Flow uniformizing device, measuring chamber and semiconductor measuring equipment

Abstract

The invention discloses a flow uniformizing device, which relates to the technical field of semiconductor processing, is applied to a measuring cavity and comprises a first flow guide part and a second flow guide part, and the first flow guide part is provided with a first flow guide surface for receiving airflow; the second flow guide part is connected to the lower edge area of the first flow guide face and provided with a second flow guide face, and an obtuse-angle flow guide structure is formed by the first flow guide face in the first flow guide part and the second flow guide face, connected to the lower edge area of the first flow guide face, in the second flow guide part. Meanwhile, the extension direction of the second flow guide face faces the side wall of the measuring part, the obtuse angle flow guide structure receives the vertically downward airflow output by the airflow generation device through the first flow guide face, and directional deflection of the airflow is achieved through the second flow guide face, so that the airflow smoothly transits from vertical flowing to adherence flowing along the side wall of the measuring part. Therefore, the uniformity of the flow field near the measurement part is improved, and the measurement accuracy is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more particularly to a flow equalization device, a measurement chamber, and a semiconductor measurement device. Background Technology

[0002] In the field of semiconductor wafer metrology, to ensure the testing accuracy of key parameters, the airflow control within the measurement chamber of semiconductor metrology equipment directly affects the accuracy and reliability of wafer inspection. Combined with... Figure 1 As shown, semiconductor measurement equipment typically employs an airflow generating device 01 positioned above the measurement chamber. The airflow generating device (environmental control cabinet) 01 vertically and uniformly delivers airflow downwards to generate airflow within the measurement chamber. Because a measurement detection module 02 is located between the airflow generating device 01 and the measurement component 03 (objective lens), the airflow is obstructed by the structure of the measurement detection module 02 above, making it difficult for the airflow to reach the area below the measurement component 03. This can easily lead to uneven flow patterns below the measurement component 03.

[0003] Existing technologies mainly improve the uniformity of the flow field around the objective lens by setting a flow guiding device around the measurement component 03 (objective lens). Summary of the Invention

[0004] This application discloses a flow equalization device, a measurement chamber, and a semiconductor measurement device to solve the technical problem of contaminant particles adhering to the optical surface of the objective lens due to uneven airflow distribution below the objective lens. The specific solution is as follows:

[0005] In a first aspect, this application provides a flow equalization device applied to a measurement chamber, the measurement chamber including an airflow generating device and a measuring component, the airflow generating device being located above the measuring component and outputting a downward-flowing airflow, comprising:

[0006] A first guide section, the first guide section having a first guide surface for receiving the airflow;

[0007] The second guide portion is connected to the lower edge region of the first guide surface. The second guide portion has a second guide surface, and the extension direction of the second guide surface is toward the side wall of the measuring component. The included angle between the first guide surface and the second guide surface is an obtuse angle.

[0008] The flow equalization device of this application has a first flow guiding section and a second flow guiding section. An obtuse angle flow guiding structure is formed by the first flow guiding surface in the first flow guiding section and the second flow guiding surface in the second flow guiding section connected to the lower edge region of the first flow guiding surface. At the same time, the extension direction of the second flow guiding surface is towards the side wall of the measuring component. The obtuse angle flow guiding structure receives the vertically downward airflow output by the airflow generating device through the first flow guiding surface and achieves directional deflection of the airflow through the second flow guiding surface, so that the airflow smoothly transitions from vertical flow to wall-adhering flow along the side wall of the measuring component, and finally guides the flow to the area around the measuring component. This improves the uniformity of the flow field near the measuring component, avoids contamination particles from adhering to the optical surface of the measuring component, and improves the accuracy of the measurement.

[0009] In one possible implementation, the first guide surface guides the airflow in a first guide direction, and the width of the first guide surface gradually narrows in the first guide direction.

[0010] As the width of the first guide surface gradually narrows from top to bottom, the airflow velocity increases and the static pressure decreases, thereby increasing the kinetic energy of the airflow moving downward and avoiding velocity attenuation caused by gravity or resistance. At the same time, the converged airflow is more easily guided by the second guide surface to the side wall of the measuring component.

[0011] In one possible implementation, the first guide surface has at least one airflow hole for the airflow to pass through, a portion of the airflow flows along the first guide surface and the second guide surface toward the side wall of the measuring component, and another portion of the airflow flows through at least one of the airflow holes toward the lower part of the first guide.

[0012] Since the first guide surface has airflow holes, a portion of the vertically flowing airflow can pass through the airflow holes to reach the bottom of the first guide section, avoiding insufficient air below the first guide section and causing additional uneven airflow distribution. Setting airflow holes can effectively suppress boundary layer separation and reduce the intensity of eddies below the first guide section.

[0013] In one possible implementation, there are multiple airflow holes, and the size of each airflow hole gradually decreases along the first flow direction.

[0014] As the width of the first guide surface narrows, the cross-sectional area of ​​the airflow channel decreases, and the airflow velocity along the first guide surface gradually increases. Using a gradually decreasing airflow orifice size can offset the pressure gradient change caused by channel contraction, maintaining a relative balance in the airflow volume of each orifice and preventing a sharp decrease in flow rate in downstream orifices due to pressure reduction. Simultaneously, as the airflow flows along the first guide surface, the air pressure increases and the airflow velocity increases further downwards in the first guide direction, while the area of ​​the lower-lying orifices decreases. This reduces airflow loss along the first guide surface, minimizes airflow passing through the orifices and flowing below the first guide section, and ensures sufficient airflow passes through the second guide surface to the area where the measurement component is located.

