Laser precision welding equipment and method for ultrathin earphone diaphragm

Abstract

The present application relates to a kind of ultra-thin earphone diaphragm laser precision welding equipment and method, for solving the problem of easy deformation when ultra-thin diaphragm and diaphragm frame welding. Including sequentially arranged feeding section, laser processing platform and discharging section along material flow direction, laser processing platform is integrated with laser heating part, laser cutting part, laser drilling part, micro tin ball implantation part and laser welding part. By laser heating part, pre-set wire coil is accurately scanned and heated, so that it forms non-destructive bonding with diaphragm;Then profile cutting and femtosecond laser synchronous drilling are carried out in turn;Then micro tin ball is implanted after turning positioning;Finally, spatial light modulation technology is used to realize multi-welding point synchronous laser welding. The present application ensures that ultra-thin diaphragm maintains structural integrity during the entire welding process by step laser processing and thermal management control, and simultaneously realizes efficient and high-precision parallel processing using beam shaping technology, significantly improves production yield and welding quality.

Description

Technical Field

[0001] This invention relates to the field of laser welding technology, and more specifically to a laser precision welding device for an ultra-thin headphone diaphragm. Background Technology

[0002] In the field of high-end headphone manufacturing, the thinner the diaphragm, the higher its response sensitivity. However, the reliable connection between the ultra-thin diaphragm and the diaphragm frame has always been a technical challenge. Traditional welding methods, such as thermoforming and ultrasonic welding, require direct pressure on the diaphragm or generate a large heat-affected zone. This can easily cause irreversible deformation, wrinkling, or even cracking of the ultra-thin diaphragm, which is only tens of micrometers thick, seriously affecting the acoustic performance and product yield of the headphones.

[0003] Existing technologies attempt to use micro-soldering processes for connection, but these have several limitations in practice: Firstly, the heat input of traditional soldering irons is difficult to control precisely, easily causing localized overheating and damaging the diaphragm; secondly, using solder paste printing faces problems such as inaccurate solder volume control, bridging, or cold solder joints, especially in scenarios requiring continuous soldering around the diaphragm, where traditional methods struggle to guarantee solder joint consistency and airtightness. Furthermore, as headphone products trend towards thinner, lighter, and higher-fidelity designs, diaphragm thickness is decreasing and structures are becoming increasingly complex, placing more stringent demands on the soldering process. Existing equipment often lacks dedicated processing modules for ultra-thin materials, and the transitions between multiple processing steps are not smooth enough, easily causing secondary damage to the fragile diaphragm during process changes. Simultaneously, traditional serial soldering methods, where each solder joint is soldered individually, are inefficient and cannot meet the demands of large-scale production. Therefore, the industry urgently needs a dedicated equipment and method capable of non-destructive, efficient, and high-precision soldering of ultra-thin diaphragms, ensuring a reliable connection between the diaphragm and frame while maintaining the structural integrity of the diaphragm, and simultaneously guaranteeing production efficiency and product consistency. This is precisely the core technical problem that this invention aims to solve. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a laser precision welding device for ultra-thin headphone diaphragms, used to weld ultra-thin headphone diaphragms to diaphragm frames. The device comprises, in sequence along the material processing flow direction, a loading section, a laser processing platform, and an unloading section.

[0005] The laser processing platform integrates a laser heating section, a laser cutting section, a laser drilling section, a micro solder ball implantation section, and a laser welding section.

[0006] The feeding section is used to precisely place the metal wire ring at a predetermined position on the ultra-thin headphone diaphragm material; the laser heating section is used to scan and heat the metal wire ring, so that it is bonded to the ultra-thin headphone diaphragm; the laser cutting section is used to precisely cut the composite diaphragm material according to the outer contour of the diaphragm frame; the laser drilling section is used to process through-hole micro-holes along the metal wire ring using a femtosecond laser; the micro-solder ball implantation section includes a flipping mechanism, a welding fixture, and a micro-solder ball feeder, used to flip and position the component and implant micro-solder balls into the micro-holes; the laser welding section is used to emit a continuous laser to melt the solder balls in the micro-holes to achieve welding between the metal wire ring and the diaphragm frame; the unloading section is used to collect the welded products.

[0007] Furthermore, the laser heating section is located after the loading section and includes a first laser generator and a coaxial vision positioning system. Under the drive of the control system, the first laser generator emits a first laser to scan and heat the metal wire ring along its path, causing the metal wire ring to be heated and bonded to the ultra-thin headphone diaphragm below. The ultra-thin headphone diaphragm is melted by the heat conducted by the metal wire ring and bonded to the metal wire ring. By controlling the energy input, the heat-affected zone is prevented from spreading to the non-contact area of ​​the diaphragm, ensuring that the ultra-thin headphone diaphragm does not deform or crack.

[0008] The laser cutting section is located after the laser heating section and includes a second laser generator, which is an ultraviolet picosecond laser. The second laser generator emits a second laser to precisely cut the composite diaphragm material according to the outer contour of the diaphragm frame, so that the ultra-thin headphone diaphragm and the outer contour of the diaphragm frame have the same shape.

[0009] The laser drilling section is located after the laser cutting section and includes a femtosecond laser generator. After the femtosecond laser beam emitted by the femtosecond laser generator is focused, it performs micro-hole drilling on the surface of the metal wire ring, which is fixed on the diaphragm, along the extension direction of the metal wire ring. The micro-holes penetrate the metal wire ring and the diaphragm material. The diameter of the processed micro-holes is 300μm to 500μm, and the hole spacing is 5mm to 8mm.

[0010] The micro-solder ball implantation unit includes a micro-solder ball feeder, a flipping mechanism, and a welding fixture; the flipping mechanism is used to flip the drilled diaphragm and the wire coil assembly 180 degrees, so that the wire coil is below and the ultra-thin diaphragm is above; the welding fixture is used to receive the assembly from the flipping mechanism and to precisely position and clamp the diaphragm frame, the flipped ultra-thin diaphragm, and the wire coil in three-dimensional space.

[0011] A micro solder ball feeder is located above the soldering fixture. The micro solder ball feeder includes a precision spray valve. The micro solder ball feeder provides spherical solder paste with a diameter between 200 μm and 400 μm. Under air pressure control, the precision spray valve sprays individual micro solder balls and implants them into corresponding microholes.

