Electrical connection unit

Abstract

The electrical connection unit has an insulating base member and a bus bar. The base member includes a plate-like or sheet-like planar portion. When the thickness direction of the planar portion is taken as a first direction, the planar portion has a receiving portion that is recessed in the first direction or passes through the planar portion in the first direction. At least a portion of the bus bar is housed in the housing portion and extends along the planar portion.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, further reductions in the thickness of electrical connection units are expected.

[0008] One embodiment provides an electrical connection unit that enables thinning.

[0009] Technical solutions for solving the problem

[0010] One embodiment of the electrical connection unit includes an insulating base component and a busbar. The base component comprises a plate-like or sheet-like planar portion. With the thickness direction of the planar portion as a first direction, the planar portion has a receiving portion that is recessed in the first direction or extends through the planar portion in the first direction. At least a portion of the busbar is received in the receiving portion and extends along the planar portion.

[0011] Invention Effects

[0012] According to one embodiment, the electrical connection unit can be made thinner. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the first embodiment.

[0014] Figure 2 This is a perspective view used to illustrate the main body of the first embodiment.

[0015] Figure 3 This is a perspective view used to illustrate the sub-units of the first embodiment.

[0016] Figure 4 This is a perspective view showing a portion of the subunit of the first embodiment.

[0017] Figure 5 This is a perspective view used to illustrate the electronic components and connecting components of the first embodiment.

[0018] Figure 6 This is a perspective view used to illustrate the electronic components and connecting components of the first embodiment.

[0019] Figure 7 This is a perspective view showing the connecting component of the first embodiment.

[0020] Figure 8 This is a perspective view showing the wiring substrate of the first embodiment.

[0021] Figure 9 This is a perspective view showing an exploded view of a portion of the wiring substrate of the first embodiment.

[0022] Figure 10 This is a top view showing the wiring substrate of the first embodiment.

[0023] Figure 11 This is a perspective view showing an exploded portion of the connecting unit of the first embodiment.

[0024] Figure 12 This is a bottom view showing the wiring substrate of the first embodiment.

[0025] Figure 13 It is along Figure 10 The cross-sectional view of the structure shown along line F13-F13.

[0026] Figure 14 This is a cross-sectional view showing a modified example of the first embodiment.

[0027] Figure 15 This is a cross-sectional view showing a modified example of the first embodiment.

[0028] Figure 16 This is a cross-sectional view showing a modified example of the first embodiment.

[0029] Figure 17 This is a cross-sectional view showing a modified example of the first embodiment.

[0030] Figure 18 This is a perspective view showing the three-dimensional wiring structure of the busbar according to the first embodiment.

[0031] Figure 19 This is a top view showing the three-dimensional wiring structure of the busbar according to the first embodiment.

[0032] Figure 20 It is along Figure 10 The cross-sectional view of the structure shown along line F20-F20.

[0033] Figure 21 This is a cross-sectional view used to illustrate the heat dissipation path related to the fixing part in the first embodiment.

[0034] Figure 22 This is a cross-sectional view used to illustrate the heat dissipation path of a modified example of the first embodiment.

[0035] Figure 23 This is a cross-sectional view used to illustrate the thermal expansion / contraction absorption structure related to the fixing part in the first embodiment.

[0036] Figure 24 This is a cross-sectional view illustrating the function of the absorption structure described above in the first embodiment.

[0037] Figure 25 This is a perspective view illustrating the first form of the insulating rib in the first embodiment.

[0038] Figure 26 This is a perspective view illustrating a first variation of the first embodiment.

[0039] Figure 27 This is a cross-sectional view used to illustrate a second variation of the first embodiment of the first form.

[0040] Figure 28 This is a perspective view illustrating a second form of the insulating rib in the first embodiment.

[0041] Figure 29 This is a cross-sectional view used to illustrate the structure related to the connecting component in the first embodiment.

[0042] Figure 30 This is a cross-sectional view used to illustrate the manufacturing method of the electrical connection unit of the first embodiment.

[0043] Figure 31 This is a cross-sectional view used to illustrate the manufacturing method of the electrical connection unit of the first embodiment.

[0044] Figure 32 This is a cross-sectional view used to illustrate the manufacturing method of the electrical connection unit of the first embodiment.

[0045] Figure 33 This is a cross-sectional view used to illustrate the manufacturing method of the electrical connection unit of the first embodiment.

[0046] Figure 34 This is a cross-sectional view used to illustrate the manufacturing method of the electrical connection unit of the first embodiment.

[0047] Figure 35 This is a perspective view used to illustrate the subunit of the second embodiment.

[0048] Figure 36 It is along Figure 35 The cross-sectional view of the structure shown is along line F36-F36.

[0049] Figure 37 This is a perspective view used to illustrate the sub-units of the third embodiment.

[0050] Figure 38 This is a perspective view used to illustrate the subunit of the fourth embodiment.

[0051] Figure 39 It is along Figure 38 The cross-sectional view of the structure shown is along line F39-F39.

[0052] Figure 40 This is a cross-sectional view showing a modified example of the fourth embodiment.

[0053] Figure 41 This is a perspective view used to illustrate the subunit of the fifth embodiment.

[0054] Figure 42 It is along Figure 41 The cross-sectional view of the structure shown along line F42-F42.

[0055] Explanation of reference numerals in the attached figures

[0056] 1…Electrical connection unit

[0057] SU… subunit

[0058] 10… Electronic components

[0059] 13, 13A, 13B…terminals

[0060] 20…Connecting parts

[0061] 21…Part 1

[0062] 21h…First mounting hole

[0063] 22…Part Two

[0064] 22h…Second mounting hole

[0065] 30…Connecting parts

[0066] 31…Part One

[0067] 32…Part Two

[0068] 40… Wiring substrate

[0069] 41…Base board

[0070] 42…Busbar

[0071] 42e1…End of busbar

[0072] 42p…board section

[0073] 42u…exposed area

[0074] 42ua…Part 1

[0075] 42ub…Part Two

[0076] 43… Fastening components (fastening parts)

[0077] 51…Planar portion (insulating base)

[0078] 51a…First page, third page

[0079] 51b…Second page, Fourth page

[0080] 52…Fixed part

[0081] 52a…Part 1, Part 3

[0082] 52b…Part Two, Part Four

[0083] 55…Containment Department

[0084] 56…Kahebu

[0085] 56a…concave

[0086] 61…First connecting part

[0087] 62…Second connecting part

[0088] 63… Extension

[0089] 64…Extension

[0090] 71…Fastening components

[0091] 72… Fastening components

[0092] 73… Fastening components

[0093] 80… metal sheet

[0094] 81…Flat section (metal base)

[0095] 82…Fixed part

[0096] 83…Fixed part

[0097] 92… Thermal conductive components

[0098] 92a…First heat conduction section

[0099] 92b…Second heat-conducting section

[0100] 100…Connecting parts

[0101] 101…Part 1

[0102] 102…Part Two

[0103] 111…Fastening components

[0104] 112… Fastening components

[0105] 121…opening

[0106] 131, 132… Maintaining Department

[0107] 141… Support section Detailed Implementation

[0108] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0109] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Orientation" refers to the overlapping of imaginary projections of two objects when viewed from a specific direction. That is, "orientation" is not limited to the case where two objects are directly facing each other, but may also include the case where two objects are facing each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0110] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 11 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 11 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction." The Z direction is an example of the "first direction." The X direction is an example of the "second direction." Furthermore, the "second direction" is not limited to the X direction; it can also be the Y direction or other directions.

[0111] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0112] (First Implementation)

[0113] <1. Structure of the Electrical Connection Unit>

[0114] Figure 1 This is a cross-sectional view showing the electrical connection unit 1 according to the first embodiment. The electrical connection unit 1 is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0115] Electrical connection unit 1, for example, includes a main body MU, a metal plate 80, and an insulating sheet 91 (see reference). Figure 11 ), multiple heat-conducting components 92 and an insulating cover 93.

[0116] <2. Main Body>

[0117] First, let's explain the main body MU.

[0118] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has 3 sub-units SU (sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0119] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a first wiring substrate 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X.

[0120] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y.

[0121] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z.

[0122] In this embodiment, three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is positioned relative to sub-unit SUY on the +X direction side. Sub-units SUX and SUY are electrically connected via multiple connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is positioned relative to sub-unit SUY on the -X direction side. Sub-units SUZ and SUY are connected via multiple connecting busbars 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y (in... Figure 2 (Only one is shown in the figure) and electrically connected. The connecting busbar 75 is arranged on the side opposite to the metal plate 80 relative to the multiple sub-units SU.

[0123] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0124] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one subunit SU. Hereinafter, without distinguishing between the subunit SUX, subunit SUY, and subunit SUZ, they will be simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Furthermore, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40". The single subunit SU included in the three subunits SUX, SUY, and SUZ is an example of a "first subunit". On the other hand, the other subunits SU included in the three subunits SUX, SUY, and SUZ are examples of "second subunits".

[0125] Furthermore, instead of the above example, the main body MU may not be divided into multiple sub-units SU. That is, the main body MU may be formed from multiple electronic components 10 and a wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU with different functions, but may also be sub-units SU with the same function.

[0126] <3. Structure of Subunits>

[0127] Next, the structure of the subunit SU will be explained.

[0128] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 This is a perspective view showing a portion of a subunit SU exploded. The subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, and a wiring substrate 40. The connecting components 20 and 30 are components that form vertical power paths. The connecting components 20 and 30 can also be referred to as "vertical wiring components."

[0129] <3.1 Electronic components and connecting components for connecting components>

[0130] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0131] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Hereinafter, examples of electronic component 10 will be described, including a first type of electronic component 10M and a second type of electronic component 10N.

[0132] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 may also be referred to as a "metal component". Hereinafter, examples of the connecting member 20 will be described, including a first type of connecting member 20M and a second type of connecting member 20N.

[0133] <3.1.1 Type 1 Electronic Components>

[0134] Figure 5 This is a perspective view showing a first type of electronic component 10M and a first type of connecting component 20M. The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged at one end. The electronic component 10M, for example, has a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0135] (case)

[0136] The housing 11 is the outer contour component that forms most of the external shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 houses the main body portion 12 of the component. Alternatively, the housing 11 and the main body portion 12 of the component can be formed integrally.

[0137] In this embodiment, the housing 11 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, plate-shaped along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates the terminals 13A and 13B from each other. Additionally, in this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting members 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates the first portions 21 of the two connecting members 20M connected to the electronic component 10M from each other.

[0138] (Main body of the component)

[0139] The main body 12 is the part that performs the main functions of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, if the electronic component 10M is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body 12 includes a part that stores charge.

[0140] (terminal)

[0141] Terminal 13 is an electrical connection portion exposed to the outside of housing 11. Terminal 13 is electrically connected to the main body 12 of component inside housing 11. In this embodiment, electronic component 10M includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a terminal on the positive side. The other of terminals 13A and 13B is a terminal on the negative side. One of terminals 13A and 13B is an example of a "first terminal". The other of terminals 13A and 13B is an example of a "second terminal".

[0142] In this embodiment, terminals 13A and 13B are disposed at one end of the electronic component 10M in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 71 (e.g., a screw or bolt) as described later. The mounting hole 13h is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10M has a threaded groove.

[0143] (Installation Department)

[0144] Mounting section 14 is a part used to fix electronic component 10M. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 11 The mounting hole 14h is for installation. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. The object to be fastened to the mounting part 14 will be described later.

[0145] <3.1.2 Type 1 Connecting Components>

[0146] The first type of connecting member 20M is a member that electrically connects the first type of electronic component 10M to the wiring substrate 40. In this embodiment, the connecting member 20M connects the electronic component 10M to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. In this embodiment, the width L12 of the connecting member 20M in the long side direction (e.g., the X direction) of the electronic component 10M is smaller than the width L11 in the long side direction of the electronic component 10M. The connecting member 20M has, for example, a first portion 21 and a second portion 22.

[0147] (Part 1)

[0148] The first portion 21 of the connecting member 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid portion extending along the Z direction. The first portion 21 extends along one end of the electronic component 10M (e.g., the end in the X direction). The first portion 21 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X direction) and connected to the terminal 13 of the electronic component 10M from the horizontal direction (e.g., the X direction).

[0149] The first portion 21 of the connecting member 20M has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) passes. The first mounting hole 21h is open in a horizontal direction (e.g., the X direction). Additionally, the first portion 21 has a recess 25 around the first mounting hole 21h. The recess 25 is a receiving portion that accommodates the head of the fastening member 71 inserted into the first mounting hole 21h. By engaging the fastening member 71 passing through the first mounting hole 21h with the mounting hole 13h of the terminal 13 of the electronic component 10M, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10M. Alternatively, the first portion 21 may not have the recess 25.

[0150] (Part Two)

[0151] The second part 22 of the connecting component 20M is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second part 22 of the connecting member 20M is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20M has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second mounting hole 22h of the second portion 22 is through which the fastening member 43 passes. And, by making the engaging member 44 (e.g., a nut, see...) Figure 3 The first part 21 engages with the end of the fastening member 43 passing through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42. In this embodiment, a connecting member 20M is formed in an L-shape by the first part 21 and the second part 22.

[0152] <3.1.3 Second Type of Electronic Components>

[0153] Figure 6 This is a perspective view showing a second type of electronic component 10N and a second type of connecting component 20N. The second type of electronic component 10N is an electronic component with two terminals 13 separately disposed at both ends in the horizontal direction. The electronic component 10N, for example, has a housing 11, a main body 12, and a plurality of terminals 13. Furthermore, in the structure of the electronic component 10N, structures having the same function as electronic component 10M are labeled with the same reference numerals. In this case, for the description of the electronic component 10N, "electronic component 10M" in the above description of electronic component 10M will be replaced with "electronic component 10N".

[0154] In electronic component 10N, terminals 13A and 13B are separately disposed at opposite ends of electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole 13h opens in the Z direction. For example, the mounting hole 13h of electronic component 10N is a through hole through which the fastening member 72 passes. One of terminals 13A and 13B is an example of a "first terminal". The other of terminals 13A and 13B is an example of a "second terminal".

[0155] <3.1.4 Second type of connecting component>

[0156] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N to the wiring substrate 40. In this embodiment, the connection member 20N connects the electronic component 10N to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. In this embodiment, the width L12 of the connecting member 20N in the long side direction (e.g., the X direction) of the electronic member 10N is smaller than the width L11 in the long side direction of the electronic member 10N. The connecting member 20N has, for example, a first portion 21, a second portion 22, and a third portion 23.

[0157] (Part 1)

[0158] The first portion 21 of the connecting member 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a cuboid portion extending in the Z direction. The first portion 21 is an upright portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 21 is adjacent to the terminal 13 of the electronic component 10N in the Z direction and is connected to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting member 20N has a first mounting hole 21h for engaging with the fastening member 72. The first mounting hole 21h is open in the Z direction. The inner peripheral surface of the first mounting hole 21h of the connecting member 20N has a threaded groove. By engaging the fastening member 72, which passes through the mounting hole 13h of the terminal 13 of the electronic component 10N, with the first mounting hole 21h of the first portion 21, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10N.

