Sensor packaging structure and manufacturing method thereof

Abstract

The invention discloses a sensor packaging structure and a manufacturing method thereof. The sensor packaging structure comprises a substrate, a sensing chip installed on the substrate, an annular supporting layer arranged on the sensing chip, a light-transmitting sheet arranged on the annular supporting layer and a packaging body formed on the substrate. A receding groove is formed in the outer edge of the top of the light-transmitting piece. The packaging body is a cured liquid sealing compound, and the packaging body is not arranged in the avoiding groove. The packaging body comprises a colloid and a plurality of fillers embedded in the colloid, and the packaging body forms a material settling boundary through the precipitation of the plurality of fillers. The inner edge of the material sinking boundary does not make contact with the light-transmitting piece and surrounds the outer side of the receding groove. Therefore, the part (namely, the material sinking boundary), which is easy to generate stress concentration, of the packaging body cannot apply force to the light-transmitting sheet, so that the condition that the light-transmitting sheet is broken is effectively reduced.

Description

Technical Field

[0001] This application relates to the field of packaging structures, and more particularly to a sensor packaging structure and its manufacturing method. Background Technology

[0002] When existing sensor packaging structures cover the annular side of their light-transmitting layer with a package formed by curing liquid encapsulant, the annular side of the light-transmitting layer is prone to cracking due to stress concentration within the package. Therefore, the inventors believed that this defect could be improved, and through dedicated research and the application of scientific principles, finally proposed this application, which features a rationally designed solution that effectively addresses the aforementioned defects. Summary of the Invention

[0003] This application provides a sensor packaging structure and its manufacturing method, which can effectively improve the defects that may occur in existing sensor packaging structures.

[0004] This application discloses a method for manufacturing a sensor packaging structure, comprising: a forming step: forming a plurality of trenches on the outer surface of a light-transmitting plate; wherein the light-transmitting plate has an inner surface located on the opposite side of the outer surface, and the light-transmitting plate defines a plurality of light-transmitting sheets through the plurality of trenches; a bonding step: forming a sacrificial layer on the light-transmitting plate that fills the plurality of trenches and covers the outer surface; a cutting step: cutting the sacrificial layer and the light-transmitting plate along the plurality of trenches to form a plurality of light-transmitting sheets separated from each other and a plurality of sacrificial sheets respectively attached to the light-transmitting sheets; wherein each light-transmitting sheet has an annular clearance groove at the outer edge of its outer surface, which is filled by a corresponding sacrificial sheet; a placement step: providing a substrate, a sensing chip mounted and electrically coupled to the substrate, and an annular support layer disposed on the sensing chip, and using a The inner surface of the light-transmitting sheet is disposed on an annular support layer; an encapsulation step: forming a liquid encapsulant on a substrate and curing it to form an encapsulation body; wherein the encapsulation body includes a colloid and a plurality of fillers mixed within the colloid, and the encapsulation body has: a first block formed on the substrate, wherein a plurality of fillers are deposited within the first block; wherein the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the first block; and a second block connected to the first block to jointly form a substrate boundary at the junction; wherein the second block is connected to the side edge of the sacrificial sheet, and the inner edge of the substrate boundary does not touch the light-transmitting sheet and surrounds the side edge of the sacrificial sheet; and a removal step: removing the sacrificial sheet so that the substrate, the sensing chip, the annular support layer, the light-transmitting sheet, and the encapsulation body together constitute a sensor encapsulation structure.

[0005] Optionally, during the forming step, the multiple grooves include multiple longitudinal grooves and multiple transverse grooves that are crisscrossed, and the light-transmitting plate defines multiple light-transmitting sheets that are arranged in a matrix and connected to each other through the multiple longitudinal grooves and multiple transverse grooves.

[0006] Optionally, in the adhesive application step, the material of the sacrificial layer is selected from one of a pyrolytic adhesive, a hydrolytic adhesive, and a photolytic adhesive.

[0007] Optionally, during the slicing step, each sacrificial slice includes: a slice body covering the outer surface of the corresponding light-transmitting slice; and a sacrificial ring connected to the slice body and filling the corresponding clearance groove.

[0008] Optionally, during the encapsulation step, the sacrificial die protrudes from the encapsulation body, while the sacrificial ring is embedded within the encapsulation body.

[0009] Optionally, during the encapsulation step, the volume of the second block is between 0.1% and 5% of the volume of the first block.

