Self-regulating buffer detection landing device based on temperature control multi-thread shape memory

Abstract

The application discloses a self-regulating buffer detection landing device based on temperature control multi-thread shape memory, relates to the technical field of moon detection landing devices, and comprises a detector main body, an elastic buffer system, a secondary lander main body, a hydraulic buffer system, a primary lander main body and a temperature control device. Through the cooperation of the temperature control multi-thread self-regulating shape memory primary and secondary lander main body, the temperature control multi-thread self-regulating shape memory elastic buffer system, the temperature control multi-thread self-regulating shape memory hydraulic buffer system and the landing feet, the moon detection landing device has strong landing buffer performance, attitude control capability and shape recoverability, and in the buffer process, the attitude can be adjusted through the temperature control device.

Description

Technical Field

[0001] This invention relates to the field of lunar exploration and landing device technology, specifically to a self-regulating buffer exploration and landing device based on temperature-controlled multi-threaded shape memory. Background Technology

[0002] With the continuous advancement of space technology, human exploration of the Moon has become more in-depth. As one of Earth's closest celestial bodies, the Moon holds many unknown mysteries and scientific value. However, in the entire lunar exploration mission, the landing phase is one of the most challenging and risky stages. Traditional lunar landing devices suffer from insufficient adaptability and weak autonomous control capabilities, thus requiring more advanced technologies to improve the success rate and efficiency of exploration missions.

[0003] Landing conditions on the lunar surface are relatively complex, including rugged terrain and numerous craters, posing challenges to the design and operation of the lander. The lander must overcome gravity to cushion its impact, decelerate, and land stably, while protecting its onboard scientific instruments and equipment from damage. Impacts and vibrations during landing can affect the integrity of the payload, thus impacting subsequent scientific experiments and data acquisition. Therefore, designing an effective cushioning structure is crucial to ensuring a safe landing and protecting the payload from damage.

[0004] Furthermore, the rough terrain of the lunar surface increases the challenge of maintaining a stable attitude for the lander after landing. The lander needs to have good self-regulating stabilization capabilities to cope with possible tilting and imbalances, ensuring that the payload can operate normally and transmit data.

[0005] Therefore, a self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory is proposed to solve the above problems. Summary of the Invention

[0006] To achieve the above objectives, the present invention provides the following technical solution: a self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory, comprising a detector body, an elastic buffer system, a secondary lander body, a hydraulic buffer system, a main lander body, and a temperature control device. The main lander body and the secondary lander body have identical structures, each including a slidingly connected outer cylinder rod and a stamping rod. The outer cylinder rod contains two temperature-controlled multi-threaded hinged auxiliary vibration damping structures and a honeycomb buffer structure, with the honeycomb buffer structure located between the two temperature-controlled multi-threaded hinged auxiliary vibration damping structures. An isolation pad is provided between the honeycomb buffer structure and the temperature-controlled multi-threaded hinged auxiliary vibration damping structure. The temperature control device includes a lander temperature control device attached to the outside of the temperature-controlled multi-threaded hinged auxiliary vibration damping structure. The temperature-controlled multi-threaded hinged auxiliary vibration damping structure and the honeycomb buffer structure are made of nickel-titanium based materials.

[0007] The outer cylindrical rod of the secondary lander is rotatably connected to the probe body, the ram rod of the secondary lander is rotatably connected to the outer cylindrical rod of the main lander, the ram rod of the main lander is connected to the landing feet through a limit bearing, an elastic buffer system is provided between the probe body and the secondary lander body, and a hydraulic buffer system is provided between the secondary lander body and the main lander body.

[0008] Preferably, the honeycomb buffer structure is one of the following: bow-shaped wave buffer structure, spiral cross buffer structure, hinge-reinforced honeycomb buffer structure, gradient Miura folded buffer structure, or orthogonal isotropic cross buffer structure.

[0009] Preferably, the elastic buffer system includes an elastic buffer main cylinder and an elastic buffer telescopic rod. The elastic buffer main cylinder also has a temperature-controlled multi-threaded hinged auxiliary vibration damping structure inside. The elastic buffer telescopic rod is slidably connected to the elastic buffer main cylinder via a telescopic rod lubricator. An auxiliary vibration damping connector is fixedly installed on the outside of the elastic buffer main cylinder. A temperature-controlled multi-threaded auxiliary vibration damper is fixedly installed on the auxiliary vibration damping connector. A secondary auxiliary vibration damping device is installed at the end of the temperature-controlled multi-threaded auxiliary vibration damper away from the auxiliary vibration damping connector. The secondary auxiliary vibration damping device includes a secondary auxiliary vibration damping connection. The system includes a device, a secondary auxiliary vibration damping platform, and a pressure sensor. The secondary auxiliary vibration damping connector is fixedly connected to the temperature-controlled multi-threaded auxiliary vibration damper and the elastic buffer telescopic rod. The secondary auxiliary vibration damping connector contacts the secondary auxiliary vibration damping platform with an arc-shaped buffer plate through a buffer groove. A pressure sensor is attached to the end of the secondary vibration damping platform away from the secondary auxiliary vibration damping connector. The pressure sensor is fixedly connected to the elastic buffer telescopic rod. The elastic buffer telescopic rod is rotatably connected to the detector body through a rotating bearing. The elastic buffer main cylinder is rotatably connected to the outer cylinder of the auxiliary lander body through a rotating bearing.

[0010] The temperature control equipment also includes an elastic buffer temperature control device, which is located on the outer wall of the elastic buffer main cylinder and connected to the auxiliary vibration damping connector.

[0011] Preferably, the hydraulic buffer system includes a hydraulic buffer main cylinder, a hydraulic buffer telescopic rod, a pressure sensor connector with an integrated pressure sensor, a temperature-controlled multi-threaded spring-type auxiliary damper, and an auxiliary damping hydraulic unit. The pressure sensor connector is fixed to the hydraulic buffer telescopic rod with bolts. One end of the temperature-controlled multi-threaded spring-type auxiliary damper is fixedly connected to the hydraulic buffer main cylinder, and the other end is fixedly connected to the pressure sensor connector. An auxiliary damping hydraulic unit is provided at the end of the hydraulic buffer telescopic rod near the hydraulic buffer main cylinder. The auxiliary damping hydraulic unit includes a hydraulic buffer auxiliary telescopic rod, a hydraulic main cylinder, a hydraulic secondary cylinder, and a hydraulic buffer auxiliary rod cap. The auxiliary damping hydraulic unit is filled with a non-Newtonian fluid. The hydraulic buffer telescopic rod slides with the hydraulic main cylinder, and the hydraulic buffer auxiliary telescopic rod slides with the hydraulic secondary cylinder. The end of the hydraulic buffer auxiliary telescopic rod that protrudes from the hydraulic buffer auxiliary rod cap is fixedly connected to the hydraulic buffer telescopic rod. The hydraulic buffer main cylinder is rotatably connected to the outer cylinder of the secondary lander body, and the hydraulic buffer telescopic rod is rotatably connected to the outer cylinder of the main lander body.

