Microsphere milling method and apparatus based on reverse variable speed drive

By establishing a simulation model and optimizing the time-varying driving velocity function during the microsphere grinding process, the collision problem caused by inconsistent orbital speeds of microspheres at different positions was solved, achieving a more efficient and stable grinding effect and ensuring the surface quality and dimensional consistency of the microspheres.

CN121061750BActive Publication Date: 2026-06-26TSINGHUA UNIVERSITY +1
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Patent Information

Application Number
CN202511413628.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2026-06-26
Estimated Expiration
2045-09-29

AI Technical Summary

Technical Problem

Because the center of the grinding disc has a fixed eccentricity relative to the axis of rotation, the orbital linear velocity of the microspheres at different positions in the annular grinding groove varies. When multiple microspheres are ground simultaneously, they are prone to collisions, resulting in surface scratches, morphological defects, and decreased dimensional consistency.

Method used

By establishing a topological model of the simulation object and importing it into dynamic simulation software for simulation analysis, key working condition data are obtained, the time-varying driving speed function is optimized, and applied to the actual variable speed grinding process to achieve precise control of the grinding process and reduce contact and collision between microspheres.

Benefits of technology

This improved the stability and uniformity of the microsphere grinding process, enhanced grinding efficiency and finished product quality, reduced experimental trial and error costs, and ensured the stable consistency of microsphere surface quality and the accuracy of size distribution.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to a microsphere grinding method and device based on a reverse variable-speed drive, wherein the method comprises the following steps: determining the working conditions and structural parameters of simulation and test microsphere grinding, establishing a topological model of a simulation object, and importing the topological model into a dynamics simulation software; simulation calculation is performed by using the dynamics simulation software, related data of the microspheres are obtained by comparison simulation, and whether the microsphere revolution collision phenomenon exists in the simulation result is judged; if the microsphere revolution collision phenomenon exists, a time-varying driving speed function is traced back, the time-varying driving speed function is applied to actual microsphere grinding test, finally, when the preset relatively stable revolution running conditions among the microspheres are met, a corrected time-varying function is derived, and the corrected time-varying function is applied to actual variable-speed grinding. Therefore, the problem that due to the fixed eccentricity of the grinding disc, the revolution speeds of the microspheres at different positions are different, and when multiple microspheres grind at the same time, the microspheres are prone to collision, thereby causing surface defects and size deviation and the like is solved.
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Description

Technical Field

[0001] This application relates to the field of microsphere grinding technology, and in particular to a microsphere grinding method and apparatus based on reverse speed change drive. Background Technology

[0002] Microspheres are widely used in major scientific and engineering fields such as aerospace and precision guidance, extreme ultraviolet lithography, and ultra-large-scale integrated circuit manufacturing. Their surface morphology accuracy, roughness, and material integrity directly determine the performance limits of cutting-edge equipment and the success or failure of their applications.

[0003] In related technologies, microsphere grinding typically employs methods such as eccentric double-disc reverse uniform speed drive and planetary multi-disc linkage, which can improve the size uniformity and surface finish of microspheres to a certain extent, and enhance processing efficiency.

[0004] However, in related technologies, due to the fixed eccentricity of the center of the grinding disc relative to the axis of rotation, and the upper and lower discs rotating in opposite directions at a constant speed, the orbital linear velocity of the grinding microspheres at different positions in the annular grinding groove varies. When multiple microspheres are placed in the same grinding groove for batch processing, the spheres located in the outer groove area with a faster orbital linear velocity are very likely to catch up with and collide with the spheres located in the inner groove area with a slower orbital linear velocity, resulting in surface scratches, morphological defects, and a decrease in dimensional consistency, which urgently needs to be solved. Summary of the Invention

[0005] This application provides a microsphere grinding method and apparatus based on reverse speed drive to solve the problems in related technologies, where the grinding disc has a fixed eccentricity relative to the axis of rotation, resulting in differences in the orbital linear velocity of the grinding microspheres at different positions in the annular grinding groove. When multiple microspheres are ground simultaneously, they are prone to collision, which causes surface scratches, morphological defects, and reduced dimensional consistency.

[0006] The first aspect of this application provides a microsphere grinding method based on reverse speed-driven grinding, comprising the following steps: determining the working conditions and structural parameters of simulated and experimental microsphere grinding, establishing a topological model of the simulation object, and importing the topological model into dynamic simulation software; defining the mass characteristics of all entities in the model in the dynamic simulation software, setting a rotary pair for the grinding disk, applying a reverse driving force, and setting at least one target force for simulating actual grinding conditions; running simulation calculations using the dynamic simulation software to compare at least one relevant data of the microspheres obtained from the simulation, and determining whether there is a microsphere revolution collision phenomenon in the simulation results based on the at least one relevant data; if the microsphere revolution collision phenomenon exists, backtracking the time-varying driving speed function to apply the time-varying driving speed function to the actual microsphere grinding experiment to obtain revolution speed fluctuations, or to determine whether there is a violent collision phenomenon of the microspheres, or to adjust the surface roughness of the microsphere grinding surface to derive a corrected time-varying function when the microspheres meet the preset relatively stable revolution operation conditions, and applying it to actual speed-driven grinding.

