Electronics platform of solid-state spinning magnetic sensor

Abstract

The invention relates to an electronics platform of a solid-state spin magnetic sensor. The electronics platform comprises a probe, an upper computer and a board card system integrated with a plurality of modules, the power supply module is used for converting a preset voltage signal into a voltage gear required by each module so as to supply power to each module, and the clock module is used for providing a synchronous clock for the electronics platform. The current source module outputs the light source driving current with the change amplitude smaller than the preset amplitude and the magnetic field signal in the first preset frequency interval, and the microwave source module generates the radio frequency signal in the second preset frequency interval. A current source, a microwave source and a data acquisition card are highly collaboratively integrated, and an integrated design is adopted, so that the blank of the existing integration technology is filled, and a solid foundation is laid for engineering of a high-integration-level electronics platform.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of quantum sensing, in particular to an electronic platform of a solid-state spin magnetic sensor. BACKGROUND

[0002] Magnetic field is a widely existing physical phenomenon in nature. The exploration and utilization of the magnetic field of the earth and the solar system have continuously promoted the development and progress of human science and technology in all eras, and many important inventions in human history have a close relationship with the magnetic field, thereby changing the communication mode and social production mode of human beings. In addition, the magnetic field can also detect the health status of the human body by measuring the weak magnetic field changes of the human body, and therefore has a wide application prospect in the fields of physics, chemistry, biomedicine and industrial production. The traditional magnetic field sensors such as Hall effect sensor, superconducting quantum interference device and magnetic force microscope have reached the limit in terms of magnetic sensing sensitivity and magnetic field resolution, and cannot meet the exploration demand of human beings for weaker magnetic field.

[0003] The solid-state spin magnetic sensor, especially the diamond nitrogen-vacancy (NV) color center system, has become an important development direction in the field of quantum precision measurement due to its long coherence time at room temperature, high spatial resolution and vector magnetic field detection capability. The NV color center can polarize the spin state by laser and realize the demodulation of magnetic field information by microwave resonance control, and its sensitivity can reach the level of femtesla, which has wide application potential in the fields of biomedical imaging, geomagnetic navigation and industrial nondestructive testing.

[0004] The system architecture of the solid-state spin magnetic sensor mainly includes a probe, an optical system, a microwave system and a readout system. In order to realize more extensive application scenarios, the magnetic sensor needs to be free from the constraints of the basic experimental platform, and high integration becomes an indispensable basic condition. Therefore, how to provide an electronic platform with high integration degree for the solid-state spin magnetic sensor has become a problem to be solved in the field. SUMMARY

[0005] Therefore, it is necessary to provide an electronic platform of a solid-state spin magnetic sensor with high integration degree in view of the above technical problems.

[0006] In a first aspect, the present application provides an electronic platform of a solid-state spin magnetic sensor, which comprises a probe, a host computer and a board card system integrated with a plurality of modules. The plurality of modules comprises a current source module, a microwave source module, an acquisition card module, a control module, a clock module and a power supply module. The power supply module is connected with the current source module, the microwave source module, the acquisition card module, the control module and the clock module. The clock module is connected with the acquisition card module and the microwave source module. The control module is connected with the current source module, the microwave source module and the acquisition card module. The host computer is connected with the control module.

[0007] a power supply module, configured to convert a preset voltage signal into voltage levels required by each module respectively, so as to supply power to each module;

[0008] a clock module, configured to provide a synchronous clock for the electronic platform, so as to output a light source driving current with a variation amplitude less than a preset amplitude and a magnetic field signal with a first preset frequency interval through the current source module, and generate a radio frequency signal with a second preset frequency interval through the microwave source module.

[0009] In one of the embodiments, the power supply module comprises an EMI filter, a first conversion circuit, a second conversion circuit and a third conversion circuit, the power supply module is close to an input interface of an external power supply providing the preset voltage signal, and the power supply module transmits current by using a copper foil with a width greater than a preset width.

[0010] the EMI filter is configured to filter the preset voltage signal to obtain a target voltage signal;

[0011] the first conversion circuit is configured to convert the target voltage signal into 8 volts and 3.3 volts; the 8 volts are used to supply power to an operational amplifier and a load in the current source module, and the 3.3 volts are used to supply power to a DAC chip and a voltage reference chip in the current source module;

[0012] the second conversion circuit is configured to convert the target voltage signal into 5 volts and 3.3 volts; the 5 volts are used to supply power to an amplifier in the microwave source module, and the 3.3 volts are used to supply power to a radio frequency chip in the microwave source module;

[0013] the third conversion circuit is configured to convert the target voltage signal into 3.3 volts and 1.8 volts; the 3.3 volts are used to supply power to the acquisition card module, the control module and the clock module, and the 1.8 volts are used to supply power to a high-speed ADC analog circuit in the acquisition card module.

[0014] In one of the embodiments, the current source module comprises a first serial peripheral interface (SPI) communication module, a DAC module and a current source core module.

[0015] the DAC module is configured to receive a digital signal sent by a micro control unit (MCU) through the first SPI communication module, convert the digital signal into an analog signal, and input the analog signal into the current source core module;

[0016] the current source core module is configured to adjust a conduction degree of a MOS transistor in the current source core module according to the analog signal and an actual voltage on a sampling resistor in the current source core module, so as to output a preset current to the LD laser module.

[0017] In one of the embodiments, the LD laser module, the sampling resistor and the MOS tube form a compact current loop, the width of the power supply line is greater than a preset width and the length of the power supply line is less than a preset length;

[0018] The current source module is away from the high-frequency area, the LD is laid with a ground copper foil below, and the current calibration loop is kept apart from the main loop of the current source module.

[0019] In one of the embodiments, the microwave source module is arranged at the edge of the board card, the microwave source module includes four radio frequency synthesis chips, the radio frequency synthesis chips are connected with the control module through high-frequency signal lines, used for generating radio frequency signals in a second preset frequency range and supporting FSK modulation, receiving a 10MHz synchronous clock to generate a basic signal, and outputting after being processed by a switch, an amplifier and a filter; the high-frequency signal lines adopt 50Ω impedance matching short straight lines;

[0020] The control module configures the chip frequency and the modulation depth of the radio frequency synthesis chips in the microwave source module through the second SPI communication module.

[0021] The radio frequency synthesis chips are used for generating radio frequency signals based on the chip frequency and the modulation depth configured by the control module.

