Wafer testing apparatus and method

Abstract

The application discloses a wafer testing device and method, and belongs to the field of wafer testing. The wafer testing device comprises a base, a suction device and a probe station, and further comprises a testing platform arranged on the suction device, wherein an adsorption disc is arranged on the testing platform, the adsorption disc is communicated with the suction device, a positioning mechanism is arranged on the testing platform and is used for moving a wafer to a center position of the adsorption disc, a feeding seat is fixedly connected to the suction device, a feeding mechanism is arranged on the inner wall of the feeding seat and close to the testing platform, the positioning mechanism and the feeding mechanism are communicated through pipelines, a probe body is arranged on the probe station, a cleaning mechanism is arranged on the side of the probe station close to the probe body, and the cleaning mechanism is communicated with the feeding mechanism and the positioning mechanism through pipelines. The application can overcome the problems of low wafer testing efficiency, easy damage, great testing difficulty and poor testing result precision.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and more particularly to a wafer testing apparatus and method. Background Technology

[0002] A wafer is a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. The main processing methods for wafers are wafer fabrication and batch fabrication, which means that one or more wafers are processed at the same time. Before packaging, each individual wafer needs to be verified for electrical characteristics and functionality. In this way, it can be ensured that each wafer meets the preset performance standards, such as operating voltage, current consumption, signal timing, and the correct execution of specific functions.

[0003] Currently, wafer probe testing mainly involves manual placement or placement via robotic arms. To ensure placement accuracy, image processing equipment and a control processor are needed to determine the coordinates of a fixed position. Then, the robotic arm is controlled to place the wafer in the designated location. After testing, the robotic arm is used to remove the wafer. During placement and removal, the equipment needs to be stationary, resulting in low wafer testing efficiency. Furthermore, the gripping method can easily damage the wafer. In addition, during long-term operation, dust and dirt accumulate on the probe surface, and the probe surface temperature gradually increases, greatly affecting the alignment between the probe and the wafer testing position. This not only increases the testing difficulty but also increases the testing error, thus affecting the accuracy of the wafer testing results. Summary of the Invention

[0004] The purpose of this invention is to solve the problems of low efficiency, easy damage, high testing difficulty, and poor accuracy of test results in existing wafer testing technologies, and to propose a wafer testing device and method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A wafer testing apparatus includes a base, an adsorption device, and a probe station. It further includes: a testing platform disposed on the adsorption device, wherein an adsorption disk is disposed on the testing platform and the adsorption disk is connected to the adsorption device; a positioning mechanism disposed on the testing platform for moving the wafer to the center position of the adsorption disk; a loading seat fixedly connected to the adsorption device, wherein a loading mechanism is disposed on the inner wall of the loading seat near the testing platform; the positioning mechanism and the loading mechanism are connected via a pipe; and a probe body disposed on the probe station, wherein a cleaning mechanism is disposed on the side of the probe station near the probe body; the cleaning mechanism is connected to the loading mechanism and the positioning mechanism via a pipe. When the wafer is placed on the adsorption disk, it is able to be suspended in mid-air, and the wafer is ejected after testing.

[0007] To facilitate placing the wafer at a designated location, preferably, the positioning mechanism includes symmetrically arranged grooves on the test platform, with a positioning ring slidably connected inside the grooves. A telescopic rod connected to the positioning ring is fixedly connected to the test platform, and a controller is fixedly connected to the inner wall of the positioning ring. The positioning ring is arc-shaped and aligned with the axis of the adsorption disk. The bottom of the positioning ring is in contact with the test platform, and the side of the positioning ring closest to the adsorption disk is inclined.

[0008] To facilitate continuous and intermittent wafer release, the loading mechanism further includes a baffle symmetrically rotatably connected to the inner wall of the loading seat. A permanent magnet is fixedly connected to the side of the baffle near the inner wall of the loading seat, and an electromagnetic block is fixedly connected to the side of the inner wall of the loading seat near the permanent magnet. An arc-shaped rod connected to the baffle is fixedly connected to the loading seat, wherein the center of the arc-shaped rod and the axis of the baffle are on the same straight line. The arc-shaped rod is elastic and includes two sets of compression chambers. The exhaust end of one set of compression chambers is connected to the air inlet end of the telescopic rod through a pipe. When the electromagnetic block is energized, the permanent magnet and the electromagnetic block on the side closer to each other have opposite magnetic properties.

