Electrical connection unit

Abstract

The electrical connection unit includes a first circuit structure, a second circuit structure, and a heat dissipation portion. The first circuit structure has a plurality of first electronic components and a first substrate on which the plurality of first electronic components are mounted. The second circuit structure has a plurality of second electronic components and a second substrate on which the plurality of second electronic components are mounted. The heat dissipation part is provided so as to overlap at least a portion of each of the first substrate and the second substrate, and is thermally connected to each of the first substrate and the second substrate. And a switching unit that is capable of switching between a first state in which the amount of heat generated in the first circuit structure is higher than the amount of heat generated in the second circuit structure, and a second state that is different from the first state, the switching unit being configured so that the switching unit can switch between the first state in which the amount of heat generated in the first circuit structure is higher than the amount of heat generated in the second circuit structure and the second state in which the amount of heat generated in the second circuit structure is higher than the amount of heat generated in the first circuit structure.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units.

[0002] This application claims priority to Japanese Patent Application No. 2024-087291, filed in Japan on May 29, 2024, the contents of which are incorporated herein by reference. Background Technology

[0003] An electrical connection unit with multiple electronic components is known.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] However, the electrical connection unit is expected to have improved heat dissipation.

[0009] One embodiment provides an electrical connection unit that can improve heat dissipation.

[0010] Technical means for solving problems

[0011] One embodiment of the electrical connection unit includes a first circuit structure, a second circuit structure, and a heat dissipation unit. The first circuit structure has a plurality of first electronic components and a first substrate on which the plurality of first electronic components are mounted. The second circuit structure has a plurality of second electronic components and a second substrate on which the plurality of second electronic components are mounted. The heat dissipation unit is provided to overlap at least a portion of both the first and second substrates and is thermally connected to both substrates. It can switch between a first state and a second state, in which the heat generation in the first circuit structure is higher than that in the second circuit structure, and in the second state, the heat generation in the second circuit structure is higher than that in the first circuit structure.

[0012] Invention Effects

[0013] According to one embodiment, an electrical connection unit that can improve heat dissipation can be provided. Attached Figure Description

[0014] Figure 1 This is a cross-sectional view showing the electrical connection unit of the embodiment.

[0015] Figure 2 This is a perspective view of the main body used to illustrate the implementation method.

[0016] Figure 3 This is a perspective view of a subunit used to illustrate the implementation method.

[0017] Figure 4 This is a perspective view showing a partial decomposition of the sub-units of the implementation method.

[0018] Figure 5 This is a perspective view showing the wiring substrate according to the embodiment.

[0019] Figure 6 This is a perspective view showing a partial exploded view of the wiring substrate of the embodiment.

[0020] Figure 7 Is with Figure 4 The sectional view corresponding to line F7-F7.

[0021] Figure 8 This is a top view showing the wiring substrate of the embodiment.

[0022] Figure 9 This is a perspective view showing a partial disassembly of the electrical connection unit of the embodiment.

[0023] Figure 10 This is a bottom view showing the wiring substrate of the embodiment.

[0024] Figure 11 yes Figure 8 A cross-sectional view of the structure shown along line F11-F11.

[0025] Explanation of reference numerals in the attached figures

[0026] 1: Electrical connection unit

[0027] 10, 10X: Electronic components (first electronic component)

[0028] 10, 10Y: Electronic components (first electronic component)

[0029] 10, 10Z: Electronic components (second electronic components)

[0030] 40, 40X: First wiring substrate (first substrate)

[0031] 40, 40Y: Second wiring substrate (first substrate)

[0032] 40, 40Z: Third wiring substrate (second substrate)

[0033] 42: Busbars (First Busbar, Second Busbar)

[0034] 55: Containment Department (First Containment Department, Second Containment Department)

[0035] 80: Metal plate (heat dissipation section)

[0036] 81: Planar section

[0037] 82: Fixing part (first support part, second support part)

[0038] 91: Insulating sheet (insulating component)

[0039] 92: Thermal conductive components

[0040] SU, SUX: First sub-unit (first circuit structure)

[0041] SU, SUY: Second sub-unit (first circuit structure)

[0042] SU, SUZ: Third sub-unit (second circuit structure) Detailed Implementation

[0043] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures will sometimes be omitted. Additionally, the specific structures described below do not limit the applicability of the embodiments.

[0044] In this invention, the terms are defined as follows: "Connection" is not limited to mechanical connections, but may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case of containing the entire component, but may also include the case of containing only a part of the component. "Facing" refers to the case where the imaginary projected images of two objects overlap when viewed from a specific direction. That is, "facing" is not limited to the case where two objects directly face each other, but may also include the case where two objects face each other with other components between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0045] In this invention, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 9 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 9The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1 The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction." The Z direction is an example of the "first direction." The X direction is an example of the "second direction."

[0046] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these interpretations are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the installation posture of the electrical connection unit 1).

[0047] <1. Structure of Electrical Connection Unit 1>

[0048] Figure 1 This is a cross-sectional view showing the electrical connection unit 1 in the embodiment.

[0049] Figure 1 The electrical connection unit 1 shown is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0050] Electrical connection unit 1, for example, includes a main body MU, a metal plate 80, and an insulating sheet 91 (see reference). Figure 11 ), multiple heat-conducting components 92 and an insulating cover 93.

[0051] <2. Main Body MU>

[0052] First, let's explain the main body MU.

[0053] Figure 2 This is a three-dimensional diagram used to illustrate the main body MU.