[0010] This application also discloses a sensor packaging structure, comprising: a substrate; a sensing chip disposed on the substrate and electrically coupled to the substrate; wherein a top portion of the sensing chip includes a sensing region and a support region surrounding the sensing region; an annular support layer disposed on the support region of the sensing chip and surrounding the sensing region; a light-transmitting sheet having an outer surface, an inner surface located on the opposite side of the outer surface, an annular side surface located between the outer surface and the inner surface, and an annular clearance groove connected to the outer surface and the annular side surface; wherein the light-transmitting sheet is disposed on the annular support layer along a predetermined direction with its inner surface, so that the light-transmitting sheet, the annular support layer, and the... The top surface of the sensing chip and the surrounding surface together form a closed space; a package is a cured liquid encapsulant, and the package includes an adhesive and a plurality of fillers embedded in the adhesive; wherein the package is not placed within the clearance groove, and the package has: a first block formed on the substrate, and a plurality of fillers deposited within the first block; wherein the sensing chip, the support layer, and the light-transmitting sheet are embedded within the first block, and the annular side of the light-transmitting sheet is completely connected to the first block; and a second block connected to the first block, so as to jointly form a substrate boundary at the junction; wherein the inner edge of the substrate boundary does not touch the annular side and surrounds the outer side of the clearance groove.

[0011] Optionally, the volume of the second block is between 0.1% and 5% of the volume of the first block.

[0012] Optionally, the clearance groove has: a first-level surface connected to the side of the ring; and a trapezoidal surface connected between the outer surface and the side of the ring; wherein the boundary of the sink material is projected toward a projection area formed by the orthographic projection of the clearance groove along a direction perpendicular to a predetermined direction, and it falls on the trapezoidal surface.

[0013] Optionally, along a preset direction, the boundaries of the sediment are higher than the step surface and are separated from each other by a gap of no more than 100 micrometers.

[0014] Optionally, the annular support layer is projected onto the outer surface of the light-transmitting sheet in a predetermined direction to form a projection space, and the trapezoidal surface is located within the projection space.

[0015] Optionally, the annular support layer is projected onto the outer surface of the light-transmitting sheet in a predetermined direction to form a projection space, and the trapezoidal surface is located outside the projection space.

[0016] Alternatively, the clearance trough can be filled with air.

[0017] Optionally, the inner edge of the annular support layer is projected onto the outer surface of the light-transmitting sheet in a predetermined direction to form a projection boundary, and the clearance groove is located outside the projection boundary.

[0018] Optionally, along a preset direction, the top edge of the second block has a height difference of no more than 10 micrometers between it and the outer surface of the light-transmitting sheet relative to the substrate.

[0019] Optionally, along a preset direction, the top edge of the second block is coplanar with the outer surface of the light-transmitting sheet.

[0020] Optionally, along a preset direction, the top edge of the second block is higher than the outer surface of the light-transmitting sheet than the substrate.

[0021] Optionally, the first block has a first filler density that is greater than a second filler density of the second block.

[0022] This application also discloses a method for manufacturing a sensor packaging structure, comprising: a forming step: forming a plurality of grooves on the outer surface of a light-transmitting plate; wherein the light-transmitting plate has an inner surface located on the opposite side of the outer surface, and the light-transmitting plate defines a plurality of light-transmitting sheets through the plurality of grooves; a bonding step: forming a sacrificial layer on the light-transmitting plate that fills the plurality of grooves; a cutting step: cutting the light-transmitting plate and the sacrificial layer along the plurality of grooves to form a plurality of light-transmitting sheets separated from each other and a plurality of sacrificial rings respectively attached to the light-transmitting sheets; wherein each light-transmitting sheet has an annular clearance groove on the outer edge of its outer surface, which is provided by a corresponding sacrificial ring. Filling; a mounting step: providing a sensing module, which includes a sensing chip and an annular support layer disposed on the sensing chip, and a light-transmitting sheet disposed on the inner surface of the annular support layer; an encapsulation step: forming a liquid encapsulant on a substrate of the sensing module and curing it to form an encapsulation body; wherein, the sensing chip is mounted and electrically coupled to the substrate; the encapsulation body includes a colloid and a plurality of fillers mixed in the colloid, and the encapsulation body has: a first block formed on the substrate, wherein the plurality of fillers are deposited within the first block; wherein, the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the first block; and

[0023] A second block, connected to the first block, together forming a substrate boundary at the junction; wherein the second block is connected to the side edge of the sacrificial ring, and the inner edge of the substrate boundary does not touch the light-transmitting sheet and surrounds the side edge of the sacrificial ring; and a removal step: removing the sacrificial ring so that the substrate, the sensing chip, the annular support layer, the light-transmitting sheet, and the package together form a sensor package structure.

