Electric connection structure, OAM module, display card device and electronic equipment

Abstract

The invention relates to an electric connection structure, an OAM module, a display card device and electronic equipment, the electric connection structure comprises at least two circuit boards and a substrate, and the bottom wall of each circuit board is provided with a connection part; matching parts are arranged on the top wall of the substrate, and the number of the matching parts is the same as that of the circuit boards; and each circuit board is connected with the corresponding matching part through the respective connecting part, so that each circuit board is electrically connected to the substrate. Through the above technical scheme, the electric connection structure provided by the invention can realize decoupling of the plurality of connection parts, can reduce the possibility of problems such as needle kneeling and poor signal contact in the assembly process of the circuit board and the substrate, and is beneficial to improving the product quality and reliability.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically, to an electrical connection structure, an OAM module, a graphics card device, and an electronic device. Background Technology

[0002] In related technologies, OAM (OCP Accelerator Module) is an open acceleration module based on the OCP standard. In order to meet its large current requirements and high-speed signal transmission requirements, the backing plate and the base plate need to be connected by multiple board connectors. However, in this arrangement, problems such as pin failure and poor signal contact are prone to occur during the assembly of multiple board connectors between the backing plate and the base plate. Summary of the Invention

[0003] The purpose of this disclosure is to provide an electrical connection structure, OAM module, graphics card device, and electronic device to solve problems such as pin failure and poor signal contact that easily occur during the assembly of multiple board connectors between the backing plate and the base plate in related technologies.

[0004] To achieve the above objectives, a first aspect of this disclosure provides an electrical connection structure, comprising: at least two circuit boards, each circuit board having a connecting portion on its bottom wall; and a substrate, the substrate having a mating portion on its top wall, the number of mating portions being the same as the number of circuit boards; each circuit board being connected to its corresponding mating portion via its respective connecting portion, such that each circuit board is electrically connected to the substrate.

[0005] Optionally, the electrical connection structure further includes a support structure, wherein each circuit board is connected to the substrate through the support structure, and the support structure supports the circuit board and the substrate.

[0006] Optionally, the circuit board has a first side and a second side arranged opposite to each other along a first direction, with one of the connecting portion and the supporting structure arranged closer to the first side and the other arranged closer to the second side.

[0007] Optionally, the connection portion includes a first connector that extends along a second direction perpendicular to the first direction. The number of support structures on the same circuit board is two, and the two support structures are spaced apart from the first connector along the first direction and are respectively located at two corners of the circuit board.

[0008] Optionally, each of the supporting structures includes a first bolt, a support column, and a second bolt. The support column is disposed between the circuit board and the substrate, and its two ends along a third direction abut against the circuit board and the substrate, respectively. The third direction is perpendicular to the plane containing the first and second directions. The first head of the first bolt abuts against the circuit board, and the first rod portion connected to the first head passes through the circuit board from top to bottom along the third direction and is then threaded to the support column. The second head of the second bolt abuts against the substrate, and the second rod portion connected to the second head passes through the substrate from bottom to top along the third direction and is then threaded to the support column.

[0009] Optionally, the support structure includes a third bolt, a pressure plate, and a support plate. The pressure plate, the circuit board, the support plate, and the substrate are stacked in a third direction. The support plate is disposed between the circuit board and the substrate, and both ends of the support plate abut against the circuit board and the substrate, respectively. The third head of the third bolt abuts against the pressure plate, and the third rod portion of the third bolt connected to the third head passes through the pressure plate, the circuit board, the support plate, and the substrate sequentially from top to bottom in the third direction before being threaded into a nut.

[0010] Optionally, the number of circuit boards in the first direction is two, including a first circuit board and a second circuit board arranged symmetrically; the connecting portions on the bottom walls of the first circuit board and the second circuit board both include a first connector, and the mating portion on the top wall of the substrate includes a second connector.

[0011] Optionally, at least two of the circuit boards are electrically connected via an electrical connector; the electrical connector includes a first conductive structure disposed on the substrate, and at least two of the circuit boards are electrically connected via the first conductive structure; and / or, the electrical connector includes a flexible circuit board, and at least two of the circuit boards are electrically connected via the flexible circuit board.