[0015] In one possible implementation, each of the airflow holes is a waist hole, and the long side of the waist hole is perpendicular to the first flow direction.

[0016] Because the airflow holes on the first guide surface are waist holes, and the long side of the waist holes is set perpendicular to the first guide direction, the concentrated airflow can be dispersed, allowing the airflow to flow evenly on the first guide surface.

[0017] In one possible implementation, the first guide portion further includes a third guide surface and a fourth guide surface, the third guide surface and the fourth guide surface being axially symmetrically arranged on both sides of the first guide surface, and both the third guide surface and the fourth guide surface being connected to the second guide surface.

[0018] By setting the third and fourth guide surfaces, lateral constraints are formed on both sides of the first guide surface. As the airflow flows from top to bottom along the first guide surface, the overflow of airflow from the left and right sides of the first guide surface is reduced, allowing more airflow to flow to the second guide surface.

[0019] In one possible implementation, the angle between the third guide surface and the first guide surface, or the angle between the fourth guide surface and the first guide surface, is within the range of [90°, 180°).

[0020] By limiting the range of the angle between the third and fourth guide surfaces relative to the first guide surface, and using right angles or obtuse angles, the airflow can be turned smoothly, avoiding airflow separation caused by sharp turns and the generation of local turbulence.

[0021] In one possible implementation, the minimum distance between the intersection line of the first guide surface and the second guide surface, or the intersection line of the first guide surface and the third guide surface, and the airflow hole is within the range of [30mm, 50mm].

[0022] By limiting the distance between the airflow hole and the two sides of the first guide surface, a portion of the solid structure is left near the two sides of the first guide surface. The airflow blocked by the third and fourth guide surfaces will not flow directly out of the airflow hole, ensuring that sufficient airflow flows along the surface of the first guide surface.

[0023] In one possible implementation, the upper edge of the first guide surface is provided with a folded edge.

[0024] The folded edge structure avoids sharp corners on the upper edge of the first guide surface, preventing cuts when handling.

[0025] In one possible implementation, the angle between the first guide surface and the airflow direction is within the range of [40°, 60°].

[0026] By limiting the tilt angle of the first guide surface and defining a suitable tilt range, if the angle between the first guide surface and the airflow direction is too small and the tilt degree of the first guide surface is too large, the angle between the first guide surface and the second guide surface will be too small, resulting in excessive resistance to the airflow from the first guide surface to the second guide surface; if the angle between the first guide surface and the airflow direction is too large and the tilt degree of the first guide surface is too small, the airflow output from the airflow generating device will have difficulty changing direction and flowing along the first guide surface.

[0027] In one possible implementation, the flow equalization device further includes a support assembly disposed on the back side of the first flow guide, the first flow guide being fixedly connected to the cavity of the measurement chamber via the support assembly.

[0028] By setting up a support component, the flow guiding component is installed into the measurement chamber, so that the flow guiding component is positioned in the required position to guide the airflow.

[0029] In one possible implementation, the support assembly includes a sliding assembly and a first support member. The first support member is fixedly connected to the first flow guide and slidably connected to the sliding assembly. The sliding assembly is fixedly installed in the measurement chamber. The first support member can slide relative to the sliding assembly along a first direction, thereby driving the first flow guide and the second flow guide fixedly connected thereto to adjust their positions in the first direction.

[0030] The first guide section is supported by the first support member, allowing the first guide section to slide and adjust its position along the first direction.

[0031] In one possible implementation, the support assembly further includes a second support member, which is fixedly connected to the first support member and slidably connected to the sliding assembly;

[0032] The first support member is provided with a plurality of first fixing positions along the second direction, and the second support member is provided with a plurality of second fixing positions along the second direction. By selecting one of the plurality of first fixing positions and one of the plurality of second fixing positions to cooperate and fix, the relative positions of the first support member and the second support member in the second direction can be adjusted.

[0033] The second support member and the first support member work together to achieve position adjustment in the second direction. The first support member, the sliding component, and the second support member work together to adjust the spatial position of the flow guide component in both the X and Y axes.

[0034] In one possible implementation, the support assembly further includes a third support member, which is fixedly connected to the second support member by fasteners. The third support member has a fourth fixing position extending in a third direction, and the second support member has a third fixing position. By adjusting the locking position of the fastener in the fourth fixing position and cooperating with the third fixing position to fix it, the relative position of the first guide portion and the second guide portion in the third direction can be adjusted.

[0035] The third and second support components work together to achieve three-dimensional position adjustment. By utilizing the cooperation between the first, sliding, second, and third support components, the position of the flow guide component in three dimensions can be adjusted to meet the needs of precise adjustment and achieve fixed support for the flow guide component.

[0036] Secondly, this application also provides a measurement chamber, including the flow equalization device described in any of the above claims.

[0037] Thirdly, this application also provides a semiconductor measurement device, including the aforementioned measurement chamber.

[0038] The measurement chamber and semiconductor measurement equipment can achieve the aforementioned technical effects. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of a measurement chamber in the prior art;

[0041] Figure 2 This is a schematic diagram of an existing secondary air volume measurement device based on flow field uniformity.