[0054] Figure 2The main body MU shown is the part that performs the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). The main body MU is, for example, divided into multiple sub-units SU. The main body MU is formed, for example, by connecting multiple sub-units SU. In this embodiment, the main body MU has three sub-units SU (first to third sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0055] The first subunit SUX has a first electrical function. The first subunit SUX includes, for example, a plurality of electronic components 10X and a first wiring substrate 40X. The plurality of electronic components 10X are electrically connected to the first wiring substrate 40X. The electronic components 10X are an example of a "first electronic component". The first subunit SUX is an example of a "first circuit structure". The first wiring substrate 40X is an example of a "first substrate".

[0056] The second subunit SUY has a second electrical function. This second function is different from the first function. The second subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y. The electronic components 10Y are an example of a "first electronic component." The second subunit SUY is an example of a "first circuit structure." The second wiring substrate 40Y is an example of a "first substrate."

[0057] The third subunit SUZ has an electrical third function. This third function is different from the first and second functions. The third subunit SUZ, for example, includes multiple electronic components 10Z and a third wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z. The electronic components 10Z are an example of a "second electronic component." The third subunit SUZ is an example of a "second circuit structure." The third wiring substrate 40Z is an example of a "second substrate."

[0058] In this embodiment, three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, the first sub-unit SUX is positioned relative to the second sub-unit SUY on the +X direction side. The first sub-unit SUX and the second sub-unit SUY are electrically connected via a connecting busbar 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, the third sub-unit SUZ is positioned relative to the second sub-unit SUY on the -X direction side. The third sub-unit SUZ and the second sub-unit SUY are electrically connected via a connecting busbar 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y. The connecting busbar 75 is positioned relative to the plurality of sub-units SU on the side opposite to the metal plate 80.

[0059] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. The three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0060] In this embodiment, the three sub-units SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one sub-unit SU. Hereinafter, without distinguishing between the first sub-unit SUX, the second sub-unit SUY, and the third sub-unit SUZ, they will be simply referred to as "sub-unit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Additionally, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40".

[0061] <3. Structure of Subunit SU>

[0062] Next, the structure of the subunit SU will be explained.

[0063] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 It is a three-dimensional diagram representing the partial decomposition of the sub-unit SU.

[0064] like Figure 3 , Figure 4 As shown, the subunit SU, for example, includes multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, a wiring substrate 40, multiple fastening components 71, 72, 73, and a connecting component 100 for connecting units (see reference). Figure 2 ).

[0065] <3.1 Electronic component 10 and connecting component 20 for connecting the component>

[0066] First, the electronic component 10 and the connecting component 20 will be described.

[0067] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or two or more of these unitized electronic components. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized.

[0068] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 is positioned upright from the wiring substrate 40 towards the +Z direction. The first end (-Z direction side end) of the connecting member 20 is connected to the busbar 42 via a fastening member 43 (e.g., a bolt). The second end (+Z direction side end) of the connecting member 20 is connected to the electronic component 10 via a fastening member 71 (e.g., a screw or bolt).

[0069] <3.2 Connecting component 30 for external connection>

[0070] Next, the connecting component 30 for external connection will be described.

[0071] The connecting member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connecting member 30 electrically connects the external connection busbar 76 to the busbar 42 included in the wiring substrate 40. The external connection busbar 76 is electrically connected to an external device. In this invention, "external device" refers to an electrical device located outside the electrical connection unit 1. Examples of external devices include a battery cell mounted on a vehicle or an inverter for driving a vehicle's motor. However, external devices are not limited to battery cells or inverters.

[0072] Connecting component 30 is also made of metal (e.g., copper or copper alloy) as connecting component 20. Figure 2 As shown, the connecting member 30 is positioned upright in the +Z direction on the outer periphery (X-direction side end) of the wiring substrate 40M. The first end (-Z-direction side end) of the connecting member 30 is connected to the busbar 42 via a fastening member 43 (e.g., a bolt). The second end (+Z-direction side end) of the connecting member 20 is connected to the external connection busbar 76 via a fastening member 73 (e.g., a screw or bolt).

[0073] <3.3 Connecting component 100 for unit connection>

[0074] Next, the connecting component 100 for unit connection will be described.

[0075] The connecting member 100 electrically connects adjacent sub-units SU to each other. In this embodiment, the connecting member 100 connects the busbar 42 contained in one sub-unit SU (e.g., the second sub-unit SUY) to the busbar 42 contained in another sub-unit SU (e.g., the third sub-unit SUZ).

[0076] <3.4 Wiring substrate 40>

[0077] First, let's explain the wiring substrate 40.

[0078] Figure 5 This is a perspective view showing the wiring substrate 40.

[0079] like Figure 5 As shown, the wiring substrate 40 is a component that forms at least a portion of the power path between multiple electronic components 10 and / or at least a portion of the power path between the electronic component 10 and an external device. In this invention, "wiring substrate" refers to a substrate-type layout structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a single plane when viewed as a whole. It should be noted that in this invention, "plate-shaped" is not limited to a completely flat case, and may include a portion containing a fixing structure protruding in the Z direction, ribs, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0080] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and multiple fastening members 43. In this embodiment, the base plate 41 and the multiple busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 as a single component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Alternatively, the wiring substrate 40 may be formed by other structures instead of insert molding. The busbars 42 provided in the first subunit SUX and the second subunit SUY are examples of "first busbars". The busbars 42 provided in the third subunit SUZ are examples of "second busbars".

[0081] Figure 6 This is a partially exploded perspective view of the wiring substrate 40. Hereinafter, for ease of explanation, the substrate 41, busbar 42 and fastening member 43 will be described with reference to the partially exploded view of the wiring substrate 40.

[0082] (Base plate 41)

[0083] like Figure 6 As shown, the substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 is, for example, formed into a rectangular shape with the X direction as its long side and the Y direction as its short side. The substrate 41 electrically insulates the plurality of busbars 42 from each other. The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52.