[0022] In one of the embodiments, the acquisition card module divides the input signal into an alternating current sub-signal and a direct current sub-signal through a cross-group operational amplifier AC / DC separation circuit, the alternating current sub-signal is collected by a high-speed ADC, and the direct current sub-signal is collected by a high-precision ADC, and the two-way data collected by the high-speed ADC and the high-precision ADC are transmitted to the control module through a third SPI communication module.

[0023] The control module is used for controlling the microwave source module to generate radio frequency signals in a second preset frequency range, controlling the current source module to drive the LD laser module to output a laser light source, and uploading the two-way data to an upper computer after processing through a USB.

[0024] In one of the embodiments, the acquisition card module is arranged away from the high-frequency and large-current area, the analog circuit is arranged concentratedly, the analog ground plane is complete and continuous, the ADC clock line connecting the clock module and the analog-to-digital converter ADC adopts 50Ω differential pair wiring and keeps apart from the analog signal line; the analog signal line is a signal line inside the acquisition card module used for connecting the cross-group operational amplifier AC / DC separation circuit and the high-speed ADC and the high-precision ADC, and the analog circuit includes the current source module, the microwave source module and the acquisition card module.

[0025] In one of the embodiments, the clock module includes a 10MHz oven-controlled crystal oscillator and a frequency synthesis chip, generates a plurality of clock signals, independently supplies power to the 10MHz oven-controlled crystal oscillator and the frequency synthesis chip, and the power inlet of the clock module is in series with a magnetic bead; the clock module is arranged at the center of the board card, the clock line is arranged in differential or shielded mode, and a shielded corridor is formed by the ground vias around the clock module.

[0026] In one of the embodiments, each module is designed in a multi-layer board and is functionally divided, the power supply module is close to the interface of the external power supply for providing a preset voltage signal, the current source module and the microwave source module are separately arranged on two sides, and a ground isolation belt is arranged between the current source module and the microwave source module.

[0027] The acquisition card module is far away from the high-frequency area, and the control module and the clock module are arranged in the center.

[0028] The analog ground and the digital ground are connected by a 0Ω resistor at a single point, and the clock line and the power supply line are arranged in perpendicular intersection mode.

[0029] In one of the embodiments, a multi-level shielding and grounding design is adopted: the microwave source module is enclosed by a 0.3mm copper cover and is grounded at multiple points, the front end of the current source analog area and the acquisition card module is grounded by a metal isolation frame, and the clock module is grounded by a shield cover through conductive glue; an EMI filter is added to the power supply area, a magnetic bead is connected in series at the power inlet of each module, and a ground via array is arranged below the LD laser module and the key chip.

[0030] The above-mentioned electronic platform of the solid-state spin magnetic sensor includes a probe, an upper computer and a board card system integrated with a plurality of modules, a power supply module is used to convert a preset voltage signal into voltage grades required by each module, to supply power to each module, a clock module is used to provide a synchronous clock for the electronic platform, to output a light source driving current with a variation amplitude less than a preset amplitude and a magnetic field signal in a first preset frequency interval through a current source module, and to generate a radio frequency signal in a second preset frequency interval through a microwave source module. The current source, the microwave source and the data acquisition card are highly cooperatively integrated, an integrated design is adopted, and a blank in the existing integration technology is filled. Compared with the loose connection of traditional discrete devices, the integrated architecture significantly shortens the physical distance between the modules, reduces signal transmission loss and delay, and realizes precise linkage of optical driving, microwave control and signal acquisition. The traditional “independent module design” idea is broken through, an MCU is used as a control center, cross-module time sequence synchronization and dynamic parameter control are realized, the overall cooperative performance of the system is greatly improved, and a solid foundation is laid for the engineering of the high-integration electronic platform. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other related drawings can be obtained without creative labor on the basis of these drawings.

[0032] Figure 1 is a structural schematic diagram of a current source module provided by an embodiment of the present application;

[0033] Figure 2 is a structural schematic diagram of a microwave source module provided by an embodiment of the present application;

[0034] Figure 3 is a combined schematic block diagram of functional modules in a microwave source module provided by an embodiment of the present application;

[0035] Figure 4 is a structural schematic diagram of a capture card module provided by an embodiment of the present application;

[0036] Figure 5 is an electronic platform system schematic diagram of a solid-state spin magnetic sensor provided by an embodiment of the present application;

[0037] Figure 6 is a communication schematic diagram between each module in an electronic platform and a host computer provided by an embodiment of the present application;

[0038] Figure 7 is a PCB module layout schematic diagram in an electronic platform provided by an embodiment of the present application;

[0039] Figure 8 is a microwave source module electromagnetic shielding design schematic diagram provided by an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0041] It should be noted that the terms "first", "second", etc. used in the present application can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element. The terms "include" and "have" and any variations thereof used in the present application are intended to cover non-exclusive inclusion. The term "a plurality of" used in the present application refers to two or more. The term "and / or" used in the present application refers to one of the options or any combination of a plurality of options.

[0042] In order to more clearly introduce the present embodiment, the current source module, the microwave source module, and the acquisition card module involved in the present application are introduced first. Referring to Figure 1 , Figure 1 is a structural schematic diagram of a current source module provided by the present embodiment.

[0043] In order to ensure the normal operation of a laser diode (LD) laser module, a stable current source needs to be developed to ensure stable output of a light source driving current. The light source driving current is used to drive the LD laser module to output stable laser light source. The laser beam emitted by the laser head (LD laser module) can excite this kind of special material contained in the probe, so that the electronic spin state in the material changes, thereby providing an initial condition for subsequent detection of external magnetic field and other physical quantities. For example, by irradiating the NV color center with laser, it is placed in a specific spin state, which facilitates the probe to detect the influence of the external magnetic field on the spin state.

[0044] The current source usually uses transistors, operational amplifiers, peripheral circuits and other devices as the current control core, combines a feedback loop to monitor and adjust the output current, so as to ensure that no matter how the load changes or the power supply voltage fluctuates, the current source module can stably provide a preset constant current output. The designed current source module mainly includes a power module, a current source core module, a DAC module, and a first serial peripheral interface (SPI) communication module, and the overall design is as shown in Figure 1 The current source core module can include an operational amplifier, a sampling resistor, and a metal-oxide-semiconductor (MOS) tube. The sampling resistor can be a low-temperature drift sampling resistor.