[0012] The laser welding section is located after the micro solder ball implantation section. It includes a third laser generator that emits a third laser, which is a continuous laser. The beam emitted by the third laser generator irradiates the micro solder ball implanted in the microhole, causing the solder ball to melt instantly and fill the microhole. After cooling, a solder joint is formed, thereby firmly welding the metal wire ring to the diaphragm frame located below.

[0013] Furthermore, the metal coil is a flat metal coil; the cross-sectional thickness of the metal wire used in the coil is 300μm to 500μm; and the cross-sectional width is 1 mm to 1.5 mm.

[0014] The first laser generator of the laser heating section is a pulsed fiber laser with an output wavelength of 1064nm, a rated average power of 50W to 100W, an adjustable pulse width of 0.1ms to 5.0ms, and a repetition frequency of 1kHz to 20kHz.

[0015] The coaxial visual positioning system includes a high-resolution CCD camera and a ring light source integrated in the laser optical path, and its positioning accuracy is better than ±10μm.

[0016] The laser beam is guided and focused by the scanning galvanometer system to form a focused spot with a diameter of 80μm to 150μm. This spot is strictly scanned along the path of the metal wire ring at a scanning speed of 100mm / s to 500mm / s under the drive of the control system.

[0017] The scanning heating process is as follows: the pulse energy of the first laser is absorbed by the surface of the metal wire ring, causing it to be instantly and locally heated to a predetermined temperature range of 200°C to 400°C. This heat melts the ultra-thin headphone diaphragm in contact with it through thermal conduction and forms an adhesive bond. The control system adjusts the laser power and scanning speed in real time to precisely control the heat-affected zone within the width range of the metal wire ring, ensuring that the temperature rise of the non-contact area of ​​the diaphragm is below its deformation threshold.

[0018] Furthermore, the second laser generator of the laser cutting section is an ultraviolet picosecond laser with an output wavelength of 355nm, a maximum average power of not less than 10W, a pulse width of less than 15ps, and a repetition frequency that is adjustable in the range of 10kHz to 500kHz.

[0019] The laser beam output by the second laser generator is guided and focused by an optical path system consisting of a scanning galvanometer system and an f-theta flat field focusing mirror, ultimately forming a focused spot with a diameter of 15μm to 30μm on the processing plane;

[0020] The optical path system also integrates a coaxial vision positioning module, which is used to identify the cutting path reference marks on the diaphragm material, and its positioning accuracy is better than ±5μm;

[0021] During the cutting process, the control system controls the focused spot to perform precise cutting along the outer contour path of the diaphragm frame at a scanning speed of 300 mm / s to 1500 mm / s, with a single cutting depth of 50 μm to 150 μm. By controlling the matching of laser power and scanning speed, the depth of the heat-affected zone at the cutting edge is controlled within the range of less than 10 μm.

[0022] The laser cutting unit also includes a negative pressure dust removal system, with its suction port located near the cutting area, used to remove debris and dust generated during the cutting process in real time, ensuring that the cut surface is clean and free of contamination.

[0023] Furthermore, the femtosecond laser generator of the laser-drilled part has an output wavelength of 1030nm, a maximum single pulse energy of not less than 50μJ, a pulse width of less than 500fs, and a repetition frequency that is adjustable in the range of 10kHz to 200kHz.

[0024] The femtosecond laser beam passes sequentially through a beam expander, a scanning galvanometer system, and an f-theta focusing lens, ultimately forming a focused spot with a diameter of 20μm to 50μm on the processing plane;

[0025] The laser drilling section integrates diffractive optical elements in its optical path to split the incident single femtosecond laser beam into multiple parallel and uniformly energetic processing beams, thereby enabling the synchronous processing of multiple micro-holes along the extension direction of the metal wire ring.

[0026] The control system controls the scanning galvanometer to cooperate with the split beam, so that multiple focused light spots are positioned on the surface of the metal wire ring according to a preset array pattern, and the micro-hole processing position accuracy is better than ±8μm;

[0027] Each microhole is created by a single pulse impact or a multi-pulse train impact, with the number of pulses in the pulse train ranging from 3 to 10, and the processing cycle of a single microhole is less than 10ms.

[0028] Furthermore, the micro solder ball feeder of the micro solder ball implantation part provides spherical solder balls with a diameter of 200μm to 400μm, whose composition is Sn96.5Ag3.0Cu0.5 and melting point of 217°C to 220°C;

[0029] The precision injection valve is piezoelectrically driven and has a precision nozzle with an orifice diameter of 100μm inside. The valve core opening time is controlled between 0.5ms and 2.0ms, and the injection air pressure is between 0.2MPa and 0.6MPa to ensure that a single micro-tin ball is accurately released with each action.

[0030] The micro-solder ball implantation unit is also equipped with an independent high-resolution visual alignment system with a positioning accuracy better than ±5μm. This system is used to verify the position of the micropores before implantation and to detect the implantation status of the micro-solder balls after implantation.

[0031] Furthermore, the third laser generator of the laser welding part is a continuous wave fiber laser with an output wavelength of 1080nm and a rated output power of 100W to 300W.

[0032] The optical path of the laser welding section integrates a spatial light modulator, which is used to phase modulate the wavefront of the continuous laser beam emitted by the third laser generator and convert it into a beam array composed of multiple independent focused light spots.

[0033] The diameter of each focused spot in the beam array is controlled between 80μm and 150μm, and the arrangement of the spot array is consistent with the distribution of the micro-hole array on the metal wire ring, so as to achieve synchronous welding of multiple implanted micro solder balls.

[0034] The control system controls the spatial light modulator and the scanning galvanometer to work together so that the beam array covers and irradiates at least 5 micro-holes at a time; the irradiation time for each micro-hole region is 5ms to 20ms, thereby achieving high-efficiency parallel welding.

[0035] A laser precision welding method for ultra-thin headphone diaphragms, using the aforementioned laser precision welding equipment, includes the following steps:

[0036] S1: Feeding and fixing steps: The metal wire ring is precisely placed in the predetermined position on the ultra-thin headphone diaphragm material through the feeding part;

[0037] S2: Laser heating step: The metal wire ring is scanned and heated by the laser heating unit, so that the metal wire ring is heated and the ultra-thin headphone diaphragm in contact with it is partially melted through heat conduction, forming an adhesive bond. At the same time, the energy input is controlled to ensure that the diaphragm does not deform or break.

[0038] S3: Laser cutting step: The composite diaphragm material is precisely cut according to the outer contour of the diaphragm frame through the laser cutting unit to form the diaphragm.

