perspective view showing a partial exploded view of the wiring substrate of the embodiment.

[0019] Figure 7 This is a top view showing the wiring substrate of the embodiment.

[0020] Figure 8 This is a perspective view showing a partial disassembly of the connection unit in the embodiment.

[0021] Figure 9 This is a bottom view showing the wiring substrate of the embodiment.

[0022] Figure 10 For along Figure 7 A cross-sectional view of the structure shown along line AA;

[0023] Figure 11 For along Figure 7 A cross-sectional view of the structure shown along the BB line;

[0024] Figure 12 This is a cross-sectional view used to illustrate the heat dissipation path associated with the fixing part in the embodiment.

[0025] Figure 13 This is a cross-sectional view illustrating the heat dissipation path of a modified embodiment.

[0026] Figure 14 This is a cross-sectional view used to illustrate the thermal expansion / contraction absorption structure associated with the fixing part in the embodiment.

[0027] Figure 15 This is a cross-sectional view illustrating the function of the absorption structure described above in the embodiment.

[0028] Explanation of reference numerals in the attached figures

[0029] 1 Electrical connection unit

[0030] 10 Electronic components

[0031] 40. Wiring substrate (mounted component)

[0032] 41 Base plate (substrate components, resin components)

[0033] 42. Busbar

[0034] 51. Planar section

[0035] 51c upper surface (component mounting surface, base surface)

[0036] 51d component mounting area

[0037] 52 Fixing Part (Three-Dimensional Structure Part)

[0038] 52a Erecting board section

[0039] 52b upper plate part

[0040] 80 Metal Plate (Support Components, Metal Parts)

[0041] 81 Planar Section

[0042] 81a Upper surface (support surface)

[0043] 82 Fixing part (boss)

[0044] SU, SUX, SUY, SUZ sub-units (circuit structures) Detailed Implementation

[0045] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0046] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Orientation" refers to the overlapping of imaginary projections of two objects when viewed from a specific direction. That is, "orientation" is not limited to the case where two objects are directly facing each other, but may also include the case where two objects are facing each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0047] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 8 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 8 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1 The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction".

[0048] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0049] (Implementation Method)

[0050] <1. Structure of the electrical connection unit>

[0051] Figure 1 This is a cross-sectional view illustrating the electrical connection unit 1 according to an embodiment. The electrical connection unit 1 is, for example, an on-board device mounted in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0052] Electrical connection unit 1, for example, includes a main body MU, a metal plate (supporting component, metal component) 80, and an insulating sheet 91 (see reference). Figure 8 ), multiple heat transfer components 92 and an insulating cover 93.

[0053] <2. Main Body>

[0054] First, let's explain the main body MU.

[0055] Figure 2This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has three sub-units SU (sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure". One of the circuit structures SUX, SUY, and SUZ is an example of a "first circuit structure". The other of the circuit structures SUX, SUY, and SUZ is an example of a "second circuit structure". Each sub-unit SU is formed by the upper surface 81a of the planar portion 81 of the metal plate 80 (refer to...). Figure 8 Support. The upper surface 81a of the planar part 81 becomes the support surface for supporting the three sub-units SU via the fixing parts 52 and 82 described later.

[0056] The subunit SUX has a primary electrical function. The subunit SUX includes, for example, multiple electronic components 10X and a first wiring substrate (mounting component) 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X. The planar portion 51 of the first wiring substrate 40X is arranged along (parallel to) the upper surface 81a of the planar portion 81 of the metal plate 80. The upper surface 51c of the planar portion 51 of the first wiring substrate 40X (the side opposite to the metal plate 80, see reference 1) Figure 8 This serves as a component mounting surface for mounting multiple electronic components 10X. In this invention, "mounting" is not limited to the case where the electronic components 10 are directly fixed; it also includes cases where the electronic components 10 are fixed via other components (e.g., connecting component 20). The component mounting surface is an example of a "base surface." The upper surface 51c (component mounting surface, base surface) of the first wiring substrate 40X is formed, for example, by the first surface 51a of the planar portion 51 of the base plate 41 (described later) and the upper surface of the busbar 42. A circuit component mounting area 51d for mounting multiple electronic components 10X is formed on the component mounting surface (see reference). Figure 7 When viewed from the Z direction, the circuit component mounting area 51d is the portion opposite to multiple electronic components 10X. The circuit component mounting area 51d is an example of an "opposite area".

[0057] Viewed from above in the normal direction (Z direction) of regions 51c and 81a of each planar portion 51 and 81, the circuit component mounting region 51d is, for example, a rectangle slightly smaller than the rectangular planar portion 51. The circuit component mounting region 51d is rectangular. At each of the four corners (top) of the rectangular circuit component mounting region 51d, a fixing part 52 for fixing the subunit SUX to the metal plate 80 is provided. Viewed from the Z direction, each fixing part 52 is arranged to surround the outer side of the circuit component mounting region 51d.

[0058] The subunit SUY has a second electrical function. This second function is different from the first function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate (mounting component) 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y. The planar portion 51 of the second wiring substrate 40Y is arranged along (parallel to) the upper surface 81a of the planar portion 81 of the metal plate 80. The region 51c of the second wiring substrate 40Y (the side opposite to the metal plate 80) becomes the component mounting surface for mounting the multiple electronic components 10Y. The region 51c (component mounting surface, base surface) of the second wiring substrate 40Y is formed, for example, by the first surface 51a of the planar portion 51 of the base plate 41 (described later) and the upper surface of the busbar 42. A circuit component mounting region 51d for mounting the multiple electronic components 10Y is formed on the component mounting surface. When viewed from the Z direction, the circuit component mounting region 51d is the portion opposite to the multiple electronic components 10Y. The circuit component mounting area 51d is an example of an "opposite area".

[0059] Viewed from above in the normal direction (Z direction) of regions 51c and 81a of each planar portion 51 and 81, the circuit component mounting region 51d is rectangular, slightly smaller than the rectangular planar portion 51. The circuit component mounting region 51d is rectangular. At each of the four corners (top) of the rectangular circuit component mounting region 51d, a fixing part 52 is provided for fixing the subunit SUY to the metal plate 80. Viewed from the Z direction, each fixing part 52 is arranged to surround the outer side of the circuit component mounting region 51d.

[0060] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate (mounting component) 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z. The planar portion 51 of the third wiring substrate 40Z is arranged along (parallel to) the upper surface 81a of the planar portion 81 of the metal plate 80. The region 51c of the third wiring substrate 40Z (the side opposite to the metal plate 80) becomes the component mounting surface for mounting the multiple electronic components 10Z. The region 51c (component mounting surface, base surface) of the third wiring substrate 40Z is formed, for example, by the first surface 51a of the planar portion 51 of the base plate 41 (described later) and the upper surface of the busbar 42. A circuit component mounting region 51d for mounting the multiple electronic components 10Z is formed on the component mounting surface. When viewed from the Z direction, the circuit component mounting region 51d is the portion opposite to the multiple electronic components 10Z. The circuit component mounting area 51d is an example of an "opposite area".