[0045] The power module is responsible for powering the load, operational amplifier, LDO, direct current to direct current (DC-DC) DC-DC converter, for example, powered by a 15V power supply, and the power supply voltage is reduced by a switching power supply (DC-DC) and two low dropout linear voltage regulators (LDO). For example, one of the 15V power supplies outputs 8.5V through a DC-DC converter and outputs 8V through a linear voltage regulator to power the load; one of the 15V power supplies outputs 3.3V through an LDO to power the reference chip and the DAC module (including but not limited to DAC8830) to complete the digital-to-analog conversion; one of the 15V power supplies outputs 8V through an LDO to power the operational amplifier in the current source core module. In the selection of inductance, 6A inductance is selected to isolate the analog ground from the digital ground.

[0046] The current source core module is responsible for realizing the stable output current of the current board card, mainly composed of an operational amplifier (including but not limited to OPA2189), a load resistor (about 0.5 ohm), a low-temperature drift sampling resistor (0.5 ohm), and a MOS tube. When the load is working, the MOS tube needs to be fully turned on, otherwise there will be a serious heating problem. According to the working principle of the virtual short and virtual open of the operational amplifier, the conduction state of the MOS tube can be controlled by adjusting the control voltage (the control voltage is the output voltage of the DAC module). The output current of the current source module is equal to the ratio of the control voltage to the resistance value of the sampling resistor.

[0047] The DAC module is responsible for converting the input digital signal into an analog signal, mainly composed of a voltage reference chip and a DAC chip. The voltage reference chip is used to provide a high-precision low-noise voltage reference source for the DAC chip to ensure the normal operation of the DAC chip. The function of the DAC chip is to perform digital-to-analog conversion on the data collected by the SPI and output a positive analog control voltage signal.

[0048] The SPI communication module transmits the signal sent by the microcontroller unit (MCU) to the digital-to-analog converter (DAC) chip.

[0049] Referring to Figure 2 , Figure 2 is a structure diagram of a microwave source module provided by an embodiment of the present application. The microwave source adopts a double-channel gating structure, is used for outputting a radio frequency signal with adjustable frequency and power, and has a frequency-shift keying (FSK) square wave input modulation function to realize spin manipulation of NV color centers. The designed microwave source module mainly consists of a voltage conversion module, a clock module, a radio frequency module, and a function module, and the overall framework is as followsFigure 3 The MCU issues a control instruction to control four chips (including but not limited to LMX2572) of the radio frequency module to generate a specific radio frequency signal. The clock module inputs a stable 10MHz clock signal. The functional module processes the radio frequency signal output of the four radio frequency synthesis chips to meet the radio frequency requirement.

[0050] The voltage conversion module is responsible for converting the input high voltage into a stable voltage required for normal operation of the chip. The voltage conversion module is composed of two direct current to direct current (DC-DC) converters and three low-dropout regulators (LDOs). Two DC-DC converters (including but not limited to SCT2360) are used as a voltage reduction circuit to provide a required 3.5V and 5.5V power supply for the back end. The LDO outputs a 5V voltage from a TPS7A4701 chip to power the amplifier and attenuator of the functional module. The LDO outputs a 3.3V voltage from an AMS1117-3.3 chip to power the MCU and the selection switch chip. The LDO outputs a 3.3V voltage from a TPS7A5701 chip to power the radio frequency module and the clock module.

[0051] The clock module is responsible for generating a 10MHz clock signal for the radio frequency module. The clock module is composed of an active crystal oscillator and a one-to-four clock distribution chip. The active crystal oscillator provides a 10MHz clock signal output to the clock distribution chip (including but not limited to CDCLVP1204RGTR) to achieve four-way output for the radio frequency synthesis chip of the radio frequency module.

[0052] The radio frequency module realizes basic four-way radio frequency output through four radio frequency synthesis chips.

[0053] The functional module is responsible for switching, amplifying, filtering, and attenuating the four-way radio frequency signal. The four-way radio frequency signal includes a first radio frequency signal, a second radio frequency signal, a third radio frequency signal, and a fourth radio frequency signal. The functional module is composed of two radio frequency switch chips (including but not limited to HMC349AMS8GETR), four radio frequency amplification chips (including but not limited to GVA-63+), six low-pass filters (including but not limited to LFCN-3000+), six high-pass filters (including but not limited to HFCN-2100+), two radio frequency attenuation chips (including but not limited to HMC472ALP4ETR), and a radio frequency combiner (including but not limited to QCN-45+). As shown in Figure 3 Figure 3 is a combination schematic block diagram of a functional module in a microwave source module provided by an embodiment of the present application.

[0054] Referring to Figure 4 ​, Figure 4 is a structural schematic diagram of a collection card module provided by an embodiment of the present application. The collection module is mainly responsible for the collection and processing of system signals, and mainly includes a power module, a cross-group operational amplifier AC / DC separation circuit, an ADC analog quantity collection circuit, a clock distribution circuit, a Universal Serial Bus (USB) communication module circuit, and a system block diagram as shown in Figure 4 . The board card first collects the front-end current signal, and then separates it into AC and DC parts through the cross-group operational amplifier AC / DC separation circuit. The AC signal is sent into a high-speed ADC (including but not limited to LTC2180) for digital collection after amplification, and the DC signal is collected through a high-precision ADC (including but not limited to ADS1247). The data collected by the two-way ADC is transmitted to the MCU main control unit for processing and analysis. Based on the processing result, the MCU main control unit will generate a control signal, based on which the current source module is controlled to drive the Laser Diode (LD) laser module to output a laser light source with specific parameters, and the microwave source module is controlled to output a corresponding radio frequency signal, for example, a 2.6-3.1 GHz radio frequency signal, forming a complete closed-loop control system. The finally processed digital signal realizes high-speed data interaction with the upper computer through the USB communication module, supporting real-time monitoring, data analysis and system control functions.

[0055] The power module serves as a system energy supply unit, and provides stable and pure working power for each functional module through a high-efficiency voltage stabilizing circuit design. The circuit is powered by an external +24V power supply, and after the +24V passes through a 5-stage MI filter, high-efficiency voltage reduction and positive and negative voltage conversion are realized through a switching power supply, and then the signal is filtered and stabilized again through a linear voltage stabilizer, and a multi-output integrated module is used to output multiple stable voltages for power supply of analog circuits, digital circuits and radio frequency modules, etc.