[0039] S4: Laser drilling step: Through the laser drilling section, a femtosecond laser is used to process through-hole micro-holes along the extension direction of the metal wire ring;

[0040] S5: Flipping and Positioning Steps: The perforated diaphragm and wire ring assembly are flipped 180 degrees using a flipping mechanism, so that the wire ring is located at the bottom; then, the diaphragm frame, the flipped ultra-thin diaphragm, and the wire ring are precisely positioned and clamped in three-dimensional space on the welding fixture.

[0041] S6: Micro-solder ball implantation step: Through the micro-solder ball implantation part, micro-solder balls with matching diameters are precisely implanted into the micro-holes, with one micro-solder ball implanted into each micro-hole;

[0042] S7: Laser welding step: Through the laser welding unit, a laser beam is emitted to irradiate the micro-solder ball implanted in the micro-hole, causing it to melt and fill the micro-hole. After cooling, a solder joint is formed, thereby firmly welding the metal wire ring to the diaphragm frame.

[0043] S8: Unloading step: Remove and collect the finished products after welding through the unloading section.

[0044] Furthermore, in the S2 laser heating step, a pulsed fiber laser with a wavelength of 1064nm is used to scan along the path of the metal wire ring with a spot diameter of 80μm to 150μm and a scanning speed of 100mm / s to 500mm / s, thereby controlling the instantaneous temperature of the metal wire ring surface between 200℃ and 400℃.

[0045] In the S4 laser drilling step, a femtosecond laser with a wavelength of 1030nm is used. The laser beam is split by a diffraction optical element to achieve simultaneous processing of multiple micro-holes along the metal wire loop. The diameter of the micro-holes is 300μm to 500μm.

[0046] In the S7 laser welding step, a continuous laser with a wavelength of 1080nm is used. The laser is modulated into a beam array by a spatial light modulator to achieve synchronous welding of micro solder balls in multiple microholes. The irradiation time of a single solder joint is 5ms to 20ms.

[0047] Furthermore, between the S2 laser heating step and the S4 laser drilling step, there is also a step S3a: a quality inspection step, which uses a vision system to detect defects in the diaphragm assembly after laser heating and bonding, identifies defective products with poor bonding or diaphragm deformation and removes them.

[0048] After the S6 micro solder ball implantation step and before the S7 laser welding step, there is also a step S6a: implantation verification step, which uses a high-resolution vision system to verify the implantation status of the micro solder balls in the microholes to confirm that each microhole is correctly filled.

[0049] The beneficial effects of this invention are as follows:

[0050] The laser precision welding equipment and method for ultra-thin headphone diaphragms of the present invention bring multiple significant benefits:

[0051] By employing non-contact laser heating and precise energy control, the problem of deformation and cracking of ultra-thin diaphragms caused by heat input has been successfully solved. The laser heating unit controls the spot parameters and scanning path to strictly limit the heat-affected zone within the range of the metal wire ring, ensuring that the temperature rise in the non-contact area of ​​the diaphragm is always below the deformation threshold, thereby guaranteeing a high product yield.

[0052] An innovative step-by-step laser processing strategy was adopted, which breaks down the complex welding process into multiple precision steps such as heating and bonding, contour cutting, micro-hole processing and final welding. Each step was optimized for specific material properties. For example, ultraviolet picosecond lasers were used for cold cutting to maintain edge quality, and femtosecond lasers were used to achieve high-precision micro-hole processing. This division of labor and cooperation mode significantly improved the overall processing accuracy.

[0053] By introducing advanced beam control technologies such as diffractive optical elements and spatial light modulators, multi-hole synchronous processing and multi-point synchronous welding have been achieved, transforming the traditional serial processing mode into a highly efficient parallel processing mode, which greatly improves production efficiency while ensuring processing consistency.

[0054] The micro solder ball implantation unit, through the coordinated operation of a precision injection valve and a vision alignment system, ensures that each micro-hole can accurately receive a single micro solder ball. Combined with a temperature-controlled fixture, it prevents the solder ball from pre-melting, providing a reliable guarantee for the subsequent soldering quality.

[0055] The entire system integrates multiple vision positioning and quality inspection links, constructing a complete closed-loop quality control system. It can monitor the processing status in real time and promptly remove defective products, thereby ensuring the high consistency and reliability of the final product and providing a complete technical solution for high-quality welding of ultra-thin diaphragms. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Appendix Figure 1 This is a schematic diagram of the overall architecture of the present invention;

[0058] Appendix Figure 2 This is a top view of the device of the present invention;

[0059] Appendix Figure 3 This is a schematic diagram of the overall structure of the device of the present invention;

[0060] Appendix Figure 4This is a schematic diagram of the metal wire coil of the present invention placed on the raw material of the ultra-thin headphone diaphragm;

[0061] Appendix Figure 5 This is a schematic diagram of the welding fixture of the present invention;

[0062] Appendix Figure 6 This is a schematic diagram of the micropore distribution of the present invention;

[0063] Appendix Figure 7 This is a schematic diagram showing the stacking order of the ultra-thin headphone diaphragm, metal wire coil, and diaphragm frame of the present invention;

[0064] Appendix Figure 8 This is a schematic diagram of the process of drilling, tinning, and soldering in this invention.

[0065] The components include: 1. Loading section; 2. Laser heating section; 3. Laser cutting section; 4. Laser drilling section; 4. Femtosecond laser generator; 5. Micro-solder ball implantation section; 5. Welding fixture; 51. Fixture fixing pin; 52. Micro-solder ball feeder; 53. Laser welding section; 6. Continuous wave fiber laser; 61. Appearance inspection section; 7. Unloading section; 8. Ultra-thin headphone diaphragm; 91. Metal wire ring; 92. Micro-hole; 921. Diaphragm frame; 93. Detailed Implementation

[0066] Example 1:

[0067] See Figures 1 to 8 The present invention provides a laser precision welding device for ultra-thin headphone diaphragms, used to weld ultra-thin headphone diaphragms 91 to diaphragm frames 93. The device includes, in sequence along the material processing flow direction, a loading section 1, a laser processing platform, and a unloading section 8.

[0068] The laser processing platform is integrated with a laser heating unit 2, a laser cutting unit 3, a laser drilling unit 4, a micro solder ball implantation unit 5, and a laser welding unit 6.

