A control method and system for a slicing apparatus

Abstract

The application discloses a kind of control method and system of slicing equipment.Method includes: the Young's modulus of sample is detected by ultrasonic detection unit;Visual area identification unit detects the area to be cut of sample;According to the Young's modulus of sample and the area to be cut, the cutting force of slicer, cutting speed, slicing thickness are determined;According to the cutting force, cutting speed, slicing thickness determined, control slicer work;Image recognition is carried out to slice, whether the quality of slice meets preset condition is judged, and qualified slice is marked.

Description

Technical Field

[0001] This invention relates to the field of automatic control technology, and specifically to a control method and system for a slicing device. Background Technology

[0002] Existing slide preparation equipment, such as those used for pathological tissue sample slides, typically requires manual parameter adjustments. Differences in sample hardness and size can lead to unstable slide quality, such as uneven slide thickness or sample damage. This necessitates repeated manual parameter adjustments, resulting in low slide quality and efficiency. Furthermore, single-parameter control modes cannot adapt to the varying physical properties of different samples and lack dynamic compensation mechanisms, making samples prone to fragmentation or cracking. Therefore, how to improve slide quality and efficiency through adaptive control has become a pressing issue in this field. Summary of the Invention

[0003] This invention provides a control method for a slicing device, the method comprising the following steps:

[0004] S1. The ultrasonic testing unit detects the Young's modulus of the sample, including:

[0005] The ultrasonic surface wave frequency of the ultrasonic testing unit is 8.12MHz±5%. The Young's modulus E of the sample is obtained by wave velocity inversion.

[0006]

[0007]

[0008] in, The density of the sample, Poisson's ratio, The propagation speed of ultrasonic surface waves in the sample, detected by the ultrasonic testing unit;

[0009] S2. The visual area recognition unit detects the area of ​​the sample to be cut, including:

[0010] S21. Pixel area calibration: Using the camera module to capture the length of a single square. The checkerboard calibration board is used to obtain the physical size of each pixel as follows:

[0011]

[0012] in, , For the physical length and width of a pixel, This represents the number of pixels in a single square.

[0013] S22. Obtain the sample area, activate the ring illumination module to illuminate the sample, the camera module captures the sample image, obtains the projection of the sample onto the camera module's imaging plane, identifies the sample outline, and segments the sample; the processing module calculates the sample area as the area to be cut, A.

[0014]

[0015] in,{( )} represents the set of pixel points of the sample contour. ) represents the pixel coordinates of the i-th contour point, and n represents the total number of sample contour points. () represents the point following the last contour point of a closed polygon, i.e., the first contour point. , The physical length and width of a pixel;

[0016] S3. Determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut, including calculations:

[0017]

[0018] Where F is the cutting force, E is Young's modulus, and A is the area to be cut. This is the tool coefficient. Let y be the fracture toughness characterization value of the sample material. These are constants for the sample material;

[0019]

[0020] in, Where E is the cutting speed, and E is Young's modulus. This is a correction factor for the ductility of the sample material. For strain rate, The strain rate sensitivity coefficient;

[0021]

[0022] in, Where is the slice thickness, F is the cutting force, and E is Young's modulus. For yield strength, This refers to the system accuracy coefficient;

[0023] S4. Based on the determined cutting force, cutting speed, and slice thickness, control the slicer's operation, including using a force sensor to detect the force on the blade in the cutting direction in real time during the cutting process, and using a PID control method to control the precession displacement of the pressure actuator on the blade with the determined cutting force as the control target, thereby controlling the force applied to the blade in the cutting direction; controlling the feed speed of the blade in the cutting direction with the determined cutting speed; and controlling the sample precession distance with the determined slice thickness.

[0024] S5. Perform image recognition on the slices, determine whether the quality of the slices meets the preset conditions, and mark the slices.

