Electrodeposition device for preparing alpha plane source

Abstract

The invention relates to the technical field of electro-deposition equipment, and particularly provides an electro-deposition device for preparing an alpha plane source, comprising a substrate; an electrodeposition tank base fixed to the substrate; the electro-deposition tank is placed on the electro-deposition tank base; each pressing assembly comprises a supporting column, a guide column and a pressing plate; the support column is fixed on the substrate far away from the electro-deposition tank; the guide post is fixed on the base plate and is closer to the electro-deposition tank than the support post; the tail end of the pressing plate is movably connected to the supporting column, the middle section of the pressing plate is provided with a first through hole allowing the guide column to penetrate through, and the head end of the pressing plate is connected to the electro-deposition tank. Under the cooperative guidance of the guide column and the first through hole, the pressing plate swings around the connecting point of the pressing plate and the supporting column, so that the head end of the pressing plate downwards presses the electro-deposition tank. Through the configuration, the electrodeposition tank is simply disassembled and assembled, meanwhile, the risk that threaded connection / sealing friction is damaged or even fails is avoided, and the effective service life of sealing is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electrodeposition equipment, in particular to an electrodeposition device for preparing an alpha plane source. BACKGROUND

[0002] Alpha plane sources are prepared by using alpha radioactive nuclides. In order to ensure that the energy of alpha particles is not attenuated in the radioactive plane source and to reduce the self-absorption phenomenon, the active layer must be formed very thin. Most of the alpha radioactive nuclides belong to the extremely toxic group. After entering the human body, the alpha radioactive nuclides will continuously irradiate the human tissues. The radiation mainly acts on DNA molecules, thereby causing damage to cells and leading to various health hazards. In the 1960s, a method for preparing radioactive sources and targets for nuclear physics experiments in weakly polar organic solvents was developed. Alpha radioactive nuclides are deposited on the cathode in the form of hydroxides or other compounds. This method is called molecular electroplating and is widely used in the field of preparation of alpha plane sources.

[0003] The patent application with the application number 201710284564.6 discloses a deposition tank for preparing high-resolution alpha radioactive sources by magnetohydrodynamic electrodeposition. The structure of the deposition tank is that permanent magnets are arranged on the outer side of the deposition tank body, the anode wire extends into the deposition liquid from the top of the deposition tank body, the bottom of the deposition tank body is sealed by a threaded bottom cover, the center hole of the threaded bottom cover, the cathode lead-out gasket and the cathode deposition source sheet are arranged in the threaded bottom cover from bottom to top, the cathode lead-out gasket is connected with the cathode lead-out wire at the bottom, and the cathode lead-out wire is led out from the hole of the threaded bottom cover and connected with the negative electrode of the power supply.

[0004] The patent application with the application number 201610196264.8 discloses an electrodeposition tank for preparing high-resolution alpha sources. The electrodeposition tank comprises a power supply, an electroplating tank, a bottom scale, a magnet and a platinum electrode. The electroplating tank has an inner and outer layer structure, and the upper end and the bottom of the inner layer are provided with openings. The inner layer of the electroplating tank is used to contain the electrodeposition plating liquid, and the opposite corners of the outer layer are provided with cooling circulating water inlets and outlets. The opening at the upper end of the inner layer is provided with an upper sealing ring and an upper sealing cover, and the opening at the bottom of the inner layer is provided with a lower sealing ring and a lower sealing cover. The bottom scale is used as a cathode and is tightly attached to the hole below the middle of the lower sealing ring. The platinum electrode extends into the position 0.5-1 cm away from the bottom of the electroplating tank from the radial center position of the upper end of the inner layer of the electroplating tank.

[0005] These prior art electrodeposition tanks are all fixed to the corresponding base by screw connection, considering that the electrodeposition process is usually carried out in a glove box, the space available for hand movement in the glove box is limited and the operability is low, and the screw connection means that the relevant connecting parts are repeatedly subjected to rotation, the operation steps are complicated and time-consuming, and the potential risk of exposure of the operator to the radioactive source increases over time; the screw connection can be worn due to the wear of the sealing surface in repeated rotation, and the thermal expansion phenomenon caused by the high heat generated by molecular plating can also affect the fit of the sealing surface, thereby causing a gap at this place and increasing the risk of leakage of radioactive substances or contamination inside the tank body; the operator indirectly operates the screw connection through the glove box, and due to the presence of the glove, the tactile feedback of the hand is weak, and the screw connection is prone to problems of rotation out of position or over-tightening. SUMMARY

[0006] The present application provides an electrodeposition device for preparing an alpha plane source, which solves the inconvenience caused by the indirect operation of the screw connection of the electrodeposition tank through the glove box in the prior art, realizes an electrodeposition device suitable for the specific deposition process environment of the glove box, and replaces the vulnerable screw connection with a compression assembly.