[0042] Figure 3 This is a schematic diagram of the flow equalization device of this application applied to the measurement chamber;

[0043] Figure 4 This is a first-view isometric view of an embodiment of the flow equalization device of this application;

[0044] Figure 5 This is a second-view isometric view of an embodiment of the flow equalization device of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 1-Semiconductor measurement equipment; 2-Measurement chamber; 3-Flow equalization device;

[0047] 01-Airflow generating device; 02-Quantity detection module; 03-Measuring component; 04-Multi-axis motion stage; 05-Wafer;

[0048] 10-Flow guiding assembly; 110-First flow guiding part; 111-First flow guiding surface; 112-Airflow hole; 113-Third flow guiding surface; 114-Fourth flow guiding surface; 115-Folded edge; 120-Second flow guiding part; 121-Second flow guiding surface;

[0049] 20-Support assembly; 201-First slider bolt; 202-Locking bolt; 203-Fastener; 204-Fixing bolt; 210-First support member; 211-First fixing position; 212-Vertical part; 213-Horizontal part; 214-Ear plate; 220-Sliding assembly; 221-First slide groove; 222-Second slide groove; 230-Second support member; 231-Second slider bolt; 240-Third support member; 241-Fourth fixing position; 242-Limiting part. Detailed Implementation

[0050] like Figure 2 As shown, in a specific design of the prior art, the flow guiding device forms a tubular channel from the wall surface A01, and several flow guiding plates A02 are arranged inside the tubular channel. The flow field is uniformly distributed through the flow guiding plates A02 and the wall surface A01. Because the inlet and outlet cross-sections of this structure are similar in size, coupled with the long air duct and multiple turning points, turbulence and separation phenomena are easily generated at the turning points of the flow guiding surface. The airflow cannot be uniformly guided to the area below the objective lens, and contaminant particles easily adhere to the optical surface of the objective lens, thus affecting the accuracy of the measurement.

[0051] The solution provided in this application is intended to overcome the shortcomings of the aforementioned flow guiding device.

[0052] This application provides a flow equalization device for use in semiconductor processing equipment, and more particularly in semiconductor measurement equipment 1. The subject matter of this application also includes a measurement chamber, which incorporates the aforementioned flow equalization device. Furthermore, the subject matter of this application also includes semiconductor measurement equipment, which incorporates the aforementioned measurement chamber.

[0053] like Figure 3 As shown, the semiconductor measurement equipment 1 includes a measurement chamber 2, which is used to perform high-precision measurements of specific parameters of a wafer in a controlled environment. Specifically, as... Figure 3 As shown, the measurement chamber 2 includes an airflow generating device 01, a measurement detection module 02, and a flow equalization device 3. The airflow generating device 01 is located above the measurement detection module 02 and is used to generate airflow in the measurement chamber 2 to form directional laminar flow, preventing contaminant particles or dust from adhering to the surface of the wafer or optical components, thus avoiding measurement errors. The measurement detection module 02 is used to generate and process optical signals. A measurement component 03 is installed at the bottom or below the measurement detection module 02. A multi-axis motion stage 04 is provided below the measurement component 03, and a wafer 05 is placed above the multi-axis motion stage 04. The flow equalization device is located below the airflow generating device 01 and is used to adjust the uniformity of the airflow in the measurement chamber 2.

[0054] Because a measurement detection module 02 is located between the airflow generating device 01 and the measuring component 03, the measuring component 03 is structurally obstructed by the measurement detection module 02 above, making it difficult for airflow to reach the area below the measuring component 03. This can lead to uneven flow field below the measuring component 03. The flow equalization device described in this application can guide the airflow to the vicinity of the measuring component 03, improving the uniformity of the flow field near the measuring component 03, preventing contaminant particles from adhering to the optical surface of the measuring component 03, and thus improving the accuracy of the measurement.

[0055] To enable those skilled in the art to better understand the technical solution of this application, the flow equalization device of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0056] The flow equalization device 3 involved in this application is applied to the measurement chamber 2, such as... Figure 3 As shown, the measurement chamber 2 includes an airflow generating device 01, a measurement detection module 02, and a measurement component 03. The airflow generating device 01 is located above the measurement detection module 02. The measurement component 03 is installed at the bottom or below the measurement detection module 02. A multi-axis motion stage 04 is provided below the measurement component 03, and a wafer 05 is placed on the upper part of the multi-axis motion stage 04. In some embodiments, the measurement component 03 is a measurement objective lens.

[0057] The airflow generating device 01 outputs downward flowing airflow, which is blocked by the measurement module 02 and cannot flow directly to the area between the measurement component 03 and the wafer 05. This results in an uneven flow field near the measurement component 03.

[0058] like Figure 4 As shown, the flow equalization device 3 of this application includes a first flow guide 110 and a second flow guide 120. The first flow guide 110 and the second flow guide 120 together constitute a flow guide assembly 10, which guides the airflow to change direction. The first flow guide 110 has a first flow guide surface 111 that receives the airflow, such as... Figure 4 As shown, the first guide surface 111 is an inclined surface. The angle between the first guide surface 111 and the airflow direction is between (0 degrees and 90 degrees). The first guide surface 111 faces upward. The airflow delivered downward by the airflow generating device 01 can blow onto the first guide surface 111. The vertical airflow is guided by the first guide surface 111 and changes direction. The airflow changes from flowing vertically downward to flowing inclinedly downward along the first guide surface 111.

[0059] The second guide portion 120 is connected to the lower edge region of the first guide surface 111. The second guide portion 120 has a second guide surface 121, which is the upper surface of the second guide portion 120. An obtuse angle is formed between the second guide surface 121 and the first guide surface 111. The second guide surface 121 is horizontally or approximately horizontally arranged, and the angle between the second guide surface 121 and the horizontal plane is ±10°.