[0056] The cross-group operational amplifier AC / DC separation circuit module is constructed based on a high-performance operational amplifier, realizes accurate separation of AC and DC components of the front-end current signal, and completes the pre-processing of signal amplification.

[0057] The ADC analog quantity collection circuit module uses a high-precision analog-to-digital converter to convert the analog current signal processed in the front end into a digital signal, providing a data basis for the rear-end MCU main control module. The front-end current signal is separated into AC and DC signals through the cross-group operational amplifier AC / DC signal separation circuit, the separated AC signal is collected and processed by a high-speed ADC chip and sent into the MCU for processing such as modulation and demodulation, data filtering and signal sampling, and the DC signal is collected by a high-precision ADC chip for voltage collection. Both the high-speed ADC and the high-precision ADC can configure their related parameters through SPI.

[0058] The clock distribution circuit module uses a professional frequency synthesis chip to provide low-jitter and high-stability clock signals for each functional module of the system, to ensure the synchronization and reliability of the overall operation. The MCU issues register configuration instructions to the frequency synthesis chip (including but not limited to CDCM6208) through SPI, and the frequency synthesis chip outputs clock signals to the MCU, high-speed ADC chip, etc.

[0059] The MCU master module serves as the system control core, and achieves coordinated scheduling and management of the internal functional modules through hardware programming, and undertakes data communication and protocol processing tasks with external devices.

[0060] The USB communication module integrates a USB2.0 protocol bridge chip to realize high-speed bidirectional data transmission and protocol conversion between the MCU master module.

[0061] In an exemplary embodiment, as shown in Figure 5 , Figure 6 and Figure 7 , Figure 5 is a schematic diagram of an electronic platform system of a solid-state spin magnetic sensor provided by an embodiment of the present application, Figure 6 is a communication schematic diagram between each module in the electronic platform and the host computer, Figure 7 is a schematic diagram of the layout of each module on the PCB in the electronic platform. The current source module, microwave source module and acquisition card module shown in Figure 1 , Figure 2 and Figure 4 may be integrated into a board card to form a board card system, Figure 7 the MCU in Figure 1 , Figure 2 and Figure 4 . The electronic platform includes a probe, a host computer and a board card system integrated with multiple modules, the multiple modules including a current source module, a microwave source module, an acquisition card module, a control module, a clock module and a power supply module, the power supply module being connected with the current source module, the microwave source module, the acquisition card module, the control module and the clock module, the clock module being connected with the acquisition card module and the microwave source module, the control module being connected with the current source module, the microwave source module and the acquisition card module, and the host computer being connected with the control module.

[0062] The power supply module is configured to convert a preset voltage signal into voltage levels required by each module, to supply power to each module.

[0063] The clock module is configured to provide a synchronous clock for the electronic platform, to output a light source driving current with a variation amplitude less than a preset amplitude and a magnetic field signal in a first preset frequency interval through the current source module, and to generate a radio frequency signal in a second preset frequency interval through the microwave source module.

[0064] The host computer sends various instructions as a control center to operate the modules in order, and the current source-microwave source-acquisition module integrated system considers the functions of driving the optical system, outputting microwaves to manipulate the NV color center spin, and signal acquisition and processing. By optimizing the optical drive, microwave control, and signal acquisition and processing architecture, the integration of the current source, microwave source, and acquisition modules can be achieved, thereby significantly reducing system complexity and cost.

[0065] The integrated board card design is divided into six modules: a power supply module, a current source module, a microwave source module, an acquisition card module, a control module, and a clock module, as shown in the overall framework Figure 5 The board card takes the control module (MCU) as the control center to coordinate the work of each module, and is powered by a 24V external power supply, which is converted into multiple voltage levels by the power supply module. A single clock source provides a synchronous clock for the entire system, and the electromagnetic compatibility problem is solved by combining functional partition layout and metal shielding design. Finally, stable light source driving current output, 2.6-3.1GHz RF signal generation, and 100Hz or less magnetic field signal acquisition and system timing synchronization are achieved.

[0066] In this embodiment, the electronics platform includes a probe, a host computer, and a board card system integrated with multiple modules. The power supply module is used to convert the preset voltage signal into the voltage level required by each module to power each module. The clock module is used to provide a synchronous clock for the electronics platform to output a light source driving current with a variation amplitude less than a preset amplitude and a magnetic field signal with a first preset frequency interval through the current source module, and to generate a radio frequency signal with a second preset frequency interval through the microwave source module. The control module is used as the core for cross-module collaborative scheduling. The power supply module is used for unified power supply, and the clock module is used for unified clock to ensure system timing synchronization and voltage stability. The board card system integrated with multiple modules realizes integrated hardware layout, thereby highly collaboratively integrating the current source, microwave source, and acquisition card modules, using an integrated design to fill the gap in existing integration technology. Compared with the loose connection of traditional discrete devices, this integrated architecture significantly shortens the physical distance between modules, reduces signal transmission loss and delay, and realizes precise linkage of optical drive, microwave control, and signal acquisition. This architecture breaks through the traditional "independent module design" approach, uses the MCU as the control center to achieve cross-module timing synchronization and dynamic parameter control, significantly improves the overall collaborative performance of the system, and lays a solid foundation for the engineering of high-integration electronics platforms.

[0067] In an exemplary embodiment, the power supply module comprises an electromagnetic interference (EMI) filter, a first conversion circuit, a second conversion circuit and a third conversion circuit, the power supply module is close to an input interface of an external power supply providing a preset voltage signal, and the power supply module transmits current by using a copper foil with a width greater than a preset width;

[0068] The EMI filter is configured to filter the preset voltage signal to obtain a target voltage signal.

[0069] The first conversion circuit is configured to convert the target voltage signal into 8 volts and 3.3 volts; the 8 volts is used to supply power to an operational amplifier and a load in the current source module, and the 3.3 volts is used to supply power to a DAC chip and a voltage reference chip in the current source module.

[0070] The second conversion circuit is configured to convert the target voltage signal into 5 volts and 3.3 volts; the 5 volts is used to supply power to an amplifier in the microwave source module, and the 3.3 volts is used to supply power to a radio frequency chip in the microwave source module.

[0071] The third conversion circuit is configured to convert the target voltage signal into 3.3 volts and 1.8 volts; the 3.3 volts is used to supply power to a collection card module, a control module and a clock module, and the 1.8 volts is used to supply power to a high-speed ADC analog circuit in the collection card module.