[0061] Viewed from above along the normal direction of regions 51c and 81a of each planar portion 51 and 81, the circuit component mounting region 51d is rectangular, slightly smaller than the rectangular planar portion 51. The circuit component mounting region 51d is rectangular. At each of the four corners (top) of the rectangular circuit component mounting region 51d, a fixing part 52 for fixing the subunit SUZ to the metal plate 80 is provided. Viewed from the normal direction of regions 51c and 81a of each planar portion 51 and 81, each fixing part 52 is arranged to surround the outer side of the circuit component mounting region 51d.

[0062] In this embodiment, the three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is positioned relative to sub-unit SUY on the +X direction side. Sub-units SUX and SUY are electrically connected via a plurality of connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is positioned relative to sub-unit SUY on the -X direction side. Sub-units SUZ and SUY are electrically connected via a plurality of connecting busbars 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y. The connecting busbars 75 are positioned relative to the plurality of sub-units SU on the side opposite to the metal plate 80.

[0063] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0064] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one subunit SU. Hereinafter, without distinguishing between the subunit SUX, subunit SUY, and subunit SUZ, they will be simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Additionally, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40".

[0065] Furthermore, instead of the above example, the main body MU may not be divided into multiple sub-units SU. That is, the main body MU may be formed from multiple electronic components 10 and a wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU with different functions, but may also be sub-units SU with the same function.

[0066] In this embodiment, for example, multiple sub-units (circuit structures) SU with different heating timings (heating periods) are used. For example, when the vehicle equipped with the electrical connection unit 1 is in motion (during discharge), circuit structures SUX and SUY heat up. On the other hand, when the vehicle is charging, circuit structure SUZ heats up.

[0067] The synthetic resin portion (wiring substrate 40) that expands due to the heat generated by the circuit structures SUX and SUY during vehicle operation is fixed to the metal plate 80 around the circuit structures SUX and SUY. Therefore, the expansion / warping of the synthetic resin portion of the circuit structures SUX and SUY is suppressed as thermal stress acting on the synthetic resin portion of the circuit structure SUZ.

[0068] On the other hand, the synthetic resin portion (wiring substrate 40) that expands due to the heat emitted by the circuit structure SUZ during vehicle charging is fixed to the metal plate 80 around the circuit substrate SUZ. Therefore, the expansion / warping of the circuit structure SUZ is suppressed as thermal stress acting on the synthetic resin portion of the circuit structures SUX and SUY.

[0069] The above results indicate that the number of times thermal stress is applied to the synthetic resin parts of each circuit structure SU can be reduced, thereby improving the lifespan of each synthetic resin part.

[0070] In addition, the multiple circuit structures 40 with different heating timings can also be circuit structures for switching charging voltages (400V / 800V).

[0071] <3. Structure of Subunits>

[0072] Next, the structure of the subunit SU will be explained.

[0073] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 This is a perspective view showing a portion of a subunit SU exploded. The subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, and a wiring substrate 40. The connecting components 20 and 30 are components that form vertical power paths. The connecting components 20 and 30 can also be referred to as "vertical wiring components."

[0074] <3.1 Electronic components and connecting components for connecting components>

[0075] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0076] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Hereinafter, examples of electronic component 10 will be described, including a first type of electronic component 10M and a second type of electronic component 10N.

[0077] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 may also be referred to as a "metal component". Hereinafter, examples of the connecting member 20 will be described, including a first type of connecting member 20M and a second type of connecting member 20N.

[0078] <3.1.1 Type 1 Electronic Components>

[0079] The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged at one end. For example, the electronic component 10M has a cuboid-shaped main body 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0080] (Main body of the component)

[0081] The main body 12 is the part that performs the main functions of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, if the electronic component 10M is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body 12 includes a part that stores charge.

[0082] The main body 12 houses structural components within a large portion of the outer contour (housing) that forms the outer shape of the electronic component 10M. The housing is, for example, made of synthetic resin and is insulating. The main body 12 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, plate-shaped along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the main body 12 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates the terminals 13A and 13B from each other. In this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting components 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates the first portions 21 of the two connecting components 20M connected to the electronic component 10M from each other.

[0083] (terminal)

[0084] Terminal 13 is an electrical connection portion exposed to the outside of the main body 12 of the component. Terminal 13 is electrically connected to structural components inside the housing. In this embodiment, the electronic component 10M includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a terminal on the positive side. The other of terminals 13A and 13B is a terminal on the negative side.

[0085] In this embodiment, terminals 13A and 13B are disposed at one end of the electronic component 10M in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole (not shown) for mounting a fastening member 71 (e.g., a screw or bolt) as described later. The mounting hole of each terminal 13 is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole of each terminal 13 has a threaded groove.

[0086] (Installation Department)

[0087] Mounting section 14 is a part used to fix electronic component 10M. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 8 The mounting hole (not shown in the attached drawing) is for installation. The mounting hole is open in the Z direction. The mounting hole is a through hole through which the fastening member 112 passes. The fixing destination of the mounting part 14 will be described later.

[0088] <3.1.2 First type of connecting component>

[0089] The first type of connecting member 20M is a member that electrically connects the first type of electronic component 10M to the wiring substrate 40. In this embodiment, the connecting member 20M connects the electronic component 10M to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 5 Electrical connection. The connection component 20M, for example, has a first portion 21 erected above the wiring substrate 40 and a second portion 22 disposed along the wiring substrate 40.

[0090] (Part 1)

[0091] The first portion 21 of the connecting member 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid portion extending along the Z-direction. The first portion 21 extends along one end of the electronic component 10M (e.g., the end in the X-direction). The first portion 21 is an erected portion in the Z-direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X-direction). For example, the first portion 21 is adjacent to and connected to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X-direction). The first portion 21 of the connecting member 20M is physically and electrically connected to the terminal 13 of the electronic component 10M by inserting a fastening member 71 (e.g., a screw or bolt) through a mounting hole (not shown) and screwing the fastening member into the mounting hole of the terminal 13 of the electronic component 10M.

[0092] (Part Two)

[0093] The second part 22 of the connecting component 20M is connected to the busbar 42 (see reference). Figure 5 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to (overlaps with) the busbar 42 in the Z direction and is connected to the busbar 42 from the Z direction. The second part 22 provides fastening components 43 (e.g., screws or bolts, see reference) that protrude from the busbar 42 in the +Z direction. Figure 5 ) through. By engaging component 44 (e.g., nut, see Figure 3 The screw is screwed into the fastening component 43 that penetrates the second part 22, thereby physically and electrically connecting it to the busbar 42.