[0024] Optionally, in the adhesive application step, the material of the sacrificial layer is selected from one of a pyrolytic adhesive, a hydrolytic adhesive, and a photolytic adhesive.

[0025] Beneficial effects of the invention

[0026] The sensor packaging structure and manufacturing method disclosed in this application can effectively reduce the occurrence of cracks in the light-transmitting sheet by forming a relief groove in the light-transmitting sheet with a position corresponding to the boundary of the substrate. This prevents stress concentration from being exerted on the light-transmitting sheet at the part of the package that is prone to stress concentration (i.e., the boundary of the substrate).

[0027] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the forming steps of the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0029] Figure 2 This is a schematic diagram of the adhesive application step in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0030] Figure 3 This is a schematic diagram of the slice steps in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0031] Figure 4 This is a schematic diagram of the die-laying steps in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0032] Figure 5 This is a schematic diagram of the packaging steps in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0033] Figure 6 for Figure 5 A cross-sectional view along section line VI-VI.

[0034] Figure 7 This is a schematic diagram of the removal steps in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0035] Figure 8for Figure 7 A schematic cross-sectional view along section line VIII-VIII.

[0036] Figure 9 for Figure 8 A magnified view of region IX.

[0037] Figure 10 This is a cross-sectional schematic diagram of another aspect of the sensor packaging structure according to Embodiment 1 of this application.

[0038] Figure 11 This is a schematic diagram of the adhesive application step in the manufacturing method of the sensor packaging structure according to Embodiment 2 of this application.

[0039] Figure 12 This is a schematic diagram of the slice steps of the manufacturing method of the sensor packaging structure of Embodiment 2 of this application.

[0040] Figure 13 This is a schematic diagram of the die-laying steps in the manufacturing method of the sensor packaging structure according to Embodiment 2 of this application.

[0041] Figure 14 This is a schematic diagram of the packaging steps in the manufacturing method of the sensor packaging structure according to Embodiment 2 of this application.

[0042] Figure 15 This is a partial cross-sectional schematic diagram of the sensor packaging structure according to Embodiment 3 of this application.

[0043] Figure 16 This is a cross-sectional schematic diagram of another aspect of the sensor packaging structure according to Embodiment 3 of this application. Detailed Implementation

[0044] The following specific embodiments illustrate the implementation of the "sensor packaging structure and manufacturing method thereof" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0045] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0046] Example 1

[0047] Please see Figures 1 to 10 As shown, this is an embodiment of the present application. This embodiment discloses a sensor package structure 100 and its manufacturing method, and the sensor package structure 100 is preferably formed by implementing the manufacturing method of the sensor package structure, but the present application is not limited thereto. Furthermore, for ease of understanding of this embodiment, the manufacturing method of the sensor package structure will be described first, and then the sensor package structure 100 will be described.

[0048] In this embodiment, as Figures 1 to 6 As shown, the manufacturing method of the sensor packaging structure sequentially includes or is implemented in sequence as follows: a forming step S110, a bonding step S120, a cutting step S130, a placement step S140, an encapsulation step S150, and a removal step S160. The specific implementation of the above steps S110 to S160 will be described below, but the implementation of the above steps S110 to S160 can be adjusted and varied according to actual needs, and this application does not impose any limitations here.

[0049] like Figure 1 As shown, in the forming step S110, a plurality of grooves 501 are formed on the outer surface 51 of a light-transmitting plate 50. The light-transmitting plate 50 has an inner surface 52 located opposite to the outer surface 51, and the light-transmitting plate 50 defines a plurality of light-transmitting sheets 5 through the plurality of grooves 501. That is, the boundary of each light-transmitting sheet 5 falls within the plurality of grooves 501.

[0050] More specifically, in the forming step S110 of this embodiment, the light-transmitting plate 50 may be a glass plate, and the plurality of grooves 501 include a plurality of vertically intersecting longitudinal grooves 501a and a plurality of transverse grooves 501b. The light-transmitting plate 50 defines a plurality of light-transmitting sheets 5 arranged in a matrix and connected to each other through the plurality of longitudinal grooves 501a and the plurality of transverse grooves 501b, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, the plurality of light-transmitting sheets 5 may also be arranged at intervals.

[0051] like Figure 2As shown, in the adhesive application step S120: a sacrificial layer 70 is formed on the light-transmitting plate 50, filling the plurality of grooves 501 and covering the outer surface 51. Preferably, the material of the sacrificial layer 70 is selected from one of a pyrolytic adhesive, a hydrolytic adhesive, and a photolytic adhesive, but this application is not limited to these.

