Vertical electroplating equipment and vertical electroplating method

Abstract

The invention relates to the technical field of electroplating, and particularly provides vertical electroplating equipment and a vertical electroplating method.The vertical electroplating equipment comprises an electroplating bath, an anode assembly and a cathode piece; the electroplating bath is used for containing electroplating liquid; the anode assembly is fixed in the electroplating bath; the anode assembly comprises first anode pieces and second anode pieces, each first anode piece comprises a first working face, each second anode piece comprises a second working face, the first working faces and the second working faces are used for electroplating to-be-electroplated faces with different electroplating patterns, and the first anode pieces and the second anode pieces are alternately arranged at intervals; the cathode piece is used for arranging a to-be-electroplated piece; the to-be-electroplated part comprises a first to-be-electroplated surface and a second to-be-electroplated surface, and the electroplating patterns of the first to-be-electroplated surface and the second to-be-electroplated surface are different; the cathode piece is arranged between the first anode piece and the second anode piece, the first to-be-electroplated surface is opposite to the first working surface, and the second to-be-electroplated surface is opposite to the second working surface. The space utilization rate and the production efficiency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electroplating, in particular to a vertical electroplating device and a vertical electroplating method. BACKGROUND

[0002] With the development of the solar industry, higher requirements are put forward for the electrode preparation technology. The traditional screen printing conductive silver paste method has problems such as affecting the light shielding area due to the large electrode width and high cost. Therefore, a copper electroplating method is used, which can realize a narrower electrode width by replacing the noble metal silver with metal copper. The conventional copper electroplating process can be divided into horizontal and vertical types according to the orientation of the to-be-electroplated part during electroplating.

[0003] In vertical electroplating, the to-be-electroplated part is immersed in the electroplating solution in a vertical state and is electrically connected to the negative electrode of the power supply to form a cathode. An anode connected to the positive electrode of the power supply is arranged on both sides of the cathode. Under the action of the electric field, cations in the electroplating solution will be separated to the vicinity of the to-be-electroplated part and form a plating layer on the to-be-electroplated part. In the prior art, for a to-be-electroplated part with different electroplating patterns on two sides, two types of anodes need to be independently configured for it, which results in low space utilization and low production efficiency of the device. SUMMARY

[0004] The vertical electroplating device and the vertical electroplating method provided by the embodiments of the present application at least solve the problem of low space utilization and low production efficiency of the device in the prior art when electroplating a to-be-electroplated part with different electroplating patterns on two sides. By sharing an anode part, the space utilization and the production efficiency of the device are effectively improved.

[0005] In a first aspect, the present application provides a vertical electroplating device, comprising an electroplating tank for setting an electroplating solution; an anode assembly fixed in the electroplating tank; the anode assembly comprises a first anode part and a second anode part, the first anode part comprises a first working surface, the second anode part comprises a second working surface, the first working surface and the second working surface are respectively used for electroplating a to-be-electroplated surface with different electroplating patterns, the first anode part and the second anode part are alternately and spacedly arranged along a first direction, wherein the first direction is perpendicular to a second direction, and the second direction is parallel to the depth direction of the electroplating tank; a cathode part for setting a to-be-electroplated part; the to-be-electroplated part comprises a first to-be-electroplated surface and a second to-be-electroplated surface, the electroplating patterns of the first to-be-electroplated surface and the second to-be-electroplated surface are different; the cathode part is arranged between the first anode part and the second anode part, the first to-be-electroplated surface is arranged opposite to the first working surface, and the second to-be-electroplated surface is arranged opposite to the second working surface.

[0006] In an embodiment of the present application, the first anode member and the second anode member each comprise a plurality of anode sub-components, the plurality of anode sub-components are arranged in sequence and spaced apart along the second direction, or / and the plurality of anode sub-components are arranged in sequence and spaced apart along a third direction, wherein the third direction is perpendicular to the first direction and the second direction respectively.

[0007] In an embodiment of the present application, the anode assembly further comprises an anode conductive frame body, the anode conductive frame body is used to arrange the first anode member or the second anode member; the anode conductive frame body is provided with an electric connection part for connecting a positive pole of a power supply, the electric connection part is provided with at least three electric connection parts, and the at least three electric connection parts are uniformly spaced apart along the third direction.

[0008] In an embodiment of the present application, a first liquid spraying member is arranged at the bottom of the electroplating tank, and a second liquid spraying member is arranged between two adjacent anode sub-components along the second direction; the second liquid spraying member is provided with a plurality of liquid spraying openings, and the plurality of liquid spraying openings are arranged in sequence and spaced apart along the third direction.

[0009] In an embodiment of the present application, an included angle A between a spraying direction of the liquid spraying opening and a working surface of a target anode member satisfies a relationship of 15°≤A≤45°; wherein the target anode member is the first anode member or the second anode member in which the second liquid spraying member is arranged.

[0010] In an embodiment of the present application, the liquid spraying opening is provided with a nozzle, and the nozzle is provided with a spraying hole; along a spraying direction of the nozzle, the spraying hole comprises a first hole section, a second hole section and a third hole section arranged in sequence; an inner diameter of the second hole section is smaller than an inner diameter of the first hole section, and the inner diameter of the first hole section is smaller than an inner diameter of the third hole section; a hole wall of the third hole section is provided with an injection through hole.

[0011] In an embodiment of the present application, along the first direction, a distance from the first working surface to the first electroplating surface is not equal to a distance from the second working surface to the second electroplating surface.

[0012] In one embodiment of the present application, the cathode member comprises: a cathode conductive frame body comprising oppositely arranged first and second mounting surfaces; the cathode conductive frame body is provided with a through accommodating hole comprising a first hole opening and a second hole opening, the first hole opening is arranged on the first mounting surface, and the second hole opening is arranged on the second mounting surface; a fixed contact is arranged on the first mounting surface; a conductive torsion spring is arranged on the second mounting surface; the conductive torsion spring is provided with a plurality of springs arranged on both sides of the second hole opening along the width direction of the second hole opening; and the conductive torsion springs are sequentially and spacedly arranged along the length direction of the second hole opening; wherein the fixed contact and the conductive torsion spring respectively contact the first and second surfaces to be electroplated to fix the electroplating member in the accommodating hole.

[0013] In one embodiment of the present application, the conductive torsion spring comprises a clamping portion and two elastic portions; the two elastic portions are sequentially arranged along the length direction of the accommodating hole, each of the elastic portions comprises a connecting arm, a spiral component and a clamping arm, the connecting arm is connected to the cathode conductive frame body, and the two ends of the spiral component are respectively connected to the connecting arm and the clamping arm; and the two clamping arms are connected to the clamping portion.

[0014] In one embodiment of the present application, the second hole opening is provided with a sunken platform, the clamping portion comprises a first fixing component and a bending component, the first fixing component is provided with a first clamping surface on one side for contacting the electroplating member, the bending component is connected to the first fixing component and the clamping arm, and an included angle is arranged between the bending component and the clamping arm.

[0015] In one embodiment of the present application, at least one of the following features is included: the torque T of the conductive torsion spring satisfies the relationship 0.1N≤T≤20N; the wire diameter d of the conductive torsion spring satisfies the relationship 0.2mm≤d≤2mm; the torsion angle θ of the conductive torsion spring satisfies the relationship 0.1 radian≤θ≤1 radian; the middle diameter D of the spring coil of the conductive torsion spring satisfies the relationship 1mm≤D≤10mm; and the effective number of turns n of the conductive torsion spring satisfies the relationship 1 turn≤n≤10 turns.