[0012] Optionally, the first conductive structure includes a wiring layer disposed on the substrate.

[0013] Optionally, the flexible circuit board is integrally formed with the circuit board, and / or the flexible circuit board is assembled and connected with the circuit board.

[0014] A second aspect of this disclosure provides an OAM module, including the electrical connection structure provided in the first aspect above.

[0015] A third aspect of this disclosure provides a graphics card device including the OAM module provided in the second aspect above.

[0016] A fourth aspect of this disclosure provides an electronic device including the graphics card device provided in the third aspect above.

[0017] Through the above-described technical solution, namely the electrical connection structure provided in this disclosure, the electrical connection structure provides a connecting part on the bottom wall of at least two circuit boards, and provides a number of mating parts on the top wall of the substrate equal to the number of circuit boards. This arrangement allows each circuit board to be connected to the corresponding mating part on the substrate through its own connecting part, thereby achieving a stable electrical connection between each circuit board and the substrate. In this way, since each circuit board is aligned with a corresponding connecting part and mating part during the assembly and connection of the circuit board and the substrate, a stable electrical connection between each circuit board and the substrate can be achieved. Compared with related technologies, where the buckle plate and the base plate need to be connected through multiple board connectors, this disclosure, by splitting the buckle plate into multiple circuit boards, and providing a connecting part on each circuit board, can achieve decoupling of multiple connecting parts (e.g., connectors), which can reduce the possibility of problems such as pin failure and poor signal contact during the assembly of the circuit board and the substrate, and is beneficial to improving product quality and reliability. In addition, since there are multiple circuit boards electrically connected to the substrate and multiple connection parts (such as connectors) on the circuit boards, it is easy to meet the design requirements of the OAM module, such as the large current demand and high-speed signal transmission requirements of the OAM module, when the electrical connection structure is applied to such a module, thus helping to improve product performance.

[0018] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a cross-sectional schematic diagram of the electrical connection structure provided in the first embodiment of this disclosure, wherein the electrical connector is not shown; Figure 2 This is a schematic diagram showing the connection between the circuit board and the connector provided in an exemplary embodiment of this disclosure; Figure 3 This is a cross-sectional schematic diagram of the electrical connection structure provided in the second embodiment of this disclosure, wherein the electrical connector is not shown; Figure 4 This is a schematic diagram of the electrical connection structure provided in the first embodiment of the present disclosure, in which the circuit boards of the electrical connection structure are electrically connected by electrical connectors, and a portion of the support structure is shown. Figure 5 This is a schematic diagram of the electrical connection structure provided in the second embodiment of the present disclosure, in which the circuit boards of each circuit board are electrically connected by electrical connectors, wherein the support structure is not shown; Figure 6 This is a schematic diagram of the electrical connection structure provided in the third embodiment of the present disclosure, in which the circuit boards of each circuit board are electrically connected by electrical connectors, wherein the support structure is not shown; Figure 7 This is a schematic diagram of the buckle plate and base plate provided in the related technology, in which the buckle plate and base plate are not connected; Figure 8 This is a schematic diagram of the connection between the buckle and the board connector provided in the related technology.

[0020] Explanation of reference numerals in the attached figures 1-Circuit board; 110-First side; 120-Second side; 130-FPC connector; 140-First circuit board; 150-Second circuit board; 2-Connecting part; 210-First connector; 3-Substrate; 4-Mating part; 410-Second connector; 5-Supporting structure; 510-First bolt; 511-First head; 512-First rod; 520-Supporting column; 530-Second bolt; 531-Second head; 532-Second rod; 540-Third bolt; 541-Third head; 542-Third rod; 550-Pressure plate; 560-Supporting plate; 570-Nut; 6-Electrical connector; 610-First conductive structure; 611-Wiring layer; 620-Flexible circuit board; 7-Snap-on plate; 8-Base plate; 9-Board connector. Detailed Implementation

[0021] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0022] In this disclosure, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to upper and lower within the space of the electrical connection structure when it is in use. "Inner" and "outer" refer to inner and outer relative to the outline of the component or structure itself. Furthermore, it should be noted that terms such as "first" and "second" are used to distinguish one element from another and do not indicate sequence or importance. Additionally, in the description with reference to the accompanying drawings, the same reference numerals in different drawings denote the same elements.

