Wafer adsorption device

Abstract

The invention provides a wafer adsorption device, and relates to the field of wafer processing, the wafer adsorption device comprises a device main body, an adsorption mechanism arranged on the device main body, and a pipeline mechanism arranged on the device main body and communicated with the adsorption mechanism; the adsorption mechanism comprises a base body and a back plate assembly arranged below the base body, the side, close to the back plate assembly, of the base body is provided with a plurality of concentric cavity grooves outwards at intervals from the center of the base body, the back plate assembly comprises a plurality of back plates, the back plates and the cavity grooves are correspondingly arranged so that the back plates and the cavity grooves can be combined to form a plurality of cavities, and the cavity bodies and the air cylinder are communicated through the pipeline mechanism; a plurality of adsorption stand columns are arranged above the base body, center through holes are formed in the adsorption stand columns, and the center through holes are communicated with the cavities, so that wafers of different sizes are adsorbed through the adsorption stand columns communicated with the different cavities. According to the invention, the plurality of adsorption columns are arranged at the corresponding positions of the cavity, and the dense adsorption columns are arranged at the center of the base body, so that the stress of the center of the wafer is improved, and the condition of collapse caused by unbalanced stress of the center of the wafer is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a wafer adsorption device. BACKGROUND

[0002] In the wafer manufacturing process, a spin coater is used to process the wafer through multiple processes, so as to complete the photoresist coating, curing, developing, and hardening of the wafer.

[0003] The existing wafer adsorption device needs to be equipped with multiple adsorption devices for different sizes of wafers, which is high in cost. SUMMARY

[0004] Therefore, the present application aims to provide a wafer adsorption device to solve the technical problems of the prior art that the wafer adsorption device cannot be used for different sizes of wafers and is prone to collapse in the center of the wafer during the adsorption process.

[0005] The present application provides a wafer adsorption device, which comprises a device main body, an adsorption mechanism arranged on the device main body, and a pipeline mechanism arranged on the device main body and connected with the adsorption mechanism. The adsorption mechanism comprises a base and a back plate assembly arranged below the base, the base is provided with a plurality of concentric cavity grooves outward from the center of the base on the side close to the back plate assembly, the back plate assembly comprises a plurality of back plates, the back plates are arranged correspondingly with the cavity grooves to form a plurality of cavities by combining the back plates with the cavity grooves, and the pipeline mechanism connects the cavities with a gas cylinder. A plurality of adsorption columns are arranged above the base, the adsorption columns are provided with central through holes, the central through holes are connected with the cavities to adsorb wafer pieces of different sizes through the adsorption columns connected with different cavities.

[0006] The wafer adsorption device can match different sizes of wafers by setting multiple different cavities, so that the same wafer adsorption device can be compatible with multiple sizes of wafers, and the production cost is reduced; further, multiple adsorption columns are arranged at the corresponding positions of the cavities, and dense adsorption columns are arranged at the center of the base body, so that the stress at the center of the wafer is improved, and the situation that the wafer center is unevenly stressed and collapses is avoided; furthermore, multiple adsorption columns are arranged in a ring shape, and a center through hole is arranged at the center of the adsorption column, and the adsorption column provides suction through the center through hole, so that multi-point adsorption of the wafer is realized, and the stress balance and stability of the wafer adsorption are further ensured, and the technical problems that the wafer adsorption device in the prior art cannot be used for different sizes of wafers and is prone to collapse at the center of the wafer during the adsorption process are solved.

[0007] In addition, the wafer adsorption device according to the present application can have the following additional technical features: Further, one side of the base plate is provided with a plurality of air holes, the air holes are arranged one by one corresponding to the cavities, one end of the air hole is communicated with the cavity, and the other end is connected with the pipeline mechanism. The pipeline mechanism comprises a plurality of independently arranged pipeline bodies and a speed control valve connecting the pipeline bodies and the air cylinder, and the pipeline bodies are communicated with the cavities through the air holes.