[0069] The feeding section 1 is used to precisely place the metal wire coil 92 at a predetermined position on the ultra-thin headphone diaphragm material; the laser heating section 2 is used to scan and heat the metal wire coil 92, so that it is bonded to the ultra-thin headphone diaphragm 91; the laser cutting section 3 is used to precisely cut the composite diaphragm material according to the outer contour of the diaphragm frame 93; the laser drilling section 4 is used to perform through-hole micro-hole processing along the metal wire coil 92 using a femtosecond laser; the micro-solder ball implantation section 5 includes a flipping mechanism, a welding fixture 51, and a micro-solder ball feeder 53, used to flip and position the component and implant micro-solder balls into the micro-holes; the laser welding section 6 is used to emit a continuous laser to melt the solder balls in the micro-holes to achieve welding of the metal wire coil 92 and the diaphragm frame 93; the unloading section 8 is used to collect the welded finished products.

[0070] Furthermore, the laser heating unit 2 is located after the feeding unit 1, and includes a first laser generator and a coaxial vision positioning system. Under the drive of the control system, the first laser generator emits a first laser to scan and heat along the path of the metal wire ring 92, so that the metal wire ring 92 is heated and forms an adhesive bond with the ultra-thin headphone diaphragm 91 below. The ultra-thin headphone diaphragm 91 is melted by the heat conducted by the metal wire ring 92 and bonded to the metal wire ring 92. By controlling the energy input, the heat-affected zone is prevented from spreading to the non-contact area of ​​the diaphragm, ensuring that the ultra-thin headphone diaphragm does not deform or break.

[0071] The laser cutting section 3 is located after the laser heating section 2. It includes a second laser generator, which is an ultraviolet picosecond laser. The second laser generator emits a second laser to precisely cut the composite diaphragm material according to the outer contour of the diaphragm frame 93, so that the outer contour shape of the ultra-thin headphone diaphragm 91 and the diaphragm frame 93 is the same.

[0072] The laser drilling section 4 is located after the laser cutting section 3 and includes a femtosecond laser generator 41. After the femtosecond laser beam emitted by the femtosecond laser generator 41 is focused, it performs micro-hole drilling on the surface of the metal wire ring 92, which is fixed on the diaphragm, along the extension direction of the metal wire ring 92. The micro-holes penetrate the metal wire ring 92 and the diaphragm material. The diameter of the processed micro-holes 921 is 300μm to 500μm, and the hole spacing is 5mm to 8mm.

[0073] The micro-solder ball implantation part 5 includes a micro-solder ball feeder 53, a flipping mechanism, and a welding fixture 51; the flipping mechanism is used to flip the completed diaphragm and wire coil 92 assembly by 180 degrees, so that the wire coil 92 is below and the ultra-thin diaphragm is above; the welding fixture 51 is used to receive the assembly from the flipping mechanism and to precisely position and clamp the diaphragm frame 93, the flipped ultra-thin diaphragm, and the wire coil 92 in three-dimensional space.

[0074] The micro-solder ball fixture includes multiple fixture fixing pins 52, which are used to engage with grooves on the diaphragm frame 93 to achieve precise fixation.

[0075] The micro solder ball feeder 53 is located above the soldering fixture 51. The micro solder ball feeder 53 includes a precision spray valve. The micro solder ball feeder 53 provides spherical solder paste with a diameter between 200 μm and 400 μm. Under air pressure control, the precision spray valve sprays individual micro solder balls and implants them into the corresponding microholes.

[0076] The laser welding section 6 is located after the micro solder ball implantation section 5. It includes a third laser generator that emits a third laser, which is a continuous laser. The beam emitted by the third laser generator irradiates the micro solder ball implanted in the microhole, causing the solder ball to melt instantly and fill the microhole. After cooling, a solder joint is formed, thereby firmly welding the metal wire ring 92 to the diaphragm frame 93 located below.

[0077] Furthermore, the metal coil 92 is a flat metal coil; the cross-sectional thickness of the metal wire used in the coil is 300μm to 500μm; and the cross-sectional width is 1 mm to 1.5 mm.

[0078] The first laser generator of the laser heating unit 2 is a pulsed fiber laser with an output wavelength of 1064nm, a rated average power of 50W to 100W, an adjustable pulse width in the range of 0.1ms to 5.0ms, and a repetition frequency of 1kHz to 20kHz.

[0079] The coaxial visual positioning system includes a high-resolution CCD camera and a ring light source integrated in the laser optical path, and its positioning accuracy is better than ±10μm.

[0080] The laser beam is guided and focused by the scanning galvanometer system to form a focused spot with a diameter of 80μm to 150μm. This spot is strictly scanned along the path of the metal wire loop 92 at a scanning speed of 100mm / s to 500mm / s under the drive of the control system.

[0081] The scanning heating process is as follows: the pulse energy of the first laser is absorbed by the surface of the metal wire ring 92, causing it to be instantly and locally heated to a predetermined temperature range of 200°C to 400°C. This heat causes the ultra-thin headphone diaphragm 91 in contact with it to partially melt and form an adhesive bond through thermal conduction. The control system adjusts the laser power and scanning speed in real time to precisely control the heat-affected zone within the width range of the metal wire ring 92, ensuring that the temperature rise of the non-contact area of ​​the diaphragm is lower than its deformation threshold.

[0082] Furthermore, the second laser generator of the laser cutting section 3 is an ultraviolet picosecond laser with an output wavelength of 355nm, a maximum average power of not less than 10W, a pulse width of less than 15ps, and a repetition frequency that is adjustable in the range of 10kHz to 500kHz.

[0083] The laser beam output by the second laser generator is guided and focused by an optical path system consisting of a scanning galvanometer system and an f-theta flat field focusing mirror, ultimately forming a focused spot with a diameter of 15μm to 30μm on the processing plane;

[0084] The optical path system also integrates a coaxial vision positioning module, which is used to identify the cutting path reference marks on the diaphragm material, and its positioning accuracy is better than ±5μm;

[0085] During the cutting process, the control system controls the focused spot to perform precise cutting along the outer contour path of the diaphragm frame 93 at a scanning speed of 300 mm / s to 1500 mm / s, with a single cutting depth of 50 μm to 150 μm. By controlling the matching of laser power and scanning speed, the depth of the heat-affected zone at the cutting edge is controlled within the range of less than 10 μm.

[0086] The laser cutting unit 3 also includes a negative pressure dust removal system, whose dust suction port is located near the cutting area, used to remove debris and dust generated during the cutting process in real time, ensuring that the cutting surface is clean and free of pollution.

