Magnetron sputtering ring piece and preparation method thereof
By designing a shoulder platform and setting a specific knurling shape on the magnetron sputtering ring, combined with processing using a self-rotating extrusion tool, the particle defects and abnormal discharge problems caused by redepo material accumulation were solved, thus improving the coating quality.
Patent Information
- Application Number
- CN202511236352.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-01
- Publication Date
- 2025-12-05
AI Technical Summary
In existing magnetron sputtering processes, redepo material buildup on the shoulder of the ring leads to particle defects and abnormal discharges. Existing knurling treatments have limited effectiveness and may also trigger abnormal discharges.
The upper and lower shoulder platforms of the magnetron sputtering ring are designed, and trapezoidal or conical knurling is set on their surface. Combined with a self-rotating extrusion tool, the ring body is formed to enhance the adsorption capacity of redepo substances.
It effectively reduces redepo material shedding from the wafer, reduces particle defects and abnormal discharge problems, and improves the stability of coating quality.
Smart Images
Figure CN121065647A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of magnetron sputtering, in particular to a magnetron sputtering ring and a preparation method thereof. BACKGROUND
[0002] The ring is an important component in the magnetron sputtering coating equipment, which is usually installed around the target material and plays a role in protection, guiding the magnetic field, controlling the distribution of sputtering particles, etc. It surrounds the edge of the target material and, together with the target material, substrate and other components, constitutes the main structure of the magnetron sputtering system.
[0003] In the magnetron sputtering coating process, electrons collide with argon atoms under the action of an electric field to produce Ar positive ions and new electrons. Ar ions accelerate and bombard the target material surface under the action of an electric field, causing the target material to sputter. However, redepo material (material that re-attaches to the target material, metal ions in the chamber during the sputtering process will re-adsorb on the target material surface due to the magnetic field to form redepo material) will re-attach to the ring or the target material, especially on the shoulder of the ring. As the sputtering process proceeds, the thickness of the redepo material increases, and the redepo material on the shoulder of the ring becomes too thick to fall off, causing Particle defects and affecting the coating quality.
[0004] In the existing process, in order to improve the risk of Particle defects, knurling is usually performed on the shoulder of the ring to increase the roughness to adsorb redepo material. However, on the one hand, the knurling pattern is shallow, and the thickness of the redepo material that can be adsorbed is limited, making it difficult to effectively solve the problem of redepo material falling off. On the other hand, the knurling pattern is sharp and may cause abnormal discharge, affecting the stability and quality of the coating process.
[0005] Therefore, it is a technical problem in the field to provide a ring structure that can improve the risk of Particle and reduce the occurrence of abnormal discharge. SUMMARY
[0006] In view of the deficiencies of the prior art, the purpose of the present application is to provide a magnetron sputtering ring and a preparation method thereof. Compared with the prior art, the magnetron sputtering ring provided by the present application can improve the adsorption capacity of redepo material and reduce the problems of Particle defects and abnormal discharge.
[0007] To achieve the purpose of the present application, the following technical solutions are adopted:
[0008] The present application provides a magnetron sputtering ring, which comprises a ring body and a nub, the ring body comprises a ring body, an upper shoulder platform and a lower shoulder platform.
[0009] The upper shoulder platform is connected with the top of the ring body and extends in the direction towards the center of the ring body, and the upper surface of the upper shoulder platform is provided with the first knurling;
[0010] The lower shoulder platform is connected with the bottom of the ring body and extends in the direction towards the center of the ring body, and the upper surface of the lower shoulder platform is provided with the first knurling;
[0011] The outer circumferential surface of the ring body is provided with a nodule.
[0012] In the present application, the shoulder of the ring is designed according to the deposition of redepo material after the ring is used, that is, the upper shoulder platform and the lower shoulder platform are designed respectively, and the first knurling is provided, and at the same time, by controlling the shape and size of the first knurling, the adsorption of the ring to the redepo material can be effectively increased, the redepo material falling on the wafer due to the failure of adsorption can be effectively avoided, the Particle defect can be reduced, and the abnormal discharge problem can be reduced.
[0013] Preferably, the first knurling is in the shape of a trapezoidal pit.