[0012] The temperature control equipment also includes a hydraulic buffer temperature control device, which is installed on the hydraulic buffer main cylinder. The hydraulic buffer temperature control device includes a temperature control power supply and a temperature controller. The temperature control multi-threaded spring-type auxiliary shock absorber is made of nickel-titanium based material.

[0013] Preferably, the landing foot is provided with a ring-shaped buffer structure at the bottom, and the ring-shaped buffer structure adopts a hollow gradient hollow design.

[0014] As a preferred design, the steps for the bow-shaped wave buffer structure are as follows:

[0015] Draw an ellipse with a major axis of 15 mm and a minor axis of 4.5 mm on the top reference plane. Draw an outline line at equidistant intervals of 0.75 mm on the outside of the ellipse to form an arched wall thickness. Cut half of the sketch through the major axis of the ellipse and use the tangent of the ellipse perpendicular to the minor axis as the mirror axis to mirror the cut sketch to form a double arched section.

[0016] Execute the Stretch Boss command, select symmetrical stretching on both sides, and generate an arc-shaped wave buffer unit solid with a thickness of 0.9mm. Then rotate the arc-shaped wave buffer unit around the mirror axis once, with a rotation angle of 90 degrees, to generate an arc-shaped wave buffer structure unit.

[0017] The bow-shaped wave buffer structure units are arrayed along the x-axis and y-axis with an array interval of 9 mm. Then, the arrayed structure is arrayed along the z-axis with an array interval of 15 mm. Multiple bow-shaped wave buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod, thus obtaining the bow-shaped wave buffer structure.

[0018] As a preferred design, the steps for the spiral cross buffer structure are as follows:

[0019] Draw two 22.5mm×1.5mm rectangles on the right reference plane and make them intersect at an angle. The long side of the rectangle makes an angle of 45° with the xoy plane to form a cross skeleton.

[0020] Execute the Stretch Boss command to generate a spiral cross unit solid with a thickness of 0.75mm. Rotate the spiral cross unit around a reference axis that passes through the center of the solid and is parallel to the z-axis once, with a rotation angle of 90 degrees, to generate a spiral cross buffer structure unit.

[0021] The spiral cross buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 12.75 mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 15 mm. Multiple spiral cross buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. With the center of the arrayed solid as the center, the outer part of the cylinder is cut off with a circle of diameter d, which corresponds to the size of the outer cylinder rod, to obtain the spiral cross buffer structure.

[0022] As a preferred design, the steps for the hinge-enhanced honeycomb buffer structure are as follows:

[0023] Draw an isosceles trapezoid on the front reference plane. The shorter base of the isosceles trapezoid is 9mm, the longer base is 18mm, and the base angle is 45°. Mirror the sketch with the shorter base as the axis of symmetry, and then draw the outline at equidistant intervals of 1.5mm along the inside of the trapezoid.

[0024] Execute the Stretch Boss command to generate a hinge reinforcement unit solid with a thickness of 0.75mm. Then rotate the hinge reinforcement unit around the reference axis 2 that passes through the center of the solid and is parallel to the z-axis once, with a rotation angle of 90 degrees, to generate a hinge-reinforced honeycomb buffer structure unit.

[0025] The hinge-reinforced honeycomb buffer structure units are arrayed along the x-axis and y-axis with an array spacing of 18.9 mm. Then, the arrayed structure is arrayed along the z-axis with an array spacing of 10 mm. Multiple hinge-reinforced honeycomb buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod, thus obtaining the hinge-reinforced honeycomb buffer structure.

[0026] As a preferred design, the steps for the gradient Miura folded buffer structure are as follows:

[0027] Draw a rectangle with a length of 25.5mm and a width of 2.25mm on the front reference plane, and use the extrude boss function to extrude the rectangle by 2.25mm to generate a cuboid solid.

[0028] The cuboid is rotated three times around a reference axis three that passes through the center of the solid and is perpendicular to the yoz plane, with a rotation angle of 45 degrees, to generate a single gradient Miura unit solid. Then, the gradient Miura unit is rotated three times around the reference axis four, with a rotation angle of 45 degrees, to generate a gradient Miura folded buffer structure unit.

[0029] The gradient Miura folded buffer structure units are arrayed along the x-axis, y-axis, and z-axis directions, with an array spacing of 15 mm. Multiple gradient Miura folded buffer structure units are distributed in a three-dimensional mesh array. Finally, a ring cut is made along the z-axis direction. With the center of the arrayed solid as the center, the outer part of the cylinder is cut off with a circle of diameter d, which corresponds to the size of the outer cylinder rod, to obtain the gradient Miura folded buffer structure.

[0030] As a preferred design, the design steps for an orthogonal isotropic cross-shaped buffer structure are as follows:

[0031] First, draw two mutually perpendicular cuboids with square cross sections and a length of 15mm to obtain a cross-shaped orthogonal isotropic cross buffer unit entity. Rotate the orthogonal isotropic cross buffer unit around a reference axis that passes through the center of the entity and is parallel to the z-axis once, with a rotation angle of 90 degrees, to obtain an orthogonal isotropic cross buffer structure unit with a length of 15mm, a width of 15mm, and a height of 15mm.

[0032] The orthogonal isotropic cross-shaped buffer structure units are arrayed along the x-axis, y-axis, and z-axis directions, with an array spacing of 15 mm. Multiple orthogonal isotropic cross-shaped buffer structure units are distributed in a three-dimensional grid array. Finally, a ring-shaped cut is made along the z-axis direction. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod, thus obtaining the orthogonal isotropic cross-shaped buffer structure.

[0033] The present invention has the following beneficial effects:

[0034] This invention enables the lunar exploration and landing device to have strong landing cushioning performance, attitude control capability, and shape recoverability through the combined action of the temperature-controlled multi-threaded self-adjusting shape memory main and auxiliary landers, the temperature-controlled multi-threaded self-adjusting shape memory elastic buffer system, the temperature-controlled multi-threaded self-adjusting shape memory hydraulic buffer system, and the landing feet.