[0016] In one embodiment of the present application, along the width direction of the first hole opening, mounting grooves are arranged on both sides of the first hole opening; the fixed contact comprises a connecting base and a fixed connecting portion, the connecting base is arranged in the mounting groove, and the fixed connecting portion is provided with a plurality of fixed connecting portions which are sequentially and spacedly arranged along the length direction of the first hole opening.

[0017] In one embodiment of the present application, the cathode conductive frame body, the fixed contact and the conductive torsion spring are at least partially coated with an insulating layer.

[0018] In a second aspect, the present application also provides a vertical electroplating method applied to the vertical electroplating device as claimed in any one of the preceding aspects, comprising the steps of: arranging a to-be-electroplated piece on a cathode piece; wherein the to-be-electroplated piece comprises a first to-be-electroplated surface and a second to-be-electroplated surface, and the first to-be-electroplated surface and the second to-be-electroplated surface have different electroplating patterns; arranging the cathode piece on an electroplating tank to perform electroplating; wherein the electroplating tank is provided with an electroplating solution and an anode assembly, the anode assembly comprises a first anode piece and a second anode piece, the first anode piece comprises a first working surface, the second anode piece comprises a second working surface, the first working surface and the second working surface are respectively used for electroplating to-be-electroplated surfaces with different electroplating patterns, and the first anode piece and the second anode piece are alternately and spacedly arranged along a first direction; the cathode piece is arranged between the first anode piece and the second anode piece, the first to-be-electroplated surface is arranged opposite to the first working surface, and the second to-be-electroplated surface is arranged opposite to the second working surface; the first direction is perpendicular to a second direction, and the second direction is parallel to a depth direction of the electroplating tank.

[0019] The above technical scheme of the present application has the following beneficial effects compared with the prior art:

[0020] The vertical electroplating device of the present application alternately and spacedly arranges the first anode piece and the second anode piece, and arranges the cathode piece between the two different anode pieces, thereby realizing electroplating for the to-be-electroplated piece with two to-be-electroplated surfaces having different electroplating pattern requirements. When electroplating the to-be-electroplated pieces on multiple cathode pieces, the to-be-electroplated pieces on two adjacent cathode pieces can share the same first anode piece or second anode piece. In this way, compared with the prior art, the number of anode pieces required for electroplating is effectively reduced from 2*N to N+1. This not only effectively reduces the electroplating cost, but also improves the space utilization rate in the electroplating tank, so as to arrange more components to realize electroplating, thereby improving the production efficiency and yield. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the present application and serve to explain the principles of the present application. In the drawings:

[0022] Figure 1 FIG. 1 is a sectional structure schematic diagram of an electroplating tank of a vertical electroplating device in the prior art.

[0023] Figure 2 FIG. 2 is a structure schematic diagram of a vertical electroplating device in a preferred embodiment of the present application.

[0024] Figure 3 FIG. 3 is a sectional structure schematic diagram of an electroplating tank in a preferred embodiment of the present application.

[0025] Figure 4 Figure 1 is a schematic diagram of the structure of an anode assembly in a preferred embodiment of the present application.

[0026] Figure 5 Figure 2 is a schematic diagram of the circuit inside a plating tank in a preferred embodiment of the present application.

[0027] Figure 6 Figure 3 is a schematic diagram of the structure of a partial anode assembly in a preferred embodiment of the present application.

[0028] Figure 7 Figure 4 is a schematic diagram of the sectional structure of a first liquid jet and a second liquid jet in a preferred embodiment of the present application.

[0029] Figure 8 Figure 5 is a schematic diagram of the structure of a cathode in a preferred embodiment of the present application.

[0030] Figure 9 Figure 6 is a schematic diagram of the structure of another cathode in a preferred embodiment of the present application.

[0031] Figure 10 Figure 7 is a schematic diagram of the structure of a conductive torsion spring in a preferred embodiment of the present application.

[0032] Figure 11 Figure 8 is a schematic diagram of the structure of a fixed contact in a preferred embodiment of the present application.

[0033] Figure 12 Figure 9 is a schematic diagram of the structure of another fixed contact in a preferred embodiment of the present application.

[0034] Figure 13 Figure 10 is a schematic diagram of the structure of an opening clamp in a preferred embodiment of the present application.

[0035] Figure 14 Figure 11 is a schematic diagram of the flow of a vertical plating method in a preferred embodiment of the present application.

[0036] Wherein, the above-mentioned drawings include the following reference signs: 011, first anode; 012, second anode; 02, side nozzle; 03, cathode; 04, baffle; 05, bottom nozzle; D1, first direction; D2, second direction; D3, third direction; 10, electroplating tank; 11, cathode driver; 12, filter; 13, heater; 20, anode assembly; 201, anode sub-component; 21, first anode piece; 211, first working surface; 22, second anode piece; 221, second working surface; 23, anode conductive frame body; 231, electrical connection part; 30, cathode piece; 31, to-be-electroplated piece; 311, first to-be-electroplated surface; 312, second to-be-electroplated surface; 32, cathode conductive frame body; 321, first mounting surface; 322, second mounting surface; 323, accommodating hole; 3231, first orifice; 3232, second orifice; 3233, sink; 3234, mounting groove; 33, fixed contact; 331, connecting base body; 332, fixed connection part; 3321, first connection component; 3322, second fixed component; 33221, second clamping surface; 34, conductive torsion spring; 341, clamping part; 3411, first fixed component; 34111, first clamping surface; 3412, bending component; 342, elastic part; 3421, connecting arm; 3422, helical component; 3423, clamping arm; 40, rectifier; 41, positive electrode of power supply; 42, negative electrode of power supply; 51, first liquid spraying piece; 52, second liquid spraying piece; 521, liquid spraying port; 53, nozzle; 531, first hole section; 532, second hole section; 533, third hole section; 534, injection through hole; 60, clamping opener; 61, clamping opener base body; 62, clamping opener piece; 621, second connection component; 622, clamping opener component. DETAILED DESCRIPTION

[0037] It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0038] It should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should also be understood that, when the terms "comprise" and / or "include" are used in the specification, there is a presence of a feature, step, operation, device, component and / or combination thereof.

[0039] The foregoing merely illustrates the principles of the application. Various modifications and alterations to the methods and devices described in this application will be apparent to those skilled in the art in view of the foregoing description. It will be appreciated that those skilled in the art will be able to devise numerous techniques which, although perhaps not explicitly set forth in the following description, embody the principles of the application and, thus, are within the spirit and scope of the application. The drawings in which:

[0040] It should be noted that the drawings Figure 1 illustrated Figure 1 show a cross-sectional structure of an existing vertical electroplating device when electroplating a workpiece with different electroplating patterns on two surfaces. The cathode 03 includes the workpiece, and the electroplating patterns on the two surfaces of the workpiece are different.

[0041] To this end, a first anode 011 and a second anode 012 need to be independently arranged on both sides of each cathode 03. That is, one first anode 011, one cathode 03, and one second anode 012 form a component group, and each component group needs to be separated by a baffle 04. This electroplating arrangement occupies a large space for each component group, and the distance between the anode and the cathode 03 is usually more than 150 mm. Low space utilization means that the number of cathodes 03 that can be electroplated in the electroplating tank is limited, and the production efficiency and yield are low.