[0084] The planar portion 51 is a plate-shaped portion formed in the base plate 41. The planar portion 51 forms the main portion of the base plate 41. The planar portion 51 extends in the horizontal direction. In this embodiment, the planar portion 51 extends across the entire width of the base plate 41 in the X direction, except for the four corners of the base plate 41, and extends across the entire width of the base plate 41 in the Y direction.

[0085] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction side. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is the surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0086] For example, one or more receiving portions 55 are formed on the planar portion 51 to receive the busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole that penetrates the planar portion 51 in the Z direction. That is, each receiving portion 55 opens in the Z direction on both the first surface 51a and the second surface 51b. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction instead of a through hole. It should be noted that in the present invention, "the receiving portion penetrates the planar portion in the first direction (Z direction)" may also include the case where a portion of the total length of the receiving portion 55 penetrates the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this invention, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole penetrating the planar portion 51 in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Figure 2 As shown, the containment unit 55 located in the first subunit SUX and the second subunit SUY is an example of a "first containment unit". The containment unit 55 located in the third subunit SUZ is an example of a "second containment unit".

[0087] like Figure 6As shown, each receiving portion 55, when viewed from the Z direction, is shaped to correspond to the shape of the receiving busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55.

[0088] In the planar portion 51, a through hole 51h is formed at a position offset from the receiving portion 55 in the X or Y direction. For example... Figure 4 As shown, when viewed from the Z direction, the through hole 51h is formed, for example, at a position overlapping with the mounting portion 14 of the electronic component 10. The mounting portion 14 is the portion for mounting the electronic component 10 onto the metal plate 80. The mounting portion 14 protrudes from the -Z direction side end of the housing of the electronic component 10 in the X or Y direction.

[0089] Figure 7 Is with Figure 4 The sectional view corresponding to line F7-F7.

[0090] like Figure 4 , Figure 7 As shown, the fixing part 52 is used to fix the metal plate 80 to the base plate 41. The fixing part 52 is provided at the corner of the base plate 41. The fixing part 52 includes, for example, an upright plate part 52a and a horizontal plate part 52b.

[0091] The upright plate portion 52a rises from the end of the flat portion 51 in the base plate 41 toward the +Z direction. When viewed from the Z direction, the upright plate portion 52a is, for example, formed in an L-shape. That is, the upright plate portion 52a extends along the Z direction with a partially open state in the horizontal direction.

[0092] The horizontal plate portion 52b extends horizontally from the end of the upright plate portion 52a on the +Z direction side. The horizontal plate portion 52b is a plate portion that runs horizontally. The horizontal plate portion 52b extends in an eave-like manner, covering the portion surrounded by the upright plate portion 52a from the +Z direction side.

[0093] (Bus line 42)

[0094] like Figure 5 , Figure 6As shown, busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10 to each other. Busbar 42 can also be a wiring component for connecting one electronic component 10 to an external device. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0095] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 extends along the planar portion 51 in a state of being received in the receiving portion 55. At least a portion of each busbar 42 extends along the first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the receiving portion 55. In this embodiment, each busbar 42 is plate-shaped along the horizontal direction throughout its entire length. Each busbar 42 extends along the planar portion 51 in a state of being received in the receiving portion 55 throughout its entire length. Hereinafter, in each busbar 42, the portion received in the receiving portion 55 (the portion extending along the planar portion 51) is sometimes referred to as "plate portion 42p".

[0096] Figure 8 This is a plan view showing the wiring substrate 40.

[0097] like Figure 8 As shown, each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 in its plate portion 42p.

[0098] The first connecting portion 61 is the portion that contacts one of the plurality of connecting members 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is the connecting member that connects one of the plurality of electronic components 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction. The first connecting portion 61 is connected to the first connecting member 20 from the Z direction.

[0099] The second connecting portion 62 is the portion that contacts a connecting member 20 (hereinafter referred to as "second connecting member 20") that is different from the first connecting member 20 among the plurality of connecting members 20. The second connecting member 20 is a connecting member that connects an electronic member 10 (hereinafter referred to as "second electronic member 10") that is different from the first electronic member 10 among the plurality of electronic members 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction. The second connecting portion 62 is connected to the second connecting member 20 from the Z direction.

[0100] The second connecting portion 62 may also be a portion that contacts the connecting member 30. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the connecting member 30 in the Z direction. The second connecting portion 62 is connected to the connecting member 30 from the Z direction.

[0101] The second connecting portion 62 may also be the portion that replaces the connecting parts 20 and 30 and contacts the connecting busbar 75 for connection with other subunits SU. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to the connecting busbar 75 in the Z direction. The second connecting portion 62 is connected to the connecting busbar 75 from the Z direction.

[0102] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0103] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 extends along the planar portion 51 in a state where it is received in the receiving portion 55 at least throughout the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 extend along the planar portion 51 while being received in the receiving portion 55. The portion of each busbar 42 received in the receiving portion 55 is exposed on the first surface 51a and the second surface 51b of the planar portion 51. That is, the Z-direction facing surface of each busbar 42 is exposed to the outside of the base plate 41 (e.g., in the +Z and -Z directions) through the opening of the receiving portion 55. However, a portion of the busbar 42 may also be embedded in the base plate 41.

[0104] In this embodiment, the extensions 63 of several busbars 42 are housed in the housing 55, thereby extending throughout both sides of the region R that overlaps with the electronic component 10 when viewed from the Z direction. For example, the extensions 63 extend linearly in the X direction. The extensions 63 extend throughout the +X and -X direction sides of the region R that overlaps with the electronic component 10 when viewed from the Z direction.