[0008] Further, the device body comprises a bottom plate, a ceramic reference platform and a base connecting the bottom plate and the ceramic reference platform, and the adsorption mechanism is arranged on the ceramic reference platform. The device body further comprises a plurality of shrouds designed in sections, and the shrouds are arranged on the periphery of the bottom plate and the base and are fixedly connected with the bottom plate and the base, and a plurality of avoidance areas are arranged on the shrouds to distribute the pipeline mechanism.

[0009] Further, the wafer adsorption device further comprises a guide mechanism, the guide mechanism is arranged on the bottom plate and located inside the base, the guide mechanism comprises a moving plate, a plurality of ceramic pins arranged on the upper and lower sides of the moving plate and a plurality of guide shafts supporting the moving plate. The ceramic pins pass through the ceramic reference platform and the adsorption mechanism in sequence to limit the adsorption mechanism.

[0010] Further, the bottom of the ceramic reference platform is provided with a groove, the depth of the groove is not less than the thickness of the moving plate, the bottom of the groove is provided with a first positioning hole, the cavity groove comprises a first cavity groove, a second cavity groove and a third cavity groove arranged in sequence from inside to outside, the bottom of the first cavity groove is provided with a second positioning hole, and the second positioning hole is arranged corresponding to the first positioning hole, and the ceramic pins pass through the first positioning hole and the second positioning hole in sequence.

[0011] Further, the cavity groove comprises a recessed area and an air passage arranged at the bottom of the recessed area, the air passage is communicated with the pipeline mechanism, the back plate is matched with the recessed area to make the outer surface of the back plate and the base body flat after assembly; A plurality of support columns are arranged in the air passage of the first cavity groove, the height of the support column is equal to the depth of the cavity groove, the second guide hole is arranged in the support column, and the back plate is arranged outside the support column and is in sealed connection with the support column.

[0012] Further, a plurality of support blocks are further arranged at the bottom of the first cavity groove, the plurality of support blocks are arranged in an annular array, the thickness of the support block is equal to the thickness of the recessed area, so that the support block can support the back plate when the back plate is assembled with the first cavity groove, and a suction stand column is arranged at the center of the annular array of the plurality of support blocks, the distance between adjacent two support blocks forms a collecting channel, and the plurality of collecting channels converge to the suction stand column at the center of the annular array to provide the suction force required by the suction stand column to adsorb the wafer.

[0013] Further, the third cavity groove comprises a first sub-groove, a plurality of third sub-grooves arranged in an annular array, and a plurality of second sub-grooves communicating the first sub-groove and the third sub-groove, one suction stand column is arranged at each end of the third sub-groove, the lengths of the first sub-groove, the third sub-groove and the second sub-groove decrease in turn, and the length of the second sub-groove is much smaller than the length of the third sub-groove to improve the adsorption effect of the third sub-groove corresponding cavity on the wafer.

[0014] Further, the contact end face of the suction stand column and the wafer is chamfered. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a product schematic diagram of the wafer adsorption device in the embodiment of the present application; Figure 2 It is an exploded view of the structure of the wafer adsorption device in the embodiment of the present application; Figure 3 It is a schematic diagram of the three-dimensional shape of the adsorption mechanism in the embodiment of the present application; Figure 4 It is a bottom view of the adsorption mechanism in the embodiment of the present application; Figure 5 It is a schematic diagram of the structure of the back plate assembly in the embodiment of the present application; Figure 6 It is a schematic diagram of the structure of the adsorption mechanism after longitudinal cutting in the embodiment of the present application; Figure 7 It is a schematic diagram of the structure of the ceramic reference platform in the embodiment of the present application; Figure 8 It is a schematic diagram of the combination of the base, the guide mechanism and the bottom plate in the embodiment of the present application; Figure 9 Fig. 1 is a schematic view of the structure of a device body in an embodiment of the present application; Figure 10 Fig. 2 is a schematic view of the structure of a guide mechanism in an embodiment of the present application; Figure 11 Fig. 3 is a schematic view of the longitudinal section of an adsorption mechanism in an embodiment of the present application; Figure 12 Fig. 4 is a schematic view of the structure of a device body in an embodiment of the present application; Figure 11 Fig. 5 is a partial enlarged view of region A in Fig. 4.