[0007] The present application provides an electrodeposition device for preparing an alpha plane source, comprising: a base plate; an electrodeposition tank base fixed to the base plate; an electrodeposition tank placed on the electrodeposition tank base; at least one compression assembly, each compression assembly comprising a support column, a guide column and a pressing plate; the support column is fixed to the base plate away from the electrodeposition tank; the guide column is fixed to the base plate closer to the electrodeposition tank than the support column; the tail end of the pressing plate is movably connected to the support column, the middle section of the pressing plate is provided with a first through hole through which the guide column passes, and the head end of the pressing plate is connected to the electrodeposition tank; Under the coordinated guidance of the guide column and the first through hole, the pressing plate swings around its connection point with the support column, so that the head end of the pressing plate presses the electrodeposition tank downward.

[0008] According to the electrodeposition device for preparing an alpha plane source provided by the present application, the tail end of the pressing plate is provided with a pivot slot, and the top end of the support column extends into the pivot slot.

[0009] According to the electrodeposition device for preparing an alpha plane source provided by the present application, each compression assembly further comprises a handle, the handle is sleeved on the guide column and located above the middle section of the pressing plate, and the bottom of the handle and the top surface of the pressing plate abut each other.

[0010] The handle is provided with a second through hole for sleeving the guide column, and the second through hole is provided with an internal thread; at least an upper section of the guide column is provided with an external thread, and the cooperation of the internal thread and the external thread enables the handle to rotate spirally around the guide column.

[0011] The guide column is sleeved with an elastic member, a first end of the elastic member is connected to the base plate, and a second end of the elastic member is connected to the middle section of the pressing plate.

[0012] The electrodeposition tank base is formed in a cylindrical or disc shape, the electrodeposition tank base is provided with a through groove penetrating through itself along a radial direction thereof, and the depth of the through groove is less than the height of the electrodeposition tank base.

[0013] On the top surface of the electrodeposition tank base, two sides of the through groove are respectively provided with arc-shaped grooves, and the arc-shaped grooves and the through groove cooperatively form a circular recess for accommodating the bottom of the electrodeposition tank.

[0014] The electrodeposition tank base further comprises a sealing member, the to-be-processed deposition source sheet, the sealing member and the electrodeposition tank are sequentially placed into the circular recess.

[0015] The base plate is provided with a base plate groove, the electrodeposition tank base is provided with a guide rail corresponding to the base plate groove at the bottom thereof, the guide rail is provided with a conductive column, and the conductive column is electrically connected to the to-be-processed deposition source sheet.

[0016] The electrodeposition device for preparing an alpha plane source further comprises an electrode member formed in a disc shape, the outer diameter of the electrode member is not greater than the inner diameter of the electrodeposition tank, and the electrode member is placed into the electrodeposition tank.

[0017] The application provides an electrodeposition device for preparing an alpha plane source, at least one pressing assembly is arranged to press the electrodeposition tank on the electrodeposition tank base, wherein the operation of the pressing assembly is relatively simple and fast, and the operator only needs to press the pressing plate in the pressing assembly downward, so that the pressing assembly can press the electrodeposition tank downward until the electrodeposition tank is firmly pressed on the electrodeposition tank base; conversely, the operator only needs to reset the pressing plate to no longer press the electrodeposition tank, so that the fixation between the electrodeposition tank and the electrodeposition tank base is released, so that the electrodeposition tank is unloaded, thereby realizing the quick assembly and disassembly of the electrodeposition tank, and greatly shortening the time required for disassembly and assembly. In addition, the working principle of the pressing assembly substantially adopts the lever principle to a large extent, wherein the pressing plate and the electrodeposition tank are uniformly stressed, friction and wear of the threaded connection are avoided, the effective service life of the sealing between the electrodeposition tank base and the electrodeposition tank is prolonged, and the equipment maintenance and replacement frequency is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0019] Figure 1 It is a perspective view of the electrodeposition device for preparing an alpha plane source provided by the application.