[0159] (Part Two)

[0160] The second part 22 of the connecting component 20N is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second part 22 of the connecting member 20N is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20N has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h opens in the Z direction. In the second portion 22, the fastening member 43, described later, passes through the second mounting hole 22h. And, by engaging the engaging member 44 (e.g., a nut, see...) Figure 3 The second part 22 engages with the end of the fastening member 43 that passes through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42.

[0161] (Part Three)

[0162] The third part 23 is an upright wall (side wall) that rises from both ends of the second part 22 in the horizontal direction towards the +Z direction. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and to the second part 22. The third part 23 extends obliquely, for example, in a manner that widens in the X direction as it moves towards the -Z direction. Furthermore, the third part 23 may also be provided in the aforementioned connecting member 20M. On the other hand, the connecting member 20N may not have the third part 23.

[0163] <3.2 Connecting components for external connections>

[0164] Next, the connecting component 30 for external connection will be described.

[0165] Figure 7 This is a perspective view showing the connection member 30 for external connection. The connection member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connection member 30 connects the external connection busbar 76 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The external connection is electrically connected to the external device via busbar 76. In this disclosure, "external device" refers to an electrical device located outside the electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples. The connection component 30 may have, for example, a first portion 31, a second portion 32, and a third portion 33.

[0166] (Part 1)

[0167] The first part 31 is the portion connected to the external connection busbar 76. The first part 31 is a cuboid portion extending along the Z direction. The first part 31 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first part 31 is adjacent to and connected to the external connection busbar 76 in the Z direction. The first part 31 has a first mounting hole 31h through which a fastening member 73 (e.g., a screw or bolt) passes. The first mounting hole 31h is open in the Z direction. The inner circumferential surface of the first mounting hole 31h has a threaded groove. By engaging the fastening member 73, which passes through the mounting hole 76h of the external connection busbar 76, with the mounting hole 31h of the first part 31, the first part 31 is physically and electrically connected to the external connection busbar 76.

[0168] (Part Two)

[0169] Part 2, 32, is related to busbar 42 (see reference). Figure 8 The second part 32 protrudes horizontally (e.g., in the X direction) from the end of the first part 31 on the -Z direction side. The second part 32 is a plate portion along the horizontal direction. The second part 32 is adjacent to and connected to the busbar 42 in the Z direction. The second part 32 is mounted in the Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 42) protruding in the +Z direction from the busbar 42. Figure 8 The second part 32 is physically and electrically connected to the busbar 42. In this embodiment, the second part 32 has a second mounting hole 32h through which the fastening member 43 passes. The second mounting hole 32h opens in the Z direction. In the second part 32, the fastening member 43, described later, passes through the second mounting hole 32h. And, by engaging the locking member 44 (e.g., a nut, see...) Figure 3 The second part 32 engages with the end of the fastening member 43 that passes through the second mounting hole 32h, thereby fixing the second part 32 to the busbar 42.

[0170] (Part Three)

[0171] The third part 33 is an upright wall (side wall) that rises from both ends of the second part 32 in the horizontal direction toward the +Z direction. The third part 33 is a wall along the Z direction. The third part 33 is connected to the first part 31 and to the second part 32. The third part 33 extends obliquely, for example, in a manner that widens in the X direction (or Y direction) as it moves toward the -Z direction. Alternatively, the connecting member 30 may not have the third part 33.

[0172] <3.3 Substrate for Wiring>

[0173] Next, the wiring substrate 40 will be described.

[0174] Figure 8 This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between an electronic component 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped," "sheet-shaped," or "plane" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction locally, or cases where there are uneven shapes on the surface that follow the thickness of the busbar, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0175] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and a plurality of fastening members 43. In this embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Furthermore, the wiring substrate 40 may also be formed by other structures instead of insert molding. A variation of the wiring substrate 40 formed by another structure will be described later.

[0176] Figure 9 This is an exploded perspective view of a portion of the wiring substrate 40. Hereinafter, for ease of explanation, the substrate 41, busbar 42, and fastening member 43 will be described with reference to the exploded view of the wiring substrate 40.

[0177] (Substrate board)

[0178] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 is an example of a "substrate component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52. The fixing portions 52 will be described later.

[0179] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0180] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0181] The planar portion 51 may have one or more receiving portions 55, for example, each receiving a busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole penetrating the planar portion 51 in the Z direction. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction, rather than a through hole. It should also be noted that in this disclosure, "the receiving portion penetrating the planar portion in the first direction (Z direction)" may also include a portion of the total length of the receiving portion 55 penetrating the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole that penetrates the planar portion 51 in the Z direction, or it may be a form that is provided inside the base plate 41 and does not expose to the outside of the base plate 41).

[0182] Viewed from the Z direction, each receiving portion 55 has a shape corresponding to the shape of the received busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55. Receiving portion 55A is provided corresponding to busbar 42A (described later) and receives busbar 42A. Receiving portion 55B is provided corresponding to busbar 42B (described later) and receives busbar 42B. Receiving portion 55C is provided corresponding to busbar 42C (described later) and receives busbar 42C. Receiving portion 55D is provided corresponding to busbar 42D (described later) and receives busbar 42D. Receiving portion 55E is provided corresponding to busbar 42E (described later) and receives busbar 42E.

[0183] (Busbar)

[0184] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 can also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0185] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is housed in a housing portion 55 and extends along the planar portion 51 along its entire length. Hereinafter, the portion of each busbar 42 housed in the housing portion 55 and extending along the planar portion 51 is sometimes referred to as "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component".

[0186] Figure 10 This is a top view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 on its plate portion 42p.

[0187] The first connecting portion 61 is the portion that contacts a connecting member 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is a connecting member that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction and is connected to the first connecting member 20 from the Z direction.

[0188] The second connecting portion 62 is the portion that contacts other connecting members 20 (hereinafter referred to as "second connecting members 20"). The second connecting member 20 is a connecting member that connects other electronic components 10 (hereinafter referred to as "second electronic components 10") included in a plurality of electronic components 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction and is connected to the second connecting member 20 from the Z direction.

[0189] Alternatively, the second connecting portion 62 may be a portion that contacts other connecting members 30 (hereinafter referred to as "second connecting member 30") instead of the example described above. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 30 in the Z direction and is connected to the second connecting member 30 from the Z direction.

[0190] Alternatively, the second connecting portion 62 may be a portion that contacts the connecting busbar 75 for connecting to other subunits SU without contacting the connecting members 20 and 30. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to and connected to the connecting busbar 75 in the Z direction.

[0191] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0192] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51, at least covering the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0193] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing 55, extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extensions 63 extend in a straight line along the X direction. The extensions 63 extend through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across the +X and -X direction sides of the region R. That is, since the busbars 42 are housed in the housing 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0194] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension portion 63. The extension portion 64 is a portion of the busbar 42 extended for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connecting portion 61 (or the second connecting portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10 when viewed from the Z direction.

[0195] The following describes several layout examples of busbar 42. Furthermore, the plurality of electronic components 10 includes three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B are, for example, first-type electronic components 10M. Electronic component 10C is, for example, second-type electronic components 10N. Moreover, the types of electronic components 10 are not limited to the examples described above. Additionally, the plurality of connecting components 20 includes six connecting components 20A, 20B, 20C, 20D, 20E, and 20F. The plurality of connecting components 30 includes two connecting components 30A and 30B. The plurality of connecting busbars 75 includes two connecting busbars 75A and 75B. The plurality of external connection busbars 76 includes two external connection busbars 76A and 76B.

[0196] (First deployment example)

[0197] First, a layout example related to busbar 42A will be described. Busbar 42A has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. When viewed from the Z direction, the first connecting portion 61 is located on the +X direction side relative to the electronic component 10A. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10A via a connecting member 20A, which serves as a first connecting member 20. When viewed from the Z direction, the second connecting portion 62 is located on the -X direction side relative to the electronic component 10A. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75A.

[0198] Since the extension 63 is housed in the housing 55, it extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction and across both sides of the region R. For example, the extension 63 extends in a straight line along the X direction. The extension 63 extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction and across the +X and -X direction sides of the region R. The busbar 42A is an example of a "first busbar". The housing 55A housing the busbar 42A is an example of a "first housing". The busbar 42A is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0199] (Second deployment example)

[0200] Next, an example of the arrangement related to busbar 42B will be described. Busbar 42B has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10A via a connecting member 20B, which is a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76A via a connecting member 30A, which is a second connecting member 30. When viewed from the Z direction, the extension portion 64 extends to the region R that overlaps with the electronic component 10A, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10A. Furthermore, busbar 42B may also have an extension portion 63 similar to busbar 42A, which extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. Busbar 42B is another example of a "first busbar". The receiving portion 55B that receives busbar 42B is another example of a "first receiving portion". From another perspective, busbar 42B is an example of a "second busbar". Reception section 55B is another example of a "second reception section". Busbar 42B is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0201] (Third deployment example)

[0202] Next, a layout example related to busbar 42C will be described. Busbar 42C has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10B via a connecting member 20C, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75B. The extension portion 64 extends to a region R that overlaps with the electronic component 10B when viewed from the Z direction, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10B when viewed from the Z direction. Busbar 42C is another example of a "first busbar". The receiving portion 55C that houses busbar 42C is another example of a "first receiving portion". Busbar 42C is, for example, a busbar included in the negative line NL of the electrical connection unit 1. From another perspective, busbar 42C is an example of a "third busbar". Containment Unit 55C is an example of the "Third Containment Unit".

[0203] (Fourth deployment example)

[0204] Next, a layout example related to busbar 42D will be described. Busbar 42D has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to terminal 13A of electronic component 10B via connecting member 20D, which is a first connecting member 20. The second connecting portion 62 is electrically connected to terminal 13B of electronic component 10C via connecting member 20E, which is a second connecting member 20. Busbar 42D is another example of a "first busbar". The receiving portion 55D that houses busbar 42D is another example of a "first receiving portion". Busbar 42D is, for example, a busbar included in the negative line NL of electrical connection unit 1. From another perspective, busbar 42D is another example of a "third busbar". The receiving portion 55D is another example of a "third receiving portion".

[0205] (Fifth Layout Example)

[0206] Next, a layout example related to busbar 42E will be described. Busbar 42E has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10C via a connecting member 20F, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76B via a connecting member 30B, which serves as a second connecting member 30. Busbar 42E is another example of a "first busbar". The receiving portion 55E that houses busbar 42E is another example of a "first receiving portion". Busbar 42E is, for example, a busbar included in the negative line NL of the electrical connection unit 1. From another perspective, busbar 42E is another example of a "third busbar". The receiving portion 55E is another example of a "third receiving portion".

[0207] (Fastening components)

[0208] Next, refer to again Figure 9 The fastening component 43 will now be described. The fastening component 43 is a component used to secure the busbar 42 to a connecting component (connecting component 20, connecting component 30, connecting busbar 75, or connecting component 100) of the busbar 42. The fastening component 43 is, for example, a riveting bolt fixed to the busbar 42. The fastening component 43 is an example of a "fastening part".

[0209] In this embodiment, the first connecting portion 61 and the second connecting portion 62 of the busbar 42 each have a through hole 42h. The through hole 42h penetrates the busbar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head 43b. The circumferential surface of the shaft portion 43a has a threaded groove. The diameter of the head 43b is larger than the diameter of the shaft portion 43a. With the shaft portion 43a passing through the through hole 42h of the busbar 42, the head 43b of the fastening member 43 is riveted to the busbar 42. Through this fixation, with the shaft portion 43a protruding from the through hole 42h of the busbar 42 in the +Z direction, the fastening member 43 is electrically and physically connected to the busbar 42. Furthermore, the fastening member 43 is not limited to riveting; it can also be fixed to the busbar 42 by welding or other methods.

[0210] In this embodiment, the connecting member 20 is first fixed to the electronic component 10 by the fastening member 71 or the fastening member 72, and then mounted to the fastening member 43 in the Z direction. For example, the connecting member 20 is used to insert the shaft portion 43a of the fastening member 43 into the second mounting hole 22h of the second part 22. Then, the engaging member 44 (e.g., a nut) engages with the shaft portion 43a of the fastening member 43, which protrudes from the second mounting hole 22h of the second part 22 of the connecting member 20. The engaging member 44 is mounted to the shaft portion 43a, for example, along the Z direction. Through this engagement, the second part 22 of the connecting member 20 is fixed to the fastening member 43.

[0211] <4. Metal plates, insulating sheets, heat-conducting components, and insulating covers>

[0212] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0213] <4.1 Metal Plate>

[0214] Figure 11 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 may also be referred to as a "rigid component".

[0215] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the long side of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0216] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 has a gap S1 (see reference) between it and the second surface 51b of the planar portion 51 of each sub-unit SU. Figure 13 ), and the second surface 51b of the planar portion 51 facing each subunit SU. The gap S1 is an example of the "first gap".

[0217] The fixing part 82 is used to fix the base plate 41 of each sub-unit SU to the metal plate 80. Viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss protruding from the flat portion 81 of the metal plate 80 in the +Z direction. The fixing part 82 will be described in detail later.

[0218] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction. The fixing part 83 will be described in detail later.

[0219] <4.2 Insulating Sheets>

[0220] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0221] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be provided between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above. Furthermore, if the heat-conducting components 92 are insulating and the necessary insulation is ensured by the heat-conducting components 92, the insulating sheet 91 may be omitted.

[0222] <4.3 Thermal Conductive Components>

[0223] The thermally conductive component 92 is a component used to transfer heat generated by the electronic component 10 when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 80. The thermally conductive component 92 is, for example, a flexible thermally conductive sheet (e.g., a thermally conductive silicone sheet). The thermally conductive component 92 is formed, for example, of a material with a higher thermal conductivity than the substrate plate 41. However, the thermally conductive component 92 is not limited to the above examples and may also be a thermally conductive component formed of thermally conductive gel or other materials.

[0224] Figure 12 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of heat-conducting components 92 are partially disposed in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged near the electronic components 10 (e.g., electronic components 10A, 10B) at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0225] Figure 13 It is along Figure 10 The diagram shows a cross-sectional view along line F13-F13 of the structure. In this embodiment, a heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80.

[0226] In this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 via the busbar 42 from the connecting component 20 to the metal plate 80.

[0227] In this embodiment, a portion of the heat-conducting component 92 is positioned to overlap with and contact the head 43b of the fastening component 43 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0228] Furthermore, in this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 13 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0229] (Modified Example)

[0230] Figure 14 This is a cross-sectional view showing a modified example. In this modified example, an air layer AS serves as a gap between the busbar 42 and the electronic component 10. The busbar 42 is thermally connected to the electronic component 10 via the air layer AS. According to this structure, the heat generated by the electronic component 10 moves to the busbar 42 through the air layer AS. The heat that moves to the busbar 42 is dissipated by moving to the metal plate 80 via the heat-conducting component 92.

[0231] (Modified Example)

[0232] Figure 15This is a cross-sectional view showing another variation. In this variation, a heat-conducting component 98 is provided between the busbar 42 and the electronic component 10. The heat-conducting component 98 is located between the busbar 42 and the electronic component 10 in the Z direction. The busbar 42 is thermally connected to the electronic component 10 via the heat-conducting component 98. The heat-conducting component 98 allows heat generated by the electronic component 10 to move towards the busbar 42. The heat-conducting component 98 is, for example, a flexible heat-conducting sheet (e.g., a thermally conductive silicone sheet). However, the heat-conducting component 98 is not limited to the above example and can also be a heat-conducting component formed of thermally conductive gel or other materials. According to this structure, the heat generated by the electronic component 10 moves efficiently towards the busbar 42 via the heat-conducting component 98. The heat that has moved to the busbar 42 is dissipated by moving towards the metal plate 80 via the heat-conducting component 92.