[0016] Main structure symbol explanation:

[0017] The following detailed description will further describe the present application in conjunction with the above-mentioned figures. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present application is more thorough and complete.

[0019] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0021] In order to solve the technical problems that the wafer adsorption device in the prior art cannot be used for different sizes of wafers and is prone to collapse in the center of the wafer during the adsorption process, the wafer adsorption device is provided, a plurality of different cavities are arranged to match the adsorption of wafers of different sizes, so that the same wafer adsorption device can be compatible with wafers of multiple sizes, and the production cost is reduced; further, a plurality of adsorption columns are arranged at the corresponding positions of the cavities, and a plurality of adsorption columns are densely arranged at the center of the base body, so as to improve the stress of the center of the wafer and avoid the situation that the center of the wafer is unevenly stressed and collapses; furthermore, a plurality of adsorption columns are arranged in a ring shape, and a center through hole is arranged at the center of the adsorption column, and the adsorption column provides suction force through the center through hole, so as to realize multi-point adsorption of the wafer, further ensure the stress balance and stability of the wafer adsorption, and solve the technical problems that the wafer adsorption device in the prior art cannot be used for different sizes of wafers and is prone to collapse in the center of the wafer during the adsorption process.

[0022] In order to facilitate the understanding of the present application, several embodiments of the present application will be given below. However, the present application can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] Please refer to Figures 1-12 The wafer adsorption device in the embodiment of the present application comprises a device main body, an adsorption mechanism 100 arranged on the device main body, and a pipeline mechanism 600 arranged on the device main body and communicating with the adsorption mechanism 100.

[0024] The adsorption mechanism 100 comprises a base body 110 and a back plate assembly arranged below the base body 110, a plurality of concentric cavity grooves are arranged on the side of the base body 110 close to the back plate assembly and outward from the center of the base body 110, the back plate assembly comprises a plurality of back plates, the back plates are arranged correspondingly to the cavity grooves so that the back plates and the cavity grooves combine to form a plurality of cavities, and the pipeline mechanism 600 communicates the cavities with a gas cylinder; a plurality of adsorption columns 111 are arranged above the base body 110, the adsorption columns 111 are provided with a center through hole, the center through hole communicates with the cavities through a through hole 121 arranged on the base body 110, so as to adsorb wafer slices of different sizes through the adsorption columns 111 communicating with different cavities. As a specific example, the cavity grooves comprise a first cavity groove 114, a second cavity groove 115 and a third cavity groove 116 arranged in sequence from inside to outside, wherein the cross section of the first cavity groove 114 is circular, and the cross section of the second cavity groove 115 is circular ring; the back plate assembly comprises a first back plate 131, a second back plate 132 and a third back plate 133, and the first cavity groove 114, the second cavity groove 115 and the third cavity groove 116 combine with the first back plate 131, the second back plate 132 and the third back plate 133 respectively to obtain a first cavity 141, a second cavity 142 and a third cavity 143. In this embodiment, 16 adsorption columns 111 are arranged above the base body 110.

[0025] The first cavity 141 is configured to adsorb a 4-inch wafer through the corresponding adsorption column 111; the first cavity 141 and the second cavity 142 are combined and adsorb a 6-inch wafer through the corresponding adsorption column 111; the first cavity 141, the second cavity 142 and the third cavity 143 are combined and adsorb an 8-inch wafer through the corresponding adsorption column 111; different adsorption areas are formed by configuring cavities of different sizes to correspondingly adsorb wafers of different sizes, which can improve the versatility of the wafer adsorption device and enrich the applicable scenarios; on the other hand, since different sizes have specially designed adsorption areas, the wafer adsorption effect can be further guaranteed. It needs to be further explained that in order to better improve the wafer adsorption effect and avoid the center of the wafer from collapsing, the number of adsorption columns 111 connected with the first cavity 141 is much larger than the number of adsorption columns 111 connected with other cavities.