[0023] The inventor discovered through research that, in the relevant technologies, reference Figure 7 and Figure 8 As shown, OAM (OCP Accelerator Module) is an open acceleration module based on the OCP standard. To meet its high current requirements and high-speed signal transmission requirements, the backing plate 7 and the base plate 8 need to be connected via multiple board connectors 9, i.e., refer to... Figure 7 and Figure 8As shown, the buckle plate 7 is usually provided with multiple board connectors 9 to achieve a high signal density after the buckle plate 7 and the base plate 8 are interconnected. However, in this arrangement, since the buckle plate 7 and the base plate 8 are rigidly connected by multiple board connectors 9, during the interconnection process of the buckle plate 7 and the base plate 8, due to the rigid interconnection of multiple board connectors 9, problems such as pin-kneading problems of board connectors 9 due to insufficient alignment accuracy of multiple board connectors 9 in the first and second directions, or poor signal contact due to inconsistent matching depth of multiple board connectors 9 in the third direction, are likely to occur, which seriously affect product quality and performance.

[0024] Based on this, according to the first aspect of this disclosure, an electrical connection structure is provided, with reference to... Figures 1 to 6 As shown, the electrical connection structure includes at least two circuit boards 1 and a substrate 3. Each circuit board 1 has a connecting part 2 on its bottom wall. The substrate 3 has a mating part 4 on its top wall. The number of mating parts 4 is the same as the number of circuit boards 1. Each circuit board 1 is connected to its corresponding mating part 4 through its own connecting part 2, so that each circuit board 1 is electrically connected to the substrate 3.

[0025] Through the above-described technical solution, namely the electrical connection structure provided in this disclosure, the electrical connection structure provides a connecting part 2 on the bottom wall of at least two circuit boards 1, and provides a number of mating parts 4 on the top wall of the substrate 3, which are the same number as the number of circuit boards 1. This arrangement allows each circuit board 1 to be connected to the corresponding mating part 4 on the substrate 3 through its own connecting part 2, thereby achieving a stable electrical connection between each circuit board 1 and the substrate 3. In this way, when assembling and connecting the circuit boards 1 and the substrate 3, each corresponding connecting part 2 and mating part 4 can be aligned to achieve a stable electrical connection between each circuit board 1 and the substrate 3. Compared with the related technology, where the buckle plate 7 and the base plate 8 need to be connected through multiple board connectors 9, this disclosure, by splitting the buckle plate 7 into multiple circuit boards 1, and providing a connecting part 2 on each circuit board 1, can achieve decoupling of multiple connecting parts 2 (e.g., connectors), which can reduce the possibility of problems such as pin failure and poor signal contact during the assembly of the circuit boards 1 and the substrate 3, and is beneficial to improving product quality and reliability. In addition, since there are multiple circuit boards 1 electrically connected to the substrate 3 and multiple connection parts 2 (e.g., connectors) on the circuit boards 1, when the electrical connection structure is applied to, for example, an OAM module, it is easy to meet the design requirements of the OAM module, such as its large current demand and high-speed signal transmission requirements, which helps to improve product performance.

[0026] It should be noted that, since this disclosure splits the buckle plate 7 into multiple circuit boards 1, and each circuit board 1 is provided with a connecting part 2, the multiple connecting parts 2 (e.g., connectors) can be decoupled. That is, during the assembly of multiple circuit boards 1 with the substrate 3, each circuit board 1 only needs to ensure that one connecting part 2 (e.g., connector) on the circuit board 1 is aligned with the mating part 4 (e.g., connector) on the substrate 3. Since each corresponding connecting part 2 and mating part 4 is aligned, each circuit board 1 can be stably electrically connected to the substrate 3. Compared with the rigid interconnection of multiple board connectors 9 in related technologies, this disclosure can ensure that the assembly of each circuit board 1 is not affected by the installation of connecting parts 2 on other circuit boards 1. In this way, the alignment accuracy requirements of connecting parts 2 (e.g., connectors) and mating parts 4 (e.g., connectors) in the first and second directions can be effectively reduced. At the same time, the possibility of problems such as poor signal contact caused by inconsistent matching depth due to the rigid linkage of multiple board connectors 9 in the third direction can also be reduced, which helps to improve product quality and performance.