[0042] To solve the above problems, referring to Figure 2 and Figure 3 , the embodiment of the present application provides a vertical electroplating device, which comprises an electroplating tank 10, an anode component 20, and a cathode 30.

[0043] The electroplating tank 10 is used to set the electroplating solution. Those skilled in the art can set the shape of the electroplating tank 10 and the circulation flow path of the corresponding electroplating solution according to actual needs. Preferably, a cuboid-shaped electroplating tank 10 is used, and a filter 12, a heater 13, and other components are arranged for the electroplating tank 10 to process the electroplating solution.

[0044] The anode assembly 20 is fixed in the electroplating tank 10 and cooperates with the cathode pieces 30 to realize electroplating. The anode assembly 20 comprises a first anode piece 21 and a second anode piece 22, the first anode piece 21 comprises a first working surface 211, and the second anode piece 22 comprises a second working surface 221, the first working surface 211 and the second working surface 221 are respectively used for electroplating the surfaces to be electroplated with different electroplating patterns.

[0045] The first anode piece 21 and the second anode piece 22 are alternately and spacedly arranged along a first direction D1, the first direction D1 is perpendicular to a second direction D2, the second direction D2 is parallel to the depth direction of the electroplating tank 10, and a third direction D3 is perpendicular to the first direction D1 and the second direction D2 respectively.

[0046] Preferably, the first working surface 211 and the second working surface 221 are arranged in parallel. In the case of arranging the first working surface 211 and the second working surface 221 in parallel, the first direction D1 is perpendicular to the first working surface 211 and the second working surface 221 respectively.

[0047] In the case of alternately and spacedly arranging, the total number of the first anode piece 21 and the second anode piece 22 is at least three. That is, one second anode piece 22 is arranged between two first anode pieces 21, or one first anode piece 21 is arranged between two second anode pieces 22, so as to realize electroplating of two cathode pieces 30.

[0048] In the case of arranging one second anode piece 22 between two first anode pieces 21, the second anode piece 22 is shared by the two cathode pieces 30 at this time; in the case of arranging one first anode piece 21 between two second anode pieces 22, the first anode piece 21 is shared by the two cathode pieces 30 at this time.

[0049] Of course, in order to improve the yield, more first anode pieces 21 and second anode pieces 22 can also be arranged. For example, the total number of the first anode pieces 21 and the second anode pieces 22 is set to seven, that is, four first anode pieces 21 and three second anode pieces 22, or three first anode pieces 21 and four second anode pieces 22, so as to realize electroplating of the surfaces to be electroplated 31 on six cathode pieces 30 at the same time.

[0050] The cathode member 30 is used to set the to-be-plated member 31, which is usually a silicon wafer of a solar cell. Taking copper plating as an example, the to-be-plated member 31 has a reduction reaction with copper ions and is deposited. The to-be-plated member 31 includes a first to-be-plated surface 311 and a second to-be-plated surface 312, and the plating patterns of the first to-be-plated surface 311 and the second to-be-plated surface 312 are different, mainly referring to different plating areas. In the case of different plating areas, the grid line heights on the two to-be-plated surfaces can be the same or different. The cathode member 30 is arranged between the first anode member 21 and the second anode member 22, the first to-be-plated surface 311 is arranged opposite to the first working surface 211, and the second to-be-plated surface 312 is arranged opposite to the second working surface 221. In this way, the two cathode members 30 can evenly distribute the metal plating layer of appropriate thickness on the corresponding to-be-plated surface under the condition of sharing the same anode member, thereby ensuring high plating quality.

[0051] In the case that the to-be-plated member 31 is moved between the first working surface 211 and the second working surface 221 by manual or automatic transportation, the plating solution flows between the working surface and the to-be-plated surface. Under the driving of the potential of the rectifier 40 and the flow of the plating solution, the metal ions in the plating solution or electrolyzed by the anode member are reduced on the corresponding pattern area of the to-be-plated surface, thereby obtaining a metal plating layer and completing the double-sided plating of the to-be-plated member 31.

[0052] Preferably, the cathode member 30 is driven to swing along the third direction D3 by setting the cathode driver 11 during plating. The cathode driver 11 belongs to the prior art, and the principle of swing driving is not described here.

[0053] In the prior art, the non-shared mode, N cathodes need to be provided with 2*N anodes (N>1). Not only the space utilization rate is low, but also the production is low, and the number of anodes required is large. The cost of anode is high, which leads to high overall plating cost.

[0054] In the present application, by setting the structure, the anode member can be shared, and in the case of setting N cathode members 30, only N+1 anode members are required to meet the plating demand. On this basis, the space arrangement in the plating tank 10 can be effectively optimized, the space utilization rate is improved, more anode members and cathode members 30 are set, and the production efficiency and yield are improved. The demand for expensive anode members is reduced, and the plating cost is effectively reduced.

[0055] The vertical electroplating equipment of this invention arranges a first anode 21 and a second anode 22 alternately, and places a cathode 30 between the two different anodes, thereby enabling electroplating of two electroplated parts 31 with different electroplating pattern requirements on two electroplating surfaces. When electroplating parts 31 on multiple cathodes 30, parts 31 on adjacent cathodes 30 can share the same first anode 21 or second anode 22. Thus, compared with the prior art, the number of anodes required for electroplating is effectively reduced from 2*N to N+1. This not only effectively reduces electroplating costs but also improves the space utilization within the electroplating tank 10, allowing for the installation of more components to achieve electroplating, thereby increasing production efficiency and output.

[0056] Reference Figure 4 and Figure 6 As shown, in some embodiments of the vertical electroplating equipment of the present invention, both the first anode element 21 and the second anode element 22 include multiple anode sub-components 201. Taking copper electroplating as an example, the anode sub-components 201 are typically the main source of copper ions in the electroplating solution and also help maintain the ion concentration. For example, the anode sub-components 201 can be configured as soluble anodes, dissolving and releasing copper ions when energized; or they can be configured as insoluble anodes, not dissolving when energized, acting only as electronic conductors, completing electroplating through the oxidation reaction of other ions in the electroplating solution. In this case, additional copper ions need to be added to maintain the concentration of the electroplating solution.

[0057] In this configuration, multiple anode sub-components 201 are arranged at intervals along a second direction D2, or / and multiple anode sub-components 201 are arranged at intervals along a third direction D3. Thus, three configurations are included.

[0058] The first type: Multiple anode sub-components 201 on the first anode component 21 and the second anode component 22 are arranged sequentially at intervals along the second direction D2.

[0059] The second type: multiple anode sub-components 201 on the first anode component 21 and the second anode component 22 are arranged sequentially at intervals along the third direction D3.

[0060] The third type: a portion of the multiple anode sub-components 201 on the first anode component 21 and the second anode component 22 are arranged at intervals along the second direction D2, and a portion are arranged at intervals along the third direction D3.

[0061] Thus, by increasing the number of anode sub-components 201 on the anode component, more parts 31 to be electroplated can be electroplated, further increasing product yield. Figure 4 For example, the second direction D2 and the third direction D3 correspond to columns and rows respectively. Each anode component has two rows and eight columns, with a total of sixteen anode sub-components 201.