[0020] Figure 2 It is a perspective view of the substrate provided by the application.

[0021] Figure 3 It is a perspective view of the electrodeposition tank base provided by the application.

[0022] Figure 4 It is a perspective view of the electrodeposition tank provided by the application.

[0023] Reference signs: 1, substrate; 11, substrate groove; 12, support column; 13, guide column; 14, pressing plate; 15, pivoting groove; 16, handle; 17, elastic member; 2, electrodeposition tank base; 21, through groove; 22, arc-shaped groove; 23, guide rail; 24, conductive column; 3, electrodeposition tank; 31, bottom of the electrodeposition tank; 32, annular protrusion; 33, top of the electrodeposition tank. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be further described in details below with reference to the drawings and embodiments. The following embodiments are used to illustrate the present application but should not be used to limit the scope of the present application.

[0025] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the embodiments of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for description purposes and cannot be understood as indicating or implying relative importance.

[0026] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, wherein the fixedly connected can include the manner of integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0027] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or it can only mean that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or it can only mean that the horizontal height of the first feature is less than that of the second feature.

[0028] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0029] The following will be described in combination with Figures 1 to 4 The electrodeposition device for preparing an α plane source of the present application is described.

[0030] Figure 1 is a perspective view of the electrodeposition device for preparing an α plane source provided by the present application, as Figure 1 The electrodeposition device for preparing an α plane source includes a substrate 1, an electrodeposition tank base 2 and an electrodeposition tank 3, as shown.

[0031] Figure 2 is a perspective view of the substrate, as Figure 2 The substrate 1 is placed on a general platform, for example, on the bottom surface inside a glove box. In combination Figure 1 The electrodeposition tank base 2 is fixedly connected to the substrate 1. The electrodeposition tank 3 is placed on the electrodeposition tank base 2.

[0032] In order to keep the electrodeposition tank 3 on the electrodeposition tank base 2, the electrodeposition device for preparing an α plane source is further provided with at least one pressing assembly, each pressing assembly including a support column 12, a guide column 13 and a pressing plate 14. For example, the number of pressing assemblies can be configured as 2, 4 or more. Referring to Figure 1 In the present embodiment, the number of pressing assemblies is 2, which are symmetrically arranged on the substrate 1 with respect to the length direction of the substrate 1. In other embodiments, the additional pressing assemblies can be arranged symmetrically on the substrate 1 with respect to the width direction of the substrate 1, or respectively arranged on the substrate 1 in alignment with the geometric center of the substrate 1.

[0033] Referring to Figure 1 and Figure 2 Here, only the layout of the pressing assembly symmetrically arranged on the substrate 1 with respect to the length direction of the substrate 1 is taken as an example to illustrate the spatial layout and connection relationship of the support column 12, the guide column 13 and the pressing plate 14, and other layouts of the pressing assembly with respect to the substrate 1 can be adapted on the basis of the layout symmetrically arranged with respect to the length direction of the substrate 1, which will not be described here.

[0034] In the length direction of the substrate 1, the support column 12 of each compression assembly is fixed on the substrate 1 away from the electrodeposition tank 3, in other words, the support column 12 is arranged close to the edge in the length direction of the substrate 1. The guide column 13 is fixed on the substrate 1 closer to the electrodeposition tank 3 than the support column 12, in other words, in the length direction of the substrate 1, the guide column 13 is closer to the inner side of the substrate 1 than the support column 12. The support column 12 and the guide column 13 are each fixedly connected to the substrate 1, for example by means of a fixed manner of screw connection and welding. The tail end of the compression plate 14 is movably connected to the support column 12; the middle section of the compression plate 14 is provided with a first through hole through which the guide column 13 passes, in particular, the hole diameter of the first through hole is slightly larger than the diameter of the guide column 13, so that the compression plate 14 is movable in a non-orthogonal posture relative to the guide column 13; the head end of the compression plate 14 is connected to the electrodeposition tank 3, in particular, the head end of the compression plate 14 is separable from the electrodeposition tank 3.

