Cooperative heat dissipation system, method and device for electronic equipment

Abstract

The invention provides a collaborative heat dissipation system, method and device for electronic equipment. The system comprises a heat source contact unit, a TEC refrigeration unit, a phase change energy storage unit, a heat dissipation unit, a circulating cooling unit and a control unit. Wherein the control unit is used for monitoring heat source temperature, phase change material temperature and environment temperature; when the temperature of the heat source exceeds a first preset threshold value, the TEC refrigeration unit is started to transfer heat to the phase change energy storage unit, and the circulating cooling unit is started; when the temperature of the phase change material exceeds a second preset threshold value, the heat dissipation unit is started; determining a target heat dissipation strategy according to the target operation speed and the target refrigeration power; and enabling the system to operate according to the target heat dissipation strategy. According to the invention, TEC refrigeration and phase change energy storage are effectively combined to form a thermoelectric-phase change collaborative heat dissipation mechanism, the operation of each refrigeration and heat dissipation unit is automatically adjusted according to different working conditions, and accurate heat dissipation and energy-saving operation are realized.

Description

Technical Field

[0001] This application relates to the field of intelligent heat dissipation technology for electronic devices, and more specifically, to a collaborative heat dissipation system, method, and apparatus for electronic devices. Background Technology

[0002] With the rapid development of technology, the integration and power density of electronic devices are constantly increasing, and the charging and discharging frequency and intensity of new energy batteries are also increasing. This leads to a sharp rise in the heat generated during the operation of electronic devices. Traditional heat dissipation methods, such as air cooling and liquid cooling, often fail to meet the requirements of continuous and efficient heat dissipation when facing long-term high-load operation or drastic changes in ambient temperature.

[0003] While thermoelectric cooling (TEC) technology enables active cooling by transferring heat from one end to the other through the Peltier effect, it suffers from low energy efficiency, limited cooling capacity, and significant performance degradation at high temperatures. Phase change energy storage technology utilizes the property of phase change materials to absorb or release large amounts of latent heat during solid-liquid or liquid-solid phase transitions, effectively storing and releasing heat. However, relying solely on phase change materials cannot achieve active heat dissipation regulation, and the heat dissipation capacity decreases significantly after the phase change process ends. Therefore, currently, there is no mature technology that can effectively combine TEC cooling with phase change energy storage to achieve continuous and stable heat dissipation 24 hours a day to meet the heat dissipation requirements of equipment under complex operating conditions. Summary of the Invention

[0004] This invention provides a synergistic heat dissipation system, method, and apparatus for electronic devices. By effectively combining TEC refrigeration with phase change energy storage, a thermoelectric-phase change synergistic heat dissipation mechanism is formed. The operation of each refrigeration and heat dissipation unit is automatically adjusted according to different operating conditions to achieve precise heat dissipation and energy-saving operation.

[0005] In a first aspect, the present invention provides a collaborative heat dissipation system for electronic devices, the system comprising: a heat source contact unit, a TEC cooling unit, a phase change energy storage unit, a heat dissipation unit, a circulating cooling unit, and a control unit;

[0006] The heat source contact unit is used to fit against the heat source and conduct heat from the heat source.

[0007] The TEC refrigeration unit consists of multiple TEC refrigeration chips and is located between the heat source contact unit and the phase change energy storage unit, and is used to cool and reduce the temperature of the heat source.

[0008] The phase change energy storage unit includes a storage cavity and heat dissipation fins. The storage cavity is filled with phase change material, and the heat dissipation fins are distributed on the outside of the storage cavity. The phase change energy storage unit is used to exchange heat with the TEC refrigeration unit.

[0009] The heat dissipation unit includes heat dissipation fins and a fan. The heat dissipation fins are disposed on the outside of the phase change energy storage unit, and the fan is installed on the heat dissipation fins to enhance the system's heat dissipation to the environment.

[0010] The heat source contact unit is provided with a fluid channel, and the circulating cooling unit is connected to the fluid channel in the heat source contact unit to form a circulation loop for the flow of coolant to dissipate heat from the heat source.

[0011] The control unit monitors the heat source temperature, phase change material temperature, and ambient temperature. When the heat source temperature exceeds a first preset threshold, the TEC cooling unit is activated to transfer heat to the phase change energy storage unit, and the circulating cooling unit is activated. When the phase change material temperature exceeds a second preset threshold, the heat dissipation unit is activated. The ambient temperature rise rate is determined based on the ambient temperature, and the target operating speed of the fan in the heat dissipation unit is determined based on the ambient temperature rise rate. The heat source temperature rise rate is determined based on the heat source temperature, and the target cooling power of the TEC cooling unit is determined based on the heat source temperature rise rate. A target heat dissipation strategy is determined based on the target operating speed and the target cooling power, and the system operates according to the target heat dissipation strategy.

[0012] Preferably, the surface of the heat source contact unit is micro-roughened, with a surface roughness Ra = 1-3 μm.