[0035] This invention, through the cooperation of multiple sets of buffers, enables the lander body to have multiple adjustable attitude positions during the landing process using a temperature-controlled multi-threaded self-adjusting shape memory alloy. This allows the lunar probe lander to control its attitude according to different terrains, ensuring a stable landing.

[0036] This invention employs a temperature-controlled multi-threaded shape memory alloy as the material for the buffer structure components in the landing device. The shape memory alloy itself possesses high elasticity and a shape memory effect, and after heat treatment, it exhibits multi-threaded temperature-controlled deformation capabilities. This enhances the impact energy absorption capacity of the landing device, making the initial attitude of the components controllable and enabling automatic retraction and release of the landing device. Furthermore, the use of shape memory alloys allows the landing device to recover to a desired shape under the control of the temperature control system after undergoing plastic deformation due to excessive impact energy during landing. This is beneficial for the safe landing and attitude stability of the lunar probe, as well as the subsequent recovery and reuse of the structure.

[0037] The present invention designs the internal structure of the landing device as a spring configuration, a hollow hinge structure and a honeycomb structure, and the landing foot design includes a gradient hollow configuration. On the one hand, this enhances the impact resistance of the landing device, and on the other hand, it reduces the overall weight of the landing device.

[0038] The auxiliary vibration damping hydraulic device of this invention is filled with non-Newtonian fluid, which on the one hand reduces the overall vibration during the extension of the landing device, and on the other hand enhances the impact resistance of the landing device.

[0039] This invention overcomes the shortcomings of traditional landing devices in terms of attitude control flexibility and ease of use, and has strong attitude control capability and shock resistance of the landing device itself.

[0040] The multi-configuration design of the buffer structure breaks through the limitations of the traditional single-cell design: through topology optimization of five heterogeneous buffer configurations, precise matching of impact conditions and structural performance is achieved. The bow-shaped wave buffer structure improves the low-frequency vibration isolation efficiency by 40%; the spiral cross buffer structure improves multi-directional impact resistance to quasi-isotropic through composite deformation; the directional folding characteristics of the hinged honeycomb in the hinge-reinforced honeycomb buffer structure solve the problem of structural irreversibility after strong impact, achieving a cycle life of tens of thousands of cycles; the gradient Mipu folding buffer structure achieves 70% energy graded absorption and reduces peak load by 40%; the orthogonal isotropic cross buffer structure breaks through directional limitations, achieving domain isotropicity (XYZ performance difference <2%) to solve the stress concentration problem of the annular sleeve, reducing impact acceleration by 45% in vertical landing scenarios. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0042] Figure 2This is a schematic diagram of the structure of the stamping rod and the outer cylinder rod in this invention;

[0043] Figure 3 This is a schematic diagram of the temperature-controlled multi-threaded hinged auxiliary vibration damping structure and the honeycomb buffer structure in this invention;

[0044] Figure 4 This is a schematic diagram of the auxiliary vibration damping connector and the temperature-controlled multi-threaded auxiliary vibration damper in this invention;

[0045] Figure 5 This is a schematic diagram of the elastic buffer telescopic rod and the telescopic rod lubricator in this invention;

[0046] Figure 6 This is a schematic diagram of the secondary auxiliary vibration damping connector, the secondary auxiliary vibration damping platform, and the pressure sensor in this invention;

[0047] Figure 7 This is a schematic diagram of the temperature-controlled multi-threaded spring-type auxiliary vibration damper and pressure-sensing connector in this invention;

[0048] Figure 8 This is a schematic diagram of the hydraulic buffer main cylinder and the hydraulic buffer telescopic rod in this invention;

[0049] Figure 9 This is a schematic diagram of the temperature control power supply and temperature controller in this invention;

[0050] Figure 10 This is a schematic diagram of the hydraulic buffer auxiliary telescopic rod, hydraulic main cylinder, and hydraulic auxiliary cylinder in this invention;

[0051] Figure 11 This is a schematic diagram of the landing foot structure in this invention;

[0052] Figure 12 This is a schematic diagram of the annular buffer structure in this invention;

[0053] Figure 13 This is a three-dimensional structural diagram of the temperature-controlled multi-threaded hinged auxiliary vibration reduction structure in this invention;

[0054] Figure 14 This is a schematic diagram of the temperature control device in this invention;

[0055] Figure 15 This is a schematic diagram of the bow-shaped wave buffer structure in this invention;

[0056] Figure 16 This is a schematic diagram of the spiral cross buffer structure in this invention;

[0057] Figure 17 This is a schematic diagram of the hinge-enhanced honeycomb buffer structure in this invention;

[0058] Figure 18 This is a schematic diagram of the gradient Miura folded buffer structure in this invention;

[0059] Figure 19 This is a schematic diagram of the orthogonal isotropic cross-shaped buffer structure in this invention.

[0060] In the diagram: 1. Detector body; 2. Elastic buffer system; 21. Rotary bearing; 22. Elastic buffer main cylinder; 23. Auxiliary vibration damping connector; 24. Temperature-controlled multi-threaded auxiliary vibration damper; 25. Secondary auxiliary vibration damping device; 251. Secondary auxiliary vibration damping connector; 252. Secondary auxiliary vibration damping platform; 253. Pressure sensor; 26. Elastic buffer telescopic rod; 27. Elastic buffer temperature control device; 29. ​​Telescopic rod lubricator; 4. Hydraulic buffer system; 41. Hydraulic buffer main cylinder; 42. Temperature-controlled multi-threaded spring-type auxiliary vibration damper 43, Pressure sensor connector; 44, Hydraulic buffer telescopic rod; 45, Hydraulic buffer temperature control device; 451, Temperature control power supply; 452, Temperature controller; 461, Hydraulic buffer auxiliary telescopic rod; 462, Hydraulic main cylinder; 463, Hydraulic auxiliary cylinder; 464, Hydraulic buffer auxiliary rod cap; 51, Stamping rod; 52, Outer cylinder rod; 53, Temperature control multi-threaded hinged auxiliary vibration reduction structure; 54, Honeycomb buffer structure; 55, Lander temperature control device; 56, Isolation pad; 6, Landing foot; 61, Limit bearing; 62, Annular buffer structure. Detailed Implementation

[0061] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0062] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0063] Embodiments of the present invention:

[0064] like Figures 1 to 13As shown, a self-regulating buffer landing device based on temperature-controlled multi-threaded shape memory includes a probe body 1, an elastic buffer system 2, a secondary lander body, a hydraulic buffer system 4, a main lander body, and temperature control equipment. The main lander body and the secondary lander body have identical structures, both including a slidingly connected outer cylinder rod 52 and a stamping rod 51. The outer cylinder rod 52 contains two temperature-controlled multi-threaded hinged auxiliary vibration damping structures 53 and a honeycomb buffer structure 54, with the honeycomb buffer structure 54 located between the two temperature-controlled multi-threaded hinged auxiliary vibration damping structures 53. An isolation pad 56 is provided between the buffer structure 54 and the temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53. The temperature control equipment includes a lander temperature control device 55 attached to the outside of the temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53. The temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53 and the honeycomb buffer structure 54 are made of nickel-titanium-based material and are temperature-controlled multi-threaded shape memory alloy structures. The nickel-titanium-based material has multi-temperature-range shape programming capability after heat treatment. The end of the outer cylinder rod 52 away from the stamping rod 51 is closed, and its interior is used to accommodate external impact loads. The outer cylinder rod 52 is filled with thermal insulation material.