[0072] The power supply module is used as a whole-board energy center, adopts an "EMI filtering + layered conversion" architecture, converts a 24V external input into multiple voltage grades required by each module, wherein when the power supply module supplies power to the current source module, the 24V is first converted by a DC-DC converter in the first conversion circuit and then is stabilized by a first LDO to output 8V to supply the operational amplifier and the load, and simultaneously outputs 3.3V to supply the DAC chip and the voltage reference chip; when the power supply module supplies power to the microwave source module, the 24V is converted by a DC-DC converter in the second conversion circuit to output 3.5V and 5.5V, and then 5V and 3.3V are generated by a second LDO to supply power to the radio frequency chip, the amplifier and the control circuit; when the power supply module supplies power to the collection card, the MCU and the clock module, the 24V is first converted by a third LDO and a DC-DC converter, and then 3.3V is generated by a power management module to supply the MCU, the ADC and the frequency synthesis chip, and 1.8V is generated to supply the high-speed ADC analog circuit. In terms of layout, the power supply module is close to the 24V input interface, i.e., close to the input interface of the external power supply providing the preset voltage signal, the preset voltage signal can be a 24V voltage signal, a wide copper foil is used for a large current path to reduce loss, a 100nF decoupling capacitor is placed beside each key chip, and a magnetic bead is connected in series at the power supply inlet of the clock module to reduce the coupling of power supply noise to the clock signal.

[0073] In an embodiment, as Figure 1As shown, the current source module includes a first serial peripheral interface (SPI) communication module, a DAC module, and a current source core module.

[0074] The DAC module is configured to receive a digital signal sent by a micro control unit (MCU) through the first SPI communication module, convert the digital signal into an analog signal, and input the analog signal into the current source core module.

[0075] The current source core module is configured to adjust the conduction degree of a MOS transistor in the current source core module according to the analog signal and the actual voltage on a sampling resistor in the current source core module, so as to output a preset current to the LD laser module.

[0076] The control module (MCU) generates a digital signal instruction (the instruction corresponds to a target parameter of a target current) for adjusting the constant current output by the current source according to an instruction from a host computer; the SPI communication module transmits the digital signal instruction generated by the MCU to the DAC module in real time according to a serial peripheral interface (SPI) protocol; after receiving the digital signal instruction transmitted by the SPI communication module, the DAC module converts the digital signal instruction into an analog control voltage corresponding to the target current; the analog control voltage output by the DAC module is transmitted to the current source core module, in which an operational amplifier monitors the voltage of the sampling resistor in real time through feedback, adjusts the conduction state of the MOS transistor in the current source core module, and finally enables the current source module to stably output a constant current consistent with the target parameter. For example, a 2A constant current is stably output.

[0077] In one embodiment, the LD laser module, the sampling resistor, and the MOS transistor form a compact current loop, the power supply line has a width greater than a preset width and a length less than a preset length.

[0078] The current source module is away from a high-frequency area, and a ground copper foil is laid under the LD. The current calibration loop in the current source module is spaced apart from the main loop of the current source module. The current calibration loop can include an operational amplifier, a low-temperature-drift sampling resistor, a MOS transistor, a self-recovery fuse, a reverse diode, a DAC chip, and a voltage reference chip.

[0079] The LD laser module, the sampling resistor, and the MOS transistor form a compact current loop, which is a large current loop. The power supply line used in the large current loop is wide and short.

[0080] The current source module takes an operational amplifier as the core and adopts a "main and auxiliary loop multiplexing architecture" to realize stable power supply for the LD and integrate the sensor self-calibration function. The main loop cooperates with a 0.5Ω low-temperature drift sampling resistor and a MOS tube to build a feedback loop. Based on the "virtual short and virtual open" characteristics of the operational amplifier, the MOS tube conduction state is adjusted by controlling the input voltage to stabilize the current output to the LD laser module. The newly added auxiliary loop utilizes the idle channel of the operational amplifier, cooperates with a 10Ω low-temperature drift sampling resistor and a small power MOS tube to form a 0.1A small current output to supply power for the calibration coil to realize the self-calibration of the solid-state spin magnetic sensor. The calibration coil in the current source module will generate a standard magnetic field with a known intensity under the action of the current, and the solid-state spin magnetic sensor can compare the detection result of the standard magnetic field with the theoretical value to correct the detection error of the solid-state spin magnetic sensor in the opposite direction, thereby realizing the self-calibration of the solid-state spin magnetic sensor. The calibration coil is the "load" of the current calibration loop, and the current calibration loop provides stable small current for the calibration coil to generate a standard magnetic field.

[0081] In the LD laser module power supply main loop, the LD laser module is connected in series with a recovery diode to prevent reverse voltage from breaking through the LD, and is connected in parallel with a self-recovery fuse to avoid overcurrent damage to the LD laser module. A 100nF ceramic capacitor and a 1μF electrolytic capacitor are connected in parallel across the LD laser module to filter out high-frequency noise and stabilize the voltage. In the small current calibration loop, a 0.2A self-recovery fuse and a reverse diode are connected in series to realize overcurrent protection and coil counter electromotive force suppression, respectively. In the signal conversion circuit, the DAC chip receives the digital signal sent by the control module (MCU) through the SPI communication module and converts it into two analog voltages to control the input of the main loop and the auxiliary loop of the current source module, respectively. The auxiliary loop adjusts the LD laser module power current, and the main loop controls the calibration coil current to make the calibration coil generate a standard magnetic field with a known intensity to provide a self-calibration reference for the solid-state spin magnetic sensor, correct the detection error and ensure the accuracy of the magnetic field detection. The voltage reference chip (including but not limited to ADR4525) provides a high-precision reference voltage to ensure the accuracy of the two current adjustments.

[0082] In terms of layout, the LD laser module is close to the output end of the main loop and forms a compact large current loop with the sampling resistor and the MOS tube to reduce the influence of wiring resistance on current accuracy and electromagnetic interference. The small current calibration loop is arranged in the idle area at the edge of the module and maintains a distance from the main loop to avoid magnetic field coupling. The power supply line uses wide copper foil to meet the current carrying requirement. The overall module is away from the high-frequency area of the microwave source and the high-speed signal line of the clock module, and maintains a safe distance from the radio frequency line and the clock line. A large area of ground copper foil is laid under the LD laser module and the key chips to enhance heat dissipation and suppress interference. The main loop power supply line uses a short and straight path and wide copper foil to ensure current carrying capacity and heat dissipation performance.