[0062] Correspondingly, the to-be-plated pieces 31 on the cathode piece 30 also need to be provided in plurality and are sequentially and spaced apart along the second direction D2 and / or sequentially and spaced apart along the third direction D3 to correspond to the anode sub-component 201. In the case of 2*8*6, i.e. 96 to-be-plated pieces 31, the yield can reach 16000 pieces / hour.

[0063] Referring to Figure 4 As shown in the figure, in some embodiments, the vertical plating equipment according to the present application further comprises an anode conductive frame body 23 for arranging the first anode piece 21 or the second anode piece 22. The anode conductive frame body 23 is provided with an electrical connection part 231, and the anode conductive frame body 23 is electrically connected to the positive pole 41 of the power supply through the electrical connection part 231 to perform electroplating.

[0064] In the prior art, the anode conductive frame body 23 is usually provided with only two electrical connection parts 231, and the current is introduced at the same time. However, the anode conductive frame body 23 itself is resistive, which leads to a decrease in current from the input of the electrical connection part 231 to the far end. The farther the current moves, the more it decreases. In this way, the uniformity of electroplating is affected, and the electroplating quality of the finished product is poor.

[0065] In order to reduce the influence of resistance on the uniformity of electroplating, in the embodiments of the present application, the number of electrical connection parts 231 on the anode conductive frame body 23 is increased. The electrical connection part 231 is provided with at least three. These electrical connection parts 231 are uniformly spaced apart along the third direction D3 on the anode conductive frame body 23, and the current is introduced. Those skilled in the art can set the number of electrical connection parts 231 according to actual needs, such as three, four, five, six, seven, eight, etc.

[0066] In this way, by increasing the number of electrical connection parts 231, it can be understood that one large resistance is divided into multiple parallel resistances, the total resistance value of the resistance is reduced, and the problem of current reduction caused by resistance can be effectively reduced, and the uniformity of electroplating is improved. Through the control variable experiment of the applicant, the electroplating uniformity of about 35% can be improved to 30%.

[0067] Preferably, in the embodiments of the present application, referring to Figure 5 As shown in the figure, by using the double-output rectifier 40 as the power supply, the negative pole 42 of the rectifier 40 is electrically connected to the cathode piece 30, the positive pole 41 is electrically connected to the electrical connection part 231 of the anode piece, and then a loop is formed with the electroplating solution. Taking copper electroplating as an example, copper ions are reduced to metal copper on the to-be-plated surface of the to-be-plated piece 31, and with the increase of the electroplating time, the thickness of the metal copper also increases, forming a copper electrode grid line.

[0068] It should be noted that in the past, the bottom spray pipe 05 is usually arranged at the bottom of the tank to spray the cathode 03. However, the power line is usually arranged at the bottom of the tank, which will block the bottom spray pipe 05.

[0069] To this end, referring to Figure 1 , in the prior art, in order to improve the plating effect, in addition to arranging the bottom spray pipe 05 at the bottom of the plating tank 10, a side spray pipe 02 is also needed to be arranged between the anode and the cathode to improve the side circulation. Although this way can optimize the plating uniformity, the arrangement of the side spray pipe 02 will occupy space and affect the overall space utilization. Generally speaking, the distance between the anode and the cathode will exceed 15 cm.

[0070] And if the side spray pipe 02 is removed and the to-be-plated pieces 31 are arranged in multiple rows in the second direction D2, the plating uniformity of the to-be-plated pieces 31 located above will be adversely affected, and the plating quality will be poor.

[0071] To solve the above problems, referring to Figure 5 and Figure 6 , the vertical plating equipment according to the present application further comprises a first spray member 51 and a second spray member 52 in some embodiments. The first spray member 51 is arranged at the bottom of the plating tank 10 to make the plating solution in the plating tank 10 flow.

[0072] Among them, along the second direction D2, the second spray member 52 is arranged between the adjacent two anode sub-components 201. The second spray member 52 is provided with a spray port 521, through which the to-be-plated pieces 31 located on one side or both sides of the first direction D1 are sprayed with plating solution to optimize the side circulation.

[0073] In this way, in the case that the to-be-plated pieces 31 are arranged in multiple rows in the second direction D2, the second spray member 52 can timely supplement the metal ions consumed by the to-be-plated pieces 31 located above during the plating process, effectively improving the plating uniformity of these to-be-plated pieces 31, and solving the problem that the first spray member 51 cannot reach the to-be-plated pieces 31 located above, resulting in substandard plating quality of the to-be-plated pieces 31 located above.

[0074] In addition, compared with the side spray pipe 02 in the prior art, since the second spray member 52 is arranged between the adjacent two anode sub-components 201 along the second direction D2, the depth direction of the plating tank 10 can be fully utilized, the space arrangement of the plating tank 10 in the first direction D1 is optimized, the distance between the anode member and the cathode member 30 in the first direction D1 is effectively reduced, more anode members and cathode members 30 can be arranged, and the production efficiency and yield are improved. Referring to Figure 5As shown, through actual tests, the distance between the present one first anode member 21, one cathode member 30 and one second anode member 22 can achieve 4cm+4cm=8cm, far less than 15cm+15cm=30cm in the prior art.

[0075] Preferably, the second liquid spraying member 52 is provided with a plurality of liquid spraying openings 521, the plurality of liquid spraying openings 521 are sequentially and spaced apart along the third direction D3, and the liquid is sprayed through the plurality of liquid spraying openings 521 at the same time, thereby further optimizing the side edge circulation effect and improving the electroplating quality.

[0076] The spraying direction of the liquid spraying opening 521 can be towards the upper side of the electroplating tank 10 along the second direction D2, or can be towards the lower side. Preferably, the spraying direction of the liquid spraying opening 521 is upwards, so as to drive the electroplating liquid below the electroplating tank 10 to move upwards, thereby optimizing the side edge circulation of the cathode member 30.

[0077] The plurality of liquid spraying openings 521 on the same second liquid spraying member 52 can all spray liquid towards the cathode member 30 on the same side along the first direction D1, or can spray liquid towards the cathode member 30 on different sides. Preferably, in the case where the plurality of liquid spraying openings 521 spray liquid towards the cathode member 30 on different sides, the different liquid spraying openings 521 are sequentially and alternately arranged.

[0078] Further, referring to Figure 7 As shown, in some embodiments of the vertical electroplating equipment, the included angle A between the spraying direction of the liquid spraying opening 521 and the working surface of the target anode member satisfies the relationship formula 15°≤A≤45°. The target anode member is the first anode member 21 or the second anode member 22 where the second liquid spraying member 52 is located, so as to Figure 7 As an example of the structure shown, if the anode sub-member 201 on both sides of the second liquid spraying member 52 along the second direction D2 is the first anode member 21 at this time, the target anode member is the first anode member 21. Those skilled in the art can set the size of the included angle A according to actual needs, such as 15°, 20°, 25°, 30°, 35°, 40°, 45°, etc.

[0079] On this basis, good spraying effect can be effectively ensured, the coverage efficiency of the electroplating liquid driven by the liquid spraying opening 521 is improved, the consumed metal ions in the electroplating process are replenished in time, and the electroplating uniformity of the electroplating piece 31 is improved.

[0080] Referring to Figure 7 As shown, in some embodiments of the vertical electroplating equipment, the liquid spraying opening 521 is provided with a nozzle 53, the nozzle 53 is provided with a spraying hole, and the nozzle 53 is used to realize the circulation of the electroplating liquid, thereby improving the electroplating quality.