[0052] like Figure 2 and Figure 3 As shown, the slicing step S130 involves cutting the sacrificial layer 70 and the light-transmitting plate 50 along the plurality of grooves 501 to form a plurality of light-transmitting sheets 5 separated from each other and a plurality of sacrificial sheets 7 respectively attached to the light-transmitting sheets 5. That is, the light-transmitting plate 50 is cut into a plurality of light-transmitting sheets 5, while the sacrificial layer 70 is simultaneously cut into a plurality of sacrificial sheets 7.

[0053] Furthermore, each of the light-transmitting sheets 5 has an annular clearance groove 54 at the outer edge of its outer surface 51, which is filled by the corresponding sacrificial sheet 7. In other words, each groove 501 is cut into two half-grooves, and the clearance groove 54 of the light-transmitting sheet 5 is formed by connecting multiple half-grooves.

[0054] More specifically, in the slicing step S130 of this embodiment, each sacrificial slice 7 includes a slice body 71 and a sacrificial ring 72 connected to the periphery of the slice body 71 (e.g., ...). Figure 6 As shown), the sheet 71 covers the outer surface 51 of the corresponding light-transmitting sheet 5, and the sacrificial ring 72 fills the corresponding clearance groove 54.

[0055] like Figure 4 As shown, the placement step S140 involves providing a substrate 1, a sensing chip 2 mounted and electrically coupled to the substrate 1, and an annular support layer 4 disposed on the sensing chip 2, with the inner surface 52 of the light-transmitting sheet 5 disposed on the annular support layer 4. Further, the light-transmitting sheet 5, the annular support layer 4, and the sensing chip 2 together form a closed space E around which air is distributed.

[0056] Furthermore, in this embodiment, the electrical coupling between the sensing chip 2 and the substrate 1 is achieved by multiple metal lines 3. In this embodiment, the substrate 1, the sensing chip 2, the annular support layer 4, and the multiple metal lines 3 can be collectively defined as a sensing module M. The multiple components of the sensing module M can be installed before the wafer placement step S140, which is not limited in this application.

[0057] like Figure 5 and Figure 6As shown, the encapsulation step S150 involves forming a liquid compound on the substrate 1 and curing it to form an encapsulation body 6. The encapsulation body 6 includes a colloid 6a and a plurality of fillers 6b mixed within the colloid 6a. In other words, any encapsulation body not formed using a liquid compound is different from the encapsulation body 6 referred to in this embodiment.

[0058] Furthermore, the package 6 has a first block 61 formed on the substrate 1 and a second block 62 connected to the first block 61. A plurality of fillers 6b are deposited within the first block 61, while the second block 62 contains almost no fillers 6b. Therefore, the first block 61 and the second block 62 together form a deposit boundary 63 at their interface. In other words, the first block 61 has a first filler density, which is greater than the second filler density of the second block 62.

[0059] More specifically, the sensing chip 2, the annular support layer 4, the multiple metal lines 3, and the light-transmitting sheet 5 are embedded within the first block 61. In this embodiment, the first block 61 is connected to the bottom edge of the sacrificial sheet 7, and the volume of the first block 61 is much larger than the volume of the second block 62 (e.g., the volume of the second block 62 is between 0.1% and 5% of the volume of the first block 61).

[0060] Furthermore, the second block 62 is connected to the side edge of the sacrificial piece 7, and the inner edge of the sink boundary 63 does not touch the annular side 53 and surrounds the side edge of the sacrificial piece 7. In this embodiment, the sheet body 71 of the sacrificial piece 7 protrudes from the encapsulation body 6 (or the second block 62), while the sacrificial ring 72 is embedded within the encapsulation body 6, but this application is not limited thereto.

[0061] like Figures 7 to 9 As shown, the removal step S160 involves removing the sacrificial piece 7 so that the substrate 1, the sensing chip 2, the annular support layer 4 (multiple metal lines 3), the light-transmitting sheet 5, and the package 6 together constitute the sensor package structure 100. The method of removing the sacrificial piece 7 may vary depending on its material (e.g., the thermally degradable adhesive, the hydrolyzable adhesive, or the ultraviolet photodegradable adhesive), and is not limited here.

[0062] Accordingly, the manufacturing method of the sensor package structure has been generally described above. The following description will then introduce the sensor package structure 100 formed after the implementation of the manufacturing method. Therefore, some technical features of the sensor package structure 100 can also be referred to the above description, but this application is not limited thereto. For example, in other embodiments not shown in this application, the sensor package structure 100 can also be obtained by implementing other methods according to actual needs.