[0087] Furthermore, the femtosecond laser generator 41 of the laser drilling section 4 has an output wavelength of 1030nm, a maximum single pulse energy of not less than 50μJ, a pulse width of less than 500fs, and a repetition frequency that is adjustable in the range of 10kHz to 200kHz.

[0088] The femtosecond laser beam passes sequentially through a beam expander, a scanning galvanometer system, and an f-theta focusing lens, ultimately forming a focused spot with a diameter of 20μm to 50μm on the processing plane;

[0089] The laser drilling section 4 integrates a diffractive optical element in its optical path to split the incident single femtosecond laser beam into multiple parallel and uniformly energetic processing beams, so as to achieve synchronous processing of multiple micro-holes along the extension direction of the metal wire loop 92.

[0090] The control system controls the scanning galvanometer to cooperate with the split beam, so that multiple focused light spots are positioned on the surface of the metal wire loop 92 according to a preset array pattern, and the micro-hole processing position accuracy is better than ±8μm;

[0091] Each microhole is created by a single pulse impact or a multi-pulse train impact, with the number of pulses in the pulse train ranging from 3 to 10, and the processing cycle of a single microhole is less than 10ms.

[0092] Furthermore, the micro solder ball feeder 53 of the micro solder ball implantation part 5 provides spherical solder balls with a diameter of 200μm to 400μm, whose composition is Sn96.5Ag3.0Cu0.5 and melting point of 217°C to 220°C;

[0093] The precision injection valve is piezoelectrically driven and has a precision nozzle with an orifice diameter of 100μm inside. The valve core opening time is controlled between 0.5ms and 2.0ms, and the injection air pressure is between 0.2MPa and 0.6MPa to ensure that a single micro-tin ball is accurately released with each action.

[0094] The micro-solder ball implantation unit 5 is also equipped with an independent high-resolution visual alignment system. The positioning accuracy of the system is better than ±5μm. It is used to verify the position of the micropores before implantation and to detect the implantation status of the micro-solder balls after implantation.

[0095] Furthermore, the third laser generator of the laser welding section 6 is a continuous wave fiber laser 61 with an output wavelength of 1080nm and a rated output power of 100W to 300W.

[0096] The optical path of the laser welding section 6 integrates a spatial light modulator, which is used to phase modulate the wavefront of the continuous laser beam emitted by the third laser generator and convert it into a beam array composed of multiple independent focused light spots.

[0097] The diameter of each focused spot in the beam array is controlled between 80μm and 150μm, and the arrangement of the spot array is consistent with the distribution of the micro-hole array on the metal wire loop 92, so as to realize the synchronous welding of multiple implanted micro solder balls.

[0098] The control system controls the spatial light modulator and the scanning galvanometer to work together so that the beam array covers and irradiates at least 5 micro-holes at a time; the irradiation time for each micro-hole region is 5ms to 20ms, thereby achieving high-efficiency parallel welding.

[0099] The specific parameter configurations are as follows:

[0100] Loading Section 1: A six-axis collaborative robot with a vacuum nozzle, brand: Universal Robots, model: UR5e, is used for loading and placing 92mm wire coils. Its repeatability is ±0.03mm. The vision positioning system uses a Keyence CV-X series camera with coaxial light, and the pixel accuracy is 10μm.

[0101] Laser heating unit 2: The first laser generator is a pulsed fiber laser manufactured by IPG Photonics, model: YLP-1-100-20-20-CN, with an output wavelength of 1064nm. In this embodiment, its average power is set to 60W, pulse width to 1.0ms, and repetition frequency to 5kHz. A scanning galvanometer, brand: Scanlab, model: IntelliSCANdee 14, in conjunction with an f-theta lens, forms a focused spot with a diameter of 100μm, scanning along the path of the metal wire loop 92 at a scanning speed of 200mm / s. Through real-time monitoring with an infrared thermal imager, the peak surface temperature of the metal wire loop 92 is controlled to be 280℃±10℃, successfully melting and bonding the ultra-thin PET diaphragm, with a thickness of ~25μm, locally. The heat-affected zone is strictly controlled within the 1.2mm width of the metal wire loop 92, and the diaphragm shows no visible deformation.

[0102] Laser Cutting Section 3: The second laser generator is a HGL-PS-355-10 ultraviolet picosecond laser from HGLaser, with a wavelength of 355nm, an average power of 8W, a pulse width of <12ps, and a repetition frequency set to 100kHz. The focused spot diameter is 20μm, and contour cutting is performed at a speed of 800mm / s. High-purity nitrogen gas at 0.4MPa is blown in as a protective gas during cutting, and the airflow of the negative pressure dust removal system is 25m³ / h. The edge of the diaphragm after cutting is smooth, and the depth of the heat-affected zone is less than 5μm as measured by microscopy.

[0103] Laser drilling section 4: The femtosecond laser generator 41 is from Amplitude Systemes' Tangerine series, with a wavelength of 1030 nm, a pulse width of 400 fs, a repetition rate set to 50 kHz, and a single pulse energy of 20 μJ. A single laser beam is split into five parallel beams using diffractive optical elements to process five micro-holes simultaneously. The micro-holes 921 have a diameter of 400 μm and a spacing of 6 mm. Each micro-hole is processed using a pulse train of three pulses, with a processing cycle of approximately 6 ms for each micro-hole.

[0104] Micro-solder ball implantation unit 5: The micro-solder ball composition is Sn96.5Ag3.0Cu0.5, and in this embodiment, a solder ball with a diameter of 350μm is selected. The nozzle orifice diameter of the precision injection valve is 100μm, the opening time is set to 1.0ms, and the injection air pressure is 0.4MPa. An independent visual alignment system performs position verification before implantation to ensure an implantation success rate of greater than 99.9%.

[0105] Laser welding section 6: The third laser generator is a continuous-wave fiber laser 61, model: RFL-C1000, wavelength 1080nm. In this embodiment, the welding power is set to 150W. Using an LCOS-based spatial light modulator, the laser is modulated into an array of five spots, each with a diameter of approximately 100μm. This array covers five micro-holes simultaneously, irradiating each weld joint for 10ms, achieving synchronous welding.