[0007] Through the above technical means, this application embodiment establishes a topological model of the simulation object and imports it into dynamic simulation software for simulation analysis to obtain key working condition data for guiding microsphere grinding experiments. Then, by comparing the simulation and experimental results, a corrected time-varying function is finally obtained and applied to actual variable speed grinding. This enables precise control of the grinding process, improves the stability and uniformity of the microsphere's orbital movement, reduces contact and collision between microspheres, improves grinding efficiency and product quality, and reduces experimental trial and error costs, thereby enhancing the applicability and robustness of the process.

[0008] Optionally, in one embodiment of this application, establishing the topological model of the simulation object and importing it into the dynamics simulation software includes: establishing a simulation model using the 3D modeling software SolidWorks; and importing the simulation model into the multibody dynamics simulation software for initialization preprocessing.

[0009] Through the above technical means, this application embodiment uses the 3D modeling software SolidWorks to establish a simulation model and imports it into the multibody dynamics simulation software for initialization preprocessing. This enables the precise definition of the geometric parameters, mass characteristics and constraints of the model, providing high-precision input conditions for subsequent dynamics simulation. It can effectively shorten the simulation modeling cycle, ensure the consistency between the simulation model and the actual structure, and thus improve the credibility and applicability of the simulation results.

[0010] Optionally, in one embodiment of this application, setting a rotary pair for the grinding disk and applying reverse drive in the dynamic simulation software includes: setting the kinematic pairs required for the relevant entities and applying at least one necessary constraint; defining and applying a time-varying drive speed function for the grinding disk to achieve reverse drive characteristics.

[0011] Through the above technical means, the embodiments of this application set the kinematic pairs required by the relevant entities, apply constraints, and define the time-varying driving speed function of the grinding disk, so as to realize that the reverse driving characteristics can truly reflect the motion state of the grinding disk under different speed conditions. The driving speed function can also be corrected according to the simulation results, thereby optimizing the speed matching relationship of the grinding disk, reducing the collision and slippage of microspheres in the grinding process, and improving grinding uniformity and processing efficiency.

[0012] Optionally, in one embodiment of this application, the time-varying driving speed function is:

[0013] ,

[0014] in, ω u Indicates the rotational speed of the upper plate; ω d Indicates the reference speed of the lower plate; k Indicates the amplitude gain coefficient; t Indicates time; f Indicates the fundamental frequency of velocity fluctuation; Indicates the grinding fluid disturbance term, This indicates the friction compensation amplitude.

[0015] Through the above technical means, the embodiments of this application quantify and analyze factors such as the rotational speed change, the characteristics of the grinding fluid, and the friction force during the grinding process, construct and optimize the time-varying drive speed function, so that the function can dynamically reflect the load change and motion characteristics under actual grinding conditions, thereby driving the simulation model more accurately and providing parameter reference for the actual variable speed grinding process.

[0016] A second aspect of this application provides a microsphere grinding device based on reverse speed-driven grinding, comprising: a setup module for determining the working conditions and structural parameters of simulated and experimental microsphere grinding, establishing a topological model of the simulation object, and importing the topological model into dynamic simulation software; a setting module for defining the mass characteristics of all entities in the model in the dynamic simulation software, setting a rotary pair on the grinding disk, applying a reverse driving force, and setting at least one target force for simulating actual grinding conditions; a judgment module for running simulation calculations using the dynamic simulation software to compare at least one relevant data of the microspheres obtained from the simulation, and judging whether there is a microsphere revolution collision phenomenon in the simulation results based on the at least one relevant data; and a grinding module for, if the microsphere revolution collision phenomenon exists, backtracking the time-varying driving speed function to apply the time-varying driving speed function to the actual microsphere grinding experiment to obtain revolution speed fluctuations, or judging whether there is a violent collision phenomenon of the microspheres, or adjusting the surface roughness of the microsphere grinding surface to derive a corrected time-varying function when the microspheres meet the preset relatively stable revolution operation conditions, and applying it to actual speed-driven grinding.

[0017] Through the above technical means, this application embodiment establishes a topological model of the simulation object and imports it into dynamic simulation software for simulation analysis to obtain key working condition data for guiding microsphere grinding experiments. Then, by comparing the simulation and experimental results, a corrected time-varying function is finally obtained and applied to actual variable speed grinding. This enables precise control of the grinding process, improves the stability and uniformity of the microsphere's orbital movement, reduces contact and collision between microspheres, improves grinding efficiency and product quality, and reduces experimental trial and error costs, thereby enhancing the applicability and robustness of the process.

[0018] Optionally, in one embodiment of this application, the establishment module includes: an establishment unit for establishing a simulation model using the 3D modeling software SolidWorks; and a processing unit for importing the simulation model into multibody dynamics simulation software for initialization preprocessing.

[0019] Through the above technical means, this application embodiment uses the 3D modeling software SolidWorks to establish a simulation model and imports it into the multibody dynamics simulation software for initialization preprocessing. This enables the precise definition of the geometric parameters, mass characteristics and constraints of the model, providing high-precision input conditions for subsequent dynamics simulation. It can effectively shorten the simulation modeling cycle, ensure the consistency between the simulation model and the actual structure, and thus improve the credibility and applicability of the simulation results.

[0020] Optionally, in one embodiment of this application, the setting module includes: a setting unit for setting the kinematic pairs required by the relevant entity and applying at least one necessary constraint; and an application unit for defining and applying a time-varying drive speed function of the grinding disc to achieve reverse drive characteristics.