[0063] In this embodiment, as Figures 7 to 9 As shown, the sensor packaging structure 100 in this embodiment includes a substrate 1, a sensing chip 2 disposed on the substrate 1, multiple metal lines 3 electrically coupled to the sensing chip 2 and the substrate 1, an annular support layer 4 disposed on the sensing chip 2, a light-transmitting sheet 5 disposed on the annular support layer 4, and a package 6 formed on the substrate 1, but is not limited thereto.

[0064] It should be noted that although the sensor packaging structure 100 is described in this embodiment as including the above-mentioned components, the sensor packaging structure 100 can also be adjusted and varied according to design requirements. For example, in other embodiments not shown in this application, the sensor packaging structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 by flip-chip or die-attach method. The structure and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

[0065] In this embodiment, the substrate 1 is square or rectangular, but this application is not limited to this. The substrate 1 has an upper surface 11 and a lower surface 12 located on opposite sides. A chip fixing region 111 is provided at approximately the center of the upper surface 11, and a plurality of bonding pads 112 are formed on the upper surface 11 outside the chip fixing region 111. In this embodiment, the plurality of bonding pads 112 are generally arranged in a ring, but this application is not limited to this. For example, in other embodiments not shown in this application, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing region 111.

[0066] In this embodiment, the sensing chip 2 is square (e.g., rectangular or square). The sensing chip 2 is described below as an image sensing chip, but this application is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 111 of the substrate 1 by die-attach adhesive; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a support area 212 surrounding the sensing area 211 (in an annular shape). Both ends of each metal wire 3 are respectively connected to the substrate 1 and the support area 212 of the sensing chip 2, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other.

[0067] More specifically, the sensing chip 2 includes a plurality of connection pads 213 located in the bearing region 212 (that is, the plurality of connection pads 213 are located outside the sensing region 211). In this embodiment, the number and position of the plurality of connection pads 213 of the sensing chip 2 correspond to the number and position of the plurality of bonding pads 112 of the substrate 1; that is, the plurality of connection pads 213 are also generally arranged in a ring shape in this embodiment. Furthermore, each metal wire 3 has its two ends connected to one bonding pad 112 and a corresponding connection pad 213.

[0068] The annular support layer 4 is disposed on the carrier region 212 of the sensing chip 2 and surrounds the outer side of the sensing region 211. In this embodiment, the annular support layer 4 is located inside the plurality of metal lines 3 and does not contact any of the metal lines 3 (that is, each metal line 3 is located outside the annular support layer 4 and is completely embedded within the package 6), but this application is not limited thereto. For example, such as Figure 10 As shown, each of the metal wires 3 may be partially embedded within the annular support layer 4, while the remaining portion of each of the metal wires 3 is embedded within the encapsulation body 6.

[0069] In this embodiment, the light-transmitting sheet 5 is described as a flat glass plate, but this application is not limited to this. The light-transmitting sheet 5 has an outer surface 51, an inner surface 52 located opposite to the outer surface 51, an annular side surface 53 located between the outer surface 51 and the inner surface 52, and an annular clearance groove 54 connecting the outer surface 51 and the annular side surface 53. The light-transmitting sheet 5 is disposed on the annular support layer 4 along a predetermined direction D with its inner surface 52, so that the light-transmitting sheet 5, the annular support layer 4, and the top surface 21 of the sensing chip 2 together form a closed space E.

[0070] More specifically, in this embodiment, the clearance groove 54 is filled with air, and the clearance groove 54 has a stepped surface 541 connected to the annular side surface 53 and a trapezoidal surface 542 connected between the outer surface 51 and the annular side surface 53. Preferably, the clearance groove 54 is configured as follows: the annular support layer 4 projects a projection space along the preset direction D toward the outer surface 51 of the light-transmitting sheet 5, and the trapezoidal surface 542 is located within the projection space. Alternatively, the inner edge of the annular support layer 4 projects a projection boundary B4 along the preset direction D toward the outer surface 51 of the light-transmitting sheet 5, and the clearance groove 54 is located outside the projection boundary B4.

[0071] The encapsulation body 6 is a cured liquid sealant, and the encapsulation body 6 is not placed within the clearance groove 54. The encapsulation body 6 comprises a colloid 6a and multiple fillers 6b embedded within the colloid 6a. In other words, any encapsulation body not formed using liquid sealant is different from the encapsulation body 6 referred to in this embodiment.

[0072] Furthermore, the package 6 has a first block 61 formed on the substrate 1 and a second block 62 connected to the first block 61. A plurality of fillers 6b are deposited within the first block 61, while the second block 62 contains almost no fillers 6b. Therefore, the first block 61 and the second block 62 together form a deposit boundary 63 at their interface. In other words, the first block 61 has a first filler density, which is greater than the second filler density of the second block 62.