[0013] Preferably, the phase change energy storage unit adopts a porous metal skeleton composite phase change material structure, the porosity of the porous metal skeleton is 85% to 90%, and the surface of the porous metal skeleton is covered with a graphene coating with a coating thickness of 5-10 μm.

[0014] Preferably, the phase change material is an organic or inorganic phase change material, and the phase change temperature range is 25℃-40℃.

[0015] In a second aspect, the present invention provides a collaborative heat dissipation method for electronic devices, the method being applied to the collaborative heat dissipation system for electronic devices as described in the first aspect, the method comprising:

[0016] Monitor the temperature of the heat source, the temperature of the phase change material, and the ambient temperature;

[0017] When the temperature of the heat source exceeds the first preset threshold, the TEC cooling unit is activated to transfer heat to the phase change energy storage unit, and the circulating cooling unit is activated.

[0018] When the temperature of the phase change material exceeds the second preset threshold, the heat dissipation unit is activated;

[0019] The ambient temperature rise rate is determined based on the ambient temperature, and the target operating speed of the fan in the heat dissipation unit is determined based on the ambient temperature rise rate.

[0020] The heat source temperature rise rate is determined based on the heat source temperature, and the target cooling power of the TEC cooling unit is determined based on the heat source temperature rise rate.

[0021] A target heat dissipation strategy is determined based on the target operating speed and the target cooling power; the system is then operated according to the target heat dissipation strategy.

[0022] Preferably, it further includes:

[0023] The rate of change of heat source temperature is determined based on the heat source temperature.

[0024] The target flow rate of the coolant in the circulating cooling unit is determined based on the rate of change of the heat source temperature.

[0025] The coolant in the circulating cooling unit is made to operate at the target flow rate.

[0026] Preferably, it further includes:

[0027] When the temperature of the phase change material continuously exceeds the upper limit of the phase change range within the target time period, and the temperature exceeds 10°C, the TEC cooling unit is shut down, and the heat dissipation unit and the circulating cooling unit are run at full speed.

[0028] When the temperature of the heat source exceeds the safety threshold, the system alarm is triggered and the equipment load is reduced.

[0029] Thirdly, the present invention provides a collaborative heat dissipation device for electronic devices, comprising:

[0030] The temperature monitoring module is used to monitor the temperature of the heat source, the temperature of the phase change material, and the ambient temperature.

[0031] The TEC cooling unit and circulating cooling unit start-up module is used to start the TEC cooling unit to transfer heat to the phase change energy storage unit and start the circulating cooling unit when the heat source temperature exceeds the first preset threshold.

[0032] A heat dissipation unit activation module is used to activate the heat dissipation unit when the temperature of the phase change material exceeds a second preset threshold.

[0033] The target operating speed determination module is used to determine the ambient temperature rise rate based on the ambient temperature, and to determine the target operating speed of the fan in the heat dissipation unit based on the ambient temperature rise rate.

[0034] The target cooling power determination module is used to determine the heat source temperature rise rate based on the heat source temperature, and to determine the target cooling power of the TEC cooling unit based on the heat source temperature rise rate.

[0035] The operation module is used to determine the target heat dissipation strategy based on the target operating speed and the target cooling power; and to make the system operate according to the target heat dissipation strategy.

[0036] Fourthly, the present invention provides a readable medium including executable instructions, which, when executed by a processor of an electronic device, cause the electronic device to perform any of the methods described in the second aspect.

[0037] Fifthly, the present invention provides an electronic device including a processor and a memory storing execution instructions, wherein when the processor executes the execution instructions stored in the memory, the processor performs the method as described in any of the second aspects.

[0038] This invention provides a collaborative heat dissipation system, method, and apparatus for electronic devices. It monitors the temperature of a heat source, the temperature of a phase change material (PCM), and the ambient temperature. When the heat source temperature exceeds a first preset threshold, the TEC (Thermoelectric Cooling) unit is activated to transfer heat to the PCM energy storage unit, and a circulating cooling unit is activated. When the PCM temperature exceeds a second preset threshold, the heat dissipation unit is activated. The ambient temperature rise rate is determined based on the ambient temperature, and the target operating speed of the fan in the heat dissipation unit is determined based on the ambient temperature rise rate. The heat source temperature rise rate is determined based on the heat source temperature, and the target cooling power of the TEC unit is determined based on the heat source temperature rise rate. A target heat dissipation strategy is determined based on the target operating speed and the target cooling power, enabling the system to operate according to the target heat dissipation strategy. This invention effectively combines TEC cooling with PCM energy storage to form a thermoelectric-phase change collaborative heat dissipation mechanism, automatically adjusting the operation of each cooling and heat dissipation unit according to different operating conditions to achieve precise heat dissipation and energy-saving operation.