[0094] In this embodiment, a connecting component 20M is formed in an L-shape by the first part 21 and the second part 22.

[0095] <3.1.3 Second Type of Electronic Components>

[0096] The second type of electronic component 10N is an electronic component in which two terminals 13 are separately disposed at both ends in the horizontal direction. The electronic component 10N, for example, has a main body 12 and a plurality of terminals 13. Furthermore, in the structure of the electronic component 10N, structures having the same function as electronic component 10M are labeled with the same reference numerals. In this case, for the description of electronic component 10N, "electronic component 10M" in the above description of electronic component 10M will be replaced with "electronic component 10N".

[0097] In electronic component 10N, terminals 13A and 13B are separately disposed at both ends of electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole (not shown) for mounting a fastening member 72 (e.g., a screw or bolt) as described later. The mounting hole of each terminal 13 opens in the Z direction. For example, the mounting hole of each terminal 13 is a through hole through which the fastening member 72 passes.

[0098] <3.1.4 Second Type of Connecting Components>

[0099] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N to the wiring substrate 40. In this embodiment, the connection member 20N connects the electronic component 10N to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 5 Electrical connection. The connecting component 20N has, for example, a first part 21, a second part 22, and a third part 23.

[0100] (Part 1)

[0101] The first portion 21 of the connecting member 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a cuboid portion extending along the Z direction. The first portion 21 is an erected portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 21 is adjacent to (overlaps with) the terminal 13 of the electronic component 10N in the Z direction and connects to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting member 20N has a mounting hole (not shown) for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole of the connecting member 20N opens upwards and has a threaded groove on its inner circumferential surface. The terminal 13 of the electronic component 10N is physically and electrically connected to the terminal 13 of the electronic component 10N by passing the fastening member 72 through it and screwing the fastening member into the mounting hole of the connecting member 20N.

[0102] (Part Two)

[0103] The second part 22 of the connecting component 20N is connected to the busbar 42 (see reference). Figure 5The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to (overlaps with) the busbar 42 in the Z direction and is connected to the busbar 42 from the Z direction. The second part 22 is connected by a fastening member 43 (e.g., a screw or bolt, see reference 42) that protrudes from the busbar 42 in the +Z direction. Figure 5 ) through, and engage the locking component 44 (e.g., nut, see Figure 3 The screw is screwed into the fastening component 43, thereby physically and electrically connecting it to the busbar 42.

[0104] (Part Three)

[0105] The third part 23 is an upright wall (side wall) that rises from both ends of the second part 22 in the horizontal direction towards the +Z direction. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and to the second part 22. The third part 23 extends obliquely, for example, in a manner that widens in the X direction as it moves towards the -Z direction. Furthermore, the third part 23 may also be provided in the aforementioned connecting member 20M. On the other hand, the connecting member 20N may not have the third part 23.

[0106] <3.2 Connecting components for external connections>

[0107] Next, the connecting component 30 for external connection will be described.

[0108] The connecting member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connecting member 30 connects the external connection busbar 76 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 5 Electrical connection. The external connection is electrically connected to the external device via busbar 76. In this invention, "external device" refers to an electrical device located outside the electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples. The connection member 30, for example, has a structure having the same first, second, and third parts as the connection member 20M; detailed description is omitted.

[0109] The upper end of the connecting member 30 (the upper end of the first part) is physically and electrically connected to the external connecting busbar 76 by fastening member 73 (e.g., screw or bolt).

[0110] The lower part (second part) of the connecting component 30 is secured by a fastening component 43 (e.g., screw or bolt, see reference) that protrudes from the busbar 42 in the +Z direction. Figure 5 ) through, and engage the locking component 44 (e.g., nut, see Figure 3The screw is screwed into the fastening component 43, thereby physically and electrically connecting it to the busbar 42.

[0111] <3.3 Substrate for Wiring>

[0112] Next, the wiring substrate 40 will be described.

[0113] Figure 5 This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between an electronic component 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped," "sheet-shaped," or "plane" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction locally, or cases where there are uneven shapes on the surface that follow the thickness of the busbar, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0114] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and a plurality of fastening members 43. In this embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. In addition, the wiring substrate 40 may also be formed by other structures instead of insert molding. For example, it may be configured such that an opening (corresponding to the receiving portion 55 described later) is formed on the wiring substrate 40, which is formed separately from the busbars 42, to fix the busbars 42 by embedding or the like, and the busbars 42 are fixed at the opening to form a busbar embedding plate.

[0115] Figure 6 This is a partially exploded perspective view of the wiring substrate 40. Hereinafter, for ease of explanation, the base plate 41, busbar 42 and fastening member 43 will be described with reference to the partially exploded view of the wiring substrate 40.

[0116] (Substrate board)

[0117] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 is an example of both a "substrate component" and a "mounting component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52. The fixing portions 52 will be described later.

[0118] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0119] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction of the planar portion 51 (the plate thickness direction, the normal direction of the first surface 51a and the second surface 51b) is the Z direction.

[0120] The planar portion 51 may have one or more receiving portions 55, for example, each receiving a busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole penetrating the planar portion 51 in the Z direction. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction, rather than a through hole. It should also be noted that in this disclosure, "the receiving portion penetrating the planar portion in the first direction (Z direction)" may also include a portion of the total length of the receiving portion 55 penetrating the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole that penetrates the planar portion 51 in the Z direction, or it may be a form that is provided inside the base plate 41 and does not expose to the outside of the base plate 41).

[0121] Viewed from the Z direction, each receiving portion 55 has a shape corresponding to the shape of the received busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55. Receiving portion 55A is provided corresponding to busbar 42A (described later) and receives busbar 42A. Receiving portion 55B is provided corresponding to busbar 42B (described later) and receives busbar 42B. Receiving portion 55C is provided corresponding to busbar 42C (described later) and receives busbar 42C. Receiving portion 55D is provided corresponding to busbar 42D (described later) and receives busbar 42D. Receiving portion 55E is provided corresponding to busbar 42E (described later) and receives busbar 42E.

[0122] (Busbar)

[0123] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 can also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0124] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is housed in a housing portion 55 along its entire length and extends along the planar portion 51. The upper and lower surfaces of each busbar 42 can be coplanar with the upper and lower surfaces (first surface 51a and second surface 51b) of the planar portion 51. The upper surface of each busbar 42 and the upper surface (first surface 51a) of the planar portion 51 form the component mounting surface of the wiring substrate 40. Hereinafter, the portion of each busbar 42 that is housed in the housing portion 55 and extends along the planar portion 51 will sometimes be referred to as "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component".