[0026] In the present embodiment, the substrate is provided with a plurality of air holes 113, which are one-to-one corresponding to the cavities, one end of the air hole 113 is connected with the cavity, and the other end is connected with the pipeline mechanism 600; the pipeline mechanism 600 includes a plurality of independently arranged pipeline bodies and a speed control valve 630 connecting the pipeline body and the air cylinder, and the pipeline body is connected with the cavity through the air hole 113. Each pipeline body can work independently according to the partition of the cavity, or can work simultaneously, but the vacuum pressure of each partition needs to be kept consistent when working simultaneously. As a specific example, the number of air holes 113 is 3 to correspond to the first cavity 141, the second cavity 142 and the third cavity 143 respectively; the number of pipeline bodies is also 3, which are connected with the air cylinder and the cavity through one air hole 113 respectively.

[0027] In the embodiment, the device body comprises a bottom plate 700, a ceramic reference platform 200, and a base 300 connecting the bottom plate 700 and the ceramic reference platform 200, and the adsorption mechanism 100 is arranged on the ceramic reference platform 200; the base 300 is provided with multiple hollows to reduce the weight of the base 300 and facilitate the installation of other structural members, such as the guide mechanism 400 and the cable tie fixing seat 310. In order to facilitate maintenance and installation, the device body further comprises multiple shrouds 500 designed in sections, which are arranged on the periphery of the bottom plate 700 and the base 300 and are fixedly connected with the bottom plate 700 and the base 300, and the shrouds 500 are provided with multiple avoidance areas to distribute the pipeline mechanism 600. As a specific example, the device body comprises three shrouds 500 designed in sections, and each shroud 500 is provided with a plurality of mounting holes to be fixedly connected with the ceramic reference platform 200 and the bottom plate 700 through the mounting holes and bolts. Further, the pipeline body comprises an air pipe (not shown in the figure), a quick connector 620 and a micro pipe connector 610 arranged on the air pipe, and the quick connector 620 and the micro pipe connector 610 are arranged to allow the air pipe to pass through the avoidance area and be arranged inside the wafer adsorption device. In addition, the base 300 is also provided with a plurality of cable tie fixing seats 310 to fix the pipeline body.

[0028] In order to facilitate the maintenance and replacement of the adsorption mechanism 100 to quickly disassemble and assemble the adsorption mechanism 100 and the device body, the wafer adsorption device further comprises a guide mechanism 400 arranged on the bottom plate 700 and located inside the base 300, the guide mechanism 400 comprises a moving plate 410, a plurality of ceramic pins 420 arranged on the upper and lower sides of the moving plate 410, and a plurality of guide shafts 430 supporting the moving plate 410; the ceramic pins 420 pass through the ceramic reference platform 200 and the adsorption mechanism 100 in sequence to limit the adsorption mechanism 100. Specifically, in the embodiment, the upper side of the moving plate 410 is provided with three ceramic pins 420, and the lower side of the moving plate 410 is provided with at least two guide shafts 430. Further, the bottom of the ceramic reference platform 200 is provided with a groove 210, the depth of the groove 210 is not less than the thickness of the moving plate 410, the bottom of the groove 210 is provided with a first positioning hole 220, the bottom of the first cavity 114 is provided with a second positioning hole 112, the second positioning hole 112 penetrates the base 110, and the second positioning hole 112 is arranged corresponding to the first positioning hole 220, and the ceramic pins 420 pass through the first positioning hole 220 and the second positioning hole 112 in sequence to match the adsorption mechanism 100 arranged on the ceramic reference platform 200.