[0039] The further effects of the aforementioned non-conventional preferred method will be explained below in conjunction with specific embodiments. Attached Figure Description

[0040] To more clearly illustrate the embodiments of the present invention or the existing technical solutions, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the structural composition of a collaborative heat dissipation system for electronic devices according to an embodiment of the present invention;

[0042] Figure 2 This is a schematic diagram of a collaborative heat dissipation method for electronic devices provided in an embodiment of the present invention;

[0043] Figure 3A schematic diagram of another collaborative heat dissipation method for electronic devices provided in an embodiment of the present invention;

[0044] Figure 4 This is a schematic diagram of a collaborative heat dissipation device for electronic devices according to an embodiment of the present invention;

[0045] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0047] With the rapid development of technology, the integration and power density of electronic devices are constantly increasing, and the charging and discharging frequency and intensity of new energy batteries are also increasing. This leads to a sharp rise in the heat generated during the operation of electronic devices. Traditional heat dissipation methods, such as air cooling and liquid cooling, often fail to meet the requirements of continuous and efficient heat dissipation when facing long-term high-load operation or drastic changes in ambient temperature.

[0048] While thermoelectric cooling (TEC) technology enables active cooling by transferring heat from one end to the other through the Peltier effect, it suffers from low energy efficiency, limited cooling capacity, and significant performance degradation at high temperatures. Phase change energy storage technology utilizes the property of phase change materials to absorb or release large amounts of latent heat during solid-liquid or liquid-solid phase transitions, effectively storing and releasing heat. However, relying solely on phase change materials cannot achieve active heat dissipation regulation, and the heat dissipation capacity decreases significantly after the phase change is complete. Therefore, currently, there is no mature technology that can effectively combine TEC cooling with phase change energy storage to achieve continuous and stable heat dissipation 24 hours a day to meet the heat dissipation requirements of equipment under complex operating conditions.

[0049] In view of this, the present invention provides a collaborative heat dissipation system for electronic devices. See also Figure 1 The image shows a specific embodiment of a collaborative heat dissipation system for electronic devices provided by the present invention.

[0050] In this embodiment, the collaborative heat dissipation system for electronic devices includes:

[0051] The system comprises a heat source contact unit 10, a TEC cooling unit 20, a phase change energy storage unit 30, a heat dissipation unit 40, a circulating cooling unit 50, and a control unit 60 (not shown in the figure). The heat source contact unit 10 is used to contact the heat source and conduct heat. The TEC cooling unit 20, composed of multiple TEC cooling chips, is located between the heat source contact unit 10 and the phase change energy storage unit 30 and is used to cool and reduce the temperature of the heat source. The phase change energy storage unit 30 includes a storage cavity and heat dissipation fins. The storage cavity is filled with phase change material, and the heat dissipation fins are distributed on the outside of the storage cavity. The phase change energy storage unit 30 is used for heat exchange with the TEC cooling unit 20. The heat dissipation unit 40 includes heat dissipation fins 410 and a fan 420. The heat dissipation fins 410 are disposed on the outside of the phase change energy storage unit 30, and the fan 420 is mounted on the heat dissipation fins 410 to enhance the system's heat dissipation to the environment. The heat source contact unit 10... The system is equipped with a fluid channel, and the circulating cooling unit 50 is connected to the fluid channel in the heat source contact unit 10 to form a circulation loop for the flow of coolant to dissipate heat from the heat source. The control unit 60 is used to monitor the heat source temperature, the phase change material temperature, and the ambient temperature. When the heat source temperature exceeds the first preset threshold, the TEC cooling unit 20 is activated to transfer heat to the phase change energy storage unit 30, and the circulating cooling unit 50 is activated. When the phase change material temperature exceeds the second preset threshold, the heat dissipation unit 40 is activated. The ambient temperature rise rate is determined based on the ambient temperature, and the target operating speed of the fan 420 in the heat dissipation unit 40 is determined based on the ambient temperature rise rate. The heat source temperature rise rate is determined based on the heat source temperature rise rate, and the target cooling power of the TEC cooling unit 20 is determined based on the heat source temperature rise rate. The target heat dissipation strategy is determined based on the target operating speed and the target cooling power, so that the system operates according to the target heat dissipation strategy.

[0052] Specifically, the heat source contact unit 10 is used to closely adhere to the heat source that needs heat dissipation. Its main body is a flat plate made of a high thermal conductivity metal (such as copper or aluminum), and its surface is micro-roughened using methods such as sandblasting or chemical etching to achieve a surface roughness Ra = 1-3 μm, thereby increasing the contact area with the heat source and reducing contact thermal resistance. A fluid channel is provided inside the flat plate. The shape and size of the fluid channel are designed according to the flow requirements of the circulating cooling system, for the flow of coolant in the circulating cooling unit 50. The prepared heat source contact unit 10 is then tightly adhered to the heat source that needs heat dissipation using thermally conductive silicone grease or other thermally conductive materials to ensure good heat conduction.