[0027] Furthermore, this disclosure does not specifically limit the number of the aforementioned plurality of circuit boards 1. Those skilled in the art can adapt the design according to actual application requirements. For example, in some embodiments, refer to Figures 1 to 6 As shown, the number of circuit boards 1 in the first direction can be two, including a first circuit board 140 and a second circuit board 150 arranged symmetrically. This arrangement can separate different functions onto different circuit boards, reducing the possibility of mutual interference. Furthermore, the symmetrical arrangement of the first circuit board 140 and the second circuit board 150 is also beneficial to improving reliability.

[0028] It is understood that the specific embodiment in which the number of circuit boards 1 is two is exemplary. In other alternative embodiments not shown, the number of circuit boards 1 may also be arranged as an integer such as four, five, or six. This disclosure does not specifically limit this, and those skilled in the art can design it adaptively according to actual application needs.

[0029] Furthermore, it should be noted that this disclosure does not specifically limit the specific structural shape and size of the circuit board 1 (e.g., the first circuit board 140 and the second circuit board 150). Those skilled in the art can adapt the design according to actual application requirements. For example, when there are multiple circuit boards 1, the structural shape and / or size of each circuit board 1 can be constructed to be the same. For example, the structural shape and / or size of the first circuit board 140 and the second circuit board 150 can be constructed to be the same. Alternatively, the structural shape and / or size of each circuit board 1 can also be constructed to be different. For example, the structural shape and / or size of the first circuit board 140 and the second circuit board 150 can be constructed to be different. This disclosure is not limited to this.

[0030] Furthermore, when there are multiple circuit boards 1, such as the first circuit board 140 and the second circuit board 150 described above, the first circuit board 140 and the second circuit board 150 can be configured as follows: Figure 2 The symmetrical arrangement shown can be used as an alternative to the asymmetrical arrangement of the first circuit board 140 and the second circuit board 150. This disclosure does not specifically limit such variations. Those skilled in the art can adapt the specific arrangement of the circuit board 1 (e.g., the first circuit board 140 and the second circuit board 150) according to actual application requirements. The purpose is to meet the design requirements of the large current demand and high-speed signal transmission requirements of the OAM module when the electrical connection structure is applied to, for example, the OAM module.

[0031] Furthermore, this disclosure does not specifically limit the specific structure of the circuit board 1 and the substrate 3. Those skilled in the art can adaptably design the circuit board 1 and the substrate 3 according to any existing suitable arrangement of the circuit board 1 and the substrate 3. For example, the circuit board 1 may include, but is not limited to, a PCB board (printed circuit board), and the substrate 3 may include, but is not limited to, a PPO (polyphenylene oxide) resin substrate. This disclosure is not limited to this.

[0032] Exemplarily, in some implementations, reference is made to Figures 1 to 6As shown, the connecting portions 2 on the bottom walls of the first circuit board 140 and the second circuit board 150 can both include first connectors 210, and the mating portions 4 on the top wall of the substrate 3 can include second connectors 410. This arrangement allows for the mating of the first connectors 210 and the second connectors 410, i.e., the first connectors 210 on the first circuit board 140 or the second circuit board 150 can be inserted downwards into the second connectors 410 on the substrate 3 along, for example, a third direction. This achieves a stable mechanical connection between each circuit board 1 and the substrate 3, while also enabling an electrical connection between each circuit board 1 and the substrate 3, facilitating assembly and disassembly and ensuring high reliability. Furthermore, since there are multiple circuit boards 1, and each circuit board 1 has one first connector 210, the arrangement of multiple connectors, such as a dual-connector structure, can increase signal density and reduce crosstalk between adjacent signals, resulting in lower transmission loss and improved system reliability. When applying this electrical connection structure to, for example, OAM modules, it facilitates meeting design requirements such as the large current demands and high-speed signal transmission requirements of OAM modules, thus improving product performance and reliability.