[0009] To facilitate the fixing of the wafer and the removal of the wafer after testing, the device further includes a discharge seat fixedly connected to the side of the adsorption device away from the loading seat. Both the loading seat and the discharge seat are provided with multiple sets of guide wheels. Both the loading seat and the discharge seat are inclined, and the bottom end of the loading seat and the top end of the discharge seat are connected to the test platform.

[0010] To facilitate probe cleaning and avoid affecting subsequent testing, the cleaning mechanism further includes an arc-shaped cylinder fixedly connected to the probe stage near the probe body. A piston plate is slidably connected inside the arc-shaped cylinder. A movable plate, slidably connected to the arc-shaped cylinder, is fixedly connected to the side of the piston plate away from the probe stage. The piston plate divides the arc-shaped cylinder into two sets of sealed chambers. The sealed chamber away from the movable plate is connected to one of the compression chambers of the arc-shaped rod through a pipe, which drives the movable plate to move along the direction of the probe body.

[0011] To further ensure the cleanliness and temperature stability of the probe during testing, a mounting ring is fixedly connected to the end of the movable plate. The mounting ring has an internal mounting groove, and a rotating ring is rotatably connected inside the mounting groove. A cleaning brush is fixedly connected to the inner wall of the rotating ring, and multiple sets of fins are fixedly connected to the outer wall of the rotating ring. Two sets of connecting pipes are connected to the outer wall of the mounting ring. One set of connecting pipes is connected to the sealing cavity near the movable plate side of the arc-shaped cylinder via a pipe. The cleaning brush is sleeved on the outside of the probe body. An air-slip ring is fixedly connected to the mounting ring and rotatably connected to the rotating ring. The air-slip ring is connected to the adsorption device via a pipe, and a dust suction hole connected to the air-slip ring is opened on the inner wall of the rotating ring.

[0012] To further reduce friction during wafer movement, the system includes a gas storage cavity within the positioning ring. An air inlet connected to the gas storage cavity is fixedly connected to the outside of the positioning ring. A connecting channel connected to the gas storage cavity is formed inside the positioning ring. A sliding cavity is formed on the side of the positioning ring near the connecting channel. A return spring is fixedly connected inside the sliding cavity. A sealing plate that slides through the sliding cavity is fixedly connected to the end of the return spring. Multiple sets of air holes connected to the connecting channel are formed on the positioning ring. A release hole connected to the connecting channel is formed on the test platform. The air inlet and the sliding cavity are connected to one of the connecting pipes via a pipe. A one-way valve is installed inside the air inlet.

[0013] To facilitate adjustment of the wafer's testing position, a horizontal slide rail is further included, which is fixedly connected to the base. A vertical slide rail is connected to the horizontal slide rail, and the adsorption device is fixedly connected to the vertical slide rail for adjusting the horizontal and vertical positions of the adsorption device.

[0014] To facilitate the detection of the test position of the wafer, the device further includes a bracket fixedly connected to the base, the probe station fixedly connected to the bracket, an adjustment seat fixedly connected to the base, a position detector fixedly connected to the adjustment seat, and the position detector located above the probe station.

[0015] A wafer testing method includes the following steps:

[0016] Step 1: Place the wafer to be tested on the equipment;

[0017] Step 2: The wafer is automatically placed in the designated position on the equipment and then adsorbed and fixed.

[0018] Step 3: When placing the wafer, keep it suspended during the sliding process to reduce wafer wear;

[0019] Step 4: After completing wafer testing, clean the probe surface.

[0020] Step 5: Collect the wafers after testing.

[0021] Compared with the prior art, the present invention provides a wafer testing apparatus and method, which has the following beneficial effects:

[0022] 1. This wafer testing device can not only temporarily store wafers to be tested through the feeding mechanism, but also continuously and intermittently release wafers to facilitate continuous testing. In addition, the feeding mechanism can drive the positioning mechanism to fix the wafers to the designated position on the adsorption plate, thereby ensuring the accuracy of the wafer testing position. At the same time, it can also realize automatic wafer unloading, which greatly improves the wafer testing efficiency.

[0023] 2. This wafer testing device can drive the cleaning mechanism to move along the direction of the probe through the feeding mechanism, so as to clean the dust and dirt attached to the probe surface. The dust and dirt in the cleaning process are collected by adsorption. At the same time, the probe can be cooled, which greatly reduces the difficulty of wafer testing, reduces the error of wafer testing, and thus improves the accuracy of wafer testing results.