[0035] The guide column 13 cooperates with the first through hole, so that the compression plate 14 moves up and down along the guide column 13 approximately orthogonally to each other. At the same time, the tail end of the compression plate 14 is movable relative to the support column 12, but the two remain connected. Under the cooperation of the three, the movable manner of the compression plate 14 is that, with the connection point of the tail end of the compression plate 14 and the support column 12 as a fulcrum, the head end of the compression plate 14 moves up and down in the vertical / height direction under the guidance of the guide column 13, that is, the compression plate 14 swings in the vertical / height direction with the aforementioned fulcrum as the axis.

[0036] Thus, by providing at least one compression assembly to compress the electrodeposition tank 3 on the electrodeposition tank base 2, the operation of the compression assembly is quite simple and fast, the operator only needs to press the compression plate 14 in the compression assembly downward, which can ensure that the compression assembly presses the electrodeposition tank 3 downward until the electrodeposition tank 3 is firmly compressed on the electrodeposition tank base 2; conversely, the operator only needs to reset the compression plate 14 to no longer press the electrodeposition tank 3 downward, which can release the fixation between the electrodeposition tank 3 and the electrodeposition tank base 2 in order to remove the electrodeposition tank 3, thereby realizing the quick assembly and disassembly of the electrodeposition tank 3, greatly shortening the time required for disassembly.

[0037] Further, the tail end of the compression plate 14 is provided with a pivot slot 15, and the top end of the support column 12 extends into the pivot slot 15. The pivot slot 15 can be formed as a smooth arcuate slot; correspondingly, the top end of the support column 12 can be formed as a semispherical body to cooperate with the pivot slot 15. Thus, the compression plate 14 can be pivoted around the semispherical body of the top end of the support column 12 like a movable joint, and the rotation amplitude of the compression plate 14 is limited by the respective main body parts of the support column 12 and the compression plate 14.

[0038] Figure 4 is a perspective view of the electrodeposition tank provided by the present application, as Figure 4As shown, the outer circumferential surface of the electrodeposition tank 3 is provided with an annular protrusion 32. The head end of the pressing plate 14 contacts and presses down the annular protrusion 32 of the electrodeposition tank 3, so as to further press the electrodeposition tank 3 on the electrodeposition tank base 2. Moreover, as mentioned above, the head end of the pressing plate 14 and the annular protrusion 32 are separable from each other, so as to facilitate the placement or removal of the electrodeposition tank 3.

[0039] Further, each pressing assembly further comprises a handle 16. The handle 16 is sleeved on the guide column 13 and is located above the middle section of the pressing plate 14. The bottom of the handle 16 and the top surface of the pressing plate 14 abut with each other. The advantage of such an arrangement is that the operator does not have to directly operate the pressing plate 14 to press down the electrodeposition tank 3, instead, the operator can operate the handle 16 so that the bottom of the handle 16 presses down the top surface of the pressing plate 14, thereby realizing the fixed mode of the pressing plate 14 pressing down the electrodeposition tank 3.

[0040] Further, the handle 16 is provided with a second through hole for sleeving the handle 16 on the guide column 13, and the second through hole is provided with an internal thread; correspondingly, at least the upper section of the guide column 13 is provided with an external thread. The handle 16 and the guide column 13 are connected with each other through thread cooperation, and the cooperation of the internal thread and the external thread enables the handle 16 to rotate spirally around the guide column 13. In particular, the thread of the handle 16 and the guide column 13 is gap cooperation, so that the handle 16 is easy to move up and down spirally along the guide column 13 under the guidance of the thread, instead of being fixed at any section of the guide column 13 due to the thread cooperation between the two. The advantage of such an arrangement is that the operator can accurately adjust the pressing stroke of the handle 16 and the pressing plate 14, thereby ensuring that the head end of the pressing plate 14 presses down the electrodeposition tank 3.

[0041] Further, the guide column 13 is sleeved with an elastic member 17, and the first end of the elastic member 17 is connected to the base plate 1 and the second end is connected to the middle section of the pressing plate 14. The elastic member 17 can be a spring or other similar objects. When the operator rotates the handle 16 to drive the pressing plate 14 to swing downward, the operator also needs to overcome the repulsive force of the elastic member 17; when the operator releases the handle 16, at this time the elastic member 17 is in a compressed state, and exerts a repulsive force on the base plate 1 and the pressing plate 14. Depending on whether the thread cooperation between the handle 16 and the guide column 13 adopts a self-locking thread design, the feedback of the pressing plate 14 and the handle 16 under the repulsive force of the elastic member 17 on the pressing plate 14 is different. In the case of self-locking thread, the elastic member 17 cooperates with the self-locking thread to lock the handle 16 and the pressing plate 14 at a certain position, i.e. the position of the two when the operator releases the handle 16; in the case of non-self-locking thread, the elastic member 17 lifts the handle 16 and the pressing plate 14 until the elastic member 17 returns to its natural state.