[0073] More specifically, the sensing chip 2, the annular support layer 4, at least a portion of each of the metal lines 3, and the light-transmitting sheet 5 are embedded within the first block 61. In this embodiment, the first block 61 is connected to the bottom edge of the sacrificial sheet 7, and the annular side surface 53 of the light-transmitting sheet 5 is completely connected to the first block 61.

[0074] The volume of the first block 61 is much larger than the volume of the second block 62 (e.g., the volume of the second block 62 is between 0.1% and 5% of the volume of the first block 61). Furthermore, the second block 62 does not touch the light-transmitting sheet 5, and the inner edge of the sink boundary 63 does not touch the annular side 53 and surrounds the outside of the clearance groove 54.

[0075] Furthermore, along the preset direction D, the substrate boundaries 63 are higher than the stepped surface 541 and preferably separated by a distance of no more than 100 micrometers (μm). The top edge of the second block 62 is separated from the substrate 1 by a height difference of no more than 10 micrometers (μm) from the outer surface 51 of the light-transmitting sheet 5 (e.g., the height difference is 0 in the embodiment, and the top edge of the second block 62 is coplanar with the outer surface 51 of the light-transmitting sheet 5). In addition, the substrate boundaries 63 are projected onto a projection area formed by the orthographic projection of the relief groove 54 along a direction perpendicular to the preset direction D, which falls on the stepped surface 542.

[0076] As described above, in this embodiment, the sensor packaging structure 100 and its manufacturing method can effectively reduce the possibility of the light-transmitting sheet 5 breaking by forming the relief groove 54 in the light-transmitting sheet 5 with the position corresponding to the sink boundary 63, so that the part of the package body 6 that is prone to stress concentration (that is, the sink boundary 63) cannot exert force on the light-transmitting sheet 5.

[0077] Example 2

[0078] Please see Figures 11 to 14 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0079] like Figure 11 As shown, in the adhesive application step S220, a sacrificial layer 70 is formed on the light-transmitting plate 50, filling the plurality of grooves 501; that is, in this embodiment, the sacrificial layer 70 does not cover the outer surface 51 of the light-transmitting plate 50.

[0080] like Figure 11 and Figure 12 As shown, the slicing step S230 involves cutting the light-transmitting plate 50 along the plurality of grooves 501 to form a plurality of light-transmitting sheets 5 separated from each other and a plurality of sacrificial rings 72 respectively attached to the light-transmitting sheets 5. Each light-transmitting sheet 5 has an annular clearance groove 54 at the outer edge of its outer surface 51, which is filled by the corresponding sacrificial ring 72.

[0081] like Figure 13 As shown, the placement step S240 involves providing a sensing module M, which includes a sensing chip 2 and an annular support layer 4 disposed on the sensing chip 2, and the inner surface 52 of the light-transmitting sheet 5 is disposed on the annular support layer 4.

[0082] like Figure 14As shown, the encapsulation step S250 involves forming a liquid encapsulant on a substrate 1 of the sensing module M and curing it to form an encapsulation body 6; wherein the sensing chip 2 is mounted and electrically coupled to the substrate 1, and the encapsulation body 6 is as described in Embodiment 1.

[0083] As described above, from the placement step S240 and the packaging step S250 disclosed in this embodiment, it can be seen that the sensing chip 2 can be mounted on the substrate 1 after the light-transmitting sheet 5 is placed on the annular support layer 4, according to actual needs. The electrical coupling between the sensing chip 2 and the substrate 1 can be implemented using multiple metal lines 3, which is not limited herein.

[0084] Example 3

[0085] Please see Figure 15 and Figure 16 As shown, this is Embodiment Three of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One described above are roughly as follows:

[0086] In this embodiment, the sensor packaging structure 100 can be adjusted according to actual needs to meet different requirements. For example, such as Figure 15 As shown, along the preset direction D, the top edge of the second block 62 is higher than the outer surface 51 of the light-transmitting sheet 5 than the substrate 1, thereby raising the position of the substrate boundary 63, so that the depth of the clearance groove 54 can be reduced, thereby improving the structural strength of the light-transmitting sheet 5.

[0087] Or, such as Figure 16 As shown, the annular support layer 4 forms a projection space by projecting its orthographic projection along the preset direction D onto the outer surface 51 of the light-transmitting sheet 5, and the trapezoidal surface 542 is located outside the projection space. Accordingly, the width of the clearance groove 54 can be reduced, thereby improving the structural strength of the light-transmitting sheet 5.