[0025] Furthermore, the calculation of the tool's precession displacement in step S4 includes:

[0026]

[0027] in, For actuator displacement, For controller coefficients, For a given cutting force, For real-time feedback values ​​from the force sensor, To accumulate control time, The voltage ceramic stiffness coefficient of the force sensor.

[0028] Furthermore, the preset conditions in step S5 include the integrity rate of the slice and the requirement that the slice cracks meet the requirements, specifically including:

[0029]

[0030] in, The integrity rate of the slice. Let A be the area of ​​the defect-free region and A be the total area of ​​the slice. The completeness threshold;

[0031]

[0032] in, The crack index of the slice. Let A be the total length of the crack and A be the total area of ​​the slice. This represents the crack threshold.

[0033] The present invention also relates to a control system for a slicing apparatus using the method described above, the system comprising a slicer, an ultrasonic detection unit, a visual area recognition unit, a determination unit, a control unit, and an identification unit;

[0034] The ultrasonic testing unit is used to detect the Young's modulus of the sample;

[0035] The visual area recognition unit is used to detect the area of ​​the sample to be cut.

[0036] The determining unit is used to determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut.

[0037] The control unit is used to control the operation of the slicer according to the determined cutting force, cutting speed, and slice thickness. This includes using a force sensor to detect the force on the blade in the cutting direction in real time during the cutting process, and using a PID control method to control the precession displacement of the pressure actuator on the blade with the determined cutting force as the control target, thereby controlling the force applied to the blade in the cutting direction; controlling the feed speed of the blade in the cutting direction with the determined cutting speed; and controlling the sample precession distance with the determined slice thickness.

[0038] The identification unit is used to perform image recognition on the slice, determine whether the quality of the slice meets the preset conditions, and identify the slice.

[0039] Furthermore, the ultrasonic surface wave frequency of the ultrasonic testing unit is 8.12MHz±5%, and the Young's modulus E of the sample is obtained through wave velocity inversion.

[0040]

[0041]

[0042] in, The density of the sample, Poisson's ratio, The propagation speed of ultrasonic surface waves in the sample, as detected by the ultrasonic testing unit;

[0043] The visual area recognition unit includes a camera module, a ring illumination module, and a processing module;

[0044] The camera module captures a single square with a length of [missing information]. The checkerboard calibration board is used to obtain the physical size of each pixel as follows:

[0045]

[0046] in, , For the physical length and width of a pixel, This represents the number of pixels in a single square.

[0047] The ring illumination module illuminates the sample, the camera module captures images of the sample, and the processing module acquires the projection image of the sample onto the camera module's imaging plane, identifies the sample outline, segments the sample, and calculates the sample area as the area to be cut, A, using the processing module.

[0048]

[0049] in,{( )} represents the set of pixel points of the sample contour. ) represents the pixel coordinates of the i-th contour point, and n represents the total number of sample contour points. () represents the point following the last contour point of a closed polygon, i.e., the first contour point. , Let A be the physical length and width of a pixel, and let A be the area to be cut.

[0050] The determining unit is used to determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut.

[0051]

[0052] Where F is the cutting force, E is Young's modulus, and A is the area to be cut. This is the tool coefficient. Let y be the fracture toughness characterization value of the sample material. These are constants for the sample material;

[0053]

[0054] in, Where E is the cutting speed, and E is Young's modulus. This is a correction factor for the ductility of the sample material. For strain rate, The strain rate sensitivity coefficient;

[0055]

[0056] in, Where is the slice thickness, F is the cutting force, and E is Young's modulus. For yield strength, This refers to the system accuracy coefficient;

[0057] Controlling the precession displacement of the tool by the pressure actuator includes,

[0058]

[0059] in, For actuator displacement, For controller coefficients, For a given cutting force, For real-time feedback values ​​from the force sensor, To accumulate control time, The voltage ceramic stiffness coefficient of the force sensor;

[0060] The preset conditions include that the integrity rate of the slices and the number of cracks in the slices meet the requirements, specifically including:

[0061]

[0062] in, The integrity rate of the slice. Let A be the area of ​​the defect-free region and A be the total area of ​​the slice. The completeness threshold;

[0063]

[0064] in, The crack index of the slice. Let A be the total length of the crack and A be the total area of ​​the slice. This represents the crack threshold.