[0029] In order to make the cavity groove and the back plate better combined, in the embodiment, the cavity groove comprises a recessed area 118 and an air channel provided at the bottom of the recessed area 118, the air channel communicates with the pipeline mechanism 600, specifically, the air channel communicates with the air hole 113 provided on the base body 110, the back plate is adapted with the recessed area 118 so that the outer surface is flat after the back plate is assembled with the base body 110; a plurality of support columns 117 are provided in the air channel of the first cavity groove 114, the height of the support column 117 is equal to the depth of the cavity groove, the second guide hole 112 is provided in the support column 117, and the back plate is sleeved outside the support column 117 and is in sealing connection with the support column 117. In order to avoid the problem that the installation strength of the back plate is insufficient and the sealing effect is poor due to the area of the first cavity groove 114 being too large, in the embodiment, a plurality of support blocks 119 are further provided at the bottom of the first cavity groove 114 to support and seal the back plate, the plurality of support blocks 119 are arranged in an annular array, the thickness of the support block 119 is equal to the thickness of the recessed area 118, so that when the back plate is assembled with the first cavity groove 114, the support block 119 can support the back plate and the outer surface after assembly is flat. The design of the support block 119 can play the role of strengthening support and sealing for the installation of the back plate on the one hand; on the other hand, an adsorption stand column 111 is provided at the annular center of the plurality of support blocks 119, and the distance between the two adjacent support blocks 119 forms a collector channel 120, the cross section of the collector channel 120 is small, and due to the influence of the size, the gas flow rate through the collector channel 120 is large, and thus under the premise of the same gas, the plurality of collector channels 120 converging to the annular center can provide greater suction force for the adsorption stand column 111 at the annular center to adsorb the wafer.

[0030] In order to improve the adsorption effect of the wafer of larger size, in the embodiment, the third cavity groove 116 is designed in shape to better fit and adsorb the wafer of larger size, specifically: the third cavity groove 116 comprises a first sub-groove 116a, a plurality of third sub-grooves 116c arranged in an annular interval, and a plurality of second sub-grooves 116b communicating the first sub-groove 116a and the third sub-groove 116c, the two ends of the third sub-groove 116c are respectively provided with an adsorption stand column 111, the lengths of the first sub-groove 116a, the third sub-groove 116c and the second sub-groove 116b decrease in turn, and the length of the second sub-groove 116b is much smaller than the length of the third sub-groove 116c to improve the adsorption effect of the third sub-groove 116c corresponding cavity on the wafer. Specifically, the third sub-groove 116c designed in sections can greatly shorten the travel of the gas, avoiding the influence of the adsorption effect due to the too large invalid area reducing the suction force. Further, in order to adapt to wafers of different sizes, only the length of the second sub-groove 116b needs to be adjusted, so that the third sub-groove 116c is extended, and the measurable size of the wafer is extended.

[0031] In the present application, the adsorption column 111 is processed by using a coffee color dense ceramic, as a specific example, the cross-sectional diameter of the adsorption column 111 is 5mm, in order to avoid the problem that the wafer is damaged due to the poor contact angle when the adsorption column 111 contacts the wafer, in the present embodiment, the contact end surface of the adsorption column 111 and the wafer is provided with a chamfer, after chamfering, the cross-sectional diameter of the contact surface of the adsorption column 111 and the wafer is 4mm; and in order to ensure the supporting effect and avoid the adsorption collapse, the diameter of the central through hole of the adsorption column 111 is much smaller than the diameter of the contact surface of the adsorption column 111 and the wafer, so as to increase the supporting area of the wafer.

[0032] In summary, the wafer adsorption device in the above-mentioned embodiment of the present application can be compatible with wafers of multiple sizes by setting multiple different cavities to match the adsorption of wafers of different sizes, thereby reducing production costs; further, multiple adsorption columns are provided at the corresponding positions of the cavities, and dense adsorption columns are provided at the center of the base body, thereby improving the stress at the center of the wafer and avoiding the situation that the wafer center collapses due to uneven stress; moreover, multiple adsorption columns are arranged in a ring shape, and a central through hole is provided at the center of the adsorption column, and the adsorption force is provided through the central through hole, thereby achieving multi-point adsorption of the wafer and further ensuring the stress balance and stability of the wafer adsorption, thereby solving the technical problems in the prior art that the wafer adsorption device cannot be used for wafers of different sizes and is prone to collapse at the center of the wafer during the adsorption process.