[0065] The outer cylindrical rod 52 of the auxiliary lander body is rotatably connected to the probe body 1. The stamping rod 51 of the auxiliary lander body is rotatably connected to the outer cylindrical rod 52 of the main lander body. The stamping rod 51 of the main lander body is connected to the landing foot 6 through the limit bearing 61, and multi-angle torsion locking is achieved by 15° indexing and locking. An elastic buffer system 2 is provided between the probe body 1 and the auxiliary lander body, and a hydraulic buffer system 4 is provided between the auxiliary lander body and the main lander body.

[0066] like Figures 15 to 19 As shown, the honeycomb buffer structure 54 adopts one of the following five optimized configurations:

[0067] Bow-shaped wave buffer structure (such as) Figure 15 The bow-shaped units are arranged radially, absorbing 35%–40% of the impact energy through large deflection bending deformation. They are adapted to the circumferential force flow of the annular sleeve, improving low-frequency vibration isolation efficiency by 40%. The design steps of the bow-shaped wave buffer structure are as follows:

[0068] Draw an ellipse with a major axis of 15 mm and a minor axis of 4.5 mm on the top reference plane. Draw an outline line at equidistant intervals of 0.75 mm on the outside of the ellipse to form an arched wall thickness. Cut half of the sketch through the major axis of the ellipse and use the tangent of the ellipse perpendicular to the minor axis as the mirror axis to mirror the cut sketch to form a double arched section.

[0069] Execute the Stretch Boss command, select symmetrical stretching on both sides, and generate an arc-shaped wave buffer unit solid with a thickness of 0.9mm. Then rotate the arc-shaped wave buffer unit around the mirror axis once, with a rotation angle of 90 degrees, to generate an arc-shaped wave buffer structure unit.

[0070] The bow-shaped wave buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 9mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 15mm. Multiple bow-shaped wave buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod 52, thus obtaining the bow-shaped wave buffer structure.

[0071] Spiral cross buffer structure ( Figure 16 The spiral rod simultaneously induces bending and torsional deformation, achieving an energy absorption density of 25–30 MJ / m³ per unit volume, reducing multi-directional impact peak load by 15%. The design steps for the spiral cross buffer structure are as follows:

[0072] Two 22.5mm×1.5mm rectangles are drawn on the right reference plane and intersected at an angle. The long side of the rectangle makes an angle of 45° with the xoy plane to form a cross skeleton (the cross skeleton is then rotated around the axis and arrayed in three dimensions to form a spatial structure with a spiral pre-deformation tendency).

[0073] Execute the Stretch Boss command to generate a spiral cross unit solid with a thickness of 0.75mm (the inclined lines form a spiral pre-deformed structure). Rotate the spiral cross unit around the reference axis that passes through the center of the solid and is parallel to the z-axis once, with a rotation angle of 90 degrees, to generate a spiral cross buffer structure unit.

[0074] The spiral cross buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 12.75mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 15mm. Multiple spiral cross buffer structure units are distributed in a three-dimensional grid array. After arraying, the spiral cross buffer structure units are ensured to be aligned at the center (to improve the consistency of multi-directional impact resistance). Finally, a ring cut is made along the z-axis direction. With the center of the arrayed solid as the center, the outer part of the cylinder is cut off with a circle of diameter d, which corresponds to the size of the outer cylinder rod 52, to obtain the spiral cross buffer structure.

[0075] Hinge-enhanced honeycomb cushioning structure ( Figure 17 The nodes are locally thinned to form flexible hinges, guiding orderly folding deformation. The compressive strength reaches over 60% of that of solid alloys. The directional folding characteristics of the hinge honeycomb in the hinge-reinforced honeycomb buffer structure solve the problem of irreversible structure after strong impact, and the cycle life reaches tens of thousands of cycles. The design steps of the hinge-reinforced honeycomb buffer structure are as follows:

[0076] Draw an isosceles trapezoid on the front reference plane. The shorter base of the isosceles trapezoid is 9mm, the longer base is 18mm, and the base angle is 45°. Mirror the sketch with the shorter base as the axis of symmetry, and then draw the outline at equidistant intervals of 1.5mm along the inside of the trapezoid.

[0077] Execute the Stretch Boss command to generate a hinge reinforcement unit solid with a thickness of 0.75mm. Then rotate the hinge reinforcement unit around the reference axis 2 that passes through the center of the solid and is parallel to the z-axis once, with a rotation angle of 90 degrees, to generate a hinge-reinforced honeycomb buffer structure unit.

[0078] The hinge-reinforced honeycomb buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 18.9 mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 10 mm. Multiple hinge-reinforced honeycomb buffer structure units are distributed in a three-dimensional grid array to form a honeycomb structure with interconnected nodes (to ensure orderly folding and recovery after strong impact). Finally, a ring cut is made along the z-axis direction. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod 52 to obtain the hinge-reinforced honeycomb buffer structure.

[0079] Gradient Miura folded buffer structure ( Figure 18 The inner ring folding angle (soft energy absorption zone) and outer ring folding angle (breakdown protection zone) are used for graded energy dissipation, achieving 70% graded energy absorption and reducing peak load by 40%. The design steps of the gradient Miura folding buffer structure are as follows:

[0080] Draw a rectangle with a length of 25.5mm and a width of 2.25mm on the front reference plane, and use the extrude boss function to extrude the rectangle by 2.25mm to generate a cuboid solid.

[0081] The cuboid is rotated three times around a reference axis three that passes through the center of the solid and is perpendicular to the yoz plane, with a rotation angle of 45 degrees, to generate a single gradient Miura unit solid. Then, the gradient Miura unit is rotated three times around the reference axis four, with a rotation angle of 45 degrees, to generate a gradient Miura folded buffer structure unit.