[0065] The present invention also relates to a computer program product, the computer program product comprising a computer program executed by a processor for performing the above-described control method for a slicing device.

[0066] The present invention also relates to a computer-readable storage medium for storing a computer program, which is executed by a processor for performing the above-described control method for a slicing device.

[0067] The technical solution of this invention uses ultrasonic non-destructive testing of the elastic modulus of samples and adopts a multi-parameter control mode to adapt to the differences in physical properties of different samples, achieving dynamic compensation and improving the quality and efficiency of slicing. Attached Figure Description

[0068] Figure 1 This is a flowchart of a control method for a slicing device according to the present invention. Detailed Implementation

[0069] The present invention will now be further described with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and should not be construed as limiting the scope of protection of the present invention. It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of the present invention.

[0070] Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0071] Embodiment 1 of the present invention relates to a control method for a slicing device, as shown in the attached figure. Figure 1 As shown, the method includes the following steps:

[0072] S1. The ultrasonic testing unit detects the Young's modulus of the sample.

[0073] For fragile samples such as pathological slides, contact hardness testing methods can easily lead to sample deformation and breakage, affecting the slicing results and even making subsequent slicing impossible. Therefore, this invention uses a non-destructive ultrasonic testing method. The ultrasonic surface wave frequency of the ultrasonic testing unit is 8.12MHz±5%, and the Young's modulus E of the sample is obtained through wave velocity inversion.

[0074]

[0075]

[0076] in, The density of the sample, Poisson's ratio, This refers to the propagation speed of ultrasonic surface waves in the sample, as detected by the ultrasonic testing unit.

[0077] S2. The visual area recognition unit detects the area of ​​the sample to be cut.

[0078] Because the samples are fragile, a non-destructive visual recognition area detection method was chosen to detect the area to be cut.

[0079] The visual area recognition unit includes a camera module, a ring illumination module, and a processing module. The specific area detection process is as follows:

[0080] S21. Pixel area calibration, specifically including using the camera module to capture images of a single square with a length of... The checkerboard calibration board is used to obtain the physical size of each pixel as follows:

[0081]

[0082] in, , For the physical length and width of a pixel, This represents the number of pixels in a single square.

[0083] S22. Obtaining the sample area specifically includes: activating the ring illumination module to illuminate the sample; the camera module capturing the sample image; obtaining the projection image of the sample on the imaging plane of the camera module; identifying the sample contour; segmenting the sample; and calculating the sample area as the area to be cut using the processing module. Specifically, this includes...

[0084]

[0085] in,{( )} represents the set of pixel points of the sample contour. ) represents the pixel coordinates of the i-th contour point, and n represents the total number of sample contour points. () represents the point following the last contour point of a closed polygon, i.e., the first contour point. , denoted as the physical length and width of a pixel, and A as the area to be cut.

[0086] S3. Determine the cutting force, cutting speed, and slice thickness of the slicing machine based on the Young's modulus of the sample and the area to be cut. Specifically, this includes...

[0087]

[0088] Where F is the cutting force, E is Young's modulus, and A is the area to be cut. This is the tool coefficient. Let y be the fracture toughness characterization value of the sample material. is a constant of the sample material.

[0089]

[0090] in, Where E is the cutting speed, and E is Young's modulus. This is a correction factor for the ductility of the sample material. For strain rate, is the strain rate sensitivity coefficient.

[0091]

[0092] in, Where is the slice thickness, F is the cutting force, and E is Young's modulus. For yield strength, This represents the system accuracy coefficient.

