Electrical connection unit

Abstract

The electrical connection unit includes a first connection object, a second connection object, a base member, and a bus bar. The base member has a plate-like or sheet-like planar portion facing the first connection object and the second connection object. The bus bar is held on the flat surface portion and electrically connects the first connection object and the second connection object. When the thickness direction of the flat surface part is set as a first direction, the flat surface part is provided with a containing part which is recessed in the first direction or penetrates through the flat surface part in the first direction. The bus bar includes a connection path portion and an extension portion. The connection path portion extends between the first connection object and the second connection object. The extension portion extends to the outside of the connection path portion and overlaps the first electronic component when viewed from the first direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, improvements in the heat storage capacity of the electrical connection unit are expected.

[0008] One embodiment provides an electrical connection unit that can improve heat storage performance.

[0009] Technical solutions for solving the problem

[0010] One embodiment of the electrical connection unit includes: a first connection object, a second connection object, a base component, and a busbar. The base component has a plate-like or sheet-like planar portion facing the first connection object and the second connection object. The busbar is held in the planar portion and electrically connects the first connection object and the second connection object. When the thickness direction of the planar portion is set as a first direction, the planar portion has a receiving portion that is recessed in the first direction or extends through the planar portion in the first direction. The busbar includes a connection path portion and an extension portion. The connection path portion extends between the first connection object and the second connection object. The extension portion extends outward from the connection path portion and overlaps with the first electronic component when viewed from the first direction.

[0011] Invention Effects

[0012] According to one embodiment, the heat storage capacity of the electrical connection unit can be improved. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the embodiment.

[0014] Figure 2 This is a perspective view of the main body used to illustrate the implementation method.

[0015] Figure 3 This is a perspective view of a subunit used to illustrate the implementation method.

[0016] Figure 4 This is a perspective view showing a portion of the sub-units of the implementation method exploded.

[0017] Figure 5 This is a perspective view showing the wiring substrate according to the embodiment.

[0018] Figure 6 This is a perspective view showing an exploded view of a portion of the wiring substrate of the embodiment.

[0019] Figure 7 This is a top view showing the wiring substrate of the embodiment.

[0020] Figure 8 This is a perspective view showing an exploded portion of the electrical connection unit of the embodiment.

[0021] Figure 9 This is a bottom view showing the wiring substrate of the embodiment.

[0022] Figure 10 It is along Figure 7 The structure shown is a cross-sectional view taken along line AA.

[0023] Figure 11 This is a cross-sectional view showing a modified example of the implementation method.

[0024] Figure 12 This is a cross-sectional view showing a modified example of the implementation method. Detailed Implementation

[0025] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0026] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Orientation" refers to the overlapping of imaginary projections of two objects when viewed from a specific direction. That is, "orientation" is not limited to the case where two objects are directly facing each other, but may also include the case where two objects are facing each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0027] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 8 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 8 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1 The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction".

[0028] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0029] (Implementation Method)

[0030] <1. Structure of the Electrical Connection Unit>

[0031] Figure 1 This is a cross-sectional view illustrating the electrical connection unit 1 according to an embodiment. The electrical connection unit 1 is, for example, an on-board device mounted in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0032] Electrical connection unit 1, for example, includes a main body MU, a metal plate (support member) 80, and an insulating sheet 91 (see reference). Figure 8 ), multiple first heat-conducting components 92 and insulating cover 93.

[0033] <2. Main Body>

[0034] First, let's explain the main body MU.

[0035] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has 3 sub-units SU (sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0036] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a first wiring substrate (mounting component) 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X.

[0037] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate (mounting component) 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y.

[0038] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate (mounting component) 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z.

[0039] In this embodiment, the three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is positioned relative to sub-unit SUY on the +X direction side. Sub-units SUX and SUY are electrically connected via a plurality of connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is positioned relative to sub-unit SUY on the -X direction side. Sub-units SUZ and SUY are electrically connected via a plurality of connecting busbars 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y. The connecting busbars 75 are positioned relative to the plurality of sub-units SU on the side opposite to the metal plate 80.

[0040] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0041] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one subunit SU. Hereinafter, without distinguishing between the subunit SUX, subunit SUY, and subunit SUZ, they will be simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Additionally, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40".

[0042] Furthermore, instead of the above example, the main body MU may not be divided into multiple sub-units SU. That is, the main body MU may be formed from multiple electronic components 10 and a wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU with different functions, but may also be sub-units SU with the same function.

[0043] <3. Structure of Subunits>

[0044] Next, the structure of the subunit SU will be explained.

[0045] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 This is a perspective view showing a portion of a subunit SU exploded. The subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, and a wiring substrate 40. The connecting components 20 and 30 are components that form vertical power paths. The connecting components 20 and 30 can also be referred to as "vertical wiring components."

[0046] <3.1 Electronic components and connecting components for connecting components>

[0047] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0048] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Hereinafter, examples of electronic component 10 will be described, including a first type of electronic component 10M and a second type of electronic component 10N.

[0049] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 may also be referred to as a "metal component". Hereinafter, examples of the connecting member 20 will be described, including a first type of connecting member 20M and a second type of connecting member 20N.

[0050] <3.1.1 Type 1 Electronic Components>

[0051] The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged at one end. For example, the electronic component 10M has a cuboid-shaped main body 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0052] (Main body of the component)

[0053] The main body 12 is the part that performs the main functions of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, if the electronic component 10M is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body 12 includes a part that stores charge.

[0054] The main body 12 houses the constituent components within a large portion of the outer contour (housing) that forms the outer shape of the electronic component 10M. The housing is, for example, made of synthetic resin and is insulating. The main body 12 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, a plate-like structure formed along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the main body 12 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates the terminals 13A and 13B from each other. In this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting members 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates the first portions 21 of the two connecting members 20M connected to the electronic component 10M from each other.