[0024] 3. This wafer testing device, through the reciprocating movement of the cleaning mechanism, can blow gas onto the testing platform while the wafer is moving, causing the wafer to move towards the adsorption plate or from the adsorption plate to the feed seat in a suspended state. This reduces the friction experienced by the wafer during movement, ensuring the quality of the wafer during testing, while also improving the wafer yield and reducing the cost of wafer testing.

[0025] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This invention can overcome the problems of low wafer testing efficiency, easy damage, high testing difficulty, and poor test result accuracy. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a wafer testing device proposed in this invention;

[0027] Figure 2 This is a partial structural schematic diagram of a wafer testing device proposed in this invention;

[0028] Figure 3 This is a partial structural diagram of the loading seat in a wafer testing device proposed in this invention;

[0029] Figure 4 This is a schematic diagram of the structure of the adsorption device in a wafer testing apparatus proposed in this invention;

[0030] Figure 5This is a schematic diagram of the probe station and probe body in a wafer testing device proposed in this invention;

[0031] Figure 6 This is a schematic diagram of the arc-shaped cylinder, movable plate, and mounting ring in a wafer testing device proposed in this invention;

[0032] Figure 7 This is a schematic cross-sectional view of the mounting ring in a wafer testing device proposed in this invention.

[0033] Figure 8 This is a schematic cross-sectional view of the arc-shaped cylinder and movable plate in a wafer testing device proposed in this invention.

[0034] Figure 9 This is a schematic cross-sectional view of the positioning ring in a wafer testing device proposed in this invention.

[0035] Figure 10 This invention provides a wafer testing device. Figure 9 A schematic diagram of the structure of part A;

[0036] Figure 11 This is a flowchart of a wafer testing method proposed in this invention.

[0037] In the diagram: 1. Base; 2. Control panel; 3. Horizontal slide rail; 4. Vertical slide rail; 5. Adsorption device; 6. Test platform; 7. Adsorption plate; 8. Slide groove; 9. Positioning ring; 10. Telescopic rod; 11. Controller; 12. Air inlet; 13. Air storage chamber; 14. Connecting channel; 15. Slide cavity; 16. Return spring; 17. Sealing plate; 18. Air hole; 19. Release hole; 20. Loading seat; 21. Unloading seat; 22. Guide wheel; 23. Baffle; 24. Permanent magnet; 25. Electromagnetic block; 26. Arc rod; 27. Bracket; 28. Probe station; 29. ​​Probe body; 30. Arc cylinder; 31. Piston plate; 32. Movable plate; 33. Mounting ring; 34. Mounting groove; 35. Rotating ring; 36. Cleaning brush; 37. Fin; 38. Connecting pipe; 39. Adjusting seat; 40. Position detector. Detailed Implementation

[0038] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0039] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0040] Example 1:

[0041] Reference Figures 1-10 A wafer testing apparatus includes a base 1, an adsorption device 5, and a probe station 28. It also includes: a testing platform 6, mounted on the adsorption device 5, with an adsorption disk 7 connected to the adsorption device 5; a positioning mechanism on the testing platform 6 for moving the wafer to the center of the adsorption disk 7; a loading seat 20, fixedly connected to the adsorption device 5, with a loading mechanism on the inner wall of the loading seat 20 near the testing platform 6; and a probe body 29, mounted on the probe station 28, with a cleaning mechanism on the side of the probe station 28 near the probe body 29; the cleaning mechanism is connected to the loading mechanism and the positioning mechanism via a pipe. When the wafer is placed on the adsorption disk 7, it is suspended in mid-air, and the tested wafer is ejected. A control panel 2 is also mounted on the base 1 for controlling the operation of various parts of the apparatus.

[0042] The specific structure of the adsorption device 5 can be referred to the technical solutions in the prior art, which are known to those skilled in the art and will not be described in detail here. The wafer is adsorbed and fixed by the adsorption device 5 and the adsorption plate 7 to facilitate the testing of the wafer. The surface of the adsorption plate 7 is provided with multiple sets of holes to generate negative pressure on the surface of the adsorption plate 7. The probe station 28 is a conventional means in the prior art and can drive the probe body 29 to move in different directions to facilitate the testing of the wafer.