[0093] S4. Control the slicer's operation based on the determined cutting force, cutting speed, and slice thickness. Specifically, this includes using a force sensor to detect the force on the blade in the cutting direction in real time during the cutting process, and using a PID controller to control the precession displacement of the pressure actuator on the blade with the determined cutting force as the control target, thereby controlling the force applied to the blade in the cutting direction; controlling the feed speed of the blade in the cutting direction with the determined cutting speed; and controlling the sample's precession distance with the determined slice thickness.

[0094] The PID method specifically includes,

[0095]

[0096] in, For actuator displacement, For controller coefficients, For a given cutting force, For real-time feedback values ​​from the force sensor, To accumulate control time, The voltage ceramic stiffness coefficient of the force sensor.

[0097] S5. Perform image recognition on the slices to determine whether the quality of the slices meets the preset conditions, and mark qualified slices.

[0098] The preset conditions include that the integrity rate of the slices and the number of cracks in the slices meet the requirements, specifically including:

[0099]

[0100] in, The integrity rate of the slice. Let A be the area of ​​the defect-free region and A be the total area of ​​the slice. This is the integrity rate threshold.

[0101]

[0102] in, The crack index of the slice. Let A be the total length of the crack and A be the total area of ​​the slice. This represents the crack threshold.

[0103] Embodiment 2 of the present invention relates to a control system for a slicing device, the system comprising a slicer, an ultrasonic detection unit, a visual area recognition unit, a determination unit, a control unit, and an identification unit.

[0104] The ultrasonic testing unit is used to detect the Young's modulus of the sample. The ultrasonic surface wave frequency of the ultrasonic testing unit is 8.12MHz ± 5%, and the Young's modulus E of the sample is obtained through wave velocity inversion.

[0105]

[0106]

[0107] in, The density of the sample, Poisson's ratio, This refers to the propagation speed of ultrasonic surface waves in the sample, as detected by the ultrasonic testing unit.

[0108] The visual area recognition unit is used to detect the area of ​​the sample to be cut.

[0109] Specifically, the visual area recognition unit includes a camera module, a ring illumination module, and a processing module.

[0110] The camera module captures a single square with a length of [missing information]. The checkerboard calibration board is used to obtain the physical size of each pixel as follows:

[0111]

[0112] in, , For the physical length and width of a pixel, This represents the number of pixels in a single square.

[0113] The ring illumination module illuminates the sample, the camera module captures images of the sample, and the processing module acquires the projection of the sample onto the camera module's imaging plane, identifies the sample outline, segments the sample, and calculates the sample area as the area to be cut using the processing module. Specifically, this includes...

[0114]

[0115] in,{( )} represents the set of pixel points of the sample contour. ) represents the pixel coordinates of the i-th contour point, and n represents the total number of sample contour points. () represents the point following the last contour point of a closed polygon, i.e., the first contour point. , denoted as the physical length and width of a pixel, and A as the area to be cut.

[0116] The determining unit is used to determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut. Specifically, it includes...

[0117]

[0118] Where F is the cutting force, E is Young's modulus, and A is the area to be cut. This is the tool coefficient. Let y be the fracture toughness characterization value of the sample material. is a constant of the sample material.

[0119]

[0120] in, Where E is the cutting speed, and E is Young's modulus. This is a correction factor for the ductility of the sample material. For strain rate, is the strain rate sensitivity coefficient.

[0121]

[0122] in, Where is the slice thickness, F is the cutting force, and E is Young's modulus. For yield strength, This represents the system accuracy coefficient.

[0123] The control unit is used to control the slicer's operation based on determined cutting force, cutting speed, and slice thickness. Specifically, it includes using a force sensor to detect the force on the blade in the cutting direction in real time during the cutting process, and using a PID control method to control the precession displacement of the pressure actuator on the blade with a determined cutting force as the control target, thereby controlling the force applied to the blade in the cutting direction; controlling the feed speed of the blade in the cutting direction with a determined cutting speed; and controlling the sample precession distance with a determined slice thickness.