[0042] Figure 3 is a perspective view of the electrodeposition tank base provided by the present application, as Figure 3As shown, the electrodeposition tank base 2 is formed in a cylindrical or disc shape. The electrodeposition tank base 2 is provided with a through groove 21 which penetrates the electrodeposition tank base 2 in its radial direction, and the depth of the through groove 21 is less than the height of the electrodeposition tank base 2. Such design results in that the through groove 21 only penetrates the electrodeposition tank base 2 in its radial direction, but not in its height direction. The through groove 21 is provided not only to reserve a ventilation and heat dissipation path for the deposition source sheet, but also to facilitate the removal of the deposition source sheet after the deposition process is completed, i.e. the operator can pry up the deposition source sheet by means of the space of the through groove 21.

[0043] Further, on the top surface of the electrodeposition tank base 2, arc-shaped grooves 22 are provided on both sides of the through groove 21. The arc-shaped grooves 22 on both sides of the through groove 21 together with the part of the through groove 21 originally provided constitute a circular recess, which is used to accommodate the bottom 31 of the electrodeposition tank. Figure 4 More specifically, the circular recess constituted by the arc-shaped grooves 22 and the part of the through groove 21 is used not only to accommodate the bottom 31 of the electrodeposition tank, but also to accommodate the deposition source sheet to be processed and the sealing member which will be described later.

[0044] Further, the electrodeposition tank base 2 further comprises a sealing member (not shown in the figure), and the deposition source sheet to be processed, the sealing member and the electrodeposition tank 3 are sequentially placed into the circular recess. The sealing member can be a rubber gasket or other forms of sealing member. In other words, when the electrodeposition tank base 2 and the electrodeposition tank 3 are assembled in place with each other, the electrodeposition tank base 2, the deposition source sheet to be processed, the sealing member and the electrodeposition tank 3 are arranged from bottom to top.

[0045] The advantage of such configuration is that the electrodeposition tank 3 and the electrodeposition liquid are arranged above the deposition source sheet to be processed, and the sealing member is arranged between the electrodeposition tank 3 and the deposition source sheet, so that the electrodeposition liquid can basically cover the entire upward-facing surface of the deposition source sheet, so that when the anode and the cathode of the electrodeposition device for preparing the α-plane source are electrified, the target metal ions in the electrodeposition liquid are deposited onto the upward-facing surface of the deposition source sheet; at the same time, the junction between the electrodeposition tank 3 and the deposition source sheet is sealed by the sealing member, preventing the electrodeposition liquid from leaking out from there.

[0046] Referring to Figure 1 and Figure 2, the substrate 1 is provided with a substrate groove 11, and the electro-deposition tank base 2 is provided with a guide rail 23 corresponding to the substrate groove 11 at the bottom thereof. When the electro-deposition tank base 2 is fixedly connected to the substrate 1, the guide rail 23 is embedded into the substrate groove 11. The guide rail 23 is provided with a conductive column 24, which is electrically connected to the deposition source sheet to be processed. Through the above configuration, the deposition source sheet to be processed is electrically connected to one of the electrodes of the power supply, and then cooperates with the other electrode member to form an electric field, so as to deposit the metal ions in the electro-deposition liquid onto the deposition source sheet.

[0047] Further, the electro-deposition device for preparing the α-plane source further comprises an electrode member (not shown in the figure). The electrode member is composed of a conductive wire wound into a disc shape, for example, similar to the shape of a disc-type mosquito-repellent incense. The disc-shaped electrode member has an outer diameter designed to be not greater than the inner diameter of the electro-deposition tank 3. The electrode member is placed into the electro-deposition tank 3, in particular, through the top 33 of the electro-deposition tank. Preferably, the disc-shaped electrode member is placed to be suspended in the electro-deposition liquid in a substantially horizontal posture. In this way, the electrode member and the deposition source sheet are substantially parallel to and face each other, so as to form a required electric field therebetween.