[0088] Technical Effects of the Embodiments in this Application

[0089] In summary, the sensor packaging structure and manufacturing method disclosed in this application can effectively reduce the possibility of the light-transmitting sheet breaking by forming a relief groove in the light-transmitting sheet with a position corresponding to the boundary of the substrate. This prevents stress concentration from being exerted on the light-transmitting sheet at the part of the package body that is prone to stress concentration (i.e., the boundary of the substrate).

[0090] The content disclosed above is only a preferred and feasible embodiment of this application and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A method for manufacturing a sensor packaging structure, characterized in that, The method for manufacturing the sensor packaging structure includes: A forming step: a plurality of grooves are formed on the outer surface of a light-transmitting plate; wherein, the light-transmitting plate has an inner surface located on the opposite side of the outer surface, and the light-transmitting plate defines a plurality of light-transmitting sheets through the plurality of grooves; One adhesive application step: A sacrificial layer is formed on the light-transmitting plate, filling the plurality of grooves and covering the outer surface; The process involves cutting the sacrificial layer and the light-transmitting plate along multiple grooves to form multiple light-transmitting sheets that are separated from each other and multiple sacrificial sheets that are respectively attached to the light-transmitting sheets; wherein each light-transmitting sheet has an annular clearance groove at the outer edge of its outer surface, which is filled by the corresponding sacrificial sheet; A chip placement step: A substrate is provided, a sensing chip is mounted and electrically coupled to the substrate, and an annular support layer is disposed on the sensing chip, with the inner surface of the light-transmitting sheet disposed on the annular support layer; An encapsulation step: A liquid encapsulant is formed on the substrate and cured to form an encapsulation body; wherein the encapsulation body comprises an adhesive and a plurality of fillers mixed within the adhesive, and the encapsulation body has: A first block is formed on the substrate, and a plurality of the fillers are deposited within the first block; wherein the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the first block; and A second block, connected to the first block, together forming a sink boundary at the junction; wherein the second block is connected to the side edge of the sacrificial sheet, and the inner edge of the sink boundary does not touch the light-transmitting sheet and surrounds the side edge of the sacrificial sheet; and A removal step: Remove the sacrificial sheet so that the substrate, the sensing chip, the annular support layer, the light-transmitting sheet, and the package together constitute a sensor package structure.

2. The method for manufacturing the sensor packaging structure according to claim 1, characterized in that, In the forming step, the plurality of grooves include a plurality of longitudinal grooves and a plurality of transverse grooves, and the light-transmitting plate defines a plurality of light-transmitting sheets arranged in a matrix and connected to each other through the plurality of longitudinal grooves and the plurality of transverse grooves.

3. The method for manufacturing the sensor packaging structure according to claim 1, characterized in that, In the adhesive application step, the material of the sacrificial layer is selected from one of a pyrolytic adhesive, a hydrolytic adhesive, and a photolytic adhesive.

4. The method for manufacturing the sensor packaging structure according to claim 1, characterized in that, In the slicing step, each of the sacrificial slices comprises: A single piece, covering the outer surface of the corresponding light-transmitting sheet; and A sacrificial ring is connected to the sheet body and fills the corresponding clearance groove.

5. The method for manufacturing the sensor packaging structure according to claim 4, characterized in that, In the encapsulation step, the sacrificial piece protrudes from the encapsulation body, while the sacrificial ring is embedded within the encapsulation body.

6. The method for manufacturing the sensor packaging structure according to claim 1, characterized in that, In the encapsulation step, the volume of the second block is between 0.1% and 5% of the volume of the first block.

7. A sensor packaging structure, characterized in that, The sensor packaging structure includes: One substrate; A sensing chip is disposed on the substrate and electrically coupled to the substrate; wherein, a top portion of the sensing chip includes a sensing area and a bearing area surrounding the sensing area; An annular support layer is disposed on the carrier area of ​​the sensing chip and surrounds the sensing area; A light-transmitting sheet has an outer surface, an inner surface located on the opposite side of the outer surface, an annular side surface located between the outer surface and the inner surface, and an annular clearance groove connected to the outer surface and the annular side surface; wherein the light-transmitting sheet is disposed on the annular support layer with the inner surface along a predetermined direction, so that the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together surround and form a closed space; An encapsulation body is a cured liquid sealant, and the encapsulation body includes a sealant and a plurality of fillers embedded within the sealant; wherein the encapsulation body is not placed within the clearance groove, and the encapsulation body has: A first block is formed on the substrate, and a plurality of the fillers are deposited within the first block; wherein the sensing chip, the support layer, and the light-transmitting sheet are embedded within the first block, and the annular sidewall of the light-transmitting sheet is completely connected to the first block; and A second block, connected to the first block, together forming a sinking boundary at the junction; wherein the inner edge of the sinking boundary does not touch the annular side and surrounds the outside of the clearance groove.