[0053] The TEC cooling unit 20 consists of multiple TEC cooling elements. The cold side of each TEC cooling element is connected to the heat source contact unit 10, and the hot side is in contact with the phase change energy storage unit 30. Each TEC cooling element is equipped with an independent power control circuit, which can adjust the cooling power according to the instructions of the control unit 60. Specifically, the number and arrangement of the TEC cooling elements can be determined according to the size of the heat source and the heat dissipation requirements. The cold side of the TEC cooling element is connected to the heat source contact unit 10 using thermally conductive adhesive, and the hot side is in close contact with the heat dissipation fins of the phase change energy storage unit 30 to ensure good heat conduction. An independent power control circuit is connected to each TEC cooling element and then connected to the controller of the control unit 60. After installation, the TEC cooling unit 20 is debugged to test its cooling performance and stability, ensuring that it can operate normally according to the instructions of the control unit 60.

[0054] The phase change energy storage unit 30 includes a storage cavity for phase change material and heat dissipation fins. It employs a porous metal skeleton composite phase change material design, optimizing the heat conduction path and energy storage structure to achieve stepped storage of sensible and latent heat. The storage cavity is filled with phase change material, which is selected from organic or inorganic materials with a suitable phase change temperature range (e.g., 25℃-40℃), such as paraffin wax or hydrated salts. Heat dissipation fins are evenly distributed on the outer side of the phase change material storage cavity to enhance heat exchange between the phase change material and the external environment. The phase change material is heated to a liquid state and then injected into the storage cavity, ensuring uniform filling and no air bubbles. The heat dissipation fins are installed to ensure a tight connection with the phase change material storage cavity, which can be achieved through welding or bolting. The assembled phase change energy storage unit 30 is connected to the hot surface of the TEC cooling unit 20 to ensure heat conduction and structural stability between the units. To improve the thermal conductivity and thermal stability of the phase change energy storage unit 30, a porous metal skeleton is installed inside the storage cavity. The porous metal skeleton can be made of aluminum foam with a porosity of 85%–90%, and is fixed to the inner wall of the storage cavity by ultrasonic welding. Before injecting the phase change material, the porous metal skeleton is coated with graphene, with the coating thickness controlled at 5–10 μm, to further enhance the thermal conductivity.

[0055] The heat dissipation unit 40 is located on the outside of the phase change energy storage unit 30 and consists of multiple heat dissipation fins 410. By increasing the heat dissipation area, the efficiency of the system in dissipating heat to the environment is improved. A fan 420 is also installed on the heat dissipation fins 410. The control line of the fan 420 is connected to the controller of the control unit 60, and the speed of the fan 420 can be adjusted by the control unit 60.

[0056] The circulating cooling unit 50 may include a coolant pump, a coolant storage tank, and a circulation loop pipeline. The coolant pump draws coolant from the coolant storage tank and delivers it through the circulation loop pipeline to the fluid channel of the heat source contact unit 10. After absorbing heat, the coolant flows back to the coolant storage tank, forming a circulating cooling loop. The coolant can be a liquid with high specific heat capacity and low freezing point, such as a water-glycol mixture. During installation, ensure the circulation loop pipeline is well-sealed and leak-free. Add an appropriate amount of water-glycol mixture to the coolant storage tank as coolant and test-run the circulating cooling unit 50 to check the coolant flow rate and circulation effect. The control line of the coolant pump is connected to the control unit 60 to adjust and control the coolant pump's flow output.

[0057] Furthermore, to monitor the heat source temperature, phase change material temperature, and ambient temperature, temperature sensors are installed at key locations within the system, such as the heat source contact unit 10, the cold and hot surfaces of the TEC cooling unit 20, and the storage cavity of the phase change energy storage unit 30. The signal lines of the temperature sensors are connected to the control unit 60. Based on the system's operational requirements, temperature thresholds and control algorithms are preset in the control unit 60. By simulating different temperature conditions, the system is debugged to ensure that the control unit 60 can accurately monitor temperature changes and effectively regulate the TEC cooling unit 20, fan 420, and circulating cooling unit 50 according to the preset algorithm. Simultaneously, the system may also include a display panel connected to the control unit 60 to ensure a clear and accurate display of the real-time temperature and operating status of each part of the system.

[0058] After system startup, the control unit 60 automatically adjusts operating parameters such as the power of the TEC cooling unit 20, the speed of the fan 420, and the flow rate of the circulating cooling unit 50 based on the monitored temperature parameters to achieve optimized heat dissipation and energy-saving operation. During system operation, the control unit 60 monitors the temperature change of the phase change material in real time and automatically adjusts the speed of the fan 420 and the flow rate of the circulating cooling unit 50 based on a preset energy storage-release strategy to achieve efficient energy recycling of the phase change material.

[0059] It should be noted that the specific types, quantities and combinations of the heat source contact unit 10, TEC cooling unit 20, phase change energy storage unit 30, heat dissipation unit 40, circulating cooling unit 50 and control unit 60 can be adjusted according to the actual needs of the application scenario, and the embodiments of this application do not limit this.