[0014] Preferably, the length of the upper base of the trapezoidal pit is 0.2-0.4mm, for example, it can be 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.30mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm or 0.4mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0015] Preferably, the length of the lower base of the trapezoidal pit is 0.4-0.6mm, for example, it can be 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm, 0.50mm, 0.52mm, 0.54mm, 0.56mm, 0.58mm or 0.6mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0016] Preferably, the height of the trapezoidal pit is 0.3-0.5mm, for example, it can be 0.3mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm or 0.5mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0017] Preferably, the distance between the centers of the lower bases of the adjacent trapezoidal concave pits is 0.1-0.3 mm, for example, it can be 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.24 mm, 0.26 mm, 0.28 mm, or 0.3 mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0018] Preferably, the density of the trapezoidal concave pits is 2-3 / mm 2 , for example, it can be 2 / mm 2 , 2.2 / mm 2 , 2.4 / mm 2 , 2.6 / mm 2 , 2.8 / mm 2 , or 3 / mm 2 , but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0019] In the present application, by controlling the density of the trapezoidal concave pits, the surface roughness of the upper shoulder platform and the lower shoulder platform can be further controlled, thereby enhancing the adsorption effect of redepo substances.
[0020] Preferably, the inner circumferential surface of the ring body is provided with second knurling.
[0021] Preferably, the second knurling is in the form of a conical pit.
[0022] Preferably, the depth of the conical pit is 0.4-0.6 mm, for example, it can be 0.4 mm, 0.42 mm, 0.44 mm, 0.46 mm, 0.48 mm, 0.5 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, or 0.6 mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0023] Preferably, the density of the conical pit is 2-3 / mm 2 , for example, it can be 2 / mm 2 , 2.2 / mm 2 , 2.4 / mm 2 , 2.6 / mm 2 , 2.8 / mm 2 , or 3 / mm 2 , but is not limited to the listed values, and other values not listed in the value range are also applicable.
[0024] Preferably, the height of the upper shoulder platform and the lower shoulder platform is independently 0.3-0.5mm, for example, can be 0.3mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm or 0.5mm, but not limited to the listed values, other values not listed in the range of values are also applicable.
[0025] Preferably, the distance between the upper shoulder platform and the lower shoulder platform is 0.1-0.3mm, for example, can be 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm or 0.3mm, but not limited to the listed values, other values not listed in the range of values are also applicable.
[0026] Preferably, the radial extension distance of the upper shoulder platform and the lower shoulder platform is independently 10-20mm, for example, can be 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm or 20mm, but not limited to the listed values, other values not listed in the range of values are also applicable.
[0027] In a second aspect, the application provides a method for preparing the magnetron sputtering ring, comprising the following steps:
[0028] The base material is rolled and extruded by the self-rotating extrusion tool, the surface of the extrusion tool is provided with a protrusion matching the annular body shape, so that the base material is processed into an annular body;
[0029] The protrusion body is welded on the outer circumferential surface of the ring body to obtain the magnetron sputtering ring.
[0030] In the preparation method, the base material is rolled and extruded by the self-rotating extrusion tool, which can control the formation of the shoulder platform and the formation of the knurling of the ring, thereby effectively increasing the adsorption of redepo material by the ring, reducing the Particle defect and abnormal discharge problem.
[0031] Preferably, the rotating speed of the extrusion tool is 20-40r / min, for example, can be 20r / min, 22r / min, 24r / min, 26r / min, 28r / min, 30r / min, 32r / min, 34r / min, 36r / min, 38r / min or 40r / min, but not limited to the listed values, other values not listed in the range of values are also applicable.
[0032] Preferably, the feeding amount of the extrusion tool is 0.2-0.4mm / r, for example, can be 0.2mm / r, 0.22mm / r, 0.24mm / r, 0.26mm / r, 0.28mm / r, 0.3mm / r, 0.32mm / r, 0.34mm / r, 0.36mm / r, 0.38mm / r or 0.4mm / r, but not limited to the listed values, other values not listed in the value range are also applicable.
[0033] Preferably, the total pressure drop amount of the extrusion tool is 5-7mm, for example, can be 5mm, 5.2mm, 5.4mm, 5.6mm, 5.8mm, 6mm, 6.2mm, 6.4mm, 6.6mm, 6.8mm or 7mm, but not limited to the listed values, other values not listed in the value range are also applicable.