[0105] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension portion 63. The extension portion 64 extends the portion of the busbar 42 for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connecting portion 61 (or the second connecting portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 extends along the planar portion 51 in a state of being housed in the housing portion 55. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction by being housed in the housing portion 55. The position where the extension portion 64 overlaps with the region R when viewed from the Z direction has the end 42e1 of the busbar 42.

[0106] The following describes several layout examples of busbar 42. Furthermore, the plurality of electronic components 10 includes three electronic components 10A, 10B, and 10C. Additionally, the plurality of connecting components 20 includes six connecting components 20A, 20B, 20C, 20D, 20E, and 20F. The plurality of connecting components 30 includes two connecting components 30A and 30B.

[0107] (First deployment example)

[0108] First, we will explain the layout example related to busbar 42A.

[0109] Busbar 42A has a first connection portion 61, a second connection portion 62, and an extension portion 63. Viewed from the Z direction, the first connection portion 61 is located on the +X direction side relative to the electronic component 10A. The first connection portion 61 is electrically connected to, for example, the positive terminal of the electronic component 10A via a connecting member 20A. Viewed from the Z direction, the second connection portion 62 is located on the -X direction side relative to the electronic component 10A. The second connection portion 62 is electrically connected to other sub-units SU via a connecting busbar 75.

[0110] The extension 63, housed in the housing 55, extends across both sides of the region R that overlaps with the electronic component 10A when viewed from the Z direction. For example, the extension 63 extends linearly in the X direction. The extension 63 extends across both the +X and -X direction sides of the region R that overlaps with the electronic component 10A when viewed from the Z direction. The busbar 42A is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0111] (Second deployment example)

[0112] Next, a layout example related to busbar 42B will be described.

[0113] Busbar 42B has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to, for example, the negative terminal of the electronic component 10A via a connecting member 20B, which is different from the first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76 via a connecting member 30A. When viewed from the Z direction, the extension portion 64 extends to a region R that overlaps with the electronic component 10A. The extension portion 64 has an end portion 42e1 of busbar 42 at the position where it overlaps with region R when viewed from the Z direction. Furthermore, the extension portion 63 of busbar 42B may also extend in the same manner as the extension portion 63 of busbar 42A, extending across both sides of region R that overlaps with the electronic component 10 when viewed from the Z direction. Busbar 42B is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0114] (Third deployment example)

[0115] Next, a layout example related to busbar 42C will be described.

[0116] Busbar 42C has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to, for example, the negative terminal of the electronic component 10B via a connecting member 20C. The second connecting portion 62 is electrically connected to other sub-units SU via a connecting busbar 75. When viewed from the Z direction, the extension portion 64 extends to a region R that overlaps with the electronic component 10B. The busbar 42C, which has an end 42e1 of the busbar 42 at the location where the extension portion 64 overlaps with the region R when viewed from the Z direction, is, for example, a busbar included in the negative line NL of the electrical connection unit 1.

[0117] (Fourth deployment example)

[0118] Next, a layout example related to busbar 42D will be described.

[0119] Busbar 42D has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to, for example, the positive terminal of electronic component 10B via connecting member 20D. The second connecting portion 62 is electrically connected to, for example, the negative terminal of electronic component 10C via connecting member 20E. Busbar 42D is, for example, a busbar included in the negative line NL of electrical connection unit 1.

[0120] (Fifth Layout Example)

[0121] Next, the layout example related to busbar 42E will be described.

[0122] Busbar 42E has a first connection portion 61, a second connection portion 62, and an extension portion 63. The first connection portion 61 is electrically connected to, for example, the negative terminal of the electronic component 10C via a connection member 20F. The second connection portion 62 is electrically connected to an external connection busbar 76 via a connection member 30B. Busbar 42E is, for example, a busbar included in the negative line NL of the electrical connection unit 1.

[0123] (Fastening component 43)

[0124] Next, return Figure 6 The fastening component 43 will be described.

[0125] Fastening component 43 is a component used to secure busbar 42 to a connecting component (connecting component 20, connecting component 30, or connecting busbar 75) of busbar 42. Fastening component 43 is, for example, a riveting bolt fixed to busbar 42. Fastening component 43 extends through busbar 42 in the Z direction. Fastening component 43 is electrically and physically connected to busbar 42 in a state protruding relative to busbar 42 in the +Z direction. Furthermore, fastening component 43 is not limited to riveting; it can also be fixed to busbar 42 by welding or other methods.

[0126] The connecting member 20 is fixed to the fastening member 43 in a state where it is first fixed to the electronic component 10 by fastening member 71 or fastening member 72. For example, the fastening member 43 passes through the first end of the connecting member 20. Figure 3 As shown, a locking member 44 (e.g., a nut) is installed on the portion of the fastening member 43 that protrudes in the +Z direction relative to the connecting member 20. Through this installation, the connecting member 20 is mounted on the wiring substrate 40. Furthermore, in this invention, "electronic component mounted on substrate" is not limited to the case where the electronic component is directly connected to the substrate, but also includes the case where the electronic component is connected to the substrate via other components (e.g., the connecting member 20). Additionally, in this invention, "electronic component mounted on substrate" means that at least the electronic component is electrically connected to the substrate, and also includes the case where the electronic component is fixed to a component different from the substrate (e.g., a metal plate 80) instead of the substrate / other than the substrate.

[0127] <4 Connection Structure>

[0128] Next, the connection structure of the subunit SU will be explained.