[0043] Reference Figure 1 , Figure 2 and Figure 4 The positioning mechanism includes symmetrically arranged grooves 8 on the test platform 6, with a positioning ring 9 slidably connected inside the grooves 8. A telescopic rod 10 connected to the positioning ring 9 is fixedly connected to the test platform 6, and a controller 11 is fixedly connected to the inner wall of the positioning ring 9. The positioning ring 9 is arc-shaped and is on the same straight line as the axis of the adsorption plate 7. The bottom of the positioning ring 9 is in contact with the test platform 6, and the side of the positioning ring 9 closest to the adsorption plate 7 is inclined.

[0044] When the wafer is released through the baffle 23, the arc-shaped rod 26 first adsorbs gas from the telescopic rod 10, causing the two sets of positioning rings 9 to move towards each other. After the wafer is released, the wafer on the adsorption plate 7 is pushed out. When the baffle 23 rotates to the initial position, gas is delivered into the telescopic rod 10 through the arc-shaped rod 26, causing the two sets of positioning rings 9 to move relative to each other, adjusting the position of the subsequent wafers until the wafer is moved to the designated position. At this time, the controller 11 on the positioning ring 9 will simultaneously contact both sides of the wafer (at this time the pressure is small and will not damage the wafer). The controller 11 can be implemented by means of electrical signals, which can not only stop the extension of the telescopic rod 10, but also start the equipment (to test the wafer).

[0045] Reference Figures 1-3 The feeding mechanism includes a baffle 23 symmetrically rotated and connected to the inner wall of the feeding seat 20. A permanent magnet 24 is fixedly connected to the side of the baffle 23 near the inner wall of the feeding seat 20. An electromagnetic block 25 is fixedly connected to the side of the inner wall of the feeding seat 20 near the permanent magnet 24. An arc-shaped rod 26 connected to the baffle 23 is fixedly connected to the feeding seat 20. The center of the arc-shaped rod 26 and the axis of the baffle 23 are on the same straight line. The arc-shaped rod 26 is elastic and includes two sets of compression chambers. The exhaust end of one set of compression chambers is connected to the air inlet end of the telescopic rod 10 through a pipe. When the electromagnetic block 25 is energized, the magnetism of the permanent magnet 24 and the electromagnetic block 25 on the side closer to each other is opposite.

[0046] The magnetic poles of the permanent magnet 24 and the electromagnetic block 25 are not limited here. As long as the permanent magnet 24 and the electromagnetic block 25 are energized, the magnetic poles of the permanent magnet 24 and the electromagnetic block 25 are opposite to each other on the side closest to each other. When the wafer test is completed, the electromagnetic block 25 can be energized. This is a conventional method in the prior art, so it will not be described in detail. Then the baffles 23 on both sides rotate towards each other. The size between the two sets of baffles 23 is larger than the size of the wafer. The wafer is moved to the test platform 6 through the loading seat 20. When the electromagnetic block 25 is de-energized, the baffles 23 are driven to rotate to the initial position under the action of the arc rod 26 to block the subsequent wafers.

[0047] Reference Figures 1-2 It also includes a discharge seat 21 fixedly connected to the side of the adsorption device 5 away from the loading seat 20. Both the loading seat 20 and the discharge seat 21 are provided with multiple sets of guide wheels 22. The loading seat 20 and the discharge seat 21 are both inclined, and the bottom end of the loading seat 20 and the top end of the discharge seat 21 are connected to the test platform 6.

[0048] After the wafer is placed on the loading seat 20, it will move along the loading seat 20 to the testing platform 6 under the action of gravity and the guide wheel 22. After the test is completed, the wafer will move through the unloading seat 21, thereby realizing the automatic loading and unloading of wafers.

[0049] Reference Figure 1 , Figure 5 , Figure 6 and Figure 8 The cleaning mechanism includes an arc-shaped cylinder 30 fixedly connected to the probe station 28 near the probe body 29. A piston plate 31 is slidably connected inside the arc-shaped cylinder 30. A movable plate 32, which is slidably connected to the arc-shaped cylinder 30, is fixedly connected to the side of the piston plate 31 away from the probe station 28. The piston plate 31 divides the arc-shaped cylinder 30 into two sets of sealed chambers. The sealed chamber away from the movable plate 32 is connected to one of the compression chambers of the arc-shaped rod 26 through a pipe, which is used to drive the movable plate 32 to move along the direction of the probe body 29.