[0106] Example 2:

[0107] A laser precision welding method for ultra-thin headphone diaphragms, using the aforementioned laser precision welding equipment, includes the following steps:

[0108] S1: Feeding and fixing steps: The metal wire ring 92 is precisely placed in the predetermined position of the ultra-thin headphone diaphragm material through the feeding part 1;

[0109] S2: Laser heating step: The metal wire ring 92 is scanned and heated by the laser heating unit 2, so that the metal wire ring 92 is heated and the ultra-thin headphone diaphragm 91 in contact with it is partially melted through heat conduction, forming an adhesive bond. At the same time, the energy input is controlled to ensure that the diaphragm does not deform or break.

[0110] S3: Laser cutting step: The composite diaphragm material is precisely cut according to the outer contour of the diaphragm frame 93 through the laser cutting part 3 to form the diaphragm.

[0111] S4: Laser drilling step: Through the laser drilling section 4, a femtosecond laser is used to perform through-hole micro-hole processing along the extension direction of the metal wire ring 92;

[0112] S5: Flipping and positioning steps: The perforated diaphragm and wire ring 92 assembly are flipped 180 degrees by the flipping mechanism so that the wire ring 92 is located below; then, the diaphragm frame 93, the flipped ultra-thin diaphragm and the wire ring 92 are precisely positioned and clamped in three-dimensional space on the welding fixture 51.

[0113] S6: Micro-solder ball implantation step: Through the micro-solder ball implantation part 5, micro-solder balls with matching diameters are precisely implanted into the micro-holes, with one micro-solder ball implanted into each micro-hole;

[0114] S7: Laser welding step: The laser welding unit 6 emits a laser beam to irradiate the micro-tin ball implanted in the micro-hole, causing it to melt and fill the micro-hole. After cooling, a solder joint is formed, thereby firmly welding the metal wire ring 92 to the diaphragm frame 93.

[0115] S8: Unloading step: The finished product after welding is removed and collected through the unloading part 8.

[0116] Furthermore, in the S2 laser heating step, a pulsed fiber laser with a wavelength of 1064nm is used to scan along the path of the metal wire ring 92 with a spot diameter of 80μm to 150μm and a scanning speed of 100mm / s to 500mm / s, thereby controlling the instantaneous surface temperature of the metal wire ring 92 to be between 200℃ and 400℃.

[0117] In the S4 laser drilling step, a femtosecond laser with a wavelength of 1030nm is used. The laser beam is split by a diffractive optical element to achieve simultaneous processing of multiple micro-holes along the metal wire loop 92. The diameter of the micro-holes is 300μm to 500μm.

[0118] In the S7 laser welding step, a continuous laser with a wavelength of 1080nm is used. The laser is modulated into a beam array by a spatial light modulator to achieve synchronous welding of micro solder balls in multiple microholes. The irradiation time of a single solder joint is 5ms to 20ms.

[0119] Furthermore, between the S2 laser heating step and the S4 laser drilling step, there is also a step S3a: a quality inspection step, which uses a vision system to detect defects in the diaphragm assembly after laser heating and bonding, identifies defective products with poor bonding or diaphragm deformation and removes them.

[0120] After the S6 micro solder ball implantation step and before the S7 laser welding step, there is also a step S6a: implantation verification step, which uses a high-resolution vision system to verify the implantation status of the micro solder balls in the microholes and confirm that each microhole is correctly filled.

[0121] Example 3:

[0122] This embodiment is applicable to scenarios with extremely high requirements for weld strength and airtightness. The difference between it and Embodiment 1 lies in the following parameters:

[0123] Laser heating section 2: The power of the first laser generator is reduced to 30W, a finer 50μm spot is used, and the scanning speed is reduced to 100mm / s to achieve lower heat input and more precise energy control. The peak surface temperature of the metal wire ring 92 is controlled at 220℃.

[0124] Laser drilling section 4: To obtain smoother hole walls, the repetition rate of the femtosecond laser generator 41 was reduced to 20 kHz, but the single-pulse energy was increased to 35 μJ. Simultaneously, the diffraction optics were replaced with a programmable type to achieve more flexible irregular array drilling. The diameter of the micro-holes 921 was reduced to 300 μm, and the hole spacing was 5 mm.

[0125] Micro-solder ball implantation section 5: Employs 280μm diameter micro-solder balls, with the composition adjusted to low-temperature Sn42Bi58 solder paste (melting point 138℃). The precision spray valve's opening time is accurate to 0.8ms and is equipped with a laser rangefinder to ensure a constant distance between the nozzle and the workpiece, further improving implantation accuracy.

[0126] Laser welding section 6: The welding power is reduced to 80W, and a longer irradiation time (20ms) is used for annealing welding to reduce welding stress and spatter, and obtain denser weld points.

[0127] Example 4:

[0128] This embodiment focuses on improving the overall production cycle time, and its parameters differ from those in Embodiment 1 in the following aspects:

[0129] Laser heating unit 2: The power of the first laser generator is increased to 80W and the scanning speed is increased to 450mm / s, thereby improving efficiency to match a faster production line.

[0130] Laser drilling section 4: The repetition frequency of the femtosecond laser generator 41 is set to 150kHz, and a laser with higher single-pulse energy (50μJ) is used. Ten processing beams are split at one time through diffraction optical elements to achieve simultaneous processing of 10 micro-holes, and the processing cycle of a single micro-hole is shortened to 4ms.

[0131] Laser welding section 6: The power of the third laser generator is set to 300W. A beam array consisting of 10 light spots is generated by a spatial light modulator, the irradiation time is shortened to 6ms, and the synchronous welding of 10 weld points is completed at one time, which doubles the welding efficiency compared with Example 1.

[0132] Material transfer: The entire platform's conveyor system is driven by linear motors, with acceleration increased to 2G, shortening the material transfer time between workstations.

[0133] Thus far, the description of the above embodiments has been provided for illustrative and descriptive purposes. This is not intended to be exhaustive or limiting of the present disclosure. Individual elements or features of particular embodiments are generally not limited to those particular embodiments, but may be interchanged and used in selected embodiments where applicable, even if not specifically shown or described. In many respects, the same elements or features may also be varied. Such variations are not considered a departure from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

[0134] Example embodiments are provided so that this disclosure will become thorough and will fully convey the scope to those skilled in the art. Numerous details, such as examples of specific parts, apparatus, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that the specific details are not required, and the example embodiments may be implemented in many different forms, neither of which should be construed as limiting the scope of this disclosure. In some example embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.