[0060] The second guide surface 121 extends toward the sidewall of the measurement component 03. The second guide surface 121 is used to further guide the airflow guided from the first guide surface 111. The angle between the first guide surface 111 and the second guide surface 121 is an obtuse angle. The airflow smoothly transitions from the first guide surface 111 to the second guide surface 121. The airflow moves along the second guide surface 121. When the airflow leaves the second guide surface 121, the airflow flows in a horizontal or near-horizontal direction, guiding the airflow to the area between the measurement component 03 and the wafer, avoiding contamination particles from adhering to the optical surface of the measurement component 03, thereby improving the accuracy of the measurement.

[0061] This application forms an obtuse-angle guiding structure by connecting the first guiding surface 111 in the first guiding section 110 and the second guiding surface 121 in the second guiding section 120, which is connected to the lower edge region of the first guiding surface 111. At the same time, the extension direction of the second guiding surface 121 is towards the side wall of the measurement component 03. Since the obtuse-angle guiding structure receives the vertically downward airflow output by the airflow generating device 01 through the first guiding surface 111 and achieves directional deflection of the airflow through the second guiding surface 121, the airflow smoothly transitions from vertical flow to wall-adhering flow along the side wall of the measurement component 03, and finally guides it to the area around the measurement component 03 (such as guiding it to the optical surface of the measurement component 03 and the area between the measurement component 03 and the wafer 05). This improves the uniformity of the flow field near the measurement component 03, avoids contamination particles from adhering to the optical surface of the measurement component 03, and improves the accuracy of measurement. Furthermore, since the distance between wafer 05 and measurement component 03 is small, directing the airflow to the vicinity of measurement component 03 can also purge wafer 05, thereby further preventing contaminant particles from depositing on the surface of wafer 05.

[0062] In some embodiments, the first guide portion 110 and the second guide portion 120 are integrally formed, such as by bending a metal sheet. In this structure, the thickness of each part of the first guide portion 110 and the second guide portion 120 is approximately equal. Alternatively, the first guide portion 110 and the second guide portion 120 may also adopt a structure in which the thicknesses are not completely equal, as long as the first guide surface 111 and the second guide surface 121 form a smooth transition with an obtuse angle.

[0063] In other embodiments, the first guide portion 110 and the second guide portion 120 are separately disposed, but fixedly connected. For example, the lower edge of the first guide portion 110 is provided with a first fixing portion, and the edge of the second guide portion 120 near the first guide portion 110 is provided with a second fixing portion. The first fixing portion and the second fixing portion are fixed by fasteners to achieve a fixed connection between the first guide portion and the second guide portion. As another example, the first guide portion 110 and the second guide portion 120 are fixed by welding, and the welded surface is subjected to random texture polishing and electrolytic polishing treatment.

[0064] Furthermore, it should be noted that the first guide surface 111 and the second guide surface 121 can be planar, curved, or multi-segmented, and all of these should be covered within the scope of protection of this application. When the first guide surface 111 is planar, it has a normal (perpendicular line); when it is curved, the normals at different positions are not perfectly parallel; when it is multi-segmented, it is formed by splicing together multiple planar segments, with adjacent segments forming an obtuse angle, and each segment having a normal.

[0065] In some embodiments, both the first guide surface 111 and the second guide surface 121 are polished to ensure that the surfaces are smooth and clean, so that the airflow passing through the first guide surface 111 and the second guide surface 121 is clean and uncontaminated.

[0066] In some embodiments, the direction in which the first guide surface 111 guides the airflow is a first guide direction. This first guide direction can be considered as the midpoint A of the upper edge and the midpoint B of the lower edge of the first guide surface 111. Figure 4 The airflow is directed from A to B along the centerline (center line) of the first guide surface 111, which is inclined downwards. The width of the first guide surface 111 gradually narrows from top to bottom in the first guide direction, and is perpendicular to the first guide direction, i.e., perpendicular to the centerline. Because the width of the first guide surface 111 gradually narrows from top to bottom, the airflow velocity increases and the static pressure decreases, thereby increasing the kinetic energy of the downward movement of the airflow and avoiding velocity attenuation due to gravity or resistance. Simultaneously, the converged airflow is more easily and accurately guided by the second guide surface 121 to the sidewall of the measuring component 03.

[0067] In some embodiments, the first guide surface 111 can be a trapezoidal plane, with its wider end close to the airflow inlet and its narrower end connected to the second guide surface 121. The smooth width contraction avoids sudden changes in airflow direction or abrupt changes in cross-section, reducing the risk of eddies and flow separation, and thus improving laminar flow stability.

[0068] like Figure 4 As shown, both sides of the first guide surface 111 are straight edges, and the first guide surface 111 is an isosceles trapezoid, with the two sides symmetrical about the centerline of the first guide surface 111. It should be noted that the two sides of the first guide surface 111 can also adopt curved edges, but they should all satisfy the rule that the width of the first guide surface 111 gradually narrows from top to bottom along the first guiding direction. The two sides of the first guide surface 111 form a smooth transition, guiding the airflow and reducing obstruction to the airflow.

[0069] It should be noted that the width of the lower edge of the first guide section 110 is the same as the width of the connection between the second guide section 120 and the first guide section 110. Since the width of the connection between the lower edge of the first guide section 110 and the second guide section 120 is the same, turbulence or backflow caused by abrupt changes in cross-section of the airflow is avoided, ensuring a smooth transition of the airflow from the first guide surface 111 to the second guide surface 121.