[0233] <4.4 Insulating Cover>

[0234] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to prevent contact with the electrical path of the main body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the electrical path of the main body MU.

[0235] <5. Exposed Structure of Busbars>

[0236] Next, the exposed structure of the busbar 42 will be described.

[0237] <5.1 Exposed structure on the upper surface side of the busbar>

[0238] First, refer to Figure 8 The exposed structure on the upper surface side of the busbar 42 will be described. In this embodiment, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate 41 on the upper surface side (the first surface 51a side of the planar portion 51). For example, the extension 63 of the busbar 42 overlaps with the electronic component 10 at least in the region R (refer to) when viewed from the Z direction. Figure 10 Part of it is exposed on the upper surface laterally to the outside of the substrate plate 41.

[0239] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length between the first connecting portion 61 and the second connecting portion 62 and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the base plate 41 on the upper surface, along its entire length between the first connecting portion 61 and the second connecting portion 62.

[0240] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the substrate plate 41 on the upper surface along its entire length.

[0241] like Figure 13 As shown, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side (second surface 51b side), in addition to the upper surface side. For example, the entire length of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side.

[0242] (Modified Example)

[0243] Figure 16 This is a cross-sectional view showing a modified example. In this modified example, the planar portion 51 of the base plate 41 has a cover 51v on the lower surface side (second surface 51b side) that covers at least a portion of the extension 63 of the busbar 42. In the area covered by the cover 51v, the busbar 42 is not exposed on the lower surface side. The cover 51v may also be provided along the entire length of the busbar 42. In addition, when viewed from the Z direction, the cover 51v may, for example, not be provided in the area overlapping with the heat-conducting member 92.

[0244] <5.2 Exposed Structure on the Lower Surface Side of the Busbar>

[0245] Next, refer to Figure 13 The exposed structure on the lower surface side of the busbar 42 will be described. In this embodiment, the plate portion 42p of the busbar 42 includes an exposed portion 42u on the lower surface side (the second surface 51b side of the planar portion 51) that exposes to the outside of the base plate 41. In this embodiment, the exposed portion 42u of the busbar 42 extends along the entire length of the busbar 42. In this embodiment, a heat-conducting member 92 is disposed between the exposed portion 42u of the busbar 42 and the metal plate 80. For example, the heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42.

[0246] In this embodiment, at least a portion of the exposed portion 42u of the busbar 42 is disposed in the region that overlaps with the connecting member 20 when viewed from the Z direction. At least a portion of the heat-conducting member 92 overlaps with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction. For example, at least a portion of the heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction.

[0247] In this embodiment, the exposed portion 42u of the busbar 42 includes a first portion 42ua disposed in the region overlapping with the connecting member 20 when viewed from the Z direction, and a second portion 42ub disposed in the region overlapping with the electronic component 10 when viewed from the Z direction.

[0248] The heat-conducting component 92 includes a first heat-conducting portion 92a and a second heat-conducting portion 92b. The first heat-conducting portion 92a overlaps with a first portion 42ua of the exposed portion 42u of the busbar 42 in the region overlapping with the connecting component 20 when viewed from the Z direction. For example, the first heat-conducting portion 92a is in contact with the first portion 42ua of the exposed portion 42u of the busbar 42. On the other hand, the second heat-conducting portion 92b overlaps with a second portion 42ub of the exposed portion 42u of the busbar 42 in the region overlapping with the electronic component 10 when viewed from the Z direction. For example, the second heat-conducting portion 92b is in contact with the second portion 42ub of the exposed portion 42u of the busbar 42.

[0249] It should be noted that, as described above, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side (first surface 51a side), in addition to the lower surface side. For example, the entire length of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side. For example, the second portion 42ub of the exposed portion 42u of the busbar 42 is also exposed to the outside of the substrate plate 41 on the upper surface side, in addition to the lower surface side, and faces the electronic component 10.

[0250] (Modified Example)

[0251] Figure 17 This is a cross-sectional view showing a modified example. In this modified example, the planar portion 51 of the base plate 41 has a cover portion 51v on the upper surface side (first surface 51a side) that covers at least a portion of the extension 63 of the busbar 42. In the area covered by the cover portion 51v, the busbar 42 is not exposed on the upper surface side. Alternatively, the cover portion 51v may be provided along the entire length of the busbar 42. Furthermore, the cover portion 51v may, for example, not be provided in the area that overlaps with the first connecting portion 61 and the second connecting portion 62 when viewed from the Z direction.

[0252] <6. Three-dimensional cabling structure of busbars>

[0253] Next, the three-dimensional wiring structure CS of busbar 42 will be explained.

[0254] Figure 18 This is a three-dimensional view showing the three-dimensional wiring structure CS of busbar 42. Figure 19This is a top view showing a three-dimensional cabling structure CS with busbars 42. The three-dimensional cabling structure CS has busbars 42F, 42G, 42H, and 42I as multiple busbars 42. Additionally, the three-dimensional cabling structure CS includes multiple connecting components 100. Furthermore, the three-dimensional cabling structure CS includes connecting busbars 75C and 75D as multiple connecting busbars 75.

[0255] Busbars 42F and 42G are, for example, busbars 42 included in subunit SUY. The planar portion 51 of the base plate 41 of subunit SUY has receiving portions 55F and 55G as multiple receiving portions 55. Busbar 42F is received in receiving portion 55F and extends along the planar portion 51. Busbar 42G is received in receiving portion 55G and extends along the planar portion 51. Busbar 42F is an example of a "first busbar". The receiving portion 55F that receives busbar 42F is an example of a "first receiving portion". Busbar 42G is an example of a "fourth busbar". The receiving portion 55G that receives busbar 42G is an example of a "fourth receiving portion". Busbars 42F and 42G are busbars 42 located in the first layer (lower layer) of the three-dimensional wiring structure CS.

[0256] In this embodiment, the busbar 42F has a first portion 42Fa extending in the X direction and a second portion 42Fb that bends from the first portion 42Fa and extends in the Y direction. The second portion 42Fb extends along the boundary B between subunit SUY and subunit SUZ.

[0257] On the other hand, busbars 42H and 42I are, for example, busbars 42 included in subunit SUZ. The planar portion 51 of the base plate 41 of subunit SUZ has receiving portions 55H and 55I as a plurality of receiving portions 55. Busbar 42H is received in receiving portion 55H and extends along planar portion 51. Busbar 42I is received in receiving portion 55I and extends along planar portion 51. Busbars 42H and 42I are busbars 42 located in the first layer (lower layer) of the three-dimensional wiring structure CS.

[0258] The connecting member 100 has the same structure as the connecting member 30 for external connection described above. For example, the connecting member 100 has a first part 101, a second part 102, and a third part 103. Furthermore, regarding the details of the connecting member 100, in the description related to the connecting member 30 described above, simply replace "connecting member 30" with "connecting member 100", "first part 31" with "first part 101", "first mounting hole 31h" with "first mounting hole 101h", "second part 32" with "second part 102", "second mounting hole 32h" with "second mounting hole 102h", and "third part 33" with "third part 103". The connecting member 100 is a member that forms a vertical power path. The connecting member 100 can also be referred to as a "vertical wiring member".

[0259] Multiple connecting components 100 include connecting component 100A and connecting component 100B. Viewed from the Z direction, connecting component 100A overlaps with the second connecting portion 62 of busbar 42G within the subunit SUY. Connecting component 100A is adjacent to and connected to the second connecting portion 62 of busbar 42G from the Z direction. Connecting component 100A extends from busbar 42G towards the +Z direction. Connecting component 100A is an example of a "third connecting component".

[0260] Viewed from the Z direction, the connecting member 100B overlaps with the second connecting portion 62 of the busbar 42I in the subunit SUZ. The connecting member 100B is adjacent to the second connecting portion 62 of the busbar 42I in the Z direction and is connected to the second connecting portion 62 of the busbar 42I from the Z direction. The connecting member 100B stands upright from the busbar 42I in the +Z direction.

[0261] One end of the connecting bus 75C is adjacent to the second connection portion 62 of bus 42F in the Z direction within sub-unit SUY, and is connected to the second connection portion 62 of bus 42F in the Z direction. The other end of the connecting bus 75C is adjacent to the second connection portion 62 of bus 42H in the Z direction within sub-unit SUZ, and is connected to the second connection portion 62 of bus 42H in the Z direction. According to this structure, bus 42F of sub-unit SUY and bus 42H of sub-unit SUZ are electrically connected via the connecting bus 75C. The connecting bus 75C is a bus 75 located in the first layer (lower layer) of the three-dimensional cabling structure CS.

[0262] On the other hand, the connecting busbar 75D is adjacent to the first portion 101 of the connecting member 100A in the Z direction in the sub-unit SUY, and is connected to the first portion 101 of the connecting member 100A in the Z direction. The other end of the connecting busbar 75D is adjacent to the first portion 101 of the connecting member 100B in the Z direction in the sub-unit SUZ, and is connected to the first portion 101 of the connecting member 100B in the Z direction.

[0263] The connecting bus 75D is supported by the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B at a position away from the bus 42F in the Z direction. The connecting bus 75D is supported by the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B, and extends in a horizontal direction (e.g., the X direction). The connecting bus 75D is electrically connected to the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B. According to this structure, the bus 42F of subunit SUY and the bus 42I of subunit SUZ are electrically connected via the two connecting members 100 and the connecting bus 75D. The connecting bus 75D is an example of a "fifth bus".

[0264] In this embodiment, the connecting bus 75D extends across the second portion 42Fb of bus 42F at a position away from bus 42F in the +Z direction. Thus, a three-dimensional cross structure is formed by the connecting bus 75D and bus 42F. In this embodiment, the connecting bus 75D extends across the boundaries B of multiple sub-units SU.

[0265] In this embodiment, the three-dimensional wiring structure CS of the busbar 42 is positioned across the boundary B of the multiple sub-units SU. With this arrangement, the connection structure between the multiple sub-units SU is strengthened by the three-dimensional wiring structure CS. Alternatively, the three-dimensional wiring structure CS of the busbar 42 may not be positioned at the boundary B of the multiple sub-units SU, but rather within one or more sub-units SU.

[0266] <7. Fixed Structure>

[0267] Next, the fixed structure of the subunit SU will be explained.

[0268] <7.1 Structure of Metal Plates>

[0269] Figure 20 It is along Figure 10 The structure shown is a cross-sectional view along line F20-F20. As described above, the metal plate 80 has a fixing part 82 and a fixing part 83.

[0270] The fixing part 82 is a boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction. The fixing part 82 protrudes further in the +Z direction than, for example, the first surface 51a of the flat part 51 of the base plate 41. In this embodiment, the fixing part 82 protrudes further in the +Z direction than the fixing part 83 described later. The fixing part 82 faces the fixing part 52 of the base plate 41 in the Z direction. The fixing part 82 has a locking hole 82h that opens in the +Z direction. The inner circumferential surface of the locking hole 82h has a threaded groove. The fixing part 82 is an example of a "first fixing part". The locking hole 82h is an example of a "first locking hole".

[0271] The fixing part 83 is a boss protruding from the planar part 81 in the +Z direction. The fixing part 83 is inserted into the through hole 51h of the planar part 51 of the base plate 41 (described later). The fixing part 83 protrudes through the through hole 51h of the planar part 51 to a position at the same level as the first surface 51a of the planar part 51, or to a position beyond the first surface 51a of the planar part 51 (a position on the +Z direction side compared to the first surface 51a). The fixing part 83 faces the mounting part 14 of the electronic component 10 in the Z direction. The fixing part 83 has a locking hole 83h that opens in the +Z direction. The inner peripheral surface of the locking hole 83h has a threaded groove. The fixing part 83 is an example of a "second fixing part". The locking hole 83h is an example of a "second locking hole".

[0272] A fastening member 112 (e.g., a screw or bolt) passes through the mounting hole 14h of the mounting portion 14 of the electronic component 10 from the +Z direction side. When the fastening member 112 passing through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engaging hole 83h of the fixing portion 83 of the metal plate 80, the electronic component 10 is fixed to the metal plate 80 without passing through the base plate 41. The fastening member 112 is an example of a "second fastening member".

[0273] <7.2 Structure of the substrate for wiring>

[0274] The base plate 41 has a fixing part 52 that is fixed to the fixing part 82 of the metal plate 80. The fixing part 52 has, for example, an upright plate part 52a and a horizontal plate part 52b.

[0275] The upright plate portion 52a rises from the end of the flat portion 51 of the base plate 41 toward the +Z direction. The upright plate portion 52a is a plate portion along the Y and Z directions. The thickness direction of the upright plate portion 52a is the X direction.

[0276] The horizontal plate portion 52b extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is a plate portion along the horizontal direction. The horizontal plate portion 52b faces the fixing portion 82 of the metal plate 80 in the Z direction. The horizontal plate portion 52b has an insertion hole 52h for engaging the fixing portion 82 of the metal plate 80. A fastening member 111 (e.g., a screw or bolt) passes through the insertion hole 52h. When the fastening member 111, passing through the insertion hole 52h of the fixing portion 52 of the base plate 41, engages with the engaging hole 82h of the fixing portion 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80. The fastening member 111 is an example of a "first fastening member".

[0277] Furthermore, the planar portion 51 of the substrate 41 has the aforementioned through hole 51h. The through hole 51h penetrates the planar portion 51 in the Z direction. When viewed from the Z direction, the through hole 51h is located at a position corresponding to the fixing portion 83 of the metal plate 80. The fixing portion 83 of the metal plate 80 protrudes through the through hole 51h of the substrate 41 to a position at the same level as the first surface 51a of the planar portion 51, or at a position closer to the +Z direction side than the first surface 51a of the planar portion 51. The mounting portion 14 of the electronic component 10 is fixed to the fixing portion 83 at a position at the same level as the first surface 51a of the planar portion 51, or at a position closer to the +Z direction side than the first surface 51a of the planar portion 51.

[0278] <8. Heat dissipation paths related to fixed structures>

[0279] Next, the heat dissipation path related to the fixing part 83 of the metal plate 80 will be explained.

[0280] Figure 21 This is a cross-sectional view illustrating the heat dissipation path associated with the fixing portion 83 of the metal plate 80. In this embodiment, the fixing portion 83 of the metal plate 80 does not contact the high-temperature portion (e.g., terminal 13) of the electronic component 10. In this embodiment, an air gap S2 is provided between the inner peripheral surface 51ha of the through hole 51h of the substrate plate 41 and the fixing portion 83. The through hole 51h may be opened relatively large, for example, such that a portion of the through hole 51h does not overlap with the mounting portion 14 of the electronic component 10 when viewed from the Z direction (a portion of the through hole 51h is located on the outer peripheral side of the mounting portion 14 when viewed from the Z direction). The fixing portion 83 is an example of a "protrusion".

[0281] In this embodiment, the temperature of the fixing portion 83 of the metal plate 80 is tended to be lower than the temperature of the busbar 42. In this case, convection occurs due to the temperature difference between the fixing portion 83 (low temperature) of the metal plate 80 and the busbar 42 (high temperature).