[0125] Figure 7 This is a top view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 on its plate portion 42p.

[0126] The first connecting portion 61 is the portion that contacts a connecting member 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is a connecting member that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction and is connected to the first connecting member 20 from the Z direction.

[0127] The second connecting portion 62 is the portion that contacts other connecting members 20 (hereinafter referred to as "second connecting members 20"). The second connecting member 20 is a connecting member that connects other electronic components 10 (hereinafter referred to as "second electronic components 10") included in a plurality of electronic components 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction and is connected to the second connecting member 20 from the Z direction.

[0128] Alternatively, the second connecting portion 62 may be a portion that contacts other connecting members 30 (hereinafter referred to as "second connecting member 30") instead of the example described above. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 30 in the Z direction and is connected to the second connecting member 30 from the Z direction.

[0129] Alternatively, the second connecting portion 62 may be a portion that contacts the connecting busbar 75 for connecting to other subunits SU without contacting the connecting members 20 and 30. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to and connected to the connecting busbar 75 in the Z direction.

[0130] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0131] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51, at least covering the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0132] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing portion 55, extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extension 63 has a portion extending linearly in the X direction. This portion extends across the +X and -X direction sides of the region R that overlaps with the electronic component 10 when viewed from the Z direction. That is, since the busbars 42 are housed in the housing portion 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0133] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension portion 63. The extension portion 64 is a portion of the busbar 42 that extends or branches to increase the heat dissipation area and / or increase the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connecting portion 61 (or the second connecting portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10 when viewed from the Z direction.

[0134] <4. Metal plates, insulating sheets, heat-conducting components, and insulating covers>

[0135] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0136] <4.1 Metal Plate>

[0137] Figure 8 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 can also be referred to as a "rigid component". The metal plate 80 is a single sheet of metal.

[0138] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the long side of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0139] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 has a gap S1 (see reference) between it and the second surface 51b of the planar portion 51 of each sub-unit SU. Figure 10 ), and the second surface 51b of the planar portion 51 facing each subunit SU.

[0140] The fixing part 82 is used to fix the base plate 41 of each sub-unit SU to the metal plate 80. Viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss protruding from the flat portion 81 of the metal plate 80 in the +Z direction. The fixing part 82 will be described in detail later.

[0141] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction. The fixing part 83 will be described in detail later.

[0142] <4.2 Insulating Sheets>

[0143] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0144] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be provided between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above. Furthermore, if the heat-conducting components 92 are insulating and the necessary insulation is ensured by the heat-conducting components 92, the insulating sheet 91 may be omitted.

[0145] <4.3 Thermal Conductive Components>

[0146] The thermally conductive component 92 is a component used to transfer heat generated by the electronic component 10 when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 80. The thermally conductive component 92 is, for example, a flexible thermally conductive sheet (e.g., a thermally conductive silicone sheet). However, the thermally conductive component 92 is not limited to the above example and may also be a thermally conductive component formed of thermally conductive gel or other materials.

[0147] Figure 9 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of heat-conducting components 92 are partially disposed in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged near the electronic components 10 (e.g., electronic components 10A, 10B) at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0148] Figure 10 It is along Figure 7 The diagram shows a cross-sectional view along line AA of the structure. In this embodiment, a heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80.

[0149] In this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 via the busbar 42 from the connecting component 20 to the metal plate 80.

[0150] In this embodiment, a portion of the heat-conducting component 92 is positioned to overlap with and contact the head 43b of the fastening component 43 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0151] Furthermore, in this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 10 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0152] <4.4 Insulating Cover>

[0153] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to prevent contact with the electrical path of the main body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the electrical path of the main body MU.

[0154] <7. Fixed Structure>

[0155] Next, the fixed structure of the subunit SU will be explained.

[0156] <7.1 Structure of Metal Plates>

[0157] Figure 11 It is along Figure 7 The structure shown is a cross-sectional view along line BB. As described above, the metal plate 80 has a fixing part 82 and a fixing part 83.

[0158] The fixing part 82 is a boss that protrudes from the planar part 81 of the metal plate 80 in the +Z direction. The fixing part 82 protrudes further in the +Z direction than, for example, the first surface 51a of the planar part 51 of the base plate 41. In this embodiment, the fixing part 82 protrudes further in the +Z direction than the fixing part 83 described later. The fixing part 82 faces the fixing part 52 of the base plate 41 in the Z direction. The fixing part 82 has a locking hole 82h that opens in the +Z direction. The inner circumferential surface of the locking hole 82h has a threaded groove.

[0159] The fixing part 83 is a boss protruding from the planar part 81 in the +Z direction. The fixing part 83 is inserted into the through hole 51h of the planar part 51 of the base plate 41 (described later). The fixing part 83 protrudes through the through hole 51h of the planar part 51 to a position at the same level as the first surface 51a of the planar part 51, or to a position beyond the first surface 51a of the planar part 51 (a position on the +Z direction side compared to the first surface 51a). The fixing part 83 faces the mounting part 14 of the electronic component 10 in the Z direction. The fixing part 83 has a locking hole 83h that opens in the +Z direction. The inner peripheral surface of the locking hole 83h has a threaded groove.

[0160] Fastening member 112 (e.g., screw or bolt) passes through mounting portion 14 of electronic component 10 from the +Z direction side. When fastening member 112, which passes through mounting hole 14h of mounting portion 14 of electronic component 10, engages with engagement hole 83h of fixing portion 83 of metal plate 80, electronic component 10 is fixed to metal plate 80 without passing through base plate 41.

[0161] <7.2 Structure of the substrate for wiring>

[0162] The base plate 41 has a fixing part 52 that is fixed to the fixing part 82 of the metal plate 80. The fixing part 52 has, for example, an upright plate part 52a and a horizontal plate part (upper plate part) 52b.

[0163] The upright plate portion 52a rises from the end of the flat portion 51 of the base plate 41 toward the +Z direction. The upright plate portion 52a is a plate portion along the Y and Z directions. The thickness direction of the upright plate portion 52a is the X direction.

[0164] The horizontal plate portion 52b extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is a plate portion along the horizontal direction. The horizontal plate portion 52b faces the fixing portion 82 of the metal plate 80 in the Z direction. The horizontal plate portion 52b has an insertion hole 52h that engages with the fixing portion 82 of the metal plate 80. A fastening member 111 (e.g., a screw or bolt) passes through the insertion hole 52h. When the fastening member 111, passing through the insertion hole 52h of the fixing portion 52 of the base plate 41, engages with the engaging hole 82h of the fixing portion 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80. The horizontal plate portions 52b of the fixing portions 52 of a pair of adjacent sub-units SU on the metal plate 80 overlap with the upper surface of the boss of the metal plate 80 and are jointly fastened by the fastening member 111. The fixing structure, including fixing parts 52 and 82, is used to fix a pair of adjacent sub-units SU on the metal plate 80.