[0060] As can be seen from the above technical solutions, the beneficial effects of this embodiment are: energy saving and consumption reduction; the intelligent control function of the synergistic heat dissipation system enables the system to automatically adjust operating parameters according to actual heat dissipation needs, avoiding energy waste and reducing system operating costs. It also exhibits strong adaptability; the system can flexibly adjust the phase change temperature range of the phase change material, the number and specifications of the TEC cooling chips, and the parameters of the circulating cooling system according to the heat dissipation needs of different heat sources and environmental conditions, possessing wide applicability and applicable to multiple fields such as electronic equipment, new energy batteries, and medical equipment.

[0061] This invention also provides an application environment method for a collaborative heat dissipation system in electronic devices. See also Figure 2 The image shows a specific embodiment of a collaborative heat dissipation method for electronic devices provided by the present invention. In this embodiment, the method is applied to... Figure 1 A collaborative heat dissipation system for electronic devices, the method comprising:

[0062] Step 101: Monitor the temperature of the heat source, the temperature of the phase change material, and the ambient temperature;

[0063] Sensors are placed at key locations within the collaborative heat dissipation system to monitor the temperatures of the heat source, phase change material (PCM), and ambient temperature. Changes in these temperatures influence the formulation of heat dissipation strategies. These key locations include the surface of the heat source contact unit, the cold / hot surfaces of the TEC cooling unit, and the interior of the storage cavity of the PCM energy storage unit. Real-time acquisition of temperature data from these three sources enables end-to-end temperature visualization, providing a data foundation for intelligent control.

[0064] Step 102: When the heat source temperature exceeds the first preset threshold, the TEC cooling unit is activated to transfer heat to the phase change energy storage unit, and the circulating cooling unit is activated.

[0065] Specifically, when the heat source temperature exceeds a first preset threshold (e.g., 60°C), the first preset threshold can be set according to the rated operating temperature of the heat source (electronic equipment). The control unit simultaneously activates the TEC cooling unit and the circulating cooling unit, transferring heat from the cold surface to the hot surface through the Peltier effect. This causes the cold surface to absorb heat and the hot surface to release heat to the phase change material of the phase change energy storage unit. The coolant pump of the circulating cooling unit is also activated because the TEC cooling unit has a low energy efficiency ratio when operating alone and needs to work in conjunction with the circulating cooling unit to improve efficiency. The simultaneous activation of both units can reduce the temperature of the heat source contact unit and prevent heat buildup in the TEC cooling unit.

[0066] Step 103: When the temperature of the phase change material exceeds the second preset threshold, the heat dissipation unit is activated;

[0067] As shown in step 102, heat from the hot surface of the TEC refrigeration unit is transferred to the phase change material (PCM) of the phase change energy storage unit. Before the PCM reaches its phase change temperature, heat is transferred through conduction and convection to raise its temperature. When the PCM reaches its phase change temperature, a phase change begins, absorbing a large amount of latent heat. This latent heat is further absorbed from the hot surface of the TEC refrigeration unit, maintaining a relatively stable temperature and ensuring the continuous and efficient operation of the TEC refrigeration unit. If the temperature of the PCM continues to rise beyond the upper limit of the phase change range after absorbing heat, it will lose its latent heat storage capacity. Therefore, when the temperature of the PCM is below its phase change point, some sensible heat needs to be dissipated through conduction and convection to prevent the material from prematurely reaching its phase change point and to extend the "energy storage preparation period."

[0068] Therefore, when the temperature of the phase change material exceeds the second preset threshold (e.g., 35℃, close to the upper limit of the phase change range of 40℃), the control unit activates the heat dissipation unit, the fan runs, and the phase change material is kept in the working range of 25-40℃ to improve the latent heat absorption efficiency.

[0069] Step 104: Determine the ambient temperature rise rate based on the ambient temperature, and determine the target operating speed of the fan in the heat dissipation unit based on the ambient temperature rise rate.

[0070] Fixed threshold control cannot adapt to sudden changes in operating conditions, therefore a dynamic determination of the target heat dissipation strategy is required. Specifically, when a phase change material is in the process of phase change (absorbing latent heat), if the ambient temperature is high, the heat dissipation efficiency will decrease, and the phase change will stop if the temperature is too high. Therefore, increasing the fan speed forces enhanced convection, thereby increasing the heat exchange rate between the phase change material and the environment, and solving the problem of lag in traditional heat dissipation response when the environment changes abruptly.

[0071] The ambient temperature rise rate is used as a benchmark for setting the target fan operating speed. A higher ambient temperature rise rate indicates a larger change in ambient temperature, increasing the system's heat dissipation demand. This necessitates increasing the fan speed to enhance air convection and accelerate heat dissipation. For example, if the ambient temperature rise rate is ≥0.5℃ / min, the target fan operating speed should be increased by 30%. When the ambient temperature rise rate is low or zero, the fan can operate at a lower speed, saving power.

[0072] Step 105: Determine the heat source temperature rise rate based on the heat source temperature, and determine the target cooling power of the TEC cooling unit based on the heat source temperature rise rate.