[0055] (terminal)

[0056] Terminal 13 is an electrical connection portion exposed to the outside of the main body 12 of the component. Terminal 13 is electrically connected to the constituent components inside the housing. In this embodiment, the electronic component 10M includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a terminal on the positive side. The other of terminals 13A and 13B is a terminal on the negative side.

[0057] In this embodiment, terminals 13A and 13B are disposed at one end of the electronic component 10M in a horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in a horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole (not shown) for mounting a fastening member 71 (e.g., a screw or bolt) as described later. The mounting hole of each terminal 13 is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole of each terminal 13 has a threaded groove.

[0058] (Installation Department)

[0059] Mounting section 14 is a part used to fix electronic component 10M. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 8 The mounting hole (not shown in the attached drawing) is for mounting the component 112. The mounting hole is an insertion hole through which the fastening component 112 passes. The object to be secured to the mounting part 14 will be described later.

[0060] <3.1.2 Type 1 Connecting Components>

[0061] The first type of connecting member 20M is a member that electrically connects the first type of electronic component 10M to the wiring substrate 40. In this embodiment, the connecting member 20M connects the electronic component 10M to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 5 Electrical connection. The connection component 20M, for example, has a first portion 21 that stands above the wiring substrate 40 and a second portion 22 that is disposed along the wiring substrate 40.

[0062] (Part 1)

[0063] The first portion 21 of the connecting member 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid portion extending along the Z direction. The first portion 21 extends along one end of the electronic component 10M (e.g., the end in the X direction). The first portion 21 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to and connected to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X direction). The first portion 21 of the connecting member 20M is physically and electrically connected to the terminal 13 of the electronic component 10M by inserting a fastening member 71 (e.g., a screw or bolt) through a mounting hole (not shown) and screwing the fastening member into the mounting hole of the terminal 13 of the electronic component 10M.

[0064] (Part Two)

[0065] The second part 22 of the connecting component 20M is connected to the busbar 42 (see reference). Figure 5 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to (overlaps with) the busbar 42 in the Z direction and is connected to the busbar 42 from the Z direction. The second part 22 is fastened by a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 5 ) through. By engaging component 44 (e.g., nut, see Figure 3 The screw is screwed into the fastening component 43 that penetrates the second part 22, thereby physically and electrically connecting it to the busbar 42.

[0066] In this embodiment, a connecting component 20M is formed in an L-shape by the first part 21 and the second part 22.

[0067] <3.1.3 Second Type of Electronic Components>

[0068] The second type of electronic component 10N is an electronic component in which two terminals 13 are separately disposed at both ends in the horizontal direction. The electronic component 10N, for example, has a main body 12 and a plurality of terminals 13. Furthermore, in the structure of the electronic component 10N, structures having the same function as electronic component 10M are labeled with the same reference numerals. In this case, for the description of electronic component 10N, "electronic component 10M" in the above description of electronic component 10M will be replaced with "electronic component 10N".

[0069] In electronic component 10N, terminals 13A and 13B are separately disposed at opposite ends of electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole (not shown) for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole of each terminal 13 opens in the Z direction. For example, the mounting hole of each terminal 13 is a through hole through which the fastening member 72 passes.

[0070] <3.1.4 Second type of connecting component>

[0071] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N to the wiring substrate 40. In this embodiment, the connection member 20N connects the electronic component 10N to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 5 Electrical connection. The connecting component 20N has, for example, a first part 21, a second part 22, and a third part 23.

[0072] (Part 1)

[0073] The first portion 21 of the connecting member 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a cuboid portion extending along the Z direction. The first portion 21 is an erected portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 21 is adjacent (coinciding) with the terminal 13 of the electronic component 10N in the Z direction and is connected to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting member 20N has a mounting hole (not shown) for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole of the connecting member 20N opens upwards and has a threaded groove on its inner circumferential surface. The terminal 13 of the electronic component 10N is physically and electrically connected to the connecting member 20N by passing the fastening member 72 through it and screwing the fastening member into the mounting hole of the connecting member 20N.

[0074] (Part Two)

[0075] The second part 22 of the connecting component 20N is connected to the busbar 42 (see reference). Figure 5 The second part 22 protrudes horizontally (e.g., in the X direction) from the end of the first part 21 on the -Z direction side. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent (coincides) with the busbar 42 in the Z direction and is connected to the busbar 42 from the Z direction. The second part 22 is connected by a fastening member 43 (e.g., a screw or bolt, see reference 42) that protrudes from the busbar 42 in the +Z direction. Figure 5 ) through, and engage the locking component 44 (e.g., nut, see Figure 3 The thread is fastened to the fastening component 43, thereby physically and electrically connecting it to the busbar 42.

[0076] (Part Three)

[0077] The third part 23 is an upright wall (side wall) that rises from both ends of the second part 22 in the horizontal direction towards the +Z direction. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and to the second part 22. The third part 23 extends obliquely, for example, in a manner that widens in the X direction as it moves towards the -Z direction. Furthermore, the third part 23 may also be provided in the aforementioned connecting member 20M. On the other hand, the connecting member 20N may not have the third part 23.

[0078] <3.2 Connecting components for external connections>

[0079] Next, the connecting component 30 for external connection will be described.

[0080] The connecting member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connecting member 30 connects the external connection busbar 76 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 5 Electrical connection. The external connection is electrically connected to an external device via busbar 76. In this disclosure, "external device" refers to an electrical device located outside the electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples. The connection member 30 may have, for example, the same first, second, and third parts as the connection member 20M, and detailed descriptions thereof are omitted.

[0081] The upper end of the connecting member 30 (the upper end of the first part) is physically and electrically connected to an external connection busbar 76 by fastening member 73 (e.g., screw or bolt).