[0021] Through the above technical means, the embodiments of this application set the kinematic pairs required by the relevant entities, apply constraints, and define the time-varying driving speed function of the grinding disk, so as to realize that the reverse driving characteristics can truly reflect the motion state of the grinding disk under different speed conditions. The driving speed function can also be corrected according to the simulation results, thereby optimizing the speed matching relationship of the grinding disk, reducing the collision and slippage of microspheres in the grinding process, and improving grinding uniformity and processing efficiency.

[0022] Optionally, in one embodiment of this application, the time-varying driving speed function is:

[0023] ,

[0024] in, ω u Indicates the rotational speed of the upper plate; ω d Indicates the reference speed of the lower plate; k Indicates the amplitude gain coefficient; t Indicates time; f Indicates the fundamental frequency of velocity fluctuation; Indicates the grinding fluid disturbance term, This indicates the friction compensation amplitude.

[0025] Through the above technical means, the embodiments of this application quantify and analyze factors such as the rotational speed change, the characteristics of the grinding fluid, and the friction force during the grinding process, construct and optimize the time-varying drive speed function, so that the function can dynamically reflect the load change and motion characteristics under actual grinding conditions, thereby driving the simulation model more accurately and providing parameter reference for the actual variable speed grinding process.

[0026] A third aspect of this application provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the microsphere grinding method based on reverse speed drive as described in the above embodiments.

[0027] A fourth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the microsphere grinding method based on reverse speed drive as described above.

[0028] A fifth aspect of this application provides a computer program product, including a computer program that, when executed, is used to implement the microsphere grinding method based on reverse speed drive as described above.

[0029] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0030] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0031] Figure 1 This is a schematic diagram of the overall structure of the upper and lower grinding discs in a simulation of an embodiment of this application;

[0032] Figure 2 This is a flowchart of a microsphere grinding method based on reverse speed change drive provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the instantaneous revolution of microspheres under variable speed grinding conditions according to an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the instantaneous revolution of microspheres under uniform grinding conditions according to an embodiment of this application;

[0035] Figure 5 This is a schematic diagram comparing the contact forces of microspheres under variable-speed and uniform-speed grinding conditions according to an embodiment of this application.

[0036] Figure 6 This is a schematic diagram comparing the SD (Standard Deviation) values ​​of microspheres ground at different groove curvature radii with those ground at conventional speeds, according to an embodiment of this application.

[0037] Figure 7 This is a schematic diagram of a variable speed time-varying curve function according to an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of the microsphere grinding process based on reverse speed change drive according to one embodiment of this application;

[0039] Figure 9 This is a block diagram of a microsphere grinding device based on reverse speed change drive according to an embodiment of this application;

[0040] Figure 10 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0041] Figure label:

[0042] 101-Upper grinding disc, 102-Lower grinding disc, 103-Microsphere, 104-Reference axis; 10-Microsphere grinding device based on reverse speed change drive; 100-Establishment module, 200-Setting module, 300-Judgment module, 400-Grinding; 1001-Memory, 1002-Processor, 1003-Communication interface. Detailed Implementation

[0043] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0044] The following description, with reference to the accompanying drawings, describes a microsphere grinding method and apparatus based on reverse speed-driven technology according to embodiments of this application. Addressing the technical problems mentioned in the background art, such as the fixed eccentricity of the grinding disc relative to the axis of rotation, leading to differences in the linear velocity of the microspheres at different positions in the annular grinding groove, and the tendency for collisions to occur when multiple microspheres are ground simultaneously, resulting in surface scratches, morphological defects, and decreased dimensional consistency, this application provides a microsphere grinding method based on reverse speed-driven technology. In this method, a topological model of the simulation object is established based on the working conditions and structural parameters of the microsphere grinding, and imported into dynamic simulation software for simulation analysis to obtain key working condition data for guiding microsphere grinding experiments. By comparing simulation and experimental results, a corrected time-varying driving function was obtained and applied to actual variable-speed grinding processes. This effectively improves the stability and uniformity of the grinding process, enhances grinding efficiency and product quality, reduces trial-and-error costs, and is suitable for grinding multiple microspheres simultaneously in orbit. It significantly reduces excessive contact and high-energy collisions between microspheres, lowers the risk of surface damage, and ensures processing accuracy while making the surface quality of microspheres more stable and consistent, with more precise size distribution. It also exhibits stronger robustness and adaptability under different working conditions, thus providing reliable technical support for batch, high-consistency grinding processes. This solves the problem of surface defects and dimensional deviations caused by collisions when multiple microspheres are ground simultaneously due to the fixed eccentricity of the grinding disc and the varying revolution speeds of microspheres at different positions.

[0045] Before describing the microsphere grinding method based on reverse speed drive in the embodiments of this application, the system architecture and application scenarios involved in the embodiments of this application will be described first.

[0046] As a concrete example, such as Figure 1As shown in the embodiment of this application, a specific structure of the grinding disc is provided. The upper grinding disc (or a grooved disc) 101 and the lower grinding disc (a non-grooved disc) 102 are both placed eccentrically on a horizontal parallel axis. The upper grinding disc 101 may include, but is not limited to, V-shaped grooves. Microspheres 103 are disposed in the V-shaped grooves of the upper grinding disc 101 and in contact with the surface of the lower grinding disc 102. The reference shaft 104 passes through the upper and lower grinding discs and serves as the main shaft for the rotation of the grinding disc.