[0282] Specifically, corresponding to the upward flow of warm air generated around the busbar 42 (refer to arrow A1), a downward flow is generated around the fixing portion 83 of the metal plate 80, passing through the through hole 51h of the base plate 41 and moving downward toward the base plate 41 (refer to arrow A2). When this downward flow is generated, an upward flow is generated due to the air propelled by the downward flow (refer to arrow A3). This upward flow is generated in such a way that warm air in the gap S1 between the metal plate 80 and the base plate 41 moves upward (outside the gap S1) near the inner circumferential surface 51ha of the through hole 51h. This suppresses the accumulation of warm air in the gap S1 between the metal plate 80 and the base plate 41, promoting heat dissipation of the electrical connection unit 1.

[0283] (Modified Example)

[0284] Figure 22 This is a cross-sectional view illustrating a modified example of the heat dissipation path. In this modified example, the metal plate 80 has a protrusion 84 in addition to or replacing the fixing part 83. The protrusion 84 is a heat dissipation protrusion. The protrusion 84 may not be used in the fixing structure. The protrusion 84 is a cylindrical or prismatic boss that protrudes from the planar part 81 of the metal plate 80 in the +Z direction. The protrusion 84 is inserted into the through hole 51h of the planar part 51 of the base plate 41. For example, the protrusion 84 passes through the through hole 51h of the planar part 51 and protrudes to the same position as the first surface 51a of the planar part 51, or to a position beyond the first surface 51a of the planar part 51 (a position closer to the +Z direction side than the first surface 51a).

[0285] According to the structure of this modified example, the temperature of the protrusion 84 of the metal plate 80 is easily lower than the temperature of the busbar 42. In this case, convection is generated due to the temperature difference between the protrusion 84 (low temperature) of the metal plate 80 and the busbar 42 (high temperature). As a result, the airflow indicated by arrows A1 to A3 is generated, promoting heat dissipation of the electrical connection unit 1.

[0286] <9. Absorbing structures for thermal expansion / contraction associated with fixed structures>

[0287] Next, the absorption structure for thermal expansion / contraction related to the fixed structure will be explained.

[0288] Figure 23This is a cross-sectional view illustrating the thermal expansion / contraction absorption structure associated with the fixing part 82. In this embodiment, the wiring substrate 40 of the sub-unit SUX has a base plate 41 and a busbar 42. The planar portion 51 of the base plate 41 has a receiving portion 55 for receiving the busbar 42. The fixing part 52 of the base plate 41 has an upright plate portion 52a that rises in the Z direction from the planar portion 51 and a horizontal plate portion 52b that extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is disposed at a position different from the first surface 51a in the Z direction. The horizontal plate portion 52b has an insertion hole 52h through which the fastening member 111 passes. The horizontal plate portion 52b is fixed to the fixing part 82 of the metal plate 80 by the fastening member 111.

[0289] The metal plate 80 has a fixing part 83 that protrudes from the flat part 81 of the metal plate 80 and is inserted into the through hole 51h of the base plate 41 for fixing the electronic component 10. The length L1 of the upright plate part 52a in the Z direction is greater than the length L2 of the fixing part 83 in the Z direction.

[0290] The busbar 42 of the subunit SUX is an example of a "first busbar". The base plate 41 of the subunit SUX is an example of a "first base component". The flat portion 51 of the subunit SUX is an example of a "first flat portion". The upright plate portion 52a of the subunit SUX is an example of a "first part". The horizontal plate portion 52b of the subunit SUX is an example of a "second part". The fixing portion 82 of the metal plate 80 is an example of a "first fixing portion". The fixing portion 83 of the metal plate 80 is an example of a "second fixing portion".

[0291] In this embodiment, the wiring substrate 40 of the sub-unit SUY has a base plate 41 and a busbar 42. The planar portion 51 of the base plate 41 has a receiving portion 55 for receiving the busbar 42. The fixing portion 52 of the base plate 41 has an upright plate portion 52a that rises in the Z direction from the planar portion 51 and a horizontal plate portion 52b that extends horizontally from the +Z direction end of the upright plate portion 52a. The horizontal plate portion 52b is disposed at a position different from the first surface 51a in the Z direction. The horizontal plate portion 52b of the base plate 41 of the sub-unit SUY overlaps with the base plate 41 and the horizontal plate portion 52b of the sub-unit SUX. The horizontal plate portion 52b of the base plate 41 of the sub-unit SUY has a through hole 52h for the fastening member 111 to pass through. The horizontal plate portion 52b of the base plate 41 of the sub-unit SUY, together with the base plate 41 and the horizontal plate portion 52b of the sub-unit SUX, are fastened together to the fixing portion 82 of the metal plate 80 by the fastening member 111.

[0292] The busbar 42 of subunit SUY is an example of a "second busbar". The base plate 41 of subunit SUY is an example of a "second base component". The planar portion 51 of subunit SUY is an example of a "second planar portion". The first surface 51a of the planar portion 51 of subunit SUY is an example of a "third surface". The second surface 51b of the planar portion 51 of subunit SUY is an example of a "fourth surface". The upright plate portion 52a of subunit SUY is an example of a "third part". The horizontal plate portion 52b of subunit SUY is an example of a "fourth part".

[0293] Figure 24 This is a cross-sectional view illustrating the function of the aforementioned absorption structure. Here, the coefficient of linear expansion of the synthetic resin substrate 41 is greater than that of the metal substrate 80. Therefore, during thermal expansion, the substrate 41 extends much more than the metal substrate 80. On the other hand, during thermal contraction, the substrate 41 contracts more significantly than the metal substrate 80.

[0294] In this embodiment, the fixing portion 52 of the base plate 41 has a standing plate portion 52a. With such a standing plate portion 52a present, during thermal expansion, the standing plate portion 52a bends in the X direction, thereby suppressing large loads acting on the planar portion 51 and / or the fixing portion 52 of the base plate 41. Similarly, during thermal contraction, the standing plate portion 52a bends in the X direction, thereby suppressing large loads acting on the planar portion 51 and / or the fixing portion 52 of the base plate 41.

[0295] <10. Fixed structures associated with multiple subunits>

[0296] Next, return Figure 11 The fixed structure associated with the multiple sub-units SU will be described. In this embodiment, the main body MU is divided into multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ).

[0297] The subunit SUX includes multiple electronic components 10X, a base plate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10X. The subunit SUX is an example of a "first subunit." The electronic components 10X are an example of a "first electronic component." The base plate 41 of the subunit SUX is an example of a "first base component." The planar portion 51 of the base plate 41 of the subunit SUX is an example of a "first planar portion."

[0298] Subunit SUY includes multiple electronic components 10Y, a base plate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10Y. Subunit SUY is electrically connected to subunit SUX, for example, via connecting busbars 75. Subunit SUY is an example of a "second subunit". Electronic components 10Y are an example of a "second electronic component". The base plate 41 of subunit SUY is an example of a "second base component". The planar portion 51 of the base plate 41 of subunit SUY is an example of a "second planar portion".

[0299] Subunit SUZ includes multiple electronic components 10Z, a base plate 41, and multiple busbars 42. The multiple busbars 42 include portions arranged on the same plane and electrically connected to the multiple electronic components 10Z. Subunit SUZ is electrically connected to subunit SUY, for example, via multiple connecting busbars 75. Subunit SUZ is an example of a "third subunit". Electronic components 10Z are an example of a "third electronic component". The base plate 41 of subunit SUZ is an example of a "third base component". The planar portion 51 of the base plate 41 of subunit SUZ is an example of a "third planar portion".

[0300] In this embodiment, multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are respectively fixed to the metal plate 80. Thus, the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are integrally held by a single metal plate 80.

[0301] In this embodiment, the long side of sub-unit SUX is in the X direction. The long side of sub-unit SUY is in the X direction. The long side of sub-unit SUZ is in the X direction. Multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) are adjacent in the X direction and arranged in a row in the X direction. The long side of metal plate 80 is in the X direction. The length of metal plate 80 in the X direction is greater than the sum of the lengths of the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) in the X direction.

[0302] In this embodiment, the fixing part 52 of sub-unit SUX and the fixing part 52 of sub-unit SUY are arranged in a position that overlaps each other in the Z direction. The fixing parts 52 of sub-unit SUX and sub-unit SUY are centrally fixed to the fixing part 82 of metal plate 80 by a fastening member 111. The fixing part 52 of sub-unit SUX is an example of a "first fixing part". The fixing part 52 of sub-unit SUY is an example of a "second fixing part".

[0303] Similarly, the fixing part 52 of sub-unit SUY and the fixing part 52 of sub-unit SUZ are arranged in a position that overlaps each other in the Z direction. The fixing part 52 of sub-unit SUY and the fixing part 52 of sub-unit SUZ are centrally fixed to the fixing part 82 of metal plate 80 by a fastening member 111.

[0304] In this embodiment, the heat generated by the electronic components 10X and busbar 42 included in subunit SUX is transferred to the metal plate 80 via one or more heat-conducting components 92 facing subunit SUX. Similarly, the heat generated by the electronic components 10Y and busbar 42 included in subunit SUY is transferred to the metal plate 80 via one or more heat-conducting components 92 facing subunit SUY. The heat generated by the electronic components 10Z and busbar 42 included in subunit SUZ is transferred to the metal plate 80 via one or more heat-conducting components 92 facing subunit SUZ.

[0305] In this embodiment, the heat generation of multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) may differ. Even when the heat generation of multiple sub-units SU differs, cooling of the multiple sub-units SU (e.g., three sub-units SUX, SUY, and SUZ) can be promoted by using a large metal plate 80. For example, when the heat generation of multiple sub-units SU differs, homogenization of the multiple sub-units SU can be achieved by using a large metal plate 80.

[0306] <11. Regarding the structure of the insulating rib>

[0307] Next, the structure related to insulating rib 53 will be described.

[0308] <11.1 First Method of Insulating Ribs>

[0309] Figure 25 This is a perspective view illustrating a first embodiment of the insulating rib 53. In this embodiment, the substrate 41 has an insulating rib 53. The insulating rib 53 is a rib that rises from the first surface 51a of the planar portion 51 in the +Z direction. The insulating rib 53 is made of synthetic resin and has insulating properties. The insulating rib 53 is provided, for example, as part of the substrate 41. The insulating rib 53 is disposed between two busbars 42 arranged side by side in the exposed state on the above-mentioned surface side (first surface 51a side), and ensures an insulating distance between the two busbars 42. In this embodiment, the first surface 51a is an example of a "first surface". The second surface 51b is an example of a "second surface".

[0310] In this embodiment, the wiring substrate 40 has busbars 42J and busbars 42K as a plurality of busbars 42. In addition, the base plate 41 has receiving portions 55J and receiving portions 55K as a plurality of receiving portions 55.

[0311] At least a portion of busbar 42J is housed in housing portion 55J and extends along planar portion 51. Busbar 42J is electrically connected to terminal 13A of an electronic component 10 (hereinafter sometimes referred to as "first electronic component 10") via connecting member 20. Busbar 42J is an example of "first busbar". Housing portion 55J is an example of "first housing portion".

[0312] At least a portion of busbar 42K is housed in housing portion 55K and extends along planar portion 51. Busbar 42K is electrically connected to terminals 13 of other electronic components 10 (second electronic components) via other connecting members 20. Alternatively, busbar 42J can also be electrically connected to terminals 13B of the first electronic component 10 via the aforementioned other connecting members 20. Busbar 42K is an example of a "second busbar". Housing portion 55K is an example of a "second housing portion".

[0313] In this embodiment, the insulating rib 53 protrudes from the first surface 51a in the +Z direction at the position between the receiving portion 55J and the receiving portion 55K. The insulating rib 53 is an example of both an "insulating wall" and a "first rib".

[0314] In this embodiment, busbar 42J includes a first straight portion 42Ja, which is housed in housing portion 55J with its upper surface side (first surface 51a side) exposed, and extends in a straight line, for example, in the X direction. Busbar 42K includes a second straight portion 42Ka, which is housed in housing portion 55K with its upper surface side (first surface 51a side) exposed, and extends in a straight line, for example, in the X direction. The first straight portion 42Ja of busbar 42J and the second straight portion 42Ka of busbar 42K are adjacent to each other, for example, in the Y direction. The second straight portion 42Ka of busbar 42K extends parallel to the first straight portion 42Ja of busbar 42J.

[0315] Viewed from the Z direction, the insulating rib 53 is located between the first straight portion 42Ja of the busbar 42J and the second straight portion 42Ka of the busbar 42K, and extends parallel to the first straight portion 42Ja of the busbar 42J and the second straight portion 42Ka of the busbar 42K. The first straight portion 42Ja of the busbar 42J, the second straight portion 42Ka of the busbar 42K, and the insulating rib 53 may also extend in a straight line in the Y direction rather than the X direction.

[0316] In this embodiment, the subunit SU has connecting member 30C and connecting member 30D as multiple connecting members 30. Connecting member 30C is adjacent to busbar 42J in the Z direction and connected to busbar 42J in the Z direction. Connecting member 30C is electrically connected to a first external device via an external connection busbar 76. Connecting member 30D is adjacent to busbar 42K in the Z direction and connected to busbar 42K in the Z direction. Connecting member 30D is electrically connected to the aforementioned first external device or second external device via another external connection busbar 76. In this embodiment, a portion of the insulating rib 53 is disposed between connecting member 30C (first connecting member) and connecting member 30D (second connecting member) to provide electrical insulation between connecting member 30C (first connecting member) and connecting member 30D (second connecting member).

[0317] Furthermore, the first connecting member is not limited to the connecting member 30, and may also be the connecting member 20 that connects to other electronic components 10 (third electronic components) included in the same subunit SU. Similarly, the second connecting member is not limited to the connecting member 30, and may also be the connecting member 20 that connects to other electronic components 10 (fourth electronic components) included in the same subunit SU.

[0318] (First variation)

[0319] Figure 26 This is a perspective view illustrating a first variation of the first embodiment of the insulating rib 53. In this variation, the insulating rib 53 is a rib that rises from the second surface 51b of the planar portion 51 in the -Z direction. The insulating rib 53 is provided, for example, as part of the base plate 41. The insulating rib 53 is positioned between two busbars 42 arranged side-by-side with their exposed lower surface side (second surface 51b side), ensuring an insulating distance between the two busbars 42. In this variation, the second surface 51b is an example of a "first surface." The first surface 51a is an example of a "second surface." The insulating rib 53 is an example of an "insulating wall."

[0320] In this modified example, busbar 42J includes a first straight portion 42Ja, which is housed in housing portion 55J with its lower surface side (second surface 51b side) exposed, and extends in a straight line, for example, in the X direction. Busbar 42K includes a second straight portion 42Ka, which is housed in housing portion 55K with its lower surface side (second surface 51b side) exposed, and extends in a straight line, for example, in the X direction. When viewed from the Z direction, insulating rib 53 is located between the first straight portion 42Ja of busbar 42J and the second straight portion 42Ka of busbar 42K, and extends parallel to both the first straight portion 42Ja of busbar 42J and the second straight portion 42Ka of busbar 42K.