[0082] The lower part (second part) of the connecting component 30 is secured by a fastening component 43 (e.g., screw or bolt, see reference) that protrudes from the busbar 42 in the +Z direction. Figure 5 ) through, and engage the locking component 44 (e.g., nut, see Figure 3 The screw is screwed into the fastening component 43, thereby physically and electrically connecting it to the busbar 42.

[0083] <3.3 Substrate for Wiring>

[0084] Next, the wiring substrate 40 will be described.

[0085] Figure 5This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between an electronic component 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped," "sheet-shaped," or "plane" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction locally, or cases where there are uneven shapes on the surface that follow the thickness of the busbar, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0086] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and multiple fastening members 43. In this embodiment, the base plate 41 and the multiple busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. In addition, the wiring substrate 40 may also be formed by other structures instead of insert molding. For example, it may be a structure in which an opening (corresponding to the receiving portion 55 described later) is formed in the wiring substrate 40, which is formed separately from the busbars 42, to fix the busbars 42 by embedding, etc., and a busbar embedding plate is formed by fixing the busbars 42 in the opening.

[0087] Figure 6 This is an exploded perspective view of a portion of the wiring substrate 40. Hereinafter, for ease of explanation, the substrate 41, busbar 42, and fastening member 43 will be described with reference to the exploded view of the wiring substrate 40.

[0088] (Substrate board)

[0089] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is made of, for example, synthetic resin and is insulating. The substrate 41 electrically insulates the plurality of busbars 42 from each other. The substrate 41 is an example of both a "base component" and a "mounting component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52.

[0090] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0091] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is the back side facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (refer to...). Figure 1 The thickness direction of the planar portion 51 (the plate thickness direction, the normal direction of the first surface 51a and the second surface 51b) is the Z direction.

[0092] The planar portion 51 may have one or more receiving portions 55, for example, each receiving a busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole penetrating the planar portion 51 in the Z direction. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction, rather than a through hole. It should also be noted that in this disclosure, "the receiving portion penetrating the planar portion in the first direction (Z direction)" may also include a portion of the total length of the receiving portion 55 penetrating the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole that penetrates the planar portion 51 in the Z direction, or it may be a form that is provided inside the base plate 41 and does not expose to the outside of the base plate 41).

[0093] Viewed from the Z direction, each receiving portion 55 has a shape corresponding to the shape of the received busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55. Receiving portion 55A is provided corresponding to busbar 42A (described later) and receives busbar 42A. Receiving portion 55B is provided corresponding to busbar 42B (described later) and receives busbar 42B. Receiving portion 55C is provided corresponding to busbar 42C (described later) and receives busbar 42C. Receiving portion 55D is provided corresponding to busbar 42D (described later) and receives busbar 42D. Receiving portion 55E is provided corresponding to busbar 42E (described later) and receives busbar 42E.

[0094] (Busbar)

[0095] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 can also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0096] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is received in a receiving portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the receiving portion 55. In this embodiment, each busbar 42 is plate-shaped along the horizontal direction throughout its entire length. Each busbar 42 is received in the receiving portion 55 and extends along the planar portion 51 along its entire length (e.g., throughout the first connecting portion 61, the second connecting portion 62, the extension portion 63, and the extension portion 64 described later). The upper and lower surfaces of each busbar 42 can be coplanar with the upper and lower surfaces (first surface 51a and second surface 51b) of the planar portion 51. The component mounting surface of the wiring substrate 40 is formed by the upper surface of each busbar 42 and the upper surface (first surface 51a) of the planar portion 51. Hereinafter, the portion of each busbar 42 that is housed in the housing portion 55 and extends along the planar portion 51 is sometimes referred to as the "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component".

[0097] Figure 7 This is a top view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 on its plate portion 42p.

[0098] The first connecting portion 61 is the portion that contacts a connecting member 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is a connecting member that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction and is connected to the first connecting member 20 from the Z direction.

[0099] The second connecting portion 62 is the portion that contacts other connecting members 20 (hereinafter referred to as "second connecting members 20"). The second connecting member 20 is a connecting member that connects other electronic components 10 (hereinafter referred to as "second electronic components 10") included in a plurality of electronic components 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction and is connected to the second connecting member 20 from the Z direction.

[0100] Alternatively, the second connecting portion 62 may be a portion that contacts other connecting members 30 (hereinafter referred to as "second connecting member 30") instead of the example described above. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 30 in the Z direction and is connected to the second connecting member 30 from the Z direction.

[0101] Alternatively, the second connecting portion 62 may be a portion that contacts the connecting busbar 75 for connecting to other subunits SU without contacting the connecting members 20 and 30. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to and connected to the connecting busbar 75 in the Z direction.

[0102] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0103] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51, at least covering the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0104] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing portion 55, thereby extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extension 63 has a portion that extends linearly along the X direction. This portion extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across the +X and -X direction sides of the region R. That is, since the busbars 42 are housed in the housing portion 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0105] In addition to the portion extending along the X direction, the extension 63 of the busbar 42 may also include a portion extending along the Y direction, forming a crank shape. The extension 63 may also have portions extending obliquely relative to both the X and Y directions. Thus, the extension 63 can extend between the first connecting portion 61 and the second connecting portion 62, which are offset in the Y direction.

[0106] The extension 63 extends from one of the first connecting portion 61 and the second connecting portion 62 toward the other.

[0107] When two mutually orthogonal directions along the plane portion 51 of the base plate 41 are designated as a first direction (e.g., the X direction) and a second direction (e.g., the Y direction), the extension portion 63 is a portion that extends toward one side in the first direction (from one side of the two connecting portions closer to the other) or one side in the second direction (the side that is closer), and is a portion that includes both the side in the first direction and the side in the second direction and extends obliquely relative to the two directions.