[0047] In the embodiments of this application, ω d This indicates the reference rotation speed of the lower plate, which is usually the system's operating reference and can determine the lower limit of grinding efficiency; ω u This indicates the rotational speed of the upper plate, which is usually a variable speed drive function and is related to the balance of centrifugal force. e u It indicates the axial offset, usually representing the offset between the upper and lower shaft centers, which can cause speed fluctuations; e v This indicates the eccentricity value of the groove, which is usually the amplitude of the periodic disturbance of the V-groove; r b This indicates the orbital radius, which is usually the radius of the microsphere's orbit.

[0048] It should be noted that the above is a grinding disc structure according to an embodiment of this application. In fact, the positions of the grinding discs can be interchanged. As long as there is shaft eccentricity or groove eccentricity between the two discs, such grinding conditions can realize the microsphere grinding method based on reverse speed drive according to the embodiment of this application. The microsphere grinding method based on reverse speed drive provided by the embodiment of this application will be described in detail below.

[0049] Specifically, Figure 2 This is a schematic flowchart of a microsphere grinding method based on reverse speed change drive provided in an embodiment of this application.

[0050] like Figure 2 As shown, the microsphere grinding method based on reverse speed-driven grinding includes the following steps:

[0051] In step S201, the working conditions and structural parameters of the simulated and experimental microsphere grinding are determined, and a topological model of the simulation object is established and imported into the dynamic simulation software.

[0052] The operating parameters can refer to the working conditions set or observed in simulations and actual tests, and may include, but are not limited to, ambient temperature, pressure, and medium viscosity. The structural parameters can be settings related to the geometry of the grinding device and the microspheres themselves, and may include, but are not limited to, the size of the grinding disc, the groove shape, the geometric features of the microspheres, and their initial distribution and orientation. The simulation objects can include, but are not limited to, models related to microsphere grinding such as the grinding disc, the spheres, and the grooves. The dynamic simulation software can be, but is not limited to, ADAMS, RecurDyn, etc.

[0053] It should be noted that the embodiments of this application can focus on building core components such as grinding discs and microsphere clusters to seamlessly import the model into the multibody dynamics simulation software ADAMS.

[0054] This application embodiment can clarify the basic conditions required for the construction of the entire simulation model and the actual experiment based on the working conditions and structural parameters of the simulated and experimental microsphere grinding. Then, a three-dimensional dynamic simulation model of microsphere grinding is established and imported into dynamic simulation software. This model can accurately depict the rotation and revolution of the microspheres, as well as the contact and collision behavior between microspheres and between microspheres and the grinding disc. Combined with the set working conditions parameters, multibody dynamics and particle collision simulation are performed to simulate the motion trajectory, collision frequency and grinding effect of the microspheres. This enables a comprehensive analysis and optimization of the grinding process, which can effectively guide the reasonable setting of actual experimental working conditions and provide theoretical support and technical guarantee for improving the uniformity and quality of microsphere grinding.

[0055] Optionally, in one embodiment of this application, establishing a topological model of the simulation object and importing it into the dynamics simulation software includes: establishing a simulation model using the 3D modeling software SolidWorks; and importing the simulation model into the multibody dynamics simulation software for initialization preprocessing.

[0056] SolidWorks is a professional 3D computer-aided design software developed by Dassault Systèmes. It is widely used in mechanical design, product development, and engineering simulation. It has powerful modeling capabilities, a user-friendly interface, and a wealth of design tools. It can efficiently create 3D models of complex parts and assemblies. 3D models built using SolidWorks can intuitively show the spatial layout and relative positions of the grinding disc and microspheres, and can be easily exported to a common format for subsequent import into dynamic simulation software for dynamic analysis.

[0057] It can be noted that in this embodiment of the application, the simulation model is imported into the multibody dynamics simulation software. In the simulation software, the imported model can be subjected to necessary geometric verification and assembly relationship confirmation to ensure that the position and fit of each component are correct. Pre-initialization processing can be performed, including but not limited to: defining the material properties and mass characteristics of each component, setting the motion parameters of the grinding disc, such as rotation speed, direction and eccentricity, setting the initial position, speed and other initial dynamic conditions, etc.

[0058] This application embodiment imports the simulation model into multibody dynamics simulation software, which can perform kinematic and dynamic analysis, simulate the rotation, revolution and collision behavior of microspheres under the action of the grinding disc, and then calculate the contact force and friction force, predict the motion trajectory of the microspheres and the grinding effect, thereby providing theoretical basis and technical support for actual experiments.

[0059] In step S202, in the dynamic simulation software, the mass characteristics of the entities in all models are defined, a rotary pair is set for the grinding disk and a reverse driving force is applied, and at least one target force is set to simulate the actual grinding conditions.

[0060] The entities in the model may include, but are not limited to, grinding discs, microspheres, bearings, and fixed supports; the mass characteristics may include mass attributes such as mass and center of mass, as well as material properties such as density and elastic modulus.

[0061] In the embodiments of this application, a revolute joint is a common type of mechanical joint that allows two parts to rotate relative to each other about a fixed axis, but restricts other degrees of freedom (such as translation or rotation about other axes). In microsphere grinding, the upper and lower grinding discs need to rotate in opposite directions about their rotational axes at predetermined speeds, and a revolute joint can ensure that the grinding discs can achieve this controlled rotational motion in simulation.

[0062] Reverse driving force refers to a force acting on a moving part in the opposite direction to the driving motion. It typically originates from, but is not limited to, friction, collision reaction forces, media resistance, or internal mechanical resistance of the system. For example, when the grinding disc rotates, friction is generated between the microspheres and the disc surface; this friction can be considered the reverse driving force of the microspheres' motion. Collisions and interactions between microspheres also generate reverse torques, which can affect the rotation and revolution of the microspheres.