[0321] (Second variation)

[0322] Figure 27 This is a cross-sectional view illustrating a second variation of the first embodiment of the insulating wall. In this variation, an insulating wall 53A is provided between the second surface 51b of the planar portion 51 of the substrate plate 41 and the planar portion 81 of the metal plate 80. The insulating wall 53A is provided on the second surface 51b of the planar portion 51. In this variation, the second surface 51b is an example of a "first surface." The first surface 51a is an example of a "second surface." It should be noted that, in this invention, "provided on a surface" is not limited to the case where it is integrally formed with a component containing that surface, but may also include the case where it exists in association with that surface by being configured in contact with that surface after being formed as a separate body.

[0323] In this modified example, the insulating wall 53A extends in the Z direction, for example, across the second surface 51b of the planar portion 51 of the base plate 41 and the planar portion 81 of the metal plate 80. The insulating wall 53A is made of synthetic resin and has insulating properties. The insulating wall 53A is formed, for example, by compressing an elastic insulating member between the base plate 41 and the metal plate 80. Similar to the insulating rib 53 in the first modified example, the insulating wall 53A is positioned between two busbars 42 arranged side-by-side with their lower surfaces exposed, ensuring an insulating distance between the two busbars 42. The other structural features of the insulating wall 53A are the same as those of the insulating rib 53 in the first modified example.

[0324] <11.2 Second Method of Insulating Ribs>

[0325] Figure 28This is a perspective view illustrating a second embodiment of the insulating rib 53. In this embodiment, the subunit SU has a plurality of connecting members 20, including connecting member 20G and connecting member 20H. Connecting member 20G is connected to terminal 13A of electronic component 10. Connecting member 20G is adjacent to and connected to busbar 42J in the Z direction. Connecting member 20H is connected to terminal 13B of electronic component 10. Connecting member 20H is adjacent to and connected to busbar 42K in the Z direction. In this embodiment, a portion of the insulating rib 53 is disposed between connecting member 20G (first connecting member) and connecting member 20H (second connecting member) to electrically insulate between connecting member 20G (first connecting member) and connecting member 20H (second connecting member).

[0326] In this embodiment, the electronic component 10 has the aforementioned insulating rib 11a. The insulating rib 11a is an example of both a "rib" and a "second rib". In this embodiment, the insulating rib 53 provided on the substrate plate 41 is connected to the insulating rib 11a of the electronic component 10. Thus, the insulating rib 11a and the insulating rib 53 of the electronic component 10 form a continuous insulating rib.

[0327] In this embodiment, the insulating rib 53 provided on the substrate plate 41 has an engaging portion 56 that engages with the insulating rib 11a of the electronic component 10. The engaging portion 56, for example, has a recess 56a. The recess 56a is recessed in the protruding direction (X direction) of the insulating rib 11a and extends in the Z direction. The recess 56a opens in the +Z direction. The insulating rib 11a of the electronic component 10 can be inserted into the recess 56a along the Z direction. Furthermore, the electronic component 10 can move along the Z direction while the insulating rib 11a is inserted into and guided by the recess 56a. The electronic component 10 is positioned in both the X and Y directions by inserting the insulating rib 11a into the recess 56a.

[0328] <12. Related Structures of Connecting Components>

[0329] Next, the structure related to the connecting component 20 will be described.

[0330] Figure 29 This is a cross-sectional view illustrating the structure related to the connecting member 20. In this embodiment, the connecting member 20 (e.g., connecting member 20M and connecting member 20N) is a heat storage member (heat absorption member) that increases the heat capacity of the energized path of the electrical connection unit 1. The connecting member 20, for example, stores (absorbs) at least a portion of the heat emitted by the electronic component 10. Alternatively / otherwise, the connecting member 20 may also store (absorb) at least a portion of the heat emitted by the busbar 42 itself due to energization. The connecting member 20 may also be referred to as a "heat storage member" or a "heat absorption member".

[0331] In this embodiment, the busbar 42 is positioned away from the terminal 13 of the electronic component 10 (e.g., away in the Z direction). The connecting member 20 is positioned between the electronic component 10 and the busbar 42. In this invention, "the connecting member is positioned between the electronic component and the busbar" is not limited to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting member is positioned between the electronic component and the busbar" can also be equivalent to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from a direction inclined relative to the X or Y direction. The connecting member 20 electrically connects the terminal 13 of the electronic component 10 to the busbar 42.

[0332] In this embodiment, the thickness of at least a portion of the connecting member 20 is greater than the thickness (Z-direction thickness) T3 of the busbar 42. For example, the thickness T1 in the X-direction of at least a portion of the connecting member 20 is greater than the thickness T3 of the busbar 42. In this embodiment, the thickness T1 in the X-direction of the first portion 21 of the connecting member 20 is greater than the thickness T3 of the busbar 42. In this embodiment, the first portion 21 has a thickness T1 in the X-direction that is greater than the thickness T3 of the busbar 42 along its entire Z-direction length. The thickness T1 in the X-direction of the first portion 21 of the connecting member 20 is, for example, more than twice the thickness T3 of the busbar 42. Alternatively, in other embodiments, the thickness T2 in the Z-direction of the second portion 22 of the connecting member 20 may also be greater than the thickness T3 of the busbar 42.

[0333] In this embodiment, the thickness T1 in the X direction of the first portion 21 of the connecting member 20 is greater than the thickness T2 in the Z direction of the second portion 22 of the connecting member 20. In this embodiment, the first portion 21 has a thickness T1 in the X direction that is greater than the thickness T2 in the Z direction of the second portion 22, which is the thickness of the first portion 21 extending along its entire length in the Z direction.

[0334] Furthermore, the aforementioned dimensional relationships also apply to the connecting member 30 connected to the external connection busbar 76 and / or the connecting member 100 connected to the connecting busbar 75. For example, regarding the description of the connecting member 30, in the above description of the connecting member 20, simply replace "connecting member 20" with "connecting member 30", "first part 21" with "first part 31", and "second part 22" with "second part 32". Similarly, regarding the description of the connecting member 100, in the above description of the connecting member 20, simply replace "connecting member 20" with "connecting member 100", "first part 21" with "first part 101", and "second part 22" with "second part 102".

[0335] <13. Manufacturing method of electrical connection unit>

[0336] Next, the manufacturing method of electrical connection unit 1 will be described.

[0337] Figures 30 to 34 This is a cross-sectional view used to illustrate the manufacturing method of the electrical connection unit 1. Furthermore, in the wiring substrate 40 of each subunit SU, with the fastening member 43 fixed to the busbar 42, the base plate 41 is integrated with the multiple busbars 42 by insert molding or other methods. Thus, the wiring substrate 40 of each subunit SU is prepared in advance.

[0338] (First process)

[0339] Figure 30 This indicates the first step. In the first step, fastening member 71 or fastening member 72 is used to fix the connecting member 20 to the terminal 13 of the electronic component 10. Thus, an assembly SA integrating the electronic component 10 and the connecting member 20 is formed.

[0340] The first process related to electronic component 10M is performed as follows: First, electronic component 10M is placed on the stage MP with the mounting holes 13h of terminals 13 of electronic component 10M facing vertically. Next, connecting component 20M is placed on electronic component 10M with the first mounting hole 21h of connecting component 20M facing vertically. Then, the positions of the first mounting hole 21h of connecting component 20M and the mounting holes 13h of terminals 13 of electronic component 10M are aligned. The first process is performed with electronic component 10M and connecting component 20M in a first orientation. The first orientation is with the mounting holes 13h and 21h facing vertically.

[0341] Next, the fastening member 71 is inserted vertically into the first mounting hole 21h of the connecting member 20M. Then, the fastening member 71, passing through the first mounting hole 21h of the connecting member 20M, engages with the mounting hole 13h of the terminal 13 of the electronic component 10. Thus, an assembly SA integrating the electronic component 10M and the connecting member 20M is formed. The vertical direction is an example of the "first mounting direction".

[0342] (Second process)

[0343] Figure 31 This indicates the second process. In the second process, the assembly SA is fixed to the wiring board 40 of each subunit SU. For example, the connecting member 20 included in the assembly SA is fixed to the busbar 42 included in the wiring board 40. Thus, the electronic component 10 is electrically connected to the busbar 42.

[0344] The second process is performed as follows. As described above, in the wiring substrate 40, the fastening member 43 is fixed to the busbar 42. The fastening member 43 protrudes vertically from the busbar 42. Then, the fastening member 43 is inserted vertically into the second mounting hole 22h of the second portion 22 of the connecting member 20, and the assembly SA is placed on the wiring substrate 40. Next, the engaging member 44 (e.g., a nut) is engaged vertically with the upper end of the fastening member 43. Thus, the second portion 22 of the connecting member 20 included in the assembly SA is fixed to the busbar 42. Thus, the assembly of each subunit SU is completed.

[0345] Here, the second process related to electronic component 10M is performed as follows. First, the posture of assembly SA is rotated 90 degrees from the first process. That is, from the first posture in which mounting hole 13h and first mounting hole 21h are oriented vertically (see...). Figure 30 The orientation is changed to a second position in which the mounting hole 13h and the first mounting hole 21h are oriented horizontally and the second mounting hole 22h of the connecting member 20 is oriented vertically (see reference). Figure 31 ).

[0346] Then, in the second position described above, the fastening member 43 is inserted vertically into the second mounting hole 22h of the second portion 22 of the connecting member 20, and the assembly SA is placed on the wiring substrate 40. Next, the engaging member 44 (e.g., a nut) is engaged vertically with the upper end of the fastening member 43. Thus, the second portion 22 of the connecting member 20M included in the assembly SA is fixed to the busbar 42.

[0347] (Third process)

[0348] Figure 32 This refers to the third step. In the third step, each sub-unit SU is mounted on the metal plate 80. The third step is performed as follows: First, an insulating sheet 91 is mounted on the surface of the flat portion 81 of the metal plate 80. Next, a heat-conducting component 92 is fixed to the upper surface of the insulating sheet 91 using an adhesive or the like. Next, each sub-unit SU is placed on the metal plate 80 with the insulating sheet 91 and the heat-conducting component 92 positioned between the sub-unit SU and the metal plate 80. Then, the fixing portion 52 of each sub-unit SU is fixed to the fixing portion 82 of the metal plate 80 using the fastening member 111.

[0349] (Fourth process)

[0350] Figure 33 This indicates the fourth process. In the fourth process, the mounting portion 14 of the electronic components 10 of each subunit SU is fixed to the fixing portion 83 of the metal plate 80 by means of the fastening member 112. Alternatively, the fourth process can be performed together with the third process.

[0351] (Fifth Process)

[0352] Figure 34 Indicates the fifth process. In the fifth process, the insulating cover 93 is mounted on the metal plate 80 in the vertical direction. Thus, the electrical connection unit 1 is assembled and completed.

[0353] In addition, instead of / in addition to the assembly formed by integrating the electronic component 10 and the connection component 20, the assembly SA can also be an assembly formed by integrating the connecting bus bar 75 and the connection component 100, or an assembly formed by integrating the external connection bus bar 76 and the connection component 30. The electronic component 10, the connecting bus bar 75, and the external connection bus bar 76 are each an example of a "connection target component". Therefore, the "electronic component 10" in the above description can be replaced with the "connecting bus bar 75" or the "external connection bus bar 76". In addition, the "connection component 20" in the above description can be replaced with the "connection component 100" or the "connection component 30".

[0354] <14. Advantages>

[0355] <A. Advantages of the wiring substrate>

[0356] As a comparative example, consider an electrical connection unit in which the bus bar is arranged in a posture standing up with respect to the lower wall of the housing. In the structure of such a comparative example, since the cross-sectional area of the bus bar is determined, for example, to achieve the function as a wiring material, it is sometimes difficult to reduce the width (height) of the standing bus bar. In this case, the width of the standing bus bar becomes a bottleneck, and it may be difficult to make the electrical connection unit thinner.

[0357] On the other hand, in the present embodiment, the electrical connection unit 1 includes the first electronic component 10 and the wiring substrate 40. The wiring substrate 40 includes the base plate 41 and the first bus bar 42. The base plate 41 has a plate-shaped flat portion 51, and the flat portion 51 has a first surface 51a facing the first electronic component 10. The flat portion 51 has a first receiving portion 55 that is recessed in the Z direction or penetrates the flat portion 51 in the Z direction. At least a part of the first bus bar 42 is received in the first receiving portion 55 and extends along the flat portion 51. According to such a structure, at least a part of the wiring path is formed on the plane, and compared with the structure of the above comparative example, the width of the bus bar is not likely to become a bottleneck, and it is easy to make the electrical connection unit 1 thinner.

[0358] In this embodiment, the electrical connection unit 1 has a first connection member 20. The first connection member 20 electrically connects the first electronic component 10 to the first busbar 42. The first busbar 42 has a first connection portion 61 that contacts the first connection member 20. The first connection portion 61 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, more of the wiring path is formed on a plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0359] In this embodiment, the electrical connection unit 1 has a second connection member 20. The second connection member 20 electrically connects a second electronic component or external device to a first busbar 42. The first busbar 42 has a second connection portion 62 that contacts the second connection member 20. The first busbar 42 is housed in a first housing portion 55 and extends along a planar portion 51, extending at least throughout the first connection portion 61 and the second connection portion 62. With this structure, more of the wiring path is formed on a planar surface, thus making it easier to achieve a thinner electrical connection unit 1.

[0360] In this embodiment, the first busbar 42 has an extension 63 between the first connecting portion 61 and the second connecting portion 62. The extension 63 is housed in the first housing portion 55 and extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. With this structure, by housing the extension 63 in the first housing portion 55, the wiring layout is less constrained by the presence of the electronic component 10. Therefore, a wiring layout that is more favorable to electrical characteristics, such as making it easier to extend the extension 63 in a straight line, can be achieved. Furthermore, routing around the busbar such as the electronic component 10 can be avoided. Thus, the electrical characteristics of the electrical connection unit 1 can be improved and / or the electrical connection unit 1 can be miniaturized.

[0361] In this embodiment, the first busbar 42 has an extension 64 that extends to a region R overlapping with the first electronic component 10 when viewed from the Z direction, and has an end portion 42e1 at the position where it overlaps with the first electronic component 10. The extension 64 is housed in a first housing portion 55 and extends along a planar portion 51. According to this structure, by housing the extension 64 in the first housing portion 55, the electrical connection unit 1 can be made thinner, and the metallic heat dissipation portion (extension 64) for promoting heat dissipation and / or heat storage of the first electronic component 10 can be positioned below the first electronic component 10. Thus, the electrical connection unit 1 can be made thinner, and the heat dissipation and / or heat storage of the electrical connection unit 1 can be improved.