[0135] Technical terms are used herein for the purpose of describing specific exemplary embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a” and “the” as used herein may also refer to the plural forms. The terms “comprising” and “having” are inclusive and therefore specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or additional having of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Unless expressly indicated in order of execution, the method steps, processes, and operations described herein are not to be construed as necessarily requiring performance in the specific order discussed and shown. It should also be understood that additional or optional steps may be employed.

Claims

1. A laser precision welding device for ultra-thin headphone diaphragms, used for welding ultra-thin headphone diaphragms to diaphragm frames, characterized in that, The equipment, along the material processing flow direction, includes, in sequence: a loading section, a laser processing platform, and a unloading section; The laser processing platform integrates a laser heating section, a laser cutting section, a laser drilling section, a micro solder ball implantation section, and a laser welding section. The feeding section is used to precisely place the metal wire coil at a predetermined position on the ultra-thin headphone diaphragm material; the laser heating section is used to scan and heat the metal wire coil, bonding it to the ultra-thin headphone diaphragm; the laser cutting section is used to precisely cut the composite diaphragm material according to the outer contour of the diaphragm frame; the laser drilling section is used to perform through-hole micro-hole processing along the metal wire coil using a femtosecond laser; the micro-solder ball implantation section includes a flipping mechanism, a welding fixture, and a micro-solder ball feeder, used to flip and position the component and implant micro-solder balls into the micro-holes; the laser welding section is used to emit a continuous laser to melt the solder balls in the micro-holes to achieve welding between the metal wire coil and the diaphragm frame; the unloading section is used to collect the welded products. The laser heating section is located after the loading section and includes a first laser generator and a coaxial vision positioning system. Under the drive of the control system, the first laser generator emits a first laser to scan and heat the metal wire ring along its path, so that the metal wire ring is heated and forms an adhesive bond with the ultra-thin headphone diaphragm below. The ultra-thin headphone diaphragm is melted by the heat conducted by the metal wire ring and bonded to the metal wire ring. By controlling the energy input, the heat-affected zone is prevented from spreading to the non-contact area of ​​the diaphragm, ensuring that the ultra-thin headphone diaphragm does not deform or crack. The laser cutting section is located after the laser heating section and includes a second laser generator, which is an ultraviolet picosecond laser. The second laser generator emits a second laser to precisely cut the composite diaphragm material according to the outer contour of the diaphragm frame, so that the ultra-thin headphone diaphragm and the outer contour of the diaphragm frame have the same shape. The laser drilling section is located after the laser cutting section and includes a femtosecond laser generator. After the femtosecond laser beam emitted by the femtosecond laser generator is focused, it performs micro-hole drilling on the surface of the metal wire ring, which is fixed on the diaphragm, along the extension direction of the metal wire ring. The micro-holes penetrate the metal wire ring and the diaphragm material. The diameter of the processed micro-holes is 300μm to 500μm, and the hole spacing is 5mm to 8mm. The micro-solder ball implantation unit includes a micro-solder ball feeder, a flipping mechanism, and a welding fixture; the flipping mechanism is used to flip the drilled diaphragm and the wire coil assembly 180 degrees, so that the wire coil is below and the ultra-thin diaphragm is above; the welding fixture is used to receive the assembly from the flipping mechanism and to precisely position and clamp the diaphragm frame, the flipped ultra-thin diaphragm, and the wire coil in three-dimensional space. A micro solder ball feeder is located above the soldering fixture. The micro solder ball feeder includes a precision spray valve. The micro solder ball feeder provides spherical solder paste with a diameter between 200 μm and 400 μm. Under air pressure control, the precision spray valve sprays individual micro solder balls and implants them into corresponding microholes. The laser welding section is located after the micro solder ball implantation section. It includes a third laser generator that emits a third laser, which is a continuous laser. The beam emitted by the third laser generator irradiates the micro solder ball implanted in the microhole, causing the solder ball to melt instantly and fill the microhole. After cooling, a solder joint is formed, thereby firmly welding the metal wire ring to the diaphragm frame located below.

2. The laser precision welding equipment for an ultra-thin headphone diaphragm according to claim 1, characterized in that: The metal coil is a flat metal coil; the cross-sectional thickness of the metal wire used in the coil is 300μm to 500μm; the cross-sectional width is 1 mm to 1.5 mm. The first laser generator of the laser heating section is a pulsed fiber laser with an output wavelength of 1064nm, a rated average power of 50W to 100W, an adjustable pulse width of 0.1ms to 5.0ms, and a repetition frequency of 1kHz to 20kHz. The coaxial visual positioning system includes a high-resolution CCD camera and a ring light source integrated in the laser optical path, and its positioning accuracy is better than ±10μm. The laser beam is guided and focused by the scanning galvanometer system to form a focused spot with a diameter of 80μm to 150μm. This spot is strictly scanned along the path of the metal wire ring at a scanning speed of 100mm / s to 500mm / s under the drive of the control system. The scanning heating process is as follows: the pulse energy of the first laser is absorbed by the surface of the metal wire ring, causing it to be instantly and locally heated to a predetermined temperature range of 200°C to 400°C. This heat melts the ultra-thin headphone diaphragm in contact with it through thermal conduction and forms an adhesive bond. The control system adjusts the laser power and scanning speed in real time to precisely control the heat-affected zone within the width range of the metal wire ring, ensuring that the temperature rise of the non-contact area of ​​the diaphragm is below its deformation threshold.

3. The laser precision welding equipment for an ultra-thin headphone diaphragm according to claim 1, characterized in that: The second laser generator of the laser cutting section is an ultraviolet picosecond laser with an output wavelength of 355nm, a maximum average power of not less than 10W, a pulse width of less than 15ps, and a repetition frequency that is adjustable in the range of 10kHz to 500kHz. The laser beam output by the second laser generator is guided and focused by an optical path system consisting of a scanning galvanometer system and an f-theta flat field focusing mirror, ultimately forming a focused spot with a diameter of 15μm to 30μm on the processing plane; The optical path system also integrates a coaxial vision positioning module, which is used to identify the cutting path reference marks on the diaphragm material, and its positioning accuracy is better than ±5μm; During the cutting process, the control system controls the focused spot to perform precise cutting along the outer contour path of the diaphragm frame at a scanning speed of 300 mm / s to 1500 mm / s, with a single cutting depth of 50 μm to 150 μm. By controlling the matching of laser power and scanning speed, the depth of the heat-affected zone at the cutting edge is controlled within the range of less than 10 μm. The laser cutting unit also includes a negative pressure dust removal system, with its suction port located near the cutting area, used to remove debris and dust generated during the cutting process in real time, ensuring that the cut surface is clean and free of contamination.