[0108] In this embodiment, the portion of the busbar 42 that extends beyond the first connecting portion 61 and the second connecting portion 62, or that branches off from the extension portion 63 and overlaps with the electronic component 10 when viewed from the Z direction, is called the extension portion 64.

[0109] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension 63. Here, the portion formed by the first connecting portion 61, the second connecting portion 62, and the extension 63 in the busbar 42 is called the "connection path portion". The connection path portion extends between the first connection object and the second connection object and electrically connects them. The "connection object" includes the electronic component 10 and the connecting members 20 and 30. When the first connecting portion 61 and the second connecting portion 62 are connected to the electronic component 10, they are connected to the electronic component 10 via the connecting member 20 adjacent to the component body portion 12. The portion that extends from the first connecting portion 61 and the second connecting portion 62 outward from the connection path portion and overlaps with the component body portion 12 when viewed from the Z direction is called the extension 64 in this embodiment. The extension 64 is not limited to overlapping with the electronic component 10 that is the connection object, but may also overlap with a third electronic component 10 that is not the connection object. The extension 64 is not limited to extending from the connecting portions 61 and 62, but may also extend from the extension 63.

[0110] The extension portion 64 is formed by extending or branching the busbar 42 for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connection portion 61 (or the second connection portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10 when viewed from the Z direction. In this embodiment, sometimes the extension portion 64 itself overlaps with the electronic component 10 for heat storage / heat absorption.

[0111] The following describes several layout examples of busbar 42. Furthermore, the plurality of electronic components 10 includes three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B are, for example, first-type electronic components 10M. Electronic component 10C is, for example, second-type electronic components 10N. Moreover, the types of electronic components 10 are not limited to the examples described above. Additionally, the plurality of connecting components 20 includes six connecting components 20A, 20B, 20C, 20D, 20E, and 20F. The plurality of connecting components 30 includes two connecting components 30A and 30B. The plurality of connecting busbars 75 includes two connecting busbars 75A and 75B. The plurality of external connection busbars 76 includes two external connection busbars 76A and 76B.

[0112] (First deployment example)

[0113] First, a layout example related to busbar 42A will be described. Busbar 42A has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. When viewed from the Z direction, the first connecting portion 61 is located on the +X direction side relative to the electronic component 10A. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10A via a connecting member 20A, which serves as a first connecting member 20. When viewed from the Z direction, the second connecting portion 62 is located on the -X direction side relative to the electronic component 10A. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75A.

[0114] Since the extension 63 is housed in the housing 55, it extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction and across both sides of the region R. For example, the extension 63 extends in a straight line along the X direction. The extension 63 extends through the region R that overlaps with the electronic component 10A when viewed from the Z direction and across the +X and -X direction sides of the region R. The busbar 42A is, for example, the busbar included in the positive line PL of the electrical connection unit 1.

[0115] (Second deployment example)

[0116] Next, an example of the arrangement related to busbar 42B will be described. Busbar 42B has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10A via a connecting member 20B, which is a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76A via a connecting member 30A, which is a second connecting member 30. When viewed from the Z direction, the extension portion 64 extends to the region R that overlaps with the electronic component 10A, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10A. Furthermore, busbar 42B may also have an extension portion 63 similar to busbar 42A, which extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. Busbar 42B is, for example, a busbar included in the positive line PL of the electrical connection unit 1.

[0117] (Third deployment example)

[0118] Next, a layout example related to busbar 42C will be described. Busbar 42C has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10B via a connecting member 20C, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to other sub-units SU via connecting busbar 75B. The extension portion 64 extends to a region R that overlaps with the electronic component 10B when viewed from the Z direction, and has an end portion 42e1 of busbar 42 at the position where it overlaps with the electronic component 10B when viewed from the Z direction. Busbar 42C is, for example, a busbar included in the negative line NL of the electrical connection unit 1.

[0119] (Fourth deployment example)

[0120] Next, a layout example related to busbar 42D will be described. Busbar 42D has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to terminal 13A of electronic component 10B via connecting member 20D, which is a first connecting member 20. The second connecting portion 62 is electrically connected to terminal 13B of electronic component 10C via connecting member 20E, which is a second connecting member 20. Busbar 42D is, for example, a busbar included in the negative line NL of electrical connection unit 1.

[0121] (Fifth Layout Example)

[0122] Next, a layout example related to busbar 42E will be described. Busbar 42E has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10C via a connecting member 20F, which serves as a first connecting member 20. The second connecting portion 62 is electrically connected to an external connection busbar 76B via a connecting member 30B, which serves as a second connecting member 30. Busbar 42E is, for example, a busbar included in the negative line NL of the electrical connection unit 1.

[0123] (Fastening components)

[0124] Next, refer to again Figure 6 The fastening component 43 will now be described. The fastening component 43 is a component used to secure the busbar 42 to a connecting component (connecting component 20, connecting component 30, or connecting busbar 75) of the busbar 42. The fastening component 43 is, for example, a riveting bolt fixed to the busbar 42.

[0125] In this embodiment, the first connecting portion 61 and the second connecting portion 62 of the busbar 42 each have a through hole 42h. The through hole 42h penetrates the busbar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head 43b. The circumferential surface of the shaft portion 43a has a threaded groove. The diameter of the head 43b is larger than the diameter of the shaft portion 43a. With the shaft portion 43a passing through the through hole 42h of the busbar 42, the head 43b of the fastening member 43 is riveted to the busbar 42. Through this fixation, with the shaft portion 43a protruding from the through hole 42h of the busbar 42 in the +Z direction, the fastening member 43 is electrically and physically connected to the busbar 42. Furthermore, the fastening member 43 is not limited to riveting; it can also be fixed to the busbar 42 by welding or other methods.