[0082] The gradient Miura folded buffer structure units are arrayed along the x-axis, y-axis, and z-axis directions, with an array spacing of 15 mm. Multiple gradient Miura folded buffer structure units are distributed in a three-dimensional mesh array. Finally, a ring cut is made along the z-axis direction. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod 52, thus obtaining the gradient Miura folded buffer structure.

[0083] Orthogonal isotropic cross-shaped buffer structure ( Figure 19The central node extends into six directions of equal length as a rod, with any cross-sectional view showing a cross shape, achieving uniform stress distribution throughout the entire domain within the annular sleeve; the design steps for the orthogonal isotropic cross-shaped buffer structure are as follows:

[0084] First, draw two mutually perpendicular cuboids with square cross sections and a length of 15mm to obtain a cross-shaped orthogonal isotropic cross buffer unit entity. Rotate the orthogonal isotropic cross buffer unit around a reference axis that passes through the center of the entity and is parallel to the z-axis once, with a rotation angle of 90 degrees, to obtain an orthogonal isotropic cross buffer structure unit with a length of 15mm, a width of 15mm, and a height of 15mm.

[0085] The orthogonal isotropic cross-shaped buffer structure units are arrayed along the x-axis, y-axis, and z-axis directions, with an array spacing of 15 mm. Multiple orthogonal isotropic cross-shaped buffer structure units are distributed in a three-dimensional grid array. Finally, a ring-shaped cut is made along the z-axis direction. With the center of the arrayed solid as the center, a circle with a diameter of d is cut off the outer part of the cylinder. d corresponds to the size of the outer cylinder rod 52, thus obtaining the orthogonal isotropic cross-shaped buffer structure.

[0086] like Figure 1 , Figures 4 to 6 As shown, the elastic buffer system 2 includes an elastic buffer main cylinder 22 and an elastic buffer telescopic rod 26. The elastic buffer main cylinder 22 also has a temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53 inside. The elastic buffer telescopic rod 26 is slidably connected to the elastic buffer main cylinder 22 via a telescopic rod lubricator 29. The telescopic rod lubricator 29 isolates the elastic buffer main cylinder 22 and the elastic buffer telescopic rod 26. The temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53 contacts the elastic buffer telescopic rod 26. An auxiliary vibration damping connector 23 is fixedly installed on the outside of the elastic buffer main cylinder 22. A temperature-controlled multi-threaded auxiliary vibration damper 24 is fixedly installed on the auxiliary vibration damping connector 23. A secondary auxiliary vibration damping device 25 is installed at the end of the temperature-controlled multi-threaded auxiliary vibration damper 24 away from the auxiliary vibration damping connector 23. The secondary auxiliary vibration damping device 25... 5 includes a secondary auxiliary vibration damping connector 251, a secondary auxiliary vibration damping platform 252, and a pressure sensor 253. The secondary auxiliary vibration damping connector 251 is fixedly connected to the temperature-controlled multi-threaded auxiliary vibration damper 24. The secondary auxiliary vibration damping connector 251 is fixed to the elastic buffer telescopic rod 26 by bolts. The secondary auxiliary vibration damping connector 251 contacts the secondary auxiliary vibration damping platform 252 with an arc-shaped buffer plate through a buffer groove. The pressure sensor 253 is bonded to the end of the secondary auxiliary vibration damping platform 252 away from the secondary auxiliary vibration damping connector 251. The pressure sensor 253 is fixedly connected to the elastic buffer telescopic rod 26. The elastic buffer telescopic rod 26 is rotatably connected to the detector body 1 through a rotating bearing 21. The elastic buffer main cylinder 22 is rotatably connected to the outer cylinder 52 of the auxiliary lander body through a rotating bearing 21.

[0087] The temperature control device also includes an elastic buffer temperature control device 27, which is located on the outer wall of the elastic buffer main cylinder 22 and connected to the auxiliary vibration damping connector 23; the temperature control multi-threaded auxiliary vibration damper 24 is made of nickel-titanium based material and is a temperature control multi-threaded shape memory alloy structure. The nickel-titanium based material has multi-temperature domain shape programming capability after heat treatment.

[0088] like Figure 1 , Figures 7 to 10 As shown, the hydraulic buffer system 4 includes a hydraulic buffer main cylinder rod 41, a hydraulic buffer telescopic rod 44, a pressure sensing connector 43 integrating a pressure sensor, a temperature-controlled multi-threaded spring-type auxiliary vibration damper 42, and an auxiliary vibration damping hydraulic device. The pressure sensing connector 43 is fixed to the end of the hydraulic buffer telescopic rod 44 by bolts. One end of the temperature-controlled multi-threaded spring-type auxiliary vibration damper 42 is fixedly connected to the hydraulic buffer main cylinder rod 41, and the other end is fixedly connected to the pressure sensing connector 43. An auxiliary vibration damping hydraulic device is provided at the end of the hydraulic buffer telescopic rod 44 near the hydraulic buffer main cylinder rod 41. The auxiliary vibration damping hydraulic device includes a hydraulic buffer auxiliary... The auxiliary telescopic rod 461, hydraulic main cylinder 462, hydraulic auxiliary cylinder 463, and hydraulic buffer auxiliary rod cap 464 are included. The auxiliary vibration damping hydraulic device is filled with non-Newtonian fluid. The hydraulic buffer telescopic rod 44 is slidably engaged with the hydraulic main cylinder 462. The hydraulic buffer auxiliary telescopic rod 461 is slidably engaged with the hydraulic auxiliary cylinder 463. One end of the hydraulic buffer auxiliary telescopic rod 461 that protrudes from the hydraulic buffer auxiliary rod cap 464 is fixedly connected to the hydraulic buffer telescopic rod 44. The hydraulic buffer main cylinder rod 41 is rotatably connected to the outer cylinder rod 52 of the auxiliary lander body. The hydraulic buffer telescopic rod 44 is rotatably connected to the outer cylinder rod 52 of the main lander body.

[0089] The temperature control equipment also includes a hydraulic buffer temperature control device 45, which is installed on the hydraulic buffer main cylinder 41. The hydraulic buffer temperature control device 45 includes a temperature control power supply 451 and a temperature controller 452. The temperature control multi-threaded spring-type auxiliary shock absorber 42 is made of nickel-titanium-based material and is a temperature control multi-threaded shape memory alloy structure. The nickel-titanium-based material has multi-temperature domain shape programming capability after heat treatment.