[0124] The PID method specifically includes,

[0125]

[0126] in, For actuator displacement, For controller coefficients, For a given cutting force, For real-time feedback values ​​from the force sensor, To accumulate control time, The voltage ceramic stiffness coefficient of the force sensor.

[0127] The identification unit is used to perform image recognition on the slices, determine whether the quality of the slices meets preset conditions, and identify qualified slices.

[0128] The preset conditions include that the integrity rate of the slices and the number of cracks in the slices meet the requirements, specifically including:

[0129]

[0130] in, The integrity rate of the slice. Let A be the area of ​​the defect-free region and A be the total area of ​​the slice. This is the integrity rate threshold.

[0131]

[0132] in, The crack index of the slice. Let A be the total length of the crack and A be the total area of ​​the slice. This represents the crack threshold.

[0133] Embodiment 3 of the present invention relates to a computer program product, the computer program product including a computer program, which is executed by a processor for performing a control method for a slicing device according to Embodiment 1.

[0134] Embodiment 4 of the present invention relates to a computer-readable storage medium for storing a computer program, which is executed by a processor to perform a control method for a slicing device according to Embodiment 1.

[0135] The above description is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A control method for a slicing device, characterized in that, The method includes the following steps: S1. The ultrasonic testing unit detects the Young's modulus of the sample, including: The ultrasonic surface wave frequency of the ultrasonic testing unit is 8.12MHz±5%. The Young's modulus E of the sample is obtained by wave velocity inversion. ； ； in, The density of the sample, Poisson's ratio, The propagation speed of ultrasonic surface waves in the sample, as detected by the ultrasonic testing unit; S2. The visual area recognition unit detects the area of ​​the sample to be cut, including: S21. Pixel area calibration: Using the camera module to capture the length of a single square. The checkerboard calibration board is used to obtain the physical size of each pixel as follows: ； in, For the physical length and width of a pixel, This represents the number of pixels in a single square. S22. Obtain the sample area, activate the ring illumination module to illuminate the sample, the camera module captures the sample image, obtains the projection of the sample onto the camera module's imaging plane, identifies the sample outline, and segments the sample; the processing module calculates the sample area as the area to be cut, A. ； in, For the sample contour pixel set, ( ) represents the pixel coordinates of the i-th contour point, and n represents the total number of sample contour points. () represents the point following the last contour point of a closed polygon, i.e., the first contour point. The physical length and width of a pixel; S3. Determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut, including calculations: ； Where F is the cutting force, E is Young's modulus, and A is the area to be cut. This is the tool coefficient. Let y be the fracture toughness characterization value of the sample material. These are constants for the sample material; ； in, Where E is the cutting speed, and E is Young's modulus. This is a correction factor for the ductility of the sample material. For strain rate, The strain rate sensitivity coefficient; ； in, Where is the slice thickness, F is the cutting force, and E is Young's modulus. For yield strength, This refers to the system accuracy coefficient; S4. Based on the determined cutting force, cutting speed, and slice thickness, control the slicer's operation, including using a force sensor to detect the force on the blade in the cutting direction in real time during the cutting process, and using a PID control method to control the precession displacement of the pressure actuator on the blade with the determined cutting force as the control target, thereby controlling the force applied to the blade in the cutting direction; controlling the feed speed of the blade in the cutting direction with the determined cutting speed; and controlling the sample precession distance with the determined slice thickness. S5. Perform image recognition on the slices to determine whether the quality of the slices meets the preset conditions, and mark qualified slices.

2. The control method for a slicing device according to claim 1, characterized in that, Step S4 involves calculating the tool's precession displacement, including: ； in, For actuator displacement, For controller coefficients, For a given cutting force, For real-time feedback values ​​from the force sensor, To accumulate control time, The voltage ceramic stiffness coefficient of the force sensor.