[0081] Specifically, along the spraying direction of the nozzle 53, the spraying hole comprises a first hole section 531, a second hole section 532 and a third hole section 533 arranged in sequence, the inner diameter of the second hole section 532 is smaller than that of the first hole section 531, and the inner diameter of the first hole section 531 is smaller than that of the third hole section 533.

[0082] The first hole section 531 is an entry section of the electroplating solution, and the hole diameter is relatively wide, so that the electroplating solution is relatively stable. The second hole section 532 is a contraction section, and the hole diameter is narrowed to make the electroplating solution flow towards the radial center of the hole, and the flow speed is increased. After the electroplating solution rapidly passes through the second hole section 532 and enters the third hole section 533, the hole diameter of the third hole section 533 is widened again, so that the subsequent flow speed of the electroplating solution gradually decreases. However, after the acceleration of the second hole section 532, the electroplating solution can be sprayed out at a relatively high flow speed.

[0083] In addition, the hole wall of the third hole section 533 is provided with an injection through hole 534. In the case of high-speed flow of the electroplating solution, a negative pressure area is formed near it, that is, the electroplating solution on the side will flow to the side of the nozzle 53. Through the injection through hole 534 on the hole wall of the third hole section 533, this part of the electroplating solution flowing relatively close to the nozzle 53 can be sucked into the nozzle 53 and then sprayed out with the electroplating solution of the spraying hole.

[0084] In the electroplating tank 10, the electroplating solution flows on the surface of the workpiece 31. Due to the viscosity effect, the fluid speed of the electroplating solution close to the surface of the workpiece 31 is basically zero. The speed of the electroplating solution gradually increases in the direction away from the workpiece 31, which is the main flow layer. A part of the electroplating solution has a sharp change in speed, and this part of the electroplating solution is a thin layer, that is, a boundary layer. Metal ions will pass through the boundary layer from the main flow layer to the surface of the workpiece 31 and be reduced and deposited. The thickness of the boundary layer affects the electroplating effect.

[0085] In the embodiment of the application, by arranging the nozzle 53 with a special spraying hole, the boundary layer can be thinned, the solute exchange of the electroplating solution between the main flow layer and the boundary layer is facilitated, the metal ions are supplemented to the workpiece 31, and the electroplating quality is improved. In addition, it is also beneficial to the timely transfer of heat in the reduction reaction process, so as to further improve the electroplating quality. Through the control variable experiment of the applicant, the electroplating uniformity of about 35% can be improved to about 20%.

[0086] Reference Figure 5As shown, in some embodiments, the distance between the first working surface 211 and the first to-be-plated surface 311 along the first direction D1 is not equal to the distance between the second working surface 221 and the second to-be-plated surface 312. In this way, there are two cases: the first case is that the distance between the first working surface 211 and the first to-be-plated surface 311 is less than the distance between the second working surface 221 and the second to-be-plated surface 312; the second case is that the distance between the second working surface 221 and the second to-be-plated surface 312 is less than the distance between the first working surface 211 and the first to-be-plated surface 311.

[0087] The distance between the working surface and the corresponding to-be-plated surface is determined by the to-be-plated surface. In the embodiments of the present application, the distance corresponding to the to-be-plated surface as the front surface of the solar cell is set to be smaller. In this way, the space in the plating tank 10 obtained by optimizing the arrangement of the internal components can be fully utilized to differentiate the grid line heights on the two to-be-plated surfaces of the to-be-plated piece 31.

[0088] In the case where the distance between the working surface and the to-be-plated surface is small, the deposition rate of metal ions is higher, and thus the obtained grid line height is higher. Taking a solar cell silicon wafer as an example, the grid line on the front surface of the silicon wafer is required to be narrow and high so as to reduce the grid line shielding and thus obtain more sunlight and improve the conversion efficiency of the cell. The grid line on the back surface of the silicon wafer is required to be wide and low to prevent damage and ensure high yield and quality in production.

[0089] For example, the distance between the first working surface 211 and the first to-be-plated surface 311 can be set to 7.5 cm, and the distance between the second working surface 221 and the second to-be-plated surface 312 can be set to 16 cm.

[0090] It should be noted that, in order to fix the to-be-plated piece 31, a tension spring is usually used to clamp and fix the to-be-plated piece 31 in the prior art. In order to enable the tension spring to stretch and contract along its axial direction, an axial space for deformation of the tension spring is usually required. In this way, the close arrangement of the anode and the cathode 30 in the plating tank 10 is not conducive, and the space utilization is low.

[0091] In order to solve the above problems, with reference to Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, the cathode 30 includes a cathode conductive frame body 32, a fixed contact 33, and a conductive torsion spring 34.

[0092] The cathode conductive frame body 32 serves as a basic frame for setting the to-be-plated part 31 and cooperates with the cathode driver 11, the rectifier 40 and other components to realize electroplating. Specifically, the cathode conductive frame body 32 comprises a first mounting surface 321 and a second mounting surface 322 arranged oppositely. The cathode conductive frame body 32 is provided with a through accommodating hole 323 comprising a first hole opening 3231 and a second hole opening 3232, the first hole opening 3231 being arranged on the first mounting surface 321 and the second hole opening 3232 being arranged on the second mounting surface 322. The to-be-plated part 31 is arranged in the accommodating hole 323, and the to-be-plated part 31 is usually in a cuboid sheet structure, and the accommodating hole 323 is preferably also arranged in a square hole.

[0093] The skilled in the art can set the number of the accommodating holes 323 according to actual needs, and the accommodating holes 323 are also arranged in multiple numbers in the case that the anode sub-component 201 is arranged in multiple numbers. In the case that the cathode part 30 is arranged in the electroplating tank 10, the multiple accommodating holes 323 are arranged in sequence and at intervals along the second direction D2, or / and the multiple accommodating holes 323 are arranged in sequence and at intervals along the third direction D3.

[0094] The fixed contact 33 is arranged on the first mounting surface 321 and serves as a fixed clamping reference part to cooperate with the conductive torsional spring 34 to realize fixed clamping of the to-be-plated part 31.

[0095] The conductive torsional spring 34 is arranged on the second mounting surface 322 and transmits current to the to-be-plated part 31 through the conductive torsional spring 34 when the rectifier 40 is powered. The conductive torsional spring 34 is arranged in multiple numbers. Along the width direction of the second hole opening 3232, the multiple conductive torsional springs 34 are arranged on both sides of the second hole opening 3232 respectively; along the length direction of the second hole opening 3232, the multiple conductive torsional springs 34 are arranged in sequence and at intervals. This can well fix the long side of the to-be-plated part 31 and has a good fixing effect, so that the to-be-plated part 31 is more stable and will not shake when the cathode conductive frame body 32 swings with the driving of the cathode driver 11. On this basis, the overall electroplating uniformity can be effectively improved to ensure high electroplating quality.

[0096] Before electroplating, the to-be-plated part 31 is arranged in the accommodating hole 323, and the fixed contact 33 and the conductive torsional spring 34 respectively contact the first to-be-plated surface 311 and the second to-be-plated surface 312 to fix the to-be-plated part 31 in the accommodating hole 323. In this way, good clamping and fixing effect can be effectively ensured to improve the electroplating quality.