[0073] The heat source temperature rise rate is used as a benchmark for determining the target cooling power of the TEC cooling unit. When the heat source experiences a sudden high temperature, the TEC cooling unit continues to operate at its original fixed threshold starting power, resulting in insufficient cooling capacity and affecting the normal operation of electronic equipment. Therefore, it is necessary to increase the cooling power of the TEC cooling unit to enhance the Peltier effect and improve the heat absorption capacity of the cold surface. For example, when the heat source temperature rise rate is ≥3℃ / s, the target cooling power can be increased to 120%. When the heat source temperature rise rate is ≤1℃ / s, the target cooling power can be reduced to 80%.

[0074] Step 106: Determine the target heat dissipation strategy based on the target operating speed and target cooling power; make the system operate according to the target heat dissipation strategy.

[0075] Step 104 converts the ambient temperature rise rate into fan speed requirements, addressing the issue of delayed response to sudden environmental changes. Step 105 converts the heat source temperature rise rate into the cooling power requirements of the TEC cooling unit, resolving the problem of insufficient cooling during sudden high temperatures. By determining the target heat dissipation strategy based on the target operating speed and target cooling power, multiple parameters work together to minimize the system's total thermal resistance. Operating according to the target heat dissipation strategy improves heat dissipation efficiency.

[0076] In some cases, risk control of the system is necessary to improve the latent heat utilization rate of phase change materials and the reliability of electronic equipment. Specifically, when the phase change material temperature continuously exceeds the upper limit of the phase change range by more than 10°C within a target duration, the TEC cooling unit is shut down, and the heat dissipation unit and circulating cooling unit operate at full speed. When the heat source temperature exceeds the safety threshold, a system alarm is triggered, and the equipment load is reduced. For example, if the phase change material temperature > the upper limit of the phase change range + 10°C (e.g., default upper limit 40°C → trigger point 50°C), and the target duration is ≥5 minutes of continuous exceedance of the threshold, the phase change material is no longer effective. Failure to shut down the TEC cooling unit may lead to overheating and damage. Therefore, the heat dissipation unit and circulating cooling unit operate at full speed to implement primary cooling. Forced convection increases heat dissipation power, and the full-speed flow of coolant improves the heat exchange efficiency of the heat source contact unit. If the above steps are ineffective, causing the heat source temperature to exceed the safety threshold, a system alarm is triggered, and the equipment load is reduced. This reduces the probability of equipment damage due to overheating and extends its service life.

[0077] As can be seen from the above technical solutions, the beneficial effects of this embodiment are as follows: It organically combines TEC refrigeration technology with phase change energy storage technology to form a thermoelectric-phase change synergistic heat dissipation mechanism, fully leveraging the advantages of both technologies and compensating for the shortcomings of a single technology in heat dissipation performance. Employing multi-sensor monitoring and intelligent algorithms, it can perceive temperature changes in various parts of the system in real time and automatically adjust the cooling power of the TEC refrigeration unit, fan speed, and flow rate of the circulating cooling unit according to different operating conditions, achieving precise heat dissipation and energy-saving operation. The rational layout and connection between the system units, as well as the system's real-time monitoring and fault early warning functions, improve the system's reliability and stability, reduce the probability of equipment damage due to overheating, and extend the equipment's service life.

[0078] Figure 2 The embodiments shown are merely basic examples of the method of the present invention. Other preferred embodiments of the method can be obtained by making certain optimizations and extensions based on them.

[0079] like Figure 3 The image shows another specific embodiment of a collaborative heat dissipation method for electronic devices according to the present invention. This embodiment further describes the method based on the foregoing embodiments, and includes the following steps:

[0080] Step 201: Determine the rate of change of the heat source temperature based on the heat source temperature;

[0081] This embodiment focuses on the dynamic control of coolant flow rate in the circulating cooling unit, using the rate of change of heat source temperature as a reference standard. Rate of change of heat source temperature = ΔT / Δt = (Tt2 - Tt1) / (t2 - t1) (unit: °C / s)

[0082] Where Tt1: the temperature of the heat source at time t1 (obtained by the temperature sensor at the heat source contact unit);

[0083] Tt2: The temperature of the heat source at time point t2;

[0084] Δt: Sampling time interval (set by the control unit).

[0085] Step 202: Determine the target flow rate of the coolant in the circulating cooling unit based on the rate of change of the heat source temperature;

[0086] When the heat source temperature change rate is large, it means the TEC refrigeration unit struggles to maintain its rated power, and the phase change energy storage unit exchanges more heat. To reduce the heat dissipation pressure on these two units, the target flow rate of the coolant in the circulating cooling unit needs to be controlled. For example, when the heat source temperature change rate is ≥3℃ / s, the target coolant flow rate is increased to 120% of the rated value; when it is ≤1℃ / s, it is reduced to 80%. Multi-dimensional control of heat exchange is achieved by changing the target flow rate.

[0087] Step 203: Make the coolant in the circulating cooling unit run at the target flow rate.