[0033] In this disclosure, the specific structure of the first connector 210 and the second connector 410 is not specifically limited. Those skilled in the art can design them adaptively according to actual application requirements. The purpose is to ensure that each circuit board 1 and the substrate 3 are stably mechanically connected, while also achieving electrical connection between each circuit board 1 and the substrate 3. For example, those skilled in the art can design the specific structure of the first connector 210 and the second connector 410 adaptively according to existing connector structures. This disclosure will not elaborate further here.

[0034] In order to ensure that each circuit board 1 is stably electrically connected to the substrate 3, in some embodiments, reference is made to... Figures 1 to 3 As shown, the electrical connection structure may further include a support structure 5. Each circuit board 1 is connected to the substrate 3 through the support structure 5. The support structure 5 supports the circuit board 1 and the substrate 3. This arrangement allows for the support and fixation of the circuit board 1 and the substrate 3, which helps improve the reliability of the electrical connection structure. Furthermore, since the support structure 5 supports the circuit board 1 and the substrate 3, the bottom wall of the circuit board 1 can be parallel to the top wall of the substrate 3. This ensures that after the circuit board 1 is assembled and connected to the substrate 3, the circuit board 1 is flush with the plane containing, for example, the first and second directions, reducing the possibility of poor signal contact due to positional misalignment of the circuit board 1.

[0035] Additionally, in some implementations, references Figures 1 to 3As shown, the circuit board 1 may have a first side 110 and a second side 120 arranged opposite to each other along a first direction. One of the connecting part 2 and the support structure 5 is arranged near the first side 110 and the other is arranged near the second side 120. By arranging the connecting part 2 and the support structure 5 on the two sides of the circuit board 1 respectively, it can be ensured that each circuit board 1 is stably electrically connected to the substrate 3, resulting in high reliability.

[0036] Exemplarily, in some implementations, reference is made to Figures 1 to 3 As shown, the connecting part 2 may include a first connector 210, which extends along a second direction perpendicular to the first direction. There are two support structures 5 on the same circuit board 1. The two support structures 5 are spaced apart from the first connector 210 along the first direction and are located at two corners of the circuit board 1 respectively. By arranging the first connector 210 and the two support structures 5 located at the corners in a triangular outline, for example, the overall structure is simple and highly reliable.

[0037] It is understood that the specific positions of the first connector 210 and the support structure 5, as well as the specific number of support structures 5, are exemplary. Those skilled in the art can adapt the specific positions of the first connector 210 and the support structure 5, and adapt the specific number of support structures 5 according to actual application needs. This disclosure does not make specific limitations in this regard. The purpose is to ensure that each circuit board 1 is stably electrically connected to the substrate 3.

[0038] The support structure 5 can be adaptively designed according to actual application requirements. For example, in some implementations, refer to... Figure 1 and Figure 2 As shown, each support structure 5 may include a first bolt 510, a support column 520, and a second bolt 530. The support column 520 is disposed between the circuit board 1 and the substrate 3, and the two ends of the support column 520 along the third direction respectively abut against the circuit board 1 and the substrate 3. The third direction is perpendicular to the plane containing the first direction and the second direction. With this arrangement, the circuit board 1 and the substrate 3 can be supported and fixed by the support column 520 located between the circuit board 1 and the substrate 3, ensuring that the bottom wall of the circuit board 1 is parallel to the top wall of the substrate 3, thus ensuring high reliability.

[0039] In addition, such as Figure 1 and Figure 2As shown, the first head 511 of the first bolt 510 can abut against the circuit board 1, and the first rod 512 connected to the first head 511 passes through the circuit board 1 from top to bottom along a third direction and is threaded to the support column 520. For example, the first rod 512 connected to the first head 511 of the first bolt 510 can pass through the through hole on the circuit board 1 from top to bottom along a third direction and is threaded to the support column 520. The second head 531 of the second bolt 530 can abut against the substrate 3, and the second rod 532 connected to the second head 531 passes through the substrate 3 from bottom to top along a third direction and is threaded to the support column 520. For example, the second rod 532 connected to the second head 531 of the second bolt 530 can pass through the through hole on the substrate 3 from bottom to top along a third direction and is threaded to the support column 520. With this arrangement, the overall structure is relatively simple, the manufacturing difficulty is low, and the disassembly and assembly operations are convenient. It can also ensure that each circuit board 1 is stably electrically connected to the substrate 3.