[0083] In one embodiment, the microwave source module is arranged at the edge of the board card, and the microwave source module includes four radio frequency synthesis chips connected with the control module through high-frequency signal lines, for generating radio frequency signals in a second preset frequency range and supporting FSK modulation, receiving a 10MHz synchronous clock to generate a basic signal, and outputting after processing by a switch, an amplifier and a filter;

[0084] The control module configures the chip frequency and modulation depth of the radio frequency synthesis chip in the microwave source module through the second SPI communication module.

[0085] The radio frequency synthesis chip generates a radio frequency signal based on the chip frequency and modulation depth configured by the control module.

[0086] The high-frequency signal line adopts a 50Ω impedance matching short straight line.

[0087] The microwave source module is responsible for generating, for example, 2.6-3.1GHz radio frequency signals and supporting FSK modulation, and is composed of radio frequency generation, signal processing and control circuits. The radio frequency generation circuit takes four radio frequency synthesis chips as the core, receives a 10MHz synchronous clock signal distributed by the clock module, and generates a basic radio frequency signal; the signal processing circuit outputs a radio frequency signal meeting the requirements through a radio frequency switch chip, an amplifier, an attenuator and a filter; in the control circuit, the MCU configures the radio frequency synthesis chip parameters (such as frequency, FSK modulation depth and attenuation value) through the second SPI communication module. In terms of layout, the microwave source module is located at the edge of the board card, the high-frequency signal line is designed as a 50Ω impedance matching short straight path to avoid layer penetration; the radio frequency chip is close to the SMA output interface, the control signal line (SPI) is connected with the MCU by using a shielded wire, the shielding layer is conductive with the ground plane, and the interference of high-frequency interference on the clock module and the acquisition card module is reduced.

[0088] In one embodiment, the acquisition card module divides the input signal into an alternating current sub-signal and a direct current sub-signal through a cross-group operational amplifier AC / DC separation circuit, the alternating current sub-signal is collected by a high-speed ADC, the direct current sub-signal is collected by a high-precision ADC, and the two-way data collected by the high-speed ADC and the high-precision ADC are transmitted to the control module through a third SPI communication module;

[0089] The control module controls the microwave source module to generate radio frequency signals in a second preset frequency range, controls the current source module to drive the LD laser module to output a laser light source, and processes the two-way data and uploads them to the upper computer through USB.

[0090] The acquisition card module is responsible for the acquisition and processing of the front-end current signal, and the control and data processing are realized by taking the MCU as the core. The signal separation circuit takes the cross-group operational amplifier AC / DC separation circuit as the core, and the input signal is separated into AC and DC components through the operational amplifier. The AC signal is sent to the high-speed ADC after amplification, and the DC signal is sent to the high-precision ADC. In the analog-to-digital conversion circuit, the high-speed ADC receives the 100MHz low-jitter clock provided by the clock module, ensuring the signal-to-noise ratio of high-frequency sampling; the high-precision ADC receives the 1MHz clock (obtained by dividing the 10MHz clock), reducing the low-frequency sampling error; both the high-precision ADC and the high-speed ADC communicate with the MCU through the third SPI communication module. After receiving the ADC data, the MCU completes filtering, sampling and other processing, and uploads it to the host computer through USB.

[0091] In one embodiment, the acquisition card module is set away from the high-frequency and high-current area, and the analog circuit is arranged centrally. The ADC clock line connecting the clock module and the analog-to-digital converter ADC is wired in a differential pair with an impedance of 50Ω and maintains a distance from the analog signal line. The analog signal line is a signal line inside the acquisition card module for connecting the cross-group operational amplifier AC / DC separation circuit, high-speed ADC and high-precision ADC. The analog circuit includes a current source module, a microwave source module and an acquisition card module.

[0092] In terms of layout, the acquisition card module is away from the high-frequency area of the microwave source module and the clock module, and the analog circuit (operational amplifier, ADC, etc.) is arranged centrally. The analog ground plane is designed as a complete and continuous area. The clock line of the ADC is wired in a differential pair (impedance 50Ω) and maintains a distance from the analog signal line to avoid clock noise coupling to the acquisition signal.

[0093] In one embodiment, the clock module includes a 10MHz oven-controlled crystal oscillator and a frequency synthesis chip, generates multiple clocks, and independently supplies power to the 10MHz oven-controlled crystal oscillator and the frequency synthesis chip. The power inlet of the clock module is connected in series with a magnetic bead. The clock module is arranged in the center of the board card, the clock line is wired in a differential or shielded manner, and a grounding via is provided around the clock module to form a shielded corridor.

[0094] The power inlet of the clock module refers to the connection position between the clock module and the power supply module, and a magnetic bead is connected in series at this connection position.

[0095] The clock module provides a synchronous clock for the whole system, and adopts a "single clock source + multi-distribution" architecture. The main clock source selects a 10MHz constant temperature crystal oscillator, and the output signal is sent to a frequency synthesis chip. The internal PLL and frequency divider of the chip generate multiple clocks. The clock module is independently powered, and a low-noise LDO chip is used to power the crystal oscillator and the frequency synthesis chip. The power input is connected in series with a magnetic bead for isolation. In terms of layout, the clock module is located in the central area of the board with less interference (far away from the microwave source RF output and the current source large current path), the crystal oscillator and the frequency synthesis chip are close to each other, and the reference clock path is short and straight. The clock lines after distribution are routed using differential pairs or shielded lines. The clock lines of different modules are routed separately to avoid parallel routing. Ground vias are arranged around the clock lines to form a shielded corridor and reduce electromagnetic interference.

[0096] The control module is the core of the whole board, and coordinates the work and data interaction of each module. In terms of interface function, the MCU connects the current source (DAC chip), microwave source (RF synthesis chip), and acquisition card (high-speed ADC chip, high-precision ADC chip) through the SPI interface to realize parameter configuration and data read-write; it interacts with the host computer at high speed through the USB communication chip; and it realizes long-distance anti-interference communication through the RS485 interface. In terms of internal processing, the MCU generates current source output control instructions and microwave source parameter instructions after receiving the data from the acquisition card to realize closed-loop control, and the working clock is provided by the clock module to ensure the stability of the control logic. In terms of layout, the MCU is located in the center of the board, the signal lines connected to each module are short and straight, the digital ground and the analog ground are connected through a 0Ω resistor at a single point, and a decoupling capacitor (100nF+1uF) is placed next to the power pin to suppress power noise; when the SPI signal line of the MCU crosses the high-speed clock line of the clock module, vertical cross wiring is adopted to reduce coupling.