[0129] like Figure 2 As shown, the first subunit SUX, the second subunit SUY, and the third subunit SUZ are arranged sequentially from the +X direction side to the -X direction side. The first subunit SUX and the second subunit SUY are electrically connected via connecting busbar 75A. The second subunit SUY and the third subunit SUZ are electrically and physically connected via connecting busbar 75B.

[0130] Adjacent subunits SU are arranged such that their ends, which are opposite each other in the X direction, overlap each other in the Z direction. Specifically, the fixing part 52 (horizontal plate part 52b) on the +X direction side of the second subunit SUY overlaps with the fixing part 52 (horizontal plate part 52b) on the -X direction side of the first subunit SUX from the +Z direction side. The fixing part 52 (horizontal plate part 52b) on the -X direction side of the second subunit SUY overlaps with the fixing part 52 (horizontal plate part 52b) on the +X direction side of the third subunit SUX from the +Z direction side.

[0131] <5. Metal plate 80, insulating sheet 91, heat-conducting component 92, and insulating cover 93>

[0132] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0133] <5.1 Metal Plate>

[0134] Figure 9 This is a perspective view showing a partial exploded view of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 is an example of a "heat dissipation section". The heat dissipation section can be made of any material with superior thermal conductivity compared to the base plate 41, and is not limited to metal; various materials can be used.

[0135] The metal plate 80, when viewed from the Z direction, is rectangular along the X direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the length direction of the metal plate 80, separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side direction of the metal plate 80, separated in the Y direction. In this embodiment, the metal plate 80 has a size that covers the entirety of the three sub-units SU (main body MU) from below. Specifically, the length of the metal plate 80 in the X direction is greater than the length of the main body MU in the X direction. The length of the metal plate 80 in the Y direction is greater than the length of the main body MU in the Y direction. Therefore, when viewed from the Z direction, the area of ​​the metal plate 80 is larger than the area of ​​the main body MU.

[0136] The metal plate 80 includes, for example, a flat portion 81, a plurality of fixing portions 82, a plurality of fixing portions 83, and a peripheral wall portion 84.

[0137] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers the entire three sub-units SU (main body MU) from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 is spaced apart by a gap S1 (see reference) from the planar portion 51 (second surface 51b) of each sub-unit SU. Figure 7 In the state of ), the second face 51b facing each sub-unit SU.

[0138] like Figure 7 , Figure 9 As shown, the fixing part 82 is used to fix the base plate 41 of each sub-unit SU to the metal plate 80. When viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction.

[0139] The fixing part 83 is used to directly fix the electronic components 10 of each subunit SU to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the planar part 81 in the +Z direction. In addition, the amount of protrusion of the fixing part 83 in the Z direction is less than the amount of protrusion of the fixing part 82 in the Z direction.

[0140] like Figure 2As shown, the peripheral wall portion 84 extends from the outer periphery of the planar portion 81 towards the +Z direction. The peripheral wall portion 84 extends along the entire circumference of the planar portion 81. The length of the peripheral wall portion 84 in the Z direction is shorter than the length of the fixed portions 82 and 83 in the Z direction.

[0141] <5.2 Insulating Sheet 91>

[0142] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z direction. The insulating sheet 91 is arranged to cover the entire planar portion 81 of the metal plate 80 from the +Z direction side. Therefore, the main body MU sandwiches the insulating sheet 91 in the middle and faces the metal plate 80. The insulating sheet 91 is an example of an "insulating component".

[0143] An insulating sheet 91 is attached to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Furthermore, in this embodiment, the thickness of the insulating sheet 91 in the Z direction is thinner than the thickness of the peripheral wall portion 84 in the Z direction. Therefore, the insulating sheet 91 is surrounded by the peripheral wall portion 84, thereby achieving horizontal positioning relative to the metal plate 80.

[0144] <5.3 Thermal Conductive Components 92>

[0145] like Figure 9 As shown, the heat-conducting component 92 is a component used to transfer the heat generated by the electronic component 10 when energized and / or the heat generated by the busbar 42 itself when energized to the metal plate 80. The heat-conducting component 92 is, for example, a flexible heat-conducting sheet (e.g., a thermally conductive silicone sheet). However, the heat-conducting component 92 is not limited to the above example and may also be a heat-conducting component formed of thermally conductive gel or other materials.

[0146] The plurality of heat-conducting components 92 include, for example, one or more heat-conducting components 92 corresponding to the first sub-unit SUX, one or more heat-conducting components 92 corresponding to the second sub-unit SUY, and one or more heat-conducting components 92 corresponding to the third sub-unit SUZ. The heat-conducting component 92 corresponding to the first sub-unit SUX is positioned at a location overlapping the first sub-unit SUX when viewed from the Z direction, and transfers the heat emitted by the first sub-unit SUX to the metal plate 80. The heat-conducting component 92 corresponding to the second sub-unit SUY is positioned at a location overlapping the second sub-unit SUY when viewed from the Z direction, and transfers the heat emitted by the second sub-unit SUY to the metal plate 80. The heat-conducting component 92 corresponding to the third sub-unit SUZ is positioned at a location overlapping the third sub-unit SUZ when viewed from the Z direction, and transfers the heat emitted by the third sub-unit SUZ to the metal plate 80.

[0147] Figure 10 This is a bottom view showing the wiring substrate 40.

[0148] like Figure 10 As shown, the heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80. Multiple heat-conducting components 92 are partially disposed in the horizontal direction relative to the wiring substrate 40. For example, when viewed from the Z direction, multiple heat-conducting components 92 are positioned to overlap with a portion of the busbar 42 in the wiring substrate 40. When viewed from the Z direction, multiple heat-conducting components 92 are disposed near the electronic component 10 (e.g., electronic components 10A, 10B) at positions overlapping with a portion of the busbar 42. In this embodiment, multiple heat-conducting components 92 are positioned when viewed from the Z direction to overlap with the connecting component 20 (the connection portion between the busbar 42 and the electronic component 10).