[0070] In some embodiments, the first guide surface 111 has at least one airflow hole 112 for airflow to pass through, and the airflow hole 112 extends through the entire first guide portion 110 in the normal direction. The airflow generating device 01 generates a vertically downward airflow, and a portion of the airflow flows along the first guide surface 111 and the second guide surface 121 to the sidewall of the measuring component 03. The originally vertically flowing airflow changes direction once after passing through the first guide surface 111 and the second guide surface 121 and finally becomes a transverse flow, so that the area where the measuring component 03 is located is blown by more airflow, effectively reducing the non-uniformity of the flow velocity in the area of ​​the measuring component 03 and avoiding the deposition of contaminant particles on the optical surface of the measuring component 03. The airflow generating device 01 generates a vertically downward airflow, while another portion of the airflow passes through at least one airflow hole 112 and flows downwards towards the first guide section 110. The airflow passing through the airflow hole 112 does not change direction and flows vertically downwards until it reaches the bottom of the first guide section 110. This avoids insufficient air below the first guide section 110, which could lead to additional uneven airflow distribution. The airflow hole 112 effectively suppresses boundary layer separation and reduces the vortex intensity below the first guide section 110. By providing the airflow hole 112 on the first guide surface 111, on the one hand, the solid portion of the first guide surface 111 causes a portion of the airflow to change direction and flow towards the area where the measuring component 03 is located; on the other hand, the airflow hole 112 maintains the original flow direction of a cross-section of the airflow until it reaches the bottom of the first guide section 110.

[0071] Specifically, there are multiple airflow holes 112, and the multiple airflow holes 112 are arranged in a honeycomb or matrix layout to ensure the uniformity of airflow distribution as it flows through the airflow holes 112 to the area below the first guide section 110.

[0072] In some embodiments, the width of the first guide surface 111 is equal at the top and bottom, and the multiple airflow holes 112 are of the same size. The airflow holes of the same size can ensure that the airflow resistance of each hole is consistent, so that the auxiliary airflow flow through each hole is kept uniform and the phenomenon of excessively strong or weak local airflow is avoided.

[0073] In other embodiments, if the width of the first guide surface gradually narrows, the size of each airflow hole 112 on the first guide surface 111 gradually decreases along the first guide direction. That is, the size of each airflow hole 112 gradually decreases from top to bottom along the centerline direction of the first guide surface 111, with the area of ​​the upper airflow hole 112 being larger than that of the lower airflow hole 112. The reduction in the area of ​​the airflow hole 112 can be achieved by gradually decreasing the length of the airflow hole 112, gradually decreasing the width of the airflow hole 112, or gradually decreasing both the length and width of the airflow hole 112. As the width of the first guide surface narrows, the cross-sectional area of ​​the airflow channel decreases, and the airflow velocity naturally increases. Using gradually decreasing airflow hole sizes can offset the pressure gradient changes caused by channel contraction, maintain a relative balance in the airflow volume of each airflow hole, and prevent a sharp decrease in flow rate in the downstream airflow hole due to pressure reduction. At the same time, the airflow flows along the first guide surface 111. The air pressure is greater and the airflow speed is faster as it goes down in the first guide direction. The area of ​​the airflow hole 112 is smaller as it goes down, so as to reduce the loss of airflow along the first guide surface 111 and reduce the airflow flowing through the airflow hole 112 to the area below the first guide part 110, so as to ensure that enough airflow passes through the second guide surface 121 and flows to the area where the vector measurement component 03 is located.

[0074] In some embodiments, each airflow hole 112 is a waist hole, and the long side of the waist hole is perpendicular to the first guiding direction. The setting of the waist hole with its long side perpendicular to the first guiding direction (the main direction of airflow) can disperse the concentrated airflow and allow the airflow to flow evenly on the first guiding surface 111.

[0075] Combination Figure 4 As shown, in this embodiment, the airflow hole 112 is an elongated, waist-shaped hole. The length of the airflow hole 112 is perpendicular to the centerline of the first guide surface 111, and the width of the airflow hole 112 is parallel to the centerline of the first guide surface 111. Alternatively, the length of the airflow hole 112 may not be perpendicular to the centerline of the first guide surface 111, forming a non-right angle with the centerline of the first guide surface 111; or the length of the airflow hole 112 may be along the first guide direction, or parallel to the first guide direction. For airflow holes 112 with a waist-shaped design, the long sides of each airflow hole 112 are not required to be completely parallel, and each airflow hole 112 may have a different orientation. Alternatively, the airflow holes 112 may adopt other shapes besides waist-shaped holes, such as an array of circular holes.

[0076] In some embodiments, the first guide portion further includes a third guide surface 113 and a fourth guide surface 114, which are axially symmetrically arranged on both sides of the width direction of the first guide surface 111. The planes of symmetry of the third guide surface 113 and the fourth guide surface 114 pass through the centerline of the first guide surface 111. Figure 4As shown, in this embodiment, the third guide surface 113 and the fourth guide surface 114 are fixed to the two side edges of the first guide surface 111. The first guide surface 111, the third guide surface 113, and the fourth guide surface 114 can be formed by bending sheet metal, which facilitates processing and manufacturing. In addition, the third guide surface 113 and the fourth guide surface 114 can also be fixed to the non-edge position of the first guide surface 111 by welding or other methods.

[0077] In some embodiments, the third guide surface 113 and the fourth guide surface 114 are both connected to the second guide surface 121. The lower part of the third guide surface 113 and the lower part of the fourth guide surface 114 are respectively connected to the two ends of the second guide surface 121 to ensure that the airflow can flow smoothly to the second guide surface 121.