[0126] In this embodiment, the connecting member 20 is first fixed to the electronic component 10 by the fastening member 71 or the fastening member 72, and then mounted to the fastening member 43 in the Z direction. For example, the connecting member 20 is used to insert the shaft portion 43a of the fastening member 43 into the second mounting hole (through hole) 22h of the second part 22. Then, the engaging member 44 (e.g., a nut) engages with the shaft portion 43a of the fastening member 43, which protrudes from the second mounting hole 22h of the second part 22 of the connecting member 20. The engaging member 44 is mounted to the shaft portion 43a, for example, along the Z direction. Through this engagement, the second part 22 of the connecting member 20 is fixed to the fastening member 43.

[0127] <4. Metal plate, insulating sheet, first heat-conducting component, and insulating cover>

[0128] Next, the metal plate 80, the insulating sheet 91, the first heat-conducting component 92, and the insulating cover 93 will be described.

[0129] <4.1 Metal Plate>

[0130] Figure 8 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 may also be referred to as a "rigid component".

[0131] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the long side of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0132] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 has a gap S1 (see reference) between it and the second surface 51b of the planar portion 51 of each sub-unit SU. Figure 10 ), and the second surface 51b of the planar portion 51 facing each subunit SU.

[0133] The fixing part 82 is a fixing part used to fix the base plate 41 of each sub-unit SU to the metal plate 80. When viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction.

[0134] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction.

[0135] <4.2 Insulating Sheets>

[0136] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of first heat-conducting components 92.

[0137] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be disposed between the wiring substrate 40 of each subunit SU and the plurality of first heat-conducting components 92, instead of the example described above. Furthermore, if the first heat-conducting components 92 are insulating and the necessary insulation is ensured by the first heat-conducting components 92, the insulating sheet 91 may be omitted.

[0138] <4.3 First Heat-Conducting Component>

[0139] The first thermally conductive component 92 is a component used to transfer heat (Joule heat) generated by the electronic component 10 when energized and / or by the busbar 42 itself when energized to the metal plate 80. The first thermally conductive component 92 is, for example, a flexible thermally conductive sheet (e.g., a thermally conductive silicone sheet). However, the first thermally conductive component 92 is not limited to the above example and may also be a thermally conductive component formed of thermally conductive gel or other materials.

[0140] Figure 9 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of first heat-conducting components 92 are locally provided in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of first heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of first heat-conducting components 92 are arranged near the electronic components 10 (e.g., electronic components 10A, 10B) at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of first heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0141] Figure 10 It is along Figure 7 The diagram shows a cross-sectional view taken along line AA of the structure. In this embodiment, a first heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The first heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat generated by the busbar 42 from the busbar 42 to the metal plate 80.

[0142] In this embodiment, when viewed from the Z direction, a portion of the first heat-conducting component 92 contacts the busbar 42 at a position overlapping with the connecting component 20. In this case, the first heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20, and then from the connecting component 20 to the metal plate 80 via the busbar 42.

[0143] Furthermore, in this embodiment, when viewed from the Z direction, a portion of the first heat-conducting member 92 is positioned overlapping with and in contact with the head 43b of the fastening member 43. In this case, the first heat-conducting member 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting member 20 from the fastening member 43 to the metal plate 80.

[0144] Furthermore, in this embodiment, a portion of the first heat-conducting component 92 contacts the busbar 42 at a location overlapping with the electronic component 10 when viewed from the Z direction. In this case, the first heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 10 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0145] (Modified Example)

[0146] Figure 11 This is a cross-sectional view showing a modified example. In this modified example, an air layer AS serves as a gap between the busbar 42 and the electronic component 10. The busbar 42 is thermally connected to the electronic component 10 via the air layer AS. According to this structure, the heat generated by the electronic component 10 moves to the busbar 42 through the air layer AS. The heat that moves to the busbar 42 is dissipated by moving to the metal plate 80 via the first heat-conducting member 92.

[0147] (Modified Example)

[0148] Figure 12This is a cross-sectional view showing another variation. In this variation, a second heat-conducting component 98 is provided between the busbar 42 and the electronic component 10. The second heat-conducting component 98 is located between the busbar 42 and the electronic component 10 in the Z direction. The busbar 42 is thermally connected to the electronic component 10 via the second heat-conducting component 98. The second heat-conducting component 98 allows heat generated by the electronic component 10 to move towards the busbar 42. The second heat-conducting component 98 is, for example, a flexible heat-conducting sheet (e.g., a thermally conductive silicone sheet). However, the second heat-conducting component 98 is not limited to the above example and can also be a heat-conducting component formed from thermally conductive gel or other raw materials. According to this structure, the heat generated by the electronic component 10 moves efficiently towards the busbar 42 via the second heat-conducting component 98. The heat that moves to the busbar 42 is dissipated by moving towards the metal plate 80 via the first heat-conducting component 92.

[0149] <4.4 Insulating Cover>

[0150] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to prevent contact with the electrical path of the main body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the electrical path of the main body MU.

[0151] <5. Exposed Structure of Busbars>

[0152] Next, the exposed structure of the busbar 42 will be described.

[0153] <5.1 Exposed structure on the upper surface side of the busbar>

[0154] First, refer to Figure 5 The exposed structure on the upper surface side of the busbar 42 will be described. In this embodiment, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate 41 on the upper surface side (the first surface 51a side of the planar portion 51). For example, the extension 63 of the busbar 42 overlaps with the electronic component 10 at least in the region R (refer to) when viewed from the Z direction. Figure 7 Part of it is exposed on the upper surface laterally to the outside of the substrate plate 41.

[0155] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length between the first connecting portion 61 and the second connecting portion 62 and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the base plate 41 on the upper surface, along its entire length between the first connecting portion 61 and the second connecting portion 62.