[0165] Furthermore, the planar portion 51 of the substrate 41 has the aforementioned through hole 51h. The through hole 51h penetrates the planar portion 51 in the Z direction. When viewed from the Z direction, the through hole 51h is located at a position corresponding to the fixing portion 83 of the metal plate 80. The fixing portion 83 of the metal plate 80 protrudes through the through hole 51h of the substrate 41 to a position at the same level as the first surface 51a of the planar portion 51, or at a position closer to the +Z direction side than the first surface 51a of the planar portion 51. The mounting portion 14 of the electronic component 10 is fixed to the fixing portion 83 at a position at the same level as the first surface 51a of the planar portion 51, or at a position closer to the +Z direction side than the first surface 51a of the planar portion 51.

[0166] <8. Heat dissipation paths related to fixed structures>

[0167] Next, the heat dissipation path related to the fixing part 83 of the metal plate 80 will be explained.

[0168] Figure 12 This is a cross-sectional view illustrating the heat dissipation path associated with the fixing portion 83 of the metal plate 80. In this embodiment, the fixing portion 83 of the metal plate 80 does not contact the high-temperature portion (e.g., terminal 13) of the electronic component 10. In this embodiment, an air gap S2 is provided between the inner peripheral surface 51ha of the through hole 51h of the substrate plate 41 and the fixing portion 83. The through hole 51h may be opened relatively large, for example, so that a portion of the through hole 51h does not overlap with the mounting portion 14 of the electronic component 10 when viewed from the Z direction.

[0169] In this embodiment, the temperature of the fixing portion 83 of the metal plate 80 is tended to be lower than the temperature of the busbar 42. In this case, convection occurs due to the temperature difference between the fixing portion 83 (low temperature) of the metal plate 80 and the busbar 42 (high temperature).

[0170] Specifically, corresponding to the rising flow of warm air generated around the busbar 42 (refer to arrow A1), a descending flow is generated around the fixing part 83 of the metal plate 80, passing through the through hole 51h of the base plate 41 and moving downward toward the base plate 41 (refer to arrow A2). When this descending flow is generated, it is pushed out by the air moving in the descending flow, and an rising flow is generated near the inner peripheral surface 51ha of the through hole 51h, causing the air (warm air) in the gap S1 between the metal plate 80 and the base plate 41 to move upward toward the base plate 41 (refer to arrow A3). As a result, hot air is prevented from filling the gap S1 between the metal plate 80 and the base plate 41, and heat dissipation of the electrical connection unit 1 is promoted.

[0171] (Modified Example)

[0172] Figure 13This is a cross-sectional view illustrating a modified example of the heat dissipation path. In this modified example, the metal plate 80 has a protrusion 84 in addition to or replacing the fixing part 83. The protrusion 84 is a heat dissipation protrusion. The protrusion 84 may not be used in the fixing structure. The protrusion 84 is a cylindrical or prismatic boss that protrudes from the planar part 81 of the metal plate 80 in the +Z direction. The protrusion 84 is inserted into the through hole 51h of the planar part 51 of the base plate 41. For example, the protrusion 84 passes through the through hole 51h of the planar part 51 and protrudes to the same position as the first surface 51a of the planar part 51, or to a position beyond the first surface 51a of the planar part 51 (a position closer to the +Z direction side than the first surface 51a).

[0173] According to the structure of this modified example, the temperature of the protrusion 84 of the metal plate 80 is easily lower than the temperature of the busbar 42. In this case, convection is generated due to the temperature difference between the protrusion 84 (low temperature) of the metal plate 80 and the busbar 42 (high temperature). As a result, the airflow indicated by arrows A1 to A3 is generated, promoting heat dissipation of the electrical connection unit 1.

[0174] <9. Absorbing structures for thermal expansion / contraction associated with fixed structures>

[0175] Next, the absorption structure for thermal expansion / contraction related to the fixed structure will be explained.

[0176] Figure 14 This is a cross-sectional view illustrating the thermal expansion / contraction absorption structure associated with the fixing part 82. In this embodiment, the wiring substrate 40 of the sub-unit SUX has a base plate 41 and a busbar 42. The planar portion 51 of the base plate 41 has a receiving portion 55 for receiving the busbar 42. The fixing part 52 of the base plate 41 has an upright plate portion 52a that rises in the Z direction from the planar portion 51 and a horizontal plate portion 52b that extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is disposed at a position different from the first surface 51a in the Z direction. The horizontal plate portion 52b has an insertion hole 52h through which the fastening member 111 passes. The horizontal plate portion 52b is fixed to the fixing part 82 of the metal plate 80 by the fastening member 111.

[0177] The metal plate 80 has a fixing part 83 that protrudes from the flat part 81 of the metal plate 80 and is inserted into the through hole 51h of the base plate 41 for fixing the electronic component 10. The length L1 of the upright plate part 52a in the Z direction is greater than the length L2 of the fixing part 83 in the Z direction.

[0178] In this embodiment, the wiring substrate 40 of the sub-unit SUY has a base plate 41 and a busbar 42. The planar portion 51 of the base plate 41 has a receiving portion 55 for receiving the busbar 42. The fixing portion 52 of the base plate 41 has an upright plate portion 52a that rises in the Z direction from the planar portion 51 and a horizontal plate portion 52b that extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is disposed at a position different from the first surface 51a in the Z direction. The horizontal plate portion 52b of the base plate 41 of the sub-unit SUY overlaps with the base plate 41 and the horizontal plate portion 52b of the sub-unit SUX. The horizontal plate portion 52b of the base plate 41 of the sub-unit SUY has a through hole 52h for the fastening member 111 to pass through. The horizontal plate portion 52b of the base plate 41 of the sub-unit SUY, together with the base plate 41 and the horizontal plate portion 52b of the sub-unit SUX, are fastened together to the fixing portion 82 of the metal plate 80 by the fastening member 111.

[0179] Figure 15 This is a cross-sectional view illustrating the function of the aforementioned absorption structure. Here, the coefficient of linear expansion of the synthetic resin substrate 41 is greater than that of the metal substrate 80. Therefore, during thermal expansion, the substrate 41 extends much more than the metal substrate 80. On the other hand, during thermal contraction, the substrate 41 contracts more significantly than the metal substrate 80.