[0040] It should be noted that the specific embodiments in which each of the above-mentioned support structures 5 may include the first bolt 510, the support column 520, and the second bolt 530 are exemplary. In other alternative embodiments, refer to... Figure 2 and Figure 3 As shown, the support structure 5 may also include a third bolt 540, a pressure plate 550, and a support plate 560. The pressure plate 550, circuit board 1, support plate 560, and substrate 3 are stacked in the third direction. The support plate 560 is disposed between the circuit board 1 and the substrate 3, and its two ends abut against the circuit board 1 and the substrate 3 respectively along the third direction. The third head 541 of the third bolt 540 abuts against the pressure plate 550, and the third rod 542 connecting the third bolt 540 and the third head 541 passes through the pressure plate 550, circuit board 1, support plate 560, and substrate 3 sequentially from top to bottom along the third direction before being threaded onto a nut. 570. With this arrangement, the support plate 560 located between the circuit board 1 and the substrate 3 can support and fix the circuit board 1 and the substrate 3, ensuring that each circuit board 1 is stably electrically connected to the substrate 3. At the same time, the pressure plate 550 pressing on the circuit board 1 can further improve the reliability of the electrical connection structure, ensuring that after the circuit board 1 and the substrate 3 are assembled and connected, the circuit board 1 is flush with the plane containing, for example, the first direction and the second direction, reducing the possibility of poor signal contact due to positional misalignment of the circuit board 1. It also has the advantages of simple overall structure, low manufacturing difficulty, and easy disassembly and assembly. This disclosure is not limited to this. Those skilled in the art can adapt the specific structure of the support structure 5 according to the actual application requirements, with the aim of supporting and fixing the circuit board 1 and the substrate 3 through the support structure 5.

[0041] The support plate 560 may be provided with a first clearance hole structure, which is used to avoid the connecting part 2 (e.g., the first connector 210) and the mating part 4 (e.g., the second connector 410), so as to facilitate the assembly and connection operation by placing the support plate 560 between the circuit board 1 and the substrate 3. Furthermore, the support plate 560 may also be provided with a through hole for the third rod portion 542 of the third bolt 540 to pass through, so that the support plate 560 can be stably placed between the circuit board 1 and the substrate 3 by the third bolt 540.

[0042] Furthermore, the aforementioned pressure plate 550 may be provided with a second clearance hole structure, which is used to avoid obstacles such as electronic components on the circuit board 1, so as to facilitate the stacked connection arrangement of the pressure plate 550 and the circuit board 1. Additionally, the pressure plate 550 may also be provided with a through hole, which is used for the third rod portion 542 of the third bolt 540 to pass through, so that the pressure plate 550 can be stably pressed onto the circuit board 1 by the third bolt 540, which helps to improve the reliability of the electrical connection structure.

[0043] Considering that when multiple circuit boards 1 (e.g., PCB boards) are arranged, in order to achieve the interconnection requirements between multiple circuit boards 1, in some embodiments, reference is made to... Figures 4 to 6 As shown, at least two circuit boards 1 can be electrically connected by electrical connectors 6. This arrangement can meet the interconnection requirements between multiple circuit boards 1. For example, the interconnection of the first circuit board 140 and the second circuit board 150 can be achieved by setting electrical connectors 6. The structure is simple and easy to install and manufacture.

[0044] The electrical connector 6 can be constructed in any suitable manner, for example, as shown in the reference. Figure 4 As shown, the electrical connector 6 may include a first conductive structure 610 disposed on the substrate 3, and at least two circuit boards 1 are electrically connected through the first conductive structure 610. For example, as shown... Figure 4 As shown, the first conductive structure 610 may include a wiring layer 611 disposed on the substrate 3. With this arrangement, the wiring layer 611 disposed on the substrate 3 can be used directly to achieve the interconnection between multiple circuit boards 1, which makes the overall structure of the electrical connection structure simpler and easier to install and manufacture.