[0362] In this embodiment, the first busbar 42 is housed in the first receiving portion 55 along its entire length and extends along the planar portion 51. With this structure, more of the wiring path is formed on the plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0363] In this embodiment, the electrical connection unit 1 has a second busbar 42 electrically connected to the second terminal 13B of the first electronic component 10. The planar portion 51 has a second receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location away from the first receiving portion 55. At least a portion of the second busbar 42 is received in the second receiving portion 55 and extends along the planar portion 51. With this structure, a larger portion of the wiring path containing multiple busbars 42 is held in a plane by a substrate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0364] In this embodiment, the electrical connection unit 1 has a third busbar 42. The first busbar 42 is the busbar included in the positive line PL. The third busbar 42 is the busbar included in the negative line NL. The planar portion 51 has a third receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction at a position away from the first receiving portion 55. At least a portion of the third busbar 42 is received in the third receiving portion 55 and extends along the planar portion 51. According to this structure, more of the wiring path forming the positive line PL and the negative line NL is held in a plane by a substrate plate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0365] In this embodiment, the electrical connection unit 1 includes a fourth bus 42G, a fifth bus 75D, and a third connecting member 100 that electrically connects the fourth bus 42G and the fifth bus 75D. The planar portion 51 has a fourth receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location remote from the first receiving portion 55. At least a portion of the fourth bus 42G is received in the fourth receiving portion 55 and extends along the planar portion 51. The third connecting member 100 includes a portion that stands upright relative to the fourth bus 42G. The fifth bus 75D is supported by the third connecting member 100 at a location remote from the first bus 42 in the Z direction and extends parallel to the first surface 51a. With this structure, a three-dimensional wiring path can be easily formed through the fourth bus 42G, the third connecting member 100, and the fifth bus 75D. Therefore, the electrical connection unit 1 with excellent assemblability can be provided. Furthermore, by positioning the fourth busbar 42G within the receiving portion 55 of the substrate 41, a portion of the three-dimensional wiring path is formed within the thickness of the substrate 41. This makes it easier to achieve a thinner electrical connection unit 1.

[0366] In the present embodiment, the fifth bus bar 75D extends in a manner that crosses the first bus bar 42 at a position away from the first bus bar 42 in the Z direction. According to such a structure, it is easy to form a wiring path that is three-dimensionally crossed with the first bus bar 42 through the third connecting member 100 and the fifth bus bar 75D. Thereby, an electrical connection unit 1 with excellent assembly property can be provided.

[0367] <B. Advantages related to the flat bus bar>

[0368] As a comparative example, consider an electrical connection unit in which the bus bar is arranged in a posture standing up with respect to the lower wall of the housing. In the structure of such a comparative example, it is necessary to fix the bus bar in a standing posture to the housing, and it is difficult to improve the workability related to the installation of the bus bar. In this case, it may be difficult to improve the assembly property of the electrical connection unit 1.

[0369] On the other hand, in the present embodiment, the electrical connection unit 1 has a base plate 41 and a bus bar 42. The base plate 41 includes a plate-shaped planar portion 51. The planar portion 51 has a first receiving portion 55 that is recessed in the Z direction or penetrates through the planar portion 51 in the Z direction. At least a part of the bus bar 42 is received in the first receiving portion 55 and extends along the planar portion 51. According to such a structure, it is easy to integrally handle the base plate 41 and the bus bar 42, and the workability related to the installation of the bus bar can be improved compared with the structure of the above comparative example. Thereby, an improvement in the assembly property of the electrical connection unit 1 can be achieved.

[0370] In the present embodiment, the bus bar 42 is received in the receiving portion 55 over the entire length of the bus bar and extends along the planar portion 51. According to such a structure, an improvement in the assembly property of the electrical connection unit 1 can be achieved, and it is easy to make the electrical connection unit 1 thinner.

[0371] In the present embodiment, the bus bar 42 is integrated with the base plate 41 by insert molding. According to such a structure, the operation of manually installing the bus bar 42 on the housing can be eliminated or reduced. Thereby, a further improvement in the assembly property of the electrical connection unit 1 can be achieved.

[0372] In the present embodiment, there are fastening members 43 protruding from the bus bar 42 in the Z direction and connecting members 20, 30 mounted on the fastening members 43 from the Z direction. The connecting members 20, 30 electrically connect the electronic component 10 or the external device to the bus bar 42. According to such a structure, it is easy to make the direction of the operation of mounting the connection target component to the bus bar 42 coincide with the Z direction. If the direction of the operation can be made to coincide, a further improvement in the assembly property of the electrical connection unit 1 can be achieved.

[0373] In the present embodiment, the connecting member 20 is connected to the electronic component 10 in the X direction (or Y direction). With such a structure, by using the connecting member 20 for the electronic component 10 that needs to be connected in the X direction, the connection direction of the electronic component 10 with respect to the bus bar 42 can be changed to the Z direction. As a result, it is possible to further improve the assemblability of the electrical connection unit 1.

[0374] <C. Advantages related to the exposed structure on the upper surface side of the bus bar>

[0375] As a comparative example, consider an electrical connection unit in which the upper surface side of the bus bar 42 is covered with a synthetic resin. In the structure of such a comparative example, it is sometimes difficult to improve the heat dissipation of the electrical connection unit.

[0376] On the other hand, in the present embodiment, the electrical connection unit 1 includes a first electronic component 10, a base plate 41, and a bus bar 42. The base plate 41 has a plate-shaped flat portion 51, and the flat portion 51 has a first surface 51a facing the first electronic component 10 and a second surface 51b located on the opposite side of the first surface 51a. The flat portion 51 has a receiving portion 55 that is recessed in the Z direction or penetrates the flat portion 51 in the Z direction. At least a part of the bus bar 42 has a plate portion 42p that is received in the receiving portion 55 and extends along the flat portion 51. The plate portion 42p includes a first connection portion 61 that overlaps the first connecting member 20 when viewed in the Z direction and an extension portion 63 that extends from the first connection portion 61 in a direction intersecting the Z direction. At least a part of the extension portion 63 is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, at least a part of the portion of the bus bar 42 other than the connection portions 61 and 62 connected to other components is exposed to the outside of the base plate 41 and functions as an area for releasing heat. In this case, it is possible to improve the heat dissipation of the electrical connection unit 1.

[0377] In the present embodiment, at least a part of the extension portion 63 in the region R that overlaps the first electronic component 10 when viewed in the Z direction is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, it is easy for a part of the extension portion 63 to function as a heat dissipation portion for transferring heat from the first electronic component 10. In this case, it is possible to improve the heat dissipation of the electrical connection unit 1.

[0378] In the present embodiment, the first bus bar 42 has a second connection portion 62 that overlaps with the second connection members 20 and 30 when viewed in the Z direction. The first bus bar 42 is accommodated in the accommodation portion 55 at least over the entire length between the first connection portion 61 and the second connection portion 62 and extends along the flat portion 51, and is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus further improvement in the heat dissipation property of the electrical connection unit 1 can be achieved.

[0379] In the present embodiment, the bus bar 42 is accommodated in the accommodation portion 55 over the entire length of the bus bar 42 and extends along the flat portion 51, and is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus further improvement in the heat dissipation property of the electrical connection unit 1 can be achieved.

[0380] At least a part of the extension portion 63 is exposed to the outside of the base plate 41 on the second surface 51b side in addition to the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus further improvement in the heat dissipation property of the electrical connection unit 1 can be achieved.

[0381] In a modification of the present embodiment, the electrical connection unit 1 includes: a metal plate 80 that faces the flat portion 51 and has a gap S1 therebetween; and a heat conductive member 92 that is disposed between the bus bar 42 and the metal plate 80. The base plate 41 has a cover portion 51v on the second surface 51b side that covers at least a part of the extension portion 63. With such a structure, even when heat tends to accumulate in the gap S1 between the base plate 41 and the metal plate 80, by providing the cover portion 51v, it is possible to suppress heat from easily accumulating in the gap S1.

[0382] <Advantages related to the exposed structure on the lower surface side of the bus bar>

[0383] As a comparative example, an electrical connection unit in which the lower surface side of the bus bar 42 is covered with a synthetic resin is considered. In the structure of such a comparative example, it is sometimes difficult to improve the heat dissipation property of the electrical connection unit.

[0384] On the other hand, in this embodiment, the electrical connection unit 1 includes a first electronic component 10, a substrate 41, and a busbar 42. The substrate 41 has a plate-shaped planar portion 51, which has a first surface 51a facing the first electronic component 10 and a second surface 51b located on the side opposite to the first surface 51a. The planar portion 51 has a receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction. At least a portion of the busbar 42 has a plate portion 42p that is received in the receiving portion 55 and extends along the planar portion 51. The plate portion 42p includes an exposed portion 42u that is exposed to the outside of the substrate 41 from the second surface 51b. With this structure, at least a portion of the plate portion 42p in the busbar 42 is exposed to the outside of the substrate 41, functioning as an area for heat dissipation. In this case, the heat dissipation performance of the electrical connection unit 1 can be improved. In this solution, the heat-conducting component 92 may not be in contact with the exposed portion 42u.

[0385] In this embodiment, at least a portion of the exposed portion 42u of the busbar 42 is disposed in the area overlapping with the connecting member 20 when viewed from the Z direction. With this structure, heat from the connecting member 20 can be easily released through the exposed portion 42u of the busbar 42. This further improves the heat dissipation performance of the electrical connection unit 1.

[0386] In this embodiment, the electrical connection unit 1 further includes a metal plate 80 and a heat-conducting component 92. The metal plate 80 faces the second surface 51b of the planar portion 51 with a gap S1 between it and the planar portion 51. The heat-conducting component 92 is disposed between the exposed portion 42u of the busbar 42 and the metal plate 80. With this structure, heat from the busbar 42 can easily move and diffuse to the metal plate 80 via the heat-conducting component 92. As a result, the heat dissipation performance of the electrical connection unit 1 can be further improved.

[0387] In this embodiment, at least a portion of the exposed portion 42u of the busbar 42 is disposed in the region overlapping with the connecting member 20 when viewed from the Z direction. At least a portion of the heat-conducting member 92 overlaps with the exposed portion 42u of the busbar 42 in the region overlapping with the connecting member 20 when viewed from the Z direction. With this structure, it is easy for the heat of the electronic component 10 to move to the metal plate 80 via the heat-conducting member 92 and dissipate heat. As a result, the heat dissipation performance of the electrical connection unit 1 can be further improved.

[0388] In addition, as an alternative / supplement to the above example, at least a part of the heat conducting member 92 overlaps with the exposed portion 42u of the bus bar 42 in the region overlapping with the connecting member 30 when viewed from the Z direction. With such a structure, even when heat is received from an external device via the external connection bus bar 76, it is easy for the received heat to move through the metal plate 80 and dissipate heat. Thereby, further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0389] In the present embodiment, the exposed portion 42u of the bus bar 42 includes a first portion 42ua disposed in the region overlapping with the connecting member 20 when viewed from the Z direction and a second portion 42ub disposed in the region overlapping with the first electronic component 10 when viewed from the Z direction. The heat conducting member 92 has a first heat conducting portion 92a overlapping with the first portion 42ua of the exposed portion 42u and a second heat conducting portion 92b overlapping with the second portion 42ub of the exposed portion 42u when viewed from the Z direction. With such a structure, it is easy for the heat of the first electronic component 10 to move through the metal plate 80 efficiently via the heat conducting member 92 and dissipate heat. Thereby, further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0390] In the present embodiment, the second portion 42ub of the exposed portion 42u of the bus bar 42 is exposed to the outside of the base plate 41 not only on the second surface 51b side but also on the first surface 51a side and faces the first electronic component 10. With such a structure, it is easy for the heat of the first electronic component 10 to move through the metal plate 80 efficiently via the heat conducting member 92 and dissipate heat. Thereby, further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0391] In the present embodiment, the bus bar 42 is entirely housed in the housing portion 55 and extends along the planar portion 51, and is exposed to the outside of the base plate 41 on the second surface 51b side. With such a structure, a larger portion functions as a heat dissipation area, so that further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0392] <E. Advantages related to the insulating wall>

[0393] As a comparative example, consider an electrical connection unit in which no insulating wall is provided between adjacent bus bars in the vicinity within a specified distance. In the structure of such a comparative example, in order to ensure the insulation distance between the bus bars, it is necessary to separate the bus bars by a distance of more than a specified distance. If it is necessary to separate the bus bars by a predetermined distance or more, it may be difficult to miniaturize the electrical connection unit.

[0394] On the other hand, in this embodiment, the substrate 41 has a first receiving portion 55J, a second receiving portion 55K, and an insulating wall (e.g., an insulating rib 53 or an insulating wall 53A). The first receiving portion 55J is recessed in the Z direction or extends through the planar portion 51 in the Z direction, and at least a portion of the first busbar 42J is received with its surface exposed on the first surface 51a. The second receiving portion 55K is recessed in the Z direction or extends through the planar portion 51 in the Z direction, and at least a portion of the second busbar 42K is received with its surface exposed on the first surface 51a. The insulating wall is provided on the first surface 51a at a position between the first receiving portion 55J and the second receiving portion 55K. With this structure, even when the first receiving portion 55J and the second receiving portion 55K are arranged within a predetermined distance, the necessary insulation distance can be ensured by the insulating wall. Therefore, it is easy to arrange multiple busbars 42 close to each other. If it is easy to arrange multiple busbars 42 close to each other, miniaturization of the electrical connection unit 1 can be achieved.

[0395] Furthermore, in this embodiment, the upward flow of air heated by each busbar 42 can be rectified using the insulating wall. This also improves the heat dissipation of the electrical connection unit 1.

[0396] In this embodiment, the first busbar 42J includes a first straight portion 42Ja, which is housed in a first receiving portion 55J and extends in a straight line, exposed on the first surface 51a side. The second busbar 42K includes a second straight portion 42Ka, which is housed in a second receiving portion 55K and extends in a straight line parallel to the first straight portion 42Ja, exposed on the first surface 51a side. When viewed from the Z direction, an insulating wall is disposed between the first straight portion 42Ja and the second straight portion 42Ka, and extends parallel to both the first straight portion 42Ja and the second straight portion 42Ka. With this structure, the first straight portion 42Ja and the second straight portion 42Ka can be easily arranged close to each other, facilitating further miniaturization of the electrical connection unit 1.

[0397] In this embodiment, the electrical connection unit 1 has a first connecting member (e.g., connecting member 20 or connecting member 30) and a second connecting member (e.g., connecting member 20 or connecting member 30). The first connecting member is connected to a first busbar 42J and electrically connects the first busbar 42J to a third electronic component or a first external device. The second connecting member is connected to a second busbar 42K and electrically connects the second busbar 42K to a fourth electronic component, a first external device, or a second external device. A portion of an insulating wall is disposed between the first connecting member and the second connecting member. With this structure, even when the first connecting member and the second connecting member are disposed within a predetermined distance, the required insulation distance between the first connecting member and the second connecting member can be ensured by the insulating wall. Therefore, it is easy to arrange the first connecting member and the second connecting member close to each other. If the first connecting member and the second connecting member can be easily arranged close to each other, further miniaturization of the electrical connection unit 1 can be easily achieved.

[0398] In this embodiment, the electrical connection unit 1 has a first connecting member (e.g., connecting member 20) and a second connecting member (e.g., connecting member 20). The first connecting member is mounted on a first busbar 42J and electrically connects the first busbar 42J to a first terminal 13A of the first electronic component 10. The second connecting member is mounted on a second busbar 42K and electrically connects the second busbar 42K to a second terminal 13B of the first electronic component 10. A portion of an insulating wall is disposed between the first connecting member and the second connecting member. With this structure, even when the first connecting member and the second connecting member, which are connected to the same electronic component 10, are disposed within a predetermined distance, the required insulation distance between the first connecting member and the second connecting member can be ensured by the insulating wall. Therefore, it is easy to arrange the first connecting member and the second connecting member close to each other. If the first connecting member and the second connecting member can be easily arranged close to each other, further miniaturization of the electrical connection unit 1 can be easily achieved.