[0097] In one embodiment, each module adopts a multi-layer board design and is functionally partitioned. The power supply module is close to the interface of the external power supply that provides a preset voltage signal, the current source module and the microwave source module are located on opposite sides, and a ground isolation belt is arranged between the current source module and the microwave source module.

[0098] The acquisition card module is far away from the high-frequency area, and the control module and the clock module are located in the center.

[0099] The analog ground and the digital ground are connected through a 0Ω resistor at a single point, and the clock line and the power supply line are cross-wired vertically.

[0100] The analog ground is the ground reference point of the analog circuit. The digital ground is the ground reference point of the digital circuit. The analog circuit can include the current source module, the microwave source module, and the acquisition card module. The digital circuit can include the control module and the clock module.

[0101] As Figure 7As shown, the overall adopts a multi-layer board design, and each module layout is strictly partitioned with "function isolation and signal coordination" as the core: the power supply module is adjacent to the 24V input interface, and the low-noise power supply is realized by the close coupling of the power supply layer and the ground layer. Through the "EMI filtering and layered conversion" architecture, multiple voltage grades are allocated to the whole board, the wide copper foil is used for the high-current path to reduce the loss, and the 100nF decoupling capacitor is configured next to the key chip. The current source module and the microwave source module are arranged on both sides of the board, and a ground isolation strip (large-area ground and metallized via) is provided in the middle to physically separate the interference. The LD laser module is close to the current source output, and forms a compact high-current loop with the sampling resistor and the MOS tube. The power supply line uses a wide copper foil, and the large-area ground copper foil below enhances heat dissipation and anti-interference. The microwave source high-frequency signal line is matched with 50Ω impedance and short straight wiring, and is away from the LD laser module. The acquisition card module is arranged in an area away from high frequency and high current, and the analog ground is independently laid with copper, and is only connected with the digital ground through a 0Ω resistor at a single point. The MCU and the clock module are in the middle as the connection hub, the clock module outputs multiple synchronous clocks, the clock lines and the LD power supply lines are vertically crossed, the MCU coordinates the interaction of each module through the SPI bus, and the analog-digital domain is also grounded at a single point by using a 0Ω resistor, ensuring the stable operation of the whole board function. The probe of the NV color center sensor containing optical devices is partially fixed on the PCB, and the fluorescence and laser signals from the probe are received through a straight insertion type coaxial interface, and then transmitted to the acquisition card module. At the same time, the current source provides a driving circuit for the NV probe, so that the excitation light source can generate excitation light for the operation of the NV color center sensor.

[0102] The present application effectively suppresses microwave high-frequency interference, high-current loop interference and clock noise coupling by comprehensively using various measures such as functional partition layout, multi-level metal shielding, ground isolation, impedance matching wiring and power supply noise suppression. Compared with the unoptimized integrated scheme, the electromagnetic compatibility of the system is significantly improved, ensuring the stable output of the light source driving current, the accurate generation of the 2.6-3.1GHz radio frequency signal and the low noise characteristics of the acquisition signal, and ensuring the long-term stable operation of the basic sensing function in the high-density integrated environment.

[0103] Moreover, the present application innovatively applies MCU to dynamically configure the parameters of the radio frequency synthesis chip, realizes multi-axis NV color center time-sharing control, and replaces the traditional multi-channel independent microwave source design. While reducing hardware redundancy, the flexibility of microwave modulation is improved, effectively solving the problem of high cost of traditional schemes. Using the MCU-based master control architecture to replace the complex processing scheme relying on FPGA, the hardware cost is significantly reduced under the premise of meeting the core functional requirements such as signal modulation and demodulation, filtering, etc., avoiding the high development threshold and long cycle of FPGA, accelerating the system deployment efficiency, and solving the problem of excessive resource consumption of signal acquisition, realizing efficient balance between performance and cost in different application scenarios.

[0104] In one embodiment, a multi-level shielding and grounding design is adopted: the microwave source module is enclosed with a 0.3mm copper cover and grounded at multiple points; the front end of the current source simulation area and the acquisition card module is grounded with a metal isolation frame; the clock module is grounded with a shielding cover and conductive adhesive; an EMI filter is added to the power supply area; ferrite beads are connected in series at the power input of each module; and an array of grounding vias is provided below the LD laser module and key chips. The key chips may include RF synthesis chips, RF switch chips, ADC chips, DAC chips, clock distribution chips, etc.

[0105] like Figure 8 As shown, Figure 8 This is a schematic diagram of an electromagnetic shielding design for a microwave source module provided in this application embodiment. To optimize the electromagnetic shielding effect, a multi-level, differentiated shielding and grounding design is adopted: the microwave source area is completely enclosed by a 0.3-2mm thick copper shield, with the shield welded to the ground plane at multiple points to construct a high-frequency interference "isolation cavity." The current source analog area and the front-end circuit of the acquisition card are separated and grounded by a metal isolation frame to create an independent analog signal area and block digital noise crosstalk; the clock module is covered with a small metal shield, which is connected to the ground plane through conductive adhesive to reduce the interference of external noise on the clock signal. Grounding treatment is simultaneously strengthened: an EMI filter is installed at the input end of the power supply area, and ferrite beads are connected in series at the power input of each module to intercept power link noise; a single-point connection between analog ground and digital ground is adopted, plus a scheme where the clock module ground and analog ground share a common ground to avoid ground loop interference; a grounding via array is arranged below the LD and key chips to enhance vertical shielding and heat dissipation, constructing a complete electromagnetic protection system from module to board level to ensure signal purity and system stability.

[0106] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps. It is understood that the steps in different embodiments can be freely combined as needed, and all non-contradictory solutions formed by such combinations are within the scope of protection of this application.

[0107] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by a computer program instructing relevant hardware. The computer program can be stored in a non-volatile computer readable storage medium. When the computer program is executed, the processes of the above-mentioned embodiment methods can be included. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. The non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. The volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, the RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., and is not limited thereto. The processor involved in the embodiments provided in the present application can be a general processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., and is not limited thereto.