[0097] The conductive torsion spring 34 can be a single torsion spring or a double torsion spring. Compared with the fixing mode of the tension-compression spring in the prior art, the conductive torsion spring 34 has a small size and requires a small space when opened, thereby effectively improving the space utilization of the cathode 30, optimizing the arrangement of the electroplating tank 10 in the first direction D1, and making the anode and the cathode 30 more closely arranged to improve the electroplating efficiency and yield.

[0098] It should be noted that the tension-compression spring has a large volume and a short service life. After a period of use, the tension-compression spring is prone to deformation, compression instability, or hook fatigue, which causes the spring force to exceed the allowable range and fail. In addition, even in a normal state, the tension-compression spring cannot guarantee the positioning accuracy and cannot ensure that the fixed contact point is always in the same position. Thus, the fixed clamping effect is affected, the electroplating quality of the electroplating piece 31 is affected, and in severe cases, the electroplating piece 31 is broken.

[0099] In addition, in the prior art, the electroplating piece 31 is also fixed by a bent spring sheet, but the stress mode of the bent spring sheet is a cantilever beam or a beam supported at both ends and subjected to a transverse force to produce bending deformation. The stress is concentrated at the bent root, and fatigue cracks are prone to occur to cause failure.

[0100] The conductive torsion spring 34 can also well overcome the above problems. In order to achieve the best clamping and fixing effect, as shown in Figure 10 The vertical electroplating equipment according to the present application includes a conductive torsion spring 34 including a clamping portion 341 and two elastic portions 342 in some embodiments.

[0101] The two elastic portions 342 are sequentially arranged along the length direction of the accommodating hole 323, each of the two elastic portions 342 includes a connecting arm 3421, a spiral component 3422, and a clamping arm 3423, the connecting arm 3421 is connected to the cathode conductive frame body 32, the two ends of the spiral component 3422 are respectively connected to the clamping arm 3423 and the connecting arm 3421, and the two clamping arms 3423 are connected to the clamping portion 341.

[0102] In work, the two elastic portions 342 are connected to the cathode conductive frame body 32 through the connecting arms 3421 to achieve fixation. The connection between the connecting arms 3421 and the cathode conductive frame body 32 can be achieved by welding, clamping, or the like. The spiral component 3422 applies a rotating force to drive the clamping arm 3423 to rotate the clamping portion 341 located between the two elastic portions 342 around the axis of the spiral component 3422, and then cooperate with the fixed contact 33 to fix the electroplating piece 31.

[0103] Thus, first, in the electroplating tank 10, the size of the clamping portion 341 and the elastic portion 342 along the first direction D1 is small, the space required for the rotation of the clamping portion 341 is also small, the space utilization of the cathode piece 30 can be effectively improved, so as to cooperate with the shared anode, the second liquid spraying piece 52 and other structures, optimize the arrangement of the electroplating tank 10 in the first direction D1, make the anode piece and the cathode piece 30 can be arranged more closely, improve the electroplating efficiency and yield. Secondly, the spiral structure of the two spiral parts 3422 can make the stress distribution more uniform, the fatigue life is high, and the actual measurement can reach more than ten million times. Finally, the two spiral parts 3422 on both sides of the clamping portion 341 jointly drive the clamping portion 341 to rotate, which can effectively ensure that the clamping position of the clamping portion is at the same place, and the repeated positioning accuracy is high. On this basis, the electroplating quality can be effectively improved, and the fragment rate can be reduced.

[0104] Preferably, the torque T of the conductive torsion spring 34 satisfies the relationship 0.1N≤T≤20N. By limiting the torque T of the conductive torsion spring 34, it can prevent the torque from being too small and the clamping force from being insufficient, so as to avoid the sliding and offset of the to-be-electroplated piece 31 in the transportation process and contact position; and it can also prevent the torque from being too large, so as to avoid the to-be-electroplated piece 31 from being damaged or fragmented in the clamping position due to large stress.

[0105] The skilled person in the art can set the specific torque T of the conductive torsion spring 34 according to actual needs, such as 0.1N, 0.2N, 0.3N, 0.4N, 0.5N, 0.6N, 0.7N, 0.8N, 0.9N, 1N, 2N, 3N, 4N, 5N, 6N, 7N, 8N, 9N, 10N, 11N, 12N, 13N, 14N, 15N, 16N, 17N, 18N, 19N, 20N, etc.

[0106] The torque T of the conductive torsion spring 34 is (E*d 4 *θ) / (32*D*n), wherein E is the elastic modulus, d is the wire diameter of the conductive torsion spring 34, θ is the torsion angle, D is the coil diameter, and n is the effective number of turns.

[0107] The wire diameter d of the conductive torsion spring 34 satisfies the relationship 0.2mm≤d≤2mm. If the wire diameter d is too small, less than 0.2mm, the torque will be insufficient, and it is usually necessary to increase the coil diameter and the effective number of turns, which will cause waste of space and cost. If the wire diameter d is too large, greater than 2mm, it will cause the torque to be too large and cause damage to the silicon wafer. When the wire diameter d is between 0.2mm and 2mm, the space utilization and the appropriate torque size can be well balanced.

[0108] Those skilled in the art can set specific wire diameters d according to actual needs, such as 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2mm, etc.

[0109] The torsion angle θ of the conductive torsion spring 34 satisfies the relationship 0.1 radians ≤ θ ≤ 1 radian. The torsion angle θ should not be too small; if it is less than 0.1 radians, insufficient torque will result, typically requiring an increase in the coil diameter and the number of effective coils, leading to wasted space and cost. The torsion angle θ should not be too large; if it is greater than 1 radian, the deformation of the conductive torsion spring 34 increases, shortening its service life. A value between 0.1 radians and 1 radian strikes a good balance between space utilization and service life.

[0110] Those skilled in the art can set specific torsion angles θ according to actual needs, such as 0.1 radians, 0.2 radians, 0.3 radians, 0.4 radians, 0.5 radians, 0.6 radians, 0.7 radians, 0.8 radians, 0.9 radians, 1 radian, etc.

[0111] The mean diameter D of the coil of the conductive torsion spring 34 satisfies the relationship 1mm ≤ D ≤ 10mm. The mean diameter D should not be too small, as a diameter less than 1mm will result in insufficient torque. The mean diameter D should not be too large, as a diameter greater than 10mm will increase the radial space occupied by the conductive torsion spring 34. A diameter between 1mm and 10mm achieves a good balance between space utilization and a suitable torque.

[0112] Those skilled in the art can set specific coil center diameter D according to actual needs, such as 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc.

[0113] The effective number of coils n of the conductive torsion spring 34 satisfies the relationship 1 coil ≤ n ≤ 10 coils. The effective number of coils n should not be too small, as less than 1 coil makes it difficult to ensure effective clamping, nor should it be too large, as more than 10 coils will increase the radial dimension and make processing more difficult. Those skilled in the art can set a specific effective number of coils n according to actual needs, such as 1 coil, 2 coils, 3 coils, 4 coils, 5 coils, 6 coils, 7 coils, 8 coils, 9 coils, 10 coils, etc.

[0114] Reference Figure 10 and Figure 11 As shown, in some embodiments of the vertical electroplating equipment of the present invention, the second orifice 3232 is provided with a countersunk platform 3233 to cooperate with the conductive torsion spring 34 to achieve negative angle installation. The clamping part 341 includes a first fixing part 3411 and a bending part 3412.