[0063] The target force may include, but is not limited to, tangential friction, collision force, and contact force, which may affect the motion state of the microspheres, the grinding effect, and the overall stability of the system.

[0064] As one possible approach, embodiments of this application can define spatial marker points for key locations such as contact points, which can record and analyze the changes in contact force at these key locations, effectively characterizing the uniformity and grinding quality during the microsphere grinding process, thus laying the groundwork for subsequent output of parameters characterizing the uniformity and quality of microsphere grinding.

[0065] The embodiments of this application can accurately simulate the interaction and dynamic behavior between the grinding disc and the microspheres during the microsphere grinding process by reasonably setting parameters such as the rotating pair, the reverse driving force, and the target force. This allows for the realistic reproduction of the microspheres' motion trajectory, force state, and grinding effect under actual working conditions, thereby providing a scientific basis for optimizing the grinding process and improving product quality.

[0066] Optionally, in one embodiment of this application, setting a revolute joint for the grinding disk in dynamic simulation software and applying reverse drive includes: setting the kinematic joint required for the relevant entities and applying at least one necessary constraint; defining and applying a time-varying drive speed function for the grinding disk to achieve reverse drive characteristics.

[0067] The constraint can be an ideal rotating pair with a fixed axis, that is, only allowing two components to rotate around a single geometric axis and completely restricting relative translation; or it can be an actual rotating connection with bearing support, which achieves low-friction rotation through rolling bearings or sliding bearings, while bearing certain radial and axial loads; it can be set by those skilled in the art according to the actual situation, and no specific restrictions are made here.

[0068] The time-varying drive speed function of the grinding disc may include, but is not limited to, parameters such as the lower disc reference speed, revolution radius, revolution speed, and groove eccentricity value.

[0069] Optionally, in one embodiment of this application, the time-varying driving speed function can be expressed as:

[0070] ,

[0071] in, ω u Indicates the rotational speed of the upper plate; ω d Indicates the reference speed of the lower plate; k Indicates the amplitude gain coefficient; t Indicates time; f Indicates the fundamental frequency of velocity fluctuation; Indicates the grinding fluid disturbance term, This indicates the friction compensation amplitude.

[0072] Furthermore, embodiments of this application can yield the following:

[0073] ,

[0074] ,

[0075] ,

[0076] The meaning and explanation of the parameters in the above formula can be seen in Table 1, which is a parameter explanation table.

[0077] Table 1

[0078]

[0079] In this embodiment, a rotary pair is set on the grinding disk and constraints are applied. Then, a reverse time-varying driving speed function is defined and applied to the grinding disk to realize the reverse driving characteristics. This can realistically simulate the physical support and reverse driving force effect, and couple it with the microsphere-disk contact model to obtain the force and motion response of the microsphere. This can provide a reliable theoretical basis and simulation data support for subsequent grinding process optimization, equipment structure improvement and dynamic characteristic analysis.

[0080] In step S203, a simulation calculation is performed using dynamic simulation software to compare at least one relevant data of the microsphere obtained from the simulation, and to determine whether there is a microsphere orbital collision phenomenon in the simulation results based on at least one relevant data.

[0081] The relevant data may include, but are not limited to, the contact and collision force between microspheres, the orbital speed, the contact force, and the coefficient of friction.

[0082] As one possible approach, embodiments of this application can utilize dynamic simulation software to extract the time-varying curves of the microsphere's orbital displacement / velocity recorded at the aforementioned MARKER points. Embodiments of this application can also statistically analyze the collision contact forces between the microsphere and the grinding disk, and between microspheres, to generate a three-dimensional trajectory cloud map of the orbital motion. This can help analyze the grinding uniformity, collision frequency, and trajectory distribution characteristics, thereby providing a scientific basis for optimizing grinding process parameters, adjusting the driving function, and improving grinding quality.

[0083] Furthermore, embodiments of this application can utilize the built-in visualization animation function of ADAMS software to determine whether there is a microsphere revolution collision phenomenon in the simulation results, or can utilize the contact collision force between microspheres. F c The judgment can be set by those skilled in the art according to the actual situation, and no specific restrictions are imposed here.

[0084] In some cases, in embodiments of this application, if the collision force F c In a single cycle, it satisfies F c ≤ C ( CThis can represent 1 / 10 of the original uniform contact collision force average), indicating the existence of a small collision. The embodiments of this application can continue downwards; if the average contact collision force per single cycle... > C If a significant collision occurs, the embodiments of this application should trace back the definition of the speed change function and adjust the parameters of the formula.

[0085] Combination Figure 3 , Figure 4 , Figure 5 The following examples illustrate the revolution of microspheres under different grinding conditions according to the embodiments of this application.

[0086] like Figure 3 As shown in the figure, this application embodiment provides a schematic diagram of the instantaneous revolution of microspheres under variable speed grinding conditions. It can be seen that under the variable speed grinding conditions realized by the function curve derived by the method proposed in this application embodiment, the five microspheres exhibit a periodically spaced position state during the grinding process in the groove, indicating that the microspheres run relatively stably on the track and will not have too much collision interference with adjacent microspheres.

[0087] like Figure 4 As shown in the embodiments of this application, under normal uniform grinding conditions, the microspheres aggregate on the track. Before and after aggregation, the different orbital speeds of the microspheres will result in large contact collision forces, causing large fluctuations in the instantaneous grinding removal rate of the microsphere surface, which may ultimately affect the surface quality.