[0156] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the substrate plate 41 on the upper surface along its entire length.

[0157] like Figure 10 As shown, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side (second surface 51b side), in addition to the upper surface side. For example, the entire length of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side.

[0158] <5.2 Exposed Structure on the Lower Surface Side of the Busbar>

[0159] Next, refer to Figure 10 The exposed structure on the lower surface side of the busbar 42 will be described. In this embodiment, the plate portion 42p of the busbar 42 includes an exposed portion 42u on the lower surface side (the second surface 51b side of the planar portion 51) that exposes to the outside of the base plate 41. In this embodiment, the exposed portion 42u of the busbar 42 extends along the entire length of the busbar 42. In this embodiment, a first heat-conducting member 92 is disposed between the exposed portion 42u of the busbar 42 and the metal plate 80. For example, the first heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42.

[0160] In this embodiment, at least a portion of the exposed portion 42u of the busbar 42 is disposed in the region that overlaps with the connecting member 20 when viewed from the Z direction. At least a portion of the first heat-conducting member 92 overlaps with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction. For example, at least a portion of the first heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction.

[0161] In this embodiment, the exposed portion 42u of the busbar 42 includes a first portion 42ua disposed in the region overlapping with the connecting member 20 when viewed from the Z direction, and a second portion 42ub disposed in the region overlapping with the electronic component 10 when viewed from the Z direction.

[0162] The first heat-conducting component 92 includes a first heat-conducting portion 92a and a second heat-conducting portion 92b. The first heat-conducting portion 92a overlaps a first portion 42ua of an exposed portion 42u of the bus bar 42 in a region overlapping with the connecting component 20 when viewed from the Z direction. For example, the first heat-conducting portion 92a contacts the first portion 42ua of the exposed portion 42u of the bus bar 42. On the other hand, the second heat-conducting portion 92b overlaps a second portion 42ub of the exposed portion 42u of the bus bar 42 in a region overlapping with the electronic component 10 when viewed from the Z direction. For example, the second heat-conducting portion 92b contacts the second portion 42ub of the exposed portion 42u of the bus bar 42.

[0163] It should be noted that, as described above, at least a part of the extension portion 63 of the bus bar 42 is exposed to the outside of the base plate 41 not only on the lower surface side but also on the upper surface side (the first surface 51a side). For example, the bus bar 42 is exposed to the outside of the base plate 41 over the entire length of the bus bar 42 on the upper surface side. For example, the second portion 42ub of the exposed portion 42u of the bus bar 42 is exposed to the outside of the base plate 41 not only on the lower surface side but also on the upper surface side and faces the electronic component 10.

[0164] <14. Advantages of the present embodiment>

[0165] <A. Advantages of the wiring substrate>[[ID=​​​​​​​In this embodiment, the electrical connection unit 1 has a first connecting member 20. The first connecting member 20 is a portion that stands upright relative to the first busbar 42 and electrically connects the first electronic component 10 to the first busbar 42. The first busbar 42 has a first connecting portion 61 that contacts the first connecting member 20. The first connecting portion 61 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, more of the wiring path is formed on a plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0169] In this embodiment, the electrical connection unit 1 has a second connection member 20. The second connection member 20 is a portion that stands upright relative to the first busbar 42 and electrically connects a second electronic component or external device to the first busbar 42. The first busbar 42 has a second connection portion 62 that contacts the second connection member 20. The first busbar 42 is housed in a first housing portion 55 and extends along a planar portion 51, at least extending across the first connection portion 61 and the second connection portion 62. With this structure, more of the wiring path is formed on a plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0170] In this embodiment, the first busbar 42 has an extension 63 between the first connecting portion 61 and the second connecting portion 62. The extension 63 is housed in the first housing portion 55 and extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. With this structure, by housing the extension 63 in the first housing portion 55, the wiring layout is less constrained by the presence of the electronic component 10. Therefore, a wiring layout that is more favorable to electrical characteristics, such as making it easier to extend the extension 63 in a straight line, can be achieved. Furthermore, routing around the busbar such as the electronic component 10 can be avoided. Thus, the electrical characteristics of the electrical connection unit 1 can be improved and / or the electrical connection unit 1 can be miniaturized.

[0171] In this embodiment, the first busbar 42 has an extension 64 that extends to a region R overlapping with the first electronic component 10 when viewed from the Z direction, and has an end portion 42e1 at the position where it overlaps with the first electronic component 10. The extension 64 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, by housing the extension 64 in the first housing portion 55, the electrical connection unit 1 can be made thinner, and the metallic heat dissipation portion (extension 64) for promoting heat dissipation and / or heat storage of the first electronic component 10 can be positioned below the first electronic component 10. As a result, the heat dissipation and / or heat storage of the electrical connection unit 1 can be improved.