[0050] When the wafer is released, the gas compressed by the arc rod 26 is delivered into the arc cylinder 30, driving the piston plate 31 to move along the arc cylinder 30, thereby driving the mounting ring 33 to move towards the probe body 29, so as to clean the dust and dirt on the surface of the probe body 29.

[0051] Reference Figures 5-7 An installation ring 33 is fixedly connected to the end of the movable plate 32. An installation groove 34 is opened inside the installation ring 33. A rotating ring 35 is rotatably connected inside the installation groove 34. A cleaning brush 36 is fixedly connected to the inner wall of the rotating ring 35. Multiple sets of fins 37 are fixedly connected to the outer wall of the rotating ring 35. Two sets of connecting pipes 38 are connected to the outer wall of the installation ring 33. One set of connecting pipes 38 is connected to the sealing cavity of the arc-shaped cylinder 30 near the movable plate 32 through a pipe. The cleaning brush 36 is sleeved on the outside of the probe body 29. An air slip ring is fixedly connected to the installation ring 33 and rotatably connected to the rotating ring 35. The air slip ring is connected to the adsorption device 5 through a pipe. A dust suction hole connected to the air slip ring is opened on the inner wall of the rotating ring 35.

[0052] When the movable plate 32 extends, the compressed gas in the sealed cavity of the piston plate 31 near the movable plate 32 is transported to the mounting groove 34 through one of the connecting pipes 38. Under the action of the fins 37, the rotating ring 35 rotates along the probe body 29. Then the gas is discharged through another connecting pipe 38. The friction between the cleaning brush 36 and the probe body 29 can clean the dust and dirt. During the cleaning process, the dust and dirt are adsorbed through the suction hole (it should be explained that the dust and dirt sucked out generally need to be collected by the collection device to collect the dust and dirt in the gas), to prevent the dust and dirt from falling onto the test platform 6. In addition, the suction can also cool the probe body 29, to prevent thermal expansion and contraction caused by high temperature after the probe body 29 has been working for a long time, thereby reducing the difficulty of wafer testing, reducing test errors, and improving the accuracy and reliability of the probe body 29.

[0053] Reference Figure 2 , Figure 4 , Figure 9 and Figure 10 It also includes an air storage chamber 13 opened in the positioning ring 9. An air inlet 12 connected to the air storage chamber 13 is fixedly connected to the outside of the positioning ring 9. A connecting channel 14 connected to the air storage chamber 13 is opened inside the positioning ring 9. A sliding cavity 15 is opened on the side of the positioning ring 9 near the connecting channel 14. A return spring 16 is fixedly connected inside the sliding cavity 15. A sealing plate 17 slidably connected to the sliding cavity 15 is fixedly connected to the end of the return spring 16. Multiple sets of air holes 18 connected to the connecting channel 14 are opened on the positioning ring 9. A release hole 19 connected to the connecting channel 14 is opened on the test platform 6. The air inlet 12 and the sliding cavity 15 are connected to one of the connecting pipes 38 through a pipe. A one-way valve is installed inside the air inlet 12.

[0054] During the wafer release process, the gas discharged through the connecting pipe 38 is stored in the gas storage chamber 13, which simultaneously pushes the sealing plate 17 to move towards the connecting channel 14. At this time, the sealing plate 17 blocks the connecting channel 14. When the wafer moves, the connecting pipe 38 adsorbs the gas in the sliding cavity 15, thereby driving the sealing plate 17 to move towards the initial position. The gas stored in the gas storage chamber 13 is discharged through the connecting channel 14 to the gas hole 18 and the release hole 19, thereby supporting the wafer during the movement, reducing friction between the wafer and the test platform 6, thereby reducing wafer damage, improving wafer yield, and reducing wafer testing costs.

[0055] Reference Figures 1-2 It also includes a horizontal slide rail 3 fixedly connected to the base 1, a vertical slide rail 4 connected to the horizontal slide rail 3, an adsorption device 5 fixedly connected to the vertical slide rail 4 for adjusting the horizontal and vertical positions of the adsorption device 5, a bracket 27 fixedly connected to the base 1, a probe station 28 fixedly connected to the bracket 27, an adjustment seat 39 fixedly connected to the base 1, a position detector 40 fixedly connected to the adjustment seat 39, and the position detector 40 located above the probe station 28.