[0399] In this embodiment, the first electronic component 10 has an insulating rib 11a located between the first terminal 13A and the second terminal 13B. The insulating rib 53 has an engaging portion 56 that engages with the insulating rib 11a of the first electronic component 10. With this structure, by engaging the insulating rib 11a of the electronic component 10 with the insulating rib 53, the position of the electronic component 10 can be aligned. This improves the assemblability of the electrical connection unit 1. Furthermore, according to this structure, a series of insulating walls can be formed by the insulating rib 53 and the insulating rib 11a of the first electronic component 10. This facilitates the arrangement of multiple power paths within the electrical connection unit 1 close to each other. Since it is easy to arrange multiple power paths close to each other, further miniaturization of the electrical connection unit 1 is easily achieved.

[0400] In the present embodiment, the engaging portion 56 of the insulating rib 53 has a recess 56a into which the insulating rib 11a of the electronic component 10 is inserted. According to such a structure, by inserting the insulating rib 11a of the electronic component 10 into the recess 56a of the insulating rib 53, the alignment of the electronic component 10 can be easily performed. Thereby, a further improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0401] <Advantages related to the fixing structure of the electronic component>

[0402] As a comparative example, consider the case where the mounting portion 14 of the electronic component 10 is fixed to the base plate 41. In the structure of such a comparative example, since the base plate 41 is made of synthetic resin, it is difficult to ensure the rigidity around the mounting portion 14. In addition, in the structure of the comparative example, since the coefficient of linear expansion of the base plate 41 is larger than that of the electronic component 10, the position of the electronic component 10 may move significantly during thermal expansion / contraction.

[0403] On the other hand, in the present embodiment, there are a base plate �1, a bus bar 42, a metal plate 80, and an electronic component 10. The base plate 41 has a plate-shaped planar portion 51, and this planar portion 51 has a first surface 51a facing the first electronic component 10 and a second surface 51b located on the side opposite to the first surface 51a. The planar portion 51 has a receiving portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction and a through hole 51h that penetrates the planar portion 51 in the Z direction. At least a part of the bus bar 42 is received in the receiving portion 55 and extends along the planar portion 51. The metal plate 80 has: a plate-shaped planar portion 81 facing the second surface 51b; a first fixing portion 82 for fixing the base plate 41; and a second fixing portion 83 that protrudes from the planar portion 81 in the Z direction and is inserted into the through hole 51h. The electronic component 10 faces the first surface 51a, is electrically connected to the bus bar 42, and is fixed to the second fixing portion 83. According to such a structure, the base plate 41 and the electronic component 10 are respectively fixed to the metal plate 80. In this case, since the metal plate 80 is made of metal, it is easy to ensure the rigidity around the mounting portion 14. Thereby, an improvement in the durability of the electrical connection unit 1 can be achieved. In addition, in this structure, the coefficient of linear expansion of the metal plate 80 is smaller than that of the base plate 41, so it is possible to suppress a significant movement of the position of the electronic component 10 during thermal expansion / contraction.

[0404] In the present embodiment, the second fixing portion 83 protrudes through the through hole 51h in the Z direction to the same position as the first surface 51a or a position exceeding the first surface 51a. The electronic component 10 is fixed to the second fixing portion 83 on the side of the first surface 51a. According to such a structure, the second fixing portion 83 protrudes near the first surface 51a, so it is easy to fix the electronic component 10 to the second fixing portion 83. Thereby, further improvement in the assemblability of the electrical connection unit 1 can be achieved. In addition, by making the second fixing portion 83 protrude and inserting it into the through hole 51h, it is easy to dispose the base plate 41 closer to the metal plate 80. If it is easy to dispose the base plate 41 near the metal plate 80, further thinning of the electrical connection unit 1 can be easily achieved.

[0405] In the present embodiment, the first fixing portion 82 has a first engaging hole 82h that opens in the Z direction and engages with a first fastening member 111 for fixing the base plate 41 to the metal plate 80. The second fixing portion 83 has a second engaging hole 83h that opens in the Z direction and engages with a second fastening member 112 for fixing the electronic component 10 to the metal plate 80. According to such a structure, the working direction of the operation of fixing the base plate 41 to the first fixing portion 82 can be unified with the working direction of the operation of fixing the electronic component 10 to the second fixing portion 83 to the same direction. If these working directions are the same, further improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0406] In the present embodiment, the electrical connection unit 1 has a connecting member 20 that electrically connects the electronic component 10 and the bus bar 42. The connecting member 20 is fixed to the electronic component 10 and also fixed to the bus bar 42. According to such a structure, the electronic component 10 is fixed to the bus bar 42 via the connecting member 20 in addition to being fixed to the metal plate 80. Thereby, the fixing structure of the electronic component 10 can be made more firm.

[0407] In the present embodiment, the electrical connection unit 1 has a fastening member 43 that protrudes from the bus bar 42 in the Z direction. The connecting member 20 is mounted on the fastening member 43 from the Z direction and connected to the bus bar 42. According to such a structure, the working direction of the operation of fixing the base plate 41 to the first fixing portion 82, the working direction of the operation of fixing the electronic component 10 to the second fixing portion 83, and the working direction of the operation of fixing the connecting member 20 fixed to the electronic component 10 to the bus bar 42 can be unified to the same direction. If these working directions are the same, further improvement in the assemblability of the electrical connection unit 1 can be achieved.<G. Regarding the advantages of the convection generating structure>

[0408]

[0409] As a comparative example, when a metal plate 80 is provided facing the second surface 51b of the planar portion 51 of the base plate 41, there is a possibility that heat accumulates in the gap S1 between the planar portion 51 of the base plate 41 and the metal plate 80. If heat accumulates in the gap S1, the heat dissipation performance of the electrical connection unit 1 may be reduced.

[0410] On the other hand, in the present embodiment, the electrical connection unit 1 includes a base plate 41, a bus bar 42, and a metal plate 80. The base plate 41 has a plate-shaped planar portion 51. The planar portion 51 has a receiving portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction, and through holes 51h that penetrate the planar portion 51 in the Z direction. At least a part of the bus bar 42 is received in the receiving portion 55 and extends along the planar portion 51. The metal plate 80 has a planar portion 81 and a protruding portion (for example, a second fixing portion 83 or a protruding portion 84). The planar portion 81 is a plate-shaped portion that faces the second surface 51b with a first gap S1 therebetween. The above-mentioned protruding portion protrudes from the planar portion 81 in the Z direction and is inserted into the through hole 51h, and a second gap S2 through which air can pass is provided between the protruding portion and the inner peripheral surface 51ha of the through hole 51h. According to such a structure, the flow of air in the above-mentioned arrows A1 to A3 is generated, and the heat dissipation performance of the electrical connection unit 1 can be improved.

[0411] In the present embodiment, the above-mentioned protruding portion protrudes through the through hole 51h in the Z direction to the same position as the first surface 51a, or protrudes to a position exceeding the first surface 51a. According to such a structure, the flow of air in the above-mentioned arrows A1 to A3 is more likely to be generated. Therefore, the heat dissipation performance of the electrical connection unit 1 can be further improved.

[0412] In the present embodiment, the above-mentioned protruding portion is a fixing portion 83 for fixing the electronic component 10. According to such a structure, the flow of air in the above-mentioned arrows A1 to A3 is further generated by the fixing portion 83 for fixing the electronic component 10. Thereby, miniaturization can be achieved and the heat dissipation performance of the electrical connection unit 1 can be improved.

[0413] <H. Advantages of the protection structure for thermal expansion / contraction>

[0414] As a comparative example, consider a structure having a fixing portion 52 without a raised plate portion 52a. In the structure of such a comparative example, due to the expansion / contraction of the synthetic resin at high / low temperatures, a difference in length occurs between the fixing positions of the base plate 41 and the metal plate 80, and the vicinity of the fixing portion 52 of the base plate 41 may be damaged.

[0415] On the other hand, in this embodiment, the electrical connection unit 1 includes a metal plate 80, a first electronic component 10, a first busbar 42, and a first base plate 41. The first base plate 41 has a first planar portion 51, a standing plate portion 52a, and a horizontal plate portion 52b. The first planar portion 51 has a first surface 51a facing the electronic component 10 and a second surface 51b located on the opposite side of the first surface 51a and facing the metal plate 80, and is plate-shaped to hold the first busbar 42. The standing plate portion 52a is plate-shaped and extends from the first planar portion 51 in a Z-direction intersecting the first surface 51a. The horizontal plate portion 52b is supported by the standing plate portion 52a and is disposed in a different position in the Z-direction from the first surface 51a, and is fixed to the metal plate 80. With this structure, the thermal expansion / contraction of the base plate 41 can be absorbed by the displacement of the standing plate portion 52a. As a result, the possibility of breakage near the fixing portion 52 of the base plate 41 can be reduced. As a result, the durability of the electrical connection unit 1 can be improved.

[0416] In this embodiment, the metal plate 80 has a planar portion 81 facing a second surface 51b of the planar portion 51, and a first fixing portion 82 protruding from the planar portion 81 in the Z direction and fixed to a horizontal plate portion 52b of the first base plate 41. With this structure, the horizontal plate portion 52b can be easily fixed to the metal plate 80. Furthermore, if a standing plate portion 52a is provided, insulation between the fixing portion 52 of the metal plate 80 and the busbar 42 can be easily ensured.

[0417] In this embodiment, the first substrate plate 41 has a through hole 51h extending through the planar portion 51 in the Z direction. The metal plate 80 has a fixing portion 83 that protrudes from the planar portion 81 in the Z direction and is inserted into the through hole 51h of the first substrate plate 41, thereby fixing the first electronic component 10. The length L1 of the upright plate portion 52a in the Z direction is greater than the length L2 of the fixing portion 83 in the Z direction. With this structure, the larger upright plate portion 52a makes it easier to absorb the thermal expansion / contraction of the substrate plate 41.

[0418] In this embodiment, the electrical connection unit 1 further includes a second substrate plate 41. The second substrate plate 41 has a second planar portion 51, a standing plate portion 52a, and a horizontal plate portion 52b. The second planar portion 51 is plate-shaped, having a third surface 51a facing the second electronic component and a fourth surface 51b located opposite the third surface 51a and facing the metal plate 80, and holding the second busbar 42. The standing plate portion 52a is plate-shaped, extending from the second planar portion 51 in the Z direction. The horizontal plate portion 52b is supported by the standing plate portion 52a and is positioned in the Z direction at a different position from the first surface 51a, and overlaps with the horizontal plate portion 52b of the first substrate to be fixed to the metal plate 80. With this structure, the horizontal plate portions 52b of the two substrate plates 41 are fixed to a fixing portion 82. As a result, miniaturization of the electrical connection unit 1 can be achieved.

[0419] <I. Advantages Related to Manufacturing Method>

[0420] As a comparative example, consider a structure in which electronic components and bus bars are directly assembled. In the structure of such a comparative example, the following states (1) or (2) may occur. (1) In the case where the bus bar is first fastened to the electronic component and then assembled into the housing, when the arranged bus bar is housed in the housing, it is necessary to confirm the contact with peripheral components and the assembly of the bus bar, which may lead to a reduction in workability. (2) In the case where the electronic component and the bus bar are respectively housed in the housing and then the electronic component and the bus bar are fastened, space for fastening in the horizontal direction is required, and useless space may be generated in the electrical connection unit.

[0421] On the other hand, in the present embodiment, the manufacturing method of the electrical connection unit 1 includes: a process of preparing a wiring substrate 40; a process of forming an assembly SA; and a process of connecting a connection component (connection component 20, connection component 30, or connection component 100) to the bus bar 42. The wiring substrate 40 includes a base plate 41 having a plate-shaped planar portion 51 and a bus bar 42 held on the planar portion 51. The planar portion 51 has a housing portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction. At least a part of the bus bar 42 is housed in the housing portion 55 and extends along the planar portion 51. The process of forming the assembly SA includes a process of using a first fastening component (fastening component 71, fastening component 72, or fastening component 73) to fix the above-mentioned connection component to a connection target component (electronic component 10, connecting bus bar 75, or external connection bus bar 76) to form an assembly SA in which the connection target component and the above-mentioned connection component are integrated. The process of connecting the above-mentioned connection component to the bus bar 42 includes: after forming the assembly SA, using a second fastening component (for example, fastening component 43) to connect the above-mentioned connection component included in the assembly SA to the bus bar 42. According to such a structure, the assembly property of the above-mentioned connection target component and the above-mentioned connection component with respect to the bus bar 42 can be improved. Thereby, an improvement in the assembly property of the electrical connection unit 1 can be achieved.

[0422] In addition, the second fastening component is not limited to the fastening component 43 that protrudes from the bus bar 42. In the case where the bus bar 42 is formed with a mounting hole (for example, a threaded hole), the second fastening component may also be a fastening component (for example, a bolt or a screw) that passes through an insertion through hole provided in the connection target component and engages with the mounting hole of the bus bar 42.

[0423] In this embodiment, an example of the connected component is the electronic component 10. The connecting component is fixed to the terminal 13 of the electronic component 10 using the first fastening component. With this structure, by forming an assembly SA with the electronic component 10 and the connecting component 20, the assemblability of the electronic component 10 and the connecting component 20 relative to the busbar 42 can be improved. Therefore, the assemblability of the electrical connection unit 1 can be improved.

[0424] In this embodiment, the operation of fixing the connecting member to the connecting object member using the first fastening member is performed with the connecting object member and the connecting member in a first posture. The operation of fixing the connecting member included in the assembly SA to the busbar 42 using the second fastening member is performed with the connecting object member and the connecting member in a second posture different from the first posture. With this structure, even when the connection direction between the connecting object member and the connecting member is horizontal after the electrical connection unit 1 is assembled, by installing the connecting object member and the connecting member in a direction different from the horizontal direction during assembly, the operator's workload can be reduced, and the assemblability of the electrical connection unit 1 can be improved.

[0425] In this embodiment, the connecting member has a first mounting hole for inserting the first fastening member and a second mounting hole for inserting the second fastening member, opening in a direction different from the first mounting hole. The first posture is one in which the first mounting hole faces a first mounting direction. The second posture is one in which the first mounting hole faces a direction different from the first mounting direction, and the second mounting hole faces the first mounting direction. With this structure, even when the connection direction between the connecting object member and the connecting member is horizontal, the mounting directions of the connecting object member and the connecting member, and the assembly direction of the assembly SA relative to the busbar 42, can be unified to the same direction. This further reduces the operator's workload and further improves the assemblability of the electrical connection unit 1.

[0426] In the present embodiment, the connecting member 20 has a first portion 21 that mounts the first fastening member and is connected to the electronic component 10, and a second portion 22 that mounts the second fastening member and is connected to the bus bar 42. The thickness T1 in the X direction of the first portion 21 is greater than the thickness in the Z direction of the second portion 22. With such a structure, the connecting member 20 has a larger heat capacity per unit length than the bus bar 42. Therefore, even when a short-term large current flows through the electronic component 10 and the electronic component 10 becomes high-temperature in the short term, a part of the heat generated by the electronic component 10 is stored in the connecting member 20. Thereby, the temperature change inside the electrical connection unit 1 can be suppressed. Thereby, improvement in the thermal characteristics (such as heat resistance) of the electrical connection unit 1 can be achieved.