[0172] In this embodiment, the first busbar 42 is housed in the first receiving portion 55 along its entire length and extends along the planar portion 51. With this structure, more of the wiring path is formed on the plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0173] In this embodiment, the electrical connection unit 1 has a second busbar 42 electrically connected to the second terminal 13B of the first electronic component 10. The planar portion 51 has a second receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location away from the first receiving portion 55. At least a portion of the second busbar 42 is received in the second receiving portion 55 and extends along the planar portion 51. With this structure, a larger portion of the wiring path containing multiple busbars 42 is held in a plane by a substrate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0174] In this embodiment, the electrical connection unit 1 has a third busbar 42. The first busbar 42 is the busbar included in the positive line PL. The third busbar 42 is the busbar included in the negative line NL. The planar portion 51 has a third receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction at a position away from the first receiving portion 55. At least a portion of the third busbar 42 is received in the third receiving portion 55 and extends along the planar portion 51. According to this structure, more of the wiring path forming the positive line PL and the negative line NL is held in a plane by a substrate plate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0175] In this embodiment, the electrical connection unit 1 includes a fourth bus 42G, a fifth bus 75D, and a third connecting member 100 that electrically connects the fourth bus 42G and the fifth bus 75D. The planar portion 51 has a fourth receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location remote from the first receiving portion 55. At least a portion of the fourth bus 42G is received in the fourth receiving portion 55 and extends along the planar portion 51. The third connecting member 100 includes a portion that stands upright relative to the fourth bus 42G. The fifth bus 75D is supported by the third connecting member 100 at a location remote from the first bus 42 in the Z direction and extends parallel to the first surface 51a. With this structure, a three-dimensional wiring path can be easily formed through the fourth bus 42G, the third connecting member 100, and the fifth bus 75D. Therefore, the electrical connection unit 1 with excellent assemblability can be provided. Furthermore, by positioning the fourth busbar 42G within the receiving portion 55 of the substrate 41, a portion of the three-dimensional wiring path is formed within the thickness of the substrate 41. This makes it easier to achieve a thinner electrical connection unit 1.

[0176] In the present embodiment, the fifth bus bar 75D extends in a manner that crosses the first bus bar 42 at a position away from the first bus bar 42 in the Z direction. With such a structure, it is easy to form a wiring path that is three-dimensionally crossed with the first bus bar 42 through the third connecting member 100 and the fifth bus bar 75D. Thereby, an electrical connection unit 1 with excellent assembly performance can be provided.

[0177] <B. Advantages related to the flat bus bar> <00,00412>As a comparative example, consider an electrical connection unit in which the bus bar is arranged in a posture standing up with respect to the lower wall of the housing. In the structure of such a comparative example, it is necessary to fix the bus bar in a standing posture to the housing, and it is difficult to improve the workability related to the installation of the bus bar. In this case, it may be difficult to improve the assembly performance of the electrical connection unit 1.

[0179] On the other hand, in the present embodiment, the electrical connection unit 1 includes a base plate 41 and a bus bar 42. The base plate 41 includes a plate-shaped flat portion 51. The flat portion 51 has a first accommodating portion 55 that is recessed in the Z direction or penetrates the flat portion 51 in the Z direction. At least a part of the bus bar 42 is accommodated in the first accommodating portion 55 and extends along the flat portion 51. With such a structure, it is easy to integrally process the base plate 41 and the bus bar 42, and the workability related to the installation of the bus bar can be improved compared with the structure of the above comparative example. Thereby, an improvement in the assembly performance of the electrical connection unit 1 can be achieved.

[0180] In the present embodiment, the bus bar 42 is accommodated in the accommodating portion 55 over the entire length of the bus bar 42 and extends along the flat portion 51. With such a structure, an improvement in the assembly performance of the electrical connection unit 1 can be achieved, and it is easy to make the electrical connection unit 1 thinner.

[0181] In the present embodiment, the bus bar 42 is integrated with the base plate 41 by insert molding. With such a structure, the operation of manually installing the bus bar 42 on the housing can be eliminated or reduced. Thereby, a further improvement in the assembly performance of the electrical connection unit 1 can be achieved.

[0182] In the present embodiment, there are fastening members 43 protruding from the bus bar 42 in the Z direction and connecting members 20, 30 mounted on the fastening members 43 from the Z direction. The connecting members 20, 30 electrically connect the electronic component 10 or the external device to the bus bar 42. With such a structure, it is easy to make the direction of the operation of mounting the connection target component on the bus bar 42 coincide with the Z direction. If the direction of the operation can be made to coincide, a further improvement in the assembly performance of the electrical connection unit 1 can be achieved. [[ID=In the present embodiment, the connecting member 20 is connected to the electronic component 10 in the X direction (or Y direction). With such a structure, by using the connecting member 20 for the electronic component 10 that needs to be connected in the X direction, the connection direction of the electronic component 10 with respect to the bus bar 42 can be changed to the Z direction. Thereby, further improvement in the assemblability of the electrical connection unit 1 can be achieved.

[0184] <C. Advantages related to the exposed structure on the upper surface side of the bus bar>

[0185] As a comparative example, consider an electrical connection unit in which the upper surface side of the bus bar 42 is covered with a synthetic resin. In the structure of such a comparative example, it is difficult to improve the heat dissipation of the bus bar 42.

[0186] On the other hand, in the present embodiment, the electrical connection unit 1 includes a first electronic component 10 and a wiring substrate 40. The wiring substrate 40 includes a base plate 41 and a bus bar 42. The base plate 41 has a plate-like planar portion 51, and the planar portion 51 has a first surface 51a facing the first electronic component 10 and a second surface 51b located on the side opposite to the first surface 51a. The planar portion 51 has a housing portion 55 that is recessed in the Z direction or penetrates the planar portion 51 in the Z direction. At least a part of the bus bar 42 has a plate portion 42p that is housed in the housing portion 55 and extends along the planar portion 51. The plate portion 42p includes a first connection portion 61 that overlaps with the first connection member 20 when viewed in the Z direction and an extension portion 63 that extends from the first connection portion 61 in a direction intersecting the Z direction. At least a part of the extension portion 63 is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, at least a part of the portion of the bus bar 42 other than the connection portions 61 and 62 connected to other components is exposed to the outside and functions as an area for heat release. In this case, improvement in the heat dissipation of the electrical connection unit 1 can be achieved. [[ID=​​​In the present embodiment, the first bus bar 42 has a second connecting portion 62 that overlaps the second connecting members 20 and 30 when viewed in the Z direction. The first bus bar 42 is at least entirely accommodated in the accommodating portion 55 between the first connecting portion 61 and the second connecting portion 62 and extends along the planar portion 51, and is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0189] In the present embodiment, the bus bar 42 is entirely accommodated in the accommodating portion 55 and extends along the planar portion 51, and is exposed to the outside of the base plate 41 on the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0190] At least a part of the extending portion 63 is exposed to the outside of the base plate 41 on the second surface 51b side in addition to the first surface 51a side. With such a structure, a larger portion functions as a heat dissipation area, and thus further improvement in the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0191] In a modification of the present embodiment, the electrical connection unit 1 includes: a metal plate 80 that faces the planar portion 51 and has a gap S1 therebetween; and a first heat conductive member 92 that is disposed between the bus bar 42 and the metal plate 80. The base plate 41 has a cover portion 51v on the second surface 51b side that covers at least a part of the extending portion 63. With such a structure, even when heat tends to accumulate in the gap S1 between the base plate 41 and the metal plate 80, by providing the cover portion 51v, heat accumulation in the gap S1 can be suppressed.