[0108] The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, it should be considered as the scope of the present application.

[0109] The above embodiments only express several implementation ways of the present application, and the description is specific and detailed, but it should not be understood as a limitation to the patent scope of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. An electronics platform for solid-state spin magnetic sensors, characterized in that, The electronic platform comprises a probe, a host computer and a board system integrated with a plurality of modules, the plurality of modules comprising a current source module, a microwave source module, an acquisition card module, a control module, a clock module and a power supply module, the power supply module being connected with the current source module, the microwave source module, the acquisition card module, the control module and the clock module, the clock module being connected with the acquisition card module and the microwave source module, the control module being connected with the current source module, the microwave source module and the acquisition card module, and the host computer being connected with the control module. The power supply module is configured to convert a preset voltage signal into voltage grades required by the modules respectively, so as to supply power to the modules. The clock module is configured to provide a synchronous clock for the electronic platform, so as to output a light source driving current with a variation amplitude less than a preset amplitude and a magnetic field signal with a first preset frequency interval by the current source module, and generate a radio frequency signal with a second preset frequency interval by the microwave source module.

2. The electronics platform of claim 1, wherein, The power supply module comprises an EMI filter, a first conversion circuit, a second conversion circuit and a third conversion circuit, the power supply module being close to an input interface of an external power supply providing the preset voltage signal, and the power supply module transmitting a current by using a copper foil with a width greater than a preset width. The EMI filter is configured to filter the preset voltage signal to obtain a target voltage signal. The first conversion circuit is configured to convert the target voltage signal into 8 volts and 3.3 volts, 8 volts being used to supply power to an operational amplifier and a load in the current source module, and 3.3 volts being used to supply power to a DAC chip and a voltage reference chip in the current source module. The second conversion circuit is configured to convert the target voltage signal into 5 volts and 3.3 volts, 5 volts being used to supply power to an amplifier in the microwave source module, and 3.3 volts being used to supply power to a radio frequency chip in the microwave source module. The third conversion circuit is configured to convert the target voltage signal into 3.3 volts and 1.8 volts. 3.3 volts is used to supply power to the acquisition card module, the control module and the clock module, and 1.8 volts is used to supply power to a high-speed ADC analog circuit in the acquisition card module.

3. The electronics platform of claim 1, wherein, The current source module comprises a first serial peripheral interface (SPI) communication module, a DAC module and a current source core module. The DAC module is configured to receive a digital signal sent by a micro control unit (MCU) through the first SPI communication module, convert the digital signal into an analog signal and input the analog signal into the current source core module. The current source core module is configured to adjust a conduction degree of a MOS transistor in the current source core module according to the analog signal and an actual voltage on a sampling resistor in the current source core module, so as to output a preset current to an LD laser module.

4. The electronics platform of claim 3, wherein, The LD laser module, the sampling resistor and the MOS transistor form a compact current loop, a power supply line has a width greater than a preset width and a length less than a preset length. The current source module is far away from the high frequency area, the LD is laid with a ground copper foil below, and a current calibration loop is kept apart from a main loop of the current source module.

5. The electronics platform of claim 1, wherein, The microwave source module is arranged at the edge of the board card, the microwave source module includes four radio frequency synthesis chips, the radio frequency synthesis chips are connected with the control module through high frequency signal lines, are used for generating radio frequency signals of the second preset frequency interval and supporting FSK modulation, receiving a 10MHz synchronous clock to generate a basic signal, and outputting after being processed by a switch, an amplifier and a filter; the high frequency signal lines adopt 50Ω impedance matching short straight lines; The control module configures the chip frequency and the modulation depth of the radio frequency synthesis chips in the microwave source module through a second SPI communication module; The radio frequency synthesis chips are used for generating radio frequency signals based on the chip frequency and the modulation depth configured by the control module.

6. The electronic platform of claim 1, wherein The acquisition card module divides input signals into alternating current sub-signals and direct current sub-signals through a cross-group operational amplifier AC / DC separation circuit, the alternating current sub-signals are collected by a high-speed ADC, the direct current sub-signals are collected by a high-precision ADC, and two-way data collected by the high-speed ADC and the high-precision ADC are transmitted to the control module through a third SPI communication module; The control module is used for controlling the microwave source module to generate radio frequency signals of the second preset frequency interval, controlling the current source module to drive the LD laser module to output a laser light source, and uploading the two-way data to the upper computer after processing through a USB.

7. The electronic platform of claim 6, wherein The acquisition card module is arranged far away from the high frequency and large current area, analog circuits are arranged in a concentrated manner, an analog ground plane is complete and continuous, an ADC clock line connecting the clock module and an analog-to-digital converter ADC adopts 50Ω differential pair wiring and keeps apart from analog signal lines; the analog signal lines are signal lines inside the acquisition card module for connecting the cross-group operational amplifier AC / DC separation circuit and the high-speed ADC and the high-precision ADC, and the analog circuits include the current source module, the microwave source module and the acquisition card module.

8. The electronics platform of claim 1, wherein, The clock module includes a 10MHz constant temperature crystal oscillator and a frequency synthesis chip, generates multiple clock signals, independently supplies power to the 10MHz constant temperature crystal oscillator and the frequency synthesis chip, and a power inlet of the clock module is connected in series with a magnetic bead; the clock module is arranged at the center of the board card, clock lines adopt differential or shielded wiring, and a shielded corridor is formed around the clock module by arranging ground vias.

9. The electronics platform of claim 1, wherein, Each of the modules adopts a multi-layer board design and functional partitioning, the power supply module is close to an interface of an external power supply providing the preset voltage signal, the current source module and the microwave source module are separately arranged on two sides, and a ground isolation belt is arranged between the current source module and the microwave source module; The acquisition card module is far away from the high frequency area, and the control module and the clock module are arranged in the center; An analog ground and a digital ground are connected by a 0Ω resistance single point, and clock lines and power supply lines are arranged in a vertical intersection manner.

10. The electronics platform of claim 1, wherein, Multi-level shielding and grounding design is adopted: the microwave source module is closed by a 0.3 mm copper cover and is multi-point grounded, the current source simulation area and the front end of the acquisition card module are grounded by a metal isolation frame, the clock module is grounded by a shielding cover through conductive glue; an EMI filter is added in the power supply area, a magnetic bead is connected in series at the power supply inlet of each module, and a grounding via array is arranged below the LD laser module and key chips.

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