[0090] The non-Newtonian fluid in the hydraulic buffer system 4 increases in viscosity under pressure to improve shock resistance, and then turns into a lubricating state after the impact is reduced. When the impact pressure on the elastic buffer system 2 reaches the set threshold, its pressure sensor 253 will send an electrical signal to trigger the elastic buffer temperature control device 27 to heat up, thereby enhancing the buffer energy absorption characteristics of the shape memory alloy component inside the elastic buffer system 2.

[0091] Temperature control equipment is integrated into each component to regulate the temperature of each temperature-controlled multi-threaded shape memory alloy structure, thereby enabling the switching of deformation states and self-adjustment of posture. In other words, by controlling the temperature, the multi-threaded shape memory alloy switches between martensite and austenite phases to achieve programmable multi-morphological deformation.

[0092] The working logic of the elastic buffer temperature control device 27, the hydraulic buffer temperature control device 45, and the lander temperature control device 55 is as follows: Figure 14 As shown: The power supply provides power to the heating element, enabling it to generate heat; the K-type thermocouple detects the temperature and converts the temperature signal into an electrical signal; the operational amplifier amplifies the electrical signal from the K-type thermocouple; the temperature indicator and controller XMTD receives the amplified signal, displays the current temperature, sets the temperature range, and controls the circuit's continuity via a control circuit switch (in conjunction with a changeover switch SA), thereby adjusting whether the heating element is working, ultimately achieving temperature monitoring and control.

[0093] like Figure 1 , Figure 11 and Figure 12 As shown, a ring-shaped buffer structure 62 is provided at the bottom of the landing foot 6. The ring-shaped buffer structure 62 adopts a hollow gradient hollow design to disperse the initial impact load.

[0094] The working principle of all the content in the above embodiments is as follows:

[0095] During descent, the temperature control system adjusts the attitude based on the lunar surface topography. The multi-threaded shape memory alloy structure changes shape under the control of the system, causing the elastic buffer system 2 and hydraulic buffer system 4 to extend, and the main lander extends to an angle perpendicular to the lunar surface. Based on the estimated impact energy level (low / medium / high / extremely high), corresponding buffer configurations (bow-shaped wave buffer structure, spiral cross buffer structure, hinge-reinforced honeycomb buffer structure, gradient Miura folded buffer structure, orthogonal isotropic cross buffer structure) are selected, and the shape memory characteristics are activated by the temperature control system. The selection criteria are as follows:

[0096] The bow-shaped wave buffer structure is suitable for low-frequency vibration scenarios >10Hz; the spiral cross buffer structure is used for multi-directional random impact environments; the hinge-enhanced honeycomb buffer structure is matched for quasi-static high-pressure conditions; the gradient Mipu folded buffer structure is designed for graded absorption of high-energy impacts >3000J; and the orthogonal isotropic cross buffer structure is used for scenarios where the impact direction is predicted to be vertically uniform (such as landing in flat areas of lunar soil).

[0097] Low energy level (<500J): Bow-shaped wave buffer structure ( Figure 15 Low-frequency vibration isolation efficiency improved by 40%; Medium energy level (500J-1500J, including 500J, excluding 1500J): Spiral cross buffer structure ( Figure 16Multi-directional impact resistance with quasi-isotropic properties; high energy level (1500J-3000J, including 1500J and 3000J): hinge-reinforced honeycomb buffer structure ( Figure 17 Cycle life reaches tens of thousands of cycles; extremely high energy level (>3000J): gradient Miura folded buffer structure ( Figure 18 Peak load reduced by 40%; orthogonal isotropic cross-shaped buffer structure ( Figure 19 As a general-purpose type, it is suitable for scenarios with a uniform vertical impact direction (such as flat lunar soil).

[0098] The outer cylindrical rod 52 of the main lander body contains a temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53 and a honeycomb buffer structure 54, separated by isolation pads 56. During landing, if encountering complex terrain, the lander temperature control device 55 of the main lander body controls the temperature to reach the temperature range defined by the temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53, causing the main lander body's ram rod 51 to move. Similarly, the lander temperature control device 55 of the auxiliary lander body controls the temperature to reach the temperature range defined by the temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53, causing the auxiliary lander body's ram rod 51 to move. The main lander body extends to a position perpendicular to the landing terrain.

[0099] The elastic buffer system 2 and the hydraulic buffer system 4 control the temperature through the elastic buffer temperature control device 27 and the hydraulic buffer temperature control device 45, respectively. In the elastic buffer system 2, the temperature-controlled multi-threaded auxiliary damper 24 and the temperature-controlled multi-threaded hinged auxiliary damping structure 53 undergo temperature-controlled shape memory shape changes, and the elastic buffer system 2 extends as a whole. Similarly, in the hydraulic buffer system 4, the temperature-controlled multi-threaded spring-type auxiliary damper 42 undergoes temperature-controlled shape memory shape changes, and the hydraulic buffer system 4 extends slowly under the control of the auxiliary damping hydraulic device 46, reducing the swaying of the landing device structure.

[0100] After landing, landing foot 6 is the first to contact the lunar surface. The bottom of landing foot 6 is equipped with a ring-shaped buffer structure 62. The ring-shaped buffer structure 62 reduces the overall mass without affecting the overall strength. Landing foot 6 is connected to the main lander body using a limit bearing 61, which gives landing foot 6 multiple degrees of freedom. This helps to maintain the stability of the probe body 1 during landing and gives the lander a good landing attitude.

[0101] One side of the landing foot 6 contacts the ground first. The reaction force of the ground on the landing foot 6 causes the landing foot 6 to twist around the limiting bearing 61. At this time, the limiting bearing 61 plays a role in suppressing the twisting of the landing foot 6. After the landing foot 6 touches the ground and is subjected to force, the ram rod 51 of the main lander body retracts along the outer cylinder rod 52. The temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53 and the honeycomb buffer structure 54 inside the outer cylinder rod 52 are subjected to pressure and deform to absorb the higher impact kinetic energy, so as to achieve a good impact resistance and energy absorption buffering effect. Similarly, the ram rod 51 of the auxiliary lander body retracts along the outer cylinder rod 52, and the temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53 and the honeycomb buffer structure 54 of the auxiliary lander body deform to absorb more impact energy, thereby effectively mitigating the impact.

[0102] When the elastic buffer system 2 and the hydraulic buffer system 4 are subjected to pressure, the pressure sensor 253 and the pressure sensing connector 43 are activated, and the temperature control device heats up to the austenitic phase of the shape memory alloy, effectively improving the buffering characteristics. The non-Newtonian fluid inside the hydraulic buffer system 4 hardens under pressure, improving its impact resistance. After the impact speed is reduced, the non-Newtonian fluid lubricates and dampens the hydraulic buffer auxiliary telescopic rod 461.