[0427] Viewed from another perspective, in the present embodiment, the connecting member 20 is disposed between the first terminal 13 of the electronic component 10 and the bus bar 42. The connecting member 20 electrically connects the electronic component 10 and the bus bar 42. The thickness of at least a part of the connecting member 20 is greater than the plate thickness in the Z direction of the bus bar 42. With such a structure, the connecting member 20 has a larger heat capacity per unit length than the bus bar 42. Therefore, even when a short-term large current flows through the electronic component 10 and the electronic component 10 becomes high-temperature in the short term, a part of the heat generated by the electronic component 10 is stored in the connecting member 20. Thereby, the temperature change inside the electrical connection unit 1 can be suppressed. Thereby, improvement in the thermal characteristics (such as heat resistance) of the electrical connection unit 1 can be achieved.

[0428] <J. Advantages related to the segmented structure>

[0429] As a comparative example, consider a structure in which the metal plate 80 is not present in a structure where the main body portion MU is divided into a plurality of sub-units SU. In the structure of such a comparative example, in order to ensure the rigidity of the connecting portions of the plurality of sub-units SU, it may be necessary to increase the plate thickness of the base plate 41 or add reinforcing members. In this case, it may be difficult to make the electrical connection unit 1 thinner.

[0430] On the other hand, in this embodiment, the electrical connection unit 1 includes a first subunit SU, a second subunit SU electrically connected to the first subunit SU, and a metal plate 80. The first subunit SU includes a plurality of first electronic components (e.g., a plurality of electronic components 10), a plurality of first busbars (e.g., a plurality of busbars 42), and a first base component (e.g., a base plate 41). The plurality of first busbars include portions arranged on the same plane as each other and electrically connected to the plurality of first electronic components. The first base component includes a plate-shaped first planar portion that holds the plurality of first busbars. The second subunit SU includes a plurality of second electronic components (e.g., a plurality of electronic components 10), a plurality of second busbars (e.g., a plurality of busbars 42), and a second base component (e.g., a base plate 41). The plurality of second busbars include portions arranged on the same plane as each other and electrically connected to the plurality of second electronic components. The second base component includes a plate-shaped second planar portion that holds the plurality of second busbars. The metal plate 80 fixes the first subunit SU and the second subunit SU respectively, and holds the first subunit SU and the second subunit SU as a single unit. With this structure, the rigidity of the connection between the first subunit SU and the second subunit SU can be ensured by the metal plate 80. Therefore, it is unnecessary or less necessary to increase the thickness of the base plate 41 or add reinforcing components, thereby enabling the electrical connection unit 1 to be made thinner compared to the case where the metal plate 80 is not present.

[0431] In this embodiment, the first planar portion has multiple first receiving portions that are recessed in the Z-direction or extend through the first planar portion in the Z-direction to accommodate multiple first busbars. The second planar portion has multiple second receiving portions that are recessed in the Z-direction or extend through the second planar portion in the Z-direction to accommodate multiple second busbars. With this structure, the electrical connection unit 1 can be further thinned.

[0432] In this embodiment, the long side of the first sub-unit SU is in the X direction. The long side of the second sub-unit SU is in the X direction. The second sub-unit SU is adjacent to the first sub-unit SU in the X direction. The long side of the metal plate 80 is in the X direction. The length of the metal plate 80 in the X direction is greater than the sum of the length of the first sub-unit SU in the X direction and the length of the second sub-unit SU in the second direction. With this structure, the first sub-unit SU and the second sub-unit SU can be more firmly held by the metal plate 80.

[0433] In this embodiment, the electrical connection unit 1 further includes a connecting busbar 75 that electrically connects the first subunit SU and the second subunit SU. The connecting busbar 75 is disposed on the side opposite to the metal plate 80 relative to the first subunit SU and the second subunit SU. With this structure, the connection between the first subunit SU and the second subunit SU is strengthened from both sides in the Z direction (+Z direction side and -Z direction side) by means of the metal plate 80 and the connecting busbar 75. As a result, the metal plate 80 can be made thinner, and the electrical connection unit 1 can be further made thinner.

[0434] In this embodiment, the first subunit SU has a first fixing portion 52. The second subunit SU has a second fixing portion 52 that overlaps with the first fixing portion 52 when viewed from the Z direction. The first fixing portion 52 and the second fixing portion 52 are fixed to the metal plate 80 by a fastening member 111. With this structure, miniaturization in the X direction of the electrical connection unit 1 can be achieved, and cost reduction can be achieved along with the reduction in the number of components.

[0435] <15. Variations>

[0436] Next, several variations will be described. Furthermore, in each variation, the structure except as described below is the same as that of the first embodiment.

[0437] (First variation)

[0438] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0439] (Second variation)

[0440] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42. It should be noted that in the present invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0441] (Third variation)

[0442] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged to hold multiple busbars 42 arranged in a horizontal direction. For example, the multiple components may be integrally formed by holding the multiple busbars 42 together through lamination. The multiple components form a planar portion 51. In this case, the receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. The sheet components may, for example, be flexible sheet components. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42.

[0443] (Fourth variation)

[0444] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0445] (Second Implementation)

[0446] Next, the second embodiment will be described. The difference between the second embodiment and the first embodiment is that the base plate 41 is provided with an opening 121 for heat dissipation. Otherwise, the structure is the same as the first embodiment except as described below.

[0447] Figure 35 This is a perspective view illustrating the subunit SU of the second embodiment. Figure 36 It is along Figure 35 The diagram shows a cross-sectional view along line F36-F36 of the structure. The electrical connection unit 1 of the second embodiment, like the first embodiment, has a metal plate 80, which is disposed with a gap S1 between the metal plate 80 and the base plate 41, and faces the second surface 51b of the planar portion 51. A heat-conducting member 92 exists between the busbar 42 and the metal plate 80. In this structure, heat may accumulate in the gap S1 between the base plate 41 and the metal plate 80.

[0448] In this embodiment, the planar portion 51 of the substrate plate 41 has an opening 121 for heat dissipation. The opening 121 extends through the planar portion 51 in the Z direction, communicates with the gap S1 between the planar portion 51 and the metal plate 80, and allows air to pass through. For example, when heated, the air in the gap S1 between the planar portion 51 and the metal plate 80 moves upward through the opening 121 towards the planar portion 51.

[0449] With this structure, heat is less likely to accumulate in the gap S1 between the base plate 41 and the metal plate 80. If heat is less likely to accumulate in the gap S1, the heat dissipation performance of the busbar 42 is improved. When the heat dissipation performance of the busbar 42 is improved, the heat dissipation performance of the electrical connection unit 1 can also be improved.

[0450] (Third Implementation)

[0451] Next, the third embodiment will be described. The difference between the third embodiment and the first embodiment is that an insulating portion is provided to improve the insulation between adjacent busbars 42. Otherwise, the structure is the same as the first embodiment except as described below.

[0452] Figure 37 This is a perspective view illustrating the subunit SU of the third embodiment. In the third embodiment, the base plate 41 has a cover portion 51v. The cover portion 51v is an insulating portion that covers a portion of the busbar 42 on at least one of the first surface 51a side or the second surface 51b side. For example, the cover portion 51v covers at least a portion of the extension 63 of the busbar 42. As an alternative / supplement to the above example, the cover portion 51v covers at least a portion of the extension 64 of the busbar 42. The cover portion 51v is provided, for example, in such portions where two busbars 42 are adjacent to each other within a predetermined distance.

[0453] This structure improves the insulation between adjacent busbars 42, making it easier to ensure the insulation distance between them. Furthermore, the cover portion 51v can be formed, for example, by insert molding, similar to other parts of the planar portion 51. Alternatively, the cover portion 51v can be formed by coating the surface of the busbars 42 with insulating material or attaching insulating sheets. The cover portion 51v can be part of the base plate 41, or it can be formed from a component that is separately installed from the base plate 41 and then mounted on it.

[0454] (Fourth Implementation)

[0455] Next, the fourth embodiment will be described. The fourth embodiment differs from the first embodiment in that it includes a retaining portion 131 for supporting the busbar 42. Otherwise, the structure is the same as the first embodiment except as described below.

[0456] Figure 38 This is a perspective view illustrating the subunit SU of the fourth embodiment. Figure 39 It is along Figure 38 The diagram shows a cross-sectional view along line F39-F39 of the structure. In the fourth embodiment, the base plate 41 has retaining portions 131 and 132 that overlap with a portion of the busbar 42 when viewed from the Z direction and support the busbar 42 in the Z direction. Alternatively, only one of the retaining portions 131 and 132 may be provided.

[0457] The retaining portion 131 is disposed adjacent to, for example, the first surface 51a of the planar portion 51, above the busbar 42, and supports the busbar 42 from above. The retaining portion 131 holds the busbar 42 in a manner that prevents it from falling upwards. On the other hand, the retaining portion 132 is disposed adjacent to the second surface 51b of the planar portion 51, and supports the busbar 42 from below. The retaining portion 132 holds the busbar 42 in a manner that prevents it from falling downwards. The retaining portions 131 and 132 are provided, for example, in the extension portion 63 or the extension portion 64 of the busbar 42. However, the retaining portions 131 and 132 may also be provided in the first connecting portion 61 or the second connecting portion 62 of the busbar 42.

[0458] With this structure, even if a gap may occur between the housing 55 and the busbar 42 during thermal expansion due to the difference in the coefficient of linear expansion between the base plate 41 and the busbar 42, the busbar 42 is less likely to detach from the base plate 41. This improves the heat resistance of the electrical connection unit 1.

[0459] Alternatively, the retaining portions 131 and 132 may also be formed by insert molding in the same way as other parts of the planar portion 51. Alternatively, the retaining portions 131 and 132 may also be formed as separate components that are installed on the base plate 41 after being separately disposed from the base plate 41.

[0460] (Modified Example)

[0461] Figure 40 This is a cross-sectional view showing a modified example of the fourth embodiment. In this modified example, the upper surface of the busbar 42 has a recess 42g that is recessed in the -Z direction. The recess 42g extends, for example, in the Y direction. Similarly, the lower surface of the busbar 42 has a recess 42g that is recessed in the +Z direction. The recess 42g extends, for example, in the Y direction.

[0462] In this modified example, the retaining portion 131 is provided in the recess 42g on the upper surface of the busbar 42. Similarly, the retaining portion 132 is provided in the recess 42g on the lower surface of the busbar 42. For example, the retaining portions 131 and 132 are formed within the thickness range of the busbar 42 in the Z direction. With such a structure, it is easier to achieve a thinner electrical connection unit 1.

[0463] (Fifth Implementation)

[0464] Next, the fifth embodiment will be described. The fifth embodiment differs from the first embodiment in that it includes a support portion 141 that presses the busbar 42 toward the heat-conducting member 92. Otherwise, the structure is the same as the first embodiment except as described below.

[0465] Figure 41 This is a perspective view illustrating the subunit SU of the fifth embodiment. Figure 42 It is along Figure 41 The cross-sectional view along line F42-F42 of the structure is shown. In the fifth embodiment, the base plate 41 has a support portion 141 disposed on the side opposite to the heat-conducting member 92 relative to the busbar 42 and pressing the busbar 42 toward the heat-conducting member 92.

[0466] In this embodiment, the heat-conducting component 92 is elastic. Therefore, if the busbar 42 can be pressed towards the heat-conducting component 92 to improve the tightness between the busbar 42 and the heat-conducting component 92, the heat dissipation can be improved. The plurality of support portions 141 include, for example, support portion 141A and support portion 141B. Alternatively, only one of support portion 141A and support portion 141B may be provided.

[0467] The support portion 141A is disposed adjacent to, for example, the first surface 51a of the planar portion 51, above the busbar 42, and supports the busbar 42 from above. When viewed from the Z direction, the support portion 141A overlaps with at least a portion of the heat-conducting member 92. When viewed from the Z direction, the support portion 141A presses the busbar 42 toward the heat-conducting member 92 in the area overlapping with the heat-conducting member 92.

[0468] The support portion 141B is disposed adjacent to, for example, the first surface 51a of the planar portion 51, above the busbar 42, and supports the busbar 42 from above. When viewed from the Z direction, the support portion 141B overlaps with at least a portion of the electronic component 10. When viewed from the Z direction, the support portion 141B presses the busbar 42 toward the heat-conducting component 92 in the area overlapping with the electronic component 10.

[0469] It should be noted that the support portion 141 is not limited to the support portion 141A or support portion 141B mentioned above, but may also be a support portion in other locations that presses the busbar 42 toward the heat conduction component 92.

[0470] With this structure, the busbar 42 is pressed against the heat-conducting component 92 by the support portion 141, improving the tightness of the fit between the busbar 42 and the heat-conducting component 92. This further enhances the heat dissipation of the electrical connection unit 1.

[0471] Alternatively, the support portion 141 may be formed by insert molding in the same manner as other parts of the planar portion 51. Alternatively, the support portion 141 may be formed as a separate component that is installed on the base plate 41 after being separately disposed from the base plate 41.

[0472] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0473] [Potential for Industrial Applications]

[0474] According to the present invention, the electrical connection unit can be made thinner.

Claims

1. An electrical connection unit, characterized in that, have: An insulating substrate component comprising a plate-shaped or sheet-shaped planar portion, wherein, with the thickness direction of the planar portion as a first direction, the planar portion has a receiving portion recessed in the first direction or penetrating the planar portion in the first direction; as well as A busbar, at least a portion of which is housed in the housing portion and extends along the planar portion.

2. The electrical connection unit as claimed in claim 1, characterized in that, The busbar is housed in the housing portion along its entire length and extends along the planar portion.

3. The electrical connection unit as described in claim 1 or 2, characterized in that, The busbar is integrated with the base component through insert molding.

4. The electrical connection unit as described in claim 1 or 2, characterized in that, It also has: The fastening part protrudes from the busbar in the first direction; as well as A connecting component, which is a component for electrically connecting the electronic component or external device to the busbar, is mounted on the fastening part from the first direction and connected to the busbar.

5. The electrical connection unit as described in claim 4, characterized in that, When the direction intersecting the first direction is taken as the second direction, the connecting component is connected to the electronic component from the second direction.

6. The electrical connection unit as described in claim 1 or 2, characterized in that, It also has: A metal plate, the metal plate facing the planar portion with a gap between it and the planar portion; and A heat-conducting component is disposed between the busbar and the metal plate. The planar portion has an opening that extends through the planar portion in the first direction and communicates with the gap, allowing air to pass through.

7. The electrical connection unit as described in claim 1 or 2, characterized in that, The planar portion has a first surface and a second surface, the second surface being located on the side opposite to the first surface. The base component has an insulating portion that covers a portion of the busbar from at least one of the first surface side and the second surface side.

8. The electrical connection unit as described in claim 1 or 2, characterized in that, The base component has a retaining portion that overlaps with a portion of the busbar when viewed from the first direction and supports the busbar in the first direction.

9. The electrical connection unit as described in claim 1 or 2, characterized in that, It also has: A metal plate, the metal plate being spaced apart from the planar portion and facing the planar portion; and A heat-conducting component is disposed between the busbar and the metal plate. The base component has a support portion disposed on the side opposite to the heat-conducting component relative to the busbar, and presses the busbar toward the heat-conducting component.

Images