[0045] It should be noted that the aforementioned wiring layer 611 may include, but is not limited to, for example, a copper layer disposed on the substrate 3. The specific arrangement and structure of the copper layer can be adapted by those skilled in the art to form a conductive path based on the existing copper layer structure on the substrate. The purpose is to enable interconnection between multiple circuit boards 1 through the wiring layer 611 (e.g., a copper layer). This disclosure will not elaborate further here.

[0046] It is understood that the specific embodiment of the electrical connector 6 described above, which may include a first conductive structure 610 disposed on the substrate 3, is exemplary. In other alternative embodiments, refer to... Figure 5 As shown, the electrical connector 6 may also include a flexible circuit board 620, through which at least two circuit boards 1 are electrically connected, for example, as shown in the figure. Figure 5 As shown, the flexible circuit board 620 can be integrally formed and arranged with the circuit board 1. That is, it can be understood that the flexible circuit board 620 can be pre-formed and processed integrally with, for example, the first circuit board 140 and the second circuit board 150, so that the flexible circuit board 620 is pre-fixed to the circuit board 1 (for example, the first circuit board 140 and the second circuit board 150). This can meet the requirement of interconnecting multiple circuit boards 1 through the flexible circuit board 620. When assembling the interconnected circuit boards 1 (for example, the first circuit board 140 and the second circuit board 150) with the substrate 3, since the flexible circuit board 620 can be bent and deformed and is relatively flexible, it can also avoid the possibility of problems such as poor signal contact caused by inconsistent matching depth due to rigid interconnection between multiple circuit boards 1, which helps to improve product quality and performance.

[0047] Among them, those skilled in the art can adapt the specific structure of the flexible circuit board 620 to the existing structure, such as that of an FPC circuit board, and this disclosure does not make any specific limitations in this regard.

[0048] Furthermore, it should be noted that the specific embodiment in which the flexible circuit board 620 can be integrally formed with the circuit board 1 is exemplary. In other alternative embodiments, the flexible circuit board 620 can also be assembled and connected with the circuit board 1. That is, it is understood that the flexible circuit board 620 can also be assembled and connected via, for example, an FPC connector 130 disposed on the circuit board 1 (e.g., the first circuit board 140 and the second circuit board 150). And, for example, when there are two support structures 5, the FPC connector 130 can be arranged between the two support structures 5. This arrangement allows the flexible circuit board 620 to be pre-assembled with the circuit board 1 (e.g., the first circuit board 140 and the second circuit board 150) via the aforementioned FPC connector 130, as needed. Furthermore, after assembling and connecting the flexible circuit board 620 and the circuit board 1 through the aforementioned FPC connector 130, the interconnected circuit board 1 (e.g., the first circuit board 140 and the second circuit board 150) is then assembled and connected to the substrate 3. Alternatively, the circuit board 1 (e.g., the first circuit board 140 and the second circuit board 150) can be assembled and connected to the substrate 3 first, and then the flexible circuit board 620 can be assembled and connected to the FPC connector 130 on the circuit board 1. This achieves the requirement of interconnecting multiple circuit boards 1. This disclosure does not specifically limit such variations. Those skilled in the art can design them adaptively according to actual application requirements. The purpose is to achieve interconnection between multiple circuit boards 1 while also stably connecting multiple circuit boards 1 to the substrate 3.

[0049] In this disclosure, the specific structure of the FPC connector 130 is not specifically limited. Those skilled in the art can choose any known FPC connector 130 in the art to make an adaptive design according to actual application needs. The purpose is to achieve a stable connection between the flexible circuit board 620 and the circuit board 1 through the FPC connector 130.

[0050] In addition, it should be noted that at least two circuit boards 1 can be electrically connected through the first conductive structure 610, and at least two circuit boards 1 can be electrically connected to each other through the flexible circuit board 620. Both methods can be set simultaneously, or only one of them can be selected to achieve the interconnection requirements between multiple circuit boards 1. This disclosure does not specifically limit such variations, and those skilled in the art can design them adaptively according to actual application requirements.

[0051] According to a second aspect of this disclosure, an OAM module is provided, which includes the electrical connection structure provided in the first aspect. Furthermore, the OAM module also possesses all the beneficial effects of the electrical connection structure provided in the first aspect, which will not be elaborated further herein.