[0078] The third guide surface 113 and the fourth guide surface 114 constrain both sides of the first guide surface 111. As the airflow flows downward along the first guide surface 111, this reduces the overflow of airflow from the left and right sides of the first guide surface 111, allowing more airflow to flow towards the second guide surface 121. In particular, the width of the first guide surface 111 narrows along the first guiding direction. Only when the third guide surface 113 and the fourth guide surface 114 constrain the airflow from both sides can the airflow at the two edges converge towards the centerline of the first guide surface 111.

[0079] The angle between the third guide surface 113 and the first guide surface 111, or the angle between the fourth guide surface 114 and the first guide surface 111, is within the range of [90°, 180°). The included angle is 90° but not 180°. The included angle between the third guide surface 113 and the first guide surface 111 can be a right angle or an obtuse angle. The included angle between the fourth guide surface 114 and the first guide surface 111 can be a right angle or an obtuse angle. Both the third guide surface 113 and the fourth guide surface 114 protrude upwards from the first guide surface 111. The use of right angles or obtuse angles allows the airflow to turn smoothly, avoiding airflow separation caused by sharp turns and the generation of local turbulence.

[0080] The minimum distance between the intersection line of the first guide surface 111 and the third guide surface 113, or the intersection line of the first guide surface 111 and the fourth guide surface 114, and the airflow hole 112 is within the range of [30mm, 50mm]. Figure 4As shown, two airflow holes 112 are provided, one row each along the centerline of the first guide surface 111. The minimum distance between the intersection of the first guide surface 111 and the third guide surface 113 and the left edge of the airflow hole 112 is d, where d ∈ [30mm, 50mm]. Similarly, the distance between the intersection of the first guide surface 111 and the fourth guide surface 114 and the right edge of the airflow hole 112 is also within the range of [30mm, 50mm]. A certain distance exists between the airflow hole 112 and the edges of the third guide surface 113 and the fourth guide surface 114. Airflow blocked by the third guide surface 113 and the fourth guide surface 114 will not flow directly out of the airflow hole 112, ensuring sufficient airflow along the surface of the first guide surface 111. It should be noted that the minimum distance d is determined by the angles between the third guide surface 113 and the fourth guide surface 114 and the first guide surface 111. The smaller the angle between the third guide surface 113 and the fourth guide surface 114 and the first guide surface 111, the larger the minimum spacing d; the larger the angle between the third guide surface 113 and the fourth guide surface 114 and the first guide surface 111, the smaller the minimum spacing d.

[0081] The upper edge of the first guide surface 111 is provided with a folded edge 115. The folded edge 115 forms a folding angle of 180° with the first guide surface 111. The folded edge 115 can be folded upward 180° or downward 180°, which can prevent the upper edge of the first guide surface 111 from forming a sharp edge and prevent cutting hands when picking it up.

[0082] The angle between the first guide surface 111 and the airflow direction is within the range of [40°, 60°], and the airflow output by the airflow generating device 01 is vertically downward. Figure 3 As shown, viewed from the side, the angle between the first guide surface 111 and the airflow direction (vertical) is α, where α ∈ [40°, 60°]. If the angle between the first guide surface 111 and the airflow direction is too small, the inclination of the first guide surface 111 will be too large, resulting in an excessively small angle between the first guide surface 111 and the second guide surface 121, causing excessive resistance to the airflow from the first guide surface 111 to the second guide surface 121. If the angle between the first guide surface 111 and the airflow direction is too large, the inclination of the first guide surface 111 will be too small, making it difficult for the airflow output from the airflow generating device 01 to change direction and flow along the first guide surface 111.

[0083] In some embodiments, the angle α between the first guide surface 111 and the airflow direction is 45 degrees. This 45-degree angle guides the vertically downward airflow to flow obliquely along the first guide direction, avoiding boundary layer separation caused by small angles and preventing airflow obstruction caused by large angles. The angle between the first guide surface 111 and the second guide surface 121 is 135 degrees, creating a smooth transition from the first guide surface 111 to the second guide surface 121, changing the oblique flow from the first guide direction to a lateral flow along the second guide surface 121. The flow equalization device 3 of this application also includes a support assembly 20, which is disposed on the back side of the first guide surface 110 or the second guide surface 120. The first guide surface 110 is fixedly connected to the cavity of the measurement chamber 2 via the support assembly 20. The first guide surface 110 and the second guide surface 120 together constitute the flow guiding assembly 10, which guides the airflow, changes its direction, and directs it to the area of ​​the measurement component 03. The flow guide assembly 10 is supported and fixed by the support assembly 20. Since the support assembly 20 is installed in the measurement chamber 2 and located on the back side of the first flow guide 110 or the second flow guide 120, the back-side fixing method can avoid interfering with the main airflow channel and prevent pollutant particles on the support assembly 20 from falling onto the first flow guide surface 111 or the second flow guide surface 121 and polluting the airflow.

[0084] Combination Figure 4 , Figure 5 As shown, the support assembly 20 includes a sliding assembly 220 and a first support member 210. The first support member 210 is fixedly connected to the first guide portion 110 and slidably connected to the sliding assembly 220. Figure 5 Two first support members 210 are arranged side by side as shown. Each first support member 210 includes a vertical portion 212 and a horizontal portion 213. The vertical portion 212 is in vertical contact with the first guide portion 110, and the horizontal portion 213 extends horizontally and is vertically fixed to the lower edge of the vertical portion 212. Ear plates 214 parallel to the first guide portion 110 are provided on the horizontal portion 213 and / or the vertical portion 212. The ear plates 214 contact the first guide portion 110 and are fixedly connected, which can be done by bolts or welding.