[0149] Figure 11 It is along Figure 8 The cross-sectional view of the structure shown is along line F11-F11.

[0150] like Figure 11 As shown, the heat-conducting component 92 is disposed in a flattened state between the main body MU and the insulating sheet 91 in the Z direction. The portion of the heat-conducting component 92 located on the -Z direction side contacts the metal plate 80 through the insulating sheet 91. Alternatively, the heat-conducting component 92 may also be disposed between the insulating sheet 91 and the metal plate 80.

[0151] A portion of the heat-conducting component 92 located on the +Z direction side contacts the busbar 42. In this embodiment, the heat-conducting component 92 contacts the busbar 42 at the position where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the connecting component 20 from the connecting component 20 to the metal plate 80 via the busbar 42. A portion of the heat-conducting component 92 is positioned at the position where it overlaps with the fastening component 43 when viewed from the Z direction and contacts the fastening component 43. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0152] In this embodiment, a portion of the heat-conducting component 92, when viewed from the Z direction, overlaps with the electronic component 10 and is in contact with the busbar 42. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, which in turn transfers heat to the metal plate 80. Figure 11In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the part of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0153] <5.4 Insulating Cover 93>

[0154] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to ensure the safety of the power supply path to the main body MU. The insulating cover 93 is made of, for example, synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 is mounted on the metal plate 80 such that it covers the main body MU from the +Z direction side. In this embodiment, a plurality of vent holes 93h are formed on the top wall of the insulating cover 93. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the power supply path of the main body MU.

[0155] <6. Fixed Structure>

[0156] Next, the fixed structure of the subunit SU will be explained.

[0157] like Figure 7 As shown, the main body MU is stacked on the metal plate 80 in the Z direction such that the fixing parts 52 of adjacent sub-units SU overlap with each other and the fixing parts 82 of the metal plate 80. The fixing parts 52 and 82 overlapping in the Z direction are fixed to each other by fastening members 111 (e.g., screws or bolts). The fastening members 111 pass through the fixing parts 52 of the sub-units SU and are fastened to the fixing parts 82 of the metal plate 80. The fixing parts 82 fixed to the sub-units SUX and SUY are examples of a "first support". The fixing parts 82 fixed to the sub-unit SUZ are examples of a "second support".

[0158] With the main body MU and the metal plate 80 stacked, the fixing part 83 of the metal plate 80 passes through the through hole 51h of the subunit SU. The mounting part 14 of the electronic component 10 overlaps with the fixing part 83 in the Z direction. The mounting part 14 and the fixing part 83 overlapping in the Z direction are fixed to each other by fastening members 112 (e.g., screws or bolts). After passing through the mounting part 14, the fastening member 112 is fastened to the fixing part 83 of the metal plate 80. In addition, a gap that allows air to pass through is provided between the inner peripheral surface of the through hole 51h and the fixing part 83.

[0159] Here, Figure 2The main body MU shown is configured such that the heating timing of the third sub-unit SUZ out of the three sub-units SUX, SUY, and SUZ differs from the heating timing of the remaining sub-units SUX and SUY. In this embodiment, the difference in heating timing is not limited to the case where the heating of any one of the third sub-unit SUZ and the remaining sub-units SUX and SUY is zero, while the heating of the other sub-units SUZ is. For example, when all sub-units SUZ are heating, this includes cases where the heating of the third sub-unit SUZ differs from the heating of the remaining sub-units SUX and SUY within the same time period. That is, the electrical connection unit 1 can switch between a first state where the heating of the remaining sub-units SUX and SUY is higher than that of the third sub-unit SUZ, and a second state where the heating of the third sub-unit SUZ is lower than that of the remaining sub-units SUX and SUY (or the heating of at least one of the sub-units SUX and SUY). In this case, the electrical connection unit 1 can switch between a relatively high-temperature sub-unit SUZ and a relatively low-temperature sub-unit SUZ, even when all sub-units SUZ are heating significantly.

[0160] For example, when the electrical connection unit 1 is installed in the vehicle, and the remaining sub-units SUX and SUY are provided during driving, while the third sub-unit SUZ is provided during charging, the heating timing of the third sub-unit SUZ is different from that of the remaining sub-units SUX and SUY. That is, driving the vehicle is an example of the "first state". When the vehicle is driving, for example, the amount of electricity supplied to the remaining sub-units SUX and SUY is greater than that supplied to the third sub-unit SUZ, and the heat generated by the remaining sub-units SUX and SUY is higher than that generated by the third sub-unit SUZ. On the other hand, charging the vehicle is an example of the "second state". When the vehicle is charging, for example, the amount of electricity supplied to the third sub-unit SUZ is greater than that supplied to the remaining sub-units SUX and SUY, and the heat generated by the third sub-unit SUZ is higher than that generated by the remaining sub-units SUX and SUY. These heating timings are switched, for example, according to instructions from the control device installed in the vehicle. For example, the switching of the heating timings is performed by switching the state of the relays included in the plurality of electronic components 10 of the electrical connection unit 1 according to the instructions.

[0161] <7. Heat Transfer>

[0162] like Figure 11As shown, in the subunit SU, heat is generated, for example, when the electronic component 10 is energized or when the busbar 42 is energized. A portion of the heat generated in the subunit SU from the base plate 41 is transferred to the metal plate 80 (flat portion 81) via the heat-conducting member 92 and the insulating sheet 91. Additionally, a portion of the heat from the base plate 41 is transferred to the fixing portion 82 of the metal plate 80 via the fixing portion 52. Furthermore, a portion of the heat from the electronic component 10 is transferred to the fixing portion 83 of the metal plate 80 via the mounting portion 14. Thus, the heat generated in the subunit SU, after being transferred to the metal plate 80, is released from the metal plate 80 to the outside.