[0088] like Figure 5 As shown in the figure, this application provides a comparison diagram of microsphere contact force under variable speed and uniform speed grinding conditions. It can be seen that, compared with the uniform speed driving grinding disc condition, the contact force under variable speed grinding conditions is about 1 / 10 of that, and the fluctuation period of the collision force is also reduced by about half.

[0089] The embodiments of this application can utilize simulation software to obtain the trajectory distribution image of microspheres during the grinding process, intuitively observe the changes in the revolution and rotation states of microspheres on the annular grinding track, and then analyze the influence of different driving conditions, eccentricity and rotation speed combinations on the motion law of microspheres, thereby optimizing grinding process parameters, effectively improving the stability and uniformity of the grinding process, reducing random collisions and uneven contact between microspheres, and improving grinding efficiency and product consistency.

[0090] In step S204, if there is a microsphere orbital collision phenomenon, the time-varying driving speed function is traced back to apply the time-varying driving speed function to the actual microsphere grinding test to obtain orbital speed fluctuations, or to determine whether there is a violent collision phenomenon of microspheres, or to adjust the surface roughness of microsphere grinding, so that when the preset relatively stable orbital operation conditions are met between microspheres, the corrected time-varying function is derived and applied to the actual variable speed grinding.

[0091] It can be explained that the preset relatively stable orbital operation conditions can be that the residence time of the microspheres at different positions in the groove is nearly uniform, without obvious concentrated or sparse areas; or the instantaneous change in orbital speed fluctuates within a small range, with a low speed standard deviation. These conditions can be set by those skilled in the art according to the actual situation, and no specific restrictions are imposed here.

[0092] In the embodiments of this application, the retrospective time-varying driving speed function may include, but is not limited to, retrospective adjustment of the pressure index α, the rotational speed index β, and the attenuation coefficient γ; further, the embodiments of this application may cycle the above steps until the parameter adjustment is successful, for example, there is small contact collision between microspheres, the collision period is shortened, etc., and then the time-varying driving speed function is output and applied to actual microsphere grinding tests.

[0093] It should be noted that, due to factors such as equipment error, human error, and grinding slurry concentration error that may exist in the experiment, the time-varying driving function derived from the simulation may not be perfectly applied to the experimental equipment. Therefore, this embodiment of the application again designs a "correction" step, mainly to correct the pressure index. α Speed ​​index β、 Attenuation coefficient γ Three indices are used to compare and analyze the simulation results with experimental data, thereby obtaining optimized time-varying driving functions or process parameters. This ensures that the microspheres revolve more smoothly, collide less, and have a more uniform motion trajectory during the grinding process, providing a reliable basis for actual variable speed grinding.

[0094] In actual implementation, the embodiments of this application can capture video through experimental recordings and analyze the image to determine the fluctuation of the orbital speed. Δω e Or, during the experiment, the experimenter may determine whether there is violent collision of the microspheres, or adjust the surface roughness of the microspheres during grinding. Ra If large collisions occur between microspheres, the embodiments of this application can correct the output time-varying driving velocity function and iterate cyclically until the microspheres revolve relatively stably.

[0095] Furthermore, in the embodiments of this application, if the microspheres revolve relatively smoothly, a corrected time-varying function is derived and applied to actual variable speed grinding.

[0096] Combination Figure 6 , Figure 7 The following examples illustrate the effectiveness of the microsphere grinding method based on reverse speed change drive proposed in this application.

[0097] like Figure 6As shown in the figure, this application embodiment provides a comparison of SD values ​​for microsphere grinding at varying speeds and conventional speeds under different groove curvature radii (SD value is an indicator for evaluating the uniformity of microsphere grinding; the lower the value, the more uniform the microsphere surface grinding), where A: 1.01 r b B: 1.04 r b C:1.07 r b D:1.1 r b As can be seen from the SD values ​​in the figure, the values ​​for the variable speed driving condition are significantly lower than those for the conventional driving condition, which confirms the effectiveness of the method proposed in the embodiments of this application.

[0098] like Figure 7 As shown in the figure, this application provides a variable speed time-varying function curve. It can be seen that the variable speed time-varying function curve presents a time-varying curve similar to a sine function, which indicates that the speed change during the grinding process is periodic and stable. This is beneficial for forming a uniform distribution in the microsphere's motion trajectory, reducing local over-grinding or under-grinding, thereby improving grinding efficiency and product consistency.

[0099] like Figure 8 As shown below, a specific example illustrates the process of microsphere milling based on reverse speed drive in an embodiment of this application. The embodiment of this application may include the following steps:

[0100] In step S801, the working conditions (ambient temperature, pressure, medium viscosity, etc.) and structural parameters (grinding disk size, microsphere diameter, material parameters, etc.) of the simulated and experimental microsphere grinding are determined.

[0101] In step S802, a three-dimensional model of the simulation object is created using SolidWorks 3D modeling software, and the model is imported into ADAMS multibody dynamics simulation software;

[0102] In step S803, the density, mass, moment of inertia, and other mass properties of all components, microspheres, etc. in the model are defined.

[0103] In step S804, the rotary joint of the grinding disc is set, and a reverse time-varying drive speed function is applied to achieve variable speed drive characteristics;

[0104] In step S805, tangential friction, normal contact force, inertial force and other related forces are set to simulate real grinding conditions, and spatial markers are defined at the contact point and key positions for subsequent output of grinding uniformity and quality indicators.