[0180] In this embodiment, the fixing portion 52 of the base plate 41 has a standing plate portion 52a. With such a standing plate portion 52a present, during thermal expansion, the standing plate portion 52a bends in the X direction, thereby suppressing large loads acting on the planar portion 51 and / or the fixing portion 52 of the base plate 41. Similarly, during thermal contraction, the standing plate portion 52a bends in the X direction, thereby suppressing large loads acting on the planar portion 51 and / or the fixing portion 52 of the base plate 41.

[0181] <10. Fixed structures associated with multiple subunits>

[0182] Next, return Figure 8 The fixed structure associated with the multiple sub-units SU will be described. In this embodiment, the main body MU is divided into multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ).

[0183] The subunit SUX includes multiple electronic components 10X, a substrate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10X.

[0184] Subunit SUY includes multiple electronic components 10Y, a substrate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10Y. Subunit SUY is electrically connected to subunit SUX, for example, via connecting busbar 75.

[0185] Subunit SUZ includes multiple electronic components 10Z, a substrate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and are electrically connected to the multiple electronic components 10Z. Subunit SUZ is electrically connected to subunit SUY, for example, via multiple connecting busbars 75.

[0186] In this embodiment, multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are respectively fixed to the metal plate 80. Thus, the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are integrally held by a single metal plate 80.

[0187] In this embodiment, the long side of sub-unit SUX is in the X direction. The long side of sub-unit SUY is in the X direction. The long side of sub-unit SUZ is in the X direction. Multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are adjacent in the X direction and arranged in a row in the X direction. The long side of metal plate 80 is in the X direction. The length of metal plate 80 in the X direction is greater than the sum of the lengths of the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) in the X direction.

[0188] In this embodiment, the fixing part 52 of sub-unit SUX and the fixing part 52 of sub-unit SUY are arranged in a position that overlaps each other in the Z direction. The fixing parts 52 of sub-unit SUX and the fixing parts 52 of sub-unit SUY are centrally fixed to the fixing part 82 of metal plate 80 by a fastening member 111.

[0189] Similarly, the fixing part 52 of sub-unit SUY and the fixing part 52 of sub-unit SUZ are arranged in a position that overlaps each other in the Z direction. The fixing part 52 of sub-unit SUY and the fixing part 52 of sub-unit SUZ are centrally fixed to the fixing part 82 of metal plate 80 by a fastening member 111.

[0190] In the present embodiment, the heat generated by the electronic component 10X and the bus bar 42 included in the sub-unit SUX is transferred to the metal plate 80 via one or more heat conductive components 92 facing the sub-unit SUX. Similarly, the heat generated by the electronic component 10Y and the bus bar 42 included in the sub-unit SUY is transferred to the metal plate 80 via one or more heat conductive components 92 facing the sub-unit SUY. The heat generated by the electronic component 10Z and the bus bar 42 included in the sub-unit SUZ is transferred to the metal plate 80 via one or more heat conductive components 92 facing the sub-unit SUZ.

[0191] In the present embodiment, the heat generation amounts of the plurality of sub-units SU (for example, three sub-units SUX, SUY, and SUZ) may be different from each other. Even when the heat generation amounts of the plurality of sub-units SU are different, cooling of the plurality of sub-units SU (for example, the three sub-units SUX, SUY, and SUZ) can be promoted by one large metal plate 80. For example, when the heat generation amounts of the plurality of sub-units SU are different, homogenization of the plurality of sub-units SU can be achieved by one large metal plate 80.

[0192] <14. Advantages of the present embodiment>

[0193] <A. Advantages of the wiring substrate>

[0194] As a comparative example, an electrical connection unit configured in a posture where the bus bar stands up with respect to the lower wall of the housing is considered. In the structure of such a comparative example, due to the width of the standing bus bar, it is sometimes difficult to make the electrical connection unit thinner.

[0195] On the other hand, in the present embodiment, the electrical connection unit 1 has the first electronic component 10 and the wiring substrate 40. The wiring substrate 40 includes a base plate 41 and a first bus bar 42. The base plate 41 has a plate-shaped planar portion 51, and the planar portion 51 has a first surface 51a facing the first electronic component 10. The planar portion 51 has a first accommodating portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction. At least a part of the first bus bar 42 is accommodated in the first accommodating portion 55 and extends along the planar portion 51. According to such a structure, at least a part of the wiring path is formed on the plane, and compared with the structure of the above comparative example, the bus bar is less likely to affect the height direction, and it is easy to make the electrical connection unit 1 thinner.

[0196] In this embodiment, the electrical connection unit 1 has a first connection member 20. The first connection member 20 includes a portion that stands upright relative to the first busbar 42 and electrically connects the first electronic component 10 to the first busbar 42. The first busbar 42 has a first connection portion 61 that contacts the first connection member 20. The first connection portion 61 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, more of the wiring path is formed on a plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0197] In this embodiment, the electrical connection unit 1 has a second connection member 20. The second connection member 20 includes a portion that stands upright relative to the first busbar 42 and electrically connects a second electronic component or external device to the first busbar 42. The first busbar 42 has a second connection portion 62 that contacts the second connection member 20. The first busbar 42 is housed in a first housing portion 55 and extends along a planar portion 51, at least extending over the first connection portion 61 and the second connection portion 62. With this structure, more of the wiring path is formed on a planar surface, thus making it easier to achieve a thinner electrical connection unit 1.

[0198] In this embodiment, the first busbar 42 has an extension 63 between the first connecting portion 61 and the second connecting portion 62. The extension 63 is housed in the first housing portion 55 and extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. With this structure, by housing the extension 63 in the first housing portion 55, the wiring layout is less constrained by the presence of the electronic component 10. Therefore, a wiring layout that is more favorable to electrical characteristics, such as making it easier to extend the extension 63 in a straight line, can be achieved. Furthermore, routing around the busbar such as the electronic component 10 can be avoided. Thus, the electrical characteristics of the electrical connection unit 1 can be improved and / or the electrical connection unit 1 can be miniaturized.

[0199] In this embodiment, the first busbar 42 has an extension 64 that extends to a region R overlapping with the first electronic component 10 when viewed from the Z direction, and has an end portion 42e1 at the position where it overlaps with the first electronic component 10. The extension 64 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, by housing the extension 64 in the first housing portion 55, the electrical connection unit 1 can be made thinner, and the metallic heat dissipation portion (extension 64) for promoting heat dissipation and / or heat storage of the first electronic component 10 can be positioned below the first electronic component 10. As a result, the heat dissipation and / or heat storage of the electrical connection unit 1 can be improved.