[0034] Compared with the prior art, the present application has the following beneficial effects:
[0035] The magnetic control sputtering ring provided by the present application is designed for the deposition of redepo material after the ring is used, that is, the upper shoulder platform and the lower shoulder platform are designed respectively, and the first knurl is arranged, and by controlling the shape and size of the first knurl, the adsorption of the ring to the redepo material can be effectively increased, the redepo material falling on the wafer due to the failure of adsorption can be effectively avoided, the Particle defect can be reduced, and the abnormal discharge problem can be reduced. BRIEF DESCRIPTION OF DRAWINGS
[0036] Figure 1 is a schematic view of the magnetic control sputtering ring provided by the embodiment 1 of the present application;
[0037] Figure 2 is Figure 1 is an enlarged sectional view of the part A in the radial direction in the figure;
[0038] Figure 3 is a structural schematic view of the extrusion tool provided by the embodiment 1 of the present application;
[0039] Wherein, 1-ring body; 2-nodular body; 3-ring body; 4-upper shoulder platform; 5-lower shoulder platform; 6-first knurl; 7-second knurl. DETAILED DESCRIPTION
[0040] The technical solutions of the present application will be further described through specific embodiments. Those skilled in the art should understand that the embodiments are only to help understand the present application, and should not be regarded as a specific limitation on the present application.
[0041] Embodiment 1
[0042] The present embodiment provides a magnetic control sputtering ring, as shown inFigure 1 and Figure 2 As shown, the magnetron sputtering ring includes an annular body 1 and a convex structure 2. The annular body 1 includes an annular body 3, an upper shoulder platform 4, and a lower shoulder platform 5.
[0043] The upper shoulder platform 4 is connected to the top of the ring 3 and extends in the direction toward the center of the ring 3. The upper surface of the upper shoulder platform 4 is provided with a first knurling 6. The lower shoulder platform 5 is connected to the bottom of the ring 3 and extends in the direction toward the center of the ring 3. The upper surface of the lower shoulder platform 5 is provided with a first knurling 6. The first knurling 6 is in the shape of trapezoidal recesses. The upper base of the trapezoidal recess has a length of 0.3 mm, the lower base has a length of 0.5 mm, and the height is 0.4 mm. The distance between the centers of adjacent lower bases of the trapezoidal recesses is 0.2 mm, and the density is 2.04 pieces / mm. 2 .
[0044] The inner circumferential surface of the ring 3 is provided with a second knurling 7; the second knurling 7 is in the shape of conical pits, the depth of the conical pits is 0.5 mm, and the density is 2.78 pits / mm. 2 .
[0045] The height of the upper shoulder platform 4 and the lower shoulder platform 5 is 0.4 mm, the distance between the upper shoulder platform 4 and the lower shoulder platform 5 is 0.2 mm, and the radial extension distance of the upper shoulder platform 4 and the lower shoulder platform 5 is 15 mm.
[0046] This embodiment also provides a method for preparing the above-mentioned magnetron sputtering ring, the method comprising the following steps:
[0047] Employing a self-rotating extrusion tool, such as Figure 3 As shown, the substrate is rolled into a circle while being extruded. The rotation speed is 30 r / min, the feed rate is 0.3 mm / r, and the total pressure drop is 6 mm. The surface of the extrusion tool is provided with protrusions that match the shape of the annular body 1, thereby processing the substrate into an annular body 1. The protruding body 2 is welded to the outer circumference of the ring body 3 to obtain the magnetron sputtering ring.
[0048] Example 2
[0049] This embodiment provides a magnetron sputtering ring, which includes an annular body and a convex structure. The annular body includes a ring, an upper shoulder platform, and a lower shoulder platform.
[0050] The upper shoulder platform is connected with the top of the ring body and extends in the direction towards the center of the ring body, the upper surface of the upper shoulder platform is provided with first knurling, the lower shoulder platform is connected with the bottom of the ring body and extends in the direction towards the center of the ring body, and the upper surface of the lower shoulder platform is provided with first knurling; the first knurling is in the shape of a trapezoidal pit, the upper base length of the trapezoidal pit is 0.2 mm, the lower base length is 0.6 mm, the height is 0.3 mm, the distance between the centers of the lower bases of adjacent trapezoidal pits is 0.1 mm, and the density is 2.51 / mm 2 .