[0056] The horizontal slide rail 3, the vertical slide rail 4, the probe stage 28, the adjustment seat 39, and the position detector 40 are all conventional means in the prior art, used to adjust the position of the wafer and the test position of the probe body 29. The position detector 40 adopts an image sensing device, which can accurately observe the test position between the probe body 29 and the wafer to ensure the accuracy and stability of wafer testing.

[0057] Example 2:

[0058] Similar to Example 1, a wafer testing method is proposed based on Example 1, including the following steps:

[0059] Step 1: Place the wafer to be tested on the equipment;

[0060] Step 2: The wafer is automatically placed in the designated position on the equipment and then adsorbed and fixed.

[0061] Step 3: When placing the wafer, keep it suspended during the sliding process to reduce wafer wear;

[0062] Step 4: After completing the wafer testing, clean the surface of the probes;

[0063] Step 5: Collect the wafers after testing.

[0064] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer testing device, comprising a base (1), characterized in that: An adsorption device (5) is provided on the base (1), a test platform (6) is provided on the adsorption device (5), and an adsorption disk (7) connected to the adsorption device (5) is provided on the test platform (6); a positioning mechanism for moving the wafer to the center position of the adsorption disk (7) is provided on the test platform (6); a probe station (28) is provided on the base (1), and a probe body (29) is provided on the probe station (28); a loading seat (20) is fixedly connected to the base (1), and a loading mechanism is provided on the inner wall of the loading seat (20) near the test platform (6); a cleaning mechanism is provided on the side of the probe station (28) near the probe body (29). The positioning mechanism includes symmetrically arranged grooves (8) on the test platform (6), a positioning ring (9) is slidably connected inside the groove (8), a telescopic rod (10) connected to the positioning ring (9) is fixedly connected to the test platform (6), a controller (11) is fixedly connected to the inner wall of the positioning ring (9), the positioning ring (9) is arc-shaped and located on the same straight line as the axis of the adsorption disk (7), the bottom of the positioning ring (9) is in contact with the test platform (6), and the side of the positioning ring (9) close to the adsorption disk (7) is inclined. The positioning ring (9) is provided with an air storage chamber (13). An air inlet (12) connected to the air storage chamber (13) is fixedly connected to the outside of the positioning ring (9). A connecting channel (14) connected to the air storage chamber (13) is opened inside the positioning ring (9). A sliding cavity (15) is opened on the side of the positioning ring (9) near the connecting channel (14). A return spring (16) is fixedly connected inside the sliding cavity (15). A sealing plate (17) slidably connected to the sliding cavity (15) is fixedly connected to the end of the return spring (16). Multiple sets of air holes (18) connected to the connecting channel (14) are opened on the positioning ring (9). A release hole (19) connected to the connecting channel (14) is opened on the test platform (6). The air inlet (12) and the sliding cavity (15) are connected to one of the connecting pipes (38) through a pipe. A one-way valve is provided inside the air inlet (12). A bracket (27) is fixed on the base (1), and the probe station (28) is fixedly connected to the bracket (27). An adjustment seat (39) is fixedly connected to the base (1), and a position detector (40) is fixedly connected to the adjustment seat (39). The position detector (40) is located above the probe station (28). The feeding mechanism includes a baffle (23) symmetrically rotated and connected to the inner wall of the feeding seat (20). A permanent magnet (24) is fixedly connected to the side of the baffle (23) near the inner wall of the feeding seat (20). An electromagnetic block (25) is fixedly connected to the side of the inner wall of the feeding seat (20) near the permanent magnet (24). An arc-shaped rod (26) connected to the baffle (23) is fixedly connected to the feeding seat (20). The arc-shaped rod (26) is elastic and includes two sets of compression chambers. One set of compression chambers is connected to the air inlet of the telescopic rod (10) through a pipe. When the electromagnetic block (25) is energized, the permanent magnet (24) and the electromagnetic block (25) on the side that are close to each other have opposite magnetic properties. The cleaning mechanism includes an arc-shaped cylinder (30) fixedly connected to the probe station (28) on the side near the probe body (29). A piston plate (31) is slidably connected inside the arc-shaped cylinder (30). A movable plate (32) slidably connected to the arc-shaped cylinder (30) is fixedly connected to the side of the piston plate (31) away from the probe station (28). The piston plate (31) divides the arc-shaped cylinder (30) into two sets of sealed cavities. The sealed cavity away from the movable plate (32) is connected to one of the compression cavities of the arc-shaped rod (26) through a pipe, which is used to drive the movable plate (32) to move along the direction of the probe body (29).

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