[0085] The sliding component 220 is fixedly installed in the measurement chamber 2, and the sliding component 220 is along the first direction ( Figure 4 A columnar structure extending along the X-axis is included, with both ends of the sliding assembly 220 fixedly installed within the measurement chamber 2. The first support member 210 can slide and translate relative to the sliding assembly 220 along a first direction, thereby causing the first guide portion 110 and the second guide portion 120, which are fixedly connected to the first support member 210, to adjust their positions in the first direction. It is understood that the X-axis direction is parallel or perpendicular to the plane where wafer 05 is located.

[0086] The support assembly 20 also includes a second support member 230, which is fixedly assembled with the first support member 210 and slidably connected to the sliding assembly 220. The second support member 230 can be moved relative to the sliding assembly 220 along a first direction (X-axis) for position adjustment. The second support member 230 is formed by two vertical plates and one horizontal plate fixedly against each other, wherein the two vertical plates are perpendicular to each other. The horizontal plate of the second support member 230 contacts the lower surface of the horizontal part 213, a second slider bolt 231 is installed on one of the vertical plates, and a fastener 203 is installed on the other vertical plate.

[0087] Combination Figure 4 As shown, the sliding component 220 is a rectangular columnar structure. A first groove 221 is provided on the upper surface of the sliding component 220. The first groove 221 is a groove extending along a first direction, with a smaller opening and a larger bottom. A second groove 222 is provided on the vertical side of the sliding component 220. The second groove 222 is a groove extending along the first direction, with a smaller opening and a larger bottom. The first support member 210 is slidably assembled to the first groove 221 by a first slider bolt 201, and the second support member 230 is slidably assembled to the second groove 222 by a second slider bolt 231. When the first slider bolt 201 is loosened, it can move relative to the first groove 221 along the X-axis, and when locked, it is fixed in position. When the second slider bolt 231 is loosened, it can move relative to the second groove 222 along the X-axis, and when locked, it is fixed in position.

[0088] The first slider bolt 201 is used to tighten and fix the first support member 210. When the first slider bolt 201 is loosened, the first support member 210 moves relative to the first slide groove 221 along the X-axis; when it is locked, the first support member 210 is fixed. The second slider bolt 231 is used to tighten and fix the second support member 230. When the second slider bolt 231 is loosened, the second support member 230 moves relative to the second slide groove 222 along the X-axis; when it is locked, the second support member 230 is fixed.

[0089] The first support member 210 has multiple first fixing positions 211 along the second direction (Y-axis), and the first fixing positions 211 are formed through the horizontal portion 213 along the normal direction. The second support member 230 has multiple second fixing positions (not shown in the figure) along the second direction (Y-axis), and the second fixing positions are located on the horizontal plate of the second support member 230. Figure 4 As shown, the first fixing position 211 is a waist hole, which is opened along the Y-axis in the length direction, and the second fixing position can be a threaded hole.

[0090] By selecting one of the plurality of first fixing positions 211 and cooperating with one of the plurality of second fixing positions for fixation, the relative positions of the first support member 210 and the second support member 230 in the second direction (Y-axis) can be adjusted. Specifically, see... Figure 4Locking bolts 202 are inserted into the first fixed position 211 and the second fixed position respectively. After the relative position of the first support member 210 and the second support member 230 on the Y axis is adjusted, tightening the locking bolts 202 will fix the first support member 210 and the second support member 230 relative to each other. When adjusting the relative position of the two on the Y axis, the locking bolts 202 need to be loosened in advance.

[0091] The spatial position of the flow guide component 10 can be adjusted in both the X and Y axes by the cooperation between the first support member 210, the sliding component 220, and the second support member 230.

[0092] The support assembly 20 also includes a third support member 240, the lowest point of which is fixedly installed in the measurement chamber 2. The third support member 240 extends upward from the bottom fixed position. The third support member 240 can be formed by bending a single sheet metal plate or by welding several plates; the specific structure of the third support member 240 is not limited. The third support member 240 is fixedly connected to the second support member 230 by fasteners 203. The third support member has a fourth fixing position 241 extending along a third direction (Z-axis), and the fourth fixing position 241 is a through hole along the first direction (X-axis) in the length direction along the third direction (Z-axis). The second support member 230 has a third fixing position (not shown in the figure), which can be a threaded hole. By adjusting the locking position of the fastener 203 in the fourth fixing position 241 and cooperating with the third fixing position to form a threaded connection, the relative position of the whole consisting of the first guide part 110 and the second guide part 120 in the third direction (Z-axis) can be adjusted. The bottom of the third support member 240 is fixed in the measurement chamber 2 by fixing bolts 204.

[0093] The height position of the flow guide assembly 10 in the Z-axis direction is adjusted by adjusting the vertical position of the second support member 230 relative to the third support member 240.

[0094] The support component 20, through the cooperation of the first support member 210, the sliding component 220, the second support member 230, and the third support member 240, can adjust the position of the flow guide component 10 (first flow guide part 110 + second flow guide part 120) in three dimensions (XYZ), meet the need for precise adjustment, and achieve fixed support of the flow guide component 10.

[0095] Combination Figure 4As shown, the third support member 240 is provided with a limiting part 242 for limiting the sliding component 220 to the lowest position in the third direction. The limiting part 242 is a stepped surface structure provided on the third support member 240. The limiting part 242 is located directly below the sliding component 220. The first support member 210, the sliding component 220 and the second support member 230 can be adjusted synchronously in the third direction (Z-axis). Among the first support member 210, the sliding component 220 and the second support member 230, the lower surface of the sliding component 220 is the lowest. When the lower surface of the sliding component 220 contacts the limiting part 242, the first support member 210, the sliding component 220 and the second support member 230 cannot descend further, thereby limiting the lowest position that the second guide part 120 can reach.