[0052] According to a third aspect of this disclosure, a graphics card device is provided, which includes the OAM module provided in the second aspect above. Furthermore, the graphics card device also possesses all the beneficial effects of the OAM module provided in the second aspect above, which will not be elaborated further herein.

[0053] According to a fourth aspect of this disclosure, an electronic device is provided, which includes the graphics card device provided in the third aspect above. Furthermore, the electronic device also possesses all the beneficial effects of the graphics card device provided in the third aspect above, which will not be elaborated further herein.

[0054] In some implementations, the aforementioned electronic devices may include, but are not limited to, general-purpose computing devices or specialized computing devices, such as computers, workstations, AI servers, cloud computing servers, data center equipment, etc.

[0055] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0056] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0057] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. An electrical connection structure, characterized in that, include: At least two circuit boards, each with a connecting portion on its bottom wall; and A substrate, wherein a mating portion is provided on the top wall of the substrate, and the number of the mating portions is the same as the number of the circuit boards; Each of the circuit boards is connected to its corresponding mating part via its respective connecting part, so that each circuit board is electrically connected to the substrate.

2. The electrical connection structure according to claim 1, characterized in that, The electrical connection structure also includes a support structure, and each of the circuit boards is connected to the substrate through the support structure, which supports the circuit board and the substrate.

3. The electrical connection structure according to claim 2, characterized in that, The circuit board has a first side and a second side arranged opposite to each other along a first direction, and one of the connecting portion and the supporting structure is arranged closer to the first side and the other is arranged closer to the second side.

4. The electrical connection structure according to claim 2, characterized in that, The connection portion includes a first connector that extends along a second direction perpendicular to the first direction. The number of support structures on the same circuit board is two. The two support structures are spaced apart from the first connector along the first direction and are respectively located at two corners of the circuit board.

5. The electrical connection structure according to claim 2, characterized in that, Each of the aforementioned support structures includes a first bolt, a support column, and a second bolt. The support column is disposed between the circuit board and the substrate, and the two ends of the support column along a third direction respectively abut against the circuit board and the substrate. The third direction is perpendicular to the plane containing the first direction and the second direction. The first head of the first bolt abuts against the circuit board, and the first rod connected to the first head passes through the circuit board from top to bottom in a third direction and is then threaded to the support column; The second head of the second bolt abuts against the substrate, and the second rod connected to the second head passes through the substrate from bottom to top along a third direction and is threaded to the support column.

6. The electrical connection structure according to claim 2, characterized in that, The support structure includes a third bolt, a pressure plate, and a support plate. The pressure plate, the circuit board, the support plate, and the substrate are stacked in a third direction. The support plate is disposed between the circuit board and the substrate, and the two ends of the support plate abut against the circuit board and the substrate respectively along the third direction. The third head of the third bolt abuts against the pressure plate, and the third rod portion of the third bolt, which is connected to the third head, passes through the pressure plate, the circuit board, the support plate, and the base plate in a third direction from top to bottom before being threaded into the nut.

7. The electrical connection structure according to claim 1, characterized in that, The number of circuit boards in the first direction is two, including a first circuit board and a second circuit board arranged symmetrically; The connecting portions on the bottom walls of both the first circuit board and the second circuit board include a first connector, and the mating portion on the top wall of the substrate includes a second connector.

8. The electrical connection structure according to any one of claims 1-7, characterized in that, At least two of the circuit boards are electrically connected via electrical connectors; The electrical connector includes a first conductive structure disposed on the substrate, and at least two of the circuit boards are electrically connected through the first conductive structure; and / or The electrical connector includes a flexible circuit board, and at least two of the circuit boards are electrically connected through the flexible circuit board.

9. The electrical connection structure according to claim 8, characterized in that, The first conductive structure includes a wiring layer disposed on the substrate.

10. The electrical connection structure according to claim 8, characterized in that, The flexible circuit board is integrally formed with the circuit board, and / or the flexible circuit board is assembled and connected with the circuit board.

11. An OAM module, characterized in that, Includes the electrical connection structure described in any one of claims 1-10.

12. A graphics card device, characterized in that, Includes the OAM module as described in claim 11.

13. An electronic device, characterized in that, Includes the graphics card device as described in claim 12.

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