[0163] The electrical connection unit 1 of this embodiment includes: subunits SUX and SUY, each having multiple electronic components 10X and 10Y and wiring substrates 40X and 40Y on which the multiple electronic components 10X and 10Y are mounted; subunit SUZ, each having multiple electronic components 10Z and wiring substrate 40Z on which the multiple electronic components 10Z are mounted; and a metal plate 80, which is disposed such that it overlaps at least a portion of each of the wiring substrates 40X, 40Y and 40Z, and is thermally connected to each of the wiring substrates 40X, 40Y and 40Z. The electrical connection unit 1 can switch between a first state and a second state, which is different from the first state. In the first state, the heat generation in subunits SUX and SUY is higher than the heat generation in subunit SUZ. In the second state, the heat generation in subunit SUZ is higher than the heat generation in subunits SUX and SUY.

[0164] According to this structure, a metal plate 80 is arranged across multiple sub-units SU. Based on this, the sub-units SU thermally connected to the metal plate 80 switch between a first state and a second state with different relative heat generation. Therefore, in the first state, in addition to the portions of the metal plate 80 overlapping with sub-units SUX and SUY, the portions overlapping with sub-unit SUZ can also be used to release heat generated in sub-units SUX and SUY. On the other hand, in the second state, in addition to the portions of the metal plate 80 overlapping with sub-unit SUZ, the portions overlapping with sub-units SUX and SUY can also be used to release heat generated in sub-unit SUZ. According to this structure, for example, compared to the case where the metal plate 80 is arranged independently relative to each sub-unit SU, while suppressing the size of the metal plate 80 in the Z direction, it is easy to ensure a larger volume of the metal plate 80 thermally connected to the sub-units SU that are the heat-generating objects. That is, while suppressing the size of the metal plate 80 in the Z direction, the heat capacity of the metal plate 80 is easily ensured, thus providing an electrical connection unit 1 with excellent heat dissipation.

[0165] In the electrical connection unit 1 of this embodiment, the subunits SUX, SUY, and SUZ are arranged in the X direction.

[0166] According to this structure, the electrical connection unit 1 can be made thinner in the Z direction.

[0167] In the electrical connection unit 1 of this embodiment, the area of ​​the metal plate 80 viewed from the Z direction is larger than the combined area of ​​the sub-units SUX, SUY, and SUZ viewed from the Z direction. When viewed from the Z direction, the metal plate 80 overlaps with the sub-units SUX, SUY, and SUZ.

[0168] Based on this structure, heat can be easily and evenly transferred from each subunit SUX, SUY, and SUZ while ensuring the heat capacity of the metal plate 80. Through this transfer, heat dissipation can be further improved.

[0169] In the electrical connection unit 1 of this embodiment, an insulating sheet 91 is provided between the metal plate 80 and the sub-unit SU.

[0170] According to this structure, by providing an insulating sheet 91 between the metal plate 80 and the sub-unit SU, insulation between the heat dissipation unit and the sub-unit SU can be ensured. This insulation increases the freedom of choice in selecting materials used as the heat dissipation unit.

[0171] In the electrical connection unit 1 of this embodiment, each subunit SU has a busbar 42 that connects multiple electronic components 10 to each other, and a flexible heat-conducting component 92 is provided between the metal plate 80 and each subunit SU. The heat-conducting component 92 is positioned at a location that overlaps with the connection portion between the busbar 42 and the electronic components 10 when viewed from the Z direction.

[0172] According to this structure, the connection portion of the busbar 42, which is one of the heat-generating components in the subunit SU, and the electronic component 10 is thermally connected to the metal plate 80 via the heat-conducting component 92. This connection enables further improvement in heat dissipation.

[0173] In the electrical connection unit 1 of this embodiment, a receiving portion 55 is formed on the wiring substrate 40. The receiving portion 55 is recessed in the Z direction or open in the Z direction, and receives the busbar 42.

[0174] According to this structure, by exposing the busbar 42 to the outside of the wiring substrate 40, the heat generated by the busbar 42 can be released quickly, and the heat accumulation on the wiring substrate 40 can be suppressed.

[0175] In the electrical connection unit 1 of this embodiment, the metal plate 80 has a planar portion 81 and a fixing portion 82 that protrudes from the planar portion 81 in the Z direction and supports the wiring substrate 40.

[0176] According to this structure, the heat from the wiring substrate 40 can be easily transferred to the metal plate 80 via the fixing part 82. Through this transfer, heat dissipation can be further improved.

[0177] In the electrical connection unit 1 of this embodiment, the subunit SU is electrically connected.

[0178] According to this structure, by pre-assembling each sub-unit SU and then connecting the sub-units SU to each other, it is possible to improve assemblability and manufacturing efficiency. Moreover, in the electrical connection unit 1 of this embodiment, by providing a metal plate 80 that spans between each sub-unit SU, it is also easy to ensure the rigidity of the connection portion between each sub-unit SU.

[0179] <8. Variations>

[0180] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as the structure of the embodiment described above.

[0181] (First variation)

[0182] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing means. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0183] (Second variation)

[0184] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by a portion of the planar portion 51 following the shape of the busbar 42. It should be noted that in this invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0185] (Third variation)

[0186] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged, for example, to sandwich multiple busbars 42 arranged horizontally from both sides in the Z direction. For example, the multiple components may be integrally formed by sandwiching the multiple busbars 42 together through lamination. These multiple components form a planar portion 51. In this case, a receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. The sheet components may, for example, be flexible sheet components. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42. For example, in this case, the receiving portion 55 formed between the multiple components is equivalent to an example of a "receiving portion recessed in the first direction (Z direction)".