3. The control method for a slicing device according to claim 1, characterized in that, The preset conditions in step S5 include the integrity rate of the slice and the requirement that the slice cracks meet the requirements, specifically including: ； in, The integrity rate of the slice. Let A be the area of ​​the defect-free region and A be the total area of ​​the slice. The completeness threshold; ； in, The crack index of the slice. Let A be the total length of the crack and A be the total area of ​​the slice. This represents the crack threshold.

4. A control system for a slicing apparatus using the method described in any one of claims 1-3, characterized in that, The system includes a slicer, an ultrasonic detection unit, a visual area recognition unit, a determination unit, a control unit, and an identification unit; The ultrasonic testing unit is used to detect the Young's modulus of the sample; The visual area recognition unit is used to detect the area of ​​the sample to be cut. The determining unit is used to determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut. The control unit is used to control the operation of the slicer according to the determined cutting force, cutting speed, and slice thickness. This includes using a force sensor to detect the force on the blade in the cutting direction in real time during the cutting process, and using a PID method to control the precession displacement of the pressure actuator on the blade with the determined cutting force as the control target, thereby controlling the force applied to the blade in the cutting direction; and controlling the feed speed of the blade in the cutting direction with the determined cutting speed. The sample precession distance is controlled by a defined slice thickness; The identification unit is used to perform image recognition on the slices, determine whether the quality of the slices meets preset conditions, and identify qualified slices.

5. The control system of a slicing device according to claim 4, characterized in that, The ultrasonic surface wave frequency of the ultrasonic testing unit is 8.12MHz±5%. The Young's modulus E of the sample is obtained by wave velocity inversion. ； ； in, The density of the sample, Poisson's ratio, The propagation speed of ultrasonic surface waves in the sample, as detected by the ultrasonic testing unit; The visual area recognition unit includes a camera module, a ring illumination module, and a processing module; The camera module captures a single square with a length of [missing information]. The checkerboard calibration board is used to obtain the physical size of each pixel as follows: ； in, For the physical length and width of a pixel, This represents the number of pixels in a single square. The ring illumination module illuminates the sample, the camera module captures images of the sample, and the processing module acquires the projection image of the sample onto the camera module's imaging plane, identifies the sample outline, segments the sample, and calculates the sample area as the area to be cut, A, using the processing module. ； in, For the sample contour pixel set, ( ) represents the pixel coordinates of the i-th contour point, and n represents the total number of sample contour points. () represents the point following the last contour point of a closed polygon, i.e., the first contour point. Let A be the physical length and width of a pixel, and let A be the area to be cut. The determining unit is used to determine the cutting force, cutting speed, and slice thickness of the slicer based on the Young's modulus of the sample and the area to be cut. ； Where F is the cutting force, E is Young's modulus, and A is the area to be cut. This is the tool coefficient. Let y be the fracture toughness characterization value of the sample material. These are constants for the sample material; ； in, Where E is the cutting speed, and E is Young's modulus. This is a correction factor for the ductility of the sample material. For strain rate, The strain rate sensitivity coefficient; ； in, Where is the slice thickness, F is the cutting force, and E is Young's modulus. For yield strength, This refers to the system accuracy coefficient; Controlling the precession displacement of the tool by the pressure actuator includes, ； in, For actuator displacement, For controller coefficients, For a given cutting force, For real-time feedback values ​​from the force sensor, To accumulate control time, The voltage ceramic stiffness coefficient of the force sensor; The preset conditions include that the integrity rate of the slices and the number of cracks in the slices meet the requirements, specifically including: ； in, The integrity rate of the slice. Let A be the area of ​​the defect-free region and A be the total area of ​​the slice. The completeness threshold; ； in, The crack index of the slice. Let A be the total length of the crack and A be the total area of ​​the slice. This represents the crack threshold.

6. A computer program product, characterized in that, The computer program product includes a computer program that is executed by a processor for performing a control method for a slicing device as described in any one of claims 1-3.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium is used to store a computer program, which is executed by a processor to perform a control method for a slicing device as described in any one of claims 1-3.

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