[0088] Because the target flow rate is determined based on the rate of change of the heat source temperature, the coolant operates according to the target flow rate. When the heat source suddenly becomes hot, it can reduce the response delay of traditional liquid cooling, reduce the temperature fluctuation of the heat source contact unit, and ensure the continuous and efficient operation of the TEC refrigeration unit.

[0089] As can be seen from the above technical solutions, the beneficial effects of this embodiment are: the circulating cooling unit operates continuously throughout the process, the coolant absorbs heat in the fluid channel of the heat source contact unit, reduces the temperature of the heat source contact unit, further assists the heat dissipation work of the TEC cooling unit and the phase change energy storage unit, makes up for the shortcomings of single technology in heat dissipation performance, and ensures that the system can achieve continuous and stable heat dissipation for 24 hours.

[0090] like Figure 4 The image shows a specific embodiment of a collaborative heat dissipation device for electronic devices according to the present invention. This embodiment of the device is used to perform... Figure 2-3 The physical apparatus of the method. Its technical solution is essentially the same as the above embodiments, and the corresponding descriptions in the above embodiments also apply to this embodiment. The apparatus in this embodiment includes:

[0091] Temperature monitoring module 301 is configured to monitor heat source temperature, phase change material temperature and ambient temperature;

[0092] The TEC cooling unit and circulating cooling unit start-up module 302 is configured to start the TEC cooling unit to transfer heat to the phase change energy storage unit and start the circulating cooling unit when the heat source temperature exceeds a first preset threshold.

[0093] The heat dissipation unit activation module 303 is configured to activate the heat dissipation unit when the temperature of the phase change material exceeds a second preset threshold.

[0094] The target operating speed determination module 304 is configured to determine the ambient temperature rise rate based on the ambient temperature and determine the target operating speed of the fan in the heat dissipation unit based on the ambient temperature rise rate.

[0095] The target cooling power determination module 305 is configured to determine the heat source temperature rise rate based on the heat source temperature, and determine the target cooling power of the TEC cooling unit based on the heat source temperature rise rate.

[0096] The operating module 306 is configured to determine the target heat dissipation strategy based on the target operating speed and the target cooling power, and to make the system operate according to the target heat dissipation strategy.

[0097] Figure 5This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. At the hardware level, the electronic device includes a processor, and optionally also includes an internal bus, a network interface, and a memory. The memory may include main memory, such as high-speed random-access memory (RAM), or it may also include non-volatile memory, such as at least one disk storage device. Of course, the electronic device may also include other hardware required for other services.

[0098] The processor, network interface, and memory can be interconnected via an internal bus, which can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, or an EISA (Extended Industry Standard Architecture) bus, etc. Buses can be categorized as address buses, data buses, and other types. For ease of representation, Figure 5 The symbol is represented by a single double-headed arrow, but this does not mean that there is only one bus or one type of bus.

[0099] Memory is used to store instructions for execution. Specifically, instructions for execution are computer programs that can be executed. Memory can include main memory and non-volatile memory, and it provides the processor with execution instructions and data.

[0100] In one possible implementation, the processor reads the corresponding execution instructions from non-volatile memory into main memory and then executes them. Alternatively, it may obtain the corresponding execution instructions from other devices to logically form a collaborative heat dissipation device for electronic devices. The processor executes the execution instructions stored in the memory to implement a collaborative heat dissipation method for electronic devices provided in any embodiment of the present invention.

[0101] The above is as described in the present invention. Figure 4The method for a collaborative heat dissipation device for an electronic device provided in the illustrated embodiment can be applied to a processor or implemented by a processor. The processor may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by integrated logic circuits in the processor's hardware or by instructions in software form. The processor can be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it can also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this invention. The general-purpose processor can be a microprocessor or any conventional processor.

[0102] The steps of the method disclosed in the embodiments of this invention can be directly manifested as being executed by a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software modules can reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. This storage medium is located in memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above method.

[0103] This invention also proposes a readable medium storing execution instructions. When these instructions are executed by a processor of an electronic device, the electronic device can perform a collaborative heat dissipation method for electronic devices provided in any embodiment of this invention, specifically for performing tasks such as... Figure 2 , Figure 3 The method shown.

[0104] The electronic devices in the foregoing embodiments may be computers.

[0105] Those skilled in the art will understand that embodiments of the present invention can be provided as methods or computer program products. Therefore, the present invention can be implemented in a completely hardware embodiment, a completely software embodiment, or a combination of software and hardware.