4. The laser precision welding equipment for an ultra-thin headphone diaphragm according to claim 1, characterized in that: The femtosecond laser generator of the laser drilling section has an output wavelength of 1030nm, a maximum single pulse energy of not less than 50μJ, a pulse width of less than 500fs, and a repetition frequency that is adjustable in the range of 10kHz to 200kHz. The femtosecond laser beam passes sequentially through a beam expander, a scanning galvanometer system, and an f-theta focusing lens, ultimately forming a focused spot with a diameter of 20μm to 50μm on the processing plane; The laser drilling section integrates diffractive optical elements in its optical path to split the incident single femtosecond laser beam into multiple parallel and uniformly energetic processing beams, thereby enabling the synchronous processing of multiple micro-holes along the extension direction of the metal wire ring. The control system controls the scanning galvanometer to cooperate with the split beam, so that multiple focused light spots are positioned on the surface of the metal wire ring according to a preset array pattern, and the micro-hole processing position accuracy is better than ±8μm; Each microhole is created by a single pulse impact or a multi-pulse train impact, with the number of pulses in the pulse train ranging from 3 to 10, and the processing cycle of a single microhole is less than 10ms.

5. The laser precision welding equipment for an ultra-thin headphone diaphragm according to claim 1, characterized in that: The micro solder ball feeder of the micro solder ball implantation part provides spherical solder balls with a diameter of 200μm to 400μm, whose composition is Sn96.5Ag3.0Cu0.5 and melting point of 217°C to 220°C; The precision injection valve is piezoelectrically driven and has a precision nozzle with an orifice diameter of 100μm inside. The valve core opening time is controlled between 0.5ms and 2.0ms, and the injection air pressure is between 0.2MPa and 0.6MPa to ensure that a single micro-tin ball is accurately released with each action. The micro-solder ball implantation unit is also equipped with an independent high-resolution visual alignment system with a positioning accuracy better than ±5μm. This system is used to verify the position of the micropores before implantation and to detect the implantation status of the micro-solder balls after implantation.

6. The laser precision welding equipment for an ultra-thin headphone diaphragm according to claim 1, characterized in that: The third laser generator of the laser welding part is a continuous wave fiber laser with an output wavelength of 1080nm and a rated output power of 100W to 300W. The optical path of the laser welding section integrates a spatial light modulator, which is used to phase modulate the wavefront of the continuous laser beam emitted by the third laser generator and convert it into a beam array composed of multiple independent focused light spots. The diameter of each focused spot in the beam array is controlled between 80μm and 150μm, and the arrangement of the spot array is consistent with the distribution of the micro-hole array on the metal wire ring, so as to achieve synchronous welding of multiple implanted micro solder balls. The control system controls the spatial light modulator and the scanning galvanometer to work together so that the beam array covers and irradiates at least 5 micro-holes at a time; the irradiation time for each micro-hole region is 5ms to 20ms, thereby achieving high-efficiency parallel welding.

7. A laser precision welding method for an ultra-thin headphone diaphragm, employing the laser precision welding equipment as described in any one of claims 1 to 6, characterized in that, The method includes the following steps: S1: Feeding and fixing steps: The metal wire ring is precisely placed in the predetermined position on the ultra-thin headphone diaphragm material through the feeding part; S2: Laser heating step: The metal wire ring is scanned and heated by the laser heating unit, so that the metal wire ring is heated and the ultra-thin headphone diaphragm in contact with it is partially melted through heat conduction, forming an adhesive bond. At the same time, the energy input is controlled to ensure that the diaphragm does not deform or break. S3: Laser cutting step: The composite diaphragm material is precisely cut according to the outer contour of the diaphragm frame through the laser cutting unit to form the diaphragm. S4: Laser drilling step: Through the laser drilling section, a femtosecond laser is used to process through-hole micro-holes along the extension direction of the metal wire ring; S5: Flipping and Positioning Steps: The perforated diaphragm and wire ring assembly are flipped 180 degrees using a flipping mechanism, so that the wire ring is located at the bottom; then, the diaphragm frame, the flipped ultra-thin diaphragm, and the wire ring are precisely positioned and clamped in three-dimensional space on the welding fixture. S6: Micro-solder ball implantation step: Through the micro-solder ball implantation part, micro-solder balls with matching diameters are precisely implanted into the micro-holes, with one micro-solder ball implanted into each micro-hole; S7: Laser welding step: Through the laser welding unit, a laser beam is emitted to irradiate the micro-solder ball implanted in the micro-hole, causing it to melt and fill the micro-hole. After cooling, a solder joint is formed, thereby firmly welding the metal wire ring to the diaphragm frame. S8: Unloading step: Remove and collect the finished products after welding through the unloading section.

8. The laser precision welding method for ultra-thin headphone diaphragms according to claim 7, characterized in that: In the S2 laser heating step, a pulsed fiber laser with a wavelength of 1064nm is used to scan along the path of the metal wire ring with a spot diameter of 80μm to 150μm and a scanning speed of 100mm / s to 500mm / s, thereby controlling the instantaneous temperature of the metal wire ring surface between 200℃ and 400℃. In the S4 laser drilling step, a femtosecond laser with a wavelength of 1030nm is used. The laser beam is split by a diffraction optical element to achieve simultaneous processing of multiple micro-holes along the metal wire loop. The diameter of the micro-holes is 300μm to 500μm. In the S7 laser welding step, a continuous laser with a wavelength of 1080nm is used. The laser is modulated into a beam array by a spatial light modulator to achieve synchronous welding of micro solder balls in multiple microholes. The irradiation time of a single solder joint is 5ms to 20ms.

9. The laser precision welding method for ultra-thin headphone diaphragms according to claim 7, characterized in that: Between the S2 laser heating step and the S4 laser drilling step, there is also a step S3a: quality inspection step, which uses a vision system to detect defects in the diaphragm assembly after laser heating and bonding, identify defective products with poor bonding or diaphragm deformation and remove them. After the S6 micro solder ball implantation step and before the S7 laser welding step, there is also a step S6a: implantation verification step, which uses a high-resolution vision system to verify the implantation status of the micro solder balls in the microholes to confirm that each microhole is correctly filled.

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