[0051] The inner circumferential surface of the ring body is provided with second knurling; the second knurling is in the shape of a conical pit, the depth of the conical pit is 0.6 mm, and the density is 2.14 / mm 2 .
[0052] The heights of the upper shoulder platform and the lower shoulder platform are each independently 0.5 mm, the distance between the upper shoulder platform and the lower shoulder platform is 0.1 mm, and the radial extension distances of the upper shoulder platform and the lower shoulder platform are each independently 20 mm.
[0053] The embodiment also provides a preparation method of the above-mentioned magnetron sputtering ring, and the preparation method comprises the following steps:
[0054] The base material is subjected to roll forming and extrusion processing at the same time by using a self-rotating extrusion tool, the rotating speed is 40 r / min, the feed amount is 0.2 mm / r, the total pressure drop amount is 7 mm, the surface of the extrusion tool is provided with protrusions matching the shape of the ring-shaped main body, so that the base material is processed into a ring-shaped main body; and the nub body is welded on the outer circumferential surface of the ring body to obtain the magnetron sputtering ring.
[0055] Embodiment 3
[0056] The embodiment provides a magnetron sputtering ring, which comprises a ring-shaped main body and a nub body.
[0057] The upper shoulder platform is connected with the top of the ring body and extends in the direction towards the center of the ring body, the upper surface of the upper shoulder platform is provided with first knurling, the lower shoulder platform is connected with the bottom of the ring body and extends in the direction towards the center of the ring body, and the upper surface of the lower shoulder platform is provided with first knurling; the first knurling is in the shape of a trapezoidal pit, the upper base length of the trapezoidal pit is 0.4 mm, the lower base length is 0.4 mm, the height is 0.5 mm, the distance between the centers of the lower bases of adjacent trapezoidal pits is 0.3 mm, and the density is 2.89 / mm 2 .
[0058] The inner circumferential surface of the ring body is provided with second knurling; the second knurling is in the shape of a conical pit, the depth of the conical pit is 0.4mm, and the density is 2.75 / mm 2 .
[0059] The height of the upper shoulder platform and the lower shoulder platform is independently 0.3mm, the distance between the upper shoulder platform and the lower shoulder platform is 0.3mm, and the radial extension distance of the upper shoulder platform and the lower shoulder platform is independently 10mm.
[0060] The embodiment also provides a preparation method of the above-mentioned magnetron sputtering ring, and the preparation method comprises the following steps:
[0061] The spinning extrusion tool is used to perform extrusion processing while performing the rolling of the base material, the rotating speed is 20r / min, the feeding amount is 0.4mm / r, the total pressure drop amount is 5mm, the surface of the extrusion tool is provided with protrusions matched with the shape of the ring body, so that the base material is processed into the ring body; the convex body is welded on the outer circumferential surface of the ring body, and the magnetron sputtering ring is obtained.
[0062] Example 4
[0063] The embodiment provides a magnetron sputtering ring, and the difference compared with the embodiment 1 is that the first knurling is in the shape of a conical pit, and the shape, depth and density are the same as those of the second knurling.
[0064] Example 5
[0065] The embodiment provides a magnetron sputtering ring, and the difference compared with the embodiment 1 is that the radial extension distance of the upper shoulder platform and the lower shoulder platform is independently 2mm.
[0066] Comparative Example 1
[0067] The comparative example provides a magnetron sputtering ring, and the difference compared with the embodiment 1 is that the upper shoulder platform and the lower shoulder platform are not provided.
[0068] Comparative Example 2
[0069] The comparative example provides a magnetron sputtering ring, and the difference compared with the embodiment 1 is that the first knurling is not provided.
[0070] The ring provided in the above-mentioned embodiment and comparative example is subjected to magnetron sputtering, and the test is repeated for 30 times, the number of times of particle defects and abnormal discharge problems is observed, and the test results are shown in Table 1.