[0187] (Fourth variation)

[0188] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0189] Several embodiments and modifications have been described above. However, the embodiments and modifications are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The present invention is not limited to the above description, but only to the appended claims.

[0190] In the above embodiments, the electrical connection unit 1 for vehicles has been described, but the structure is not limited to this.

[0191] In the above embodiments, the case where two sub-units SUX and SUY are used as the first circuit structure and one sub-unit SUZ is used as the second circuit structure is described, but the implementation is not limited to this structure. Alternatively, there may be multiple second circuit structures, and the same number of first and second circuit structures may be used.

[0192] In the above embodiment, the structure in which subunits SUX, SUY, and SUZ are arranged in a row in the X direction has been described, but the structure is not limited to this. Subunits SUX, SUY, and SUZ can be arranged in the X and Y directions, or in the Z direction.

[0193] In the above embodiment, a structure in which the metal plate 80 and the sub-unit SU are completely overlapped has been described, but the structure is not limited to this. The metal plate 80 may overlap at least partially with each sub-unit SU.

[0194] In the above embodiments, the structure in which the sub-units SU are electrically connected to each other has been described, but the structure is not limited to this. The sub-units SU can be thermally connected to each other via the metal plate 80, or the sub-units SU may not be directly connected to each other.

[0195] In the above embodiments, a structure in which the wiring substrate 40 and the busbar 42 are integrally formed has been described, but the structure is not limited to this. The busbar 42 may be formed separately from the wiring substrate 40.

[0196] In the above embodiment, the structure in which the heat dissipation unit is connected to the subunit SU via the heat-conducting component 92 and the insulating sheet 91 has been described, but the structure is not limited to this. The heat dissipation unit may also be directly provided on the subunit SU.

[0197] In the above embodiment, the metal plate 80 serving as the heat dissipation unit is described as a plate-shaped structure disposed on one side in the Z direction relative to the subunit SU, but the structure is not limited to this. The heat dissipation unit may also be provided in a manner that surrounds the subunit SU.

[0198] The embodiments of the present invention have been described and illustrated above, but these embodiments are shown as examples and are not intended to limit the scope of the present invention. The above embodiments can be implemented in various other ways, and without departing from the spirit of the present invention, the constituent elements in the above embodiments can be replaced with known constituent elements, and various additions, omissions, substitutions, and modifications can be made.

[0199] [Potential for Industrial Applications]

[0200] According to the present invention, an electrical connection unit that can improve heat dissipation can be provided.

Claims

1. An electrical connection unit, characterized in that, have: A first circuit structure having a plurality of first electronic components and a first substrate on which the plurality of first electronic components are mounted. The second circuit structure has a plurality of second electronic components and a second substrate on which the plurality of second electronic components are mounted. as well as The heat dissipation section is disposed such that it overlaps with at least a portion of both the first substrate and the second substrate, and is thermally connected to both the first substrate and the second substrate. The electrical connection unit can switch between a first state and a second state, which is different from the first state. In the first state, the heat generation in the first circuit structure is higher than the heat generation in the second circuit structure. In the second state, the heat generation in the second circuit structure is higher than the heat generation in the first circuit structure.

2. The electrical connection unit according to claim 1, characterized in that, When the thickness direction of the first substrate is defined as the first direction and the direction intersecting the first direction is defined as the second direction, The first circuit structure and the second circuit structure are arranged in the second direction.

3. The electrical connection unit according to claim 2, characterized in that, The area of ​​the heat dissipation portion, viewed from the first direction, is larger than the combined area of ​​the first circuit structure and the second circuit structure, viewed from the first direction. Viewed from the first direction, the heat dissipation part overlaps entirely with the first circuit structure and the second circuit structure.

4. The electrical connection unit according to claim 1 or 2, characterized in that, An insulating component is provided between the heat dissipation part and the first circuit structure, and between the heat dissipation part and the second circuit structure. The heat dissipation section includes a metal plate, which is disposed in a manner that overlaps with at least a portion of the first substrate and the second substrate, and is thermally connected to the first substrate and the second substrate respectively.

5. The electrical connection unit according to claim 1 or 2, characterized in that, The first circuit structure includes a first busbar that electrically connects the plurality of the first electronic components to each other. The second circuit structure includes a second busbar that electrically connects the plurality of the second electronic components to each other. An elastic heat-conducting component is provided between the heat dissipation part and the first circuit structure or between the heat dissipation part and the second circuit structure. When the thickness direction of the first substrate is set as the first direction, the heat-conducting component is positioned at a location that overlaps with the connection portion of the first busbar and the first electronic component or the connection portion of the second busbar and the second electronic component when viewed from the first direction.

6. The electrical connection unit according to claim 5, characterized in that, A first receiving portion is formed on the first substrate. The first receiving portion is recessed in the first direction or open in the first direction, and receives the first busbar. A second receiving portion is formed on the second substrate. The second receiving portion is recessed in the first direction or opened in the first direction, and receives the second busbar.

7. The electrical connection unit according to claim 2 or 3, characterized in that, The heat dissipation unit includes: A planar portion that overlaps with the first substrate and the second substrate when viewed from the first direction; A first support portion protrudes from the planar portion in the first direction and supports the first substrate; as well as The second support portion protrudes from the planar portion in the first direction and supports the second substrate.

8. The electrical connection unit according to claim 1 or 2, characterized in that, The first circuit structure and the second circuit structure are electrically connected to each other.

Images