[0192] <D. Advantages related to the exposed structure on the lower surface side of the bus bar>

[0193] [[ID=1​​​​​In this embodiment, the device includes: a wiring substrate 40, wherein a busbar 42 is integrally held (including insert and embedding) on ​​the substrate body; and an electronic component 10 mounted on the wiring substrate 40. The busbar 42 includes: a connection path portion (a first connection portion 61, a second connection portion 62, and an extension portion 63) that extends between a first connection object (electronic component 10 or connection member 20, 30) and a second connection object (other electronic component 10 or other connection member 20, 30); and an extension portion (excess length portion) 64 that extends outward from the connection path portion and overlaps with the component body portion (heating portion) 12 of the electronic component 10 when viewed from the normal direction (Z direction) of the wiring substrate 40.

[0196] According to this structure, the busbar 42 held on the wiring substrate 40 has an extension 64 extending outward to the connection path portion. This extension 64 overlaps with the main body portion 12 of the electronic component 10, thereby enabling the heat generated by the electronic component 10 to be conducted to the busbar 42 via the extension 64. As a result, the busbar 42 can be used as a heat storage component, thereby improving the heat storage capacity of the electrical connection unit 1.

[0197] In this embodiment, the busbar 42 is integrated with the wiring substrate 40 by insert molding.

[0198] With this structure, since the busbar 42 is embedded in the wiring substrate 40, the component mounting surface of the wiring substrate 40 is flush, and the thickness of the wiring substrate 40 can be suppressed. The busbar 42 can be easily exposed on both sides of the substrate, and the heat of the electronic component 10 can be easily dissipated to the back side of the wiring substrate 40 through the busbar 42.

[0199] In this embodiment, the extension 64 contacts the main body 12 of the electronic component 10 via the second heat-conducting component 98.

[0200] With this structure, the extension 64 contacts the electronic component 10 via the second heat-conducting component 98, thereby enabling good heat conduction from the electronic component 10 to the extension 64 and further improving the heat storage capacity of the electrical connection unit 1.

[0201] <Variation Example>

[0202] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as the structure of the embodiment described above.

[0203] (First variation)

[0204] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0205] (Second variation)

[0206] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42. It should be noted that in the present invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0207] (Third variation)

[0208] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged such that multiple busbars 42 arranged horizontally are sandwiched between, for example, both sides in the Z direction. For example, the multiple components may be integrally formed by sandwiching the multiple busbars 42 together through lamination. The multiple components form a planar portion 51. In this case, a receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. A sheet component may, for example, be a flexible sheet component. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42. For example, in this case, the receiving portion 55 formed between the multiple components is equivalent to an example of a "receiving portion recessed in the first direction (Z direction)".

[0209] (Fourth variation)

[0210] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0211] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0212] [Potential for Industrial Applications]

[0213] According to the present invention, the thermal characteristics of the electrical connection unit can be improved.

[0214] Explanation of reference numerals in the attached figures

[0215] 1 Electrical connection unit

[0216] 10 Electronic components

[0217] 12 Components Main Body

[0218] 20 and 30 connectors

[0219] 40. Wiring substrate

[0220] 41 base plate

[0221] 42. Busbar

[0222] 51. Planar section

[0223] 51a First page

[0224] 51b Second page

[0225] 61 First connecting part

[0226] 62 Second connecting part

[0227] 63 Extension

[0228] 64 Extension

[0229] 80 metal sheet

[0230] 92 First heat-conducting component

[0231] 98 Second heat-conducting component

Claims

1. An electrical connection unit, characterized in that, have: The first connection object is any one of the following: a first electronic component, a connection component connected to the first electronic component, or a connection component for external connection; The second connection object is any one of the following: a second electronic component, a connection component connected to the second electronic component, or a connection component for external connection; A base component having a plate-shaped or sheet-shaped planar portion facing the first connecting object and the second connecting object; as well as A busbar, which is held on the planar portion and electrically connects the first connection object and the second connection object. When the thickness direction of the planar portion is set as a first direction, the planar portion has a receiving portion that is recessed in the first direction or extends through the planar portion in the first direction. The bus bar has the following features: A connection path portion, the connection path portion extending between the first connection object and the second connection object; and An extension portion extends outward from the connecting path portion, is housed within the housing portion, and overlaps with the first electronic component when viewed from the first direction.

2. The electrical connection unit as claimed in claim 1, characterized in that, When viewed from the first direction, the extension has the end of the busbar at a position where it overlaps with the first electronic component.

3. The electrical connection unit as described in claim 1 or 2, characterized in that, The busbar is integrated with the base component through insert molding.

4. The electrical connection unit as described in claim 1 or 2, characterized in that, The electrical connection unit also includes: A metal plate facing the base component from the side opposite to the first connecting object; and A first heat-conducting component is disposed between the busbar and the metal plate.

5. The electrical connection unit as described in claim 1 or 2, characterized in that, It also includes a second heat-conducting component disposed between the extension and the first electronic component.

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