[0115] The first fixed part 3411 is provided with a first clamping surface 34111 on the side for contacting the to-be-plated part 31. By providing the first clamping surface 34111, the contact area can be effectively increased, the contact surface is ensured to be smooth, stress concentration caused by sharp parts is avoided, and the fragment rate is reduced.

[0116] The bending part 3412 is connected to the first fixed part 3411 and the clamping arm 3423, respectively, and an included angle is arranged between the bending part 3412 and the clamping arm 3423. Preferably, the included angle is a right angle. In this way, the negative angle installation is realized in cooperation with the sink 3233, so as to realize the opening and clamping of the material changing in cooperation with the corresponding opening and clamping device 60. The space utilization rate of the cathode part 30 is improved, and the clamping effect is good, which helps to improve the electroplating quality and reduce the fragment rate.

[0117] Referring to Figure 10 and Figure 11 , in some embodiments, the vertical electroplating equipment is provided with a mounting groove 3234 on both sides of the first aperture 3231 along the width direction of the first aperture 3231.

[0118] The fixed contact 33 includes a connecting base 331 and a fixed connecting part 332, and the connecting base 331 is arranged in the mounting groove 3234. The fixed connecting part 332 is provided in plurality, and the plurality of fixed connecting parts 332 are arranged in sequence along the length direction of the first aperture 3231.

[0119] By arranging the structure, the space utilization rate of the cathode part 30 can be effectively improved, and the cathode part 30 is convenient to debug, so that the fixed connecting part 332 is aligned with the first clamping surface 34111 of the conductive torsional spring 34, and the clamping is more stable.

[0120] Preferably, referring to Figure 12 , the fixed connecting part 332 includes a first connecting part 3321 and a second fixed part 3322, and the first connecting part 3321 is connected to the connecting base 331.

[0121] The second fixed part 3322 is arranged on the side of the first connecting part 3321 close to the conductive torsional spring 34. The second fixed part 3322 is arranged in a conical structure, and the second fixed part 3322 is provided with a second clamping surface 33221 on the side for contacting the to-be-plated part 31. The radial dimension of the second fixed part 3322 gradually decreases in the direction away from the conductive torsional spring 34. In this way, the clamping and fixing of the to-be-plated part 31 can be realized by cooperation of the second clamping surface 33221 and the first clamping surface 34111, so that the to-be-plated part 31 is more stable during electroplating, thereby improving the electroplating quality and preventing accidental fragments.

[0122] In some embodiments of the vertical electroplating apparatus, the cathode conducting frame body 32, the fixed contact 33 and the conducting torsion spring 34 are at least partially coated with an insulating layer (not shown). Preferably, the insulating layer is made of PTFE, polyimide or the like.

[0123] Preferably, the insulating layer only exposes the first clamping surface 34111 of the conducting torsion spring 34. In this way, the internal components are mechanically protected by the insulating layer, and the non-contact part is prevented from causing dispersion of the electroplating current.

[0124] Through the control variable experiments of the applicant, by optimizing the cathode part 30, the electroplating uniformity of about 35% can be improved to 25%.

[0125] In the case of using the plurality of electrical connections 231, the nozzle 53 with special position and structure and the cathode part 30 with special structure at the same time, the components cooperate with each other, and the final electroplating uniformity can be improved to 8%, which is better than the conventional 20%. At the same time, the equipment has a scrap rate of less than 0.03%, which is much lower than the conventional requirement of less than 0.1%.

[0126] Preferably, referring to Figure 13 The vertical electroplating apparatus of the present application also includes an unclamping device 60 in some embodiments, which opens the conducting torsion spring 34 to realize feeding and discharging. The unclamping device 60 includes an unclamping base 61 and an unclamping part 62.

[0127] The unclamping base 61 is used to arrange the unclamping part 62 and cooperate with a driver such as a mechanical arm to open and close the conducting torsion spring 34. Preferably, the unclamping base 61 is provided with a stepped hole matched with the corresponding driver.

[0128] The unclamping part 62 is provided with a plurality of unclamping parts 62, which are sequentially and spaced apart along the length direction of the unclamping base 61, and each unclamping part 62 corresponds to a corresponding conducting torsion spring 34. When feeding and discharging is needed, the unclamping part 62 is inserted into the inside of the conducting torsion spring 34 to open it, and then feeding and discharging is carried out.

[0129] The unclamping part 62 includes a second connecting part 621 and an unclamping part 622, the second connecting part 621 is connected with the unclamping base 61, the unclamping part 622 is arranged on the side away from the unclamping base 61 of the second connecting part 621, and an included angle is arranged between the unclamping part 622 and the second connecting part 621.

[0130] In this way, the opening and closing actions of the conducting torsion spring 34 can be completed by the cooperation of the second connecting part 621 and the unclamping part 622. The included angle between the unclamping part 622 and the second connecting part 621 can effectively limit the conducting torsion spring 34 and prevent it from being detached during the opening process. Preferably, the included angle is set to be a right angle.

[0131] In another aspect, referring to Figure 14 The application also provides a vertical electroplating method applied to the vertical electroplating device as described in any one of the above embodiments. The vertical electroplating method comprises the steps of:

[0132] The workpiece 31 is arranged on the cathode 30. The workpiece 31 comprises a first work surface 311 and a second work surface 312, and the first work surface 311 and the second work surface 312 have different electroplating patterns.

[0133] The cathode 30 is arranged in the electroplating tank 10 for electroplating. The electroplating tank 10 is provided with an electroplating solution and the anode assembly 20. The anode assembly 20 comprises a first anode 21 and a second anode 22. The first anode 21 comprises a first working surface 211, and the second anode 22 comprises a second working surface 221. The first working surface 211 and the second working surface 221 are used for electroplating work surfaces with different electroplating patterns, respectively. The first anode 21 and the second anode 22 are alternately and spacedly arranged along a first direction D1. The cathode 30 is arranged between the first anode 21 and the second anode 22. The first work surface 311 is arranged opposite to the first working surface 211, and the second work surface 312 is arranged opposite to the second working surface 221. The first direction D1 is perpendicular to a second direction D2, and the second direction D2 is parallel to the depth direction of the electroplating tank 10.

[0134] Working principle:

[0135] The conductive torsion spring 34 is opened by the opening clamp 60, and the workpiece 31 is placed in the accommodating hole 323. The workpiece 31 is fixed by the cooperation of the conductive torsion spring 34 and the fixed contact 33.

[0136] Subsequently, the cathode 30 provided with the workpiece 31 is transported to the electroplating tank 10. Each cathode 30 is arranged between a first anode 21 and a second anode 22, and adjacent two cathodes 30 share the first anode 21 or the second anode 22.

[0137] The rectifier 40 is powered on, the four electrical connection parts 231 of the anode are collectively introduced into the current, the workpiece 31 has a reduction reaction with metal ions and is deposited, and electroplating is realized. In this process, the cathode 30 swings in the electroplating solution under the driving of the cathode driver 11. At the same time, the first liquid jet 51 and the second liquid jet 52 jet the electroplating solution to improve the circulation of the side of the cathode 30.