[0200] In this embodiment, the first busbar 42 is housed in the first receiving portion 55 along its entire length and extends along the planar portion 51. With this structure, more of the wiring path is formed on the plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0201] In this embodiment, the electrical connection unit 1 has a second busbar 42 electrically connected to the second terminal 13B of the first electronic component 10. The planar portion 51 has a second receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location away from the first receiving portion 55. At least a portion of the second busbar 42 is received in the second receiving portion 55 and extends along the planar portion 51. With this structure, a larger portion of the wiring path containing multiple busbars 42 is held in a plane by a substrate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0202] In this embodiment, the electrical connection unit 1 has a third busbar 42. The first busbar 42 is the busbar included in the positive line PL. The third busbar 42 is the busbar included in the negative line NL. The planar portion 51 has a third receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction at a position away from the first receiving portion 55. At least a portion of the third busbar 42 is received in the third receiving portion 55 and extends along the planar portion 51. According to this structure, more of the wiring path forming the positive line PL and the negative line NL is held in a plane by a substrate plate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0203] In this embodiment, the electrical connection unit 1 includes a fourth bus 42G, a fifth bus 75D, and a third connecting member 100 that electrically connects the fourth bus 42G and the fifth bus 75D. The planar portion 51 has a fourth receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location remote from the first receiving portion 55. At least a portion of the fourth bus 42G is received in the fourth receiving portion 55 and extends along the planar portion 51. The third connecting member 100 includes a portion that stands upright relative to the fourth bus 42G. The fifth bus 75D is supported by the third connecting member 100 at a location remote from the first bus 42 in the Z direction and extends parallel to the first surface 51a. With this structure, a three-dimensional wiring path can be easily formed through the fourth bus 42G, the third connecting member 100, and the fifth bus 75D. Therefore, the electrical connection unit 1 with excellent assemblability can be provided. Furthermore, by positioning the fourth busbar 42G within the receiving portion 55 of the substrate 41, a portion of the three-dimensional wiring path is formed within the thickness of the substrate 41. This makes it easier to achieve a thinner electrical connection unit 1.

[0204] In the present embodiment, the fifth bus bar 75D extends in a manner crossing the first bus bar 42 at a position away from the first bus bar 42 in the Z direction. With such a structure, it is easy to form a wiring path that is three-dimensionally crossed with the first bus bar 42 through the third connecting member 100 and the fifth bus bar 75D. Thereby, an electrical connection unit 1 with excellent assemblability can be provided.

[0205] <B. Advantages related to the flat bus bar>

[0206] As a comparative example, consider an electrical connection unit in which the bus bar is arranged in a posture standing up with respect to the lower wall of the housing. In the structure of such a comparative example, it is necessary to fix the bus bar in the standing-up posture to the housing, and it is difficult to improve the workability related to the installation of the bus bar. In this case, it may be difficult to improve the assemblability of the electrical connection unit 1.

[0207] On the other hand, in the present embodiment, the electrical connection unit 1 includes a base plate 41 and a bus bar 42. The base plate 41 includes a plate-shaped planar portion 51. The planar portion 51 has a first accommodating portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction. At least a part of the bus bar 42 is accommodated in the first accommodating portion 55 and extends along the planar portion 51. With such a structure, it is easy to integrally handle the base plate 41 and the bus bar 42, and compared with the structure of the above comparative example, the workability related to the installation of the bus bar can be improved. Thereby, an improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0208] In the present embodiment, the bus bar 42 is accommodated in the accommodating portion 55 over the entire length of the bus bar 42 and extends along the planar portion 51. With such a structure, an improvement in the assemblability of the electrical connection unit 1 can be achieved, and it is easy to make the electrical connection unit 1 thinner.

[0209] In the present embodiment, the bus bar 42 is integrated with the base plate 41 by insert molding. With such a structure, the operation of manually installing the bus bar 42 on the housing can be eliminated or reduced. Thereby, a further improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0210] In the present embodiment, there are fastening members 43 protruding from the bus bar 42 in the Z direction and connecting members 20, 30 mounted on the fastening members 43 from the Z direction. The connecting members 20, 30 electrically connect the electronic component 10 or an external device to the bus bar 42. With such a structure, it is easy to make the direction of the operation of mounting the connection target component on the bus bar 42 coincide with the Z direction. If the direction of the operation can be made to coincide, a further improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0211] In the present embodiment, the connecting member 20 is connected to the electronic component 10 in the X direction (or Y direction). With such a structure, by using the connecting member 20 for the electronic component 10 that needs to be connected in the X direction, the connection direction of the electronic component 10 with respect to the bus bar 42 can be changed to the Z direction. As a result, further improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0212] <C. Advantages related to the exposed structure on the upper surface side of the bus bar>

[0213] As a comparative example, consider an electrical connection unit in which the upper surface side of the bus bar 42 is covered with a synthetic resin. In the structure of such a comparative example, it is difficult to improve the heat dissipation performance of the bus bar 42.

[0214] On the other hand, in the present embodiment, the electrical connection unit 1 includes a first electronic component 10 and a wiring substrate 40. The wiring substrate 40 includes a base plate 41 and a bus bar 42. The base plate 41 has a plate-shaped planar portion 51, and the planar portion 51 has a first surface 51a facing the first electronic component 10 and a second surface 51b located on the side opposite to the first surface 51a. The planar portion 51 has a receiving portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction. At least a part of the bus bar 42 has a plate portion 42p that is received in the receiving portion 55 and extends along the planar portion 51. The plate portion 42p includes a first connection portion 61 that overlaps the first connecting member 20 when viewed in the Z direction and an extension portion 63 that extends from the first connection portion 61 in a direction intersecting the Z direction. At least a part of the extension portion 63 is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, at least a part of the portion of the bus bar 42 other than the connection portions 61 and 62 connected to other components is exposed to the outside and functions as an area for releasing heat. In this case, improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0215] In the present embodiment, at least a part of the region R where the extension portion 63 overlaps the first connecting member 20 when viewed in the Z direction is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, it is easy for a part of the extension portion 63 to function as a heat dissipation portion for transferring heat from the first connecting member 20. In this case, improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0216] In the present embodiment, the first bus bar 42 has a second connection portion 62 that overlaps the second connection members 20 and 30 when viewed in the Z direction. The first bus bar 42 is accommodated in the accommodation portion 55 at least over the entire length between the first connection portion 61 and the second connection portion 62 and extends along the planar portion 51, and is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus it is possible to further improve the heat dissipation performance of the electrical connection unit 1.

[0217] In the present embodiment, the bus bar 42 is accommodated in the accommodation portion 55 over the entire length of the bus bar 42 and extends along the planar portion 51, and is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus it is possible to further improve the heat dissipation performance of the electrical connection unit 1. <​​​​​​​​​​​​​​​​In this embodiment, a plurality of circuit structures SUX, SUY, and SUZ are provided, and a support member (metal plate 80) supports the plurality of circuit structures SUX, SUY, and SUZ on a support surface (upper surface 81a of the planar portion 81). Each circuit structure SUX, SUY, and SUZ includes: an electronic component 10 constituting a circuit; and a mounting member (wiring substrate 40), which is arranged along the support surface and mounts the electronic component 10 in a circuit component mounting area 51d on a component mounting surface (upper surface 51c of the planar portion 51) formed on the side opposite to the metal plate 80. The wiring substrate 40 is fixed to the metal plate 80 by a plurality of fixing parts 52, 82 arranged in a manner that surrounds the outside of the circuit component mounting area 51d when viewed from the normal direction of the support surface.