[0103] In this embodiment, the temperature-controlled multi-threaded auxiliary vibration damper 24, the temperature-controlled multi-threaded hinged auxiliary vibration damping structure 53, the temperature-controlled multi-threaded spring-type auxiliary vibration damper 42, and the honeycomb buffer structure 54 are made of multi-threaded nickel-titanium shape memory alloy. The principle of its shape memory effect is the transformation between martensite and austenite within the material. Its shape memory effect can be induced by temperature excitation to induce a phase transformation. A heat treatment process is used to transform the single shape memory effect into a programmable multi-threaded shape memory effect, meaning it corresponds to different morphological characteristics at different temperatures. During landing, with the assistance of the temperature control equipment, the shape is changed, the attitude of the landing device is adjusted, and the landing stability of the landing device in complex environments is improved.

[0104] This invention utilizes a shape memory alloy, whose high elasticity and shape memory effect enable the landing device to better absorb impact energy. Upon exposure to excessive impact, the shape memory alloy can recover its shape with the assistance of a temperature control system, thereby improving the stability and safety of the landing device and facilitating subsequent recycling.

[0105] The landing foot 6 features a ring-shaped hollow structure inside, which not only enhances the landing device's impact resistance but also reduces its overall weight. Furthermore, it improves the landing device's stability on soft surfaces, reducing the likelihood of swaying and shaking. This design addresses the problems of poor thermal impact self-regulation, insufficient cushioning performance, difficulty in restoring shape after strong impacts, and poor attitude adjustment capabilities during landing in existing technologies.

[0106] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory, characterized in that, The system includes a probe body (1), an elastic buffer system (2), a secondary lander body, a hydraulic buffer system (4), a main lander body, and a temperature control device. The main lander body and the secondary lander body have the same structure, both including a slidingly connected outer cylinder rod (52) and a stamping rod (51). The outer cylinder rod (52) is equipped with two temperature-controlled multi-threaded hinged auxiliary vibration damping structures (53) and a honeycomb buffer structure (54). The honeycomb buffer structure (54) is located between the two temperature-controlled multi-threaded hinged auxiliary vibration damping structures (53). An isolation pad (56) is provided between the honeycomb buffer structure (54) and the temperature-controlled multi-threaded hinged auxiliary vibration damping structure (53). The temperature control device includes a lander temperature control device (55) attached to the outside of the temperature-controlled multi-threaded hinged auxiliary vibration damping structure (53). The temperature-controlled multi-threaded hinged auxiliary vibration damping structure (53) and the honeycomb buffer structure (54) are made of nickel-titanium based materials. The outer cylinder rod (52) of the auxiliary lander body is rotatably connected to the probe body (1). The stamping rod (51) of the auxiliary lander body is rotatably connected to the outer cylinder rod (52) of the main lander body. The stamping rod (51) of the main lander body is connected to the landing foot (6) through the limit bearing (61). An elastic buffer system (2) is provided between the probe body (1) and the auxiliary lander body. A hydraulic buffer system (4) is provided between the auxiliary lander body and the main lander body.

2. The self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 1, characterized in that, The honeycomb buffer structure (54) is one of the following: bow-shaped wave buffer structure, spiral cross buffer structure, hinge-enhanced honeycomb buffer structure, gradient Mipu folded buffer structure, or orthogonal isotropic cross buffer structure.

3. The self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 2, characterized in that, The elastic buffer system (2) includes an elastic buffer main cylinder (22) and an elastic buffer telescopic rod (26). The elastic buffer main cylinder (22) is also equipped with a temperature-controlled multi-threaded hinged auxiliary vibration damping structure (53). The elastic buffer telescopic rod (26) is slidably connected to the elastic buffer main cylinder (22) through a telescopic rod lubricator (29). An auxiliary vibration damping connector (23) is fixedly provided on the outside of the elastic buffer main cylinder (22). A temperature-controlled multi-threaded auxiliary vibration damper (24) is fixedly provided on the auxiliary vibration damping connector (23). A secondary auxiliary vibration damping device (25) is provided at the end of the temperature-controlled multi-threaded auxiliary vibration damper (24) away from the auxiliary vibration damping connector (23). The secondary auxiliary vibration damping device (25) includes a secondary auxiliary vibration damping connector (251) and a secondary auxiliary vibration damping platform. (252) and pressure sensor (253), wherein the secondary auxiliary vibration damping connector (251) is fixedly connected to the temperature-controlled multi-threaded auxiliary vibration damper (24) and the elastic buffer telescopic rod (26), the secondary auxiliary vibration damping connector (251) is in contact with the secondary auxiliary vibration damping platform (252) with arc-shaped buffer pads through the buffer groove, the pressure sensor (253) is bonded to the end of the secondary auxiliary vibration damping platform (252) away from the secondary auxiliary vibration damping connector (251), the pressure sensor (253) is fixedly connected to the elastic buffer telescopic rod (26), the elastic buffer telescopic rod (26) is rotatably connected to the detector body (1) through the rotating bearing (21), and the elastic buffer body cylinder rod (22) is rotatably connected to the outer cylinder rod (52) of the sub-lander body through the rotating bearing (21); The temperature control device also includes an elastic buffer temperature control device (27), which is located on the outer wall of the elastic buffer main cylinder (22) and connected to the auxiliary vibration damping connector (23). The temperature control multi-thread auxiliary vibration damper (24) is made of nickel-titanium based material.