[0138] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "rear", "front", "vertical" and "horizontal" as can be perceived herein relative to the accompanying drawings refer to the orientation of the components being described. However, it is to be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device described herein relative to the other device or structure is inverted, then a spatially relative term such as "above" can be interpreted as meaning "below" or "below" can be interpreted as meaning "above". The device can also be oriented in other ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0139] In addition, it should be pointed out that the use of "first", "second" and the like words to qualify parts, is only intended to facilitate the distinction of the corresponding parts, and does not have a special meaning unless otherwise stated, and therefore cannot be understood as a limitation of the scope of protection of the present application.

[0140] The preferred embodiments of the present application are described above in detail. The present application, however, is not limited to the above embodiments, but can be variously changed and modified by those skilled in the art without departing from the spirit and scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. A vertical electroplating apparatus, characterized by, The vertical electroplating device comprises: an electroplating tank for setting an electroplating solution; an anode assembly fixed in the electroplating tank; the anode assembly comprises a first anode member and a second anode member, the first anode member comprises a first working surface, the second anode member comprises a second working surface, the first working surface and the second working surface are respectively used for electroplating surfaces to be electroplated with different electroplating patterns, and the first anode member and the second anode member are alternately and spacedly arranged along a first direction, wherein the first direction is perpendicular to a second direction, and the second direction is parallel to a depth direction of the electroplating tank; a cathode member for setting a piece to be electroplated; the piece to be electroplated comprises a first surface to be electroplated and a second surface to be electroplated, the first surface to be electroplated and the second surface to be electroplated have different electroplating patterns; the cathode member is arranged between the first anode member and the second anode member, the first surface to be electroplated is arranged opposite to the first working surface, and the second surface to be electroplated is arranged opposite to the second working surface.

2. The vertical electroplating device according to claim 1, wherein: the first anode member and the second anode member each comprise a plurality of anode sub-components, and the plurality of anode sub-components are sequentially and spacedly arranged along the second direction, or / and the plurality of anode sub-components are sequentially and spacedly arranged along a third direction; wherein the third direction is perpendicular to the first direction and the second direction respectively.

3. The vertical electroplating device according to claim 2, wherein: the anode assembly further comprises an anode conductive frame body for setting the first anode member or the second anode member; the anode conductive frame body is provided with an electric connection part for connecting a positive pole of a power supply, and the electric connection part is provided with at least three electric connection parts which are uniformly and spacedly arranged along the third direction.

4. The vertical electroplating apparatus of claim 2, wherein, Further comprising: a first liquid spraying member arranged at the bottom of the electroplating tank; and a second liquid spraying member arranged between two adjacent anode sub-components along the second direction, wherein the second liquid spraying member is provided with a plurality of liquid spraying openings which are sequentially and spacedly arranged along the third direction.

5. The vertical electroplating device according to claim 4, wherein: an included angle A between a spraying direction of the liquid spraying opening and a working surface of a target anode member satisfies a relationship of 15°≤A≤45°; wherein the target anode member is the first anode member or the second anode member in which the second liquid spraying member is arranged.

6. The vertical electroplating device according to claim 4, wherein: the liquid spraying opening is provided with a spraying nozzle, and the spraying nozzle is provided with a spraying hole; along a spraying direction of the spraying nozzle, the spraying hole comprises a first hole section, a second hole section and a third hole section which are sequentially arranged; an inner diameter of the second hole section is smaller than an inner diameter of the first hole section, and the inner diameter of the first hole section is smaller than an inner diameter of the third hole section; and a draft hole is arranged on a hole wall of the third hole section.

7. The vertical electroplating device according to claim 1, wherein: along the first direction, a distance from the first working surface to the first surface to be electroplated is not equal to a distance from the second working surface to the second surface to be electroplated. the cathode member comprises:

8. The vertical electroplating apparatus according to any one of claims 1 to 7, characterized by, ​ The cathode conductive frame body comprises a first installation surface and a second installation surface arranged oppositely; the cathode conductive frame body is provided with a through accommodating hole, the accommodating hole comprises a first hole and a second hole, the first hole is arranged on the first installation surface, and the second hole is arranged on the second installation surface; A fixed contact is arranged on the first installation surface; A plurality of conductive torsion springs are arranged on the second installation surface; the conductive torsion springs are arranged on both sides of the second hole along the width direction of the second hole; and the conductive torsion springs are arranged in sequence along the length direction of the second hole. The fixed contact and the conductive torsion spring are respectively in contact with the first to-be-plated surface and the second to-be-plated surface, so that the to-be-plated part is fixed in the accommodating hole.

9. The vertical plating equipment according to claim 8, wherein: The conductive torsion spring comprises a clamping portion and two elastic portions; the two elastic portions are arranged in sequence along the length direction of the accommodating hole; each elastic portion comprises a connecting arm, a spiral component and a clamping arm; the connecting arm is connected to the cathode conductive frame body; the two ends of the spiral component are connected to the connecting arm and the clamping arm respectively; and the two clamping arms are connected to the clamping portion.

10. The vertical plating equipment according to claim 9, wherein: The second hole is provided with a sink; the clamping portion comprises a first fixed component and a bent component; the first fixed component is provided with a first clamping surface on one side for contacting the to-be-plated part; the bent component is connected to the first fixed component and the clamping arm respectively; and an included angle is arranged between the bent component and the clamping arm.

11. The vertical electroplating apparatus of claim 8, wherein, At least one of the following features is included: The torque T of the conductive torsion spring satisfies the relationship 0.1N≤T≤20N; The wire diameter d of the conductive torsion spring satisfies the relationship 0.2mm≤d≤2mm; The torsion angle θ of the conductive torsion spring satisfies the relationship 0.1 radian≤θ≤1 radian; The middle diameter D of the spring coil of the conductive torsion spring satisfies the relationship 1mm≤D≤10mm; The effective number of turns n of the conductive torsion spring satisfies the relationship 1 turn≤n≤10 turns.

12. The vertical plating equipment according to claim 8, wherein: Along the width direction of the first hole, installation grooves are arranged on both sides of the first hole; The fixed contact comprises a connecting base and a fixed connecting portion; the connecting base is arranged in the installation groove; and the fixed connecting portion is provided with a plurality of fixed connecting portions arranged in sequence along the length direction of the first hole.

13. The vertical plating equipment according to claim 8, wherein: The cathode conductive frame body, the fixed contact and the conductive torsion spring are at least partially coated with an insulating layer.

14. A vertical plating method applied to the vertical plating apparatus according to any one of claims 1 to 13, characterized by, The steps include: A to-be-plated part is arranged on a cathode part; wherein the to-be-plated part comprises a first to-be-plated surface and a second to-be-plated surface, and the plating patterns of the first to-be-plated surface and the second to-be-plated surface are different; The cathode piece is arranged in an electroplating tank for electroplating; wherein the electroplating tank is provided with an electroplating solution and an anode assembly, the anode assembly comprises a first anode piece and a second anode piece, the first anode piece comprises a first working surface, the second anode piece comprises a second working surface, the first working surface and the second working surface are respectively used for electroplating different electroplating patterns of a to-be-electroplated surface, and the first anode piece and the second anode piece are alternately and spacedly arranged along a first direction; the cathode piece is arranged between the first anode piece and the second anode piece, the first to-be-electroplated surface is oppositely arranged with the first working surface, and the second to-be-electroplated surface is oppositely arranged with the second working surface; the first direction is perpendicular to a second direction, and the second direction is parallel to a depth direction of the electroplating tank.

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