[0096] Combination Figure 3 As shown, the second flow guide 120 should be located above the wafer 05 to guide the airflow to the measurement component 03. By limiting the lowest position of the second flow guide surface 121, it is ensured that the second flow guide 120 will not contact the wafer 05 under any circumstances, and that the device will not collide with precision components.

[0097] The flow equalization device 3 of this application forms an obtuse-angled flow guiding structure through the first flow guiding surface 111 in the first flow guiding part 110 and the second flow guiding surface 121 in the second flow guiding part 120 connected to the lower edge region of the first flow guiding surface. The extension direction of the second flow guiding surface 121 is towards the side wall of the measurement component 03. Since the obtuse-angled flow guiding structure receives the vertically downward airflow output by the airflow generating device 01 through the first flow guiding surface 111 and realizes the directional deflection of the airflow through the second flow guiding surface 121, the airflow smoothly transitions from vertical flow to wall-adhering flow along the side wall of the measurement component 03, and finally guides the flow to the vicinity of the measurement component 03, improving the uniformity of the flow field near the measurement component 03, avoiding the adhesion of contaminant particles to the optical surface of the measurement component 03, and improving the accuracy of measurement.

[0098] The foregoing preferred embodiments have further illustrated the objectives, technical solutions, and advantages of the present invention. It should be understood that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flow equalization device, characterized in that, Applied to a measurement chamber, the measurement chamber includes an airflow generating device and a measuring component. The airflow generating device is located above the measuring component and outputs a downward-flowing airflow, including: A first guide section, the first guide section having a first guide surface for receiving the airflow; The second guide portion is connected to the lower edge region of the first guide surface. The second guide portion has a second guide surface, and the extension direction of the second guide surface is toward the side wall of the measuring component. The included angle between the first guide surface and the second guide surface is an obtuse angle.

2. The flow equalization device according to claim 1, characterized in that, The direction in which the first guide surface guides the airflow is the first guide direction, and the width of the first guide surface gradually narrows in the first guide direction.

3. The flow equalization device according to claim 2, characterized in that, The first guide surface has at least one airflow hole for the airflow to pass through. A portion of the airflow flows along the first guide surface and the second guide surface toward the side wall of the measuring component, and another portion of the airflow flows through at least one of the airflow holes toward the lower part of the first guide.

4. The flow equalization device according to claim 3, characterized in that, The at least one airflow hole is a plurality of holes, and the size of each airflow hole gradually decreases along the first flow direction.

5. The flow equalization device according to claim 3, characterized in that, Each of the airflow holes is a waist hole, and the long side of the waist hole is perpendicular to the first flow direction.

6. The flow equalization device according to any one of claims 1 to 5, characterized in that, The first guide portion further includes a third guide surface and a fourth guide surface, which are arranged symmetrically on both sides of the first guide surface. Both the third guide surface and the fourth guide surface are connected to the second guide surface.

7. The flow equalization device according to claim 6, characterized in that, The angle between the third guide surface and the first guide surface, or the angle between the fourth guide surface and the first guide surface, is within the range of [90°, 180°).

8. The flow equalization device according to claim 6, characterized in that, The minimum distance between the intersection line of the first guide surface and the second guide surface, or the intersection line of the first guide surface and the third guide surface, and the airflow hole is within the range of [30mm, 50mm].

9. The flow equalization device according to any one of claims 1 to 8, characterized in that, The upper edge of the first guide surface is provided with a folded edge.

10. The flow equalization device according to any one of claims 1 to 9, characterized in that, The angle between the first guide surface and the airflow direction is within the range of [40°, 60°].

11. The flow equalization device according to any one of claims 1 to 10, characterized in that, The flow equalization device further includes a support assembly, which is disposed on the back side of the first flow guide, and the first flow guide is fixedly connected to the cavity of the measurement chamber through the support assembly.

12. The flow equalization device according to claim 11, characterized in that, The support assembly includes a sliding assembly and a first support member. The first support member is fixedly connected to the first flow guide and slidably connected to the sliding assembly. The sliding assembly is fixedly installed in the measurement chamber. The first support member can slide relative to the sliding assembly along a first direction, thereby driving the first flow guide and the second flow guide fixedly connected to it to adjust their positions in the first direction.

13. The flow equalization device according to claim 12, characterized in that, The support assembly further includes a second support member, which is fixedly connected to the first support member and slidably connected to the sliding assembly. The first support member is provided with a plurality of first fixing positions along the second direction, and the second support member is provided with a plurality of second fixing positions along the second direction. By selecting one of the plurality of first fixing positions and one of the plurality of second fixing positions to cooperate and fix, the relative positions of the first support member and the second support member in the second direction can be adjusted.

14. The flow equalization device according to claim 13, characterized in that, The support assembly further includes a third support member, which is fixedly connected to the second support member by fasteners. The third support member has a fourth fixing position extending in a third direction, and the second support member has a third fixing position. By adjusting the locking position of the fastener in the fourth fixing position and cooperating with the third fixing position to fix it, the relative position of the first guide part and the second guide part in the third direction can be adjusted.

15. A measuring chamber, characterized in that, include: The flow equalization device as described in any one of claims 1 to 14.

16. A semiconductor measurement device, characterized in that, include: The measurement chamber as described in claim 15.

Images