8. The sensor packaging structure according to claim 7, characterized in that, The volume of the second block is between 0.1% and 5% of the volume of the first block.

9. The sensor packaging structure according to claim 7, characterized in that, The clearance groove has: A first-order surface, connected to the side surface of the ring; and A trapezoidal surface is connected between the outer surface and the annular side surface; wherein the boundary of the sink material is projected onto a projection area formed by the orthogonal projection of the relief groove along a direction perpendicular to the preset direction, and it falls on the trapezoidal surface.

10. The sensor packaging structure according to claim 9, characterized in that, Along the preset direction, the boundaries of the sediment are higher than the stepped surface and are separated from each other by a gap of no more than 100 micrometers.

11. The sensor packaging structure according to claim 9, characterized in that, The annular support layer forms a projection space by projecting a projection onto the outer surface of the light-transmitting sheet along the preset direction, and the trapezoidal surface is located within the projection space.

12. The sensor packaging structure according to claim 9, characterized in that, The annular support layer forms a projection space by projecting a projection onto the outer surface of the light-transmitting sheet along the preset direction, and the trapezoidal surface is located outside the projection space.

13. The sensor packaging structure according to claim 7, characterized in that, The clearance groove is filled with air.

14. The sensor packaging structure according to claim 7, characterized in that, The inner edge of the annular support layer is projected onto the outer surface of the light-transmitting sheet along the preset direction to form a projection boundary, and the clearance groove is located outside the projection boundary.

15. The sensor packaging structure according to claim 7, characterized in that, Along the preset direction, the top edge of the second block is separated from the substrate and the outer surface of the light-transmitting sheet by a height difference of no more than 10 micrometers.

16. The sensor packaging structure according to claim 15, characterized in that, Along the preset direction, the top edge of the second block is coplanar with the outer surface of the light-transmitting sheet.

17. The sensor packaging structure according to claim 15, characterized in that, Along the preset direction, the top edge of the second block is higher than the outer surface of the light-transmitting sheet relative to the substrate.

18. The sensor packaging structure according to claim 7, characterized in that, The first block has a first filler density, which is greater than a second filler density of the second block.

19. A method for manufacturing a sensor packaging structure, characterized in that, The method for manufacturing the sensor packaging structure includes: A forming step: a plurality of grooves are formed on the outer surface of a light-transmitting plate; wherein, the light-transmitting plate has an inner surface located on the opposite side of the outer surface, and the light-transmitting plate defines a plurality of light-transmitting sheets through the plurality of grooves; A first adhesive application step: forming a sacrificial layer that fills a plurality of the grooves on the light-transmitting plate; a second slicing step: cutting the light-transmitting plate and the sacrificial layer along the plurality of grooves to form a plurality of light-transmitting sheets separated from each other and a plurality of sacrificial rings respectively attached to the light-transmitting sheets; wherein, each light-transmitting sheet has an annular clearance groove at the outer edge of its outer surface, which is filled by the corresponding sacrificial ring; A step of placing a light-transmitting sheet: A sensing module is provided, which includes a sensing chip and an annular support layer disposed on the sensing chip, and the inner surface of the light-transmitting sheet is disposed on the annular support layer. An encapsulation step: A liquid encapsulant is formed on a substrate of the sensing module and cured to form an encapsulation body; wherein the sensing chip is mounted and electrically coupled to the substrate; the encapsulation body includes a colloid and a plurality of fillers mixed within the colloid, and the encapsulation body has: A first block is formed on the substrate, and a plurality of the fillers are deposited within the first block; wherein the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the first block; and A second block, connected to the first block, together forming a sink boundary at the junction; wherein the second block is connected to the side edge of the sacrificial ring, and the inner edge of the sink boundary does not touch the light-transmitting sheet and surrounds the side edge of the sacrificial ring; and A removal step: Remove the sacrificial ring so that the substrate, the sensing chip, the annular support layer, the light-transmitting sheet, and the package together constitute a sensor package structure.

20. The method for manufacturing the sensor packaging structure according to claim 19, characterized in that, In the adhesive application step, the material of the sacrificial layer is selected from one of a pyrolytic adhesive, a hydrolytic adhesive, and a photolytic adhesive.

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