[0071] Table 1
[0072]
[0073]
[0074] From the data of Table 1, it can be seen that:
[0075] (1) From the data of Examples 1-3, it can be seen that the magnetic control sputtering ring provided by the application can effectively avoid the Particle defect and abnormal discharge problem.
[0076] (2) From the comparison of Example 1 and Example 4, it can be seen that by preferably controlling the first knurling in the shape of trapezoidal pit, the application can reduce sharp structure and reduce the occurrence of abnormal discharge.
[0077] (3) From the comparison of Example 1 and Example 5, it can be seen that by preferably controlling the extension distance of the upper shoulder platform and the lower shoulder platform along the radial direction, the application can further adsorb redepo material, reduce the risk of redepo material falling off, and reduce Particle defect.
[0078] (4) By comparing the data of Example 1 and Comparative Examples 1-2, it can be seen that by setting the upper shoulder platform, the lower shoulder platform and the first knurling, the application can effectively enhance the adsorption of low redepo material and improve the quality of target sputtering.
[0079] In summary, the magnetic control sputtering ring provided by the application can improve the adsorption capacity of redepo material, reduce the Particle defect and abnormal discharge problem.
[0080] The applicant declares that the above is only a specific embodiment of the application, but the protection scope of the application is not limited thereto. It should be understood by those skilled in the art that any changes or replacements within the technical scope disclosed by the application can be easily thought of by any person skilled in the art, and all fall within the protection scope and disclosure scope of the application.
Claims
1. A magnetron sputtering ring, characterized in that, The magnetron sputtering ring includes an annular body and a convex structure. The annular body includes an annular body, an upper shoulder platform, and a lower shoulder platform. The upper shoulder platform is connected to the top of the ring and extends in the direction toward the center of the ring. The upper surface of the upper shoulder platform is provided with a first knurling. The lower shoulder platform is connected to the bottom of the ring and extends in the direction toward the center of the ring. The upper surface of the lower shoulder platform is provided with a first knurling. The outer circumferential surface of the ring is provided with a convex structure.
2. The magnetron sputtering ring according to claim 1, characterized in that, The first knurling is trapezoidal indentation; Preferably, the length of the trapezoidal concave upper base is 0.2-0.4 mm; Preferably, the length of the trapezoidal recessed lower base is 0.4-0.6 mm; Preferably, the height of the trapezoidal recess is 0.3-0.5 mm; Preferably, the distance between the centers of adjacent trapezoidal recesses at their lower bases is 0.1-0.3 mm; Preferably, the density of the trapezoidal pits is 2-3 per mm. 2 .
3. The magnetron sputtering ring according to claim 1 or 2, characterized in that, The inner circumferential surface of the ring is provided with a second knurling.
4. The magnetron sputtering ring according to claim 3, characterized in that, The second knurling is in the form of conical pits; Preferably, the depth of the conical recess is 0.4-0.6 mm; Preferably, the density of the conical pits is 2-3 per mm. 2 .
5. The magnetron sputtering ring according to any one of claims 1-4, characterized in that, The height of the upper shoulder platform and the lower shoulder platform are each 0.3-0.5mm.
6. The magnetron sputtering ring according to any one of claims 1-5, characterized in that, The distance between the upper shoulder platform and the lower shoulder platform is 0.1-0.3mm.
7. The magnetron sputtering ring according to any one of claims 1-6, characterized in that, The radial extension distance of the upper shoulder platform and the lower shoulder platform is 10-20mm each independently.
8. A method for preparing a magnetron sputtering ring as described in any one of claims 1-7, characterized in that, The preparation method includes the following steps: A self-rotating extrusion tool is used to roll the substrate into a circle while simultaneously extruding it. The surface of the extrusion tool is provided with protrusions that match the shape of the annular body, thereby processing the substrate into an annular body. The convex structure is welded to the outer circumferential surface of the ring to obtain the magnetron sputtering ring.
9. The preparation method according to claim 8, characterized in that, The extrusion tool rotates at a speed of 20-40 r / min.
10. The preparation method according to claim 8 or 9, characterized in that, The feed rate of the extrusion tool is 0.2-0.4 mm / r; Preferably, the total pressure drop of the extrusion tool is 5-7 mm.