[0224] According to this structure, the wiring substrate 40 of each circuit structure SUX, SUY, SUZ is fixed to the metal plate 80 by a plurality of fixing parts 52, 82 arranged in such a way as to surround the outside of the circuit component mounting area 51d, thereby suppressing the strain between the metal plate 80 and the wiring substrate 40 caused by the heat of any circuit structure on other circuit structures.

[0225] That is, when the SUX, SUY, and SUZ circuit structures are subjected to high / low temperatures, if the resin wiring substrate 40 expands / contracts relative to the metal plate 80, a difference in length (spacing) will occur between multiple fixed positions between the metal component (rigid component) and the resin component (busbar embedding plate). Due to such repeated expansion / contraction of the resin component, the area near the fixing part of the busbar embedding plate may be damaged.

[0226] In this embodiment, the fixing portion 52 of the busbar embedding plate (wiring substrate 40) is provided at a different height from the main body portion (the flat portion 51 forming the component mounting surface) and fixed to the boss (fixing portion 82) of the metal plate 80. This allows the thermal expansion / contraction of the busbar embedding plate to be absorbed by the deflection of the upright plate portion (wall portion) 52a. The upright plate portion 52a is located closer to the circuit component mounting area 51d than the boss (fixing portion 82) of the metal plate 80, thus insulating the fixing portion (boss) 82 from the busbar 42 surrounding the fixing portion.

[0227] In this embodiment, the metal plate 80 is an integral metal component, and the wiring substrate 40 of each circuit structure SUX, SUY, and SUZ has a separate resin base plate 41.

[0228] According to this structure, the strain between the metallic support component (metal plate 80) and the resin base component (base plate 41) of the mounting component caused by the heat generated by any of the circuit structures SUX, SUY, SUZ can be suppressed and applied to other circuit structures.

[0229] In this embodiment, each fixing part 52, 82 includes: a columnar boss (fixing part 82) protruding from the support surface of the metal plate 80 in the normal direction; and a three-dimensional structure part (fixing part 52) ​​protruding from the component mounting surface of the wiring substrate 40 in the normal direction. The three-dimensional structure part (fixing part 52) ​​includes: an upright plate part 52a that stands upright from the component mounting surface of the wiring substrate 40 in the normal direction; and an upper plate part 52b that extends from the end of the upright plate part 52a parallel to the component mounting surface and is fixed to the end of the boss 82.

[0230] According to this structure, the upper plate portion 52b of the resin fixing portion 52 is supported by the upright plate portion 52a, which is fixed to the metal boss 82. Thus, when the wiring substrate 40 expands / contracts thermally, the upright plate portion 52a bends in the direction along the surface of the component mounting surface, which can suppress large loads acting on the flat portion 51 of the wiring substrate 40.

[0231] In this embodiment, the fixing part 82 between a pair of adjacent circuit structures on the support surface is used to fix the pair of circuit structures.

[0232] With this structure, by using the fixing part 82 between adjacent pairs of circuit structures for fixing a pair of circuit structures, the fixing structure of multiple circuit structures can be simplified and the cost can be reduced.

[0233] In this embodiment, when viewed from the normal direction of the support surface, the circuit component mounting area 51d is rectangular, and fixing parts 52 and 82 are arranged at the top of each rectangle of the circuit component mounting area 51d.

[0234] With this structure, by arranging fixing parts 52 and 82 at the four corners of the rectangular circuit component mounting area 51d in top view, the circuit component mounting area 51d can be efficiently secured.

[0235] <Variation Example>

[0236] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as the structure of the embodiment described above.

[0237] (First variation)

[0238] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0239] (Second variation)

[0240] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42. It should be noted that in the present invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0241] (Third variation)

[0242] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged such that multiple busbars 42 arranged horizontally are sandwiched between, for example, both sides in the Z direction. For example, the multiple components may be integrally formed by sandwiching the multiple busbars 42 together through lamination. The multiple components form a planar portion 51. In this case, a receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. A sheet component may, for example, be a flexible sheet component. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42. For example, in this case, the receiving portion 55 formed between the multiple components is equivalent to an example of a "receiving portion recessed in the first direction (Z direction)".

[0243] (Fourth variation)

[0244] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0245] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0246] [Potential for Industrial Applications]

[0247] According to the present invention, the thermal characteristics of the electrical connection unit can be improved.

Claims

1. An electrical connection unit, characterized in that, have: Multiple circuit structures; and Support component, the support component supporting multiple circuit structures Each of the aforementioned circuit structures includes: Multiple electronic components; Busbar, the busbar electrically connecting the plurality of said electronic components; and An insulating base component that holds the busbar. When the orientation of the plurality of electronic components opposite the base component is set as the first orientation, Each of the base components has an opposing region that faces the plurality of electronic components when viewed from the first direction, and is fixed to the support component by a plurality of fixing portions arranged in such a way as to surround the outside of the opposing region when viewed from the first direction.

2. The electrical connection unit according to claim 1, characterized in that, The plurality of circuit structures include a first circuit structure and a second circuit structure disposed adjacent to the first circuit structure. The heating periods of the first circuit structure and the second circuit structure are different.

3. The electrical connection unit according to claim 1 or 2, characterized in that, The supporting component is a metal plate. The matrix component is a separate synthetic resin component.

4. The electrical connection unit according to claim 3, characterized in that, The base component has a base surface, the base surface including the opposing region. Each of the aforementioned fixing parts includes: A first fixing part protrudes from the support member in the first direction; and A second fixing part protrudes from the base surface of the base component. The second fixing part includes: a first part, which stands upright from the base surface in the first direction; and a second part, which extends parallel to the base surface from the end of the first part and is fixed to the first fixing part.

5. The electrical connection unit according to claim 1 or 2, characterized in that, The plurality of circuit structures include a first circuit structure and a second circuit structure disposed adjacent to the first circuit structure. The plurality of fixing parts include fixing parts disposed at the boundary between the first circuit structure and the second circuit structure, and used together for fixing the first circuit structure and the second circuit structure.

6. The electrical connection unit according to claim 1 or 2, characterized in that, When viewed from the first direction, the opposing region is rectangular in shape, and a plurality of the fixing parts are arranged corresponding to the four corners of the opposing region.

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