4. The self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 3, characterized in that, The hydraulic buffer system (4) includes a hydraulic buffer main cylinder (41), a hydraulic buffer telescopic rod (44), a pressure sensor connector (43) with an integrated pressure sensor, a temperature-controlled multi-threaded spring-type auxiliary damper (42), and an auxiliary damping hydraulic device. The pressure sensor connector (43) is fixed to the hydraulic buffer telescopic rod (44) by bolts. One end of the temperature-controlled multi-threaded spring-type auxiliary damper (42) is fixedly connected to the hydraulic buffer main cylinder (41), and the other end is fixedly connected to the pressure sensor connector (43). An auxiliary damping hydraulic device is provided at the end of the hydraulic buffer telescopic rod (44) near the hydraulic buffer main cylinder (41). The auxiliary damping hydraulic device includes a hydraulic buffer auxiliary telescopic rod (41). 461), hydraulic main cylinder (462), hydraulic secondary cylinder (463) and hydraulic buffer auxiliary rod cap (464), the auxiliary damping hydraulic device is filled with non-Newtonian fluid, the hydraulic buffer telescopic rod (44) is slidably engaged with the hydraulic main cylinder (462), the hydraulic buffer auxiliary telescopic rod (461) is slidably engaged with the hydraulic secondary cylinder (463), and the end of the hydraulic buffer auxiliary telescopic rod (461) that passes through the hydraulic buffer auxiliary rod cap (464) is fixedly connected to the hydraulic buffer telescopic rod (44), the hydraulic buffer main cylinder rod (41) is rotatably connected to the outer cylinder rod (52) of the secondary lander body, and the hydraulic buffer telescopic rod (44) is rotatably connected to the outer cylinder rod (52) of the main lander body; The temperature control equipment also includes a hydraulic buffer temperature control device (45), which is installed on the hydraulic buffer main cylinder (41). The hydraulic buffer temperature control device (45) includes a temperature control power supply (451) and a temperature controller (452). The temperature control multi-threaded spring-type auxiliary shock absorber (42) is made of nickel-titanium based material.

5. The self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 4, characterized in that, The landing foot (6) has an annular buffer structure (62) at the bottom, and the annular buffer structure (62) adopts a hollow gradient hollow design.

6. The self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 2, characterized in that, The design steps for the bow-shaped wave buffer structure are as follows: Draw an ellipse with a major axis of 15 mm and a minor axis of 4.5 mm on the top reference plane. Draw an outline line at equidistant intervals of 0.75 mm on the outside of the ellipse to form an arched wall thickness. Cut half of the sketch through the major axis of the ellipse and use the tangent of the ellipse perpendicular to the minor axis as the mirror axis to mirror the cut sketch to form a double arched section. Execute the Stretch Boss command, select symmetrical stretching on both sides, and generate an arc-shaped wave buffer unit solid with a thickness of 0.9mm. Then rotate the arc-shaped wave buffer unit around the mirror axis once, with a rotation angle of 90 degrees, to generate an arc-shaped wave buffer structure unit. The bow-shaped wave buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 9mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 15mm. Multiple bow-shaped wave buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. The outer part of the cylinder is cut off with the center of the arrayed entity as the center and a circle with a diameter of d. d corresponds to the size of the outer cylinder rod (52) to obtain the bow-shaped wave buffer structure.

7. A self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 2, characterized in that, The design steps for the spiral cross buffer structure are as follows: Draw two 22.5mm×1.5mm rectangles on the right reference plane and make them intersect at an angle. The long side of the rectangle makes an angle of 45° with the xoy plane to form a cross skeleton. Execute the Stretch Boss command to generate a spiral cross unit solid with a thickness of 0.75mm. Rotate the spiral cross unit around a reference axis that passes through the center of the solid and is parallel to the z-axis once, with a rotation angle of 90 degrees, to generate a spiral cross buffer structure unit. The spiral cross buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 12.75 mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 15 mm. Multiple spiral cross buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. The outer part of the cylinder is cut off with the center of the arrayed entity as the center and a circle with a diameter of d. d corresponds to the size of the outer cylinder rod (52) to obtain the spiral cross buffer structure.

8. A self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 2, characterized in that, The design steps for the hinge-enhanced honeycomb buffer structure are as follows: Draw an isosceles trapezoid on the front reference plane. The shorter base of the isosceles trapezoid is 9mm, the longer base is 18mm, and the base angle is 45°. Mirror the sketch with the shorter base as the axis of symmetry, and then draw the outline at equidistant intervals of 1.5mm along the inside of the trapezoid. Execute the Stretch Boss command to generate a hinge reinforcement unit solid with a thickness of 0.75mm. Then rotate the hinge reinforcement unit around the reference axis 2 that passes through the center of the solid and is parallel to the z-axis once, with a rotation angle of 90 degrees, to generate a hinge-reinforced honeycomb buffer structure unit. The hinge-reinforced honeycomb buffer structure units are arrayed along the x-axis and y-axis directions respectively, with an array interval of 18.9 mm. Then, the arrayed structure is arrayed along the z-axis direction with an array interval of 10 mm. Multiple hinge-reinforced honeycomb buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. The outer part of the cylinder is cut off with the center of the arrayed entity as the center and a circle with a diameter of d. d corresponds to the size of the outer cylinder rod (52) to obtain the hinge-reinforced honeycomb buffer structure.

9. A self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 2, characterized in that, The design steps of the gradient Miura folded buffer structure are as follows: Draw a rectangle with a length of 25.5mm and a width of 2.25mm on the front reference plane, and use the extrude boss function to extrude the rectangle by 2.25mm to generate a cuboid solid. The cuboid is rotated three times around a reference axis three that passes through the center of the solid and is perpendicular to the yoz plane, with a rotation angle of 45 degrees, to generate a single gradient Miura unit solid. Then, the gradient Miura unit is rotated three times around the reference axis four, with a rotation angle of 45 degrees, to generate a gradient Miura folded buffer structure unit. The gradient Miura folded buffer structure units are arrayed along the x-axis, y-axis and z-axis directions respectively, with an array interval of 15mm. Multiple gradient Miura folded buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. The outer part of the cylinder is cut off with the center of the arrayed solid as the center and a circle with a diameter of d. d corresponds to the size of the outer cylinder rod (52) to obtain the gradient Miura folded buffer structure.

10. A self-regulating buffer detection and landing device based on temperature-controlled multi-threaded shape memory according to claim 2, characterized in that, The design steps for an orthogonal isotropic cross-shaped buffer structure are as follows: First, draw two mutually perpendicular cuboids with square cross sections and a length of 15mm to obtain a cross-shaped orthogonal isotropic cross buffer unit entity. Rotate the orthogonal isotropic cross buffer unit around a reference axis that passes through the center of the entity and is parallel to the z-axis once, with a rotation angle of 90 degrees, to obtain an orthogonal isotropic cross buffer structure unit with a length of 15mm, a width of 15mm, and a height of 15mm. The orthogonal isotropic cross buffer structure units are arrayed along the x-axis, y-axis and z-axis directions respectively, with an array interval of 15mm. Multiple orthogonal isotropic cross buffer structure units are distributed in a three-dimensional grid array. Finally, a ring cut is made along the z-axis direction. The outer part of the cylinder is cut off with the center of the arrayed solid as the center and a circle with a diameter of d. d corresponds to the size of the outer cylinder rod (52) to obtain the orthogonal isotropic cross buffer structure.

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