[0106] The various embodiments in this invention are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the apparatus embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0107] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0108] The above are merely embodiments of the present invention and are not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A cooperative heat dissipation system for an electronic device, comprising: The system comprises a heat source contact unit, a TEC refrigeration unit, a phase change energy storage unit, a heat dissipation unit, a circulating cooling unit and a control unit. The heat source contact unit is used to adhere to the heat source and conduct the heat of the heat source. The TEC refrigeration unit is composed of multiple TEC refrigeration pieces and is located between the heat source contact unit and the phase change energy storage unit, and is used to refrigerate and reduce the temperature of the heat source. The phase change energy storage unit comprises a storage cavity and heat dissipation fins, the storage cavity is filled with phase change material, and the heat dissipation fins are distributed on the outside of the storage cavity, and the phase change energy storage unit is used for heat exchange with the TEC refrigeration unit. The heat dissipation unit comprises heat dissipation fins and a fan, the heat dissipation fins are arranged on the outside of the phase change energy storage unit, and the fan is installed on the heat dissipation fins and is used to enhance the heat dissipation of the system to the environment. The heat source contact unit is provided with a fluid channel, the circulating cooling unit is connected with the fluid channel in the heat source contact unit to form a circulating loop, and is used to flow through the cooling liquid to dissipate heat for the heat source. The control unit is used to monitor the temperature of the heat source, the temperature of the phase change material and the temperature of the environment; when the temperature of the heat source exceeds a first preset threshold, the TEC refrigeration unit is started to transfer heat to the phase change energy storage unit, and the circulating cooling unit is started; when the temperature of the phase change material exceeds a second preset threshold, the heat dissipation unit is started; the environmental temperature rise rate is determined according to the temperature of the environment, and the target operating speed of the fan in the heat dissipation unit is determined according to the environmental temperature rise rate; the heat source temperature rise rate is determined according to the temperature of the heat source, and the target refrigeration power of the TEC refrigeration unit is determined according to the heat source temperature rise rate; the target heat dissipation strategy is determined according to the target operating speed and the target refrigeration power; and the system is operated according to the target heat dissipation strategy.

2. The system of claim 1, wherein, The surface of the heat source contact unit is subjected to micro-roughening treatment, and the surface roughness Ra is 1-3 μm.

3. The system of claim 1, wherein, The phase change energy storage unit adopts a porous metal framework composite phase change material structure, the porosity of the porous metal framework is 85%-90%, and the surface of the porous metal framework is covered with a graphene coating with a thickness of 5-10 μm.

4. The system of claim 1, wherein, The phase change material is an organic or inorganic phase change material, and the phase change temperature range is 25-40℃.

5. A method for cooperative heat dissipation of an electronic device, the method comprising: The method is applied to the cooperative heat dissipation system for electronic equipment as claimed in claim 1, and the method comprises: monitoring the temperature of the heat source, the temperature of the phase change material and the temperature of the environment; when the temperature of the heat source exceeds a first preset threshold, starting the TEC refrigeration unit to transfer heat to the phase change energy storage unit and starting the circulating cooling unit; when the temperature of the phase change material exceeds a second preset threshold, starting the heat dissipation unit; determining the environmental temperature rise rate according to the temperature of the environment and determining the target operating speed of the fan in the heat dissipation unit according to the environmental temperature rise rate; determining the heat source temperature rise rate according to the temperature of the heat source and determining the target refrigeration power of the TEC refrigeration unit according to the heat source temperature rise rate; determining the target heat dissipation strategy according to the target operating speed and the target refrigeration power; and operating the system according to the target heat dissipation strategy.

6. The method of claim 5, wherein, It also comprises: determining the heat source temperature change rate according to the temperature of the heat source; determining a target flow rate of the cooling liquid in the circulating cooling unit according to the heat source temperature change rate; operating the cooling liquid in the circulating cooling unit at the target flow rate.

7. The method according to any of claims 5 or 6, characterized in that, Further comprising: when the phase change material temperature continuously exceeds the upper limit of the phase change interval for a target time length, and the temperature exceeds 10℃, turning off the TEC refrigeration unit, and operating the heat dissipation unit and the circulating cooling unit at full speed; when the heat source temperature exceeds a safety threshold, triggering a system alarm and reducing the device load.

8. A collaborative heat dissipation device for electronic devices, characterized in that, comprising: a temperature monitoring module for monitoring the heat source temperature, the phase change material temperature, and the ambient temperature; a TEC refrigeration unit and circulating cooling unit starting module for starting the TEC refrigeration unit to transfer heat to the phase change energy storage unit and starting the circulating cooling unit when the heat source temperature exceeds a first preset threshold; a heat dissipation unit starting module for starting the heat dissipation unit when the phase change material temperature exceeds a second preset threshold; a target operating speed determination module for determining an ambient temperature rise rate according to the ambient temperature, and determining a target operating speed of a fan in the heat dissipation unit according to the ambient temperature rise rate; a target refrigeration power determination module for determining a heat source temperature rise rate according to the heat source temperature, and determining a target refrigeration power of the TEC refrigeration unit according to the heat source temperature rise rate; an operating module for determining a target heat dissipation strategy according to the target operating speed and the target refrigeration power; operating the system according to the target heat dissipation strategy.

9. A computer readable storage medium, characterized in that, The computer-readable storage medium comprises a stored program, wherein the program, when executed, performs the method of any one of claims 5 to 7.

10. An electronic device, comprising: The electronic device comprises: a processor; a memory for storing executable instructions of the processor; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method of any one of claims 5 to 7.

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