[0033] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0034] The above-described embodiments only express several implementation manners of the present application, the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that, for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A wafer chucking device, characterized by comprising: The device body, the adsorption mechanism arranged on the device body, and the pipeline mechanism arranged on the device body and communicated with the adsorption mechanism are comprised; The adsorption mechanism comprises a base and a back plate assembly arranged below the base, one side of the base close to the back plate assembly is provided with a plurality of concentric cavity grooves outward from the center of the base, the back plate assembly comprises a plurality of back plates, the back plates are arranged correspondingly with the cavity grooves so that the back plates and the cavity grooves combine to form a plurality of cavities, and the pipeline mechanism communicates the cavities and the air cylinder; A plurality of adsorption columns are arranged above the base, the adsorption columns are provided with central through holes, the central through holes communicate the cavities, and different sizes of wafer are adsorbed through the adsorption columns communicated with different cavities.

2. The wafer chucking apparatus according to claim 1, wherein One side of the base plate is provided with a plurality of air holes, the air holes are arranged one by one with the cavities, one end of the air holes communicates with the cavities, and the other end is connected with the pipeline mechanism; The pipeline mechanism comprises a plurality of independently arranged pipeline bodies and a speed control valve connecting the pipeline bodies and the air cylinder, and the pipeline bodies communicate the cavities through the air holes.

3. The wafer chucking apparatus according to claim 1, wherein The device body comprises a bottom plate, a ceramic reference platform, and a pedestal connecting the bottom plate and the ceramic reference platform, and the adsorption mechanism is arranged on the ceramic reference platform; The device body further comprises a plurality of shields designed in sections, the plurality of shields are arranged on the periphery of the bottom plate and the pedestal and are fixedly connected with the bottom plate and the pedestal, a plurality of avoidance areas are arranged on the shields to distribute the pipeline mechanism.

4. The wafer chucking apparatus according to claim 3, wherein The wafer adsorption device further comprises a guide mechanism arranged on the bottom plate and located inside the pedestal, the guide mechanism comprises a moving plate, a plurality of ceramic pins arranged on the upper and lower sides of the moving plate, and a plurality of guide shafts supporting the moving plate; The ceramic pins pass through the ceramic reference platform and the adsorption mechanism in sequence to limit the adsorption mechanism.

5. The wafer chucking apparatus according to claim 4, wherein The bottom of the ceramic reference platform is provided with a groove, the depth of the groove is not less than the thickness of the moving plate, the bottom of the groove is provided with a first positioning hole, the cavity groove comprises a first cavity groove, a second cavity groove, and a third cavity groove arranged in sequence from inside to outside, the bottom of the first cavity groove is provided with a second positioning hole, and the second positioning hole is arranged correspondingly with the first positioning hole, and the ceramic pins pass through the first positioning hole and the second positioning hole in sequence.

6. The wafer chucking apparatus according to claim 5, wherein The cavity groove comprises a recessed area and an air duct arranged at the bottom of the recessed area, the air duct communicates with the pipeline mechanism, and the back plate is adapted with the recessed area so that the outer surface of the back plate and the base is flat after assembly; A plurality of support columns are arranged in the air duct of the first cavity groove, the height of the support columns is equal to the depth of the cavity groove, the second positioning hole is arranged in the support columns, and the back plate is arranged outside the support columns and is sealingly connected with the support columns.

7. The wafer chucking apparatus according to claim 6, wherein The bottom of the first cavity is also provided with a plurality of support blocks, which are arranged in an annular array, the thickness of the support blocks is equal to the thickness of the recessed area, so that the support blocks can support the back plate when the back plate is assembled with the first cavity, and the annular center of the plurality of support blocks is provided with a suction column, the distance between two adjacent support blocks forms a collector, and a plurality of collectors converge to the annular center to provide the suction column in the annular center with the required suction force for adsorbing the wafer.

8. The wafer chucking apparatus according to claim 5, wherein The third cavity includes a first sub-cavity, a plurality of third sub-cavities arranged in an annular interval, and a plurality of second sub-cavities communicating the first sub-cavity and the third sub-cavities, the two ends of the third sub-cavities are respectively provided with a suction column, the lengths of the first sub-cavity, the third sub-cavities and the second sub-cavities decrease in turn, and the length of the second sub-cavity is much smaller than the length of the third sub-cavity to improve the adsorption effect of the third sub-cavity corresponding to the cavity on the wafer.

9. The wafer chucking apparatus according to claim 1, wherein The contact end face of the suction column and the wafer is provided with a chamfer.

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