[0105] In step S806, the simulation data is post-processed and compared with the experimental data of the microsphere orbiting in orbit.

[0106] In step S807, it is determined whether a large collision exists: if it does, the speed change function is backtracked and the simulation is repeated; if it does not exist, the test phase is entered.

[0107] In step S808, the time-varying driving speed function is applied to the grinding of the experimental microspheres;

[0108] In step S809, it is determined whether there is dense collision of microspheres: if there is, the parameters are corrected and the experiment is repeated until the collision meets the preset requirements; if there is no collision, the actual variable speed grinding is started.

[0109] In step S810, variable speed drive grinding is performed according to the final optimized parameters to verify the grinding quality and efficiency.

[0110] The microsphere grinding method based on reverse variable speed drive proposed in this application establishes a topological model of the simulation object based on the working conditions and structural parameters of the microsphere grinding, and imports it into dynamic simulation software for simulation analysis to obtain key working condition data to guide the microsphere grinding experiment. Then, by comparing the simulation and experimental results, a corrected time-varying driving function is obtained and applied to the actual variable speed grinding process. This can effectively improve the stability and uniformity of the grinding process, enhance grinding efficiency and product quality, reduce trial and error costs, and is applicable to grinding multiple microspheres simultaneously in orbit. It can significantly reduce excessive contact and high-energy collisions between microspheres, reduce the risk of surface damage, and make the surface quality of microspheres more stable and consistent while ensuring processing accuracy and more precise size distribution. It has stronger robustness and adaptability under different working conditions, thus providing reliable technical support for batch and high-consistency grinding processing.

[0111] Next, referring to the accompanying drawings, a microsphere grinding device based on reverse speed change drive is described according to an embodiment of this application.

[0112] Figure 9 This is a block diagram of a microsphere grinding device based on reverse speed drive according to an embodiment of this application.

[0113] like Figure 9 As shown, the microsphere grinding device 10 based on reverse speed drive includes: a setup module 100, a setting module 200, a judgment module 300, and a grinding module 400.

[0114] The module 100 is used to determine the working conditions and structural parameters of the simulated and experimental microsphere grinding, establish the topological model of the simulation object, and import the topological model into the dynamic simulation software.

[0115] The setting module 200 is used to define the mass characteristics of all entities in the model in the dynamic simulation software, set a rotary pair for the grinding disk and apply a reverse driving force, and set at least one target force to simulate the actual grinding conditions.

[0116] The judgment module 300 is used to run simulation calculations using dynamic simulation software to compare at least one relevant data of the microspheres obtained from the simulation, and to determine whether there is a microsphere revolution collision phenomenon in the simulation results based on at least one relevant data.

[0117] The grinding module 400 is used to backtrack the time-varying driving speed function if there is a microsphere revolution collision phenomenon, so as to apply the time-varying driving speed function to the actual microsphere grinding test, obtain the revolution speed fluctuation, or determine whether there is a violent collision phenomenon of microspheres, or to grind the surface roughness of microspheres. When the preset relatively stable revolution operation conditions are met between microspheres, the corrected time-varying function is derived and applied to the actual variable speed grinding.

[0118] Optionally, in one embodiment of this application, the establishment module 100 includes: an establishment unit and a processing unit.

[0119] The "establishment unit" is used to create simulation models using the 3D modeling software SolidWorks.

[0120] The processing unit is used to import the simulation model into the multibody dynamics simulation software for initialization preprocessing.

[0121] Optionally, in one embodiment of this application, the setting module 200 includes a setting unit and an application unit.

[0122] The setting unit is used to set the kinematic pairs required for the relevant entities and apply at least one necessary constraint.

[0123] An application unit is used to define and apply the time-varying drive speed function of the grinding disc to achieve reverse drive characteristics.

[0124] Optionally, in one embodiment of this application, the time-varying driving speed function is:

[0125] ,

[0126] in, ω u Indicates the rotational speed of the upper plate; ω d Indicates the reference speed of the lower plate; k Indicates the amplitude gain coefficient; t Indicates time; f Indicates the fundamental frequency of velocity fluctuation; Indicates the grinding fluid disturbance term, This indicates the friction compensation amplitude.

[0127] It should be noted that the foregoing explanation of the embodiment of the microsphere grinding method based on reverse speed drive also applies to the microsphere grinding device based on reverse speed drive in this embodiment, and will not be repeated here.

[0128] According to the microsphere grinding device based on reverse speed-driven embodiment of this application, a topological model of the simulation object is established based on the working conditions and structural parameters of microsphere grinding, and imported into dynamic simulation software for simulation analysis to obtain key working condition data to guide microsphere grinding experiments. Then, by comparing the simulation and experimental results, a corrected time-varying driving speed function is obtained and applied to the actual speed-driven grinding process. This can effectively improve the stability and uniformity of the grinding process, improve grinding efficiency and product quality, reduce trial and error costs, and is suitable for grinding multiple microspheres simultaneously in orbit. It can significantly reduce excessive contact and high-energy collisions between microspheres, reduce the risk of surface damage, and make the surface quality of microspheres more stable and consistent while ensuring processing accuracy and more precise size distribution. It has stronger robustness and adaptability under different working conditions, thus providing reliable technical support for batch and high-consistency grinding processing.

[0129] Figure 10 A schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device may include:

[0130] The memory 1001, the processor 1002, and the computer program stored on the memory 1001 and capable of running on the processor 1002.