[0048] Generally, in the general radioactive source electro-deposition process, the deposition source sheet is electrically connected to the cathode of the power supply, and the electrode member is electrically connected to the anode of the power supply. However, in some specific scenarios, it can also be configured to be reversely polarized, i.e., the deposition source sheet is electrically connected to the anode of the power supply, and the electrode member is electrically connected to the cathode of the power supply.

[0049] Further, the electro-deposition tank 3 is made of transparent acrylic. In this way, the electro-deposition tank 3 has good chemical stability and visibility, which facilitates the operator to observe the whole process of the deposition procedure.

[0050] Additionally, the quick-disassembly electro-deposition device can also be configured with an electro-deposition liquid supply device. After the electro-deposition tank 3 and the electro-deposition tank base 2 are assembled in place, the electro-deposition liquid is supplied to the electro-deposition tank 3 by means of the electro-deposition liquid supply device; when the deposition procedure of the deposition source sheet is completed, the electro-deposition liquid can be recovered into an external liquid tank by reversely operating the electro-deposition liquid supply device.

[0051] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electrodeposition apparatus for preparing an alpha plane source, characterized by, The utility model relates to an electrodeposition tank device, comprising: a substrate; an electrodeposition tank base fixed to the substrate; an electrodeposition tank placed on the electrodeposition tank base; at least one pressing assembly, each of which comprises a support column, a guide column and a pressing plate; the support column is fixed to the substrate away from the electrodeposition tank; the guide column is fixed to the substrate closer to the electrodeposition tank than the support column; the tail end of the pressing plate is movably connected to the support column, the middle section of the pressing plate is provided with a first through hole through which the guide column passes, and the head end of the pressing plate is connected to the electrodeposition tank; under the joint guidance of the guide column and the first through hole, the pressing plate swings around its connection point with the support column, so that the head end of the pressing plate presses the electrodeposition tank downward.

2. The electrodeposition apparatus for preparing an alpha plane source according to claim 1, wherein, The tail end of the pressing plate is provided with a pivot slot, and the top end of the support column extends into the pivot slot.

3. The electrodeposition apparatus for preparing an alpha plane source of claim 1, wherein, Each of the pressing assemblies further comprises a handle, which is sleeved on the guide column and located above the middle section of the pressing plate, and the bottom of the handle and the top surface of the pressing plate abut each other.

4. The electrodeposition apparatus for preparing an alpha plane source according to claim 3, wherein The handle is provided with a second through hole for sleeving on the guide column, and the second through hole is provided with internal threads; at least an upper section of the guide column is provided with external threads, and the cooperation of the internal threads and the external threads enables the handle to rotate spirally around the guide column.

5. The electrodeposition apparatus for preparing an alpha plane source of claim 4, wherein, The guide column is sleeved with an elastic member, the first end of the elastic member is connected to the substrate, and the second end is connected to the middle section of the pressing plate.

6. The electrodeposition apparatus for preparing an alpha plane source of claim 1, wherein, The electrodeposition tank base is formed in a cylindrical or disc shape, the electrodeposition tank base is provided with a through groove penetrating through itself along its radial direction, and the depth of the through groove is less than the height of the electrodeposition tank base.

7. The electrodeposition apparatus for preparing an alpha plane source of claim 6, wherein, On the top surface of the electrodeposition tank base, arc-shaped grooves are arranged on both sides of the through groove respectively, and the arc-shaped grooves and the through groove cooperatively form a circular recess to accommodate the bottom of the electrodeposition tank.

8. The electrodeposition apparatus for preparing an alpha plane source according to claim 7, wherein The electrodeposition tank base further comprises a sealing member, and the deposition source sheet to be treated, the sealing member and the electrodeposition tank are sequentially placed into the circular recess.

9. The electrodeposition apparatus for preparing an alpha plane source of claim 8, wherein, The substrate is provided with a substrate groove, the electrodeposition tank base is provided with a guide rail corresponding to the substrate groove at its bottom, the guide rail is provided with a conductive column, and the conductive column is electrically connected to the deposition source sheet to be treated.

10. The electrodeposition apparatus for preparing an alpha plane source of claim 9, wherein, Further comprising an electrode member formed in a disc shape, the outer diameter of which is not greater than the inner diameter of the electrodeposition tank, and the electrode member is placed into the electrodeposition tank.

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