[0131] When the processor 1002 executes the program, it implements the microsphere grinding method based on reverse speed drive provided in the above embodiments.

[0132] Furthermore, electronic devices also include:

[0133] Communication interface 1003 is used for communication between memory 1001 and processor 1002.

[0134] The memory 1001 is used to store computer programs that can run on the processor 1002.

[0135] The memory 1001 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0136] If the memory 1001, processor 1002, and communication interface 1003 are implemented independently, then the communication interface 1003, memory 1001, and processor 1002 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized into address buses, data buses, control buses, etc. For ease of representation, Figure 10 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0137] Optionally, in a specific implementation, if the memory 1001, processor 1002, and communication interface 1003 are integrated on a single chip, then the memory 1001, processor 1002, and communication interface 1003 can communicate with each other through an internal interface.

[0138] The processor 1002 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of this application.

[0139] This embodiment also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the microsphere grinding method based on reverse speed drive as described above.

[0140] This application also provides a computer program product, including a computer program that can run computer instructions. When the computer instructions are executed by a processor, they implement the microsphere grinding method based on reverse speed drive provided in this application.

[0141] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0142] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0143] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or N executable instructions for implementing custom logic functions or processes, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.

[0144] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0145] It should be understood that the various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, it can be implemented using any one or more of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0146] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0147] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0148] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A microsphere grinding method based on reverse speed-driven grinding, characterized in that, Includes the following steps: The working conditions and structural parameters of the simulated and experimental microsphere grinding were determined, and a topological model of the simulation object was established and imported into the dynamic simulation software. In the dynamic simulation software, the mass characteristics of all entities in the model are defined, a rotary pair is set for the grinding disk and a reverse driving force is applied, and at least one target force is set to simulate the actual grinding conditions. The dynamic simulation software is used to run simulation calculations to compare at least one relevant data of the microspheres obtained from the simulation, and to determine whether there is a microsphere revolution collision phenomenon in the simulation results based on the at least one relevant data. If the microspheres are involved in a revolution collision, the time-varying driving speed function is traced back to apply it to the actual microsphere grinding test to obtain the revolution speed fluctuation, or to determine whether the microspheres are involved in a violent collision. When the microspheres meet the preset relatively stable revolution operation conditions, the corrected time-varying function is derived and applied to the actual variable speed grinding. The step of setting a rotary pair on the grinding disk and applying a reverse driving force includes: setting the kinematic pair required by the relevant entities and applying at least one necessary constraint; defining and applying the time-varying driving speed function of the grinding disk to achieve the reverse driving characteristic; The time-varying driving speed function is: , in, ω u Indicates the rotational speed of the upper plate; ω d Indicates the reference speed of the lower plate; k Indicates the amplitude gain coefficient; t Indicates time; f Indicates the fundamental frequency of velocity fluctuation; Indicates the grinding fluid disturbance term, This indicates the friction compensation amplitude.

2. The method according to claim 1, characterized in that, The process of establishing a topological model of the simulation object and importing it into the dynamics simulation software includes: The simulation model was created using the 3D modeling software SolidWorks. The simulation model is imported into the multibody dynamics simulation software for initialization preprocessing.

3. A microsphere grinding device based on reverse speed-changing drive, characterized in that, include: A module is established to determine the working conditions and structural parameters of the simulated and experimental microsphere grinding, and to establish a topological model of the simulation object, and then import the topological model into the dynamic simulation software; The setting module is used to define the mass characteristics of all entities in the model in the dynamic simulation software, set a rotary pair for the grinding disk and apply a reverse driving force, and set at least one target force to simulate the actual grinding conditions. The judgment module is used to run simulation calculations using the dynamic simulation software to compare at least one relevant data of the microspheres obtained from the simulation, and to determine whether there is a microsphere revolution collision phenomenon in the simulation results based on the at least one relevant data. The grinding module is used to backtrack the time-varying driving speed function if the microspheres are in orbital collision, so as to apply the time-varying driving speed function to the actual microsphere grinding test, obtain the orbital speed fluctuation, or determine whether the microspheres are in violent collision, so as to derive the corrected time-varying function when the preset relatively stable orbital operation conditions are met between the microspheres, and apply it to the actual variable speed grinding. The setting module includes: a setting unit for setting the kinematic pairs required by the relevant entities and applying at least one necessary constraint; and an application unit for defining and applying the time-varying drive speed function of the grinding disk to achieve reverse drive characteristics. The time-varying driving speed function is: , in, ω u Indicates the rotational speed of the upper plate; ω d Indicates the reference speed of the lower plate; k Indicates the amplitude gain coefficient; t Indicates time; f Indicates the fundamental frequency of velocity fluctuation; Indicates the grinding fluid disturbance term, This indicates the friction compensation amplitude.

4. The apparatus according to claim 3, characterized in that, The establishment module includes: Establishment unit, used to create simulation models using the 3D modeling software SolidWorks. The processing unit is used to import the simulation model into the multibody dynamics simulation software for initialization preprocessing.

5. An electronic device, characterized in that, include: The memory, the processor, and the computer program stored in the memory and executable on the processor, the processor executing the program to implement the microsphere grinding method based on reverse speed drive as described in any one of claims 1-2.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that, The program is executed by the processor to implement the microsphere grinding method based on reverse speed drive as described in any one of claims 1-2.

7. A computer program product, comprising a computer program, characterized in that, The computer program is executed to implement the microsphere grinding method based on reverse speed drive as described in any one of claims 1-2.

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